Method, Receiver

Abstract

Reduce the manufacturing cost of a power receiver used in a wireless power supply system. 【Solution means】 In a wireless power supply system, it is a method for manufacturing a plurality of power receivers that receive a power supply signal from a transmitter that transmits the power supply signal and generate electric power. The method includes a step of mounting a plurality of circuits on a single substrate, a step of mounting a conductor bent in a bridge shape on each of the plurality of circuits on the substrate, and a step of cutting the substrate to which the conductor is mounted.

Description

Technical Field

[0001] The present disclosure relates to a method and a receiver.

Background Art

[0002] In recent years, wireless power supply that supplies power wirelessly has been realized.

[0003] Patent Document 1 discloses an antenna device having high antenna efficiency and flexibility.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to use wireless power supply in various applications, it is assumed that the production volume of receivers used in wireless power supply systems will increase in the future. Therefore, it is desired to reduce the cost of manufacturing receivers.

[0006] An object of the present disclosure is to realize a reduction in the manufacturing cost of receivers used in wireless power supply systems.

Means for Solving the Problems

[0007] A method of manufacturing a plurality of receivers that receive a power supply signal from a transmitter that transmits a power supply signal and generate power in a wireless power supply system. The method includes a step of attaching a plurality of circuits to a single substrate, a step of attaching a conductor bent in a bridge shape to each of the plurality of circuits on the substrate, and a step of cutting the substrate to which the conductor is attached.

Effects of the Invention

[0008] According to the present disclosure, the manufacturing cost of a power receiver used in a wireless power supply system can be reduced.

Brief Description of the Drawings

[0009]

Figure 1

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Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In all the drawings for describing the embodiments, the same reference numerals are given to common components, and repeated descriptions are omitted. Note that the following embodiments do not unduly limit the content of the present disclosure described in the claims. Also, not all of the components shown in the embodiments are essential components of the present disclosure. Also, each figure is a schematic diagram and is not necessarily drawn precisely.

[0011] <Summary> The wireless power supply system has a transmitter that transmits a power supply signal and a plurality of receivers that receive the power supply signal transmitted from the transmitter and generate electric power. The receiver has, for example, a cylindrical shape with a substantially rectangular cross section. The receiver is manufactured, for example, as follows. That is, the first assembling means attaches a plurality of circuits to a single substrate. The second assembling means attaches a conductor bent in a bridge shape to each of the plurality of circuits on the substrate. The cutting means cuts the substrate to which the conductor is attached.

[0012] Also, the receiver may have a shape in which a cylindrical shape with a substantially rectangular cross section is closed by a substrate, for example. The receiver is manufactured, for example, as follows. That is, the first assembling means attaches a plurality of circuits to a single substrate. The second assembling means attaches an annularly bent conductor on the substrate so as to surround each of the plurality of circuits with the annularly bent conductor. The cutting means cuts the substrate to which the conductor is attached. <1 Configuration Diagram of the Whole System> FIG. 1 is a diagram showing the overall configuration of the WPT system 1 according to the present embodiment.

[0013] The WPT system 1 shown in FIG. 1 includes, for example, a transmitter 100, a receiver 200, a first information processing device 300, and a second information processing device 400. The WPT system 1 shown in FIG. 1 is used, for example, in a building or a factory. Note that the connection between the transmitter 100 and the first information processing device 300 and the connection between the first information processing device 300 and the second information processing device 400 may be wired or wireless.

[0014] In FIG. 1, an example in which the WPT system 1 includes three transmitters 100 is shown, but the number of transmitters 100 included in the WPT system 1 is not limited to three. The number of transmitters 100 included in the WPT system 1 may be two or less, or may be four or more.

[0015] In FIG. 1, an example in which the WPT system 1 includes seven receivers 200 is shown, but the number of receivers 200 included in the WPT system 1 is not limited to seven. The number of receivers 200 included in the WPT system 1 may be six or less, or may be eight or more.

[0016] Note that in this specification, the transmitter 100 is a (power) transmitter 100 in the sense of wirelessly transmitting power. Similarly, the receiver 200 is a (power) receiver 200 in the sense of wirelessly receiving power. As will be described later, the receiver 200 may transmit information regarding the state of the receiver 200 or information regarding the measurement result by a sensor to the transmitter 100 as a data signal, and the transmitter 100 may receive such a data signal. In this case, the transmitter 100 is a receiver that receives the data signal, and the receiver 200 functions as a transmitter that transmits the data signal.

[0017] In FIG. 1, an example in which the WPT system 1 includes two first information processing devices 300 is shown, but the number of first information processing devices 300 included in the WPT system 1 is not limited to two. The number of first information processing devices 300 included in the WPT system 1 may be one, or may be three or more.

[0018] The transmitter 100 transmits, for example, a power supply signal or a data signal to the receiver 200. The transmitter 100 transmits a power supply signal to the receiver 200 by radio waves in the 920 MHz band, for example. The transmitter 100 transmits a data signal to the receiver 200 by radio waves in the 2.4 GHz band, for example. The transmitter 100 may transmit the data signal by radio waves in the 920 MHz band.

[0019] The power transmission signal transmitted from the transmitter 100 may be, as an example, a continuous wave (CW) having a predetermined power. Also, the frequency band of the power transmission signal is, for example, the 920 MHz band in consideration of the distance between the transmitter 100 and the receiver 200. If it is a band with a higher frequency than the exemplified frequency band, unless the distance between the transmitter 100 and the receiver 200 is shortened, there is a possibility that the receiver 200 cannot supply a predetermined power for operation. Therefore, by considering the practical range (for example, the distance between the transmitter 100 and the receiver 200 is several meters), an appropriate frequency band can be determined.

[0020] At this time, due to laws and regulations of the country where the WPT system 1 is installed, there may be a restriction on intermittently performing a power transmission signal having a predetermined power. As an example, when the power transmission signal from the transmitter 100 falls under the regulations of a radio station stipulated in the Radio Law of Japan (regardless of the presence or absence of a license), it may be necessary to provide a certain pause period for the power transmission signal based on the Radio Law. In this case, considering it on a certain time axis, the power transmission signal cannot be said to be a continuous wave. However, it is important to provide a pause period, and even if this pause period is short, the power transmission signal transmitted from the transmitter 100 can be regarded as a substantially continuous continuous wave. The ratio of the continuous time of the power transmission signal to the time of the pause period may be such that, as described above, the power transmission signal transmitted from the transmitter 100 can be regarded as a substantially continuous continuous wave. As an example, the time of the pause period is about 1 / 50 to 1 / 100 of the continuous time of the power transmission signal.

[0021] The transmitter 100 may, for example, supply power to one receiver 200 or may supply power to a plurality of receivers 200. The transmitter 100 may, for example, transmit a data signal to one receiver 200 or may transmit a data signal to a plurality of receivers 200. The transmitter 100 may, for example, transmit the same data signal as another transmitter 100 or may transmit a data signal different from that of another transmitter 100. The transmitter 100 may, for example, transmit a predetermined command signal as a data signal to the receiver 200 or may transmit a preset signal as a data signal to the receiver 200.

[0022] The transmitter 100 receives, for example, a data signal transmitted from the receiver 200. The transmitter 100 may, for example, receive a data signal transmitted from one receiver 200 or may receive data signals transmitted from a plurality of receivers 200. The transmitter 100 transmits the data signal transmitted from the receiver 200 to the first information processing device 300. The transmitter 100 transmits information regarding the state of the transmitter 100 to the first information processing device 300.

[0023] The receiver 200 receives, for example, a power supply signal or a data signal transmitted from the transmitter 100. For example, when the receiver 200 has a power storage unit, the receiver 200 converts the power supply signal transmitted from the transmitter 100 into electric power and stores the converted electric power in the power storage unit. For example, when the receiver 200 has a predetermined sensor, the receiver 200 converts the power supply signal transmitted from the transmitter 100 into electric power and drives the sensor with the converted electric power.

[0024] The receiver 200 transmits, for example, information regarding the state of the receiver 200 or information regarding the measurement result by the sensor to the transmitter 100 as a data signal.

[0025] The first information processing device 300 is an information processing device that monitors the operations of the transmitter 100 and the receiver 200 accommodated in the WPT system 1. For example, based on the information regarding the states of the transmitter 100 and the receiver 200 transmitted from the transmitter 100, the first information processing device 300 determines whether the transmitter 100 or the receiver 200 is in a preset state. If it is determined that the device is in the preset state, the first information processing device 300 transmits predetermined information to the second information processing device 400.

[0026] In addition, the first information processing device 300 accumulates information about the transmitter 100 and the receiver 200 accommodated in the WPT system 1. For example, the first information processing device 300 stores the information regarding the states of the transmitter 100 and the receiver 200 transmitted from the transmitter 100 in a storage unit provided in the first information processing device 300.

[0027] In addition, the first information processing device 300 controls the operation of the transmitter 100 accommodated in the WPT system 1. For example, the first information processing device 300 transmits a predetermined instruction or information to the transmitter 100.

[0028] In addition, the first information processing device 300 controls the operation of the second information processing device 400.

[0029] The second information processing device 400 is, for example, an information processing device operated by the administrator of the WPT system 1. When the second information processing device 400 receives from the first information processing device 300 a notice that the transmitter 100, the receiver 200, or both of them accommodated in the WPT system 1 are in a predetermined state, the second information processing device 400 presents to the user that the transmitter 100, the receiver 200, or both of them are in the predetermined state.

[0030] In addition, the second information processing device 400 analyzes the information regarding the states of the transmitter 100 and the receiver 200 stored in the first information processing device 300 and presents predetermined information to the user. The predetermined information is, for example, as follows. · Information regarding the arrangement of the transmitter 100 · Information regarding the arrangement of the receiver 200 · Information on power consumption · Information on power quantity

[0031] <Configuration of transmitter and receiver> FIG. 2 is a block diagram showing a configuration example of the transmitter 100 shown in FIG. 1 and the receiver 200. As shown in FIG. 2, the transmitter 100 and the receiver 200 are, for example, separated from each other at a predetermined interval. For example, the transmitter 100 and the receiver 200 are installed at a distance of about several meters. Specifically, for example, the transmitter 100 is fixedly installed at a predetermined high position provided on a high place indoors, such as a ceiling or a wall. The receiver 200 is installed on a predetermined device indoors or placed near a device that requires power supply. Further, the receiver 200 may be carried by a user. The transmitter 100 transmits a power supply signal to the receiver 200 by radio waves of a predetermined frequency, for example, in the 920 MHz band. The receiver 200 converts the power supply signal transmitted from the transmitter 100 into power, and charges the converted power or supplies the converted power to a predetermined device.

[0032] The transmitter 100 has, for example, an oscillator 101, a transmission antenna 102, a microcomputer (controller) 103, a data transceiver 104, and a data transceiver antenna 105. The oscillator 101, the microcomputer 103, the data transceiver 104, the data transceiver antenna 105, or at least any combination thereof may be mounted on, for example, a PCB (printed circuit board).

[0033] The oscillator 101 oscillates a signal in a predetermined frequency band, for example, in the 920 MHz band. The oscillated signal may be amplified and unnecessary frequency components may be removed as necessary.

[0034] The transmission antenna 102 is formed, for example, to be able to efficiently transmit radio waves in the 920 MHz band. The transmission antenna 102 radiates the signal oscillated by the oscillator 101 as a power supply signal.

[0035] The microcontroller 103 controls the operation of the transmitter 100. The microcontroller 103 is realized by, for example, a semiconductor element equipped with an ARM processor. The microcontroller 103 controls, for example, the transmission of radio waves by the transmission antenna 102.

[0036] The data transceiver 104 performs processes such as analog conversion of digital data and modulation of analog data. Further, the data transceiver 104 performs processes such as demodulation of a data signal received by the data transmission / reception antenna 105 and digitization of the demodulated data. The data transceiver 104 extracts, for example, a predetermined signal from the data signal received by the data transmission / reception antenna 105, converts it into digital data, and transmits it to the microcontroller 103.

[0037] The data transmission / reception antenna 105 is formed, for example, to be able to efficiently transmit and receive radio waves in the 2.4 GHz band. The data transmission / reception antenna 105 radiates the data signal supplied from the data transceiver 104. Also, the data transmission / reception antenna 105 receives the data signal transmitted from the receiver 200.

[0038] The receiver 200 includes, for example, a reception antenna 201, a rectifier 202, a power management unit 203, a power storage unit 204, a microcontroller 205, a data transceiver 206, and a data transmission / reception antenna 207. The reception antenna 201, the rectifier 202, the power management unit 203, the power storage unit 204, the microcontroller 205, the data transceiver 206, the data transmission / reception antenna 207, or at least any combination thereof may be mounted on, for example, a PCB or an FPC (flexible printed circuit board).

[0039] The reception antenna 201 is formed, for example, to be able to efficiently receive radio waves in the 920 MHz band. The reception antenna 201 receives the power supply signal radiated from the transmission antenna 102.

[0040] The rectifier 202 rectifies the radio wave received as a power supply signal and converts it into a DC voltage.

[0041] The power management unit 203 manages the DC voltage. For example, the power management unit 203 controls the charging voltage based on the DC voltage. The power management unit 203 charges the power storage unit 204 by controlling the charging voltage. Also, when, for example, power equal to or greater than a predetermined capacity is stored in the power storage unit 204, the power management unit 203 supplies the DC voltage to the connected members.

[0042] Also, the power management unit 203 discharges the power stored in the power storage unit 204 in response to the control from the microcomputer 205.

[0043] The power storage unit 204 stores power in response to an instruction from the power management unit 203. The power storage unit 204 is realized by, for example, a battery or a capacitor. Also, the power storage unit 204 discharges the stored power in response to an instruction from the power management unit 203.

[0044] The microcomputer 205 controls the operation of the receiver 200. The microcomputer 205 is driven by the DC voltage supplied from the power management unit 203 or the power stored in the power storage unit 204. The microcomputer 205 controls the power management unit 203 to discharge the power stored in the power storage unit 204.

[0045] The receiver 200 can be connected to various sensors 208, for example. For example, a thermal sensor, a temperature sensor, a light sensor, a humidity sensor, a vibration sensor, a magnetic sensor, etc. are connected to the receiver 200. Also, a force sensor, a proximity sensor, a gas sensor, an acceleration sensor, a human presence sensor, an infrared sensor, an illuminance sensor, a flow sensor, a current sensor, a pressure sensor, etc. may be connected to the receiver 200. The sensors connected to the receiver 200 are driven by, for example, a DC voltage supplied from the power management unit 203 or the power discharged from the power storage unit 204. The microcontroller 205 continuously or intermittently monitors the voltage value at a predetermined part of the receiver 200, the status of the sensor 208 connected to the receiver 200, the information detected by the sensor 208, etc. The microcontroller 205 transmits the voltage value at a predetermined part of the receiver 200, the status of the sensor 208 connected to the receiver 200, the information detected by the sensor 208, etc. to the data transceiver 206 as digital data. Note that the sensor 208 may be built into the receiver 200.

[0046] The data transceiver 206 performs processes such as analog conversion of digital data supplied from the microcontroller 205 and modulation of analog data. Also, the data transceiver 206 performs processes such as demodulation of a data signal received by the data transmission / reception antenna 207 and digitization of the demodulated data. The data transceiver 206 is driven by, for example, a DC voltage supplied from the power management unit 203 or the power discharged from the power storage unit 204.

[0047] The data transmission / reception antenna 207 is formed to be able to efficiently transmit and receive radio waves in the 2.4 GHz band, for example. The data transmission / reception antenna 207 radiates a data signal supplied from the data transceiver 206. Also, the data transmission / reception antenna 207 receives the data signal transmitted from the transmitter 100. For example, the data transmission / reception antenna 207 is driven by, for example, a DC voltage supplied from the power management unit 203 or the power discharged from the power storage unit 204.

[0048] <3.1 Configuration of Receiver Horizontal Type> FIG. 3 is a schematic diagram showing a configuration example of the receiver 200. The receiver 200 shown in FIG. 3 has, for example, a cylindrical shape with a substantially rectangular cross section. The receiver 200 has an upper surface portion, a lower surface portion, and side surface portions. The upper surface portion represents a portion located on the upper surface in FIG. 3. The lower surface portion represents a portion located on the lower surface in FIG. 3. The side surface portions represent portions located on the side surfaces in FIG. 3. The upper surface portion and the lower surface portion are arranged to face each other. In the receiver 200 shown in FIG. 3, the upper surface portion and the lower surface portion are arranged substantially parallel to each other. The upper surface portion and the lower surface portion do not have to be arranged substantially parallel to each other. Also, the upper surface portion, the lower surface portion, and the side surface portions may be flat, curved, or a combination thereof, either entirely or partially.

[0049] The receiver 200 has, for example, a receiving antenna 201, a circuit portion 210, and a sensor 208.

[0050] The receiving antenna 201 has a longitudinal direction and a lateral direction and has a predetermined height. For example, the receiving antenna 201 has a width of 10 mm in the lateral direction, a width of 30 mm in the longitudinal direction, and a height of 8 mm. The width of 30 mm in the longitudinal direction is, for example, approximately the same length as one-tenth of the wavelength of a signal in the 920 MHz band where reception is assumed. Note that the size of the receiving antenna 201 is not limited to this and may be increased or decreased within a predetermined range. The receiving antenna 201 may be treated as a loop antenna or an inverted-F antenna.

[0051] The receiving antenna 201 includes a first conductor 2011 and a second conductor 2012. The first conductor 2011 is formed on the upper surface portion of the receiver 200 shown in FIG. 3. The first conductor 2011 is realized, for example, by a conductive layer formed on a PCB. The conductive layer formed on the PCB is realized, for example, by a copper foil.

[0052] The second conductor 2012 is realized by, for example, a conductive plate that constitutes the lower surface portion and both side surface portions of the receiver 200 shown in FIG. 3. The conductive plate is made of, for example, a metal plate such as copper or aluminum. The second conductor 2012 is formed by, for example, bending a single conductive plate. More specifically, for example, a single copper plate is bent to have a substantially U-shaped (substantially U-shaped or substantially C-shaped) cross-section. In the bending process, for example, a mold may be used to plastically process the copper plate or the like. The first conductor 2011 and the second conductor 2012 are connected, for example, by soldering the second conductor 2012 to a PCB.

[0053] The circuit portion 210 is formed on the upper surface portion of the receiver 200 shown in FIG. 3. The circuit portion 210 is mounted on, for example, a PCB. The circuit portion 210 includes a rectifier 202, a power management unit 203, a power storage unit 204, a microcomputer 205, a data transceiver 206, and a data transceiver antenna 207. A slit (gap) is formed in the first conductor 2011 in the vicinity of the region where the rectifier 202 is installed. In the receiver 200 shown in FIG. 3, the slit is formed on the upper surface portion. In FIG. 3, the circuit portion 210 is mounted in the spatial direction on the upper surface portion. The circuit portion 210 may be mounted in the direction of the lower surface portion on the upper surface portion.

[0054] The characteristic impedances of the first conductor 2011 and the second conductor 2012 and the characteristic impedance of the rectifier 202 are designed to be matched. Specifically, for example, the characteristic impedances of the first conductor 2011 and the second conductor 2012 and the characteristic impedance of the rectifier 202 are matched using complex conjugates. For example, the characteristic impedances of the first conductor 2011 and the second conductor 2012 are designed to be R + jX. Also, the characteristic impedance of the rectifier 202 is designed to be R - jX.

[0055] Sensor 208 is, for example, a sensor module having a predetermined size. Sensor 208 is, for example, a magnetic sensor. Sensor 208 is connected to circuit unit 210 by connecting to wiring formed on a PCB. Sensor 208 is disposed at a position penetrating the lower surface portion on the back side of the lower surface portion with respect to the upper surface portion. The distance between sensor 208 and the lower surface portion is based on, for example, the position where the state of the device is measured by sensor 208 when 200w is attached to the device. Note that sensor 208 does not necessarily have to be disposed so as to penetrate the lower surface portion. For example, wiring may be allowed to crawl on the surfaces of first conductor 2011 and second conductor 2012, and sensor 208 may be disposed at a position on the back side of the lower surface portion with respect to the upper surface portion. At this time, for example, circuit unit 210 and sensor 208 can be mounted on a rigid-flex substrate. By installing a ferrite bead or an inductor at the connection portion between the rigid portion and the flex portion of the rigid-flex substrate, it is possible to suppress the influence on receiving antenna 201 of the flex portion.

[0056] Note that the structure of receiver 200 is not limited to that shown in FIG. 3. For example, FIG. 3 shows a case where circuit unit 210 is attached in the spatial direction of the upper surface portion. The lower surface portion may be realized by a PCB, and first conductor 2011 may be formed on the lower surface portion. At this time, circuit unit 210 is mounted on the PCB of the lower surface portion. Circuit unit 210 may be mounted in the spatial direction of the lower surface portion or in the upper surface portion direction of the lower surface portion. Second conductor 2012 is realized, for example, by a conductive plate constituting the upper surface portion and both side surface portions.

[0057] Receiver 200 may be attached with a shielding material 252 for reflecting radio waves. Shielding material 252 is made of, for example, a conductive material, for example, metal. Shielding material 252 is formed so as to cover circuit unit 210 while avoiding the slit to which rectifier 202 is connected.

[0058] FIG. 4 shows an example of a schematic diagram of the receiver 200 when the shielding material 252 is attached. The shielding material 252 is attached, for example, in the space direction on the upper surface portion. Note that in FIG. 4, a case where the shielding material 252 covers the entire circuit portion 210 is shown, but the shielding material 252 may cover a part of the circuit portion 210. Also, the shielding material 252 may cover a plurality of locations instead of covering only one location of the circuit portion 210.

[0059] FIG. 5 shows another example of a schematic diagram of the receiver 200 when the shielding material 252 is attached. The shielding material 252 is attached, for example, in the direction of the lower surface portion on the upper surface portion. Note that in FIG. 5, a case where the shielding material 252 covers the entire back side of the upper surface portion is shown, but the shielding material 252 may cover a part of the back side of the upper surface portion. Also, the shielding material 252 may cover a plurality of locations instead of covering only one location of the back side of the upper surface portion.

[0060] <3.2 Installation of Receiver> The receiver 200 is installed, for example, on a predetermined device indoors. More specifically, for example, the receiver 200 is attached to the metal housing of the driving unit used indoors. Note that the attachment destination of the receiver 200 is not limited to the driving unit. For example, the receiver 200 may be attached to a predetermined frame. Also, the attachment destination of the receiver 200 is not limited to the metal housing. For example, the receiver 200 may be attached to a non-metal housing.

[0061] When the receiver 200 is attached to the metal housing of the driving unit, for example, it is stored in a housing 250 for attachment to the metal housing. The housing 250 is realized by a thermoplastic resin such as polycarbonate resin, for example.

[0062] FIG. 6 is a diagram showing an example of a schematic diagram of the receiver 200 stored in the housing 250. The receiver 200 is attached, for example, such that one surface of the housing 250 is in contact with the metal housing of the driving unit.

[0063] The housing 250 that houses the receiver 200 is not limited to being entirely made of resin. At least one surface of the housing 250 may be made of a conductive material, for example, metal.

[0064] FIG. 7 is a diagram showing an example of a schematic diagram of the receiver 200 when one surface of the housing 250 is made of metal. FIG. 8 is a diagram showing an example of a schematic diagram of a cross-sectional view of the A-A cross-section of FIG. 7. In the examples shown in FIGS. 7 and 8, the lower surface portion of the receiving antenna 201 and the metal portion 251 are in physical contact. Note that the sensor 208 is not shown in FIGS. 7 and 8. In FIGS. 7 and 8, when the sensor 208 is shown, for example, a hole is formed in the metal portion 251, and the sensor 208 is connected from the hole. Also, the metal portion 251 is not limited to physically contacting the lower surface portion. The metal portion 251 may be located, for example, on the side surface portion of the housing 250 and may be in physical contact with the side surface portion of the receiving antenna 201. Also, the metal portion 251 may be located, for example, on the upper surface portion of the housing 250 and may be in physical contact with the upper surface portion of the receiving antenna 201.

[0065] The metal portion 251 does not have to be in physical contact with the receiving antenna 201. For example, when the metal portion 251 is the lower surface portion of the housing 250, 251 may be in functional or electrical contact with the lower surface portion of the receiving antenna 201. Also, for example, when the metal portion 251 is the side surface portion of the housing 250, the metal portion 251 may be in functional or electrical contact with the side surface portion of the receiving antenna 201. Also, for example, when the metal portion 251 is the upper surface portion of the housing 250, the metal portion 251 may be in functional or electrical contact with the upper surface portion of the receiving antenna 201.

[0066] The metal part 251 may be shared with one surface of the receiving antenna 201. For example, in FIGS. 7 and 8, the metal part 251 may be integrated with the lower surface part of the receiving antenna 201. Similarly, in FIGS. 7 and 8, when the metal part 251 is a side surface part of the housing 250, the metal part 251 may be integrated with the side surface part of the receiving antenna 201. Also, in FIGS. 7 and 8, when the metal part 251 is an upper surface part of the housing 250, the metal part 251 may be integrated with the upper surface part of the receiving antenna 201.

[0067] <3.3 Manufacturing of Receiver> FIG. 9 is a block diagram showing a configuration example of a manufacturing system 600 for the receiver 200. In the present embodiment, the receiver 200 is manufactured using the manufacturing system 600 for the receiver 200. The manufacturing system 600 for the receiver 200 shown in FIG. 9 has, for example, a first assembling means 601, a second assembling means 602, and a cutting means 603. The first assembling means 601, the second assembling means 602, and the cutting means 603 are realized by, for example, one or a plurality of computers. The first assembling means 601, the second assembling means 602, and the cutting means 603 receive an instruction from an operator and execute operations related to each means.

[0068] The first assembling means 601 is, for example, means for attaching electronic components to a single substrate (PCB). Note that the area where the first assembling means 601 attaches the electronic components may be one surface of the substrate or both surfaces. The PCB is, for example, a single large substrate that has been confirmed to operate electrically normally and have no abnormalities in appearance. A pattern capable of attaching electronic components of a plurality of receivers 200 is formed on the PCB according to a predetermined rule. The predetermined rule represents, for example, a state in which the vertical and horizontal directions of the pattern are aligned and matched so that each of the structures after cutting can operate as a receiver 200 when the PCB is cut by the cutting means 603.

[0069] The first assembling means 601 mounts electronic components in the receiving system of the power supply signal (such as the rectifier 202, the power management unit 203 (PMS: Power Management System), the power storage unit 204, etc.) and electronic components in the transmitting system of the data signal (such as logic, the microcontroller 205 (MCU: Micro Controller Unit), the data transceiver 206, the data transmission / reception antenna 207, etc.) on the PCB according to the patterns formed on the PCB, for example. The first assembling means 601 mounts the electronic components on the PCB by soldering the electronic components to the PCB, for example.

[0070] FIG. 10 is a schematic diagram showing an example of the manufacturing process of the receiver 200. As shown in FIG. 10(a), the first assembling means 601 mounts a plurality of electronic components in each area defined by a single large PCB. The first assembling means 601 may mount the electronic components on the surface of the PCB shown in FIG. 10(a) or on the back surface. The first assembling means 601 mounts, for example, all of one type of electronic component on all the receivers 200 and sequentially transfers the electronic components to be mounted. Also, the first assembling means 601 may mount a plurality of electronic components one by one for each receiver 200, for example.

[0071] The second assembling means 602 is a means for mounting the second conductor 2012 on the PCB to which the electronic components are mounted. The second conductor 2012 is formed, for example, by bending a conductive plate made of a metal plate such as copper or aluminum. The second assembling means 602 solders the second conductor 2012 to the PCB so that the second conductor 2012 straddles the circuit portion mounted on the PCB. A conductive layer is formed on the PCB, and when the second conductor 2012 is mounted on the PCB, the conductive layer of the PCB and the second conductor 2012 are connected.

[0072] As shown in Fig. 10(b), the second assembling means 602 attaches a plurality of circuit parts attached to a single large PCB across each second conductor 2012. For example, in the PCB, the second assembling means 602 starts attaching the second conductor 2012 after all the electronic components have been attached. Also, when the first assembling means 601 attaches the electronic components for each receiver 200 one by one, the second assembling means 602 may sequentially attach the second conductor 2012 to the area where the attachment of the electronic components for one receiver 200 is completed.

[0073] The cutting means 603 is a means for cutting the PCB to which the electronic components and the second conductor 2012 are attached. For example, the cutting means 603 cuts the PCB based on the pattern forming rules in the PCB.

[0074] As shown in Fig. 10(c), for example, the cutting means 603 cuts the PCB along the grid. Each grid of the PCB has a circuit part and the second conductor 2012 attached thereto.

[0075] By manufacturing the receiver 200 as shown in Fig. 10, it becomes possible to efficiently manufacture a plurality of receivers 200.

[0076] <4.1 Configuration of Receiver Vertical Type> Figs. 11 and 12 are schematic diagrams showing other configuration examples of the receiver 200a. Fig. 11 represents a schematic diagram of the receiver 200a when viewed from a predetermined direction. Fig. 12 represents a schematic diagram of the receiver 200a shown in Fig. 11 when viewed from the back.

[0077] The receiver 200a shown in FIGS. 11 and 12 has, for example, a cylindrical shape with a substantially rectangular cross-section that is closed by a substrate. The receiver 200a has an upper surface portion, a lower surface portion, and side surface portions. The upper surface portion represents the portion located on the upper surface in FIGS. 11 and 12. The lower surface portion represents the portion located on the lower surface in FIGS. 11 and 12. The side surface portions represent the portions located on the side surfaces in FIGS. 11 and 12. The upper surface portion and the lower surface portion are arranged to face each other. A slit (gap) is formed in one of the side surface portions. In the receiver 200a shown in FIGS. 11 and 12, the upper surface portion and the lower surface portion are arranged substantially parallel to each other. The upper surface portion and the lower surface portion do not necessarily have to be arranged substantially parallel to each other. Also, the upper surface portion, the lower surface portion, and the side surface portions may be flat, curved, or a combination thereof, either entirely or partially.

[0078] The receiver 200a has, for example, a receiving antenna 201a, a back surface portion 209a, a circuit portion 210a, and a sensor 208.

[0079] The receiving antenna 201a has a longitudinal direction and a lateral direction and has a predetermined height. For example, the receiving antenna 201a has a width of 10 mm in the lateral direction, a width of 30 mm in the longitudinal direction, and a height of 8 mm. The width of 30 mm in the longitudinal direction is, for example, approximately the same length as one-tenth of the wavelength of a signal in the 920 MHz band where reception is assumed. Note that the size of the receiving antenna 201a is not limited to this and may be increased or decreased within a predetermined range. The receiving antenna 201a may be treated as a loop antenna or an inverted-F antenna.

[0080] The receiving antenna 201a is realized, for example, by a conductor having an annular shape. The receiving antenna 201a is realized, for example, by a conductive plate made of a metal such as copper or aluminum. The receiving antenna 201a is formed, for example, by bending a single conductive plate. More specifically, for example, a single copper plate is bent to have a substantially rectangular shape in a cross-sectional view. In the bending process, for example, a mold may be used to plastically process the copper plate or the like.

[0081] The circuit unit 210a is formed on the back surface portion 209a shown in FIGS. 11 and 12. The circuit unit 210a includes a rectifier 202a, a power management unit 203, a power storage unit 204, a microcomputer 205, a data transceiver 206, and a data transmission / reception antenna 207. In FIGS. 11 and 12, the case where the sensor 208 is mounted as a module is shown, but the sensor 208 may be formed as a circuit on the back surface portion 209a. That is, the sensor 208 may be surface-mounted on the back surface portion 209a. The rectifier 202a is connected to the gap on the side surface portion of the receiver 200a. The circuit unit 210a may be formed on both surfaces of the back surface portion 209a or on one surface thereof.

[0082] The back surface portion 209a is realized by a substrate such as a PCB, for example. The back surface portion 209a is arranged so as to close the cylindrical portion of the receiving antenna 201a, for example. The back surface portion 209a may close the entire cylindrical portion of the receiving antenna 201a or may close a part of the cylindrical portion, for example.

[0083] FIGS. 13 and 14 are schematic views showing a configuration example of the back surface portion 209a. FIG. 13 is a schematic view showing a configuration example of the back surface portion 209a on the side that does not contact the receiving antenna 201a. FIG. 14 is a schematic view showing a configuration example of the back surface portion 209a on the side that contacts the receiving antenna 201a. The hatched portions in FIGS. 13 and 14 represent insulators. That is, the hatching represents a region where no conductive material exists. In the back surface portion 209a, the conductive material is used in a limited region. For example, in the back surface portion 209a, the conductive material is used only for circuits, metal wires for connecting circuits, antenna elements, a part of the ground, vias, etc. In the back surface portion 209a, the insulator represented by the hatched portion may be hollowed out to be in a state of nothing.

[0084] In FIGS. 11 and 12, in the back surface portion 209a, the portion for attaching the sensor 208 protrudes from the receiving antenna 201a. However, the protruding portion is not limited to the portion for attaching the sensor 208. The back surface portion 209a may protrude in the direction of the upper surface portion, the side surface portion, the lower surface portion, and the direction of any combination of at least any of these. That is, the back surface portion 209a may be larger than the cross section of the receiving antenna 201a. The circuit portion 210a may be mounted in a region protruding from the receiving antenna 201a on the back surface portion 209a.

[0085] The characteristic impedance of the receiving antenna 201a and the characteristic impedance of the rectifier 202a are designed to match. Specifically, for example, the characteristic impedance of the receiving antenna 201a and the characteristic impedance of the rectifier 202a are matched using complex conjugates. For example, the characteristic impedance of the receiving antenna 201a is designed to be R + jX. Also, the characteristic impedance of the rectifier 202a is designed to be R - jX.

[0086] The sensor 208 is, for example, a sensor module having a predetermined size. The sensor 208 is, for example, a magnetic sensor and is connected to wiring formed on a substrate. The receiver 200a can be expected to have a reception efficiency approximately the same as that of the receiver 200.

[0087] A shielding material for reflecting radio waves may be attached to the receiver 200a. The shielding material is made of, for example, a conductive material, for example, metal. The shielding material is attached so as to cover, for example, a part of the back surface portion 209a. Specifically, the shielding material is attached so as to cover, for example, the rectifier 202a. The shielding material may be attached to the receiving antenna 201a side of the back surface portion 209a or to the space side.

[0088] <4.2 Installation of Receiver> The receiver 200a is installed in a predetermined indoor device, for example. More specifically, for example, the receiver 200a is attached to the metal housing of the driving unit used indoors. Note that the attachment destination of the receiver 200a is not limited to the driving unit. For example, the receiver 200a may be attached to a predetermined frame. Also, the attachment destination of the receiver 200 is not limited to the metal housing. For example, the receiver 200a may be attached to a non-metal housing.

[0089] When the receiver 200a is attached to the metal housing of the driving unit, for example, it is stored in a housing for attachment to the metal housing. The housing is realized by a thermoplastic resin such as polycarbonate resin, for example. The housing for storing the receiver 200a is not limited to one entirely realized by resin. At least one surface of the housing may be realized by a conductive material, for example, metal.

[0090] Any surface of the housing may be realized by the conductive material. The conductive material may be in physical contact with the receiving antenna 201a of the receiver 200a stored in the housing, or may be in functional or electrical contact. The conductive material in the housing may be integrated with at least a part of the receiving antenna 201a.

[0091] <4.3 Manufacturing of Receiver> In this embodiment, the receiver 200a is manufactured using the manufacturing system 600a of the receiver 200a. The manufacturing system of the receiver 200a has, for example, a first assembling means 601a, a second assembling means 602a, and a cutting means 603a.

[0092] The first assembling means 601a is a means for attaching electronic components to, for example, a single substrate (PCB). Note that the area where the first assembling means 601a attaches the electronic components may be one side of the substrate or both sides. The PCB is, for example, a single large substrate that has been confirmed to operate electrically normally and have no abnormalities in appearance. On the PCB, patterns enabling attachment of a plurality of electronic components of the receivers 200 are formed according to a predetermined rule. The predetermined rule represents, for example, a state where the vertical and horizontal directions of the pattern are aligned so that each of the structures after cutting can operate as a receiver 200a when the PCB is cut by the cutting means 603a.

[0093] The first assembling means 601a attaches electronic components of the power supply signal receiving system (power management unit 203 (PMS: Power Management System), power storage unit 204, etc.) and electronic components of the data signal transmission system (logic, microcontroller 205 (MCU: Micro Controller Unit), data transceiver 206, data transmission / reception antenna 207, etc.) to the PCB according to the patterns formed on the PCB. The first assembling means 601a attaches the electronic components to the PCB, for example, by soldering the electronic components to the PCB.

[0094] FIG. 15 is a schematic diagram showing an example of the manufacturing process of the receiver 200a. As shown in FIG. 15(a), the first assembling means 601a attaches a plurality of electronic components to each area defined by a single large PCB. The first assembling means 601a may attach the electronic components to the front surface or the back surface of the PCB shown in FIG. 15(a). The first assembling means 601a, for example, attaches all of one type of electronic component to all the receivers 200a and sequentially transfers the electronic components to be attached. Also, the first assembling means 601a may attach a plurality of electronic components one by one for each receiver 200a, for example.

[0095] The second assembling means 602a is a means for attaching the receiving antenna 201a to a PCB to which electronic components are attached. The receiving antenna 201a is formed, for example, by bending a conductive plate made of a metal plate such as copper or aluminum. The second assembling means 602a solders the receiving antenna 201a to the PCB such that the circuit portion 210a attached to the PCB is surrounded by the receiving antenna 201a bent in a circular shape.

[0096] As shown in FIG. 15(b), the second assembling means 602a attaches a plurality of circuit portions 210a attached to a single large PCB so as to be surrounded by respective receiving antennas 201a. The second assembling means 602a starts attaching the receiving antenna 201a, for example, when the attachment of a plurality of electronic components to the PCB is completed. Also, when the first assembling means 601a attaches the electronic components for one receiver 200a at a time, the second assembling means 602a may sequentially attach the receiving antenna 201a to the area where the attachment of the electronic components for one receiver 200a is completed.

[0097] The cutting means 603a is a means for cutting the PCB to which the electronic components and the receiving antenna 201a are attached. The cutting means 603a cuts the PCB based on, for example, the pattern forming rules in the PCB.

[0098] As shown in FIG. 15(c), the cutting means 603a cuts the PCB, for example, along the grid. Each grid of the PCB has a circuit portion 210a and a receiving antenna 201a attached thereto.

[0099] As shown in FIG. 15, by manufacturing the receiver 200a, it becomes possible to efficiently manufacture a plurality of receivers 200a.

[0100] As described above, in the above embodiment, the first assembling means 601 attaches a plurality of circuits (circuit units 210) to a single substrate. The second assembling means 602 attaches a conductor (second conductor 2012) bent in a bridge shape to each of the plurality of circuit units 210 on the substrate. The cutting means 603 cuts the substrate to which the second conductor 2012 is attached. As a result, it becomes possible to efficiently manufacture a plurality of receivers 200 at once from a single substrate.

[0101] Therefore, according to the system according to the present embodiment, it is possible to reduce the manufacturing cost of the receiver 200 used in the wireless power feeding system.

[0102] Also, in the above embodiment, the first assembling means 601a attaches a plurality of circuits (circuit units 210a) to a single substrate. The second assembling means 602a attaches a reception antenna 201a bent in a ring shape on the substrate so as to surround each of the plurality of circuit units 210a with the conductor (reception antenna 201a) bent in a ring shape. The cutting means 603a cuts the substrate to which the reception antenna 201a is attached. As a result, it becomes possible to efficiently manufacture a plurality of receivers 200a at once from a single substrate.

[0103] Also, in the above embodiment, the circuit unit 210a includes a sensor 208. As a result, it becomes possible to surface-mount the sensor 208 on the back surface portion 209a, and it becomes possible to further reduce the manufacturing cost of the receiver 200a.

[0104] Also, in the above embodiment, the receiver 200a is composed of a conductor having a predetermined width, and includes a reception antenna 201a having a ring shape, a substrate (back surface portion 209a) arranged so as to close the cylindrical portion of the ring-shaped reception antenna 201a, and a circuit (circuit unit 210a) formed on the substrate. As a result, it becomes possible to provide a receiver 200a that is small and can be mass-produced. Further, since the structure of the reception antenna 201a is supported by the substrate, it becomes possible to improve the strength of the receiver 200a.

[0105] In the above-described embodiment, the back surface portion 209a has a shape larger than that of the annular receiving antenna 201a, and a circuit portion 210a or a module is mounted in the region outside the receiving antenna 201a. Thus, by increasing the size of the back surface portion 209a, it becomes possible to mount a large number of electronic components, and structural limitations when mounting the circuit portion 210a are eliminated.

[0106] In the above-described embodiment, the sensor 208 is mounted in the region outside the receiving antenna 201a on the back surface portion 209a. Thus, it becomes possible to surface-mount the sensor 208.

[0107] In the above-described embodiment, the metal provided on the back surface portion 209a is a circuit and a metal structure for connecting the circuits. Thus, it becomes possible to suppress the metal formed on the back surface portion 209a. When the cylindrical portion formed by the receiving antenna 201a is blocked by a conductor, the distribution of the electric field generated in the receiving antenna 201a is disturbed, and the reception efficiency of the power supply signal by the receiving antenna 201a decreases. By blocking the cylindrical portion with the back surface portion 209a in which the mounting of the conductive material is suppressed, it is possible to suppress the disturbance of the distribution of the electric field in the receiving antenna 201a.

[0108] In the above-described embodiment, the receivers 200 and 200a are stored in a housing. At least one surface of the housing is made of metal (metal portion 251). The receiving antennas 201 and 201a are electrically connected to the metal portion 251. Thus, the receivers 200 and 200a maintain their reception efficiency even when stored in the housing.

[0109] In the above-described embodiment, at least a part of the receiving antennas 201 and 201a is integrated with the metal portion 251. Thus, it becomes possible to efficiently manufacture the housing.

[0110] In the above-described embodiment, a shield that covers at least a part of the circuit (circuit portions 210 and 210a) is provided. Thus, it is possible to suppress the secondary radiation generated in the receivers 200 and 200a.

[0111] <Basic Hardware Configuration of a Computer> FIG. 16 is a block diagram showing the basic hardware configuration of a computer 90. The computer 90 includes at least a processor 91, a main memory device 92, an auxiliary storage device 93, and a communication IF 99 (Interface). These are electrically connected to each other by a bus.

[0112] The processor 91 is hardware for executing an instruction set described in a program. The processor 91 is composed of an arithmetic unit, registers, peripheral circuits, and the like.

[0113] The main memory device 92 is for temporarily storing a program and data processed by the program and the like. For example, it is a volatile memory such as DRAM (Dynamic Random Access Memory).

[0114] The auxiliary storage device 93 is a storage device for storing data and programs. For example, it includes a flash memory, an HDD (Hard Disc Drive), a magneto-optical disk, a CD-ROM, a DVD-ROM, a semiconductor memory, and the like.

[0115] The communication IF 99 is an interface for inputting and outputting signals for communicating with other computers via a network using a wired or wireless communication standard. The network is composed of various mobile communication systems constructed by the Internet, a LAN, a wireless base station, and the like. For example, the network includes 3G, 4G, 5G mobile communication systems, LTE (Long Term Evolution), a wireless network (e.g., Wi-Fi (registered trademark)) that can be connected to the Internet by a predetermined access point, and the like. When connecting wirelessly, communication protocols such as Z-Wave (registered trademark), ZigBee (registered trademark), Bluetooth (registered trademark), etc. are included. When connecting wired, the network includes those directly connected by a USB (Universal Serial Bus) cable or the like.

[0116] Note that all or part of each hardware configuration can be provided by being distributed among a plurality of computers 90 and connected to each other via a network, so that the computer 90 can be virtually realized. In this way, the computer 90 is a concept including not only a single housing and the computer 90 housed in a case, but also a virtualized computer system.

[0117] <Basic Functional Configuration of Computer 90> The functional configuration of the computer realized by the basic hardware configuration of the computer 90 shown in FIG. 16 will be described. The computer includes at least functional units of a control unit, a storage unit, and a communication unit.

[0118] Note that the functional units included in the computer 90 can also be realized by distributing all or part of each functional unit among a plurality of computers 90 connected to each other via a network. The computer 90 is a concept including not only a single computer 90, but also a virtualized computer system.

[0119] The control unit is realized by the processor 91 reading out various programs stored in the auxiliary storage device 93 and expanding them in the main storage device 92, and executing processing according to the programs. The control unit can realize a functional unit that performs various information processes according to the type of program. Thereby, the computer is realized as an information processing device that performs information processing.

[0120] The storage unit is realized by the main storage device 92 and the auxiliary storage device 93. The storage unit stores data, various programs, and various databases. Further, the processor 91 can secure a storage area corresponding to the storage unit in the main storage device 92 or the auxiliary storage device 93 according to the program. Further, the control unit can cause the processor 91 to execute addition, update, and deletion processing of the data stored in the storage unit according to various programs.

[0121] The database refers to a relational database, which is for managing a set of data called a tabular table structurally defined by rows and columns by associating them with each other. In a database, a table is called a table, a column of a table is called a column, and a row of a table is called a record. In a relational database, relationships between tables can be set and associated. Normally, each table is set with a column that serves as a key for uniquely identifying records, but setting a key for a column is not essential. The control unit can cause the processor 91 to add, delete, or update records in a specific table stored in the storage unit according to various programs.

[0122] The communication unit is realized by the communication IF99. The communication unit realizes the function of communicating with other computers 90 via a network. The communication unit can receive information transmitted from other computers 90 and input it to the control unit. The control unit can cause the processor 91 to perform information processing on the received information according to various programs. Also, the communication unit can transmit the information output from the control unit to other computers 90.

[0123] As described above, some embodiments of the present disclosure have been explained, but these embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are to be included in the scope and gist of the invention, as well as in the invention described in the claims and its equivalent scope.

[0124] Also, in the above description, the "processor" is one or more processors. At least one processor is typically a microprocessor such as a CPU (Central Processing Unit), but it may also be another type of processor such as a GPU (Graphics Processing Unit). At least one processor may be single-core or multi-core.

[0125] Further, at least one processor may be a processor in a broad sense, such as a hardware circuit (e.g., FPGA (Field-Programmable Gate Array) or ASIC (Application Specific Integrated Circuit)) that performs part or all of the processing.

[0126] Also, in the above description, the expression such as "xxx table" may be used to describe information from which an output can be obtained for an input. However, this information may be data of any structure or a learning model such as a neural network that generates an output for an input. Therefore, "xxx table" can be referred to as "xxx information".

[0127] Also, in the above description, the configuration of each table is an example. One table may be divided into two or more tables, or all or part of two or more tables may be one table.

[0128] Also, in the above description, the "program" may be used as the subject to describe the processing. However, since the program is executed by a processor to perform the defined processing while appropriately using a storage unit and / or an interface unit, etc., the subject of the processing may be the processor (or a device such as a controller having the processor, a microcomputer).

[0129] The program may be installed in a device such as a computer, or may be in, for example, a program distribution server or a computer-readable (e.g., non-transitory) recording medium. Also, in the following description, two or more programs may be realized as one program, or one program may be realized as two or more programs.

[0130] Also, in the above description, an identification number is used as the identification information for various objects, but other types of identification information (e.g., an identifier including letters and symbols) may be adopted.

[0131] Also, in the above description, when describing elements of the same kind without distinction, reference signs (or common signs among the reference signs) are used, and when describing elements of the same kind separately, identification numbers (or reference signs) of the elements may be used.

[0132] Also, in the following description, the control lines and information lines indicate those considered necessary for the description, and not necessarily all the control lines and information lines on the product are shown. All the components may be interconnected.

[0133] The functions realized by the components described in this specification may be implemented in circuitry or processing circuitry including a general-purpose processor, an application-specific processor, an integrated circuit, ASICs (Application Specific Integrated Circuits), a CPU (a Central Processing Unit), a conventional circuit, and / or a combination thereof, which are programmed to realize the described functions. The processor includes transistors and other circuits and is regarded as circuitry or processing circuitry. The processor may be a programmed processor that executes a program stored in a memory. In this specification, circuitry, unit, and means are hardware programmed to realize the described functions or hardware that executes the functions. The hardware may be any hardware disclosed in this specification or any hardware known as being programmed or executing to realize the described functions. When the hardware is regarded as a processor of the circuitry type, the circuitry, means, or unit is a combination of the hardware and the software used to configure the hardware and / or the processor.

[0134] <Appendix> The matters described in each of the above embodiments are appended below. (Appendix 1) In a wireless power supply system, a method for manufacturing a plurality of receivers that receive a power supply signal from a transmitter that transmits the power supply signal and generate electric power, the method comprising: mounting a plurality of circuits on a single substrate; mounting, on the substrate, a conductor bent in a bridge shape for each of the plurality of circuits; and cutting the substrate to which the conductor is mounted. (Appendix 2) In a wireless power supply system, a method for manufacturing a plurality of receivers that receive a power supply signal from a transmitter that transmits the power supply signal and generate electric power, the method comprising: mounting a plurality of circuits on a single substrate; mounting, on the substrate, a conductor bent in an annular shape so as to surround each of the plurality of circuits with the conductor bent in an annular shape; and cutting the substrate to which the conductor is mounted. (Appendix 3) The circuit includes a sensor. The method according to (Appendix 2). (Appendix 4) A receiver comprising: an antenna made of a conductor having a predetermined width and having an annular shape; a substrate disposed so as to close a cylindrical portion of the annular antenna; and a circuit formed on the substrate. (Appendix 5) The substrate has a shape larger than that of the annular antenna, and a circuit or a module is mounted in a region outside the antenna. The receiver according to (Appendix 4). (Appendix 6) A sensor is mounted in a region outside the antenna of the substrate. The receiver according to (Appendix 5). (Appendix 7) The metal provided on the substrate is a circuit and a metal structure for connecting the circuits. The receiver according to any one of (Appendix 4) to (Appendix 6). (Appendix 8) A housing that covers the whole and at least one surface of which is metal, and the antenna is electrically connected to the metal of the housing. The receiver according to any one of (Appendix 4) to (Appendix 7). (Appendix 9) At least a part of the antenna is integrated with the metal of the housing (the receiver described in Supplementary Note 8). (Supplementary Note 10) The receiver according to any one of (Supplementary Note 4) to (Supplementary Note 9), comprising a shield covering at least a part of the circuit.

Explanation of Signs

[0135] 1…WPT system 100…Transmitter 101…Oscillator 102…Transmitting antenna 103…Microcomputer 104…Data transceiver 105…Data transmission / reception antenna 200…Receiver 201…Receiving antenna 202…Rectifier 203…Power management unit 204…Power storage unit 205…Microcomputer 206…Data transceiver 207…Data transmission / reception antenna 300…First information processing device 400…Second information processing device

Claims

1. A method for manufacturing a plurality of receivers in a wireless power supply system, the receivers receiving a power supply signal from a transmitter that transmits the power supply signal and generating power, comprising the steps of: Attaching a plurality of circuits to a single board; Attaching a conductor that forms a part of a receiving antenna for receiving the power supply signal to each of the plurality of circuits on the substrate, the conductor being deformed so as to have a cylindrical shape together with the substrate after cutting when attached to the substrate; cutting the substrate with the conductor attached; A method for providing the above.

2. A method for manufacturing a plurality of receivers in a wireless power supply system, the receivers receiving a power supply signal from a transmitter that transmits the power supply signal and generating power, comprising the steps of: Attaching a plurality of circuits to a single board; a step of attaching a cylindrically bent conductor on the substrate so as to surround each of the plurality of circuits, the cylindrically bent conductor forming a receiving antenna for receiving the power supply signal; cutting the substrate with the conductor attached; A method for providing the above.

3. The method of claim 2 , wherein the circuitry includes a sensor.

4. an antenna made of a conductor having a predetermined width, having a cylindrical shape, and functioning as a receiving antenna for receiving a power supply signal; A substrate disposed so as to cover a cylindrical portion of the antenna; A circuit formed on the substrate; A receiver comprising:

5. 5. The receiver according to claim 4, wherein the substrate is larger than the cylindrical antenna, and a circuit or a module is mounted in an area outside the antenna.

6. 6. The receiver of claim 5, wherein a sensor is mounted on the substrate in an area outside the antenna.

7. an antenna made of a conductor having a predetermined width, having a cylindrical shape, and functioning as a receiving antenna for receiving a power supply signal; a substrate on which a metal is disposed, the substrate being disposed so as to cover a cylindrical portion of the cylindrical antenna; A circuit formed on the substrate; Equipped with The metal is a circuit and a metal structure for connecting the circuit.

8. A housing that covers the entire device and has at least one surface made of metal, 5. The receiver according to claim 4, wherein the antenna is electrically connected to a metal of the housing.

9. 9. The receiver of claim 8, wherein at least a portion of the antenna is integral with the metal of the housing.

10. 5. The receiver of claim 4, further comprising a shield covering at least a portion of said circuitry.

Images