HEAT DISSIPATION ASSEMBLY, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE

Abstract

The heat dissipation assembly includes a heat spreader configured to contact an element; a frame body configured to limit the position of the heat spreader, wherein the frame body surrounds a side wall of the heat spreader; and an elastic structure fixedly connected to the frame body. In the present application, the heat spreader is arranged to enable even conduction of heat generated by the element; and the elastic structure fixedly connected to the frame body is arranged to ensure that the element, the heat spreader, and the frame body are securely fixed in the thickness direction to ensure smooth conduction of the heat generated by the element. In addition, since the requirement for the adhesive strength of the thermally conductive material is reduced, a thermally conductive material with better heat dissipation performance can be selected, thereby further improving the heat dissipation efficiency of the chip.

Description

[Technical field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to Chinese Patent Application No. 202011244298.2, entitled "HEAT DISSIPATION ASSEMBLY, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE," filed with the State Intellectual Property Office of the People's Republic of China on November 10, 2020, which is incorporated herein by reference.

[0002] The present application relates to the field of heat dissipation technology, and in particular to heat dissipation assemblies, electronic devices, and chip package structures. [Background technology]

[0003] With the continuous development of electronic devices, people need more and more high chip integration, and the power consumption of chips is also increasing. As a result, the heat dissipation of chips is very limited and becomes a challenge. The chip structure can be shown in FIG. 1. The chip generally includes a substrate 11, a die 12 fixed to the substrate 11, and a protective cover 13. The protective cover 13 is bonded to the die 12 by using a thermally conductive material.

[0004] In surface mount technology (SMT) of chips, the high temperature reflow process requires that the thermal conductive material has good high temperature resistance performance and good adhesion. However, the thermal conductive material with good adhesion and high temperature resistance generally has a low thermal conductivity coefficient of only about 2W / mK, which cannot meet the heat dissipation requirements of the chip. As a result, the problem of heat dissipation of the chip becomes more and more obvious. Summary of the Invention

[0005] The present application provides heat dissipation assemblies, electronic devices, and package structures to improve the heat dissipation efficiency of elements, including but not limited to electronic elements, optical elements, optoelectronic elements, etc.

[0006] According to a first aspect, the present application provides a heat dissipation assembly for an element. The heat dissipation assembly includes a heat spreader, a frame body, and an elastic structure. The heat spreader is configured to contact the element and can evenly conduct heat generated by the element. The frame body is configured to limit the position of the heat spreader. The frame body surrounds a side wall of the heat spreader and can prevent the heat spreader from moving in a horizontal direction, thereby avoiding damage to the heat dissipation interface caused by the movement of the heat spreader. The elastic structure is fixedly connected to the frame body, and the elastic structure is located on a side of the heat spreader facing away from the element to be contacted. The elastic structure may contact another component in the electronic device and be deformed thereby, thereby ensuring that the element, the heat spreader, and the frame body are securely fixed in the thickness direction to smoothly conduct heat generated by the element.

[0007] For example, the element is a chip. In the heat dissipation assembly in this embodiment of the present application, in the manufacturing process, the chip may first be subjected to surface mounting technology, then the surface of the chip is coated with a thermal conductive material, and then the heat dissipation assembly is attached. Therefore, the requirement for the adhesive strength of the thermal conductive material is reduced, so that the heat dissipation material with better heat dissipation performance can be selected. In this way, the thermal resistance between the element and the heat dissipation assembly is small, which further improves the heat dissipation efficiency of the chip.

[0008] In a possible implementation, at least a portion of the edge of the frame body is bent toward the edge of the surface of the heat spreader, so that the frame body can vertically restrict the position of the heat spreader, and in addition, the coverage area of ​​the frame body to the heat spreader is small, so that the thermal conduction performance of the heat spreader is not affected.

[0009] In a possible implementation, the frame body is configured to surround the sidewall of the element to be contacted and to be clamped to the element to be contacted. This arrangement allows the heat spreader to be fixed to the surface of the element, so that the element, the heat spreader, and the frame body do not easily move in the horizontal direction. This further ensures the stability of the heat dissipation interface between the element and the heat spreader.

[0010] In a possible implementation, the frame body may be disposed farther from the heat spreader. surface The edges of the frame body are flush with the surface of the element that is to be contacted. This arrangement increases the contact area between the frame body and the element, which leads to a better clamping effect between the frame body and the element. In addition, the edges of the frame body are flush with the surface of the element that is to be contacted, which faces away from the heat spreader. surface The frame body does not extend beyond the surface of the element, so that the frame body can be more easily attached to the element. Furthermore, the frame body does not occupy the area of ​​the element, and the space around the element is sufficient to accommodate the frame body.

[0011] In a possible implementation, a protruding structure protruding inwardly may be disposed on a side wall of the frame body to increase the clamping force between the frame body and the element. To ensure that the frame body, the heat spreader, and the element are securely fixed in the horizontal direction, the element can be held by using the protruding structure.

[0012] In a possible implementation, the protruding structure is a portion of the heat spreader facing away from the elastic structure. surface In order to ensure that the element and the heat spreader do not move in the horizontal direction, the position of the element may be limited by using a protruding structure. In addition, in this way, the frame body can contact the element to be clamped more easily, and the clamping force between the frame body and the element is increased, so that the element is less likely to move.

[0013] In a possible implementation, the protruding structure is present on at least two opposing side walls of the frame body. For example, the protruding structure is present on all four side walls of the frame body, or the protruding structure is present on two opposing side walls of the frame body. In this way, the clamping force of the frame body can be made more uniform.

[0014] In a possible implementation, there are one or more protruding structures on each of at least one side wall of the frame body. The quantity of the protruding structures can be set according to actual requirements, so as to achieve a better effect of clamping the frame body to the heat spreader and the element.

[0015] In a possible implementation, the elastic structures are arranged on at least two opposing edges of the frame body. For example, the elastic structures are arranged on all edges of the frame body. surface Alternatively, the elastic structure may be disposed on the edge of the frame body. surface In this way, the elastic forces applied to the heat spreader and the component can be more uniform after the elastic structure deforms under compression.

[0016] In a possible implementation, the elastic structure may be configured as a spring plate, the elastic structure having at least one protruding portion protruding away from the heat spreader, such that when the elastic structure deforms under compression, an elastic force can be generated, which allows the heat spreader and the element to be in close contact with each other.

[0017] In a possible implementation, the protruding portion may be configured as an arc shape, in this way the elastic structure can be deformed more easily and the elasticity of the elastic structure is good.

[0018] In a possible implementation, in order to increase the elasticity of the elastic structure, the elastic structure may be configured as having two symmetrically arranged protruding parts. In addition, the elastic structure may be configured as a one-piece structure, which improves the elasticity of the elastic structure.

[0019] In a possible implementation, the protruding portion is strip-shaped, and the extending direction of the protruding portion is the same as the extending direction of the edge of the heat spreader, or there is a certain angle between the extending direction of the protruding portion and the extending direction of the edge of the heat spreader. When the protruding portion is arranged in either of these two ways, the area of ​​the heat spreader occupied by the protruding portion can be reduced, so that the heat dissipation effect of the element is not affected. In order to dissipate the heat of the element more effectively, the extending direction of the protruding portion can be set based on the specific structure of the element.

[0020] In a possible implementation, the material of the elastic structure may include an elastic plastic material or a metal material. For example, the elastic structure may be manufactured as an elastic thin steel plate or sheet metal part, so that the elastic structure can have good elasticity.

[0021] In a possible implementation, the shape of the heat spreader is the same as the contour shape of the element that is to be contacted, and the size of the heat spreader is the same as the contour size of the element.In this way, the heat dissipation area of ​​the heat spreader can be increased, thereby improving the heat dissipation efficiency of the element.In addition, this makes it easier for the frame body to limit the position of the heat spreader, thereby making the clamping effect between the frame body and the element better.

[0022] In a possible implementation, the material of the heat spreader may include a metal material. For example, the heat spreader may be made of a material with high thermal conductivity, such as copper, iron, or aluminum. Metal materials have strong heat conduction ability. Therefore, when the heat spreader is made of a metal material, the heat of the element can be rapidly conducted, thereby improving the heat dissipation efficiency of the element.

[0023] In a possible implementation, the frame body and the elastic structure may be an integral structure. In this way, the elastic structure and the frame body can be more firmly connected. During manufacturing, the frame body and the elastic structure can be directly formed through the same process, thereby reducing manufacturing costs.

[0024] In a possible implementation, the frame body is a removable structure, thus simplifying the fixing scheme of the frame body, the heat spreader and the components.

[0025] According to a second aspect, the present application further provides an electronic device. The electronic device may include an element and a heat dissipation assembly according to the first aspect or any one of the possible implementations of the first aspect, where the element is in contact with a heat spreader in the heat dissipation assembly. In the electronic device provided in this embodiment of the present application, the heat dissipation assembly is attached to the position of the element, so that the heat generated by the element can be conducted through the heat dissipation assembly, thereby improving the heat dissipation efficiency of the electronic device. The element includes, but is not limited to, an electronic element, an optical element, an optoelectronic element, etc.

[0026] In a possible implementation, the electronic device may further include a lower housing, an upper cover fixedly connected to the lower housing, and a printed circuit board. The lower housing and the upper cover enclose a space capable of housing the printed circuit board, the components, and the heat dissipation assembly. The printed circuit board is disposed in the lower housing. The components are disposed on the printed circuit board facing away from the lower housing. surface The upper cover is fixed to the lower housing. surface The heat dissipation boss is disposed on the heat spreader. The elastic structure of the heat dissipation assembly is in contact with the heat dissipation boss, and the elastic structure is deformed. The heat dissipation assembly is attached to the position of the element and is attached to one side of the heat spreader. surface The surface of the heat spreader contacts the element and the other surface of the heat spreader surface The surface of the heat spreader contacts the elastic structure, and the elastic structure contacts the heat dissipation boss. In addition, the elastic structure is deformed to a certain extent, so that the element, the heat spreader, and the frame body are securely fixed in the thickness direction. In this way, the heat generated by the element can be evenly conducted through the heat spreader and the heat dissipation boss.

[0027] In a possible implementation, a space between the heat dissipation boss and the heat spreader is filled with a first thermally conductive material, for example, the first thermally conductive material may be a thermal gel.

[0028] In a possible implementation, the heat spreader contacts the element through the second thermal conductive material. Because the heat dissipation assembly has low requirements for the adhesive strength of the thermal conductive material, the thermal conductive material having good heat dissipation ability can be selected as the second thermal conductive material. For example, the material of the second thermal conductive material can include a silicone material with a thermal conductivity coefficient of about 6 W / mK, thereby improving the heat dissipation efficiency of the element.

[0029] According to a third aspect, in order to solve the problem that the protective cover occupies the layout area of ​​the chip package, an embodiment of the present application further provides a chip package structure. The chip package structure may include a substrate, a die fixed to the substrate, and a cover plate. In order to obtain a sufficient space for packaging, an edge of the die is located within an edge of the substrate. The cover plate covers the edge of the die facing away from the substrate. surface The cover plate is located close to the substrate. surface The substrate has support posts at the inner surface of the substrate. The support posts are fixed to the edges of the cover plate. The substrate is provided with notches at locations corresponding to the support posts. For example, the notches may be quarter-circular holes, semi-circular holes, etc. The support posts are fixedly connected to the substrate via the inner surface of the notches.

[0030] In the chip package structure provided in this embodiment of the present application, a cover plate with support posts is disposed, and a notch is provided on the substrate at a position corresponding to the support posts, and the support posts are fixedly connected to the substrate through the inner surface of the notch, so that the cover plate does not occupy the area of ​​the component, and the layout area of ​​the component package is increased.

[0031] In a possible implementation, the support columns facing away from the cover plate surface The surface of the board faces away from the cover plate. surface With this arrangement, the gap between the die and the cover plate can be controlled by using the support posts to avoid an excessively large gap resulting in increased thermal resistance between the component and the cover plate, and an excessively small gap resulting in the component being squeezed.

[0032] In a possible implementation, the inner surface of the notch of the substrate has a metal layer. For example, a copper plating may be disposed on the notch of the substrate. The pillars may then be welded to the inner surface of the notch through the metal layer, making the connection between the pillars and the substrate more rigid.

[0033] In a possible implementation, the support pillars have fixing parts protruding inwards, which are fixed to the substrate near the cover plate. surface This can enhance the support capacity of the support pillars and ensure a specific gap between the die and the cover plate.

[0034] In a possible implementation, the space between the die and the cover plate is filled with a third thermally conductive material to improve the heat dissipation efficiency of the chip package structure. [Brief description of the drawings]

[0035] [Figure 1] FIG. 1 is a schematic diagram of a chip structure in the related art.

[0036] [Diagram 2] FIG. 2 is a schematic diagram of a three-dimensional structure of a heat dissipation assembly according to an embodiment of the present application.

[0037] [Diagram 3] FIG. 2 is a schematic diagram illustrating the installation of a heat dissipation assembly at an element location according to an embodiment of the present application.

[0038] [Figure 4] FIG. 2 is a schematic diagram illustrating the application of a heat dissipation assembly to an optical module according to an embodiment of the present application.

[0039] [Diagram 5] 1 is a schematic top view of a structure of a heat dissipation assembly according to an embodiment of the present application.

[0040] [Figure 6] 6 is a schematic cross-sectional view of FIG. 5 taken along dashed line L.

[0041] [Figure 7] FIG. 2 is another schematic top view of a structure of a heat dissipation assembly according to an embodiment of the present application.

[0042] [Figure 8] FIG. 8 is a side view of the heat dissipation assembly corresponding to FIG. 7.

[0043] [Figure 9] FIG. 2 is another schematic top view of a structure of a heat dissipation assembly according to an embodiment of the present application.

[0044] [Figure 10] FIG. 10 is a side view of the heat dissipation assembly corresponding to FIG. 9.

[0045] [Figure 11] FIG. 2 is another schematic top view of a structure of a heat dissipation assembly according to an embodiment of the present application.

[0046] [Figure 12] FIG. 12 is a side view of the heat dissipation assembly corresponding to FIG.

[0047] [Figure 13] FIG. 2 is another schematic top view of a structure of a heat dissipation assembly according to an embodiment of the present application.

[0048] [Figure 14] FIG. 14 is a side view of the heat dissipation assembly corresponding to FIG. 13.

[0049] [Figure 15] FIG. 2 is another schematic top view of a structure of a heat dissipation assembly according to an embodiment of the present application.

[0050] [Figure 16] FIG. 16 is a side view of the heat dissipation assembly corresponding to FIG. 15.

[0051] [Figure 17] FIG. 1 is a schematic diagram of the structure of an electronic device that is an optical module.

[0052] [Figure 18] FIG. 2 is a side view of a chip package structure according to an embodiment of the present application.

[0053] [Figure 19] FIG. 2 is a schematic plan view of a chip package structure according to an embodiment of the present application;

[0054] [Figure 20] FIG. 2 is a schematic diagram of a three-dimensional structure of a chip package structure according to an embodiment of the present application.

[0055] [Figure 21] FIG. 2 is another schematic diagram of a three-dimensional structure of a chip package structure according to an embodiment of the present application.

[0056] The reference numbers are as follows: 1 element; 11 boards; 12 Die; 13 protective cover; 14 Second weld layer; 15 First weld layer; 2 Heat dissipation assembly; 21 heat spreader; 22 frame body; 23 Elastic structure; 231 protruding part; P protruding structure; 31 Lower housing; 32 top cover; 33 Printed circuit boards; 34 heat dissipation boss; 35 Optical Components; T1 First bolt; T2 Second bolt; 4 cover plates; 41 pillars; 411 fixed part; U notch DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0057] In order to make the objectives, technical solutions and advantages of the present application clearer, the following will further describe the present application in detail with reference to the accompanying drawings.

[0058] In order to facilitate understanding of the heat dissipation assembly of the elements provided in the embodiments of the present application, the application scenario of the heat dissipation assembly will be described first. The heat dissipation assembly in the present application may dissipate heat from various elements so that the elements can operate in a non-high temperature environment, thereby avoiding the elements from burning out and maintaining the lifespan of the elements. The elements include, but are not limited to, electronic elements, optical elements, optoelectronic elements, etc. For example, the elements may be chips, and may be any type of chips, such as radio frequency integrated chips or driver chips. Of course, the elements in the present application may alternatively be other components. In some embodiments, the heat dissipation assembly may also be applied to an optical module. For example, the heat dissipation assembly may be disposed at the position of the chip in the optical module. By disposing the heat dissipation assembly in the optical module, the heat dissipation problem of the chip with high heat density in the optical module can be effectively solved. In addition, the heat dissipation assembly may also be applied to electronic devices, such as mobile phones, tablet computers, or notebook computers, to improve the heat dissipation efficiency of the electronic devices.

[0059] For example, the element is a chip. As the requirements for chip integration become more and more advanced, the chip generally may have multiple functions such as data exchange, control, and digital / analog conversion, and the power consumption of the chip is also increasing. As a result, the heat dissipation of the chip is very limited and becomes a challenge. In chip surface mounting technology, the high temperature reflow process requires high temperature resistance performance and high adhesion of thermal conductive materials. However, thermal conductive materials with good adhesion and high temperature resistance generally have a low thermal conductivity coefficient of only about 2W / mK, which cannot meet the heat dissipation requirements of chips. As a result, the problem of chip heat dissipation is becoming more and more obvious.

[0060] Based on this, to solve the problem of heat dissipation of chips, the embodiments of the present application provide a heat dissipation assembly, an electronic device, and a package structure.

[0061] It should be noted herein that like reference numbers and characters in the following attached drawings represent like items, and therefore, once an item is defined in an attached drawing, that item does not need to be further defined or interpreted in the following attached drawings.

[0062] It should be noted that in the description of this application, the orientations or positions indicated by terms such as "center", "top", "bottom", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are orientations or positions based on the accompanying drawings, and are intended only to facilitate and simplify the description of this application, rather than to indicate or imply that the device or element in question must have a particular orientation or be constructed and operated in a particular orientation. Thus, such terms cannot be construed as limitations on this application. In addition, the terms "first" and "second" are used for descriptive purposes only, and are not to be construed as indicating or implying relative importance.

[0063] It should be noted that in the description of this application, unless expressly specified and limited otherwise, the terms "attached," "interconnected," and "connected" should be understood broadly. For example, such terms may indicate a fixed connection, a removable connection, or an integral connection, may indicate a mechanical connection or an electrical connection, and may indicate a direct interconnection, an indirect interconnection through an intermediate medium, or an internal communication between two elements. Those skilled in the art can understand the specific meaning of the aforementioned terms in this application based on the specific situation.

[0064] 2 is a schematic diagram of a three-dimensional structure of a heat dissipation assembly 2 according to an embodiment of the present application. As shown in FIG. 2, the heat dissipation assembly 2 may include: a heat spreader 21 configured to contact the element 1; a frame body 22 configured to limit the position of the heat spreader 21, where the frame body 22 surrounds a side wall of the heat spreader 21; and an elastic structure 23 fixedly connected to the frame body 22, where the elastic structure 23 is located on a side of the heat spreader 21 facing away from the element 1 to be contacted.

[0065] In the heat dissipation assembly provided in this embodiment of the present application, a heat spreader configured to contact the element is arranged so as to evenly conduct the heat generated by the element; a frame body is arranged so as to restrict the position of the heat spreader, thereby preventing the heat spreader from moving in the horizontal direction, and avoiding the impact on heat dissipation performance caused by damage to the heat dissipation interface caused by the movement of the heat spreader; and an elastic structure fixedly connected to the frame body is arranged, and the elastic structure may contact and deform with another component in the electronic device, thereby ensuring that the element, the heat spreader and the frame body are securely fixed in the thickness direction to smoothly conduct the heat generated by the element. Furthermore, in the manufacturing process, a surface mounting technique may be performed on the chip first, and the surface of the chip is coated with a thermal conductive material, and then the heat dissipation assembly is attached. Therefore, the requirement for the adhesive strength of the thermal conductive material is reduced, so that a thermal conductive material with better heat dissipation performance can be selected. In this way, the thermal resistance between the element and the heat dissipation assembly is small, and the heat dissipation efficiency of the chip is further improved.

[0066] Please refer to FIG. 1 in the related art. The die 12 and the protective cover 13 are bonded to each other through a thermal conductive material, and the heat generated by the die 12 is conducted through the thermal conductive material and the protective cover 13. However, in the surface mounting technology, the high temperature reflow process requires that the high temperature resistance performance and the adhesion of the thermal conductive material are good, but the thermal conductive material with good adhesion and high temperature resistance generally has a low thermal conductivity coefficient of only about 2W / mK, which cannot meet the heat dissipation requirements of the chip. Compared with the related art solution shown in FIG. 1 in which the protective cover 13 is bonded to the die 12, in this embodiment of the present application in which the heat dissipation assembly is arranged, it has been proved by experiment that the heat dissipation gain of the element can reach 7°C to 11°C, and the power consumption of the element is also reduced to a certain extent, thereby improving the performance of the element.

[0067] In this embodiment of the present application, the heat dissipation assembly is described using an example in which the element is a chip. In practical application, the heat dissipation assembly may also dissipate the heat of another element, and the application scenario of the heat dissipation assembly may be selected based on practical requirements. The element is not limited in this application.

[0068] 3 is a schematic diagram showing the installation of a heat dissipation assembly at the location of the element 1 according to one embodiment of the present application. Referring to FIG. 2 and FIG. 3, one side of the heat spreader 21 is provided with a heat dissipation assembly for conducting heat generated by the element 1. surface The surface of the heat spreader 21 contacts the element 1. In order to achieve a balanced heat conduction effect of the heat spreader 21, the heat spreader 21 may be configured to have a uniform thickness. For example, the thickness of the heat spreader 21 may be set to approximately 2 mm. The specific thickness of the heat spreader 21 may be set based on the pressure resistance and reliability of the element 1. The thickness of the heat spreader 21 is not limited in the present application. The elastic structure 23 is formed on the surface of the heat spreader 21 facing away from the element 1. surfaceAfter the elastic structure 23 is deformed, the element 1, the heat spreader 21, and the frame body 22 can be fixed at a fixed position in the thickness direction, so that the heat generated by the element 1 can be conducted to the heat spreader 21. In addition, the frame body 22 can limit the position of the heat spreader 21, so as to prevent the heat spreader 21 from moving in the horizontal direction. Therefore, after the heat dissipation assembly 2 is attached to the position of the element 1, the heat spreader 21 does not move in the horizontal direction or the thickness direction. This ensures that the heat dissipation interface is stable, so that the heat generated by the element 1 is smoothly conducted. In addition, the elastic structure 23 is located at the part of the frame body 22 close to the heat spreader 21. surface Therefore, the coverage area of ​​the elastic structure 23 with respect to the heat spreader 21 is small, so that the heat conduction performance of the heat spreader 21 is not affected.

[0069] Optionally, as shown in Fig. 2 and Fig. 3 in the present application, the elastic structure 23 may contact the heat spreader 21, in other words, the elastic structure 23 is located inside the frame body 22. In this way, the space occupied by the heat dissipation assembly is small, which further contributes to the appropriate utilization of the space. Of course, alternatively, the elastic structure 23 may not contact the heat spreader 21. For example, the elastic structure 23 may be located outside the frame body 22. As long as the elastic structure 23 can fix the element 1, the heat spreader 21, and the frame body 22 in the thickness direction after being deformed, the specific position of the elastic structure 23 is not limited in the present application.

[0070] See Fig. 3. In order to further improve the heat dissipation effect, the space between the heat spreader 21 and the element 1 may be filled with a heat conductive material. The heat dissipation assembly 2 can select a heat conductive material with good heat dissipation performance capability, since the requirement for the adhesive strength of the heat conductive material is low. For example, the heat conductive material may be a silicone material with a thermal conductivity coefficient of about 6 W / mK, which improves the heat dissipation efficiency of the element 1. In addition, in order to avoid the influence on the heat conduction from the element 1 to the heat spreader 21 caused by the distance between the element 1 and the heat spreader 21 being too large, the gap between the element 1 and the heat spreader 21 may be set to be smaller than 0.1 mm, for example, 0.05 mm, in other words, the thickness of the heat conductive material disposed between the element 1 and the heat spreader 21 is smaller than 0.1 mm.

[0071] FIG. 4 is a schematic diagram showing the application of a heat dissipation assembly to an optical module according to an embodiment of the present application. As shown in FIG. 4, the optical module may include a lower housing 31, an upper cover 32 fixedly connected to the lower housing 31, and a printed circuit board 33. The upper cover 32 includes a heat dissipation boss 34. The lower housing 31 and the upper cover 32 enclose a space that can accommodate the printed circuit board 33, the element 1, and the heat dissipation assembly 2. Optionally, the lower housing 31 may be fixedly connected to the upper cover 32 by using a first bolt T1, and the printed circuit board 33 is disposed on the lower housing 31. Optionally, the printed circuit board 33 may be fixedly connected to the lower housing 31 by using a second bolt T2. Of course, alternatively, the printed circuit board 33 may be disposed on the lower housing 31 in another manner, which is not limited in the present application. The element 1 is fixed to the printed circuit board 33. Optionally, the element 1 may be fixed to the printed circuit board 33 via a first welding layer 15. The heat dissipation assembly 2 is attached to the element 1, where one side of the heat spreader 21 surfaceThe surface of the elastic structure 23 contacts the element 1, and the elastic structure 23 contacts the heat dissipation boss 34. In addition, the elastic structure 23 is deformed to a certain extent, so that the element 1, the heat spreader 21, and the frame body 22 are securely fixed in the thickness direction. In this way, the heat generated by the element 1 can be evenly conducted through the heat spreader 21 and the heat dissipation boss 34.

[0072] FIG. 5 is a schematic top view of the structure of a heat dissipation assembly according to an embodiment of the present application. As shown in FIG. 2 and FIG. 5, in some embodiments, at least a part of the edge of the frame body 22 is bent toward the edge of the surface of the heat spreader 21. In this way, the frame body 22 can limit the position of the heat spreader 21 in the vertical direction. In addition, since the edge of the frame body 22 is bent toward the edge of the surface of the heat spreader 21, the coverage area of ​​the frame body 22 with respect to the heat spreader 21 is small, so that the thermal conduction performance of the heat spreader 21 is not affected. FIG. 6 is a schematic cross-sectional view of FIG. 5 along the dashed line L. As shown in FIG. 6, the frame body 22 surrounds the heat spreader 21, and the frame body 22 contacts the heat spreader 21, so that the position of the heat spreader 21 in the horizontal direction can be limited.

[0073] Further, in the heat dissipation assembly provided in this embodiment of the present application, please refer to FIG. 3. The frame body 22 is configured to surround the sidewall of the element 1 to be contacted and to be clamped to the element 1 to be contacted. In this manner, the heat spreader 21 can be fixed to the surface of the element 1, so that the element 1, the heat spreader 21, and the frame body 22 do not easily move in the horizontal direction. This further ensures the stability of the heat dissipation interface between the element 1 and the heat spreader 21. To implement the clamping between the frame body 22 and the element 1, the frame body 22 may contact at least a portion of the sidewall of the element 1.

[0074] See FIG. 3. In this embodiment of the present application, the portion of the frame body 22 that is farther away from the heat spreader 21 surface The edges of the frame body 22 are flush with the surface of the element 1 that they are to contact. In this way, the contact area between the frame body 22 and the element 1 is large, which allows the frame body 22 to be clamped to the element 1 more easily and the heat spreader 21 to be more firmly fixed to the surface of the element 1. In addition, the cormorant The heat spreader is now farther away from the Face The edge of element 1 faces away from heat spreader 21. Face The frame body 22 does not exceed the surface, so that the frame body 22 can be more easily attached to the position of the element 1. Moreover, the frame body 22 does not occupy the area of ​​the element 1, so that there is no need to modify the original structure of the element 1, and the space around the element 1 is sufficient to accommodate the frame body 22. Therefore, the heat dissipation assembly in the present application can also be applied to a small element 1, thereby solving the problem in the related art that a heat dissipation component cannot be placed on a small element 1 due to insufficient space.

[0075] Fig. 7 is another schematic top view of the structure of the heat dissipation assembly according to an embodiment of the present application. Fig. 8 is a side view of the heat dissipation assembly corresponding to Fig. 7. As shown in Fig. 7 and Fig. 8, the side wall of the frame body 22 has a protruding structure P protruding inward. In this way, the element 1 can be held by using the protruding structure P, which makes the clamping force between the frame body 22 and the element 1 larger, thereby ensuring that the frame body 22, the heat spreader 21, and the element 1 are securely fixed in the horizontal direction, and further ensuring the stability of the heat dissipation interface between the element 1 and the heat spreader 21.

[0076] Optionally, in the heat dissipation assembly provided in this embodiment of the present application, a protruding structure P is located on the side of the heat spreader 21 facing away from the elastic structure 23, as shown in Fig. 3. The elastic structure 23 is located on the frame body 22 near the heat spreader 21. surface Since the protruding structure P is fixed to the edge of the frame body 22, the position of the heat spreader 21 can be limited to at least a position where the elastic structure 23 contacts the frame body 22. Therefore, the protruding structure P is fixed to the edge of the heat spreader 21 facing away from the elastic structure 23. surface , so that the position of the element 1 can be further restricted by using the protruding structure P, so that the element 1 and the heat spreader 21 are further ensured not to move in the horizontal direction. In addition, an example is used in which the element 1 is a chip. The element 1 may include a substrate 11 and a die 12. The die 12 is fixed to the substrate 11 via a second welding layer 14. Generally, the size of the die 12 is smaller than that of the substrate 11. Since the protruding structure P is disposed at the position of the sidewall of the element 1, the frame body 22 can contact the element 1 to be clamped more easily, and further, the clamping force between the frame body 22 and the element 1 can be increased, so that the element 1 is less likely to move. In addition, the protruding structure P may alternatively be disposed at a position corresponding to the heat spreader 21. The specific position of the protruding structure P is not limited in this application. The die 12 may be a die, which is a small block of an unpackaged integrated circuit body made of a semiconductor material, and a given function of the integrated circuit is implemented in this small part of the semiconductor.

[0077] FIG. 9 is another schematic top view of the structure of the heat dissipation assembly according to an embodiment of the present application. FIG. 10 is a side view of the heat dissipation assembly corresponding to FIG. 9. As shown in FIG. 9 and FIG. 10, the protruding structure P exists on at least two opposite side walls of the frame body 22. For example, in the heat dissipation assembly shown in FIG. 9, the protruding structure P exists on all four side walls of the frame body 22. FIG. 11 is another schematic top view of the structure of the heat dissipation assembly according to an embodiment of the present application. FIG. 12 is a side view of the heat dissipation assembly corresponding to FIG. 11. In FIG. 11 and FIG. 12, the protruding structure P exists on two opposite side walls of the frame body 22. In this way, the clamping force of the frame body 22 can be made more uniform, thereby avoiding the relative movement between the element 1 and the heat spreader 21 caused by the uneven clamping force of the frame body 22.

[0078] Optionally, in the embodiment of the present application, at least one side wall of the frame body 22 may have one or more protruding structures P, respectively. FIG. 13 is another schematic top view of the structure of the heat dissipation assembly according to an embodiment of the present application. FIG. 14 is a side view of the heat dissipation assembly corresponding to FIG. 13. As shown in FIG. 13 and FIG. 14, at least one side wall of the frame body 22 may have one protruding structure P, respectively. FIG. 15 is another schematic top view of the structure of the heat dissipation assembly according to an embodiment of the present application. FIG. 16 is a side view of the heat dissipation assembly corresponding to FIG. 15. Alternatively, as shown in FIG. 15 and FIG. 16, at least one side wall of the frame body 22 may have multiple protruding structures P, respectively. In this way, the clamping force of the frame body 22 can be increased, thereby achieving a better clamping effect of the frame body 22 to the heat spreader 21 and the element 1, so that the heat spreader 21 and the element 1 are less likely to move. 15 and 16, an example in which three protruding structures P exist on one side wall of the frame body 22 is used for illustration, and the number of the protruding structures P is not limited. In addition, in FIGS. 7 to 16, an example in which the protruding structure P exists near the central region of the side wall of the frame body 22 is used for illustration. In actual applications, the position of the protruding structure P may be set based on actual requirements. The position of the protruding structure P is not limited in the present application.

[0079] In all the accompanying drawings of this application, a limited number of the protruding structure P and the elastic structure 23 are used as an example for illustration, but this does not impose a limit on the number of the protruding structure P and the elastic structure 23. In addition, in all the accompanying drawings of this application, an example in which the protruding structure P is a square is used for illustration. In an actual application, the protruding structure P may alternatively be configured as a circle, a trapezoid, or another shape. The shape of the protruding structure P is not limited in this application.

[0080] Optionally, in the heat dissipation assembly in the embodiment of the present application, the elastic structures 23 are disposed on at least two opposite edges of the frame body 22, as shown in Fig. 5. In this way, the elastic forces applied to the heat spreader 21 and the element 1 are more uniform after the elastic structures 23 are deformed under compression, thereby avoiding the relative movement caused by the uneven elastic forces applied to the heat spreader 21 and the element 1. For example, in Figs. 5 and 6, the elastic structures 23 are disposed on all edges of the frame body 22. surface As shown in Figs. 9 and 10, the elastic structure 23 is disposed on the two opposing edges of the frame body 22. surface is located at the edge of the

[0081] In one embodiment of the present application, as shown in Figures 5 and 6, the resilient structure 23 is a spring plate.

[0082] The elastic structure 23 has at least one protruding portion 231. The protruding portion 231 protrudes in a direction away from the heat spreader 21.

[0083] The elastic structure 23 is configured as a spring plate and is provided with at least one protruding portion 231, so that when the elastic structure 23 is deformed under compression, an elastic force can be generated, and the heat spreader 21 and the element 1 can be in close contact with each other. In addition, one end of the protruding portion 231 can be fixed, while the other end is movable, so that when the protruding portion 231 is compressed, the movable end can slide on the surface of the heat spreader 21, and when the protruding portion 231 is not compressed, the movable end can return to its initial state. In this way, the elastic ability of the elastic structure 23 is strong.

[0084] Optionally, in the heat dissipation assembly in the embodiment of the present application, the protruding portion 231 may be in a circular arc shape, as shown in Fig. 6. In this way, the elastic structure 23 can be deformed more easily, and the elasticity of the elastic structure 23 is good.

[0085] In some embodiments, in the heat dissipation assembly provided in the embodiment of the present application, the elastic structure 23 has two protruding parts 231 arranged symmetrically, as shown in FIG. 5, which increases the elastic ability of the elastic structure 23. The fixed ends of the two protruding parts 231 may be connected so that the other ends of the two protruding parts 231 are still movable. For example, the elastic structure 23 may be configured as an integral structure, so that the elasticity of the elastic structure 23 is good. As shown in FIG. 11 and FIG. 12, the elastic structure 23 may alternatively have one protruding part 231. It should be noted that FIG. 12 is a side view of FIG. 11, and thus there are two protruding parts 231 in FIG. 12, but these two protruding parts 231 do not belong to the same elastic structure. Of course, the elastic structure 23 may alternatively have more protruding parts 231. The number of protruding parts 231 in the elastic structure 23 is not limited in the present application.

[0086] Optionally, in the heat dissipation assembly in the embodiment of the present application, the protruding portion 231 may be in the shape of a strip, as shown in FIG.

[0087] As shown in Figures 5 and 6, the extension direction of the protruding portion 231 is the same as the extension direction of the edge of the heat spreader 21. Alternatively, as shown in Figures 13 and 14, there is a certain included angle between the extension direction of the protruding portion 231 and the extension direction of the edge of the heat spreader 21. When the protruding portion 231 is arranged in either of these two ways, the area of ​​the heat spreader occupied by the protruding portion 231 is small, so that the heat dissipation effect of the element is not affected. In practical applications, the extension direction of the protruding portion 231 may be set based on the specific structure of the element to dissipate the heat of the element more effectively.

[0088] In some embodiments of the present application, the material of the elastic structure may include elastic plastic material or metal material. When the elastic structure is made of elastic plastic material or metal material, the elastic structure can have good elasticity. For example, the elastic structure may be manufactured as an elastic thin steel plate or sheet metal part. Of course, the elastic structure may alternatively be made of another elastic material. For example, the elastic structure may alternatively be made of a plastic material. This is not limited in the present application.

[0089] Optionally, in the heat dissipation assembly provided in the embodiment of the present application, as shown in FIG. 3, the shape of the heat spreader 21 is the same as the contour shape of the element 1 it is to contact, and the size of the heat spreader 21 is the same as the contour size of the element 1.

[0090] Please note that the outline of element 1 in this application may be understood as the shape surrounded by the outermost edge of element 1. Take an example where element 1 is a chip. The size of substrate 11 in element 1 is larger than the size of die 12, therefore the outline of element 1 may be the outline of substrate 11.

[0091] The shape and size of the heat spreader 21 are set to be the same as the contour shape and size of the element 1. In this way, the heat dissipation area of ​​the heat spreader 21 can be increased, thereby improving the heat dissipation efficiency of the element 1. In addition, this makes it easier for the frame body 22 to restrict the position of the heat spreader 21, and also achieves a better clamping effect between the frame body 22 and the element 1, so that the heat spreader 21 and the element 1 are not easily moved, thereby ensuring the stability of the heat dissipation interface between the heat spreader 21 and the element 1.

[0092] In some embodiments, in the heat dissipation assembly provided in the embodiment of the present application, the material of the heat spreader may include a metal material. The metal material has a strong thermal conduction ability. When the heat spreader is made of a metal material, the heat of the element can be rapidly conducted, thereby improving the heat dissipation efficiency of the element. For example, the heat spreader may be made of a material with high thermal conductivity, such as copper, iron, or aluminum. Of course, alternatively, the heat spreader may be made of another material with a strong thermal conduction ability. The material of the heat spreader is not limited in the present application. In the embodiment of the present application, the gap between the heat spreader and the element may be set to be small, for example, smaller than 0.1 mm, and the heat spreader has a strong thermal conduction ability, for example, when the heat spreader is made of copper, the thermal conductivity of the heat spreader can reach 400 W / mK, so that the heat generated by the element can be conducted evenly and quickly.

[0093] Optionally, see FIG. 3 in the embodiment of the present application. The frame body 22 and the elastic structure 23 may be an integral structure. In this way, the elastic structure 23 and the frame body 22 can be more firmly connected. Furthermore, during manufacturing, the frame body 22 and the elastic structure 23 can be directly formed through the same process, which reduces the manufacturing steps and reduces the manufacturing cost. Of course, alternatively, the elastic structure 23 and the frame body 22 may be two separate components, in which case the elastic structure 23 is fixed at the edge position of the frame body 22 in a manner such as welding or bonding. The specific manner of arranging the frame body 22 and the elastic structure 23 is not limited in the present application.

[0094] In some embodiments, in the heat dissipation assembly provided in the embodiments of the present application, the frame body is a removable structure. In the manufacturing process, the chip may be first subjected to surface mounting technology, then the surface of the chip is coated with a thermal conductive material, and then the heat dissipation assembly is attached. Therefore, the requirement for the adhesive strength of the thermal conductive material is reduced, so that a thermal conductive material with better heat dissipation performance can be selected, which further improves the heat dissipation efficiency of the chip. In addition, when the frame body is arranged as a removable structure, the method of fixing the frame body, the heat spreader, and the element is simplified.

[0095] Based on the same technical concept, an embodiment of the present application further provides an electronic device. As shown in Fig. 17, the electronic device includes the above-described element 1 and an optional heat dissipation assembly 2. The element 1 is in contact with a heat spreader in the heat dissipation assembly 2. In the electronic device provided in this embodiment of the present application, the heat dissipation assembly is attached to the position of the element, so that the heat generated by the element can be conducted through the heat dissipation assembly, thereby improving the heat dissipation efficiency of the electronic device. The element includes, but is not limited to, an electronic element, an optical element, an optoelectronic element, etc.

[0096] In FIG. 17, an example in which the electronic device is an optical module is used for illustration. The optical module is a component that implements optical to electrical conversion and electrical to optical conversion, and is an important functional module of an optical communication device. As shown in FIG. 17, the electronic device may further include an optical component 35. In this application, an example in which the electronic device is an optical module is used for explanation. Of course, the electronic device may alternatively be another device that requires heat dissipation, and the heat dissipation assembly only needs to be attached to the position of the element that requires heat dissipation in the electronic device. The type of electronic device is not limited in this application.

[0097] In this embodiment of the present application, please refer to FIG. 4. The electronic device may further include a lower housing 31, an upper cover 32 fixedly connected to the lower housing 31, and a printed circuit board 33. The printed circuit board 33 is disposed in the lower housing 31. The element 1 is a part of the printed circuit board 33 facing away from the lower housing 31. surface The upper cover 32 is fixed to the lower housing 31. surface A heat dissipation boss 34 is disposed on the heat dissipation assembly 2. The elastic structure 23 of the heat dissipation assembly 2 is in contact with the heat dissipation boss 34, and the elastic structure 23 is deformed.

[0098] The lower housing 31 and the upper cover 32 enclose a space that can accommodate the printed circuit board 33, the element 1, and the heat dissipation assembly 2. Optionally, the lower housing 31 may be fixedly connected to the upper cover 32 by using a first bolt T1, and the printed circuit board 33 may be fixedly connected to the lower housing 31 by using a second bolt T2. Alternatively, the printed circuit board 33 may be disposed on the lower housing 31 in another manner that is not limited in this application. The element 1 is fixed to the printed circuit board 33. Optionally, the element 1 may be fixed to the printed circuit board 33 via a first weld layer 15. The heat dissipation assembly 2 is attached to the position of the element 1, and in this position, one of the heat spreaders 21 is fixed to the element 1. surface The surface of element 1 is in contact with the other surface of the heat spreader. surface The surface of the component 1 contacts the elastic structure 23, and the elastic structure 23 contacts the heat dissipation boss 34. In addition, the elastic structure 23 is deformed to a certain extent, so that the component 1, the heat spreader 21, and the frame body 22 are securely fixed in the thickness direction. In this way, the heat generated by the component 1 can be evenly conducted through the heat spreader 21 and the heat dissipation boss 34.

[0099] In some embodiments, the electronic device provided in this embodiment of the present application, see FIG. 4. The space between the heat dissipation boss 34 and the heat spreader 21 is filled with a first thermal conductive material (not shown). For example, the first thermal conductive material may be thermal gel. In order to have enough space for the elastic structure 23 and the first thermal conductive material, the gap between the heat dissipation boss 34 and the heat spreader 21 may be set to be less than 0.5 mm. In addition, the first thermal conductive material is a soft material, and when the elastic structure 23 is compressed and expanded, the first thermal conductive material can flow with the elastic structure 23, thereby preventing the first thermal conductive material from affecting the elastic ability of the elastic structure 23.

[0100] Optionally, in the electronic device provided in this embodiment of the present application, see FIG. 4. The heat spreader 21 contacts the element 1 through a second thermal conductive material (not shown). Since the heat dissipation assembly 2 has low requirements for the adhesive strength of the thermal conductive material, a thermal conductive material with good heat dissipation ability can be selected as the second thermal conductive material. For example, the material of the second thermal conductive material may include a silicone material with a thermal conductivity coefficient of about 6 W / mK, thereby improving the heat dissipation efficiency of the element 1. In addition, alternatively, the material of the second thermal conductive material may be another material with high thermal conductivity. This is not limited in the present application. In addition, in order to avoid an effect on thermal conduction from element 1 to heat spreader 21 caused by an excessively large distance between element 1 and heat spreader 21, the gap between element 1 and heat spreader 21 may be set to be smaller than 0.1 mm, for example, 0.05 mm, that is, the thickness of the thermally conductive material disposed between element 1 and heat spreader 21 is smaller than 0.1 mm.

[0101] 1, a chip may generally include a substrate 11, a die 12 fixed to the substrate 11, and a protective cover 13. The protective cover 13 is bonded to the die 12 by using a thermally conductive material. In addition, the protective cover 13 is bonded to the four corners or periphery of the chip, so the protective cover 13 occupies the layout area of ​​the chip package.

[0102] Based on this, to solve the problem of the protective cover occupying the layout area of ​​the chip package, an embodiment of the present application provides a chip package structure. 18 is a side view of a chip package structure according to an embodiment of the present application. As shown in FIG. 18, the chip package structure may include a substrate 11, a die 12 fixed to the substrate 11, and a cover plate 4. The edge of the die 12 is located within the edge of the substrate 11. Optionally, the die 12 may be fixed to the substrate 11 via a second welding layer 14. 19 is a schematic plan view of the structure of a chip package structure according to an embodiment of the present application. It can be clearly seen from FIG. 19 that the edge of the die 12 is located within the edge of the substrate 11, that is, the size of the die 12 is smaller than that of the substrate 11, in order to have enough space for packaging. The die can be a die, which is a small block of unpackaged integrated circuit body made of semiconductor material, and a given function of the integrated circuit is implemented in this small part of semiconductor.

[0103] 20 and 21 are another schematic diagrams of a three-dimensional structure of a chip package structure according to an embodiment of the present application. Please refer to Figures 20 and 21 together. surface A cover plate 4 is located on the substrate 11; the cover plate 4 is located close to the substrate 11. surfaceThe substrate 11 has a support 41 at a position corresponding to the support 41, which is fixed to the edge of the cover plate 4; the substrate 11 is provided with a notch U at a position corresponding to the support 41; the support 41 is fixedly connected to the substrate 11 through the inner surface of the notch U. Optionally, the notch U may be disposed at the four corners or side edges of the substrate 11, which is not limited in the present application. The notch U may be a quarter-circular hole or a semi-circular hole, or may be another shape, which is not limited in the present application.

[0104] In the chip package structure provided in this embodiment of the present application, a cover plate with support posts is arranged, and the cover plate is provided with notches at positions corresponding to the support posts, and the support posts are fixedly connected to the substrate through the inner surface of the notches. Therefore, the cover plate does not occupy the area of ​​the component, and the layout area of ​​the component package is increased. It has been proved by experiment that the cover plate of the present application can increase the layout area of ​​the component by approximately 9%.

[0105] In this embodiment of the present application, as shown in FIG. 18, the support columns 41 facing away from the cover plate 4 are surface The surface of the substrate 11 faces away from the cover plate 4. surface Thus, the gap between the die 12 and the cover plate 4 can be controlled by using the support posts 41 to avoid cases where the thermal resistance between the component 1 and the cover plate 4 increases due to an excessively large gap, and where the component 1 is squeezed due to an excessively small gap.

[0106] Optionally, see FIG. 21 . To form a notch U corresponding to the support 41, a position on the substrate 11 corresponding to the support 41 may be milled, and the support 41 is fixed to the inner surface of the notch U by using a bonding material. Optionally, the inner surface of the notch U of the substrate 11 may have a metal layer. For example, copper plating may be disposed on the notch U of the substrate 11. Thus, the support 41 may be welded to the inner surface of the notch U through the metal layer, which makes the connection between the support 41 and the substrate 11 more rigid. Of course, the support 41 may alternatively be fixed to the inner surface of the notch U by using another bonding material. For example, an adhesive with strong adhesive strength may be used. The bonding material is not limited in the present application.

[0107] Furthermore, in the chip package structure provided in this embodiment of the present application, the support 41 has a fixing portion 411 protruding inward, as shown in FIG. 21, and the fixing portion 411 is fixed to the substrate 11 close to the cover plate 4. surface The support pillar 41 is provided with a fixing portion 411, which is in contact with the surface of the substrate 11, so that the support pillar 41 can further enhance the supporting ability, thereby ensuring a certain gap between the die 12 and the cover plate 4. In addition, in this embodiment of the present application, see FIG. 18. The space between the die 12 and the cover plate 4 may be filled with a third thermal conductive material (not shown). The heat generated by the die 12 is conducted through the third thermal conductive material, thereby improving the heat dissipation efficiency of the chip package structure.

[0108] The above description is merely a specific implementation example of the present application, and is not intended to limit the scope of protection of the present application. Any modifications or replacements that are easily conceived by those skilled in the art within the technical scope disclosed in the present application shall be included in the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims. (Other possible items) (Item 1) A heat dissipation assembly of an element, comprising: a heat spreader (21) configured to contact the element (1); a frame body (22) configured to limit the position of the heat spreader (21), where the frame body (22) surrounds a sidewall of the heat spreader (21); and a resilient structure (23) fixedly connected to the frame body (22), wherein the resilient structure (23) is a portion of the heat spreader (21) facing away from the element (1) to be contacted; surface Located in A heat dissipation assembly comprising: (Item 2) 2. The heat dissipation assembly of claim 1, wherein at least a portion of an edge of the frame body (22) is curved toward an edge of a surface of the heat spreader (21). (Item 3) 2. The heat dissipation assembly of claim 1, wherein the frame body (22) is configured to surround a side wall of the element (1) to be contacted and to be clamped to the element (1) to be contacted. (Item 4) The frame body (22) is located farther away from the heat spreader (21). surface 4. The heat dissipation assembly according to item 3, wherein the edge of the heat dissipation assembly is flush with the surface of the element (1) that it is to contact. (Item 5) 4. The heat dissipation assembly according to item 3, wherein a protruding structure (P) protruding inward is present on a side wall of the frame body (22). (Item 6) The protruding structure (P) of the heat spreader (21) facing away from the elastic structure (23). surface Item 6. The heat dissipation assembly of item 5, wherein the heat dissipation assembly is located at (Item 7) 6. The heat dissipation assembly according to item 5, wherein a protruding structure (P) is present on at least two opposing side walls of the frame body (22). (Item 8) 6. The heat dissipation assembly according to item 5, wherein one or more protruding structures (P) are present on each of at least one side wall of the frame body (22). (Item 9) 2. The heat dissipation assembly according to item 1, wherein elastic structures (23) are disposed on at least two opposing edges of the frame body (22). (Item 10) The elastic structure (23) is a spring plate; 10. The heat dissipation assembly of any one of claims 1 to 9, wherein the elastic structure (23) has at least one protruding portion (231), the protruding portion (231) protruding in a direction away from the heat spreader (21). (Item 11) Item 11. The heat dissipation assembly according to item 10, wherein the protruding portion (231) is arc-shaped. (Item 12) Item 11. The heat dissipation assembly according to item 10, wherein the elastic structure (23) has two protruding portions (231) symmetrically arranged. (Item 13) the protruding portion (231) is strip-shaped; The extension direction of the protruding portion (231) is the same as the extension direction of the edge of the heat spreader (21); or Item 11. The heat dissipation assembly according to item 10, wherein a specific included angle exists between an extension direction of the protruding portion (231) and an extension direction of the edge of the heat spreader (21). (Item 14) Item 2. The heat dissipation assembly according to item 1, wherein the material of the elastic structure (23) comprises an elastic plastic material or a metal material. (Item 15) The shape of the heat spreader (21) is the same as the contour shape of the element (1) that it is to contact; 2. The heat dissipation assembly of claim 1, wherein the size of the heat spreader (21) is the same as the outline size of the element (1). (Item 16) 2. The heat dissipation assembly of claim 1, wherein a material of the heat spreader (21) comprises a metallic material. (Item 17) Item 17. The heat dissipation assembly according to any one of items 1 to 16, wherein the frame body (22) and the elastic structure (23) are of one piece structure. (Item 18) 17. The heat dissipation assembly according to any one of the preceding claims, wherein the frame body (22) is a removable structure. (Item 19) 19. An electronic device comprising an element (1) and a heat dissipation assembly (2) according to any one of items 1 to 18, wherein the element (1) is in contact with a heat spreader within the heat dissipation assembly (2). (Item 20) The device further comprises a lower housing (31), an upper cover (32) fixedly connected to the lower housing (31), and a printed circuit board (33), The printed circuit board (33) is disposed in the lower housing (31), and the element (1) is a part of the printed circuit board (33) facing away from the lower housing (31). surface is fixed at; The upper cover (32) close to the lower housing (31) surface 20. The electronic device according to item 19, wherein a heat dissipation boss (34) is disposed on the heat dissipation assembly (2), and an elastic structural portion (23) of the heat dissipation assembly (2) is in contact with the heat dissipation boss (34), and the elastic structural portion (23) is deformed. (Item 21) Item 21. The electronic device of item 20, wherein a space between the heat dissipation boss (34) and the heat spreader (21) is filled with a first thermally conductive material. (Item 22) 22. The electronic device of any one of claims 19 to 21, wherein the heat spreader (21) is in contact with the element (1) via a second thermally conductive material. (Item 23) Item 23. The electronic device of item 22, wherein the material of the second thermally conductive material comprises a silicone material. (Item 24) The semiconductor device includes a substrate (11), a bare die (12) fixed to the substrate (11), and a cover plate (4), The edge of the bare die (12) is located within the edge of the substrate (11); The cover plate (4) is disposed on the bare die (12) facing away from the substrate (11). surface Located in; The cover plate (4) is close to the substrate (11). surface a support (41) at the edge of the cover plate (4); The substrate (11) is provided with a notch (U) at a position corresponding to the support (41), and the support (41) is fixedly connected to the substrate (11) via the inner surface of the notch (U). Chip package structure. (Item 25) The pillars (41) facing away from the cover plate (4) surface The surface of the substrate (11) facing away from the cover plate (4) surface 25. The chip package structure of item 24, wherein the chip package structure is flush with the surface of the substrate. (Item 26) 25. The chip package structure of claim 24, wherein the inner surface of the notch (U) of the substrate (11) has a metal layer. (Item 27) The support (41) has a fixing portion (411) protruding inwardly; The fixed portion (411) of the base plate (11) close to the cover plate (4) surface 27. The chip package structure of any one of items 24 to 26, in contact with a surface of (Item 28) 27. The chip package structure of any one of items 24 to 26, wherein a space between the bare die (12) and the cover plate (4) is filled with a third thermally conductive material.

Claims

1. A heat dissipation assembly of an element, comprising: a heat spreader configured to contact the element; a frame body configured to limit the position of the heat spreader, where the frame body surrounds a sidewall of the heat spreader; and an elastic structure fixedly connected to the frame body, the elastic structure being located on a surface of the heat spreader facing away from the element to be contacted, the elastic structure having a connection portion connected to the frame body and two protruding portions disposed symmetrically with respect to the connection portion and protruding in a direction away from the heat spreader beyond the connection portion; A heat dissipation assembly comprising:

2. The heat dissipation assembly of claim 1 , wherein a fixed end of each of the two protruding portions is connected such that the other end of each of the two protruding portions is movable.

3. 3. The heat dissipation assembly of claim 2, wherein when the protruding portion is compressed, the other movable end slides on the surface of the heat spreader, and when the protruding portion is not compressed, the other movable end returns to its initial state.

4. The heat dissipation assembly according to claim 1 , wherein there is a specific included angle between the extending direction of the protruding portion and the extending direction of the edge of the heat spreader.

5. The heat dissipation assembly of claim 1 , wherein at least a portion of an edge of the frame body is curved toward an edge of a surface of the heat spreader.

6. The heat dissipation assembly of claim 1 , wherein the frame body is configured to surround a side wall of the element to be contacted and to be clamped to the element to be contacted.

7. The heat dissipation assembly of claim 6 , wherein an edge of the face of the frame body farther away from the heat spreader is flush with a surface of the element with which it is to contact.

8. The heat dissipation assembly according to claim 6 , wherein a protruding structure protruding inwardly is present on a side wall of the frame body.

9. The heat dissipation assembly of claim 8 , wherein the protruding structure is located on a surface of the heat spreader facing away from the resilient structure.

10. The heat dissipation assembly of claim 8 , wherein the protruding structures are present on at least two opposing side walls of the frame body.

11. The heat dissipation assembly of claim 8 , wherein one or more of the protruding structures are present on each of at least one sidewall of the frame body.

12. The heat dissipation assembly according to claim 1 , wherein the elastic structures are disposed on at least two opposing edges of the frame body.

13. The heat dissipation assembly of claim 1 , wherein the resilient structure is a spring plate.

14. An electronic device comprising a component and a heat dissipation assembly, The heat dissipation assembly comprises: a heat spreader configured to contact the element; a frame body configured to limit the position of the heat spreader, where the frame body surrounds a sidewall of the heat spreader; and an elastic structure fixedly connected to the frame body, the elastic structure being located on a surface of the heat spreader facing away from the element to be contacted, the elastic structure having a connection portion connected to the frame body and two protruding portions disposed symmetrically with respect to the connection portion and protruding in a direction away from the heat spreader beyond the connection portion; having The element contacts the heat spreader in the heat dissipation assembly.

15. a lower housing, an upper cover fixedly connected to the lower housing, and a printed circuit board; the printed circuit board is disposed in the lower housing, and the element is fixed to a surface of the printed circuit board facing away from the lower housing; 15. The electronic device of claim 14, wherein a heat dissipation boss is disposed on a surface of the upper cover close to the lower housing, and the elastic structure in the heat dissipation assembly is in contact with the heat dissipation boss and is deformed.

16. An electronic device comprising a component and a heat dissipation assembly, The heat dissipation assembly comprises: a heat spreader configured to contact the element; a frame body configured to limit the position of the heat spreader, where the frame body surrounds a sidewall of the heat spreader; and a resilient structure fixedly connected to the frame body, the resilient structure being located on a surface of the heat spreader facing away from the element to be contacted; having the element contacting the heat spreader in the heat dissipation assembly, a lower housing, an upper cover fixedly connected to the lower housing, and a printed circuit board; the printed circuit board is disposed in the lower housing, and the element is fixed to a surface of the printed circuit board facing away from the lower housing; An electronic device, wherein a heat dissipation boss is disposed on a surface of the upper cover close to the lower housing, and the elastic structure in the heat dissipation assembly is in contact with the heat dissipation boss and is deformed.

17. 17. The electronic device of claim 15 or 16, wherein a space between the heat dissipation boss and the heat spreader is filled with a first thermally conductive material.

18. 18. The electronic device of claim 14, wherein the heat spreader contacts the element through a second thermally conductive material.

19. 20. The electronic device of claim 18, wherein the second thermally conductive material comprises a silicone material.

20. a substrate, a die secured to the substrate, and a cover plate; an edge of the die is located within an edge of the substrate; the cover plate is located on a surface of the die facing away from the substrate; the cover plate has a support post on a surface adjacent to the substrate, the support post being fixed to an edge of the cover plate; the substrate is provided with a notch at a position corresponding to the support pillar, the support pillar being fixedly connected to the substrate via an inner surface of the notch, the inner surface of the notch having a metal layer; the post having an inwardly protruding fixing portion; the fixing portion is in contact with a surface of the substrate that is closer to the cover plate; Chip package structure.

21. 21. The chip package structure as claimed in claim 20, wherein the notch is a quarter-circle or semi-circle hole.

22. 22. The chip package structure of claim 20 or 21, wherein the surface of the support pillar facing away from the cover plate is flush with the surface of the substrate facing away from the cover plate.

23. a substrate, a die secured to the substrate, and a cover plate; an edge of the die is located within an edge of the substrate; the cover plate is located on a surface of the die facing away from the substrate; the cover plate has a support post on a surface adjacent to the substrate, the support post being fixed to an edge of the cover plate; The substrate is provided with a notch at a position corresponding to the support post, and the support post is fixedly connected to the substrate via an inner surface of the notch; the post having an inwardly protruding fixing portion; the fixing portion is in contact with a surface of the substrate that is closer to the cover plate; Chip package structure.

24. 24. The chip package structure of claim 20, wherein a space between the die and the cover plate is filled with a third thermally conductive material.

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