Electronic device

Abstract

To provide an electronic apparatus capable of suppressing temperature rise of an internal electronic component and suppressing thermal influence on an adjacent electronic device or the like.SOLUTION: An electronic device 100 includes a circuit board 40 on which a heating element 41 that generates heat is mounted, a housing 10 housing the circuit board 40, a heat dissipation unit 20 connected to the housing 10 and dissipating heat, a heat transfer member 22 disposed between the heat generating element 41 and the heat dissipating unit 20 and transferring the heat generated by the heat generating element 41 to the heat dissipation unit 20, and a housing cover 30 provided on the side opposite to the heat transfer member 22 side of the heat dissipation unit 20. A convection area which is a space in which air convects is provided between the heat dissipation unit 20 and the housing cover 30.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electronic device having heat generating elements, such as electronic components, arranged on a circuit board. [Background technology]

[0002] Many electronic devices include electronic circuits in which electronic components are mounted on a printed wiring board (PWB). Electronic components such as integrated circuits, transistors, diodes, resistors, and capacitors are soldered onto the PWB, which has wiring formed by lithography, to form a printed circuit board (PCB). Some electronic components generate heat during operation, so they are used with a cooling structure to dissipate the heat.

[0003] As a cooling structure, a heat sink, a heat pipe, etc. are widely used. Generally, when the heat generated by electronic components is to be dissipated to a heat sink that dissipates the heat to the outside or to a housing or the like, each heat-generating component such as an integrated circuit is attached via a heat transfer member such as a heat pipe or a metal block.

[0004] In recent years, the amount of information processed by electronic devices has increased, and the amount of heat generated by these devices has also increased due to the use of integrated circuits that can operate at higher speeds. This has created a demand for cooling structures that can efficiently cool electronic components.

[0005] In order to improve the cooling efficiency, forced air cooling using a fan or the like is effective in increasing the amount of heat transfer by convection. However, in industrial equipment that requires long-term reliability, improvements to the natural cooling structure, which uses the PCB and the case itself as the main heat sink, are being considered for reasons such as a significant deterioration in cooling capacity when the fan stops due to a malfunction or other reason, and the need for a structure to supply power to the fan.

[0006] Well-known methods include mounting a heat sink on a heat-generating component, using a heat dissipation heat pipe as a heat transfer path to a housing in contact with the atmosphere, and using a metal block with high thermal conductivity, such as aluminum (Al), for the same purpose.

[0007] For example, in the electronic device disclosed in Patent Document 1 below, a heat transfer member is provided between the upper part of the heat generating element and the housing, and heat is dissipated by transferring the heat to the housing via this heat transfer member. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2016-143769 A Summary of the Invention [Problem to be solved by the invention]

[0009] However, the electronic device described in Patent Document 1 may cause problems when applied to a configuration in which multiple electronic devices are adjacent to each other. The electronic device described in Patent Document 1 dissipates heat into the housing, which results in the heat being transferred to other electronic devices adjacent to the housing heat dissipation surface, causing the inside of the other adjacent electronic devices to heat up, resulting in the malfunction of electronic components or a shortened lifespan. Furthermore, since the heat dissipation surface is adjacent to another electronic device (electronic device), there is no space for dissipating heat, and there is a problem that a rise in temperature inside the electronic device itself cannot be suppressed.

[0010] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic device that can suppress the temperature rise of internal electronic components and suppress the thermal impact on adjacent electronic devices, etc.

[0011] The above and other objects of the present invention and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings. [Means for solving the problem]

[0012] In order to achieve the above object, an electronic device of the present invention includes a circuit board on which a heat generating element that generates heat is mounted, and a housing that houses the circuit board. The electronic device of the present invention further includes a heat dissipation section connected to the housing for dissipating heat, a heat transfer member disposed between the heat generating element and the heat dissipation section for transferring heat generated by the heat generating element to the heat dissipation section, and a housing cover provided on the side of the heat dissipation section opposite the heat transfer member. In the electronic device of the present invention, a convection area, which is a space where air convection occurs, is provided between the heat dissipation section and the housing cover. Furthermore, the electronic device of the present invention has a housing provided with an intake vent for taking in air into the housing, and an exhaust vent for expelling the air inside the housing to the outside, and the heat transfer member has a cross-sectional shape that does not obstruct the airflow that is drawn in through the intake vent, flows along the outer shape of the heat transfer member, and is exhausted to the exhaust vent. Effect of the Invention

[0013] According to the electronic device of the present invention described above, heat generated by the heat generating element is transferred to the heat dissipation section by the heat transfer member, so that it is possible to suppress a rise in temperature of the electronic components inside the housing. A housing cover is provided on the side of the heat dissipation unit opposite the heat transfer member, and a convection area is provided between the heat dissipation unit and the housing cover. This allows air to convect in the convection area, dissipating heat from the heat dissipation unit and cooling the heat dissipation unit. In addition, since heat is dissipated through the convection area and the heat within the convection area is insulated by the housing cover, the thermal impact on external devices adjacent to the electronic device can be suppressed. Furthermore, the housing is provided with an intake vent for taking in air into the housing, and an exhaust vent for expelling the air inside the housing to the outside, and the heat transfer member has a cross-sectional shape that does not impede the airflow that is drawn in through the intake vent, flows along the external shape of the heat transfer member, and is exhausted to the exhaust vent, thereby reducing the impact of heat dissipation from the heat transfer member on internal components of the electronic device.

[0014] Problems, configurations and effects other than those described above will become apparent from the following description of the embodiments. [Brief description of the drawings]

[0015] [Figure 1] 1 is a schematic configuration diagram (perspective view) of an electronic device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is an exploded perspective view of the electronic device of FIG. [Diagram 3]2 is a cross-sectional view of the electronic device of FIG. 1, taken along a cross section including a heat transfer member. [Figure 4] 2 is a cross-sectional view of the electronic device of FIG. 1 including a heat transfer member and a convection area. [Diagram 5] 11 is a cross-sectional view of an electronic device according to a first modified example, taken along a cross section including a heat transfer member. [Figure 6] 11 is a cross-sectional view of an electronic device according to a second modified example, taken along a cross section including a heat transfer member. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, the embodiments and examples of the present invention will be described with reference to text and drawings. However, the structures, materials, and other specific configurations shown in the present invention are not limited to the embodiments and examples described here, and can be appropriately combined or improved without changing the gist of the invention. Elements that are not directly related to the present invention are not shown.

[0017] The electronic device of the present invention includes a circuit board on which a heat generating element that generates heat is mounted, and a housing that houses the circuit board. The electronic device of the present invention further includes a heat dissipation section connected to the housing for dissipating heat, a heat transfer member disposed between the heat generating element and the heat dissipation section for transferring heat generated by the heat generating element to the heat dissipation section, and a housing cover provided on the side of the heat dissipation section opposite the heat transfer member. In the electronic device of the present invention, a convection area, which is a space where air convection occurs, is provided between the heat dissipation section and the housing cover.

[0018] In the configuration of the electronic device described above, the heat generating element is an element that generates heat, for example, an element that generates heat by its own operation. Specific examples of the heat generating element include electronic components such as integrated circuits, transistors, diodes, resistors, and capacitors.

[0019] In the above-described configuration of the electronic device, the housing accommodates a circuit board on which the above-described heat generating element is mounted.

[0020] In the above-described configuration of the electronic device, the heat dissipation section is a component that dissipates heat. The heat dissipation portion may be made of a material that dissipates heat easily, such as aluminum or a steel plate.

[0021] In the above-described configuration of the electronic device, the heat transfer member is disposed between the heat generating element and the heat dissipation portion, and transfers the heat generated by the heat generating element to the heat dissipation portion. The material of the heat transfer member is preferably a material with high thermal conductivity and high corrosion resistance, such as aluminum. The high thermal conductivity of the heat transfer member can increase the efficiency of heat dissipation, and the corrosion resistance of the heat transfer member can extend the life of the heat transfer member and reduce the maintenance cost of the electronic device. The heat transfer member can be in either a direct contact with the heat generating element or the heat dissipation portion, or can be connected via a thermally conductive member with good thermal conductivity (e.g., a gel-like material or grease).

[0022] In the above-mentioned electronic device configuration, the housing cover is provided on the side opposite the heat transfer member of the heat dissipation unit. By providing the housing cover on the side opposite the heat transfer member of the heat dissipation unit in this way, it is possible to insulate the heat from the heat dissipation unit and prevent the heat from the heat dissipation unit from being directly directed to other electronic devices in the vicinity.

[0023] In the above-described configuration of the electronic device, a convection area, which is a space through which air convection occurs, is provided between the heat dissipation section and the housing cover. By providing this convection area, the heat radiated from the heat dissipation section can be moved by convection, thereby cooling the heat dissipation section and suppressing the temperature rise of the housing cover due to the heat radiated from the heat dissipation section. There are three possible configurations for convection to be generated in the convection area: natural convection, a combination of natural convection and forced convection, and forced convection.

[0024] When natural convection is to be generated in the convection area, openings are provided on the bottom and top of the convection area between the heat dissipation unit and the housing cover. Air warmed by heat dissipated from the heat dissipation unit becomes lighter and rises, so by providing an opening on the top of the convection area, the warm air can be discharged to the outside of the electronic device through this opening on the top. In addition, new air can be supplied through the opening on the bottom, so natural convection is generated and the newly supplied air can be used to cool the heat dissipation unit. When forced convection is to be generated in the convection area, a structure for generating forced convection, such as a fan, is provided, and the installation position, installation direction, air volume, etc. are set so that a predetermined convection is generated.

[0025] Even when forced convection is generated in the convection area, it is preferable to provide the convection area with an opening for air to flow into the convection area and an opening for air to be discharged from the convection area to the outside, and by providing these openings, the cooling effect of the heat dissipation section by forced convection can be enhanced. Also, instead of providing the openings, it is possible to provide a heat dissipation member made of a material that dissipates heat easily. However, if there are other electronic devices adjacent to the electronic device, these openings and heat dissipation members are provided on the surface on the side where there are no other adjacent electronic devices (for example, the lower surface, upper surface, or front surface when there are other devices on the left and right). Also, if there are other electronic devices adjacent and a heat dissipation member is provided, it is preferable to configure the material of the heat dissipation member to be a material that dissipates heat more easily than the material of the housing cover, and to dissipate heat mainly from the heat dissipation member.

[0026] The electronic device described above is more preferably configured so that convection occurs not only in the convection area between the heat dissipation portion and the housing cover, but also in the vicinity of the heat transfer member inside the housing. As with convection generated in the convection area, there are three possible configurations for convection generated near the heat transfer component: natural convection, a combination of natural convection and forced convection, and forced convection.

[0027] When natural convection is to be generated near the heat transfer member, an intake opening (ventilation hole) for taking in air into the housing is provided on the bottom surface of the housing, and an exhaust opening (ventilation hole) for discharging the air inside the housing to the outside is provided on the top surface of the housing. By providing an exhaust opening (ventilation hole) on the top surface of the housing, air warmed by the heat transfer member can be discharged from this opening (ventilation hole). Also, by providing an intake opening (ventilation hole) on the bottom surface of the housing, natural convection can be generated by supplying new air that flows in from this opening (ventilation hole), and the newly supplied air can cool the heat transfer member. When forced convection is to be generated near the heat transfer member, a structure for generating forced convection, such as a fan, is provided, and the installation position, wind direction, wind volume, etc. are set so that a desired convection is generated.

[0028] Even when forced convection is generated near the heat transfer member, it is preferable to provide the housing with an opening (ventilation hole) for taking in air into the housing and an opening (ventilation hole) for discharging the air from the housing to the outside. By providing these openings (ventilation holes), the cooling effect of the heat transfer member by forced convection can be improved. Also, instead of providing the openings, it is possible to provide a heat dissipation member made of a material that easily dissipates heat. However, if there are other electronic devices adjacent to the electronic device, these openings and heat dissipation members are provided on the side that does not have other adjacent electronic devices (for example, the bottom, top, or front side when there are other devices on the left and right).

[0029] When a configuration is used in which natural convection is generated near the convection area or the heat transfer member inside the housing, power consumption can be reduced and problems with the lifespan of fans, etc. can be avoided compared to a configuration in which forced convection is generated.

[0030] In addition, in a configuration in which forced convection is generated near the convection area and the heat transfer member inside the housing, it is also possible to further consider a configuration in which the space in the convection area and the space inside the housing are connected to circulate the forced convection between these spaces. This allows a single configuration to be used for both spaces without having to provide a configuration such as a fan in each of the two spaces, and also allows for more efficient cooling by the convection that passes through the heat dissipation section and the heat transfer member. However, when using a configuration that circulates forced convection in this manner, it is desirable to provide the aforementioned openings or heat dissipation members in at least one of the convection area and the housing so that heat can be dissipated to the outside of the electronic device, so as to prevent heat from building up in the connected space.

[0031] It is desirable that the shape and arrangement of the heat transfer member are set so as not to impede convection (natural convection or forced convection) occurring near the heat transfer member inside the housing. For example, if a heat transfer member is shaped like a rectangular prism and is placed with the sides of the rectangle facing up and down, the convection currents will be received on a flat surface. This flat surface will hinder the convection currents, resulting in the formation of a heat spot where heat accumulates on the back side of the rectangular prism-shaped heat transfer member. In contrast, if the heat transfer member is cylindrical, elliptical cylindrical, or a polygonal column with pentagons or more, or if the diagonals of a quadrangular prism-shaped heat transfer member (square, diamond) are arranged so that the diagonals are up and down, obstruction of convection can be suppressed.

[0032] It is also possible to provide the heat dissipation section or heat transfer member with protrusions such as flat fins as a member for dissipating heat. For example, protrusions such as fins can be provided on the convection area side surface of the heat dissipation section or on the outer surface of the heat transfer member so as not to impede convection. This allows the convecting air to hit the protrusions, allowing for efficient heat dissipation and improving the cooling effect.

[0033] According to the configuration of the electronic device of the present invention, the electronic device includes a circuit board on which a heat generating element that generates heat is mounted, and a housing that houses the circuit board. In addition, according to the configuration of the electronic device of the present invention, the electronic device includes a heat dissipation section connected to the housing and dissipating heat, a heat transfer member arranged between the heat generating element and the heat dissipation section and transferring heat generated by the heat generating element to the heat dissipation section, and a housing cover provided on the side of the heat dissipation section opposite the heat transfer member. Furthermore, according to the configuration of the electronic device of the present invention, a convection area where air convection occurs is provided between the heat dissipation section and the housing cover. As a result, the heat generated by the heat generating element is transferred to the heat dissipation section by the heat transfer member, so that the heat generated by the heat generating element moves to the heat dissipation section and the temperature rise of the electronic components inside the housing can be suppressed. Then, air is circulated in the convection area to dissipate the heat from the heat dissipation section and cool the heat dissipation section. In addition, since heat is dissipated through the convection area and the heat within the convection area is insulated by the housing cover, the thermal impact on external devices adjacent to the electronic device can be suppressed.

[0034] The electronic device of the present invention is suitable for use in a configuration in which a plurality of electronic device modules each including a heat generating element are arranged adjacent to each other in the horizontal direction. By applying the electronic device of the present invention to such a configuration, the influence of heat between adjacent modules can be suppressed.

[0035] Specific embodiments of the present invention will be described below.

[0036] (First embodiment) A schematic configuration of an electronic device according to a first embodiment of the present invention will be described with reference to the drawings. The electronic device of this embodiment is suitable for use in a configuration in which multiple modules including heat generating elements are arranged adjacent to each other horizontally, such as a small controller for an automated system in a manufacturing line.

[0037] FIG. 1 is a schematic configuration diagram (perspective view) of an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the electronic device of FIG.

[0038] The electronic device 100 in this embodiment has a rectangular box shape with its longitudinal direction aligned with the direction of gravity, as indicated by a downward arrow in FIGS.

[0039] As shown in FIGS. 1 and 2, the electronic device 100 includes a housing 10, a heat dissipation section 20, a housing cover 30, and a heat transfer section 22. The housing 100 includes a housing cover 30 and a heat transfer section 22. As shown in FIG.

[0040] As shown in FIG. 2, the housing 10 has a front side, a bottom side, a top side, and a right side side (not shown), and a circuit board 40 is housed in the internal space surrounded by these four sides. An intake vent 11 for taking in air into the housing 10 is provided on the underside of the housing 10, and an exhaust vent 12 for expelling the air inside the housing 10 to the outside of the housing 10 is provided on the upper surface of the housing 10. As shown in FIG. 2, the heat dissipation section 20 is substantially L-shaped with a left side and a back side. The housing 10 and the heat dissipation section 20 are formed by, for example, pressing an aluminum or steel plate.

[0041] A heating element 41 is mounted on the circuit board 40. The heating element 41 is an element that generates heat, and generates heat, for example, when the heating element 41 itself operates. Specific examples of the heating element 41 include electronic components such as integrated circuits, transistors, diodes, resistors, and capacitors.

[0042] A heat transfer member 22 for transferring heat from the heating element 41 to the heat dissipation section 20 is provided between the surface of the heating element 41 and the heat dissipation section 20 . The heat transfer member 22 has a cylindrical shape as shown in FIG. 2, and is made of, for example, an aluminum member.

[0043] A thermally conductive member 21 is provided between the heat generating element 41 and the heat transfer member 22, and the heat generating element 41 and the heat transfer member 22 are joined to each other so as to be capable of heat transfer via this thermally conductive member 21. In addition, a thermally conductive member 23 is provided between the heat transfer member 22 and the heat dissipation section 20, and the heat transfer member 22 and the heat dissipation section 20 are joined to each other so as to be capable of heat transfer via this thermally conductive member 23. As the thermally conductive members 21 and 23, for example, a gel-like material or grease can be used.

[0044] FIG. 3 is a cross-sectional view of the electronic device 100 in FIG. 1 along a cross section including the heat transfer member 22. As shown in FIG. The airflow sucked in through the intake vent 11 of the housing 10 flows along the outer shape of the heat transfer member 22 as it approaches the heat transfer member 22, as shown by arrow 24 in Figure 3, and is exhausted from the top of the heat transfer member 22 through the exhaust vent 12 of the housing 10.

[0045] The housing cover 30 is formed, for example, by pressing aluminum or steel plate, or from a resin material.

[0046] A convection area is provided between the housing cover 30 and the heat dissipation section 20 . Fig. 4 is a cross-sectional view of a cross section including the heat transfer member 22 and the convection area of ​​the electronic device 100 of Fig. 1. The cross section of Fig. 4 is a cross section perpendicular to the cross section of Fig. 3.

[0047] 4, a lower opening 31 and an upper opening 32 are provided between the housing cover 30 and the heat dissipation unit 20, and thus an airflow (natural convection) indicated by arrows 34 is generated in a convection area 33 between these openings 31, 32. That is, air flows into the convection area 33 from the lower opening 31, and is discharged from the convection area 33 to the outside of the electronic device 100 via the upper opening 32, generating a natural convection indicated by arrows 34. In addition, the heat dissipated from the heat dissipation section 20, as shown by the arrow 35 in Figure 4, is carried by the air current 34 generated in the convection area 33, and is dissipated to the outside of the electronic device 100 (the outside of the housing 10 and the heat dissipation section 20), and is not transferred to the housing cover 30.

[0048] Although not shown in FIG. 4, the circuit board 40 and the right side surface of the housing 10 are spaced apart to a certain extent in order to accommodate electronic components such as a connector between the circuit board 40 and the right side surface of the housing 10. In contrast, if no other electronic components are provided between the circuit board 40 and the right side surface of the housing 10, the distance between the circuit board 40 and the right side surface of the housing 10 can be made shorter than that shown in FIG.

[0049] As described above, in the electronic device 100 of this embodiment, heat from the heat generating element 41 is transferred to the heat dissipation section 20 via the heat transfer member 22, and the heat transfer member 22 has a shape that does not impede convection and is configured to provide a convection area 33 between the heat dissipation section 20 and the housing cover 30. When dissipating heat from the heat generating element 41, by providing a convection area 33 between the heat dissipation section 20 and the housing cover 30, distance from other adjacent electronic devices can be ensured, and the heat within the convection area 33 is insulated by the housing cover 30. This makes it possible to suppress heat transfer to other adjacent electronic devices, and also makes it possible to suppress heat transfer from other adjacent electronic devices.

[0050] In addition, in the electronic device 100 of this embodiment, an intake vent 11 is provided on the underside of the housing 10, an exhaust vent 12 is provided on the upper surface of the housing 10, and openings 31 and 32 are provided on the lower and upper surfaces between the heat dissipation section 20 and the housing cover 30, respectively. This makes it possible to generate natural convection from intake vent 11 through heat transfer member 22 in housing 10 toward exhaust vent 12, and natural convection from opening 31 through convection area 33 toward opening 32. Since natural convection can be generated in this manner, cooling can be achieved mainly by using natural convection, which reduces power consumption compared to a configuration that uses forced convection, and avoids problems with the life span of a fan, etc.

[0051] Furthermore, in electronic device 100 of this embodiment, heat transfer member 22 is cylindrical and has a shape that does not impede convection from intake vent 11 to exhaust vent 12, from bottom to top in the direction of gravity. This makes it possible to suppress the influence of heat dissipation from the heat transfer member 22 on the internal components of the electronic device 100.

[0052] In the electronic device 100 according to the first embodiment described above, the heat transfer member 22 has a cylindrical shape. However, the shape of the heat transfer member 22 is not limited to a cylindrical shape.

[0053] (Variation 1) FIG. 5 shows a cross-sectional view of an electronic device according to the first modification, taken along a cross section including a heat transfer member. As shown in Fig. 5, in electronic device 110 of Modification 1, heat transfer member 22 has a hexagonal prism shape. Heat transfer member 22 of the hexagonal prism shape shown in Fig. 5 is arranged so that the vertices of the hexagon face up and down. Even if heat transfer member 22 is made into a hexagonal column shape in this manner, it does not interfere with the airflow indicated by arrow 24 in Figure 5 entering through intake vent 11 in housing 10, so the effects of heat dissipation from heat transfer member 22 can be suppressed.

[0054] (Variation 2) FIG. 6 shows a cross-sectional view of an electronic device according to the second modification, taken along a cross section including a heat transfer member. As shown in Fig. 6, in electronic device 120 of Modification 2, heat transfer member 22 has a pentagonal prism shape. Heat transfer member 22 of the pentagonal prism shape shown in Fig. 6 is disposed so that the apex of the pentagon faces downward. Even if heat transfer member 22 is made into a pentagonal prism shape in this manner, it does not interfere with the airflow indicated by arrow 24 in Figure 6 that enters through intake vent 11 in housing 10, so that the effects of heat dissipation from heat transfer member 22 can be suppressed.

[0055] (Other variations) In the above embodiment and modified examples, the shape of the heat transfer member 22 has been described as a cylindrical shape, a hexagonal prism shape, and a pentagonal prism shape, but the shape of the heat transfer member is not limited to these three shapes. For example, the shape of the heat transfer member may be an elliptical cylinder, a square cylinder in which the diagonal of the square is arranged in the direction of gravity, etc. The shape of the heat transfer member may also be a configuration in which flat fins or the like are added to each of the above shapes. By adding fins or the like, the convecting air hits the protrusions, allowing for efficient heat dissipation and improving the cooling effect. If the heat transfer member is configured so that it is not subjected to convection on a surface perpendicular to the direction of convection, the convection is not impeded.

[0056] In the above embodiment, the surface of the heat dissipation unit 20 on the housing cover 30 side (the surface on the convection area 33 side) is flat. In response to this, protrusions such as flat fins that protrude into the convection area may be added to the surface of the heat dissipation section facing the convection area. This allows the convecting air to hit the protrusions, making it possible to dissipate heat efficiently and improving the cooling effect. Furthermore, by adding protrusions such as fins, as long as the convection area can be secured without impeding the convection in the space between the housing cover, the thermal impact on adjacent modules, etc. can be suppressed.

[0057] In addition, in the above embodiment and modified example, in order to generate natural convection in the housing 10 and the convection area 33, respectively, the ventilation holes 11, 12 and the openings 31, 32 are provided on the bottom and top surfaces, thereby utilizing natural convection. The present invention is not limited to the configuration using natural convection, but may be configured to use both natural convection and forced convection, or to mainly use forced convection. When using forced convection, the convection is forcibly generated by a fan or the like. As described above, even when forced convection is used, it is desirable to provide ventilation holes, openings, etc., which are inlets and outlets for air. When forced convection is used, ventilation holes, openings, etc. can be provided not only on the bottom and top surfaces, but also on the side surfaces. In this case, the position of the ventilation holes or openings and the specifications of the configuration for forced convection (installation position, wind direction, air volume, etc.) of the fan or the like are set so that convection passes through the side surface of the heat transfer member and the position of the heat dissipation section corresponding to the heat transfer member.

[0058] When forced convection is used, problems such as the power consumption and lifespan of the components for forcibly generating convection, such as fans, arise, as described above. In contrast, by mainly utilizing natural convection, it is possible to reduce power consumption and avoid problems with the life span of fans and the like.

[0059] In addition, in the above embodiment, the housing 10 has a front side, a bottom side, a top side, and a right side, the heat dissipation section 20 has a left side and a back side, and the housing cover 30 has a front side, a left side, and a back side. The shapes of the housing, heat dissipation unit, and housing cover are not limited to those in the above embodiment. Any shape may be used as long as it is possible to accommodate the heat generating element, the circuit board, and the heat transfer member in the housing and to ensure a convection area. For example, a cylindrical member having openings on the bottom and top surfaces may be used as both the heat dissipation unit and the housing cover, and this cylindrical member may be attached to a housing having an opening on one surface.

[0060] Although the preferred embodiments and modifications of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the spirit of the present invention. The above-mentioned embodiments and modifications have been described in detail to explain the present invention in an easily understandable manner, and the present invention is not necessarily limited to those having all of the configurations described. [Explanation of symbols]

[0061] 10... housing, 11... intake vent, 12... exhaust vent, 20... heat dissipation section, 21, 23... thermally conductive member, 22... heat transfer member, 30... housing cover, 31, 32... opening, 33... convection area, 40... circuit board, 41... heat generating element, 100, 110, 120... electronic device

Claims

1. A circuit board on which a heat generating element is mounted, A housing in which the circuit board is housed; a heat dissipation unit connected to the housing and configured to dissipate heat; a heat transfer member disposed between the heat generating element and the heat dissipation portion, for transferring heat generated by the heat generating element to the heat dissipation portion; a housing cover provided on a side of the heat dissipation portion opposite to a side of the heat transfer member; Equipped with a convection area, which is a space where air convection occurs, is provided between the heat dissipation unit and the housing cover; the housing is provided with an intake vent for taking in air into the housing and an exhaust vent for exhausting the air in the housing to the outside, The heat transfer member has a cross-sectional shape that does not impede the airflow that is drawn in through the intake vent, flows along the outer shape of the heat transfer member, and is exhausted to the exhaust vent.

1. An electronic device comprising:

2. 2. The electronic device according to claim 1, further comprising an opening for allowing air to flow into the convection area and an opening for discharging air from the convection area to the outside.

3. 3. The electronic device according to claim 2, characterized in that an opening for allowing air to flow into the convection area is provided on the underside between the heat dissipation section and the housing cover, and an opening for discharging air from the convection area to the outside is provided on the upper side between the heat dissipation section and the housing cover.

4. 2. The electronic device according to claim 1, wherein the intake ventilation hole is provided on a bottom surface of the housing, and the exhaust ventilation hole is provided on a top surface of the housing.

5. 2. The electronic device according to claim 1, wherein the heat transfer member has a cylindrical shape or a polygonal column shape having pentagons or more sides.

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