Epoxy resin composition and electronic component device

Abstract

To provide an epoxy resin composition which suppresses occurrence of warpage and generation of voids when a cured product is formed on a semiconductor wafer.SOLUTION: The epoxy resin composition contains an epoxy resin, a curing agent, a filler, and a solvent. The epoxy resin contains a reaction product of a phenol compound represented by the following general formula (A) and a silicone-modified epoxy resin. In the general formula (A), each R1 independently represents an alkyl group or an allyl group; each X independently represents an alkylene group or an arylene group; p represents 1 or 2; each m independently represents an integer of 0 to 4; and n represents an integer of 0 to 4 when p is 1, and represents an integer of 0 to 3 when p is 2.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to an epoxy resin composition and an electronic component device.

Background Art

[0002] In recent years, in order to reduce the cost, size, thickness, weight, and improve the performance and functionality of electronic component devices, miniaturization, multilayerization, and multi-pinning of element wirings, as well as high-density mounting by miniaturizing and thinning packages have been progressing. Along with this, an electronic component device having substantially the same size as an IC (Integrated Circuit) element, that is, a CSP (Chip Size Package) has been widely used.

[0003] Among them, a wafer-level chip size package that performs resin encapsulation at the semiconductor wafer stage has attracted attention as the ultimate package. This wafer-level chip size package is a semiconductor wafer in which fine wiring is provided as a semiconductor element, and rewiring and electrodes for external connection terminal extraction are formed on its surface, and bumps are formed or leads are connected on the electrodes, and the surface of the semiconductor wafer is encapsulated with an epoxy resin composition, and after soldering to the bumps or leads, the semiconductor wafer is cut into individual elements to obtain a product. In this method, at the semiconductor wafer stage, a large number of elements are encapsulated and separated at once by transfer molding using a solid epoxy resin composition, printing molding using a liquid epoxy resin composition, etc., so that significant production rationalization is possible compared to the method of encapsulating after separating the elements. However, in a wafer-level chip size package, the encapsulated semiconductor wafer is likely to warp, and this warping causes problems in each process such as conveyance, grinding, inspection, and separation after encapsulation, and there is a problem that element characteristics vary depending on the device. The wafer diameter tends to become larger and larger in order to further reduce costs, and the larger the wafer diameter, the greater the warping. Therefore, reducing the warping of the semiconductor wafer has become an important issue in popularizing the wafer-level chip size package.

[0004] In addition, in a liquid epoxy resin composition used for manufacturing a wafer-level chip size package by a printing and molding method, it is required to be excellent in foam-breaking property and defoaming property when removing residual air in the vacuum treatment process, and to have few residual voids in the cured product. Conventionally, in the field of element encapsulation of electronic component devices such as transistors and ICs, resin encapsulation has become the mainstream from the viewpoints of productivity, cost, etc., and epoxy resin molding materials are widely used. This is because epoxy resins are well-balanced in various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to insert parts. The warpage of a semiconductor wafer is affected by the stress generated by the curing shrinkage of this epoxy resin composition, the mismatch in the coefficient of thermal expansion between the semiconductor wafer and the epoxy resin composition, etc., and there is a risk of reducing the reliability of the package. Therefore, it is necessary to reduce the stress in the epoxy resin composition used for such applications. Generally, it is effective to reduce the curing shrinkage of the epoxy resin composition, to highly fill an inorganic filler to reduce the coefficient of thermal expansion, or to use a flexibilizer, a flexible resin, etc. to reduce the elastic modulus.

[0005] For example, Patent Document 1 discloses a liquid epoxy resin composition containing a naphthalene skeleton type epoxy resin or a biphenyl skeleton type epoxy resin and adding silicone powder and silicone oil. In addition, Patent Documents 2 and 3 disclose a liquid resin composition mainly composed of a silicone-modified epoxy resin and having an elastic modulus of the cured product at room temperature of 5 GPa or less.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, even with the liquid resin compositions disclosed in Patent Documents 1 to 3, there are cases where the occurrence of warpage and voids in the semiconductor wafer cannot yet be sufficiently suppressed. The present disclosure has been made in view of the above-described conventional circumstances, and an epoxy resin composition in which the occurrence of warpage and voids when a cured product is formed on a semiconductor wafer is suppressed, and an electronic component device using this epoxy resin composition are provided.

Means for Solving the Problems

[0008] Specific means for achieving the above problems are as follows. <1> An epoxy resin composition containing an epoxy resin, a curing agent, a filler, and a solvent, wherein the epoxy resin contains a reaction product of a phenol compound represented by the following general formula (A) and a silicone-modified epoxy resin.

[0009]

Chemical Formula

[0010] (In general formula (A), R 1 each independently represents an alkyl group or an allyl group, X each independently represents an alkylene group or an arylene group. p represents 1 or 2, m each independently represents an integer of 0 to 4, n represents an integer of 0 to 4 when p is 1, and represents an integer of 0 to 3 when p is 2.) <2> The epoxy resin composition according to <1>, wherein the content of the solvent is 1% by mass to 10% by mass. <3> The epoxy resin composition according to <1> or <2>, wherein the ratio of the filler in the solid content is 40% by mass to 95% by mass. <4> The filler contains an inorganic filler, and the proportion of the inorganic filler in the filler is 50% by mass to 99.9% by mass. The epoxy resin composition according to any one of <1> to <3>. <5> The curing agent contains an amine-based curing agent. The epoxy resin composition according to any one of <1> to <4>. <6> The epoxy resin composition according to any one of <1> to <5>, which is used for sealing a wafer-level chip size package. <7> An electronic component device including an element sealed with the epoxy resin composition according to any one of <1> to <6>.

Effect of the Invention

[0011] According to the present disclosure, there are provided an epoxy resin composition in which the occurrence of warpage and the occurrence of voids when a cured product is formed on a semiconductor wafer are suppressed, and an electronic component device using this epoxy resin composition.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments for carrying out the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values and their ranges, and they do not limit the present disclosure.

[0013] In the present disclosure, the term "step" includes not only a step independent of other steps but also a step that is not clearly distinguishable from other steps as long as the purpose of the step is achieved. In the numerical range indicated by "~" in the present disclosure, the numerical values described before and after "~" are included as the minimum value and the maximum value, respectively. In the numerical ranges described step by step in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in other step-by-step descriptions. Further, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. In the present disclosure, each component may contain a plurality of corresponding substances. When a plurality of substances corresponding to each component are present in the composition, the content rate or content of each component means the total content rate or content of the plurality of substances present in the composition, unless otherwise specified. In the present disclosure, the particles corresponding to each component may contain a plurality of corresponding particles. When a plurality of particles corresponding to each component are present in the composition, the particle diameter of each component means a value for a mixture of the plurality of particles present in the composition, unless otherwise specified. In the present disclosure, the terms "layer" or "film" include not only the case where the layer or film is formed over the entire region when observing the region where the layer or film exists, but also the case where the layer or film is formed only in a part of the region. In the present disclosure, the "solid content" of the epoxy resin composition refers to the components obtained by removing the solvent from the entire composition of the epoxy resin composition.

[0014] <Epoxy resin composition> The epoxy resin composition of the present disclosure contains an epoxy resin, a curing agent, a filler, and a solvent, and the epoxy resin contains a reaction product of a phenol compound represented by the following general formula (A) and a silicone-modified epoxy resin (hereinafter sometimes referred to as a specific epoxy resin).

[0015]

Chemical formula

[0016] In general formula (A), R 1Each independently represents an alkyl group or an allyl group, and X each independently represents an alkylene group or an arylene group. p represents 1 or 2, m each independently represents an integer from 0 to 4, n represents an integer from 0 to 4 when p is 1, and represents an integer from 0 to 3 when p is 2.

[0017] As a result of intensive studies, the present inventors have found that by using the epoxy resin composition of the present disclosure containing a specific epoxy resin, the occurrence of warpage and the occurrence of voids when a cured product is formed on a semiconductor wafer are suppressed, and thus completed the present invention.

[0018] The epoxy resin composition of the present disclosure contains an epoxy resin, a curing agent, a filler, and a solvent, and may contain other components as necessary. Hereinafter, each component constituting the epoxy resin composition of the present disclosure will be described.

[0019] -Epoxy resin- The epoxy resin composition contains a specific epoxy resin. The epoxy resin composition may contain other epoxy resins other than the specific epoxy resin.

[0020] (Specific epoxy resin) The specific epoxy resin includes a reaction product of a phenol compound represented by the general formula (A) and a silicone-modified epoxy resin.

[0021] In the general formula (A), R 1 is an alkyl group or an allyl group, and a plurality of R 1 may be the same or different. In the general formula (A), the alkyl group represented by R 1 is preferably an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably an alkyl group having 1 or 2 carbon atoms. R 1Specific examples of the alkyl group represented by [[ID=]] are a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, a neopentyl group, an isopentyl group, an s-pentyl group, a 3-pentyl group, a t-pentyl group, and the like.

[0022] In the general formula (A), the alkylene group represented by X may be linear or branched, and is preferably an alkylene group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 15 carbon atoms, and even more preferably an alkylene group having 1 to 10 carbon atoms. Specific examples of the alkylene group represented by X include a methylene group, an ethylene group, a tetramethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group, a decamethylene group, an undecamethylene group, a dodecamethylene group, a 2-methylpentamethylene group, a 2-methylhexamethylene group, a 2-methylheptamethylene group, a 2-methyloctamethylene group, a 2-methylnonamethylene group, a 2-methyldecamethylene group, an isopropylidene group (>C(CH 3 ) 2 ), and the like.

[0023] In the general formula (A), the arylene group represented by X is preferably an arylene group having 6 to 25 carbon atoms, and more preferably an arylene group having 6 to 14 carbon atoms. Specific examples of the arylene group represented by X include a phenylene group, a biphenylylene group (-C 6 H 4 -C 6 H 4 -), a naphthylene group, and the like.

[0024] In the general formula (A), m each independently represents an integer of 0 to 4, and 0 or 1 is preferred. In the general formula (A), p represents 1 or 2. In the general formula (A), when p is 1, n represents an integer of 0 to 4, and 0 or 1 is preferred. When p is 2, n represents an integer of 0 to 3, and 0 or 1 is preferred.

[0025] In general formula (A), when at least one of R 1 is an allyl group, the allyl group is preferably substituted at the ortho position in relation to the phenolic hydroxyl group.

[0026] The phenolic compound represented by general formula (A) is preferably a compound in which R 1 is an allyl group, p is 1, X is an alkylene group, and both m and n are 0 or 1. More preferably, R 1 is an allyl group, p is 1, X is a methylene group or an isopropylidene group, and both m and n are 0 or 1. Even more preferably, R 1 is an allyl group, p is 1, X is an isopropylidene group, and both m and n are 1, or p is 1, X is a methylene group, and both m and n are 0.

[0027] The hydroxyl equivalent of the phenolic compound represented by general formula (A) is preferably 50 g / eq to 500 g / eq, more preferably 70 g / eq to 400 g / eq, and even more preferably 90 g / eq to 300 g / eq. In the present disclosure, the hydroxyl equivalent refers to a value calculated from the hydroxyl value determined in accordance with JIS K7236:2009.

[0028] Commercially available industrial products of the phenolic compound represented by general formula (A) include 2,2'-diallylbisphenol A (DABPA, hydroxyl equivalent: 154 g / eq, Daiwa Kasei Kogyo Co., Ltd.), Ledtop SBA (hydroxyl equivalent: 260 g / eq), Ledtop APG (hydroxyl equivalent: 148 g / eq), Ledtop LVA (hydroxyl equivalent: 154 g / eq), Ledtop BPF-SG (high-purity bisphenol F, hydroxyl equivalent: 100 g / eq) (all from Gunei Chemical Industry Co., Ltd.), etc.

[0029] The phenolic compound represented by general formula (A) may be used alone or in combination of two or more.

[0030] The silicone-modified epoxy resin is not particularly limited as long as it has a siloxane structure in the molecule. Among them, the silicone-modified epoxy resin is preferably a compound represented by the following general formula (B).

[0031] [Chemical formula]

[0032] In the general formula (B), R 2 is an alkyl group or a phenyl group, and a plurality of R 2 may be the same or different. In the general formula (B), specific examples of R 2 include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a phenyl group, etc., and a methyl group is preferred. Also, in the general formula (B), q is an integer of 1 or more, preferably 25 or less, and more preferably 15 or less. Commercially available products that are industrially available as the compound represented by the general formula (B) include KF-105, X22-163A (Shin-Etsu Chemical Co., Ltd.), TSL9906 (Momentive Performance Materials Japan LLC), etc.

[0033] The compound represented by the general formula (B) may be used alone or in combination of two or more.

[0034] The epoxy equivalent of the compound represented by the general formula (B) is preferably 1000 g / eq or less, and more preferably 600 g / eq or less. The epoxy equivalent of the compound represented by the general formula (B) may be 150 g / eq or more. In the present disclosure, the epoxy equivalent refers to a value measured by the perchloric acid titration method in accordance with JIS K7236:2009.

[0035] The reaction product of a phenolic compound represented by the general formula (A) and a silicone-modified epoxy resin can be obtained, for example, by mixing a phenolic compound represented by the general formula (A) and a compound represented by the general formula (B), adding a catalyst if necessary, further adding an organic solvent if necessary, and heating the mixture to cause a reaction. Examples of the catalyst include the following. Specifically, cycloamidine compounds such as 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), 1,5-diazabicyclo[4.3.0]nonene, 5,6-dibutylamino-1,8-diazabicyclo[5.4.0]undec-7-ene; compounds having intramolecular polarization formed by adding quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-xylenequinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, etc., compounds having a π bond such as diazophenylmethane, phenolic resin, etc. to the cycloamidine compound; tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol, derivatives of tertiary amine compounds; imidazole compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, derivatives of imidazole compounds; organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris(4-methylphenyl)phosphine, diphenylphosphine, phenylphosphine, etc., phosphorus compounds having intramolecular polarization formed by adding quinone compounds such as maleic anhydride, the above quinone compounds, diazophenylmethane, phenolic resin, etc. having a π bond to the organic phosphine compound; tetraphenylborate salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazolium tetraphenylborate, N-methylmorpholinium tetraphenylborate, derivatives of tetraphenylborate salts; triphenylborane complexes such as triphenylphosphine-triphenylborane complex, morpholine-triphenylborane complex, etc. are mentioned. When reacting, the equivalent ratio of the phenol compound represented by the general formula (A) and the silicone-modified epoxy resin is preferably such that the ratio of epoxy equivalent / hydroxyl equivalent is 1 to 5.

[0036] The epoxy equivalent of the specific epoxy resin is preferably from 400 g / eq to 2000 g / eq, more preferably from 600 g / eq to 1500 g / eq.

[0037] (Other epoxy resins) The epoxy resin composition may contain other epoxy resins other than the specific epoxy resin. Examples of other epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule such as alkyl alcohol glycidyl ethers [butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.], alkenyl alcohol glycidyl ethers [vinyl glycidyl ether, allyl glycidyl ether, etc.]; difunctional aliphatic epoxy compounds having two epoxy groups in the molecule such as alkylene glycol diglycidyl ethers, alkenylene glycol diglycidyl ethers; polyglycidyl ethers of trifunctional or higher alcohols such as trimethylolpropane, pentaerythritol, dipentaerythritol [trimethylolpropane triglycidyl ether, pentaerythritol (tri or tetra) glycidyl ether, dipentaerythritol (tri, tetra, penta or hexa) glycidyl ether, etc.] and other polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, glycidyl ethers of difunctional phenols such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S, catechol, resorcinol, glycidyl ether esters of hydroxycarboxylic acids such as hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, p-hydroxybenzoic acid, monoglycidyl esters or polyglycidyl esters of carboxylic acids such as benzoic acid, phthalic acid, terephthalic acid, glycidylamine type epoxy compounds such as diglycidylaniline, diglycidyltoluidine, triglycidyl-p-aminophenol, tetraglycidyl-m-xylenediamine, epoxy compounds having a naphthalene skeleton such as glycidyl esters of naphthol, glycidyl ether esters of β-hydroxynaphthoic acid, etc. Among these, from the viewpoint of obtaining a cured product having a high glass transition temperature, glycidyl ethers of bifunctional phenols, hydrogenated bisphenol A diglycidyl ether, etc. are preferable. Further, from the viewpoint of obtaining an epoxy resin composition having a low viscosity, it is preferable that it is a glycidyl ether of bifunctional phenols, a bifunctional aliphatic epoxy compound or a polyfunctional aliphatic epoxy compound.

[0038] The proportion of the specific epoxy resin in the epoxy resin is preferably 10% by mass or more, more preferably 10% by mass to 70% by mass, still more preferably 10% by mass to 65% by mass, and particularly preferably 15% by mass to 60% by mass.

[0039] From the viewpoint of preventing corrosion of aluminum wiring or copper wiring on elements such as ICs, it is preferable that the purity of the epoxy resin is high and the amount of hydrolyzable chlorine is small. From the viewpoint of improving the moisture resistance of the epoxy resin composition, the amount of hydrolyzable chlorine is preferably 500 ppm or less on a mass basis.

[0040] Here, the amount of hydrolyzable chlorine is a value determined by potentiometric titration after dissolving 1 g of the epoxy resin of the sample in 30 mL of dioxane, adding 5 mL of 1N - KOH methanol solution, and refluxing for 30 minutes.

[0041] The content of the epoxy resin in the solid content of the epoxy resin composition is preferably 1.5% by mass to 20% by mass, more preferably 2.0% by mass to 15% by mass, and still more preferably 3.0% by mass to 10% by mass. The content of the epoxy resin in the solid content of the epoxy resin composition excluding the filler is preferably 30% by mass to 85% by mass, more preferably 35% by mass to 80% by mass, and still more preferably 40% by mass to 80% by mass.

[0042] - Curing agent - The epoxy resin composition contains a curing agent. The curing agent may be any one that undergoes a polymerization reaction with the epoxy resin, and it can be used whether it is liquid or solid at 25°C. Examples of the curing agent include amine-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, etc. Among these, amine-based curing agents are preferred as the curing agent.

[0043] Examples of the amine-based curing agent include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, etc. From the viewpoints of heat resistance and electrical properties, it is preferably an aromatic amine, more preferably an aromatic amine in which an amino group is directly bonded to the aromatic ring and one or two aromatic rings are contained in one molecule. Specific examples of the amine-based curing agent include aromatic amine curing agents having one aromatic ring such as m-phenylenediamine, 1,3-diaminotoluene, 1,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl-2,6-diaminotoluene and other diethyltoluenediamines, 2,4-diaminoanisole; aromatic amine curing agents having two aromatic rings such as 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-methylenebis(2-ethylaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane; hydrolysis condensates of aromatic amine curing agents; aromatic amine curing agents having a polyether structure such as polytetramethylene oxide di-p-aminobenzoate, polytetramethylene oxide diparaaminobenzoate; condensates of aromatic diamines and epichlorohydrin; reaction products of aromatic diamines and styrene, etc.

[0044] As the amine curing agent, commercially available products may be used. Specific examples of commercially available amine curing agents include amine curing agents manufactured by Nippon Kayaku Co., Ltd. (product name: Kayahard-AA), amine curing agents manufactured by Mitsubishi Chemical Corporation (product names: jER Cure (registered trademark) 113, product name: jER Cure (registered trademark) W, etc.), and the like. However, the amine curing agent is not limited to these specific examples. The amine curing agent may be used alone or in combination of two or more kinds.

[0045] As the acid anhydride curing agent, phthalic anhydride, maleic anhydride, methyl hymic anhydride, hymic anhydride, succinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride maleic acid adduct, benzophenone tetracarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, hydrogenated methyl nadic anhydride, various cyclic acid anhydrides such as those obtained by the Diels-Alder reaction from maleic anhydride and a diene compound, trialkyltetrahydrophthalic anhydride having a plurality of alkyl groups, dodecenyl succinic anhydride, etc. may be mentioned.

[0046] As the phenolic curing agent, a novolak resin obtained by condensing or co-condensing at least one selected from the group consisting of phenolic compounds (for example, phenol, cresol, xylenol, resorcinol, catechol, bisphenol A and bisphenol F) and naphthol compounds (for example, α-naphthol, β-naphthol and dihydroxynaphthalene) with an aldehyde compound (for example, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst; a phenol-aralkyl resin; a biphenyl-aralkyl resin; a naphthol-aralkyl resin; and the like may be mentioned. The curing agent may be used alone or in combination of two or more kinds.

[0047] The ratio of the equivalent number of functional groups of the curing agent (for example, the active hydrogen of the amino group in the case of an amine-based curing agent, the phenolic hydroxyl group in the case of a phenolic curing agent, and the acid anhydride group in the case of an acid anhydride-based curing agent) to the equivalent number of epoxy groups of the epoxy resin (equivalent number of curing agent / equivalent number of epoxy resin) can be set in the range of 0.6 to 1.4, may be in the range of 0.7 to 1.3, or may be in the range of 0.8 to 1.2.

[0048] - Filler - The epoxy resin composition contains a filler. The filler may be an inorganic filler or an organic filler. The proportion of the filler in the solid content of the epoxy resin composition is preferably 40% by mass to 95% by mass, more preferably 50% by mass to 95% by mass, and even more preferably 60% by mass to 95% by mass.

[0049] Examples of the inorganic filler include silica such as spherical silica and crystalline silica, calcium carbonate, clay, alumina, silicon nitride, silicon carbide, boron nitride, calcium silicate, potassium titanate, aluminum nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania, etc. powders, beads obtained by spheroidizing these, glass fibers, etc. Further, examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate, etc. These inorganic fillers may be used alone or in combination of two or more. Among them, spherical silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The shape of the inorganic filler is preferably spherical from the viewpoints of high filling of the inorganic filler and fluidity and permeability into the fine gaps of the epoxy resin composition. As the inorganic filler, an untreated filler may be used, or one treated in advance with a coupling agent described later may be used.

[0050] The particle size of the inorganic filler is preferably from 1 μm to 20 μm, more preferably from 1.5 μm to 15 μm, and even more preferably from 2 μm to 10 μm. If the average particle size of the inorganic filler is 1 μm or more, it tends to be easy to disperse the inorganic filler at a high concentration in the epoxy resin composition. If the average particle size of the inorganic filler is 20 μm or less, the coarse particle component of the inorganic filler decreases, insufficient filling into the fine gaps of the epoxy resin composition or streak-like defects during printing are suppressed, and the surface smoothness tends to improve. In the present disclosure, the average particle size refers to the particle size at which the volume cumulative particle size distribution measured using the laser diffraction method is 50%.

[0051] When the filler contains an inorganic filler, the proportion of the inorganic filler in the filler is preferably from 50% by mass to 99.9% by mass, more preferably from 80% by mass to 99.5% by mass, and even more preferably from 90% by mass to 99.5% by mass from the viewpoint of mechanical strength.

[0052] In the present disclosure, the organic filler refers to an organic compound having a particulate or fibrous shape. Examples of the organic compound constituting the organic filler include resin components such as urea formalin resin, polycarbonate resin, melamine resin, unsaturated polyester resin, polyurethane resin, polyolefin resin, acrylic resin, fluororesin, polystyrene resin, cellulose, formaldehyde resin, coumarone indene resin, lignin, petroleum resin, amino resin, polyester resin, polyethersulfone resin, butadiene resin, and copolymers thereof. These resin components may be used alone or in combination of two or more. Further, rubber particles may be used as the organic filler. Examples of the rubber particles include rubber particles such as styrene-butadiene rubber (SBR), nitrile-butadiene rubber (NBR), butadiene rubber (BR), urethane rubber (UR), and acrylic rubber (AR). Among them, rubber particles made of acrylic rubber are preferable from the viewpoints of heat resistance and moisture resistance, and core-shell type acrylic polymer, that is, core-shell type acrylic rubber particles are more preferable. As rubber particles other than those described above, silicone rubber particles can also be preferably used. Examples of silicone rubber particles include silicone rubber particles obtained by crosslinking polyorganosiloxanes such as linear polydimethylsiloxane, polymethylphenylsiloxane, and polydiphenylsiloxane; those in which the surface of the silicone rubber particles is coated with a silicone resin; core-shell polymer particles composed of a core of solid silicone particles obtained by emulsion polymerization or the like and a shell of an organic polymer such as an acrylic resin. These silicone polymer particles can be used regardless of whether their shape is amorphous or spherical, but spherical ones are preferably used in order to keep the viscosity related to the moldability of the epoxy resin composition low. Commercially available products of these silicone polymer particles are available from Toray Dow Corning Silicone Co., Ltd., Shin-Etsu Chemical Co., Ltd., and the like.

[0053] The organic filler is preferably spherical, and the average particle diameter is preferably from 0.05 μm to 4 μm, more preferably from 0.08 μm to 3 μm.

[0054] When the filler contains an organic filler, the proportion of the organic filler in the filler is preferably from 0.1% by mass to 50% by mass, more preferably from 0.5% by mass to 20% by mass, and even more preferably from 0.5% by mass to 10% by mass, from the viewpoint of flexibility.

[0055] When the filler contains silicone rubber particles, the proportion of the silicone rubber particles in the filler is preferably from 0.1% by mass to 50% by mass, more preferably from 0.5% by mass to 20% by mass, and even more preferably from 0.5% by mass to 10% by mass, from the viewpoint of warpage reduction. When the proportion of the silicone rubber particles is 0.1% by mass or more, the warpage suppression effect tends to be greater because sufficient stress reduction can be achieved, and when it is 50% by mass or less, the strength and moisture resistance of the cured product tend to be less likely to decrease. When an organic filler is used as the filler, only silicone rubber particles may be used, only the organic filler composed of a resin component may be used, or both may be used in combination.

[0056] - Solvent - The epoxy resin composition contains a solvent. The solvent is a component for imparting the optimum viscosity and thixotropic index to the printing formability of the epoxy resin composition. As the solvent, from the viewpoint of avoiding void formation due to the volatilization of the solvent during the heat curing of the epoxy resin composition or suppressing the change in the viscosity of the epoxy resin composition during the printing operation due to the volatilization of the solvent, a solvent having a boiling point of 170 °C or higher is preferable, and a solvent having a boiling point of 200 °C or higher is more preferable. Further, when a coating film is formed by vacuum printing, since the epoxy resin composition is always handled under vacuum, there is a concern that the solvent gradually volatilizes and the viscosity changes. In this case, the boiling point of the solvent is preferably in the range of 240 °C to 300 °C.

[0057] Specific examples of the solvent include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, ethylene glycol mono-2-ethylhexyl ether, diethylene glycol mono-2-ethylhexyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, tripropylene glycol monomethyl ether, propylene glycol monon-butyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, 3-methyl-3-methoxybutyl acetate, butyl carbitol acetate, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate, 2,2,4-trimethyl-1,3-pentanediol diisobutyrate, γ-butyrolactone, etc. Among these, one type may be used alone or two or more types may be used in combination.

[0058] The content rate of the solvent in the epoxy resin composition is preferably 1% by mass to 10% by mass, more preferably 2% by mass to 8% by mass, and even more preferably 3% by mass to 6% by mass. If the content rate of the solvent is 1% by mass or more, the viscosity of the epoxy resin composition will not become too high, and the coating workability and printability tend not to decrease. If the content rate of the solvent is 10% by mass or less, the viscosity of the epoxy resin composition will not decrease too much, so after printing, the phenomenon that the epoxy resin composition flows to the back surface of the wafer and the generation of voids during curing tend not to occur.

[0059] -Other components- The epoxy resin composition may contain other components other than the epoxy resin, curing agent, filler and solvent, if necessary.

[0060] (Curing accelerator) The epoxy resin composition may further contain a curing accelerator. The type of the curing accelerator is not particularly limited, and known curing accelerators can be used. Specific examples of the known curing accelerators include the compounds exemplified as the specific examples of the above-mentioned catalysts used when synthesizing the reaction product of the phenol compound represented by the general formula (A) and the silicone-modified epoxy resin. The curing accelerator may be used alone or in combination of two or more.

[0061] (Ion trap agent) The epoxy resin composition may further contain an ion trap agent. The ion trap agent that can be used in the present disclosure is not particularly limited as long as it is an ion trap agent generally used in a sealing material used for manufacturing semiconductor devices. Examples of the ion trap agent include compounds represented by the following general formula (VI-1) or the following general formula (VI-2).

[0062] Mg 1-a Al a (OH) 2 (CO 3 ) a / 2 ·uH 2 O (VI-1) (In the general formula (VI-1), a is 0 < a ≤ 0.5, and u is a positive number.) BiO b (OH) c (NO 3 ) d (VI-2) (In the general formula (VI-2), b is 0.9 ≤ b ≤ 1.1, c is 0.6 ≤ c ≤ 0.8, and d is 0.2 ≤ d ≤ 0.4.)

[0063] Ion trapping agents are commercially available. As the compound represented by the general formula (VI-1), for example, "DHT-4A" (trade name, Kyowa Chemical Industry Co., Ltd.) is commercially available. As the compound represented by the general formula (VI-2), for example, "IXE500" (trade name, Toagosei Co., Ltd.) is commercially available.

[0064] In addition, as ion trapping agents other than the above, examples include hydrated oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony, etc. The ion trapping agent may be used alone or in combination of two or more.

[0065] When the epoxy resin composition contains an ion trapping agent, from the viewpoint of achieving sufficient moisture resistance reliability, the content of the ion trapping agent is preferably 1 part by mass or more with respect to 100 parts by mass of the epoxy resin. From the viewpoint of fully exerting the effects of other components, the content of the ion trapping agent is preferably 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin.

[0066] Also, the average particle size of the ion trapping agent is preferably 0.1 μm to 3.0 μm, and the maximum particle size is preferably 10 μm or less.

[0067] (Coupling agent) The epoxy resin composition may further contain a coupling agent. The type of the coupling agent is not particularly limited, and known coupling agents can be used. Examples of the coupling agent include silane coupling agents and titanium coupling agents. The coupling agent may be used alone or in combination of two or more.

[0068] Examples of silane coupling agents include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane (3-glycidoxypropyltrimethoxysilane), vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-[bis(β-hydroxyethyl)]aminopropyltriethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(β-aminoethylamino)propyldimethoxymethylsilane, N-(dimethoxymethylsilylisopropyl)ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N-(β-(N-vinylbenzylamino)ethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, γ-anilinopropyltrimethoxysilane, vinyltrimethoxysilane, decyltrimethoxysilane, hexyltrimethoxysilane, and γ-mercaptopropylmethyldimethoxysilane.

[0069] Examples of titanium coupling agents include isopropyltriisostearoyl titanate, isopropyltris(dioctylpyrophosphate) titanate, isopropyltri(N-aminoethyl-aminoethyl) titanate, tetraoctylbis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl phosphite) titanate, bis(dioctylpyrophosphate)oxyacetate titanate, bis(dioctylpyrophosphate)ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyldiacryl titanate, isopropyltri(dioctyl phosphate) titanate, isopropyltricumylphenyl titanate, and tetraisopropylbis(dioctyl phosphite) titanate.

[0070] When the epoxy resin composition contains a coupling agent, the content of the coupling agent is preferably 10% by mass or less based on the total solid content of the epoxy resin composition, and from the viewpoint of fully exerting its effect, it is preferably 0.1% by mass or more.

[0071] (Release agent) The epoxy resin composition may further contain a release agent. The type of the release agent is not particularly limited, and a known release agent can be used. Specifically, for example, higher fatty acids, carnauba wax, and polyethylene wax can be mentioned. The release agent may be used alone or in combination of two or more. When the epoxy resin composition contains a release agent, the content of the release agent is preferably 10% by mass or less based on the total amount of the epoxy resin and the curing agent, and from the viewpoint of exerting its effect, it is preferably 0.5% by mass or more.

[0072] (Colorant) The epoxy resin composition may contain a colorant (for example, carbon black). The colorant may be used alone or in combination of two or more.

[0073] When using conductive particles such as carbon black as the colorant, the content of particles having a particle diameter of 10 μm or more is preferably 1% by mass or less. When the epoxy resin composition contains conductive particles, the content of the conductive particles is preferably 3% by mass or less based on the total amount of the epoxy resin and the curing agent.

[0074] The epoxy resin composition may contain, as other components, silicone oil; surfactant; antioxidant; nitrogen-containing compounds such as phosphate ester, melamine, melamine derivative, compound having a triazine ring, cyanuric acid derivative, isocyanuric acid derivative, etc., phosphonitrilic compounds such as cyclophosphazene, metal compounds such as zinc oxide, iron oxide, molybdenum oxide, ferrocene, etc., antimony oxides such as antimony trioxide, antimony tetroxide, antimony pentoxide, conventionally known flame retardants such as brominated epoxy resin; dispersant, etc., if necessary.

[0075] The epoxy resin composition may be prepared by any method as long as the above various components can be uniformly dispersed and mixed. As a general method for preparing the epoxy resin composition, there can be mentioned a method of weighing components in predetermined compounding amounts and dispersing and kneading them by a three-roll mill, a kneader, a planetary mixer, a hard mixer, a homomixer, etc. Also, a method using a masterbatch in which each compounding component is preliminarily dispersed and preliminarily heated is preferable from the viewpoints of uniform dispersibility and fluidity.

[0076] The curing conditions of the epoxy resin composition are not particularly limited. The heat treatment temperature is preferably 120°C to 250°C, more preferably 130°C to 220°C, and even more preferably 130°C to 210°C. The heat treatment time is preferably 15 minutes to 4 hours, and more preferably 30 minutes to 4 hours. Also, the heat treatment temperature may be increased stepwise.

[0077] The glass transition temperature (Tg) measured by the DMA method for the cured product of the epoxy resin composition is preferably 80°C or higher, and more preferably 90°C or higher.

[0078] The viscosity of the epoxy resin composition at 25°C is preferably less than 1000 Pa·s, more preferably 800 Pa·s or less, and even more preferably 500 Pa·s or less. The viscosity of the epoxy resin composition at 25°C is taken as the value measured using a rotational shear viscometer under the condition of a rotational speed of 5 revolutions per minute. The thixotropic index [(viscosity at 1 revolution per minute) / (viscosity at 5 revolutions per minute)] of the epoxy resin composition, which is the ratio of the viscosity at a rotational speed of 1 revolution per minute and the viscosity at a rotational speed of 5 revolutions per minute measured at 25°C using a rotational shear viscometer, is preferably from 0.3 to 1.5, more preferably from 0.5 to 1.2. When the thixotropic index is within the above range, the filling property tends to be further improved. Note that the viscosity and thixotropic index of the epoxy resin composition can be adjusted to a desired range by appropriately selecting the composition of the epoxy resin, the filler content, etc.

[0079] The epoxy resin composition of the present disclosure is suitably used for sealing a wafer-level chip size package described later. According to the epoxy resin composition of the present disclosure, the occurrence of repulsion is likely to be suppressed when the epoxy resin composition is applied to the surface of a semiconductor wafer by a printing method or the like.

[0080] <Electronic component device> The electronic component device of the present disclosure includes an element sealed with the epoxy resin composition of the present disclosure. Examples of the electronic component device include those in which electronic components such as semiconductor chips, active elements such as transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, resistor arrays, coils, and switches are mounted on support members such as lead frames, wired tape carriers, wiring boards, glass, and silicon wafers, and the necessary parts are sealed with the epoxy resin composition of the present disclosure. Among them, the epoxy resin composition of the present disclosure is effective for electronic component devices that require low warpage and high reliability, and is particularly suitable for sealing wafer-level chip size packages. Since warpage is suppressed in the semiconductor wafer sealed with the epoxy resin composition of the present disclosure, problems caused by warpage are less likely to occur in each process such as conveyance, grinding, inspection, and singulation after sealing of the semiconductor wafer. Further, when the Tg of the cured product of the epoxy resin composition is 90°C or higher, chipping is less likely to occur during processing such as dicing. As a method for encapsulating an element using the epoxy resin composition of the present disclosure, there are a dispensing method, a casting method, a printing method, etc., and the printing method is particularly preferred.

Examples

[0081] Hereinafter, the present disclosure will be described in more detail based on examples, but the present disclosure is not limited to the following examples. In the following examples, parts and % indicate parts by mass and mass % unless otherwise specified.

[0082] [Examples 1 to 5 and Comparative Example 1] Each material shown in Table 1 was kneaded and dispersed using a three-roll mill and a kneader, and then degassed under vacuum to prepare the epoxy resin compositions described in the examples and comparative examples. The unit of the composition of each component described in Table 1 is parts by mass except for the solvent. In Table 1, “inorganic filler (mass %)” means the ratio based on the mass of the inorganic filler in the solid content, and “inorganic filler (parts by mass)” indicates the amount based on the mass of the inorganic filler used in the preparation of the epoxy resin composition. In Table 1, “solvent (mass %)” means the ratio based on the mass of the solvent in the epoxy resin composition.

[0083] The prepared epoxy resin compositions were evaluated by the following various tests. The obtained results are summarized in Table 1.

[0084] (Initial viscosity and thixotropic index) The viscosity of the produced epoxy resin composition was measured at 25°C and 5 revolutions per minute by the above method. Also, the value obtained by dividing the measured viscosity value of the epoxy resin composition measured at 1 revolution per minute at 25°C by the measured viscosity value measured at 5 revolutions per minute at 25°C was defined as the thixotropic index.

[0085] (Pot life (PL)) Regarding the epoxy resin composition produced by the above method, after leaving it standing at 25°C for 24 hours, using a rotational shear viscometer, the viscosity was measured at 25°C under the condition of 5 revolutions per minute, and the increase rate from the initial viscosity was defined as the pot life. PL = (viscosity after standing for 24 hours - initial viscosity) / initial viscosity × 100

[0086] (Warp) On a silicon wafer with a diameter of 200 mm and a thickness of 500 μm, using a mold, an epoxy resin composition layer with a diameter of 198 mm and a thickness of 300 μm was formed, and it was heat-cured at 130°C for 60 minutes and then at 200°C for 120 minutes to obtain a sample. After curing, using a three-dimensional measuring instrument of KEYENCE CORPORATION, the height difference between the center of the silicon wafer and the coating end of the epoxy resin composition was measured as the warp.

[0087] (Color unevenness) The silicon wafer with a diameter of 200 mm and a thickness of 500 μm was subjected to half-cut dicing, and using a mold, an epoxy resin composition layer with a diameter of 198 mm and a thickness of 300 μm was formed, and it was heat-cured at 130°C for 60 minutes and then at 200°C for 120 minutes to obtain a sample. After curing, the wafer was cut using a diamond pen, and color unevenness evaluation was carried out by observing the cross-section according to the following criteria. A: Having a uniform color B: Having a mottled color with a tinge of white

[0088] (Void) The silicon wafer with a diameter of 200 mm and a thickness of 500 μm was subjected to half-cut dicing, and using a mold, an epoxy resin composition layer with a diameter of 198 mm and a thickness of 300 μm was formed, and it was heat-cured at 130°C for 60 minutes and then at 200°C for 120 minutes to obtain a sample. After curing, the wafer was cut using a diamond pen, and the presence or absence of voids in the cross-section was evaluated according to the following criteria. A: No voids are present B: Voids with a diameter of less than 60 μm are present C: Voids with a diameter of 60 μm or more are present

[0089]

Table 1

[0090] In Table 1, the details of each material are as follows. Also, in Table 1, “-” means that the corresponding material was not used.

[0091] (Synthesis of Epoxy Resin 1) In a 3-liter flask equipped with a nitrogen inlet tube, a thermometer, a condenser, a dropping funnel, and a mechanical stirrer, 453 g of DABPA, 1152 g of KF-105, and 427 g of TSL9906 were weighed and added, and the mixture was stirred until the liquid temperature reached 140°C. Next, 20 g of DBU and 295 g of KF-105 and 109 g of TSL9906 were weighed, preliminarily mixed until homogeneous, and then added dropwise into the flask using the dropping funnel. After the dropping was completed, the reaction was carried out at 150°C for 5 hours to obtain Epoxy Resin 1. The viscosity of Epoxy Resin 1 at 25°C, as well as the number-average molecular weight (Mn) and weight-average molecular weight (Mw), are shown in Table 2. The viscosity at 25°C was measured using a rotational shear viscometer under the condition of 20 revolutions per minute. The molecular weights (Mn and Mw) of the epoxy resin were measured by the GPC method using tetrahydrofuran (THF) as the eluent and were determined in terms of standard polystyrene conversion.

[0092] (Synthesis of Epoxy Resin 2) In the synthesis of Epoxy Resin 1, the reaction was carried out in the same manner except that the compounding amounts of each material were changed as follows to obtain Epoxy Resin 2. 317 g of BPF-SG, 1228 g of KF-105, and 450 g of TSL9906 were weighed and added, and the mixture was stirred until the liquid temperature reached 140°C. Next, 12 g of DBU, 332 g of KF-105, and 128 g of TSL9906 were weighed, preliminarily mixed until homogeneous, and then added dropwise into the flask using the dropping funnel. The viscosity of Epoxy Resin 2 at 25°C, as well as the number-average molecular weight (Mn) and weight-average molecular weight (Mw), are shown in Table 2. The viscosity at 25°C was measured using a rotational shear viscometer under the condition of 20 revolutions per minute.

[0093] (Synthesis of Epoxy Resin 3) In the synthesis of epoxy resin 1, the reaction was carried out in the same manner except that the compounding amounts of each material were changed as follows to obtain epoxy resin 3. 480 g of terpene diphenol (YP-90, Yasuhara Chemical Co., Ltd.), 1145 g of KF-105, and 424 g of TSL9906 were weighed and added, and the mixture was stirred until the liquid temperature reached 140 °C. Next, 20 g of DBU, 295 g of KF-105, and 115 g of TSL9906 were weighed, preliminarily mixed until uniform, and then dropped into the flask using a dropping funnel. The viscosity, number average molecular weight (Mn), and weight average molecular weight (Mw) of epoxy resin 3 at 25 °C are shown in Table 2. The viscosity at 25 °C was measured using a rotational shear viscometer under the condition of 10 revolutions per minute.

[0094]

Table 2

[0095] · Epoxy resin 4: Bisphenol F type epoxy resin, epoxy equivalent 161 g / eq · Organic filler: Spherical silicone rubber particles with an average primary particle size of 0.1 μm, the core part containing crosslinked polydimethylsiloxane and the shell part containing polymethyl methacrylate · Curing agent: Diethyltoluenediamine, active hydrogen equivalent 45 g / eq · Colorant: Carbon black · Dispersant 1: Cationic dispersant · Dispersant 2: Anionic dispersant · Coupling agent: 3-Glycidoxypropyltrimethoxysilane · Antioxidant: Hindered phenol-based antioxidant · Ion trap agent: Bismuth-based ion trap agent · Inorganic filler (a 1:4 (mass basis) mixture of spherical silica with an average particle size of 0.5 μm and spherical silica with an average particle size of 4.2 μm) · Solvent: Diethylene glycol monobutyl ether acetate

[0096] As is clear from the results in Table 1, the epoxy resin composition of the example suppresses the generation of voids when formed into a cured product, as compared with the epoxy resin composition of the comparative example. Further, the epoxy resin composition of the example suppresses the generation of warpage when formed into a cured product to the same extent as or more than that of the epoxy resin composition of the comparative example.

Claims

1. An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, and a solvent, wherein the epoxy resin contains a reaction product of a phenolic compound represented by the following general formula (A) and a silicone-modified epoxy resin, the curing agent contains an amine-based curing agent, the proportion of the reaction product in the epoxy resin is 57% to 70% by mass, the content of the solvent is 1% to 10% by mass, and the proportion of the filler in the solid content is 40% to 95% by mass. 【Chemical 1】 (In general formula (A), R １ each independently represents an alkyl group or an allyl group, and X each independently represents an alkylene group or an arylene group. p represents 1 or 2, and m Each independently represents an integer of 0 to 4, n represents an integer of 0 to 4 when p is 1, and represents an integer of 0 to 3 when p is 2.

2. The epoxy resin composition according to claim 1, wherein the filler contains an inorganic filler, and the proportion of the inorganic filler in the filler is 50% to 99.9% by mass.

3. The epoxy resin composition according to claim 1 or claim 2, which is used for sealing a wafer-level chip size package.

4. An electronic component device including an element sealed with the epoxy resin composition according to any one of claims 1 to 3.

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