Card Cage System for Hybrid Cooling of Computer Circuit Cards

Abstract

Disclosed herein is a computer circuit card cage system configured to house one or more computer circuit cards. The computer circuit card cage system may include a housing including one or more walls having one or more openings formed therein. The computer circuit card cage system may further include one or more support rails supported by the one or more walls and configured to support the computer circuit cards. The one or more support rails may have one or more openings formed therein to facilitate the flow of fluid through the one or more support rails. The fluid flow path is through one or more openings in the wall of the housing and one or more openings in the support rail.

Description

Background Art

[0001] Computer circuit cards and expansion cards are widely popular in modern society and are used in the operation of computer systems in a variety of computing applications. Computer circuit cards with high power density tend to operate at high temperatures and are difficult to cool. Bulky and large liquid cooling systems are often mounted in a card cage that holds the cards to provide adequate cooling for the computer circuit cards. However, computer circuit cards and card cages are often used in systems where only a small space can be used for mounting the computer circuit cards and card cages. Therefore, in a system with space constraints, there is not enough room to accommodate a large liquid cooling system, so a large liquid cooling system cannot be used to cool the computer circuit cards. In many cases, only one mode of heat transfer / cooling (e.g., conduction support rails or forced air cooling) is utilized within the card cage to cool the computer circuit cards within a computer system with space constraints. Additional heat transfer and / or cooling operations or systems are often required to properly cool the computer cards. Therefore, improvements and innovations in cooling systems for cooling computer cards in systems with limited space continue to be developed to ensure proper operating temperatures and predictable desired operations of the computer circuit cards.

[0002] The features and advantages of the present invention will become apparent from the following detailed description in conjunction with the accompanying drawings, which illustrate the features of the present invention by way of example.

Brief Description of the Drawings

[0003]

Figure 1

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Figure 2b

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[0004] Next, with reference to the exemplary and typical embodiments illustrated, specific language is used herein to describe them. Nevertheless, it should be understood that the scope of the present invention is not thereby intended to be limited.

Mode for Carrying Out the Invention

[0005] As used herein, the term "substantially" refers to the complete or nearly complete scope or degree of an action, characteristic, property, state, structure, item, or result. For example, an object that is "substantially" enclosed means that the object is either completely enclosed or nearly completely enclosed. The exact allowable degree of deviation from absolute completeness may, in some cases, depend on the particular circumstances. However, generally speaking, as it approaches completion, the same overall result is obtained as if absolute and complete completion had been achieved. The use of "substantially" is equally applicable when used in a negative sense to refer to a complete or nearly complete absence of an action, characteristic, property, state, structure, item, or result.

[0006] As used herein, "adjacent" refers to two structures or elements being in close proximity. In particular, an element identified as "adjacent" may be in contact or connected. Such elements may be close or near to each other without necessarily touching. The exact degree of proximity may, in some cases, depend on the particular circumstances.

[0007] The first general idea of the present invention is shown below, and then specific examples will be described in more detail. This initial overview is intended to help the reader understand the examples more quickly, but it is not intended to identify important or essential features of the examples, nor is it intended to limit the scope of the subject matter recited in the claims.

[0008] This specification discloses a computer circuit card cage system configured to house one or more computer circuit cards. The computer circuit card cage system can include a housing including one or more walls having one or more openings formed therein. The card cage system can further include one or more support rails supported by one or more of the one or more walls. The support rails can each be configured to support a computer circuit card. The one or more support rails can have one or more openings formed therein to facilitate the flow of fluid therethrough. The fluid flow path can pass through the one or more openings of the housing walls and the one or more openings of the support rails.

[0009] This specification further discloses a method of configuring a computer circuit card cage system configured to house one or more computer circuit cards. The method can include configuring the card cage system to include a housing including one or more walls having one or more openings formed therein. The method can further include configuring the card cage system to include one or more support rails supported by one or more of the one or more walls and configured to support a computer circuit card. The method can further include configuring the one or more support rails to have one or more openings formed therein to facilitate the flow of fluid therethrough. The fluid flow path can pass through the one or more openings of the housing walls and the one or more openings of the support rails.

[0010] To further illustrate the present technology, examples will be shown below with reference to the drawings. Referring to FIG. 1, a card cage system 100 according to an example of the present disclosure is shown. The card cage system 100 can be configured to accommodate one or more computer circuit cards. As shown in the figure, the card cage can include a housing 101 including a plurality of walls. For example, the housing 101 of the card cage system 100 can include a first side wall 102 and a second side wall 104 disposed opposite and parallel to the first side wall 102. The rear wall 106 can abut against the first side wall 102 and the second side wall 104 at the rear of the card cage system 100. Further, the upper wall 108 can abut against the first side wall 102, the second side wall 104, and the rear wall 106 at the upper part of the card cage system 100. The bottom wall 110 can abut against the first side wall 102, the second side wall 104, and the rear wall 106 at the bottom of the card cage system 100.

[0011] The first side wall 102, the second side wall 104, the rear wall 106, the upper wall 108, and the bottom wall 110 of the card cage system 100 can together form and define a circuit card storage cavity 112 configured to receive and hold one or more computer circuit cards (see, for example, computer circuit cards 114a, 114b, 114c, and 114d). The card cage system 100 can include a plurality of support rails that each contact and support one or more of the computer circuit cards 114a, 114b, 114c, and 114d.

[0012] In addition, as shown in FIG. 1, the card cage system 100 can further include an opening cover 116 that covers one of the side walls of the card cage system 100 (e.g., the second side wall 104 shown in the figure). The fan 118 can be attached to and supported by the opening cover 116. As will be described in more detail below, the fan 118 can operate to push a cooling fluid (e.g., ambient air or other gas) through the card cage system 100. The term "air" is used within this disclosure, but this disclosure is not intended to be limited in any way to this particular type of fluid. In fact, the cooling fluid can include any known fluid for cooling or heating that can be used within the card cage system 100.

[0013] Further details of the card cage system 100 are shown and described with reference to FIGS. 2a and 2b. FIGS. 2a and 2b show the card cage system 100 with the upper wall 108 and the circuit cards 114a, 114b, 114c, and 114d removed to more clearly show the internal configuration of the card cage system 100.

[0014] FIG. 2a shows an isometric view of the card cage system 100 as seen with the second side wall 104 closest to the observer. As shown in FIG. 2a, the first side wall 102 can include a plurality of support rails 120a, 120b, 120c, and 120d supported on the inside 103a of the first side wall 102. Each of the support rails 120a, 120b, 120c, and 120d can include a support surface 121a, 121b, 121c, and 121d for one of the computer circuit cards 114a, 114b, 114c, and 114d. The computer circuit cards 114a, 114b, 114c, and 114d can be configured to contact and interface with the respective support surfaces 121a, 121b, 121c, and 121d of the support rails 120a, 120b, 120c, and 120d.

[0015] Each of the support rails 120a, 120b, 120c, and 120d can be made entirely or partially of a thermally conductive material or coated with a thermally conductive material. The thermally conductive material can facilitate the conduction of heat generated by the computer circuit cards 114a, 114b, 114c, and 114d away from the computer circuit cards through the thermally conductive support rails, allowing the heat to dissipate into the surrounding environment to cool the computer circuit cards 114a, 114b, 114c, and 114d.

[0016] FIG. 2b shows an isometric view of the card cage system 100 as seen with the first side wall 102 closest to the observer. As shown in FIGS. 1 and 2a, the second side wall 104 can include a plurality of support rails 122a, 122b, 122c, and 122d supported on the inner side 105a of the second side wall 104. Each of the support rails 122a, 122b, 122c, and 122d can include a support surface 123a, 123b, 123c, and 123d for one of the computer circuit cards 114a, 114b, 114c, and 114d. The computer circuit cards 114a, 114b, 114c, and 114d can be configured to contact and interface with the respective support surfaces 123a, 123b, 123c, and 123d of the support rails 122a, 122b, 122c, and 122d.

[0017] Each of the support rails 122a, 122b, 122c, and 122d can be made entirely or partially of a thermally conductive material or coated with a thermally conductive material. Examples of materials include, but are not limited to, aluminum, copper, graphite, thermally conductive ceramics, and others that will be apparent to those skilled in the art. Examples of coatings can include, but are not limited to, thermal grease, paste, gel, graphite, graphite pads, phase change materials, and others that will be apparent to those skilled in the art. The thermally conductive material can facilitate the transfer of heat generated by the computer circuit cards 114a, 114b, 114c, and 114d away from the computer circuit cards and allow the heat to dissipate into the surrounding environment to cool the computer circuit cards 114a, 114b, 114c, and 114d.

[0018] FIG. 3 shows a front view of the card cage system 100 with the computer circuit cards 114a, 114b, 114c, and 114d removed. The second side wall 104 and the first side wall 102 are in opposing positions relative to each other. The first side wall 102 and the second side wall 104 at least partially define a circuit card storage cavity 112 between the first side wall 102 and the second side wall 104. The circuit card storage cavity 112 is configured to store one or more computer circuit cards on the support surfaces of the support rails.

[0019] As shown, the first side wall 102 includes first support rails 120a, 120b, 120c, and 120d respectively disposed at spaced-apart positions from each other. The second side wall 104 includes second support rails 122a, 122b, 122c, and 122d respectively disposed at spaced-apart positions that are substantially the same as the first support rails. In other words, the support rail 120a is located substantially in the same plane as the support rail 122a such that the support surface 121a and the support surface 123a are in the same plane to support the computer circuit card.

[0020] The support surfaces 121a and 123a of the support rails 120a on the first side wall 102, and correspondingly, the support rails 122a disposed on the second side wall 104, at least partially define a first circuit card slot 124a within the circuit card storage cavity 112 of the card cage system 100. Similarly, the support surfaces 121b and 123b of the support rails 120b, and correspondingly, the support rails 122b disposed correspondingly, at least partially define a second circuit card slot 124b. The support surfaces 121c and 123c of the support rails 120c, and correspondingly, the support rails 122c disposed correspondingly, at least partially define a third circuit card slot 124c. Similarly, the support surfaces 121d and 123d of the support rails 120d, and correspondingly, the support rails 122d disposed correspondingly, at least partially define a fourth circuit card slot 124d. Each of the card slots 124a, 124b, 124c, and 124d is configured to receive a computer circuit card therein and support the computer circuit card on the support surface of each card slot (see, for example, FIG. 1).

[0021] FIG. 4a shows a side view of the first side wall 102 of the card cage system 100, showing the outer side 103b of the first side wall 102. A plurality of openings 125 (including, for example, openings 125a, 125b, and 125c) can be formed in the first side wall 102. As shown according to an example, three rows of openings 125 can be formed within the first side wall 102, including the first opening 125a, the second opening 125b, and the third opening 125c.

[0022] In addition, the fins 119 can be formed or supported on the first sidewall 102, and each fin 122 can be disposed between the openings 125 formed through the first sidewall 102. The fins 119 can assist in heat transfer. The fins 119 are extensions on the outer surface of the first sidewall 102 of the card cage system 100. Fins such as the fins 119 increase the heat conductivity to or from the card cage system 100 by increasing the convection between the surrounding environment and the first sidewall 102. Convection is increased by increasing the surface area of the first sidewall 102, which in turn increases the heat transfer rate and helps to cool the computer circuit cards 114 housed within the card cage system 100.

[0023] FIG. 4b shows a cross-sectional view of the card cage system 100 along line AA shown in FIG. 3. The support rails 120a, 120b, 120c, and 120d are shown supported on the inner side 103a of the first sidewall 102. The support rails 120a, 120b, 120c, and 120d “supported” on the first sidewall 102 can include support rails 120a, 120b, 120c, and 120d integrally formed with the first sidewall 102, and can further include support rails 120a, 120b, 120c, and 120d formed separately from and attached to the first sidewall 102.

[0024] As shown in FIG. 4b, the openings 126a, 126b, and 126c can be formed through the respective support rails 120a, 120b, and 120c. The openings 125a, 125b, 125c within the first side wall 102 can extend through the entire thickness from the outer side 103b of the first side wall 102 and out through the inner side 103a. The openings 126a, 126b, and 126c can extend through the entire thickness of the support rails 120a, 120b, and 120c. The openings 125a, 125b, and 125c of the first side wall 102 can be substantially aligned with the openings 126a, 126b, and 126c of the support rails 120a, 120b, and 120c to provide a fluid flow path for a cooling fluid (e.g., ambient air or other gaseous fluid) through the first side wall 102 and the support rails 120a, 120b, and 120c.

[0025] Figures 5a, 5b, and 6 show various views of the second side wall 104. Figure 5a shows a side view of the card cage system 100, showing the second side wall 104 as viewed from the outside of the card cage system 100. Figure 5a shows the outside 105b of the second side wall 104. The second side wall 104 can support a forced air system 115 configured to push a cooling fluid (e.g., air) through one or more of the openings 125 and 126 of the first side wall 102 and the second side wall 104. The forced air system 115 can include an opening cover 116 supported on the second side wall 104 in a position surrounding and covering a plurality of openings 128 (see Figure 5b) formed within the second side wall 104. The forced air system 115 can further include a fan 118 supported on the cover 116 and configured to operate to push the fluid flowing through each of the openings 128 through either blowing or suction of the fluid through the openings 128. The cover 116 and the openings 128 can together function as a fan manifold that defines one or more air channels through which the fluid pushed by the fan flows. The air channels of the manifold can include the air channels of the openings 128 and an air chamber 130 defined by the cover 116 and through which the fluid flows due to the operation of the fan 118. Additionally, the fan manifold may be modified to include individual channels formed within the cover 116, or tubes and passages from the openings 128 to the fan 118.

[0026] Figure 5b shows a side view of the second side wall 104 of the card cage system 100, showing the outside 105b of the second side wall 104 with the cover 116 and the fan 118 removed. A plurality of openings 127 (including openings 127a, 127b, and 127c) can be formed within the second side wall 104. As shown according to one example, three rows of openings 127 can be formed within the second side wall 104 including a first opening 127a, a second opening 127b, and a third opening 127c.

[0027] FIG. 6 shows a cross-sectional view of the card cage system 100 along line BB shown in FIG. 3. Support rails 122a, 122b, 122c, and 122d are shown supported on the inner side 105a of the second side wall 104. The support rails 122a, 122b, 122c, and 122d “supported” on the second side wall 104 can include support rails 122a, 122b, 122c, and 122d formed integrally with the second side wall 104, and can further include support rails 122a, 122b, 122c, and 122d formed separately from and attached to the second side wall 104.

[0028] As shown in FIG. 6, openings 128a, 128b, and 128c can be formed through respective ones of support rails 122a, 122b, and 122c. Openings 127a, 127b, 127c within the second side wall 104 can extend through the entire thickness from the outer side 105b of the second side wall 104 and out through the inner side 105a. The openings 128a, 128b, and 128c of the support rails can extend through the entire thickness of support rails 122a, 122b, and 122c. The openings 127a, 127b, and 127c of the second side wall 104 can be substantially aligned with the openings 128a, 128b, and 128c of support rails 120a, 120b, and 120c to provide a fluid flow path for a cooling fluid (e.g., ambient air or other gaseous fluid) through the first side wall 102 and support rails 120a, 120b, and 120c.

[0029] As shown in FIGS. 4b and 6, the openings need not necessarily be formed in all of the support rails. The openings can be formed in one or more of the support rails within the card cage system 100, up to and including all of the support rails. Further, it should be understood that the support rails described herein may be formed integrally with the sidewalls or created separately from the sidewalls and then attached to the sidewalls. In a configuration where the support rails are formed integrally with the sidewalls, each opening may be a single opening formed through both the sidewalls and the support rails. In another configuration, where the support rails are formed separately from the sidewalls and then attached to the sidewalls, separate openings may be formed in the sidewalls and the support rails. The support rails may be attached to the sidewalls such that the openings in the sidewalls are substantially aligned with the openings in the support rails to form a fluid flow path through the sidewalls and the support rails.

[0030] For clarity, in FIGS. 4a, 4b, 5b, and 6, not all of the openings are individually identified, and as shown, openings 125 and 126 are disposed over a majority of the length of support rails 120a, 120b, 120c, 122a, 122b, and 122c. Openings 125 and 126 can be formed through the entire thickness of first sidewall 102 and second sidewall 104, respectively, such that the openings are accessible from both sides of the first sidewall 102 and the second sidewall 104. Thus, a fluid such as any gas or ambient air can pass through the first sidewall 102 along a fluid flow path through opening 125 in the first sidewall 102. A fluid such as any gas or ambient air can further pass through the second sidewall 104 along a fluid flow path through opening 126 in the second sidewall 104. Further, FIGS. 4a through 6 show that openings 125 and 126 have an oval shape as formed in the support rails and the sidewalls. However, the shape of the openings is not intended to be limiting in any way according to the present disclosure. Openings of any shape can be used.

[0031] Figure 7 shows a front view of the card cage system 100 in which computer circuit cards 114a, 114b, 114c, and 114d are supported within the card cage system 100. The computer circuit card 114a is supported at least on the support surface 121a of the support rail 120a, the computer circuit card 114b is supported at least on the support surface 121b of the support rail 120b, the computer circuit card 114c is supported at least on the support surface 121c of the support rail 120c, and the computer circuit card 114d is supported at least on the support surface 121d of the support rail 120d.

[0032] Each of the computer circuit cards 114a, 114b, 114c, and 114d can physically contact their respective support surfaces 121a, 121b, 121c, and 121d. With each computer circuit card in contact with the thermally conductive support rail, heat generated by each computer circuit card during operation can be conducted away from the computer circuit card, facilitating the cooling of the computer circuit card.

[0033] Figure 8 shows an enlarged view of section C of Figure 7. Figure 8 shows the flow of heat H by conduction through the computer circuit card 114a to the thermally conductive support rail 120a, to the first side wall 102, and finally out to the surrounding environment. The other computer circuit cards 114b, 114c, and 114d are cooled in a manner similar to that shown in Figure 8.

[0034] In conduction, heat H is transferred from a first temperature location to a second temperature location. For conduction to occur, there must be a temperature difference between the two locations. The transfer of heat H continues as long as there is a difference in temperature (i.e., a temperature difference) between the two places, but when the two places reach the same temperature, thermal equilibrium is established and heat transfer stops. As is known to those skilled in the art, conduction flows heat H from a location of higher temperature to a location of lower temperature. In the example shown in FIG. 8, the computer circuit card 114a has a temperature of T1, the support rail 120a of the first side wall 102 has a temperature of T2, and the surrounding environment has a temperature of T3. For heat H to flow from the computer circuit card 114a to the surrounding environment, it is assumed that T1 is higher than T2 and T2 is higher than T3.

[0035] Due to the difference in temperature, the heat H generated by the operation of the computer circuit card 114a flows to the environment through the support rail 120a and the first side wall 102. The greater the difference between the temperatures T1, T2 and / or T3, the more the flow of heat H departs from the computer circuit card 114a. That is, the greater the temperature difference, the higher the thermal conductivity. As long as the support rail 120a is at a lower temperature T2 than the computer circuit card 114a, heat transfer continues.

[0036] The card cage system 100 is configured to provide hybrid cooling of the computer circuit cards 114a, 114b, 114c and 114d in accordance with an example of the present disclosure. In addition to the conduction cooling of the computer circuit cards 114a, 114b, 114c and 114d shown in FIG. 8, the card cage system 100 provides convective cooling of the computer circuit cards 114a, 114b, 114c and 114d, as well as convective cooling of the side walls 102, 104 and the support rails 120a, 120b, 120c, 120d, 122a, 122b, 122c and 122d by the flow of cooling air through the openings 125a, 125b, 125c, 125d, 126a, 126b, 126c, 126d, 127a, 127b, 127c, 127d, 128a, 128b, 128c and 128d.

[0037] Figure 9 shows the convective cooling of the computer circuit cards, side walls, and support rails of the card cage system 100. As shown in Figure 9, the computer circuit cards 114a, 114b, 114c, and 114d can be cooled by a fluid flow F that enters the card cage system 100 through openings formed in one or more of the side walls and support rails. When the fluid flow F enters through the openings in the first side wall 102 and the support rails 120a, 120b, 120c, and 120d, the fluid flow F draws heat H1 from the first side wall 102 (including the support rails 120a, 120b, 120c, and 120d supported on the first side wall 102) and convectively cools the first side wall 102 and the support rails 120a, 120b, 120c, and 120d. The fan 118, according to at least one example, can displace the fluid flow F so that it enters the card cage system 100 through the opening in the first side wall 102 by the operation of the fan 118.

[0038] The openings in the first side wall 102 are in fluid communication with the openings in the second side wall 104, and the fluid flow F continues to flow through the cavity 112 between the side walls from the first side wall 102 to the second side wall 104 through the card cage system 100. When the fluid flow F moves from the first side wall 102 to the second side wall 114, the fluid flow F draws heat H2, H3, H4, and H5 from each of the computer circuit cards 114a, 114b, 114c, and 114d and convectively cools the cards. The fluid flow F then exits through the second side wall 104 through the openings 127a, 127b, 127c, 127d, 128a, 128b, 128c, and 128d formed in the support rails 122a, 122b, 122c, and 122d and the second side wall 104, draws heat H6 from the second side wall 104 and the support rails 122a, 122b, 122c, and 122d, and convectively cools the second side wall 104 and the support rails 122a, 122b, 122c, and 122d. The fluid flow F then enters an air chamber 130 (shown by the dashed line) defined by the cover 116 and is finally discharged to the ambient environment by the fan 118.

[0039] Embodiments of the present disclosure provide many advantages and beneficial effects that exceed the current state of the art. Embodiments of the present disclosure provide both convective and conductive cooling of computer circuit cards 114a, 114b, 114c, and 114d in a small, constrained space without the need for an additional large and bulky liquid cooling system. Using both conductive and convective cooling cools computer circuit cards 114a, 114b, 114c, and 114d more efficiently and rapidly than using only one of conductive or convective cooling.

[0040] Furthermore, the openings formed in each of the support rails allow cooling fluid to flow through the support rails, thereby convectively cooling the support rails. By convectively cooling the support rails, the ability of the support rails to conduct heat away from the computer circuit cards is increased. As the temperature difference increases, the thermal conductivity increases. The conductive heat transfer rate increases as the temperature difference between two locations at different temperatures increases. By convectively cooling the support rails, the temperature of the support rails is reduced compared to the computer circuit cards, thus increasing the thermal conductivity and increasing the amount of heat withdrawn from the computer circuit cards. Thus, providing convective cooling to the support rails improves the cooling of the computer circuit cards by the following: 1) Conductively cooling the computer circuit cards through the support rails. 2) Convectively cooling the computer circuit cards. 3) Improving the conductive cooling of the computer circuit cards by convectively cooling the support rails that facilitate the conductive cooling of the computer circuit cards. Thereby, the heat transfer and overall cooling of the computer circuit cards are improved by the examples described herein.

[0041] The examples described in this specification mainly target the cooling of elements within a card cage system. However, the principles described in this specification can also be applied to a system for heating specific elements that need to be heated. Further, the examples described in this specification place a fan on a side wall adjacent to an opening of the card cage system. However, the fan (or fans) can be placed on any other wall of the card cage system, as well as the top wall, bottom wall, front wall, or rear wall or other walls. Therefore, the fan is not limited to being placed on the wall having the opening.

[0042] Reference has been made to the examples illustrated in the drawings and specific language has been used herein to describe them. However, it should be understood that it is not intended thereby to limit the scope of the technology. Modifications and further changes to the features illustrated herein, as well as further applications of the examples illustrated herein, should be considered to be within the scope of the description.

[0043] In this disclosure, although some embodiments or features described herein may not be explicitly disclosed as being combinable with other embodiments or features described herein, this disclosure should be read to explain any such combination that is executable by those skilled in the art. It should be understood that the use of "or" in this disclosure means non-exclusive or, i.e., "and / or", unless otherwise specified herein.

[0044] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more examples. In the foregoing description, many specific details such as examples of various configurations have been provided to obtain a thorough understanding of the examples of the described technology. However, it is understood that this technology can be implemented without using one or more of the specific details or using other methods, components, devices, etc. In other cases, well-known structures or operations have not been illustrated or described in detail to avoid obscuring aspects of this technology.

[0045] Although the subject matter has been described in language specific to structural features and / or acts, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features and acts described above. Rather, the specific features and acts described above are disclosed as example embodiments of carrying out the claims. Without departing from the spirit and scope of the described technology, many modifications and alternative arrangements may be devised.

Claims

1. A computer circuit card cage system configured to accommodate one or more computer circuit cards, comprising: a housing including a plurality of walls having one or more openings formed therein; a plurality of support rails supported by one or more of the walls and configured to support computer circuit cards, the plurality of support rails having one or more openings formed therein to facilitate the flow of fluid therethrough; the fluid flow path passing through the one or more openings in the walls of the housing and the one or more openings in the support rails; a first support rail of the plurality of support rails being supported by a first wall of the plurality of walls of the housing, a second support rail corresponding to the first support rail being supported by a second wall of the plurality of walls of the housing, the second wall being disposed on the opposite side of the first wall, the first and second support rails being operable to support the computer circuit cards; the one or more openings formed through the first support rail and the one or more openings formed through the first wall being in fluid communication with the one or more openings formed through the second support rail and the one or more openings formed through the second wall to facilitate the flow of fluid through the computer circuit card cage system between the first wall and the second wall, the plurality of support rails; a forced air system supported by the second wall and configured to push the fluid flow through the computer circuit card cage system and through the first wall and the second wall into the surrounding environment. A computer circuit card cage system.

2. The computer circuit card cage system according to claim 1, wherein the support rails are made of a thermally conductive material.

3. The computer circuit card cage system according to claim 1, further comprising one or more fins supported by the plurality of walls adjacent to the one or more openings formed in the plurality of walls of the housing.

4. The computer circuit card cage system according to claim 1, wherein the first wall and the second wall at least partially define a computer circuit card storage cavity between the first wall and the second wall, and the computer circuit card storage cavity is configured to store one or more computer circuit cards.

5. The computer circuit card cage system according to claim 1, wherein the support rails are supported at spaced positions within the computer circuit card cage system.

6.

7. The computer circuit card cage system according to claim 5, wherein at least a portion of the support rails includes a plurality of openings formed therein to facilitate the flow of fluid therethrough.

7.

8. The forced air system includes a fan, a fan manifold operable with the fan and including one or more air channels operable to direct the fluid through the one or more openings of the support rails, and a cover operable to cover the one or more air channels of the fan manifold. The computer circuit card cage system according to claim 1.

9.

10. A method of constructing a computer circuit card cage system configured to accommodate one or more computer circuit cards, the method comprising: constructing the computer circuit card cage system to include a housing including a plurality of walls having one or more openings formed therein; constructing the computer circuit card cage system to include a plurality of support rails supported by one or more of the walls and configured to support computer circuit cards, the plurality of support rails having one or more openings formed therein to facilitate the flow of fluid therethrough; providing that the fluid flow path passes through the one or more openings of the walls of the housing and the one or more openings of the support rails; configuring a first support rail of the plurality of support rails to be supported by a first wall of the plurality of walls of the housing. To configure a second support rail corresponding to the first support rail to be supported by a second wall among the plurality of walls of the housing, the second wall being disposed on the opposite side of the first wall, and the first and second support rails being configured to be operable to support the computer circuit card, That the one or more openings formed through the first support rail and the one or more openings formed through the first wall are in fluid communication with the one or more openings formed through the second support rail and the one or more openings formed through the second wall to facilitate the flow of fluid through the computer circuit card cage system between the first wall and the second wall, That the computer circuit card cage system is supported by the second wall and includes a forced air system configured to push the flow of the fluid through the computer circuit card cage system and through the first wall and the second wall into the ambient environment, Method. The method according to claim 8, wherein the support rails are supported at spaced positions within the computer circuit card cage system.

10. The method according to claim 9, further comprising configuring at least a portion of the support rail to include a plurality of openings formed therein to facilitate the flow of the fluid therethrough.

11. Configuring the forced air system, A fan, A fan manifold operable with the fan and having one or more air channels configured to direct the fluid through the one or more openings of the support rail, The method according to claim 8, further comprising configuring the forced air system to include a cover operable to cover the one or more air channels of the fan manifold. The method according to claim 8.

12. The method according to claim 8, further comprising configuring the computer circuit card cage system to include one or more fins supported by the wall adjacent to the one or more openings.

Images