Temperature control device and its epitaxial growth equipment

Abstract

The present invention discloses a temperature control device and an epitaxial growth device thereof, the temperature control device is used in an epitaxial growth device, the epitaxial growth device includes a heating device, a reflector device, and a temperature control device provided in the reflector device to control the temperature of the reflector device, the temperature control device includes an outer ring, an inner ring provided inside the outer ring, and a temperature control assembly provided in the outer ring and / or the inner ring, the temperature control assembly includes an inlet for a cooling medium, an outlet for a cooling medium, and a cooling passage passing through both. The advantage is that the temperature control device is composed of at least two rings, so the width of each ring is reduced compared to an integrated water-cooled plate structure, and therefore, when warping occurs due to thermal deformation, the gap between each ring and the reflector device is not large, ensuring close contact with the reflector device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and more particularly, to a temperature control device and its epitaxial growth equipment.

Background Art

[0002] In the production process of semiconductor chips, a large amount of microfabrication is required. Among them, the commonly used method is to use a vapor deposition or plasma treatment process to process and fabricate a semiconductor substrate using a vacuum reaction chamber. Depending on whether a chemical reaction is involved in the vapor deposition process, vapor deposition is divided into physical vapor deposition (PVD for short) and chemical vapor deposition (CVD for short). Here, CVD is currently the most widely used technology for depositing various materials in the semiconductor industry, including a wide range of insulating materials, most metal materials, and metal alloy materials.

[0003] Chemical vapor deposition refers to a method in which a chemical gas or vapor reacts on the surface of a substrate to synthesize a coating or nanomaterial. Generally speaking, its principle is to use a carrier gas to transport a gas-phase reactant or precursor into a reaction chamber where the substrate is placed. Here, an epitaxial growth apparatus (a type of chemical vapor deposition apparatus) uses a plurality of heating devices to send thermal energy into the reaction chamber, raise the temperature inside the chamber, heat the substrate and the gas-phase reactants inside the chamber to raise their temperatures, and then cause a chemical reaction between single or multiple types of gases in a high-temperature state. Each gas-phase reactant decomposes and recombines to form a new solid substance, which is also deposited on the surface of the substrate to form a required thin film.

[0004] Generally, in order to enhance the efficiency of heat radiation transfer from a heating device to a chamber, a reflector device can be utilized to maximize the heat radiation generated by the heating device and transfer it to the reaction chamber. However, during the process, the reflector device inevitably absorbs a portion of the thermal energy generated by the heating device, resulting in an overly high temperature of the reflector device. When the temperature is too high, not only does the metal layer on the surface of the reflector device peel off, but the stress of individual components increases, leading to damage to the components. Therefore, it is also necessary to provide a water-cooled plate structure to adjust the temperature of the reflector device. However, when the epitaxial growth process is carried out, the process temperature reaches 1000°C, and the temperature change is significant, varying from several hundred to several thousand. The water-cooled plate structure warps and deforms due to the effects of thermal expansion and cold shrinkage. In the long term, the bonding between the water-cooled plate structure and the reflector device is not very good, and the gap between the two becomes large. When the gap becomes large, the efficiency of heat exchange between the water-cooled plate structure and the reflector device is low, thus affecting the temperature adjustment of the reflector device.

Summary of the Invention

[0005] The present invention aims to provide a temperature control device and its epitaxial growth equipment. The temperature control device combines an inner ring, an outer ring, and a temperature control assembly to reduce the gap caused by thermal deformation when the temperature control device is connected to the reflector device, which helps to ensure the adhesion with the reflector device, avoid the problems of warping and deformation of the temperature control device after long-term use, enhance the efficiency of heat exchange between the temperature control device and the reflector device, and ensure the efficiency of its temperature adjustment.

[0006] To achieve the above object, the present invention is realized by the following technical solutions.

[0007] A temperature control device for use in epitaxial growth equipment, comprising a heating device, a reflector device, and a temperature control device provided on the reflector device for controlling the temperature of the reflector device, wherein

[0008] an outer ring, An internal ring provided inside the outer ring, and a temperature control assembly provided on the outer ring and / or the internal ring, and including an inlet of a cooling medium, an outlet of the cooling medium, and a cooling passage passing through both.

[0009] Optionally, the temperature control assembly is installed only on the internal ring, and the temperature control device further includes a pressure assembly for applying pressure to the internal ring in the direction of the reflector device through the outer ring.

[0010] Optionally, the pressure assembly is provided between the internal ring and the outer ring.

[0011] Optionally, the pressure assembly includes at least one protrusion structure provided on the outer periphery of the internal ring, and a stepped concave groove provided on the inner periphery of the outer ring and matching the protrusion structure.

[0012] Optionally, the thermal conductivity of the material of the outer ring is less than the thermal conductivity of the material of the internal ring, and / or the wear resistance of the material of the outer ring is greater than the wear resistance of the material of the internal ring.

[0013] Optionally, the material of the outer ring includes stainless steel, and the material of the internal ring includes copper.

[0014] Optionally, the temperature control assembly is installed only on the outer ring, and the temperature control device further includes a pressure assembly for applying pressure to the outer ring in the direction of the reflector device through the internal ring.

[0015] Optionally, the pressure assembly is provided between the internal ring and the outer ring.

[0016] Optionally, the pressure assembly includes at least one protrusion structure provided on the inner periphery of the outer ring, and a stepped concave groove provided on the outer periphery of the internal ring and matching the protrusion structure.

[0017] Optionally, the thermal conductivity of the material of the inner ring is less than the thermal conductivity of the material of the outer ring, and / or the wear resistance of the material of the inner ring is greater than the wear resistance of the material of the outer ring.

[0018] Optionally, the material of the inner ring includes stainless steel and the material of the outer ring includes copper.

[0019] Optionally, the profile of the at least one protrusion structure is one or more of a continuous waveform, a continuous polyline, and a continuous zigzag.

[0020] Optionally, the temperature control device further includes a base for detachably mounting a heating device, which is detachably connected to the outer ring or the inner ring via a connection assembly.

[0021] Optionally, the connection assembly includes a sliding guide member and a positioning member disposed between the base and the outer ring or the inner ring to guide the base to slide in a sliding direction with respect to the outer ring or the inner ring. The positioning member is used to fix the base at the mounting position with respect to the outer ring or the inner ring when the base slides to reach the mounting position.

[0022] Optionally, the sliding guide member includes a T-shaped boss and a corresponding T-shaped groove, and the T-shaped groove is used to guide the T-shaped boss to slide inside it. The T-shaped boss is provided on a contact surface contacting the outer ring or the inner ring of the base, and the T-shaped groove is provided on a contact surface contacting the base of the outer ring or the inner ring, or the T-shaped groove is provided on a contact surface contacting the outer ring or the inner ring of the base, and the T-shaped boss is provided on a contact surface contacting the base of the outer ring or the inner ring.

[0023] Optionally, the positioning member includes an elastic structure and a corresponding positioning concave groove. The elastic structure includes an extension portion. When in the mounting position, the extension portion of the elastic structure forms a locking relationship with the positioning concave groove.

[0024] The elastic structure is provided on a contact surface that contacts the outer ring or inner ring of the base. The positioning concave groove is provided on a contact surface that contacts the base of the outer ring or inner ring, or the elastic structure is provided on a contact surface that contacts the base of the outer ring or inner ring, and the positioning concave groove is provided on a contact surface that contacts the outer ring or inner ring of the base.

[0025] Optionally, the extension portion of the elastic structure is a ball plunger.

[0026] Optionally, the number of the positioning members is at least two, and the positioning members are symmetrically installed with respect to the sliding guide member. The sliding guide member extends radially along the outer ring or inner ring.

[0027] Optionally, the temperature control device is provided on the outer ring and / or inner ring, and further includes a fastening member for fixing the outer ring and inner ring to the reflector device.

[0028] Optionally, an epitaxial growth apparatus, including a reaction chamber for carrying out an epitaxial growth process, which contains a tray for placing a substrate therein, a heating device provided above and / or below the reaction chamber for providing heat radiation in the epitaxial growth process, a reflector device for reflecting the heat radiation generated by the heating device to the reaction chamber, and a temperature control device for controlling the temperature of the reflector device.

[0029] The present invention has the following advantages compared with the prior art.

[0030] In the temperature control device and its epitaxial growth equipment provided by the present invention, since the outer ring water cooling plate structure is composed of at least two rings, the width of each ring is reduced compared with the integrated water cooling plate structure. Because the width is reduced, when warping due to thermal deformation occurs in the water cooling plate structure, the gap between each ring of the water cooling plate structure and the reflector device is not large, which helps to ensure the adhesion with the reflector device and improve the efficiency of heat exchange between the temperature control device and the reflector device. Moreover, there is a pressure assembly between the inner ring and the outer ring, which can ensure the adhesion between the inner ring or the outer ring and the reflector device. In addition, the inner ring and the outer ring are not integrated, the materials of the two rings are different, and the base is arranged only on one of the wear-resistant materials of the inner ring or the outer ring, so the flatness and stability of the heating device in a high-temperature environment are ensured.

Brief Description of the Drawings

[0031]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6a

Figure 6b

Figure 7

Figure 8a

Figure 8b

Best Mode for Carrying Out the Invention

[0032] Next, in order to make the objectives, technical solutions, and merits of the embodiments of the present invention clearer, in combination with the drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

[0033] It should be noted that in this document, the terms "include", "contain", "comprise", or any other variations thereof cover non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements but also other elements not explicitly listed, or other elements inherent to such a process, method, article, or terminal device. Without further limitation, an element limited by a statement of "comprising..." or "including..." does not exclude the existence of other elements in the process, method, article, or terminal device that includes the said element.

[0034] It should be noted that the drawings are in a very simplified form and all use inaccurate ratios, and are only used to assist in conveniently and clearly explaining the objective of one embodiment of the present invention.

[0035] Example 1 As shown in combination with FIGS. 1 and 2, it is a schematic structural diagram of the epitaxial growth equipment of the present invention. The epitaxial growth apparatus includes a reaction chamber 100 for carrying out an epitaxial growth process, and the reaction chamber 100 is used for processing one or more substrates W including depositing a material on the upper surface of the substrate W. The reaction chamber 100 has an upper wall 101 located at the upper end, a lower wall 102 located at the bottom end, and side walls extending between the upper wall 101 and the lower wall 102. Optionally, the upper wall 101 and the lower wall 102 are made of an optically transparent or translucent material (e.g., a quartz material transparent to a specific infrared band, etc.) that is transparent to thermal energy.

[0036] The reaction chamber 100 is provided with a gas inlet 103 provided at one end and a gas outlet 104 provided at the other end. Inside the reaction chamber 100, a gas introduction region corresponding to the gas inlet 103, a gas discharge region corresponding to the gas outlet 104, and a reaction region between the gas introduction region and the gas discharge region are included. The substrate W is located in the reaction region. As shown by the arrow in FIG. 1, the reaction gas for deposition flows from the gas inlet 103 into the internal space of the chamber, a chemical vapor deposition process is carried out in the reaction region, and is discharged from the gas outlet 104 of the chamber.

[0037] As shown in FIG. 1, the lower wall 102 is provided with an extension tube extending downward. The extension tube is used to accommodate an internal space through which the rotation shaft 105 is inserted into the reaction chamber 100. On the upper part of the rotation shaft 105, a plurality of support rods for supporting the tray and the substrate W on the tray are included so as to rotate and drive the tray and the substrate W placed on the tray in the reaction region, and further ensure the uniformity effect of the thin film deposition of the substrate W. Optionally, the rotation shaft 105 is made of quartz so as to reduce the risk of contamination by particles.

[0038] Furthermore, when the epitaxial growth process is carried out, the epitaxial growth equipment further includes a plurality of heating devices 106 for providing thermal radiation to the reaction chamber 100 and the substrate W. Each of the heating devices 106 is provided outside the reaction chamber 100 so as to heat the reaction chamber 100 and the substrate W therein. To facilitate understanding of the temperature change situation in the reaction chamber 100, the epitaxial growth equipment further includes a thermometer 107.

[0039] In this embodiment, heating devices 106 are arranged both above and below the reaction chamber 100. During the epitaxial growth process, to assist in the thermal decomposition of the reaction gas in the reaction chamber 100, thermal radiation is provided to the inside of the reaction chamber 100 and the substrate W through each heating device 106, so that the inside of the reaction chamber 100 of the epitaxial growth equipment and the substrate W reach the required process temperature. Accordingly, a thin film material is deposited on the upper surface of the substrate W. At the same time, the thermometer 107 is used to measure the temperature in the reaction chamber 100 in real time, thereby adjusting the process. Optionally, the thin film material deposited on the upper surface of the substrate W is a semiconductor material such as silicon or germanium, and may also include other doping materials such as group III, IV, and / or V materials. Further optionally, the heating device 106 is a high-intensity tungsten lamp having a transparent quartz shell and containing a halogen gas such as iodine. Only a very small part of the radiant heat energy generated by the high-intensity tungsten lamp is absorbed by the upper wall 101 and the lower wall 102 of the reaction chamber 100, so that the thermal energy generated by each heating device 106 is maximally transmitted to the substrate W and the reaction gas in the reaction chamber 100. Of course, the heating device 106 can also be other devices capable of realizing thermal radiation, and the present invention is not limited thereto.

[0040] To enhance the heat radiation efficiency of the heating device 106 to the reaction chamber 100, the epitaxial growth equipment of the present invention further includes a reflector device. The reflector device is used to reflect the heat radiation generated by the heating device 106 to the reaction chamber 100 and is extremely reflective to the heat radiation of the heating device 106. As shown in FIG. 2, in this embodiment, the inner ring reflector device 108 and the outer ring reflector device 109 are installed according to the distribution of the heating devices 106 to ensure the efficiency of the heat radiation transmission of each heating device 106. From the above, each reflector device has an extremely high reflectivity to heat radiation. However, since a part of the heat radiation absorbed by the inner ring reflector device 108 and the outer ring reflector device 109 still exists, it can be seen that the epitaxial growth equipment is further provided with an inner ring water-cooled plate structure 110 and an outer ring water-cooled plate structure 120 to adjust the temperatures of the inner ring reflector device 108 and the outer ring reflector device 109 respectively. Optionally, the structures of the inner ring water-cooled plate structure 110 and the outer ring water-cooled plate structure 120 are partially or completely the same. Next, the structure will be described by taking the outer ring water-cooled plate structure 120 (i.e., the temperature control device) as an example.

[0041] As shown in FIG. 3, the outer ring water-cooling plate structure 120 is provided on the outer ring reflector device 109 and is used to control the temperature of the outer ring reflector device 109. The outer ring water-cooling plate structure 120 includes an outer ring 121, an inner ring 122 provided inside the outer ring 121, and a temperature control assembly 123. The temperature control assembly 123 is provided on the inner ring 122 and / or the outer ring 121. The temperature control assembly 123 includes an inlet 1231 of a cooling medium, an outlet 1232 of the cooling medium, and a cooling passage through both. The cooling medium flows in the cooling passage so as to achieve heat exchange between the temperature control assembly 123 and the external and other members. In the present invention, the outer ring water-cooling plate structure 120 includes an inner ring 122 and an outer ring 121. Compared with the width of the water-cooling plate structure of an integrated structure, since the outer ring water-cooling plate structure 120 is composed of two rings, the width of each ring is reduced. Because the width is reduced, when warping due to thermal deformation occurs in the water-cooling plate structure, the gap between the water-cooling plate structure and the reflector device is not large, which helps to enhance the adhesion between the outer ring water-cooling plate structure 120 and the outer ring reflector device 109, improves the efficiency of heat exchange between the two, and is useful for uniform temperature control of the outer ring water-cooling plate structure 120 for the outer ring reflector device 109. At the same time, the members of the outer ring water-cooling plate structure 120 are not too many, the degree of its connection and fastening is easy to control, its structure is simple, and assembly and disassembly are more convenient. Of course, optionally, the water-cooling plate structure can further include more rings other than the inner ring and the outer ring, and thus the width of each ring can be further reduced.

[0042] Example 2 Based on the characteristics of the structure of the epitaxial growth equipment in Example 1, in this example, changes are made to the outer ring water-cooling plate structure 120, mainly by changing the installation position of the temperature control assembly 123. As shown in Figures 4 to 6b combined, this example shows the situation where the temperature control assembly 123 is provided on the inner ring 122. In this example, the temperature control assembly 123 is only installed on the inner ring 122, and through the temperature control assembly 123 of the inner ring 122, temperature control for the outer ring reflector device 109 is realized. The outer ring water-cooling plate structure 120 further includes a pressure assembly, and in order to make the connection between the inner ring 122 and the outer ring reflector device 109 stronger and reduce the gap between the inner ring 122 and the outer ring reflector device 109, the pressure assembly applies pressure in the direction of the outer ring reflector device 109 to the inner ring 122 through the outer ring 121.

[0043] In the present invention, the pressure assembly is arranged between the inner ring 122 and the outer ring 121, and the inner ring 122 and the outer ring 121 are detachably connected. Optionally, the pressure assembly includes at least one protrusion structure 124 provided on the outer periphery of the inner ring 122 and a stepped concave groove 125 provided on the inner periphery of the outer ring 121 and matching the protrusion structure 124. The inner ring 122 and the outer ring 121 of the outer ring water-cooling plate structure 120 are detachably connected through the pressure assembly, and both disassembly and attachment are convenient.

[0044] As shown in FIG. 5, in this embodiment, a plurality of single-step stepped protrusion structures 124 (i.e., skirt-shaped protrusion structures or rectangular protrusion structures) are arranged in the circumferential direction of the peripheral edge of the inner ring 122. On the inner circumference of the outer ring 121, a single-step stepped concave groove 125 of a skirt-shaped protrusion structure corresponding to the plurality of single-step stepped protrusion structures 124 is arranged along the circumferential direction correspondingly. The plurality of single-step stepped protrusion structures 124 are fitted with the single-step stepped concave groove 125, which helps the outer ring 121 apply a downward force (i.e., a force directed towards the outer ring reflector device 109) to the inner ring 122. Therefore, the inner ring 122 is closely attached to the outer ring reflector device 109, improving the efficiency of heat conduction. At the same time, the stepped concave groove 125 can guide the protrusion structure 124 to perform radial thermal expansion therein, ensuring the stability after connection. Of course, the protrusion structure 124 and the stepped concave groove 125 are not limited to only a single-step stepped structure, and may be made into a multi-step stepped structure according to the requirement of adhesion, and the present invention does not limit this. Furthermore, the protrusion structure 124 is not limited to only a stepped protrusion structure, and the contour around it may be one or more of a continuous waveform, a continuous polyline, and a continuous zigzag. That is, the protrusion structure 124 can be continuously installed in the circumferential direction along the peripheral edge of the inner ring 122, and the inner circumference of the outer ring 121 is correspondingly installed, thereby expanding the engagement range between the inner ring 122 and the outer ring 121, and further ensuring the robustness of the outer ring water-cooling plate structure 120.

[0045] Optionally, the outer ring water-cooling plate structure 120 further includes a fastening member. The fastening member is provided on the outer ring 121 and / or the inner ring 122 so as to fix the outer ring 121 and the inner ring 122 to the outer ring reflector device 109 and further realize the fixation of the outer ring water-cooling plate structure 120.

[0046] When installing the outer ring water cooling plate structure 120, by inserting the stepped protrusion structure 124 of the inner ring 122 into the stepped concave groove 125 of the outer ring 121 through the fitting of the one-stage stepped protrusion structure 124 and the one-stage stepped concave groove 125, the two are not rotated relative to each other. Further, the outer ring 121 and the inner ring 122 are fixed to the outer ring reflector device 109 via a fastening member, and further, the fixing of the outer ring water cooling plate structure 120 is realized.

[0047] Furthermore, the thermal conductivity of the material of the outer ring 121 is less than that of the material of the inner ring 122, and / or the wear resistance of the material of the outer ring 121 is greater than that of the material of the inner ring 122. Optionally, the material of the outer ring 121 includes stainless steel, and the material of the inner ring 122 includes pure copper. In this embodiment, the temperature control assembly 123 is provided only on the inner ring 122. Since the temperature control assembly 123 exists and the thermal conductivity of the material of the outer ring 121 is smaller than that of the material of the inner ring 122, heat is mainly absorbed by the inner ring 122, and the heat absorbed by the outer ring 121 is less, so the thermal deformation is small. Moreover, since the outer ring 121 and the inner ring 122 are not integrated but joined, a gap is generated between the inner circumference of the outer ring 121 and the outer circumference of the inner ring 122, and the efficiency of heat transfer from the inner ring 122 to the outer ring 121 decreases. Therefore, the temperature of the outer ring 121 does not become high. In addition, since the outer ring 121 uses stainless steel, its linear expansion coefficient is smaller than that of copper, so the outer ring 121 is more stable, which has better benefits when the base 126 is installed, and will be described in detail below. Moreover, since the hardness of stainless steel is greater than that of copper, even if the copper inner ring 122 undergoes thermal deformation, the stainless steel outer ring 121 can firmly fix the copper inner ring 122 to the surface of the outer ring reflector device 109.

[0048] As shown in FIG. 7, in this embodiment, the outer ring water-cooled plate structure 120 (i.e., the temperature control device) further includes a base 126 for detachably mounting the heating device 106, and the base 126 is detachably connected to the external ring 121 via a connection assembly. The base 126 further includes an inverted L-shaped fixing frame 1261 provided thereon.

[0049] The heating device 106 includes a socket 1061 and a heating lamp 1062. The socket 1061 includes an upper socket and a lower socket. The socket 1061 is fixed to the inverted L-shaped fixing frame 1261 of the base 126. Four through holes are provided in the inverted L-shaped fixing frame 1261, and corresponding through holes are also provided in the upper socket and the lower socket. By passing a screw assembly through the corresponding through holes on the inverted L-shaped fixing frame 1261, the upper socket, and the lower socket, the upper socket is attached above the inverted L-shaped fixing frame 1261 of the base 126, and the lower socket is attached below the inverted L-shaped fixing frame 1261 of the base 126. Female pins are provided on the upper socket and the lower socket on the side edge close to the heating lamp 1062. These female pins match the male pins at the end of the heating lamp 1062. Through these male and female pins, the heating lamp 1062 is connected to the socket 1061, and further the heating lamp 1062 is detachably attached to the base 126.

[0050] In order to make full use of the installation space of the epitaxial growth equipment, the heating device 106 can be fixed via the base 126 by means of the outer ring water-cooling plate structure 120 (shown in Fig. 2). However, in the prior art, usually, the heating device 106 is directly fixed using a screw assembly. Since the installation space in the outer ring water-cooling plate structure 120 is narrow, within the visual field, it is inconvenient to disassemble the screw assembly using disassembly tools. At the same time, during the disassembly and installation process, there is a risk that the screw assembly may fall into the equipment and cannot be taken out, making installation and disassembly very inconvenient. On the other hand, due to the constraints of the installation space, the screw assembly can only be installed at the edge of the heating device 106 and the outer ring water-cooling plate structure 120. Due to the processing error of the equipment, it is difficult to ensure that an absolute plane is maintained between the heating device 106 and the outer ring water-cooling plate structure 120. When the screw assembly is installed and locked, a torque that warps the other end of the heating device 106 upward is generated on the entire heating device 106. Therefore, the heating lamp 1062 cannot maintain good flatness, and the flatness of the heating lamp 1062 affects the uniformity of the temperature field of the substrate W in the reaction chamber 100. Furthermore, the temperature uniformity of the airflow field cannot be ensured, thereby the heating effect of the airflow field of the process gas in the substrate W and the reaction region fails to achieve the expected uniformity, and the uniformity of the thin film deposition cannot be ensured.

[0051] As is well known, throughout the entire epitaxial growth process, the growth environment of the substrate W thin film is extremely harsh. Factors such as the temperature uniformity of the substrate W material itself, the temperature uniformity of the airflow field, and the accuracy of the reaction temperature are all important, and they directly determine the quality of the thin film deposited on the substrate W. Therefore, the stable fixation of the outer ring water-cooling plate structure 120 and the heating device 106 is particularly important. When the outer ring water-cooling plate structure 120 is in close contact with the outer ring reflector device 109, the heating device 106 placed on the outer ring water-cooling plate structure 120 can also maintain good flatness.

[0052] In view of the above problems, as shown in the combination of FIGS. 4, 7, 8a and 8b, in this embodiment, the base 126 of the outer ring water cooling plate structure 120 detachably mounts the heating device 106. The base 126 is detachably connected to the outer ring 121 via a connection assembly. Optionally, there are a plurality of heating devices 106, which are arranged annularly on the upper surface of the outer ring water cooling plate structure 120. Each heating device 106 is mounted by one base 126, which is convenient for the detachment of any heating device 106. When the outer ring 121 and the inner ring 122 of the outer ring water cooling plate structure 120 are stably connected and fixed to the outer ring reflector device 109, it is helpful for the stable installation of the heating device 106 mounted on the base 126. Furthermore, it ensures the levelness and heating stability of the heating device 106, and does not cause instability in the levelness and direction of the heating device 106. In particular, the base 126 is provided only on the outer ring 121, and the stainless-steel outer ring 121 is installed separately from the inner ring 122. The outer ring 121 is not easily deformed. Therefore, the levelness and direction stability of the heating device 106 can be better ensured. Moreover, the material of the outer ring 121 has good wear resistance and can be better adapted to the disassembly of the base 126.

[0053] Regarding the disassembly method, the connection assembly includes a sliding guide member and a positioning member. The sliding guide member is disposed between the base 126 and the outer ring 121 and is used to guide the base 126 to slide in the sliding direction with respect to the outer ring 121. The positioning member is used to fix the base 126 at the mounting position with respect to the outer ring 121 when the base 126 slides and reaches the mounting position.

[0054] When attaching the heating device 106, mount the heating device 106 on the base 126 of the outer ring water-cooling plate structure 120, and slide the base 126 on which the heating device 106 is placed along the axial direction of the sliding guide member with respect to the outer ring 121 from the initial position to the mounting position. The initial position is the initial connection position when the base 126 is connected to the outer ring 121 via the sliding guide member, and the mounting position is a predetermined mounting position reached after the base 126 and the outer ring 121 slide facing each other via the sliding guide member. At this time, the lower surface of the base 126 and the upper surface of the outer ring 121 come into contact with each other. Correspondingly, when disassembling the lamp holder structure, slide the base 126 along the axial direction of the sliding guide member with respect to the outer ring 121 to completely separate the lower surface of the base 126 from the upper surface of the outer ring 121.

[0055] Optionally, the sliding guide member includes a T-shaped boss 127 and a corresponding T-shaped concave groove 128. The T-shaped concave groove 128 is used to slide and guide the T-shaped boss 127 inside it. The vertical structure of the T-shaped structure ensures the guiding action of the sliding, and the horizontal structure prevents falling. Thereby, both are integrated and locked without generating displacement in the vertical direction. The sliding guide member further ensures the adhesion of both connections, and its structure is simple and easy to process. Using the T-shaped boss 127 and the T-shaped concave groove 128 as the sliding guide member can maintain the stable state of the heating device 106 during the assembly and disassembly process, without the need to constantly apply an external force to prevent the base 126 from falling, making it easy to operate. At the same time, the assembled heating device 106 is more stable.

[0056] As shown in combination with FIGS. 4, 7, and 8a, in this embodiment, on the upper surface of the external ring 121, a plurality of sliding guide members are provided at equal intervals along the circumferential direction. Each sliding guide member extends radially along the external ring 121. Optionally, one base 126 is correspondingly attached to each of the sliding guide members. Specifically, the T-shaped boss 127 is provided on the contact surface that contacts the base 126 of the external ring 121, and the T-shaped concave groove 128 that matches the T-shaped boss 127 is provided on the contact surface of the base 126 that contacts the external ring 121.

[0057] Furthermore, so as to ensure that both sides of the heating device 106 placed on the base 126 receive uniform force, the T-shaped concave groove 128 is symmetrically arranged with respect to the central axis of the base 126. When a torque appears at one end of the assembled heating device 106 to bend the heating lamp 1062 upward or sink it, the T-shaped concave groove 128 and the corresponding T-shaped boss 127 can resist the above torque, thereby making the base 126 and the heating device 106 it places on more stable.

[0058] Optionally, the length of the T-shaped boss 127 is less than or equal to the length of the T-shaped concave groove 128, and the T-shaped concave groove 128 penetrates the entire lower surface of the base 126. When assembling or disassembling the base 126, the T-shaped boss 127 on the upper surface of the external ring 121 is slid in the T-shaped concave groove 128 that penetrates the lower surface of the base 126, thus realizing the assembly process of sliding from the initial position to the mounting position, or the disassembly process of sliding from the mounting position to the initial position.

[0059] In this embodiment, the T-shaped boss 127 is provided on the upper surface of the outer ring 121. Through the sliding insertion between the T-shaped boss 127 of the outer ring 121 and the T-shaped concave groove 128 of the base 126, the installation and disassembly of the heating device 106 can be realized. To ensure the service life of the members, the wear resistance of the material of the outer ring 121 is greater than that of the material of the inner ring 122. Even if it is slid and inserted many times, it will not cause significant wear or damage to the outer ring 121, which helps to extend the service life of the outer ring 121. As described above, in this embodiment, the material of the outer ring 121 includes stainless steel, and the material of the inner ring 122 includes copper or pure copper. The outer ring 121 made of stainless steel material greatly enhances its wear resistance. By frequently replacing the heating device 106, the guiding and positioning function and reliability of the T-shaped boss 127 will not decrease. While ensuring the thermal conductivity of each member, the wear resistance of the outer ring 121 is also considered.

[0060] It should be understood that in other embodiments, the installation positions of the T-shaped concave groove 128 and the T-shaped boss 127 can be exchanged, but their functions and relative sliding relationships remain unchanged. Exemplarily, the T-shaped boss 127 is provided on the contact surface contacting the outer ring 121 of the base 126, and the T-shaped concave groove 128 matching the T-shaped boss 127 is provided on the contact surface contacting the base 126 of the outer ring 121. Optionally, the T-shaped boss 127 is symmetrically installed with respect to the central axis of the lower surface of the base 126, and the length of the T-shaped boss 127 is less than or equal to the length of the T-shaped concave groove 128. When assembling or separating the base 126, the T-shaped boss 127 of the base 126 is slid into the T-shaped concave groove 128 of the outer ring 121, and further, the installation or disassembly of the heating device 106 is realized.

[0061] Of course, the sliding guide member is not limited to the fitting of the T-shaped boss 127 and the T-shaped concave groove 128, and other sliding guide structures commonly seen in prior arts such as slide rails may be adopted. The number of sliding guide members is not limited to only one, and it may be two. The two sliding guide members are symmetrically installed with respect to the central axis of the base 126. Also, it may be three. One sliding guide member is installed on the central axis, and the other two are provided at equal intervals on both sides thereof. Of course, more quantities and arrangement forms may be installed as required, and the present invention does not limit this.

[0062] In this embodiment, when assembling the heating device 106, first, the heating device 106 is mounted on the base 126 of the outer ring water-cooling plate structure 120. The heating device 106 slides on the outer ring 121 under the guiding action of the sliding guide member together with the base 126. When it slides to the mounting position and reaches, the relative position of the base 126 and the outer ring 121 is fixed by the action of the positioning member, and further, the fixing of the heating device 106 is realized.

[0063] Furthermore, the positioning member includes an elastic structure and a positioning concave groove 129 (shown in FIG. 8b) that matches it. The elastic structure includes an extension portion. When in the mounting position, the extension portion of the elastic structure forms a locking relationship with the positioning concave groove 129. In actual use, when the extension portion of the elastic structure slides into the positioning concave groove 129, the extension portion presses the upper part of the positioning concave groove 129, and the elastic structure undergoes elastic deformation. The elastic structure shrinks inward and is in a state of elastic compression. Due to its elastic force, the extension portion always contacts the upper part of the positioning concave groove 129, and further, the positioning function is realized. The positioning member has a simple structure and is easy to use and operate.

[0064] In this embodiment, the elastic structure is provided on the contact surface that contacts the base 126 of the outer ring 121, and the positioning concave groove 129 that matches the elastic structure is provided on the contact surface of the base 126 that contacts the outer ring 121. Specifically, two positioning concave grooves 129 are correspondingly provided on the lower surface of each base 126. At the position corresponding to the base 126, two elastic structures are provided on the outer ring 121. The two elastic structures are symmetrically installed on both sides of the T-shaped boss 127 on the upper surface of the outer ring 121. Correspondingly, the paired positioning concave grooves 129 are symmetrically installed on both sides of the T-shaped concave groove 128 on the lower surface of the base 126. When the base 126 slides to the mounting position with respect to the outer ring 121 and reaches it, the extension of the elastic structure slides into the positioning concave groove 129 to achieve positioning.

[0065] When assembling the heating difference T106 of this embodiment, first mount the heating device 106 on the base 126. When in the initial position, place the T-shaped boss 127 provided on the upper surface of the outer ring 121 into the T-shaped concave groove 128 of the base 126. At this time, a part of the upper surface of the outer ring 121 and a part of the lower surface of the base 126 are tightly connected. Therefore, the extension of the elastic structure on the upper surface of the outer ring 121 is compressed under the action of the base 126. As the T-shaped boss 127 slides in the T-shaped concave groove 128, when the relative position of the outer ring 121 and the base 126 slides to the mounting position and reaches it, the epitaxial growth of the elastic structure just faces the positioning concave groove 129 on the lower surface of the base 126. At this time, the extension of the elastic structure pops out and extends into the corresponding positioning concave groove 129, whereby the relative position between the base 126 and the outer ring 121 is fixed at the mounting position. When it is necessary to disassemble the heating device 106, first take out the base 126 on which the heating device 106 is placed, and by simply applying an upward force to the base 126, the extension of the elastic structure can be withdrawn from the positioning concave groove 129.

[0066] By adopting the above symmetric elastic structure and the corresponding positioning concave groove 129 as the positioning member between the base 126 on which the heating device 106 is placed and the outer ring 121, not only is there no asymmetric torque during the mounting process, but also the heating lamp 1062 of the heating device 106 attached to the base 126 is not warped upward, maintaining good flatness, which is helpful for the substrate W and the reaction gas in the reaction chamber 100 to receive heat evenly.

[0067] Note that the number of the elastic structure and the positioning concave groove 129 in this embodiment is two. However, if it can be ensured that the elastic structure is symmetric with respect to the T-shaped boss 127 on the upper surface of the outer ring 121, and the positioning concave groove 129 is symmetric with respect to the T-shaped concave groove 128 on the lower surface of the base 126, the same effect can also be achieved by adopting other numbers of the elastic structure and the positioning concave groove 129. That is, the present invention does not limit the number of the positioning members, and it is only necessary to realize that there is no asymmetric torque during the mounting process and the heating device 106 is not warped upward. Preferably, each positioning member is symmetrically installed with respect to the sliding guide member, that is, the positioning member is symmetrically installed with respect to the central axis of the base 126, which is helpful for maintaining the flatness of the heating device 106.

[0068] Of course, in other embodiments, without changing their functions, the positions of the elastic structure and the positioning concave groove 129 can be exchanged, that is, the elastic structure is provided on the contact surface that contacts the outer ring 121 of the base 126, and the positioning concave groove 129 corresponding to the elastic structure is provided on the contact surface that contacts the base 126 of the outer ring 121. The elastic structure is symmetric with respect to the T-shaped boss 127 or the T-shaped concave groove 128 on the lower surface of the base 126, and the positioning concave groove 129 is symmetric with respect to the T-shaped concave groove 128 or the T-shaped boss 127 on the upper surface of the outer ring 121.

[0069] Optionally, the extension of the elastic structure is a ball plunger, and correspondingly, the positioning concave groove 129 is a spherical hole structure (shown in FIG. 8b). Of course, the structure of the extension is not limited to the above description, and it can also be other members that can achieve the same function, and the present invention is not limited thereto.

[0070] Example 3 Based on the characteristics of the structure of the epitaxial growth equipment in Example 2, in this example, changes are made to the outer ring water cooling plate structure, mainly by changing the installation position of the temperature control assembly. In this example, the outer ring water cooling plate structure includes an inner ring, an outer ring, and a temperature control assembly. The difference from Example 2 is that the temperature control assembly in this example is only provided on the outer ring.

[0071] In this example, a temperature control assembly including a cooling passage is only installed on the outer ring. At the same time, the base is detachably connected to the inner ring through a connection assembly.

[0072] Similar to Example 2, in this example, the outer ring water cooling plate structure further includes a pressure assembly, and the pressure assembly is used to apply pressure to the outer ring in the direction of the outer ring reflector device through the inner ring. In this example, the pressure assembly is provided between the inner ring and the outer ring, and the inner ring and the outer ring cooperate with each other to ensure the stability of the outer ring water cooling plate structure.

[0073] Furthermore, the pressure assembly of this example includes at least one protrusion structure provided on the inner circumference of the outer ring and a stepped concave groove provided on the outer circumference of the inner ring and matching the protrusion structure.

[0074] The thermal conductivity of the material of the inner ring is less than that of the material of the outer ring, and / or the wear resistance of the material of the inner ring is greater than that of the material of the outer ring. The material of the inner ring includes stainless steel, and the material of the outer ring includes copper and pure copper. Similar to the foregoing embodiments, in this embodiment, the temperature control assembly is provided only on the outer ring. Since there is a temperature control assembly and the thermal conductivity of the material of the inner ring is less than that of the material of the outer ring, heat is mainly absorbed by the outer ring, and the inner ring absorbs less heat, so the thermal deformation is small. Moreover, since the outer ring and the inner ring are not integrated but joined, a gap is generated between the inner circumference of the outer ring and the outer circumference of the inner ring, and the efficiency of heat transfer from the outer ring to the inner ring decreases. Therefore, the temperature of the inner ring is not high. In addition, since the inner ring uses stainless steel, its linear expansion coefficient is smaller than that of copper, so the inner ring is more stable. Therefore, the base connected to the inner ring is more stable, ensuring the flatness and directional stability of the heating device. Moreover, since the hardness of stainless steel is greater than that of copper, even if the copper outer ring undergoes thermal deformation, the stainless steel inner ring can firmly fix the copper outer ring to the surface of the outer ring reflector device.

[0075] In this embodiment, since the base is provided on the inner ring, the sliding guide member and the positioning member of the connection assembly also act between the inner ring of the base.

[0076] In addition, the structures of other parts and the operating modes of each assembly in this embodiment are all similar to or the same as those in Embodiment 1 or 2, and will not be elaborated here.

[0077] In summary, in the temperature control device and its epitaxial growth equipment according to the present invention, since the outer ring water-cooling plate structure 120 is composed of at least two rings, the width of each ring is reduced compared to the integrated water-cooling plate structure. Because the width is reduced, when warping due to thermal deformation occurs in the water-cooling plate structure, the gap between each ring of the water-cooling plate structure and the reflector device is not large, which helps to ensure the adhesion with the reflector device and improve the efficiency of heat exchange between the temperature control device and the reflector device.

[0078] Furthermore, the inner ring 122 and the outer ring 121 are not integrated, the materials of the two rings are different, and the base 126 is arranged only on one of the wear-resistant materials of the inner ring 122 or the outer ring 121, so the levelness and stability of the heating device 106 in a high-temperature environment are ensured.

[0079] Although the content of the present invention has been described in detail by the above preferred embodiments, it should be recognized that the above description should not be regarded as a limitation to the present invention. Various modifications and alternatives of the present invention will become apparent to those skilled in the art after reading the above content. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A temperature control device used in an epitaxial growth apparatus comprising a heating device, a reflector device, and a temperature control device provided in the reflector device for controlling the temperature of the reflector device, an outer ring, an inner ring provided inside the outer ring, a temperature control assembly provided in the outer ring and / or the inner ring, and including an inlet of a cooling medium, an outlet of the cooling medium, and a cooling passage passing through both, wherein the temperature control device is characterized by comprising the above.

2. The temperature control assembly is installed only in the inner ring, and the temperature control device further includes a pressure assembly for applying pressure to the inner ring in the direction of the reflector device through the outer ring. The temperature control device according to Claim 1 is characterized by this.

3. The temperature control device according to Claim 2 is characterized in that the pressure assembly is provided between the inner ring and the outer ring.

4. The pressure assembly according to Claim 3 includes at least one protrusion structure provided on the outer periphery of the inner ring and a stepped concave groove provided on the inner periphery of the outer ring and matching the protrusion structure. The temperature control device is characterized by this.

5. The thermal conductivity of the material of the outer ring is less than the thermal conductivity of the material of the inner ring, and / or the wear resistance of the material of the outer ring is greater than the wear resistance of the material of the inner ring. The temperature control device according to Claim 4 is characterized by this.

6. The temperature control device according to Claim 5 is characterized in that the material of the outer ring includes stainless steel and the material of the inner ring includes copper.

7. The temperature control assembly is installed only in the outer ring, and the temperature control device further includes a pressure assembly for applying pressure to the outer ring in the direction of the reflector device through the inner ring. The temperature control device according to Claim 1 is characterized by this.

8. The temperature control device according to Claim 7 is characterized in that the pressure assembly is provided between the inner ring and the outer ring.

9. The pressure assembly according to Claim 8 includes at least one protrusion structure provided on the inner periphery of the outer ring and a stepped concave groove provided on the outer periphery of the inner ring and matching the protrusion structure. The temperature control device is characterized by this.

10. The thermal conductivity of the material of the inner ring is less than the thermal conductivity of the material of the outer ring, And / or, the wear resistance of the material of the inner ring is greater than the wear resistance of the material of the outer ring, the temperature control device according to claim 9, characterized in that.

11. The material of the inner ring includes stainless steel, and the material of the outer ring includes copper, the temperature control device according to claim 10, characterized in that.

12. The contour of the at least one protrusion structure is one or more of a continuous waveform, a continuous polyline, and a continuous zigzag, the temperature control device according to claim 4 or 9, characterized in that.

13. The temperature control device further includes a base for detachably mounting a heating device, which is detachably connected to the outer ring or the inner ring via a connection assembly, the temperature control device according to claim 2 or 7, characterized in that.

14. The connection assembly includes a sliding guide member and a positioning member disposed between the base and the outer ring or the inner ring for guiding the base to slide in a sliding direction with respect to the outer ring or the inner ring, and the positioning member is used to fix the base to the mounting position with respect to the outer ring or the inner ring when the base slides to and reaches the mounting position, the temperature control device according to claim 13, characterized in that.

15. The sliding guide member includes a T-shaped boss and a corresponding T-shaped concave groove, and the T-shaped concave groove is used to guide the T-shaped boss to slide inside it. The T-shaped boss is provided on a contact surface that contacts the outer ring or the inner ring of the base, and the T-shaped concave groove is provided on a contact surface that contacts the base of the outer ring or the inner ring, or the T-shaped concave groove is provided on a contact surface that contacts the outer ring or the inner ring of the base, and the T-shaped boss is provided on a contact surface that contacts the base of the outer ring or the inner ring, the temperature control device according to claim 14, characterized in that.

16. The positioning member includes an elastic structure and a corresponding positioning concave groove, the elastic structure includes an extension portion, and when in the mounting position, the extension portion of the elastic structure forms a locking relationship with the positioning concave groove. The elastic structure is provided on a contact surface that contacts an outer ring or an inner ring of the base, and the positioning concave groove is provided on a contact surface that contacts the base of the outer ring or the inner ring, or the elastic structure is provided on a contact surface that contacts the base of the outer ring or the inner ring, and the positioning concave groove is provided on a contact surface that contacts the outer ring or the inner ring of the base. The temperature control device according to claim 14, characterized in that.

17. The temperature control device according to claim 16, characterized in that an extension of the elastic structure is a ball plunger.

18. The number of the positioning members is at least two, and the positioning members are symmetrically installed with respect to the sliding guide member. The temperature control device according to claim 14, characterized in that the sliding guide member extends radially along an outer ring or an inner ring.

19. The temperature control device is further includes a fastening member provided on an outer ring and / or an inner ring for fixing the outer ring and the inner ring to the reflector device. The temperature control device according to claim 1, characterized in that.

20. A reaction chamber for performing an epitaxial growth process, including a tray for placing a substrate therein, A heating device provided above and / or below the reaction chamber for providing heat radiation in the epitaxial growth process, and a reflector device for reflecting the heat radiation generated by the heating device to the reaction chamber. An epitaxial growth apparatus comprising the temperature control device according to claim 1 for controlling the temperature of the reflector device.

Images