Semiconductor Device and Electronic Device

Abstract

To provide a semiconductor device which is attachable / detachable to / from a printed wiring board.SOLUTION: A semiconductor device 2 includes a substrate 21, a semiconductor chip, a sealing resin 22, and a terminal. The substrate spreads across a first surface. The semiconductor chip is provided above a substrate in a first direction. The sealing resin covers the semiconductor chip. The terminal is provided below the substrate in the first direction. The sealing resin includes a first part 22A and a second part 22B. The height in the first direction of the second part is higher than the height in the first direction of the first part. The end in the second direction along the first surface of the second part is a part of the end in a second direction of the resin.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] Embodiments relate to semiconductor devices and electronic devices.

Background Art

[0002] Semiconductor devices incorporating semiconductor chips are known. The semiconductor chip includes, for example, a chip on which a circuit of a NAND memory capable of storing data non-volatilely is formed. The semiconductor device is mounted on a printed circuit board via solder, a socket, or the like. The printed wiring board on which the semiconductor device is mounted is provided in an information processing apparatus as an electronic device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Provided are a semiconductor device and an electronic device that can be easily attached to and detached from a printed circuit board.

Means for Solving the Problems

[0005] In the embodiments The electronic device includes a semiconductor device, a printed wiring board, mounting components, and fixing components. The semiconductor device includes a substrate extending along a first surface, a semiconductor chip provided above the substrate in a first direction of the substrate, a resin covering the semiconductor chip, and terminals provided below the substrate in the first direction. The resin includes a first portion occupying a lower portion of the resin and a second portion occupying an upper portion of the resin and having a surface common with a part of the upper surface of the first portion. The resin is further divided into a third portion having the second portion and a fourth portion not having the second portion. A first height from the upper surface of the substrate in the first direction to the upper surface of the third portion is higher than a second height from the upper surface of the substrate in the first direction to the upper surface of the fourth portion. An end portion in a second direction along the first surface of the fourth portion is a part of an end portion of the resin in the second direction. The printed wiring board has a second terminal and a first hole electrically connected to the terminals. The mounting components have a fifth portion arranged above the fourth portion, a sixth portion having a second hole, and a seventh portion connecting the fifth portion and the sixth portion. The fixing components have a portion extending across the first hole and the second hole.

Brief Description of the Drawings

[0006]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

[0007] Embodiments will be described below with reference to the drawings. Each embodiment illustrates an apparatus and a method for embodying the technical idea of the invention. The drawings are schematic or conceptual, and the dimensions, ratios, etc. of each drawing are not necessarily the same as those in reality. The description of one embodiment applies to the description of another embodiment as well, unless explicitly or implicitly excluded. The technical idea of the present invention is not specified by the shape, structure, arrangement, etc. of the components.

[0008] In the following description, components having substantially the same functions and configurations are denoted by the same reference numerals. The numbers after the characters constituting the reference numerals are referred to by the reference numerals including the same characters, and are used to distinguish elements having similar configurations from each other. When there is no need to distinguish elements denoted by reference numerals including the same characters from each other, these elements are referred to by reference numerals including only the characters.

[0009] [1] First Embodiment [1-1] Configuration (Structure) Hereinafter, an example of the configuration of the semiconductor device according to the first embodiment will be described.

[0010] In the figures referred to hereinafter, the X direction and the Y direction are directions along the surface of the substrate 11 (see, for example, FIG. 1) included in the semiconductor device 1 to be described later. The Z direction corresponds to the vertical direction with respect to the surface of the substrate 11 (see, for example, FIG. 1) to be described later. Also, in the figures referred to hereinafter, the plus direction of the vertical axis may be referred to as the upper side and the minus direction may be referred to as the lower side. Similarly, the plus direction of the horizontal axis may be referred to as the right side and the minus direction may be referred to as the left side.

[0011] For example, in the XY plan view seen from the +Z direction, the upper side indicates the +Y direction and the lower side indicates the -Y direction. In the XY plan view seen from the +Z direction, the right side indicates the +X direction and the left side indicates the -X direction. For example, in the XZ plan view seen from the -Y direction, the upper side indicates the +Z direction and the lower side indicates the -Z direction. In the XZ plan view seen from the -Y direction, the right side indicates the +X direction and the left side indicates the -X direction.

[0012] In some figures, hatching is appropriately added to make the figures easier to view. The hatching added to the figures is not necessarily related to the material or characteristics of the components to which the hatching is added. In the cross-sectional view, components such as the insulator layer, wiring, and contact are appropriately omitted to make the figures easier to view.

[0013] [1-1-1] Configuration of Semiconductor Device 1 FIG. 1 shows a configuration example of the semiconductor device 1 according to the first embodiment. The upper figure in FIG. 1 is a plan view (XY plane) seen from the +Z direction of the semiconductor device 1, and the lower figure in FIG. 1 is a side view (XZ plane) seen from the -Y direction of the semiconductor device 1. The semiconductor device 1 is, for example, a package device that encapsulates a semiconductor chip.

[0014] As shown in FIG. 1, the semiconductor device 1 includes, for example, a plurality of terminals 10, a plurality of solder balls 9, a substrate 11, and a sealing resin 12. The substrate 11 is formed, for example, in a plate shape extending along the XY plane. The substrate 11 includes an insulator such as ceramic. The substrate 11 includes the terminals 10 at the lower part (the part on the -Z direction side).

[0015] The solder balls 9 are provided on the lower surface of the substrate 11 (the surface extending in the XY plane on the -Z direction side). The solder balls are formed, for example, in a spherical shape or a hemispherical shape. The solder balls 9 are arranged in a grid pattern in the XY plane below the substrate 11. The number of the solder balls 9 can be arbitrarily set. The solder balls 9 include a conductor, for example, solder. The solder balls 9 are connected to the terminals 10. The solder balls 9 have a structure such as BGA (Ball Grid Array) or LGA (Land Grid Array). BGA and LGA are one of the terminal layout methods and are used, for example, when there are many input / output pins and / or when suppressing the area seen from the Z direction of the semiconductor device 1. The solder balls 9 are used as external terminals of the semiconductor device 1. The solder balls 9 are connected to the wiring pattern of a printed wiring board 15 (see FIG. 2, for example) described later.

[0016] The sealing resin 12 is located above the substrate 11 (+Z direction). The sealing resin 12 has a rectangular shape in the XY plane. The sealing resin 12 has an end portion that coincides with the end portion of the substrate 11 in the XY plane.

[0017] The sealing resin 12 has, for example, a cross-shaped groove 5 extending along the XY plane. Hereinafter, the groove 5 will be specifically described. The sealing resin 12 has a difference in height in the Z direction depending on the location. Specifically, it is as follows. The sealing resin 12 includes a first portion 12A and a second portion 12B. The first portion 12A occupies the lower part (-Z side) of the sealing resin 12 and has a rectangular parallelepiped shape. The second portion 12B occupies the upper part (+Z side) of the sealing resin 12 and has a surface common with the upper surface of the first portion 12A (the XY plane viewed from the +Z direction). The first portion 12A and the second portion 12B are provided continuously in the Z direction and are integrally formed.

[0018] The second part 12B includes four sub-parts 12BS (12BSa, 12BSb, 12BSc, and 12BSd). The sub-part 12BSa is provided in the upper left part of the paper surface along the XY plane within the second part 12B. In other words, the sub-part 12BSa is located on the -X direction side and the +Y direction side among the four sub-parts 12BS. Similarly, the sub-parts 12BSb, 12BSc, and 12BSd are provided in the upper right, lower left, and lower right parts of the paper surface along the XY plane within the second part 12B, respectively. In other words, the sub-part 12BSb is located on the +X direction side and the +Y direction side among the four sub-parts 12BS, the sub-part 12BSc is located on the -X direction side and the -Y direction side among the four sub-parts 12BS, and the sub-part 12BSd is located on the +X direction side and the -Y direction side among the four sub-parts 12BS. The four sub-parts 12BS are spaced apart from each other. Each sub-part 12BS has, for example, a rectangular parallelepiped shape. Due to such a shape and arrangement of each sub-part 12BS, a groove 5 is formed between each sub-part 12BS. That is, each sub-part 12BS is arranged to be separated by the groove 5. The bottom surface of the groove 5 corresponds to a part of the upper surface of the first part 12A. By having such a shape, the encapsulation resin 12 has a difference in height in the Z direction depending on the location. That is, the encapsulation resin 12 has a lower height in the Z direction in the region between the sub-parts 12BSa, 12BSb, 12BSc, and 12BSd (that is, the groove 5) compared to the sub-parts 12BSa, 12BSb, 12BSc, and 12BSd. The groove 5 is the space generated in the region between the sub-parts 12BSa, 12BSb, 12BSc, and 12BSd. Therefore, in the present embodiment, the groove 5 is the space generated by the height difference of the encapsulation resin 12 in the Z direction.

[0019] The encapsulating resin 12 can also be understood as follows. The encapsulating resin 12 can be divided into a portion having the second portion 12B and a portion not having the second portion 12B. The portion not having the second portion 12B is the portion below the groove 5 within the first portion 12A, and the portion having the second portion 12B is all of the encapsulating resin 12 other than the portion below the groove 5 described above. The height of the portion having the second portion 12B in the Z direction is higher than the height of the portion not having the second portion 12B.

[0020] The groove 5 can be formed, for example, by cutting the portion where the groove 5 is to be formed in the rectangular encapsulating resin before processing with a grinder or the like. Further, the groove 5 may be formed, for example, by forming unevenness corresponding to the groove 5 in a mold or the like into which liquid resin is poured to form the encapsulating resin 12.

[0021] Details of the depth and shape of the groove 5 will be described later. Here, the depth of the groove 5 corresponds to the height of the sub-portion 12BS in the Z direction.

[0022] [1-1-2] Configuration of the electronic device 100 Next, an example of the configuration in a state where the semiconductor device 1 is attached to the printed wiring board 15 will be described with reference to FIG. 2.

[0023] FIG. 2 shows a configuration example of the electronic device 100 according to the first embodiment. The upper diagram in FIG. 2 is a plan view of the electronic device 100 and shows a view seen from the same direction as the upper diagram in FIG. 1. The lower diagram in FIG. 2 is a side view of the electronic device 100 and shows a view seen from the same direction as the lower diagram in FIG. 1.

[0024] As shown in FIG. 2, the electronic device 100 includes, for example, the semiconductor device 1, the mounting component 13, the screw 14, and the printed wiring board 15 shown in FIG. 1. The screw 14 is an example of a fixing component.

[0025] The printed wiring board 15 is located below (-Z direction) the semiconductor device 1. When attaching the semiconductor device 1 to the printed wiring board 15, the printed wiring board 15 and the solder balls 9 are electrically connected by the solder balls 9 coming into contact with the wiring patterns provided on the printed wiring board 15. The wiring patterns of the semiconductor device 1 and the printed wiring board 15 may be directly connected via the solder balls 9, or may be connected via other electrodes such as a sheet-type socket, for example. The printed wiring board 15 has holes into which the screws 14 are inserted.

[0026] The mounting component 13 has a cross-shaped portion extending along the XY plane, a portion extending in the Z direction, and a portion in contact with the printed wiring board 15. The cross-shaped portion extending along the XY plane, the portion extending in the Z direction, and the portion in contact with the printed wiring board 15 may hereinafter be referred to as an upper portion 13A, a side portion 13B, and a contact portion 13C, respectively. The upper portion 13A, the side portion 13B, and the contact portion 13C are continuously formed integrally. A part of the upper portion 13A and a part of the side portion 13B are connected at a right angle within a range allowing for manufacturing errors. Another part of the side portion 13B and a part of the contact portion 13C are connected at a right angle within a range allowing for manufacturing errors.

[0027] The upper portion 13A is cross-shaped and extends along the XY plane. The upper portion 13A is, for example, a cross shape similar to but slightly smaller than the groove 5. The upper portion 13A has a shape that can be fitted into the groove 5. By fitting the upper portion 13A into the groove 5, the mounting component 13 can suppress displacement of the semiconductor device 1 in the XY direction. Also, by fitting the upper portion 13A into the groove 5, the electronic device 100 according to the first embodiment can suppress the height in the Z direction.

[0028] The size of the upper part 13A in the XY direction only needs to be such that it can fit into the groove 5. In order to suppress the displacement of the semiconductor device 1 in the XY direction, it is desirable that the size of the upper part 13A in the XY direction be close to the size of the groove 5 in the XY direction. More specifically, that the size of the upper part 13A in the XY direction is close to the size of the groove 5 in the XY direction means that the widths of the respective parts constituting the cross of the upper part 13A in the X direction and the Y direction are respectively close to the widths of the respective parts constituting the cross of the groove 5 in the X direction and the Y direction, and / or that the lengths of the upper part 13A in the X direction and the Y direction are respectively close to the lengths of the groove 5 in the X direction and the Y direction.

[0029] The height (or thickness) of the upper part 13A in the Z direction may exceed the depth of the groove 5 as long as it can suppress the displacement of the semiconductor device 1 in the XY direction. However, in order to suppress the height of the electronic device 100 in the Z direction, it is desirable that the height of the upper part 13A in the Z direction is within the depth of the groove 5. Also, regarding the depth of the groove 5, it only needs to be such that the upper part 13A can be stably fitted into the groove 5.

[0030] The side part 13B extends in the Z direction. With the upper part 13A fitted into the groove 5, the side part 13B extends in the Z direction between the ends of the cross of the upper part 13A and the printed wiring board 15. In other words, with the upper part 13A fitted into the groove 5, the side part 13B extends in the Z direction along the side surface of the semiconductor device 1. The length of the side part 13B in the Z direction only needs to be such that it can suppress the displacement of the semiconductor device 1 in the Z direction when the semiconductor device 1 is attached to the printed wiring board 15.

[0031] The contact part 13C has a shape that spreads along the XY plane. The contact part 13C has a hole through which the screw 14 passes. In the state where the semiconductor device 1 is attached to the printed wiring board 15, the contact part 13C contacts the printed wiring board 15.

[0032] Thus, the mounting component 13 mainly suppresses the displacement of the semiconductor device 1 in the XY direction by the upper portion 13A, mainly suppresses the displacement of the semiconductor device 1 in the Z direction by the side portion 13B, and fixes the semiconductor device 1 to the printed wiring board 15 together with the screw 14 via the contact portion 13C. That is, the mounting component 13 has a function of pressing the semiconductor device 1 against the printed wiring board 15.

[0033] The screw 14 has a function of fixing the mounting component 13 to the printed wiring board 15. The screw 14 passes through the hole provided in the contact portion 13C and is inserted into the hole provided in the printed wiring board 15. For example, when the screw 14 is a male screw, a groove corresponding to the thread provided on the screw 14 may be formed inside the hole of the printed wiring board 15 into which the screw 14 is inserted. By inserting and screwing the screw 14 into the hole provided in the printed wiring board 15, the mounting component 13 sandwiched between the screw 14 and the printed wiring board 15 is fixed. By fixing the mounting component 13, the semiconductor device 1 is fixed to the printed wiring board 15. That is, the screw 14 fixes the mounting component 13 and the semiconductor device 1 to the printed wiring board 15. In the example of FIG. 2, an example in which there are four screws 14 is shown, but the number of screws 14 can be arbitrarily set as long as the mounting component 13 can be fixed to the printed wiring board 15. For example, the electronic device 100 may fix one contact portion 13C with two or more screws.

[0034] The fixing mentioned here is the fixing achieved by tightening the screw 14. Therefore, when it is desired to remove the semiconductor device 1 from the printed wiring board 15, it can be easily removed by loosening the screw 14.

[0035] As described above, the solder ball 9 of the semiconductor device 1 is connected to, for example, the printed wiring board 15 of the electronic device 100. The solder ball 9 and the printed wiring board 15 can be removed without being fixed, for example, by soldering. That is, the semiconductor device 1 according to the first embodiment is designed to be portable with respect to the printed wiring board 15 and the like of the electronic device 100.

[0036] From the above, the electronic device 100 according to the first embodiment includes that the encapsulation resin 12 of the semiconductor device 1 has the groove 5, has the mounting component 13 shaped to be fitted into the groove 5, and the removal of the mounting component 13 can be easily performed by a screw 14 or the like.

[0037] In the electronic device 100 according to the first embodiment, the shapes of the groove 5 of the semiconductor device 1 and the mounting component 13 may have a structure in which the upper portion 13A is fitted into the groove 5 and the semiconductor device 1 can be fixed to the printed wiring board 15 by the mounting component 13.

[0038] That is, the cross shapes of the groove 5 and the upper portion 13A may be such that, for example, the two lines forming the cross are bent, in a crank shape, or curved. Also, each part of the cross of the groove 5 and the upper portion 13A does not have to be connected at a right angle. Also, the cross shape of the groove 5 and the upper portion 13A may be biased in either the +X direction or the -X direction, or may be biased in either the +Y direction or the -Y direction.

[0039] Also, the groove 5 and the upper portion 13A may not be in a cross shape, but may be, for example, in a linear shape or a square shape. Even in this case, by fitting the upper portion 13A into the groove 5, the displacement of the semiconductor device 1 in the XY direction can be suppressed. The structure in which the upper portion 13A is fitted into the groove 5 and the semiconductor device 1 can be fixed to the printed wiring board 15 by the mounting component 13 includes a structure in which at least one of the ends of the groove 5 in the XY plane includes the end of the encapsulation resin 12 in the XY plane. Such a structure will be described in other embodiments described later.

[0040] Similarly, if the upper part 13A is fitted into the groove 5 and the semiconductor device 1 can be fixed to the printed wiring board 15 by the mounting component 13, the shape of the semiconductor device 1 in the XY plane viewed from the +Z direction does not have to be rectangular. The shape of the semiconductor device 1 in the XY plane viewed from the +Z direction may be, for example, a shape in which one of the corners of a rectangle is chamfered.

[0041] [1-1-3] Cross-sectional structure of the electronic device 100 FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2 and shows an example of the cross-sectional structure of the electronic device 100 according to the first embodiment. As shown in FIG. 3, the semiconductor device 1 included in the electronic device 100 further includes, for example, a plurality of NAND chips 17 (17a to 17d), a controller chip 16, and wires 18a and 18b in addition to the structure described with reference to FIGS. 1 and 2. The substrate 11 includes an insulator portion 11a and a conductor portion 11b. The semiconductor device 1 is, for example, a memory system such as a solid state drive (SSD) or a universal flash storage (UFS) device. Hereinafter, the cross-sectional structure of the electronic device 100 will be described.

[0042] The NAND chips 17a to 17d, the controller chip 16, and the wires 18a and 18b are provided above the substrate 11 (in the +Z direction). The NAND chips 17a to 17d, the controller chip 16, and the wires 18a and 18b are covered with a sealing resin 12. In other words, the NAND chips 17a to 17d, the controller chip 16, and the wires 18a and 18b are located between the substrate 11 and a part of the sealing resin 12.

[0043] The NAND chips 17a to 17d are semiconductor chips formed using a semiconductor material, for example, for a circuit of a NAND type flash memory. The NAND type flash memory is a storage device that can store data non-volatilely. The NAND chips 17a to 17d are each formed, for example, in a plate shape extending along the XY plane. For example, the NAND chip 17a is stacked above the substrate 11, the NAND chip 17b is stacked above the NAND chip 17a, the NAND chip 17c is stacked above the NAND chip 17b, and the NAND chip 17d is stacked above the NAND chip 17c. Between each of the NAND chips 17, they are insulated, for example, via an insulator layer.

[0044] For example, the NAND chip 17b is not completely overlapped above the NAND chip 17a, but is provided in a stepped manner with a slight shift on the XY plane. Similarly, the NAND chip 17c is not completely overlapped with the NAND chip 17b, but is provided in a stepped manner with a slight shift on the XY plane. Similarly, the NAND chip 17d is not completely overlapped with the NAND chip 17c, but is provided in a stepped manner with a slight shift on the XY plane. By providing each of the NAND chips 17a to 17d in a stepped manner, the wire 18a can be connected. That is, the shifting width (quantity or size) may be any width (quantity or size) that can connect the NAND chip 17 and the wire 18a.

[0045] In the example of FIG. 3, the NAND chips 17a to 17d are shown, but the number of the NAND chips 17 can be arbitrarily set.

[0046] The controller chip 16 is a semiconductor chip formed using a semiconductor material, for example, for a circuit of a memory controller. The memory controller is a control device that controls the NAND type flash memory formed in the NAND chip 17.

[0047] Wire 18a electrically connects each of the NAND chips 17a to 17d and the controller chip 16. Specifically, the NAND chips 17a to 17d are provided with pads connected to the NAND type flash memory, and the controller chip 16 is provided with pads connected to the memory controller. Then, wire 18a electrically connects the pads provided on the NAND chips 17a to 17d and a part of the pads provided on the controller chip 16. In this way, each NAND type flash memory provided in the NAND chips 17a to 17d and the memory controller provided in the controller chip 16 transmit and receive various signals via wire 18a.

[0048] Wire 18b electrically connects the controller chip 16 and the conductor portion 11b of the substrate 11. Specifically, wire 18b electrically connects the other part of the pads provided on the controller chip 16 and the conductor portion 11b of the substrate 11. Although details will be described later, the controller chip 16 transmits and receives signals to and from the printed wiring board 15 via wire 18b, the conductor portion 11b of the substrate 11, the terminal 10, and the solder ball 9. The connection method such as wires 18a and 18b is called, for example, wire bonding. Wires 18a and 18b are also called bonding wires. Wires 18a and 18b contain, for example, gold.

[0049] The conductor portion 11b of the substrate 11 is, for example, wiring formed in the substrate 11. Such wiring is also called a through-silicon via (TSV). The conductor portion 11b of the substrate 11 is electrically connected to the terminal 10 and the solder ball 9.

[0050] The solder ball 9 supplies the power supply voltage from the outside of the semiconductor device 1 to the semiconductor device 1 via, for example, the printed wiring board 15. For example, the solder ball 9 is used to supply the power supply voltage to the NAND chips 17a to 17d and the controller chip 16. The solder ball 9 is also used, for example, for transmitting and receiving signals between the external device of the semiconductor device 1 and the controller chip 16 via the printed wiring board 15.

[0051] [1-1-4] Structure of Information Processing Apparatus 600 FIG. 4 is a block diagram showing an example of the configuration of an information processing apparatus 600 including a semiconductor device 1 according to the first embodiment. The information processing apparatus 600 includes a ROM (Read Only Memory) 400, a RAM (Random Access Memory) 500, and a printed wiring board 15 described with reference to FIGS. 2 and 3. The information processing apparatus 600 is, for example, a notebook PC, a smartphone, a tablet terminal, an in-vehicle device, or the like. A CPU (Central Processing Unit), a ROM 400, a RAM 500, and an electronic device 100 (an SSD in one example) are mounted on the printed wiring board 15. The ROM 400 and the RAM 500 may be connected via connectors or sockets provided on the printed wiring board 15.

[0052] The ROM 400 stores, for example, a program executed by the CPU 200 in a non-volatile manner. This program is loaded from the ROM 400 to the RAM 500 when the electronic device 100 operates. The RAM 500 stores the program loaded from the ROM 400. The CPU 200 executes the program loaded into the RAM 500. The CPU 200 uses the RAM 500 as a work memory. The CPU 200 is also connected to the electronic device 100. The CPU 200 requests the electronic device 100 to write data, read data, and the like. The electronic device 100 includes the semiconductor device 1 according to the first embodiment.

[0053] [1-2] Advantages (Effects) of the First Embodiment According to the semiconductor device 1 and the electronic device 100 including the semiconductor device 1 according to the first embodiment described above, the semiconductor device 1 can be fixed to the printed wiring board 15 by the mounting component 13. Thereby, the semiconductor device 1 can be easily replaced. Further, according to the semiconductor device 1 according to the first embodiment and the electronic device 100 including the semiconductor device 1, even when the mounting component 13 is attached to the semiconductor device 1, the height of the semiconductor device 1 can be maintained in the Z direction, or the change in the height of the electronic device 100 can be minimized. Hereinafter, the detailed effects of the electronic device 100 according to the first embodiment will be described.

[0054] There is a desire to facilitate the attachment and detachment of an SSD mounted on a printed wiring board included in an information processing apparatus (or an electronic device). For example, in a notebook PC, the storage capacity of the SSD varies depending on the product. Such SSDs with different storage capacities may be encapsulated in packages of the same standard or shape. If it becomes possible to easily replace the SSD while keeping the package standard and shape the same, it becomes possible to easily produce products with different SSD storage capacities. That is, it becomes possible to easily create different product variations.

[0055] However, BGAs and LGAs used in semiconductor devices constituting SSDs are assumed to be connected to a printed wiring board by melting solder. When connecting the printed wiring board and the connection terminals of the semiconductor device (solder balls 9 in the case of the semiconductor device 1 according to the first embodiment) by melting the solder, the SSD cannot be easily removed.

[0056] On the other hand, a comparative example can be considered in which the printed wiring board and the connection terminals of the semiconductor device are not connected by melting solder, and a mounting component is placed over the semiconductor device and designed to be attached to the printed wiring board.

[0057] However, in this comparative example, since the structure is such that the mounting component is placed on top of a semiconductor device with a flat surface, the overall height increases by the thickness of the mounting component. When the height of the electronic device increases, the electronic device will consume a large amount of space within the information processing device, and thus it may not be usable, for example, in a thin notebook PC or the like.

[0058] In contrast, the electronic device 100 according to the first embodiment has a structure that enables easy removal of the semiconductor device 1 without changing the overall height of the electronic device 100 or while minimizing the change in the height of the electronic device 100.

[0059] Specifically, the semiconductor device 1 according to the first embodiment has a groove 5 in a part of the upper surface of the encapsulating resin 12 of the semiconductor device 1. By fitting the mounting component 13 into the groove 5, the height of the electronic device 100 in the Z direction can be suppressed.

[0060] That is, when the height of the upper portion 13A of the mounting component 13 in the Z direction is within the depth of the groove 5, the electronic device 100 according to the first embodiment can fix the semiconductor device 1 to the printed wiring board by the mounting component 13 without changing the height of the electronic device 100. Even when the height of the upper portion 13A of the mounting component 13 in the Z direction exceeds the depth of the groove 5, the electronic device 100 according to the first embodiment can fix the semiconductor device 1 to the printed wiring board by the mounting component 13 while minimizing the change in the height of the electronic device 100 compared to the comparative example.

[0061] Also, according to the electronic device 100 according to the first embodiment, heat dissipation is easier compared to the comparative example. In the comparative example, since the structure is such that the entire upper surface of the semiconductor device is covered by the mounting component, heat dissipation on the surface of the semiconductor device is hindered, and it may be difficult to release the heat generated by the semiconductor device. On the other hand, in the electronic device 100 according to the first embodiment, the mounting component 13 covers only the portion of the groove 5 on the upper surface of the semiconductor device 1. Therefore, the electronic device 100 according to the first embodiment can release heat from the portion not covered by the mounting component 13. Furthermore, by making the material of the mounting component 13 a material that is easy to dissipate heat, it can be expected that heat will also be easily dissipated from the portion of the mounting component.

[0062] Also, according to the electronic device 100 according to the first embodiment, it is possible to make it difficult to misalign the direction in which the semiconductor device 1 is fixed to the printed wiring board 15. Specifically, by providing the groove 5 asymmetrically, for example, on the upper surface of the sealing resin 12, it is possible to prevent the semiconductor device 1 from being misaligned and attached when fixing the semiconductor device 1 to the printed wiring board 15. For example, instead of providing the intersection of the cross of the groove 5 at the center of the sealing resin 12, it may be shifted in the X direction and / or the Y direction. For example, the shape of the groove 5 may be formed in an asymmetric shape instead of a line-symmetric shape such as a cross.

[0063] [2] Second Embodiment [2-1] Configuration (Structure) Hereinafter, an example of the configuration of the semiconductor device 2 and the electronic device 102 according to the second embodiment will be described. The semiconductor device 2 and the electronic device 102 are different from the first embodiment in terms of the shape of the mounting component and the groove, and the number of screws. Regarding other structures and functions, the second embodiment is substantially the same as the first embodiment. Hereinafter, the semiconductor device 2 and the electronic device 102 according to the second embodiment will be mainly described with respect to the differences from the first embodiment.

[0064] [2-1-1] Configuration of Semiconductor Device 2 FIG. 5 shows a configuration example of the semiconductor device 2 according to the second embodiment. The upper diagram in FIG. 5 is a plan view (XY plane) viewed from the +Z direction of the semiconductor device 2, and shows a view seen from the same direction as the upper diagram in FIG. 1. The lower diagram in FIG. 5 is a side view (XZ plane) viewed from the -Y direction of the semiconductor device 2, and shows a view seen from the same direction as the lower diagram in FIG. 1.

[0065] As shown in FIG. 5, the semiconductor device 2 includes, for example, a plurality of terminals 20, a plurality of solder balls 19, a substrate 21, and a sealing resin 22. Since the substrate 21, the solder balls 19, and the terminals 20 have the same configurations and functions as the substrate 11, the solder balls 9, and the terminals 10 according to the first embodiment, respectively, detailed descriptions thereof are omitted.

[0066] The sealing resin 22 is located above the substrate 21 (+Z direction). The sealing resin 22 has a rectangular shape in the XY plane. The sealing resin 22 has an end that coincides with the end of the substrate 21 in the XY plane. The sealing resin 22 has a groove 6 having a shape that surrounds the end of the sealing resin 22 in the XY plane. In other words, the groove 6 has a shape that reduces a part of the area of the sealing resin 22 by bringing both ends of the sealing resin 22 in the X direction closer to the center and both ends of the sealing resin 22 in the Y direction closer to the center in the XY plane.

[0067] The following specifically describes the groove 6. The encapsulation resin 22 has a difference in height in the Z direction depending on the location. Specifically, it is as follows. The encapsulation resin 22 includes a first portion 22A and a second portion 22B. The first portion 22A occupies the lower (-Z side) portion of the encapsulation resin 22 and has a rectangular parallelepiped shape. The second portion 22B occupies the upper (+Z side) portion of the encapsulation resin 22 and has a rectangular parallelepiped shape. The first portion 22A and the second portion 22B are provided continuously in the Z direction and are integrally formed. The second portion 22B is not located in a part of the upper surface (+Z direction view of the XY plane) of the first portion 22A. In the region where the second portion 22B is not located, the upper surface (+Z direction view of the XY plane) of the first portion 22A is exposed. That is, the groove 6 is formed in the region where the upper surface of the first portion 22A is exposed and the second portion 22B is not located. By having such a shape, the encapsulation resin 22 has a difference in height in the Z direction depending on the location. That is, the encapsulation resin 22 has a lower height in the Z direction in the exposed region of the upper surface of the first portion 22A compared to other regions. The groove 6 is a space generated by the difference in height in the Z direction between the exposed portion of the upper surface of the first portion 22A and the upper surface of the second portion 22B.

[0068] In other words, the encapsulation resin 22 has a structure in which a second portion 22B having a rectangular parallelepiped shape with a smaller area than the first portion 22A in the XY plane is provided on the first portion 22A having a rectangular parallelepiped shape. The second portion 22B is arranged so as not to protrude from the first portion 22A in the XY plane. For example, in the XY plane, the second portion 22B may have a similar shape to the first portion 22A. For example, the center of the second portion 22B in the XY plane coincides with the center of the first portion 22A in the XY plane. The space generated by the second portion 22B being smaller than the first portion 22A is the groove 6. The groove 6, that is, the region where the upper surface of the first portion 22A is exposed, extends along the edge of the second portion 22B with a certain width in the XY plane.

[0069] The groove 6 may be formed in the same manner as the groove 5 according to the first embodiment. Details of the depth and shape of the groove 6 will be described later. Here, the depth of the groove 6 corresponds to the height of the second portion 22B in the Z direction.

[0070] [2-1-2] Configuration of the electronic device 102 An example of the configuration in a state where the semiconductor device 2 is attached to the printed wiring board 25 will be described with reference to FIG. 6.

[0071] FIG. 6 shows a configuration example of the electronic device 102 according to the second embodiment. The upper diagram in FIG. 6 is a plan view of the electronic device 102 and shows a view seen from the same direction as the upper diagram in FIG. 5. The lower diagram in FIG. 6 is a side view of the electronic device 102 and shows a view seen from the same direction as the lower diagram in FIG. 5.

[0072] As shown in FIG. 6, the electronic device 102 includes, for example, the semiconductor device 2, the mounting component 23, the screw 24, and the printed wiring board 25 shown in FIG. 5. Since the printed wiring board 25 and the screw 24 have the same configuration and function as the printed wiring board 15 and the screw 14 according to the first embodiment, detailed descriptions thereof are omitted.

[0073] The mounting component 23 has a portion that covers the exposed portion on the upper surface of the first portion 22A of the sealing resin 22, that is, the bottom surface of the groove 6, a portion that extends in the Z direction, and a portion that contacts the printed wiring board 25. The portion that covers the bottom surface of the groove 6, the portion that extends in the Z direction, and the portion that contacts the printed wiring board 25 may be hereinafter referred to as the upper portion 23A, the side portion 23B, and the contact portion 23C, respectively. The upper portion 23A, the side portion 23B, and the contact portion 23C are continuously formed integrally. A part of the upper portion 23A and a part of the side portion 23B are connected at a right angle within a range that allows manufacturing errors. Another part of the side portion 23B and a part of the contact portion 23C are connected at a right angle within a range that allows manufacturing errors.

[0074] The upper part 23A has a shape that surrounds the end portion of the encapsulating resin 22 in the XY plane. The upper part 23A has, for example, the same shape as the groove 6. The upper part 23A has a shape that can be fitted into the groove 6. When the upper part 23A is fitted into the groove 6, the upper part 23A can press against the bottom surface of the groove 6. In other words, the upper part 23A can be positioned so as to be fitted into the groove 6. By the upper part 23A pressing against the bottom surface of the groove 6, the mounting component 23 can suppress displacement of the semiconductor device 2 in the XY direction. Also, by the upper part 23A being positioned within the groove 6, the electronic device 102 according to the second embodiment can suppress the height in the Z direction, similar to the electronic device 100 according to the first embodiment.

[0075] The size of the upper part 23A in the XY direction only needs to be a size that can press against the bottom surface of the groove 6. In order to suppress displacement of the semiconductor device 2 in the XY direction, it is desirable that the size of the upper part 23A in the XY direction be close to the size of the groove 6 in the XY direction. More specifically, that the size of the upper part 23A in the XY direction is close to the size of the groove 6 in the XY direction means that the widths of the respective parts constituting the upper part 23A in the X direction and the Y direction are respectively close to the widths of the respective parts constituting the groove 6 in the X direction and the Y direction, and / or that the lengths of the upper part 23A in the X direction and the Y direction are respectively close to the lengths of the groove 6 in the X direction and the Y direction.

[0076] The height (or thickness) of the upper part 23A in the Z direction may exceed the depth of the groove 6 as long as it can suppress displacement of the semiconductor device 2 in the XY direction, similar to the first embodiment. However, in order to suppress the height of the electronic device 102 in the Z direction, it is desirable that the height of the upper part 23A in the Z direction be within the depth of the groove 6. Also, regarding the depth of the groove 6, it only needs to be a depth such that the upper part 23A can be stably fitted into the groove 6.

[0077] The side portion 23B extends in the Z direction. With the upper portion 23A fitted into the groove 6, the side portion 23B extends in the Z direction from the square end of the upper portion 23A to the printed wiring board 25. In other words, with the upper portion 23A fitted into the groove 6, the side portion 23B extends along the side surface of the semiconductor device 2 in the Z direction. The length of the side portion 23B in the Z direction may be any length that can suppress the displacement of the semiconductor device 2 in the Z direction when the semiconductor device 2 is attached to the printed wiring board 25.

[0078] The contact portion 23C has a shape that spreads along the XY plane. The contact portion 23C has a hole through which the screw 24 passes. In a state where the semiconductor device 2 is attached to the printed wiring board 25, the contact portion 23C contacts the printed wiring board 25.

[0079] In this way, the attachment component 23 mainly suppresses the displacement of the semiconductor device 2 in the XY direction by the upper portion 23A, mainly suppresses the displacement of the semiconductor device 2 in the Z direction by the side portion 23B, and fixes the semiconductor device 2 to the printed wiring board 25 together with the screw 24 via the contact portion 23C. That is, the attachment component 23 has a function of pressing the semiconductor device 2 against the printed wiring board 25.

[0080] The fixing mentioned here is the fixing achieved by tightening the screw 24. Therefore, when it is desired to remove the semiconductor device 2 from the printed wiring board 25, it can be easily removed by loosening the screw 24.

[0081] Similar to the first embodiment, the solder ball 19 and the printed wiring board 25 can be removed without being fixed, for example, by melting the solder. That is, the semiconductor device 2 according to the second embodiment is designed to be portable with respect to the printed wiring board of the electronic device 102 or the like.

[0082] From the above, the electronic device 102 according to the second embodiment, similar to the first embodiment, includes that the encapsulation resin 22 of the semiconductor device 2 has the groove 6, has the mounting component 23 with a shape that fits into the groove 6, and that the removal of the mounting component 23 can be easily performed by a screw 24 or the like.

[0083] In the electronic device 102 according to the second embodiment, the shape of the groove 6 of the semiconductor device 2 and the mounting component 23 may be any structure as long as the upper portion 23A fits into the groove 6 and the semiconductor device 2 can be fixed to the printed wiring board 25 by the mounting component 23.

[0084] Similarly, as long as the upper portion 23A fits into the groove 6 and the semiconductor device 2 can be fixed to the printed wiring board 25 by the mounting component 23, the shape of the semiconductor device 2 in the XY plane viewed from the +Z direction does not have to be a rectangular shape. The shape of the semiconductor device 2 in the XY plane viewed from the +Z direction may be, for example, a shape in which one of the corners of the rectangle is chamfered.

[0085] [2-2] Advantages (effects) of the second embodiment According to the semiconductor device 2 and the electronic device 102 including the semiconductor device 2 according to the second embodiment described above, the same effects as those of the first embodiment can be obtained even in a structure different from that of the first embodiment.

[0086] The encapsulation resin 22 of the semiconductor device 2 included in the electronic device 102 according to the second embodiment has the groove 6. Therefore, according to the electronic device 102 according to the second embodiment, similar to the first embodiment, it is possible to fix the semiconductor device 2 to the printed wiring board 25 by the mounting component 23. Therefore, even when the mounting component 23 is attached to the semiconductor device 2, the height of the semiconductor device 2 can be maintained in the Z direction, or the change in the height of the electronic device 102 can be minimized.

[0087] Also, the electronic device 102 according to the second embodiment is, similar to the first embodiment, easier to dissipate heat compared to the comparative example.

[0088] Also, similar to the first embodiment, the electronic device 102 according to the second embodiment can make it difficult to misorient the semiconductor device 2 when fixing it to the printed wiring board 25 by providing the groove 6 asymmetrically.

[0089] [3] Third Embodiment [3-1] Configuration (Structure) Hereinafter, an example of the configuration of the semiconductor device 3 and the electronic device 103 according to the third embodiment will be described. The semiconductor device 3 and the electronic device 103 are different from the first and second embodiments in terms of the shape of the mounting components and grooves, and the number of screws. Regarding other structures and functions, the third embodiment is substantially the same as the first embodiment. Hereinafter, the semiconductor device 3 and the electronic device 103 according to the third embodiment will be mainly described with respect to the differences from the first embodiment.

[0090] [3-1-1] Configuration of Semiconductor Device 3 FIG. 7 shows a configuration example of the semiconductor device 3 according to the third embodiment. The upper figure in FIG. 7 is a plan view (XY plane) viewed from the +Z direction of the semiconductor device 3, showing a view from the same direction as the upper figure in FIG. 1. The lower figure in FIG. 7 is a side view (XZ plane) viewed from the -Y direction of the semiconductor device 3, showing a view from the same direction as the lower figure in FIG. 1.

[0091] As shown in FIG. 7, the semiconductor device 3 includes, for example, a plurality of terminals 30, a plurality of solder balls 29, a substrate 31, and a sealing resin 32. Since the substrate 31, the solder balls 29, and the terminals 30 have the same configurations and functions as the substrate 11, the solder balls 9, and the terminals 10 according to the first embodiment, respectively, detailed descriptions thereof are omitted.

[0092] The encapsulating resin 32 is located above the substrate 31 (+Z direction). The encapsulating resin 32 has a rectangular shape in the XY plane. The encapsulating resin 32 has an end that coincides with the end of the substrate 31 in the XY plane. The encapsulating resin 32 has two grooves 7 shaped to extend along the ends in the Y direction of the encapsulating resin 32 in the XY plane. In other words, each groove 7 has, for example, a cuboid shape. The two grooves 7 are respectively located at both ends in the Y direction of the encapsulating resin 32.

[0093] Hereinafter, the groove 7 will be specifically described. The encapsulating resin 32 has differences in height in the Z direction depending on the location. Specifically, it is as follows. The encapsulating resin 32 includes a first portion 32A and a second portion 32B. The first portion 32A occupies the lower (-Z side) portion of the encapsulating resin 32 and has a cuboid shape. The second portion 32B occupies the upper (+Z side) portion of the encapsulating resin 32 and has a cuboid shape. The first portion 32A and the second portion 32B are provided continuously in the Z direction and are integrally formed. The second portion 32B is not located in a part of the upper surface (+Z direction, looking at the XY plane) of the first portion 32A. The upper surface of the first portion 32A is exposed in the region where the second portion 32B is not located. That is, the groove 7 is formed in the region where the upper surface of the first portion 32A is exposed and the second portion 32B is not located. By having such a shape, the encapsulating resin 32 has differences in height in the Z direction depending on the location. That is, the encapsulating resin 32 has a lower height in the Z direction in the exposed region of the upper surface of the first portion 32A compared to other regions. The groove 7 is a space generated by the difference in height in the Z direction between the exposed portion of the upper surface of the first portion 32A and the upper surface of the second portion 32B.

[0094] In other words, the sealing resin 32 has a structure in which a second portion 32B having a rectangular parallelepiped shape with a smaller size (or shorter length) in the X direction than the first portion 32A in the XY plane is provided on the first portion 32A having a rectangular parallelepiped shape. The size of the second portion 32B in the Y direction is the same as the size of the first portion 32A in the Y direction. The second portion 32B is arranged so as not to protrude from the first portion 32A in the XY plane. For example, the center of the second portion 32B in the XY plane coincides with the center of the first portion 32A in the XY plane. The space generated by the second portion 32B being smaller than the first portion 32A is the groove 7. The groove 7, that is, the region where the upper surface of the first portion 32A is exposed, extends along the end in the Y direction of the second portion 32B with a certain width in the XY plane.

[0095] The groove 7 may be formed in the same manner as the groove 5 according to the first embodiment. Details of the depth and shape of the groove 7 will be described later. Here, the depth of the groove 7 corresponds to the height of the second portion 32B in the Z direction.

[0096] [3-1-2] Configuration of the electronic device 103 An example of the configuration in a state where the semiconductor device 3 is attached to the printed wiring board 35 will be described with reference to FIG. 8.

[0097] FIG. 8 shows a configuration example of the electronic device 103 according to the third embodiment. The upper diagram of FIG. 8 is a plan view of the electronic device 103 and shows a view seen from the same direction as the upper diagram of FIG. 7. The lower diagram of FIG. 8 is a side view of the electronic device 103 and shows a view seen from the same direction as the lower diagram of FIG. 7.

[0098] As shown in FIG. 8, the electronic device 103 includes, for example, the semiconductor device 3, the mounting component 33, the screw 34, and the printed wiring board 35 shown in FIG. 7. Since the printed wiring board 35 and the screw 34 have the same configuration and function as the printed wiring board 15 and the screw 14 according to the first embodiment, respectively, detailed descriptions thereof are omitted.

[0099] The attachment component 33 has a portion that covers the exposed portion of the upper surface (XY plane as viewed from the +Z direction) of the first portion 32A of the encapsulation resin 32, that is, the portion covering the bottom surface of the groove 7, a portion extending in the Z direction, and a portion in contact with the printed wiring board 35. The portion covering the bottom surface of the groove 7, the portion extending in the Z direction, and the portion in contact with the printed wiring board 35 may be hereinafter referred to as the upper portion 33A, the side portion 33B, and the contact portion 33C, respectively. The upper portion 33A, the side portion 33B, and the contact portion 33C are continuously formed integrally. A part of the upper portion 33A and a part of the side portion 33B are connected at a right angle within a range allowing for manufacturing errors. Another part of the side portion 33B and a part of the contact portion 33C are connected at a right angle within a range allowing for manufacturing errors.

[0100] The upper portion 33A has a shape that extends along the end in the Y direction in the XY plane of the encapsulation resin 32. The upper portion 33A has, for example, the same shape as the groove 7 and presses against the bottom surface of the groove 7. In other words, the upper portion 33A is positioned so as to be fitted into the groove 7. By the upper portion 33A pressing against the bottom surface of the groove 7, the attachment component 33 can suppress the displacement of the semiconductor device 3 in the XY direction. Further, by the upper portion 33A being positioned within the groove 7, the electronic device 103 according to the third embodiment can suppress the height in the Z direction, similarly to the electronic device 100 according to the first embodiment.

[0101] The size of the upper portion 33A in the XY direction may be any size that can press against the bottom surface of the groove 7. In order to suppress the displacement of the semiconductor device 3 in the XY direction, it is desirable that the size of the upper portion 33A in the XY direction be close to the size of the groove 7 in the XY direction. More specifically, for the size of the upper portion 33A in the XY direction to be close to the size of the groove 7 in the XY direction means that the widths of the respective portions constituting the upper portion 33A in the X direction and the Y direction are respectively close to the widths of the respective portions constituting the groove 7 in the X direction and the Y direction, and / or the lengths of the upper portion 33A in the X direction and the Y direction are respectively close to the lengths of the groove 7 in the X direction and the Y direction.

[0102] The height (or thickness) of the upper part 33A in the Z direction may exceed the depth of the groove 7 as long as it can suppress the displacement of the semiconductor device 3 in the XY direction, similar to the first embodiment. However, in order to suppress the height of the electronic device 103 in the Z direction, it is desirable that the height of the upper part 33A in the Z direction is within the depth of the groove 7. Also, regarding the depth of the groove 7, it is sufficient that the upper part 33A can be stably fitted into the groove 7.

[0103] The side part 33B extends in the Z direction. With the upper part 33A fitted into the groove 7, the side part 33B extends in the Z direction from the edge of the square of the upper part 33A to the printed wiring board 35. In other words, with the upper part 33A fitted into the groove 7, the side part 33B extends along the side surface of the semiconductor device 3 in the Z direction. The length of the side part 33B in the Z direction may be any length that can suppress the displacement of the semiconductor device 3 in the Z direction when the semiconductor device 3 is attached to the printed wiring board 35.

[0104] The contact part 33C has a shape that spreads along the XY plane. The contact part 33C has a hole through which the screw 34 passes. In the state where the semiconductor device 3 is attached to the printed wiring board 35, the contact part 33C contacts the printed wiring board 35.

[0105] In this way, the attachment component 33 mainly suppresses the displacement of the semiconductor device 3 in the XY direction by the upper part 33A, mainly suppresses the displacement of the semiconductor device 3 in the Z direction by the side part 33B, and fixes the semiconductor device 3 to the printed wiring board 35 together with the screw 34 through the contact part 33C. That is, the attachment component 33 has the function of pressing the semiconductor device 3 against the printed wiring board 35.

[0106] The fixation mentioned here is the fixation achieved by tightening the screw 34. Therefore, when it is desired to remove the semiconductor device 3 from the printed wiring board 35, it can be easily removed by loosening the screw 34.

[0107] Similar to the first embodiment, the solder ball 29 and the printed wiring board 35 can be removed without being fixed by melting the solder, for example. That is, the semiconductor device 3 according to the third embodiment is designed to be portable with respect to the printed wiring board of the electronic device 103 or the like.

[0108] From the above, the electronic device 103 according to the third embodiment, similar to the first embodiment, includes that the sealing resin 32 of the semiconductor device 3 has the groove 7, has the mounting component 33 shaped to be fitted into the groove 7, and the removal of the mounting component 33 can be easily performed by a screw 34 or the like.

[0109] In the electronic device 103 according to the third embodiment, the shape of the groove 7 of the semiconductor device 3 and the mounting component 33 may be any structure as long as the upper part 33A is fitted into the groove 7 and the semiconductor device 3 can be fixed to the printed wiring board 35 by the mounting component 33.

[0110] Similarly, as long as the upper part 33A is fitted into the groove 7 and the semiconductor device 3 can be fixed to the printed wiring board 35 by the mounting component 33, the shape of the semiconductor device 3 in the XY plane viewed from the +Z direction does not have to be a rectangular shape. The shape of the semiconductor device 3 in the XY plane viewed from the +Z direction may be, for example, a shape in which one of the corners of the rectangle is chamfered.

[0111] [3-2] Advantages (effects) of the third embodiment According to the semiconductor device 3 and the electronic device 103 including the semiconductor device 3 according to the third embodiment described above, the same effects as those of the first embodiment can be obtained even in a structure different from that of the first embodiment.

[0112] The encapsulation resin 32 of the semiconductor device 3 included in the electronic device 103 according to the third embodiment has the groove 7. Therefore, according to the electronic device 103 according to the third embodiment, similarly to the first and second embodiments, the semiconductor device 3 can be fixed to the printed wiring board 35 by the mounting component 33. Therefore, even if the mounting component 33 is attached to the semiconductor device 3, the height of the semiconductor device 3 can be maintained in the Z direction, or the change in the height of the electronic device 103 can be minimized.

[0113] Also, the electronic device 103 according to the third embodiment is, similarly to the first embodiment, easier to dissipate heat than the comparative example.

[0114] Also, the electronic device 103 according to the third embodiment can, similarly to the first embodiment, make it difficult to misalign the direction in which the semiconductor device 3 is fixed to the printed wiring board 35 by providing the groove 7 asymmetrically.

[0115] [4] Fourth Embodiment [4-1] Configuration (Structure) Hereinafter, an example of the configuration of the semiconductor device 4 and the electronic device 104 according to the fourth embodiment will be described. The semiconductor device 4 and the electronic device 104 differ from the third embodiment in terms of the mounting component, the substrate, the encapsulation resin, the shape of the screw and the groove, and the number of screws. Regarding other structures and functions, the fourth embodiment is substantially the same as the third embodiment. Hereinafter, the semiconductor device 4 and the electronic device 104 according to the fourth embodiment will be mainly described with respect to the differences from the third embodiment.

[0116] [4-1-1] Configuration of Semiconductor Device 4 FIG. 9 shows a configuration example of the semiconductor device 4 according to the fourth embodiment. The upper figure of FIG. 9 is a plan view (XY plane) viewed from the +Z direction of the semiconductor device 4, and shows a view viewed from the same direction as the upper figure of FIG. 7. The lower figure of FIG. 9 is a side view (XZ plane) viewed from the -Y direction of the semiconductor device 4, and shows a view viewed from the same direction as the lower figure of FIG. 7.

[0117] As shown in FIG. 9, the semiconductor device 4 includes, for example, a plurality of terminals 40, a plurality of solder balls 39, a substrate 41, and a sealing resin 42. Since the solder balls 39 and the terminals 40 have the same configurations and functions as the solder balls 29 and the terminals 30 according to the third embodiment, detailed descriptions thereof are omitted.

[0118] The substrate 41 has the same function as the substrate 31 according to the third embodiment and is different from the substrate 31 in terms of shape. The substrate 41 has a rectangular shape in the XY plane and has, for example, a semi-circular concave shape at an end along the Y direction. In other words, each of the ends of the substrate 41 extending in the Y direction has a portion that is not along the Y direction, and the shape of the non-along portion is a semi-circular concave shape. A screw 44 (see FIG. 10), which will be described later, is fitted into the semi-circular concave portion.

[0119] The sealing resin 42 is located above the substrate 41 (+Z direction). The sealing resin 42 has an end that coincides with the end of the substrate 41 in the XY plane. That is, the sealing resin 42 has a rectangular shape in the XY plane and has, for example, a semi-circular concave shape at an end along the Y direction. The sealing resin 42 has two grooves 8 having a shape that extends along the end in the Y direction of the sealing resin 42 in the XY plane. In other words, each groove 8 has, for example, a rectangular parallelepiped shape. The two grooves 8 are respectively located at both ends of the sealing resin 42 in the Y direction. The groove 8 includes a semi-circular concave portion.

[0120] Hereinafter, the groove 8 will be specifically described. The encapsulation resin 42 has a difference in height in the Z direction depending on the location. Specifically, it is as follows. The encapsulation resin 42 includes a first portion 42A and a second portion 42B. The first portion 42A occupies the lower (-Z side) portion of the encapsulation resin 42. The first portion 42A has a shape in which a part of the end portion is cut out in a semi-cylindrical shape, for example, along two surfaces along the inner ZY surface of the rectangular parallelepiped in the Z direction. The cut-out portion extends in the Z direction, for example, across the upper surface and the bottom surface of the first portion 42A in the Z direction. Specifically, a part of the four sides extending in the Y direction within the rectangular parallelepiped of the first portion 42A has a semi-circular concave shape. Among the four sides extending in the Y direction of the first portion 42A, the two sides located on the -X side of the first portion 42A face each other along the Z direction in the semi-circular portions. Similarly, among the four sides extending in the Y direction of the first portion 42A, the two sides located on the +X side of the first portion 42A face each other along the Z direction in the semi-circular portions. In other words, the two sides located on the -X side of the first portion 42A are in the same positions in the X and Y directions and in different positions in the Z direction. The two sides located on the +X side of the first portion 42A are in the same positions in the X and Y directions and in different positions in the Z direction.

[0121] The second portion 42B occupies the upper (+Z side) portion of the encapsulation resin 42 and has a rectangular parallelepiped shape. The first portion 42A and the second portion 42B are provided continuously in the Z direction and are integrally formed. The second portion 42B is not located in a part of the upper surface (XY plane viewed from the +Z direction) of the first portion 42A. The upper surface of the first portion 42A is exposed in the region where the second portion 42B is not located. That is, the groove 8 is formed in the region where the upper surface of the first portion 42A is exposed and the second portion 42B is not located. By having such a shape, the encapsulation resin 42 has a difference in height in the Z direction depending on the location. That is, the encapsulation resin 42 has a lower height in the Z direction in the exposed region of the upper surface of the first portion 42A compared to other regions. The groove 8 is a space generated by the difference in height in the Z direction between the exposed portion of the upper surface of the first portion 42A and the upper surface of the second portion 42B.

[0122] In other words, a part of the end portion of the sealing resin 42 along the ZY plane is on the first portion 42A having a rectangular parallelepiped shape with a semi-cylindrical cutout in the Z direction, and has a rectangular parallelepiped shape smaller in size (or shorter in length) in the X direction than the first portion 42A in the XY plane. The second portion 42B is provided. The size of the second portion 42B in the Y direction is the same as the size of the first portion 42A in the Y direction. The second portion 42B is arranged so as not to protrude from the first portion 42A in the XY plane. For example, the center of the second portion 42B in the XY plane coincides with the center of the first portion 42A in the XY plane. The space generated by the second portion 42B being smaller than the first portion 42A is the groove 8. The groove 8, that is, the region where the upper surface of the first portion 42A is exposed, extends along the end portion in the Y direction of the second portion 42B with a certain width in the XY plane. The groove 8 includes a concave semi-circular portion.

[0123] The groove 8 may be formed in the same manner as the groove 7 according to the third embodiment. Details of the depth and shape of the groove 8 will be described later. Here, the depth of the groove 8 corresponds to the height of the second portion 42B in the Z direction.

[0124] [4-1-2] Configuration of the electronic device 104 An example of the configuration in a state where the semiconductor device 4 is attached to the printed wiring board 45 will be described with reference to FIG. 10.

[0125] FIG. 10 shows a configuration example of the electronic device 104 according to the fourth embodiment. The upper figure of FIG. 10 is a plan view of the electronic device 104 and shows a view seen from the same direction as the upper figure of FIG. 9. The lower figure of FIG. 10 is a side view of the electronic device 104 and shows a view seen from the same direction as the lower figure of FIG. 9.

[0126] As shown in FIG. 10, the electronic device 104 includes, for example, the semiconductor device 4, the mounting component 43, the screw 44, and the printed wiring board 45 shown in FIG. 9. Since the printed wiring board 45 has the same configuration and function as the printed wiring board 35 according to the third embodiment, a detailed description thereof will be omitted.

[0127] The mounting component 43 has a portion that covers the exposed portion on the upper surface (XY plane as viewed from the +Z direction) of the first portion 42A of the sealing resin 42, that is, the bottom surface of the groove 8. Unlike the mounting components 13, 23, and 33, the mounting component 43 does not have a portion extending in the Z direction (a portion corresponding to the side portions 13B, 23B, and 33B of the mounting components 13, 23, and 33) and a portion in contact with the printed wiring board 45 (a portion corresponding to the contact portions 13C, 23C, and 33C of the mounting components 13, 23, and 33). In the mounting component 43, the functions corresponding to the side portions 13B, 23B, and 33B and the contact portions 13C, 23C, and 33C of the mounting components 13, 23, and 33 are compensated for by the screw 44 and the semi-circular recesses provided in the substrate 41 and the sealing resin 42. These details will be described later.

[0128] The mounting component 43 has a shape that extends along the end of the sealing resin 42 in the Y direction in the XY plane. The mounting component 43 has, for example, the same shape as the groove 8 and presses against the bottom surface of the groove 8. In other words, the mounting component 43 is positioned so as to be fitted into the groove 8. By the mounting component 43 pressing against the bottom surface of the groove 8 together with the screw 44, the mounting component 43 can suppress the displacement of the semiconductor device 4 in the XY direction. Further, since the mounting component 43 is positioned in the groove 8, the electronic device 104 according to the fourth embodiment can suppress the height in the Z direction, similar to the electronic device 103 according to the third embodiment.

[0129] The size of the mounting component 43 in the XY direction only needs to be large enough to press against the bottom surface of the groove 8. In order to suppress the displacement of the semiconductor device 4 in the XY direction, it is desirable that the size of the mounting component 43 in the XY direction be close to the size of the groove 8 in the XY direction. More specifically, the size of the mounting component 43 in the XY direction being close to the size of the groove 8 in the XY direction means that the widths of the respective parts constituting the mounting component 43 in the X and Y directions are respectively close to the widths of the respective parts constituting the groove 8 in the X and Y directions, and / or the lengths of the mounting component 43 in the X and Y directions are respectively close to the lengths of the groove 8 in the X and Y directions.

[0130] The height (or thickness) of the mounting component 43 in the Z direction may exceed the depth of the groove 8 as long as it can suppress the displacement of the semiconductor device 4 in the XY direction, similar to the third embodiment. However, in order to suppress the height of the electronic device 104 in the Z direction, it is desirable that the height of the mounting component 43 in the Z direction be within the depth of the groove 8. Also, regarding the depth of the groove 8, it only needs to be deep enough to stably fit the mounting component 43 into the groove 8.

[0131] The screw 44 has a function of fixing the mounting component 43 and the semiconductor device 4 to the printed wiring board 45. A part of the screw 44 is fitted into a semi-circular recess provided in the substrate 41 and the sealing resin 42. The screw 44 is inserted into a hole provided in the printed wiring board 45. For example, when the screw 44 is a male screw, a groove corresponding to the thread provided on the screw 44 may be formed inside the hole of the printed wiring board 45 into which the screw 44 is inserted. By inserting and screwing the screw 44 into the hole provided in the printed wiring board 45, the mounting component 43 sandwiched between the screw 44 and the printed wiring board 45 is fixed. By fixing the mounting component 43, the semiconductor device 4 is fixed to the printed wiring board 45.

[0132] The screw 44 extends in the Z direction. The screw 44 extends in the Z direction from the end of the semi-circular recess of the mounting component 43 to the printed wiring board 45 while being fitted into the semi-circular recesses provided in the substrate 41 and the encapsulating resin 42. In other words, the screw 44 extends in the Z direction along the side surface of the semiconductor device 4 while being fitted into the semi-circular recesses provided in the substrate 41 and the encapsulating resin 42. The length of the screw 44 in the Z direction may be adjusted to a length that can suppress the displacement of the semiconductor device 4 in the Z direction when the semiconductor device 4 is attached to the printed wiring board 45.

[0133] In this way, the screw 44 suppresses the displacement of the semiconductor device 4 in the XY direction mainly by being embedded in the semi-circular recesses provided in the mounting component 43, the substrate 41, and the encapsulating resin 42. Further, the screw 44 suppresses the displacement of the semiconductor device 4 in the Z direction mainly by being inserted into the hole provided in the printed wiring board 45, and fixes the semiconductor device 4 to the printed wiring board 45 together with the mounting component 43. That is, the screw 44 and the mounting component 43 have a function of pressing the semiconductor device 4 against the printed wiring board 45.

[0134] The fixing mentioned here is the fixing achieved by tightening the screw 44. Therefore, when it is desired to remove the semiconductor device 4 from the printed wiring board 45, it can be easily removed by loosening the screw 44.

[0135] Similar to the third embodiment, the solder balls 39 and the printed wiring board 45 can be removed without being fixed, for example, by melting the solder. That is, the semiconductor device 4 according to the fourth embodiment is designed to be portable with respect to the printed wiring board of the electronic device 104 or the like.

[0136] In the example of FIG. 10, although an example where there are two screws 44 is shown, the number of screws 44 can be arbitrarily set as long as the mounting component 43 can be fixed to the printed wiring board 45. For example, the electronic device 104 may have two or more screws in one of the two grooves 8.

[0137] Also, the electronic device 104 may have a stud or the like between the screw 44 and the printed wiring board 45. That is, instead of directly inserting the screw 44 into the hole formed in the printed wiring board 45, a part of the stud is embedded in the hole formed in the printed wiring board 45 and the stud is fixed. The fixed stud extends in the Z direction. The stud has a hole in the upper part (+Z side). The inside of the hole of the stud may be formed with a groove corresponding to the thread provided on the screw 44 which is, for example, a male screw. By inserting and screwing the screw 44 into the hole provided in the stud, the entire semiconductor device 4 is fixed to the printed wiring board 45. That is, the screw 44 fixes the mounting component 43 and the semiconductor device 4 to the printed wiring board 45 via the stud.

[0138] From the above, similar to the third embodiment, the electronic device 104 according to the fourth embodiment includes that the sealing resin 42 of the semiconductor device 4 has the groove 8, has the mounting component 43 shaped to fit into the groove 8, and the removal of the mounting component 43 can be easily performed by the screw 44 or the like. Further, the electronic device 104 according to the fourth embodiment has a semi-circular recess in the mounting component 43, the substrate 41, and the sealing resin 42 into which a part of the screw 44 can be fitted.

[0139] In the electronic device 104 according to the fourth embodiment, the shape of the groove 8 of the semiconductor device 4 and the mounting component 43 only needs to be such that the mounting component 43 can be fitted into the groove 8 and the semiconductor device 4 can be fixed to the printed wiring board 45 by the mounting component 43. The semi-circular recesses provided in the mounting component 43, the substrate 41, and the encapsulating resin 42 may have a shape other than semi-circular as long as they can fit a part of the screw 44. For example, the recess may be arc-shaped or polygonal.

[0140] Similarly, as long as the mounting component 43 is fitted into the groove 8 and the semiconductor device 4 can be fixed to the printed wiring board 45 by the mounting component 43 and the screw 44, the XY plane of the semiconductor device 4 in the XY plane viewed from the +Z direction does not have to be square. The shape of the semiconductor device 4 in the XY plane viewed from the +Z direction may be, for example, a shape in which one of the corners of the square is chamfered.

[0141] [4-2] Advantages (effects) of the fourth embodiment According to the semiconductor device 4 and the electronic device 104 including the semiconductor device 4 according to the fourth embodiment described above, the same effects as those of the third embodiment can be obtained even in a structure different from that of the third embodiment.

[0142] The encapsulating resin 42 of the semiconductor device 4 included in the electronic device 104 according to the fourth embodiment has a groove 8. Further, the electronic device 104 according to the fourth embodiment has semi-circular recesses in the mounting component 43, the substrate 41, and the encapsulating resin 42 into which a part of the screw 44 can be fitted. Therefore, according to the electronic device 104 according to the fourth embodiment, similarly to the third embodiment, the semiconductor device 4 can be fixed to the printed wiring board 45 by the mounting component 43 and the screw 44. Therefore, even if the mounting component 33 is attached to the semiconductor device 4, the height of the semiconductor device 4 can be maintained in the Z direction or the change in the height of the electronic device 104 can be minimized.

[0143] In addition, similar to the third embodiment, the electronic device 104 according to the fourth embodiment is more easily cooled than the comparative example.

[0144] In addition, similar to the third embodiment, the electronic device 104 according to the fourth embodiment can reduce the likelihood of misorienting the semiconductor device 4 when fixing it to the printed wiring board 45 by providing the groove 8 asymmetrically.

[0145] [5] Other modifications and the like In the first to fourth embodiments, the structures of the semiconductor devices 1, 2, 3, 4 and the electronic devices 100, 102, 103, 104 each including the semiconductor devices 1, 2, 3, 4 may be other structures.

[0146] In this specification, "connected" indicates being electrically connected, and for example, does not exclude having another element in between. "Electrically connected" may be through an insulator as long as it can operate in the same manner as an electrically connected one. "Substantially the same" and "substantially identical" include errors due to manufacturing variations.

[0147] The first to fourth embodiments of the present invention are presented as examples and are not intended to limit the scope of the invention. The first embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. The first embodiment and its modifications are included in the scope and gist of the invention and are included in the invention described in the claims and its equivalent scope.

Description of Reference Numerals

[0148] 1 to 4... semiconductor device, 5 to 8... groove, 10, 20, 30, 40... terminal, 9, 19, 29, 39... solder ball, 11, 21, 31, 41... substrate, 12, 22, 32, 42... encapsulating resin, 13, 23, 33, 43... mounting component, 14, 24, 34, 44... screw, 15, 25, 35, 45... printed wiring board, 16... controller chip, 17... NAND chip, 18a, 18b... wire, 100, 102, 103, 104... electronic device, 200... CPU, 400... ROM, 500... RAM, 600... information processing device

Claims

1. A substrate extending along a first surface, a semiconductor chip provided above the substrate in a first direction of the substrate, a resin covering the semiconductor chip, a terminal provided below the substrate in the first direction of the substrate, comprising: the resin includes a first portion occupying a lower portion of the resin and a second portion occupying an upper portion of the resin and having a surface common with a part of the upper surface of the first portion, the resin is further divided into a third portion having the second portion and a fourth portion not having the second portion, a first height from the upper surface of the substrate to the upper surface of the third portion in the first direction of the third portion is higher than a second height from the upper surface of the substrate to the upper surface of the fourth portion in the first direction of the fourth portion, an end portion of the fourth portion in a second direction along the first surface is a part of an end portion of the resin in the second direction, a semiconductor device, a printed wiring board having a second terminal and a first hole electrically connected to the terminal, a mounting component having a fifth portion disposed above the fourth portion, a sixth portion having a second hole, and a seventh portion connecting the fifth portion and the sixth portion, a fixing component having a portion extending across the first hole and the second hole, an electronic device.

2. a thickness of the fifth portion in the first direction is the same as or shorter than a difference between the first height and the second height in the first direction, The electronic device according to claim 1.

3. the fixing component can fix the mounting component to the printed wiring board, The electronic device according to claim 1.

4. the fixing component is detachable from the printed wiring board, The electronic device according to claim 1.

5. The fourth portion extends in the second direction, The electronic device according to claim 1.

6. The fourth portion includes a first sub-portion extending in the second direction and a second sub-portion extending along the first surface and intersecting the second direction in a third direction, an end portion of the first sub-portion in the second direction is a part of an end portion of the resin in the second direction, an end portion of the second sub-portion in the third direction is a part of an end portion of the resin in the third direction, The electronic device according to claim 1.

7. The fourth portion includes a first sub-portion each extending in the second direction and a second sub-portion spaced apart from the first sub-portion, The electronic device according to claim 1. **Claim 8**: The fourth part further includes a third sub - part and a fourth sub - part, each extending along the first surface and in a third direction intersecting the second direction, wherein the resin further has a first side and a second side arranged in the second direction, and a third side and a fourth side arranged in the third direction, wherein the first sub - part includes the first side, the second sub - part includes the second side, the third sub - part includes the third side, and the fourth sub - part includes the fourth side, An electronic device according to claim 7. **Claim 9**: The fifth part of the attachment component is arranged to avoid the upper part of the third part. An electronic device according to claim 1. **Claim 10**: A substrate extending along a first surface, a semiconductor chip provided above the substrate in a first direction of the substrate, a resin covering the semiconductor chip, a terminal provided below the substrate in the first direction of the substrate, comprising: the resin includes a first part occupying the lower part of the resin and a second part occupying the upper part of the resin and having a common surface with a part of the upper surface of the first part, the resin is further divided into a third part having the second part and a fourth part not having the second part, a first height from the upper surface of the substrate to the upper surface of the third part in the first direction of the third part is higher than a second height from the upper surface of the substrate to the upper surface of the fourth part in the first direction of the fourth part, an end in a second direction along the first surface of the fourth part is a part of an end of the resin in the second direction, a semiconductor device, a printed wiring board having a second terminal and a first hole electrically connected to the terminal, an attachment component including a fifth part arranged above the fourth part, a fixing component having an eighth part arranged above the fifth part of the attachment component, a ninth part embedded in the first hole, and a tenth part connecting the eighth part and the ninth part, the fourth part of the resin has a recess, the eighth part of the fixing component is arranged in the recess, An electronic device. **Claim 11**: The fourth part includes a first sub - part extending in the second direction and a second sub - part spaced apart from the first sub - part, wherein the resin has a first side and a second side arranged in the second direction, the first sub - part includes the first side, and the second sub - part includes the second side, The first side and the second side each have a semi-circular, arc-shaped, or polygonal portion. The electronic device according to claim 10.

12. The fifth portion of the attachment component is arranged to avoid the upper portion of the third portion. The electronic device according to claim 10.

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