ULTRASONIC PROBE HOUSING WITH SINUSOIDAL INTERFACE AND ASSOCIATED DEVICES, SYSTEMS AND METHODS - Patent application

The sinusoidal interface in the ultrasonic probe housing addresses issues of adhesion line breakage and manufacturing complexity by creating a durable, reliable, and efficiently assembled housing that effectively transmits shear loads.

JP7679381B2Active Publication Date: 2025-05-19KONINKLIJKE PHILIPS NV
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Patent Information

Application Number
JP2022536772
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-12-17
Filing Date
2020-12-10
Publication Date
2025-05-19
Estimated Expiration
2040-12-10

AI Technical Summary

Technical Problem

Current ultrasonic probe housings face issues with adhesion line breakage, high scrap rates due to aesthetic or ergonomic damage, and complex manufacturing processes, which affect the reliability and strength of the housing.

Method used

The implementation of a sinusoidal interface between two housing bodies, featuring a coupling interface with opposing sinusoidal geometries, creates a substantially continuous interface capable of transmitting shear loads effectively. This design promotes component alignment, distributes loads evenly, and eliminates the need for closing tools in manufacturing.

Benefits of technology

The sinusoidal interface enhances the durability and reliability of the ultrasonic probe housing by improving its ability to withstand impact and distribute loads uniformly, while also simplifying the manufacturing process and reducing assembly time.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a medical device housing including a coupling interface having a sinusoidal geometric shape. The housing is formed of a first body and a second body having a corresponding opposing sinusoidal geometric shape. The first body includes a first proximal portion and a first distal portion. The first proximal portion has a first sinusoidal shape. The second body includes a second proximal portion and a second distal portion. The second proximal portion has a second opposing sinusoidal shape. The first body and the second body are coupled to form a handle having a sinusoidal interface. Furthermore, the first distal portion and the second distal portion form a head portion in which an ultrasound transducer assembly is disposed.
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Description

Technical Field

[0001]

[0001] This disclosure generally relates to the structure of an ultrasonic probe, and more particularly, to an ultrasonic probe housing including a sinusoidal interface.

Background Art

[0002]

[0002] An ultrasonic probe is used to non-invasively acquire an ultrasonic image or sonogram of the internal anatomical structure of a patient. An ultrasonic probe typically includes a housing or body forming a handle and an ultrasonic transducer assembly at least partially positioned inside the housing. Ultrasonic probe housings have been developed with unique features for use in a medical environment. For example, it is desirable for an ultrasonic probe to include a housing that meets high aesthetic and ergonomic standards. These housings are also desirably fully sterilizable since they are used on patients in a medical environment. Some conventional ultrasonic probes developed over the years to meet such criteria present manufacturing problems such as high scrap rates due to aesthetic or ergonomic damage and high overall cost. Specifically, the reliability testing of an ultrasonic probe housing affects the overall strength of the housing and exposes problems at the joint of the housing at the adhesion line (also called a seam, interface, or parting line) that cannot withstand impact, which is a common cause of housing breakage.

Summary of the Invention

Problems to be Solved by the Invention

[0003]

[0003] Current ultrasonic probe housings do not adequately address adhesion line breakage. Further, current ultrasonic probe housings are associated with other undesirable manufacturing processes and reliability - related problems. For example, adhesion line breakage has been observed in housings that use room - temperature vulcanizing silicone rubber (RTV) as a gap filler, especially in ultra - mobile sealed transducers. The addition of epoxy - bonded ribs helps improve the adhesion strength to the ultrasonic probe housing, but is only available at separate locations on the housing and is associated with additional manufacturing process complexity and manufacturing time. Additionally, physical joining or fusing techniques introduce additional problems such as damage to delicate electronics, areas of breakage, and misalignment of some parts of the ultrasonic probe housing. For example, some conventional housing designs include post and tube mechanisms or crush rib mechanisms for alignment and retention, which are extremely vulnerable to shear loads.

Means for Solving the Problem

[0004]

[0004] The present application provides an improved interface for a joint portion of a medical device housing that includes a coupling interface having a sinusoidal geometry. The interface is formed with opposing and corresponding sinusoidal geometries between two housing bodies, i.e., the two halves. By joining two housing bodies that are identical but have opposing sinusoidal geometries, a substantially continuous interface capable of effectively transmitting shear loads is formed. In this way, the sinusoidal pattern creates a joining mechanism that promotes component alignment while distributing equilibrium under tensile, compressive, and torsional loads. Further, the coupling interface includes a snap - fit mechanism for providing retention between both bodies of the housing. The incorporated sinusoidal snap - fit mechanism eliminates the need for closing tools in manufacturing and shortens the assembly time.

[0005]

[0005] According to one embodiment of the present disclosure, an ultrasonic probe includes a housing having a first body and a second body, and an ultrasonic transducer assembly. The first body includes a first proximal portion and a first distal portion, and the first proximal portion has a first sinusoidal shape. The second body includes a second proximal portion and a second distal portion. In one aspect, the second proximal portion has a second sinusoidal shape facing each other. In another aspect, the first body and the second body are coupled such that the first sinusoidal shape engages with the second sinusoidal shape to form a sinusoidal interface. In another aspect, the first proximal portion and the second proximal portion form a handle configured to be gripped by a user. In another aspect, the first distal portion and the second distal portion form a head portion. The ultrasonic transducer assembly is configured to acquire ultrasonic data. In one aspect, the ultrasonic transducer assembly is disposed in the head portion of the housing.

[0006]

[0006] In some embodiments, the first body and the second body have a polymer material. In some embodiments, the first body includes a first outer wall portion, and the second body includes a second outer wall portion. In some embodiments, the first outer wall portion and the second outer wall portion extend side by side along the first sinusoidal shape and the second sinusoidal shape, respectively. In some embodiments, the first outer wall portion and the second outer wall portion engage to form a linear interface when the first body is coupled to the second body. In some embodiments, the first outer wall portion and the second outer wall portion are formed and provided in relation to the first sinusoidal shape and the second sinusoidal shape such that the first outer wall portion contacts the second outer wall portion when the first sinusoidal shape engages with the second sinusoidal shape. In some embodiments, the first body includes a protrusion disposed at the sinusoidal interface. In some embodiments, the second body includes a groove disposed at the sinusoidal interface. In some embodiments, the protrusion and the groove lock when the first sinusoidal shape engages with the second sinusoidal shape.

[0007]

[0007] In some embodiments, the protrusions are positioned on the inner surface of the first outer wall portion, and the grooves are positioned on the first sinusoidal shape. In some embodiments, the first body includes a plurality of grooves disposed on a sinusoidal interface. In some embodiments, the second body is configured such that the first body is coupled to the second body to form a housing by a tool-free assembly process, and includes a plurality of grooves disposed on a sinusoidal interface. In some embodiments, the ultrasonic probe further includes an adhesive applied between the first body and the second body at the sinusoidal interface. In some embodiments, the first sinusoidal shape includes a plurality of protrusions and a plurality of recesses. In some embodiments, the first outer wall portion includes a rim. In some embodiments, the plurality of protrusions are positioned on the rim. In some embodiments, the plurality of recesses are at least partially positioned under the rim.

[0008]

[0008] In some embodiments, the ultrasonic probe further includes a cable coupled to the housing, the cable comprising a plurality of conductors electrically coupled to the ultrasonic transducer assembly. In some embodiments, the housing includes a first opening at the distal end of the housing and a second opening at the proximal end of the housing. In some embodiments, the ultrasonic transducer assembly is positioned within the first opening and the cable is positioned within the second opening. In some embodiments, the sinusoidal interface extends between the first opening and the second opening. In some embodiments, the sinusoidal interface has a proximal region extending along the handle and a distal region extending along the head portion, the proximal region and the distal region having different sinusoidal geometries. In some embodiments, the first sinusoidal shape continuously extends along the first proximal portion and the first distal portion of the first body. In some embodiments, the second sinusoidal shape continuously extends along the second proximal portion and the second distal portion of the second body. In some embodiments, the sinusoidal interface has at least three first periods. In some embodiments, the first sinusoidal shape is shifted by a half period from the second sinusoidal shape.

[0009]

[0009] According to another embodiment of the present disclosure, an ultrasonic imaging system includes an ultrasonic probe and a processor circuit that communicates with the ultrasonic probe. The ultrasonic probe includes a housing and an ultrasonic transducer assembly. The housing includes a first body and a second body. The first body includes a first proximal portion and a first distal portion, and the first proximal portion has a first sinusoidal shape. The second body includes a second proximal portion and a second distal portion. In one aspect, the second proximal portion has a second sinusoidal shape facing each other. The first body and the second body are coupled such that the first sinusoidal shape engages with the second sinusoidal shape to form a sinusoidal interface. The first proximal portion and the second proximal portion form a handle configured to be gripped by a user. The first distal portion and the second distal portion form a head portion. The ultrasonic transducer assembly is configured to acquire ultrasonic data and is disposed in the head portion of the housing. The processor circuit is configured to generate an ultrasonic image based on the ultrasonic data and output the ultrasonic image to a display that communicates with the processor circuit.

[0010]

[0010] Additional aspects, features, and advantages of the present disclosure will become apparent from the following detailed description.

[0011]

[0011] Exemplary embodiments of the present disclosure are described with reference to the accompanying drawings.

Brief Description of the Drawings

[0012]

Figure 1

[0012] A diagram of an ultrasonic imaging system including a console and an ultrasonic probe according to an aspect of the present disclosure.

Figure 2

[0013] A perspective view of an ultrasonic probe housing according to an embodiment of the present disclosure.

Figure 3

[0014] A perspective view of a first body of an ultrasonic probe housing having a sinusoidal interface geometry according to an embodiment of the present disclosure.

Figure 4

[0015] Perspective view of a second body of an ultrasonic probe housing having a sinusoidal interface geometry, according to an embodiment of the present disclosure.

Figure 5

[0016] Cutaway view of an ultrasonic probe housing including a crush rib mechanism, according to an embodiment of the present disclosure.

Figure 6

[0017] Cutaway view of an ultrasonic probe housing including a sinusoidal snap-fit interface with play for electronic components, according to an embodiment of the present disclosure.

Figure 7A

[0018] Perspective view of an ultrasonic probe housing including a crush rib mechanism, according to an embodiment of the present disclosure.

Figure 7B

[0019] Perspective view of an ultrasonic probe housing including a crush rib mechanism, according to an embodiment of the present disclosure.

Figure 8A

[0020] Perspective view of an ultrasonic probe housing including a sinusoidal snap-fit interface, according to an embodiment of the present disclosure.

Figure 8B

[0021] Perspective view of an ultrasonic probe housing including a sinusoidal snap-fit interface, according to an embodiment of the present disclosure.

Figure 9

[0022] Graph of a finite element analysis model demonstrating the stress in the ultrasonic probe housing in the x-direction under an axial load condition, according to an embodiment of the present disclosure.

Figure 10

[0023] Graph of a finite element analysis model demonstrating the stress in the ultrasonic probe housing in the y-direction under an axial load condition, according to an embodiment of the present disclosure.

Figure 11

[0024] Graph of a finite element analysis model demonstrating the stress in the ultrasonic probe housing in the x-y direction under an axial load condition, according to an embodiment of the present disclosure.

Figure 12

[0025] A graph of a finite element analysis model demonstrating the stress in the x - direction under shear load conditions of an ultrasonic probe housing with a sinusoidal curve interface according to an embodiment of the present disclosure.

Figure 13

[0026] A graph of a finite element analysis model demonstrating the stress in the y - direction of an ultrasonic probe housing under shear load conditions according to an embodiment of the present disclosure.

Figure 14

[0027] A graph of a finite element analysis model demonstrating the shear stress in the x - y direction of an ultrasonic probe housing under shear load conditions according to an embodiment of the present disclosure.

Figure 15

[0028] A flowchart of a method for assembling an ultrasonic probe housing with a sinusoidal snap - fit interface according to an embodiment of the present disclosure.

Figure 16

[0029] A schematic diagram of a processor circuit according to an embodiment of the present disclosure.

Best Mode for Carrying Out the Invention

[0013]

[0030] For the purpose of facilitating understanding of the principles of the present disclosure, reference is hereby made to the embodiments shown in the drawings, and specific terminology is used to describe the same. It should still be understood that no limitation to the scope of the disclosure is intended. Any alternative and further modifications to the devices, systems, and methods described, and any further applications of the principles of the present disclosure are fully contemplated and are included within the scope of the disclosure as would be ordinarily conceived by those skilled in the art to which the disclosure pertains. For example, although a medical device housing is considered as an ultrasonic probe housing, it is understood that it is not intended to be limited to this application. Specifically, it is fully contemplated that the mechanisms, components, and / or steps described with respect to one embodiment may be combined with the mechanisms, components, and / or steps described with respect to other embodiments of the present disclosure. However, for the sake of simplicity, the repetition of these numerous combinations is not described separately.

[0014]

[0031] FIG. 1 is a diagram of an ultrasonic imaging system 100 according to an aspect of the present disclosure. The ultrasonic imaging system 100 includes a console 102 and an ultrasonic probe 108. The ultrasonic imaging system 100 is used to acquire and display ultrasonic images of anatomical structures. In some situations, the system 100 is implemented with additional elements and / or without one or more of the elements shown in FIG. 1.

[0015]

[0032] The ultrasonic probe 108 is sized, shaped, structurally arranged, and / or otherwise configured to be placed on or near the subject's anatomical structure to visualize the anatomical structure within the subject's body. The subject is a human patient or an animal. The ultrasonic probe 108 is positioned outside the subject's body. In some embodiments, the ultrasonic probe 108 is positioned proximate to or in contact with the subject's body. For example, the ultrasonic probe 108 is placed directly on or adjacent to the subject's body. The appearance of the anatomical structure shown in the ultrasonic image depends on the position and orientation of the ultrasonic probe 108. To acquire ultrasonic data of the anatomical structure, since the ultrasonic probe 108 can be appropriately positioned and oriented by a user such as a physician, a sonographer, and / or other medical personnel, the transducer array 112 emits ultrasonic waves and receives ultrasonic echoes from a desired portion of the anatomical structure. The ultrasonic probe 108 is portable and suitable for use in a medical environment. In some examples, the ultrasonic probe 108 may be referred to as an ultrasonic imaging device, a diagnostic imaging device, an external imaging device, a transthoracic echocardiogram (TTE) probe, and / or a combination thereof.

[0016]

[0033] The ultrasonic probe 108 includes a housing 110 that is structurally arranged, sized, shaped, and / or otherwise configured to be hand-held and gripped by a user. The housing 110 may be referred to as a handle in some embodiments. In other embodiments, the proximal portion 107 of the housing 110 may be referred to as a handle. For example, the housing 110 includes a handle or handle portion and a probe head or head portion. The housing 110 surrounds and protects various components of the imaging device 108, such as the electronic circuit 116 and the transducer array 112. An internal structure, such as a space frame for fixing the various components, is positioned within the housing 110. In some embodiments, the housing 110 includes two or more parts that are joined together during manufacture. The housing 110 can be formed from any suitable material, including plastic, polymeric material, composite material, or combinations thereof.

[0017]

[0034] The housing 110 and / or the ultrasonic probe 108 includes a proximal portion 107 that terminates at a proximal end 117 and a distal portion 105 that terminates at a distal end 115. The proximal portion 107 is referred to as a handle or handle portion in some embodiments and is grippable by a user. The distal portion 105 is referred to as a probe head or head portion and includes or houses an imaging assembly. All or a portion of the imaging assembly of the ultrasonic probe 108 can define the distal end 115. The transducer array 112 can be coupled directly or indirectly to the housing 110. The operator of the ultrasonic probe 108 contacts the distal end 115 of the ultrasonic probe 108 with the patient's body such that the anatomical structure is elastically compressed. For example, the imaging assembly including the transducer array 112 is disposed directly on or adjacent to the subject's body. In some examples, the distal portion 105 is disposed in direct contact with the subject's body such that the transducer array 112 is adjacent to the subject's body.

[0018]

[0035] The ultrasonic probe 108 is configured to acquire ultrasonic imaging data associated with any suitable anatomical structure of a patient. For example, the ultrasonic probe 108 can be used to examine any number of anatomical locations and tissue types, including but not limited to organs such as the liver, heart, kidney, gallbladder, pancreas, and lungs, ducts, intestinal tracts, the nervous system structures including the brain, dural sac, spinal cord, and peripheral nerves, the urinary tract, and valves, blood, ventricles or other parts of the heart and / or other systems of the body within blood vessels. The anatomical structure can be a blood vessel such as an artery or vein of the patient's vascular system, including the cardiovascular system, peripheral vascular system, neurovascular system, renal vascular system, and / or any other suitable internal body lumen. In addition to native structures, the ultrasonic probe 108 is used to examine artificial structures such as, but not limited to, heart valves, stents, shunts, filters, and other devices.

[0019]

[0036] The transducer array 112 is configured to emit ultrasonic signals and receive ultrasonic echo signals corresponding to the emitted ultrasonic signals. The echo signals are reflections of the ultrasonic signals from anatomical structures in the subject's body. The ultrasonic echo signals are processed by the electronic circuit 116 within the ultrasonic probe 108 and / or the console 102 to generate an ultrasonic image. The transducer array 112 is part of the imaging assembly of the ultrasonic probe 108 and includes an acoustic window / lens, a matching material on the transmitting side of the transducer array 112, and an acoustic backing material on the back side of the transducer array 112. The acoustic window and the matching material have acoustic properties that facilitate the propagation of ultrasonic energy in a desired direction (e.g., outward, into the patient's body) from the transmitting side of the transducer array 112. The backing material has acoustic properties that impede or limit the propagation of ultrasonic energy in an undesired direction (e.g., inward, away from the patient's body) from the back side of the transducer array 112.

[0020]

[0037] The transducer array 112 includes any number of transducer elements. For example, the array can include from 1 to 10,000 acoustic elements, such as values of 2 acoustic elements, 4 acoustic elements, 15 acoustic elements, 64 acoustic elements, 128 acoustic elements, 500 acoustic elements, 812 acoustic elements, 3,000 acoustic elements, 9,000 acoustic elements, and / or other values greater than and less than those. The transducer elements of the transducer array 112 are arranged in any suitable configuration, such as a linear array, a planar array, a curved array, a curved array, a circumferential array, an annular array, a phased array, a matrix array, a one-dimensional (1D) array, a 1.x-dimensional array (e.g., 1.5D array), or a two-dimensional (2D) array. The array of transducer elements (e.g., arranged in one or more columns, one or more rows, and / or one or more orientations) can be controlled and operated uniformly or independently. The transducer array 112 can be configured to acquire one-dimensional, two-dimensional, and / or three-dimensional images of a patient's anatomical structure. The ultrasonic transducer elements are piezoelectric / piezoresistive elements, piezoelectric micromachined ultrasonic transducer (PMUT) elements, capacitive micromachined ultrasonic transducer (CMUT) elements, and / or any other suitable type of ultrasonic transducer elements.

[0021]

[0038] The transducer array 112 is in communication with (e.g., electrically coupled to) the electronic circuit 116. The electronic circuit 116 can be any suitable passive component or active electronic component such as an integrated circuit (IC) for controlling the transducer array 112 to acquire ultrasonic imaging data and / or for processing the acquired ultrasonic imaging data. For example, the electronic circuit 116 includes one or more transducer control logic dies. The electronic circuit 116 includes one or more application-specific integrated circuits (ASICs). In some embodiments, one or more of the ICs include a microbeamformer (μBF), an acquisition controller, a transceiver, a power circuit, a multiplexer circuit (MUX), and the like. In some embodiments, the electronic circuit 116 includes a processor, a memory, a gyroscope, and / or an accelerometer. The electronic circuit 116 is disposed within the ultrasonic probe 108 and surrounded by the housing 110.

[0022]

[0039] The ultrasonic probe 108 includes a cable 114 to provide signal transmission between the console 102 and one or more components of the ultrasonic probe 108 (e.g., the transducer array 112 and / or the electronic circuit 116). The cable 114 includes a plurality of electrical conductors 120 configured to carry electrical signals between the console 102 and the ultrasonic probe 108. The electrical conductors 120 can be bare wires surrounded by one or more layers of insulating material. The insulating material is typically a polymer-based composite, nylon, and / or polyvinyl chloride (PVC) synthetic plastic polymer. For example, an electrical signal representing imaging data acquired by the transducer array 112 can be transmitted from the ultrasonic probe 108 to the console 102 via the electrical conductors 120. Control signals and / or power can be transmitted from the console 102 to the ultrasonic probe 108 via the electrical conductors 120. The cable 114 and / or the electrical conductors 120 provide any type of wired connection such as a dedicated connection, an Ethernet connection, any type of universal serial bus (USB) connection, or any type of mini-USB.

[0023]

[0040] Cable 114 can also include a conduit 118 that surrounds the electrical conductor 120. The conduit 118 is formed as a tube and is used to protect and route the electrical conductor 120 within the cable 114 of the ultrasonic imaging device 108. The conduit 118 can be flexible and can be made of a polymer, plastic, metal, fiber, other suitable materials, and / or combinations thereof. The conduit 118 protects the electrical conductor 120 by avoiding direct exposure of the electrical conductor 120 to external elements. The distal portion 109 of the cable 114 is coupled to the proximal portion 107 of the housing 110 of the ultrasonic probe 108. The cable 114 also includes one or more strain relief structures positioned at the proximal portion 107 of the housing 110 and a connector 124.

[0024]

[0041] The connector 124 is disposed at the proximal portion 113 of the cable 114. The connector 124 is configured to removably couple to the console 102. Signal transmission between the ultrasonic probe 108 and the console 102 is established when the connector 124 is received within the insertion port 103 of the console 102. In that regard, the ultrasonic probe 108 can be electrically and / or mechanically coupled to the console 102. The console 102, in some examples, may be referred to as a computer or a computing device. The console 102 includes a user interface 104 and a display 106. The console 102 is configured to process the imaging data acquired by the ultrasonic probe 108 to generate an ultrasonic image and output the ultrasonic image on the display 106. The user can control the acquisition of ultrasonic imaging data by the ultrasonic probe 108 and / or the display of the ultrasonic image by providing an input at the user interface 104. The imaging device 108 and the display 106 are communicatively coupled to the console 102 directly or indirectly.

[0025]

[0042] One or more image processing steps can be completed by the console 102 and / or the ultrasonic probe 108. The console 102 and / or the ultrasonic probe 108 can include one or more processors that communicate with a memory. The processor can be an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a central processing unit (CPU), a digital signal processor (DSP), another hardware device, a firmware device, or any combination thereof configured to perform the operations described herein. In some embodiments, the memory is a random access memory (RAM). In other embodiments, the memory can be a cache memory (e.g., a processor cache memory), a magnetoresistive RAM (MRAM), a read only memory (ROM), a programmable read only memory (PROM), an erasable programmable read only memory (EPROM), an electrically erasable programmable read only memory (EEPROM), a flash memory, a solid state memory device, a hard disk drive, other forms of volatile and non-volatile memory, or a combination of different types of memory. In some embodiments, the memory includes a non-transitory computer-readable medium. The memory stores instructions. The instructions include instructions that, when executed by the processor, cause the processor to perform the operations described herein.

[0026]

[0043] In some embodiments, the console 102 includes a movable cart to which a user interface 104, a display 106, and a processor are coupled. In some embodiments, the console 102 includes a desktop computer. In some embodiments, the console 102 includes a mobile device (e.g., a smartphone, a tablet, a laptop, or a personal digital assistant (PDA)) having an integrated processor, memory, and display. For example, the touch screen of the mobile device can be the user interface 104 and the display 106.

[0027]

[0044] FIG. 2 shows an ultrasonic probe housing 200 that includes a first body 202 and a second body 204 joined together along a seam, adhesive line, or interface 206. In that regard, the first body 202 and the second body 204 are referred to as one side of the housing. The first body 202 and the second body 204 are so called for ease of reference, but the first body 202 and the second body 204 may be distinguished in other ways, such as male part 202 and female part 204, upper and lower, etc. In some embodiments, the first body 202 and the second body 204 are configured to be joined together with a tongue-and-groove type connection and / or a sinusoidal snap-fit mechanism, which will be further described below. Specifically, the first body 202 includes an extension, protrusion, projection, or energy waveguide, and the second body 204 includes a groove, protrusion, projection, recess, or opening. However, the bodies 202, 204 may be joined in other ways, such as an adhesive bond of substantially similar surfaces on both bodies 202, 204, or a combination of an adhesive and an interface of unique geometry. Further, although the housing 200 is shown as being formed from two bodies 202, 204 of relatively the same size, it should be understood that other numbers of bodies of various sizes (i.e., three, four, or five parts) may be used to form the housing 200. The bodies 202, 204 are formed from a plastic material or a polymer material. For example, the bodies 202, 204 include acrylonitrile butadiene styrene (ABS), polysulfone (PSU), and polybutylene terephthalate (PBT). In some embodiments, the material includes glass fibers.

[0028]

[0045] As discussed with reference to FIG. 1, the housing 200 is sized and shaped in a similar manner to the handle 110. The housing 200 includes an opening 210 at the distal portion (i.e., for the transducer assembly) and an opening 208 at the proximal portion (i.e., for a data interface such as a connector or wire, such as connector 124 and / or cable 114). The opening 208 in the proximal portion of the housing 200 is configured to engage and / or couple with the conduit 118 of the cable 114 and / or the strain relief mechanism. In an exemplary embodiment, the interface 206 extends longitudinally along both sides of the housing 200 from the proximal portion to the distal portion and / or along the length from the opening 208 to the opening 210. The housing 200 is sized and shaped to be gripped by a user and used in a medical environment. The first body 202 and the second body 204 of the housing 200 are joined together at the interface 206 by a sinusoidal snap-fit mechanism, as will be discussed in more detail with reference to FIGS. 3-4. In some embodiments, a sealant is used alone or in addition to the snap-fit mechanism. The sealant includes an epoxy resin that is applied over the sinusoidal interface 206 and cured to bond the first body and the second body 204 at the interface 206. In some aspects, the housing 200 employs the sealant for one or both of the first body 202 and the second body 204, and uses the sinusoidal snap-fit mechanism to join the bodies 202, 204 through the sealant. The sinusoidal snap-fit mechanism is positioned and / or distributed between one of two housings (i.e., the first body 202 and the second body 204) that are identical but have sinusoidal geometries in facing relationship, in the form of a sine wave or a periodic structure. When the first body 202 and the second body 204 are snap-fitted or joined together, they form a continuous interface joint that provides retention for both bodies 202, 204. The presence of the continuous interface 206 allows for more effective transmission of shear loads along the length of the housing 200.

[0029]

[0046] As mentioned above, in some embodiments, the bodies 202, 204 of the housing 200 are joined or bonded to form an interface having a sinusoidal geometry. The interface 206 having a sinusoidal geometry increases the strength and / or resistance to shock of the transducer probe housing 200 by changing or dispersing the load path throughout the housing. In that regard, the sinusoidal geometry expands the contact area between the two housing bodies or between one side of the housing, which ultimately facilitates the transfer of load. By canceling the tensile load with the corresponding compressive load, stress equilibrium is achieved within the housing. This results in effective load transfer at the housing interface 206 while suppressing the presence of stress concentration. Specifically, the exemplary side interface 206 having a sinusoidal geometry prevents misalignment between portions or bodies of the housing, which is a problem in conventional probe housings.

[0030]

[0047] FIG. 3 is a perspective view of a first body 300 of an ultrasonic probe housing having a sinusoidal interface, according to an embodiment of the present disclosure. In some embodiments, the first body 300 includes a first proximal portion 105 and a second distal portion 207. The first body 300 includes a first sinusoidal shape or portion 326, a second sinusoidal shape 328, a first outer wall portion 305 that extends laterally alongside the first sinusoidal shape 326 and is positioned outside thereof, and a second outer wall portion 307 that extends laterally alongside the second sinusoidal shape 328 and is positioned outside thereof. The outer wall portions 305, 307 also include edges, also referred to as left and right opposite edges, or first and second opposite edges. The outer wall portions 305, 307 are positioned on opposing sides of the first body 300 and include a geometry and / or mechanism for joining the outer wall portions 305, 307 of the first body 300 to the outer wall portions 405, 407 (FIG. 4) of the second body 400. The outer wall portions 305, 307 include a flat or substantially flat rim that extends laterally alongside the sinusoidal shapes 326, 328 from the proximal portion 105 of the first body 300 to the distal end 303. The sinusoidal shapes 326, 328 form or include a first portion of the wall thickness of the first body 300, and the outer wall portions 305, 307 form or include a second portion of the wall thickness. Specifically, the outer wall portions 305, 307 form the outer portion of the wall thickness, and the sinusoidal shapes 326, 328 form the inner portion of the wall thickness. In other embodiments, the sinusoidal shapes 326, 328 and the outer wall portions 305, 307 may be interchanged such that the sinusoidal shapes 326, 328 include the outer portion of the wall thickness and the outer wall portions 305, 307 include the inner portion of the wall thickness. It should be understood that the sinusoidal geometry is not limited to sinusoidal-type curves and includes various periodic geometries, including smooth curves, flat surfaces, pointed surfaces, and / or combinations thereof.

[0031]

[0048] In the illustrated embodiment, the sinusoidal shapes 326, 328 include a protrusion 306 extending from the tip of the proximal portion 105 to the proximal end 301 of the distal portion 107 and a recess 308. The sinusoidal shapes 326, 328 include mechanisms that are the same and / or different in size from each other and / or have the same and / or different amplitudes from each other. In some embodiments, the protrusion 306 and the recess 308 may be referred to as positive and negative amplitudes or concave and convex regions, although different specialized terms are used with respect to the geometry of these mechanisms. The distal portion 107 of the first body 300 includes additional recesses 310, 312 and protrusions 320, 322, which form a sinusoidal geometry different from the sinusoidal shapes 326, 328. In other embodiments, the sinusoidal shapes 326, 328 extend continuously from the proximal portion 105 to the distal portion 107. The mechanisms 310, 312, 320, 322 are positioned to engage or couple with the mechanisms 408, 410, 412, 414 (FIG. 4) of the second body 400. The mechanisms 310, 312, 320, 322 are positioned between the proximal end 301 and the distal end 303 of the distal portion 107 of the first body 300. In some embodiments, the outer wall portions 305, 307 of the first body 300 include mechanisms such as a bayonet mechanism, slots, protrusions, and / or other mechanisms for aligning and joining the bodies 300, 400. Specifically, the first body 300 includes a retaining mechanism 304 in the shape of a hollow bar that extends inwardly from the inner surface of the first body 300. The retaining mechanism 304 is configured to fit into a protrusion 318 (FIG. 4) of the second body 400. In the illustrated embodiment, the first body 300 includes a protrusion 318 positioned on the inner surface of the outer wall portion 307 and a flat rectangular shape configured to fit into the retaining mechanism 304 (FIG. 4) of the second body 400. In the embodiment shown in FIG. 3, the recessed region 306 of the first body 300 includes a locking protrusion 314 configured to be positioned within a corresponding groove or slot 404 (FIG. 4). The protrusion 314 includes a mechanism like a return, is sized, shaped, and otherwise structurally arranged to be inserted into the groove 404. In some aspects, the protrusion 314 and the groove 404 are referred to as a snap-fit mechanism.The protrusions 314 and grooves 404 facilitate the attachment between the first body 300 and the second body 400. The protrusions 314 are formed to fit into the gaps 404 (FIG. 4) of the second body 400 when the first body 300 is aligned with and joined to the second body 400 and the sinusoidal shapes 326, 328 of the first body 300 engage the sinusoidal shapes 426, 428 of the second body 400. It should be understood that the locking mechanisms 314, 404 include different structural geometries and / or retaining components such as slots, dowels, interference fits, shear joints, latches, detents and / or combinations thereof.

[0032]

[0049] FIG. 4 is a perspective view of a second body 400 of an ultrasonic probe housing having a sinusoidal interface according to an embodiment of the present disclosure. The second body 400 includes a mechanism similar to or the same as that of the first body 300 shown in FIG. 3. In the illustrated embodiment, the second body 400 includes a second proximal portion 105 and a second distal portion 107. The second body 400 includes a first sinusoidal shape 426, a second sinusoidal shape 428, a first outer wall portion 405 that extends laterally alongside the first sinusoidal shape 426 and is positioned outside thereof, and a second outer wall portion 407 that extends laterally alongside the second sinusoidal shape 428 and is positioned outside thereof. The sinusoidal shapes 426, 428 include protrusions 402 and recesses 406. In the illustrated embodiment, the outer wall portions 405, 407, protrusions 402, and recesses 406 have shapes and dimensions complementary to the shapes and dimensions of the outer wall portions 305, 307, protrusions 306, and recesses 308 of the first body 300 in FIG. 3. In the embodiment of FIG. 4, the first sinusoidal shape 426 and the second sinusoidal shape 428 of the second body 400 are sized, shaped, and structurally arranged to engage with the first sinusoidal shape 326 and the second sinusoidal shape 328 of the first body 300 to form a sinusoidal interface. In that regard, the first sinusoidal shape 426 and the second sinusoidal shape 428 include mechanisms, structures, and sizes similar to or complementary to those of the first sinusoidal shape 326 and the second sinusoidal shape 328 shown in FIG. 3. Specifically, the protrusion 402 of the second body 400 includes a groove 404 formed to fit with the protrusion 314 illustrated in FIG. 3. Further, the outer wall portions 405, 407 of the second body 400 are sized, shaped, and structurally arranged to form a linear interface when the sinusoidal shapes 326, 328 of the first body 300 engage with the sinusoidal shapes 426, 428 of the second body such that the outer wall portions 405, 407 of the second body 400 contact the outer wall portions 305, 307 of the first body 300. In the illustrated embodiment, the recesses 406 of the sinusoidal shapes 426, 428 of the second body 400 do not include any mechanisms such as grooves, protrusions, ridges, etc.However, in other embodiments, the recess 406 may comprise a retaining mechanism such as a protrusion, groove, slot, barb, latch, or any other mechanism suitable for facilitating the coupling of the first body 300 and the second body 400.

[0033]

[0050] The embodiments shown in FIGS. 2-4 describe a probe housing formed of two bodies or one side, but it should be understood that the present disclosure contemplates embodiments including three or more bodies each including a respective sinusoidal coupling interface including any other suitable number of bodies, including both three, four, five, or greater and less than these.

[0034]

[0051] The sinusoidal interface formed between the bodies of the ultrasonic probe housing can be adapted to different shape factors and sizes, for example in this form, i.e., using different parameters of the sine wave y = Asin(Px), where the parameters A and P represent the amplitude and period of the wave, respectively. The amplitude is relatively the same among models having a nominal value of approximately 4 mm, and the period is calculated based on the length of the housing and has three or more periods per face. However, other amplitudes and / or periods are also contemplated, including any other values including both 1 mm, 2 mm, 3 mm, 5 mm, 10 mm, 15 mm, 30 mm and greater and less than these. The present disclosure also contemplates including any suitable number of periods, including any other suitable number of periods including 1, 2, 3, 4, 5, 6, 8, 10, 15, 20 or greater and less than these. It should also be understood that the present disclosure contemplates other probe housing types, shapes, and / or sizes other than those specifically illustrated.

[0035]

[0052] The sinusoidal geometry and / or snap-fit mechanism (e.g., protrusions 314, grooves 404) of the probe housing is consistent among different probe housings of different sizes and types. The snap-fit mechanism is relatively small so that they can be used in smaller ultrasonic probe housings or larger ultrasonic probe housings. The use of the sinusoidal snap-fit mechanism in a manufacturing environment simplifies the current manufacturing assembly process. In some embodiments, an adhesive for sealing is applied to a portion of the housing near the interface before a portion or body of the housing is snap-fitted together. The adhesive forms a barrier layer that can reduce friction and wear between the body or portions of the housing. This replaces the assembly process steps that include placing the housing into a closure fixture and / or rotating a screw to close the seam.

[0036]

[0053] FIG. 5 is a cutaway view of the head of a conventional ultrasonic probe housing 500, which includes a standard crush rib mechanism. An ultrasonic transducer assembly 510 is coupled to the housing 500 and is oriented to emit ultrasonic energy distally of the probe housing 500. In the side region 505, the conventional housing 500 has no play at each edge 502, 508 between the outer wall of the probe housing 500 and the ultrasonic transducer assembly 510. The lack of play in the conventional housing can make the components of the transducer assembly vulnerable to damage if an impact occurs to the housing during transportation and use.

[0037]

[0054] FIG. 6 is a cutaway view of the head of an ultrasonic probe housing 600 including a sinusoidal snap-fit mechanism according to an embodiment of the present disclosure. The ultrasonic probe housing 600 includes an ultrasonic transducer assembly 610 positioned and fixed therein. Specifically, the ultrasonic transducer assembly 610 includes a transducer array 604 positioned at the distal end of the ultrasonic transducer assembly and oriented to emit ultrasonic energy in the distal direction of the housing 600. In the illustrated embodiment, the sinusoidal interface utilizes the wall thickness of the probe housing 600 and does not include a crush rib mechanism protruding into the side region 605 of the internal cavity of the housing 600. This allows for more play on each of the edges 602, 608 between the wall of the housing 600 and the ultrasonic transducer assembly 610, protecting the components of the transducer assembly 610 in the event of an impact.

[0038]

[0055] FIGS. 7-14 illustrate the analysis of various physical and simulated failures related to an ultrasonic probe housing having a sinusoidal snap-fit interface according to aspects of the present disclosure. Although the specific structure and / or materials of the probe may vary, all embodiments are sized, shaped, structurally arranged, and / or otherwise configured to exhibit characteristics such as durability against impact, uniform load transfer, improved alignment, elimination of designs with sharp edges, and reduced mold complexity. For example, the probe related to the analysis described below has the shape, features, and structural arrangement of the probe illustrated above with respect to FIGS. 2-4.

[0039]

[0056] FIGS. 7A and 7B are perspective views of a conventional probe housing 700 including a crush rib design. Specifically, FIGS. 7A and 7B show the results of a conventional ultrasonic probe housing 700 with a crush rib mechanism resulting from a drop test or an impact test, and a breakage 704. The breakage 704 in the conventional probe is significant and is associated with the crush rib mechanism. In contrast, FIGS. 8A and 8B are perspective views of a probe housing 800 including a sinusoidal snap fit structure 808 according to an embodiment of the present disclosure. The probe housing 800 is molded from the same material as the probe housing 700 of FIGS. 7A and 7B and has undergone the same drop test as the probe housing 700 illustrated in FIGS. 7A and 7B. As shown, the probe housing 800 with a sinusoidal interface indicates increased durability against impacts as the breakage 804 is not as severe.

[0040]

[0057] Further advantages of an exemplary sinusoidal snap fit design interface between two bodies of an ultrasonic probe housing are illustrated in FIGS. 9-14. FIGS. 9-14 illustrate the results of simulated stress analyses under different loading conditions. In some embodiments, the simulated stress analysis is performed using advanced finite element simulation software such as ANSYS, COMSOL, SolidWorks, Fluent, or combinations thereof. To demonstrate load transfer using the sinusoidal geometry, two simple finite element models are used, one to demonstrate axial loading (illustrated in FIGS. 9-11) and the other to demonstrate shear loading (illustrated in FIGS. 12-14). The results from the finite element analysis show that the sinusoidal interface effectively transfers the load and reduces or eliminates areas of high stress concentration on the sinusoidal interface. FIG. 9 shows a finite element analysis model 900 demonstrating stress dispersion points (e.g., 904, 906, 908, 910) in the x-direction 903 under an axial load 902 condition of an ultrasonic probe housing with a sinusoidal interface according to an embodiment of the present disclosure.

[0041]

[0058] FIG. 10 shows a finite element analysis model 1000 demonstrating stress dispersion points (e.g., 1004, 1006, 1008, 1010, 1012) similar to the model 900 shown in FIG. 9 in the y-direction 905 under the axial load 902 condition of an ultrasonic probe housing with a sinusoidal interface according to an embodiment of the present disclosure. FIG. 11 shows a finite element analysis model 1100 demonstrating shear stress dispersion points (e.g., 1104, 1106, 1108) in the x-y directions 903, 905 under the axial load 1102 condition of an ultrasonic probe housing with a sinusoidal interface according to an embodiment of the present disclosure. In the illustrated embodiments of FIGS. 9-11, the exemplary design with a sinusoidal interface under the axial load condition effectively cancels out the tensile and compressive stresses generated in the normal stress directions along the x-axis (FIG. 9) and y-axis (FIG. 10), while the shear stress in the x-y direction (FIG. 11) is uniformly transmitted throughout the interface.

[0042]

[0059] Similarly, FIG. 12 shows a finite element analysis model 1200 demonstrating stress dispersion points (e.g., 1204, 1206, 1208, 1210) in the x-direction 903 under the shear load 1202 condition of an ultrasonic probe housing with a sinusoidal interface according to an embodiment of the present disclosure.

[0043]

[0060] Figure 13 shows a finite element analysis model 1300 demonstrating stress dispersion points (e.g., 1304, 1306, 1308, 1310, 1312, 1314) similar to those of the model 1200 shown in FIG. 12 in the y-direction 905 under a shear load 1302 of an ultrasonic probe housing with a sinusoidal interface according to an embodiment of the present disclosure. In the illustrated embodiment of FIG. 14, the finite element analysis model 1400 shows a finite element analysis model 1400 demonstrating shear stress dispersion points (e.g., 1404, 1406, 1408, 1410) in the x-y directions 903, 905 under a similar shear load 1402 of an ultrasonic probe housing with a sinusoidal interface according to an embodiment of the present disclosure. In the illustrated embodiments of FIGS. 12-14, the exemplary design with a sinusoidal interface under shear load conditions cancels out tensile and compressive stresses generated in the normal stress directions along the x-axis (FIG. 12) and y-axis (FIG. 13), while the shear stress in the x-y direction (FIG. 14) is uniformly transmitted throughout the interface.

[0044]

[0061] To fabricate an ultrasonic probe housing with a sinusoidal interface, several different conventional and non-conventional manufacturing techniques are used, including injection molding, casting, 3D printing, laser cutting and microstructuring, extrusion, micromachining, co-forming, punching, electron beam melting, and / or other suitable techniques, based on the material, mechanism, and structure of the interface. It should be understood that no limitation or suggestion to any particular manufacturing technique is intended or implied from the teachings of the disclosed principles.

[0045]

[0062] The structure of the probe with an exemplary sinusoidal interface is selected based on the size, shape, functional purpose, and / or type of the ultrasonic probe. Thus, an advantageous structural arrangement with appropriate length, width, and height is adopted, which may utilize shapes consisting of arcs, triangles, cones, parabolas, polygons, and / or straight lines, not only including the shapes discussed herein. The sinusoidal interface includes any number of periods and amplitudes, such as 1, 2, 5, 10, or more, and combinations of various mechanisms. All exemplary variations of the interface are included in the ultrasonic probe. Advantageously, the sinusoidal interface incorporates various material properties and structures that can facilitate a number of purposes for any assembly incorporating the treatment device.

[0046]

[0063] FIG. 15 shows a flowchart illustrating an exemplary method 1500 of forming a medical device housing with a sinusoidal snap-fit interface geometry. The steps of method 1500 are shown with reference to steps 1502, 1504, 1506, 1508, 1510 of FIG. 15. In step 1502, method 1500 includes applying a layer of sealant / adhesive to a first body that includes a sinusoidal geometry. The sealant functions as a barrier layer to prevent friction that may cause wear and cracking when the female and male portions are joined.

[0047]

[0064] In step 1504, method 1500 includes aligning a first body with a second body that is complementary or has a mating sinusoidal geometry configured to engage the sinusoidal geometry of the first body. In this step 1504, the enlarged contact area between the first body and the second body is ensured, promoting uniform load transfer and resulting in a connection that is more adaptable to shear loads than conventional ultrasonic probes.

[0048]

[0065] In step 1506, method 1500 includes coupling a first body and a second body having a sinusoidal snap-fit geometry such that the first body and the second body form a sinusoidal interface. The formation of the sinusoidal interface between the first body and the second body reduces the likelihood of misalignment of the two housing bodies, which was a problem in conventional housing designs.

[0049]

[0066] In step 1508, method 1500 includes engaging a snap-fit mechanism of the first body and the second body to secure the first body to the second body. In some embodiments, steps 1506 and 1508 are performed using a single operation. The incorporated snap-fit mechanism eliminates the need for assembly tools during manufacturing. Additional mechanical retention between the housing bodies also reduces the chance of gaps forming within the housing.

[0050]

[0067] In step 1510, method 1500 further includes enabling the sealant to fully cure and forming a final enclosure assembly of the ultrasonic probe.

[0051]

[0068] FIG. 16 is a schematic diagram of a processor circuit 150 according to an embodiment of the present disclosure. Processor circuit 150 is implemented in console 102 and / or imaging probe 108 of FIG. 1. As shown, processor circuit 150 includes a processor 160, a memory 164, and a communication module 168. These elements communicate with each other directly or indirectly, for example, via one or more buses.

[0052]

[0069] Processor 160 includes a central processing unit (CPU), a digital signal processor (DSP), an ASIC, a controller, an FPGA, another hardware device, a firmware device, or any combination thereof configured to perform the operations described herein. Processor 160 may also be implemented as a combination of computing devices such as, for example, a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

[0053]

[0070] Memory 164 includes cache memory (e.g., cache memory of processor 160), random access memory (RAM), magnetoresistive RAM (MRAM), read only memory (ROM), programmable read only memory (PROM), erasable programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), flash memory, solid state memory devices, hard disk drives, other forms of volatile and non-volatile memory, or combinations of different types of memory. In one embodiment, memory 164 includes a non-transitory computer-readable medium. Memory 164 stores instructions 166. Instructions 166, when executed by processor 160, cause processor 160 to perform the operations described herein with reference to console 102 and / or ultrasonic probe 108 (FIG. 1). Instructions 166 are also referred to as code. The terms "instructions" and "code" should be construed broadly to include any type of computer-readable statement. For example, the terms "instructions" and "code" refer to one or more programs, routines, subroutines, functions, procedures, etc. "Instructions" and "code" include a single computer-readable statement or many computer-readable statements.

[0054]

[0071] The communication module 168 can include any electronic and / or logic circuitry to facilitate direct or indirect transfer of data between the processor circuitry 150, the imaging device 102, and / or the display 106. In that regard, the communication module 168 can be an input / output (I / O) device. In some examples, the communication module 168 facilitates direct or indirect communication between various elements of the processor circuitry 150 and / or the console 102 (FIG. 1).

[0055]

[0072] One of ordinary skill in the art will understand that the apparatus, systems, and methods described above can be varied in many ways. Accordingly, one of ordinary skill in the art will understand that the embodiments encompassed by this disclosure are not limited to the specific exemplary embodiments described above. In that regard, while exemplary embodiments have been shown and described, a wide range of modifications, changes, and substitutions are contemplated in the above disclosure. It should be understood that such variations can be made to the foregoing without departing from the scope of this disclosure. Accordingly, it should be understood that the appended claims are to be interpreted broadly and in a manner consistent with this disclosure.

Claims

1. a first body having a first proximal portion and a first distal portion, the first proximal portion having a first sinusoidal shape; a second body having a second proximal portion and a second distal portion, the second proximal portion having a second sinusoidal shape corresponding opposite to the first sinusoidal shape, the first body and the second body being coupled such that the first sinusoidal shape engages with the second sinusoidal shape to form a sinusoidal interface, the first proximal portion and the second proximal portion forming a handle to be grasped by a user, the first distal portion and the second distal portion forming a head portion, the sinusoidal interface having a form of at least three periods of structure. Housing and an ultrasonic transducer assembly for acquiring ultrasonic data and disposed in the head portion of the housing.

2. The ultrasonic probe of claim 1 , wherein the first body and the second body comprise a polymeric material.

3. 2. The ultrasonic probe of claim 1, wherein the first body further comprises a first outer wall portion and the second body comprises a second outer wall portion, the first outer wall portion and the second outer wall portion extending side by side across the first sinusoidal shape and the second sinusoidal shape, respectively, and the first outer wall portion and the second outer wall portion engaging to form a linear interface when the first body is coupled to the second body.

4. 4. The ultrasonic probe of claim 3, wherein the first and second outer wall portions are shaped and disposed relative to the first and second sinusoidal shapes such that the first outer wall portion contacts the second outer wall portion when the first sinusoidal shape engages the second sinusoidal shape.

5. 4. The ultrasonic probe of claim 3, wherein the first body comprises a protrusion disposed in the sinusoidal interface and the second body comprises a groove disposed in the sinusoidal interface, the protrusion and the groove locking when the first sinusoidal shape engages the second sinusoidal shape.

6. The ultrasonic probe of claim 5 , wherein the protrusion is positioned on an inner surface of the first outer wall portion and the groove is positioned on the first sinusoidal shape.

7. 4. The ultrasonic probe of claim 3, wherein the first body comprises a plurality of grooves disposed in the sinusoidal interface and the second body comprises a plurality of grooves disposed in the sinusoidal interface such that the first body is coupled to the second body to form the housing by a tool-less assembly process.

8. The ultrasonic probe of claim 7 , further comprising an adhesive applied between the first body and the second body at the sinusoidal interface.

9. 4. The ultrasonic probe of claim 3, wherein the first sinusoidal shape comprises a plurality of protrusions and a plurality of recesses, the first outer wall portion comprises a rim, the plurality of protrusions positioned above the rim and the plurality of recesses positioned at least partially below the rim.

10. 2. The ultrasonic probe of claim 1, further comprising a cable coupled to the housing, the cable comprising a plurality of conductors electrically coupled to the ultrasonic transducer assembly, the housing comprising a first opening at a distal end of the housing and a second opening at a proximal end of the housing, the ultrasonic transducer assembly being positioned within the first opening and the cable being positioned within the second opening.

11. The ultrasonic probe of claim 10 , wherein the sinusoidal interface extends between the first aperture and the second aperture.

12. 10. The ultrasonic probe of claim 1, wherein the sinusoidal interface has a proximal section extending along the handle and a distal section extending along the head portion, the proximal and distal sections having different sinusoidal geometries.

13. 2. The ultrasonic probe of claim 1, wherein the first sinusoidal shape extends continuously along the first proximal and first distal portions of the first body and the second sinusoidal shape extends continuously along the second proximal and second distal portions of the second body.

14. The ultrasonic probe of claim 1 , wherein the first sinusoidal shape is offset from the second sinusoidal shape by one-half period.

15. An ultrasonic probe according to any one of claims 1 to 14, a processor circuit in communication with the ultrasound probe to generate an ultrasound image based on the ultrasound data and output the ultrasound image on a display in communication with the processor circuit.

Citation Information

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