Electronic Components

Abstract

To provide an electronic component which suppresses occurrence of migration even when an external electrode includes a conductive resin layer.SOLUTION: A plurality of external electrodes 5 are arranged on each of both ends of an element body 3 in a second direction D2. An internal electrode 7 is electrically connected to the corresponding external electrode 5a among the plurality of external electrodes 5. An auxiliary internal electrode 11 is arranged between a side face 3c and the internal electrode 7, and is arranged in the same layer as the internal electrode 7. The external electrode 5 has an electrode part 5c which is arranged on the side face 3c and includes a second electrode layer E2. The auxiliary internal electrode 11 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected, and is positioned between the second electrode layer E2 to which the internal electrode 7 is not electrically connected, and the internal electrode.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes a rectangular parallelepiped element body, a plurality of external electrodes, and a plurality of internal electrodes (see, for example, Patent Document 1). The element body has a pair of main surfaces facing each other in a first direction, a pair of end faces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction. The multiple external electrodes are respectively arranged on both ends of the element body in the second direction. The multiple internal electrodes are arranged within the element body so as to be aligned in the first direction, and are electrically connected to corresponding external electrodes among the multiple external electrodes. Each of the multiple external electrodes has a pair of side electrode portions respectively arranged on a pair of side surfaces and including a conductive resin layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-006501 A Summary of the Invention [Problem to be solved by the invention]

[0004] The conductive resin layer generally contains a plurality of metal particles and a resin. In this case, migration may occur in the external electrodes. Migration is considered to occur, for example, due to the following phenomena. The electric field generated between the side electrode portion and the internal electrode that is not electrically connected to the side electrode portion acts on the metal particles contained in the conductive resin layer, ionizing the metal particles. The generated metal ions are attracted to the electric field generated between the external electrodes and migrate from the conductive resin layer. The metal ions that migrate from the conductive resin layer react with electrons supplied from the element body, for example, and are precipitated as metal on the surface of the element body.

[0005] An object of one aspect of the present invention is to provide an electronic component that suppresses the occurrence of migration even when external electrodes include a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes a rectangular parallelepiped element body, a plurality of external electrodes, a plurality of internal electrodes, and a plurality of auxiliary internal electrodes. The element body has a pair of main surfaces facing each other in a first direction, a pair of end faces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction. The plurality of external electrodes are respectively arranged on both ends of the element body in the second direction. The plurality of internal electrodes are arranged in the element body so as to be aligned in the first direction, and are electrically connected to corresponding external electrodes among the plurality of external electrodes. The plurality of auxiliary internal electrodes are arranged between each of the pair of side surfaces and the plurality of internal electrodes, and in the same layer as each of the plurality of internal electrodes. Each of the plurality of external electrodes has a pair of side electrode portions respectively arranged on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to an external electrode that is not electrically connected to an internal electrode located in the same layer, and is located between the conductive resin layer that is not electrically connected to the internal electrode located in the same layer.

[0007] In the one aspect, the auxiliary internal electrode is located between the side electrode portion electrically connected to the auxiliary internal electrode and the internal electrode that is not electrically connected to the side electrode portion. That is, the auxiliary internal electrode is located between the side electrode portion and the internal electrode that are not electrically connected to each other. Therefore, the side electrode portion and the internal electrode that are not electrically connected to each other are unlikely to directly face each other in the third direction. An electric field is unlikely to be generated between the conductive resin layer included in the side electrode portion and the internal electrode that are not electrically connected to each other. As a result, the one aspect suppresses the occurrence of migration.

[0008] In the above-mentioned one aspect, in the two conductive resin layers located on the same side surface, one conductive resin layer may have an edge facing the other conductive resin layer. With a plane including the edge face taken as a reference plane, a first length of the auxiliary internal electrode in a second direction from the reference plane may be greater than a second length from the reference plane to an edge of the conductive resin layer to which the auxiliary internal electrode is electrically connected. The first length may be smaller than a third length from the reference plane to an edge of the conductive resin layer to which the auxiliary internal electrode is not electrically connected. In a configuration in which the first length is greater than the second length, the side electrode portion and the internal electrode that are not electrically connected to each other are unlikely to reliably face each other directly in the third direction, and an electric field is even less likely to be generated between the conductive resin layer included in the side electrode portion and the internal electrode that are not electrically connected to each other. In a configuration in which the first length is shorter than the third length, the auxiliary internal electrode is unlikely to face, in the third direction, a side electrode portion to which the auxiliary internal electrode is not electrically connected, and an electric field is unlikely to be generated between the auxiliary internal electrode and a conductive resin layer included in the side electrode portion, which are not electrically connected to each other. A configuration in which the first length is greater than the second length and less than the third length further suppresses the occurrence of migration.

[0009] The one aspect may include a plurality of dummy conductors. In the configuration in which the one aspect includes a plurality of dummy conductors, the plurality of dummy conductors are arranged, for example, between each of the pair of side surfaces and the plurality of internal electrodes, and in the same layer as each of the plurality of internal electrodes. Each of the plurality of dummy conductors is, for example, electrically connected to an external electrode to which the internal electrode located in the same layer is electrically connected. In the configuration in which the one aspect of the present invention includes a plurality of dummy conductors, the configuration on one end face side from the center in the second direction is unlikely to differ from the configuration on the other end face side from the center in the second direction, and therefore structural defects are unlikely to occur in the element body.

[0010] The length of the dummy conductor in the second direction from the reference surface may be smaller than the length from the reference surface to an edge of the conductive resin layer to which the dummy conductor is not electrically connected. In a configuration in which the length of the dummy conductor in the second direction from the reference plane is shorter than the length from the reference plane to the edge of the conductive resin layer to which the dummy conductor is not electrically connected, an electric field is unlikely to be generated between the dummy conductor and the conductive resin layer to which the dummy conductor is not electrically connected, and therefore this configuration reliably suppresses the occurrence of migration.

[0011] Each of the multiple external electrodes may have a pair of principal surface electrode portions disposed on the principal surface and including a conductive resin layer. An outermost internal electrode located outermost in a first direction among the multiple internal electrodes may have a first end exposed at an end surface and a second end facing the first end in a second direction and located within the element body. When the outermost internal electrode and the conductive resin layer included in the principal surface electrode portion to which the outermost internal electrode is electrically connected are viewed from the first direction, the second end may be exposed from the conductive resin layer included in the principal surface electrode portion. When the outermost internal electrode and the conductive resin layer included in the principal surface electrode portion to which the outermost internal electrode is not electrically connected are viewed from the first direction, the outermost internal electrode and the conductive resin layer included in the principal surface electrode portion may not overlap each other. In a configuration in which, when viewed from the first direction, the second end of the outermost internal electrode is exposed from the conductive resin layer included in the principal-surface electrode portion to which the outermost internal electrode is electrically connected, the internal electrode adjacent to the outermost internal electrode in the first direction and the conductive resin layer included in the principal-surface electrode portion adjacent to the same outermost internal electrode in the first direction are not electrically connected to each other, but are unlikely to face each other in the first direction. An electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other. In a configuration in which an outermost internal electrode and a conductive resin layer included in a principal-surface electrode portion to which the outermost internal electrode is not electrically connected do not overlap each other when viewed from a first direction, the outermost internal electrode is unlikely to face, in the first direction, a conductive resin layer included in a principal-surface electrode portion to which the outermost internal electrode is not electrically connected, and an electric field is unlikely to be generated between the conductive resin layer and the outermost internal electrode that are not electrically connected to each other. As a result, even in a configuration in which the external electrodes have main surface electrode portions that include a conductive resin layer, the occurrence of migration is suppressed.

[0012] The one aspect may include an inner conductor located in the same layer as the outermost inner electrode and spaced apart from the outermost inner electrode, and the inner conductor may be electrically connected to an outer electrode to which the outermost inner electrode located in the same layer as the inner conductor is not electrically connected. In a configuration in which the internal conductor is located in the same layer as the outermost internal electrode, structural defects are unlikely to occur in the element.

[0013] The one aspect may include a pair of internal conductors. In the configuration in which the one aspect includes a pair of internal conductors, the pair of internal conductors are arranged between the corresponding main surface of the pair of main surfaces and the outermost internal electrode so as to face each other in the first direction with the outermost internal electrode located on the outermost side in the first direction among the multiple internal electrodes. Each of the multiple external electrodes has, for example, a pair of main surface electrode portions arranged on the main surface and including a conductive resin layer. Each of the pair of internal conductors faces, for example, in the first direction, a conductive resin layer included in a main surface electrode portion that is not electrically connected to the outermost internal electrode facing the internal conductor in the first direction. In a configuration in which the above-mentioned one aspect includes a pair of internal conductors, the internal conductors are located in the first direction between the principal surface electrode portion that is not electrically connected to the internal conductor and the outermost internal electrode that is not electrically connected to the principal surface electrode portion. That is, the internal conductors are located in the first direction between the principal surface electrode portion and the outermost internal electrode that are not electrically connected to each other. Therefore, the principal surface electrode portion and the outermost internal electrode that are not electrically connected to each other are unlikely to directly face each other in the first direction. An electric field is unlikely to be generated between the conductive resin layer included in the principal surface electrode portion and the outermost internal electrode that are not electrically connected to each other. As a result, even in a configuration in which the external electrodes have main surface electrode portions that include a conductive resin layer, the occurrence of migration is suppressed.

[0014] The above-mentioned one aspect may include a pair of other internal conductors. In the configuration in which the above-mentioned one aspect includes a pair of other internal conductors, the pair of other internal conductors are arranged, for example, in the same layer as the corresponding one of the pair of internal conductors. Each of the pair of other internal conductors faces, for example, in the first direction to a conductive resin layer included in a main-surface electrode portion to which an outermost internal electrode facing the other internal conductor in the first direction is electrically connected. In the configuration in which the above-mentioned one embodiment includes a pair of separate internal conductors, the configuration on one end face side from the center in the second direction is unlikely to differ from the configuration on the other end face side from the center in the second direction, and therefore structural defects are unlikely to occur in the element body.

[0015] In one of the above aspects, when the internal electrode and the conductive resin layer included in the side electrode portion, which are not electrically connected to each other, are viewed from a third direction, the internal electrode and the conductive resin layer included in the side electrode portion may overlap each other. In this case, the length of the internal electrodes in the second direction becomes large, making it possible to increase the capacitance.

[0016] In the above-described one embodiment, the conductive resin layer may contain a plurality of silver particles. Effect of the Invention

[0017] One aspect of the present invention provides an electronic component that suppresses the occurrence of migration even when an external electrode includes a conductive resin layer. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional configuration of the multilayer capacitor in accordance with the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Diagram 5] FIG. 5 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 6] FIG. 6 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 7] FIG. 7 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 8] FIG. 8 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 9] FIG. 9 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 10] FIG. 10 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the third embodiment. [Figure 11] FIG. 11 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the third embodiment. [Figure 12] FIG. 12 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the third embodiment. [Figure 13] FIG. 13 is a diagram showing a cross-sectional configuration of an electronic component device according to the fourth embodiment. [Figure 14] FIG. 14 is a diagram showing a cross-sectional configuration of an electronic component device according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0020] First embodiment The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described with reference to Fig. 1 to Fig. 4. Fig. 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. Figs. 2, 3, and 4 are views showing cross-sectional configurations of the multilayer capacitor in accordance with the first embodiment. In this embodiment, the electronic component is, for example, the multilayer capacitor C1. 1, the multilayer capacitor C1 includes a rectangular parallelepiped element body 3 and a plurality of external electrodes 5. In this embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 are disposed on the outer surface of the element body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0021] The element body 3 has a pair of main surfaces 3a facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of main surfaces 3a, the pair of side surfaces 3c, and the pair of end surfaces 3e are rectangular. The direction in which the pair of main surfaces 3a face each other is a first direction D1. The direction in which the pair of side surfaces 3c face each other is a third direction D3. The direction in which the pair of end surfaces 3e face each other is a second direction D2. The multilayer capacitor C1 is solder mounted on an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, one of the main surfaces 3a faces the electronic device. The one of the main surfaces 3a is arranged to form a mounting surface. The one of the main surfaces 3a is the mounting surface.

[0022] The first direction D1 is a direction perpendicular to each of the main faces 3a and perpendicular to the third direction D3. The second direction D2 is a direction parallel to each of the main faces 3a and each of the side faces 3c and perpendicular to the first direction D1 and the third direction D3. The third direction D3 is a direction perpendicular to each of the side faces 3c, and the second direction D2 is a direction perpendicular to each of the end faces 3e. In this embodiment, the length of the element body 3 in the second direction D2 is greater than the length of the element body 3 in the first direction D1 and is greater than the length of the element body 3 in the third direction D3. The second direction D2 is the longitudinal direction of the element body 3. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may be different from each other.

[0023] The length of element body 3 in the first direction D1 is the height of element body 3. The length of element body 3 in the third direction D3 is the width of element body 3. The length of element body 3 in the second direction D2 is the length of element body 3. In this embodiment, the height of element body 3 is 0.1 to 2.5 mm, the width of element body 3 is 0.1 to 5.0 mm, and the length of element body 3 is 0.2 to 5.7 mm. For example, the height of element body 3 is 2.5 mm, the width of element body 3 is 2.5 mm, and the length of element body 3 is 3.2 mm.

[0024] The pair of side surfaces 3c extend in the first direction D1 to connect the pair of main surfaces 3a. The pair of side surfaces 3c also extend in the second direction D2. The pair of end surfaces 3e extend in the first direction D1 to connect the pair of main surfaces 3a. The pair of end surfaces 3e also extend in the third direction D3.

[0025] The element body 3 has four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between the end face 3e and the main face 3a. The ridges 3i are located between the end face 3e and the side face 3c. The ridges 3j are located between the main face 3a and the side face 3c. In this embodiment, the ridges 3g, 3i, and 3j are rounded to be curved. The element body 3 is subjected to a so-called R chamfering process. The end face 3e and the main face 3a are indirectly adjacent to each other via the ridges 3g. The end face 3e and the side face 3c are indirectly adjacent to each other via the ridges 3i. The main face 3a and the side face 3c are indirectly adjacent to each other via the ridges 3j.

[0026] The element body 3 is configured by stacking a plurality of dielectric layers in a first direction D1. The element body 3 has a plurality of dielectric layers stacked on top of each other. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the first direction D1. Each dielectric layer is configured, for example, from a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible.

[0027] As shown in Figs. 2 to 4, the multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the internal electrodes 7, 9 is an internal conductor disposed within the element body 3. Each of the internal electrodes 7, 9 is made of a conductive material that is typically used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the internal electrodes 7, 9 are made of Ni.

[0028] The internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other at an interval in the first direction D1. The internal electrodes 7 and the internal electrodes 9 have mutually different polarities. One end of the internal electrodes 7, 9 is exposed at the corresponding end face 3e. The internal electrodes 7, 9 have one end exposed at the corresponding end face 3e. The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the first direction D1. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the first direction D1. Each of the internal electrodes 7, 9 is located in a plane approximately parallel to the side surface 3c. The internal electrodes 7 and 9 face each other in the first direction D1. The direction in which the internal electrodes 7 and 9 face each other (first direction D1) is perpendicular to the direction parallel to the main surface 3a (second direction D2 and third direction D3).

[0029] As shown in FIG. 1, the external electrodes 5 are respectively arranged at both ends of the element body 3 in the second direction D2. Each external electrode 5 is arranged on the side of a corresponding end face 3e of the element body 3. In this embodiment, each external electrode 5 is arranged on a pair of main faces 3a, a pair of side faces 3c, and one end face 3e. As shown in FIGS. 2 to 4, the external electrode 5 has a plurality of electrode portions 5a, 5c, 5e. The electrode portion 5a is arranged on the main face 3a and on the ridge portion 3g. Each electrode portion 5c is arranged on the side face 3c and on the ridge portion 3i. The electrode portion 5e is arranged on the end face 3e. The external electrode 5 also has an electrode portion arranged on the ridge portion 3j.

[0030] The external electrode 5 is formed on five surfaces, namely, the pair of main surfaces 3a, one end surface 3e, and the pair of side surfaces 3c, as well as on the ridges 3g, 3i, and 3j. The electrode portions 5a, 5c, and 5e adjacent to each other are connected and electrically connected. The electrode portion 5e covers one end of the corresponding internal electrode 7, 9 in its entirety. The electrode portion 5e is directly connected to the corresponding internal electrode 7, 9. The external electrode 5 is electrically connected to the corresponding internal electrode 7, 9. As shown in Figs. 2 to 4, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a and 5e has a first electrode layer E1 and a third electrode layer E3. Each of the electrode portions 5c has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3.

[0031] The first electrode layer E1 of the electrode portion 5a is disposed on the main surface 3a and the ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed so as to cover a part of the main surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the part of the main surface 3a and the entire ridge portion 3g. That is, in the electrode portion 5a, the first electrode layer E1 is in direct contact with the element body 3. The part of the main surface 3a is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the main surface 3a is a partial region of the main surface 3a near the end surface 3e. The first electrode layer E1 of the electrode portion 5a is located on the main surface 3a. The first electrode layer E1 does not have to be formed on the main surface 3a. That is, the first electrode layer E1 does not have to be disposed on the main surface 3a. The third electrode layer E3 of the electrode unit 5a is disposed on the first electrode layer E1. In the electrode unit 5a, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode unit 5a, the third electrode layer E3 is in contact with the entire first electrode layer E1. That is, in the electrode unit 5a, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5a is located on the main surface 3a. The electrode portion 5a has a two-layer structure. A part of the electrode portion 5a constitutes, for example, a principal surface electrode portion. The part of the electrode portion 5a is, for example, a portion that is included in the electrode portion 5a and is located on the principal surface 3a.

[0032] The first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c and the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed so as to cover a part of the side surface 3c and the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the part of the side surface 3c and the entire ridge portion 3i. That is, in the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3c is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3c is a partial region of the side surface 3c near the end face 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. That is, the first electrode layer E1 does not have to be disposed on the side surface 3c. The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the entire first electrode layer E1 of the electrode portion 5c. In the electrode portion 5c, the second electrode layer E2 indirectly covers the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. Each second electrode layer E2 located on the same side surface 3c has an edge E2e. On the same side surface 3c, the edge E2e of one second electrode layer E2 faces the edge E2e of the other second electrode layer E2. The third electrode layer E3 of the electrode portion 5c is disposed on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c. The electrode portion 5c has a three-layer structure. A part of the electrode portion 5c constitutes, for example, a side electrode portion. The part of the electrode portion 5c is, for example, a portion that is included in the electrode portion 5c and is located on the side surface 3c. In the part of the electrode portion 5c, the second electrode layer E2 is in direct contact with the side surface 3c.

[0033] The first electrode layer E1 of the electrode unit 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode unit 5e is formed so as to cover the entire end surface 3e. The first electrode layer E1 of the electrode unit 5e is in contact with the entire end surface 3e. That is, in the electrode unit 5e, the first electrode layer E1 is in direct contact with the end surface 3e. The third electrode layer E3 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire first electrode layer E1. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5e is located on the end surface 3e. The electrode portion 5e has a two-layer structure and constitutes, for example, an end surface electrode portion.

[0034] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the part of the main surface 3a, the part of the side surface 3c, one end surface 3e, and the ridges 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering a metal component (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 of each electrode portion 5a, 5c, and 5e is integrally formed.

[0035] The second electrode layer E2 is formed by curing a conductive resin applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer that covers the first electrode layer E1. The conductive resin contains, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal particles. The metal particles are, for example, silver particles or copper particles. In this embodiment, the second electrode layer E2 contains a plurality of silver particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j.

[0036] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (a portion exposed from the second electrode layer E2) by plating. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 has, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder leach resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or a Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each electrode portion 5a, 5c, 5e is integrally formed.

[0037] The electrode portion 5a does not include the second electrode layer E2. The electrode portion 5c includes the second electrode layer E2. For example, when the electrode portion 5c constitutes the first electrode portion, the electrode portion 5a constitutes the second electrode portion, and the electrode portion 5e constitutes the third electrode portion. In this embodiment, the electrode portion 5e does not include the second electrode layer E2.

[0038] As shown in Figs. 2 to 4, the multilayer capacitor C1 includes a plurality of auxiliary internal electrodes 11 and a plurality of auxiliary internal electrodes 13. Each of the auxiliary internal electrodes 11, 13 is an internal conductor disposed in the element body 3. The auxiliary internal electrodes 11, 13, like the internal electrodes 7, 9, are made of a conductive material that is usually used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The auxiliary internal electrodes 11, 13 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the auxiliary internal electrodes 11, 13 are made of Ni.

[0039] As shown in FIG. 3, each of the multiple auxiliary internal electrodes 11 is arranged in the same layer as the corresponding internal electrode 7 among the multiple internal electrodes 7. Each of the multiple auxiliary internal electrodes 11 is arranged between the corresponding internal electrode 7 and the side surface 3c. In this embodiment, one internal electrode 7 and two auxiliary internal electrodes 11 are located in the same layer. One internal electrode 7 and two auxiliary internal electrodes 11 are arranged at the same position in the first direction D1. The internal electrode 7 and the auxiliary internal electrode 11 arranged in the same layer are spaced apart from each other in the third direction D3. The auxiliary internal electrode 11 is spaced apart from the side surface 3c and is not exposed to the side surface 3c.

[0040] The auxiliary internal electrode 11 has a pair of ends 11e1, 11e2 facing each other in the second direction D2. The end 11e1 is exposed at a corresponding one of a pair of end faces 3e. The end 11e2 is located within the element body 3. The end face 3e at which the end 11e1 is exposed is different from the end face 3e at which one end of the internal electrode 7 is exposed. One end of the internal electrode 7 is not exposed at the end face 3e at which the end 11e1 is exposed.

[0041] Each auxiliary internal electrode 11 is directly connected to the electrode portion 5e of the corresponding one of the pair of external electrodes 5. The end 11e1 is directly connected to the electrode portion 5e of the corresponding external electrode 5. Each auxiliary internal electrode 11 is electrically connected to the electrode portion 5e of the corresponding external electrode 5. The electrode portion 5e to which the auxiliary internal electrode 11 is electrically connected is different from the electrode portion 5e to which the internal electrode 7 is electrically connected. The internal electrode 7 is not electrically connected to the electrode portion 5e to which the auxiliary internal electrode 11 is electrically connected.

[0042] The auxiliary internal electrode 11 is located between the internal electrode 7 located in the same layer as the auxiliary internal electrode 11 and the corresponding one of the pair of side surfaces 3c. The auxiliary internal electrode 11 is located between the internal electrode 7 located in the same layer as the auxiliary internal electrode 11 and the electrode portion 5c located on the corresponding side surface 3c. The auxiliary internal electrode 11 is located between a second electrode layer E2 to which the internal electrode 7 located in the same layer as the auxiliary internal electrode 11 is not electrically connected, and the internal electrode 7 located in the same layer as the auxiliary internal electrode 11. The internal electrode 7 is located between the pair of auxiliary internal electrodes 11 located in the same layer as the internal electrode 7 in the third direction D3.

[0043] The length L11 of the auxiliary internal electrode 11 in the second direction D2 from the reference plane PL1 is greater than the length L21 in the second direction D2 from the reference plane PL1 to the end edge E2e of the second electrode layer E2 electrically connected to the auxiliary internal electrode 11. Therefore, when the auxiliary internal electrode 11 and the second electrode layer E2 to which the auxiliary internal electrode 11 is electrically connected are viewed from the third direction D3, e2 are exposed from the second electrode layer E2 to which the auxiliary internal electrodes 11 are electrically connected. The length L11 is smaller than the length L31 in the second direction D2 from the reference plane PL1 to the edge E2e of the second electrode layer E2 to which the auxiliary internal electrode 11 is not electrically connected. Therefore, when the auxiliary internal electrode 11 and the second electrode layer E2 to which the auxiliary internal electrode 11 is not electrically connected are viewed from the third direction D3, the auxiliary internal electrode 11 and the second electrode layer E2 to which the auxiliary internal electrode 11 is not electrically connected do not overlap each other. The reference plane PL1 includes the end surface 3e from which the end 11e1 is exposed. For example, when the length L11 constitutes a first length, the length L21 constitutes a second length, and the length L31 constitutes a third length.

[0044] The length L41 in the second direction D2 from the reference plane PL1 to the other end of the internal electrode 7 is smaller than the length L21. Therefore, when the internal electrode 7 that is not electrically connected to the auxiliary internal electrode 11 and the second electrode layer E2 to which the auxiliary internal electrode 11 is electrically connected are viewed from the third direction D3, the internal electrode 7 and the second electrode layer E2 to which the auxiliary internal electrode 11 is electrically connected overlap each other. The length L11 is larger than the length L41. Therefore, when the internal electrode 7 and the auxiliary internal electrode 11 located in the same layer are viewed from the third direction D3, the internal electrode 7 and the auxiliary internal electrode 11 overlap each other. In this case, the internal electrode 7 and the auxiliary internal electrode 11 located in the same layer can contribute to the formation of a capacitance. The length L11 may be smaller than the length L41.

[0045] As shown in FIG. 4, each of the multiple auxiliary internal electrodes 13 is arranged in the same layer as the corresponding internal electrode 9 among the multiple internal electrodes 9. Each of the multiple auxiliary internal electrodes 13 is arranged between the corresponding internal electrode 9 and the side surface 3c. In this embodiment, one internal electrode 9 and two auxiliary internal electrodes 13 are located in the same layer. One internal electrode 9 and two auxiliary internal electrodes 13 are arranged at the same position in the first direction D1. The internal electrode 9 and the auxiliary internal electrode 13 arranged in the same layer are spaced apart from each other in the third direction D3. The auxiliary internal electrode 13 is spaced apart from the side surface 3c and is not exposed to the side surface 3c.

[0046] The auxiliary internal electrode 13 has a pair of ends 13e1, 13e2 facing each other in the second direction D2. The end 13e1 is exposed at a corresponding one of the pair of end faces 3e. The end face 3e at which the end 13e1 is exposed is different from the end face 3e at which the end 11e1 is exposed. The end 13e2 is located within the element body 3. The end face 3e at which the end 13e1 is exposed is different from the end face 3e at which one end of the internal electrode 9 is exposed. One end of the internal electrode 9 is not exposed at the end face 3e at which the end 13e1 is exposed.

[0047] Each auxiliary internal electrode 13 is directly connected to the electrode portion 5e of the corresponding external electrode 5 of the pair of external electrodes 5. The end 13e1 is directly connected to the electrode portion 5e of the corresponding external electrode 5. Each auxiliary internal electrode 13 is electrically connected to the electrode portion 5e of the corresponding external electrode 5. The electrode portion 5e to which the auxiliary internal electrode 13 is electrically connected is different from the electrode portion 5e to which the internal electrode 9 is electrically connected. The internal electrode 9 is not electrically connected to the electrode portion 5e to which the auxiliary internal electrode 13 is electrically connected.

[0048] The auxiliary internal electrode 13 is located between the internal electrode 9 located in the same layer as the auxiliary internal electrode 13 and the corresponding one of the pair of side surfaces 3c. The auxiliary internal electrode 13 is located between the internal electrode 9 located in the same layer as the auxiliary internal electrode 13 and the electrode portion 5c located on the corresponding side surface 3c. The auxiliary internal electrode 13 is located between the second electrode layer E2 to which the internal electrode 9 located in the same layer as the auxiliary internal electrode 13 is not electrically connected, and the internal electrode 9 located in the same layer as the auxiliary internal electrode 13. The internal electrode 9 is located between the pair of auxiliary internal electrodes 13 located in the same layer as the internal electrode 9 in the third direction D3.

[0049] The length L12 of the auxiliary internal electrode 13 in the second direction D2 from the reference plane PL2 is greater than the length L22 in the second direction D2 from the reference plane PL2 to the end edge E2e of the second electrode layer E2 electrically connected to the auxiliary internal electrode 13. Therefore, when the auxiliary internal electrode 13 and the second electrode layer E2 to which the auxiliary internal electrode 13 is electrically connected are viewed from the third direction D3, e2 are exposed from the second electrode layer E2 to which the auxiliary internal electrodes 13 are electrically connected. The length L12 is smaller than the length L32 in the second direction D2 from the reference plane PL2 to the edge E2e of the second electrode layer E2 to which the auxiliary internal electrode 13 is not electrically connected. Therefore, when the auxiliary internal electrode 13 and the second electrode layer E2 to which the auxiliary internal electrode 13 is not electrically connected are viewed from the third direction D3, the auxiliary internal electrode 13 and the second electrode layer E2 to which the auxiliary internal electrode 13 is not electrically connected do not overlap each other. The reference plane PL2 includes the end surface 3e from which the end 13e1 is exposed. For example, when the length L11 constitutes the first length, the length L21 constitutes the second length, and the length L31 constitutes the third length.

[0050] The length L42 in the second direction D2 from the reference plane PL2 to the other end of the internal electrode 9 is smaller than the length L22. Therefore, when the internal electrode 9 that is not electrically connected to the auxiliary internal electrode 13 and the second electrode layer E2 to which the auxiliary internal electrode 13 is electrically connected are viewed from the third direction D3, the internal electrode 9 and the second electrode layer E2 to which the auxiliary internal electrode 13 is electrically connected overlap each other. The length L12 is larger than the length L42. Therefore, when the internal electrode 9 and the auxiliary internal electrode 13 located in the same layer are viewed from the third direction D3, the internal electrode 9 and the auxiliary internal electrode 13 overlap each other. In this case, the internal electrode 9 and the auxiliary internal electrode 13 located in the same layer can contribute to the formation of a capacitance. The length L12 may be smaller than the length L42.

[0051] Length L11 and length L12 may be the same or different. Length L21 and length L22 may be the same or different. Length L31 and length L32 may be the same or different. Length L41 and length L42 may be the same or different.

[0052] When the multilayer capacitor C1 is solder-mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act on the element body 3 through the electrode portion 5c. The external force is transmitted to the electrode portion 5c from a solder fillet formed during solder mounting. The electronic device may include, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the electrode portion 5c has the second electrode layer E2. Therefore, an external force is unlikely to act on the element body 3 from the electrode portion 5c. As a result, the multilayer capacitor C1 suppresses the occurrence of cracks in the element body 3.

[0053] In the multilayer capacitor C1, the auxiliary internal electrode 11 is located between the electrode portion 5c electrically connected to the auxiliary internal electrode 11 and the internal electrode 7. The internal electrode 7 is not electrically connected to the electrode portion 5c electrically connected to the auxiliary internal electrode 11. The auxiliary internal electrode 13 is located between the electrode portion 5c electrically connected to the auxiliary internal electrode 13 and the internal electrode 9. The internal electrode 9 is not electrically connected to the electrode portion 5c electrically connected to the auxiliary internal electrode 13. The auxiliary internal electrode 11 is located between the electrode portion 5c and the internal electrode 7, which are not electrically connected to each other. The auxiliary internal electrode 13 is located between the electrode portion 5c and the internal electrode 9, which are not electrically connected to each other. Therefore, the electrode portion 5c and the internal electrode 7 that are not electrically connected to each other are unlikely to directly face each other in the third direction D3. An electric field is unlikely to be generated between the second electrode layer E2 included in the electrode portion 5c and the internal electrode 7 that are not electrically connected to each other. The electrode portion 5c and the internal electrode 9 that are not electrically connected to each other are also unlikely to directly face each other in the third direction D3. An electric field is unlikely to be generated between the second electrode layer E2 included in the electrode portion 5c and the internal electrode 9 that are not electrically connected to each other. As a result, the multilayer capacitor C1 suppresses the occurrence of migration.

[0054] In the multilayer capacitor C1, the lengths L11, L12 are greater than the lengths L21, L22, and the lengths L11, L12 are smaller than the lengths L31, L32. When the length L11 is equal to or smaller than the length L21, the electrode portion 5c and the internal electrode 7, which are not electrically connected to each other, are unlikely to directly face each other in the third direction D3. An electric field is even less likely to be generated between the second electrode layer E2 included in the electrode portion 5c, which are not electrically connected to each other, and the internal electrode 7. When the length L12 is equal to or smaller than the length L22, the electrode portion 5c and the internal electrode 9, which are not electrically connected to each other, are unlikely to directly face each other in the third direction D3. An electric field is even less likely to be generated between the second electrode layer E2 included in the electrode portion 5c, which are not electrically connected to each other, and the internal electrode 9. In a configuration in which the length L11 is smaller than the length L31, the auxiliary internal electrode 11 is unlikely to face, in the third direction D3, an electrode portion 5c to which the auxiliary internal electrode 11 is not electrically connected. An electric field is unlikely to be generated between the auxiliary internal electrode 11 and the second electrode layer E2 included in the electrode portion 5c, which are not electrically connected to each other. In a configuration in which the length L12 is smaller than the length L32, the auxiliary internal electrode 13 is unlikely to face, in the third direction D3, an electrode portion 5c to which the auxiliary internal electrode 13 is not electrically connected. An electric field is unlikely to be generated between the auxiliary internal electrode 13 and the second electrode layer E2 included in the electrode portion 5c, which are not electrically connected to each other. As a result, the multilayer capacitor C1 further suppresses the occurrence of migration.

[0055] In the multilayer capacitor C1, when the internal electrode 7 and the second electrode layer E2 to which the auxiliary internal electrode 11 is electrically connected are viewed from the third direction D3, the internal electrode 7 and the second electrode layer E2 to which the auxiliary internal electrode 11 is electrically connected overlap each other. When the internal electrode 9 and the second electrode layer E2 to which the auxiliary internal electrode 13 is electrically connected are viewed from the third direction D3, the internal electrode 9 and the second electrode layer E2 to which the auxiliary internal electrode 13 is electrically connected overlap each other. In this case, the length of the internal electrodes 7, 9 in the second direction D2 becomes large, and the capacitance of the multilayer capacitor C1 can be increased.

[0056] The second electrode layer E2 contains a plurality of silver particles. Silver particles tend to cause migration more easily than, for example, copper particles. The multilayer capacitor C1 reliably suppresses the occurrence of migration even when the second electrode layer E2 contains a plurality of silver particles.

[0057] Next, the configuration of a multilayer capacitor according to a modified example of the first embodiment will be described with reference to Fig. 5 and Fig. 6. Fig. 5 and Fig. 6 are diagrams showing the cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the above embodiment in the configuration of the conductors arranged in the element body 3. Below, the differences between the first embodiment and this modified example will be mainly described.

[0058] As shown in Figs. 5 and 6, the multilayer capacitor C1 includes a plurality of conductors 15 and a plurality of conductors 17. Each of the conductors 15 and 17 is an internal conductor disposed in the element body 3. The conductors 15 and 17, like the internal electrodes 7 and 9, are made of a conductive material that is typically used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The conductors 15 and 17 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the conductors 15 and 17 are made of Ni.

[0059] As shown in FIG. 5, each of the multiple conductors 15 is arranged in the same layer as the corresponding internal electrode 7 among the multiple internal electrodes 7. Each of the multiple conductors 15 is arranged between the corresponding internal electrode 7 and the side surface 3c. In this embodiment, one internal electrode 7, two auxiliary internal electrodes 11, and two conductors 15 are located in the same layer. One internal electrode 7, two auxiliary internal electrodes 11, and two conductors 15 are arranged at the same position in the first direction D1. The internal electrode 7 and the conductor 15 arranged in the same layer are spaced apart from each other in the third direction D3. The conductor 15 is spaced apart from the side surface 3c and is not exposed to the side surface 3c. The auxiliary internal electrode 11 and the conductor 15 arranged in the same layer and located between one side surface 3c and the internal electrode 7 are spaced apart from each other in the second direction D2.

[0060] The conductor 15 has a pair of ends 15e1, 15e2 facing each other in the second direction D2. The end 15e1 is exposed at a corresponding one of the pair of end faces 3e. The end 15e1 is exposed at the end face 3e at which the internal electrode 7 is exposed. One end of the internal electrode 7 is exposed at the end face 3e at which the end 15e1 is exposed. The end face 3e at which the end 15e1 is exposed is different from the end face 3e at which the end 11e1 is exposed. The end 15e2 is located within the element body 3. Each conductor 15 is directly connected to the electrode portion 5e of the corresponding one of the pair of external electrodes 5. An end 15e1 is directly connected to the electrode portion 5e of the corresponding external electrode 5. Each conductor 15 is electrically connected to the electrode portion 5e of the corresponding external electrode 5. The conductor 15 is electrically connected to the electrode portion 5e to which the internal electrode 7 is electrically connected.

[0061] The conductor 15 is located between the internal electrode 7 located in the same layer as the conductor 15 and the corresponding one of the pair of side surfaces 3c. The conductor 15 is located between the internal electrode 7 located in the same layer as the conductor 15 and the electrode portion 5c located on the corresponding side surface 3c. The conductor 15 is located between the second electrode layer E2 to which the internal electrode 7 located in the same layer as the conductor 15 is electrically connected, and the internal electrode 7 located in the same layer as the conductor 15. The internal electrode 7 is located between the pair of conductors 15 located in the same layer as the internal electrode 7 in the third direction D3. The conductor 15 faces the auxiliary internal electrode 13 in the first direction D1.

[0062] The length L51 of the conductor 15 in the second direction D2 from the reference plane PL2 is smaller than the length L32 in the second direction D2 from the reference plane PL2 to the edge E2e of the second electrode layer E2 that is not electrically connected to the conductor 15. Therefore, when the conductor 15 and the second electrode layer E2 to which the conductor 15 is not electrically connected are viewed from the third direction D3, e2 is exposed from the second electrode layer E2 to which the conductor 15 is not electrically connected. In this modification, the reference plane PL2 includes the end face 3e from which the end 15e1 is exposed. The conductor 15 constitutes, for example, a dummy conductor that is unlikely to contribute to the formation of capacitance.

[0063] As shown in FIG. 6, each of the multiple conductors 17 is arranged in the same layer as the corresponding internal electrode 9 among the multiple internal electrodes 9. Each of the multiple conductors 17 is arranged between the corresponding internal electrode 9 and the side surface 3c. In this embodiment, one internal electrode 9, two auxiliary internal electrodes 13, and two conductors 17 are located in the same layer. One internal electrode 9, two auxiliary internal electrodes 13, and two conductors 17 are arranged at the same position in the first direction D1. The internal electrode 9 and the conductor 17 arranged in the same layer are spaced apart from each other in the third direction D3. The conductor 17 is spaced apart from the side surface 3c and is not exposed to the side surface 3c. The auxiliary internal electrode 13 and the conductor 17 arranged in the same layer and located between one side surface 3c and the internal electrode 9 are spaced apart from each other in the second direction D2.

[0064] The conductor 17 has a pair of ends 17e1, 17e2 facing each other in the second direction D2. The end 17e1 is exposed at a corresponding one of the pair of end faces 3e. The end 17e1 is exposed at the end face 3e at which the internal electrode 9 is exposed. One end of the internal electrode 9 is exposed at the end face 3e at which the end 17e1 is exposed. The end face 3e at which the end 17e1 is exposed is different from the end face 3e at which the end 13e1 is exposed. The end 17e2 is located within the element body 3. Each conductor 17 is directly connected to the electrode portion 5e of the corresponding one of the pair of external electrodes 5. An end 17e1 is directly connected to the electrode portion 5e of the corresponding external electrode 5. Each conductor 17 is electrically connected to the electrode portion 5e of the corresponding external electrode 5. The conductor 17 is electrically connected to the electrode portion 5e to which the internal electrode 9 is electrically connected.

[0065] The conductor 17 is located between the internal electrode 9 located in the same layer as the conductor 17 and the corresponding one of the pair of side surfaces 3c. The conductor 17 is located between the internal electrode 7 located in the same layer as the conductor 17 and the electrode portion 5c located on the corresponding side surface 3c. The conductor 17 is located between the second electrode layer E2 to which the internal electrode 9 located in the same layer as the conductor 17 is electrically connected, and the internal electrode 9 located in the same layer as the conductor 17. The internal electrode 9 is located between the pair of conductors 17 located in the same layer as the internal electrode 9 in the third direction D3. The conductor 17 faces the auxiliary internal electrode 11 in the first direction D1.

[0066] The length L52 of the conductor 17 in the second direction D2 from the reference plane PL1 is smaller than the length L31 in the second direction D2 from the reference plane PL1 to the edge E2e of the second electrode layer E2 that is not electrically connected to the conductor 17. Therefore, when the conductor 17 and the second electrode layer E2 to which the conductor 17 is not electrically connected are viewed from the third direction D3, e2 is exposed from the second electrode layer E2 to which the conductor 17 is not electrically connected. In this modification, the reference plane PL1 includes the end face 3e from which the end 17e1 is exposed. The conductor 17 constitutes, for example, a dummy conductor that is unlikely to contribute to the formation of capacitance. Length L51 and length L52 may be the same or different. Length L11 and length L51 may be the same or different. Length L12 and length L52 may be the same or different.

[0067] In this modification, the multilayer capacitor C1 includes a plurality of conductors 15 and a plurality of conductors 17. Each of the plurality of conductors 15 is located in the same layer as the corresponding auxiliary internal electrode 11 among the plurality of auxiliary internal electrodes 11, and is exposed at the end face 3e where the corresponding auxiliary internal electrode 11 is not exposed. Each of the plurality of conductors 17 is located in the same layer as the corresponding auxiliary internal electrode 13 among the plurality of auxiliary internal electrodes 13, and is exposed at the end face 3e where the corresponding auxiliary internal electrode 13 is not exposed. In the multilayer capacitor C1, the configuration on one end face 3e side from the center in the second direction D2 is unlikely to differ from the configuration on the other end face 3e side from the center in the second direction D2. Therefore, structural defects are unlikely to occur in the element body 3.

[0068] In this modified example, the length L51 is shorter than the length L32. Therefore, an electric field is unlikely to be generated between the conductor 15 and the second electrode layer E2 to which the conductor 15 is not electrically connected. The length L52 is smaller than the length L31. Therefore, an electric field is unlikely to be generated between the conductor 17 and the second electrode layer E2 to which the conductor 17 is not electrically connected. A configuration in which the length L51 is smaller than the length L32 and the length L52 is smaller than the length L31 reliably suppresses the occurrence of migration.

[0069] Second Embodiment The configuration of the multilayer capacitor C2 in accordance with the second embodiment will be described with reference to Figs. 7 to 9. Figs. 7, 8, and 9 are diagrams showing the cross-sectional configuration of the multilayer capacitor in accordance with the second embodiment. The multilayer capacitor C2 is generally similar to or the same as the multilayer capacitor C1, but the multilayer capacitor C2 differs from the multilayer capacitor C1 in terms of the configurations of the electrode portions 5a, 5e and the internal electrodes 7, 9. The following mainly describes the differences between the multilayer capacitor C1 and the multilayer capacitor C2. In this embodiment, the electronic component is, for example, the multilayer capacitor C2.

[0070] As shown in Figs. 7 to 9, the multilayer capacitor C2 includes a rectangular parallelepiped element body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. In this embodiment, the multilayer capacitor C2 includes a pair of external electrodes 5. The element body 3 has a pair of main surfaces 3a facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. Each external electrode 5 includes a plurality of electrode portions 5a, 5c, and 5e. Each of the electrode portions 5a, 5c, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3.

[0071] The electrode portion 5a has a three-layer structure. The second electrode layer E2 of the electrode unit 5a is disposed on the first electrode layer E1 and the main surface 3a. In the electrode unit 5a, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the main surface 3a. In the electrode unit 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the main surface 3a. The second electrode layer E2 of the electrode unit 5a is formed so as to cover the first electrode layer E1 of the electrode unit 5a. In the electrode unit 5a, the second electrode layer E2 indirectly covers the main surface 3a so that the first electrode layer E1 is located between the second electrode layer E2 and the main surface 3a. The second electrode layer E2 of the electrode unit 5a is located on the main surface 3a. The third electrode layer E3 of the electrode unit 5a is disposed on the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode unit 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5a is located on the main surface 3a.

[0072] The electrode portion 5e has a three-layer structure. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is formed so as to cover the entire first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 indirectly covers the end surface 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The second electrode layer E2 of the electrode unit 5e is located on the end surface 3e. The third electrode layer E3 of the electrode unit 5e is disposed on the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The second electrode layer E2 of each of the electrode portions 5a, 5c, 5e is integrally formed.

[0073] In this embodiment, the multiple internal electrodes 7 include one internal electrode 7A located outermost in the first direction D1. The internal electrode 7A is the outermost internal electrode. The internal electrode 7A has a pair of ends 7Ae1, 7Ae2 facing each other in the second direction D2. The end 7Ae1 is exposed at the end face 3e. The end 7Ae2 is located within the element body 3. In this embodiment, the multiple internal electrodes 9 include one internal electrode 9A located outermost in the first direction D1. The internal electrode 9A is the outermost internal electrode. The internal electrode 9A has a pair of ends 9Ae1, 9Ae2 facing each other in the second direction D2. The end 9Ae1 is exposed at the end face 3e. The end 9Ae2 is located within the element body 3. For example, if each end 7Ae1, 9Ae1 constitutes a first end, then the ends 7Ae2, 9Ae2 constitute a second end.

[0074] 7, the length L62 of the internal electrode 7A in the second direction D2 from the reference plane PL2 is greater than the length L22 in the second direction D2 from the reference plane PL2 to the edge E2e of the second electrode layer E2 electrically connected to the internal electrode 7A. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed from the first direction D1, e2 is exposed from the second electrode layer E2 to which the internal electrode 7A is electrically connected. The length L62 is smaller than the length L32 in the second direction D2 from the reference plane PL2 to the edge E2e of the second electrode layer E2 to which the internal electrode 7A is not electrically connected. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected are viewed from the first direction D1, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected do not overlap each other. The reference plane PL2 includes an end surface 3e at which the end 7Ae1 of the internal electrode 7A is exposed.

[0075] The length L61 of the internal electrode 9A in the second direction D2 from the reference plane PL1 is greater than the length L21 in the second direction D2 from the reference plane PL1 to the end edge E2e of the second electrode layer E2 electrically connected to the internal electrode 9A. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the first direction D1, e2 is exposed from the second electrode layer E2 to which the internal electrode 9A is electrically connected. The length L61 is smaller than the length L31 in the second direction D2 from the reference plane PL1 to the edge E2e of the second electrode layer E2 to which the internal electrode 9A is not electrically connected. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected are viewed from the first direction D1, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected do not overlap each other. The reference plane PL1 includes the end surface 3e where the end 9Ae1 of the internal electrode 9A is exposed. The length L61 and the length L62 may be the same or different. The lengths L61 and L62 may be the same or different from the lengths L11 and L12.

[0076] As shown in Figures 7 to 9, the multilayer capacitor C1 includes a plurality of internal conductors 21, 23. The plurality of internal conductors 21, 23 are disposed within an element body 3. In this embodiment, the multilayer capacitor C2 includes two internal conductors 21, 23. For the sake of explanation, in Figures 8 and 9, the internal electrodes 7, 9 (the internal electrodes 7A, 9A) and the internal conductors 21, 23 are intentionally illustrated as being shifted from each other in the third direction D3. The internal conductors 21 and 23, like the internal electrodes 7 and 9, are made of a conductive material that is typically used as an internal conductor for a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal conductors 21 and 23 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the internal conductors 21 and 23 are made of Ni.

[0077] The internal conductor 21 is located in the same layer as the internal electrode 7A and is spaced apart from the internal electrode 7A. The internal conductor 21 has one end exposed at the corresponding end face 3e. One end of the internal conductor 21 is exposed at the end face 3e where one end of the internal electrode 9 is exposed. One end of the internal conductor 21 is entirely covered by the corresponding electrode portion 5e. The internal conductor 21 is directly connected to the corresponding electrode portion 5e. The internal conductor 21 is electrically connected to the corresponding external electrode 5. In this embodiment, the internal conductor 21 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9 is electrically connected. That is, the internal conductor 21 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected. The internal conductor 23 is located in the same layer as the internal electrode 9A and is spaced apart from the internal electrode 9A. The internal conductor 23 has one end exposed at the corresponding end face 3e. One end of the internal conductor 23 is exposed at the end face 3e where one end of the internal electrode 7 is exposed. One end of the internal conductor 23 is entirely covered by the corresponding electrode portion 5e. The internal conductor 23 is directly connected to the corresponding electrode portion 5e. The internal conductor 23 is electrically connected to the corresponding external electrode 5. In this embodiment, the internal conductor 23 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7 is electrically connected. That is, the internal conductor 23 is electrically connected to the external electrode 5 to which the internal electrode 9 is not electrically connected. The internal conductors 21 and 23 constitute, for example, dummy conductors that are unlikely to contribute to the formation of capacitance.

[0078] When the multilayer capacitor C2 is solder-mounted on an electronic device, there is a risk that an external force acting on the multilayer capacitor C2 from the electronic device will act on the element body 3 through the electrode portions 5a. The external force is transmitted from the electronic device to the electrode portions 5a. In the multilayer capacitor C2, the electrode portion 5a has the second electrode layer E2. Therefore, external force is unlikely to act from the electrode portion 5a to the element body 3. As a result, the multilayer capacitor C2 further suppresses the occurrence of cracks in the element body 3.

[0079] In the multilayer capacitor C2, the length L61 is longer than the length L21. Therefore, the internal electrode 7 adjacent to the internal electrode 9A in the first direction D1 and the second electrode layer E2 included in the electrode portion 5a adjacent to the internal electrode 9A in the first direction D1 are not electrically connected to each other, but are unlikely to face each other in the first direction D1. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7 that are not electrically connected to each other. The length L62 is greater than the length L22. Therefore, the internal electrode 9 adjacent to the internal electrode 7A in the first direction D1 and the second electrode layer E2 included in the electrode portion 5a adjacent to the internal electrode 7A in the first direction D1 are not electrically connected to each other, but are unlikely to face each other in the first direction D1. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9 that are not electrically connected to each other. The length L61 is shorter than the length L31. Therefore, the internal electrode 9A is unlikely to face, in the first direction D1, the second electrode layer E2 included in the electrode portion 5a to which the internal electrode 9A is not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9A, which are not electrically connected to each other. The length L62 is shorter than the length L32. Therefore, the internal electrode 7A is unlikely to face, in the first direction D1, the second electrode layer E2 included in the electrode portion 5a to which the internal electrode 7A is not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A, which are not electrically connected to each other. As a result, the multilayer capacitor C2 suppresses the occurrence of migration.

[0080] The multilayer capacitor C2 includes internal conductors 21 and 23. The internal conductor 21 is electrically connected to an external electrode 5 to which the internal electrode 7A is not electrically connected. The internal conductor 23 is electrically connected to an external electrode 5 to which the internal electrode 9A is not electrically connected. In the multilayer capacitor C2 in which the internal conductor 21 is located in the same layer as the internal electrode 7A and the internal conductor 23 is located in the same layer as the internal electrode 9A, the configuration on one end face 3e side from the center in the second direction D2 is unlikely to differ from the configuration on the other end face 3e side from the center in the second direction D2. Therefore, structural defects are unlikely to occur in the element body 3.

[0081] Third embodiment The configuration of the multilayer capacitor C3 in accordance with the third embodiment will be described with reference to Figs. 10 to 12. Figs. 10, 11, and 12 are diagrams showing the cross-sectional configuration of the multilayer capacitor in accordance with the second embodiment. The multilayer capacitor C3 is generally similar to or the same as the multilayer capacitor C2, but the multilayer capacitor C3 differs from the multilayer capacitor C2 in terms of the configuration of the conductors disposed in the element body 3. The following mainly describes the differences between the multilayer capacitor C2 and the multilayer capacitor C3. In this embodiment as well, the electronic component is, for example, the multilayer capacitor C3.

[0082] As shown in Figs. 10 to 12, the multilayer capacitor C3 includes a rectangular parallelepiped element body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. In this embodiment, the multilayer capacitor C3 includes a pair of external electrodes 5. The element body 3 includes a pair of main surfaces 3a facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. Each of the external electrodes 5 includes a plurality of electrode portions 5a, 5c, and 5e. Each of the electrode portions 5a, 5c, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3.

[0083] As shown in Figures 10 to 12, the multilayer capacitor C3 includes a pair of internal conductor layers 31, 33. The pair of internal conductor layers 31, 33 are disposed within the element body 3. In Figures 11 and 12, for the sake of explanation, the internal electrodes 7A, 9A and the internal conductor layers 31, 33 are intentionally illustrated as being shifted from each other in the third direction D3.

[0084] The internal conductor layer 31 is adjacent to one of the principal surfaces 3a in the first direction D1. The internal conductor layer 31 is adjacent to the internal electrode 7A in the first direction D1. The internal conductor layer 31 is located between one of the principal surfaces 3a and the internal electrode 7A. The internal conductor layer 31 includes an internal conductor 31a and an internal conductor 31b. The internal conductor 31a faces, in the first direction D1, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on one of the principal faces 3a. Therefore, the internal conductor 31a faces, in the first direction D1, the second electrode layer E2 included in the electrode part 5a to which the internal electrode 7A is not electrically connected. The internal conductor 31b faces, in the first direction D1, the second electrode layer E2 to which the internal electrode 7A is electrically connected and which is disposed on one of the principal surfaces 3a. For example, when the inner conductor 31a constitutes one inner conductor, the inner conductor 31b constitutes another inner conductor.

[0085] The internal conductor 31a is spaced apart from the internal conductor 31b in the second direction D2 and is not electrically connected to any of the second electrode layers E2. The internal conductor 31a does not have an end exposed on the surface of the element body 3. The internal conductor 31b is electrically connected to a second electrode layer E2 included in the electrode portion 5a facing the internal conductor 31b in the first direction D1. The internal conductor 31b has an end exposed at the end face 3e where the internal electrode 7A is exposed. The internal conductor 31b is directly connected at the end exposed at the end face 3e to the external electrode 5 (electrode portion 5e) to which the internal electrode 7A is electrically connected. The internal conductor 31b is electrically connected to the external electrode 5 to which the internal electrode 7A is electrically connected. The internal conductor 31b does not have to be electrically connected to any of the second electrode layers E2. The internal conductors 31a and 31b constitute, for example, dummy conductors that are unlikely to contribute to the formation of capacitance.

[0086] The internal conductor layer 33 is adjacent to the other principal surface 3a in the first direction D1. The internal conductor layer 33 is adjacent to the internal electrode 9A in the first direction D1. The internal conductor layer 33 is located between the other principal surface 3a and the internal electrode 9A. The internal conductor layer 33 includes an internal conductor 33a and an internal conductor 33b. The internal conductor 33a faces, in the first direction D1, the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on the other main surface 3a. Therefore, the internal conductor 33a faces, in the first direction D1, the second electrode layer E2 included in the electrode portion 5a to which the internal electrode 9A is not electrically connected. The internal conductor 33b faces, in the first direction D1, the second electrode layer E2 to which the internal electrode 9A is electrically connected and which is disposed on the other main surface 3a. For example, when the inner conductor 33a constitutes one inner conductor, the inner conductor 33b constitutes another inner conductor.

[0087] The internal conductor 33a is spaced apart from the internal conductor 33b in the second direction D2 and is not electrically connected to any of the second electrode layers E2. The internal conductor 33a does not have an end exposed on the surface of the element body 3. The internal conductor 33b is electrically connected to a second electrode layer E2 included in the electrode portion 5a facing the internal conductor 33b in the first direction D1. The internal conductor 33b has an end exposed at the end face 3e where the internal electrode 9A is exposed. The internal conductor 33b is directly connected at the end exposed at the end face 3e to the external electrode 5 (electrode portion 5e) to which the internal electrode 9A is electrically connected. The internal conductor 33b is electrically connected to the external electrode 5 to which the internal electrode 9A is electrically connected. The internal conductor 33b does not have to be electrically connected to any second electrode layer E2. The internal conductors 33a and 33b constitute, for example, dummy conductors that are unlikely to contribute to the formation of capacitance.

[0088] The end 7Ae2 overlaps with the internal conductor 31a when viewed from the first direction D1. In the positional relationship between the internal electrode 7A, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on one of the principal surfaces 3a, and the internal conductor 31a, the internal conductor 31a is located between the internal electrode 7A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on one of the principal surfaces 3a do not face each other in the first direction D1.

[0089] The end 9Ae2 overlaps with the internal conductor 33a when viewed from the first direction D1. In the positional relationship between the internal electrode 9A, the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on the other main surface 3a, and the internal conductor 33a, the internal conductor 33a is located between the internal electrode 9A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on the other main surface 3a do not face each other in the first direction D1.

[0090] The internal conductors 31a, 31b, 33a, and 33b are made of a conductive material that is generally used as an internal conductor of a multilayer electronic component, similar to the internal electrodes 7 and 9. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal conductors 31a, 31b, 33a, and 33b are formed as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the internal conductors 31a, 31b, 33a, and 33b are made of Ni.

[0091] In the multilayer capacitor C3, the internal conductor layer 31 is located between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The internal conductor layer 31 separates the second electrode layer E2 from the internal electrode 7A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. The internal conductor layer 33 is located between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. The internal conductor layer 33 separates the second electrode layer E2 from the internal electrode 9A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. As a result, the multilayer capacitor C3 suppresses the occurrence of migration.

[0092] The internal conductor 31a faces the second electrode layer E2 in the first direction D1 to which the internal electrode 7A adjacent to the internal conductor 31a in the first direction D1 is not electrically connected. The internal conductor 31a is located between the electrode portion 5a not electrically connected to the internal conductor 31a and the internal electrode 7A not electrically connected to the electrode portion 5a in the first direction D1. That is, the internal conductor 31a is located between the electrode portion 5a and the internal electrode 7A that are not electrically connected to each other in the first direction D1. Therefore, the electrode portion 5a and the internal electrode 7A that are not electrically connected to each other are unlikely to directly face each other in the first direction D1. An electric field is unlikely to be generated between the second electrode layer E2 included in the electrode portion 5a and the internal electrode 7A that are not electrically connected to each other. The internal conductor 33a faces the second electrode layer E2 in the first direction D1 to which the internal electrode 9A adjacent to the internal conductor 33a in the first direction D1 is not electrically connected. The internal conductor 33a is located between the electrode portion 5a not electrically connected to the internal conductor 33a and the internal electrode 9A not electrically connected to the electrode portion 5a in the first direction D1. That is, the internal conductor 33a is located between the electrode portion 5a and the internal electrode 9A that are not electrically connected to each other in the first direction D1. Therefore, the electrode portion 5a and the internal electrode 9A that are not electrically connected to each other are unlikely to directly face each other in the first direction D1. An electric field is unlikely to be generated between the second electrode layer E2 included in the electrode portion 5a and the internal electrode 9A that are not electrically connected to each other. As a result, the multilayer capacitor C3 reliably suppresses the occurrence of migration.

[0093] The end 7Ae2 overlaps with the internal conductor 31a when viewed from the first direction D1. Therefore, it is even less likely that an electric field will be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The end 9Ae2 overlaps with the internal conductor 33a when viewed from the first direction D1. Therefore, it is even less likely that an electric field will be generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. As a result, the multilayer capacitor C3 more reliably suppresses the occurrence of migration.

[0094] The internal conductor 31b is disposed in the same layer as the internal conductor 31a. The internal conductor 31b faces, in the first direction D1, the second electrode layer E2 included in the electrode unit 5a to which the internal electrode 7A is electrically connected. The internal conductor 33b is disposed in the same layer as the internal conductor 33a. The internal conductor 33b faces, in the first direction D1, the second electrode layer E2 included in the electrode unit 5a to which the internal electrode 9A is electrically connected. In the multilayer capacitor C3 in which the internal conductors 31b and 31a are located in the same layer and the internal conductors 33b and 33a are located in the same layer, the configuration on one end face 3e side from the center in the second direction D2 is unlikely to differ from the configuration on the other end face 3e side from the center in the second direction D2, and therefore structural defects are unlikely to occur in the element body 3.

[0095] (Fourth embodiment) The configuration of an electronic component device ECD according to the fourth embodiment will be described with reference to Fig. 13 and Fig. 14. Fig. 13 and Fig. 14 are diagrams showing a cross-sectional configuration of the electronic component device according to the fourth embodiment.

[0096] As shown in Fig. 13 and Fig. 14, the electronic component device ECD includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or an electronic component. The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED has a main surface EDa and two pad electrodes PE. Each pad electrode PE is arranged on the main surface EDa. The two pad electrodes PE are spaced apart from each other. The multilayer capacitor C1 is arranged on the electronic device ED such that the main surface 3a, which is the mounting surface, faces the main surface EDa. Each internal electrode 7, 9 is located in a plane that is approximately perpendicular to the main surface EDa.

[0097] When the multilayer capacitor C1 is solder-mounted, molten solder wets and rises up the external electrodes 5 (third electrode layers E3). When the wetted solder solidifies, solder fillets SF are formed on the external electrodes 5. The corresponding external electrodes 5 and pad electrodes PE are connected via the solder fillets SF.

[0098] The above describes the embodiments and modifications of the present invention, but the present invention is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible without departing from the spirit of the present invention.

[0099] The electronic component device ECD may include a multilayer capacitor C2 or a multilayer capacitor C3 instead of the multilayer capacitor C1.

[0100] In the present embodiment and the modified example, the multilayer capacitors C1, C2, and C3 are used as examples of electronic components, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer composite components, or electronic components other than multilayer electronic components. [Explanation of symbols]

[0101] 3…body, 3a…main surface, 3c…side surface, 3e…end surface, 5…external electrode, 5a, 5c, 5e…electrode portion, 7, 9, 7A, 9A…internal electrode, 7Ae1, 7Ae2, 9Ae1, 9Ae2…end of internal electrode, 11, 13…auxiliary internal electrode, 15, 17…conductor, 21, 23, 31a, 31b, 33a, 33b…internal conductor, C1, C2, C3…layered conductor, D1…first direction, D2…second direction, D3…third direction, E2…second electrode layer, E2e…end edge of second electrode layer.

Claims

1. an element body having a rectangular parallelepiped shape, the element body having a pair of main surfaces facing each other in a first direction, a pair of end surfaces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction; a plurality of external electrodes disposed on both ends of the element body in the second direction; a plurality of internal electrodes arranged in the element body so as to be aligned in the first direction and electrically connected to corresponding ones of the plurality of external electrodes; a plurality of auxiliary internal electrodes disposed between each of the pair of side surfaces and the plurality of internal electrodes and in the same layer as each of the plurality of internal electrodes; Each of the plurality of external electrodes is a pair of principal surface electrode portions that are respectively disposed on the pair of principal surfaces and do not include a conductive resin layer; a pair of side electrode portions each of which is disposed on the pair of side surfaces and includes a conductive resin layer; an electronic component, wherein each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and the auxiliary internal electrodes are located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.

2. An electronic component as described in claim 1, wherein each of the plurality of external electrodes further has an end face electrode portion that is arranged on a corresponding one of the pair of end faces and does not include a conductive resin layer.

3. an element body having a rectangular parallelepiped shape, the element body having a pair of main surfaces facing each other in a first direction, a pair of end surfaces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction; a plurality of external electrodes disposed on both ends of the element body in the second direction; a plurality of internal electrodes arranged in the element body so as to be aligned in the first direction and electrically connected to corresponding ones of the plurality of external electrodes; a plurality of auxiliary internal electrodes disposed between each of the pair of side surfaces and the plurality of internal electrodes and in the same layer as each of the plurality of internal electrodes; Each of the plurality of external electrodes is a pair of principal surface electrode portions each disposed on the pair of principal surfaces and including a base metal layer in contact with the principal surfaces and a plating layer in contact with the base metal layer; a pair of side electrode portions each disposed on the pair of side surfaces and including a base metal layer in contact with the side surfaces, a conductive resin layer in contact with the base metal layer, and a plating layer in contact with the conductive resin layer; an electronic component, wherein each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and the auxiliary internal electrodes are located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.

4. An electronic component as described in claim 3, wherein each of the plurality of external electrodes is arranged on a corresponding one of the pair of end faces, and further has an end face electrode portion including an underlying metal layer in contact with the end face and a plating layer in contact with the underlying metal layer.

5. one of the two conductive resin layers located on the same side surface has an edge facing the other conductive resin layer; 5. The electronic component according to claim 1, wherein, when a plane including the end face is used as a reference plane, a first length of the auxiliary internal electrode in the second direction from the reference plane is greater than a second length from the reference plane to the edge of the conductive resin layer to which the auxiliary internal electrode is electrically connected, and is smaller than a third length from the reference plane to the edge of the conductive resin layer to which the auxiliary internal electrode is not electrically connected.

6. a plurality of dummy conductors disposed between each of the pair of side surfaces and the plurality of internal electrodes and in the same layer as each of the plurality of internal electrodes; 6. The electronic component according to claim 5, wherein each of the plurality of dummy conductors is electrically connected to the external electrode to which the internal electrode located in the same layer is electrically connected.

7. The electronic component according to claim 6, wherein a length of the dummy conductor in the second direction from the reference surface is smaller than a length from the reference surface to an edge of the conductive resin layer to which the dummy conductor is not electrically connected.

8. The electronic component according to any one of claims 1 to 7, wherein when the internal electrode and the conductive resin layer included in the side electrode portion, which are not electrically connected to each other, are viewed from the third direction, the internal electrode and the conductive resin layer included in the side electrode portion overlap each other.

9. The electronic component according to any one of claims 1 to 8, wherein the conductive resin layer contains a plurality of silver particles.

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