Flow rate change rate measuring device
The rate-of-change flow measurement device addresses the challenge of calibrating small-scale mass flow controllers by using a processor to calculate and compensate for chamber volume variations, ensuring accurate flow rate measurements.
Patent Information
- Application Number
- JP2021127835
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-07-16
- Filing Date
- 2021-08-03
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2041-08-03
AI Technical Summary
Accurate calibration and validation of small-scale mass flow controllers are challenging due to the difficulty in considering small variations in the position of the control valve, which affect the volume of the downstream chamber.
A rate-of-change flow measurement device is developed, featuring a block body with a flow path, a chamber, a position control valve with an actuator and valve position sensor, pressure sensors on both sides of the flow path, and a processor that calculates the chamber volume using valve position data to compensate for variations during calibration.
This solution enables accurate and repeated calibration and validation of devices under test by effectively measuring and compensating for small variations in the chamber volume, thereby enhancing the accuracy of flow rate measurements.
Smart Images

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Abstract
Description
Technical Field
[0001] This application claims priority based on U.S. Provisional Patent Application No. 63 / 065,995, filed on August 14, 2020, the entire disclosure of which is incorporated herein by reference for all purposes.
Background Art
[0002] A mass flow controller (MFC) is used to measure and control the flow of liquids and gases in a fluid flow system. Mass flow controllers are frequently used in applications where it is desirable to determine the amount of fluid flowing through the mass flow controller with high accuracy, such as in the manufacture of semiconductor devices. Typically, the flow rate is not measured directly, but rather is calculated by measuring the characteristics of the fluid and the valve. Accurate calibration and validation of such small-scale and precise mass flow controllers is difficult to implement, especially when the volume of the chamber for measuring and controlling small flow rates is small. A slight variation in the position of the control valve of the mass flow controller can affect the volume of the downstream chamber, and these slight variations need to be appropriately considered to ensure accurate measurement and control of the gas flow rate passing through the mass flow controller. In practice, for example, each time the mass flow controller is connected to a flow rate change rate measuring device for calibration or validation, the problem of considering these small variations arises.
Summary of the Invention
[0003] According to one aspect of the present disclosure, there is provided a rate-of-change flow measurement device including a block body having a flow path, a chamber including a part of the flow path of the block body, a position control valve including an actuator, a valve position sensor configured to measure the valve position of the actuator of the position control valve, a first pressure sensor disposed on the primary side (or the first side, a first side) of the flow path as viewed from the position control valve and configured to detect a first pressure on the primary side of the flow path, a second pressure sensor disposed on the secondary side (or the second side, a second side) of the flow path as viewed from the position control valve and configured to detect a second pressure on the secondary side of the flow path adjacent to the chamber, and a processor. The processor receives valve position data indicating the valve position of the actuator from the valve position sensor, receives first pressure data from the first pressure sensor, receives second pressure data from the second pressure sensor, and is configured to calculate the volume of the chamber using at least a part of the valve position data when calibrating a device under test by opening the position control valve and lowering or raising the pressure in the chamber while maintaining the first pressure at a pressure set value.
[0004] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Further, the claimed subject matter is not limited to embodiments that solve any or all disadvantages noted in any part of this disclosure.
Brief Description of the Drawings
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DETAILED DESCRIPTION OF THE INVENTION
[0006] In view of the above problems, the present disclosure relates to a flow rate change rate measuring device configured to accurately and repeatedly calibrate and validate a device under test (DUT) located upstream or downstream of the flow rate change rate measuring device by performing a change rate test, the change rate test including a flow rate change rate measurement including a rate of rise (ROR) measurement and a rate of fall (ROF) measurement. The calculation of the flow rate is performed based on a pressure change in a chamber of a device having a known volume, which is measured during the change rate test. According to the present disclosure, a relatively small flow rate of a fluid flowing in a flow path can be accurately measured.
[0007] As shown in FIGS. 1 and 2, the flow rate change rate measuring device 10 includes a first pressure sensor 28, a position control valve 16, a second pressure sensor 29, a heat exchanger 27 having a chamber 27a, and an isolation valve 22, and these are provided on a flow path 14 passing through a block body 12 of the flow rate change rate measuring device 10. In FIGS. 1 and 2, when performing ROR measurement, the flow path 14 is shown as flowing from left to right. However, it will be understood that when performing ROF measurement, the flow direction may be changed from right to left. The position control valve 16 and the isolation valve 22 are at least partially provided in the flow path 14 of the block body 12. The position control valve 16 and the isolation valve 22 may be opened and closed to control the flow of fluid along the flow path 14.
[0008] The first pressure sensor 28 is arranged upstream or on the primary side of the position control valve 16 in the flow path 14 and is configured to detect a first pressure that is the pressure on the primary side of the flow path. Further, the second pressure sensor 29 is arranged downstream or on the secondary side of the position control valve 16 in the flow path 14 and is configured to detect a second pressure that is the pressure on the secondary side of the flow path adjacent to the chamber 27a. As will be described in detail below, the measurement of the magnitudes of the pressure increase and pressure decrease detected by the second pressure sensor 29 may be used to calculate a pressure difference.
[0009] The first pressure sensor 28 and the second pressure sensor 29 may be configured as dual-range pressure sensors that enable high-resolution measurements not only at high pressures but also at low pressures. The position control valve 16 may be configured as a piezo valve that functions as a pressure adjustment mechanism. The position control valve 16 further includes a valve position sensor 18 configured to measure the degree (opening) of its opening and closing. The valve position sensor 18 measures the valve position of the actuator 20 of the position control valve 16 within a range between the fully open state and the fully closed state. The valve position sensor 18 may be configured to detect a nano-scale change in the position of the actuator 20. For example, the valve position sensor 18 may detect the displacement amount of the actuator with a resolution of 3 nm or more and 10 nm or less, and may detect the displacement amount of the actuator up to a maximum of 50 μm. It will be understood that the resolution band is determined by the displacement of the actuator 20 and the resolution band may take other regions as well.
[0010] The heat exchanger 27 is configured to reduce the thermal effects that can induce errors that may occur during calibration and validation of the DUT. The heat exchanger 27 includes a chamber 27a that forms part of the flow path 14. A small variation in the volume of the chamber 27a can significantly affect the flow rate measurement, particularly in a micro-scale flow rate change rate measuring device 10 configured to measure a relatively small flow rate, when the chamber 27a is scaled with relatively small dimensions. As will be described in more detail below, the actuator position of the position control valve 16 is determined during calibration, and the determined actuator position is used to compensate for the variation in the chamber volume due to the movement of the position control valve 16. Accordingly, the position control of the actuator 20 of the position control valve 16 is used to compensate for the variation in the chamber volume.
[0011] The heat exchanger 27 may have a porous structure including a thermally conductive material. The heat exchanger 27 may include a labyrinthine coil passage or a serpentine passage so as to facilitate heat exchange between the passing fluid and the wall of the heat exchanger. The heat exchanger 27 may be detachably provided within the flow rate change rate measuring device 10, enabling the user to easily remove the heat exchanger 27 and replace it with another heat exchanger 27 model having a different chamber volume, structure, and composition. Alternatively, a plate connected to the heat exchanger 27 may be detachably attached to the body (or housing, main body, body) of the heat exchanger 27, allowing the user to easily remove the chamber 27a and replace the heat exchanger 27 with a different plate including a different chamber, so as to be able to configure different chamber volumes within the heat exchanger 27. Therefore, for example, the user may select and attach a model of the heat exchanger 27 or the chamber 27a optimized for a specific DUT, and customize the heat exchanger 27 and / or the chamber 27a to have an optimal chamber size.
[0012] The isolation valve 22 may further include a position sensor 24 configured to determine (or decide) whether the isolation valve 22 is in an open state or a closed state. This position sensor 24 may determine whether the valve position of the actuator 26 of the isolation valve 22 is in a fully open state or a fully closed state. And the isolation valve 22 seals completely so that there is no leakage from the heat exchanger chamber 27a. An example of the isolation valve 22 is a valve for atomic layer deposition (ALD valve), which enables high-precision flow rate measurement during a high-speed pulsation process used in applications of ALD / atomic layer etching (ALE).
[0013] The flow rate change rate measuring device 10 further includes a processor 30 and a memory 32 operably connected to the processor 30. The memory 32 stores a diagnostic application 40 executed by the processor 30. The processor 30 receives sensor data from the first pressure sensor 28, the second pressure sensor 29, the position sensor 18, and the position sensor 24. Further, the processor 30 transmits a drive signal to the actuator 20 of the position control valve 16 to open and close the position control valve 16, and transmits a drive signal to the actuator 26 of the isolation valve 22 to open and close the isolation valve 22.
[0014] In some embodiments, the processor 30 and the memory 32 may be physically integrated within the flow rate change rate measuring device 10. Alternatively, the processor 30 and / or the memory 32 may be included in a separate physical computing device configured to communicate with the components of the flow rate change rate measuring device 10 via wired and / or wireless signals. In some embodiments, the functions of the processor 30 and the memory 32 may be distributed among a plurality of communicatively connected computing devices including one or more client computing devices and / or one or more server computing devices.
[0015] FIG. 3 depicts a schematic diagram showing an example of a practical example of the flow rate change rate measuring device 10 for performing dynamic ROR measurement via the diagnostic application 40. In this example, the flow rate change rate measuring device 10 is installed directly downstream of the DUT 100 to perform dynamic ROR measurement. In this dynamic configuration, the gas source 36 flows gas in the downstream direction in the order of the mechanical pressure regulator (regulator) 34, the DUT 100, the flow rate change rate measuring device 10, and the pump 38. The gas flows into the DUT 100 at the inlet side of the DUT 100 and flows out of the DUT 100 at the outlet side of the DUT 100. Here, it will be understood that the inlet side and the outlet side of the DUT 100 are defined at fixed positions of the DUT 100. The mechanical pressure regulator 34 adjusts the pressure at the inlet side of the DUT 100, thereby ensuring that only a pressure increase (mass accumulation) in the chamber 27a occurs during the rate of change test. Further, the position control valve 16 adjusts the pressure at the outlet side of the DUT 100, thereby ensuring that only a pressure increase (mass accumulation) in the chamber 27a occurs during the rate of change test. As a result, the volume of the chamber 27a is mathematically isolated, so that when a new DUT 100 is calibrated or validated, it is not necessary to recalibrate the volume of the chamber 27a. In order to prevent mass accumulation upstream of the chamber 27a that may add an error to the flow rate calculation, the upstream pressure adjustment is performed precisely. This error is minimized by optimizing the mechanical pressure regulator 34 to minimize the volume between the DUT 100 and the mechanical pressure regulator 34.
[0016] As will be described in more detail below, in order to perform dynamic ROR measurement, the pressure set value of the flow rate change rate measuring device 10 is set and the pressure on the outlet side of the DUT 100 is controlled. The gas source 36 is opened and the inflow of gas into the flow path 14 is started. First, the isolation valve 22 is opened, then the mechanical pressure regulator 34 is opened, and the pressure on the inlet side of the DUT 100 is continuously adjusted. Then, the pressure measured by the first pressure sensor 28 (denoted as P0) and the pressure measured by the second pressure sensor 29 (denoted as P2) are continuously controlled so that the pressure at the first pressure sensor remains at the pressure set value until they reach a stable equilibrium state as the gas spreads throughout the flow path 14. After the gas reaches the equilibrium state, the isolation valve 22 is completely closed and pressurization of the chamber 27a is started. When the pressure in the chamber 27a rises after the isolation valve 22 is closed, the position control valve 16 is gradually opened and kept constant so that the pressure measured by the first pressure sensor 28 remains at the pressure set value, whereby the pressure on the outlet side of the DUT 100 is maintained. The position control valve 16 continues to control the pressure so as to stay at the pressure set value until it cannot maintain the pressure on the outlet side of the DUT 100 when it is fully opened.
[0017] FIG. 4 depicts a schematic diagram showing an example of a flow rate change rate measuring device 10 for performing dynamic ROF measurement. In this example, the flow rate change rate measuring device 10 is directly installed upstream of the DUT 100 to perform dynamic ROF measurement. In this dynamic configuration, the gas source 36 flows gas in the downstream direction in the order of the mechanical pressure regulator 34, the flow rate change rate measuring device 10, the DUT 100, and the pump 38. The gas flows into the DUT 100 at the inlet side of the DUT 100 and flows out of the DUT 100 at the outlet side of the DUT 100. Here, it will be understood that the inlet side and the outlet side are defined at fixed positions of the DUT 100, similar to the example for performing dynamic ROR measurement as shown in FIG. 3. The mechanical pressure regulator 34 maintains the pressure at the inlet side of the flow rate change rate measuring device 10 constant. Further, the position control valve 16 adjusts the pressure at the inlet side of the DUT 100, so that only a pressure drop in the chamber 27a occurs reliably during the change rate test. As a result, the volume of the chamber 27a is mathematically separated, so that it is not necessary to recalibrate the volume of the chamber 27a when a new DUT 100 is calibrated or validated.
[0018] As will be described in further detail below, in order to perform a dynamic ROF measurement, a pressure set value is set in the flow rate change rate measuring device 10, and the pressure on the inlet side of the DUT 100 is controlled. The gas source 36 is opened, and the inflow of gas into the flow path 14 is started. First, the isolation valve 22 is opened, and then the mechanical pressure regulator 34 is opened to continuously adjust the pressure on the inlet side of the DUT 100. Then, the pressure at the first pressure sensor is continuously controlled to stay at the pressure set value by controlling the position control valve 16 so that the pressure measurement value (displayed as P0) of the first pressure sensor 28 and the pressure set value (displayed as P1) of the second pressure sensor 29 reach a stable equilibrium state as the gas spreads throughout the flow path 14. After the gas reaches the equilibrium state, the isolation valve 22 is completely closed, and the pressure reduction into the chamber 27a is started. When the pressure in the chamber 27a decreases after the isolation valve 22 is closed, the position control valve 16 is gradually opened, and the pressure on the inlet side of the DUT 100 is maintained by constantly maintaining the pressure measurement value of the first pressure sensor 28 at the pressure set value. The position control valve 16 continues to control the pressure to stay at the pressure set value until it cannot maintain the pressure on the inlet side of the DUT 100 when it is fully opened.
[0019] In both the processes of the dynamic ROR measurement and the dynamic ROF measurement, the flow rate change rate measuring device 10 may automatically calculate the flow rate and record all the data from the first pressure sensor 28, the second pressure sensor 29, and the valve position sensor 18 of the position control valve 16. When the processes of the dynamic ROR measurement and the dynamic ROF measurement are repeated multiple times, a large amount of sensor data is collected, and a large-scale statistical analysis of the sensor data over multiple measurements may be performed.
[0020] Referring to FIG. 5, a method 200 for performing an ROR measurement on a DUT using a flow rate change rate measuring device will be described. The following description of the method 200 is provided with reference to the software and hardware components described and shown in FIGS. 1 - 3. It will be understood that the method 200 may also be performed in other situations using other suitable software and hardware components.
[0021] In step 202, the flow rate change rate measuring device is installed on the downstream side of the DUT. In step 204, a pressure set value is set for the position control valve. In step 206, the gas source is opened. In step 208, the isolation valve and the mechanical pressure regulator are opened to continuously adjust the pressure on the inlet side of the DUT. Then, the position control valve continuously controls so that the pressure value in the first pressure sensor remains at the above-mentioned pressure set value.
[0022] In step 210, it is determined whether the pressure measurement values of the first pressure sensor and the second pressure sensor are stable. If the pressure measurement values of the first pressure sensor and the second pressure sensor are stable (YES), method 200 proceeds to step 212. If the pressure measurement values of the first pressure sensor and the second pressure sensor are not stable (NO), method 200 returns to step 208, the mechanical pressure regulator continues to adjust the pressure on the inlet side of the DUT, the position control valve continues to control so that the pressure value in the first pressure sensor remains at the pressure set value, and the isolation valve remains open.
[0023] In step 212, when it is determined that the pressure measurement value is stable and has reached an equilibrium state, the isolation valve is completely closed, and the pressure in the chamber begins to rise or increase.
[0024] In steps 214, 216, 218, and 220, as the position control valve gradually opens and the pressure measurement value at the first pressure sensor is kept constant to stay at the pressure set value, the position data of the actuator of the position control valve is collected while the pressure on the outlet side of the DUT is maintained. In step 214, the volume of the chamber is calculated using the current valve position, and the current flow rate is calculated using the pressure difference (dp / dt) based on the time change of the pressure measurement value at the second pressure sensor. In step 228, the current flow rate may be output so as to be displayed on the display of the flow rate change rate measuring device and / or output to another computing device for downstream processing. In step 216, the difference between the pressure measurement value of the first pressure sensor and the pressure set value is determined. In step 220, it is determined whether the position control valve is fully open. If not (NO), method 200 proceeds to step 218. In step 218, the position control valve is opened to an extent corresponding to the determined difference between the pressure measurement value and the pressure set value at the first pressure sensor, and the pressure measurement value at the first pressure sensor is kept constant to stay at the pressure set value.
[0025] As a result, since the position control valve gradually opens and the pressure on the outlet side of the DUT (the pressure measurement value at the first pressure sensor) is continuously maintained, an increase or rise in the chamber pressure is allowed. This process continues until the position control valve is fully open or the position control valve can no longer maintain the pressure. In step 222, if it is determined that the position control valve is fully open or the position control valve can no longer maintain the pressure (YES), the isolation valve is opened.
[0026] In step 224, based on the volume of the chamber calculated based on the position data of the actuator of the collected position control valve, and from the time when the isolation valve is closed until the position control valve is fully opened or the position control valve can no longer maintain the pressure, based on the magnitude of the pressure increase detected in the chamber by the second pressure sensor, an averaged flow rate or a flow rate profile (time change of the flow rate) is calculated. In step 226, the averaged flow rate or the flow rate profile (time change of the flow rate) is output so as to be displayed on the display of the flow rate change rate measuring device, or output to another calculation device for downstream processing.
[0027] Referring to FIG. 6, a method 300 for performing ROF measurement on a DUT using a flow rate change rate measuring device will be described. The following description of method 300 is provided with reference to the software and hardware components described above and shown in FIGS. 1, 2, and 4. It will be understood that method 300 can also be executed in other situations using other suitable software and hardware components.
[0028] First, in step 302, a variable flow type flow rate measuring device is installed upstream of the DUT. In step 304, a pressure set value is set for the position control valve. In step 306, the gas source is opened. In step 308, the isolation valve and the position control valve are opened, and the pressure on the inlet side of the DUT is continuously adjusted. Then, the position control valve continuously controls the pressure value at the first pressure sensor to stay at the above-mentioned pressure set value.
[0029] In step 310, it is determined whether the pressure measurement values in the first pressure sensor and the second pressure sensor are stable. If the pressure measurement values of the first pressure sensor and the second pressure sensor are stable (YES), method 300 proceeds to step 312. If the pressure measurement values of the first pressure sensor and the second pressure sensor are not stable (NO), method 300 returns to step 308, the position control valve continues to adjust the pressure on the inlet side of the DUT, the position control valve continues to be controlled to keep the pressure in the first pressure sensor at the pressure set value, and the isolation valve remains open.
[0030] In step 312, when it is determined that the pressure measurement value is stable and has reached an equilibrium state, the isolation valve is fully closed, and the pressure in the chamber begins to decrease or drop.
[0031] In steps 314, 316, and 318, while gradually opening the position control valve and maintaining the inlet pressure of the DUT by keeping the pressure measurement value of the first pressure sensor at the pressure set value, the position data of the actuator of the position control valve is collected. In step 314, the volume of the chamber is calculated using the current valve position, and the current flow rate is calculated using the pressure difference (dp / dt) based on the time change of the pressure measurement value in the second pressure sensor. In step 328, the current flow rate may be output to be displayed on the display of the flow rate change rate measuring device or output to other computing devices. In step 316, the difference between the pressure measurement value of the first pressure sensor and the pressure set value is determined. In step 320, it is determined whether the position control valve is fully open. If it is not fully open (NO), method 300 proceeds to step 318. In step 318, the position control valve is opened to an extent corresponding to the difference between the pressure measurement value of the first pressure sensor and the pressure set value, and the pressure measurement value in the first pressure sensor is constantly maintained at the pressure set value.
[0032] As the position control valve gradually opens, the chamber pressure decreases or is reduced, and the pressure at the inlet side of the DUT (the pressure measurement value of the first pressure sensor) is continuously maintained. This process continues until the position control valve is fully open or the position control valve can no longer maintain the pressure at the inlet side of the DUT. In step 322, if it is determined that the position control valve is fully open or the position control valve cannot maintain the pressure (YES), the isolation valve is opened.
[0033] In step 324, based on the volume of the chamber calculated based on the position data of the actuator of the position control valve collected, and the pressure difference calculated based on the magnitude of the pressure drop in the chamber detected by the second pressure sensor from the time when the isolation valve is closed until the position control valve is fully open or the position control valve can no longer maintain the pressure, the averaged flow rate or flow profile (the time variation of the flow rate) is calculated. In step 326, the averaged flow rate or flow profile (the time variation of the flow rate, flow rate over time) is output and displayed on the display of the flow rate change rate measuring device, or output to other computing devices for downstream processing.
[0034] FIG. 7 shows a flowchart of data input provided to a diagnostic application that performs calculations based on an input, converts data, and outputs the result. As an input, the pressure difference calculation unit 42 of the diagnostic application 40 receives the first pressure data 28a from the first pressure sensor 28 and the second pressure data 29a from the second pressure sensor 29, and receives the position data 18a from the valve position sensor 18 of the position control valve by the volume calculation unit 44 of the diagnostic application 40. In this example showing the input from the ROR measurement, the position data 18a depicts a position control valve that gradually opens to stably maintain the pressure at the outlet side of the DUT, the first pressure data 28a depicts the pressure at the outlet side of the DUT that is constantly maintained at the pressure set value, and the second pressure data 29a depicts the chamber pressure that gradually increases after the isolation valve is closed.
[0035] The pressure difference calculation unit 42 calculates a pressure difference value 42a (dp / dt) based on the first pressure data 28a and the second pressure data 29a, and determines the magnitude of the pressure increase from the time when the isolation valve is opened until the position control valve is fully opened. The volume calculation unit 44 calculates a volume value 44a based on a function (V = f(Pos)) that describes the position data 18a of the position control valve.
[0036] The mass flow rate calculation unit 46 of the diagnostic application 40 receives the pressure difference value 42a and the volume value 44a as inputs, and based on this pressure difference value 42a and volume value 44a, calculates the mass flow rate using the formula dn / dt = (dP·V) / (dt·ZRT), and outputs a mass flow rate value 46a. The fluid flow rate calculation unit 48 receives the mass flow rate value 46a as an input, and based on this mass flow rate value 46a, divides the mass flow rate by the density of the mass of the fluid in the formula Q = (dn / dt) / ρ to calculate a fluid flow rate value 48a. Here, Q is the flow rate of the fluid, and ρ is the fluid density. Then, the fluid flow rate value 48a may be output so as to be displayed on the display of the flow rate change rate measuring device, or may be output to another computing device.
[0037] According to the present disclosure, even in a process for a pulse control system and even in the measurement of an extremely low flow rate, the device can be accurately calibrated and validated. By calculating the flow rate based on the change in pressure with respect to time change, the volume of the chamber is minimized. Furthermore, the change in the volume of the position control valve can be compensated, thereby enhancing the accuracy of the estimation of the chamber volume.
[0038] FIG. 8 schematically shows a non-limiting embodiment of a computing system 400 that can implement one or more of the processes described above. The computing system 400 is shown in a simplified form. The computing system 400 may embody the flow rate change rate measuring device 10 and / or the processor 30 and the memory 32 described and shown in FIG. 2. The computing system 400 may take the form of one or more personal computers, server computers, tablet computers, home entertainment computers, network computing devices, gaming devices, mobile computing devices, mobile communication devices (e.g., smartphones), and / or other computing devices, as well as wearable computing devices such as smart wristwatches and head-mounted augmented reality devices.
[0039] The computing system 400 includes a logical processor 402, a volatile memory 404, and a non-volatile storage device 406. The computing system 400 may optionally include a display subsystem 408, an input subsystem 410, a communication subsystem 412, and / or other components not shown in FIG. 8.
[0040] The logical processor 402 includes one or more physical devices configured to execute instructions. For example, the logical processor may be configured to execute instructions that are part of one or more applications, programs, routines, libraries, objects, components, data structures, or other logical constructs. Such instructions may be implemented to perform a task, implement a data type, transform the state of one or more components, achieve a technical effect, or obtain other desired results.
[0041] A logical processor may include one or more physical processors (hardware) configured to execute software instructions. Additionally or alternatively, a logical processor may include one or more hardware logic circuits or firmware devices configured to execute logic or firmware instructions implemented in hardware. The processor of the logical processor 402 may be single-core or multi-core, and the instructions executed thereon may be configured for sequential processing, parallel processing, and / or distributed processing. The individual components of the logical processor may be distributed across any two or more distinct devices, which may be located remotely and / or configured for coordinated processing. As another aspect, the logical processor may be virtualized and executed by a networked, cloud computing configuration of computing devices accessible from a remote location. In such a case, it will be understood that these virtualized aspects may be executed on different physical logical processors of different machines.
[0042] The non-volatile memory device 406 includes one or more physical devices configured to hold instructions executable by a logical processor for implementing the methods and processes described herein. When such methods and processes are implemented, the state of the non-volatile memory device 406 may be transformed, for example, to hold different data.
[0043] The non-volatile memory device 406 may include a removable and / or built-in physical device. The non-volatile memory device 406 may include optical memory (e.g., CD, DVD, HD-DVD, Blu-Ray Disc, etc.), semiconductor memory (e.g., ROM, EPROM, EEPROM, FLASH memory, etc.), and / or magnetic memory (e.g., hard disk drive, floppy disk drive, tape drive, MRAM, etc.), or other mass storage device technologies. The non-volatile memory device 406 may include non-volatile, dynamic, static, read / write, read-only, sequential access, location-addressable, file-addressable, and / or content-addressable devices. It will be understood that the non-volatile memory device 406 is configured to hold instructions even when power to the non-volatile memory device 406 is turned off.
[0044] The volatile memory 404 may include a physical device including random access memory. The volatile memory 404 is typically utilized by the logic processor 402 to temporarily store information during the processing of software instructions. It will be understood that the volatile memory 404 typically does not continue to store instructions when power to the volatile memory 404 is turned off.
[0045] One aspect of the logic processor 402, the volatile memory 404, and the non-volatile memory device 406 may be integrated together into one or more hardware-logic components. Such hardware-logic components may include, for example, FPGA (Field-Programmable Gate Array), PASIC / ASIC (Program- and Application-specific Integrated Circuit), PSSP / ASSP (Program- and Application-specific Standard Products), SOC (System-on-a-Chip), and CPLD (Complex Programmable Logic Device).
[0046] The terms "module", "program", and "engine" may be used to describe an aspect of a computing system 400 that is typically implemented in software by a processor to perform certain functions using a portion of volatile memory, and this function includes conversion processing that specially configures the processor to perform the function. Thus, a module, program, or engine may be instantiated via a logic processor 402 that uses a portion of volatile memory 404 and executes instructions held by a non-volatile storage device 406. It will be understood that different modules, programs, and / or engines may be instantiated from the same application, service, code block, object, library, routine, API, function, etc. Similarly, the same module, program, and / or engine may be instantiated by different applications, services, code blocks, objects, routines, APIs, functions, etc. The terms "module", "program", "engine" may include individual configurations or groups such as executable files, data files, libraries, drivers, scripts, database records, etc.
[0047] When a display subsystem 408 is included, the display subsystem 408 may be used to present a visual representation of data held by the non-volatile storage device 406. The visual representation may take the form of a graphical user interface (GUI). When the methods and processes described herein change the data held by the non-volatile storage device, thereby converting the state of the non-volatile storage device, the state of the display subsystem 408 may likewise be converted to visually represent the change in the underlying data. The display subsystem 408 may include one or more display devices that utilize virtually any type of technology. Such display devices may be combined with the logic processor 402, volatile memory 404, and / or non-volatile storage device 406 within a shared enclosure, or may be peripheral display devices.
[0048] When input subsystem 410 is included, input subsystem 410 may include or interface with one or more user input devices such as a keyboard, mouse, touch screen, or game controller. In some embodiments, the input subsystem may include or interface with a selected natural user input (NUI) component. Such components may be integrated or peripheral, and the transmission and / or processing of input actions may be performed on-board or off-board. By way of example, NUI components may be a microphone for voice and / or speech recognition, an infrared camera for machine vision and / or gesture recognition, a color camera, a stereoscopic camera, a depth camera, a head tracker for motion detection and / or intent recognition, an eye tracker, an accelerometer, a gyroscope, an electric field detection component for evaluating brain activity, and / or other suitable sensors.
[0049] When communication subsystem 412 is included, communication subsystem 412 may be configured to communicatively connect various computing devices and other devices described herein. Communication subsystem 412 may include wired and / or wireless communication devices compatible with one or more different communication protocols. By way of non-limiting example, the communication subsystem may be configured for communication via a wireless telephone network or a wired or wireless local or wide area network such as an HDMI over Wi-Fi connection. In some embodiments, the communication subsystem may enable the computing system 400 to send and / or receive messages to and from other devices via a network such as the Internet.
[0050] The configurations and / or approaches described in this specification are essentially exemplary, and many other variations are possible. It should be understood that these specific embodiments or examples should not be considered limiting. Also, the specific routines or methods described in this specification may represent one or more of any number of processing strategies. Therefore, the various acts illustrated and / or described may be performed in the order illustrated and / or described, in other orders, in parallel, or omitted. Similarly, the order of the above-described processing may be changed.
[0051] This disclosure includes all novel and non-obvious combinations and sub-combinations of the various features and techniques disclosed herein. The various features and techniques disclosed herein are not necessarily required in all embodiments of this disclosure. Further, the various features and techniques disclosed herein define patentable subject matter separate from the disclosed embodiments and may find utility in other implementations not explicitly disclosed herein.
[0052] As used herein, "and / or" means a logical disjunctive operation, and thus it should be understood that A and / or B has the following truth table. TIFF0007693438000001.tif41170
[0053] Terms such as "includes", "including", "has", "contains", etc. are used in this specification, and these terms are intended to be inclusive, similar to "comprises" as an open transitional term, without excluding additional elements or other elements.
Claims
1. A block body having a flow path, A chamber including a part of the flow path of the block body, A position control valve including an actuator, A valve position sensor configured to measure the valve position of the actuator of the position control valve, A first pressure sensor disposed on the primary side of the position control valve in the flow path and configured to detect a first pressure on the primary side of the flow path, A second pressure sensor disposed on the secondary side of the position control valve in the flow path and configured to detect a second pressure on the secondary side of the flow path adjacent to the chamber, A flow rate change rate measuring device including a processor, wherein the processor, Receives valve position data indicating the valve position of the actuator from the valve position sensor, Receives first pressure data from the first pressure sensor, Receives second pressure data from the second pressure sensor, When calibrating the device under test by opening the position control valve and reducing or increasing the pressure in the chamber while maintaining the first pressure at a pressure set value, the volume of the chamber is calculated using at least a part of the valve position data.
2. The flow rate change rate measuring device according to claim 1, wherein the valve position sensor is configured to detect a displacement amount of the actuator with a resolution of 3 nm or more and 10 nm or less.
3. The flow rate change rate measuring device according to claim 1, further comprising a heat exchanger including the chamber.
4. The flow rate change rate measuring device according to claim 3, wherein the heat exchanger is detachably mounted inside.
5. The chamber is included in a plate, The heat exchanger is connected to the plate, The flow rate change rate measuring device according to claim 3, wherein the plate is detachably attached to the body of the heat exchanger.
6. The flow rate change rate measuring device according to claim 1, further comprising an isolation valve configured to seal the chamber.
7. The flow rate change rate measuring device according to claim 6, wherein the isolation valve is an atomic layer deposition (ALD) valve.
8. The processor further calculates a pressure difference from the time when the isolation valve is closed to the time when the position control valve is fully opened based on the magnitude of the pressure increase or decrease detected in the chamber by the second pressure sensor, calculates a flow rate based on the calculated volume of the chamber and the pressure difference, and outputs the flow rate to a display. The flow rate change rate measuring device according to claim 6.
9. A rate of rise (ROR) measurement method using a flow rate change rate measuring device including a block body having a flow path, a chamber including a part of the flow path of the block body, a position control valve including an actuator, a valve position sensor configured to measure the valve position of the actuator of the position control valve, an isolation valve configured to seal the chamber, a first pressure sensor disposed on the primary side of the position control valve in the flow path and configured to detect a first pressure on the primary side of the flow path, and a second pressure sensor disposed on the secondary side of the position control valve in the flow path and configured to detect a second pressure on the secondary side of the flow path adjacent to the chamber, the method comprising: installing the flow rate change rate measuring device downstream of the device under test (DUT) such that the DUT is located on the primary side of the flow path; setting a pressure set value for the position control valve; opening the isolation valve and controlling the position control valve to control the pressure at the first pressure sensor to remain at the pressure set value; When the pressure measurement values of the first pressure sensor and the second pressure sensor become stable, closing the isolation valve; Gradually opening the position control valve until it is fully open so that the pressure measurement value of the first pressure sensor is maintained constant, and collecting the position data of the actuator of the position control valve during that time; Calculating the volume of the chamber based on the position data of the actuator of the position control valve; Calculating a pressure difference based on the pressure measurement values from the time the isolation valve is closed until the position control valve is fully open; Calculating a flow rate based on the calculated volume of the chamber and the pressure difference; An increase rate measurement method including outputting the flow rate for post-processing by a display or a computing device.
10. The method according to claim 9, wherein a mechanical pressure regulator is provided between the gas source and the DUT.
11. The method according to claim 10, wherein the mechanical pressure regulator is opened to continuously control the pressure on the inlet side of the DUT.
12. The method according to claim 9, wherein the position data of the actuator is collected with a resolution of 3 nm or more and 10 nm or less.
13. The method according to claim 9, further including selecting the chamber optimized for the DUT and attaching it to the flow rate change rate measuring device.
14. A block body having a flow path, a chamber including a part of the flow path of the block body, a position control valve including an actuator, a valve position sensor configured to measure the valve position of the actuator of the position control valve, an isolation valve configured to seal the chamber, a first pressure sensor disposed on the primary side of the position control valve in the flow path and configured to detect a first pressure on the primary side of the flow path, and a second pressure sensor disposed on the secondary side of the position control valve in the flow path and configured to detect a second pressure on the secondary side of the flow path adjacent to the chamber, and a method for measuring a descent rate using a flow rate change rate measuring device, comprising: Installing the flow rate change rate measuring device upstream of the DUT such that the device under test (DUT) is located on the primary side of the flow path; Setting a pressure set value for the position control valve; Opening the isolation valve; Closing the isolation valve when the pressure measurement values of the first pressure sensor and the second pressure sensor are stable; Gradually opening the position control valve until it is fully open while maintaining the pressure measurement value of the first pressure sensor constant, and collecting position data of the actuator of the position control valve during that time; Calculating the volume of the chamber based on the position data of the actuator of the position control valve; Calculating a pressure difference based on the pressure measurement values from the time the isolation valve is closed until the position control valve is fully open; Calculating a flow rate based on the calculated volume of the chamber and the pressure difference; Outputting the flow rate for post-processing by a display or a computing device. A method for measuring a descent rate.
15. The method according to claim 14, wherein a mechanical pressure regulator is provided between the gas source and the flow rate change rate measuring device.
16. The method according to claim 15, wherein the mechanical pressure regulator is opened to continuously control the pressure at the inlet side of the DUT.
17. The method according to claim 14, wherein the position data of the actuator is collected with a resolution of 3 nm or more and 10 nm or less.
18. The method according to claim 14, further comprising the step of selecting the chamber optimized for the DUT and attaching it to the flow rate change rate measuring device.
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