Backlight panel, manufacturing method and display panel

Abstract

This application relates to a backlight panel, a manufacturing method and a display panel. A reflective layer, a white ink layer, a welding pad and a lamp bead are placed on a substrate of the backlight panel, a window is provided in the white ink layer, a welding pad is installed in the window, the lamp bead and the welding pad are electrically connected, and the reflective layer is used to reflect the light emitted by the lamp bead when electricity is applied. The light emitted by the lamp bead is reflected toward the reflective layer, improving the reflectance of the backlight panel and improving the light utilization rate of the backlight panel.

Description

[Technical field]

[0001] The present application relates to the field of display technology, and in particular to a backlight panel, a manufacturing method and a display panel. [Background technology]

[0002] In Mini-LED (Mini-light emitting diode) backlight products, the number of lamp beads on the light panel is huge, so high precision is required for the opening of the white solder resist ink on the light panel, and photosensitive white ink is generally used. Since the reflectance of photosensitive white ink is proportional to the film thickness of the white ink, if a high reflectance specification is required, the film thickness of the white ink also becomes large. In addition, if the thickness of the white ink is too large, the bottom of the white ink cannot be sufficiently solidified during exposure, and the white ink that is not sufficiently solidified during the development process will cause an undercut structure due to side etching. Summary of the Invention [Problem to be solved by the invention]

[0003] Since the undercut structure is a hollowed-out structure, it is prone to breakage and falling off due to external forces, and if it falls on the welding pad, it will result in a defective product or a situation where it cannot be lit. Also, if the thickness of the white ink is too large, the thermal expansion coefficients of the white ink and glass do not match after the high-temperature process, which generates stress and causes the board to warp, and if the warp is too large, it is prone to breakage. [Means for solving the problem]

[0004] Based on the above, there is a need to provide a backlight panel and a manufacturing method thereof to solve the problems of damage and warping of the white ink layer in the conventional backlight panel.

[0005] In order to achieve the above object, according to a first aspect, the present embodiment comprises: The lamp includes a substrate, a reflective layer, a white ink layer, a welding pad, and a lamp bead; The reflective layer, the white ink layer, the welding pad and the lamp bead are placed on the substrate, a window is provided in the white ink layer, the welding pad is placed in the window, and the lamp bead and the welding pad are electrically connected; A backlight panel is provided, the reflective layer being provided on a side of the white ink layer closer to the substrate.

[0006] According to a second aspect, the present embodiment comprises: Providing a substrate; forming a reflective layer on the substrate; forming a weld pad on the substrate; forming a white ink layer on the substrate, providing a window in the white ink layer, and placing the welding pad within the window; and soldering a lamp bead to the weld pad. The reflective layer is provided on a side of the white ink layer closer to the substrate.

[0007] According to a third aspect, the present embodiment comprises: The display includes a main control panel, a diffusion panel, a diffusion sheet, a driving circuit panel, a vertical polarizing sheet, a TFT glass panel, a liquid crystal layer, a color filter, a horizontal polarizing sheet, and a backlight panel; the main control board, the backlight panel, the diffusion plate, the diffusion sheet, the driving circuit board, the vertical polarizing sheet, the TFT glass plate, the liquid crystal layer, the color filter, and the horizontal polarizing sheet are provided in this order; The backlight panel includes a substrate, a reflective layer, a white ink layer, a welding pad, and a lamp bead; The reflective layer, the white ink layer, the welding pad and the lamp bead are placed on the substrate, a window is provided in the white ink layer, the welding pad is placed in the window, and the lamp bead and the welding pad are electrically connected; A display panel is provided, wherein the reflective layer is provided on a side of the white ink layer closer to the substrate. Effect of the Invention

[0008] The backlight panel provided in each embodiment of the present application is provided with a reflective layer, a white ink layer, a welding pad, and a lamp bead placed on a substrate. A window for installing the welding pad is provided in the white ink layer, and the lamp bead and the welding pad are electrically connected. Here, the reflective layer is used to reflect the light emitted by the lamp bead when electricity is applied, and realizes the reflection of the light emitted by the lamp bead toward the reflective layer, thereby improving the reflectance of the backlight panel and improving the light utilization rate of the backlight panel. When the backlight panel has a reflective layer for improving the reflectance, the amount of the white ink layer can be reduced and the thickness of the white ink layer can be thinned. The thinned white ink layer can be sufficiently solidified in the solidification process, and the damage of the white ink layer due to the occurrence of an undercut structure in the development process can be prevented. In addition, the thinned white ink layer can also prevent warping due to an excessive difference in thermal expansion coefficient with the substrate. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a structural schematic diagram of a backlight panel provided in an embodiment of the present application. [Diagram 2] FIG. 2 is a structural schematic diagram of a backlight panel provided in an embodiment of the present application. [Diagram 3] FIG. 2 is a structural schematic diagram of a backlight panel provided in an embodiment of the present application. [Figure 4] FIG. 2 is a structural schematic diagram of a backlight panel provided in an embodiment of the present application. [Diagram 5] FIG. 2 is a structural schematic diagram of a backlight panel provided in an embodiment of the present application. [Figure 6] 2 is a flow chart of a method for manufacturing a backlight panel provided in an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In order to facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings, in which there is shown a preferred embodiment of the present application. However, the present application may be embodied in many different forms and is not limited to the embodiments set forth herein. On the contrary, the purpose of providing these embodiments is to provide a more complete and thorough understanding of the present disclosure.

[0011] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and integrated therewith, or there may be another element between them. In this specification, expressions such as "mounted," "one end," and "other end" are used for descriptive purposes only.

[0012] Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0013] The display panel is used to display images and videos, and generally includes a main control plate, a diffusion plate, a diffusion sheet, a driving circuit board, a vertical polarizing sheet, a TFT glass plate, a liquid crystal layer, a color filter, a horizontal polarizing sheet and a backlight panel 1.

[0014] Among them, the main control board is the control center of the display panel and is used to control the coordinated operation of each device in the display panel. For example, the main control board includes a controller and a processor. The diffusion plate is a sheet or film that spreads the light emitted by the backlight panel 1 evenly over the entire surface. For example, the base material of the diffusion plate is PET (Polyethylene terephthalate), PC (Polycarbonate), or PMMA (Polymethyl methacrylate). The diffusion sheet can eliminate uneven brightness and bright spots. For example, the diffusion sheet is a sheet with a convex microlens group formed on the main surface of a transparent sheet base material. The driving circuit board supplies a stable voltage or current driving signal to the lamp beads of the backlight panel 1. The vertical polarizing sheet and the horizontal polarizing sheet control the polarization direction of the light beam. For example, the material of the polarizing sheet is polyvinyl alcohol. The TFT (Thin Film Transistor) glass plate is used to display pixels in the display panel. The liquid crystal layer contains liquid crystal molecules that change orientation when an electric field is applied. The color filter is an optical filter that expresses color, transmitting a small wavelength range of light waves and reflecting the rest of the wavelength range. The backlight panel 1 is a device that provides a light source to the display panel.

[0015] The backlight panel 1 is an important component in a display panel. However, in the conventional backlight panel 1, the white ink layer 15 is easily damaged and the backlight panel 1 is easily warped. In order to solve the above problems, the embodiment of the present application provides a backlight panel 1. As shown in FIG. 1, the backlight panel 1 includes a substrate 11, a reflective layer 13, a white ink layer 15, a welding pad 17, and a lamp bead. Here, the substrate 11 is used to mount the reflective layer 13, the white ink layer 15, the welding pad 17, and the lamp bead. It should be noted that the substrate 11 may be a transparent substrate 11 or a non-transparent substrate 11. For example, the transparent substrate 11 may be a glass substrate 11. For example, the non-transparent substrate 11 may be a PCB (Printed Circuit Board) substrate 11, a metal (e.g., aluminum) substrate 11, etc. The substrate 11 may be specifically set according to actual requirements and is not limited thereto. The white ink layer 15 has a solder resist function on the one hand, and has a certain degree of light reflection effect on the other hand. Specifically, the white ink layer 15 is formed by solidifying the white ink. The welding pad 17 is a joint of a current transmission line for connecting the lamp beads, for example, the inside of the welding pad 17 is a metal wiring, and the outer layer is wrapped with an anti-oxidation layer, which has electrical conductivity. The lamp beads emit light when electricity is applied. In the formation structure of the backlight panel 1, a window is provided in the white ink layer 15, and it can be understood that the window may or may not penetrate the white ink layer 15. The welding pad 17 is disposed within the window. The lamp beads and the welding pad 17 are electrically connected, specifically, the connection end of the lamp beads can be soldered to the welding pad 17.

[0016] The reflective layer 13 is provided on the substrate 11, specifically, on the side of the white ink layer 15 closer to the substrate 11. The reflective layer 13 is used to reflect the light emitted by the lamp beads when the electric current is applied, and to irradiate as much of the light emitted by the lamp beads as possible to the diffusion plate, thereby increasing the utilization rate of the light source. The selection of the material of the reflective layer 13 depends on the reflective properties of the material, for example, the reflective layer 13 is made of white ink, the reflective layer 13 is made of vinyl acetate adhesive, the reflective layer 13 is made of copper, the reflective layer 13 is made of aluminum, or the reflective layer 13 is made of silver, and the material is not specifically limited here. In addition, different manufacturing processes are used depending on the material, for example, the reflective layer 13 can be manufactured by processes such as printing, coating, sputtering, embedding, etc.

[0017] The reflective layer 13 can be disposed on the substrate 11 in at least three ways:

[0018] As an example, as shown in FIG. 1, the backlight panel 1 includes a substrate 11, a reflective layer 13, a white ink layer 15, a welding pad 17 and a lamp bead. The substrate 11 includes a first plate surface and a second plate surface facing each other, in other words, the first plate surface can be said to be the front surface of the substrate 11. This front surface is provided toward the diffusion plate of the display panel. The second plate surface can be said to be the rear surface of the substrate 11. This rear surface is provided on the side away from the diffusion plate of the display panel. The first plate surface is provided with a white ink layer 15, a welding pad 17 and a lamp bead, and the second plate surface is provided with a reflective layer 13, specifically, the white ink layer 15 is laid on the first plate surface, a window is provided in the white ink layer 15, and the welding pad 17 is installed in the window. The lamp bead and the welding pad 17 are soldered. The number of windows is the same as the number of lamp beads, and the number of lamp beads is set according to actual requirements. Here, the substrate 11 is used to place the reflective layer 13, the white ink layer 15, the welding pad 17 and the lamp bead. The white ink layer 15 has a solder resist function on the one hand, and has a certain degree of light reflection effect on the other hand. Specifically, the white ink layer 15 is formed by solidifying the white ink. The welding pad 17 is a joint of a current transmission line for connecting the lamp bead. For example, the inside of the welding pad 17 is a metal wiring, and the outer layer is wrapped with an anti-oxidation layer, and the anti-oxidation layer has electrical conductivity. For another example, the welding pad 17 is a metal solder joint. The lamp bead emits light when electricity is applied. In the formation structure of the backlight panel 1, a window is provided in the white ink layer 15, and as can be understood, the window may or may not penetrate the white ink layer 15. The welding pad 17 is installed in the window. The lamp bead and the welding pad 17 are electrically connected, specifically, the connection end of the lamp bead can be soldered to the welding pad 17.

[0019] In the above example, the substrate 11 is transparent so that the reflective layer 13 can perform a reflective function, and the light emitted by the lamp beads can pass through the substrate 11. Specifically, the light emitted by the lamp beads when energized passes through the substrate 11, is reflected by the reflective layer 13, passes through the substrate 11 again, and is then irradiated onto the diffusion plate of the display panel.

[0020] The material selected for the reflective layer 13 has light reflectivity. For example, the reflective layer 13 may be made of white ink, the reflective layer 13 may be made of vinyl acetate adhesive, the reflective layer 13 may be made of copper, the reflective layer 13 may be made of aluminum, or the reflective layer 13 may be made of silver, and the material is not specifically limited here. Also, different manufacturing processes are used depending on the material, and for example, the reflective layer 13 can be manufactured by a process such as printing, coating, sputtering, etc. The method of arranging the reflective layer 13 in this example does not require changing the structure of the backlight panel 1, and it is sufficient to provide one layer of the reflective layer 13 on the back surface of the substrate 11 of the backlight panel 1.

[0021] In this example, the backlight panel 1 further includes an auxiliary substrate 19 as shown in FIG. 2 so as to ensure that the reflective layer 13 is installed on the substrate 11 of the backlight panel 1. The auxiliary substrate 19 is provided on the reflective layer 13 so as to sandwich the reflective layer 13 between the substrate 11 and the auxiliary substrate 19. The auxiliary substrate 19 may be made of a metallic material or a non-metallic material. The auxiliary substrate 19 is bonded and screwed to the substrate 11 of the backlight panel 1 so as to further strengthen the reflective layer 13. The protective effect of the auxiliary substrate 19 improves the life of the reflective layer 13, and improves the life of the backlight panel 1 and the display panel.

[0022] As an example, the backlight panel 1 includes a substrate 11, a reflective layer 13, a white ink layer 15, a welding pad 17, and a lamp bead. As shown in FIG. 3, in this example, the reflective layer 13 is embedded in the substrate 11. For example, the reflective layer 13 is manufactured in advance, and in the process of manufacturing the substrate 11 of the backlight panel 1, the reflective layer 13 manufactured in advance is infiltrated into the material for manufacturing the substrate 11, and the reflective layer 13 is embedded in the substrate 11 as the material solidifies, thereby forming the substrate 11 with the reflective layer 13. The white ink layer 15 is provided on the substrate 11, a window is provided in the white ink layer 15, the welding pad 17 is provided in the window, and the lamp bead and the welding pad 17 are soldered. Note that the white ink layer 15 has a solder resist function on the one hand, and has a certain degree of light reflection effect on the other hand. Specifically, the white ink layer 15 is formed by solidifying white ink. The welding pad 17 is a joint of a current transmission line for connecting the lamp bead, and as an example, the welding pad 17 is a copper metal solder joint. The lamp bead emits light when current is applied. In the formation structure of the backlight panel 1, a window is provided in the white ink layer 15, and it can be understood that the window may or may not penetrate the white ink layer 15. The welding pad 17 is disposed within the window. The lamp bead and the welding pad 17 are electrically connected, and specifically, the connection end of the lamp bead can be soldered to the welding pad 17.

[0023] In the above example, the substrate 11 is a transparent substrate 11, for example a plastic substrate 11, so that the reflective layer 13 performs a reflective function. In this way, the light emitted by the lamp beads can pass through the substrate 11. Specifically, the light emitted by the lamp beads when energized passes through the substrate 11, is reflected by the reflective layer 13, and is irradiated onto the diffusion plate of the display panel.

[0024] The position where the reflective layer 13 is embedded in the substrate 11 can be changed according to actual requirements, and as an example, the reflective layer 13 is embedded in the middle region of the substrate 11 .

[0025] In the above example, the reflective layer 13 is embedded in the substrate 11, thereby preventing the reflective layer 13 from being oxidized and corroded by air or moisture, and improving the reliability of the product.

[0026] As an example, as shown in FIG. 4, the backlight panel 1 further includes a substrate 11, a reflective layer 13, a white ink layer 15, a welding pad 17, a lamp bead, and a transparent insulating layer 21. In this example, the reflective layer 13 is provided on one side of the substrate 11, the transparent insulating layer 21 is provided on the reflective layer 13, the white ink layer 15 is provided on the transparent insulating layer 21, a window is provided on the white ink layer 15, and the welding pad 17 is provided in the window. The lamp bead and the welding pad 17 are soldered. Note that the transparent insulating layer 21 is used to insulate the reflective layer 13, the welding pad 17, and the metal wiring corresponding to the welding pad 17, and when the reflective layer 13 is made of a conductive layer material, it prevents the crosstalk between the metal wiring of the welding pad 17 and the reflective layer 13 from affecting the transmission of electrical energy from the metal wiring to the lamp bead. The transparent insulating layer 21 is, for example, glass, plastic, etc. The white ink layer 15 has a solder resist function on the one hand, and a certain degree of light reflection effect on the other hand. Specifically, the white ink layer 15 is formed by solidifying the white ink. The welding pad 17 is a joint of a current transmission line for connecting the lamp bead, and as an example, the welding pad 17 is a silver metal solder joint. The lamp bead emits light when current is applied. In the formation structure of the backlight panel 1, a window is provided in the white ink layer 15, and it can be understood that the window may or may not penetrate the white ink layer 15. The welding pad 17 is disposed within the window. The lamp bead and the welding pad 17 are electrically connected, and specifically, the connection end of the lamp bead can be soldered to the welding pad 17.

[0027] In the above example, the substrate 11 may be a transparent substrate 11 or a non-transparent substrate 11. In this example, the light emitted by the lamp bead when it is energized passes through the transparent insulating layer 21, is reflected by the reflective layer 13, and passes through the transparent insulating layer 21 again.

[0028] In this example, the reflective layer 13 is set in the same layer as other structures such as the white ink layer 15 to facilitate process setup.

[0029] The reflective layer 13 may be a complete single layer of material, in other words, a continuous reflective layer 13 is formed on the substrate 11. As an example, as shown in FIG. 5, the reflective layer 13 includes sub-reflective layers 131 in the same number as the number of lamp beads. The reflective layer 13 is composed of a plurality of sub-reflective layers 131 that are independent of each other and do not contact each other, that is, the reflective layer is not complete. The sub-reflective layers 131 are provided on the substrate 11 in one-to-one correspondence with the lamp beads, that is, one sub-reflective layer 131 is provided for each lamp bead, and the sub-reflective layer 131 is used to reflect the light emitted by the corresponding lamp bead when it is energized. Depending on the method in which the reflective layer 13 is provided on the substrate 11, the sub-reflective layer 131 can also be formed in different ways. When the reflective layer 13 is provided on the second plate surface (the back surface of the substrate 11) of the substrate 11, as an example, a complete reflective layer 13 is first provided on the second plate surface, and the reflective layer 13 is cut according to the arrangement position of the lamp beads to form the sub-reflective layer 131. As another example, the sub-reflective layer 131 is prepared in advance, and the sub-reflective layer 131 is provided at the position of the corresponding lamp bead. When the reflective layer 13 is embedded in the substrate 11, the sub-reflective layer 131 is prepared in advance, and each sub-reflective layer 131 is provided according to the position of the lamp bead, and during the manufacturing process of the substrate 11, each sub-reflective layer 131 is infiltrated into the material of the substrate 11 and solidified to form. When the reflective layer 13 and the white ink layer 15 are provided on the same side of the substrate 11, as an example, a complete reflective layer 13 is provided on one surface of the substrate 11, and the reflective layer 13 is cut according to the position of the lamp bead to form the sub-reflective layer 131. As another example, the sub-reflective layer 131 is prepared in advance, and the sub-reflective layer 131 is provided at the position of the corresponding lamp bead. The area of ​​the sub-reflective layer 131 is an area that can reflect most of the light emitted toward the reflective layer 13.

[0030] In each embodiment, the backlight panel 1 is provided with a reflective layer 13, a white ink layer 15, a welding pad 17 and lamp beads by a substrate 11. A window for installing the welding pad 17 is provided in the white ink layer 15, and the lamp beads and the welding pad 17 are electrically connected. Here, the reflective layer 13 is used to reflect the light emitted by the lamp beads when electricity is applied, and realizes the reflection of the light emitted by the lamp beads toward the reflective layer 13, thereby improving the reflectance of the backlight panel 1 and improving the light utilization rate of the backlight panel 1. When the backlight panel 1 has a reflective layer 13 for improving the reflectance, the amount of the white ink layer 15 can be reduced and the thickness of the white ink layer 15 can be thinned. The thinned white ink layer 15 can be sufficiently solidified in the solidification process, and damage to the white ink layer 15 due to the occurrence of an undercut structure can be prevented in the development process. In addition, the thinned white ink layer 15 can also prevent warping due to an excessive difference in thermal expansion coefficient with the substrate 11.

[0031] According to one embodiment, a method for manufacturing a backlight panel 1 is provided, which includes the following steps, as shown in FIG.

[0032] Step S61: Provide a substrate 11. The substrate 11 may be a transparent substrate 11 or a non-transparent substrate 11. For example, the transparent substrate 11 is a glass substrate 11. For example, the non-transparent substrate 11 is a PCB (Printed Circuit Board) substrate 11, a metal (e.g., aluminum) substrate 11, etc. In particular, the substrate 11 may be set according to actual requirements and is not limited thereto.

[0033] Step S63: Form a reflective layer 13 on the substrate 11. The material for making the reflective layer 13 is any one of white ink, vinyl acetate adhesive, copper, aluminum and silver. Different manufacturing processes are used according to the material, for example, the reflective layer 13 can be made by printing, coating, sputtering, embedding and other processes. The reflective layer 13 can be arranged in at least three ways as follows. In the first method, the reflective layer 13 is provided on the back side of the substrate 11, in the second method, the reflective layer 13 is provided on the front side of the substrate 11, and in the third method, the reflective layer 13 is provided within the substrate 11. According to the different installation methods, the method for forming the reflective layer 13 on the substrate 11 is also different. In the first and third methods, the reflective layer 13 is made by printing, coating, sputtering and other processes. In the second method, the reflective layer 13 is made in advance, and the reflective layer 13 is solidified in the substrate 11 during the formation of the substrate 11.

[0034] When the reflective layer 13 includes multiple sub-reflective layers 131, the reflective layer 13 may be cut after the complete reflective layer 13 is formed on the substrate 11, or the sub-reflective layer 131 may be fabricated in advance and placed in the substrate 11. The reflective layer 13 is used to reflect a part of the light emitted by the lamp beads located on the backlight panel 1 when the lamp beads are energized.

[0035] Step S65: Form a welding pad 17 on the substrate 11. Specifically, in the process of laying a metal wiring on the front surface of the substrate 11, the welding pad 17 is provided on the metal wiring. As an example, the inside of the welding pad 17 is a metal wiring, and the outside is wrapped with an anti-oxidation layer, which is conductive. As another example, the welding pad 17 is a metal solder joint.

[0036] Step S67: A white ink layer 15 is formed on the substrate 11, a window is provided in the white ink layer 15, and a welding pad 17 is placed in the window. Specifically, white ink is applied to the substrate 11 so as to cover the welding pad 17, the white ink is solidified, and the solidified white ink is exposed and developed to form a window that exposes the welding pad 17.

[0037] Step S69: The lamp bead is soldered to the welding pad 17.

[0038] When the reflective layer 13 is provided on the front surface of the substrate 11, the following step 66 is further included between step S65 and step S67.

[0039] A transparent insulating layer 21 is formed on the reflective layer 13. A white ink layer 15 is formed on the transparent insulating layer 21. The transparent insulating layer is used to insulate the reflective layer 13, the welding pad 17 and the metal wiring corresponding to the welding pad 17, and when the reflective layer 13 is made of a conductive layer material, it prevents crosstalk between the metal wiring of the welding pad 17 and the reflective layer 13 from affecting the transmission of electrical energy from the metal wiring to the lamp bead. The transparent insulating layer 21 is, for example, glass, plastic, etc.

[0040] The backlight panel 1 manufactured by the manufacturing method of the present application reflects the light emitted by the lamp beads when they are energized by the reflective layer 13, and reflects the light emitted by the lamp beads toward the reflective layer 13, improving the reflectance of the backlight panel 1 and improving the light utilization rate of the backlight panel 1. When the backlight panel 1 has the reflective layer 13 for improving the reflectance, the amount of the white ink layer 15 can be reduced, and the thickness of the white ink layer 15 can be thinned. The thinned white ink layer 15 can be sufficiently solidified in the solidification process, and damage to the white ink layer 15 due to the occurrence of an undercut structure in the development process can be prevented. In addition, the thinned white ink layer 15 can also prevent warping due to an excessive difference in thermal expansion coefficient with the substrate 11.

[0041] The technical features of the above-mentioned embodiments may be combined in any manner. For the sake of brevity, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, any combination should be considered to be within the scope of the present specification.

[0042] The above examples show some embodiments of the present application, and the description is specific and detailed, but should not be understood as limiting the scope of the patent application of the present application. It should be noted that those skilled in the art can make some modifications and improvements without departing from the concept of the present application, all of which are within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be based on the scope of the attached claims. [Explanation of symbols]

[0043] 1: Backlight panel 11: Substrate 13: Reflective layer 131: Sub-reflective layer 15: White ink layer 17: Welding pad 19: Auxiliary board 21: Welding pad

Claims

1. The lamp includes a substrate, a reflective layer, a white ink layer, a welding pad, and a lamp bead; The reflective layer, the white ink layer, the welding pad and the lamp bead are placed on the substrate, a window is provided in the white ink layer, the welding pad is placed in the window, and the lamp bead and the welding pad are electrically connected; A backlight panel, wherein the reflective layer is provided on a side of the white ink layer closer to the substrate.

2. the substrate includes a first plate surface and a second plate surface opposed to each other; The backlight panel according to claim 1 , wherein the white ink layer, the welding pads and the lamp beads are provided on the first plate surface, and the reflective layer is provided on the second plate surface.

3. The backlight panel further includes an auxiliary substrate; The backlight panel of claim 2 , wherein the reflective layer is sandwiched between the substrate and the auxiliary substrate.

4. The backlight panel of claim 1 , wherein the reflective layer is embedded within the substrate.

5. The backlight panel of claim 4 , wherein the reflective layer is embedded in an intermediate region of the substrate.

6. the backlight panel further comprises a transparent insulating layer; The backlight panel according to claim 1 , wherein the reflective layer is provided on one side of the substrate, the transparent insulating layer is provided on the reflective layer, and the white ink layer is provided on the transparent insulating layer.

7. the reflective layer includes a number of sub-reflective layers equal to the number of lamp beads, the sub-reflective layers not contacting each other; The backlight panel according to claim 1 , wherein the sub-reflective layers are provided on the substrate in one-to-one correspondence with the lamp beads.

8. 2. The backlight panel of claim 1, wherein the material of the reflective layer is any one of the following: white ink, vinyl acetate adhesive, copper, aluminum and silver.

9. Providing a substrate; forming a reflective layer on the substrate; forming a weld pad on the substrate; forming a white ink layer on the substrate, providing a window in the white ink layer, and placing the welding pad within the window; and soldering a lamp bead to the weld pad. The method for manufacturing a backlight panel, wherein the reflective layer is provided on a side of the white ink layer closer to the substrate.

10. The display includes a main control panel, a diffusion panel, a diffusion sheet, a driving circuit panel, a vertical polarizing sheet, a TFT glass panel, a liquid crystal layer, a color filter, a horizontal polarizing sheet, and a backlight panel; the main control board, the backlight panel, the diffusion plate, the diffusion sheet, the driving circuit board, the vertical polarizing sheet, the TFT glass plate, the liquid crystal layer, the color filter, and the horizontal polarizing sheet are provided in this order; The backlight panel includes a substrate, a reflective layer, a white ink layer, a welding pad, and a lamp bead; The reflective layer, the white ink layer, the welding pad and the lamp bead are placed on the substrate, a window is provided in the white ink layer, the welding pad is placed in the window, and the lamp bead and the welding pad are electrically connected; A display panel, wherein the reflective layer is provided on a side of the white ink layer closer to the substrate.

11. the substrate includes a first plate surface and a second plate surface opposed to each other; The display panel according to claim 10 , wherein the white ink layer, the welding pads and the lamp beads are provided on the first plate surface, and the reflective layer is provided on the second plate surface.

12. The backlight panel further includes an auxiliary substrate; The display panel of claim 11 , wherein the reflective layer is sandwiched between the substrate and the auxiliary substrate.

13. The display panel of claim 10 , wherein the reflective layer is embedded in the substrate.

14. The display panel of claim 13 , wherein the reflective layer is embedded in an intermediate region in the substrate.

15. the backlight panel further comprises a transparent insulating layer; The display panel according to claim 10 , wherein the reflective layer is provided on one surface of the substrate, the transparent insulating layer is provided on the reflective layer, and the white ink layer is provided on the transparent insulating layer.

16. the reflective layer includes a number of sub-reflective layers equal to the number of lamp beads, the sub-reflective layers not contacting each other; The display panel according to claim 10 , wherein the sub-reflective layer is provided on the substrate in one-to-one correspondence with the lamp beads.

17. 11. The display panel according to claim 10, wherein the material of the reflective layer is any one of white ink, vinyl acetate adhesive, copper, aluminum and silver.

Images