Yttria-Zirconia Sintered Ceramics for Plasma-Resistant Materials

Abstract

Disclosed is a ceramic sintered body comprising yttrium oxide and zirconium oxide, the ceramic sintered body comprising 75 to 95 mol % yttrium oxide and 5 to 25 mol % zirconium oxide, the ceramic sintered body comprising porosity in an amount of less than 2 vol %, and the density of the ceramic sintered body does not vary by more than 2% relative to theoretical density across its greatest dimension. The ceramic sintered body has an average grain size of 0.4 to less than 2 μm as measured according to ASTM E112-2010. The ceramic sintered body may be machined into plasma resistant components for use in plasma processing chambers. Methods of fabrication are also disclosed.

Description

[Technical field]

[0001] The present disclosure relates generally to plasma-resistant sintered ceramic bodies comprising yttrium oxide and zirconium oxide and methods of making the same, and more particularly to plasma-resistant chamber components manufactured from the sintered ceramic bodies. [Background technology]

[0002] Semiconductor processing requires the use of halogen-based gases as well as oxygen and other process gases in combination with high electric and magnetic fields to create an environment suitable for plasma etching and deposition processes. These plasma etching and deposition environments are created in vacuum chambers for etching and depositing materials on semiconductor substrates. The harsh plasma environment requires the use of highly plasma-resistant (corrosion and erosion resistant) materials for the components in the processing chambers. These chambers include components such as disks or windows that confine the plasma over the wafer being processed, liners, gas injectors, rings, and cylinders. These components are made of materials that provide resistance to corrosion and erosion in the plasma environment, as described, for example, in U.S. Pat. Nos. 5,798,016, 5,911,852, 6,123,791, and 6,352,611. However, these components used in plasma processing chambers are continuously attacked by the plasma, resulting in corrosion, erosion, and roughening on the surfaces of the chamber parts exposed to the plasma. This corrosion and erosion contributes to wafer level contamination through the release of particles from component surfaces into the chamber, resulting in yield loss of semiconductor devices.

[0003] It is known that rare earth oxides, particularly yttrium oxide Y2O3 and zirconium oxide ZrO2 sintered bodies, are chemically inert and exhibit high plasma resistance (corrosion and erosion). However, the use of rare earth oxides, particularly yttrium oxide and zirconium oxide sintered bodies, has several drawbacks.

[0004] Yttrium oxide and zirconium oxide are known to be difficult to sinter to the required high density by conventional methods, resulting in low density and significant porosity remaining in the final part or component. The residual porosity and low density accelerate corrosion during plasma etching and deposition processes, thereby degrading the plasma resistance of the component. Furthermore, sintering yttrium oxide and zirconium oxide typically requires high temperatures, about 1800° C. or higher, for extended periods of time. The high temperatures and long sintering durations result in excessive grain growth and adversely affect the mechanical strength of the yttrium oxide and zirconium oxide bodies. High purity powders of yttria and zirconia pose challenges for sintering to the high density required for semiconductor plasma processing chamber applications. In particular, the high sintering temperatures and plasma-resistant yttria and zirconia material properties present challenges in sintering to high density while maintaining the required high purity. To promote densification of yttrium oxide and zirconium oxide bodies useful as plasma chamber components, sintering aids are often used to reduce sintering temperatures and promote densification. However, the addition of sintering aids effectively reduces the corrosion and erosion resistance of the yttrium oxide and zirconium oxide materials and increases the possibility of impurity contamination at the semiconductor device level.

[0005] Films or coatings of rare earth oxides, such as yttrium oxide and zirconium oxide, are known to be deposited by aerosol or plasma spray techniques on bases or substrates formed from different materials that are cheaper and stronger than yttrium oxide and zirconium oxide. However, these methods are limited in the film thickness that can be produced, exhibit poor interfacial adhesion strength between the rare earth oxide film and the substrate, and high levels of porosity, typically on the order of 5% to 50%, resulting in particle shedding into the process chamber.

[0006] Attempts to produce solid ceramic bodies for large size corrosion resistant components made from rare earth oxides such as yttria-zirconia have met with limited success. Solid components with diameters on the order of 100 mm or greater that can be handled and used as part of a chamber wall without breaking or cracking are difficult to produce beyond laboratory scale. This is due to the typically low density and sintered strength of yttrium oxide and zirconium oxide. Thus far, attempts to prepare large yttria-zirconia components have resulted in high porosity, low density, breakage, and poor quality for their use in corrosion resistant applications. Currently, there are no commercially available large yttria-zirconia solid sintered bodies or components on the order of 100 mm to 622 mm in diameter for use in semiconductor etching and deposition applications. Summary of the Invention [Problem to be solved by the invention]

[0007] As a result, there is a need in the art for plasma-resistant sintered ceramic bodies that have high density, low porosity, high purity, and high mechanical strength that provide improved resistance to corrosion and erosion under plasma etching and deposition conditions (plasma resistance), and are particularly suitable for the manufacture of components of large dimensions (diameters 100-622 mm).

[0008] These and other needs are addressed by the various embodiments, aspects, and configurations disclosed herein. Embodiment 1. A ceramic sintered body comprising yttrium oxide and zirconium oxide, the ceramic sintered body comprising 75 mol% to 95 mol% yttrium oxide and 5 mol% to 25 mol% zirconium oxide, the ceramic sintered body comprising an amount of porosity of less than 2 vol%, the density of the ceramic sintered body does not vary by more than 2% relative to the theoretical density across the maximum dimension, and the ceramic sintered body has an average grain size of 0.4 to less than 2 μm as measured according to ASTM E112-2010.

[0009] Embodiment 2. The ceramic sintered body of embodiment 1 having at least one surface comprising yttrium oxide and zirconium oxide, wherein the at least one surface is polished and comprises porosity in an amount of less than 2% by pore area of ​​the at least one surface.

[0010] Embodiment 3. The ceramic sintered body of embodiment 2, wherein the porosity measured on the polished surface extends throughout the ceramic sintered body.

[0011] Embodiment 4. The ceramic sintered body according to any one of embodiments 1 to 3, comprising yttrium oxide in an amount of 75 mol % or more and 85 mol % or less, and zirconium oxide in an amount of 15 mol % or more and 25 mol % or less.

[0012] Embodiment 5. The ceramic sintered body according to any one of embodiments 1 to 4, comprising 77 mol % or more and 83 mol % or less of yttrium oxide and 17 mol % or more and 23 mol % or less of zirconium oxide.

[0013] Embodiment 6. The ceramic sintered body according to any one of embodiments 1 to 5, comprising 78 mol % or more and 82 mol % or less of yttrium oxide and 18 mol % or more and 22 mol % or less of zirconium oxide.

[0014] Embodiment 7. The ceramic sintered body according to any one of embodiments 4 to 6, having a density of 5.01 g / cc to 5.13 g / cc as measured according to ASTM B962-17.

[0015] Embodiment 8. The ceramic sintered body according to any one of embodiments 4 to 7, having a hardness of 8.5 to 14.5 GPa as measured according to ASTM standard C1327.

[0016] Embodiment 9. A ceramic sintered body according to any one of embodiments 1 to 8, having a purity of more than 99.99% (excluding HfO2 and SiO2) relative to 100% purity, as measured using an ICP-MS method.

[0017] Embodiment 10. The ceramic sintered body of any one of embodiments 1 to 9, having a total impurity content of less than 100 ppm.

[0018] Embodiment 11. The ceramic sintered body according to any one of embodiments 1 to 10, wherein at least one crystalline phase comprises a cubic solid solution selected from the group consisting of fluorite, c-type cubic crystals, and combinations thereof.

[0019] Embodiment 12. A ceramic sintered body according to any one of embodiments 1 to 11, having a pore size of 0.1 μm or more and 5 μm or less, measured across the polished surface.

[0020] Embodiment 13. A ceramic sintered body according to any one of embodiments 1 to 12, having a pore size of 0.1 μm or more and 3 μm or less, measured across the polished surface.

[0021] Embodiment 14. A ceramic sintered body according to any one of embodiments 1 to 13, having at least one surface with an average grain size of 0.75 to 6 μm as measured according to ASTM E112-2010.

[0022] Embodiment 15. A ceramic sintered body according to any one of embodiments 1 to 14, comprising a c-type cubic solid solution phase.

[0023] Embodiment 16. The ceramic sintered body according to any one of embodiments 1 to 15, each having a maximum dimension of 100 mm to 622 mm, preferably 100 to 575 mm, preferably 100 to 406 mm, preferably 150 to 622 mm, preferably 150 to 575 mm, preferably 150 to 406 mm, preferably 406 to 622 mm, and more preferably 406 to 575 mm with respect to the longest extension of the sintered body.

[0024] Embodiment 17. The ceramic sintered body according to any one of embodiments 1 to 16, wherein the ceramic sintered body is selected from the group consisting of a window in a plasma processing chamber, an RF window, a lid, a focus ring, a shield ring, a nozzle, a gas injector, a showerhead, a gas distribution plate, a chamber liner, a chuck, an electrostatic chuck, a puck, and / or a cover ring.

[0025] Embodiment 18. A method for making a sintered ceramic body, comprising: combining yttrium oxide and zirconium oxide powders to make a powder mixture; sintering the powder mixture by applying heat to raise the temperature of the powder mixture to a sintering temperature and maintaining the sintering temperature to form a sintered powder mixture; placing the sintered powder mixture in a volume defined by a sintering machine toolset to create a vacuum in the volume; applying pressure to the sintered powder mixture while heating to the sintering temperature to sinter to form a sintered ceramic body; and reducing the temperature of the sintered ceramic body.

[0026] Embodiment 19. The method of embodiment 18, optionally further comprising: annealing the ceramic sintered body by applying heat to increase the temperature of the ceramic sintered body to reach an annealing temperature to form an annealed ceramic sintered body; and reducing the temperature of the annealed ceramic sintered body.

[0027] Embodiment 20. The method of embodiment 18 or 19, optionally further comprising machining the ceramic sintered body to form ceramic sintered body components, such as windows, RF windows, lids, focus rings, shield rings, nozzles, gas injectors, showerheads, gas distribution plates, chamber liners, chucks, electrostatic chucks, pucks, and / or cover rings in a plasma processing chamber.

[0028] Embodiment 21. The method of any one of embodiments 18-20, wherein the calcined powder mixture has a purity of 99.99% or greater relative to 100% purity, as measured using ICP-MS techniques.

[0029] Embodiment 22. The calcined powder mixture has a surface area of ​​2 to 14 m2 / g, preferably 2 to 12 m2 / g, as measured according to ASTM C1274. 2 The method according to any one of embodiments 18 to 21, wherein the specific surface area (SSA) is from 2 to 10 m2 / g, preferably from 2 to 8 m2 / g, preferably from 2 to 6 m2 / g, preferably from 2.5 to 10 m2 / g, preferably from 3 to 10 m2 / g, preferably from 4 to 10 m2 / g, and more preferably from 2 to 5 m2 / g.

[0030] Embodiment 23. The method according to any one of embodiments 18 to 22, wherein the firing temperature is between 600°C and 1200°C.

[0031] Embodiment 24. The method of any one of embodiments 18 to 23, wherein the pressure is 10 to 60 MPa.

[0032] Embodiment 25. The method according to any one of embodiments 18 to 24, wherein the pressure is 10 to 50 MPa.

[0033] Embodiment 26. The method according to any one of embodiments 18 to 25, wherein the pressure is 10 to 40 MPa.

[0034] Embodiment 27. The method according to any one of embodiments 18 to 26, wherein the pressure is 10 to 30 MPa.

[0035] Embodiment 28. The method according to any one of embodiments 18 to 27, wherein the pressure is 15 to 40 MPa.

[0036] Embodiment 29. The method according to any one of embodiments 18 to 28, wherein the pressure is 15 to 30 MPa.

[0037] Embodiment 30. The method of any one of embodiments 18 to 29, wherein the pressure is 15 to 25 MPa.

[0038] Embodiment 31. The method according to any one of embodiments 18 to 30, wherein the sintering temperature is 1200°C to 1700°C.

[0039] Embodiment 32. The method according to any one of embodiments 18 to 31, wherein the annealing temperature is 800°C to 1500°C.

[0040] Embodiment 33. A ceramic sintered body according to any one of embodiments 1 to 17, produced according to the method according to any one of embodiments 18 to 32.

[0041] It is to be understood that both the foregoing general description and the following detailed description are exemplary of the present disclosure and are not restrictive. [Brief description of the drawings]

[0042] The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, according to common practice, the various features of the drawings are not to scale. Conversely, dimensions of the various features have been arbitrarily expanded or reduced for clarity. The drawings include the following figures: [Figure 1] FIG. 1 is a phase diagram of yttria and zirconia according to the present disclosure. [Figure 2a] FIG. 2a shows the X-ray diffraction results for an exemplary calcined powder mixture disclosed herein. [Figure 2b] FIG. 2b shows the X-ray diffraction results for an exemplary calcined powder mixture disclosed herein. [Diagram 3] FIG. 3 shows an exemplary X-ray diffraction result of a sintered yttria-zirconia ceramic body disclosed herein. [Figure 4] FIG. 4 shows an exemplary X-ray diffraction result of a sintered yttria-zirconia ceramic body disclosed herein. [Diagram 5] FIG. 5 shows the change in X-ray diffraction results due to annealing of the yttria-zirconia ceramic sintered body disclosed herein. [Figure 6] FIG. 6 shows exemplary microstructures at 5000 times magnification of yttria-zirconia ceramic sintered bodies under different annealing conditions disclosed herein. [Figure 7] FIG. 7 shows a first example of a semiconductor processing chamber. [Figure 8] FIG. 8 shows a second example of a semiconductor processing chamber. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Reference will now be made in detail to certain embodiments. Examples of certain embodiments are illustrated in the accompanying drawings. Although the present disclosure will be described in conjunction with these specific implementations, it will be understood that the present disclosure is not limited to such specific embodiments. On the contrary, the present disclosure is intended to cover alternatives, modifications, and equivalents that may be included within the spirit and scope of the present invention as defined by the appended claims. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. The present disclosure may be practiced without some or all of these specific details.

[0044] As used herein, the term "zirconia" is understood to be zirconium oxide, including ZrO2. As used herein, the term "alumina" is understood to be aluminum oxide, including Al2O3. As used herein, the term "yttria" is understood to be yttrium oxide, including Y2O3.

[0045] As used herein, the terms "semiconductor wafer," "wafer," "substrate," and "wafer substrate" are used interchangeably. Wafers or substrates used in the semiconductor device industry typically have diameters of 200 mm, or 300 mm, 450 mm, or greater, as known in the art.

[0046] As used herein, the term "ceramic sintered body" is synonymous with "sinter," "body," or "sintered body" and refers to a unitary, integral, sintered ceramic article formed from compressing a powder by applying pressure and heat to produce a single, dense, sintered ceramic body. The single sintered ceramic body can be machined into a single sintered ceramic component that is useful as a chamber component in plasma processing applications.

[0047] As used herein, the term "nano powder" refers to a powder having a molecular weight of 2000 or less. 2 This is intended to encompass powders having a specific surface area (SSA) of 1 / g or more.

[0048] As used herein, the term "purity" refers to the absence of various contaminants and / or impurities in a) the starting materials from which the powder mixture may be formed, b) the powder mixture after processing, and c) the sintered ceramic bodies disclosed herein. Higher purities, approaching 100%, represent materials that are essentially free of contaminants, dopants, or impurities and contain only the intended material composition of Y, Zr, and O. Impurities differ from dopants in that dopants are compounds that are intentionally added to the starting powders or to the powder mixtures, typically to achieve certain electrical, mechanical, optical, or other properties (e.g., grain size modification, etc.) in the sintered ceramic body.

[0049] As used herein, the term "impurities" refers to compounds / contaminants present in a) the starting materials from which the powder mixture may be formed, b) the powder mixture after processing and / or the fired powder mixture, and c) the sintered ceramic body, including impurities other than the starting materials themselves, including Y, Zr, and O. Impurities may be present in the starting powder materials, the powder mixture, and / or the fired powder mixture after processing / combining or during sintering, and are reported as ppm, with lower ppm levels corresponding to lower impurity contents. Impurities reported herein do not include Si in the form of SiO2 or Hf in the form of HfO2. Yttria present in the starting zirconium oxide material is present as a stabilizer and is therefore not considered an impurity.

[0050] Conversion of purity to impurities can be made using a conversion of 1% by weight, which is equal to 10,000 pm, as known to those skilled in the art. When reported herein in ppm, all values ​​are relative to the total mass of the material being measured, such as the powder embodiments and / or sintered ceramic bodies disclosed herein.

[0051] As used herein, the term "sintering aid" refers to an additive such as calcia, silica or magnesia that enhances densification during the sintering process, thereby reducing porosity.

[0052] As used herein, the term "ceramic sintered body component" refers to a ceramic sintered body after machining steps to produce a particular form or shape required for use in a semiconductor manufacturing plasma processing chamber.

[0053] As used herein, the term "powder mixture" refers to at least one powder that has been mixed by methods known to those skilled in the art, such as ball milling, jet milling, tumble mixing, drying, calcining, sieving, refining, and repetition or combination of these steps, prior to a sintering process, and after sintering, the powder mixture is formed into the disclosed sintered ceramic body and / or sintered ceramic body component.

[0054] As used herein, the term "tool set" may include at least a die and two punches, and optionally additional spacer elements.

[0055] The terms "phase" or "crystalline phase" are synonymous and, as used herein, are understood to mean an ordered structure that forms the crystal lattice of a material, including a stoichiometric or compound phase or a solid solution phase. As used herein, a "solid solution" is defined as a mixture of different elements that share the same crystal lattice structure. The mixture in the lattice may be substitutional, where atoms of one starting crystal substitute for atoms of the other starting crystal, or interstitial, where atoms occupy positions normally vacant in the lattice.

[0056] The term "calcination" is understood to mean a heat treatment step that can be carried out on powders in air at temperatures below the sintering temperature in order to remove moisture and / or impurities, increase the crystallinity and possibly modify the surface area of ​​the powder and / or powder mixture.

[0057] As applied to ceramic heat treatment, the term "annealing" is understood herein to mean a heat treatment in which the disclosed ceramic sintered bodies or ceramic sintered body components are brought to a constant temperature and allowed to cool gradually to relieve stress and / or normalize stoichiometry. Typically, air or an oxygen-containing environment may be used.

[0058] As used herein, the term "about" when used in connection with a number allows for a variance of plus or minus 10%. The term "substantially" as used herein is a descriptive term indicating approximation, meaning "to a great extent" or "to the greater part, but not entirely, of what is specified," and is intended to avoid precise numerical boundaries for specified parameters.

[0059] The following detailed description assumes that the embodiments are performed in an apparatus such as an etching or deposition chamber required as part of the fabrication of a semiconductor wafer substrate. However, the present disclosure is not so limited. The workpieces may be of various shapes, sizes, and materials. In addition to semiconductor wafer processing, other workpieces that may utilize the embodiments disclosed herein include various articles such as inorganic circuit boards with fine feature sizes, magnetic recording media, magnetic recording sensors, mirrors, optical elements, micromechanical devices, and the like.

[0060] During the processing of semiconductor devices, corrosion-resistant parts or chamber components are used in plasma processing chambers and are exposed to harsh corrosive environments that can cause particle release into the reactor-chamber, resulting in yield loss due to wafer-level contamination. The ceramic sintered bodies and related ceramic sintered body components disclosed herein provide improved plasma resistance in semiconductor processing reactor chambers due to certain material properties and characteristics described below.

[0061] The embodiments disclosed herein provide a ceramic sintered body comprising 75-95 mol % yttrium oxide and 5-25 mol % zirconium oxide, the ceramic sintered body comprising an amount of porosity less than 2 vol % and a grain size of 0.5-8 μm as measured according to ASTM E112-2010. The ceramic sintered body has at least one surface comprising at least one crystalline phase comprising yttrium oxide and zirconium oxide, the surface having a porosity of less than 2% of the pore area and a grain size of 0.5-8 μm. The porosity measured on the polished surface may extend throughout the bulk of the ceramic sintered body, and thus the porosity on the polished surface represents volumetric or bulk porosity. The ceramic sintered body disclosed herein may have a density of 98% or greater relative to theoretical density as defined herein. The ceramic sintered body may be made from high purity powders of yttria and zirconia having a particle size distribution and surface area that provide handleability, flowability and chemical reactivity.

[0062] FIG. 1 shows the yttrium oxide / zirconium oxide phase diagram, illustrating the phases of yttrium oxide and zirconium oxide and the molar combinations to achieve them. The formation of crystalline phases as shown in the diagram can be achieved by several parameters, such as the molar ratio of the starting powder mixture, the degree of mixing, and the purity of the starting powders. Sintering conditions, such as the ramp rate, temperature and time of the current and pressure assisted process as disclosed, and the annealing temperature and time, can also affect the crystalline phase formation. Guidelines for achieving these crystalline phases of yttria-zirconia are known to those skilled in the art, as evidenced by the yttria-zirconia phase diagram of Andrievskaya et.al (2014) (incorporated herein by reference in its entirety), shown in FIG. 1.

[0063] In embodiments, yttria-zirconia ceramic sintered bodies including c-type cubic crystal structure (designated as C according to the phase diagram of FIG. 1), fluorite structure (designated as F according to the phase diagram of FIG. 1), and solid solutions of combinations thereof are disclosed herein as shown within the square region defined in FIG. 1. Within this composition range (horizontal axis) and sintering temperature region (vertical axis), embodiments of the ceramic sintered body can be formed. In other embodiments (depending on the composition according to the phase diagram of FIG. 1), the ceramic sintered body includes a solid solution of c-type (yttria) cubic crystal structure. The c-type yttria / rare earth oxide crystal structure is disclosed in detail according to "Phase Equilibria in Systems Involving the Rare-Earth Oxides. Part 1. Polymorphism of the Oxides of the Trivalent Rare-Earth Ions", by RS Roth et.al., 1960, which is incorporated herein by reference in its entirety.

[0064] The ceramic sintered components disclosed herein may benefit from the use of yttria-zirconia ceramic sintered bodies for several reasons: Yttria-zirconia ceramic sintered bodies within the composition ranges of 75-95 mol% Y2O3 and 5-25 mol% ZrO2 may provide a favorable combination of high density (and correspondingly low porosity), halogen-based plasma resistance, dielectric and thermal properties, and hardness compared to other ceramic materials. The yttria-zirconia ceramic sintered body and components produced therefrom may, for example, be 75 mol% to 95 mol% Y2O3 and 5 mol% to 25 mol% ZrO2, preferably 75 mol% to 93 mol% Y2O3 and 7 mol% to 25 mol% ZrO2, preferably 75 mol% to 90 mol% Y2O3 and 10 mol% to 25 mol% ZrO2, preferably 75 mol% to 87 mol% Y2O3 and 13 ... % to 85 mol% Y2O3 and 15 mol% to 25 mol% ZrO2, preferably 75 mol% to 83 mol% Y2O3 and 17 mol% to 25 mol% ZrO2, preferably 77 mol% to 83 mol% Y2O3 and 17 mol% to 23 mol% ZrO2, preferably 78 mol% to 82 mol% Y2O3 and 18 mol% to 22 mol% ZrO2, and more preferably from about 80 mol% Y2O3 to about 20 mol% ZrO2.

[0065] In some embodiments, the c-type cubic phase may be preferred, and may be approximately 80 to 95 mol% yttria and 5 to 20 mol% zirconia, preferably 81 to 95 mol% Y2O3 and 5 to 19 mol% ZrO2, preferably 82 to 95 mol% Y2O3 and 5 to 18 mol% ZrO2, preferably 83 to 95 mol% Y2O3 and 5 to 17 mol% ZrO2, preferably 84 to 95 mol% Y2O3 and 5 to 17 mol% ZrO2, according to the phase diagram of FIG. The composition may include 95 mol% or less Y2O3 and 5 mol% to 16 mol% ZrO2, preferably 86 mol% to 95 mol% Y2O3 and 5 mol% to 14 mol% ZrO2, preferably 88 mol% to 95 mol% Y2O3 and 5 mol% to 12 mol% ZrO2, preferably 90 mol% to 95 mol% Y2O3 and 5 mol% to 10 mol% ZrO2, and preferably 92 mol% to 95 mol% Y2O3 and 5 mol% to 8 mol% ZrO2.

[0066] The use of ceramic sintered bodies and components prepared according to the methods disclosed herein in semiconductor processing chambers provides improved resistance to corrosion and erosion from halogen-based process gases. This enhanced plasma resistance is due, at least in part, to the high density and corresponding low porosity of the sintered bodies. Embodiments of the disclosed yttria-zirconia ceramic sintered bodies (and components made therefrom) may have a density of 5.01-5.15 g / cc, preferably 5.01-5.13 g / cc, preferably 5.03-5.13 g / cc, preferably 5.06-5.13 g / cc, preferably 5.08-5.15 g / cc, preferably 5.08-5.13 g / cc, preferably 5.10-5.13 g / cc, preferably 5.12-5.13 g / cc, preferably 5.01-5.11 g / cc, preferably 5.01-5.10 g / cc, preferably 5.06-5.15 g / cc, preferably 5.06-5.12 g / cc, and more preferably 5.08-5.13 g / cc, according to an Archimedes density measurement performed in accordance with ASTM B962-17. Table 1 lists the preparation conditions (temperature, time, pressure, and annealing), density, and volume porosity of the yttria zirconia ceramic sintered bodies disclosed herein.

[0067] Volumetric mixture rules known to those skilled in the art may not be applicable to solid solutions such as the ceramic sintered body as disclosed, and therefore can be used to approximate the theoretical density of the ceramic sintered body as disclosed herein. Theoretical densities used herein were estimated using a combination of volumetric mixture rules and calculations based on Equation 4 for substitutional solid solutions as disclosed in "an exact density formula for substitutional solid solution alloys", J. Mater. Sci. Letters 13 (1994), by Chen and Bandeira (adapted for calculations of oxide solid solutions of yttria and zirconia). Approximate theoretical density values ​​of 5.09 g / cc and 5.15 g / cc were calculated over the composition ranges of 95 mol% yttria and 5 mol% zirconia, and 75 mol% yttria and 25 mol% zirconia, respectively. Density measurements using the Archimedes method according to ASTM B962-17 were performed on the exemplary 80 mol% yttria 20 mol% zirconia ceramic sintered body disclosed in Table 1. Commercial grades of zirconium oxide used herein are known to have up to 5 wt% HfO2, which may slightly increase the density. Five measurements were averaged and a maximum value of 5.13 g / cc was measured. This value is in good agreement with the calculated value and is therefore considered the theoretical density of a 80 mol% yttria 20 mol% zirconia sintered ceramic body. Sample 8 in Table 1 corresponds to a yttria zirconia sintered ceramic body containing 90 mol% yttria and 10 mol% zirconia and having a density of 5.08 g / cc, which is considered the theoretical density of that composition. N / A indicates that the sample was not subjected to annealing.

[0068] [Table 1]

[0069] The relative density (RD) of a given material is defined as the ratio of the measured density of a sample (ρ sample) to the reported theoretical density of the same material (ρ theoretical), as shown in the following equation:

[0070]

number

[0071] where ρ sample is the (Archimedes) density measured according to ASTM B962-17, ρ theoretical is the measured theoretical density disclosed herein, and RD is the relative fractional density. High density yttria-zirconia ceramic sintered bodies have correspondingly low porosity. Porosity (used synonymously herein with volume porosity) can be calculated by subtracting the density of the fully dense part (i.e., 100%) from the relative density (calculated above). Using this calculation, porosity (or volumetric porosity, as the case may be) in terms of a percentage of the total volume of 0.05% to 2%, preferably 0.05% to 1.5%, preferably 0.05% to 1%, preferably 0.05% to 0.5%, preferably 0.1% to 1.5%, preferably 0.1% to 1%, preferably 0.1% to 0.5%, more preferably 0.05% to 0.2% was calculated from the Archimedes density values ​​measured for the yttria-zirconia ceramic sintered bodies disclosed herein.

[0072] The ceramic sintered bodies disclosed herein and associated components produced therefrom may have a density (or relative density, RD) relative to theoretical density calculated from density measurements performed according to ASTM B962-17 of 98-100%, preferably 98.5-100%, preferably 99-100%, preferably 99.5-100%, more preferably 99.8-100%. The variation in density (relative to theoretical density) across the largest dimension of the ceramic sintered body (for disk-shaped samples, the largest dimension is the diameter) may be 2% or less, preferably 1.5% or less, preferably 1% or less, and more preferably 0.8% or less.

[0073] The high density disclosed herein contributes to the high hardness values ​​of the yttria-zirconia sintered ceramic bodies. Hardness measurements were performed using a 0.1 kgf load cell in accordance with ASTM standard C1327. Table 2 below lists hardness results over a total of about 40 measurements for Samples 1, 2 and 11, each containing about 80 mole % yttria and about 20 mole % zirconia. Sample 11 was prepared under similar pressure, temperature and time conditions as Sample 7.

[0074] [Table 2]

[0075] Embodiments of the yttria-zirconia sintered ceramic body may have a hardness of 8.5 to 14.5 GPa or more. Other embodiments may have an average hardness of 9.4 GPa to 12.4 GPa or less, preferably 9.8 GPa to 11.7 GPa or less, and preferably 10.2 GPa to 11 GPa or less.

[0076] The yttria-zirconia sintered ceramic body may include a unitary body made according to the processes disclosed herein and may therefore include porosity uniformly distributed on the surface and throughout the body. In other words, the porosity measured on the surface represents the porosity within the volume of the bulk sintered ceramic body, and therefore the terms "porosity" and "volumetric porosity" are to be taken to have the same meaning as used herein.

[0077] Semiconductor processing reactors associated with etching or deposition processes require chamber components to be fabricated from materials that are highly resistant to chemical attack by the reactive plasmas required for semiconductor processing. These plasma or process gases include O2, F, Cl2, HBr, BCl3, CCl 4、 N2, NF3, NO, N2O, C2H 4、The ceramic sintered body may be composed of various halogen, oxygen and nitrogen based chemicals such as CF4, SF6, C4F8, CHF3, CH2F2, etc. The use of ceramic sintered bodies formed from the corrosion resistant materials disclosed herein provides reduced chemical corrosion during use. Furthermore, providing chamber component materials such as ceramic sintered bodies with very high purity provides a uniform corrosion resistant body with fewer impurities that can act as initiation sites for corrosion. Furthermore, components made from very dense materials with small diameter minimal pores may provide greater resistance to corrosion and erosion during etching and deposition processes. As a result, preferred chamber components may be made from materials that have high erosion and corrosion resistance during plasma etching and deposition. As used herein, the term "plasma resistant" refers to materials that do not corrode or erode during exposure to halogen-based process gas plasmas. This plasma resistance prevents the release of particles from the component surface into the reactor chamber during semiconductor processing. Such release of particles into the reactor-chamber contributes to wafer contamination by introducing semiconductor process drift and semiconductor device level yield loss.

[0078] Chamber components must have sufficient bending strength or mechanical strength for the handling required during component installation, removal, cleaning, and use in the process chamber. The use of current and pressure assisted sintering techniques with high heating and cooling rates and short sintering times provide high density and fine grain size in the ceramic sintered body and associated components, providing increased mechanical strength. High mechanical strength allows for machining of intricate features of fine geometry into the ceramic sintered body without breakage, cracking, or chipping. Bending strength or stiffness becomes especially important with the large component sizes used in modern process tools. In some component applications, such as chamber windows on the order of 200-622 mm in diameter, the window is subjected to significant stresses during use under vacuum conditions. This requirement necessitates the use of corrosion resistant materials with high strength and stiffness (also called Young's modulus). Ceramic sintered bodies according to embodiments disclosed herein meet these strength and handleability requirements.

[0079] As semiconductor device geometries continue to shrink and become smaller, temperature control becomes increasingly important to minimize process yield loss. This temperature variation within the processing chamber affects the control of the critical dimensions of nanometer-scale features and negatively impacts device yield. -4Material selection for chamber components with low dielectric loss, such as ≦1000 (dielectric loss is used synonymously herein with the terms “loss factor” and “loss tangent”), may be desirable to prevent heat generation and result in temperature non-uniformity in the chamber. Dielectric loss may be affected by grain size, purity, and the use of dopants and / or sintering aids in the material, among other factors. The use of sintering aids and / or dopants in combination with extended sintering conditions may result in larger grain size, lower purity material, which may not provide the low loss tangent required for application in high frequency chamber processes common in industry, resulting in grain generation and reduced mechanical strength, which may prevent the manufacture of large component sizes. Thus, disclosed herein are ceramic sintered bodies that are free or substantially free of dopants and / or sintering aids. To improve plasma generation efficiency and prevent overheating, especially at high frequencies from 1 MHz to 20 GHz (and above RF range) such as those used in plasma processing chambers, preferably the semiconductor chamber components are materials with as low dielectric loss as possible. Heat generated by absorption of microwave energy in these component materials with higher dielectric loss causes non-uniform heating and increases thermal stress on the components. Table 3 below lists the dielectric loss and permittivity measured at ambient temperature at 1 MHz according to ASTM D-150 from Samples 9 and 10 containing about 80 mole % yttria and about 20 mole % zirconia made according to the methods disclosed herein. Within the range of measurements performed, the same dielectric performance was measured for annealed and non-annealed yttria-zirconia ceramic sintered bodies.

[0080] [Table 3]

[0081] Embodiments of ceramic sintered bodies including compositions of yttria and zirconia may have low levels of porosity, less than 2%, preferably less than 1%, preferably 0.05%-2%, preferably 0.05%-1%, more preferably 0.05%-0.5% of the total area including porosity, which may provide improved performance in semiconductor plasma etch and deposition applications. This may result in longer component life, improved process stability, and reduced chamber downtime for cleaning and maintenance. Porosity is measured by image analysis of polished surfaces polished according to the following method (Strasbaugh polisher, polishing supplies from Struers, Inc.): (i) 40 μm alumina: to planarize surface as needed; (ii) 12 um alumina, fixed abrasive pad: 2 min; (iii) 9 pm diamond, polyurethane pad: 8 min; (iv) 6 μm diamond, raised cloth: 3 min; and (v) 1 μm diamond, raised cloth: 3 min. Images were taken at 5000x magnification using a Nanoscience Instruments Phenom XL scanning electron microscope (SEM). SEM images were imported into ImageJ image processing software and used to measure and quantify pore size and pore area. Nearly dense or fully dense yttria-zirconia ceramic sintered bodies with minimal (less than 2% by volume) porosity are disclosed herein. This minimal porosity may provide a very dense plasma-facing surface, thereby enabling reduced particle generation by preventing trapping of contaminants at the surface of the ceramic sintered body during etching and deposition processes. The corrosion-resistant ceramic sintered bodies disclosed herein may have a very high density of more than 98%, preferably more than 99%, preferably more than 99.5%, more preferably about 99.8% of theoretical density, and a corresponding low porosity of less than 2%, preferably less than 1%, preferably less than 0.5%, preferably less than 0.2% on the surface and throughout the volume of the ceramic sintered body, providing improved etch resistance due to the controlled surface area containing the porosity. The ceramic sintered bodies disclosed herein are integral homogeneous bodies containing crystalline phases, purity, and porosity / pores both on the surface and throughout the bulk.Thus, features such as crystalline phase, pore size, % porosity, and pore area measured on the surface represent features within the bulk, and therefore the volume, of the sintered ceramic body. The term "homogeneous" means that a material or system has substantially the same properties throughout, is uniform and free of irregularities. Thus, a "homogeneous body" means that the distribution of features such as % porosity, pore size, pore area, and crystalline phase is spatially uniform and does not have significant gradients, i.e., a substantially uniform sintered ceramic body exists regardless of location within the bulk or on the surface.

[0082] Ceramic sintered bodies including yttria and zirconia may be one of the most etch-resistant materials known, and the use of high purity starting materials to produce ceramic sintered bodies of very high purity and density as starting materials provides inherent plasma resistance to the ceramic sintered components. Impurities or contaminants present may act as initiation sites for corrosion and / or erosion during plasma processing. This high purity may prevent roughening of the ceramic sintered body surface by halogen-based gas species, which may otherwise chemically attack, roughen and etch components made from less pure powders.

[0083] For the reasons stated above, a total purity of greater than 99.99%, preferably greater than 99.995%, preferably greater than 99.999%, relative to a material purity of 100% in the yttrium oxide and zirconium oxide starting materials is preferred.

[0084] The purity of the zirconium oxide starting material may be greater than 99.9%, preferably greater than 99.95%, and preferably greater than 99.99% to provide corrosion and erosion resistance during use in etching and deposition chamber conditions. Commercial grades of zirconium oxide are known to have 5% or less HfO2 by weight. Zirconia and hafnia (HfO2) may react similarly during the formation of the yttria-zirconia ceramic sintered body disclosed herein, and therefore the presence of HfO2 in the ceramic sintered body is not considered to be detrimental to the use of the body as a chamber component in plasma processing applications. Thus, HfO2 is not considered an impurity as disclosed herein. Furthermore, removing hafnia from zirconia to amounts less than 5% by weight may be impractical due to the resulting high cost of the zirconia powder. Thus, the HfO2 present in the starting zirconia powder is not considered to be a contaminant or impurity, and therefore is not considered when reporting the purity, contaminants, and impurities disclosed herein. The zirconium oxide starting powder may comprise at least one selected from the group consisting of unstabilized zirconia, partially stabilized zirconia, and stabilized zirconia.

[0085] The total purity of the calcined powder mixtures disclosed herein may be greater than 99.99%, preferably greater than 99.995%, and more preferably about 99.999% or greater, each relative to 100% purity of the calcined powder mixture.

[0086] The total purity of the ceramic sintered body disclosed herein may be greater than 99.99%, preferably greater than 99.995%, based on 100% purity of the ceramic sintered body. In embodiments where zirconia media is used for mixing, the molar ratio of yttria to zirconia may be adjusted to account for media wear to achieve the final desired composition, and the purity of the ceramic sintered components may be maintained from the purity of the ceramic sintered body and associated starting materials.

[0087] Preparation method The preparation of sintered ceramic bodies can be carried out using pressure-assisted sintering in combination with DC sintering and related techniques, which use direct current to heat an electrically conductive die arrangement or tool set, thereby sintering the material. This heating regime allows for very high heating and cooling rates to be applied, enhancing densification mechanisms over diffusion mechanisms that drive grain growth, facilitating the preparation of very fine grain size sintered ceramic bodies, and transferring the inherent properties of the original powders to their nearly or fully dense products.

[0088] The sintered ceramic body is prepared by a method including the steps of: a. combining yttrium oxide and zirconium oxide powders to create a powder mixture; b. sintering the powder mixture by applying heat to raise the temperature of the powder mixture to a sintering temperature and maintaining the sintering temperature to form a sintered powder mixture; c. placing the sintered powder mixture within a volume defined by a sintering apparatus toolset to create a vacuum within the volume; d. applying pressure to the sintered powder mixture while heating to the sintering temperature to sinter to form a sintered ceramic body; and e. reducing the temperature of the sintered ceramic body. The following additional method steps are optional: f. Optionally, annealing the ceramic sintered body by applying heat to increase the temperature of the ceramic sintered body to reach an annealing temperature to form an annealed ceramic sintered body; g. Decreasing the temperature of the annealed ceramic sintered body; and h. Optionally, machining the ceramic sintered body to form (and in embodiments may be annealed) ceramic sintered body components such as windows, RF windows, lids, focus rings, shield rings, nozzles, gas injectors, showerheads, gas distribution plates, chamber liners, chucks, electrostatic chucks, pucks, and / or cover rings in plasma processing chambers. Ceramic sintered body component embodiments including windows, RF windows, or lids may be construed as equivalent to those disclosed herein.

[0089] The characteristics of the corrosion-resistant ceramic sintered body component formed from the ceramic sintered body are achieved in particular by adapting the purity of the starting powders of yttrium oxide and zirconium oxide as well as the purity of the powder mixture, the pressure on the fired powder mixture (of yttrium oxide and zirconium oxide), the sintering temperature, the sintering duration, the temperature of the ceramic sintered body / ceramic sintered body component during the optional annealing step, and the duration of the optional annealing step.

[0090] The methods disclosed herein provide for the preparation of ceramic sintered bodies and / or ceramic sintered body components over a composition range of from 75 mol% to 95 mol% yttrium oxide (YO) and from 5 mol% to 25 mol% zirconium oxide (ZrO).

[0091] The characteristics of the ceramic sintered body and ceramic sintered body components according to one embodiment are achieved, among others, by the starting powder particle size distribution (PSD), specific surface area (SSA), purity (measured by inductively coupled mass spectrometry (ICP-MS)), as well as the method of powder mixing / combining and sintering the powder mixture, the particle size and surface area of ​​the sintered powder mixture, the pressure on the sintered powder mixture, the sintering temperature of the powder mixture, the duration of sintering the powder mixture, the temperature of the ceramic sintered body or component during the optional annealing step, and the duration of the optional annealing step. The disclosed process provides for the preparation of single-phase cubic, c-type yttria (C), or mixed-phase cubic (phases of c-type yttria and fluorite (F) crystal structure) ceramic sintered bodies containing yttrium oxide and zirconium oxide with high purity, low volume porosity, and high density. The ceramic sintered bodies can be suitably used as ceramic sintered bodies or corrosion-resistant members, especially in plasma processing equipment such as semiconductor manufacturing equipment. Such parts or components can include windows, lids, nozzles, injectors, showerheads, chamber liners, wafer supports, electronic wafer chucks, and various rings known to those skilled in the art, such as focus rings and guard rings.

[0092] Step a) of the method disclosed herein includes combining powders including yttrium oxide and zirconium oxide to create a powder mixture. The starting materials of yttrium oxide and zirconium oxide for forming the ceramic sintered body and / or component are preferably commercially available powders of high purity. However, other oxide powders, such as those produced from chemical synthesis processes and related methods, may be used. The zirconium oxide starting powder may include at least one selected from the group consisting of unstabilized zirconia, partially stabilized zirconia, and stabilized zirconia. Yttria is known to be added as a stabilizer for zirconia, and therefore, in some embodiments, yttria may be preferred as a zirconia stabilizer for providing a high purity ceramic sintered body including Y, Zr, and O as disclosed herein, although other known stabilizers for zirconia may be used.

[0093] In step a), the ceramic powders of yttrium oxide and zirconium oxide are batched according to the desired molar ratio of yttria and zirconia in the ceramic sintered body. The ceramic sintered body may be formed from a powder mixture having a molar range of 75 mol% to 95 mol% of yttrium oxide (YO) and 5 mol% to 25 mol% of zirconium oxide (ZrO). The purity of the yttria powder may be greater than 99.9%, preferably greater than 99.99%, preferably greater than 99.999%, preferably about 99.9999%, and the purity of the zirconia powder may be greater than 99.95%, preferably greater than 99.99%, preferably greater than 99.995%, as measured by inductively coupled mass spectrometry (ICP-MS) using an Agilent 7900 ICP-MS model G8403. Using the ICPMS disclosed herein, the reporting limit for detecting the presence of lighter elements such as Sc and lighter elements is generally about 1.4 ppm or less, higher than the reporting limit for heavier elements, which may be about 0.14 ppm or less. In particular, the use of the ICPMS method disclosed herein to detect Si can be performed within a confidence level of about 14 ppm or more. Thus, the starting powders, powder mixtures, calcined powder mixtures and sintered ceramic bodies can contain silica in an amount of about 14 ppm or less. Although Si in the form of silica is not included in the % purity or impurity content of the starting powders, calcined powder mixtures and sintered ceramic bodies disclosed herein and can be considered to be about 14 ppm or less, Si has often gone undetected.

[0094] Table 4 lists the impurities / contaminants (ppm) and % purity (relative to 100% purity) measured using ICP-MS for exemplary 80 mol% yttria / 20 mol% zirconia calcined powder mixtures 1-7 made from the disclosed mixtures of yttria and zirconia starting materials (Hf is not included in the results as an impurity for reasons disclosed herein, and silica was not typically detected but may be detectable in amounts up to 14 ppm).

[0095] The zirconium oxide starting material typically comprises zirconium, HfO2 and impurities. In one embodiment, the starting material may comprise greater than 94 wt. % zirconium oxide, less than 5 wt. % HfO2, and less than 0.1 wt. % impurities, or greater than 96 wt. % zirconium oxide, less than 3 wt. % HfO2, and less than 0.05 wt. % impurities. In a further embodiment, excluding impurities, the zirconium oxide starting material consists of greater than 94 wt. % zirconium oxide, less than 5 wt. % HfO2, or greater than 96 wt. % zirconium oxide, less than 3 wt. % HfO2, with the total amount of impurities being less than 0.1 wt. %, preferably less than 0.05 wt. %, and more preferably less than 0.02 wt. %.

[0096] The impurities may typically include metallic elements such as Al, B, Ca, Cr, Co, Cu, Fe, Pb, Li, Mg, Mn, Ni, K, Na, Sn, and Zn, as well as their respective metal oxides.

[0097] [Table 4]

[0098] For most samples, the specific surface areas of the starting powders, powder mixtures, and calcined powder mixtures were measured in the range of 0.01 to 2000 m 2 The particle sizes of the starting powders, powder mixtures, and calcined powder mixtures were measured using a Horiba BET Surface Area Analyzer model SA-9601, which can measure to within 10% accuracy over a specific surface area of ​​100 nm / g. The particle sizes of the starting powders, powder mixtures, and calcined powder mixtures were measured using a Horiba model LA-960 Laser Scattering Particle Size Distribution Analyzer, which can measure particle sizes from 10 nm to 5 mm. As used herein, d50 is defined as the median and represents the value where half of the particle size distribution is above this point and half is below this point. Similarly, 90% of the distribution is below d90 and 10% of the distribution is below d10.

[0099] Typical surface areas of yttrium oxide powder are between 1 and 15 m2 / g, preferably 2 to 10m 2 / g, preferably 2 to 8 m 2 / g, preferably 2 to 6m 2 / g, preferably 3 to 10m 2 / g, preferably 4 to 10m 2 / g, preferably 6 to 10m 2 / g, preferably 2 to 4 m 2 / g.

[0100] The d10 particle size of the yttrium oxide powder used as starting material according to one embodiment of the present invention is preferably 1-6 μm, preferably 1-5 μm, preferably 1-4 μm, preferably 2-6 μm, preferably 3-6 μm, preferably 4-6 μm, preferably 2-4 μm.

[0101] The d50 particle size of the yttrium oxide powder used as a starting material according to one embodiment of the present invention is preferably 3-9 μm, preferably 3-8.5 μm, preferably 3-8 μm, preferably 3-7 μm, preferably 4-9 μm, preferably 5-9 μm, preferably 6-9 μm, preferably 4-8 μm. The yttria powder disclosed herein may have an average particle size of about 5-9 μm.

[0102] The d90 particle size of the yttrium oxide powder used as starting material according to one embodiment of the present invention is preferably 6-16 μm, preferably 6-15 μm, preferably 6-14 μm, preferably 6.5-16 μm, preferably 7-16 μm, preferably 7.5-16 μm, preferably 7.5-14 μm.

[0103] The purity of the yttrium oxide starting material is preferably greater than 99.99%, preferably greater than 99.995%, more preferably greater than 99.999%, more preferably greater than 99.9995%, more preferably greater than about 99.9999%, which corresponds to an impurity level of 100 ppm or less, preferably 50 ppm or less, preferably 25 ppm or less, preferably 10 ppm or less, more preferably about 1 ppm, preferably 1-100 ppm, preferably 1-50 ppm, preferably 1-25 ppm, preferably 1-10 ppm, preferably 1-5 ppm.

[0104] Zirconia as used herein typically contains Hf in the form of HfO2 in amounts of about 2-5 mol%, up to 5 wt%, as is common in many commercially available zirconia powders. Hf is not considered an impurity as disclosed herein due to its chemically similar behavior to zirconia, and therefore is not included in the purity / impurity amounts. Zirconia powders typically have a pH of 1-16. 2 / g, preferably 2 to 12 m 2 / g, and more preferably 4 to 9 m 2 The zirconia starting powder has a specific surface area of ​​100% / g. The purity of the zirconia starting powder is typically greater than 99.5%, preferably greater than 99.8%, preferably greater than 99.9%, preferably greater than 99.99%, more preferably greater than 99.995%, relative to 100% purity. This corresponds to a total impurity content of 5000 ppm or less, preferably 2000 ppm or less, preferably 1000 ppm or less, preferably 100 ppm or less, and more preferably 50 ppm or less.

[0105] The zirconium oxide powder may have a particle size distribution with a d10 of 0.08 to 0.50 μm, a d50 of 0.5 to 0.9 μm, and a d90 of 0.9 to 5 μm.

[0106] The starting powders of zirconia and yttria disclosed herein are preferably crystalline, thereby having long-range crystallographic order. 2Starting powders with high surface areas, such as greater than about 18 m / g, present handling problems. Thus, the powder mixtures and / or calcined powder mixtures disclosed herein are free or substantially free of nanopowder and have a surface area of ​​about 18 m / g. 2 It is preferred that the specific surface area (SSA) is 0.1 to 1.0 μm / g or less.

[0107] Approximately 1m 2 Starting powders with specific surface areas less than 1 to 18 m / g may suffer from agglomeration, require higher energy and longer mixing times for mixing, and may reduce the sintering activation energy, thus producing ceramic sintered bodies with lower density and higher porosity. Preferred for use in the disclosed method are typically powders with specific surface areas between 1 and 18 m / g. 2 / g, preferably 2 to 15m 2 / g of SSA.

[0108] According to step a), the selected ceramic powders of yttria and zirconia may be combined using powder preparation techniques known to those skilled in the art, such as wet or dry ball (axial) milling, wet or dry tumbling (end-over-end or vertical) mixing, jet milling, and combinations thereof. The use of these powder combination methods provides a high energy process that breaks down particulates and agglomerates.

[0109] Using dry conditions, the starting powders may be ball milled or end-over-end / tumbling mixed using high purity (>99.9%) alumina media. In other embodiments, zirconia media may be used to break down hard agglomerates. Ball milling may be accomplished using zirconia media as an example and may be performed according to methods known to those skilled in the art. In embodiments where zirconia media is used for mixing, the molar ratio of yttria to zirconia may be adjusted to account for media attrition to achieve the final desired composition, and the purity of the ceramic sintered components may be very close to or maintained from the purity of the ceramic sintered body and associated starting materials. In other examples, aluminum oxide media may be used. In embodiments where alumina media is used for mixing, alumina may be present in trace amounts in the ceramic sintered body. Media used to perform dry ball milling may have dimensions ranging from, for example, 5 to 15 mm in diameter and are added at a loading of about 50 to about 100% by powder weight. The media used to perform the dry tumbling mixing may include, but is not limited to, at least one media element of large size (diameter about 20-40 mm). Dry ball milling and / or dry tumbling mixing may be performed for a period of 12-48 hours, preferably 16-48 hours, preferably 16-24 hours, preferably 18-22 hours. The dry ball milling or tumbling mill process (axial rotation) may use an RPM (revolutions per minute) of 50-250 RPM, preferably 75-200 RPM, preferably 75-150 RPM, preferably 100-125 RPM, each with a vessel having a diameter of about 200 mm. The RPM may vary depending on the size of the vessel selected for use, e.g., one with a diameter larger than 200 mm may have a correspondingly lower RPM, as known to those skilled in the art. Dry end-over-end / tumbling mixing may be performed at an RPM of 10-30 rpm, preferably about 20. After dry ball milling and / or dry end-over-end / mixing, the powder mixture may be sieved and blended as necessary using any number of meshes that may have openings, for example, between 45 and 400 μm, without any limitation as to repetition or sequence, as known to those skilled in the art.

[0110] Wet ball milling or wet end-over-end / tumbling mixing can be done by suspending the starting powders in various solvents such as ethanol, methanol, and other alcohols to form a slurry. The slurry in either process can be formed during milling or mixing with a powder loading of 25-75% by powder weight, preferably 40-75% by powder weight, and preferably 50-75% by powder weight. Wet ball milling or wet end-over-end / tumbling mixing can result in improved dispersion of the powders due to increased mobility, resulting in a fine scale homogenous mix prior to heat treatment or calcination. In other embodiments, wet mixing can be done using liquids such as water, ethanol, isopropanol, etc., 25-50% by powder weight, or a medium, 25-150% by powder weight, can be added to the powder mix to form a slurry. The wet milling process can be done for the same duration and RPM as those disclosed for the dry process.

[0111] If a wet mixing or milling process is used, the slurry can be dried by rotary evaporation, for example at a temperature of about 40° C. to 90° C. for 1 to 4 hours, depending on the volume of the slurry to be dried, as known to those skilled in the art. In other embodiments, the slurry can be dried using spray drying techniques known to those skilled in the art. After drying, the powder mixture may be sieved and blended as necessary, for example, using a mesh having openings of 45 to 400 μm, without any limitation with respect to repetition or sequence. The aforementioned powder preparation techniques may be used alone or in any combination thereof.

[0112] After drying, the powder mixture of step a) is mixed with 2 to 18 ml 2 / g, preferably 2 to 17 m2 / g, 2 to 14 m 2 / g, preferably 2 to 12 m 2 / g, 2-10m 2 / g, preferably 4 to 17m 2 / g, 6-17m 2 / g, preferably 8 to 17m 2 / g, preferably 10 to 17m 2 / g, 4~12m 2 / g, preferably 4 to 10m 2 / g, preferably 5 to 8 m 2 / g specific surface area (SSA).

[0113] The purity of the powder mixture can be maintained from that of the starting materials after mixing / milling by using high purity grinding media, for example aluminum oxide media of 99.99% purity or greater.

[0114] Additional powder preparation procedures such as grinding, high shear mixing, planetary milling, and other known procedures may also be applied. The above mentioned powder preparation techniques may be used alone or in any combination thereof, or for mixtures of two or more powders that are subsequently combined into the final sintered ceramic body.

[0115] Step b) of the method disclosed herein involves calcining the powder mixture by heating to raise the temperature of the powder mixture to a calcination temperature and maintaining the calcination temperature to form a calcined powder mixture. This step can be performed such that moisture can be removed and the surface condition of the powder mixture is uniform and homogeneous before sintering. Calcination by heat treatment step can be performed at a temperature of 600°C to 1200°C, preferably 600°C to 1100°C, preferably 600°C to 1000°C, preferably 600°C to 900°C, preferably 700°C to 1100°C, preferably 800°C to 1100°C, preferably 800°C to 1000°C, preferably 850°C to 950°C. Calcination can be performed in an oxygen-containing environment for a duration of 4 to 12 hours, preferably 4 to 10 hours, preferably 4 to 8 hours, preferably 6 to 12 hours, preferably 4 to 6 hours. After calcination, the powder mixture may be sieved and / or tumbled and / or blended according to known methods to form at least a first and a second calcined powder mixture. Calcination may or may not result in a reduction in the specific surface area.

[0116] The calcined powder mixture typically has a d10 particle size of 0.1-4 μm, a d50 particle size of 4-8 μm, and a d90 particle size of 8-12 μm.

[0117] The calcined powder mixture typically has a surface area of ​​2 to 14 m2 / g, preferably 2 to 12 m2 / g, as measured according to ASTM C1274. 2 / g, preferably 2 to 10 m2 / g, preferably 2 to 8 m2 / g, preferably 2 to 6 m2 / g, preferably 2.5 to 10 m2 / g, preferably 3 to 10 m2 / g, preferably 4 to 10 m2 / g, and more preferably 2 to 6 m2 / g.

[0118] The calcined powder mixture typically has a purity of 99.99% to 99.9995%, preferably 99.9925% to 99.9995%, preferably 99.995% to 99.9995%, preferably 99.995% to 99.999%, each relative to 100% purity, and an impurity content (ppm) of 5 ppm to 100 ppm, preferably 75 ppm to 5 ppm, preferably 50 ppm to 5 ppm, preferably 10 ppm to 50 ppm, as measured using an ICPMS method. The impurity content disclosed herein does not include Hf in the form of HfO2 and Si in the form of silicon dioxide SiO2. Using the disclosed ICPMS method, silica can be detected in an amount of about 14 ppm or less. Since no silica was detected in the calcined powder mixture, silica can be present in an amount of about 14 ppm or less.

[0119] In addition to the powder combining process described above, a jet milling process, as known to those skilled in the art, can also be used to thoroughly mix the starting powders and / or the calcined powder mixture to provide a powder or powder mixture with a narrow particle size distribution. Jet milling uses high velocity jets of either inert gas or air to collide particles of the starting powders and / or the powder mixture and / or the calcined powder mixture without the use of milling or mixing media, thus maintaining the initial purity of the powder being milled. The chamber can be designed to allow larger particles to be preferentially reduced in size, providing a narrow particle size distribution in the final powder, powder mixture or calcined powder mixture. Upon reaching the desired particle size, as determined by the machine settings prior to processing, the powder exits the jet milling chamber. The starting powders, powder mixtures and / or calcined powder mixtures disclosed herein may be subjected to jet milling at a pressure of about 100 psi, as disclosed herein, separately as the powder grinding / mixing processes disclosed, or in any combination thereof, or all of them. After jet milling, the powder and / or powder mixture may optionally be sieved and blended using any number of meshes, e.g., having openings of 45-400 μm, without any restrictions on the number of repetitions or order. Either the starting powder, the powder mixture, and / or the calcined powder mixture may optionally be blended and / or dry milled using any number of meshes, e.g., having openings of 45-400 μm, in various process steps according to known methods, without any restrictions on the number of repetitions or order.

[0120] Step c) of the method disclosed herein includes placing the sintered powder mixture in a volume defined by a tool set of a sintering apparatus to create a vacuum condition in the volume. The sintering apparatus used in the process according to an embodiment includes a tool set including at least a graphite die, which is typically a cylindrical graphite die having a volume, an inner wall, a first and a second opening, and a first and a second punch. The first and the second punches are operatively coupled to the die, each of the first and the second punches having an outer wall defining a diameter smaller than the diameter of the inner wall of the die, thereby forming a gap between each of the first and the second punches and the inner wall of the die when at least one of the first and the second punches moves within the volume of the die. As disclosed in U.S. Provisional Patent Application No. 63 / 124,547 (incorporated herein by reference in its entirety), the tool set disclosed herein has a gap of 10 μm to 100 μm, the gap being configured between the inner wall of the die and the outer wall of each of the first and the second punches. SPS equipment and procedures are disclosed, for example, in U.S. Patent Application Publication No. 2010 / 0156008(A1), which is incorporated herein by reference. A first punch is moved into a first opening of the die, the sintered powder mixture is placed into a second opening of the die, and a second punch is moved into a second opening of the die, thereby placing the sintered powder mixture into a volume defined by the toolset of the sintering apparatus. Vacuum conditions known to those skilled in the art are established in the volume defined by the toolset. Exemplary vacuum conditions include vacuum conditions of 10 -2 ~10 -3 Pressures include, for example, pressures of 1000 torr and below. A vacuum is applied primarily to remove the air to protect the graphite from burning and to remove most of the air from the sintered powder mixture. The method disclosed herein provides a manufacturing process for sintered ceramic bodies and / or sintered ceramic components that is scalable and compatible with commercial manufacturing methods. The method utilizes powders with micron-sized average particle size distribution that are commercially available powders and / or prepared from chemical synthesis techniques without the need for sintering aids, cold pressing, shaping or machining of the green body prior to sintering.

[0121] The disclosed methods utilize commercially available powders or powders prepared from chemical synthesis techniques without the need for polymeric additives such as binders or deflocculants, sintering aids, cold pressing, molding or machining of the green body prior to sintering.

[0122] Step d) of the method disclosed herein includes applying pressure to the sintered powder mixture while heating to a sintering temperature to perform sintering to form a ceramic sintered body, and step e) includes reducing the temperature of the ceramic sintered body by removing the heat source to the sintering apparatus and cooling the ceramic sintered body. After placing the sintered powder mixture in the volume defined by the tool set, pressure is applied to the powder mixture. Thereby, the pressure is increased to a pressure of 5 MPa to 60 MPa, preferably 5 MPa to 40 MPa, preferably 5 MPa to 30 MPa, preferably 5 MPa to 20 MPa, preferably 5 MPa to 10 MPa, preferably 10 MPa to 60 MPa, preferably 10 MPa to 40 MPa, preferably 10 MPa to 30 MPa, preferably 10 MPa to 20 MPa, preferably 15 MPa to 60 MPa, preferably 15 MPa to 40 MPa, preferably 15 MPa to 30 MPa, preferably 15 MPa to 25 MPa, preferably 15 to 20 MPa. Pressure is applied axially to the sintered powder mixture placed in the volume defined by the tool set of the sintering apparatus.

[0123] In a preferred embodiment, the powder mixture is directly heated by the punch and die of the sintering apparatus. The die may be constructed of a conductive material such as graphite to facilitate resistive / joule heating. Sintering apparatus and procedures are disclosed in U.S. Patent Application Publication No. 2010 / 0156008(A1), which is incorporated herein by reference.

[0124] The calcined powder mixture (including yttria and alumina) is sintered under pressure to produce a co-compressed, single sintered ceramic body. According to the disclosed method, the calcined powder mixture is sintered in situ to form a sintered ceramic body including the yttria and zirconia compositions disclosed herein.

[0125] The temperatures of the sintering apparatus according to the present disclosure are typically measured in the graphite die of the apparatus, and therefore are preferably measured as close as possible to the calcined powder being processed so that the indicated temperatures are actually realized in the calcined powder mixture as it is sintered.

[0126] The application of heat to the powder mixture fed into the die facilitates a sintering temperature of about 1200 to about 1700°C, preferably about 1200 to about 1650°C, preferably about 1200 to about 1625°C, preferably about 1300 to about 1700°C, preferably about 1400 to about 1700°C, preferably about 1500 to about 1700°C, preferably about 1400 to about 1650°C, preferably about 1500 to 1650°C, preferably about 1550 to 1650°C, and more preferably about 1600 to 1650°C.

[0127] Sintering can typically be achieved with sintering times of 0.5-180 minutes, preferably 0.5-120 minutes, preferably 0.5-100 minutes, preferably 0.5-80 minutes, preferably 0.5-60 minutes, preferably 0.5-40 minutes, preferably 0.5-20 minutes, preferably 5-120 minutes, preferably 10-120 minutes, preferably 20-120 minutes, preferably 40-120 minutes, preferably 60-120 minutes, preferably 30-120 minutes, preferably 30-90 minutes. In certain embodiments, sintering can be performed without a sintering time, and once the sintering temperature is reached, cooling is initiated at a rate disclosed herein. In step e) of the process, the sintered ceramic body is passively cooled by removal of the heat source. Natural convection can occur until a temperature is reached at which the sintered ceramic body can be easily handled and the optional annealing process can be initiated.

[0128] During sintering, a volume reduction typically occurs, so that the sintered ceramic body may have a volume that is approximately one-third the volume of the starting powder mixture when placed into the sintering apparatus tool set.

[0129] In one embodiment, the order of application of pressure and temperature may be varied according to the present disclosure, meaning that it is possible to apply the indicated pressure first, followed by application of heat to reach the desired temperature. Furthermore, in other embodiments, it is also possible to first apply the indicated heating to reach the desired temperature, followed by application of the indicated pressure. In a third embodiment according to the present disclosure, temperature and pressure may be applied simultaneously or intermittently to the powder mixture to be sintered, ramping up to the indicated values.

[0130] Induction or radiant heating methods can also be used to heat the sintering apparatus to indirectly heat the powder mixture in the toolset.

[0131] In contrast to other sintering techniques, pre-sintered sample preparation, i.e. by cold pressing or molding of a pre-sintered green body (preform), is not required, but the fired powder mixture is directly loaded into a mold. This preparation method provides high purity in the final ceramic sintered body by avoiding the contamination associated with forming and handling pre-sintered green bodies, laminates or tapes as commonly associated with other methods.

[0132] In further contrast to other sintering techniques, sintering aids are not required. For optimal plasma resistance performance, high purity starting powders are desirable. The absence of sintering aids and the use of high purity starting materials with purities of 99.99% to about 99.9999% allow for the production of high purity ceramic sintered bodies that provide improved plasma resistance for use as ceramic sintered components in semiconductor etching and deposition chambers. The purity of the ceramic sintered bodies may be 99.99% or more, preferably 99.995% or more, and more preferably 99.999%, respectively, relative to 100% purity. These reported purities do not include silica in the form of SiO2, or Hf in the form of HfO2. Silicon dioxide (SiO2) can be measured down to 14 ppm using the disclosed ICPMS method, and hafnium oxide (HfO2) is not harmful for use in plasma processing chambers and is therefore not considered an impurity or contaminant.

[0133] In one embodiment of the present invention, process step d) may further comprise a pre-sintering step with at least one heating gradient of 0.1° C. / min-100° C. / min, 0.1° C. / min-50° C. / min, 0.1° C. / min-25° C. / min, preferably 0.5° C. / min-50° C. / min, preferably 0.5-25° C. / min, preferably 0.5-10° C. / min, preferably 0.5° C. / min-5° C. / min, preferably 1-10° C. / min, preferably 1-5° C. / min, preferably 2-5° C. / min, until a specific pre-sintering time is reached.

[0134] In a further embodiment of the present invention, process step d) may further comprise a pre-sintering step with at least one pressure gradient of 0.15-30 MPa / min, 0.15-20 MPa / min, 0.15-10 MPa / min, 0.15-5 MPa / min, 0.25-20 MPa / min, 0.35 MPa / min-20 MPa / min, 0.5 MPa / min-20 MPa / min, 0.75 MPa / min-20 MPa / min, 1 MPa / min-20 MPa / min, 5 MPa / min-20 MPa / min, preferably 0.15-5 MPa / min, preferably 0.15-1 MPa / min, preferably 0.15-0.5 MPa / min until a specific pre-sintering time is reached.

[0135] In another embodiment, process step d) may further comprise a pre-sintering step using the specific heating gradient mentioned above and the specific pressure gradient mentioned above.

[0136] In an embodiment, at the end of process step d), the method may further comprise step e) of reducing the temperature of the ceramic sintered body by removing the heat source cooling of the ceramic sintered body, which may be carried out according to natural cooling (non-forced cooling) of the process chamber under vacuum conditions, as known to those skilled in the art. In a further embodiment according to process step e), the ceramic sintered body may be cooled under convection of an inert gas, for example argon or nitrogen at 1 bar or any inert gas. Other gas pressures above or below 1 bar may also be used. In a further embodiment, the ceramic sintered body is cooled under forced convection conditions in an oxygen-containing environment. To start the cooling step, at the end of sintering step d), the power applied to the sintering device is removed and the pressure applied to the ceramic sintered body is removed, after which the cooling is carried out according to step e).

[0137] Step f) of the method disclosed herein optionally comprises annealing the ceramic sintered body (or in embodiments, optionally annealing the sintered ceramic component) by applying heat to increase the temperature of the ceramic sintered body to reach the annealing temperature, and step g) comprises lowering the temperature of the annealed ceramic sintered body. In optional step f), the obtained ceramic sintered body or ceramic sintered component of step d) or h), respectively, may be subjected to an annealing procedure (annealing may also be referred to herein as "thermal oxidation", and these terms are to be interpreted as having the same meaning). Typically, annealing is performed in an oxygen-containing environment, such as air or forced convection. In other examples, the ceramic sintered body or component may not be annealed. According to other embodiments, annealing may be performed without removal, in an external furnace upon removal from the sintering device, or within the sintering device itself.

[0138] For the purpose of annealing according to a preferred embodiment of the present disclosure, the ceramic sintered body may be removed from the sintering apparatus after cooling according to process step e, and the process step of annealing may be carried out in a separate apparatus, such as a furnace.

[0139] In some embodiments, for the purposes of annealing according to the present disclosure, the ceramic sintered body in step d) may be annealed subsequently in the sintering apparatus without the need to remove it from the sintering apparatus between the sintering step d) and the optional annealing step f).

[0140] This annealing can improve the chemical and physical properties of the sintered body, the annealing step can be carried out by conventional methods used for annealing glasses, ceramics, and metals, and the degree of improvement can be selected by the selection of the annealing temperature and the duration for which the annealing is continued.

[0141] In an embodiment, the optional step f) of annealing the sintered ceramic body is carried out at a heating rate of 0.5° C. / min to 20° C. / min, preferably 0.5° C. / min to 25° C. / min, more preferably 0.5° C. / min to 10° C. / min, more preferably 0.5° C. / min to 5° C. / min, more preferably 1° C. / min to 50° C. / min, more preferably 3° C. / min to 50° C. / min, more preferably 5° C. / min to 50° C. / min, more preferably 25° C. / min to 50° C. / min, preferably 1° C. / min to 10° C. / min, preferably 2° C. / min to 10° C. / min, preferably 2° C. / min to 5° C. / min.

[0142] In an embodiment, the optional step f) of annealing the sintered ceramic body is carried out at a temperature of about 900 to about 1600°C, preferably about 1100 to about 1600°C, preferably about 1300 to about 1600°C, preferably about 900 to about 1500°C, preferably about 900 to about 1400°C, preferably about 1400 to about 1600°C.

[0143] In an embodiment, the optional step f) of annealing the sintered ceramic body is carried out at a cooling rate of 0.5° C. / min to 20° C. / min, preferably 0.5° C. / min to 25° C. / min, more preferably 0.5° C. / min to 10° C. / min, more preferably 0.5° C. / min to 5° C. / min, more preferably 1° C. / min to 50° C. / min, more preferably 3° C. / min to 50° C. / min, more preferably 5° C. / min to 50° C. / min, more preferably 25° C. / min to 50° C. / min, preferably 1° C. / min to 10° C. / min, preferably 2° C. / min to 10° C. / min, preferably 2° C. / min to 5° C. / min.

[0144] The optional annealing step f) is intended to modify the oxygen vacancies in the crystal structure and return the ceramic sintered body to the stoichiometric ratio (current and pressure assisted methods as disclosed can typically produce reduced, oxygen deficient ceramic sintered bodies). The optional annealing step can be carried out at the annealing temperature for a duration of 1-24 hours, preferably 1-18 hours, preferably 1-16 hours, preferably 1-8 hours, preferably 4-24 hours, preferably 8-24 hours, preferably 12-24 hours, preferably 4-12 hours, and preferably 6-10 hours.

[0145] Typically, the optional process step f) of annealing the ceramic sintered body is carried out in an oxidizing atmosphere, whereby the annealing process increases the albedo, reduces stress, improves mechanical handling, and reduces porosity. The optional annealing step may, in embodiments, be carried out in an oxidizing environment, such as air or forced convection.

[0146] After the optional process step f of annealing the ceramic sintered body, the temperature of the sintered, and in some cases annealed, ceramic sintered body is reduced to ambient temperature according to process step g) (ambient as used herein means a temperature of about 22°C to about 25°C) and the sintered and optionally annealed ceramic body is removed from the furnace (if the annealing step is performed outside the sintering machine) or removed from the tool set (if the annealing step f is performed within the sintering machine).

[0147] The pressure and current assisted process according to one embodiment described above is suitable for use in the preparation of large yttria-zirconia ceramic sintered bodies. The disclosed process provides rapid powder consolidation and densification, retaining maximum grain size of less than 8 μm in the sintered ceramic body, achieving high density of greater than 98% of theoretical and volume porosity of less than 2%. High density (greater than 98%) combined with fine grain size (less than 8 μm) improves handling and reduces overall stress in the sintered ceramic body. This combination of fine grain size and high density provides high strength yttria-zirconia ceramic sintered bodies of large size suitable for machining, handling and use as components in semiconductor processing chambers.

[0148] Step h) of the method disclosed herein optionally includes machining the ceramic sintered body, or in some embodiments, machining the ceramic sintered body after the optional annealing process to form ceramic sintered components such as windows, RF windows, lids, focus rings, shield rings, nozzles, gas injectors, showerheads, gas distribution plates, chamber liners, electrostatic chucks, pucks, and / or cover rings in plasma processing chambers, which may be performed according to known methods for machining corrosion-resistant ceramic parts from the ceramic sintered bodies disclosed herein. The corrosion-resistant ceramic sintered components required for semiconductor etching and deposition chambers may include RF or dielectric windows, nozzles and / or injectors, showerheads, gas distribution assemblies, chamber liners, wafer supports, electronic wafer chucks, and various rings such as focus rings, process rings, shield or guard rings, among other components known to those skilled in the art. Machining, drilling, grinding, lapping, polishing, etc., known to those skilled in the art, may be performed as necessary according to known methods to form the multilayer sintered ceramic body into a predetermined shape of a yttria-zirconia ceramic sintered component for use in a plasma processing chamber. At least one surface of the ceramic sintered body may be polished by the following method (polishing articles provided by Struers, Inc.) (Strasbaugh polishing machine): (i) 40 um alumina: to planarize the surface as needed; (ii) 12 um alumina, fixed abrasive pad: 2 minutes; (iii) 9 pm diamond, polyurethane pad: 8 minutes; (iv) 6 μm diamond, raised cloth: 3 minutes; and (v) 1 μm diamond, raised cloth: 3 minutes. More specifically, at least one surface configured to face the interior of the reactor-chamber may be polished to a very low surface roughness according to the disclosed method.

[0149] Thus, the surface roughness of sintered ceramic bodies can be correlated to particulate generation in the process chamber. It is therefore generally beneficial to have reduced surface roughness. Surface roughness measurements were performed using a Keyence 3D laser scanning confocal digital microscope model VK-X250X. ISO 25178 Surface Texture (Areal Roughness measurement) is a set of international standards for the analysis of surface roughness that this microscope adheres to.

[0150] Detailed images of the samples were taken by laser scanning the surface of the samples at 50x magnification using a confocal microscope. The parameters Sa (arithmetic mean height) and Sz (maximum height / peak-valley) were measured for the sintered ceramic bodies. Sa represents the average roughness value calculated over a user-defined area of ​​the surface of the sintered ceramic body. Sz represents the maximum peak-valley distance over a user-defined area of ​​the surface of the sintered ceramic body. Ra is defined as the arithmetic mean of the absolute value of the profile height deviation from the mean line recorded within the measurement length. Ra was measured according to ASME B46.1, giving values ​​of 20-45 nm over the polished surface of a 572 mm diameter sintered ceramic body.

[0151] The surface roughness characteristics Sa, Ra and Sz are parameters known in the underlying technical field and are described, for example, in ISO standard 25178-2-2012.

[0152] The present disclosure relates to a sintered ceramic body and / or a component made therefrom having a corrosion resistant polished surface providing an arithmetic mean height Sa of less than 90 nm, more preferably less than 70 nm, more preferably less than 50 nm, more preferably less than 25 nm, and preferably less than 15 nm, measured according to ISO standard 25178-2-2012.

[0153] The present disclosure relates to sintered ceramic bodies and / or components made therefrom having a corrosion resistant polished surface providing a peak-valley height Sz of less than 3.5 μm, preferably less than 2.5 μm, preferably less than 2 μm, preferably less than 1.5 μm, and more preferably less than 1 μm, measured according to ISO standard 25178-2-2012.

[0154] The ceramic sintered bodies / components made according to the methods disclosed herein may have sufficient mechanical properties to allow the manufacture of large body sizes for use in plasma processing chambers. The components disclosed herein may have sizes of 100 mm to 622 mm, preferably 100 to 575 mm, preferably 100 to 406 mm, preferably 150 to 622 mm, preferably 200 mm to 622 mm, preferably 300 to 622 mm, preferably 150 to 575 mm, preferably 150 to 406 mm, preferably 406 to 622 mm, preferably 500 to 622 mm, and more preferably 406 to 575 mm, preferably 450 to 622 mm, respectively, with respect to the longest extension of the sintered body. Typically, the yttria-zirconia ceramic sintered bodies disclosed herein have a disk shape, with the longest extension being the diameter.

[0155] The methods disclosed herein provide high purity, improved control over the amount of porosity, higher density, improved mechanical strength, which results in improved handleability of the corrosion-resistant ceramic sintered components, particularly for ceramic bodies measuring, for example, over 200 mm over their longest extension, and reduced oxygen vacancies in the lattice of the corrosion-resistant ceramic sintered components. Forming the sintered body directly from the fired powder mixture without the need for sintering aids provides yttria-zirconia ceramic sintered bodies that are free or substantially free of sintering aids as disclosed herein.

[0156] performance FIG. 2 shows X-ray diffraction results from a powder sintering study of an exemplary yttria-zirconia calcined powder mixture for a powder batch composition of 80 mol % yttria and 20 mol % zirconia. The exemplary powder mixture in FIG. 2a) was calcined at 800° C.-850° C. for 4-6 hours, while the exemplary powder mixture in FIG. 2b) was calcined at 850° C.-900° C. for 6-8 hours. In the XRD pattern in FIG. 2a), a tetragonal phase corresponding to zirconia and a c-type cubic phase corresponding to yttria were observed, indicating that the calcined powder mixture contained crystalline yttria and zirconia powders. FIG. 2b) also shows the crystalline phase in FIG. 2a), which further contains a small amount of a solid solution cubic phase of yttrium zirconium oxide observed at higher calcination temperatures and extended calcination times, indicating a reaction between yttria and zirconia. In some embodiments, a calcined powder mixture containing yttria and zirconia starting powders is preferred. Further embodiments may include starting powders of yttria and zirconia as the majority phase and a cubic phase of yttrium zirconium oxide as the minority phase. All X-ray diffraction (XRD) was performed using a PANanlytical Aeris model XRD, which allows crystalline phase identification to about + / - 2% by volume.

[0157] Calcination modifies and optimizes particle size distribution (PSD) and specific surface area (with respect to starting powders and / or calcined powder mixtures, surface area and specific surface area (SSA) are used interchangeably herein). Table 5 discloses the calcination conditions and resulting powder surface area and particle size distribution for the 80 mol% yttria and 20 mol% zirconia calcined powder mixtures disclosed herein.

[0158] [Table 5]

[0159] Calcination at temperatures above 1400°C may not be preferred due to the resulting low specific surface area (SSA) and very large particle size. Preferably, the calcined powder mixture has an SSA of 1.75 m2 / g or more, more preferably 2 m2 / g or more. A large particle size measured at 1400°C indicates particle agglomeration that may inhibit powder flowability and mixing. Therefore, calcination at temperatures below 1300°C is preferred, more preferably a calcination temperature of 600°C to 1200°C, preferably 600°C to 1100°C in an oxidizing environment. Any of the starting powders, powder mixtures, and calcined powder mixtures may be blended and / or dry milled, optionally in various process steps according to known methods, without any restriction on the number of repetitions or order, for example using any number of meshes that may have openings between 45 μm and 400 μm.

[0160] 3 shows an X-ray diffraction result of an exemplary yttria-zirconia ceramic sintered body having a composition of about 80 mole % yttria and about 20 mole % zirconia, sintered at a temperature of about 1500° C. for 30 minutes at a pressure of about 30 MPa according to the methods disclosed herein. The X-ray diffraction confirmed the presence of a cubic phase including at least one of fluorite and c-type yttria crystal structures.

[0161] 4 shows the X-ray diffraction results of the exemplary yttria-zirconia ceramic sintered body of FIG. 3 after annealing in an oxidizing environment at 1550° C. for 8 hours. The X-ray diffraction confirmed that there was no change in the crystalline phases present upon annealing from those of FIG. 3.

[0162] 5 shows X-ray diffraction results for exemplary yttria-zirconia ceramic sintered bodies over a range of annealing conditions from no annealing (A) to annealing temperatures of 1100° C. (B) to 1550° C. (C). The increase in peak height and decrease in peak width indicate increased crystallinity of the yttria-zirconia sintered bodies at higher annealing temperatures.

[0163] 6a)-d) show SEM micrographs at 5000x of exemplary sintered microstructures of yttria-zirconia sintered bodies disclosed herein. FIG. 6a) shows an exemplary microstructure after sintering at 1500°C and 30 MPa for 30 minutes. FIG. 6b) shows an exemplary microstructure after sintering according to a) and annealing at 1000°C for 8 hours. FIG. 6c) shows an exemplary microstructure after sintering according to a) and annealing at 1200°C for 8 hours, and FIG. 6d) shows an exemplary microstructure after sintering according to a) and annealing at 1400°C for 8 hours. No porosity is observed in the microstructure, indicating a very high density (>98.5% of theoretical).

[0164] In the SEM images of Figures 6a)-d) very small grain sizes can be observed. The grain sizes were measured according to the Heyn Linear Intercept Procedure described in the ASTM standard E112-2010 "Standard Test Method for Determining Average Grain Size". The maximum grain size may be less than 8 μm, preferably less than 5 μm, and preferably between 3 and 8 μm. Particle size measured in "μm" herein is defined as the grain size of 10 μm. -6 The mean grain size is measured to be less than 0.5-3 μm, preferably less than 0.5-2 μm, preferably 0.5-1 μm, and more preferably less than 0.4-2 μm. The SEM micrograph of FIG. 6a) (unannealed) was measured to have an average grain size of about 0.7 μm, while the micrograph of FIG. 6d) (annealed at 1400° C. for 8 hours) was measured to have a grain size very similar to that of FIG. 6a) with an average grain size of about 0.8 μm. These fine grain sizes provide yttria-zirconia ceramic sintered bodies with improved mechanical strength and resistance to microcracking and / or spalling during machining and during use as components in plasma processing chambers.

[0165] The combination of high density / low porosity, small grain size, and high purity of yttria-zirconia ceramic sintered bodies (and components made therefrom) offers advantages over other ceramic materials when used in semiconductor processing applications. These include improved resistance to the erosion and corrosion effects resulting from plasma etching and deposition processes (plasma resistance) and improved mechanical strength.

[0166] Embodiments disclosed herein include ceramic sintered bodies and components manufactured therefrom adapted for use in the exemplary semiconductor processing chamber shown in FIGS.

[0167] 7, an embodiment of the technology disclosed herein can include a semiconductor processing system 9500, also referred to as a processing system. The processing system 9500 can include a remote plasma region. The remote plasma region can include a plasma source 9502, also referred to as a remote plasma source ("RPS").

[0168] The processing system 9500, which may represent a capacitively coupled plasma processing apparatus, includes a vacuum chamber 9550 having a corrosion resistant chamber liner (not shown), a vacuum source, and a chuck 9508 supporting a wafer 50, also referred to as a semiconductor substrate. A cover ring 9514 and an upper shield ring 9512 surround the wafer 50 and a puck 9509. A window or lid 9507 forms the upper wall of the vacuum chamber 9550. The window / lid 9507, gas distribution system 9506, cover ring 9514, upper shield ring 9512, focus ring (not shown), chamber liner (not shown), and puck 9509 may be made entirely or partially from the ceramic sintered body embodiments disclosed herein, including 75 mol % to 95 mol % yttria, and 5 mol % to 25 mol % zirconia, and compositions within these ranges disclosed herein. The terms "window" and "lid" are construed to have the same meaning and are therefore used interchangeably herein. Embodiments of ring components, such as cover rings, shield rings, and process rings, may include any number of ring components known to those of skill in the art.

[0169] The remote plasma source 9502 is provided outside a window 9507 of a chamber 9550 that houses a wafer 50 to be processed. The remote plasma region may be in fluid communication with the vacuum chamber 9550 via a gas supply system 9506. In the chamber 9550, a capacitively coupled plasma may be generated by supplying a process gas to the chamber 9550 and a high frequency power to the plasma source 9502. The capacitively coupled plasma thus generated is used to perform a predetermined plasma process on the wafer 50. A planar antenna having a predetermined pattern is widely used as the high frequency antenna of the capacitively coupled processing system 9500.

[0170] As shown in the cross-sectional view of FIG. 8, another embodiment of the technology disclosed herein can include a semiconductor processing system 9600, also referred to as a processing system. The processing system 9600, which can represent an inductively coupled plasma processing apparatus, includes a vacuum chamber 9650, a vacuum source, and a chuck 9608 that supports a wafer 50, also referred to as a semiconductor substrate. A showerhead 9700 forms an upper wall of the vacuum chamber 9650 or is attached below the upper wall. The ceramic showerhead 9700 includes a gas plenum in fluid communication with a number of showerhead gas outlets for supplying process gases to the interior of the vacuum chamber 9650. The showerhead 9700 is in fluid communication with a gas supply system 9606. Additionally, the showerhead 9700 can include a central opening configured to receive a central gas injector 9714, also referred to as a nozzle. An RF energy source energizes the process gases into a plasma state to process the semiconductor substrate. The flow rate of process gas supplied by the central gas injector 9714 and the flow rate of process gas supplied by the ceramic showerhead can be controlled independently. The showerhead or gas distribution plate 9700, gas supply system 9606, and central gas injector 9714 can be made from the ceramic sintered body embodiments disclosed herein, including from 75 mol% to 95 mol% yttria, and from 5 mol% to 25 mol% zirconia, and compositions within these ranges disclosed herein.

[0171] The system 9600 may further include an electrostatic chuck 9608 designed to hold the wafer 50. The chuck 9608 may include a puck 9609 to support the wafer 50. The puck 9609 may be formed from a dielectric material and may have a chucking electrode encased within the puck proximate a support surface of the puck 9609 to electrostatically hold the wafer 50 when placed on the puck 9609. The chuck 9608 may include a base 9611 having a ring shape extending to support the puck 9609, and a shaft 9610 disposed between the base and the puck and supporting the puck above the base such that a gap is formed between the puck 9609 and the base 9610, the shaft 9610 supporting the puck proximate a periphery of the puck 9609. The chuck 9608 and puck 9609 can be made from the ceramic sintered body embodiments disclosed herein, including 75 to 95 mol % yttria, and 5 to 25 mol % zirconia, and compositions within these ranges disclosed herein. The chuck 9608 can include electrostatic chucks (ESCs) and other embodiments beyond those disclosed as known to one of ordinary skill in the art.

[0172] A portion of the surface of the showerhead 9700 may be covered with a shield ring 9712. A portion of the surface of the showerhead 9700, particularly the radial side of the surface of the showerhead 9700, may be covered with an upper shield ring 9710. The shield ring 9712 and the upper shield ring 9710 may be made from an embodiment of a ceramic sintered body disclosed herein, including from 75 mol% to 95 mol% yttria, and from 5 mol% to 25 mol% zirconia, and compositions within these ranges disclosed herein.

[0173] A portion of the support surface of the puck 9609 may be covered by a cover ring 9614. An additional portion of the surface of the puck 9609 may be covered by an upper shield ring 9612 and / or a shield ring 9613. The shield ring 9613, cover ring 9614 and upper shield ring 9612 may be made from embodiments of the ceramic sintered bodies disclosed herein, including those containing from 75 mol % to 95 mol % yttria, and from 5 mol % to 25 mol % zirconia, and compositions within these ranges disclosed herein.

[0174] The embodiments of the ceramic sintered body disclosed herein can be combined in any particular ceramic sintered body. Thus, two or more of the features disclosed herein can be combined to more specifically describe the ceramic sintered body, for example as outlined in the embodiments.

[0175] The inventors have determined that the above-described ceramic sintered bodies and related corrosion-resistant sintered components have improved behavior in etching and deposition processes as well as improved handling capabilities, and can be readily used as materials for the preparation of components for use in plasma processing chambers.

[0176] The yttria and zirconia materials used to date for plasma processing chamber parts suffer from the main problem of particulate generation under harsh etching and deposition conditions that contaminate the products being processed, as already mentioned above. Due to the inherently low mechanical strength of yttrium oxide and zirconium oxide, it is difficult to manufacture solid, phase-pure, high-strength parts of large dimensions (maximum dimensions or diameters between 200 mm and 622 mm) made from high-purity sintered bodies containing yttrium oxide and zirconium oxide that are free of defects, cracks, or microcracks (cracks that are not visually evident to the naked eye).

[0177] In contrast, the present technology provides a new concept for manufacturing corrosion resistant components for use in plasma processing chambers, focusing on purity, density, crystal phase, grain size, and handleability. In accordance with the present disclosure, it has been determined that in addition to the bulk (percentage) porosity characteristics of the yttria and zirconia materials disclosed herein, the porosity characteristics, density, and grain size can have a significant impact on etch and deposition stability.

[0178] The ceramic sintered bodies described above, including yttrium oxide and zirconium oxide crystalline phases, as well as combinations thereof, may be suitable for the manufacture of large corrosion-resistant components with dimensions of 10 mm to 622 mm for the longest extension of the sintered body. The large component dimensions described herein may be made possible by the increased density, low porosity, and fine grain size of the ceramic sintered bodies from which the chamber components may be manufactured.

[0179] The use of ceramic sintered bodies made from yttrium oxide and zirconium oxide crystalline phases, and combinations thereof, in semiconductor processing chambers results in sintered materials that exhibit improved plasma corrosion and erosion resistance ("plasma resistance") over other materials when subjected to halogen-based plasma processing and deposition conditions. EXAMPLES

[0180] The general nature of the present disclosure is more clearly illustrated in the following examples, which are intended to illustrate, but not limit, the present disclosure.

[0181] Example 1 (Sample 1, Table 1) 2-4 m 2 Yttria powder with a surface area of ​​6-8 m 2Zirconia powders having a surface area of ​​100 / g were weighed and mixed to make a powder mixture with a ratio of 80 mole % yttria and 20 mole % zirconia (amount of 87.3% yttria and 12.7% zirconia by weight). The purity of the yttria powder was greater than about 99.998% and the purity of the zirconia powder was greater than about 99.79% as measured using the ICP-MS method disclosed herein. 50% ethanol by powder weight and 100% zirconia media by powder weight were added to the powder mixture to form a slurry. The slurry was end-over-end / tumbling mixed at an RPM of 10-30 rpm for 12 hours. The ethanol was extracted from the slurry using a rotary evaporator at a temperature of about 75° C. until dry. Any of the starting powders, powder mixtures, and calcined powder mixtures may be optionally blended and / or dry milled in various process steps according to known methods, without any restriction on the number or order of repetitions, for example using any number of meshes that may have openings between 45 μm and 400 μm.

[0182] The powder mixture was sintered at 850°C for 6 hours in air. The sintered powder mixture was then sintered under vacuum at a sintering temperature of 1625°C, a pressure of 25 MPa, and a sintering time of 90 minutes to form a disk-shaped ceramic body having a diameter of 406 mm according to the method disclosed herein. The ceramic body was annealed at 1400°C for about 8 hours. Density measurements were performed according to ASTM B962-17 to measure an average density of 5.10 g / cc, which corresponds to 99.4% of the theoretical density of a ceramic body comprising 80 mole % yttria / 20 mole % zirconia (theoretical density disclosed herein is 5.13 g / cc). The porosity of the ceramic body (also referred to herein as volume porosity Vp) was in the amount of 0.6%. Density measurements performed across the ceramic body measured a difference in density (relative to theoretical density) across the diameter of no more than 2%.

[0183] Example 2 (Sample 2, Table 1) A disk-shaped sintered ceramic body with a diameter of 406 mm was formed according to the materials and methods disclosed in Example 1, except that no annealing treatment was performed. Density measurements were performed according to ASTM B962-17, and an average density of 5.13 g / cc was measured, which corresponds to 100% of the theoretical density of a sintered ceramic body containing 80 mole % yttria / 20 mole % zirconia. The sintered ceramic body had no porosity (also referred to herein as volume porosity Vp).

[0184] Example 3 (Sample 3, Table 1) A powder mixture was formed and dried according to the amounts, materials and methods of Example 1. Sintering of the powder mixture was carried out at 950°C in air for 6 hours. The sintered powder mixture was then sintered under vacuum at a sintering temperature of 1600°C, a pressure of 15 MPa, and a sintering time of 30 minutes according to the methods disclosed herein to form a disk-shaped sintered ceramic body having a diameter of 150 mm. Density measurements were performed according to ASTM B962-17, and an average density of 5.11 g / cc was measured, which corresponds to 99.6% of the theoretical density of a sintered ceramic body containing 80 mole % yttria / 20 mole % zirconia. The porosity of the sintered ceramic body (also referred to herein as volume porosity Vp) was in the amount of 0.4%.

[0185] Example 4 (Sample 4, Table 1) A ceramic body was formed according to the materials and methods of Example 3. The ceramic body was annealed at a temperature of 1200° C. in an oxygen-containing environment for 8 hours. Density measurements were performed according to ASTM B962-17 and an average density of 5.11 g / cc was measured, which corresponds to 99.6% of the theoretical density of the annealed ceramic body containing 80 mole % yttria / 20 mole % zirconia. The porosity of the ceramic body (also referred to herein as volume porosity Vp) was in the amount of 0.4%.

[0186] Example 5 (Sample 5, Table 1) A ceramic body was formed according to the materials and methods of Example 3. The ceramic body was further annealed at a temperature of 1300° C. for 8 hours in an oxygen-containing environment. Density measurements were performed according to ASTM B962-17 and an average density of 5.09 g / cc was measured, which corresponds to 99.2% of the theoretical density of a ceramic body containing 80 mole % yttria / 20 mole % zirconia. The porosity of the ceramic body (also referred to herein as volume porosity Vp) was in the amount of 0.8%.

[0187] Example 6 (Sample 6, Table 1) A powder mixture was formed and dried according to the materials and methods of Example 1, except that 35% ethanol by powder weight and 100% zirconia media by powder weight were added to the powder mixture to form a slurry. Firing was carried out at 850°C for 6 hours in air. The sintered powder mixture was then sintered under vacuum at a sintering temperature of 1450°C, a pressure of 20 MPa, and a sintering time of 30 minutes to form a disk-shaped sintered ceramic body having a diameter of 150 mm according to the methods disclosed herein. The sintered ceramic body was annealed in an oxygen-containing environment at 1300°C for 8 hours. Density measurements were performed according to ASTM B962-17, and an average density of 5.11 g / cc was measured, which corresponds to 99.6% of the theoretical density of a sintered ceramic body containing 80 mole % yttria / 20 mole % zirconia. The porosity of the sintered ceramic body (also referred to herein as volume porosity Vp) was in the amount of 0.4%.

[0188] Example 7 (Sample 7 in Table 1) A sintered powder mixture was formed as disclosed in Example 1. The sintered powder mixture was then sintered under vacuum at a sintering temperature of 1500°C, a pressure of 30 MPa, and a sintering time of 30 minutes according to the method disclosed herein to form a disk-shaped sintered ceramic body having a diameter of 100 mm. Density measurements were performed according to ASTM B962-17, and an average density of 5.13 g / cc was measured, which corresponds to 100% of the theoretical density of a sintered ceramic body containing 80 mole % yttria / 20 mole % zirconia. The sintered ceramic body had no porosity.

[0189] Example 8 (Sample 8 in Table 1) 6 to 8 m 2 Yttria powder with a surface area of ​​6-8 m 2 Zirconia powders having a surface area of ​​1000 / g were weighed and mixed to produce a powder mixture with a ratio of 90 mol% yttria and 10 mol% zirconia. A slurry was formed by adding about 35 wt% ethanol based on the weight of the powder mixture, and zirconia media was added at a loading of 100% based on the weight of the powder. The powder mixture was ball milled at about 125 RPM for about 12 hours. The powder mixture was fired at 1000°C in air for 8 hours. The fired powder mixture was then sintered under vacuum at a sintering temperature of 1500°C, a pressure of 30 MPa, and a sintering time of 30 minutes to form a disk-shaped sintered ceramic body having a diameter of 100 mm according to the method disclosed herein. Density measurements were performed according to ASTM B962-17, and an average density of 5.08 g / cc was measured, which corresponds to 100% of the theoretical density of a sintered ceramic body containing 90 mol% yttria / 10 mol% zirconia. The sintered ceramic body had no porosity.

[0190] [Table 6]

[0191] Examples 9 and 10 A sintered powder mixture was prepared according to the disclosure of Example 1. The sintered powder mixture was sintered under vacuum at a sintering temperature of 1600°C, a pressure of 15 MPa, and a sintering time of 45 minutes to form a disk-shaped ceramic sintered body having a diameter of 406 mm corresponding to Sample 9 according to the method disclosed herein. The ceramic sintered body of Sample 9 was further annealed at 1400°C in air for 8 hours. Sample 10 was formed from the sintered powder mixture of Example 1 by sintering under vacuum at a sintering temperature of 1625°C, a pressure of 20 MPa, and a sintering time of 60 minutes to form a disk-shaped ceramic sintered body having a diameter of 406 mm according to the method disclosed herein. The dielectric constant and loss factor were measured according to ASTM D-150 at a frequency of 1 MHz and ambient temperature, and the results are listed below. Within the range of measurements performed, the same dielectric performance was measured for the annealed yttria-zirconia ceramic sintered body and the non-annealed yttria-zirconia ceramic sintered body.

[0192] [Table 7]

[0193] Example 11 A sintered powder mixture was formed as disclosed in Example 1. The sintered powder mixture was sintered under vacuum at a sintering temperature of 1625°C, a pressure of 15 MPa, and a sintering time of 90 minutes to form an intact 80 mol% yttria / 20 mol% zirconia ceramic sintered body in the shape of a disk having an easily handled diameter of 572 mm, according to the method disclosed herein. The sintered ceramic body was annealed at 1400°C for 10 minutes in an oxygen-containing atmosphere. Density measurements were then performed on the sintered body according to ASTM B962-17. A density of 5.13 g / cc was measured, which corresponds to about 100% of the theoretical density (herein referred to as 5.13 g / cc) for a sintered body containing 80 mol% yttria and 20 mol% zirconia. Surface roughness measurements were performed using a Keyence 3D laser scanning confocal digital microscope model VK-X250X. ISO 25178 Surface Texture (Areal Roughness measurement) is a set of international standards for the analysis of surface roughness to which this microscope conforms. The parameters Sa (arithmetic mean height) and Sz (maximum height / peak-valley) were measured for sintered ceramic bodies. Sa represents the average roughness value calculated over a user-defined area of ​​the surface of the sintered ceramic body. Sz represents the maximum peak-valley distance over a user-defined area of ​​the surface of the sintered ceramic body. The surface roughness characteristics Sa and Sz are parameters known in the underlying technical field and are described, for example, in ISO standard 25178-2-2012.

[0194] Sa values ​​of less than 90 nm, more preferably less than 70 nm, more preferably less than 50 nm, more preferably less than 25 nm, and preferably less than 15 nm were measured on polished surfaces according to ISO standard 25178-2-2012.

[0195] Sz values ​​of less than 3.5 μm, preferably less than 2.5 μm, preferably less than 2 μm, preferably less than 1.5 μm, and more preferably less than 1 μm, were measured on the polished surface according to ISO standard 25178-2-2012.

[0196] Although shown and described above with reference to certain specific embodiments and examples, the present disclosure is not limited to the details shown. Rather, various modifications can be made in details without departing from the spirit of the present disclosure, within the scope and range of equivalents of the claims. For example, all broad ranges described herein are expressly intended to include all narrow ranges included in the broad ranges.

Claims

1. A ceramic sintered body comprising yttrium oxide and zirconium oxide, 1. The ceramic sintered body comprising: 75 mol% to 95 mol% yttrium oxide; and 5 mol% to 25 mol% zirconium oxide; the ceramic sintered body comprises porosity in an amount of less than 2 vol.%; the density of the ceramic sintered body does not vary by more than 2% relative to theoretical density across its maximum dimension; and the ceramic sintered body has an average grain size of 0.4 to less than 2 μm as measured according to ASTM E112-2010.

2. 10. The ceramic sintered body of claim 1 having at least one surface comprising yttrium oxide and zirconium oxide, said at least one surface being polished and comprising porosity in an amount of less than 2% by pore area of ​​said at least one surface.

3. 3. The ceramic sintered body of claim 2, wherein the porosity measured on a polished surface extends throughout the ceramic sintered body.

4. 3. The ceramic sintered body of claim 1, having a pore size of 0.1 μm to 3 μm measured over the polished surface.

5. 3. The ceramic sintered body according to claim 1 or 2, having at least one surface with an average grain size of 0.75 μm to 6 μm as measured according to ASTM El 12-2010.

6. The ceramic sintered body according to claim 1 or 2, comprising a c-type cubic solid solution phase.

7. 3. The ceramic sintered body according to claim 1 or 2, each having a maximum dimension of 100 mm to 622 mm with respect to the longest extension of the sintered body.

8. A method for producing the ceramic sintered body according to claim 1, comprising the steps of: a. combining yttrium oxide and zirconium oxide powders to form a powder mixture; b. calcining the powder mixture by applying heat to raise the temperature of the powder mixture to a calcination temperature and maintaining the calcination temperature to form a calcined powder mixture; c. placing the fired powder mixture within a volume defined by a conductive tool set of a sintering machine and creating a vacuum condition within the volume; d) applying pressure to the fired powder mixture while heating the conductive tool set at a sintering temperature using a direct current to sinter the mixture to form the ceramic sintered body; e) reducing the temperature of the ceramic sintered body.

9. f. optionally annealing the ceramic sintered body by applying heat to increase the temperature of the ceramic sintered body to reach an annealing temperature to form an annealed ceramic sintered body; g. reducing the temperature of the annealed ceramic body.

10. The method of claim 8 or 9, optionally further comprising machining the ceramic sintered body to form ceramic sintered body components, such as windows, RF windows, lids, focus rings, shield rings, nozzles, gas injectors, showerheads, gas distribution plates, chamber liners, chucks, electrostatic chucks, pucks, and / or cover rings in plasma processing chambers.

11. 10. The method of claim 8 or 9, wherein the calcined powder mixture has a purity of 99.99% or greater, relative to 100% purity, as measured using ICP-MS method.

12. The calcined powder mixture has a viscosity of 2 to 14 mm as measured in accordance with ASTM C1274. ２ 10. The method of claim 8 or 9, wherein the sintered body has a specific surface area (SSA) of 100 / g.

13. The method according to claim 8 or 9, wherein the firing temperature is from 600°C to 1200°C.

14. The method according to claim 8 or 9, wherein the pressure is from 10 to 60 MPa.

15. The method according to claim 8 or 9, wherein the sintering temperature is between 1200°C and 1700°C.

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