Cooling system

The cooling system addresses the challenges of increasing heat generation density in electronic devices by using a refrigerant tank, heat pipes, and a blower fan to enhance cooling efficiency and energy savings, while maintaining high heat removal ability and ensuring high maintainability.

JP7689857B2Active Publication Date: 2025-06-09MITSUBISHI HEAVY IND LTD
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Patent Information

Application Number
JP2021062776
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-04-01
Publication Date
2025-06-09
Estimated Expiration
2041-04-01

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Abstract

To provide a cooling system capable of improving cooling efficiency.SOLUTION: A cooling system comprises: a refrigerant tank that houses a refrigerant for removing heat from a heating element inside a closed space; a plurality of heat pipes arranged so as to extend from the refrigerant tank to the outside of the refrigerant tank, and each having a passage formed therein through which a refrigerant as a working fluid can move; and a blower fan that blows air to the plurality of heat pipes outside the refrigerant tank in a direction in which the heat pipes are arranged. A cross-sectional shape orthogonal to an extension direction of each heat pipe has a flat shape with a ventilation direction as a longitudinal direction, an upstream side of the ventilation direction as a front edge, and the downstream side as a rear edge.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • JP1981101695U

  • Multifrequency signal receiver

    JP1982097758A

  • Evaporator

    JP1985263064A

  • Electrically insulated heat pipe

    JP1991064950A

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    JP1994021279A