Cooling device and method for manufacturing the same

Abstract

To provide a cooling device capable of sufficiently increasing the mounting density of multiple fin rows on a heat dissipation surface, and a manufacturing method of cooling device.SOLUTION: In a cooling device (100), a first heat radiation fin row (21) and a second heat radiation fin row (22) are arranged alternately. The first heat radiation fin height (2111) is different from the second heat radiation fin height (2211). The first heat radiation fin height (2111) is, in a state where the downwardly tapered tool (5) is in contact with the heat dissipation surface (11) to form the second heat dissipation fin row (22), the height is such that the upper portion of the tool (5), which is wider in the horizontal direction than the lower portion, does not come into contact with the first radiation fin row (21).SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present invention relates to a cooling device and a method for manufacturing a cooling device. [Background technology]

[0002] In recent years, there has been a demand for increased output from power conversion devices. At the same time, there has been a demand for a structure that can improve the productivity of cooling devices mounted on the power conversion devices.

[0003] However, if the improvement in productivity of the cooling device leads to a decrease in the heat transfer coefficient, it will hinder the increase in the output of the power conversion device. Compared to power conversion devices for industrial use, on-board power conversion devices are used in environments with greater temperature changes. For this reason, power conversion devices that can maintain high reliability even in high-temperature environments require cooling devices with high heat transfer coefficients.

[0004] In Patent Document 1, a heat dissipation surface of a substrate made of aluminum metal or an aluminum metal alloy is plated with copper or nickel at predetermined locations, and a heat dissipation fin row, which is a row of wire fins made of copper metal or a copper alloy and formed by bending the wire fins multiple times through the plated locations, is soldered to the heat dissipation surface to form an integrated unit.

[0005] According to the configuration described in Patent Document 1, the heat dissipation area is increased by using a heat dissipation fin row that is continuously folded in an uneven shape. In addition, since the wires that make up the heat dissipation fin row are continuously folded to form the heat dissipation fins, the number of steps in the manufacturing process is reduced, resulting in increased productivity. Furthermore, the heat dissipation area is increased by arranging the heat dissipation fin rows that are folded in an uneven shape in parallel. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2002-190557 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, the technique described in Patent Document 1 does not allow the spacing between adjacent heat dissipation fin rows to be small, which may result in an insufficient mounting density of multiple heat dissipation fin rows on the heat dissipation surface.

[0008] An object of the present invention is to provide a cooling device that can sufficiently increase the mounting density of a plurality of rows of heat dissipating fins on a heat dissipating surface, and a method for manufacturing the cooling device. [Means for solving the problem]

[0009] A cooling device according to one embodiment of the present invention is a cooling device in which heat dissipation fins, which are linear heat dissipation portions, are arranged on a heat dissipation surface, and which has a plurality of heat dissipation fin rows, wherein a first heat dissipation fin row among the heat dissipation fin rows and a second heat dissipation fin row, which is the heat dissipation fin row adjacent to the first heat dissipation fin row, are arranged alternately, and a first heat dissipation fin height, which is the height of the first heat dissipation fin row from the heat dissipation surface, is different from a second heat dissipation fin height, which is the height of the second heat dissipation fin row from the heat dissipation surface, and the first heat dissipation fin height is a height at which an upper part of the tool, which has a horizontal width greater than the lower part, does not contact the first heat dissipation fin row when a tool having a downwardly tapered shape contacts the heat dissipation surface to form the second heat dissipation fin row. Effect of the Invention

[0010] According to the present invention, it is possible to provide a cooling device and a method for manufacturing a cooling device that can sufficiently increase the mounting density of multiple fin rows on a heat dissipation surface. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is an exploded perspective view showing a cooling device according to a first embodiment. [Diagram 2] FIG. 2 is a vertical cross-sectional view showing the cooling device according to the first embodiment as viewed from the X direction in FIG. [Diagram 3] FIG. 3 is a vertical cross-sectional view showing the cooling device according to the first embodiment as viewed from the Y direction in FIG. [Figure 4] FIG. 4 is a perspective view showing the cooling device according to the first embodiment with the cooling cover removed. [Diagram 5] FIG. 5 is a front view showing the cooling device according to the first embodiment with the cooling cover removed, as viewed from the X direction in FIG. [Figure 6] FIG. 6 is a side view showing the cooling device according to the first embodiment with the cooling cover removed, as viewed from the Y direction in FIG. [Figure 7] FIG. 7 is an explanatory diagram showing the tool according to the first embodiment. [Figure 8] FIG. 8 is a flowchart showing a method for manufacturing the cooling device according to the first embodiment. [Figure 9] FIG. 9 is an explanatory diagram showing a first manufacturing step of the manufacturing method for the cooling device according to the first embodiment. [Figure 10] FIG. 10 is an explanatory diagram showing a second manufacturing step of the manufacturing method for the cooling device according to the first embodiment. [Figure 11] FIG. 11 is an explanatory diagram showing the dimensional relationship between the first and second heat dissipation fin rows and the tool according to the first embodiment. [Figure 12] FIG. 12 is a perspective view showing a cooling device according to Modification 1 of the first embodiment with a cooling cover removed. [Figure 13] FIG. 13 is a front view showing the cooling device according to the first modification of the first embodiment with the cooling cover removed, as viewed from the X direction in FIG. [Figure 14] FIG. 14 is a side view showing the cooling device according to the first modification of the first embodiment with the cooling cover removed, as viewed from the Y direction in FIG. [Figure 15] FIG. 15 is a vertical cross-sectional view showing a cooling device according to Modification 2 of the first embodiment, as viewed from the Y direction in FIG. [Figure 16] FIG. 16 is an explanatory diagram showing a first manufacturing step of the manufacturing method for the cooling device according to the third modification of the first embodiment. [Figure 17]FIG. 17 is an explanatory diagram showing a second manufacturing step of the manufacturing method for the cooling device according to the third modification of the first embodiment. [Figure 18] FIG. 18 is an explanatory diagram showing a dimensional relationship between the first and second heat dissipation fin rows and the tool according to the third modification of the first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment, and the technical idea of ​​the present invention may be realized by combining other known components. In addition, the same elements in each drawing are indicated by the same reference numerals, and duplicated explanations are omitted.

[0013] First Embodiment <Overall Configuration of Cooling Device 100> Fig. 1 is an exploded perspective view showing a cooling device 100 according to a first embodiment. Fig. 2 is a vertical cross-sectional view showing the cooling device 100 according to the first embodiment, as viewed from an X direction in Fig. 1. Fig. 3 is a vertical cross-sectional view showing the cooling device 100 according to the first embodiment, as viewed from a Y direction in Fig. 1.

[0014] 1 to 3, the cooling device 100 dissipates heat from a heat dissipation member 1 by circulating a refrigerant therein. The cooling device 100 is a box body. The cooling device 100 includes a heat dissipation member 1, a first heat dissipation fin row 21, a second heat dissipation fin row 22, a heat dissipation cover 3, and a seal member 4.

[0015] The heat dissipation member 1 is used in an in-vehicle power conversion device and is used in an environment with large temperature changes. The heat dissipation member 1 is a rectangular plate material, and is composed of a substrate part made of aluminum metal or an aluminum metal alloy, and the heat dissipation surface 11 is formed with the upper surface plated with copper or nickel.

[0016] The first heat dissipating fin row 21 and the second heat dissipating fin row 22 are configured by connecting heat dissipating fins 2, which are wire fins formed by continuously bending metal wires 23, such as copper metal or copper alloy, which are linear heat dissipating parts, into multiple uneven shapes. The first heat dissipating fin row 21 and the second heat dissipating fin row 22 are disposed on the heat dissipating surface 11 of the heat dissipating member 1 and integrated with each other. The first heat dissipating fin row 21 and the second heat dissipating fin row 22 are provided in a plurality of rows extending in the X direction of the cooling device 100 and aligned in the Y direction.

[0017] The heat dissipation cover 3 is made of an insulating resin material and covers the heat dissipation surface 11 from above. The heat dissipation cover 3 is a lid member and is fixed to the upper part of the heat dissipation member 1 by screws (not shown). The heat dissipation cover 3 is rectangular in shape, has a hollow portion that opens downward inside, and has a top surface portion 31 and side surface portions 32 on four sides connected to the top surface portion 31. The heat dissipation cover 3 is in contact with the second heat dissipation fin row 22 that enters the hollow portion at the bottom surface of the top surface portion 31. The pair of opposing side surface portions 32 of the heat dissipation cover 3 are provided with an inlet portion 33 and an outlet portion 34 for the refrigerant that flows through the cooling device 100. As shown in FIG. 1, the X direction is a direction perpendicular to the refrigerant flow direction, and the Y direction is the refrigerant flow direction.

[0018] The seal member 4 seals the heat dissipation member 1 and the heat dissipation cover 3. The seal member 4 is a rectangular ring member that surrounds the edge of the heat dissipation surface 11. The seal member 4 is fitted into recesses 321 formed on the lower surfaces of the four side surface portions 32 of the heat dissipation cover 3. As a result, the heat dissipation surface 11 is sealed by the heat dissipation cover 3 and the seal member 4, and is cooled by an insulating refrigerant (not shown) that flows through the cooling device 100.

[0019] <Example of heat dissipation fin configuration> Fig. 4 is a perspective view showing the cooling device 100 with the cooling cover 3 according to the first embodiment removed. Fig. 5 is a front view showing the cooling device 100 with the cooling cover 3 according to the first embodiment removed, as viewed from the X direction in Fig. 1. Fig. 6 is a side view showing the cooling device 100 with the cooling cover 3 according to the first embodiment removed, as viewed from the Y direction in Fig. 1.

[0020] 4 to 6, the first heat dissipating fin row 21 and the second heat dissipating fin row 22 are formed by crimping linear wires 23 forming the heat dissipating fins 2 onto the heat dissipating surface 11. The first heat dissipating fin row 21 and the second heat dissipating fin row 22, which is a heat dissipating fin row adjacent to the first heat dissipating fin row 21, are arranged alternately. A first heat dissipating fin height 2111, which is the height of the first heat dissipating fin row 21 from the heat dissipating surface 11, is different from a second heat dissipating fin height 2211, which is the height of the second heat dissipating fin row 22 from the heat dissipating surface 11.

[0021] The first heat dissipation fin row 21 and the second heat dissipation fin row 22 have a first heat dissipation fin connection portion 211 and a second heat dissipation fin connection portion 221 which are joints with the heat dissipation surface 11. The contact area of ​​the second heat dissipation fin connection portion 221 is larger than that of the first heat dissipation fin connection portion 211. Between adjacent first heat dissipation fin connection portions 211 and adjacent second heat dissipation fin connection portions 221 in one heat dissipation fin row, the wire 23 is bent and raised above the heat dissipation surface 11 to bridge the gap, and has a convex loop that comes into contact with the refrigerant flowing through the cooling device 100.

[0022] The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are arranged so that the opposing area with respect to the flow of the refrigerant flowing through the cooling device 100 is larger than the opposing area intersecting the refrigerant flow. In other words, the opposing area of ​​the first heat dissipation fin row 21 and the second heat dissipation fin row 22 facing in the Y direction is larger than the opposing area facing in the X direction.

[0023] <Tool 5 Configuration> Fig. 7 is an explanatory diagram showing the tool 5 according to the first embodiment. As shown in Fig. 7, the tool 5 has a shape in which the upper part is wider than the lower part and tapers downward, with the upper part having a horizontal width greater than the lower part. The tool 5 has a wire feed section 51, a high-frequency vibration pressing section 52, and a cutting section 53. The wire feed section 51, the high-frequency vibration pressing section 52, and the cutting section 53 are arranged in three rows.

[0024] The wire feed section 51 has an outlet for the metal wire 23, and bends the metal wire 23 into an uneven shape and feeds it continuously.

[0025] The high-frequency vibration pressing unit 52 has a columnar pressing portion, and the pressing portion vibrates the wire 23 at a high frequency to bring it into contact with the heat dissipation surface 11. The high-frequency vibration pressing unit 52 presses the linear wire 23 forming the heat dissipation fins 2 sent out from the tool 5 onto the heat dissipation surface 11, thereby forming the first heat dissipation fin row 21 and the second heat dissipation fin row 22.

[0026] The tool 5 does not have to use a technique for crimping the linear wire 23 forming the heat dissipation fin 2 sent from the tool 5 by the high-frequency vibration pressing unit 52 onto the heat dissipation surface 11. For example, the tool 5 may use a technique for soldering a fin that has been bent in advance.

[0027] The cutting unit 53 cuts the metal wire 23 after one row of the first heat dissipation fin row 21 or the second heat dissipation fin row 22 has been formed.

[0028] <Method of Manufacturing Cooling Device 100> Fig. 8 is a flowchart showing a method for manufacturing the cooling device 100 according to the first embodiment. Fig. 9 is an explanatory diagram showing a first manufacturing step of the method for manufacturing the cooling device 100 according to the first embodiment. Fig. 10 is an explanatory diagram showing a second manufacturing step of the method for manufacturing the cooling device 100 according to the first embodiment.

[0029] As shown in FIG. 8, the method for manufacturing the cooling device 100 includes a first manufacturing step S1 and a second manufacturing step S2.

[0030] 9, a first manufacturing step S1, which is a first manufacturing process, forms a first heat dissipating fin row 21 of the heat dissipating fin rows such that a first heat dissipating fin height 2111, which is the height from the heat dissipating surface 11, is different from a second heat dissipating fin height 2211, which is the height from the heat dissipating surface 11, of the second heat dissipating fin row 22. The first manufacturing step S1 is performed before the second manufacturing step S2. As a result, the first heat dissipating fin row 21 is formed before the second heat dissipating fin row 22.

[0031] In the first manufacturing step S1, the dimension of the first heat dissipation fin height 2111 of the first heat dissipation fin row 21 to be formed is set to a height such that, when a tool 5 having an upper width wider than a lower width and a downwardly tapered shape contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22, the upper part of the tool 5, which has a horizontal width greater than the lower part, does not come into contact with the first heat dissipation fin row 21.

[0032] 10, the second manufacturing step S2, which is the second manufacturing process, forms a second heat dissipating fin row 22, which is a heat dissipating fin row that is alternately arranged adjacent to the first heat dissipating fin row. In the second manufacturing step S2, the vibration amount of the high-frequency vibration applied to the heat dissipating surface 11 of the tool 5 is increased compared to the vibration amount of the high-frequency vibration in the case of the first heat dissipating fin row 21. As a result, the second heat dissipating fin row 22 is configured to be formed with the vibration amount of the high-frequency vibration applied to the heat dissipating surface 11 of the tool 5 increased compared to the vibration amount of the high-frequency vibration in the case of the first heat dissipating fin row 21.

[0033] <Dimensional Relationship Between the First Heat Dissipating Fin Row 21 and the Second Heat Dissipating Fin Row 22 and the Tool 5> FIG. 11 is an explanatory diagram showing the dimensional relationship between the first heat dissipation fin row 21 and the second heat dissipation fin row 22 and the tool 5 according to the first embodiment.

[0034] 11, the first heat dissipation fin row 21 has a first heat dissipation fin height 2111, which is the height from the heat dissipation surface 11, which is different from the second heat dissipation fin height 2211, which is the height from the heat dissipation surface 11 of the second heat dissipation fin row 22. The first heat dissipation fin height 2111 is a height at which the upper part of the tool 5, which has a horizontal width greater than the lower part, does not come into contact with the first heat dissipation fin row 21 when the tool 5, which has an upper width wider than the lower width and a tapered shape in the downward direction, contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22. In other words, the first heat dissipation fin height 2111 is a height at which the horizontal width of the tool 5, which has a tip portion in contact with the heat dissipation surface 11 of the heat dissipation member 1, can form the second heat dissipation fin row 22 between the adjacent first heat dissipation fin rows 21 that sandwich the second heat dissipation fin row 22, without contacting any of the first heat dissipation fin rows 21.

[0035] The tool 5 is formed so that the lower part is narrower than the upper part having a horizontal width. Therefore, the interval between the adjacent first heat dissipation fin row 21 and the second heat dissipation fin row 22 is narrowed. The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are densely arranged on the heat dissipation surface 11 of the cooling member 1.

[0036] <Other> The following describes a modification of the first embodiment. In the following, the description of the same matters as in the first embodiment is omitted by assigning the same reference numerals to the same configurations, and the characteristic parts are described.

[0037] <Variation 1> Fig. 12 is a perspective view showing the cooling device 100 with the cooling cover 3 according to the first modification of the first embodiment removed. Fig. 13 is a front view showing the cooling device 100 with the cooling cover 3 according to the first modification of the first embodiment removed, as viewed from the X direction in Fig. 12. Fig. 14 is a side view showing the cooling device 100 with the cooling cover 3 according to the first modification of the first embodiment removed, as viewed from the Y direction in Fig. 12.

[0038] 12 to 14, the first heat dissipating fin row 21 and the second heat dissipating fin row 22 are arranged in a staggered manner. The convex portions of the second heat dissipating fin row 22 are formed to overlap the upper portions of the first fin connection portions 211 which are concave portions of the first heat dissipating fin row 21. The first heat dissipating fin row 21 extends in an uneven manner in the Y direction, and a plurality of rows are arranged in the X direction. The second heat dissipating fin row 22 extends in an uneven manner in the X direction, and a plurality of rows are arranged in the Y direction.

[0039] The refrigerant flows in from the inlet portion 33 in the Y direction and flows out from the outlet portion 34 on the opposite side. The second heat dissipation fin row 22, which is taller than the first fin row 21, is arranged to expand the opposing area in the Y direction, thereby increasing the effective contact area of ​​the entire fin row with the refrigerant and improving the heat transfer coefficient of the heat dissipation fins 2. This improves the cooling performance of the cooling device 100.

[0040] Here, as shown in Figures 13 and 14, the first heat dissipation fin height 2111 is a height at which the upper part of the tool 5, which has a horizontal width greater than the lower part and is tapered downward, does not come into contact with the first heat dissipation fin row 21 when the tool 5, which has an upper width greater than the lower width and is tapered downward, contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22.

[0041] In detail, when the tool 5, whose upper width is wider than the lower width and whose shape is tapered downward, contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22, it contacts the heat dissipation surface 11 up to the end of the second heat dissipation fin connection part 221 closest to the first fin row 21, as shown in Fig. 14. In this case, the first heat dissipation fin height 2111 is a height that allows the horizontal width of the tool 5, whose tip part is in contact with the heat dissipation surface 11 of the heat dissipation member 1, to form the second heat dissipation fin row 22 between adjacent first heat dissipation fin rows 21 that sandwich the second heat dissipation fin row 22 without contacting any of the first heat dissipation fin rows 21.

[0042] With the above-mentioned configuration, the cooling device 100 does not interfere with the first heat dissipation fin row 21 and the second heat dissipation fin row 22 and the tool 5, and the mounting density of the first heat dissipation fin row 21 and the second heat dissipation fin row 22 can be increased, and the heat transfer rate of the heat dissipation fins 2 can be improved. As a result, the cooling performance of the cooling device 100 can be improved.

[0043] <Variation 2> Fig. 15 is a vertical cross-sectional view of the cooling device 100 according to the second modification of the first embodiment, as viewed from the Y direction in Fig. 1. As shown in Fig. 15, a convex portion 35 is provided on the inside of the heat dissipation cover 3, which protrudes downward in a convex shape in accordance with the first heat dissipation fin height 2111 based on the second heat dissipation fin height 2211. This ensures that the flow speed of the refrigerant (not shown) is uniform within the refrigerant flow path in the cooling device 100. As a result, the heat transfer coefficient of the heat dissipation fins 2 is improved, and the cooling performance of the cooling device 100 is improved.

[0044] <Variation 3> Fig. 16 is an explanatory diagram showing a first manufacturing step of the manufacturing method for the cooling device 100 according to the third modification of the first embodiment. Fig. 17 is an explanatory diagram showing a second manufacturing step of the manufacturing method for the cooling device 100 according to the third modification of the first embodiment. Fig. 18 is an explanatory diagram showing the dimensional relationship between the first and second heat dissipation fin rows 21 and 22 and the tool 5 according to the third modification of the first embodiment.

[0045] As shown in Figs. 16 to 18, in the vertical direction of the tool 5, the width H2 is sharper and narrower than the width H1 of the first embodiment. Therefore, the first heat dissipation fin row 21 and the second heat dissipation fin row 22 are arranged more densely by narrowing the interval K1 to the interval K2 as the upper part having the horizontal width is narrower than the lower part of the tool 5. Therefore, when forming the second heat dissipation fin row 22, the first heat dissipation fin row 21 and the tool 5 do not interfere with each other, and the interval between the first heat dissipation fin row 21 and the second heat dissipation fin row 22 becomes smaller. This increases the mounting density of the heat dissipation fins 2 and improves the heat transfer coefficient of the heat dissipation fins 2. As a result, the cooling performance of the cooling device 100 can be improved.

[0046] <Effects> (A) The cooling device 100 has heat dissipation fins 2, which are linear heat dissipation parts, arranged on a heat dissipation surface 11, and includes a plurality of heat dissipation fin rows, which are rows of the heat dissipation fins 2. A first heat dissipation fin row 21 among the heat dissipation fin rows and a second heat dissipation fin row 22, which is a heat dissipation fin row adjacent to the first heat dissipation fin row 21, are arranged alternately. A first heat dissipation fin height 2111, which is the height of the first heat dissipation fin row 21 from the heat dissipation surface 11, is different from a second heat dissipation fin height 2211, which is the height of the second heat dissipation fin row 22 from the heat dissipation surface 11. The first heat dissipation fin height 2111 is a height at which an upper portion of the tool 5, which has a horizontal width greater than a lower portion, does not come into contact with the first heat dissipation fin row 21 when a tool 5, which has an upper width wider than a lower width and is tapered downward, comes into contact with the heat dissipation surface 11 to form the second heat dissipation fin row 22.

[0047] In this configuration, the dimension of the first heat dissipation fin height 2111 is set to a height such that, in a state where the tool 5, which has an upper width wider than a lower width and a tapered shape in the downward direction, contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22, the upper part of the tool 5, which has a horizontal width wider than the lower part, does not contact the first heat dissipation fin row 21. As a result, when the second heat dissipation fin row 22 is formed, the tool 5 does not contact the first heat dissipation fin row 21. Therefore, the interval between the adjacent first heat dissipation fin row 21 and second heat dissipation fin row 22 can be made small. Therefore, the mounting density of the multiple heat dissipation fin rows on the heat dissipation surface 11 is sufficiently increased.

[0048] (B) The first heat dissipating fin row 21 and the second heat dissipating fin row 22 are arranged more densely with the adjacent fins spaced closer together as the upper portion of the tool 5 having a horizontal width is narrower than the lower portion.

[0049] In this configuration, the thinner the upper portion of the tool 5 having a horizontal width is compared to the lower portion, the less the tool 5 comes into contact with the first heat dissipation fin row 21 when forming the second heat dissipation fin row 22. Therefore, the interval between the adjacent first heat dissipation fin row 21 and second heat dissipation fin row 22 can be made smaller. This sufficiently increases the mounting density of the multiple heat dissipation fin rows on the heat dissipation surface 11.

[0050] (C) The first heat dissipating fin row 21 is formed before the second heat dissipating fin row 22.

[0051] In this configuration, when the second heat dissipation fin row 22 is formed after the first heat dissipation fin row 21 is formed, the tool 5 does not come into contact with the first heat dissipation fin row 21. Therefore, the distance between the adjacent first heat dissipation fin row 21 and second heat dissipation fin row 22 can be made small. Therefore, the mounting density of the multiple heat dissipation fin rows on the heat dissipation surface 11 is sufficiently increased.

[0052] (D) The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are configured to be continuously formed by bending a metal wire 23 into an uneven shape.

[0053] In this configuration, the first heat dissipating fin row 21 and the second heat dissipating fin row 22 can be easily formed, and the productivity can be improved.

[0054] (E) The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are configured to be pressure-bonded to the heat dissipation surface 11 .

[0055] In this configuration, since it is not necessary to bend the fin array 2 and then solder it to the heat dissipation surface 11 as in the conventional case, the soldering process is no longer an essential process, and productivity can be improved.

[0056] (F) The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are formed by contacting a tool 5 with the heat dissipation surface 11 using high-frequency vibration, and crimping a linear wire 23 forming the heat dissipation fin 2 sent out from the tool 5 onto the heat dissipation surface 11.

[0057] In this configuration, it is not necessary to bend the fin row 2 and then solder it to the heat dissipation surface 11 as in the conventional method. When the heat dissipation fin row is formed by the linear wire 23 fed out by the tool 5, the linear wire 23 is crimped to the heat dissipation surface 11 to form the first heat dissipation fin row 21 and the second heat dissipation fin row 22 on the heat dissipation surface 11. Therefore, the soldering process is no longer an essential process, and productivity can be improved.

[0058] (G) The second heat dissipating fin row 22 is configured so that the vibration intensity of the high frequency vibration applied to the heat dissipating surface 11 of the tool 5 is increased compared to the vibration intensity of the high frequency vibration in the case of the first heat dissipating fin row 21 .

[0059] In this configuration, the second heat dissipation fin row 22 is more firmly attached to the heat dissipation surface 11 than the first heat dissipation fin row 21 is attached to the heat dissipation surface 11. This makes it possible to prevent the second heat dissipation fin row 22, which has a height greater than the first heat dissipation fin height 2111 and which places a load on the refrigerant, from collapsing.

[0060] (H) The first heat dissipation fin row 21 has a first heat dissipation fin connection portion 211 which is a joint with the heat dissipation surface 11. The second heat dissipation fin row 22 has a second heat dissipation fin connection portion 221 which is a joint with the heat dissipation surface 11. The contact area of ​​the second heat dissipation fin connection portion 221 is larger than that of the first heat dissipation fin connection portion 211.

[0061] In this configuration, the second heat dissipation fin row 22 is more firmly attached to the heat dissipation surface 11 than the first heat dissipation fin row 21 is attached to the heat dissipation surface 11. This makes it possible to prevent the second heat dissipation fin row 22, which has a height greater than the first heat dissipation fin height 2111 and which places a load on the refrigerant, from collapsing.

[0062] (I) The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are arranged in a staggered manner.

[0063] In this configuration, the effective contact area of ​​the heat dissipating fin row with the refrigerant is increased, improving the heat transfer coefficient of the heat dissipating fins 2. This improves the cooling performance of the cooling device 100.

[0064] (J) The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are arranged so that the area facing the flow of the refrigerant circulating inside the cooling device 100 is larger than the area facing the flow of the refrigerant that intersects with the flow of the refrigerant.

[0065] In this configuration, the effective contact area of ​​the heat dissipating fin row with the refrigerant is increased, improving the heat transfer coefficient of the heat dissipating fins 2. This improves the cooling performance of the cooling device 100.

[0066] (K) The cooling device 100 has a heat dissipation cover 3 that covers the heat dissipation surface 11 from above. The heat dissipation cover 3 is in contact with the second heat dissipation fin row 22.

[0067] In this configuration, the coefficient of heat transfer from the second heat dissipation fin row 22 to the heat dissipation cover 3 via the contact portion between the second heat dissipation fin row 22 and the heat dissipation cover 3 is improved. This improves the cooling performance of the cooling device 100. In addition, when the heat dissipation fins 2 of the uneven second heat dissipation fin row 22 have a tolerance in the height direction, the tolerance in the height direction can be absorbed by the convex loop of the heat dissipation fin 2 contacting the heat dissipation cover 3 and bending, and all the second heat dissipation fin rows 22 can contact the heat dissipation cover 3, thereby improving the coefficient of heat transfer from the second heat dissipation fin row 22 to the heat dissipation cover 3 via the contact portion between the second heat dissipation fin row 22 and the heat dissipation cover 3.

[0068] (L) On the inside of the heat dissipation cover 3, a convex portion 35 is provided that protrudes downward in a convex shape in accordance with the first heat dissipation fin height 2111 based on the second heat dissipation fin height 2211.

[0069] In this configuration, the clearance between the first heat dissipation fin row 21 and the heat dissipation cover 3 and the clearance between the second heat dissipation fin row 22 and the heat dissipation cover 3 can be matched, and the flow speed of the refrigerant flowing through the cooling device 100 becomes uniform. As a result, the amount of heat carried away by the refrigerant from the first heat dissipation fin row 21 and the second heat dissipation fin row 22 can be uniformed, and the cooling performance of the cooling device 100 can be improved.

[0070] (M) The cooling device 100 has heat dissipation fins 2, which are linear heat dissipation parts, arranged on a heat dissipation surface 11, and includes a plurality of heat dissipation fin rows, which are rows of the heat dissipation fins 2. Among the heat dissipation fin rows, a first heat dissipation fin row 21 and a second heat dissipation fin row 22, which is adjacent to the first heat dissipation fin row 21, are arranged alternately. A first heat dissipation fin height 2111, which is the height of the first heat dissipation fin row 21 from the heat dissipation surface 11, is different from a second heat dissipation fin height 2211, which is the height of the second heat dissipation fin row 22 from the heat dissipation surface 11. The first heat dissipation fin row 21 and the second heat dissipation fin row 22 are formed by being pressure-bonded to the heat dissipation surface 11 using high-frequency vibration.

[0071] In this configuration, the first heat dissipating fin row 21 and the second heat dissipating fin row 22 are formed by pressure bonding to the heat dissipating surface 11 using high-frequency vibration. As a result, a soldering process is not required when forming the first heat dissipating fin row 21 and the second heat dissipating fin row 22. As a result, when forming the second heat dissipating fin row 22, it is not necessary to insert a soldering jig into the gap between the adjacent first heat dissipating fin rows 21 formed on the heat dissipating surface 11. Therefore, the gap between the adjacent first heat dissipating fin rows 21 and the second heat dissipating fin rows 22 can be made small. Therefore, the mounting density of the multiple heat dissipating fin rows on the heat dissipating surface 11 is sufficiently increased.

[0072] (N) A manufacturing method of the cooling device 100 includes arranging heat dissipation fins 2 which are linear heat dissipation portions on the heat dissipation surface 11, and forming a plurality of rows of heat dissipation fin rows which are rows of the heat dissipation fins 2. The manufacturing method of the cooling device 100 includes a first manufacturing step of forming a first heat dissipation fin row 21 of the heat dissipation fin rows such that a first heat dissipation fin height 2111 which is the height from the heat dissipation surface 11 is different from a second heat dissipation fin height 2211 which is the height from the heat dissipation surface 11 of a second heat dissipation fin row 22. The manufacturing method of the cooling device 100 includes a second manufacturing step of forming a second heat dissipation fin row 22 which is a heat dissipation fin row adjacent to the first heat dissipation fin row 21 and which is arranged alternately. In the first manufacturing step, the dimension of the first heat dissipation fin height 2111 of the first heat dissipation fin row 21 to be formed is set to a height such that, when a tool 5 having an upper width wider than a lower width and a downwardly tapered shape contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22, the upper part of the tool 5, which has a horizontal width greater than the lower part, does not contact the first heat dissipation fin row 21.

[0073] In this configuration, the dimension of the first heat dissipation fin height 2111 is set to a height such that, in a state where the tool 5, which has an upper width wider than a lower width and a tapered shape in the downward direction, contacts the heat dissipation surface 11 to form the second heat dissipation fin row 22, the upper part of the tool 5, which has a horizontal width wider than the lower part, does not contact the first heat dissipation fin row 21. As a result, when forming the second heat dissipation fin row 22, the tool 5 does not contact the first heat dissipation fin row 21 on the heat dissipation surface 11. Therefore, the interval between the adjacent first heat dissipation fin row 21 and second heat dissipation fin row 22 can be made small. Therefore, the mounting density of the multiple heat dissipation fin rows on the heat dissipation surface 11 is sufficiently increased.

[0074] (O) The first manufacturing step is performed before the second manufacturing step.

[0075] In this configuration, when the second heat dissipation fin row 22 is formed after the first heat dissipation fin row 21 is formed, the tool 5 does not come into contact with the first heat dissipation fin row 21. Therefore, the distance between the adjacent first heat dissipation fin row 21 and second heat dissipation fin row 22 can be made small. Therefore, the mounting density of the multiple heat dissipation fin rows on the heat dissipation surface 11 is sufficiently increased.

[0076] Although the embodiments of the present invention have been described above, the above-mentioned embodiments merely show some of the application examples of the present invention, and it is not intended that the technical scope of the present invention be limited to the specific configurations of the above-mentioned embodiments. [Explanation of symbols]

[0077] 100...cooling device, 1...heat dissipation member, 11...heat dissipation surface, 2...heat dissipation fin, 21...first heat dissipation fin row, 211...first heat dissipation fin connection portion, 2111...first heat dissipation fin height, 22...second heat dissipation fin row, 221...second heat dissipation fin connection portion, 2211...second heat dissipation fin height, 23...wire, 3...heat dissipation cover, 31...top surface portion, 32...side surface portion, 321...recess, 33...inlet portion, 34...outlet portion, 35...convex portion, 4...sealing member, 5...tool, 51...wire feed-out portion, 52...high-frequency vibration pressing portion, 53...cutting portion.

Claims

1. A cooling device including a heat dissipation fin that is a linear heat dissipation portion arranged on a heat dissipation surface and a plurality of heat dissipation fin rows that are rows of the heat dissipation fins, a first heat dissipating fin row and a second heat dissipating fin row adjacent to the first heat dissipating fin row are alternately arranged among the heat dissipating fin rows; a first heat dissipation fin height, which is a height of the first heat dissipation fin row from the heat dissipation surface, is different from a second heat dissipation fin height, which is a height of the second heat dissipation fin row from the heat dissipation surface; the first heat dissipation fin height is a height at which an upper portion of the tool having a horizontal width greater than a lower portion does not come into contact with the first heat dissipation fin row when a tool having a tapered shape in a downward direction is in contact with the heat dissipation surface to form the second heat dissipation fin row; Cooling device.

2. 2. The cooling device according to claim 1, the first heat dissipation fin row and the second heat dissipation fin row are arranged more densely with a narrower interval between adjacent fins as an upper portion of the tool having a horizontal width is narrower than a lower portion of the tool; Cooling device.

3. 2. The cooling device according to claim 1, The first heat dissipation fin row is formed before the second heat dissipation fin row. Cooling device.

4. 2. The cooling device according to claim 1, The first heat dissipation fin row and the second heat dissipation fin row are configured to be continuously formed by bending a metal wire into an uneven shape. Cooling device.

5. 2. The cooling device according to claim 1, The first heat dissipation fin row and the second heat dissipation fin row are formed by being pressure-bonded to the heat dissipation surface. Cooling device.

6. 6. The cooling device according to claim 5, the first heat dissipation fin row and the second heat dissipation fin row are formed by contacting the tool with the heat dissipation surface by vibrating the tool at a high frequency and crimping a linear wire forming the heat dissipation fins fed from the tool onto the heat dissipation surface. Cooling device.

7. 7. The cooling device according to claim 6, the second heat dissipation fin row is configured to increase the vibration amount of high frequency vibration applied to the heat dissipation surface of the tool compared to the vibration amount of the high frequency vibration applied to the first heat dissipation fin row. Cooling device.

8. 2. The cooling device according to claim 1, the first heat dissipation fin row has a first heat dissipation fin connection portion which is a joint portion with the heat dissipation surface, the second heat dissipation fin row has a second heat dissipation fin connection portion which is a joint portion with the heat dissipation surface, a contact area of ​​the second heat dissipation fin connection portion is larger than that of the first heat dissipation fin connection portion; Cooling device.

9. 2. The cooling device according to claim 1, The first heat dissipation fin row and the second heat dissipation fin row are arranged in a staggered manner. Cooling device.

10. 2. The cooling device according to claim 1, the first heat dissipation fin row and the second heat dissipation fin row are arranged such that an opposing area with respect to a flow of a refrigerant circulating within the cooling device is larger than an opposing area with respect to the flow of the refrigerant. Cooling device.

11. 2. The cooling device according to claim 1, a heat dissipation cover that covers the heat dissipation surface from above, the heat dissipation cover is in contact with the second heat dissipation fin row; Cooling device.

12. 12. The cooling device of claim 11, A convex portion is provided on the inside of the heat dissipation cover, the convex portion protruding downward in accordance with the first heat dissipation fin height based on the second heat dissipation fin height. Cooling device.

13. A cooling device having a heat dissipation surface on which heat dissipation fins are arranged, the heat dissipation fins being linear heat dissipation portions, and including a plurality of heat dissipation fin rows, a first heat dissipating fin row and a second heat dissipating fin row adjacent to the first heat dissipating fin row are alternately arranged among the heat dissipating fin rows; a first heat dissipation fin height, which is a height of the first heat dissipation fin row from the heat dissipation surface, is different from a second heat dissipation fin height, which is a height of the second heat dissipation fin row from the heat dissipation surface; The first heat dissipation fin row and the second heat dissipation fin row are formed by being pressed against the heat dissipation surface using high-frequency vibration. Cooling device.

14. A method of manufacturing a cooling device in which heat dissipation fins, which are linear heat dissipation portions, are arranged on a heat dissipation surface, and a plurality of heat dissipation fin rows, which are rows of the heat dissipation fins, is formed, a first manufacturing step of forming a first heat dissipating fin row of the heat dissipating fin rows such that a first heat dissipating fin height, which is a height from the heat dissipating surface, is different from a second heat dissipating fin height, which is a height from the heat dissipating surface, of a second heat dissipating fin row; a second manufacturing step of forming the second heat dissipating fin row, the second heat dissipating fin row being the heat dissipating fin row adjacent to and alternately arranged with the first heat dissipating fin row; Including, In the first manufacturing step, a dimension of the first heat dissipation fin height of the first heat dissipation fin row to be formed is set to a height such that an upper portion of the tool having a horizontal width greater than a lower portion does not contact the first heat dissipation fin row when a tool having a tapered shape in a downward direction is in contact with the heat dissipation surface to form the second heat dissipation fin row. A method for manufacturing a cooling device.

15. A method for manufacturing a cooling device according to claim 14, comprising the steps of: The first manufacturing step is performed prior to the second manufacturing step. A method for manufacturing a cooling device.

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