SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

Abstract

This substrate treatment system comprises a batch treatment unit, a sheet treatment unit, and a conveyance unit. The batch treatment unit collectively treats a plurality of substrates by immersing the plurality of substrates in ozone water stored in a treatment tank. The sheet treatment unit treats the substrates one by one by means of a chemical solution. The conveyance unit conveys the substrates from the batch treatment unit to the sheet treatment unit while the substrates are still wet.

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing system and a substrate processing method. [Background technology]

[0002] The substrate processing apparatus described in Patent Document 1 includes an adjustment liquid supply unit, a dissolution unit, a processing chamber, and a liquid delivery unit. The adjustment liquid supply unit supplies an adjustment liquid exhibiting a predetermined hydrogen ion concentration. The dissolution unit dissolves ozone gas in the adjustment liquid to generate ozone water. The processing chamber cleans the substrate with the ozone water. The liquid delivery unit delivers the ozone water from the dissolution unit to at least one processing chamber through a liquid delivery line. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 100661 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for improving the efficiency of treating a substrate with ozone water and for improving the cleanliness of a substrate treated with ozone water. [Means for solving the problem]

[0005] A substrate processing system according to an embodiment of the present disclosure includes a batch processing unit, a single wafer processing unit, and a transport unit. The batch processing unit processes a plurality of substrates at once by immersing the substrates in ozone water stored in a processing tank. The single wafer processing unit processes the substrates one by one with a chemical solution, and the transport unit transports the substrates from the batch processing unit to the single wafer processing unit while still wet. The substrate processing system includes an imaging device that images the ozone water stored in the processing tank, an image processing unit that processes the image captured by the imaging device and acquires color information of the ozone water, and a concentration calculation unit that calculates the ozone concentration of the ozone water based on the color information of the ozone water acquired by the image processing unit. Effect of the Invention

[0006] According to one aspect of the present disclosure, the efficiency of treating a substrate with ozone water can be improved, and the cleanliness of a substrate treated with ozone water can be improved. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a substrate processing system according to an embodiment. [Diagram 2] FIG. 2 is a flowchart showing a substrate processing method according to an embodiment. [Diagram 3] FIG. 3 is a diagram showing an example of a supply unit that supplies ozone water to the treatment tank. [Figure 4] FIG. 4 is a diagram showing another example of the supply unit that supplies ozone water to the treatment tank. [Diagram 5] FIG. 5 is a cross-sectional view showing an example of a batch-type liquid processing apparatus. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 7 is a plan view showing an example of the arrangement of the outlets of the gas discharge nozzle and the substrate. [Figure 8] FIG. 8 is a functional block diagram of an example of components of the control device. [Figure 9] FIG. 9 is a flowchart showing an example of batch processing. [Figure 10] FIG. 10 is a cross-sectional view showing an example of S209 in FIG. [Figure 11] FIG. 11 is a cross-sectional view showing an example of S210 in FIG. [Figure 12] FIG. 12 is a flowchart showing another example of batch processing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and the description thereof may be omitted.

[0009] Generally, SPM (aqueous solution of sulfuric acid and hydrogen peroxide) is used to remove residues remaining after ashing photoresist. Because SPM contains sulfuric acid, the cost of discharging SPM is high. Therefore, the use of ozone water instead of SPM is being considered. As described in Patent Document 1, when substrates are treated one by one with ozone water, throughput is reduced compared to when substrates are treated one by one with SPM.

[0010] The technology of the present disclosure, which will be described in detail later, improves throughput by immersing multiple substrates in ozone water and processing the multiple substrates at once. Processing multiple substrates at once is also called batch processing, and processing substrates one by one is also called single-wafer processing. Compared to single-wafer processing, batch processing improves throughput, but is more likely to leave dirt on the substrates.

[0011] Therefore, the technique of the present disclosure next transports the substrates wet from the batch processing unit to the single wafer processing unit. This is because if the substrates dry, dirt will adhere firmly to the substrate. Transporting the substrates wet can prevent dirt from adhering firmly to the substrate. The technique of the present disclosure also treats the substrates one by one with a chemical solution in the single wafer processing unit to remove dirt remaining on the substrate. By treating the substrates one by one with a chemical solution, secondary contamination can be prevented. This can improve the cleanliness of the substrates that have been batch-processed with ozone water.

[0012] The ozone water may be used to change the quality of the dirt on the substrate to such an extent that it can be easily dissolved in the chemical solution. The chemical solution is not particularly limited, but may be, for example, an alkaline solution such as SC1 (aqueous solution of ammonium hydroxide and hydrogen peroxide). For example, the ozone water oxidizes the resist residue and reduces its molecular weight. Meanwhile, the alkaline solution dissolves and removes the reduced molecular weight resist residue. The technology disclosed herein may be applied to applications other than removing the resist residue.

[0013] Next, a substrate processing system according to one embodiment will be described with reference to Fig. 1. The substrate processing system 1 includes a loading / unloading section 2, a single wafer processing section 3, an interface section 5, a batch processing section 6, and a control section 9. The loading / unloading section 2 includes a mounting table 21 on which a cassette C is placed. The cassette C contains a plurality of substrates W (e.g., 25 substrates) and is loaded into and unloaded from the loading / unloading section 2. The substrates W are held horizontally inside the cassette C. The single wafer processing section 3 processes the substrates W one by one. The interface section 5 transfers the substrates W between the single wafer processing section 3 and the batch processing section 6. The batch processing section 6 processes a plurality of substrates W (e.g., 50 or 100 substrates) at a time.

[0014] The loading / unloading section 2, the single wafer processing section 3, the interface section 5, and the batch processing section 6 are arranged in this order from the negative side in the X-axis direction to the positive side in the X-axis direction. The loading / unloading section 2 has a mounting table 21, which has a plurality of mounting plates 22. A cassette C is placed on each mounting plate 22. The number of mounting plates 22 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

[0015] The loading / unloading section 2 has a first transport area 23, which is adjacent to the mounting table 21 and disposed on the positive side of the mounting table 21 in the X-axis direction. A first transport device 24 is provided in the first transport area 23. The first transport device 24 has a first transport arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The first transport arm transports the substrate W between the cassette C and a transfer section 25 described below. The number of first transport arms may be one or more, and in the latter case, the first transport device 24 transports multiple substrates W (e.g., five substrates) at a time.

[0016] The load / unload section 2 has a transfer section 25, which is adjacent to the first transfer region 23 and is arranged on the positive side in the X-axis direction of the first transfer region 23. The transfer section 25 has a first transition device 26 that temporarily stores the substrate W. There may be more than one first transition device 26, and multiple first transition devices 26 may be stacked in the vertical direction.

[0017] The single wafer processing unit 3 has a second transfer area 31, which is adjacent to the delivery unit 25 and is disposed on the positive side of the delivery unit 25 in the X-axis direction. A second transfer device 32 is provided in the second transfer area 31. The second transfer device 32 has a second transfer arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The second transfer arm transfers substrates between devices adjacent to the second transfer area 31. The number of second transfer arms may be one or more, and in the latter case, the second transfer device 32 transfers multiple substrates W (e.g., five substrates) at a time.

[0018] The single wafer processing apparatus 3 has, for example, a second transition apparatus 33 and a liquid processing apparatus 34 adjacent to the second transfer region 31. The second transition apparatus 33 is adjacent to the second transfer region 31 and is disposed on the positive side of the second transfer region 31 in the X-axis direction. The second transition apparatus 33 temporarily stores the substrates W. The liquid processing apparatus 34 is of a single wafer type and processes the substrates W one by one with a chemical liquid.

[0019] The interface section 5 has, for example, a lot formation section 51 and a transport section 52. The lot formation section 51 arranges a plurality of substrates W at a desired pitch to form a lot L. One lot L is made up of a plurality of substrates W. The transport section 52 transports the substrates W from the single wafer processing section 3 to the lot formation section 51, and transports the substrates W from the batch processing section 6 to the single wafer processing section 3.

[0020] The batch processing unit 6 has a third transfer region 61, which is adjacent to the interface unit 5 and is disposed on the positive side of the interface unit 5 in the X-axis direction. A third transfer device 62 is provided in the third transfer region 61. The third transfer device 62 has a third transfer arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The third transfer arm transfers substrates W between devices adjacent to the third transfer region 61. The third transfer arm transfers lots L in a batch.

[0021] The third transfer area 61 is rectangular in plan view, and its longitudinal direction is the X-axis direction. The lot formation unit 51 is disposed adjacent to the short side of the third transfer area 61, the treatment tank 63 is disposed adjacent to the long side of the third transfer area 61, and the transfer unit 52 is disposed adjacent to both the lot formation unit 51 and the treatment tank 63. The transfer unit 52 has access to both the lot formation unit 51 and the treatment tank 63.

[0022] The arrangement direction of the substrates W is different between the lot formation section 51 and the processing tank 63. Therefore, the third transport device 62 rotates around a vertical axis while holding a plurality of substrates W, and changes the arrangement direction of the substrates W between the X-axis direction and the Y-axis direction. Note that, if there is no need to change the arrangement direction of the substrates W, the third transport device 62 does not need to rotate around the vertical axis.

[0023] The batch processing unit 6 has a processing tank 63 that stores ozone water in which the lot L is immersed, and a substrate holding unit 64 that receives and holds the lot L from the third transfer device 62. The substrate holding unit 64 arranges a plurality of substrates W in the Y-axis direction and holds each substrate W upright. The batch processing unit 6 has a drive unit 65 that raises and lowers the substrate holding unit 64.

[0024] The control unit 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the substrate processing system 1. The control unit 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the storage medium 92.

[0025] Next, the operation of the substrate processing system 1, i.e., a substrate processing method, will be described with reference to Fig. 2. The process shown in Fig. 2 is performed under the control of the control unit 9. First, a cassette C containing a plurality of substrates W is loaded into the load / unload unit 2 and placed on the mounting plate 22.

[0026] Next, the first transport device 24 takes out the substrate W in the cassette C (step S101) and transports it to the first transition device 26. Then, the second transport device 32 receives the substrate W from the first transition device 26 and transports it to the second transition device 33. Thereafter, the transport section 52 receives the substrate W from the second transition device 33 and transports it to the lot formation section 51.

[0027] Next, the lot formation unit 51 arranges a plurality of substrates W in the X-axis direction at a desired pitch to form a lot L (step S102). One lot L is composed of substrates W accommodated in, for example, N (N is a natural number equal to or greater than 2) cassettes C.

[0028] Next, the third transfer device 62 receives the lot L from the lot formation unit 51 and passes it to the substrate holding unit 64. During this process, the third transfer device 62 rotates around a vertical axis to change the arrangement direction of the multiple substrates W from the X-axis direction to the Y-axis direction.

[0029] Next, the driving device 65 lowers the substrate holder 64, and immerses the lot L held by the substrate holder 64 in the ozone water stored in the processing tank 63, thereby batch processing the plurality of substrates W at once (step S103). After being immersed in the ozone water, the plurality of substrates W are immersed in a rinsing liquid. The rinsing liquid is, for example, DIW (deionized water). Thereafter, the driving device 65 raises the substrate holder 64, and lifts the lot L held by the substrate holder 64 out of the rinsing liquid stored in the processing tank 63.

[0030] The processing tank 63 storing the rinsing liquid and the processing tank 63 storing the ozone water may be provided separately. In this case, the driving device 65 may not only raise and lower the substrate holding part 64 vertically but also move it horizontally (for example, in the X-axis direction) in order to transport a plurality of substrates W between the two processing tanks 63. However, a substrate holding part 64 and a driving device 65 may be provided for each processing tank 63, and in this case, the driving device 65 does not need to move the substrate holding part 64 horizontally.

[0031] Next, the transfer unit 52 receives the substrate W from the substrate holder 64, and transfers the substrate W while it is wet from the batch processor 6 to the single wafer processor 3 (step S104). At this time, the transfer unit 52 transfers the substrate W one by one, but may transfer multiple substrates at a time. The substrate W may be transferred to the liquid processing device 34 without passing through the second transition device 33, or may be transferred to the liquid processing device 34 via the second transition device 33. In the latter case, the second transfer device 32 may transfer the substrate W from the second transition device 33 to the liquid processing device 34.

[0032] Next, the liquid processing device 34 processes the substrates W one by one with a chemical solution (step S105). The chemical solution is not particularly limited, but an alkaline solution such as SC1 is used. The liquid processing device 34 supplies the chemical solution to the substrate W, for example, while rotating the substrate W. The chemical solution containing the contaminants on the substrate W is shaken off from the substrate W by centrifugal force.

[0033] The liquid processing apparatus 34 supplies, for example, a chemical liquid, a rinsing liquid, and a drying liquid in this order to the substrate W. As the drying liquid, for example, an organic solvent such as IPA (isopropyl alcohol) is used. The liquid processing apparatus 34 spins the substrate W to shake off the drying liquid adhering to the substrate W, and dries the substrate W.

[0034] The single wafer processing section 3 may include a supercritical dryer, in which case the substrate W is transported to the supercritical dryer with a puddle of drying liquid thereon. The supercritical dryer dries the substrate W by using a supercritical fluid.

[0035] Next, the second transfer device 32 receives the substrate W from the liquid processing device 34 and transfers it to the first transition device 26. Next, the first transfer device 24 receives the substrate W from the first transition device 26 and stores it in the cassette C (step S105). The cassette C is transferred out of the transfer section 2 with a plurality of substrates W stored therein.

[0036] As described above, in the substrate processing system 1, a plurality of substrates W are immersed in ozone water stored in the processing tank 63 in the batch processing unit 6, the substrates W are transported wet from the batch processing unit 6 to the single wafer processing unit 3, and the substrates W are treated one by one with a chemical solution in the single wafer processing unit 3. By immersing a plurality of substrates W in ozone water at once, it is possible to improve throughput. Then, by transporting the substrates W wet from the batch processing unit 6 to the single wafer processing unit 3, it is possible to prevent contaminants from firmly adhering to the substrates W. Furthermore, by further treating the substrates W one by one with a chemical solution in the single wafer processing unit 3, it is possible to improve the cleanliness of the substrates W that have been batch-processed with ozone water.

[0037] Next, referring to FIG. 3, an example of a supply unit 70 that supplies ozone water to the treatment tank 63 will be described. The supply unit 70 includes a circulation path 71 and an ozone gas supply unit 72. The circulation path 71 circulates the ozone water. The capacity of the circulation path 71 is larger than the amount of ozone water used in one batch process. The ozone gas supply unit 72 supplies ozone gas to the circulation path 71. The ozone gas dissolves in water to generate ozone water. The water is DIW or the like, and is supplied to the circulation path 71 from a liquid source 73. In the process in which the ozone water circulates through the circulation path 71, the ozone gas dissolves in the ozone water, and the ozone concentration of the ozone water gradually increases.

[0038] The liquid source 73 may supply an acidic aqueous solution to the circulation path 71 instead of water. The acidic aqueous solution includes an organic acid or an inorganic acid. As the organic acid, for example, citric acid, acetic acid, or carbonic acid is used. As the inorganic acid, for example, hydrochloric acid or nitric acid is used. The acidic aqueous solution is effective in removing metal ions contained in the resist residue.

[0039] The supply unit 70 includes a pressurizing device 74, a pressure gauge 75, and a pressure control valve 76. The pressurizing device 74 is, for example, a pump, and increases the limit amount (solubility) of ozone gas that dissolves in water by pressurizing the ozone water in the circulation path 71. The pressure gauge 75 measures the pressure of the ozone water. The pressure control valve 76 controls the pressure of the ozone water so that the measurement value of the pressure gauge 75 becomes a set value.

[0040] The supply unit 70 includes a cooling device 77. The cooling device 77 increases the solubility of the ozone gas by cooling the ozone water in the circulation path 71. The cooling device 77 includes, for example, a Peltier element. A thermometer (not shown) may be provided in the circulation path 71, and the cooling device 77 cools the ozone gas so that the temperature of the thermometer becomes a set temperature.

[0041] The supply unit 70 includes a carbon dioxide gas supply unit 78. The carbon dioxide gas supply unit 78 supplies carbon dioxide gas (CO2 gas) to the circulation path 71. When the carbon dioxide gas dissolves in the ozone water, the pH value of the ozone water decreases and the solubility of the ozone gas increases. Instead of the carbon dioxide gas, an organic acid or an inorganic acid may be supplied.

[0042] The supply unit 70 includes a filter 79, a flowmeter 80, and an ozone concentration meter 81. The filter 79 collects particles contained in the ozone water in the circulation path 71. The flowmeter 80 measures the flow rate of the ozone water flowing through the circulation path 71. The ozone concentration meter 81 measures the ozone concentration of the ozone water flowing through the circulation path 71.

[0043] The supply unit 70 includes a branch path 82 and a directional switching valve 83. The branch path 82 branches off from the circulation path 71, and supplies the ozone water flowing through the circulation path 71 to the treatment tank 63. The directional switching valve 83 switches the flow direction of the ozone water between a direction in which the ozone water circulates through the circulation path 71 and a direction in which the ozone water is supplied to the treatment tank 63.

[0044] The processing tank 63 includes, for example, an inner tank 63a and an outer tank 63b. The inner tank 63a stores ozone water. The substrates W are immersed in the ozone water stored in the inner tank 63a. The outer tank 63b collects the ozone water that overflows from the inner tank 63a. A discharge unit 85 is connected to the processing tank 63.

[0045] The discharge unit 85 discharges used ozone water. The discharge unit 85 includes a discharge path 86 and a waste liquid treatment unit 87. The discharge path 86 is connected to the treatment tank 63. The waste liquid treatment unit 87 includes an ozone filter that decomposes ozone into oxygen. The ozone filter has a catalyst or activated carbon. The waste liquid treatment unit 87 includes a mesh filter that collects resist residue.

[0046] The imaging device 88 captures an image of the ozone water stored in the treatment tank 63 (e.g., the inner tank 63a). The higher the ozone concentration of the ozone water, the deeper the blue color of the ozone water. By processing the image captured by the imaging device 88 and acquiring color information of the ozone water, the ozone concentration of the ozone water can be detected.

[0047] The location where the substrate W is immersed in the ozone water is not the circulation path 71 but the treatment tank 63. The pressure of the ozone water is lower in the treatment tank 63 and the solubility of ozone gas is lower than in the circulation path 71, so that the ozone concentration of the ozone water may be lower. If the imaging device 88 is used instead of the ozone concentration meter 81, the ozone concentration of the ozone water can be detected at the location where the substrate W is immersed in the ozone water.

[0048] The imaging device 88 is installed, for example, above the treatment tank 63 so as not to get wet, and captures an image of the liquid surface of the ozone water.

[0049] Next, with reference to FIG. 4, another example of the supply unit 70 that supplies ozone water to the treatment tank 63 will be described. Hereinafter, differences between FIG. 3 and FIG. 4 will be mainly described. The circulation path 71 shown in FIG. 3 is closed in an endless ring shape, whereas the circulation path 71 shown in FIG. 4 is open. The treatment tank 63 has an inner tank 63a and an outer tank 63b, and the circulation path 71 connects the outer tank 63b and the inner tank 63a as shown in FIG. 4. One end of the circulation path 71 is connected to the outer tank 63b, and the other end of the circulation path 71 is connected to the inner tank 63a. The circulation path 71 returns the ozone water taken out from the outer tank 63b to the inner tank 63a. The liquid source 73 may be connected to at least one of the inner tank 63a and the outer tank 63b as shown in FIG. 4, instead of being connected to the circulation path 71 as shown in FIG. 3.

[0050] Next, an example of a batch-type liquid processing apparatus will be described with reference to Figures 5 to 7. The batch-type liquid processing apparatus includes a processing tank 63, a substrate holding unit 64, a driving device 65, a liquid discharge nozzle 66, and a gas discharge nozzle 67.

[0051] The processing tank 63 stores ozone water in which a plurality of substrates W are immersed at once. The processing tank 63 may store a rinsing liquid. The processing tank 63 may be provided with an ultrasonic generator (not shown). The ultrasonic generator applies ultrasonic vibration to the ozone water to improve the efficiency of cleaning the substrates W with the ozone water.

[0052] The substrate holding unit 64 arranges a plurality of substrates W in the Y-axis direction and holds each substrate W vertically. The substrate holding unit 64 has a plurality of holding arms 64a (for example, four). Each holding arm 64a is provided along the Y-axis direction and has a plurality of grooves spaced apart in the Y-axis direction. Each substrate W is held by the grooves of the holding arm 64a.

[0053] The driving device 65 raises and lowers the substrate holding part 64. The substrate holding part 64 is raised and lowered between a position inside the processing tank 63 and a position above the processing tank 63. The driving device 65 may move the substrate holding part 64 in the horizontal direction as described above.

[0054] The liquid discharge nozzle 66 is provided horizontally inside the processing tank 63, and discharges a processing liquid into the processing tank 63. The discharged processing liquid is ozone water or a rinsing liquid supplied from a supply unit 70. The liquid discharge nozzles 66 are provided, for example, along the Y-axis direction, and a plurality of nozzles are provided at intervals in the X-axis direction. Each liquid discharge nozzle 66 has a plurality of discharge ports 66a at intervals in the Y-axis direction. Each discharge port 66a is provided below the substrate W immersed in the processing liquid. Although each discharge port 66a discharges the processing liquid directly upward in FIGS. 5 and 6, the processing liquid may be discharged diagonally upward.

[0055] The gas discharge nozzle 67 is provided horizontally inside the processing tank 63 and discharges gas into the processing tank 63. The gas discharge nozzle 67 is provided, for example, along the Y-axis direction, and a plurality of gas discharge nozzles 67 are provided at intervals in the X-axis direction. Each gas discharge nozzle 67 has a plurality of discharge ports 67a at intervals in the Y-axis direction. Each discharge port 67a is provided below the substrate W immersed in the processing liquid. Although each discharge port 67a discharges the processing liquid directly upward in FIGS. 5 and 6, the processing liquid may be discharged obliquely upward. The discharge port 67a of the gas discharge nozzle 67 is provided below the discharge port 66a of the liquid discharge nozzle 66.

[0056] The processing tank 63 stores ozone water, and while the substrate W is immersed in the ozone water, the gas discharge nozzle 67 discharges gas. The gas increases the flow rate of the ozone water, allowing the ozone water to reach the resist residue before the ozone water is deactivated. This improves the efficiency of removing the resist residue.

[0057] When ozone water is stored inside the treatment tank 63, the gas discharge nozzle 67 discharges, for example, oxygen gas or a rare gas. Unlike nitrogen gas, oxygen gas or a rare gas does not react with ozone, so that deactivation of the ozone water can be suppressed.

[0058] 7, when viewed from above, each gas discharge nozzle 67-1, 67-2 has a discharge port 67a in the first gap G1 or the second gap G2 between two substrates W adjacent in the Y-axis direction. The discharge port 67a discharges gas directly upward. Since the substrates W do not prevent the discharged gas from rising, the flow rate of the ozone water is likely to increase, and resist residues are likely to be removed.

[0059] When viewed from above, the first gap G1 and the second gap G2 are alternately arranged in the Y-axis direction, and the gas discharge nozzle 67-1 having the discharge port 67a only in the first gap G1 and the gas discharge nozzle 67-2 having the discharge port 67a only in the second gap G2 are alternately provided in the X-axis direction. Gas can be discharged widely and uniformly into both the first gap G1 and the second gap G2.

[0060] As shown in FIG. 8, the control unit 9 includes, for example, an image processing unit 101, a concentration calculation unit 102, a first imaging control unit 103, a first determination unit 104, a second imaging control unit 105, and a second determination unit 106.

[0061] The image processing unit 101 processes the image captured by the imaging device 88 to obtain color information of the ozone water. By using the imaging device 88, it is possible to detect the ozone concentration of the ozone water that is actually in contact with the substrate W. The concentration calculation unit 102 calculates the ozone concentration of the ozone water based on the color information of the ozone water obtained by the image processing unit 101. It is also possible to use the color information itself as an index representing the ozone concentration without calculating the ozone concentration.

[0062] After storing ozone water in the treatment tank 63, the first imaging control unit 103 images the ozone water using the imaging device 88 before immersing multiple substrates W in the ozone water. The first judgment unit 104 judges whether or not to immerse the substrate W in the ozone water based on the color information of the ozone water acquired by the image processing unit 101. The substrate W is immersed in ozone water whose color information or the ozone concentration calculated from the color information is within a set range. If the color information or the ozone concentration is outside the set range, the discharge unit 85 discharges the ozone water from the treatment tank 63, and the supply unit 70 supplies new ozone water to the treatment tank 63. This makes it possible to suppress deterioration in the quality of the substrates W due to an abnormality in the ozone concentration.

[0063] The second imaging control unit 105 images the ozone water using the imaging device 88 while the multiple substrates W are immersed in the ozone water stored in the processing tank 63. The second judgment unit 106 judges whether the processing of the multiple substrates W has been performed normally or not, based on color information of the ozone water imaged under the control of the second imaging control unit 105. If the color information or the ozone concentration calculated from the color information is within a set range, the processing is judged to be normal, and otherwise the processing is judged to be abnormal. The processing quality of the substrates W can be easily judged.

[0064] Note that each functional block shown in Fig. 8 is conceptual and does not necessarily have to be physically configured as shown in the figure. All or part of each functional block shown in Fig. 8 can be functionally or physically distributed and integrated in any unit. All or any part of each processing function performed by each functional block can be realized by a program executed by a CPU, or can be realized as hardware using wired logic.

[0065] Next, an example of batch processing will be described with reference to Fig. 9 to Fig. 11. In Fig. 9 to Fig. 11, ozone water and a rinsing liquid are stored in order in one processing tank 63. The processing shown in Fig. 9 is performed under the control of the control unit 9. First, the discharge unit 85 discharges the rinsing liquid used in the previous batch processing from the processing tank 63 (step S201).

[0066] Next, the supply unit 70 supplies ozone water to the treatment tank 63 (step S202). Even after the inner tank 63a of the treatment tank 63 is filled with ozone water, the supply unit 70 continues to supply ozone water to the inner tank 63a so that the ozone water in the inner tank 63a is not deactivated, and the supply unit 70 continues to overflow the ozone water from the inner tank 63a to the outer tank 63b.

[0067] Next, the imaging device 88 captures an image of the ozone water stored in the inner tank 63a (step S203). This imaging is performed under the control of the first imaging control unit 103. When the imaging device 88 captures an image of the ozone water, the gas discharge nozzle 67 does not discharge gas into the ozone water. This is because bubbling of the ozone water can change the color information of the ozone water. The imaging device 88 transmits the captured image to the control unit 9.

[0068] Next, the image processing unit 101 processes the image captured by the imaging device 88 to obtain color information of the ozone water (step S204). After that, although not shown, the concentration calculation unit 102 may calculate the ozone concentration of the ozone water based on the color information of the ozone water obtained by the image processing unit 101.

[0069] Next, the first judgment unit 104 judges whether or not to immerse the substrates W in the ozone water based on the color information of the ozone water acquired by the image processing unit 101 (step S205). If the color information or the ozone concentration calculated from the color information is within a set range, the first judgment unit 104 judges that immersion is possible. Next, the driving device 65 lowers the substrate holding unit 64, and immerses the multiple substrates W held by the substrate holding unit 64 in the ozone water stored in the inner tank 63a (step S206).

[0070] If the color information or the ozone concentration calculated from the color information is outside the set range, the first judgment unit 104 judges that immersion is not possible. In this case, the discharge unit 85 discharges the ozone water from the inner bath 63a, the supply unit 70 supplies new ozone water to the inner bath 63a, and the first judgment unit 104 again judges whether immersion is possible. Here, if the first judgment unit 104 again judges that immersion is not possible, the processing of the substrate W is interrupted and maintenance is performed.

[0071] Next, the gas discharge nozzle 67 starts discharging gas (step S207). The discharged gas increases the flow rate of the ozone water, allowing the ozone water to reach the resist residue before the ozone water is deactivated. This improves the efficiency of removing the resist residue. Note that the start of gas discharge (step S207) may be any time after the imaging of the ozone water (step S203).

[0072] Although not shown, the second imaging control unit 105 may image the ozone water by the imaging device 88 while the multiple substrates W are immersed in the ozone water stored in the inner tank 63a. The second judgment unit 106 judges whether the processing of the multiple substrates W has been normally performed based on color information of the ozone water imaged under the control of the second imaging control unit 105.

[0073] When the elapsed time from the immersion of the substrate W (step S206) reaches a set time, the supply unit 70 stops supplying the ozone water to the inner bath 63a, and the gas discharge nozzle 67 stops discharging the gas (step S208).

[0074] Next, the exhaust unit 85 exhausts the ozone water from the inner bath 63a (step S209). As shown in Fig. 10, while the liquid level of the ozone water is lowering, the nozzle 68 may supply a shower or mist of rinsing liquid from above to the substrate W so that the substrate W does not dry. During this time, the substrate W is accommodated inside the inner bath 63a.

[0075] Next, the supply unit 70 supplies a rinsing liquid to the inner bath 63a (step S210). As shown in Fig. 11, while the level of the rinsing liquid is rising, the nozzle 68 may supply the rinsing liquid from above in the form of a shower or mist to the substrate W so that the substrate W does not dry. During this time, the substrate W is accommodated inside the inner bath 63a.

[0076] Even after the inner bath 63a is filled with the rinsing liquid, the supply unit 70 continues to supply the rinsing liquid to the inner bath 63a, and the supply unit 70 continues to make the rinsing liquid overflow from the inner bath 63a to the outer bath 63b. The rinsing liquid removes ozone water remaining on the substrate W. The supply of the rinsing liquid continues for a set time.

[0077] Next, the driving device 65 raises the substrate holder 64, and pulls up the substrates W held by the substrate holder 64 from the rinsing liquid stored in the inner bath 63a. Thereafter, the transport unit 52 unloads the substrates W (step S211). Note that the substrates W may be unloaded one by one in sequence by the transport unit 52 while still immersed in the rinsing liquid.

[0078] Next, another example of batch processing will be described with reference to Fig. 12. In Fig. 12, two processing tanks 63 are used. One processing tank 63 is a chemical tank that stores ozone water. The other processing tank 63 is a rinse tank that stores a rinse liquid. The processing shown in Fig. 12 is performed under the control of the control unit 9.

[0079] At least, the chemical tank is configured so that the circulation path 71 returns the ozone water taken out from the outer tank 63b to the inner tank 63a as shown in Fig. 4. The supply unit 70 continues to circulate the ozone water (step S301). At this time, the rinse tank is on standby with the rinse liquid stored in the inner tank 63a, and the overflow of the rinse liquid is stopped.

[0080] Next, the control unit 9 performs steps S302 to S307. Steps S302 to S307 are similar to steps S203 to S208 in Fig. 9, so a description thereof will be omitted. However, in step S307, unlike step S208 in Fig. 9, the supply of ozone water is not stopped and the circulation of ozone water is continued.

[0081] Next, the driving device 65 raises the substrate holding part 64, and pulls up the multiple substrates W held by the substrate holding part 64 from the ozone water stored in the inner bath 63a. The multiple substrates W are carried out by, for example, the third transfer device 62 (step S308). Thereafter, the third transfer device 62 delivers the multiple substrates to the substrate holding part 64 waiting above the rinsing bath.

[0082] In this embodiment, different substrate holders 64 are used for the chemical tank and the rinsing tank, but it is also possible to use the same substrate holder 64. In the latter case, the driving device 65 may not only raise and lower the substrate holder 64 vertically but also move it horizontally (for example, in the X-axis direction) in order to transport multiple substrates W between the chemical tank and the rinsing tank.

[0083] On the other hand, in the rinsing tank, the rinsing liquid starts to overflow (step S401). The start of the overflow of the rinsing liquid (step S401) may be performed before the substrate W is immersed in the rinsing liquid (step S402).

[0084] Next, the driving device 65 lowers the substrate holder 64, and immerses the substrates W held by the substrate holder 64 all at once into the rinsing liquid stored in the inner bath 63a (step S402). The rinsing liquid removes the ozone water remaining on the substrates W. The overflow of the rinsing liquid continues for a set time.

[0085] Next, the overflow of the rinsing liquid is stopped (step S403). Thereafter, the driving device 65 raises the substrate holding part 64, and pulls up the multiple substrates W held by the substrate holding part 64 from the rinsing liquid stored in the inner bath 63a. Thereafter, the transport part 52 unloads the substrates W (step S404). Note that the substrates W may be unloaded one by one in sequence by the transport part 52 while still immersed in the rinsing liquid.

[0086] Although the embodiments of the substrate processing system and the substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above-mentioned embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0087] This application claims priority based on Patent Application No. 2021-111943 filed with the Japan Patent Office on July 6, 2021, and the entire contents of Patent Application No. 2021-111943 are incorporated by reference into this application. [Explanation of symbols]

[0088] 1. Substrate Processing System 3 Single-wafer processing section 52 Conveyor 6 Batch Processing Section 63 Treatment tank W substrate

Claims

1. a batch processing unit that immerses a plurality of substrates in ozone water stored in a processing tank to process the substrates at the same time; a single-wafer processing section for processing the substrates one by one with a chemical solution; a transport unit that transports the substrate while it is wet from the batch processing unit to the single wafer processing unit; an imaging device for imaging the ozone water stored in the treatment tank; an image processing unit that processes the image captured by the imaging device and acquires color information of the ozone water; a concentration calculation unit that calculates an ozone concentration of the ozone water based on the color information of the ozone water acquired by the image processing unit; A substrate processing system comprising:

2. a batch processing unit that immerses a plurality of substrates in ozone water stored in a processing tank to process the substrates at the same time; a single-wafer processing section for processing the substrates one by one with a chemical solution; a transport unit that transports the substrate while it is wet from the batch processing unit to the single wafer processing unit; an imaging device for imaging the ozone water stored in the treatment tank; an image processing unit that processes the image captured by the imaging device and acquires color information of the ozone water; a first determination unit that determines whether or not to immerse the substrate in the ozone water based on color information of the ozone water acquired by the image processing unit; A substrate processing system comprising:

3. The substrate processing system of claim 1 or 2, further comprising a first imaging control unit that images the ozone water using the imaging device after the ozone water is stored in the processing tank and before a plurality of the substrates are immersed in the ozone water.

4. a second imaging control unit that captures an image of the ozone water by the imaging device while the substrates are immersed in the ozone water stored in the treatment tank; A second determination unit that determines whether or not the processing of the plurality of substrates has been normally performed based on color information of the ozone water imaged under the control of the second imaging control unit; The substrate processing system according to claim 1 , further comprising:

5. Each of the substrates has resist residue thereon; The ozone water oxidizes the resist residue, 3. The substrate processing system according to claim 1, wherein the chemical dissolves and removes the resist residue oxidized by the ozone water.

6. 3. The substrate processing system of claim 1, wherein the batch processing unit includes a circulation path for circulating the ozone water, an ozone gas supply unit for supplying ozone gas to the circulation path, a pressurizing device for pressurizing the ozone water in the circulation path, and a cooling device for cooling the ozone water in the circulation path.

7. In the batch processing section, a plurality of substrates are immersed in ozone water stored in a processing tank to process the plurality of substrates at once; transporting the substrate while it is wet from the batch processing section to a single wafer processing section; treating the substrates one by one with a chemical solution in the single wafer processing section; A method for processing a substrate, comprising: Before immersing the plurality of substrates in the ozone water stored in the treatment tank, an image of the ozone water stored in the treatment tank is captured by an image capture device; Processing the image captured by the imaging device by an image processing unit to obtain color information of the ozone water; When color information of the ozone water acquired by the image processing unit satisfies a preset condition, immersing a plurality of the substrates in the ozone water stored in the treatment tank; The substrate processing method comprises:

8. In the batch processing section, a plurality of substrates are immersed in ozone water stored in a processing tank to process the plurality of substrates at once; transporting the substrate while it is wet from the batch processing section to a single wafer processing section; treating the substrates one by one with a chemical solution in the single wafer processing section; A method for processing a substrate, comprising: While the plurality of substrates are immersed in the ozone water stored in the treatment tank, an image of the ozone water stored in the treatment tank is captured by an image capture device; Processing the image captured by the imaging device by an image processing unit to obtain color information of the ozone water; determining whether the processing of the plurality of substrates has been performed normally based on whether color information of the ozone water acquired by the image processing unit satisfies a preset condition; The substrate processing method comprises:

9. Each of the substrates has resist residue thereon; The ozone water oxidizes the resist residue, 9. The substrate processing method according to claim 7, wherein the chemical dissolves and removes the resist residue oxidized by the ozone water.

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