Method for processing resin member, device for processing resin member, and method for manufacturing resin part

Abstract

The present invention addresses the problem of providing a method for machining resin members by using photoirradiation to sufficiently heat only a desired region of a resin-containing member. The present invention also addresses the problem of providing a resin member machining apparatus and a resin component manufacturing method for carrying out said machining.　A resin member machining method that solves these problems includes a step for irradiating a resin-containing first member with first light of a first wavelength that electronically excites the resin, and a step for irradiating the resin, electronically excited through irradiation with the first light, with second light of a second wavelength longer than the first wavelength. The second wavelength is included in a wavelength region such that the optical absorptance of the resin is increased through electronic excitation.

Description

[Technical field]

[0001] The present invention relates to a method for processing a resin member, an apparatus for processing a resin member, and a method for manufacturing a resin part. [Background technology]

[0002] In recent years, in the field of electronic components and devices, attention has been focused not only on inorganic materials such as semiconductors and metals, but also on devices that partially incorporate organic materials (resins) to maximize their functionality. When manufacturing such devices, it is necessary to bond resin-containing components to other components and to precisely process resin-containing components (cutting, forming grooves, etc.).

[0003] Laser welding has attracted attention as a method for processing members containing resin (for example, Patent Document 1). In this laser welding method, at least one of two or more members (at least one member containing resin) is irradiated with near-infrared or infrared laser light. In the area irradiated with the laser light, the temperature of the resin rises to or above the glass transition temperature due to the photothermal effect. Then, the molten resin of the member irradiated with the laser light is brought into close contact with another member, thereby joining the multiple members.

[0004] In addition, it has also been conventional to locally heat a resin member by irradiating it with near-infrared or infrared laser light, thereby cutting the resin member at a desired position or forming a groove in the resin member at a desired position. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2012-27447 A Summary of the Invention [Problem to be solved by the invention]

[0006] In order to heat a resin by irradiating it with a laser beam, it is necessary to irradiate the resin with a laser beam having a wavelength range that the resin can absorb. However, general-purpose resins (such as polystyrene (hereinafter also referred to as "PS"), polymethyl methacrylate (hereinafter also referred to as "PMMA"), polyethylene terephthalate (hereinafter also referred to as "PET"), and polycarbonate (hereinafter also referred to as "PC") usually do not absorb light in the visible light range. For example, PET does not substantially absorb light over a wide range of wavelengths from 400 nm to 2200 nm. Furthermore, polycarbonate also does not substantially absorb light over a wide range of wavelengths from 400 nm to 1600 nm. Therefore, in order to process PET or polycarbonate, it is necessary to irradiate them with a laser beam having a longer wavelength than these.

[0007] Furthermore, the light absorption coefficient of resin in the near-infrared region (wavelengths of about 800 nm to 2 μm) is very small. Therefore, even if resin is irradiated with near-infrared laser light at high light intensity, absorption saturation (hereinafter, this phenomenon is also referred to as "absorption saturation") easily occurs. Therefore, it is difficult to make resin absorb light energy above the threshold value. Therefore, there is room for improvement in heating resin using near-infrared or infrared laser light (photothermal reaction).

[0008] The present invention has been made in view of the above circumstances. That is, an object of the present invention is to provide a method for processing a resin member by efficiently raising the temperature of a member containing resin by light irradiation. Another object of the present invention is to provide a processing device for a resin member for carrying out the processing, and a manufacturing method for a resin part. [Means for solving the problem]

[0009] The present invention provides the following method for processing a resin workpiece. A method for processing a resin member, comprising the steps of: irradiating a first member containing resin with first light of a first wavelength that electronically excites the resin; and irradiating the resin that has been electronically excited by the irradiation of the first light with second light of a second wavelength that is longer than the first wavelength, wherein the wavelength range of the second wavelength is included in a wavelength range in which the light absorptance of the resin increases as a result of the resin being electronically excited.

[0010] The present invention provides the following resin member processing apparatus. An apparatus for processing a resin member, comprising: a first light irradiation system for irradiating resin of a first member containing resin with first light of a first wavelength that electronically excites the resin; and a second light irradiation system for irradiating the resin of the first member with second light of a second wavelength that is longer than the first wavelength, wherein the wavelength range of the second wavelength is included in a wavelength range in which the resin is electronically excited to increase its light absorptance.

[0011] The present invention provides the following method for producing a resin part. A method for manufacturing a resin part, comprising: a step of irradiating a first member containing resin with first light of a first wavelength that electronically excites the resin; and a step of irradiating the resin that has been electronically excited by the irradiation with the first light with second light of a second wavelength that is longer than the first wavelength, wherein the wavelength range of the second wavelength is included in a wavelength range in which the light absorptance of the resin increases as a result of the resin being electronically excited. Effect of the Invention

[0012] In the method for processing a resin workpiece of the present invention, the resin-containing workpiece can be sufficiently heated and processed by light irradiation.

[0013] Furthermore, according to the resin member processing device of the present invention, it is possible to process the resin by irradiating a desired area with two or more types of light.

[0014] In the method for producing a resin part of the present invention, the temperature of the member containing resin can be sufficiently raised by light irradiation, making it possible to produce a resin part. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic diagram showing an example of an apparatus for processing a resin member according to the present invention. [Diagram 2] FIG. 2A is a schematic diagram showing a wavelength range in which the light absorptance increases as the temperature of a resin increases due to electronic excitation, and FIG. 2B is a schematic diagram showing a wavelength range in which the light absorptance increases due to an excited triplet state that appears transiently due to electronic excitation. [Diagram 3] FIG. 3 is a schematic diagram illustrating a method for manufacturing a resin part. [Figure 4] FIG. 4 is a diagram showing the relationship between the total output of the laser light and the temperature of the PET plate when the PET plate is irradiated with the laser light in Example 3 of the present invention. [Diagram 5] FIG. 5 is a diagram showing the relationship between the total output of laser light and the temperature of the PC board when the PC board is irradiated with laser light in Example 3 of the present invention. [Figure 6] FIG. 6 is a diagram showing the relationship between the total output of laser light and the temperature of a PMMA plate when the PMMA plate is irradiated with laser light in Example 3 of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The present invention relates to a method for processing a resin member, a processing device for a resin member used in the processing method, and a manufacturing method for a resin part using the processing method. Hereinafter, the method for processing a member, the processing device, and the manufacturing method for a resin part will be described using an embodiment of the present invention as an example, but the present invention is not limited to the embodiment.

[0017] 1. Processing method for resin components In a method for processing a resin member according to an embodiment of the present invention, a step of irradiating a first member containing resin with a first light having a first wavelength that electronically excites the resin (a first light irradiation step) and a step of irradiating the resin that has been electronically excited by the irradiation with the first light with a second light having a second wavelength that is longer than the first wavelength (a second light irradiation step) are performed. Note that the second wavelength is a wavelength included in a wavelength range in which the light absorptance of the resin increases as the resin is electronically excited.

[0018] As described above, in the method of irradiating a resin with near-infrared light or infrared light to vibrationally excite the resin, absorption saturation tends to occur, and it is difficult to sufficiently increase the temperature of the resin.

[0019] In contrast, in this embodiment, the resin of the first member to be processed is electronically excited by irradiation with the first light having the first wavelength. The electronic excitation described here refers to the excitation of electrons of the chromophores of the polymer, which is the resin, and is mainly π-π * Transition or n-π * The electronic excitation corresponds to the transition. When the resin is electronically excited, a wavelength range in which the light absorptance increases is generated. Therefore, in this embodiment, a second light of a second wavelength included in the wavelength range in which the light absorptance increases is further irradiated. By irradiating the resin with the second light, the temperature of the resin is sufficiently increased, and the first member can be processed. In this specification, the wavelength range in which the light absorptance of the resin increases may be a wavelength range in which the light absorptance of the resin increases compared to before the irradiation with the first light, and the wavelength range also includes a wavelength range in which there is no light absorption before the irradiation with the first light, and in which new light absorption occurs due to the irradiation with the first light.

[0020] Here, there are two types of wavelength ranges in which the light absorptance increases by electronically exciting the resin. The first wavelength range in which the light absorptance increases is a wavelength range that exists on the longer wavelength side than the first wavelength (first light) for causing electronic transition in the resin, and in which the light absorptance increases as the temperature of the resin rises due to electronic excitation. This wavelength range is also called a hot band, and is explained by Urbach's law.

[0021] Urbach's rule states that the shape A of the light absorption spectrum of a substance on the low-energy side (long wavelength side) is expressed by the following formula.

number

[0022] According to the Urbach law, as the temperature of a substance rises, the low-energy tail of the light absorption spectrum shifts to the long-wavelength side. Light absorption then occurs in wavelength regions where there was little or no absorption at low temperatures. That is, as in this embodiment, when the resin is electronically excited by irradiation with the first light, the temperature of the resin rises, and the light absorptance increases in wavelength regions longer than the wavelength region where the resin can normally absorb light.

[0023] The second wavelength range in which light absorptance increases is a wavelength range that is longer than the first wavelength (first light) for causing electronic transition in the resin, and in which light absorptance increases due to an excited triplet state that appears transiently due to electronic excitation.

[0024] There are many organic substances that have no optical absorption in the visible light range in the ground state, but have absorption in the visible light range in the excited state and have a large absorption coefficient. For example, The Journal of Physical Chemistry, 1993, Vol. 97, pp. 6753-6759 (published by the American Chemical Society) shows the optical absorption spectrum of PET in the excited triplet state. As mentioned above, PET does not have optical absorption in the wavelength range of 400 nm to 2200 nm in the ground state. However, the document shows that PET has an optical absorption band in the wavelength range of 390 nm to 550 nm when it is in the excited triplet state.

[0025] Furthermore, Macromolecules, Vol. 27, No. 14, 1994 (published by the American Chemical Society) shows the light absorption spectrum of the excited triplet state of polycarbonate. In this document, polycarbonate also does not have light absorption over a wavelength range of 400 nm to 1600 nm in the ground state. However, when polycarbonate is in an excited triplet state, it is shown in this document that it has a light absorption band over a wavelength range of 350 nm to 500 nm. That is, when the resin is electronically excited by irradiation with the first light as in this embodiment, the resin is in an excited triplet state, and a new wavelength range in which the resin can absorb light is usually expressed on the longer wavelength side than the wavelength range in which the resin can absorb light.

[0026] Here, the method for processing a resin member of this embodiment is applicable to a method for heating and processing a first member containing resin, and can be applied to various methods. For example, it can be applied to a method for joining a first member containing resin to another member. It can also be applied to a method for cutting a first member containing resin or forming a groove. Hereinafter, the first light irradiation step, the second light irradiation step, and the joining step of this embodiment will be described using a method for joining a first member containing resin to a second member as an example, but the processing method of this embodiment is not limited to the joining method.

[0027] (First light irradiation step) In this process, a first member containing a resin is irradiated with a first light having a first wavelength. Here, the resin contained in the first member may be any resin that can be electronically excited by irradiation with light (first light), and examples thereof include polyethylene terephthalate (PET), polystyrene, polymethyl methacrylate (PMMA), polycarbonate (PC), etc. Note that the resin does not need to have absorption due to electronic excitation with respect to the wavelength of the second light (second wavelength) described below.

[0028] Among the above resins, polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA) are preferred because they are easily electronically excited by irradiation with the first light and have a high optical absorptivity on the long wavelength side. Note that the first member only needs to contain a resin in the region that is bonded to the second member described below, and may contain components other than resin.

[0029] The shape of the first member is not particularly limited, and may be, for example, a flat plate or a three-dimensional structure. The joining surface of the first member to the second member may be a flat surface or a curved surface.

[0030] The light (first light and second light) transmittance of the first member is appropriately selected depending on the direction in which the light (first light and second light) is irradiated. For example, when the first light and the second light are irradiated from the bonding surface side of the first member with the second member, the first member does not need to be transparent to the first light and the second light. On the other hand, when the first light and the second light are irradiated from the side opposite to the bonding surface of the first member with the second member, it is preferable that the first member is transparent to the first light and the second light.

[0031] The wavelength of the first light (first wavelength) irradiated in this process may be any wavelength capable of electronically exciting the resin in the first member, and is appropriately selected according to the type of resin. For example, for polyethylene terephthalate (PET) or polycarbonate (PC), the wavelength range of the first wavelength is preferably 410 nm or less, and may be, for example, a laser beam with a wavelength of 375 nm or a laser beam with a wavelength of 405 nm.

[0032] Here, the first light is particularly preferably a laser light. When the first light is a laser light, the irradiation area can be controlled to be very small, and the first light can be irradiated in a precise pattern. The laser light may be a continuous wave laser light or a pulsed laser light. From the viewpoint of being able to continuously irradiate the first light to a desired region, a continuous wave laser light is more preferable.

[0033] In this case, the output from the laser light source is preferably 10 to 500 mW. For example, in the case of polyethylene terephthalate (PET), 100 to 400 mW is more preferable. For example, in the case of polycarbonate (PC), 30 to 250 mW is preferable, and 30 to 200 mW is more preferable. For example, in the case of polymethyl methacrylate (PMMA), 100 to 400 mW is more preferable. By irradiating the first light with this output, it is possible to efficiently excite the resin electronically. In addition, the light intensity of the first light at the focused position is 0.01 kW / cm. 2 More than 0.01kW / cm is preferable. 2 ~1.00kW / cm 2 is more preferred.

[0034] Furthermore, the integrated light amount of the first light at the focusing position of the first light is 0.2 to 35.0 mJ / cm 2 When the integrated light amount of the first light is within this range, it becomes possible to sufficiently increase the temperature of the resin by electronic excitation to generate the above-mentioned hot band or the above-mentioned excited triplet state.

[0035] During the irradiation of the first light, the temperature of the area irradiated with the first light may be measured, and the intensity of the first light may be adjusted in accordance with the measured temperature.

[0036] (Second light irradiation step) In this step, the resin electronically excited by irradiation with the first light is irradiated with a second light having a second wavelength longer than that of the first light. The timing of irradiation with the second light may be any timing while the resin is electronically excited by irradiation with the first light, and may be slightly shifted from the irradiation of the first light, but it is usually preferable to irradiate the first light and the second light simultaneously.

[0037] The wavelength of the second light (second wavelength) irradiated in this step may be longer than the first wavelength and may be included in the wavelength range in which the resin is electronically excited to increase its light absorptivity. As described above, the wavelength range in which the resin's light absorptivity increases due to electronic excitation is longer than the first wavelength (first light) and is a wavelength range in which the resin's temperature increases due to electronic excitation to increase its light absorptivity. As described above, the wavelength range in which the resin's light absorptivity increases due to electronic excitation is longer than the first wavelength (first light) and is a wavelength range in which the resin's light absorptivity increases due to electronic excitation to increase its temperature. Furthermore, as described above, the wavelength range in which the resin's light absorptivity increases due to electronic excitation is longer than the first wavelength (first light) and is a wavelength range in which the resin's light absorptivity increases due to an excited triplet state that appears transiently due to electronic excitation. The second light may be light of a wavelength included in any of these wavelength ranges.

[0038] Here, the wavelength range that exists on the longer wavelength side than the first wavelength (first light) and in which the light absorptance increases as the temperature of the resin rises due to electronic excitation is, for example, the wavelength range shown by the dashed line in Fig. 2A. Also, the wavelength range that exists on the longer wavelength side than the first wavelength (first light) and in which the light absorptance increases due to an excited triplet state that appears transiently due to electronic excitation is, for example, the wavelength range shown by the dashed line in Fig. 2B. In Figs. 2A and 2B, the wavelength range shown by the solid line is the original absorption wavelength range of the resin.

[0039] The wavelength range where the resin's light absorption rate increases due to electronic excitation of the resin varies depending on the type of resin. Therefore, the second wavelength is appropriately selected according to the type of resin. For example, for polyethylene terephthalate (PET) and polycarbonate (PC), the wavelength range of the second wavelength is preferably more than 400 nm and 550 nm or less, and can be, for example, a laser beam with a wavelength of 405 nm or a laser beam with a wavelength of 450 nm.

[0040] Here, the second light is also preferably a laser light. When the second light is a laser light, the irradiation area can be controlled to be very small, and the second light can be irradiated in a precise pattern. The laser light may be a continuous wave laser light or a pulsed laser light. From the viewpoint of being able to continuously irradiate the second light to a desired region, a continuous wave laser light is more preferable.

[0041] In this case, the output from the laser light source is preferably 30 to 1200 mW. For example, in the case of polyethylene terephthalate (PET), the output is more preferably 100 to 1000 mW. For example, in the case of polycarbonate (PC), the output is more preferably 50 to 500 mW. For example, in the case of polymethyl methacrylate (PMMA), the output is more preferably 100 to 500 mW. By irradiating the second light with this output, the temperature of the resin in the first member can be efficiently increased. In addition, the light intensity of the second light at the focusing position is 0.01 kW / cm. 2 More than 0.01kW / cm is preferable. 2 ~2.00kW / cm 2 is more preferred.

[0042] Furthermore, the integrated light amount of the second light at the focusing position may be any amount that can heat the first member (resin) to a temperature equal to or higher than the glass transition temperature of the resin in the first member. For example, it may be 0.2 to 65.0 mJ / cm 2 When the integrated light amount of the second light is within this range, the temperature of the resin increases sufficiently, and the first member and the second member are easily joined firmly.

[0043] Here, the second light may be irradiated from the same axis direction as the first light, or from a different direction. Also in this process, the temperature of the area irradiated with the second light (and the first light) may be measured, and the intensity of the second light may be adjusted according to the measured temperature.

[0044] (Joining process) The joining step is a step of joining the region (resin) of the first member irradiated with the first light and the second light to the second member. The joining step may be performed after the first light irradiation step and the second light irradiation step are performed on the first member. That is, the first member may be overlapped with a second member prepared separately (prepared in the preparation step) and joined after the first member is irradiated with the first light and the second light irradiation step are performed on the first member to sufficiently increase the temperature of the resin in the first member.

[0045] On the other hand, the bonding step may be performed simultaneously with the above-mentioned first light irradiation step and second light irradiation step (particularly simultaneously with the second light irradiation step). When the bonding step, the first light irradiation step, and the second light irradiation step are performed simultaneously, the first member and the second member are placed in a stacked manner in advance, and the first light and the second light are focused at the interface between them, so that the first light irradiation step, the second light irradiation step, and the bonding step can be performed simultaneously.

[0046] In the joining step, the first member and the second member may be pressed against each other, if necessary.

[0047] Here, the type of the second member is not particularly limited as long as it is a component capable of bonding with the first member, and is appropriately selected according to the purpose. For example, it may be the same resin as that of the first member, or a different resin. When the second member contains a resin, the temperature of not only the resin in the first member but also the resin in the second member may be raised by irradiation with the first light and the second light. On the other hand, the second member may be an inorganic material such as a metal or ceramic.

[0048] The shape of the second member is not particularly limited, and may be, for example, a flat plate or a three-dimensional structure. The joining surface of the second member to the first member may be a flat surface or a curved surface.

[0049] The light (first light and second light) transparency of the second member is appropriately selected depending on the timing of performing the bonding step and the direction of irradiating the light (first light and second light). For example, when the first light irradiation step and the second light irradiation step are not performed simultaneously with the bonding step, the second member may not have transparency to the first light and the second light. Even when the first light irradiation step and the second light irradiation step are performed in a state where the first member and the second member are overlapped, when the first light and the second light are irradiated from the first member side, the second member may not have transparency to the first light and the second light. On the other hand, when the first light irradiation step and the second light irradiation step are performed in a state where the first member and the second member are overlapped, when the first light and the second light are irradiated from the second member side, it is preferable that the second member has transparency to the first light and the second light.

[0050] (others) In the above description, the irradiation of two types of wavelengths of the first light and the second light has been described. However, in this embodiment, the irradiation of three or more types of wavelengths of light may be performed. For example, the temperature of the resin in the first member can be increased more efficiently by irradiating the second light having a wavelength corresponding to the hot band generated by the irradiation of the first light, and further irradiating the third light having a wavelength corresponding to the absorption wavelength range of the excited triplet state generated by the irradiation of the first light.

[0051] Further, although the above describes a method of joining a first member and a second member by irradiating a first light, this embodiment may also be a method of, for example, melting a desired portion of the first member and cutting the first member into a desired shape, or heating a partial area of ​​the first member and forming a desired recess, etc.

[0052] In the above description, the resin contained in the first member is electronically excited by irradiation with the first light, and then the resin is irradiated with the second light having a wavelength range in which the resin's light absorption rate increases due to the electronic excitation. However, in this embodiment, the first member may absorb the first light when irradiated with the first light, and the resin in the first member may be irradiated with the second light having a second wavelength in a wavelength range in which the resin absorbs the first light due to the light absorption.

[0053] (effect) In the above-mentioned method, the resin is electronically excited by the first light, and the second light included in the wavelength range where the light absorption is increased by the electronic excitation is irradiated. In this way, by irradiating a combination of two types of light that can be absorbed by the resin, a large amount of light energy can be absorbed by the resin, and the resin can be heated efficiently. Furthermore, a relatively short-wavelength laser light, such as a laser light with a wavelength of 375 nm or a laser light with a wavelength of 405 nm, used as the first light can narrow the irradiation range compared to a relatively long-wavelength laser light such as near-infrared or infrared, and therefore the irradiation accuracy of the laser light can be increased. Therefore, more precise processing can be performed than when a resin member is processed using a relatively long-wavelength laser light such as near-infrared or infrared.

[0054] In addition, the light absorptance of the resin in the wavelength range where the light absorptance increases due to electronic excitation may be significantly higher than the light absorptance of the first light. Therefore, according to the above-mentioned method, a very large amount of light energy can be absorbed by the resin by irradiating it with the second light, and as a result, the temperature of the resin can be raised efficiently.

[0055] Furthermore, in general, the oscillation wavelength of a high-output type laser light irradiation system is usually 400 to 1600 nm. In general, a laser light irradiation system with an oscillation wavelength of 400 nm or less has a low output to avoid internal damage caused by the short wavelength. In the above-mentioned method, the second wavelength of the second light can be made to exceed 400 nm. Therefore, it is also possible to use a high-output type laser light irradiation system.

[0056] 2.Processing equipment The above-mentioned processing method can be performed by the following processing device including a first light irradiation system for irradiating the first light of the above-mentioned first wavelength and a second light irradiation system for irradiating the second light of the above-mentioned second wavelength. However, the device for performing the above-mentioned processing method is not limited to the above device. In the following description, a device for joining the first member and the second member will be described, but the processing device may be, for example, a cutting device or a cutting device for the first member.

[0057] An example of a processing apparatus according to this embodiment is shown in Fig. 1. As shown in Fig. 1, the processing apparatus 100 has an XY stage on which a first member 111 and a second member 112 are placed, a first light irradiation system 120, a second light irradiation system 130, a lens 140, a temperature measurement unit 150, and a light amount control unit 160. Note that, if necessary, a support unit (not shown) and a position control unit (not shown) for controlling the relative positions of the first member 111 and the second member 112 may be included.

[0058] The first light irradiation system 120 is a light irradiation system for irradiating the above-mentioned first light 123, and can be configured to include, for example, a first laser light source 121 and a first mirror (dichroic mirror) 122. The first laser light source 121 can be, for example, a laser that oscillates laser light with a wavelength of 375 nm or laser light with a wavelength of 405 nm.

[0059] The second light irradiation system 130 is a light irradiation system for irradiating the above-mentioned second light 133, and may include, for example, a second laser light source 131 and a second mirror 132. The second laser light source 131 may be, for example, a laser that oscillates laser light having a wavelength of 405 nm or 450 nm.

[0060] The type of lens 140 is not particularly limited as long as it can focus the first light 123 emitted from the first light irradiation system 120 and the second light 133 emitted from the second light irradiation system 130 on the contact portions of the first member 111 and the second member 112. The diameter of the focused spot is appropriately selected depending on the bonding pattern.

[0061] The XY stage 110 may have any configuration for supporting the first member 111 and the second member 112, and may be the same as the XY device of a general laser irradiation device. The XY stage 110 may be linked to a support unit (not shown) for controlling the relative positions of the first member 111 and the second member 112. The support unit may have a structure capable of supporting the first member 111 and / or the second member 112, for example, and moving them so that they are in a desired positional relationship. The configuration of a position control unit (not shown) for adjusting the position of the support unit and the position of the XY stage 110 is not particularly limited, and may be a computer or the like.

[0062] Furthermore, the temperature measuring means is not particularly limited as long as the temperature measuring unit 150 can measure the temperature at the irradiation position (contact portion of the first member 111 and the second member 112) of the first light 123 from the first light irradiation system 120 and the second light 133 from the second light irradiation system 130. The temperature measuring unit 150 can be, for example, a radiation type thermometer.

[0063] The light quantity control unit 160 is not particularly limited in configuration as long as it is capable of acquiring the temperature measured by the temperature measurement unit 150 and adjusting the output of the first light irradiation system 120 and the second light irradiation system 130 based on the temperature. For example, it may be a computer. Note that one computer may function as both the light quantity control unit 160 and the position control unit.

[0064] When the first member 111 and the second member 112 are joined using the processing apparatus 100, the first member 111 (the first member 111 and the second member 112 in FIG. 1) is placed on the XY stage 110. Then, a first light 123 is emitted from a first light irradiation system 120. At this time, the first light 123 is focused by a lens 140 on the resin of the first member 111 (the contact portion between the first member 111 and the second member 112 in FIG. 1).

[0065] Furthermore, substantially simultaneously with the irradiation of the first light 123 by the first light irradiation system 120, the second light irradiation system 130 emits the second light 133. Then, the lens 140 also focuses the second light 133 on the resin of the first member 111 (the contact portion between the first member 111 and the second member 112 in FIG. 1).

[0066] Then, the temperature measuring unit 150 measures the temperature of the resin irradiated with the first light and the second light. The light amount control unit 160 judges whether the temperature measured by the temperature measuring unit 150 is equal to or higher than the glass transition temperature of the resin in the first member 111, and adjusts the light output of the first light irradiation system 120 and the second light irradiation system 130 based on the judgment result. At this time, the above-mentioned position control unit (not shown) may move the XY stage 110 as necessary to irradiate the first light 123 and the second light 133 in a desired pattern.

[0067] 1, the first light 123 and the second light 133 are irradiated from the same direction, but the first light 123 and the second light 133 may be irradiated from different directions. In the device shown in FIG. 1, the first light 123 and the second light 133 are irradiated in a state in which the first member 111 and the second member 112 are arranged so as to be in contact with each other, but it is also possible to place only the first member 111 on the XY stage 110, irradiate the first light 123 and the second light 133, and then overlap the second member 112 on the first member 111 by the above-mentioned support section and join them.

[0068] 3. Manufacturing method of resin parts The method for manufacturing a resin part of the present invention includes a step of irradiating a first light having a first wavelength that electronically excites the resin of a first member that contains resin, and a step of irradiating the resin that has been electronically excited by the irradiation of the first light with a second light having a second wavelength that is longer than the first wavelength. Here, the wavelength range of the second wavelength may be included in the wavelength range in which the light absorptance of the resin increases due to the electronic excitation of the resin, but the wavelength range of the second wavelength is preferably a wavelength range in which the light absorptance of the resin increases due to the temperature rise of the resin caused by the electronic excitation of the resin contained in the first member.

[0069] Examples of resin parts manufactured by the method for manufacturing a resin part of the present invention include parts manufactured by processing resin, such as parts manufactured by cutting out resin, parts with grooves formed in resin, and parts in which resin and resin are joined together. Examples of parts manufactured by cutting out resin and parts in which grooves are formed in resin include resin containers such as beverage containers and food containers, and backlight reflectors. Examples of parts in which resin and resin are joined together include pipes for passing gas or liquid. In addition, resin parts may include a region made of a material other than resin. That is, examples of resin parts include parts in which resin and metal or ceramic other than resin are joined together. Examples of parts in which resin and metal or ceramic other than resin are joined together include mechanical parts such as decorative screws and electronic parts such as fuses and connectors.

[0070] An example of a method for manufacturing a resin part of the present invention is shown in Fig. 3. The manufacturing method includes a step of irradiating a first member 211 containing resin with a first light and a step of irradiating a second light. The first member 211 can be made of the same material as the first member 111.

[0071] The manufacturing method includes, for example, a method of performing the above-mentioned first light irradiation step and second light irradiation step on a first member 211 containing resin, forming a groove of a desired shape in the first member 211, and manufacturing a resin part. Also, the manufacturing method of the resin part includes, for example, a method of performing the above-mentioned first light irradiation step and second light irradiation step on a first member 211 containing resin, cutting the first member 211 into a desired shape, and manufacturing a resin part. Note that an apparatus (manufacturing apparatus for resin parts) 200 used in the manufacturing method of the resin part is similar to the above-mentioned processing apparatus 100, except that the first member 211 is irradiated with the first light and the second light, and the first member 211 is processed as desired. The same components as those of the above-mentioned processing apparatus 100 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0072] As another example of the method for manufacturing a resin part of the present invention, in addition to the above-mentioned steps of irradiating the first light and irradiating the second light, a step of preparing a second member and a step of joining the first member and the second member by contacting the area of ​​the first member irradiated with the first light and the second light with the second member can be mentioned. According to this method, the first member and the second member can be joined, and a resin part in which resin is joined to resin, or a resin part in which resin is joined to a metal or ceramic other than resin, can be manufactured. When manufacturing a resin part in which resin is joined to resin, examples of the first member and the second member include resin pipes, and the resin part is a pipe to which a resin pipe is joined. When manufacturing a resin part in which resin is joined to a metal other than resin, an example of the first member includes a resin head, an example of the second member includes a metal screw portion, and the resin part is a decorative screw to which a resin head and a metal screw portion are joined. In addition, when manufacturing a resin part in which a resin and a metal other than resin are joined, an example of the first member is a resin housing or a resin case, and an example of the second member is a metal terminal. Note that the step of irradiating the second light and the step of joining the first member and the second member may be performed simultaneously.

[0073] Here, the first light irradiation step, the second light irradiation step, and the joining step in the manufacturing method of the resin part of the present invention are the same as the steps described in the above-mentioned processing method of the resin member. Furthermore, the first member and the second member used in the manufacturing method of the resin part can be the same as the first member and the second member described in the above-mentioned processing method of the resin member. Therefore, detailed description of these will be omitted. EXAMPLES

[0074] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples.

[0075] (Reference Example 1) Demonstration of increased light absorption (hot band) The light absorption spectra of a PET plate (thickness 1 mm) in the wavelength range of 350-500 nm were measured at room temperature and at 65°C, and the results were compared. As a result, the light absorption rate was higher on the long wavelength side in the light absorption spectrum measured at 65°C than in the light absorption spectrum measured at room temperature, and the absorbance was particularly high in the wavelength range of 380 nm or more. From these results, it is clear that increased light absorption (hot band) occurs in the PET plate.

[0076] (Reference Example 2) Demonstration of temperature rise of resin due to laser light irradiation A PET plate, a PMMA plate, and a PC (polycarbonate) plate were each irradiated with a semiconductor laser beam having a wavelength of 405 nm at an output of 300 mW, and the temperature at the site irradiated with the laser beam was measured. As a result, almost no temperature increase was observed in the PET plate and the PMMA plate. Although a temperature increase was observed in the PC (polycarbonate) plate, it did not rise to a temperature necessary for resin processing, for example, which can be used for welding. These results show that PET, PMMA, and PC (polycarbonate) have no substantial light absorption of the 405 nm laser beam.

[0077] In this specification, "has substantially no light absorption" includes slight light absorption. Also, "has no light absorption" is used in the same sense as "has substantially no light absorption." For example, as in Reference Example 2, when a laser beam with an output of 300 mW is irradiated to a resin, the resin is deemed to have substantially no light absorption if its temperature does not exceed the glass transition temperature due to absorption of the laser beam.

[0078] Comparative Example 1 The PET plate was irradiated solely with a semiconductor laser beam (continuous wave type) with a wavelength of 375 nm, and the temperature of the irradiated area was measured. The focused light irradiation system was a single lens (f = 40-100 mm), and the focused spot diameter was 1 mm or less. Furthermore, the temperature was measured in real time using a radiation type thermometer. The results are shown in Table 1.

[0079] ·result [Table 1]

[0080] When joining (welding) resins, the temperature of at least one of the resin components must be higher than its glass transition temperature (T g ) is required. The glass transition temperature of PET is 70°C. In contrast, as shown in Table 1, when a PET plate was irradiated with a semiconductor laser beam with a wavelength of 375 nm alone, the temperature of the resin was 67.5°C even when the output was increased. In other words, the glass transition temperature of PET was not reached. Furthermore, even when two PET plates were placed in contact with each other and a 400mW laser beam with a wavelength of 375 nm was focused, the plates could not be joined.

[0081] Example 1 ·Condition 1 Two PET plates, a PET plate and a PC (polycarbonate) plate, or a PET plate and a PMMA plate were placed one on top of the other. Laser light 1 (wavelength 375 nm) of 400 mW was focused on the overlapping area, while laser light 2 (wavelength 405 nm) of 1000 mW was focused on the overlapping area. In both cases, the laser light was irradiated from the PET plate side.

[0082] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0083] ·Result 1 After the laser irradiation, the PET plates were observed together, the PET plate and the PC plate, and the PET plate and the PMMA plate, and it was confirmed that all of them were joined (welded). In the above-mentioned Comparative Example 1, the PET plates could not be welded together even when the laser beam with a wavelength of 375 nm was irradiated alone, whereas the two types of resin plates could be welded together when the laser beam with a wavelength of 375 nm and the laser beam with a wavelength of 405 nm were used in combination.

[0084] According to the results, it is clear that the resin (mainly PET) was electronically excited by the irradiation of the 375 nm laser light, and a new light absorption band appeared on the longer wavelength side (near 405 nm). Furthermore, it can be said that welding was achieved because the temperature of the PET exceeded its glass transition point by irradiation with the two types of laser light.

[0085] ·Condition 2 Two PC plates, or a PC plate and a PMMA plate, were placed one on top of the other. Laser light 1 (wavelength 375 nm) with an output of 200 mW was focused on the overlapping area, while laser light 2 (wavelength 405 nm) with an output of 500 mW was focused on the overlapping area. The laser light was irradiated onto the overlapping area of ​​the PC plate and PMMA plate from the PMMA plate side.

[0086] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0087] ·Result 2 After irradiation with the laser light, the overlapping portions of the PC plates, and the PC and PMMA plates, were observed and it was confirmed that all were joined (welded).

[0088] According to the results, it is clear that the resin (mainly PC) was electronically excited by the irradiation of the 375 nm laser light, and a new light absorption band appeared on the longer wavelength side (near 405 nm). Furthermore, it can be said that welding was achieved because the temperature of the PC exceeded its glass transition point by irradiation with the two types of laser light.

[0089] ·Condition 3 Two PMMA plates were placed one on top of the other. Laser light 1 (wavelength 375 nm) with an output of 400 mW was focused on the overlapping portion, while laser light 2 (wavelength 405 nm) with an output of 1000 mW was focused on the overlapping portion.

[0090] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0091] ·Result 3 After the above-mentioned laser light irradiation, the overlapping parts of the PMMA plates were observed and it was confirmed that they had been joined (welded). According to these results, it is clear that the resin (PMMA) was electronically excited by the irradiation of the 375 nm laser light, and a new light absorption band appeared on the longer wavelength side than 375 nm (near 405 nm). Furthermore, it can be said that welding was achieved because the temperature of PMMA exceeded its glass transition point by the irradiation of the two types of laser light.

[0092] Example 2 ·Condition 1 A PET plate (thickness 1 mm) was irradiated with laser light 1 (wavelength 375 nm) at an output of 200 mW, and the temperature of the irradiated area was raised to 40° C. Then, while irradiating with laser light 1, the same irradiated area was further irradiated with laser light 2 (semiconductor laser light with a wavelength of 405 nm) at an output of 500 mW, and the temperature of the irradiated area was measured.

[0093] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0094] ·Result 1 By irradiating the laser beam 2, the temperature of the PET plate rose to 110°C (temperature rise ΔT = 85°C). This temperature exceeded the glass transition temperature of PET (70°C), and it can be said that PET can be processed.

[0095] ·Condition 2 A PET plate (thickness 1 mm) was irradiated with the following laser light 1 (wavelength 375 nm) with an output of 200 mW, and the temperature of the irradiated area was raised to 60°C. Then, while irradiating with laser light 1, the same irradiated area was further irradiated with laser light 2 (wavelength 405 nm) with an output of 500 mW, and the temperature of the irradiated area was measured. The type of laser light, type of focused light irradiation system, and temperature measurement method were the same as in Condition 1.

[0096] ·Result 2 By irradiating the laser beam 2, the temperature of the irradiated area rose to 125°C (temperature rise ΔT = 100°C). This temperature exceeds the glass transition temperature of PET (70°C), which means that PET can be processed.

[0097] Example 3 ·Condition 1 A PET plate (thickness 1 mm) was irradiated with laser light using each of the following five methods, and the temperature of the irradiated area was measured. Figure 4 shows the relationship between the temperature of the irradiated area and the combined total output of the laser light. Specifically, in Figure 4, Method 4 and Method 5 are shown as examples in which a combination of two types of laser light with different wavelengths was irradiated and the temperature of the irradiated area was measured. As comparative examples, Method 1, Method 2, and Method 3 are shown in which only one type of laser was irradiated and the temperature of the irradiated area was measured.

[0098] Method 1 (comparison example): Irradiation with laser light 1 (wavelength 375 nm) only Method 2 (comparison example): Irradiation with laser light 2 (wavelength 405 nm) only Method 3 (comparison example): Irradiation with laser light 3 (wavelength 450 nm) only Method 4 (Example): Laser light 1 (wavelength 375 nm) and laser light 2 (wavelength 405 nm) are irradiated simultaneously with equal power. Method 5 (Example): Laser light 1 (wavelength 375 nm) and laser light 3 (wavelength 450 nm) are irradiated simultaneously with equal power. In the methods 4 and 5 using two types of lasers, the sum of the outputs of the two laser beams indicates the total output. For example, when the total output in the method 4 is 200 mW, the outputs of the laser beam 1 and the laser beam 2 are each 100 mW.

[0099] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Laser light 3: Semiconductor laser light with a wavelength of 450 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0100] ·Result 1 As shown in Figure 4, the temperature of the PET plate hardly changed in method 2, where laser light 2 (wavelength 405 nm) was irradiated alone, and method 3, where laser light 3 (wavelength 450 nm) was irradiated alone. On the other hand, the temperature of the PET plate rose significantly in method 4, where laser light 1 (wavelength 375 nm) and laser light 2 (wavelength 405 nm) were irradiated in combination, and in method 5, where laser light 1 (wavelength 375 nm) and laser light 3 (wavelength 450 nm) were irradiated in combination. A temperature rise was confirmed for method 1, where laser light 1 (wavelength 375 nm) was irradiated alone, but as will be described later, ultraviolet laser light such as laser light 1 has a low light conversion efficiency, so method 1 requires a relatively large amount of power.

[0101] ·Condition 2 Laser light was irradiated onto a PC board (thickness 5 mm) using each of the following five methods, and the temperature of the irradiated area was measured. The relationship between the temperature of the irradiated area and the combined total output of the laser light is shown in FIG. 5. Specifically, in FIG. 5, Method 4 and Method 5 are shown as examples in which a combination of two types of laser light with different wavelengths was irradiated and the temperature of the irradiated area was measured. As comparative examples, Method 1, Method 2, and Method 3 are shown in which only one type of laser was irradiated and the temperature of the irradiated area was measured.

[0102] Method 1 (comparison example): Irradiation with laser light 1 (wavelength 375 nm) only Method 2 (comparison example): Irradiation with laser light 2 (wavelength 405 nm) only Method 3 (comparison example): Irradiation with laser light 3 (wavelength 450 nm) only Method 4 (Example): Laser light 1 (wavelength 375 nm) and laser light 2 (wavelength 405 nm) are irradiated simultaneously with equal power. Method 5 (Example): Laser light 1 (wavelength 375 nm) and laser light 3 (wavelength 450 nm) are irradiated simultaneously with equal power. For methods 4 and 5 using two types of lasers, the sum of the outputs of the two laser beams indicates the total output. For example, when the total output in method 4 is 50 mW, the outputs of laser beam 1 and laser beam 2 are each 25 mW.

[0103] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Laser light 3: Semiconductor laser light with a wavelength of 450 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0104] ·Result 2 As shown in Figure 5, the temperature of the PC board hardly changed in method 2, where laser light 2 (wavelength 405 nm) was irradiated alone, and method 3, where laser light 3 (wavelength 450 nm) was irradiated alone. On the other hand, the temperature of the PC board rose significantly in method 4, where laser light 1 (wavelength 375 nm) and laser light 2 (wavelength 405 nm) were irradiated in combination, and in method 5, where laser light 1 (wavelength 375 nm) and laser light 3 (wavelength 450 nm) were irradiated in combination. A temperature rise was confirmed for method 1, where laser light 1 (wavelength 375 nm) was irradiated alone, but as will be described later, ultraviolet laser light such as laser light 1 has a low light conversion efficiency, so method 1 requires a relatively large amount of power.

[0105] ·Condition 3 A PMMA plate (5 mm thick) was irradiated with laser light by each of the following five methods, and the temperature of the irradiated area was measured. The relationship between the temperature of the irradiated area and the combined total output of the laser light is shown in FIG. 6. Specifically, in FIG. 6, Method 4 and Method 5 are shown as examples in which a combination of two types of laser light with different wavelengths was irradiated and the temperature of the irradiated area was measured. As comparative examples, Method 1, Method 2, and Method 3 are shown in which only one type of laser was irradiated and the temperature of the irradiated area was measured.

[0106] Method 1 (comparison example): Irradiation with laser light 1 (wavelength 375 nm) only Method 2 (comparison example): Irradiation with laser light 2 (wavelength 405 nm) only Method 3 (comparison example): Irradiation with laser light 3 (wavelength 450 nm) only Method 4 (Example): Laser light 1 (wavelength 375 nm) and laser light 2 (wavelength 405 nm) are irradiated simultaneously with equal power. Method 5 (Example): Laser light 1 (wavelength 375 nm) and laser light 3 (wavelength 450 nm) are irradiated simultaneously with equal power. In the methods 4 and 5 using two types of lasers, the sum of the outputs of the two laser beams indicates the total output. For example, when the total output in the method 4 is 200 mW, the outputs of the laser beam 1 and the laser beam 2 are each 100 mW.

[0107] The following types of laser light and focused light irradiation system were used, and temperature measurements were performed as follows. Laser light 1: Semiconductor laser light with a wavelength of 375 nm (continuous wave type) Laser light 2: Semiconductor laser light with a wavelength of 405 nm (continuous wave type) Laser light 3: Semiconductor laser light with a wavelength of 450 nm (continuous wave type) Condensed light irradiation system: Condensed light irradiation using a single lens (f = 40 to 100 mm), with a focused spot diameter of 1 mm or less Temperature measurement: Real-time measurement using a radiation thermometer

[0108] ·Result 3 As shown in Fig. 6, the temperature of the PMMA plate hardly changed in method 2, where laser light 2 (wavelength 405 nm) was irradiated alone, and method 3, where laser light 3 (wavelength 450 nm) was irradiated alone. On the other hand, the temperature of the PMMA plate increased significantly in method 4, where laser light 1 (wavelength 375 nm) and laser light 2 (wavelength 405 nm) were irradiated in combination, and in method 5, where laser light 1 (wavelength 375 nm) and laser light 3 (wavelength 450 nm) were irradiated in combination. A temperature increase was confirmed for method 1, where laser light 1 (wavelength 375 nm) was irradiated alone, but as will be described later, ultraviolet laser light such as laser light 1 has a low light conversion efficiency, so method 1 requires a relatively large amount of power.

[0109] From the results 1 to 3 in Example 3, it is clear that light in the visible light range, which is not originally absorbed by resin, can also be used in the processing method of the present invention. Moreover, ultraviolet laser light generally has low light conversion efficiency. Therefore, in order to make ultraviolet laser light high-power, a relatively large amount of power is required. In the processing method of the present invention, the output of such an ultraviolet laser with low light conversion efficiency can be reduced, so that the resin member can be processed very efficiently while suppressing power consumption. In addition, since the ultraviolet laser element has low light conversion efficiency, its temperature is easily increased, and there is a concern that the element may be damaged due to the temperature increase. As a countermeasure against such damage to the element due to the temperature increase, it is considered to use multiple ultraviolet laser elements to achieve the desired output while suppressing damage to each ultraviolet laser element. However, in the processing method of the present invention, the output of the ultraviolet laser light required for processing can be suppressed, so that the number of ultraviolet laser elements can be reduced.

[0110] In addition, since the temperature of the resin can be increased without incorporating a light absorbent into the resin or applying a light absorbent to the surface of the resin, the cost of resin processing can be reduced compared to when a light absorbent is used.

[0111] This application claims priority from Japanese Patent Application No. 2019-239647, filed December 27, 2019. The contents of the specification and drawings of said application are incorporated herein by reference in their entirety. [Industrial Applicability]

[0112] According to the processing method of the present invention, it is possible to process a resin-containing member by allowing only the desired region of the resin-containing member to absorb a sufficient amount of light and raise the temperature of the resin-containing member, which is therefore a very useful technique for, for example, the manufacture of various electronic components and devices. [Explanation of symbols]

[0113] 100 Processing equipment 110 XY Stage 111, 211 First member 112 Second member 120 1st light irradiation system 121 First laser light source 122 Mirror No. 1 123 First Light 130 Second light irradiation system 131 Second Laser Light Source 132 2nd Mirror 133 Second light 140 Lens 150 Temperature measurement section 160 Light quantity control unit 200 Plastic parts manufacturing equipment

Claims

1. irradiating a first member including a resin with a first light having a first wavelength; irradiating the resin irradiated with the first light with second light having a second wavelength longer than the first wavelength; Equipped with the wavelength range of the second wavelength is included in a wavelength range in which the light absorptance of the resin is increased by irradiation with the first light, The second wavelength is greater than 400 nm and less than or equal to 550 nm. A method for processing resin components.

2. providing a second member; The method further includes a step of bonding the first member and the second member by contacting the second member with the region of the first member irradiated with the first light and the second light. The method for processing a resin member according to claim 1.

3. The step of irradiating the second light and the step of joining the first member and the second member are performed simultaneously. The method for processing a resin member according to claim 2.

4. The wavelength range of the second wavelength is a wavelength range in which the light absorptance of the resin increases due to a temperature rise of the resin caused by irradiation with the first light. The method for processing a resin member according to any one of claims 1 to 3.

5. The wavelength range of the second wavelength is a wavelength range in which the light absorptance of the resin increases due to an excited triplet state of the resin generated by irradiation with the first light. The method for processing a resin member according to any one of claims 1 to 3.

6. the resin does not absorb the light of the second wavelength in a state where the first light is not irradiated; The method for processing a resin member according to any one of claims 1 to 5.

7. The step of irradiating the first light and the step of irradiating the second light are performed simultaneously. The method for processing a resin member according to any one of claims 1 to 6.

8. the first light and the second light are laser light; The method for processing a resin member according to any one of claims 1 to 7.

9. The first wavelength is 410 nm or less. The method for processing a resin member according to any one of claims 1 to 8.

10. In the step of irradiating the first light and the step of irradiating the second light, a temperature of an area of ​​the first member irradiated with the first light and the second light is measured, and an intensities of the first light and the second light are adjusted in accordance with the temperature of the area of ​​the first member irradiated with the first light and the second light. The method for processing a resin member according to any one of claims 1 to 9.

11. a first light irradiation system for irradiating a resin of a first member containing resin with a first light having a first wavelength; a second light irradiation system for irradiating the resin of the first member with second light having a second wavelength longer than the first wavelength; Equipped with the wavelength range of the second wavelength is included in a wavelength range in which the light absorptance of the resin is increased by irradiation with the first light, The second wavelength is greater than 400 nm and less than or equal to 550 nm. Processing equipment for resin parts.

12. Further, a position control unit is provided for controlling a relative position between the first member and the second member, the position control unit bonds the first member onto which the first light irradiation system and the second light irradiation system have irradiated the first light and the second light, respectively, to the second member; The apparatus for processing a resin member according to claim 11.

13. the first light and the second light are irradiated from the first light irradiation system and the second light irradiation system, respectively, to an interface between the first member and the second member in a state in which the first member and the second member are arranged so as to be in contact with each other; The apparatus for processing a resin member according to claim 11.

14. The wavelength range of the second wavelength is a wavelength range in which the light absorptance of the resin increases due to a temperature rise of the resin caused by irradiation with the first light. The resin member processing device according to any one of claims 11 to 13.

15. The wavelength range of the second wavelength is a wavelength range in which the light absorptance of the resin increases due to an excited triplet state of the resin generated by irradiation with the first light. The resin member processing device according to any one of claims 11 to 13.

16. the first light irradiation system and the second light irradiation system simultaneously irradiate the first light and the second light; The apparatus for processing a resin member according to any one of claims 11 to 15.

17. the first light irradiation system and the second light irradiation system each emit a laser beam; The apparatus for processing a resin member according to any one of claims 11 to 16.

18. The first wavelength is 410 nm or less. The apparatus for processing a resin member according to any one of claims 11 to 17.

19. Further comprising a temperature measuring unit and a light amount control unit, the temperature measurement unit measures a temperature of a region of the first member irradiated with the first light and the second light, the light amount control unit adjusts the intensities of the first light and the second light in response to the temperature measured by the temperature measurement unit. The apparatus for processing a resin member according to any one of claims 11 to 18.

20. irradiating a first member including a resin with a first light having a first wavelength; irradiating the resin irradiated with the first light with second light having a second wavelength longer than the first wavelength; Equipped with the wavelength range of the second wavelength is included in a wavelength range in which the light absorptance of the resin is increased by irradiation with the first light, The second wavelength is greater than 400 nm and less than or equal to 550 nm. Manufacturing method for plastic parts.

21. providing a second member; The method further includes a step of bonding the first member and the second member by contacting the second member with the region of the first member irradiated with the first light and the second light. The method for producing a resin part according to claim 20.

22. The step of irradiating the second light and the step of joining the first member and the second member are performed simultaneously. The method for producing the resin part according to claim 21.

23. The wavelength range of the second wavelength is a wavelength range in which the light absorptance of the resin increases due to a temperature rise of the resin caused by irradiation with the first light. The method for manufacturing a resin part according to any one of claims 20 to 22.

Images