Conductor-equipped laminate, sheet heater, optical sensor, and conductor-equipped resin material

Abstract

To provide a laminate with a conductor in which damage to conductor wiring due to deformation hardly occurs.SOLUTION: A laminate with a conductor comprises: a resin material with a conductor 4 including a resin layer 11 that includes a resin (A) having a glass-transition temperature of 40°C or less, and conductor wiring 12 that has a volume resistivity at 25°C of 10 μΩcm; and an insulating substrate 13. At least part of the conductor wiring 12 is embedded in the resin layer 11. The insulating substrate 13 overlaps the resin material with a conductor 4. The area of a cross section orthogonal in a longitudinal direction of the conductor wiring 12 is 0.2×103 μm2 or more and 10×103 μm2 or less. The conductor wiring 12 has an exposed surface 12a exposed from the resin layer 11 in a surface opposite to the insulating substrate 13 in the resin material with a conductor 4. The exposed surface 12a is in direct contact with the insulating substrate 13. The peel strength between the conductor wiring 12 and the insulating substrate 13 is less than 0.01 N / 25 mm.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure generally relates to a laminate with a conductor, a planar heater, an optical sensor, and a resin material with a conductor, and more specifically, the present disclosure relates to a laminate with a conductor comprising a resin layer, a conductor, and an insulating substrate, a planar heater comprising this laminate with a conductor, an optical sensor comprising this planar heater, and a resin material with a conductor comprising a resin layer and a conductor. [Background technology]

[0002] Conventionally, wiring boards in which metal conductor wiring is formed on the surface of an insulating substrate have been widely used.

[0003] In the invention described in Patent Document 1, copper foil is adhered to one side of a heat-resistant insulating film via an adhesive layer, and a metal film is deposited on the other side by a vapor deposition method or the like to obtain a functional copper-clad laminate that can be used as a material for printed wiring boards. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 7-26126 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present disclosure is to provide a conductor-equipped laminate in which damage to the conductor wiring due to deformation is unlikely to occur, a planar heater comprising the conductor-equipped laminate, an optical sensor comprising the planar heater, and a conductor-equipped resin material that can be used to produce the conductor-equipped laminate. [Means for solving the problem]

[0006] A laminate with a conductor according to one embodiment of the present disclosure comprises a resin material with a conductor, the resin material comprising a resin layer containing a resin (A) having a glass transition temperature of 40° C. or less and a conductor wiring having a volume resistivity of 10 μΩcm or less at 25° C., and an insulating substrate. At least a portion of the conductor wiring is embedded in the resin layer. The insulating substrate overlaps the resin material with a conductor. The area of ​​a cross section perpendicular to the longitudinal direction of the conductor wiring is 0.2×10 3 μm 2 More than 10x10 3 μm 2 The conductor wiring has an exposed surface that is exposed from the resin layer at a surface of the conductor-attached resin material facing the insulating substrate, and the exposed surface is in direct contact with the insulating substrate. A peel strength between the conductor wiring and the insulating substrate is less than 0.01 N / 25 mm.

[0007] A laminate with a conductor according to another embodiment of the present disclosure comprises a resin material with a conductor, the resin material comprising a resin layer containing a resin (A) having a glass transition temperature of 40° C. or less and a conductor wiring having a volume resistivity of 10 μΩcm or less at 25° C., and an insulating substrate. At least a portion of the conductor wiring is embedded in the resin layer. The insulating substrate overlaps the resin material with a conductor. The area of ​​a cross section perpendicular to the longitudinal direction of the conductor wiring is 0.2×10 3 μm 2 More than 10x10 3 μm 2 A part of the resin layer is interposed between the conductor wiring and the insulating substrate.

[0008] A planar heater according to one aspect of the present disclosure includes any one of the conductor-attached laminates described above.

[0009] An optical sensor according to one aspect of the present disclosure includes the planar heater and a light receiving portion that receives light transmitted through the planar heater.

[0010] A resin material with a conductor according to one embodiment of the present disclosure includes a resin layer and a conductor wiring. At least a portion of the conductor wiring is embedded in the resin layer. The resin layer has a first surface facing in a thickness direction thereof and a second surface facing in a direction opposite to the first surface. The conductor wiring is not exposed on either the first surface or the second surface. Effect of the Invention

[0011] In the conductor-equipped laminate according to one aspect of the present disclosure, breakage of the conductor wiring due to deformation is unlikely to occur. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic cross-sectional view of a laminate with a conductor produced by a conventional technique. [Diagram 2] 2A, 2B, and 2C are schematic cross-sectional views showing an example of a conductor-attached laminate according to an embodiment of the present disclosure. [Diagram 3] FIG. 3A is a schematic cross-sectional view of an optical sensor according to one embodiment of the present disclosure, and FIG. 3B is a perspective view of a portion of an automobile equipped with the optical sensor. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The following provides an overview of how the inventors have completed the present disclosure.

[0014] When an optical sensor 3 such as LiDAR used for an autonomous driving system is installed on an automobile near an emblem or headlight of the vehicle body, if snow adheres to light-transmitting parts such as the outer surface of the emblem or the windshield of the headlight, the light transmission is hindered and the detection accuracy is reduced. For this reason, the inventors considered installing a sheet heater 2 equipped with a conductor wiring 12 on the light-transmitting part on the outer surface of the vehicle body.

[0015] If a wiring board having conductor wiring 12 provided on an insulating substrate 13 is directly applied to a sheet heater 2, the conductor wiring 12 will be exposed and therefore prone to damage. Furthermore, when the sheet heater 2 is bent or extended to conform to the shape of an outer surface such as an emblem or windshield, the conductor wiring 12 will be easily broken due to the force applied thereto.

[0016] The inventors have also considered constructing a sheet heater 2 by embedding conductor wiring 12 on one side of a resin layer 11 and bonding an insulating substrate 13 with an adhesive to the surface of the resin layer 11 where the conductor wiring 12 is exposed, as shown in Fig. 1. However, even in this case, deformation of the sheet heater 2 tends to cause breakage of the wiring.

[0017] Therefore, the inventors conducted extensive research and development in order to provide a conductor-attached laminate 1 in which damage to the conductor wiring 12 due to deformation is unlikely to occur, and as a result, have completed the present disclosure.

[0018] Although the present disclosure has been completed through the above process, the use of the conductor-equipped laminate 1 is not limited to the planar heater 2, and it may be used, for example, as a wiring board that does not function as a heater.

[0019] (1) Overview Hereinafter, one embodiment according to the present disclosure will be described.

[0020] A conductor-attached laminate 1 according to one embodiment of the present disclosure comprises a conductor-attached resin material 4, which comprises a resin layer 11 containing a resin (A) having a glass transition temperature of 40° C. or less and a conductor wiring 12 having a volume resistivity of 10 μΩcm or less at 25° C., and an insulating substrate 13. At least a portion of the conductor wiring 12 is embedded in the resin layer 11. The insulating substrate 13 overlaps the conductor-attached resin material 4. The area of ​​a cross section perpendicular to the longitudinal direction of the conductor wiring 12 is 0.2×10 3 μm 2 More than 10x10 3 μm 2 The peel strength between the conductor wiring 12 and the insulating substrate 13 is less than 0.01 N / 25 mm.

[0021] The longitudinal direction of the conductor wiring 12 is the direction in which the conductor wiring 12 extends when viewed in the direction in which the insulating substrate 13 and the conductor-equipped resin material 4 overlap, and can also be said to be the direction in which current flows through the conductor wiring 12 when electricity is applied (current flow direction).

[0022] The peel strength between the conductor wiring 12 and the insulating substrate 13 is measured by a method conforming to JIS Z0237 "Testing methods for adhesive tapes and adhesive sheets" using a sample of a laminate 1 with a conductor in which a resin layer 11 having a width of 25 mm in a plan view, a conductor wiring 12 having a width of 25 mm in a plan view, and an insulating substrate 13 having a width of 25 mm in a plan view are laminated in this order. This peel strength is preferably less than 0.001 N / 25 mm, more preferably 0 N / 25 mm.

[0023] As shown in Figure 1, when the surface of the conductor wiring 12 exposed from the resin layer 11 and the insulating substrate 13 are fixed with an adhesive layer 14, stress generated due to deformation of the conductor-equipped laminate 1 tends to concentrate at the interface between the conductor wiring 12 and the adhesive layer 14, making the conductor wiring 12 prone to breakage.

[0024] However, in this embodiment, as described above, the peel strength between the conductor wiring 12 and the insulating substrate 13 is less than 0.01 N / 25 mm, so that even if the conductor-included laminate 1 is deformed, the above-mentioned concentration of stress is unlikely to occur in the conductor wiring 12. Therefore, in this embodiment, a conductor-included laminate 1 can be obtained in which the conductor wiring 12 is unlikely to be damaged due to deformation.

[0025] A conductor-attached laminate 1 according to another embodiment of the present disclosure comprises a conductor-attached resin material 4, which comprises a resin layer 11 containing a resin (A) having a glass transition temperature of 40° C. or less and a conductor wiring 12 having a volume resistivity of 10 μΩcm or less at 25° C., and an insulating substrate 13. At least a portion of the conductor wiring 12 in the conductor-attached resin material 4 is embedded in the resin layer 11. The insulating substrate 13 overlaps the conductor-attached resin material 4. The area of ​​a cross section perpendicular to the longitudinal direction of the conductor wiring 12 is 0.2×10 3 μm 2 More than 10x10 3 μm 2A part of the resin layer 11 is interposed between the conductor wiring 12 and the insulating substrate 13.

[0026] As shown in Figure 1, when the surface of the conductor wiring 12 exposed from the resin layer 11 and the insulating substrate 13 are fixed with an adhesive layer 14, stress generated due to deformation of the conductor-equipped laminate 1 tends to concentrate at the interface between the conductor wiring 12 and the adhesive layer 14, making the conductor wiring 12 prone to breakage.

[0027] However, in this embodiment, as described above, at least a portion of the conductor wiring 12 is embedded in the resin layer 11, and a portion of the resin layer 11 is interposed between the conductor wiring 12 and the insulating substrate 13, so that even if the conductor-included laminate 1 is deformed, the above-mentioned concentration of stress in the conductor wiring 12 is unlikely to occur. Therefore, in this embodiment, a conductor-included laminate 1 can be obtained in which the conductor wiring 12 is unlikely to be damaged due to deformation.

[0028] (2) Details of the laminate with conductor A more specific structure of the conductor-equipped laminate 1 according to this embodiment will be described with reference to Figs. 2A, 2B, and 2C.

[0029] (2.1) First embodiment FIG. 2A shows a conductor-equipped laminate 1 according to the first embodiment.

[0030] The conductor-equipped laminate 1 according to the first embodiment includes a conductor-equipped resin material 4 and an insulating substrate 13. The conductor-equipped resin material 4 includes a resin layer 11 and a conductor wiring 12, and the conductor wiring 12 is partially embedded in the resin layer 11. The conductor wiring 12 has an exposed surface 12a that is exposed from the resin layer 11 on the surface of the conductor-equipped resin material 4 that faces the insulating substrate 13, and the exposed surface 12a is in direct contact with the insulating substrate 13.

[0031] The resin layer 11 is, for example, plate-like or sheet-like. The resin layer 11 has a thickness and has a first surface 1a facing in the thickness direction and a second surface 1b facing in the opposite direction to the first surface 1a. The conductor wiring 12 has an exposed surface 12a. The conductor wiring 12 is embedded in the resin layer 11 except for the exposed surface 12a, and the exposed surface 12a is exposed to the outside of the resin layer 11 at the first surface 1a. The exposed surface 12a and the first surface 1a are on the same plane.

[0032] The insulating substrate 13 is, for example, in the form of a sheet or plate. The first surface 1a and the exposed surface 12a of the resin material with conductor 4 overlap the insulating substrate 13, and in this state, the insulating substrate 13 and the resin material with conductor 4 are bonded to each other. Although the first surface 1a is bonded to the insulating substrate 13 and the exposed surface 12a is in contact with the insulating substrate 13, the peel strength between the conductor wiring 12 and the insulating substrate 13 is less than 0.01 N / 25 mm. The first surface 1a and the insulating substrate 13 may be bonded to each other via an adhesive, or the first surface 1a may be fused to the insulating substrate 13.

[0033] The resin layer 11 is made of a resin (A). The resin (A) is, for example, a thermoplastic resin. In this case, the resin layer 11 can be heat-sealed to an object such as a vehicle body. The resin layer 11 may contain only the resin (A). The resin layer 11 may further contain a material other than the resin (A), such as an inorganic filler.

[0034] The resin layer 11 preferably contains a resin (A) having a glass transition temperature of 40° C. or lower. By containing the resin (A) having a glass transition temperature of 40° C. or lower, the resin layer 11 is likely to have flexibility. By having flexibility, the resin layer 11 is easily deformed, and the stress accompanying the deformation is unlikely to be concentrated on the conductor wiring 12.

[0035] The storage modulus of the resin layer 11 at 25° C. is 10 4 MPa or more 10 9 The storage modulus of the resin layer 11 at 25° C. is preferably less than 10 MPa. 4 When the storage modulus of the resin layer 11 at 25° C. is 10 MPa or more, the shape of the resin layer 11 can be maintained. 9When the storage modulus is less than 10 MPa, stress is less likely to be concentrated on the conductor wiring 12 when the resin layer 11 is deformed, and the conductor wiring 12 is less likely to be damaged. 5 MPa or more 10 8 It is more preferable that the pressure is not more than 100 MPa.

[0036] The resin (A) contains, for example, at least one of an acrylic resin and a thermoplastic elastomer. This makes it easy to achieve the above-mentioned glass transition temperature of the resin (A) and the above-mentioned storage modulus of the resin layer 11. The acrylic resin is a polymer of at least one monomer selected from the group consisting of, for example, butyl acrylate, methyl methacrylate, etc. In this case, the above-mentioned glass transition temperature and storage modulus can be adjusted by adjusting the type and ratio of the monomer. The thermoplastic elastomer contains, for example, at least one selected from the group consisting of an olefin-based thermoplastic elastomer, a polybutadiene-based thermoplastic elastomer, etc. Note that the components that the resin (A) can contain are not limited to the above.

[0037] The thickness of the resin layer 11 is preferably 25 μm or more and 200 μm or less, and more preferably 50 μm or more and 150 μm or less. When the thickness of the resin layer 11 is 25 μm or more, it is easy to form the conductor-equipped resin material 4. When the thickness of the resin layer 11 is 200 μm or less, it is easy to make the conductor-equipped laminate 1 thin.

[0038] It is preferable that the resin layer 11 has transparency. In particular, it is preferable that the total light transmittance in the thickness direction of the resin layer 11 measured according to JIS K7361 is 80% or more, and the haze value in the thickness direction of the resin layer 11 measured according to JIS K7136 is 2% or less.

[0039] The conductor wiring 12 is made of a metal such as copper. There is no particular limitation on the shape of the conductor wiring 12. The conductor wiring 12 can be used, for example, as a heating wire. The conductor wiring 12 may also be used to transmit electric current. The conductor wiring 12 is, for example, lattice-shaped, mesh-shaped, fan-shaped, or meander-shaped. In this case, the conductor wiring 12 can be easily spread out in a planar shape, and therefore the conductor-equipped laminate 1 can be easily applied to a planar heater. It is particularly preferable that the conductor wiring 12 is meander-shaped. In this case, even if the conductor-equipped laminate 1 is deformed, the conductor wiring 12 is particularly unlikely to be damaged.

[0040] The volume resistivity of the conductor wiring 12 at 25° C. is 10 μΩcm or less, and the area of ​​the cross section perpendicular to the longitudinal direction of the conductor wiring 12 is 0.2×10 3 μm 2 More than 10x10 3 μm 2 It is preferable that the volume resistivity is 10 μΩcm or less. If the volume resistivity is 10 μΩcm or less, it is easy to increase the amount of heat generated by the conductor wiring 12 when electricity is applied, and therefore the conductor wiring 12 can easily generate heat even if the width of the conductor wiring 12 is reduced. Therefore, it is easy to maintain the heat generation property of the conductor wiring 12 while making it difficult to visually recognize the conductor wiring 12, and the conductor-attached laminate 1 can be easily applied to a planar heater provided on the rear window of an automobile, for example. In addition, if the cross-sectional area of ​​the conductor wiring 12 is 0.2×10 3 μm 2 If the cross-sectional area is 10×10 3 μm 2 If the volume resistivity is less than 1 μΩcm, the conductor wiring 12 is less likely to interfere with the transmission of light through the conductor-attached laminate 1, and the influence of the conductor wiring 12 on the sensing of the optical sensor can be reduced. The volume resistivity is more preferably 6 μΩcm or less, and even more preferably 3 μΩcm or less. The volume resistivity is, for example, 1 μΩcm or more, but is not limited thereto. The cross-sectional area of ​​the conductor wiring 12 is 0.5×10 3 μm 2 More preferably, it is 1.0×10 3 μm 2 More preferably, the cross-sectional area is 7.5×10 3 μm 2Less than 5.0×10 is preferable. 3 μm 2 It is even more preferable if it is less than this.

[0041] A method for producing the resin material 4 with a conductor will be described. For example, a molding material containing a resin (A) is molded by an appropriate method to produce a sheet-like or plate-like molded body, and the conductor wiring 12 is embedded in the molded body by an appropriate method. In this way, a resin layer 11 is produced from the molded body, and a resin material 4 with a conductor including the conductor wiring 12 and the resin layer 11 can be obtained. More specifically, for example, the molding material is first molded by an appropriate method such as an extrusion molding method, a solution casting method, or a calendar method to produce a molded body. Next, the conductor wiring 12 is formed on the surface of the molded body by an appropriate method such as an additive method or a subtractive method. Then, the molded body and the conductor wiring 12 are hot-pressed to embed the conductor wiring 12 in the molded body while deforming the molded body. In this way, a resin layer 11 is produced from the molded body, and the conductor wiring 12 can be embedded in the resin layer 11 so that the exposed surface 12a is exposed on the first surface 1a of the resin layer 11.

[0042] The method of producing the resin material 4 with a conductor is not limited to the above. For example, the resin material 4 with a conductor may be produced by an insert molding method. In this case, for example, the conductor wiring 12 is arranged in the mold, and a molding material containing the resin (A) is molded in the mold to obtain the resin material 4 with a conductor. Alternatively, the surface of a film may be subjected to an appropriate release treatment, and then the conductor wiring 12 may be produced on the surface of the film, and a flexible resin material may be placed on the surface of the film with the conductor wiring 12 to embed the conductor wiring 12 in the resin material, and then the film may be peeled off from the resin material and the conductor wiring 12. In this case, the resin layer 11 is produced from the resin material, and the conductor wiring 12 is embedded in the resin layer 11.

[0043] The insulating substrate 13 is made of resin (B). The insulating substrate 13 may contain only resin (B). The insulating substrate 13 may also contain materials other than resin (B), such as inorganic fillers and reinforcing materials.

[0044] Insulating substrate 13 preferably contains a resin (B) having a glass transition temperature of not less than 80° C. When insulating substrate 13 has a glass transition temperature of not less than 80° C., sufficient strength for protecting conductor wiring 12 is obtained.

[0045] The resin (B) contains at least one selected from the group consisting of, for example, polycarbonate, polyethylene terephthalate, polymethyl methacrylate, etc. However, the components contained in the resin (B) are not limited to these.

[0046] It is preferable that insulating substrate 13 is transparent. It is preferable that insulating substrate 13 has a total light transmittance in the thickness direction measured in accordance with JIS K7361 of 80% or more, and resin layer 11 has a haze value in the thickness direction measured in accordance with JIS K7136 of 2% or less.

[0047] The thickness of insulating substrate 13 is preferably 50 μm or more and 500 μm or less. When the thickness of insulating substrate 13 is within this range, conductor-equipped laminate 1 can be easily made thin.

[0048] The water contact angle θ of the surface of the insulating substrate 13 is preferably 60° or more. When the water contact angle θ of the surface of the insulating substrate 13 is 60° or more, water is less likely to adhere to the surface of the insulating substrate 13, and particularly when the conductor-attached laminate 1 is used as a planar heater 2 for melting snow, water generated by melting snow is more likely to flow down from the surface of the conductor-attached laminate 1. It is more preferable that the water contact angle θ of the insulating substrate 13 is 90° or more. In order to set the water contact angle θ of the surface of the insulating substrate 13 within the above range, a hydrophobic resin may be selected as the resin (B), or the insulating substrate 13 may contain a hydrophobic material. The surface of the insulating substrate 13 may be subjected to a water-repellent treatment.

[0049] As described above, the surface of the insulating substrate 13 may be subjected to a surface treatment. Specific examples of the surface treatment include a water-repellent treatment and a hard coat treatment.

[0050] The insulating substrate 13 can be produced, for example, by molding a molding material containing the resin (B) by a suitable method such as extrusion molding, injection molding, solution casting, or calendaring.

[0051] The conductor-attached laminate 1 is produced, for example, by overlapping an insulating substrate 13 on a conductor-attached resin material 4 and bonding the resin layer 11 in the conductor-attached resin material 4 to the insulating substrate 13. When the resin layer 11 contains a thermoplastic resin, the resin layer 11 and the insulating substrate 13 can be bonded to each other by heat pressing.

[0052] In this embodiment, the exposed surface 12a of the conductor wiring 12 is in contact with the insulating substrate 13 without being bonded thereto, and the portion of the conductor wiring 12 other than the exposed surface 12a is embedded in the resin layer 11, so that even if the conductor-equipped laminate 1 is deformed, a force is unlikely to be applied from the insulating substrate 13 to the conductor wiring 12. Therefore, stress is unlikely to concentrate at the interface between the conductor wiring 12 and the insulating substrate 13.

[0053] The thickness of the conductor-included laminate 1 is preferably 75 μm or more and 550 μm or less. When the thickness of the conductor-included laminate 1 is 75 μm or more, the strength of the conductor-included laminate 1 can be maintained. Furthermore, when the thickness is 550 μm or less, the conductor-included laminate 1 can be made thinner. This thickness is more preferably 150 μm or more, and even more preferably 250 μm or more. Furthermore, this thickness is more preferably 400 μm or less, and even more preferably 350 μm or less.

[0054] When a tensile load is applied to the resin material 4 with conductor in at least one direction perpendicular to the thickness direction of the resin layer 11 in at least one temperature atmosphere between -20°C and 50°C, the elongation of the resin material 4 with conductor at which the conductor wiring 12 breaks (hereinafter referred to as conductor elongation) is preferably 110% or more. In this case, even if the resin material 4 with conductor is deformed, the conductor wiring 12 is particularly unlikely to break. The resin material 4 with conductor according to this embodiment can have such a conductor elongation by having the above-mentioned configuration. It is more preferable that the conductor elongation be 120% or more.

[0055] It is more preferable that the resin material 4 with conductor has the above conductor elongation rate in a temperature atmosphere of 25° C. It is also more preferable that the resin material 4 with conductor has the above conductor elongation rate in at least one of temperature atmospheres of −20° C. and 50° C. It is particularly preferable that the resin material 4 with conductor has the above conductor elongation rate in any temperature atmosphere between −20° C. and 50° C. It is also particularly preferable that the resin material 4 with conductor has the above conductor elongation rate in any direction perpendicular to the thickness direction of the resin layer 11 when a tensile load is applied to the resin material 4 with conductor in any direction perpendicular to the thickness direction of the resin layer 11.

[0056] The conductor-attached laminate 1 preferably has a total light transmittance in the thickness direction of 80% or more as measured based on JIS K7361, and a haze value in the thickness direction of 2% or less as measured based on JIS K7136. If the total light transmittance is 80% or more and the haze value is 2% or less, the conductor-attached laminate 1 is suitable as a material for the sheet heater 2 attached to the optical sensor 3.

[0057] (2.2) Second embodiment FIG. 2B shows a conductor-equipped laminate 1 according to the second embodiment.

[0058] The conductor-included laminate 1 according to the second embodiment differs from the conductor-included laminate 1 according to the first embodiment in that a part of the resin layer 11 is interposed between the conductor wiring 12 and the insulating substrate 13. Other configurations are the same as those of the conductor-included laminate 1 according to the first embodiment. Hereinafter, explanations of configurations that overlap with those of the first embodiment will be omitted as appropriate by assigning the same reference numerals.

[0059] In the second embodiment, similarly to the first embodiment, the conductor-attached laminate 1 includes a conductor-attached resin material 4 and an insulating substrate 13, but as described above, a part of the resin layer 11 is interposed between the conductor wiring 12 and the insulating substrate 13. As a result, the conductor wiring 12 and the insulating substrate 13 are not bonded to each other, nor are they in direct contact with each other. Therefore, even if the conductor-attached laminate 1 is deformed, stress is unlikely to concentrate on the conductor wiring 12. Therefore, in the conductor-attached laminate 1 obtained from the conductor-attached resin material 4 according to the second embodiment, the conductor wiring 12 is unlikely to be damaged even if the laminate is deformed.

[0060] The resin material with conductor 4 in the second embodiment will be described. The resin material with conductor 4 includes a resin layer 11 and a conductor wiring 12. The resin layer 11 has a first surface 1a facing in its thickness direction and a second surface 1b facing in the opposite direction to the first surface 1a. The conductor wiring 12 is embedded in the resin layer 11, and is not exposed on either the first surface 1a or the second surface 1b. Other than this, the resin material with conductor 4 has the same configuration as in the first embodiment.

[0061] Moreover, the insulating substrate 13 has the same configuration as in the first embodiment.

[0062] A first surface 1a of the resin layer 11 in the conductor-equipped resin material 4 is superimposed on and bonded to the insulating substrate 13. The first surface 1a and the insulating substrate 13 may be bonded via an adhesive, or the first surface 1a may be fused to the insulating substrate 13. Therefore, a portion between the first surface 1a of the resin layer 11 and the conductor wiring 12 is interposed between the conductor wiring 12 and the insulating substrate 13.

[0063] A method for producing the resin material 4 with a conductor will be described. For example, a molding material containing a resin (A) is molded by an appropriate method to produce a sheet-like or plate-like molded body, and the conductor wiring 12 is embedded in this molded body by an appropriate method. In this way, a resin layer 11 is produced from the molded body, and a resin material 4 with a conductor including the conductor wiring 12 and the resin layer 11 can be obtained. More specifically, for example, the molding material is first molded by an appropriate method such as extrusion molding, solution casting, or calendaring to produce two molded bodies (a first molded body and a second molded body). Next, the conductor wiring 12 is formed on the surface of the first molded body by an appropriate method such as an additive method or a subtractive method. Next, the first molded body and the second molded body are laminated so that the conductor wiring 12 is interposed between them, and then heat-pressed, whereby the conductor wiring 12 is embedded between the first molded body and the second molded body while deforming the first molded body and the second molded body. This allows a resin layer 11 to be produced from the first molded body and the second molded body, and the conductor wiring 12 can be embedded in the resin layer 11 so that it is not exposed on either the first surface 1a or the second surface 1b of the resin layer 11.

[0064] The method of producing the resin material 4 with a conductor is not limited to the above. For example, the resin material 4 with a conductor may be produced by an insert molding method. In this case, for example, the conductor wiring 12 is arranged in the mold, and a molding material containing the resin (A) is molded in the mold to obtain the resin material 4 with a conductor. Alternatively, the surface of a film may be subjected to an appropriate release treatment, and then the conductor wiring 12 may be produced on the surface of the film, and a flexible resin material may be placed on the surface of the film with the conductor wiring 12 to embed the conductor wiring 12 in the resin material, and then the film may be peeled off from the resin material and the conductor wiring 12. In this case, the resin layer 11 is produced from the resin material, and the conductor wiring 12 is embedded in the resin layer 11.

[0065] The thickness of the resin material with conductor 4 is preferably 50 μm or more and 200 μm or less. When the thickness is 50 μm or more, the conductor wiring 12 can be stably arranged on the resin layer 11. Furthermore, when the thickness is 200 μm or less, the resin material with conductor 4 can be made thin. The thickness is more preferably 75 μm or more, and even more preferably 100 μm or more. Furthermore, the thickness is more preferably 175 μm or less, and even more preferably 150 μm or less.

[0066] When light from a D65 light source is incident on the conductor-equipped resin material 4 in the thickness direction, it is preferable that the total light transmittance is 80% or more and the haze value is 2% or less.

[0067] The conductor-attached resin material 4 according to this embodiment preferably has the same conductor elongation rate as in the first embodiment.

[0068] (2.3) Third embodiment FIG. 2C shows a conductor-equipped laminate 1 according to a third embodiment.

[0069] The conductor-equipped laminate 1 according to the third embodiment differs from the conductor-equipped laminate 1 according to the first embodiment in that the second surface 1b of the conductor-equipped resin material 4 overlaps the insulating substrate 13, and in this state, the insulating substrate 13 and the conductor-equipped resin material 4 are bonded together. Other configurations are the same as those of the conductor-equipped laminate 1 according to the first embodiment. Hereinafter, explanations of configurations that overlap with those of the first embodiment will be omitted as appropriate.

[0070] In the third embodiment, as in the first embodiment, the conductor-attached laminate 1 includes a conductor-attached resin material 4 and an insulating substrate 13, but as described above, the second surface 1b of the conductor-attached resin material 4 overlaps the insulating substrate 13, and in this state, the insulating substrate 13 and the conductor-attached resin material 4 are bonded together. As a result, a part of the resin layer 11 is interposed between the conductor wiring 12 and the insulating substrate 13, and the conductor wiring 12 and the insulating substrate 13 are not bonded together, nor are they in direct contact with each other. Therefore, even if the conductor-attached laminate 1 is deformed, stress is unlikely to concentrate on the conductor wiring 12. Therefore, even if the conductor-attached laminate 1 obtained from the conductor-attached resin material 4 according to the third embodiment is deformed, the conductor wiring 12 is unlikely to be damaged.

[0071] The resin material 4 with a conductor in the third embodiment has the same configuration as that in the first embodiment, and is produced by the same method as that in the first embodiment. The resin material 4 with a conductor in this embodiment preferably has a conductor elongation rate similar to that in the first embodiment.

[0072] Moreover, the insulating substrate 13 has the same configuration as in the first embodiment.

[0073] (3) Planar heater As described above, the conductor-equipped laminate 1 can be applied to the planar heater 2. This planar heater 2 includes the conductor-equipped laminate 1. This planar heater 2 preferably further includes a terminal connection portion. The terminal connection portion may be integrated with the conductor-equipped laminate 1, or may have a structure that protrudes from an end portion of the conductor-equipped laminate 1. The planar heater 2 is connected to a power source via the terminal connection portion, and can be used as a heater when the conductor wiring 12 generates heat due to electricity supplied from the power source.

[0074] Since the conductor-equipped laminate 1 has the above-mentioned configuration, the planar heater 2 is less likely to break even when the conductor-equipped laminate 1 is bent or stretched. Therefore, the planar heater 2 can be attached to the curved outer surface of an automobile part, for example, while being bent or stretched, and can be used as a snow melting heater. Note that the use of the planar heater 2 is not limited to only as a snow melting heater for automobile parts.

[0075] (4) Optical Sensor The optical sensor 3 will now be described. The optical sensor 3 comprises the above-mentioned planar heater 2 and a light receiving unit 15 that receives light transmitted through the planar heater 2 (see FIG. 3). This optical sensor 3 is provided on the body of an automobile, on an emblem, near a headlight, etc., for an autonomous driving system, for example. By providing the planar heater 2, this optical sensor 3 is less likely to have snow adhere to the portion through which light transmits. For this reason, this optical sensor 3 is likely to operate well even during snowfall.

[0076] 3A shows a specific example of the optical sensor 3. In addition to the sheet heater 2 and the light receiving section 15, the optical sensor 3 includes a light projecting section 16 that irradiates light toward the sheet heater 2.

[0077] Specifically, the optical sensor 3 shown in FIG. 3A includes a housing 18, a light receiving unit 15, a light projecting unit 16, and a beam splitter 17 arranged in the housing 18, and a planar heater 2. The housing 18 has an exposed surface 31 exposed to the outdoors. A part of the housing 18 is a light transmitting unit 20 that can transmit light, and the light transmitting unit 20 constitutes at least a part of the exposed surface 31. Through the light transmitting unit 20, light can be emitted from the inside of the housing 18 to the outside, and can be incident from the outside to the inside. The light transmitting unit 20 is made of, for example, silicate glass, transparent resin, or the like. The light receiving unit 15 is an element that can detect light by receiving light, such as a light receiving element, that is, an element that converts the intensity of light into an electrical signal. The light projecting unit 16 is an element that can emit light, such as a laser emitter. Light receiving unit 15, light projecting unit 16, and beam splitter 17 are arranged so that beam splitter 17 controls the direction of light emitted by light projecting unit 16 to be directed toward transmission unit 20, and so that beam splitter 17 controls the direction of light incident from the outside to the inside of housing 18 through transmission unit 20 to be directed toward light receiving unit 15. The arrows in Fig. 3A indicate the paths of the above-mentioned light.

[0078] The sheet heater 2 is disposed on the exposed surface 31 of the housing 18, and covers the transmissive portion 20. The conductor-equipped laminate 1 is disposed such that the conductor-equipped resin material 4 is located between the insulating substrate 13 and the transmissive portion 20. Therefore, the insulating substrate 13 can protect the conductor-equipped resin material 4 by covering the conductor-equipped resin material 4.

[0079] In this optical sensor 3, when the light-projecting unit 16 emits light, the direction of the light is controlled by the beam splitter 17 so that the light is directed toward the transmitting unit 20. The light passes through the transmitting unit 20 and the planar heater 2 and is emitted to the outside of the housing 18. When this light is reflected by the object and directed toward the optical sensor 3, the light passes through the planar heater 2 and the transmitting unit 20 and enters the inside of the housing 18. The direction of the light is controlled by the beam splitter so that the light is directed toward the light-receiving unit 15. The light-receiving unit 15 receives the light and can detect it. This detection result can be used, for example, to measure the distance between the optical sensor 3 and the object.

[0080] Even if snow adheres to the outer surface (exposed surface 31) of the optical sensor 3, the snow can be melted on the surface of the planar heater 2 by the heat generated by the planar heater 2. Therefore, the progression of light is less likely to be impeded by snow, and the detection accuracy of the optical sensor 3 is less likely to decrease.

[0081] This optical sensor 3 is suitable for use outdoors. For example, as shown in FIG. 3B, the optical sensor 3 can be attached to the body of the automobile 21 with the exposed surface 31 facing the outside of the body. In this case, the optical sensor 3 can be used as a component of a distance measuring device for measuring the distance between the automobile 21 and an object in an automatic driving system, for example. By using this optical sensor 3, it is possible to prevent the accuracy of the measurement results by the distance measuring device from decreasing during snowfall, and to increase the stability of the automatic driving system. EXAMPLES

[0082] The present disclosure will be specifically described below with reference to examples, but the present disclosure is not limited to the examples.

[0083] [Resin (A) raw materials] As the resin (A) in each of the examples and comparative examples, an acrylic resin was prepared by polymerizing butyl acrylate (glass transition temperature -55°C) and methyl methacrylate (glass transition temperature 105°C) in the ratio shown in the "Resin layer" column in Table 1.

[0084] [Formation of resin layer 11] The above resin (A) was molded by injection molding to form a resin layer 11 having a thickness shown in the "Resin layer" column of Table 1.

[0085] [Formation of Conductive Wiring 12] Copper foil (thickness 12 μm) which is the material of the conductor wiring 12 was laminated on the surface of the resin layer 11, and heat-pressed at a heating temperature of 250° C., a pressure of 1 MPa, and a heating time of 5 minutes to obtain a metal clad laminate. The obtained metal clad laminate was subjected to an etching treatment to remove unnecessary parts, thereby forming the conductor wiring 12 on the surface of the resin layer 11. The resin layer 11 on which the conductor wiring 12 was formed on the surface was further heat-pressed at a heating temperature of 250° C., a pressure of 1 MPa, and a heating time of 5 minutes to embed the conductor wiring 12 in the resin layer 11. The width, thickness, and cross-sectional area of ​​the formed conductor wiring 12 were the values ​​shown in Table 1.

[0086] [Resin (B) raw materials] As the resin (B) in each of the Examples and Comparative Examples, polycarbonate (manufactured by Mitsubishi Gas Chemical Company, Inc., product name Iupilon, glass transition temperature 89° C.) was used.

[0087] [Formation of insulating substrate 13] The above resin (B) was molded by injection molding to form an insulating substrate 13 having the thickness shown in the "insulating substrate thickness" column in Table 1.

[0088] [Formation of Laminate 1 with Conductor] The obtained insulating substrate 13 was placed on the surface of the resin layer 11 in which the conductor wiring 12 was embedded, on which the conductor wiring 12 was exposed, and heat pressed at a heating temperature of 250°C, a pressure of 1 MPa, and a heating time of 5 minutes to obtain a laminate with a conductor 1. At this time, in Examples 1 to 8 and Comparative Examples 1 to 3, the conductor wiring 12 and the insulating substrate 13 were in direct contact with each other. On the other hand, in Comparative Example 4, an acrylic adhesive was interposed between the conductor wiring 12 and the insulating substrate 13 as an adhesive.

[0089] [evaluation] (Glass transition temperature of resin layer 11) The glass transition points of the resin layers 11 in Examples 1 to 8 and Comparative Examples 1 to 4 were measured by thermomechanical analysis (TMA).

[0090] (Storage modulus of resin layer 11) The storage modulus of the resin layer 11 was measured under conditions of atmospheric pressure and humidity of 65% in an air atmosphere. A viscoelasticity measuring device (DMS6220, manufactured by Hitachi High-Technologies Corporation) was used as the measuring device, and the measurement was performed under the conditions of bending (double-supported beam) measurement mode, measurement temperature range from 25°C to 200°C, and temperature rise rate of 10°C / min. This resulted in a relationship curve between storage viscoelasticity and temperature. The storage modulus at 25°C (standard state) was read from this relationship curve.

[0091] (Volume resistivity) A voltage of DC 500 V was applied to the conductor wiring 12 embedded in the resin layer 11 at room temperature (25° C.) using an electrometer device (digital vibration capacitance type electrometer: TAKEDA RIKEN TR8411), and the volume resistance value of the conductor wiring 12 was measured.

[0092] (peel strength) A sample of a laminate 1 with a conductor was prepared under the same conditions as in each of the Examples and Comparative Examples, in which a resin layer 11 having a width of 25 mm in plan view, a conductor wiring 12 having a width of 25 mm in plan view, and an insulating substrate 13 having a width of 25 mm in plan view were laminated in that order. The peel strength of the conductor wiring 12 from the insulating substrate 13 in this sample was measured according to JIS Z0237 "Test method for adhesive tapes and adhesive sheets."

[0093] (Disconnection resistance) The conductor-attached laminate 1 was stretched at 10 mm / min along the longitudinal direction of the conductor wiring 12 in a thermostatic chamber at 120°C using a tensile tester (Autograph AGS, manufactured by Shimadzu Corporation), and the presence or absence of breakage in the conductor wiring 12 was then confirmed. A: Even when the resin layer 11 is stretched by 130%, no breakage of the conductor wiring 12 is observed. B: Even when the resin layer 11 was stretched by 125%, no breakage of the conductor wiring 12 was observed, but when it was stretched by 130%, the conductor wiring 12 broke. C: When the resin layer 11 was stretched by 125%, the conductor wiring 12 was broken.

[0094] [Table 1]

[0095] According to the above results, high resistance to wire breakage was obtained in all of Examples 1 to 8. On the other hand, in Comparative Example 1, in which the glass transition temperature of the resin layer 11 (i.e., the glass transition temperature of the resin (A)) exceeded 40°C, the resistance to wire breakage was low. This is presumably because the resin layer 11 was hard and therefore a strong stress was applied when it was stretched, causing the wire breakage. 3 μm 2 The resistance to disconnection was also low in Comparative Examples 2 and 3, where the cross-sectional area of ​​the conductor wiring 12 was less than 100%, and it is believed that this is because the small cross-sectional area of ​​the conductor wiring 12 makes the shape unstable and the durability is insufficient, which makes the wiring more susceptible to disconnection. The resistance to disconnection was also low in Comparative Example 4, where the peel strength between the conductor wiring 12 and the insulating substrate 13 was 0.01 N / 25 mm or more. It is believed that this is because the conductor wiring 12 and the insulating substrate 13 are firmly bonded with an adhesive, so that the stress generated when the insulating substrate 13 is stretched is easily transmitted to the conductor wiring 12. [Explanation of symbols]

[0096] 1 Laminate with conductor 11 Resin layer 12 Conductor wiring 12a Exposed surface 13 Insulating substrate 2 Planar heater 3. Optical Sensor 4. Resin material with conductor

Claims

1. A resin layer containing a resin (A) having a glass transition temperature of 40° C. or lower; A resin material with a conductor, the resin material including a conductor wiring having a volume resistivity of 10 μΩcm or less at 25° C.; An insulating substrate; At least a portion of the conductor wiring is embedded in the resin layer, the insulating substrate overlaps the conductor-attached resin material, The area of ​​the cross section perpendicular to the longitudinal direction of the conductor wiring is 0.2×10 ３ μm ２ Above 10 x 10 ３ μm ２ is as follows: the conductor wiring has an exposed surface exposed from the resin layer at a surface of the conductor-attached resin material facing the insulating substrate, the exposed surface being in direct contact with the insulating substrate; A laminate with a conductor, wherein the peel strength between the conductor wiring and the insulating substrate is less than 0.01 N / 25 mm.

2. A resin layer containing a resin (A) having a glass transition temperature of 40° C. or lower; A resin material with a conductor, the resin material including a conductor wiring having a volume resistivity of 10 μΩcm or less at 25° C.; An insulating substrate; At least a portion of the conductor wiring is embedded in the resin layer, the insulating substrate overlaps the conductor-attached resin material, The area of ​​the cross section perpendicular to the longitudinal direction of the conductor wiring is 0.2×10 ３ μm ２ Above 10 x 10 ３ μm ２ is as follows: a part of the resin layer is interposed between the conductor wiring and the insulating substrate; Laminate with conductor.

3. The insulating substrate contains a resin (B) having a glass transition temperature of 80° C. or higher. The conductor-attached laminate according to claim 1 or 2.

4. The thickness is 75 μm or more and 550 μm or less. The conductor-attached laminate according to claim 1 .

5. When a tensile load is applied to the resin material with a conductor in at least one direction perpendicular to the thickness direction of the resin layer under at least one temperature atmosphere of -20°C or more and 50°C or less, the elongation of the resin material with a conductor at which breakage occurs in the conductor wiring is 110% or more. The conductor-attached laminate according to claim 1 .

6. The conductor wiring has a lattice-like, mesh-like, fan-like or meandering shape. The conductor-attached laminate according to claim 1 .

7. The water contact angle θ of the surface of the insulating substrate is 60° or more. The conductor-attached laminate according to claim 1 .

8. The conductor-attached laminate has a total light transmittance of 80% or more and a haze value of 2% or less. The conductor-attached laminate according to claim 1 .

9. A laminate with a conductor according to any one of claims 1 to 8, Surface heater.

10. The sheet heater according to claim 9 ; a light receiving unit that receives light transmitted through the planar heater; Optical sensor.

11. A resin layer and a conductor wiring are provided. At least a portion of the conductor wiring is embedded in the resin layer, the resin layer has a first surface facing in a thickness direction thereof and a second surface facing in a direction opposite to the first surface, the conductor wiring is not exposed on either the first surface or the second surface, The resin layer contains a resin (A) having a glass transition temperature of 40° C. or lower. Resin material with conductor.

12. The total light transmittance of the conductor-attached resin material is 80% or more, and the haze value is 2% or less. The conductor-attached resin material according to claim 11.

13. When a tensile load is applied to the resin material with a conductor in at least one direction perpendicular to the thickness direction of the resin layer under at least one temperature atmosphere of -20°C or higher and 50°C or lower, the elongation of the resin material with a conductor at which breakage occurs in the conductor wiring is 110% or higher. The resin material with a conductor according to claim 11 or 12.

14. The thickness is 75 μm or more and 550 μm or less. The resin material with a conductor according to any one of claims 11 to 13.

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