Information processing device and cooling method

Abstract

To efficiently cool a heating component mounted on an information processing device.SOLUTION: A blocking unit performs first operation of blocking air flowing from a first heat generation component toward a second heat generation component or second operation of passing air flowing from the first heat generation component toward the second heat generation component. When temperature of air flowing from the first heat generation component toward the second heat generation component is higher than a predetermined value, a control unit instructs the first operation to the blocking unit. When temperature of air flowing from the first heat generation component toward the second heat generation component is lower than the predetermined value, the control unit instructs the second operation to the blocking unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to cooling technology. [Background technology]

[0002] An information processing device (computer) such as a server includes electronic components such as a CPU (Central Processing Unit) and memory, and auxiliary storage devices such as an HDD (Hard Disk Drive) and an SSD (Solid State Drive). These electronic components and auxiliary storage devices are the main heat sources in the information processing device.

[0003] In order to suppress the effect of heat generation on the performance and lifespan of components, a fan installed inside the case of the information processing device takes in outside air to cool the components. In addition, in a server that has an LSI (Large-Scale Integration) that monitors and manages the server status, the LSI monitors the temperature of each component inside the case and controls the air volume by increasing or decreasing the number of rotations of the fan, thereby controlling the temperature of the components.

[0004] In relation to cooling of components in information processing devices, a server device is known that can efficiently cool an object to be cooled even if the object mounted on the device has a different configuration (see, for example, Patent Document 1). A dynamic air impedance mechanism for blowing air through a server is also known (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2016-157237 A [Patent Document 2] JP 2020-107312 A Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, PCI Express, a type of I / O (Input / Output) interface for PCI (Peripheral Component Interconnect) cards, has been revised from Gen1 to Gen5. With the revision of PCI Express, the performance of PCI cards has improved, but the power consumption of the PCI cards themselves has also increased. As an example, the power consumption of PCI cards has increased from a few watts to over 70W.

[0007] In this way, the heat generated by the PCI card, which was previously of little concern, is now a factor in raising the temperature inside information processing devices. However, current information processing devices are designed to effectively cool the CPU, memory, and auxiliary storage devices, which are the main heat sources, and little consideration is given to cooling the PCI card.

[0008] For example, if the rotation of the fan causes air to flow from the front to the rear of the case and the slot in which the PCI card is installed is located behind the main heat source, the PCI card will be subjected to hot air and will not be cooled effectively.

[0009] This problem is not limited to cooling of PCI cards, but occurs when cooling various heat-generating components mounted on information processing devices.

[0010] In one aspect, the present invention aims to efficiently cool heat-generating components mounted on an information processing device. [Means for solving the problem]

[0011] In one example, the information processing device includes a first heat generating component, a second heat generating component, a blocking unit, and a control unit. The blocking unit performs a first operation of blocking air flowing from the first heat generating component toward the second heat generating component, or a second operation of allowing air flowing from the first heat generating component toward the second heat generating component to pass through.

[0012] The control unit instructs the cut-off unit to perform a first operation when the temperature of the air flowing from the first heat-generating component to the second heat-generating component is higher than a predetermined value, and instructs the cut-off unit to perform a second operation when the temperature of the air flowing from the first heat-generating component to the second heat-generating component is lower than a predetermined value. Effect of the Invention

[0013] According to one aspect, heat-generating components mounted on an information processing device can be efficiently cooled. [Brief description of the drawings]

[0014] [Figure 1] FIG. 2 is a functional configuration diagram of the information processing apparatus according to the embodiment. [Diagram 2] FIG. 2 is a hardware configuration diagram of a specific example of an information processing device. [Diagram 3] 3A and 3B are a top view and a cross-sectional view of an information processing unit. [Figure 4] 3A to 3C are a top view, a front view, a rear view, and a cross-sectional view of a cooling section. [Diagram 5] FIG. 2 illustrates a power supply and a temperature sensor in a PCI card. [Figure 6] FIG. 2 is a functional configuration diagram of a control unit. [Figure 7] 4 is a flowchart of a cooling process. [Figure 8] 13 is a flowchart of air blowing control with enhanced cooling. [Figure 9] 4 is a flowchart of rotation speed control. [Figure 10] 13 is a flowchart of air blowing control without enhanced cooling. [Figure 11] FIG. 2 is a hardware configuration diagram of a control unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, the embodiments will be described in detail with reference to the drawings.

[0016] In information processing devices, if a fan that blows air from the front to the rear of the case is rotated at its maximum speed to cool the PCI card installed behind the main heat sources such as the CPU, memory, and auxiliary storage device, the fan will make a lot of noise. Also, when the fan is rotated at its maximum speed, the power consumption of the fan increases, reducing the cooling efficiency.

[0017] However, it is difficult to cool a PCI card that generates a lot of heat by only controlling the airflow by increasing or decreasing the fan speed. Therefore, a dedicated cooling mechanism that is optimized for the PCI card that generates a lot of heat and the information processing device in which the PCI card is installed is sometimes adopted.

[0018] In a dedicated cooling mechanism, for example, the position of the slot in which a PCI card that generates a large amount of heat is mounted is fixed, and a dedicated air guide plate is installed so that the air is concentrated at that position. In this case, the configuration of the information processing device is limited, and it becomes difficult to add a PCI card with new specifications to an existing information processing device. For this reason, it may not always be possible to meet customer demands in the development and sale of information processing devices.

[0019] Furthermore, when a dedicated cooling mechanism is adopted, development, manufacturing, and material management of dedicated parts are required for each information processing device, which leads to increased costs and man-hours. Therefore, a dedicated cooling mechanism cannot be said to be an efficient solution.

[0020] Therefore, measures to limit the operating temperature of the information processing device can be considered. However, the operating temperature limit is not always observed. If the operating temperature limit is not observed, the performance of the PCI card will decrease, and in the worst case, the information processing device may be shut down due to the shutdown of the PCI card itself.

[0021] Fig. 1 shows an example of a functional configuration of an information processing device according to an embodiment. The information processing device 101 in Fig. 1 includes a first heat generating component 111, a second heat generating component 112, a blocking unit 113, and a control unit 114. The blocking unit 113 performs a first operation of blocking air flowing from the first heat generating component 111 toward the second heat generating component 112, or a second operation of allowing air flowing from the first heat generating component 111 toward the second heat generating component 112 to pass through.

[0022] When the temperature of the air flowing from first heat generating component 111 to second heat generating component 112 is higher than a predetermined value, control unit 114 instructs cut-off unit 113 to perform a first operation. On the other hand, when the temperature of the air flowing from first heat generating component 111 to second heat generating component 112 is lower than the predetermined value, control unit 114 instructs cut-off unit 113 to perform a second operation.

[0023] According to the information processing device 101 in FIG. 1, heat-generating parts mounted on the information processing device 101 can be efficiently cooled.

[0024] Fig. 2 shows an example of a hardware configuration of a specific example of the information processing device 101 in Fig. 1. The information processing device 201 in Fig. 2 is, for example, a server, and includes an information processing unit 211 and a control unit 212. The information processing unit 211 and the control unit 212 are hardware. The control unit 212 may be, for example, a control LSI. The control unit 212 corresponds to the control unit 114 in Fig. 1.

[0025] Fig. 3 is a top view and a cross-sectional view showing an example of the information processing unit 211 in Fig. 2. The cross-sectional view shows a cross section taken along the cutting line AA in the top view.

[0026] 3 includes a cooling unit 311, power supplies 312-1 and 312-2, a free slot 313, and PCI cards 314-1 to 314-3. The information processing unit 211 further includes memories 315-1 to 315-4, CPUs 316-1 and 316-2, fans 317-1 to 317-6, and an auxiliary storage device 318. These components are hardware and are housed within the housing 301. The auxiliary storage device 318 is, for example, an HDD or SSD.

[0027] Memories 315-1 to 315-4, CPUs 316-1 and 316-2, and auxiliary storage device 318 are main heat sources and correspond to first heat generating component 111 in Fig. 1. Power supplies 312-1 and 312-2, and PCI cards 314-1 to 314-3 correspond to second heat generating component 112 in Fig. 1, and cooling unit 311 corresponds to cutoff unit 113 in Fig. 1.

[0028] The PCI cards 314-1 and 314-3 are PCI cards with high power consumption, and the PCI card 314-2 is a PCI card with low power consumption. Therefore, the amount of heat generated by the PCI cards 314-1 and 314-3 is greater than the amount of heat generated by the PCI card 314-2. The PCI cards 314-1 to 314-3 are examples of expansion cards, and are installed in slots for expansion cards.

[0029] The right side of housing 301 corresponds to the front side of housing 301, and the left side of housing 301 corresponds to the rear side of housing 301. Fans 317-1 to 317-6 rotate to generate airflow from the front side to the rear side of housing 301. The air flowing from the front side to the rear side of housing 301 corresponds to air flowing from first heat generating component 111 to second heat generating component 112.

[0030] Cooling section 311 includes fans 321-1 to 321-6, louvers 322-1 to 322-6, temperature sensors 323-1 to 323-6, an upper duct 324, and a lower duct 325.

[0031] Duct 324 guides air flowing from the front to the rear of housing 301 toward the outside of housing 301. Duct 325 guides air flowing from the front to the rear of housing 301 toward power supplies 312-1, 312-2, and PCI cards 314-1 to 314-3. Duct 324 is an example of a second duct, and duct 325 is an example of a first duct.

[0032] Fig. 4 shows a top view, a front view, a rear view, and a cross-sectional view of the cooling unit 311 in Fig. 3. The cross-sectional view shows a cross section taken along the cutting line BB in the top view.

[0033] Air intakes 411-1 to 411-6 are provided on the front surface of duct 324. Air flowing into duct 324 from air intakes 411-1 to 411-6 is exhausted to the outside of housing 301 from an exhaust port provided on the rear surface of duct 324.

[0034] Air intake ports 412-1 to 412-6 are provided on the front surface of duct 325, and exhaust ports are provided at positions opposite each of air intake ports 412-i (i=1 to 6) on the rear surface of duct 325. Air flowing into duct 325 from each air intake port 412-i is exhausted from the exhaust port opposite air intake port 412-i.

[0035] By providing ducts 324 and 325, air flowing in from the front of intake port 411-i and intake port 412-i can be selectively discharged to the outside of housing 301 or to the rear of an exhaust port opposite intake port 412-i.

[0036] Each fan 321-i (i=1 to 6) is provided behind an exhaust port opposite to the intake port 412-i. Each fan 321-i discharges the air flowing from the intake port 412-i into the duct 325 from the exhaust port opposite to the intake port 412-i toward a heat-generating component mounted at a position opposite to the fan 321-i.

[0037] For example, the fan 321-1 discharges the air flowing into the duct 325 from the intake port 412-1 through an exhaust port opposite the intake port 412-1 toward the power supply 312-1 located behind the fan 321-1.

[0038] The fan 321-2 discharges the air flowing into the duct 325 from the intake port 412-2, from an exhaust port opposite the intake port 412-2, toward the power supply 312-2 located behind the fan 321-2.

[0039] The fan 321-4 discharges the air flowing into the duct 325 from the intake port 412-4, from an exhaust port opposite the intake port 412-4, toward the PCI card 314-1 located behind the fan 321-4.

[0040] The fan 321-5 discharges the air flowing into the duct 325 from the intake port 412-5, from an exhaust port opposite the intake port 412-5, toward the PCI card 314-2 located behind the fan 321-5.

[0041] The fan 321-6 discharges the air flowing into the duct 325 from the intake port 412-6, from an exhaust port opposite the intake port 412-6, toward the PCI card 314-3 located behind the fan 321-6.

[0042] By providing the fan 321-i, the air flowing into the duct 325 from the air intake 412-i can be forcibly discharged toward the heat-generating components located behind the fan 321-i, facilitating the cooling of the heat-generating components.

[0043] Each louver 322-i (i=1 to 6) shields either the air intake 411-i or the air intake 412-i. Each louver 322-i shields the air intake 411-i by tilting upward, and shields the air intake 412-i by tilting downward. The louvers 322-i are an example of a shielding member.

[0044] By blocking intake port 411-i and opening intake port 412-i, air flowing from the front to the rear of housing 301 passes through duct 325 and is exhausted from the exhaust port opposite intake port 412-i.

[0045] On the other hand, by opening air intake 411-i and closing air intake 412-i, air flowing from the front surface to the rear surface of housing 301 passes through duct 324 and is exhausted to the outside of housing 301.

[0046] Each temperature sensor 323-i (i=1 to 6) is attached to the tip of louver 322-i, and acquires the temperature of the air in front of cooling unit 311. Hereinafter, the temperature of the air in front of cooling unit 311 may be referred to as the intake side temperature. Temperature sensor 323-i is an example of a first temperature sensor.

[0047] For example, the temperature sensor 323-1 acquires the temperature of the air flowing from the memory 315-1, and the temperature sensor 323-2 acquires the temperature of the air flowing from the CPU 316-1.

[0048] Temperature sensor 323-3 acquires the temperature of the air flowing in from memory 315-2, and temperature sensor 323-4 acquires the temperature of the air flowing in from memory 315-3. Temperature sensor 323-5 acquires the temperature of the air flowing in from CPU 316-2, and temperature sensor 323-6 acquires the temperature of the air flowing in from memory 315-4.

[0049] Fig. 5 shows examples of temperature sensors in the power supplies 312-i (i=1, 2) and PCI cards 314-i (i=1 to 3) in Fig. 3. Fig. 5(a) shows an example of a temperature sensor in the power supply 312-i. The power supply 312-i includes a temperature sensor 511 that acquires the temperature of the power supply 312-i.

[0050] 5(b) shows an example of a temperature sensor in the PCI card 314-i. The PCI card 314-i includes a temperature sensor 512 that acquires the temperature of the PCI card 314-i. The temperature sensor 511 and the temperature sensor 512 are examples of a second temperature sensor.

[0051] Fig. 6 shows an example of a functional configuration of the control unit 212 in Fig. 2. The control unit 212 in Fig. 6 includes an acquisition unit 611, a cooling control unit 612, and a storage unit 613. The control unit 212 may be, for example, a control LSI.

[0052] The storage unit 613 stores temperature specification information of each heat generating component in the information processing unit 211. The temperature specification information includes a threshold value of the temperature of the heat generating component.

[0053] When the information processing device 201 is started up, the acquisition unit 611 acquires mounting information and position information of the heat generating components present behind each fan 321-i. The mounting information indicates whether or not a heat generating component is mounted at a predetermined position, and the position information indicates the position of the mounted heat generating component.

[0054] For example, the mounting information of power supply 312-1 indicates whether power supply 312-1 is mounted behind fan 321-1, and the position information indicates the position of power supply 312-1. The mounting information of power supply 312-2 indicates whether power supply 312-2 is mounted behind fan 321-2, and the position information indicates the position of power supply 312-2.

[0055] The mounting information of the PCI card 314-1 indicates whether the PCI card 314-1 is mounted in the slot behind the fan 321-4, and the position information indicates the position of the slot the PCI card 314-1 is mounted in. The mounting information of the PCI card 314-2 indicates whether the PCI card 314-2 is mounted in the slot behind the fan 321-5, and the position information indicates the position of the slot in which the PCI card 314-2 is mounted.

[0056] The mounting information of the PCI card 314-3 indicates whether or not the PCI card 314-3 is mounted in a slot behind the fan 321-6, and the position information indicates the position of the slot in which the PCI card 314-3 is mounted.

[0057] During operation of the information processing device 201, the acquiring unit 611 acquires the temperatures of the memories 315-1 to 315-4, the CPUs 316-1 and 316-2, and the auxiliary storage device 318. The acquiring unit 611 also acquires the intake side temperature from the temperature sensors 323-i, the temperature of the power supplies 312-i from the temperature sensors 511, and the temperature of the PCI cards 314-i from the temperature sensors 512.

[0058] Furthermore, the acquiring unit 611 acquires the rotation speed of the fan 317-i from the fan 317-i, and acquires the rotation speed of the fan 321-i from the fan 321-i. The acquiring unit 611 stores the acquired temperature and rotation speed in the storage unit 613. The acquiring unit 611 may periodically acquire the temperature and rotation speed.

[0059] As in the past, the cooling control unit 612 monitors the acquired temperatures of the memories 315-1 to 315-4, the CPU 316-1, the CPU 316-2, and the auxiliary storage device 318. Then, the cooling control unit 612 uses the temperature specification information of these heat-generating components to perform airflow control by increasing or decreasing the number of rotations of the fans 317-i, thereby controlling the temperatures of these heat-generating components.

[0060] The cooling control unit 612 further controls the cooling unit 311. When the intake side temperature acquired from the temperature sensor 323-i is higher than a predetermined value, the cooling control unit 612 instructs the cooling unit 311 to perform an exhaust operation. As the predetermined value, for example, the temperature of the heat-generating component behind the fan 321-i acquired from the temperature sensor 511 or the temperature sensor 512 is used.

[0061] In the exhaust operation, louvers 322-i cover intake ports 412-i, so that air flowing from intake ports 411-i into ducts 324 is exhausted to the outside of housing 301. This forcibly exhausts hot air having a higher temperature than the heat-generating components behind fans 321-i, preventing the heat-generating components from being heated. The exhaust operation corresponds to the first operation.

[0062] On the other hand, when the intake side temperature acquired from the temperature sensor 323-i is lower than the predetermined value, the cooling control unit 612 instructs the cooling unit 311 to perform a cooling operation.

[0063] In the cooling operation, the louvers 322-i cover the intake ports 411-i and the fans 321-i rotate, so that the air flowing from the intake ports 412-i into the ducts 325 is discharged toward the heat-generating components behind the fans 321-i. This allows the heat-generating components to be cooled using cool air that is at a lower temperature than the heat-generating components behind the fans 321-i. The cooling operation corresponds to the second operation.

[0064] When the temperature of the heat-generating components in front of the cooling unit 311 rises, the temperature of the air that has cooled the heat-generating components also rises, and hot air is generated in front of the cooling unit 311. Therefore, by having the cooling unit 311 perform an operation of exhausting hot air and emitting only cool air to the heat-generating components according to the intake side temperature acquired from the temperature sensor 323-i, the heat-generating components behind the fan 321-i can be efficiently cooled.

[0065] For example, even if heat-generating components that generate a lot of heat, such as the PCI cards 314-1 and 314-3, are mounted behind the main heat source, the heat-generating components can be efficiently cooled. In this case, since there is no need to rotate the fan 317-i for cooling the main heat source at the upper limit rotation speed, the noise and power consumption of the fan 317-i can be reduced.

[0066] As an example, the cooling unit 311 is a general-purpose type that can be mounted on a rack-type information processing device. However, the cooling unit 311 can be optionally mounted on other information processing devices as long as the other information processing devices include a power supply and a control interface.

[0067] This increases the degree of freedom in the configuration of information processing devices, making it easier to add PCI cards with new specifications to existing information processing devices. In addition, since there is no need to provide a dedicated cooling mechanism, there is no need to develop, manufacture, and manage dedicated parts for each information processing device, reducing costs and labor.

[0068] Furthermore, there is no need to limit the operating temperature of the information processing device, and it is possible to prevent the performance of the PCI card from deteriorating and the information processing device from being shut down.

[0069] Instead of louvers 322-i, it is also possible to use another shielding member such as a shutter or a film-like screen to shield intake port 411-i or intake port 412-i.

[0070] 7 is a flowchart showing an example of a cooling process in which the information processing apparatus 201 in FIG. 2 controls the cooling unit 311. Each fan 321-i of the cooling unit 311 rotates at either high speed or low speed. The rotation speed of the high speed rotation is higher than the rotation speed of the low speed rotation.

[0071] First, the user turns on the power of the information processing device 201 (step 701), and the acquisition unit 611 of the control unit 212 acquires mounting information and position information of each heat-generating component (step 702).

[0072] Next, the acquisition unit 611 acquires the temperature of the power supply 312-i from the temperature sensor 511, and acquires the temperature of the PCI card 314-i from the temperature sensor 512 (step 703).Then, the acquisition unit 611 acquires the intake side temperature from the temperature sensor 323-i of the cooling unit 311 (step 704), and acquires the rotation speed of the fan 321-i from the fan 321-i (step 705).

[0073] Next, the cooling control unit 612 compares the temperature of each heat-generating component with a threshold value included in the temperature specification information of that heat-generating component (step 706). Each heat-generating component is a power supply 312-i or a PCI card 314-i.

[0074] If the temperature of any heat-generating component is equal to or higher than the threshold (step 706, YES), the cooling control unit 612 performs airflow control with enhanced cooling (step 707). On the other hand, if the temperatures of all heat-generating components are lower than the threshold (step 706, NO), the cooling control unit 612 performs airflow control without enhanced cooling (step 708).

[0075] Fig. 8 is a flowchart showing an example of airflow control with enhanced cooling in step 707 in Fig. 7. First, the cooling control unit 612 compares the temperature of each heat-generating component with the intake-side temperature acquired from the temperature sensor 323-i corresponding to that heat-generating component (step 801).

[0076] The temperature sensor 323-i corresponding to the heat-generating component is attached to a louver 322-i that shields an intake port 412-i located in front of the heat-generating component. The intake port 412-i located in front of the heat-generating component is located in a position in the duct 325 opposite an exhaust port provided in front of a fan 321-i that emits cool air toward the heat-generating component.

[0077] If the intake side temperature is lower than the temperature of the heat-generating components (step 801, YES), the cooling control unit 612 instructs the cooling unit 311 to perform a cooling operation (step 802) and controls the rotation speed of the fan 321-i (step 803). As a result, the louvers 322-i block the intake ports 411-i, and the air flowing from the intake ports 412-i into the duct 325 is discharged toward the heat-generating components.

[0078] On the other hand, if the intake side temperature is equal to or higher than the temperature of the heat-generating component (step 801, NO), the cooling control unit 612 instructs the cooling unit 311 to perform an exhaust operation (step 804). As a result, the louvers 322-i block the intake ports 412-i, and the air flowing from the intake ports 411-i into the duct 324 is exhausted to the outside of the housing 301.

[0079] In step 801, if no heat-generating component is mounted in a position facing fan 321-i, cooling control unit 612 uses a predetermined specific temperature as the temperature of the heat-generating component to compare with the intake side temperature.

[0080] Fig. 9 is a flowchart showing an example of the rotation speed control in step 803 in Fig. 8. First, the cooling control unit 612 refers to the acquired mounting information and checks whether or not a heat-generating component is mounted in a position facing the fan 321-i (step 901).

[0081] If a heat-generating component is mounted in a position facing fan 321-i (step 901, YES), cooling control unit 612 compares the temperature of the heat-generating component with a threshold value included in the temperature specification information of the heat-generating component (step 902).

[0082] If the temperature of the heat-generating component is equal to or higher than the threshold (step 902, YES), the cooling control unit 612 instructs the fan 321-i to rotate at high speed (step 903), thereby quickly cooling the high-temperature heat-generating component.

[0083] On the other hand, if the temperature of the heat-generating component is below the threshold (step 902, NO), the cooling control unit 612 instructs the fan 321-i to rotate at a low speed (step 904). This allows the heat-generating component that is not generating much heat to be cooled slowly.

[0084] If no heat-generating component is mounted at a position opposite the fan 321-i (step 901, NO), the cooling control unit 612 instructs the fan 321-i to stop operating (step 905). This prevents cool air from being emitted from the exhaust port in front of the fan 321-i, and makes it easier to guide the cool air to another exhaust port for use in cooling the heat-generating components.

[0085] Fig. 10 is a flowchart showing an example of airflow control without strengthened cooling in step 708 in Fig. 7. First, cooling control unit 612 compares the temperature of each heat-generating component with the intake-side temperature acquired from temperature sensor 323-i corresponding to that heat-generating component (step 1001).

[0086] If the intake side temperature is lower than the temperature of the heat-generating components (step 1001, YES), the cooling control unit 612 instructs the cooling unit 311 to perform a cooling operation (step 1002), and instructs all fans 321-i to rotate at low speed (step 1003).

[0087] As a result, the louvers 322-i block the air intakes 411-i, and the air flowing from the air intakes 412-i into the ducts 325 is discharged toward the heat-generating components. By rotating all the fans 321-i at low speeds, the warm air is prevented from accumulating inside the housing 301, and the heat-generating components that do not generate much heat are cooled slowly.

[0088] On the other hand, if the intake side temperature is equal to or higher than the temperature of the heat-generating component (step 1001, NO), the cooling control unit 612 instructs the cooling unit 311 to perform an exhaust operation (step 1004). As a result, the louvers 322-i block the intake ports 412-i, and the air flowing from the intake ports 411-i into the duct 324 is exhausted to the outside of the housing 301.

[0089] In step 1001, if no heat-generating component is mounted in a position opposite fan 321-i, cooling control unit 612 uses a predetermined specific temperature as the temperature of the heat-generating component to compare with the intake side temperature.

[0090] For example, assume that the temperatures of the power supply 312-1, the power supply 312-2, and the PCI card 314-2 are below the threshold, and the temperatures of the PCI card 314-1 and the PCI card 314-3 are equal to or higher than the threshold.

[0091] 7, mounting information indicating that power supply 312-1, power supply 312-2, and PCI cards 314-1 to 314-3 are mounted, and position information of these heat-generating components is acquired. Furthermore, mounting information indicating that no PCI card is mounted in empty slot 313 is acquired.

[0092] Next, in step 706, it is determined that the temperatures of the PCI card 314-1 and the PCI card 314-3 are equal to or higher than the threshold, and it is determined that the temperatures of the power supply 312-1, the power supply 312-2, and the PCI card 314-2 are lower than the threshold. In this case, in step 707, airflow control with enhanced cooling is performed.

[0093] 8, it is determined that the intake side temperature acquired from temperature sensor 323-4 is lower than the temperature of PCI card 314-1, and it is determined that the intake side temperature acquired from temperature sensor 323-6 is lower than the temperature of PCI card 314-3. Then, in step 802, louvers 322-4 and 322-6 shield intake ports 411-4 and 411-6, respectively.

[0094] Next, in step 903 of FIG. 9, the fan 321-4 and the fan 321-6 are instructed to rotate at high speed, and the PCI card 314-1 and the PCI card 314-3 are quickly cooled.

[0095] 8, it is determined that the intake side temperature acquired from the temperature sensor 323-1 is lower than the temperature of the power supply 312-1, and the intake side temperature acquired from the temperature sensor 323-2 is lower than the temperature of the power supply 312-2. Furthermore, it is determined that the intake side temperature acquired from the temperature sensor 323-5 is lower than the temperature of the PCI card 314-2.

[0096] Then, in step 802, louvers 322-1, 322-2, and 322-5 shield air inlets 411-1, 411-2, and 411-5, respectively.

[0097] Next, in step 904 of FIG. 9, the fans 321-1, 321-2, and 321-5 are instructed to rotate at low speeds, and the power supply 312-1, the power supply 312-2, and the PCI card 314-2 are cooled slowly.

[0098] 8, it is determined that the intake side temperature acquired from the temperature sensor 323-3 is lower than a specific temperature. Then, in step 802, the louver 322-3 blocks the intake port 411-3.

[0099] Next, in step 905 of FIG. 9, fan 321-3 is instructed to stop operating, and the cool air flowing in from intake port 412-3 is guided to the exhaust port opposite to other intake port 412-i.

[0100] Fig. 11 shows an example of a hardware configuration of the control unit 212 in Fig. 2. The control unit 212 in Fig. 11 includes a CPU 1101 (processor), a memory 1102, a communication circuit 1103, and a communication circuit 1104. These components are hardware.

[0101] The memory 1102 is, for example, a semiconductor memory such as a Read Only Memory (ROM) or a Random Access Memory (RAM), and stores programs and data used in processing. The memory 1102 may operate as the storage unit 613 in FIG.

[0102] The CPU 1101, for example, executes a program using the memory 1102, thereby operating as the acquisition unit 611 and the cooling control unit 612 in FIG.

[0103] The communication circuit 1103 is connected to a control bus such as an I2C (Inter-Integrated Circuit) bus, and communicates with the power supplies 312-i, PCI cards 314-i, fans 321-i, louvers 322-i, and temperature sensors 323-i via the control bus. The communication circuit 1103 also communicates with the memories 315-i, CPUs 316-i, fans 317-i, and auxiliary storage devices 318 via the control bus.

[0104] The communication circuit 1104 is connected to a communication network such as a LAN (Local Area Network) or a WAN (Wide Area Network), and communicates with a terminal device of an administrator via the communication network. The administrator can monitor and remotely operate the information processing device 201 by communicating with the control unit 212 using the terminal device.

[0105] The configurations of the information processing device 101 in FIG. 1 and the information processing device 201 in FIG. 2 are merely examples, and some of the components may be omitted or changed depending on the application or conditions of the information processing device.

[0106] 3 and the cooling unit 311 in FIG 4 are merely examples, and some of the components may be omitted or changed depending on the application or conditions of the information processing device 201. For example, when the rotation of the fan 317-i can ensure a sufficient air volume in the duct 325, the fan 321-i can be omitted.

[0107] The configurations of the power supply 312-i and the PCI card 314-i in Fig. 5 are merely examples, and some of the components may be omitted or changed depending on the configuration or conditions of the information processing device 201. The configurations of the control unit 212 in Fig. 6 and Fig. 11 are merely examples, and some of the components may be omitted or changed depending on the configuration or conditions of the information processing device 201.

[0108] The flowcharts in FIGS. 7 to 10 are merely examples, and some of the processes may be omitted or changed depending on the configuration or conditions of the information processing device 201.

[0109] Although the disclosed embodiments and their advantages have been described in detail, it will be appreciated that those skilled in the art may make various modifications, additions and omissions therein without departing from the scope of the invention as clearly set forth in the claims.

[0110] The following notes are further disclosed regarding the embodiment described with reference to FIGS. (Appendix 1) A first heat generating component; A second heat generating component; a blocking unit that performs a first operation of blocking air flowing from the first heat generating component toward the second heat generating component or a second operation of allowing the air to pass; a control unit that instructs the cutoff unit to perform the first operation when the temperature of the air is higher than a predetermined value, and instructs the cutoff unit to perform the second operation when the temperature of the air is lower than the predetermined value; An information processing device comprising: (Appendix 2) the information processing device further includes a housing that houses the first heat generating component, the second heat generating component, and the interrupter; The interrupter is a first duct that guides the air toward the second heat generating component; a second duct that guides the air toward the outside of the housing; a shielding member that shields one of the first duct intake port and the second duct intake port, the first action is an action in which the shielding member shields an air intake port of the first duct, 2. The information processing device according to claim 1, wherein the second operation is an operation in which the shielding member shields an air intake port of the second duct. (Appendix 3) the blocking unit further includes a fan that discharges the air in the second duct from an exhaust port of the second duct toward the second heat generating component, 3. The information processing device according to claim 2, wherein the second operation includes an operation of rotating the fan. (Appendix 4) the blocking unit includes a first temperature sensor that acquires a temperature of air flowing from the first heat generating component toward the second heat generating component, the second heat generating component includes a second temperature sensor that acquires a temperature of the second heat generating component; The information processing device described in any one of Appendices 1 to 3, characterized in that the control unit acquires the air temperature from the first temperature sensor, acquires the temperature of the second heat-generating component from the second temperature sensor, and uses the temperature of the second heat-generating component as the predetermined value. (Appendix 5) the first heat generating component is a processor, a memory, or an auxiliary storage device; 5. The information processing device according to claim 1, wherein the second heat generating component is an expansion card. (Appendix 6) In an information processing device including a first heat generating component and a second heat generating component, when a temperature of air flowing from the first heat generating component toward the second heat generating component is higher than a predetermined value, causing a blocking unit to perform a first operation of blocking the air; When the temperature of the air is lower than the predetermined value, causing the blocking unit to perform a second operation of passing the air; A cooling method comprising: (Appendix 7) The interrupter is a first duct that guides the air toward the second heat generating component; a second duct that guides the air toward the outside of a housing that houses the first heat generating component, the second heat generating component, and the blocking unit; and a shielding member that shields one of the first duct intake port and the second duct intake port, the first action is an action in which the shielding member shields an air intake port of the first duct, 7. The cooling method according to claim 6, wherein the second action is an action in which the shielding member shields the intake port of the second duct. (Appendix 8) the blocking unit further includes a fan that discharges the air in the second duct from an exhaust port of the second duct toward the second heat generating component, 8. The cooling method according to claim 7, wherein the second operation includes an operation in which the fan rotates. (Appendix 9) the blocking unit includes a first temperature sensor that acquires a temperature of air flowing from the first heat generating component toward the second heat generating component, the second heat generating component includes a second temperature sensor that acquires a temperature of the second heat generating component; The cooling method includes: obtaining a temperature of the air from the first temperature sensor; acquiring a temperature of the second heat generating component from the second temperature sensor; Further equipped with the step of causing the interrupter to perform the first operation includes a step of using a temperature of the second heat generating component as the predetermined value; The cooling method according to any one of claims 6 to 8, wherein the step of causing the interrupter to perform the second operation includes a step of using the temperature of the second heat-generating component as the predetermined value. (Appendix 10) the first heat generating component is a processor, a memory, or an auxiliary storage device; 10. The cooling method according to claim 6, wherein the second heat-generating component is an expansion card. [Explanation of symbols]

[0111] 101, 201 Information processing device 111 First heating component 112 Second heating element 113 Circuit Breaker 114 Control section 211 Information Processing Department 212 Control section 301 Case 311 Cooling section 312-1, 312-2 power supply 313 Free Slots 314-1~314-3 PCI cards 315-1~315-4, 1102 memory 316-1, 316-2, 1101 CPU 317-1~317-6, 321-1~321-6 Fan 318 Auxiliary storage 322-1~322-6 Louver 323-1~323-6, 511, 512 Temperature Sensors 324, 325 Duct 411-1~411-6, 412-1~412-6 Intake 611 Acquisition Department 612 Cooling control unit 613 Storage section 1103, 1104 Communication circuits

Claims

1. A first heat generating component; A second heat generating component; a blocking unit that performs a first operation of blocking air flowing from the first heat generating component toward the second heat generating component or a second operation of allowing the air to pass; a control unit that instructs the cutoff unit to perform the first operation when the temperature of the air is higher than a predetermined value, and instructs the cutoff unit to perform the second operation when the temperature of the air is lower than the predetermined value; a housing that houses the first heat generating component, the second heat generating component, and the interrupter, The interrupter is a first duct for guiding the air toward the second heat generating component; a second duct that guides the air toward the outside of the housing; a shielding member that shields one of the first duct intake port and the second duct intake port, the first action is an action of the shielding member shielding an air intake port of the first duct, The information processing apparatus, wherein the second operation is an operation in which the shielding member shields an air intake port of the second duct.

2. the blocking unit further includes a fan that discharges the air in the second duct from an exhaust port of the second duct toward the second heat generating component, The information processing apparatus according to claim 1 , wherein the second operation includes an operation of rotating the fan.

3. the blocking unit includes a first temperature sensor that acquires a temperature of air flowing from the first heat generating component toward the second heat generating component, the second heat generating component includes a second temperature sensor that acquires a temperature of the second heat generating component; 3. The information processing device according to claim 1, wherein the control unit acquires the temperature of the air from the first temperature sensor, acquires the temperature of the second heat-generating component from the second temperature sensor, and uses the temperature of the second heat-generating component as the predetermined value.

4. An information processing device having a first heat generating component, a second heat generating component, a blocking unit that performs a first operation of blocking air flowing from the first heat generating component toward the second heat generating component or a second operation of allowing the air to pass, and a housing that houses the first heat generating component, the second heat generating component, and the blocking unit, The interrupter is a first duct for guiding the air toward the second heat generating component; a second duct that guides the air toward the outside of the housing; a shielding member that shields one of the first duct intake port and the second duct intake port, a step of causing the blocking unit to perform the first operation, which is an operation of blocking the air intake port of the first duct with the blocking member, when a temperature of the air flowing from the first heat generating component toward the second heat generating component is higher than a predetermined value; When the temperature of the air is lower than the predetermined value, causing the blocking unit to perform the second operation, which is an operation in which the blocking member blocks the air intake port of the second duct; A cooling method comprising the steps of:

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