Soldering method

Abstract

To provide a soldering method capable of secure soldering without any risk of depression of winding toward the root of a pin terminal by an iron tip when the iron tip having a solder hole penetrating in an axial direction in which a solder piece is supplied is used to solder the pin terminal and the winding around the pin terminal together.SOLUTION: An iron tip 5a has an opening part 52 which has a predetermined length L from a downstream end of the iron tip 5a in a supply direction of a solder piece Wh to an upstream side in the supply direction of the solder piece Wh and a width equal to or larger than an internal diameter d of a solder hole 51, and also reaches an inner peripheral surface of the solder hole 51 from an outer peripheral surface of the iron tip 5a, at least one of a pin terminal P and the iron tip 5a moves substantially perpendicularly to the axial direction of the pin terminal P to pass through the opening part 52 of the pin terminal to be inserted into the solder hole 51 of the iron tip 5a, and then the solder piece Wh is supplied into the solder hole 51 and then fused with the heated iron tip 5a to solder the pin terminal P and winding 83 together.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a soldering method, and more particularly to a method for soldering a pin terminal protruding outward from a component body of an electronic component and a winding wire wound around the pin terminal.

Background Art

[0002] Soldering of a pin terminal protruding outward from a component body of an electronic component and a winding wire wound around the pin terminal has generally been performed by immersing the tip of the pin terminal downward to near the root of the pin terminal in a solder bath after the winding wire is wound around the pin terminal (for example, Patent Document 1). At this time, in order to ensure and strengthen the soldering between the pin terminal and the winding wire, generally, it has been necessary to immerse the pin terminal in the solder bath a plurality of times. Further, in such immersion of the pin terminal in the solder bath, Patent Document 2 has proposed a technique of making the soldering more reliable and strong by widening the winding interval of the winding wire around the pin terminal.

[0003] In such a conventional soldering operation of immersing in a solder bath a plurality of times, there has been a limit to the improvement of productivity.

[0004] Therefore, for example, Patent Document 3 has proposed soldering a pin terminal and a winding wire using a heatable soldering tip having a substantially cylindrical shape and a soldering hole penetrating in the axial direction in which a solder piece is supplied.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] When soldering is performed using the substantially cylindrical tip of the above-mentioned proposal, as shown in FIG. 9, the tip 5b is separated from the pin terminal P by a predetermined distance in the vertical direction, and the central axes C 1 and the central axis C 2 After relative movement so as to be substantially on the same straight line, the tip 5b moves relative to the pin terminal P in a direction approaching it (shown by a broken line in FIG. 9), and the pin terminal P around which the winding 83 is wound is inserted into the solder hole 51 of the tip 5b.

[0007] However, when the central axis C 1 of the tip 5b and the central axis C 2 of the pin terminal P are not substantially on the same straight line and are displaced, as shown in FIG. 10, the lower surface opening periphery of the solder hole 51 of the tip 5b and the winding 83 come into contact with each other, and the winding 83 may be pushed downward in the direction of the root of the pin terminal P by the relative movement of the tip 5b, resulting in a shorter winding interval of the winding 83. When the winding interval of the winding 83 becomes narrow, there is a risk that the molten solder cannot sufficiently penetrate between the pin terminal P and the winding 83, resulting in insufficient soldering. Therefore, when soldering the pin terminal P and the winding 83, more precise control is required for the relative movement of the tip 5b with respect to the pin terminal P than in other cases.

[0008] Therefore, an object of the present invention is to provide a soldering method capable of firmly soldering without the risk of the winding being pushed downward in the direction of the root of the pin terminal by the tip, even when the movement control of the tip with respect to the pin terminal is of the same accuracy as that of normal movement control, when soldering a pin terminal and a winding using the substantially cylindrical tip.

Means for Solving the Problems

[0009] The soldering method according to one aspect of the present invention for achieving the above object uses a heatable tip having a substantially cylindrical shape and a solder hole penetrating in the axial direction in which solder pieces are supplied, and solders a pin terminal protruding outward from a component body of an electronic component and a winding wound around the pin terminal. The inner diameter of the solder hole is equal to or greater than the outermost diameter of the winding wound around the pin terminal, and the tip has a width equal to or greater than the inner diameter of the solder hole at a predetermined length from the downstream end in the supply direction of the solder piece of the tip to the upstream side in the supply direction of the solder piece. The tip has an opening extending from the outer peripheral surface of the tip to the inner peripheral surface of the solder hole. At least one of the pin terminal around which the winding is wound and the tip moves in a direction substantially perpendicular to the axial direction of the pin terminal, and the pin terminal around which the winding is wound is inserted into the solder hole of the tip through the opening. Then, a solder piece is supplied into the solder hole, and the solder piece is melted by the heated tip to solder the pin terminal and the winding.

[0010] In the soldering method having the above configuration, the width of the opening may be configured to continuously decrease from the radially outer side to the inner side of the tip.

[0011] Also, in the soldering method having the above configuration, it is preferable that the front end in the supply direction of the solder piece supplied into the solder hole abuts against the pin terminal or the winding.

[0012] Also, in the soldering method having the above configuration, it is preferable that the tip is heated before the solder piece is supplied to the solder hole.

[0013] Further, according to the present invention, there is provided a tip used in the soldering method described above, the tip having a substantially cylindrical shape, a solder hole penetrating in the axial direction in which solder pieces are supplied, and an inner diameter equal to or greater than the outermost diameter of the winding wound around the pin terminal, and having a width equal to or greater than the inner diameter of the solder hole at a predetermined length from the downstream end in the supply direction of the solder piece of the tip to the upstream side in the supply direction of the solder piece, and an opening extending from the outer peripheral surface of the tip to the inner peripheral surface of the solder hole.

[0014] At the tip of the spatula configured as described above, it is preferable that the width of the opening continuously narrows from the outer side to the inner side in the radial direction of the tip of the spatula.

Advantages of the Invention

[0015] According to the soldering method of the present invention, the tip moves relative to the pin terminal in a direction substantially perpendicular to the axial direction of the pin terminal, and the pin terminal is inserted into the solder hole of the tip. Therefore, even if the movement control of the tip with respect to the pin terminal is at the same level of accuracy as that of normal movement control, the winding wire wound around the pin terminal will not be pushed down toward the root of the pin terminal by the tip. As a result, reliable soldering becomes possible.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0017] A method of soldering and the tip of a soldering apparatus used therefor according to the present invention will be described with reference to the drawings, but the present invention is not limited to these embodiments at all.

[0018] (Tip) Figs. 1 and 2 show one form of the tip usable in the present invention. Fig. 1 is a perspective view of the tip 5a, and Fig. 2 is a horizontal sectional view of the lower part of the tip 5a. The tip 5a has a cylindrical shape and a solder hole 51 with a circular cross-section that penetrates in the axial direction (the vertical direction in Fig. 1) around the central axis C. 1 Further, the tip 5a has an opening 52 at the outer peripheral part of the lower end that reaches from the outer peripheral surface to the inner peripheral surface of the solder hole 51. The opening 52 has a length L (shown in Fig. 1) upward from the lower end of the tip 5a, and has a shape in which the width W in the direction perpendicular to the central axis C continuously decreases inward in the radial direction of the tip 5a from the width W1 to the width W2. Note that the width W2 is equal to the inner diameter d of the solder hole 51. Further, the tip 5a has a release hole 53 that communicates the solder hole 51 and the outer peripheral surface above the opening 52. The release hole 53 serves to release nitrogen gas supplied from a gas supply unit (not shown), vaporized flux, etc. to the outside of the tip 5a when the lower end opening of the solder hole 51 is blocked by the melted solder. 1 The width W of the opening 52 is usually at least the same as the width W2 (the inner diameter d of the solder hole 51) at the minimum and at most the same as the outer diameter D of the tip 5a at the maximum. A preferable range of the width W of the opening 52 is a range larger than the inner diameter d of the solder hole 51 and smaller than the outer shape D of the tip 5a. In such a range, even when the position of the tip 5a and the pin terminal P before movement (before insertion) is deviated from the normal position or the relative movement direction of the tip 5a is deviated from the normal direction, the pin terminal P is guided into the solder hole 51 of the tip 5a by the side surface of the opening 52. Note that the inner diameter d of the solder hole 51 is set to be equal to or larger than the outermost diameter of the winding 83 wound around the pin terminal P described later.

[0019] (Soldering process)

[0020] (Soldering process) Figs. 3 and 4 show soldering process diagrams. Figs. 3 and 4 are centered on the central axis C. 1and the central axis C 2 FIG. 8 is a partial vertical sectional view of the component body 81 of the electronic component and the tip 5a in a plane including 2 . An electronic component 8 (shown in FIG. 5) such as a transformer to be soldered includes a component body 81, pin terminals P implanted in the component body 81, and a winding 83 that is drawn out from the component body 81 through a lead-out groove 82 formed in the component body 81 and wound around the pin terminals P.

[0021] As will be described later with reference to FIG. 5, the control means Cont of the soldering apparatus AP controls the rotational movement of the articulated arm Am of the manipulator ML so that, as shown in FIG. 3(a), the tip 5a is such that the outer peripheral surface of the tip 5a does not contact the winding 83 wound around the pin terminal P and the lower end surface of the tip 5a is moved to a position (first position) near the pin terminal P implantation surface of the component body 81. Next, as shown in FIG. 3(b), the control means Cont controls the manipulator ML to move the tip 5a in a direction perpendicular to the central axis C of the pin terminal P, that is, in the left direction of FIG. 3, so that the pin terminal P around which the winding 83 is wound is positioned within the solder hole 51 of the tip 5a (second position). Preferably, the central axis C of the pin terminal P 2 is positioned so as to be in the same straight line as the central axis C of the tip 5a. 2 and the central axis C of the tip 5a 1 are positioned on the same straight line.

[0022] Here, even when the first position is deviated from the set position or when the direction of movement from the first position to the second position is deviated, even if the tip 5a contacts the winding 83 wound around the pin terminal P when the tip 5a moves relatively from the first position to the second position, only a force perpendicular to the direction of the central axis C of the pin terminal P is applied to the winding 83, and no force is applied in the direction of the central axis C 2 so that there is no risk that the winding 83 is pushed downward in the root direction of the pin terminal P and the winding interval of the winding 83 becomes shorter. 2

[0023] ​At the second position, it is desirable to make the distance between the lower surface of the trowel tip 5a and the implantation surface of the pin terminal P of the component body 81 as small as possible. Since the periphery of the pin terminal P around which the winding 83 is wound is mostly surrounded by the inner peripheral surface of the solder hole 51 of the trowel tip 5a, the winding 83 and the pin terminal P are likely to be heated by radiant heat or the like from the trowel tip 5a. For this purpose, the length L in the direction of the central axis C 1 of the opening 52 is preferably greater than the protruding height of the pin terminal P from the component body 81.

[0024] Next, as shown in FIG. 3(c), a solder piece Wh is supplied to the solder hole 51 of the trowel tip 5a. Here, the inner diameter d of the solder hole 51 of the trowel tip 5a is equal to or greater than the outermost diameter of the winding 83 wound around the pin terminal P as described above. (Naturally, the inner diameter d of the solder hole 51 is larger than the outer diameter of the solder piece Wh.) And it is desirable to set the maximum gap between the inner peripheral surface of the solder hole 51 and the outermost periphery of the winding 83 wound around the pin terminal P to be smaller than the outer diameter of the solder piece Wh supplied to the solder hole 51. Thereby, the solder piece Wh supplied into the solder hole 51 abuts against the tip portion of the pin terminal P or the winding 83. Note that even when the central axis C 1 of the trowel tip 5a and the central axis C 2 of the pin terminal P are not on the same straight line and are displaced, such displacement is allowed as long as the solder piece Wh supplied into the solder hole 51 abuts against the tip portion of the pin terminal P or the winding 83.

[0025] The solder piece Wh supplied into the solder hole 51 usually has a part of it in contact with the inner peripheral surface of the solder hole 51 (except when the solder piece Wh stands on the pin terminal P or the winding 83 without contacting the inner peripheral surface of the solder hole 51), so the solder piece Wh is directly heated by heat transfer from the trowel tip 5a. Note that the trowel tip 5a has been heated before the solder piece Wh is supplied to the solder hole 51. Specifically, it is heated by the heater unit 4 from when the main power supply of the soldering apparatus AP is turned on, and the trowel tip 5a is maintained at a predetermined temperature.

[0026] The solder piece Wh supplied into the solder hole 51 is heated to the melting temperature in a short time by heat transfer from the tip of the soldering iron 5a. In the process of heating and melting the solder piece Wh, the flux with a melting temperature lower than that of the solder first melts and flows out onto the surface of the solder piece Wh. Since the flux has a higher thermal conductivity than the solder, the heat transfer from the tip of the soldering iron 5a to the solder piece Wh is accelerated through the flux. Also, a part of the flux flowing down from the solder piece Wh removes the oxide film on the surfaces of the pin terminal P and the winding 83 and prevents oxidation of the pin terminal P and the winding 83 during the soldering process.

[0027] Then, when the temperature of the solder piece Wh reaches the melting temperature, it melts, and the molten solder MS becomes substantially spherical due to surface tension at the upper part of the pin terminal P. When the pin terminal P is heated above the solder melting temperature, it flows down and solders the pin terminal P and the winding 83 as shown in Fig. 4(d).

[0028] After that, the control means Cont controls the manipulator ML so that, as shown in Fig. 4(e), the tip of the soldering iron 5a is moved in the vertical direction with respect to the central axis C of the pin terminal P, that is, in the right direction of Fig. 4, from the second position to the first position. Next, the tip of the soldering iron 5a is moved in the direction away from the component body 81 in the direction of the central axis C, that is, in the upward direction of Fig. 4, and the next soldering operation is performed. 2 with respect to, that is, in the right direction of Fig. 4, to move it from the second position to the first position. Next, the tip of the soldering iron 5a is 1 moved in the direction away from the component body 81 in the direction of the central axis C, that is, in the upward direction of Fig. 4, and the next soldering operation is performed.

[0029] Note that after the soldering is completed, the tip of the soldering iron 5a may immediately move in the direction away from the component body 81 in the direction of the central axis C, that is, in the upward direction of Fig. 4, to perform the next soldering operation. 1 in the direction of the central axis C, that is, in the upward direction of Fig. 4, to perform the next soldering operation.

[0030] (Overall Configuration of the Soldering Apparatus) Fig. 5 is a perspective view of a soldering apparatus AP that performs soldering using the tip of the soldering iron 5a described above, and shows a case where the soldering apparatus AP solders the pin terminal P of the electronic component 8 fixed to the jig Gj by a conventionally known means and the winding 83 wound around the pin terminal P. Two pin terminals P are implanted on the upper surface of the component body 81 of the electronic component 8 so as to protrude upward, and a winding 83 is wound around each of the pin terminals P.

[0031] The soldering device AP includes a manipulator ML as moving means having an articulated arm Am, a device body A1 attached to the tip of the manipulator ML, and a control device Cont that controls the operations of the manipulator ML and the device body A1. The manipulator ML is installed on a base Bs, and the articulated arm Am is rotatable at each of a plurality of joint portions. The control means Cont controls the rotational movement of the articulated arm Am of the manipulator ML to move the device body A1 to a desired position in the X direction, Y direction, and Z direction shown in FIG. 5. Further, the control means Cont controls the operations of a cutter unit 2, a drive mechanism 3, a solder feed mechanism 6, and a heater unit 4 (all shown in FIG. 6) of the device body A1 described later. In this embodiment, the cutter unit 2, the drive mechanism 3, and the solder feed mechanism 6 constitute a solder piece supply means.

[0032] When performing soldering with the soldering device AP, the device body A1 is moved in the X direction, Y direction, and Z direction by the manipulator ML, and the tip 5a of the spatula does not contact the winding 83 whose outer peripheral surface is wound around the pin terminal P, and the lower end surface of the tip 5a moves to a position near the pin terminal P implantation surface of the component body 81. Thereafter, the tip 5a is moved in a direction approaching the pin terminal P, and the pin terminal P around which the winding 83 is wound is inserted into the solder hole of the tip 5a. In this embodiment, although the device body A1 is moved, the device body A1 may be fixed and the jig Gj may be moved, or both the device body A1 and the jig Gj may be moved.

[0033] Such movement control of the tip 5a by the control means Cont may be performed based on a value set in advance, or may be performed based on a detection signal from a detection means (not shown) such as a contact sensor.

[0034] (Device body A1) FIG. 6 shows a perspective view of the device body A1, and FIG. 7 shows a vertical sectional view of the device unit U shown in FIG. 6. FIG. 8 is an exploded perspective view of a part of the drive mechanism provided in the device unit U shown in FIG. 7. In FIG. 6, a part of the housing is cut away to show the inside of the device body A1.

[0035] As shown in FIG. 6, the apparatus main body A1 includes an apparatus unit U, a support member SP that supports the apparatus unit U so as to be movable within a predetermined distance range in the Z direction, and a cover C (dashed line in FIG. 6) that covers the apparatus unit U and the support member SP.

[0036] The support member SP includes a plate-shaped base Mf having a rectangular YZ plane and a predetermined thickness in the X direction, a guide rail Mg having a predetermined width in the Y direction and protruding in the X direction and continuous in the Z direction at the central portion in the Y direction on one side surface of the base Mf in the X direction, and a block Mb movably attached to the guide rail Mg in the Z direction.

[0037] The upper end portion of the base Mf in the Z direction is attached to the tip of the multi-joint arm Am of the manipulator ML. The wall body 11 of the apparatus unit U is attached to the block Mb over substantially the entire region in the Z direction. That is, the apparatus unit U is fixed to the block Mb and is movable in the Z direction integrally with the block Mb. Further, a movement restricting pin 91 is provided so as to protrude vertically outward from the side surface at the lower end portion on one side surface of the block Mb in the Y direction.

[0038] On the other hand, a rectangular parallelepiped-shaped upper stopper portion 93 and a lower stopper portion 94 are provided so as to face each other with a predetermined distance in the Z direction at the end position in the Y direction at the lower portion in the Z direction on one side surface of the base Mf in the X direction.

[0039] The movement restricting pin 91 provided on one side surface of the block Mb is located in the region between the upper stopper portion 93 and the lower stopper portion 94 of the base Mf. In the initial state, that is, when the tip 5a of the spatula is not in contact with the wiring board Bd, the movement restricting pin 91 is in contact with the lower stopper portion 94 due to the self-weight of the device unit U and the block Mb. In other words, when the movement restricting pin 91 contacts the lower stopper portion 94, the downward movement of the device unit U in the Z direction is restricted. On the other hand, when the tip 5a of the spatula contacts the wiring board Bd and the device unit U moves upward in the Z direction, the upward movement of the device unit U in the Z direction is restricted when the movement restricting pin 91 contacts the upper stopper portion 93.

[0040] (Device unit U) The device unit U includes a support portion 1, a cutter unit 2, a drive mechanism 3, a heater unit 4, a tip 5a of the spatula, and a solder feeding mechanism 6.

[0041] The support portion 1 includes a vertically standing flat wall body 11. In the following description, for convenience, as shown in FIG. 6, the horizontal direction along the wall body 11 is defined as the X direction, the horizontal direction perpendicular to the wall body 11 is defined as the Y direction, and the vertical direction along the wall body 11 is defined as the Z direction. For example, as shown in FIG. 6, the wall body 11 has a ZX plane.

[0042] The support portion 1 includes the wall body 11, a holding portion 12, a sliding guide 13, and a heater unit fixing portion 14. The wall body 11 is a flat wall body standing vertically. The wall body 11 serves as a support member for the device main body A1. The holding portion 12 is fixed at a position shifted upward from the lower end portion of the wall body 11 in the Z direction. The holding portion 12 holds an air cylinder 31 of the drive mechanism 3 described later. The heater unit fixing portion 14 is a member for fixing the heater unit 4 and is provided at the end portion (lower end portion) of the wall body 11 in the Z direction.

[0043] The sliding guide 13 is fixed near the lower end of the wall body 11 in the Z direction. The sliding guide 13 is fixed together with a cutter lower blade 22 (to be described later) of the cutter unit 2 to the wall body 11, and guides a cutter upper blade 21 (to be described later) of the cutter unit 2 to be slidable in the X direction.

[0044] The sliding guide 13 is a pair of members facing each other in the Y direction. The sliding guide 13 has a pair of wall portions 131 and a retaining portion 132. The wall portion 131 is a flat plate-shaped member extending in the X direction. One wall portion 131 is arranged in contact with the wall body 11, and the surface on the side opposite to the wall body 11 is in contact with the cutter lower end 22. Also, the other wall portion 131 is in contact with the side surface of the cutter lower blade 22. That is, the pair of wall portions 131 sandwich the cutter lower blade 22 from both sides in the Y direction. And the pair of wall portions 131 and the cutter lower blade 22 are fastened and fixed to the wall body 11 with a fastener such as a screw.

[0045] The retaining portion 132 is provided on each of the pair of wall portions 131. The pair of wall portions 131 extend in the Z direction beyond the upper surface of the cutter lower blade 22 in the Z direction, and extend from the upper end portions of the pair of wall portions 131 in the Z direction toward the other side respectively. That is, the sliding guide 13 is provided with a pair of retaining portions 132. And the tips of the pair of retaining portions 132 in the Y direction do not contact each other. In other words, the sliding guide 13 has an opening at the upper part. The cutter upper blade 21 is arranged at least partially between the upper surface of the cutter lower blade 22 and the retaining portion 132. Thereby, the cutter upper blade 21 is guided in the X direction and is prevented from coming off in the Z direction.

[0046] The cutter unit 2 is a cutting tool that cuts the wire solder W sent by the solder feeding mechanism 6 into solder pieces Wh of a predetermined length. The cutter unit 2 includes a cutter upper blade 21, a cutter lower blade 22, and a pusher pin 23.

[0047] As described above, the lower cutter blade 22 is fixed to the wall body 11 together with the sliding guide 13. As shown in FIG. 7, the lower cutter blade 22 includes a lower blade hole 221 and a gas inlet hole 222. The lower blade hole 221 is a through hole that penetrates the lower cutter blade 22 in the Z direction, and the thread solder W that penetrates the upper blade hole 211 (to be described later) of the upper cutter blade 21 is inserted therein. The edge portion at the upper end of the lower blade hole 221 is formed in a cutting edge shape. Using the upper blade hole 211 and the lower blade hole 221, the thread solder W is cut into solder pieces Wh of a predetermined length. The cut solder pieces Wh fall downward inside the lower blade hole 221 by their own weight or being pushed by the pusher pin 23. The lower blade hole 221 communicates with the solder hole 51 (to be described later) of the tip 5a via the solder supply hole 422 (to be described later) of the heater unit 4. The solder pieces Wh that have fallen inside the lower blade hole 221 reach the solder supply hole 422 and then fall into the solder hole 51.

[0048] The gas inlet hole 222 is a hole that communicates the outer surface of the lower cutter blade 22 and the lower blade hole 221. The gas supplied from a gas supply source (not shown) flows into the gas inlet hole 222. Then, the gas passes through the lower blade hole 221 and the solder supply hole 422 and reaches the solder hole 51. Note that the gas is used to suppress the oxidation of the solder when heating and melting the solder. That is, it is a gas for suppressing the contact between the molten solder and oxygen. Examples of the gas include nitrogen gas, argon gas, helium gas, carbon dioxide, and the like. In the soldering apparatus AP of the present embodiment, it will be described that nitrogen gas is supplied.

[0049] As described above, the upper cutter blade 21 is disposed on the upper surface of the lower cutter blade 22 in the Z direction. The upper cutter blade 21 is guided by the sliding guide 13 so that the sliding direction becomes the X direction during sliding and is prevented from coming off in the Z direction. That is, the upper cutter blade 21 slides in the X direction on the upper surface of the lower cutter blade 22 in the Z direction. Note that the upper cutter blade 21 is slid by the drive mechanism 3.

[0050] The upper cutter blade 21 is provided with an upper blade hole 211 and a pin hole 212. The upper blade hole 211 is a through hole that penetrates the upper cutter blade 21 in the Z direction. The wire solder W sent from the solder feeding mechanism 6 is inserted into the upper blade hole 211. The edge portion at the lower end of the upper blade hole 211 is formed in a cutting edge shape. The pin hole 212 is a through hole that penetrates the upper cutter blade 21 in the Z direction. A rod portion 231 of the pusher pin 23 described later is slidably inserted into the pin hole 212.

[0051] The pusher pin 23 has a rod portion 231, a head portion 232, and a spring 233. The rod portion 231 is a cylindrical member and is slidably inserted into the pin hole 212. Also, when the pusher pin 23 moves downward in the Z direction, the tip of the rod portion 23 projects from the pin hole 212. The head portion 232 is connected to the upper end in the axial direction of the rod portion 231. The head portion 232 has a disc shape with an outer diameter larger than the inner diameter of the pin hole 212. The head portion 232 is not inserted into the pin hole 212. That is, the head portion 232 serves as a so-called stopper that restricts the movement of the rod portion 231 into the pin hole 212.

[0052] The spring 233 is a compression coil spring that surrounds the outer side in the radial direction of the rod portion 231. The lower end in the Z direction of the spring 233 contacts the upper surface of the upper cutter blade 21, and the upper end in the Z direction contacts the lower surface of the head portion 232. That is, the spring 233 receives a reaction force from the upper surface of the upper cutter blade 21 and pushes the head portion 232 upward in the Z direction. As a result, the rod portion 231 connected to the head portion 232 is lifted upward in the Z direction, and the lower end of the rod portion 231 is maintained so as not to protrude from the lower end of the pin hole 212. Note that a retaining means (not shown) for preventing the rod portion 231 from coming out of the pin hole 212 is provided at the lower end in the Z direction of the rod portion 231.

[0053] The pusher pin 23 is cut by the upper cutter blade 21 and the lower cutter blade 22 and pushes the solder piece Wh remaining in the lower blade hole 221 downward. And the pusher pin 23 is always pushed upward, that is, to the side opposite to the lower cutter blade 22, by the elastic force of the spring 233. That is, when the head portion 232 is pushed, the rod portion 231 protrudes downward from the lower end portion in the Z direction of the pin hole 212. And the head portion 232 is pushed by a cam member 33 (to be described later) of the drive mechanism 3.

[0054] In the upper cutter blade 21, the upper blade hole 211 and the pin hole 212 are provided side by side in the X direction. The upper cutter blade 21 moves in the X direction to a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically, or a position where the pin hole 212 and the lower blade hole 221 overlap vertically. Note that the upper cutter blade 21 may slide so that the upper blade hole 211 and the lower blade hole 221 overlap when it slides to one sliding end, and the pin hole 212 and the lower blade hole 221 overlap when it slides to the other sliding end.

[0055] Then, when the thread solder W is fed from the solder feeding mechanism 6 in a state where the upper blade hole 211 and the lower blade hole 221 overlap in the Z direction, the thread solder W that has passed through the upper blade hole 211 is inserted into the lower blade hole 221. As described above, the edge portion at the lower end of the upper blade hole 211 is formed in a cutting edge shape, and the edge portion at the upper end of the lower blade hole 221 is also formed in a cutting edge shape. And the lower surface of the upper cutter blade 21 is in contact with the upper surface of the lower cutter blade 22. Therefore, in a state where the thread solder W is inserted into the lower blade hole 221, when the upper cutter blade 21 slides in the X direction, the thread solder W is cut by the cutting edges of the upper blade hole 211 and the lower blade hole 221 respectively.

[0056] The upper cutter blade 21 is slid in the X direction by the cam member 33. Therefore, the upper cutter blade 21 and the pusher pin 23 are synchronized with the cam member 33. The cam member 33 pushes the head portion 232 when the pin hole 212 overlaps the lower blade hole 221 in the Z direction. Therefore, when the upper cutter blade 21 slides in the X direction, the tip of the rod portion 231 of the pusher pin 23 is accommodated in the pin hole 212. Therefore, when the upper cutter blade 21 slides in the X direction, contact between the tip of the rod portion 231 and the upper surface of the lower cutter blade 22 is suppressed, and deformation, breakage, etc. of the tip of the rod portion 231 and / or the lower cutter blade 22 are suppressed.

[0057] When the upper cutter blade 21 slides in the X direction, the lower blade hole 211 and the pin hole 212 overlap in the Z direction. In a state where the pin hole 212 overlaps the lower blade hole 211, the head portion 232 is pushed by the cam member 33. As a result, the pusher pin 23 moves downward in the Z direction. When the pusher pin 23 protrudes downward in the Z direction from the pin hole 212, a part of the pusher pin 23 is inserted into the lower blade hole 211. If a solder piece described later, which cuts the thread solder, remains at the entrance of the lower blade hole 211, the tip of the pusher pin 23 pushes the solder piece, and the solder piece falls.

[0058] As shown in FIGS. 6 and 7, the drive mechanism 3 includes an air cylinder 31, a piston rod 32, a cam member 33, a slider portion 34, and a guide post portion 35. The air cylinder 31 is held by the holding portion 12. The air cylinder 31 has a bottomed cylindrical shape. The piston rod 32 is accommodated inside the air cylinder 31, and the piston rod 32 is slidably driven (extended and contracted) by the pressure of air supplied from the outside. The air cylinder 31 and the piston rod 32 constitute an actuator of the drive mechanism 3. The piston rod 32 is disposed inside the air cylinder 31, and a part of the piston rod 32 always protrudes from one end in the axial direction of the air cylinder 31 (here, the lower end in the Z direction). The air cylinder 31 is held by the holding portion 12 so that the surface from which the piston rod 32 protrudes faces the cutter unit 2, that is, faces downward in the Z direction.

[0059] The piston rod 32 passes through a through hole (not shown) provided in the holding portion 12. The piston rod 32 is provided in parallel with the guide column portion 35 and reciprocates linearly along the guide column portion 35. The tip of the piston rod 32 is fixed to the cam member 33, and the cam member 33 slides in the Z direction as the piston rod 32 expands and contracts. The sliding of the cam member 33 is guided by the guide column portion 35.

[0060] As shown in FIG. 7, the lower end of the guide column portion 35 is fitted into a concave hole provided in the lower cutter blade 22 and is fixed to the lower cutter blade 22 with a screw 351. Further, the upper part of the guide column portion 35 passes through a hole provided in the holding portion 12, and its movement is restricted by a pin 352. That is, the guide column portion 35 is fixed to the lower cutter blade 22 by the screw 351 and to the holding portion 12 by the pin 352.

[0061] In the present embodiment, the guide column portion 35 is fixed by the screw 351 and the pin 352, but it is not limited thereto. For example, it may be fixed by a fixing method such as press-fitting or welding. Further, in the present embodiment, the guide column portion 35 is a cylindrical member, but it is not limited thereto, and a cross-sectional polygonal shape, an ellipse, or the like may be used.

[0062] As shown in FIGS. 7 and 8, the cam member 33 is a rectangular member and includes a concave portion 330 formed by cutting out a part of the long side in a rectangular shape, and a cylindrical support portion 331 connected to the cam member 33 and having a through hole through which the guide column portion 35 passes. A slider portion 34 is disposed in the concave portion 330 so as to be slidable (in the X direction and the Z direction). Further, the support portion 331 has a shape extending in parallel with the guide column portion 35 and is provided to suppress rattling of the cam member 33. That is, when the cam member 33 has a certain thickness and is less likely to rattle, the cylindrical portion may be omitted and the support portion 331 may be constituted only by the through hole.

[0063] And the cam member 33 includes a columnar pin 332 provided at the middle portion of the concave portion 330 with its central axis orthogonal to the guide pillar portion 35, a pin pressing portion 333 that presses the pusher pin 23 adjacent to the concave portion 330, and a shaft bearing 334 disposed inside the support portion 331. The pin 332 is inserted into a cam groove 340 (to be described later) provided in the slider portion 34. Further, the shaft bearing 334 is externally fitted to the guide pillar portion 35 and is a member that allows smooth sliding so that the cam member 33 does not rattle.

[0064] As shown in FIGS. 7 and 8, the slider portion 34 is a rectangular plate-shaped member and is integrally formed with the upper cutter blade 21. The slider portion 34 has a cam groove 340 that penetrates in the plate thickness direction and extends in the longitudinal direction. The cam groove 340 is provided with a first groove portion 341 extending parallel to the guide pillar portion 35 on the upper side and a second groove portion 342 also extending parallel to the guide pillar portion 35 on the lower side. And the first groove portion 341 and the second groove portion 342 are provided with a shift in the X direction, and the cam groove 340 includes a connection groove portion 343 that connects the first groove portion 341 and the second groove portion 342.

[0065] The pin 332 of the cam member 33 is inserted into the cam groove 340, and as the cam member 33 moves along the guide pillar portion 35, the pin 332 slides on the inner surface of the cam groove 340. When the pin 332 is located in the connection groove portion 343 of the cam groove 340, it presses the inner surface of the connection groove portion 343. Thereby, the slider portion 34 and the upper cutter blade 21 integrally formed with the slider portion 34 move (slide with respect to the lower cutter blade 22) in a direction (X direction) intersecting the sliding direction (Z direction) of the cam member 33.

[0066] In this embodiment, a configuration in which the cam member 33 is provided with the pin 332 and the slider portion 34 is provided with the cam groove 340 is described. However, actually, a configuration in which the cam member is provided with a cam groove and the slider portion is provided with a pin may also be used.

[0067] In this embodiment, pneumatic pressure is used as the actuator of the drive mechanism 3, but it is not limited thereto, and a fluid other than air (for example, hydraulic oil) may be used (hydraulic pressure). Further, it is not limited to using a fluid, and power such as a motor or a solenoid may be used. In this embodiment, one actuator, a cam, and a cam groove are used to slide the upper cutter blade 21 and push down the pusher pin 23, but it is not limited thereto. For example, a plurality (two) of actuators may be provided so as to slide the upper cutter blade 21 and push down the pusher pin 23.

[0068] As shown in FIGS. 6 and 7, the solder feeding mechanism 6 supplies the thread solder W. The solder feeding mechanism 6 includes a pair of feeding rollers 61 and a guide tube 62. The pair of feeding rollers 61 is rotatably attached to the support wall 11. The pair of feeding rollers 61 rotates with the side surfaces of the thread solder W sandwiched therebetween to feed the thread solder downward. The pair of feeding rollers 61 is biased toward each other, and the thread solder W is sandwiched by the biasing force. The length of the fed thread solder W is measured (determined) according to the rotation angle (rotation speed) of the feeding roller 61.

[0069] The guide tube 62 is an elastically deformable tube body, and the upper end thereof is disposed close to the portion where the thread solder W of the feeding roller 61 is fed out. Further, the lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the upper cutter blade 21. The lower end of the guide tube 62 moves following the sliding of the upper cutter blade 21, and the guide tube 62 has a length and a shape that are not excessively pulled or stretched within the range where the upper cutter blade 21 slides.

[0070] The heater unit 4 is a heating device for heating and melting the solder piece Wh, and as shown in FIG. 7, it is fixed to the heater unit fixing portion 14 provided at the lower end portion of the wall body 22. The heater unit 4 includes a heater 41 and a heater block 42. The heater 41 generates heat when energized. Here, the heater 41 has a heating wire wound around the outer peripheral surface of the cylindrical heater block 42.

[0071] The heater block 42 has a cylindrical shape and includes a recess 421 having a circular cross-section for attaching the tip 5a of the spatula at the axial end, and a solder supply hole 422 penetrating from the center of the bottom of the recess 421 to the opposite side. The heater block 42 is provided in contact with the cutter lower blade 22 such that the solder supply hole 422 communicates with the lower blade hole 221. By providing the heater block 42 in this way, the solder piece Wh moves from the lower blade hole 221 to the solder supply hole 422.

[0072] (Operation of the soldering device) Next, the operation of the soldering device AP will be described. As shown in FIGS. 3 and 5, the control means Cont controls the rotational operation of the articulated arm Am of the manipulator ML so that the tip 5a of the device body A1 does not contact the winding 83 whose outer peripheral surface is wound around the pin terminal P, and the lower end surface of the tip 5a is positioned near the pin terminal P implantation surface of the component body 81. Next, the control means Cont controls the manipulator ML to move the tip 5a in a direction approaching the pin terminal P, and the pin terminal P around which the winding 83 is wound is inserted into the solder hole 51 of the tip 5a.

[0073] Next, as shown in FIG. 3, the solder piece Wh is supplied to the solder hole 51 of the tip 5a. The tip 5a is heated by heat transferred from the heater 41 (shown in FIG. 7), heat transfer and radiant heat from the tip 5a, and further convection in the solder hole 51. As shown in FIG. 4, when the temperature of the solder piece Wh reaches the melting temperature, the solder piece Wh melts into molten solder MS and flows down, and the pin terminal P and the winding 83 are soldered. The soldering device AP repeats this series of operations to sequentially solder the pin terminal P of the electronic component 8 and the winding 83.

[0074] The embodiments described above show an example of the soldering method and the tip of the soldering iron according to the present invention, and various modifications and the like are possible within a range that does not inhibit the effects of the present invention.

Industrial Applicability

[0075] According to the soldering method of the present invention, the winding wire 83 wound around the pin terminal P is not pushed down in the direction of the root of the pin terminal P by the tip 5a, and reliable soldering can be surely performed.

Explanation of Signs

[0076] AP Soldering Device A1 Device Body 4 Heater Unit 41 Heater 42 Heater Block 5a, 5b Tips 51 Solder Hole 52 Opening 6 Solder Feeding Mechanism 8 Electronic Component 81 Component Body 82 Lead-out Groove 83 Winding Wire C 1 Central Axis of the Tip C 2 Central Axis of the Pin Terminal d Inner Diameter of the Solder Hole D Outer Diameter of the Tip L Axial Length of the Opening in the Direction of the Axis of the Tip W 1 , W 2 Width of the Opening (Length in the Direction Perpendicular to the Axial Direction of the Tip) P Pin Terminal W Thread Solder Wh Solder Piece

Claims

1. A soldering method for soldering a pin terminal protruding outward from a component body of an electronic component and a winding wound around the pin terminal, using a heatable tip having a substantially cylindrical shape and having a solder hole penetrating in the axial direction in which a solder piece is supplied, wherein an inner diameter of the solder hole is equal to or greater than an outermost diameter of the winding wound around the pin terminal, the tip has a length of a predetermined length from a downstream end in the supply direction of the solder piece of the tip to an upstream side in the supply direction of the solder piece, a width in a direction perpendicular to the axial direction of the solder hole is equal to or greater than the inner diameter of the solder hole, and has an opening extending from an outer peripheral surface of the tip to an inner peripheral surface of the solder hole that continuously narrows from the radially outer side to the inner side of the tip, at least one of the pin terminal around which the winding is wound and the tip moves in a direction substantially perpendicular to the axial direction of the pin terminal, and the pin terminal around which the winding is wound is inserted into the solder hole of the tip through the opening, then, a solder piece is supplied into the solder hole, and the solder piece is melted by the heated tip to solder the pin terminal and the winding. The soldering method is characterized by this.

2. The soldering method according to claim 1, wherein a front end in the supply direction of the solder piece supplied into the solder hole abuts against the pin terminal or the winding.

3. The soldering method according to claim 1 or 2, wherein the tip is heated before the solder piece is supplied to the solder hole.

4. A tip used in the soldering method according to any one of claims 1 to 3, having a substantially cylindrical shape, a solder hole penetrating in the axial direction in which a solder piece is supplied, and having an inner diameter equal to or greater than an outermost diameter of the winding wound around the pin terminal, a length of a predetermined length from a downstream end in the supply direction of the solder piece of the tip to an upstream side in the supply direction of the solder piece, a width in a direction perpendicular to the axial direction of the solder hole is a width equal to or greater than the inner diameter of the solder hole, and has an opening extending from an outer peripheral surface of the tip to an inner peripheral surface of the solder hole that continuously narrows from the radially outer side to the inner side of the tip and is characterized by having these.

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