Electrical device

Abstract

To reduce the size while keeping contact pressure with a cooling object.SOLUTION: An inverter 1 includes a semiconductor module 5, a first cooler 31 and a second cooler 32 that cool in contact with the semiconductor module 5, and an inverter housing 6 that houses the semiconductor module 5 and the first cooler 31. The first cooler 31, the semiconductor module 5, and the second cooler 32 are stacked in this order. The inverter 1 includes a case 21 in contact with the first cooler 31, and a plate spring 33 that applies stress to the second cooler 32. The plate spring 33 is disposed so that stress is increased at a place where the first cooler 31 and the second cooler 32 and the semiconductor module 5 are in contact, that is, at a disposing part 323 and at a place where the semiconductor module 5 is disposed in the first cooler 31.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electrical device.

Background Art

[0002] Patent Document 1 discloses a structure in which refrigerant tubes and heat sinks are arranged on both sides of a double-sided cooling type semiconductor module, and these are clamped by a pressing plate, through bolts, and nuts. Patent Document 2 discloses a structure in which heat sinks arranged on both sides of a semiconductor module are fixed by leaf springs.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In each of the above-described technologies, a structure is used in which a cooling target is sandwiched between a plurality of coolers, and the plurality of coolers are fixed outside the contact portion with the cooling target. For this reason, in order to maintain the contact pressure with the cooling target by the stress applied to the cooler and bring the cooler and the cooling target into close contact, the cooler needs to have rigidity. As a result, the cooler needs to have a thickness, and there is a risk that the cooler will become large-sized.

[0005] The present invention has been made in view of such problems, and an object thereof is to achieve miniaturization while maintaining the contact pressure with the cooling target.

Means for Solving the Problems

[0006] An electrical device according to an aspect of the present invention is an electrical device having an electronic device, a cooler that contacts and cools the electronic device, and a housing that houses the electronic device and the cooler, the electrical device having a contact member that abuts against either the electronic device or the cooler, and an elastic member that applies stress to either the electronic device or the cooler that does not abut against the contact member. The elastic member is arranged such that the stress increases at a predetermined location where the cooler and the electronic device are in contact. At the same time, it is fixed to the contact member. The contact member has an elastic structure at the fixing portion with the elastic member. 。

[0007] An electrical device according to another aspect of the present invention is an electrical device having an electronic device, a cooler that contacts and cools the electronic device, and a housing that houses the electronic device and the cooler, It has a contact member that contacts either an electronic device or a cooler, and an elastic member that applies stress to either an electronic device or a cooler that does not contact the contact member. The elastic member is arranged such that the stress increases at a predetermined location where the cooler and the electronic device are in contact, The cooler has a deformation structure in which stress increases at a predetermined location due to the biasing force from the elastic member. The predetermined location is the placement portion of the electronic device, and the deformation structure is a structure with low rigidity in the direction in which the flatness indicating the degree of deterioration of the flatness of the heat transfer surface of the cooler is large in the placement portion.

Advantages of the Invention

[0008] According to these aspects, it is possible to increase the stress at a predetermined location where the cooler and the electronic device are in contact. For this reason, it is not necessary to thicken the cooler, and it is possible to achieve miniaturization while maintaining the contact pressure with the electronic device to be cooled. Further, by maintaining the contact pressure in this way, it is not necessary to provide the elastic member on the contact member side, which also contributes to miniaturization.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0011] (First Embodiment) FIG. 1 is an exploded view of the inverter 1. FIG. 2 is an exploded view of the cooler unit 3. In FIG. 1, the main part of the inverter 1 is shown in an exploded state together with the motor 10. In FIG. 2, the cooler unit 3 is shown in a state where the second cooler 32 is removed from the semiconductor module 5.

[0012] The inverter 1 is an example of an electric device and is provided on the motor 10. The motor 10 has a motor housing 101 and motor electrodes 102. An opening O formed of a circular hole is provided at the center of one end face of the motor housing 101. The motor electrodes 102 are provided on the inner wall of the opening O. A plurality (here, six) of the motor electrodes 102 are provided along the circumferential direction and are evenly arranged.

[0013] The inverter 1 constitutes an inverter integrated motor together with the motor 10. The inverter 1 has a capacitor 2, a cooler unit 3, a control board 4, a semiconductor module 5, an inverter housing 6, and an inverter cover 7. The capacitor 2, the cooler unit 3, and the control board 4 are arranged in this order in the axial direction of the motor 10, and the capacitor 2 is arranged between the motor 10 and the cooler unit 3.

[0014] The capacitor 2 is a smoothing capacitor, and is composed of a capacitor module in which a plurality of capacitor elements such as film capacitor elements are housed in a case 21 and modularized. The case 21 has a cylindrical shape, and a plurality (here, six) of fixing portions 211 are arranged along the circumferential direction on the outer peripheral portion of the case 21. The fixing portion 211 is configured to have an elastic structure by extending in a plate shape. Further, a plurality (here, six) of PN electrodes 22 composed of a positive electrode and a negative electrode are arranged along the circumferential direction on the outer peripheral portion of the case 21. The fixing portion 211 and the PN electrode 22 are arranged evenly.

[0015] The cooler unit 3 has a first cooler 31, a second cooler 32, and a leaf spring 33, and cools the semiconductor module 5 to be cooled. The cooler unit 3 has a structure in which the first cooler 31, the semiconductor module 5, and the second cooler 32 are laminated in this order, and the first cooler 31 is arranged on the motor 10 side when viewed from the semiconductor module 5.

[0016] The first cooler 31 has a refrigerant inlet 311 and a refrigerant outlet 312, and allows the refrigerant to flow inside. The first cooler 31 has a cylindrical shape, and the refrigerant inlet 311 and the refrigerant outlet 312 are provided on the outer peripheral portion of the first cooler 31 so as to face each other. For this reason, the refrigerant flows through the first cooler 31 in the circumferential direction. The first cooler 31 is formed, for example, by brazing ring-shaped thin plates to both ends of a cylindrical main body portion. In the first cooler 31, the ring-shaped end face constitutes the arrangement surface of the semiconductor module 5. A thermal interface material such as a thermally conductive adhesive is provided between the first cooler 31 and the semiconductor module 5. Thereby, the gap between the first cooler 31 and the semiconductor module 5 caused by the flatness of the first cooler 31 and the semiconductor module 5 is filled, and the cooling effect of the semiconductor module 5 is enhanced. The semiconductor module 5 is an example of an electronic device and is a cooling target of the first cooler 31 and the second cooler 32. A plurality (here, six, from semiconductor modules 5a to 5f) of the semiconductor modules 5 are provided along the circumferential direction between the first cooler 31 and the second cooler 32. The semiconductor modules 5 are arranged evenly. The second cooler 32 has a refrigerant inlet 321 and a refrigerant outlet 322, and is configured in the same manner as the first cooler 31.

[0017] The leaf spring 33 is a plate-shaped elastic body and is arranged on the second cooler 32. The leaf spring 33 is made of, for example, metal and is constituted by a bent plate-shaped extension member. The leaf spring 33 has a clamping portion 331 and a fixing portion 332. The clamping portion 331 is arranged on the second cooler 32. The fixing portion 332 is continuous with the clamping portion 331 and bends so that the tip portion is arranged at the fixing portion 211 of the case 21. By fixing the fixing portion 332 to the fixing portion 211, the leaf spring 33 is fixed to the capacitor 2. The fixing portion 332 is fixed to the fixing portion 211 by a fastening bolt. A force from the leaf spring 33 acts on the fastening bolt in the fixed state. For this reason, by using the leaf spring 33, loosening due to the vibration of the fastening bolt is prevented, and thereby, the leaf spring 33 is prevented from falling off.

[0018] The leaf spring 33 is arranged such that the stress becomes large at a predetermined location where the first cooler 31 and the second cooler 32 come into contact with the semiconductor module 5. The predetermined location is, for example, the arrangement portion 323 described later. When viewed along the stacking direction of the first cooler 31, the semiconductor module 5, and the second cooler 32, the leaf spring 33 is arranged so as to overlap the semiconductor module 5. Thereby, even if the second cooler 32 is thin and has low rigidity, the semiconductor module 5 and the second cooler 32 can be brought into close contact by the clamping force of the leaf spring 33. The same applies to the semiconductor module 5 and the first cooler 31. Also, since the leaf spring 33 is thin, it contributes to downsizing of the cooler unit 3. A plurality of leaf springs 33 are provided corresponding to the plurality of semiconductor modules 5 (semiconductor modules 5a to 5f). For this reason, a plurality of leaf springs 33 (here, six leaf springs 33a to 33f) are provided along the circumferential direction. The same applies to the fixing portion 211. The plurality of semiconductor modules 5 constitute a power module that converts DC power into AC power and supplies it to the motor 10.

[0019] The leaf spring 33 provided as described above applies stress to the second cooler 32, and presses the stacked first cooler 31, semiconductor module 5, and second cooler 32 against the capacitor 2 from the side of the second cooler 32. In other words, the leaf spring 33 causes the first cooler 31 to abut against the case 21 of the capacitor 2 via the second cooler 32. The leaf spring 33 directly applies stress to the second cooler 32. The leaf spring 33 corresponds to an elastic member, and the case 21 of the capacitor 2 corresponds to a contact member. The contact member may be the inverter housing 6. Both the case 21 and the inverter housing 6 are components of the inverter 1. If the contact member is constituted by the components of the inverter 1, the inverter 1 can be assembled separately from the motor 10. Further, if the contact member is constituted by the case 21, the cooler unit 3 can be provided in the inverter housing 6 after being assembled in advance, so that the assemblability of the cooler unit 3 is improved. The stacked first cooler 31, semiconductor module 5, and second cooler 32 may be pressed against, in addition to the inner wall of the inverter housing 6, components such as brackets provided so as to be pressed against them. Other components other than such a case 21 and the inverter housing 6 can also constitute the contact member and also constitute the components of the inverter 1.

[0020] The control board 4 is a board on which control circuits of a plurality of semiconductor modules 5 are mounted, and has a control signal connection portion 41. Control signal terminals 51 are connected to the control signal connection portion 41 by press fitting or soldering. The control signal connection portion 41 is provided in a plurality (here, six from control signal connection portions 41a to 41f) corresponding to the control signal terminals 51 (control signal terminals 51a to 51f) of the plurality of semiconductor modules 5.

[0021] In addition to the control signal terminal 51, the semiconductor module 5 has a PN electrode 52 composed of a positive electrode and a negative electrode and an output electrode 53. The PN electrode 52 is disposed radially outside the first cooler 31 and the second cooler 32. For each of the plurality of PN electrodes 52 (PN electrodes 52a to 52f), the PN electrode 52 is connected to the PN electrode 22 of the inverter 1 by welding or the like. The output electrode 53 is disposed radially inside the first cooler 31 and the second cooler 32. For each of the plurality of output electrodes 53 (output electrodes 53a to 53f), the output electrode 53 is connected to the motor electrode 102 by welding or the like.

[0022] The inverter housing 6 houses the components of the inverter 1 such as the capacitor 2, the cooler unit 3, and the control board 4. The inverter housing 6 has a bottomed cylindrical shape, and an opening is provided in the bottom wall portion of the inverter housing 6 corresponding to the opening O. The inverter cover 7 has a disk shape and covers the inverter housing 6 that houses the components of the inverter 1 such as the capacitor 2, the cooler unit 3, and the control board 4. It can also be understood that the cooler unit 3 further includes the capacitor 2.

[0023] FIG. 3 is a front view of the second cooler 32. FIG. 4 is a view of the second cooler 32 as seen in the direction of arrow A shown in FIG. 3. FIG. 5 is a view showing the second cooler 32 in a cross section taken along line B-B shown in FIG. 3. The second cooler 32 has a plurality of arrangement portions 323 (arrangement portions 323a to 323f). A semiconductor module 5 is disposed in each of the arrangement portions 323. In FIG. 3, the semiconductor module 5 is brought into contact with the arrangement portion 323 from the back side of the paper. The second cooler 32 has beads 324 between adjacent arrangement portions 323. Each of the plurality of beads 324 (beads 324a to 324f) is provided in a groove shape along the radial direction. Each of the plurality of beads 324 is formed on the surface opposite to the heat transfer surface with the semiconductor module 5. Each of the plurality of beads 324 may be provided on the heat transfer surface with the semiconductor module 5. The beads 324 reduce the rigidity of the second cooler 32 between adjacent arrangement portions 323.

[0024] Therefore, in the second cooler 32, the stress increases in the placement portion 323 due to the biasing force from the leaf spring 33. As a result, even if there are height variations among the plurality of placement portions 323, a decrease in the adhesion between some of the semiconductor modules 5 and the heat transfer surface of the second cooler 32 is suppressed. Consequently, the cooling effect of the semiconductor module 5 is enhanced.

[0025] The second cooler 32 further has fins 325. The fins 325 are fixed in the second cooler 32 by, for example, brazing. By providing the fins 325 in the second cooler 32, the cooling effect of the semiconductor module 5 is enhanced. The fins 325 have a fin shape in which a plurality of flow paths F are arranged and the rigidity is lower in the extending direction of the flow paths F than in the arranging direction of the flow paths F. The flow paths F are formed in the concave portions and the convex portions respectively due to the concavo-convex shape of the fins 325. The fin shape is, for example, a shape in which a plurality of flow paths F are arranged radially. The fin shape may be a shape in which a plurality of flow paths F are arranged in a direction orthogonal to the extending direction of the flow paths F. The fins 325 are arranged spaced apart from the inner side wall and the outer side wall of the second cooler 32.

[0026] The fins 325 are arranged in the direction with lower rigidity indicated by the arrow C, that is, in the same direction as the arrangement direction of the concavo-convexities. The arrow C indicates the tangential direction of the second cooler 32 and corresponds to the direction in which the flatness of the heat transfer surface of the second cooler 32 is large. This is because the second cooler 32 is longer in the circumferential direction than in the radial direction, and the flatness of the heat transfer surface deteriorates more in the circumferential direction than in the radial direction. By arranging the fins 325 in this way, the heat transfer surface is likely to be in close contact with the semiconductor module 5. Also, since the fin shape is a regular shape in which a plurality of flow paths F are arranged, the mass productivity of the fins 325 is high.

[0027] The fins 325 are provided in the placement portions 323 and are not provided between adjacent placement portions 323. As a result, low-rigidity portions with lower rigidity than each of the placement portions 323 are formed between adjacent placement portions 323. Therefore, it is possible to prevent the adhesion from decreasing between some of the semiconductor modules 5 and the heat transfer surface of the second cooler 32, and the cooling effect of the semiconductor module 5 is enhanced.

[0028] The configuration part 323 corresponds to a predetermined position, and the bead 324 corresponds to a low-rigidity part. In the second cooler 32, a deformed structure is realized by the bead 324, and a deformed structure is formed by the fins 325. The first cooler 31 is also configured in the same manner as the second cooler 32. Thereby, the adhesion between the heat transfer surface of the first cooler 31 and the semiconductor module 5 is also enhanced. Only one of the first cooler 31 and the second cooler 32 may have a deformed structure. Even in this case, it corresponds to the cooler including the first cooler 31 and the second cooler 32 having a deformed structure.

[0029] Next, the main operational effects of the present embodiment will be described.

[0030] The inverter 1 includes a semiconductor module 5, first and second coolers 31 and 32 that come into contact with the semiconductor module 5 for cooling, and an inverter housing 6 that houses the semiconductor module 5 and the first cooler 31. The inverter 1 is provided with a cooler including the first cooler 31 and the second cooler 32. The first cooler 31, the semiconductor module 5, and the second cooler 32 are laminated in this order. The inverter 1 has a case 21 that abuts against the first cooler 31 and a leaf spring 33 that applies stress to the second cooler 32. The leaf spring 33 is arranged such that stress increases at a predetermined position where the first cooler 31, the second cooler 32, and the semiconductor module 5 come into contact, that is, the arrangement part 323, and the arrangement part of the semiconductor module 5 in the first cooler 31. According to such a configuration, the stress can be increased at a predetermined position. Therefore, it is not necessary to thicken the first cooler 31 or the second cooler 32, and it is possible to reduce the size while maintaining the contact pressure with the semiconductor module 5 to be cooled. Also, by maintaining the contact pressure in this way, it is not necessary to provide the leaf spring 33 on the case 21 side, which also contributes to reducing the size.

[0031] The second cooler 32 has a deformation structure in which the stress increases at the arrangement portion 323 due to the biasing force from the leaf spring 33. According to such a configuration, since it has a deformation structure in which the stress increases at the arrangement portion 323, it is possible to increase the stress at the portion where the stress is applied to the semiconductor module 5 by the biasing force from the leaf spring 33. Therefore, it is not necessary to thicken the second cooler 32, and it is possible to achieve miniaturization while maintaining the contact pressure with the semiconductor module 5. The same applies to the first cooler 31.

[0032] The deformation structure is configured to have low-rigidity portions that are less rigid than the respective arrangement portions 323 between adjacent arrangement portions 323. According to such a configuration, the second cooler 32 is likely to deform between adjacent arrangement portions 323. Therefore, even when there is a variation in height when sandwiching a plurality of semiconductor modules 5, the adhesion between the heat transfer surface of the second cooler 32 and the semiconductor module 5 can be enhanced, thereby reducing the thermal resistance. Also, since the clamping pressure can be set lower, miniaturization can be achieved by thinning the leaf spring 33. The same applies to the first cooler 31.

[0033] The deformation structure is configured such that fins 325 are provided on the arrangement portion 323 within the second cooler 32, while no fins 325 are provided between adjacent arrangement portions 323, thereby forming low-rigidity portions. According to such a configuration, it is possible to improve the adhesion between the heat transfer surface of the second cooler 32 and the semiconductor module 5 while reducing the flow path pressure loss of the refrigerant. The same applies to the first cooler 31.

[0034] The deformation structure is configured such that the rigidity is low in the direction in which the flatness of the heat transfer surface of the second cooler 32 is large at the arrangement portion 323. According to such a configuration, the arrangement portion 323 is likely to deform in the direction in which the flatness of the heat transfer surface is large, so that the adhesion between the heat transfer surface and the semiconductor module 5 can be enhanced, thereby reducing the thermal resistance. Also, since the clamping pressure can be set lower, miniaturization can be achieved by thinning the leaf spring 33. The same applies to the first cooler 31.

[0035] The cooler unit 3 of the inverter 1 arranges a plurality of flow paths F and further includes fins 325 having a fin shape with lower rigidity in the extending direction of the flow path F than in the arranging direction of the flow paths F. The deformation structure is configured such that the fins 325 are arranged in the second cooler 32 with the arranging direction of the flow paths F aligned with the direction in which the flatness of the heat transfer surface of the second cooler 32 is large. According to such a configuration, since the fins 325 are arranged with the direction of low rigidity aligned with the direction in which the flatness of the heat transfer surface is large, it is possible to easily bring the heat transfer surface into close contact with the semiconductor module 5. Also, since the fin shape is regular, the mass productivity of the fins 325 can be enhanced. The same applies to the first cooler 31.

[0036] The case 21 of the capacitor 2 has an elastic structure at the fixing portion 211 with the leaf spring 33. According to such a configuration, it is not necessary to provide an elastic member for clamping the semiconductor module 5 from the side of the first cooler 31, so that the cooler unit 3 can be made thinner.

[0037] (Second Embodiment) FIG. 6 is a diagram showing the cooler unit 3 together with the capacitor 2 in the present embodiment. FIG. 7 is a diagram showing the leaf spring 34 in the cross section taken along the line E-E shown in FIG. 6. FIG. 8 is a diagram showing the fixing portion 343 in the direction of the arrow E shown in FIG. 7. In FIG. 6, the semiconductor module 5 is shown in a simplified manner.

[0038] As shown in FIG. 6, the cooler unit 3 in the present embodiment is configured in the same manner as in the first embodiment, except that it includes a leaf spring 34 instead of the leaf spring 33. The leaf spring 34 has a clamping portion 341, a connecting portion 342, and a fixing portion 343. The clamping portion 341 is disposed on the second cooler 32. The clamping portion 341 is disposed so as to overlap with the semiconductor module 5 when viewed along the stacking direction. A plurality (six, from clamping portions 341a to 341f) of clamping portions 341 are provided corresponding to the plurality of semiconductor modules 5. The connecting portion 342 connects the adjacent clamping portions 341 to form a ring-shaped main body portion. The fixing portion 343 is bent so that the tip portion is disposed at the fixing portion 211 of the case 21 while being continuous with the connecting portion 342. A plurality (six, from connecting portions 342a to 342f and six, from fixing portions 343a to 343f) of both the connecting portion 342 and the fixing portion 343 are provided. The leaf spring 34 constitutes a single elastic member common to the plurality of semiconductor modules 5. According to such a configuration, it is not necessary to provide a plurality of elastic members, so that the assembling workability can be improved.

[0039] As shown in FIG. 7, the leaf spring 34 has a structure in which a ring-shaped main body portion including the clamping portion 341 and the connecting portion 342 is recessed on the second cooler 32 side by the clamping portion 341. Thereby, even when the leaf spring 34 common to the plurality of semiconductor modules 5 is used, a clamping force can be appropriately applied to the plurality of semiconductor modules 5. As shown in FIG. 8, a convex bending portion G is provided on the fixing portion 343. In other words, the leaf spring 34 has a bending portion G on the fixing portion 343, and the bending portion G corresponds to an elastic structure. According to such a configuration, compared with the case of adjusting the thickness of the leaf spring 34, the clamping force is easier to adjust.

[0040] As described above, the embodiments of the present invention have been described. However, the above embodiments merely show a part of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

[0041] For example, in the above-described embodiment, the case where the cooler unit 3 of the inverter 1 has the first cooler 31 and the second cooler 32 has been described. However, the inverter 1 may be configured to have only one of the first cooler 31 and the second cooler 32. When the inverter 1 has only the first cooler 31 among the first cooler 31 and the second cooler 32, the case 21 abuts against the first cooler 31, and the leaf spring 33 is configured to apply stress to the semiconductor module 5. When the inverter 1 has only the second cooler 32 among the first cooler 31 and the second cooler 32, the case 21 abuts against the semiconductor module 5, and the leaf spring 33 is configured to apply stress to the second cooler 32. Even in these cases, since the stress can be increased at a predetermined location by the biasing force from the leaf spring 33, it is possible to achieve miniaturization while maintaining the contact pressure with the semiconductor module 5 to be cooled. Also, it is not necessary to provide the leaf spring 33 on the case 21 side, which also contributes to miniaturization.

[0042] In the above-described embodiment, the case where the inverter 1 is an electrical device has been described. However, the electrical device may be a device other than the inverter 1 as long as it has an electronic device, a cooler that contacts and cools the electronic device, and a housing that houses the electronic device and the cooler.

Explanation of Reference Numerals

[0043] 1 Inverter (electrical device) 2 Capacitor 21 Case (contact member) 211 Fixing portion 3 Cooler unit 5 Semiconductor module (electronic device) 6 Inverter housing (housing) 10 Motor 31 First cooler (cooler) 32 Second cooler (cooler) 323 Arrangement portion 325 Fin 33 Leaf spring (elastic member) 34 Leaf spring (single elastic member) 343 fixing part

Claims

1. An electrical device having an electronic device, a cooler that contacts and cools the electronic device, and a housing that houses the electronic device and the cooler, a contact member that contacts either the electronic device or the cooler, and an elastic member that applies stress to either the electronic device or the cooler that does not contact the contact member, characterized in that the elastic member is arranged such that the stress becomes large at a predetermined location where the cooler and the electronic device are in contact, and is fixed to the contact member, the contact member has an elastic structure at a fixing portion with the elastic member, which is an electrical device.

2. The electrical device according to claim 1, characterized in that the cooler has a deformation structure in which stress becomes large at the predetermined location due to a biasing force from the elastic member. which is an electrical device.

3. The electrical device according to claim 2, characterized in that the predetermined locations are respectively the arrangement portions of a plurality of the electronic devices, and the deformation structure is a structure having low-rigidity portions that are less rigid than the respective arrangement portions between adjacent arrangement portions. which is an electrical device.

4. The electrical device according to claim 3, characterized in that the deformation structure is a structure in which fins are provided at the arrangement portions in the cooler, while the fins are not provided between adjacent arrangement portions, thereby forming the low-rigidity portions. which is an electrical device.

5. The electrical device according to claim 2, characterized in that the predetermined location is the arrangement portion of the electronic device, and the deformation structure is a structure having low rigidity in a direction in which the flatness indicating the degree of deterioration of the flatness of the heat transfer surface of the cooler is large in the arrangement portion. which is an electrical device.

6. The electrical device according to claim 5, characterized in that a plurality of flow paths are arranged, and further provided with fins having a fin shape that is less rigid in the arrangement direction of the flow paths than in the extending direction of the flow paths, and the deformation structure is a structure in which the fins are arranged in the cooler in alignment with the arrangement direction of the flow paths in a direction in which the flatness indicating the degree of deterioration of the flatness of the heat transfer surface of the cooler is large. which is an electrical device.

7. The electrical device according to claim 1, characterized in that the elastic member is a single elastic member common to a plurality of the electronic devices. which is an electrical device.

8. The electrical device according to claim 1, characterized in that the elastic member has an elastic structure at a fixing portion. which is an electrical device.

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