Composition for use in the manufacture of in-mold electronics (IME) components

Abstract

A composition for use in the manufacture of in-mold electronic (IME) components, the composition comprising a binder comprising a crosslinking agent comprising melamine formaldehyde, a thermoplastic resin comprising hydroxyl groups, and a solvent.

Description

Technical Field

[0001] The present invention relates to a composition for use in manufacturing in-mould electronic (IME) components, a method for manufacturing the composition, a method for manufacturing in-mould electronic (IME) components, and in-mould electronic (IME) components.

Background Art

[0002] There is a high demand for the development of reliable, robust, lightweight, decorative, and three-dimensionally (3D) shaped human-machine interface electronic devices for the development of next-generation automotive, white goods, or household appliance applications.

[0003] Film Insert Molding (FIM) is a process known for integrating graphics, labels, and components into plastic parts during the molding process. Film Insert Molding is in the form of In-Mold Decorating (IMD) or In-mold Labeling (IML). The FIM process enables the creation of a single, decorated plastic part from a two-dimensional (2D) to a curved and complex-shaped 3D design, which is durable, lightweight, and can be used for multiple applications. In a typical FIM process, the decoration (color and light transmissibility) and surface functionality (scratch, anti-reflection, anti-glare, gloss, matte, fingerprint prevention, etc.) of the thermoplastic film are designed according to the needs of the application and integrated to produce a robust, complex-shaped, and decorative plastic part. This technology is well-known for producing decorative parts for automotive, handheld electronic devices, and consumer products, while some recent examples show attempts to integrate electronic functions. One of the methods for preparing such structures is by injection molding of screen-printed and / or thermoformed conductive and dielectric ink-printed electronic circuits.

[0004] It is desirable to produce 3D injection molded lightweight plastic structures that can perform electronic device functions. These structures can be produced, for example, by screen printing interconnect circuits on a flexible polymer substrate such as polycarbonate (PC) and polyethylene terephthalate (PET), attaching / assembling electronic components to these screen printed circuits, thermoforming to produce a 3D structure of such an electronic device device, and subsequently injecting a liquid resin into the back side of the thermoformed structure by injection molding to produce a robust and solid plastic structure. Such structures can be designed to perform capacitive and resistive touch switch applications for wireless or Bluetooth connectivity, control of volume or light intensity, and many such applications. These injection molded electronic device structures are referred to as in-mold electronics (IME), or injection molded structural electronics (IMSE), or plastronics, or surface electronics.

[0005] The IME technology consists of the integration of several electronic device and plastic manufacturing process steps: screen printing of electronic inks (conductive inks and dielectric inks), drying or curing of the electronic inks, attachment or electronic assembly of components using electronic adhesives, thermoforming and trimming to produce curved or 3D structures, and backfilling of these curved or 3D structures with molten resin by injection molding. Figure 1 shows a schematic diagram of the general manufacturing process steps of IME. Four broad manufacturing process steps are schematically represented in Figure 1. In A (screen printing and drying), a schematic diagram of a 2D screen-printed interconnect is shown, where 10 represents a thermoformable PC or PET substrate, 20 represents a screen-printed electrical conductive interconnect, and 30 represents a screen-printed electrical insulating dielectric layer. In B (electronic component assembly (SMT components, LEDs, etc.)), a schematic diagram of a 2D electronic circuit with electronic components, LEDs, etc. attached is shown. 40, 50, and 60 represent different SMT components or LEDs. In C (thermoforming [vacuum or high air pressure and temperature (140 - 210 °C)]), a schematic diagram of a thermoformed 3D electronic circuit (70) is shown. In D (injection molding [temperature (170 - 330 °C)]), a schematic diagram of an injection-molded (filled with injection-molded resin), thermoformed, 3D electronic circuit (80) is shown.

[0006] The functionality of the electronic device can be integrated with the FIM structure in either two films or a single film laminate. In the two-film laminate, the plastic layer printed with electronic device ink is prepared separately by screen printing of conductive ink or dielectric ink, which is further integrated with the decorative plastic coated with graphic ink during the injection molding step. Both the decorative and electronic functions in the single-layer film structure can be fabricated in a continuous manner starting with the screen printing of the graphic ink layer, followed by the screen printing of the electronic ink (conductive ink and dielectric ink), and component attachment using a conductive or non-conductive adhesive, and then the entire laminate is further thermoformed and back-injection molded. The plastic substrate is typically PC or PET, and the injection molding resin is typically selected from polycarbonate (PC), polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyester, poly(methyl methacrylate) (PMMA), low density polyethylene (LDPE), high-density polyethylene (HDPE), polystyrene (PS), and thermoplastic polyurethane (TPU), etc.

[0007] Typical polymer thick film inks (e.g., silver, carbon, etc., and UV / thermosetting dielectric inks) and conductive adhesives are used to form flexible circuits on PC and PET substrates. Although these inks are very flexible, they cannot be thermoformed because they show breaks and cracks during thermoforming and thus cannot be used for IME device fabrication.

[0008] Fabrication of IME devices requires integration of different processing conditions, screen printing, component assembly, thermoforming, trimming, and injection molding, and thus there are several issues that need to be resolved in order to develop a fully functional and reliable IME structure. The material properties of each of these steps, as well as the processing conditions and parameters, can further affect the performance of the IME device at different stages.

[0009] For example, in order to achieve excellent thermoforming performance of the laminate, all inks (graphic ink layer and electronic ink layer) and substrates need to be highly compatible with each other and have similar thermal stability and modulus of elasticity characteristics. Furthermore, such compatibility and thermal stability of the inks and substrates significantly contribute to the success of the injection molding process that governs the overall stability and reliability of such IME structures.

[0010] Therefore, the following problems are related to the compositions for use in the manufacture of IME components.

[0011] Screen Printing and Drying: One of the key requirements of electronic ink materials is their screen printability. For example, screen printing of conductive traces with well-defined width, thickness, and controlled porosity is extremely important for constructing high-performance interconnects to build circuits, touch switches, lighting devices, and other similar devices. Similarly, printing of a thin, uniform, pinhole-free insulating or encapsulating film is important for constructing multilayer circuits that often act as crossover dielectrics. Variations in the deposited structure can significantly affect the electrical function of the IME and the performance of similar structures, and thus will increase the defect rate during manufacturing. Similarly, precise dispensing, spraying, stencil printing, casting of conductive and non-conductive adhesives and encapsulants are required for assembling electronic components onto such interconnect structures.

[0012] Controlling the rheology and viscosity of these formulations is one of the most important features and is involved in depositing conductive traces and non-conductive layers without such defects. Efficient drying and curing of these screen-printed materials is essential to minimize defects during thermoforming and injection molding processes, thereby increasing the yield of the overall IME process. Additionally, any printing and drying defects can also separately affect the electrical and reliability performance of 3D structured electronics or IME components.

[0013] Optimization of the formulation with suitable and compatible chemicals is desirable to achieve fast and complete drying, still have a longer screen life during printing, and provide other functional requirements such as electrical conductivity, stretchability, and stability during injection molding. Along with the storage stability of these compositions, a longer screen life is important for industrial applicability and manufacturability.

[0014] Compatibility: Along with the compatibility with different flexible polymer substrates, decorative inks, adhesives, encapsulants, and injection molding resins, the mutual compatibility of dielectric and conductive materials is the other of the most important aspects for the manufacture of IMEs and similar structures. In most cases, the chemical functional groups of these materials are involved in their compatibility, and a perfect match is the key to manufacturing robust and high-performance IMEs and similar structures, while incompatible materials will result in defective and unreliable electronic devices. An incompatible combination of materials causes several obstacles such as corrosion, dissolution, and delamination of the underlying layer where another new layer is deposited.

[0015] Electrical properties: Conductive electronic materials should have the desired electrical conductivity to form electronic device devices capable of switch switching, lighting, and touch functions. Furthermore, for the construction of structures, higher electrical conductivity is desirable, and these are capable of carrying high currents for performing wireless signal processing, Bluetooth connection, and ultra-high frequency sensing functions. The processing of such conductive electronic materials needs to be strictly below 150 °C due to the stability threshold of most flexible substrates, which are options for the manufacture of IMEs and similar structures. Such conductive materials also need to maintain their electrical paths before and after the thermoforming process without significantly changing their electrical conductivity. It would also be important to control the dielectric properties for effective insulation of high-current electrical devices. In addition, such conductors and dielectrics must have sufficient thermal stability to withstand injection molding processing conditions. To balance the electrical properties with other functional requirements such as thermoformability and injection molding stability, it is necessary to blend high-performance conductive and non-conductive polymer composites.

[0016] Assembly of electronic components: Typical options for assembling electronic components such as passive components and LEDs are to use conductive and non-conductive adhesives, which also need to withstand thermoforming and injection molding process steps. Conductive and non-conductive adhesive compositions are also disclosed, and these can either be screen printed or dispensed for assembling passive components, LEDs, QFPs, QFNs, and other similar components.

[0017] Thermoformability: To fabricate IMEs and similar structures, it is necessary to deposit electronic materials on a flexible polymer substrate to create a 2D printed electronic device structure by screen printing, and then convert it into a 3D form by a thermoforming process. The thermoforming process of functional materials on various substrates has been opened up to create new designs and patterns in 3D form, which were impossible with traditional printed circuit board technology. The thermoforming process is a process that utilizes heat to soften the substrate above its glass transition / softening temperature, and this temperature varies for each substrate. High vacuum or high pressure is also applied to the softened plastic, and a specific size and shape are given during the thermoforming process. Several other processing conditions such as the time and temperature of the thermoforming process, the design of the tool, i.e., the depth or height of the tool, and the vacuum pressure need to be optimized to obtain very good 3D parts. The challenge is to design high-performance polymer composites that can be screen printed, and the electrical properties (width and thickness) of the screen-printed traces can be predictably controlled as a function of thermoforming strain and process conditions.

[0018] In addition, the aesthetic appearance before and after thermoforming, very good adhesion to the above substrate before and after thermoforming, i.e., no delamination of the ink layers occurs during thermoforming, especially the compatibility with different inks such as dielectrics for multilayer composite structures during thermoforming, i.e., laminate compatibility, flexibility and elongation such that no cracks are shown during thermoforming, i.e., the behavior of material properties during thermoforming, etc. In addition, some other aesthetic defects such as imprinting (ghosting) of electronic circuits should be avoidable and are often caused by an inappropriate combination of design parameters, thermoforming processing conditions, and improper selection of mold, due to the incompatibility of conductive and dielectric inks with the substrate or the substrate coated with graphic ink coating.

[0019] Stability during injection molding: Screen-printed and thermoformed flexible electronic device structures are injection molded to provide structural stability, rigidity, and reliability requirements. Based on the performance requirements of IMEs and similar structures, various resins such as PC, ABS, ABS-PC blends, polyester, PP, and TPU are used. Higher processing temperatures and injection pressures are very harsh on screen-printed circuits that need to directly face the flow of hot injection-molded resin. Therefore, one of the key requirements for electronic materials, their thermal stability as well as their compatibility with the incoming injection-molded resin, and high-temperature adhesion to the underlying substrate to resist any structural deformation and breakage. Often, such deformation and breakage of screen-printed features during injection molding is called "ink wash-off". Ink wash-off is a significant factor that can reduce the manufacturing yield of IME devices. In addition, the change in resistance before and after injection molding must also be minimized. Along with the material composition, the circuit design is the key to avoiding ink wash-off during injection molding.

[0020] Reliability: Typical IME devices need to pass several environmental tests such as 85°C / 85RH, thermal aging, thermal cycling, lighting tests, etc. The reliability of IMEs and similar structures ultimately depends on the accuracy of all the above factors considered, as well as the compatibility of all materials, substrates, and components. Sufficient knowledge and iteration are required to select different compatible raw materials and compound and optimize highly compatible electronic device materials. The selection and optimization of the ratio of appropriate inorganic fillers, polymer resins, solvents, and functional additives are important for optimizing such electronic compositions for manufacturing IMEs and similar structures.

[0021] The present invention seeks to address at least some of the problems associated with the prior art or, at least, to provide a commercially acceptable alternative thereto. SUMMARY OF THE INVENTION

[0022] In a first aspect, the present invention is a composition for use in manufacturing in-mold electronics (IME) components, comprising: a crosslinking agent comprising melamine formaldehyde; a thermoplastic resin containing hydroxyl groups; a solvent, and a binder-containing composition.

[0023] Each aspect or embodiment defined herein can be combined with any other aspect or embodiment unless otherwise explicitly indicated. In particular, any feature shown to be preferred or advantageous may be combined with any other feature shown to be preferred or advantageous.

[0024] The inventors have surprisingly found that the composition is particularly suitable for use in the manufacture of IME components, for example as conductive ink or dielectric ink, and can result in the manufacture of IME components having excellent robustness, environmental durability / durability, mechanical flexibility, and improved operating life for electronic device applications compared to conventional IME components.

[0025] As will be discussed in more detail below, the composition can include solid particles such as conductive and non-conductive particles. The binder serves to "bind" these components of the composition together. If the composition includes solid particles, the binder can form the remainder of the composition together with any unavoidable impurities. If the composition does not contain solid particles, the binder together with any unavoidable impurities can constitute the entire composition.

[0026] The term "melamine formaldehyde" as used herein can include resins having a melamine ring terminated with a plurality of hydroxyl groups derived from the condensation product of two monomers, melamine, and formaldehyde. Melamine formaldehyde may be referred to as "melamine formaldehyde resin", "melamine resin", or simply "melamine".

[0027] As used herein, the term "thermoplastic resin" may include a plastic polymer material that becomes flexible or moldable at a certain elevated temperature and solidifies upon cooling.

[0028] As used herein, the term "component" may include, for example, part or all of an electronic component.

[0029] During a typical IME manufacturing process, a composition such as a conductive ink or a dielectric ink is printed onto a thermoformable substrate. Then, prior to thermoforming, the composition is typically dried at an elevated temperature of up to 150 °C, such as 50 - 120 °C, for a certain period of time to remove the solvent from the composition. Without being bound by theory, for example, when the composition of the present invention is heated using such typical drying temperatures and times, it is believed that the melamine resin may react with the hydroxyl groups of the thermoplastic resin to form a "nitrogen-carbon-oxygen" bonded polymer network.

[0030] Advantageously, when dried under such conditions, the binder of the present invention may exhibit two opposing properties. At the normal operating temperature of an IME device (e.g., about -20 °C to +50 °C), the binder may act like a thermosetting material exhibiting exceptional strength, cohesion, and interlayer adhesion, as well as a moderate ability to stretch and contract. However, at a higher temperature used during thermoforming, the binder may transform into a thermoplastic material that can be easily thermoformed into a 3D structure without necking, breaking, or delamination.

[0031] Without being bound by theory, these opposing properties may result from the use of a crosslinking agent containing melamine formaldehyde with a hydroxyl group-containing resin. In particular, this advantageous balance between thermoplastic and thermosetting properties is believed to be achieved by the occurrence of partial, i.e., not complete, crosslinking. This is perhaps because compared to the crosslinking agents used in conventional IME methods, melamine formaldehyde is a relatively "slow" crosslinking agent and results in only partial crosslinking as a result of the drying temperatures and times used in typical IME manufacturing processes.

[0032] During a typical IME manufacturing process, multiple thermoformable compositions are used to form final components such as conductive inks, dielectric inks, conductive adhesives, non-conductive adhesives, encapsulants, barrier layers, and the like. Advantageously, when the compositions of the present invention are used as a common platform, the compatibility of these materials can be improved. Each of these materials may of course contain different species (e.g., conductive particles, non-conductive particles, etc.), but the use of a common binder can ensure the compatibility between materials (e.g., between inks). As a result, problems associated with delamination between layers of different materials can be reduced, for example.

[0033] These compositions are compatible with substrates coated with conventional graphic inks, which is a desirable criterion for constructing high-functional IME structures and devices.

[0034] Flexible electronic circuits constructed using these compositions can exhibit excellent electrical performance.

[0035] These compositions can be highly compatible with injection molding resins typically employed in IME manufacturing methods.

[0036] The use of the compositions can also reduce the occurrence of ink washout compared to compositions used in conventional IME methods.

[0037] Thermoformed and injection molded structures prepared using the compositions exhibit excellent environmental reliability characteristics and are thus particularly suitable for IME applications for automotive, household appliance, and white goods applications.

[0038] Advantageously, the compositions can be stable at normal storage and ambient temperatures. Again, without being bound by theory, this is thought to be due to the substantial absence of crosslinking by melamine formaldehyde at such temperatures.

[0039] Melamine formaldehyde preferably contains hexamethoxymethylmelamine. Hexamethoxymethylmelamine is a particularly suitable crosslinking agent. In addition, hexamethoxymethylmelamine is soluble in the most common organic solvents except aliphatic hydrocarbons.

[0040] Suitable commercially available melamine formaldehyde resins include, for example, Maprenal BF891 / 77SNB, Maprenal MF600 / 55BIB, Maprenal MF650 / 55IB, Maprenal MF800 / 55IB, CYMEL370, CYMEL373, and CYMEL380. Maprenal MF600 / 55BIB is an imino type, highly reactive, isobutylated melamine-formaldehyde resin.

[0041] The crosslinking agent may advantageously further contain isocyanate, and / or polyisocyanate, and / or blocked polyisocyanate. Such species can increase the degree of crosslinking under the drying conditions employed in conventional IME manufacturing methods. This can be advantageous when the composition is required to have increased "thermosetting" properties. "Blocked" or "masked" isocyanates can include isocyanates containing protected isocyanate groups. The isocyanate functional group is typically masked through the use of a blocking agent that produces a compound that appears to be inert at room temperature but produces a reactive isocyanate functional group at elevated temperatures.

[0042] Suitable isocyanates, polyisocyanates, and blocked polyisocyanates include, for example, toluene diisocyanate (TDI), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), Desmodur BL3175A, Desmodur BL3272MPA, Desmodur BL1100 / 1, and Vestanat B1358A manufactured by Evonik. These can be used alone or in combination with melamine formaldehyde resin. Vestanat B1358A contains a methyl-ether-ketone-oxime (MEKO) blocked alicyclic polyisocyanate based on isophorone diisocyanate (IPDI).

[0043] The thermoplastic resin preferably includes one or more of a polyurethane resin, a polyester resin, a polyacrylate resin, a polyvinyl ester resin, a phenoxy resin, and a ketone resin, that is, a hydroxyl group-containing polyurethane resin, a polyester resin, a polyacrylate resin, a polyvinyl ester resin, a phenoxy resin, and / or a ketone resin. Such resins are particularly suitable for use in the present invention and react with melamine formaldehyde under the drying conditions of a typical IME manufacturing method to provide the desired degree of crosslinking.

[0044] These thermoplastic resins can be used alone or in combination with other thermoplastic resins.

[0045] The polyurethane resin can include, for example, the reaction product of a hydroxy-terminated polyol, hydroxy-terminated poly(ethylene oxide), hydroxy-terminated poly(dimethylsiloxane), or trimethylolpropane ethoxylate with methylbenzyl isocyanate, (trimethylsilyl) isocyanate, 1-naphthyl isocyanate, 3-(triethoxysilyl)propyl isocyanate, phenyl isocyanate, allyl isocyanate, butyl isocyanate, hexyl isocyanate, cyclohexyl isocyanate, furfuryl isocyanate, isophorone diisocyanate, hexamethylene diisocyanate, m-xylylene diisocyanate, 1,4-cyclohexylene diisocyanate, poly(propylene glycol), or tolylene 2,4-diisocyanate. The polyurethane resin can include one or a mixture of thermoplastic polyurethanes such as the Pearlstick series of polyurethanes like Pearlstick5701, Pearlstick5703, Pearlstick5707, the Estane series of polyurethanes like ESTANE FS M92B4P, the Desmocoll series of polyurethanes like Desmocoll540 / 4, Desmocoll400, and the Desmomelt series of polyurethanes like Desmomelt540 / 3, Desmomelt540 / 4. The phenoxy resin is preferably a thermoplastic bisphenol-A polyether containing a polyester or polyacrylate or polyurethane compound. Examples of suitable phenoxy resins containing a polyester or polyacrylate or polyurethane include phenoxy resins available under the trade names LEN-HB, PKHW-35, PKHH, PKHA, PKHM-301, and PKHS-40. The polyester resin, polyacrylate resin, and / or polyurethane resin can contain one or more of a polyol, hydroxyl, amine, carboxylic acid, amide, and aliphatic chain. The phenoxy resin contains a polyester, or polyacrylate, or polyurethane, or polyether, or polyamide main chain.

[0046] The thermoplastic resin preferably includes a polyurethane resin, a polyester resin, and a phenoxy resin. More preferably, based on the total weight of the thermoplastic resin, 20 to 60% by weight of a polyurethane resin, preferably 35 to 47% by weight of a polyurethane resin, and 5 to 30% by weight of a polyester resin, preferably 13 to 19% by weight of a polyester resin, and 20 to 60% by weight of a phenoxy resin, preferably 34 to 51% by weight of a phenoxy resin.

[0047] Such a thermoplastic resin, particularly in the amounts listed above, is particularly suitable for obtaining a desired degree of crosslinking with melamine formaldehyde. The presence of the polyurethane resin can provide a dry composition having a desirable level of flexibility, particularly in the amounts listed. The presence of the polyester resin can provide a dry composition having a desired degree of flexibility and can also promote adhesion to the substrate, particularly in the amounts listed. The presence of the phenoxy resin can promote adhesion to the substrate, particularly in the amounts listed. The combination of these three resins can provide a favorable combination of high flexibility and strong adhesion to the substrate, particularly in the amounts listed.

[0048] Preferably, the thermoplastic resin includes homopolymers, as well as copolymers and / or terpolymers, and / or has a glass transition temperature of less than 100 °C, and / or has a weight average molecular weight of 1000 to 100000 g / mol, and / or has a softening point of less than 100 °C, and / or has a hydroxyl content (OH value) of more than 20 mg KOH / g.

[0049] In a preferred embodiment, the composition includes 1 to 40% by weight of a crosslinking agent, preferably 7 to 24% by weight of a crosslinking agent, and 60 to 99% by weight of a thermoplastic resin, preferably 76 to 93% by weight of a thermoplastic resin, based on the total amount of the crosslinking agent and the thermoplastic resin. Such amounts can serve to provide the desired level of crosslinking under the drying conditions of conventional IME manufacturing methods.

[0050] The solvent preferably contains one or more of glycol ether acetate, glycol ether, ester, ketone, alcohol, and hydrocarbon. Such solvents can be particularly suitable for use in the present invention. Such solvents can be used alone or in combination. Such solvents can be particularly suitable for dissolving thermoplastic resins and / or crosslinking agents, and can be particularly compatible with substrates and any functional fillers and / or additives in the composition. Such solvents can have a favorable combination of polarity, solubility characteristics (Hansen solubility parameters), compatibility with substrates, toxicity, and other physical properties such as boiling point and flash point. Such solvents can improve the storage stability of the composition, drying profile, drying stability during processing (e.g., on the screen during screen printing), and reactivity with substrates and other printed ink layers (such as graphic ink or electronic device ink layers). Such solvents can be stable during storage and can result in a homogeneous composition that also meets the performance requirements. Non-limiting examples of solvents include methanol, ethanol, 2-propanol, benzyl alcohol, ethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 2,5-dimethyl-2,5-hexanediol, ethylene glycol methyl ether, ethylene glycol monobutyl ether, propylene glycol phenyl ether, diethylene glycol mono-n-butyl ether, propylene glycol n-propyl ether, dipropylene glycol methyl ether, terpineol, butyl carbitol, butyl carbitol acetate, glycol ether acetate, 2-(2-ethoxyethoxy)ethyl acetate, dipropylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, 2-butoxyethyl acetate, carbitol acetate, propylene carbonate butyl carbitol, butyl cellosolve, heptane, hexane, cyclohexane, benzene, xylene, Cyrene, dibasic ester, isophorone, C11-ketone, and toluene.

[0051] Preferred solvents, based on the total weight of the solvent, Up to 95% by weight of glycol ether acetate, preferably up to 85% by weight of glycol ether acetate, and / or Up to 95% by weight of glycol ether, preferably up to 85% by weight of glycol ether (e.g., 1 - 85% by weight), and / or Up to 15% by weight of ester, preferably up to 5% by weight of ester (e.g., 1 - 5% by weight), and / or Up to 40% by weight of ketone, preferably up to 32% by weight of ketone (e.g., 1 - 32% by weight), and / or Up to 80% by weight of alcohol, preferably up to 70% by weight of alcohol (e.g., 1 - 70% by weight), and / or Up to 30% by weight of hydrocarbon, preferably up to 22% by weight of hydrocarbon (e.g., 1 - 22% by weight).

[0052] Such amounts may be particularly suitable for providing the above - mentioned advantages.

[0053] The binder preferably comprises a thermosetting resin preferably containing one or both of an acrylic resin and an epoxy resin, and may further comprise a curing catalyst for curing the thermosetting resin, preferably for thermally curing the thermosetting resin and / or for UV - curing the thermosetting resin.

[0054] The presence of the thermosetting resin and the curing catalyst can serve to form a three - dimensional thermosetting network. This can be beneficial when the dried composition is required to have higher "thermosetting" properties. The thermosetting resin preferably contains one or both of an acrylic resin and an epoxy resin and can be cured using a thermosetting agent and / or a UV - curing agent.

[0055] The thermosetting resin may contain, for example, a polyester, or a polyacrylate, or a polyether, or a polyurethane, or a polyamide main chain. The thermosetting resin may contain different combinations of monomers, dimers, trimers, tetramers, pentas, or hexamers having epoxy, polyurethane, polyester, polyether, and acrylic main chains, and oligomers.

[0056] Examples of epoxy resins include bisphenol-A epoxy, 4-vinyl-1-cyclohexene 1,2-epoxide, 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexene carboxylate, 1,4-butanediol diglycidyl ether, trimethylolpropane triglycidyl ether, triglycidyl isocyanurate, epoxy siloxane, epoxy silane, and phenol novolac epoxy. The epoxy resin may include one or a mixture of epoxy resins such as EPON862, DYCK-CH, JER828, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether (DER731), ortho-cresyl glycidyl ether (DER723), and C12-C14 alkyl glycidyl ether (DER721). One or more hardeners may be present, and such hardeners may be any of amines such as butylamine, N,N-diethylaminoethanol, or aminoethanol, acids such as oleic acid, adipic acid, or glutaric acid, or anhydrides such as succinic anhydride, phthalic anhydride, or maleic anhydride. Epoxy acrylate can also be used. The (meth)acrylate is produced by the ring-opening reaction of 1,4-butanediol diglycidyl ether, bisphenol-A epoxy, 4-vinyl-1-cyclohexene 1,2-epoxide, 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexene carboxylate, trimethylolpropane triglycidyl ether, triglycidyl isocyanurate, epoxy siloxane, epoxy silane, phenol novolac epoxy with methacrylic acid. The epoxy acrylate may include one or more of epoxy skeleton-based (meth)acrylates such as, but not limited to, Ebecryl3503, Ebecryl3201, Photomer3005, Photomer3316, Ebecryl3411, and Ebecryl3500. Polyurethane acrylates such as urethane acrylate, methacrylate-terminated polyurethane, and isocyanate modified with hydroxyethyl methacrylate can also be used.The urethane acrylate may include one or more of urethane skeleton-based (meth) acrylates such as, by way of example and not limitation, SUO2371, SUO-300, SUO-7620, Photomer6891, SUO S3000, Ebecryl8413, Ebecryl230, Ebecryl4833, Ebecryl8411, Ebecryl270, Ebecryl8804, and Photomer-6628. Polyester acrylates such as fatty acid-modified pentaerythritol acrylate, trimethylolpropane triacrylate, and methacrylated monosaccharides can also be used. Polyether acrylates such as poly(ethylene glycol) methyl ether acrylate, poly(ethylene glycol) methacrylate, and poly(ethylene glycol) dimethacrylate can also be used. The polyester acrylate may include one or more of polyester skeleton-based (meth) acrylates such as, by way of example and not limitation, Photomer-4006, Ebecryl450, Photomer5429, and Ebecryl812. Non-limiting examples of monomer acrylates include methacrylic acid, 3-(trimethoxysilyl)propyl methacrylate, isoborynyl acrylate, tetrahydrofufuryl acrylate, poly(ethylene glycol) methyl ether acrylate, hydroxypropyl methacrylate, dimethylaminoethyl methacrylate, 2-ethylhexyl acrylate, butyl acrylate, isooctyl acrylate, methyl methacrylate, lauryl acrylate, dodecyl acrylate, and tetrahydrofurfuryl acrylate, but are not limited thereto. Non-limiting examples of dimer acrylates include poly(ethylene glycol) dimethacrylate, 1,6-bis(acryloyloxy)hexane, bisphenol-A-ethoxylate dimethacrylate, and dimer methacrylates such as neopentyl glycol diacrylate 1,3-butanediol diacrylate.

[0057] Non-limiting examples of trimmer acrylates include trimmer methacrylates such as trimethylolpropane triacrylate, pentaerythritol triacrylate, and 1,3,5-triacryloylhexahydro-1,3,5-triazine. Non-limiting examples of tetramer acrylates include pentaerythritol tetraacrylate and di(trimethylolpropane) tetraacrylate.

[0058] Non-limiting examples of pentamer or hexamer acrylates include dipentaerythritol penta-acrylate and dipentaerythritol hexa-acrylate. Siloxane acrylates can include, by way of example and not limitation, one or more of siloxane backbone-based (meth)acrylates such as BYK-UV3570, BYK-UV3575, BYK-UV3535, BYK-UV3530, BYK-UV3505, BYK-UV3500, Ebecryl350, Ebecryl1360, and SUO-S3000. Aliphatic acrylates can include, by way of example and not limitation, one or more of hydrocarbon backbone-based (meth)acrylates such as Ebecryl1300, SAP-M3905, Ebecryl525, and SAP-7700HT40.

[0059] Preferably, it further comprises one of more functional additives selected from one or more of a surfactant, a rheology modifier, a dispersant, an antifoaming agent, an anti-tack agent, a slip additive, an anti-sagging agent, a leveling agent, a surfactant, a surface tension reducing agent, an adhesion promoter, an anti-skinning agent, a matting agent, a colorant, a dye, a pigment, and a wetting agent. The antifoaming agent can remove bubbles from the binder, and the anti-tack agent can remove tackiness from the binder. The surfactant may include an anionic, cationic, or nonionic surfactant. Non-limiting examples include surfactants available under the trade names SPAN-80, SPAN-20, Tween-80, Triton-X-100, Sorbitan, IGEPAL-CA-630, Nonidet P-40, cetyl alcohol, FS-3100, FS-2800, FS-2900, FS-230, FS-30, BYK-UV3500 / UV3505 / 077 / UV3530, FS-34, Modaflow2100, Omnistab LS292, Omnivad-1116, and Additol LED01. The rheology modifier is an organic or inorganic additive that controls the rheological properties of the formulation. These can be used alone or in a mixture. Examples of suitable rheology modifiers include, but are not limited to, those available under the trade names THIXIN-R, Crayvallac Super, Brij35, 58, L4, O20, S100, 93, C10, O10, L23, O10, S10, and S20. The functional additive can be a colorant, a dye, and a pigment. Non-limiting examples of colorants, dyes, and pigments include anthraquinone dyes, azo dyes, acridine dyes, cyanine dyes, diazonium dyes, nitro dyes, nitroso dyes, quinone dyes, xanthene dyes, fluorene dyes, and rhodamine dyes. Non-limiting examples of antioxidants and inhibitors include 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-p-cresol, butylhydroxytoluene, 3,5-di-tert-4-butylhydroxytoluene, Omnistab IC, Omnistab In515 / 516, hydroquinone, and phenothiazine.

[0060] In addition to the elements recited herein, it will be understood that the compositions and binders may contain unavoidable impurities. Such unavoidable impurities, when present, are typically present in an amount of up to 1% by weight, more typically up to 0.5% by weight, even more typically up to 0.1% by weight, and even more typically up to 0.05% by weight of the composition or binder.

[0061] In a preferred embodiment, the binder is 0.5 to 12% by weight of a crosslinking agent, preferably 1.5 to 7.7% by weight of a crosslinking agent, 10 to 40% by weight of a thermoplastic resin, preferably 11 to 30.4% by weight of a thermoplastic resin, and 40 to 85% by weight of a solvent, preferably 46.7 to 78.8% by weight of a solvent, Optionally, 0.1 to 30% by weight of a thermosetting resin and 0.1 to 3% by weight of a curing catalyst for curing the thermosetting resin, preferably 1 to 10% by weight of a thermosetting resin and 0.1 to 1% by weight of a curing catalyst for curing the thermosetting resin, and / or 0.1 to 20% by weight of a functional additive, preferably 1.7 to 17% by weight of a functional additive.

[0062] Such binders are particularly suitable for providing compositions having the advantages described above.

[0063] Preferably, the binder contains a low level of ionic substances, more preferably is substantially free of ionic substances, and / or free halogens, more preferably is substantially free of free halogens, and / or intentionally added halogens, more preferably is free of intentionally added halogens.

[0064] In a preferred embodiment, the composition further comprises conductive particles, i.e., electrically conductive particles. This can enable the composition to be used, for example, as a conductive ink or a conductive adhesive.

[0065] The conductive particles preferably contain metal particles, more preferably one or more selected from silver particles, copper particles, brass particles, nickel particles, gold particles, platinum particles, palladium particles, metal alloy particles, silver-coated copper particles, silver-coated brass particles, silver-nickel alloy particles, and silver-copper alloy particles. Such particles are particularly suitable for use in conductive inks or conductive adhesives.

[0066] Alternatively, or in addition, the conductive particles preferably contain non-metal particles, more preferably contain carbon particles, preferably one or more selected from graphite particles, graphite flakes, carbon black particles, graphene particles, and carbon nanotubes. Such particles are particularly suitable for use in conductive inks or conductive adhesives. The use of graphene can improve the mechanical properties, flexibility properties, and barrier properties of the composition. The combination of the unique mechanical properties, flexibility characteristics, and barrier properties of graphene is very beneficial for the preparation of a flexible, mechanically robust, wear-resistant, and corrosion-resistant carbon layer, thereby enhancing the operating life of IME and similar structures. In addition, by incorporating graphene into metal inks, it may be possible to develop high-performance and low-cost metal inks with moderate electrical conductivity.

[0067] The conductive particles preferably have an average particle size (d50) of 0.5 to 30 μm, more preferably 1 to 20 μm, and even more preferably 1.25 to 7 μm. The particle size can be determined, for example, using SEM, TEM, a laser scattering particle size analyzer, or dynamic light scattering method. Such a particle size distribution can provide favorable packing density, particle interactions for the target viscosity, and electrical properties. The specific average particle size may depend on the end use, such as fine line printing, thermoformable applications, e-textiles, etc., and the processing technique.

[0068] The conductive particles preferably have a tap density of 1 to 5 g / cc, more preferably 1.5 to 4 g / cc. The tap density can be determined using a conventional tap density tester. The higher the tap density, the higher the percolation threshold for electrical conductivity. A lower tap density can make the processing more difficult and can have an adverse effect on the viscosity and rheology of the composition.

[0069] The conductive particles preferably have a surface area of 0.3 to 2.1 m 2 / g or 0.5 to 5 m 2 / g. This can make the conductive particles more suitable for electronic applications. It can also help to provide a composition with favorable rheology and viscosity. The larger the surface area, the higher the viscosity. Thus, when the composition is used as a conductive adhesive, a higher surface area may be more advantageous, whereas when the composition is used as a conductive ink, a lower surface area may be more advantageous. The surface area can be determined, for example, using the gas adsorption BET method.

[0070] The conductive particles preferably have an organic content of 0.06 to 1.3 wt% or 0.01 to 3 wt%. The organic matter can act as an organic coating or capping agent. The organic coating may have a variable chain length and can include saturated or unsaturated fatty acids or esters, or glycerol-based derivatives, or amines, or amides, or phosphates, or thiols. The organic coating can help the conductive particles to interact with the polymer so that the conductive particles remain in a single phase. The organic content can be determined, for example, by gravimetry. The amount of organic content on the filler particles (metal or metal oxide) is calculated by the weight loss after heat treatment (200 - 700 °C).

[0071] The conductive particles are preferably in one or more forms of flakes, spheres, irregularly shaped particles, nano powders, and nano wires. More preferably, the conductive particles are in the form of flakes. Compared to spheres, flakes may have a greater tendency to interact with the binder and adjacent particles. These characteristics can help achieve better adhesion to the substrate and provide a percolation threshold for electrical conductivity.

[0072] Preferably, the conductive particles contain a low level of ionic substances, more preferably substantially free of ionic substances, and / or contain free halogens, more preferably substantially free of free halogens, and / or contain intentionally added halogens, more preferably free of intentionally added halogens.

[0073] In addition to the above-mentioned conductive fillers, the composition may preferably further contain nano-sized silver particles or organic silver compounds (such as AgMOCs like silver neodecanoate and silver 2-ethylhexanoate). These can further increase the electrical conductivity of the composition.

[0074] The conductive filler is conductive metallic nano wires (such as silver, copper, gold, palladium, platinum, silver-copper alloy, nickel, copper-nickel, silver-coated copper, nickel-coated copper, etc.), and / or conductive carbon nanotubes and carbon nanofibers (such as conductive or semiconductive single-walled carbon nanotubes, conductive or semiconductive multi-walled carbon nanotubes, conductive or semiconductive carbon nanofibers, etc.), and / or conductive polymers (such as polyaniline, PEDOT:PSS, polythiophene, etc.), and / or conductive graphene flakes, and may be included.

[0075] Such conductive fillers can be particularly suitable for producing transparent conductive films, printed resistive heaters, transparent heaters, and transparent flexible and circuit elements. The present invention also provides the use of such conductive fillers for manufacturing such objects.

[0076] The composition preferably contains 30 to 85% by weight of a binder, preferably 40.1 to 80.9% by weight of a binder, and 15 to 70% by weight of conductive particles, preferably 19.1 to 59.9% by weight of conductive particles.

[0077] Such amounts, together with the advantages of the above-mentioned binder, can provide a convenient level of conductivity.

[0078] In a preferred embodiment, this composition contains 30 to 85% by weight of a binder, preferably 40.1 to 80.9% by weight of a binder, and 15 to 70% by weight of conductive particles, preferably 19.1 to 59.9% by weight of conductive particles, and the binder contains 0.2 to 6% by weight of a crosslinking agent, preferably 0.7 to 3.3% by weight of a crosslinking agent, and 1 to 7.5% by weight of a polyurethane resin, preferably 1.7 to 4.5% by weight of a polyurethane resin, and 0.1 to 5.5% by weight of a polyester resin, preferably 0.7 to 1.8% by weight of a polyester resin, and 1 to 7.5% by weight of a phenoxy resin, preferably 2.5 to 6.6% by weight of a phenoxy resin, and 0 to 10% by weight of a thermosetting resin, preferably 0 to 5.7% by weight of a thermosetting resin (e.g., 0.1 to 5.7%), and 0 to 1% by weight of a curing catalyst, preferably 0 to 0.6% by weight of a curing catalyst (e.g., 0.1 to 0.6%), and 0.2 to 10% by weight of a functional additive, preferably 2.6 to 7.4% by weight of a functional additive. 0 to 60% by weight of glycol ether acetate, preferably 4.3 to 43.2% of glycol ether acetate, and 0 to 40% by weight of glycol ether, preferably 0 to 24.1% by weight of glycol ether (e.g., 1 to 24.1% by weight), and 0 to 5% by weight of ester, preferably 0 to 1.7% by weight of ester (e.g., 0.1 to 1.7% by weight), and 0 to 30% by weight of ketone, preferably 0 to 20.5% by weight of ketone (e.g., 1 to 20.5% by weight), and

[0079] In a preferred embodiment, this composition is in the form of a conductive ink. In other words, the present invention provides a conductive ink comprising the composition described herein. The conductive ink can advantageously be used to create electrically flexible and formable circuits, interconnects, attachment components and parts, and via fills. The conductive ink can also be used for thermal connections. The conductive ink can exhibit a viscosity and rheology suitable for printing, for example, using screen, stencil, gravure, and flexographic techniques to generate electronic device interconnect circuits on various polymer substrates such as PC and PET. When thermally dried and / or cured, the interconnect lines, pattern shapes, and / or features (e.g., trace width, pad width, etc.) generated using such ink can be controlled to >100 μm, possess an excellent surface resistance <100 Ω / □ / mil (when various carbon particles are used only as the conductive filler) or <100 mΩ / □ / mil (when various metallic particles and / or flakes are used as the conductive filler), and have an adhesion suitable for the manufacture of flexible electronic device circuits (by ASTM standard >3B). These interconnect circuits generated using such ink can possess excellent thermoformability, be stable under injection molding ink washout, and are thus suitable for IME manufacture.

[0080] In a preferred embodiment, the composition is in the form of a conductive adhesive. In other words, the present invention provides a conductive adhesive comprising the composition described herein. The conductive adhesive can be used to interconnect various components, packages, and LEDs for assembling various components, packages, and LEDs on various polymer substrates such as PC and PET to interconnect circuits generated by the previously disclosed conductive inks, and can exhibit viscosity and rheological properties suitable for printing (screen and stencil), dispensing, spraying, and micro-dispensing techniques. When thermally dried or cured, these interconnecting lines and pattern shapes and features can be controlled to >50 μm, have excellent surface resistance <100 Ω / □ / mil (when various carbon particles are used only as conductive fillers) or <100 mΩ / □ / mil (when various metallic particles and / or flakes are used as conductive fillers), and have adhesiveness suitable for the manufacture of flexible electronic device circuits (according to ASTM standard >3B). The assembled components and packages generated using such a conductive adhesive can exhibit high mechanical stability, as evidenced by die shear results. The circuits generated using such a conductive adhesive can possess excellent thermoformability, be stable under injection molding ink washout, and thus be suitable for IME manufacturing.

[0081] In a preferred embodiment, this composition further comprises non-conductive particles. Such a composition can be used, for example, to fabricate electrically flexible and formable circuits, interconnects, attachment components and parts, and via fills. Such a composition can be used for mechanical and thermal connections.

[0082] The non-conductive particles preferably comprise organic non-conductive particles and are preferably selected from one or more of cellulose, waxes (e.g., Ceraflour 991, Ceraflour 929, and Ceraflour 920 manufactured by BYK), polymer microparticles, non-conductive carbon particles, and graphene oxide.

[0083] Alternatively, or in addition, the non-conductive particles preferably comprise inorganic non-conductive particles, preferably selected from one or more of mica, silica (SiO2), fumed silica, talc, titanium dioxide (TiO2), alumina, barium titanate (BaTiO3), zinc oxide (ZnO), and boron nitride (BN), and optionally, the inorganic non-conductive particles are sub-micron to micron sized (e.g., 5 to 50000 nm, preferably 10 to 30000 nm).

[0084] Organic non-conductive particles can increase the homogeneity of the composition but may have a lower dielectric strength compared to inorganic non-conductive particles. Inorganic non-conductive particles can increase the dielectric strength but may result in reduced homogeneity compared to organic non-conductive particles. Thus, it may be preferable to functionalize the non-conductive particles with functional groups such as carboxylic acids, amines, or alcohols to enable very good dispersion of the non-conductive particles through interaction with the polymer system. The organic coating may have a variable chain length and may include saturated or unsaturated fatty acids or esters, or glycerol-based derivatives, or amines, or amides, or phosphates, or thiols. This can also help improve the long-term storage stability of the composition.

[0085] The non-conductive particles preferably exhibit an average particle size (d50) of 1 to 30 μm or 10 μm or less. A high ratio of a very small particle size distribution results in a high viscosity and difficult processing, whereas the presence of a higher distribution of very large particle sizes reduces the viscosity and creates slumping problems.

[0086] The non-conductive particles can be in the form of flakes and / or spheres and / or irregularly shaped particles. Preferably, the non-conductive particles are in the form of flakes and / or irregularly shaped particles. This is because, compared to spheres, flakes and irregularly shaped particles can have improved adhesion to the substrate and can reduce the property of delaminating during the thermoforming process.

[0087] The non-conductive particles preferably have a low ionic content, preferably substantially zero.

[0088] Preferably, the non-conductive particles have a low level of ionic substances, more preferably substantially free of ionic substances, and / or free halogen, more preferably substantially free of free halogen, and / or intentionally added halogen, more preferably free of intentionally added halogen.

[0089] The composition preferably comprises 0 to 50 wt% non-conductive particles, preferably 2 to 45 wt% non-conductive particles, and 50 to 100 wt% binder, preferably 55 to 98 wt% binder.

[0090] Such amounts, together with the advantages of the binders described above, can provide advantageous levels of dielectric properties.

[0091] In a preferred embodiment, the composition comprises 40 to 100 wt% binder, preferably 50 to 98 wt% binder, and 0 to 60 wt% non-conductive particles, preferably 2 to 50 wt% non-conductive particles, and The binder comprises 0.5 to 10 wt% crosslinking agent, preferably 1.9 to 6.1 wt% crosslinking agent, and 2 to 12 wt% polyurethane resin, preferably 4.8 to 8.4 wt% polyurethane resin, and 0.5 to 10 wt% polyester resin, preferably 1.9 to 5.3 wt% polyester resin, and 2 to 18 wt% phenoxy resin, preferably 4.5 to 12.4 wt% phenoxy resin, and 0 to 30 wt% thermosetting resin, preferably 0 to 19.6 wt% thermosetting resin (e.g., 1 to 19.6 wt%). 0 to 3% by weight of a curing catalyst, preferably 0 to 2% by weight of a curing catalyst (e.g., 0.1 to 2% by weight), and 0.3 to 17% by weight of a functional additive, preferably 1.4 to 12.5% by weight of a functional additive, and 0 to 60% by weight of a glycol ether acetate, preferably 4.9 to 41.7% by weight of a glycol ether acetate, and 0 to 60% by weight of a glycol ether, preferably 0 to 43.8% by weight of a glycol ether (e.g., 1 to 43.8% by weight), and 0 to 30% by weight of a ketone, preferably 0 to 19.9% by weight of a ketone (e.g., 1 to 19.9% by weight), and 0 to 50% by weight of an alcohol, preferably 0 to 35.5% by weight of an alcohol (e.g., 1 to 35.5% by weight), and 0 to 20% by weight of a hydrocarbon, preferably 0 to 13.3% by weight of a hydrocarbon (e.g., 1 to 13.3% by weight), and are included.

[0092] In a preferred embodiment, the composition is in the form of a dielectric ink. In other words, the present invention provides a dielectric ink comprising the composition described herein.

[0093] In a preferred embodiment, the composition is in the form of a non-conductive adhesive. In other words, the present invention provides a non-conductive ink comprising the composition described herein.

[0094] In a preferred embodiment, the composition is in the form of a encapsulant. In other words, the present invention provides an encapsulant comprising the composition described herein.

[0095] When dried / hardened, the binders of the dielectric ink, non-conductive adhesive, and encapsulant possess excellent dielectric properties, are very flexible and moderately stretchable, have excellent adhesion and compatibility with other ink materials (e.g., silver and carbon) and substrates, and can have excellent weather resistance (to moisture, gases, and chemicals). The dielectric ink, non-conductive adhesive, and encapsulant can possess excellent thermoformability, be stable under injection molding ink wash, and thus can be suitable for IME manufacturing. The viscosity and rheology of the dielectric ink, non-conductive adhesive, and encapsulant can be suitable for printing using, for example, screen, stencil, gravure, or flexo techniques, spray coating, dispensing, and spray techniques for generating insulating layers to protect conductive interconnect circuits on various polymer substrates such as PC and PET. When thermally dried or cured, the dielectric coating thickness can be controlled to >1 μm, can possess an excellent dielectric breakdown voltage (>100 V), and can have an adhesion suitable for the manufacture of flexible electronic circuits (by ASTM standard >3B). The encapsulation coating layer can provide protection for the conductive circuit from the environment such as moisture and gases.

[0096] The composition can preferably further include a colorant and / or a dye and / or a pigment and can be in the form of a graphic ink. In other words, the present invention provides a graphic ink comprising the composition described herein. The dye and / or pigment can form part of the functional additives discussed above.

[0097] In a further aspect, the present invention is a method for manufacturing the composition described herein, comprising providing a solvent, providing a thermoplastic resin having a hydroxyl group, dissolving the thermoplastic resin in the solvent at a temperature of 50 to 100 °C, preferably 70 to 100 °C, cooling the solution to room temperature, Optionally, adding to the cooled solution one or more of a functional additive, a thermosetting resin, a curing catalyst for curing the thermosetting resin, conductive particles, and non-contact particles, to provide a method.

[0098] The advantages and preferred features of the first aspect equally apply to this aspect.

[0099] In a further aspect, the present invention is a method for manufacturing an in-mold electronics (IME) component, comprising: preparing a blank; thermoforming the blank, wherein preparing the blank includes forming one or more structures on a thermoformable substrate, each structure comprising: disposing the composition described herein on the thermoformable substrate; drying the composition at a temperature of 20 to 150 °C for 1 to 30 minutes, and providing a method formed by a method including the above.

[0100] As used herein, the term "thermoforming" may encompass a manufacturing process in which a plastic sheet is heated to a flexible forming temperature, formed into a specific shape within a mold, and trimmed to create a usable product. The sheet is typically heated in an oven to a temperature high enough to allow it to be stretched over or into a mold and cooled to its final shape. A simplified version of this is vacuum forming. Pressure can be applied during thermoforming. Thermoforming can include high-pressure thermoforming.

[0101] Drying the composition is carried out at a temperature of 20 to 150 °C, preferably 30 to 130 °C, for 0.5 to 60 minutes, preferably 1 to 30 minutes.

[0102] Preferably, two or more structures are formed. The use of the composition disclosed herein ensures that one or more structures, for example, one or more layers in a multilayer laminate, are compatible with each other.

[0103] One or more structures are preferably selected from a conductive layer, a wire, a dielectric layer, an encapsulant layer, a graphic layer, and a barrier layer.

[0104] One or more structures preferably include a multilayer laminate.

[0105] One or more structures preferably include a printed circuit board.

[0106] Disposing the composition preferably includes printing the composition, more preferably screen printing the composition.

[0107] The substrate preferably includes polycarbonate (PC) and / or polyethylene terephthalate (PET). The compositions described herein are compatible with such materials and form strong adhesion with such materials. Such materials also exhibit favorable thermoforming properties.

[0108] Thermoforming is preferably carried out at a temperature of 140°C to 210°C. Such temperatures are particularly suitable for thermoforming, and the compositions described herein can be stable at such temperatures. Thermoforming can include vacuum thermoforming. In a preferred embodiment, vacuum thermoforming is carried out at a pressure of 0.25 MPa to 0.4 MPa. In another preferred embodiment, high-pressure thermoforming is carried out at a pressure in the range of 6 MPa to 12 MPa.

[0109] Preferably, the method further includes attaching one or more electronic devices to the blank using a conductive adhesive or a non-conductive adhesive, the conductive adhesive being the composition described herein, and the attachment being carried out before and / or after thermoforming.

[0110] Preferably, this method further includes applying a resin layer to the substrate using injection molding after thermoforming. Preferably, the resin includes one or more of polycarbonate (PC), polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyester, poly(methyl methacrylate) (PMMA), low density polyethylene (LDPE), high density polyethylene (HDPE), polystyrene (PS), and thermoplastic polyurethane (TPU). Other similar resins can also be used. Such a resin layer can provide a final IME component having favorable mechanical properties and / or aesthetic properties.

[0111] Injection molding is preferably carried out at a temperature of 170 to 330 °C. Such a temperature is particularly suitable for injection molding, and the compositions described herein can be stable at such temperatures.

[0112] An in-mold electronics (IME) component preferably includes a capacitive touch switch or a resistive touch switch. Such capacitive touch switches and resistive touch switches can exhibit improved performance and / or reliability compared to conventional capacitive touch switches and resistive touch switches.

[0113] An in-mold electronics (IME) component preferably includes one or more of a display, a light / lamp, a sensor, an indicator, and a tactile / touch feedback device.

[0114] An in-mold electronics (IME) component preferably includes one or more of a transparent conductive film, a printed resistive heater, a transparent resistive heater, a transparent capacitive touch-based device, and transparent flexible and circuit elements. In such cases, preferably, the composition includes a conductive filler that can include conductive metallic nanowires and / or conductive carbon nanotubes and carbon nanofibers, and / or a conductive polymer, and / or conductive graphene flakes, as described above.

[0115] In a further aspect, the present invention provides an in-mold electronics (IME) component manufactured according to the methods described herein. Compared to conventional IME components, the IME components may exhibit improved performance and / or reliability.

[0116] In a further aspect, the present invention provides an in-mold electronics (IME) component comprising the composition described herein. As will be appreciated, the composition will undergo at least partial crosslinking. Compared to conventional IME components, the IME components may exhibit improved performance and / or reliability.

[0117] The in-mold electronics (IME) component preferably includes a capacitive touch switch or a resistive touch switch. Compared to conventional capacitive touch switches and resistive touch switches, such capacitive touch switches and resistive touch switches may exhibit improved performance and / or reliability.

[0118] The in-mold electronics (IME) component preferably includes one or more of a display, a light / lamp, a sensor, an indicator, and a hepatic / touch feedback device. Compared to conventional displays, lights / lamps, sensors, indicators, and hepatic / touch feedback devices, such displays, lights / lamps, sensors, indicators, and hepatic / touch feedback devices can exhibit improved performance and / or reliability.

[0119] The in-mold electronics (IME) component preferably includes one or more of a transparent conductive film, a printed resistive heater, a transparent resistive heater, a transparent capacitive touch-based device, and a transparent flexible and circuit element. In such cases, preferably, the composition includes a conductive filler and as described above, may include conductive metallic nanowires, and / or conductive carbon nanotubes and carbon nanofibers, and / or conductive polymers, and / or conductive graphene flakes.

[0120] The present invention will be further described with reference to the clauses numbered as follows.

[0121] 1. A binder composition comprising: A thermoplastic resin containing a hydroxyl group; A crosslinking agent; A solvent, and containing a binder, the binder composition.

[0122] 2. The binder composition according to clause 1, for use in a composition for electronic assembly.

[0123] 3. 5 to 50% by weight, preferably 10 to 45% by weight, more preferably 10 to 40% by weight, still more preferably 15 to 30% by weight of the thermoplastic resin; 0.1 to 5% by weight, preferably 1 to 4% by weight of the crosslinking agent; 45 to 85% by weight, preferably 50 to 80% by weight, more preferably 55 to 75% by weight of the solvent, the binder composition according to clause 1 or 2.

[0124] 4. The thermoplastic resin exhibits one or more of the following: A glass transition temperature < 100 °C (preferably measured using DSC); A molecular weight in the range of -1000 to 100000 g / mol (preferably measured using a viscosity technique); A softening point < 100 °C (preferably measured according to ASTM-D1525); A hydroxyl content (OH value) > 20 mg KOH / g (preferably measured according to ASTM E222-17), the binder composition according to any one of clauses 1 to 3.

[0125] 5. The thermoplastic resin contains one or more of a polyurethane resin, a polyester resin, a polyacrylate resin, a polyvinyl ester resin, a phenoxy resin, and a ketone resin, the binder composition according to any one of clauses 1 to 4.

[0126] 6. 1 to 50% by weight of a polyurethane resin, (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a polyester resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a polyacrylate (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a polyvinyl ester resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a phenoxy resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a ketone resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and Preferably, the total amount of the thermoplastic resin does not exceed 50% by weight, more preferably 45% by weight, and even more preferably 40% by weight, of the binder composition according to clause 5.

[0127] 7. The thermoplastic resin is 1 to 50% by weight of a polyurethane resin, (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a polyester resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a polyacrylate (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a polyvinyl ester resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a phenoxy resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and / or 1 to 30% by weight of a ketone resin (preferably 10 to 30% by weight, more preferably 15 to 20% by weight), and the binder composition according to clause 5.

[0128] 8. The binder composition according to any one of clauses 1 to 7, comprising at least two thermoplastic resins containing hydroxyl groups.

[0129] 9. The binder composition according to any one of clauses 1 to 8, wherein the crosslinking agent is selected from one or more of melamine resin, amino resin, polyamine resin, isocyanate, and polyisocyanate, and preferably is melamine resin.

[0130] 10. The binder composition according to any one of clauses 1 to 9, wherein the solvent is selected from one or more of alcohol, glycol, glycol ether, glycol ester, ester, and / or ketone solvent, and / or hydrocarbon.

[0131] 11. 1 to 55% by weight of an alcohol solvent, and / or 1 to 50% by weight of a glycol solvent, and / or 1 to 15% by weight of a glycol ether solvent, and / or 1 to 60% by weight of a glycol ester solvent, and / or 1 to 75% by weight of an ester solvent, and / or 1 to 25% by weight of a ketone solvent, and / or 1 to 30% by weight of a hydrocarbon solvent, and preferably, the total amount of the alcohol solvent, glycol solvent, glycol ether solvent, glycol ester solvent, ester solvent, ketone solvent, and hydrocarbon solvent is 85% by weight or less. The binder composition according to clause 8.

[0132] 12. The solvent is 1 to 55% by weight of an alcohol solvent, and / or 1 to 50% by weight of a glycol solvent, and / or 1 to 15% by weight of a glycol ether solvent, and / or 1 to 60% by weight of a glycol ester solvent, and / or 1 to 75% by weight of an ester solvent, and / or 1 to 25% by weight of a ketone solvent, and / or ​The binder composition according to clause 8, comprising 1 to 30% by weight of a hydrocarbon solvent.

[0133] 13. An acrylate resin, and / or An epoxy resin, together with one or more curing agents, further comprising the binder composition according to any one of clauses 1 to 12.

[0134] 14. 0.05 to 2% by weight, preferably 0.1 to 1% by weight of a curing agent, and 0.1 to 20% by weight, preferably 1 to 10% by weight of an acrylate resin, and One or both of 0.1 to 20% by weight, preferably 1 to 10% by weight of an epoxy resin, comprising the binder composition according to clause 13.

[0135] 15. The binder composition according to any one of clauses 1 to 14, wherein the binder composition is thermoformable.

[0136] 16. The binder composition according to any one of clauses 1 to 15, wherein the binder composition is thermosetting.

[0137] 17. The binder composition according to any one of clauses 1 to 16, wherein the thermoplastic resin can form a crosslinking agent and a nitrogen-carbon bond.

[0138] 18. A composition for electronic assembly, comprising the binder composition according to any one of clauses 1 to 17, and Filler particles.

[0139] 19. 30 to 99% by weight, preferably 30 to 98% by weight of a binder composition (alternatively 30 to 55% by weight, preferably 30 to 50% by weight of a binder composition), and 1 to 40% by weight, preferably 2 to 40% by weight (alternatively 45 to 70% by weight, preferably 50 to 70% of conductive filler particles, or 5 to 40% by weight of filler particles, typically non-conductive filler particles), comprising the composition for electronic assembly according to clause 18.

[0140] 20. A composition for an electronic assembly according to clause 18 or 19, wherein the filler particles comprise a filler such as a metal or a non-metal (typically a conductive filler), or a filler such as a metal oxide or a non-metal or an organic polymer material (typically a non-conductive filler).

[0141] 21. A composition for an electronic assembly according to any one of clauses 18 to 20, wherein the filler particles (typically conductive filler particles) comprise one or more of silver, silver alloy, copper, copper alloy (e.g., CuNi, CuZn, and CuNiZn), silver-coated copper, silver-coated copper alloy, graphene, carbon black, carbon nanotube, graphite, silver-coated graphene, and silver-coated graphite.

[0142] 22. A composition for an electronic assembly according to any one of clauses 18 to 21, wherein the filler particles (typically non-conductive filler particles) comprise one or more of cellulose, wax, polymer, mica, silica, talc, alumina, barium titanate, carbon particles (typically non-conductive carbon particles), graphene oxide, and boron nitride.

[0143] 23. A composition for an electronic assembly according to any one of clauses 18 to 22, wherein the filler particles preferably have a D50 of 1 to 30 μm, preferably 2 to 20 μm, measured using SEM and / or a laser scattering particle size analyzer.

[0144] 24. A composition for an electronic assembly according to any one of clauses 18 to 23, wherein at least some of the filler particles, preferably substantially all of the filler particles, have a flake-like shape, and preferably the ratio of the longest dimension of the particle to the shortest dimension of the particle is greater than 1, more preferably greater than 2, even more preferably 2 to 10.

[0145] 25. A composition for an electronic assembly according to any one of clauses 18 to 24, wherein the filler particles have a tapped density of 1 to 5.

[0146] 26. A composition for an electronic assembly according to any one of clauses 18 to 25, wherein the filler particles are capped with a capping agent.

[0147] 27. A composition for an electronic assembly according to any one of clauses 18 to 26, wherein the filler particles have a surface area of 0.5 to 5 m 2 / g.

[0148] 28. A composition for an electronic assembly according to any one of clauses 18 to 27, which is in the form of a metallic ink, a non-metallic ink, or a conductive adhesive.

[0149] 29. A composition for an electronic assembly according to any one of clauses 18 to 28, which is in the form of a dielectric ink, a non-conductive ink, or a non-conductive adhesive, or an encapsulant.

[0150] 30. A composition for an electronic assembly according to any one of clauses 18 to 29, which is printed and / or thermoformed on a polymer substrate such as polycarbonate (PC) or polyethylene terephthalate (PET) to form curved 2.5D and 3D structures.

[0151] 31. A composition for an electronic assembly according to any one of clauses 18 to 30, which is printed on a suitable polymer substrate such as polycarbonate (PC) or polyethylene terephthalate (PET), thermoformed to form curved 2.5D and 3D structures, and injection molded to form in-mold electronics (IME) and similar structures.

[0152] 32. A composition for an electronic assembly according to any one of clauses 18 to 31, which can be printed on a suitable graphic ink or decorative ink applied on a polymer substrate such as polycarbonate (PC) or polyethylene terephthalate (PET), and can be thermoformed to form curved 2.5D and 3D structures.

[0153] 33. A composition for an electronic assembly according to any one of clauses 18 to 32, which is printed on a suitable graphic ink or decorative ink applied on a polymer substrate such as polycarbonate (PC) or polyethylene terephthalate (PET), can be thermoformed to form curved 2.5D and 3D structures, and can be injection molded to form in-mold electronics (IME) and similar structures.

[0154] 34. The compositions for an electronic assembly according to any one of clauses 18 to 33 are compatible with each other, have sufficient adhesiveness, are thermoformable, and are resistant to ink washout during injection molding.

[0155] 35. Use of a composition for an electronic assembly according to any one of clauses 18 to 34 in the manufacture of an in-mold electronics structure (IME).

[0156] 36. A method for manufacturing an in-mold electronics structure (IME), comprising: providing a composition for an electronic assembly according to any one of clauses 18 to 34 between a polymer substrate and an electronic component to form an electronic structure; thermoforming the structure to form a thermoformed structure; and injection molding the thermoformed structure.

[0157] 37. The method according to clause 36, wherein the thermoforming is carried out at a temperature of 140 to 180 °C.

[0158] 38. The method according to clause 36 or 37, wherein the injection molding is carried out at a temperature of 200 to 330 °C.

[0159] 39. The polymer substrate is flexible and / or contains polycarbonate (PC) and / or polyethylene terephthalate (PET), and / or has graphic ink on its surface, the method according to any one of clauses 36 to 38.

[0160] 40. The polymer substrate is coated with one or more of ink (preferably graphic or decorative ink), a non-conductive layer (preferably formed from non-conductive ink), a dielectric layer, and an outer layer in the form of a circuit formed of (or formed from) conductive ink, the method according to any one of clauses 36 to 39.

[0161] 41. Providing a composition between the polymer substrate and the electronic component to form a structure, the method according to any one of clauses 36 to 40, including screen printing the composition and / or drying or curing the composition.

[0162] 42. The method according to any one of clauses 36 to 41, wherein the in-mold electronic device structure is curved 2.5D or 3D.

[0163] 43. A binder composition comprising a thermoplastic resin containing a hydroxyl group, a crosslinking agent, and a solvent, and / or an acrylate resin having one or more curing agents, and / or an epoxy resin having one or more curing agents.

[0164] 44. The binder composition according to any one of clauses 1 to 43 for use in a composition for electronic assembly.

[0165] 45. 5 to 45% by weight, preferably 10 to 40% by weight, more preferably 15 to 30% by weight of a thermoplastic resin, and 0.1 to 5% by weight, preferably 1 to 4% by weight of a crosslinking agent, and 0.1 to 20% by weight, preferably 1 to 10% by weight of an acrylate resin, and / or 0.1 to 20% by weight, preferably 1 to 10% by weight of an epoxy resin, and 0.05 to 2% by weight, preferably 0.1 to 1% by weight of a curing agent, and 45 to 85% by weight, preferably 50 to 80% by weight, more preferably 55 to 75% by weight of a solvent, comprising the binder composition according to clause 43 or 44.

[0166] 46. The thermoplastic resin has a glass transition temperature < 100 °C, and a molecular weight in the range of 1000 to 100000 g / mol, and a softening point < 100 °C, and a hydroxy content (OH value) > 20 mg KOH / g, presenting one or more of the above, the binder composition according to any one of clauses 1 to 45.

[0167] 47. The thermoplastic resin includes one or more of a polyurethane resin, a polyester resin, a polyacrylate resin, a polyvinyl ester resin, a phenoxy resin, and a ketone resin, the binder composition according to any one of clauses 1 to 46.

[0168] 48. 1 to 50% by weight of a polyurethane resin, and / or 1 to 30% by weight of a polyester resin, and / or 1 to 30% by weight of a polyacrylate resin, and / or 1 to 30% by weight of a polyvinyl ester resin, and / or 1 to 30% by weight of a phenoxy resin, and / or 1 to 30% by weight of a ketone resin, and / or 1 to 75% by weight of an acrylate resin, and / or A binder composition according to any one of clauses 43 to 47, comprising 1 to 75% by weight of an epoxy resin.

[0169] 49. The binder composition according to any one of clauses 1 to 48, wherein the crosslinking agent is selected from one or more of a melamine resin, an amino resin, a polyamine resin, an isocyanate, and a polyisocyanate, and preferably is a melamine resin.

[0170] 50. The binder composition according to any one of clauses 1 to 49, wherein the curing agent is selected from one or more of a heat curing initiator and / or a UV curing initiator.

[0171] 51. The binder composition according to any one of clauses 1 to 50, wherein the solvent is selected from one or more of an alcohol, a glycol, a glycol ether, a glycol ester, an ester, and / or a ketone solvent, and / or a hydrocarbon.

[0172] 52. 1 to 50% by weight of an alcohol solvent, and / or 1 to 50% by weight of a glycol solvent, and / or 1 to 15% by weight of a glycol ether solvent, and / or 1 to 60% by weight of a glycol ester solvent, and / or 1 to 75% by weight of an ester solvent, and / or 1 to 25% by weight of a ketone, and / or 1 to 30% by weight of a hydrocarbon solvent, comprising the binder composition according to clause 51.

[0173] 53. The binder composition according to any one of clauses 1 to 52, wherein the binder composition is thermosetting.

[0174] 54. The binder composition according to any one of clauses 1 to 53, wherein the binder composition is UV curable.

[0175] 55. The binder composition according to any one of clauses 1 to 54, wherein the binder composition is thermoformable.

[0176] 56. The binder composition according to any one of clauses 1 to 55, wherein the thermoplastic resin can form a crosslinking agent and a nitrogen-carbon bond.

[0177] 57. A composition for electronic assembly, the binder composition according to any one of clauses 43 to 56, and filler particles, the composition.

[0178] 58. 30 to 99% by weight, preferably 30 to 99% by weight of the binder composition, and 45 to 70% by weight, preferably 50 to 70% by weight of conductive filler particles, or 1 to 40% by weight, preferably 2 to 40% by weight, or 5 to 40% by weight of non-conductive filler particles, the composition according to clause 57.

[0179] 59. The composition according to clause 57 or 58, wherein the filler particles include conductive ones such as metals or non-metals, or non-conductive ones such as metal oxides or non-metals or organic polymer materials.

[0180] 60. The composition according to any one of clauses 57 to 59, wherein the conductive filler particles include one or more of silver, silver alloy, copper, copper alloy (for example, CuNi, CuZn, and CuNiZn), silver-coated copper, silver-coated copper alloy, graphene, graphite, carbon black, carbon nanotube, silver-coated graphene, and silver-coated graphite.

[0181] 61. The composition according to any one of clauses 57 to 60, wherein the non-conductive filler particles include one or more of cellulose, wax, polymer, mica, silica, talc, alumina, barium titanate, non-conductive carbon particles, graphene oxide, and boron nitride.

[0182] 62. The composition according to any one of clauses 57 to 61, wherein the filler particles preferably have a D50 of 1 to 30 μm, preferably 2 to 20 μm, measured using SEM and / or a laser scattering particle size analyzer.

[0183] 63. The composition according to any one of clauses 57 to 62, wherein at least some of the filler particles, preferably substantially all of the filler particles, have a flake-like shape, and preferably the ratio of the longest dimension of the particle to the shortest dimension of the particle is greater than 1, more preferably greater than 2, even more preferably 2 to 10.

[0184] 64. The composition according to any one of clauses 57 to 63, wherein the filler particles have a tapped density of 1 to 5.

[0185] 65. The composition according to any one of clauses 57 to 64, wherein the filler particles are capped with a capping agent.

[0186] 66. The composition according to any one of clauses 57 to 65, wherein the filler particles have a surface area of 0.5 to 5 m 2 / g.

[0187] 67. The composition according to any one of clauses 57 to 66, which is in the form of a metallic ink, a non-metallic ink, or a conductive adhesive.

[0188] 68. The composition according to any one of clauses 57 to 67, which is in the form of a dielectric ink, a non-conductive ink, or a non-conductive adhesive, or a encapsulant.

[0189] 69. Use of the composition according to any one of clauses 57 to 67 in the manufacture of an in-mold electronic device structure (IME).

[0190] 70. A method of manufacturing an in-mold electronic device structure (IME), comprising: providing the composition according to any one of clauses 57 to 68 between a polymer substrate and an electronic component to form a structure; Thermoforming a structure to form a thermoformed structure; and injection molding the thermoformed structure, a method comprising.

[0191] 71. The method according to clause 70, wherein the thermoforming is carried out at a temperature of 140 to 180 °C.

[0192] 72. The method according to clause 70 or 71, wherein the injection molding is carried out at a temperature of 200 to 330 °C.

[0193] 73. The polymer substrate is flexible and / or comprises polycarbonate (PC) and / or polyethylene terephthalate (PET), the method according to any one of clauses 70 to 72.

[0194] 74. Providing a composition between the polymer substrate and the electronic component to form a structure, the method according to any one of clauses 70 to 73, comprising screen printing the composition and / or drying or curing the composition.

[0195] 75. An electronic device structure, comprising a polymer substrate, coated or uncoated with a graphic or decorative ink, coated with a non-conductive layer or a dielectric layer, followed by applying a conductive ink to form a circuit, and attached within the electronic device component using a conductive adhesive, the structure being thermoformed and / or the structure being injection molded to produce a part, an electronic device structure.

[0196] 76. A method of manufacturing the electronic device structure according to clause 75, providing a non-conductive ink composition or a dielectric ink composition according to any one of clauses 13 to 23 or 44 to 54 on a polymer substrate, coated or uncoated with a graphic or decorative ink; Screen printing the conductive ink composition according to any one of clauses 13 to 23 or 44 to 54 onto a polymer substrate coated with a non-conductive ink, and Positioning an electronic component attached using a suitable conductive and non-conductive adhesive according to any one of clauses 13 to 23 and 44 to 54 to form an electronic structure, and Thermoforming the structure to form a thermoformed structure, and Injection molding the thermoformed structure, a method comprising.

[0197] 77. The method according to clause 76, wherein the thermoforming is carried out at a temperature of 140 to 180 °C.

[0198] 78. The method according to clause 76 or 77, wherein the injection molding is carried out at a temperature of 200 to 330 °C.

[0199] 79. The polymer substrate is Flexible and / or The method according to any one of clauses 76 to 78, comprising polycarbonate (PC) and / or polyethylene terephthalate (PET).

[0200] 80. The polymer substrate is Flexible and / or The method according to any one of clauses 76 to 79, comprising polycarbonate (PC) and / or polyethylene terephthalate (PET) coated with a graphic ink.

[0201] 81. Providing a composition between the polymer substrate and the electronic component to form a structure, the method according to any one of clauses 76 to 80, comprising screen printing the composition and / or drying or curing the composition.

[0202] 82. An in-mold electronic device structure (IME) manufactured according to the method according to any one of clauses 36 to 42 or 70 to 81.

Brief Description of the Drawings

[0203] The present invention will now be described in connection with the following non - limiting drawings.

Figure 1

Figure 2

Figure 3-1

Figure 3-2

Figure 4-1

Figure 4-2

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

DETAILED DESCRIPTION OF THE INVENTION

[0204] The present invention will now be discussed in connection with the following non-limiting examples.

[0205] The important attributes of the various fillers (conductive and non-conductive) used in the examples are presented in Table 1 below.

[0206]

Table 1

[0207] Examples of Conductive Inks and Compositions: Several compositions were prepared by dissolving a mixture of a thermoplastic polyester resin, a polyurethane resin, and a phenoxy resin having hydroxyl functional groups in a mixture of solvents of different categories at 70 - 100 °C. The reaction mixture was cooled to room temperature, and subsequently a functional additive package containing a surfactant, a rheology modifier, a dispersant, an antifoaming agent, and a wetting agent was added. Then, a reactive crosslinking agent and / or other acrylic or epoxy curing agent were thoroughly mixed with the above polymer resin mixture. For the preparation of conductive inks, coatings, and adhesive compositions, the composition was further mixed with several different conductive particles. The conductive particles were mixed using an orbital mixer (1 minute at 1000 rpm, 3 cycles). Certain compositions were also milled in a three-roll mill for several minutes to obtain a homogeneous paste.

[0208] Examples 1 - 14 and Examples 19 - 26 below are conductive compositions prepared without a thermosetting resin. Examples 15 - 18 are conductive compositions prepared using a thermosetting resin and a corresponding curing catalyst.

[0209] Example 1

[0210] [Table 2]

[0211] 53.2 wt% silver flakes and 46.8 wt% polymer solution were mixed together using an orbital mixer at 1000 rpm for 1 minute, 3 cycles to obtain a homogeneous paste. The viscosity of the paste was found to be in the range of 4000 - 7000 cP, which is suitable for screen printing.

[0212] Examples 2 - 26 Compositions having the components specified in Tables 2 - 6 below were prepared by the process described in Example 1 above.

[0213] [Table 3]

[0214]

Table 4

[0215]

Table 5

[0216]

Table 6

[0217]

Table 7

[0218] Examples of Non-Conductive Inks and Compositions: Several compositions were prepared by dissolving a mixture of a hydroxyl-functionalized thermoplastic polyester resin, a polyurethane resin, and a phenoxy resin in a mixture of solvents of different categories at 70 - 100 °C. The reaction mixture was cooled to room temperature, and subsequently a functional additive package containing a surfactant, a rheology modifier, a dispersant, an antifoaming agent, and a wetting agent was added. Then, a reactive crosslinking agent and / or other acrylic or epoxy curing agent was thoroughly mixed with the above polymer resin mixture. For the preparation of conductive inks, coatings, and adhesive compositions, the composition was further mixed with several different conductive particles. The conductive particles were mixed using an orbital mixer (1 minute at 1000 rpm, 3 cycles). Certain compositions were also milled in a three-roll mill for several minutes to obtain a homogeneous paste.

[0219] Examples 27 - 36 and Examples 41 - 61 below are conductive compositions prepared without a thermosetting resin. Examples 37 - 40 are conductive compositions prepared using a thermosetting resin and a corresponding curing catalyst.

[0220] Example 27

[0221]

Table 8

[0222] A mixture of 30.1 wt% talc and an organic filler, and 69.9 wt% of a polymer solution were mixed together using an orbital mixer at 1000 rpm for 1 minute in 3 cycles to obtain a homogeneous paste. The viscosity of the paste was found to be in the range of 11000 - 15000 cP and is suitable for screen printing.

[0223] Examples 28 - 61 Compositions having the components specified in Tables 7 - 11 below were prepared according to the process described in Example 27 above.

[0224]

Table 9

[0225]

Table 10

[0226]

Table 11

[0227]

Table 12

[0228]

Table 13

[0229] Thermoforming and injection molding performance: Structure of 3D electronic devices: The conductive and dielectric compositions disclosed above have been thoroughly characterized, tested for screen printing, electrical performance, compatibility between different inks and substrates (PC and PET), and adhesion and stability under different accelerated environmental test conditions. These inks were further tested for thermal stability, thermoforming, and injection molding stability.

[0230] For example, Table 12 below summarizes various characteristics and test performance attributes of the conductive compositions described in Examples 1 to 26.

[0231]

Table 14

[0232] Furthermore, Table 13 below summarizes various characteristics and test performance attributes of the non-conductive compositions described in Examples 27 to 61.

[0233]

Table 15

[0234] Along with the compatibility with different flexible polymer substrates, decorative inks, adhesives, encapsulants, and injection molding resins, the mutual compatibility of conductive and non-conductive materials is an important aspect for the manufacture of IMEs and similar structures.

[0235] Compatibility of the wet silver ink composition with various PC substrates The wet silver ink composition is highly compatible with various PC substrates. The compatibility of the wet silver ink (Examples 1, 17, 23, and 25) with a PC film substrate (Makrafol DE1.4) was investigated by taking microscopic images of the screen-printed pattern (1000 μm line) of the wet silver ink at different time intervals (immediately, i.e., 0 min, 1, 2, 3, 5, and 15 min) before drying using a jet dryer. These results indicate very good compatibility of the silver ink with the PC substrate.

[0236] Compatibility of silver ink with dielectric ink compositions and with various pristine and graphic-coated PET and PC substrates The disclosed silver and dielectric ink compositions are highly compatible and conformable with various pristine and graphic-coated PET and PC substrates. Adhesion tests (tested according to ASTM F1842-09) were performed to show the compatibility of dried silver and dielectric inks with various polymer film substrates (PC, PET, and graphic-coated PC film substrates). Table 14 below summarizes representative adhesion test results of silver ink (Example 2) and dielectric ink (Examples 33 and 34) on graphic inks printed on various pristine PET (MacDermid Autotype AHU5, CT5, and HT5), pristine PC (Makrafol DE1.4), and PC (MacDermid Autotype XFG2502L-HTR952) film substrates. Table 4 also summarizes representative adhesion test results of silver ink (Example 2) on dielectric ink (Examples 33 and 34) coated on graphic inks printed on various pristine PET (MacDermid Autotype AhU5, CT5, and HT5), pristine PC (Makrafol DE1.4), and PC (MacDermid Autotype XFG2502L-HTR952) film substrates.

[0237]

Table 16

[0238] Adhesion tests were also performed on the following: · Silver ink (Example 1) printed on pristine PC (Makrafol DE1.4), · Silver ink (Example 1) printed on dielectric ink (Example 32) coated on pristine PC (Makrafol DE1.4), · Silver ink (Example 1) printed on graphic-ink-printed PC (MacDermid Autotype XFG2502L-HTR952), · Silver ink (Example 1) printed on a dielectric ink (Example 32) coated on a PC (MacDermid Autotype XFG2502L-HTR952) printed with graphic ink, · Dielectric ink (Example 32) on an initial PC (Makrafol DE1.4), · Graphic ink (Example 32) printed on a PC (MacDermid Autotype XFG2502L-HTR952), · Multilayer laminate of silver ink (Example 10) / dielectric ink (Example 53) / silver ink (Example 10) on an initial PC (Makrafol DE1.4), · Multilayer laminate of silver ink (Example 10) / dielectric ink (Example 54) / silver ink (Example 10) on an initial PC (Makrafol DE1.4).

[0239] All of these samples show the 5B adhesion test results according to ASTM F1842-09.

[0240] Accelerated environmental test The disclosed silver ink and dielectric ink compositions are very robust and stable when tested under different accelerated environmental test conditions according to JEDEC22-A101 85 (Environmental test, 85°C / 85RH) and IEC60068-2-2 thermal aging test / dry heat test. A typical test structure consisted of 500 μm lines of conductive silver circuit traces prepared by screen printing onto an initial PC and drying by jet drying. The electrical resistance of these lines was measured before and after exposure for 100 - 1000 hours to either 85°C / 85RH or 110°C. Also, a laminate of a dielectric ink / / silver ink / / dielectric ink sample was prepared and the electrical resistance of the conductive silver circuit trace was measured. Further, the adhesion of these inks was tested according to ASTM F1842-09 after exposing these samples to either 85°C / 85RH or 110°C for 100 - 1000 hours.

[0241] Table 5 summarizes the change rate of electrical resistance (%R, calculated by Equation 1) of a representative test structure prepared using silver ink (Example 10) and dielectric ink (Example 47) after 100 hours of exposure to 85°C / 85RH or 110°C, and a laminate of dielectric ink (Example 47) on silver ink (Example 10) / / initial PC (Makrafol DE1.4). Δ Change rate of electrical resistance (%ΔR) = [(resistance after - resistance before) / resistance before] (Equation 1)

[0242] The adhesion test of the above reliability test structure after exposure to environmental test conditions was performed according to ASTM F1842-09, and the results are summarized in Table 15.

[0243]

Table 17

[0244] Laminate of a thermoformable PC substrate coated with a screen-printed silver layer / / dielectric layer / / graphic layer Figure 2 shows a representative laminate of a thermoformable PC substrate (MacDermid Autotype Xtraform PC) (90) coated with a screen-printed silver layer / / dielectric layer / / graphic layer, and an image sample prepared using Example 1 (silver ink) Example 47 (dielectric ink) on a thermoformable PC substrate coated with black graphic ink, which produced structures 110, 120, and 130 during thermoforming. The interconnecting lines printed on these structures are electrically connected and show no significant change in resistance after thermoforming. For the thermoforming process, a screen-printed sample 100 as shown in Figure 2, as well as the components with the sample mounted, were exposed to a temperature of 170 ± 2 °C for 30 - 35 seconds. During the thermoforming process, the printed traces were directed towards the heater. Upon exposure to heat, the printed substrate was softened and positioned on the forming tool for 10 - 15 seconds under a vacuum pressure of 4 bar to obtain a 3D thermoformed substrate as shown as 110, 120, and 130 in Figure 2. The images 100, 110, 120, and 130 shown in Figure 2 correspond to Example 1. Similarly, the printed structures of Example 2, Example 4, Example 33, Example 34, Example 35, and Example 42 were also tested for thermoforming performance using different combinations on PC and PET substrates and were found to be thermoformable.

[0245] One of the key attributes of conductive and non-conductive compositions is thermoformability. This is particularly important for IME and similar applications. To evaluate the thermoformability of 2D circuit traces formed within 3D circuits / devices, a conical structure test vehicle was employed. To determine the thermoform attributes of the traces, a proprietary procedure called the "cone formability test procedure" was used. In this procedure, the conductivity of a series of circuit traces is measured on a flat polymer substrate. After formation, along with other failure mechanisms, changes in electrical resistance are used to evaluate the degree of thermoformability. This test structure has straight traces with line widths of 150 μm, 300 μm, 500 μm, and 1000 μm. These flat line structures are thermoformed into a cylindrical conical shape that can be convex or concave. During thermoforming, various traces can undergo stretching that can vary from 0 to 58%. An important performance metric is to determine the thermoformability such that it stretches preferably with a small change in electrical resistance without breaking or delaminating from the substrate.

[0246] Thermoform Attributes of Silver Ink The thermoform attributes of silver ink were evaluated by the aforementioned "cone formability test procedure". In a typical process, silver ink was printed on a thermoformable polymer substrate (e.g., PC or PET), and the electrical resistance of the conductive test circuit was measured before and after the thermoforming process to record the change in resistance at various % strains. Figures 3a and 3b show representative images of typical test samples before and after thermoforming on a thermoformable PC substrate (Makrafol DE1.4), respectively. After formation, along with other failure mechanisms, changes in electrical resistance are used to evaluate the degree of thermoformability. For example, Figures 3c and 3d show the variation in electrical resistance of 1000 μm line width conductive silver circuit traces of silver ink (Example 1, Example 2, Example 10, and Example 11) before and after thermoforming, respectively. The resistance before (Figure 3c) and after (Figure 3d) thermoforming is plotted as a function of % strain position and % strain, respectively. During thermoforming, the circuit lines / traces are formed into the shape of a cone. As a result, the circuit line traces undergo stretching.

[0247] Compatibility of Silver Ink with Various PC Substrates and Thermoform Attributes The compatibility and thermoformability characteristics of the silver ink with various PC substrates were evaluated by the aforementioned "Conical Formability Test Procedure". In a typical process, the silver ink was printed onto different types of thermoformable PC substrates (DE as Makrafol DE1.4, V3 as MacDermid Autotype XFG250 M HCL V3, and 2L as MacDermid Autotype XFG250 2L substrates), and onto PC substrates coated with graphic ink (GCPC as MacDermid Autotype XFG2502L-HTR952). Since the PC substrate coated with graphic ink (GCPC) was found to conduct mildly to avoid short circuits, a layer of dielectric ink (Example 33) was printed prior to the printing of the silver ink. The electrical resistance of the silver conductive test circuit was measured before and after the thermoforming process to record the change in resistance at various % strains. After forming, the degree of thermoformability was evaluated using the change in electrical resistance along with other failure mechanisms. For example, FIGS. 4a and 4b show the variation in electrical resistance of the 1000 μm line width conductive silver circuit traces of the silver ink (Example 10) on various PC substrates before and after thermoforming, respectively. The resistance before (FIG. 4a) and after (FIG. 4b) thermoforming is plotted as a function of the % strain position and % strain, respectively. During thermoforming, the circuit line / trace is formed into a conical shape. As a result, the circuit line trace undergoes stretching. FIG. 4c shows microscope images of the 1000 μm line width conductive silver circuit traces of the silver ink (Example 10) at 30, 37, and 46% strain on various PC substrates, revealing very minimal strain below 40% strain.

[0248] Compatibility and Thermoforming Attributes of Dielectric Ink and Silver Ink of the 2-Layer Laminate The compatibility and thermoformability attributes of the dielectric ink and silver ink of the 2 - laminate were evaluated by the aforementioned "Conical Formability Test Procedure". A typical 2 - laminate circuit assembly was prepared by first printing a dielectric ink layer (barrier dielectric layer) on a thermoformable polymer substrate (e.g., PC or PET), and subsequently printing conductive silver circuit traces. The electrical resistance of the silver conductive test circuit was measured before and after the thermoforming process to record the change in resistance at various % strains. Figures 5a and 5b show representative images of typical test samples before and after thermoforming, respectively. After formation, the degree of thermoformability was evaluated using the change in electrical resistance along with other failure mechanisms. For example, Figures 5c and 5d show the variation in electrical resistance of 1000 - μm line - width conductive silver circuit traces of silver ink (Example 1) printed on dielectric ink (Examples 33 and 35), silver ink Example 10 printed on dielectric ink (Examples 33 and 35), and silver ink (Example 11) printed on dielectric ink (Example 35) before and after thermoforming, respectively. The resistance before (Figure 5c) and after (Figure 5d) thermoforming was plotted as a function of the % strain position and % strain, respectively. During thermoforming, the circuit lines / traces are formed into the shape of a cone. As a result, the circuit line traces are subjected to stretching.

[0249] The compatibility and thermoformability attributes of the dielectric ink and silver ink of the 3 - laminate The compatibility and thermoformability attributes of the dielectric ink and silver ink of the 3 - laminate were evaluated by the aforementioned "Conical Formability Test Procedure". A typical 3 - laminate circuit assembly was prepared by first printing a dielectric ink layer (barrier dielectric layer) on a thermoformable polymer substrate (e.g., PC or PET), then printing a conductive silver circuit trace, and subsequently printing another dielectric ink layer (protective layer). The electrical resistance of the conductive silver test circuit was measured before and after the thermoforming process to record the change in resistance at various % strains. Figures 6a and 6b show representative images of typical test samples before and after thermoforming, respectively. After formation, the degree of thermoformability was evaluated using the change in electrical resistance along with other failure mechanisms. For example, Figures 6c and 6d show the variation in electrical resistance of a 1000 - μm line - width conductive circuit trace of silver ink (Example 10) where the barrier dielectric layer and the protective layer were selected as either Example 35 or Example 47, or a combination thereof. The resistance before (Figure 6c) and after (Figure 6d) thermoforming was plotted as a function of the % strain position and % strain, respectively. During thermoforming, the circuit lines / traces are formed into the shape of a cone. As a result, the circuit line traces are subjected to stretching.

[0250] A thermoformable conductive composition used as a conductive adhesive for attaching various SMD components The thermoformable conductive compositions disclosed in Examples 1 to 26 can also be used as conductive adhesives for attaching various SMD components, LEDs, etc. to thermoformable conductive silver ink circuit traces. The viscosities of these formulations can be optimized to place these conductive adhesives either by dispensing or by screen printing. The compatibility of the thermoformable conductive adhesive silver ink with the substrate is very essential for fabricating IME structures. Figure 7 shows a representative application of a thermoformable conductive adhesive composition (Example 7) for attaching SMD components onto a formable conductive silver circuit trace (Example 10). For example, Figure 7a shows a microscopic image of dispensed dots (wet deposits) of Example 7 with a diameter of 650 - 700 μm. Figures 7b and 7c show microscopic images of the wet assemblies of SMD1206 chips and SMD1206 LEDs on a formable conductive silver circuit trace (Example 10), respectively. Figures 7d and 7e show the thermally cured and dried ones formed in Figures 7b and 7c, respectively.

[0251] Thermoforming Attributes of Representative Conductive Circuit Structures The thermoforming characteristics of a representative conductive circuit structure in which components (such as SMD1206 chips or SMD1206 LEDs) are attached onto a silver ink (Example 10) on a thermoformable PC substrate (DE as Makrafol DE1.4) using a conductive adhesive (Example 7) were evaluated by the aforementioned "Conical Formability Test Procedure". A typical assembly was prepared by first printing a silver ink (Example 10) conductive circuit trace on a thermoformable polymer substrate (DE), then dispensing Example 7, and subsequently attaching components of SMD1206 chips and SMD1206 LEDs. The electrical continuity of these conductive circuit structures was confirmed by supplying current before and after thermoforming. For example, Figures 8a and 8b show an LED on a printed conductive track before and after applying current. In particular, the lit LED indicating the continuity of the circuit structure, and the corresponding stained positions are also shown in Figures 8a and 8b. These results show the suitability of the use of Example 7 as a conductive adhesive for the construction of thermoformable circuit assemblies.

[0252] Typical laminate of screen-printed silver layer / thermoformable PC substrate Figure 9 shows a typical laminate of a screen-printed silver layer / / thermoformable PC substrate (140) that produced the structure 150 during injection molding. The injection molding was carried out on an injection molding machine using a center gate. The cavity dimensions were 100 mm × 80 mm. The injection molding was carried out in a flat shape with a thickness of 2 - 3 mm, and some of the maximum weights were approximate. Example 10 was used as the silver ink and the initial PC substrate (Makrofol DE1.4) to prepare the structure 140, and this structure was injection molded with a PC resin to produce the structure 150. Similarly, the printed structures of Example 1, Example 2, Example 4, Example 33, Example 34, Example 35, and Example 42 were also tested for injection molding performance with different combinations of various injection molding resins such as PC and ABS, and it has been found that they are stable during injection molding.

[0253] Typical functional 3D electronic device Figure 10 shows the design and configuration of a typical functional 3D electronic device. This device was produced by screen-printing Example 1, drying it, then attaching an LED using Example 1, and then thermoforming the entire laminate. Figures 10 (a and b) are images of the hand-held type, and (c and d) are of the console type of a demonstrator that can perform touch-switching applications. This process involved the first printing of Example 1, followed by drying. In the second step, it involved stencil printing and LED positioning of Example 7, followed by drying. The LED was lit by providing power through a button battery.

[0254] Typical fully functional IME device Figure 11 shows a representative fully functional IME device that can be seen as a prototype of a typical aircraft console panel. Figures 11a and 11b are optical images of the IME device in the switched off and switched on states, respectively. Figure 11b shows the capacitive touch switching application of such an IME demonstrator. These devices were produced by a multi-step process such as screen printing, thermal drying, dispensing, SMT component assembly, high-pressure thermoforming, laser cutting, injection molding (PC resin), etc., using various commercially available graphic inks (such as Proell) and silver ink (Example 10), dielectric ink (Example 47), conductive adhesive (Example 7), and various MacDermid Autotype Xtraform PC substrates. These IME devices were configured as a single film structure, and the first few layers of decorative graphic ink (black and white) were printed and dried. Subsequently, a conductive electronic circuit layer was printed and dried using silver ink and dielectric ink, and LEDs were assembled using a conductive adhesive. The entire laminate was further thermoformed, laser cut and trimmed according to the desired shape, and back injection molded with PC resin. In Figure 11b, the LEDs were lit by providing power through a button cell.

[0255] The foregoing detailed description is provided by way of explanation and illustration and is not intended to limit the scope of the appended claims. Many variations of the presently preferred embodiments shown herein will be apparent to those skilled in the art and remain within the scope of the appended claims and their equivalents.

Claims

1. A composition for use in the manufacture of in-mold electronics (IME) components, comprising a crosslinking agent containing methylated melamine formaldehyde or butylated melamine formaldehyde, a thermoplastic resin containing a hydroxyl group, a solvent, and containing a binder, wherein the thermoplastic resin comprises, based on the total weight of the thermoplastic resin, 5 to 30% by weight of a thermoplastic polyester resin, 20 to 60% by weight of a thermoplastic polyurethane resin, and 20 to 60% by weight of a thermoplastic phenoxy resin, the thermoplastic polyester resin contains one or more functional groups among a polyol group, a hydroxyl group, an amine group, a carboxylic acid group, an amide group, and an aliphatic chain, the thermoplastic polyurethane resin comprises a reaction product of isophorone diisocyanate, hexamethylene diisocyanate, m-xylene diisocyanate, 1,4-cyclohexylene diisocyanate, poly(propylene glycol), or tolylene 2,4-diisocyanate with a hydroxy-terminated polyol, hydroxy-terminated poly(ethylene oxide), hydroxy-terminated poly(dimethylsiloxane), or trimethylolpropane ethoxylate, the thermoplastic phenoxy resin is a thermoplastic bisphenol-A-based polyether containing a polyester or polyacrylate or polyurethane backbone. A composition.

2. The composition according to claim 1, wherein the methylated melamine formaldehyde contains hexamethoxymethyl melamine.

3. The composition according to claim 1 or 2, wherein the crosslinking agent further comprises one or more of a polyfunctional isocyanate, a polyisocyanate, and a blocked polyisocyanate.

4. The thermoplastic resin is including a homopolymer, as well as a copolymer and / or a terpolymer, and / or having a glass transition temperature of less than 100°C, and / or having a weight average molecular weight of 1,000 to 100,000 g / mol and / or having a softening point of less than 100 °C and / or The composition according to any one of claims 1 to 3, having a hydroxyl content (OH value) of more than 20 mg KOH / g.

5. Based on the total amount of the crosslinking agent and the thermoplastic resin, 1 to 40% by weight of the crosslinking agent, and 60 to 99% by weight of the thermoplastic resin, The composition according to any one of claims 1 to 4.

6. The solvent contains one or more of glycol ether acetate, glycol ether, ester, ketone, alcohol, and hydrocarbon, and the solvent is based on the total weight of the solvent, up to 95% by weight of glycol ether acetate, up to 95% by weight of glycol ether, up to 15% by weight of ester, up to 40% by weight of ketone, up to 80% by weight of alcohol, and / or up to 30% by weight of hydrocarbon, The composition according to any one of claims 1 to 5.

7. The binder is a thermosetting resin containing one or both of an acrylic resin and an epoxy resin, and a curing catalyst for curing the thermosetting resin, The composition according to any one of claims 1 to 6.

8. The binder further contains one or more of functional additives selected from surfactants, rheology modifiers, dispersants, defoamers, anti-blocking agents, slip additives, anti-sagging agents, leveling agents, surfactants, surface tension reducers, adhesion promoters, anti-skinning agents, matting agents, colorants, dyes, pigments, and wetting agents. The composition according to any one of claims 1 to 7.

9. The binder is 0.5 to 12% by weight of the crosslinking agent, 10 to 40% by weight of the thermoplastic resin, 40 to 85% by weight of a solvent, and Optionally, 0.1 to 30% by weight of a thermosetting resin and 0.1 to 3% by weight of a curing catalyst for curing the thermosetting resin, and / or 0.1 to 20% by weight of a functional additive, the composition according to any one of claims 1 to 8.

10. Further comprising conductive particles, wherein the conductive particles are selected from one or more of silver particles, copper particles, brass particles, nickel particles, gold particles, platinum particles, palladium particles, metal alloy particles, silver-coated copper particles, silver-coated brass particles, silver-nickel alloy particles, and silver-copper alloy particles, and / or contain one or more of carbon particles selected from one or more of graphite particles, graphite flakes, carbon black particles, graphene flakes, graphene particles, and carbon nanotubes, the composition according to any one of claims 1 to 9.

11. The conductive particles have an average particle size (d50) of 1.25 to 7 μm, and a tap density of 2 to 4 g / cc, 0.3 to 2.1 m ２ / g of surface area and exhibit one or more of the above, the composition according to claim 10.

12. The conductive particles are in one or more forms of flakes, spheres, irregularly shaped particles, nano powders, and nano wires, the composition according to claim 10 or 11.

13. 30 to 85% by weight of a binder, 15 to 70% by weight of conductive particles, the composition according to any one of claims 10 to 12.

14. The composition 30 to 85% by weight of a binder, and 15 to 70% by weight of conductive particles, and wherein the binder is 0.2 to 6% by weight of a crosslinking agent, and 1 to 7.5% by weight of a thermoplastic polyurethane resin, and 0.1 to 5.5% by weight of a thermoplastic polyester resin, and 1 to 7.5% by weight of a thermoplastic phenoxy resin, and 0 to 10% by weight of a thermosetting resin, and 0 to 1% by weight of a curing catalyst, and 0.2 to 10% by weight of a functional additive, and 0 to 60% by weight of a glycol ether acetate, and 0 to 40% by weight of a glycol ether, and 0 to 5% by weight of an ester, and 0 to 30% by weight of a ketone, and comprising the composition according to any one of claims 10 to 12.

15. The composition according to any one of claims 10 to 14, which is in the form of a conductive ink or in the form of a conductive adhesive.

16. Further comprising non-conductive particles, wherein the non-conductive particles include organic non-conductive particles selected from one or more of cellulose, wax, polymer microparticles, non-conductive carbon particles, and graphene oxide, and / or mica, silica (SiO ２ ), fumed silica, talc, titanium dioxide (TiO ２ ), alumina, barium titanate (BaTiO ３ ), zinc oxide (ZnO), and boron nitride (BN), and optionally, the inorganic non-conductive particles are of submicron and micron sizes, the composition according to any one of claims 1 to 9.

17. The composition according to claim 16, wherein the inorganic non-conductive particles exhibit an average particle size (d50) of 10 μm or less.

18. 0 to 50% by weight of non-conductive particles, and 50 to 100% by weight of a binder, the composition according to claim 16 or 17.

19. The composition is 40 to 100% by weight of a binder, and 0 to 60% by weight of non-conductive particles, and The binder is 0.5 to 10% by weight of a crosslinking agent, and 2 to 12% by weight of a thermoplastic polyurethane resin, and 0.5 to 10% by weight of a thermoplastic polyester resin, and 2 to 18% by weight of a thermoplastic phenoxy resin, and 0 to 30% by weight of a thermosetting resin, and 0 to 3% by weight of a curing catalyst, and 0.3 to 17% by weight of a functional additive, and 0 to 41.7% by weight of glycol ether acetate, and 0 to 60% by weight of glycol ether, and 0 to 30% by weight of a ketone, and 0 to 50% by weight of an alcohol, and 0 to 20% by weight of a hydrocarbon, the composition according to claim 17 or 18.

20. In the form of a dielectric ink, or in the form of a non-conductive adhesive, or in the form of a sealant, the composition according to any one of claims 1 to 9, 16 to 19.

21. Further comprising one or more of a colorant, a dye, and a pigment, and being in the form of a graphic ink, the composition according to any one of claims 1 to 9.

22. A method for producing the composition according to any one of claims 1 to 21, comprising providing a solvent, and providing a thermoplastic resin having a hydroxyl group, and dissolving the thermoplastic resin in the solvent at a temperature of 50 to 100°C cooling the solution to room temperature; optionally, adding to the cooled solution one or more of a functional additive, a thermosetting resin, a curing catalyst for curing the thermosetting resin, conductive particles, and non-conductive particles.

23. A method of manufacturing an in-mold electronics (IME) component, comprising: preparing a blank; thermoforming the blank, wherein preparing the blank includes forming one or more structures on a thermoformable substrate, each structure comprising: disposing the composition according to any one of claims 1 to 21 on a thermoformable substrate; drying the composition at a temperature of 20 to 150 °C for 0.5 to 60 minutes.

24. The method according to claim 23, wherein the one or more structures are selected from a conductive layer, a conductive track layer, an adhesive attachment layer, a dielectric layer, an encapsulant layer, a graphic layer, and a barrier layer.

25. The method according to claim 23 or 24, wherein the one or more structures include a multilayer laminate.

26. The method according to any one of claims 23 to 25, wherein the one or more structures include a printed circuit board.

27. The method according to any one of claims 23 to 26, wherein disposing the composition includes printing the composition.

28. The method according to any one of claims 23 to 27, wherein the substrate includes polycarbonate (PC) and / or polyethylene terephthalate (PET).

29. The method according to any one of claims 23 to 28, wherein the thermoforming is carried out at a temperature of 140°C to 210°C and / or a pressure in the range of 0.25 MPa to 0.4 MPa and / or 6 MPa to 12 MPa.

30. Further comprising attaching one or more electronic devices to the blank using a conductive adhesive or a non-conductive adhesive, wherein when the conductive adhesive is in the form of a conductive adhesive, it is the composition according to claim 15, and when the non-conductive adhesive is in the form of a non-conductive adhesive, it is the composition according to claim 20, and the attaching is carried out before and / or after the thermoforming, the method according to any one of claims 23 to 29.

31. Further comprising applying a layer of resin to the substrate using injection molding after the thermoforming, wherein the resin comprises one or more of polycarbonate (PC), polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyester, poly(methyl methacrylate) (PMMA), low density polyethylene (LDPE), high density polyethylene (HDPE), polystyrene (PS), and thermoplastic polyurethane (TPU), the method according to any one of claims 23 to 30.

32. The method according to claim 31, wherein the injection molding is carried out at a temperature of 170 to 330°C.

33. The in-mold electronics (IME) component comprises a capacitive touch switch, a resistive touch switch, or a capacitive touch sensor, or the in-mold electronics (IME) component comprises one or more of a display, a light / lamp, a sensor, an indicator, and a tactile / touch feedback device, the method according to any one of claims 23 to 32.

34. An in-mold electronics (IME) component comprising the composition according to any one of claims 1 to 21.

35. Comprising a capacitive touch switch or a resistive touch switch, or The in-mold electronics (IME) component according to claim 34, comprising one or more of a display, a light / lamp, a sensor, an indicator, and a haptic / touch feedback device.

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