Porous showerhead for processing chamber - Patents.com

Abstract

The showerhead assembly includes a support structure and a porous plate. The support structure includes support features. The porous plate has a thermal conductivity of at least about 50 W / (mK) and includes a plurality of pores having an average diameter of less than about 100 μm, at least a portion of the periphery of the porous plate resting on the support features. The showerhead can be included in a processing chamber utilized to process a substrate.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to a showerhead for a processing chamber, and more particularly to a porous showerhead for a processing chamber. [Background technology]

[0002] In many conventional showerhead designs, the showerhead includes a gas distribution plate having a number of holes through which process gases can flow. However, the number of holes in the gas distribution plate can be limited, limiting the uniformity of the flow of process gases through the showerhead. A major factor limiting the number of holes a gas distribution plate can include is the process by which the holes are created. For example, the holes are typically created using mechanical or other subtractive methods. However, the creation of the holes places a high level of stress on the gas distribution plate, and the creation of a large number of holes can result in damage to the gas distribution plate. Furthermore, the manufacture of such gas distribution plates is slow and the manufacturing costs are prohibitive. Thus, the number of holes that can be drilled into a ceramic or aluminum plate is kept below a level that provides consistent quality and reduces the manufacturing time and manufacturing costs of the gas distribution plate.

[0003] In many applications, increasing the number of holes in the gas distribution plate increases the uniformity of gas distribution through the showerhead and increases the uniformity of processing results for processed substrates. However, current methods for fabricating holes in gas distribution plates are unable to produce the number and size of holes required to achieve a high level of uniformity in gas distribution.

[0004] Therefore, there is a need for an improved gas distribution plate to increase the uniformity of processing results for processed substrates. Summary of the Invention

[0005] In one embodiment, a showerhead assembly for a processing chamber includes a support structure and a porous plate, the support structure comprising support features, the porous plate having a thermal conductivity of at least about 50 W / (mK) and including a plurality of pores having an average diameter of less than about 100 μm, at least a portion of the periphery of the porous plate resting on the support features.

[0006] In one embodiment, the processing chamber includes a substrate support, a showerhead assembly, and a gas supply source. The substrate support is configured to support a substrate. The showerhead assembly is configured to flow gas into the processing chamber, the showerhead assembly including a support structure and a porous plate. The support structure includes a support feature. The porous plate has a thermal conductivity of at least about 50 W / (mK) and includes a plurality of holes having diameters less than about 100 μm, with at least a portion of the periphery of the porous plate on the support feature. The gas supply is configured to supply process gas to the showerhead assembly.

[0007] So that the above features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, can be had by reference to embodiments, some of which are illustrated in the accompanying drawings, in which it is noted, however, that the accompanying drawings depict only exemplary embodiments and therefore should not be considered limiting of its scope, as other equally effective embodiments may be permitted. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic side view of a showerhead assembly according to one or more embodiments. [Diagram 2] 1 is a bottom view of a portion of a porous plate according to one or more embodiments. [Diagram 3] 1 is a schematic side view of a processing chamber according to one or more embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] To facilitate understanding, wherever possible, like reference numerals are used to designate like elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0010] An embodiment of the present application includes a showerhead assembly having a porous plate. The porous plate includes a plurality of pores through which process gas can flow. The size of each of the plurality of pores and the number of the plurality of pores enhances the uniformity of the process gas applied to a substrate during processing. Furthermore, the porous plate is formed from a material having a thermal conductivity that reduces thermal stress experienced by the porous plate during processing of a substrate.

[0011] 1 illustrates a showerhead assembly 100 in accordance with one or more embodiments. The showerhead assembly 100 includes a porous plate 110 and a support structure 120. The porous plate 110 includes a plurality of pores 112. The pores 112 form a plurality of continuous pathways within the porous plate 110 that extend from an upper surface 116 to a lower surface 118 of the porous plate 110. Furthermore, the continuous pathways formed by the pores 112 allow process gases to pass through the porous plate 110 from a first side thereof to a second side thereof. The porous plate 110 may be referred to as a gas distribution plate or a gas distributor.

[0012] The porous plate 110 may include greater than about 100 linear paths per linear inch and / or greater than 100 pores per cubic inch. Alternatively, the porous plate 110 may include greater than about 60 linear paths per linear inch and / or greater than 100 pores per cubic inch. 60 In one embodiment, the porous plate 110 may include more than about 30,000 pores. Alternatively, the porous plate 110 may include more than 100,000 pores, or more than 1,000,000 pores.

[0013] The pores 112 have an average diameter of less than about 100 μm. Further, the pores 112 may have an average diameter of less than about 50 μm. Further, each pore 112 may have a diameter ranging from about 5 μm to about 75 μm. In addition, the diameter of one or more pores 112 may be different from the diameter of another one of the pores 112.

[0014] The porous plate 110 can be formed of materials such as metals, metal alloys, and ceramics. For example, the metals can include aluminum, molybdenum, or other metals, the ceramics can include silicon carbide or other ceramics, and the metal alloys can include aluminum nitride, aluminum oxide, or other alloys. Additionally, the porous plate 110 can be formed from a single continuous material.

[0015] The porous plate 110 may have a circular shape. For example, the porous plate 110 may have a circular shape with a diameter ranging from about 200 mm to about 350 mm. Alternatively, the porous plate 110 may have a diameter less than about 200 mm or more than about 350 mm. Furthermore, the porous plate 110 may have a shape other than a circular shape. For example, the porous plate 110 may have an oval or rectangular shape, among others.

[0016] The porous plate 110 is supported by the support structure 120. For example, at least a portion of the edge of the porous plate 110 may be supported by the support features 122 of the support structure 120. Alternatively, the entire edge may be supported by the support features 122. The support structure 120 may support the porous plate 110 such that process gases can flow through the porous plate 110 and such that the process gases are not significantly impeded by the support structure 120. The porous plate 110 may be removably or non-removably connected to the support features 122. For example, the porous plate 110 may be non-permanently attached to the support features 122 such that the porous plate 110 may be removed for cleaning, maintenance, or replacement. The porous plate 110 may be bonded to one or more elements of the support structure 120 such that the porous plate 110 may be removed without significantly damaging the porous plate 110 and / or the support structure 120. Additionally, the porous plate 110 may be permanently attached to the support feature 122 by welding or gluing the porous plate 110 to the support feature 122 using another suitable means. For example, the porous plate 110 may be adhered using an adhesive that can be removed by damaging the porous plate 110 and / or the support structure 120.

[0017] In one example, the support structure 120 includes an optional clamping plate 124 configured to hold the porous plate 110 between the clamping plate 124 and the support features 122. Additionally, the clamping plate 124 may be removable such that the porous plate 110 can be removed for cleaning and / or replacement. The clamping plate 124 and / or the porous plate 110 may be permanently attached to the support structure 120 such that the clamping plate 124 and / or the porous plate 110 cannot be removed without significantly damaging the porous plate 110 and / or the support structure 120. For example, the clamping plate 124 may be welded to the support structure 120.

[0018] The porous plate 110 is formed using a sintering process with powdered materials. Additionally, the particle size distribution of the powered material can be mixed to create a pore size within a selected range in the porous plate 110, and then the powered material can be sintered to create the porous plate 110. In one example, controlling the particle size includes removing smaller sized particles from the powder. For example, particles smaller than the average particle size of all particles in the powder can be removed. Alternatively, particles having other sizes can be removed. In one such example, a percentage of particles of the average particle size can be removed from the powder such that not all particles smaller than the average particle size are removed from the powder. The size of the particles removed from the powder can be varied to create materials with different amounts of porosity. Additionally, a bimodal distribution of particles in the powered can be utilized to shift the particle size to be larger and smaller than the particles used to create the dense material. The smaller particles help bond the larger particles during the sintering process to create the porous material. By removing selected particles from the powder or otherwise adjusting the particle composition, a desired porosity is created in the final material due to the absence of smaller particles creating gaps between the larger particles.

[0019] Alternatively, the porous plate 110 may be formed using additive manufacturing techniques such as 3D printing. For example, the porous plate 110 may be formed by depositing one or more materials according to a pattern that defines the location, size, and number of the pores 112.

[0020] FIG. 2 is a bottom view of a porous plate 110 according to one embodiment. In the embodiment of FIG. 2, the pores 112 vary in size. For example, the diameter of pore 112a is larger than the diameter of pore 112b, which is larger than the diameter of pore 112c. Each pore 112 may have a different diameter. Alternatively, at least two pores 112 may have the same diameter. Furthermore, the pores 112 may be randomly arranged throughout the porous plate 110. For example, the pores 112 may be arranged according to an irregular pattern. When arranged according to an irregular pattern, the pores 112, the positions and / or sizes of the pores 112 may not be repeated according to any rule. Furthermore, when arranged according to an irregular pattern, the pores 112 may be arranged such that the arrangement of the pores lacks symmetry. Alternatively, the pores 112 may be arranged according to one or more repeating patterns. In addition, although the pores 112 are shown as being at least substantially circular, the pores 112 may have other shapes. For example, the pores 112 may be any shape, including regular and irregular shapes. Furthermore, one or more of the pores 112 may be shaped differently than one or more of the other pores 112.

[0021] 3 shows a schematic cross-sectional view of a processing chamber 300 according to one embodiment. The processing chamber 300 can be used to process one or more substrates 340, including depositing material on the substrate 340, heating the substrate 340, etching the substrate 340, or a combination thereof. The processing chamber 300 can be an atomic layer deposition (ALD) chamber. Furthermore, the processing chamber 300 can be a chemical vapor deposition (CVD) processing chamber, a plasma enhanced chemical vapor deposition (PECVD) processing chamber, or a physical vapor deposition (PVD) processing chamber, among others.

[0022] In one or more embodiments, the processing chamber 300 has an interior region 311 that includes a substrate support 342 disposed therein to support a substrate 340. The substrate support 342 includes a heating element 318 and an element that holds the substrate 340 on an upper surface of the substrate support 342, such as an electrostatic chuck, a vacuum chuck, a substrate holding clamp, etc. The substrate support 342 is coupled to and movably disposed within the interior region 311 by a stem 310 that is connected to a lift system that moves the substrate support 342 between a raised processing position and a lowered position that facilitates transfer of the substrate 340 in and out of the processing chamber 300 through the opening 324.

[0023] The processing chamber 300 may include a gas supply 326. In one or more embodiments, the gas supply 326 may include a mass flow control (MFC) device disposed between the gas source and the interior region 311 to control the flow rate of the process gas or gases from the gas source to the showerhead assembly 100 used to distribute the process gas throughout the interior region 311. For example, the process gas may flow into the interior region 311 through the gas inlet 314 and through the pores 112 of the porous plate 110. The support structure 120 is coupled to the processing chamber 300. For example, the support structure 120 may be coupled to an element 317 of the processing chamber 300 to position the porous plate 110 above the substrate 340. The porous plate 110 may be positioned at the center of the substrate 340. Additionally, the porous plate 110 may be larger than the substrate 340 such that an edge of the porous plate 110 extends beyond an edge of the substrate 340. The support structure 120 may be removably mounted to the processing chamber 300 such that the showerhead assembly 100 may be removed for maintenance or replacement. Alternatively, the support structure 120 may be non-removably mounted to the processing chamber 300. Additionally, the showerhead 328 may be connected to an RF power source to generate a plasma in the interior region 311 from the process gases. Additionally, a deposition process may be utilized to process the substrate 340 at a processing pressure to deposit or grow a film on the substrate 340.

[0024] The porous plate 110 may experience a range of temperatures while the substrate 340 is being processed in the processing chamber 300. Thus, the porous plate may break at high temperatures due to the thermal stress experienced by the porous plate. Thus, reducing the thermal stress experienced by the porous plate may reduce the defect rate of the porous plate. For example, the porous plate 110 may have a thermal conductivity that reduces the thermal stress experienced by the porous plate during substrate processing. The porous plate 110 may have a thermal conductivity of at least about 50 W / (mK). Further, the porous plate 110 may have a thermal conductivity of at least about 100 W / (mK). Alternatively, the porous plate 110 may have a thermal conductivity of at least about 150 W / (mK).

[0025] Additionally, one or more of the upper surface 116 and the lower surface 118 of the porous plate 110 may be coated (e.g., coating 323) to reduce the possibility of particles being introduced from the porous plate 110 into the processing chamber 300 during processing of the substrate 340. Alternatively, all surfaces of the porous plate 110 may be coated with the coating 323. Additionally, the porous plate 110 may be coated with an oxide using an atomic layer deposition (ALD) process or any other process capable of depositing a layer on the porous plate 110 such that processing gases can still pass through the pores 112 of the porous plate 110. For example, the thickness of the coating may be selected such that the coating does not impede the passage of the processing gases through the coating. The porous plate 110 may be coated in an oxide such as aluminum oxide or yttrium oxide, among others. Additionally, the support structure 120 may be coated using a process similar to that used to coat the porous plate 110.

[0026] The stem 310 is configured to move the substrate 340 to a raised processing position to process the substrate 340. Further, in one or more embodiments, a vacuum pump 357 is coupled to the interior region 311 to control the pressure within the interior region 311.

[0027] Process gases, such as deposition gases or cleaning chemicals, can be supplied from a gas source 327 into the interior region 311 through a gas inlet 313 of the processing chamber 300. Further, the process gases can exit the process gas region through a gas outlet 336. Removal of the process gases, including the cleaning chemicals, through the gas outlet 336 is facilitated by a vacuum pump 357 coupled to the gas outlet 336.

[0028] The above-described processing chamber 300 can be controlled by a processor-based system controller, such as controller 330. For example, controller 330 can be configured to control the flow of various precursor gases, process gases, and purge gases during various operations of a substrate processing sequence. As a further example, controller 330 can be configured to control gas delivery, lamp operation, or other process parameters, among other controller operations.

[0029] The controller 330 is generally used to facilitate the control and automation of the components within the process chamber 300. The controller 330 may be, for example, a computer, a programmable logic controller, or an embedded controller. The controller 330 typically includes a central processing unit (CPU) 332, a memory 334, and support circuitry for input / output (I / O). The CPU 332 may be one of any form of computer processor used in industrial environments to control various system functions, substrate movement, chamber processing, and control support hardware (e.g., sensors, motors, heaters, etc.) and monitor the processes performed within the process chamber 300. The memory 334 is connected to the CPU 332 and may be one or more of readily available non-volatile memory, such as random access memory (RAM), flash memory, read-only memory (ROM), floppy disk, hard disk, or any other form of local or remote digital storage. Software instructions and data may be coded and stored within the memory to instruct the CPU 332. Support circuits are also connected to the CPU 332 for assisting the processor in a conventional manner. The support circuits may include cache, power supplies, clock circuits, input / output circuits, subsystems, etc. A program (e.g., software routines or computer instructions) readable by the controller 330 determines which tasks are executable by the components within the process chamber 300. Preferably, the program is software readable by the processor within the controller 330 that includes code for performing tasks related to monitoring, executing, and controlling the supply and control of process variables utilized in one or more processes performed within the process chamber 300, as well as moving, supporting, and / or positioning the substrate 340 and other components within the process chamber 300 with the various process tasks and various sequences controlled by the controller 330.

[0030] While the forgoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, which scope is determined by the following claims.

Claims

1. 1. A showerhead assembly for a processing chamber, comprising: a support structure having support features; and A porous plate having a thermal conductivity of at least 50 W / (mK) and comprising a plurality of pores having an average diameter of less than 50 μm, at least a portion of an edge of the porous plate resting on said support feature. A shower head assembly comprising:

2. 10. The showerhead assembly of claim 1, wherein the plurality of pores form a plurality of continuous paths extending from a first surface to a second surface of the porous plate.

3. 10. The showerhead assembly of claim 1, wherein the porous plate has a circular shape with a diameter of at least 200 mm.

4. 10. The showerhead assembly of claim 1, wherein the plurality of pores number at least 60 pores per cubic inch of the porous plate.

5. 10. The showerhead assembly of claim 1, wherein the porous plate has a thermal conductivity of at least 75 W / (mK).

6. 10. The showerhead assembly of claim 1, wherein the support structure further comprises a clamping plate, and wherein at least a portion of the edge of the porous plate is held between the clamping plate and the support feature.

7. 10. The showerhead assembly of claim 1, wherein the porous plate comprises one of silicon carbide, aluminum nitride, and molybdenum.

8. A processing chamber comprising: A substrate support configured to support a substrate; a showerhead assembly configured to flow gas into an interior of the processing chamber, the showerhead assembly comprising: a support structure having support features; a porous plate having a thermal conductivity of at least 50 W / (mK) and including a plurality of pores having diameters less than 50 μm, at least a portion of an edge of the porous plate resting on the support feature; a showerhead assembly comprising: a gas supply configured to supply a process gas to the showerhead assembly; a processing chamber comprising:

9. The processing chamber of claim 8 , wherein the plurality of pores form a plurality of continuous pathways extending from a first surface to a second surface of the porous plate.

10. 9. The processing chamber of claim 8, wherein the porous plate has a circular shape with a diameter of at least 200 mm.

11. 9. The processing chamber of claim 8, wherein the plurality of pores number at least 60 pores per cubic inch of the porous plate.

12. 9. The processing chamber of claim 8, wherein the porous plate has a thermal conductivity of at least 75 W / (mK).

13. The processing chamber of claim 8 , wherein the support structure further comprises a clamping plate, and at least a portion of the edge of the porous plate is held between the clamping plate and the support feature.

14. The processing chamber of claim 8 , wherein the porous plate comprises one of silicon carbide, aluminum nitride, and molybdenum.

15. 1. A porous plate for a showerhead assembly of a processing chamber, the porous plate comprising: A plurality of pores arranged according to an irregular pattern; a plurality of continuous pathways formed from the plurality of pores; each of the plurality of continuous paths extending from a first surface to a second surface of the porous plate; 10. A porous plate, wherein the porous plate has a thermal conductivity of at least 50 W / (mK), and the plurality of pores have an average diameter of less than 50 μm.

16. 16. The porous plate of claim 15, wherein the plurality of pores number at least 60 pores per cubic inch of the porous plate.

17. 10. The showerhead assembly of claim 1, wherein the porous plate is coated with an oxide.

18. 20. The showerhead assembly of claim 17, wherein the oxide is aluminum oxide or yttrium oxide.

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