Apparatus, system, and method for curing ink printed on a substrate

Abstract

An apparatus (100) is provided that includes a light-sealable housing (105) for curing a photocurable ink printed on a substrate (10) having light-emitting diodes (LEDs). The apparatus includes a substrate support (130), an interface (110) for providing power to the LEDs, and a transport device (120) configured to change the relative position of the interface and the substrate support (130). The transport device (120) is configured to bring the interface (110) into contact with the substrate (10) to provide power to the LEDs to illuminate them and cure the photocurable ink.

Description

Technical Field

[0001]

[0001] The present disclosure relates to the field of display manufacturing, and more particularly, to the field of providing substrates for display applications. More specifically, the present disclosure relates to an apparatus and method for curing a curable substance on a substrate.

Background Art

[0002]

[0002] In display manufacturing, several techniques are known for providing displays with improved resolution and contrast characteristics, and many approaches have been developed. LCDs (Liquid Crystal Displays) use the light modulation properties of liquid crystals to generate color or monochrome images by affecting the light supplied from a backlight source or reflector, while the techniques for OLED (Organic Light Emitting Diode) displays provide organic materials that directly emit visible light in response to electricity.

[0003]

[0003] OLED displays are known to have beneficial effects that are in contrast to LCDs. For example, they can provide thinner and lighter displays, and OLED displays achieve deeper black levels and higher contrast ratios. Also, because they are flexible and transparent, OLED displays can be used in multiple applications such as screens, televisions, smartphones, etc.

[0004]

[0004] The fabrication of OLED substrates is typically carried out by coating an organic material on a substrate, and the organic material provides the primary colors red, blue, and green, which are the primary colors for generating pixels on the substrate. The coating process may be based on, for example, the evaporation of organic materials such as host materials and dopant materials deposited on the substrate to provide pixels of different colors on the substrate.

[0005] In contrast to OLED technology, micro light-emitting diodes (micro LEDs) can provide tiny pixels on a substrate. Micro LEDs are made of inorganic materials provided as a semiconductor array, such as indium gallium nitride (InGaN), and can emit light by themselves in response to power. Micro LED technology can be beneficial for display manufacturing compared to OLED technology, for example, in terms of the resulting display's lifespan, brightness, and contrast. So far, the manufacture of micro LED arrays suitable for display manufacturing has been expensive and inefficient. Furthermore, it has been difficult to provide colored pixels.

[0006] In view of the above, it is beneficial to provide improved devices, systems, and methods for micro LED and display manufacturing. SUMMARY OF THE INVENTION

[0007] According to the present disclosure, there is provided an apparatus including a light-sealable housing for curing a photocurable ink printed on a substrate having light-emitting diodes (LEDs). The apparatus includes a substrate support, an interface for supplying power to the LEDs, and a transfer device. The transfer device is configured to change the relative position between the interface and the substrate support. The transfer device is configured to bring the interface into contact with the substrate to supply power to the LEDs to light them and cure the photocurable ink.

[0008] According to one aspect, there is provided a system for processing a substrate having light-emitting diodes (LEDs). The system includes a printing section for providing a photocurable ink to the substrate and an apparatus according to an embodiment described herein.

[0009]

[0009] According to a further aspect, a method for curing a photocurable ink on a substrate having a light-emitting diode (LED) is provided. The method includes providing an interface for supplying power to the LED, providing a substrate having the LED, contacting the interface with the LED, supplying a cooling gas for stabilizing the temperature, supplying power to the interface to turn on the LED, and curing the photocurable ink on the substrate.

[0010]

[0010] Embodiments also relate to an apparatus for carrying out the disclosed methods and include apparatus components for performing the aspects of each of the described methods. These method aspects may be implemented by hardware components, a computer programmed by appropriate software, any combination of the two, or any other means. Further, embodiments according to the present disclosure also relate to a method of operating the described apparatus. The method includes method aspects for performing all functions of the apparatus.

[0011]

[0011] To enable a more detailed understanding of the features of the present disclosure described above, the present disclosure summarized above will be described in more detail with reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0013]

[0012] Here, various embodiments of the present disclosure will be referred to in detail, and one or more examples thereof will be shown in the figures. In the following description of the drawings, the same reference numerals refer to the same components. Usually, only the differences regarding individual embodiments are described. Each example is provided for the purpose of explaining the present disclosure and does not limit the present disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in combination with other embodiments to create further embodiments. This specification includes such modifications and variations.

[0014]

[0013] In the following description of the drawings, the same reference numerals refer to the same or similar components. Usually, only the differences regarding individual embodiments are described. Unless otherwise specified, the description of a part or aspect in one embodiment is also applicable to the corresponding part or aspect in other embodiments.

[0015]

[0014] The photocurable ink can be used for a wide range of applications and can be particularly beneficial in the manufacture of displays, especially displays having light-emitting diodes (LEDs) for providing pixels that can be individually lit across the entire display. For example, micro LEDs, also known as μ-LEDs, MLEDs, and / or mLEDs, i.e., tiny single LEDs, can be beneficial for the manufacture of displays having high contrast, fast response times, improved color reproducibility and energy efficiency, and improved lifespan compared to other display techniques such as LCDs (liquid crystal displays) or OLEDs (organic light-emitting diodes).

[0016]

[0015] In the resulting display, each pixel represents one micro-LED that provides a primary color, namely red, green or blue, and each pixel can be selectively controlled to generate a target color representation, i.e., a combination of lit pixels that generates an image. To create the pixels, a photocurable ink can be used. That is, for example, the ink can be provided by printing the ink on a substrate having micro-LEDs, and then the ink can be fixed thereon. Thus, each pixel can be created by using different colored inks provided on the substrate and the micro-LEDs.

[0017]

[0016] It can be combined with any of the other embodiments described herein, and according to the embodiment illustratively shown in FIG. 1, an apparatus 100 for curing a photocurable ink printed on a substrate 10 having light-emitting diodes (LEDs) is provided. The apparatus includes a light-sealable housing 105. The apparatus further includes an interface 110 for supplying power to the LEDs. The apparatus further includes a substrate support 130 and a transfer device 120 for changing the relative position between the interface and the substrate support 130. The transfer device is configured to bring the interface 110 into contact with the substrate 10 in order to supply power for lighting the LEDs to the LEDs to cure the photocurable ink.

[0018] According to an embodiment that can be combined with any other embodiment described herein, the light-sealable housing 105 may include two side walls, namely a first side wall 108 and a second side wall 109, where the second side wall 109 faces the first side wall or vice versa, and may include a top wall 106 and a bottom wall 107. The light-sealable housing 105 may have an interface, a transfer device, a substrate support, and may be in contact with the substrate at the boundary when the substrate is loaded into the device. The light-sealable housing may include an inner wall, specifically two inner side walls, an inner top wall, and an inner bottom wall. The inner wall may be colored, specifically, the inner wall may be colored in achromatic colors, specifically black (hex triplet: #000000; sRGB: (0,0,0) CMYK: (0,0,0,100)), that is, the light-sealable housing may include a black inner wall to absorb radiant light and avoid, i.e., absorb, stray radiant light generated, for example, by turning on an LED. In other words, the inner wall of the device may be configured to prevent the light emitted from the LED from reflecting when it hits the inner wall. It should be understood that the wall may include a dark color, i.e., a color slightly deviating from black, for example, a dark gray or other color that contains little or no light-reflecting ability.

[0019] Advantageously, the stray radiant light of the LED can be avoided and / or prevented. Accordingly, unspecified curing can be avoided or reduced. Accordingly, the curing efficiency can be improved, and a higher yield can be achieved.

[0020] According to an embodiment that can be combined with any other embodiment described herein, the apparatus may further include an attachment area 140 for providing support to the interface 110 and / or the transfer device 120. Specifically, the transfer device 120 and / or the substrate support 130 may be provided in the attachment area 140, and the interface 110 may be connected to the transfer device 120 and / or the substrate support 130. The transfer device 120 may be configured to bring the interface into contact with the substrate. For example, the transfer device may be configured to bring the interface into contact with the substrate, thereby supplying power for lighting the LED to cure the photocurable ink. The transfer device can move the interface and / or the substrate support. For example, the transfer device can move the interface up and down, that is, in a direction towards the upper wall of the device and / or in a direction towards the bottom wall of the device. In other words, the transfer device can translate the interface and / or the substrate in the vertical direction (along the distance in the y direction as shown in FIG. 1). Additionally or alternatively, the transfer device can move the interface and / or the substrate support horizontally to align the interface with the substrate. Therefore, as shown in FIG. 1, the transfer device can move the interface along the distance in the z direction.

[0021]

[0020] As used herein, the terms “vertical” or “horizontal” can include orientations that include a slight deviation from exact verticality or horizontality. For example, compared to the exact vertical or horizontal direction, an angle of up to 10° or 15° may exist.

[0022]

[0021] Additionally or alternatively, the transfer device may be configured to move the substrate support 130. The transfer device can move the substrate support to align the interface with the substrate. The interface may be stationary. The transfer device may be configured to move the substrate support in the vertical and / or horizontal directions to align the substrate with the interface.

[0023] According to an embodiment that can be combined with any other embodiment described herein, the interface is configured to supply power to the LEDs on the substrate. The interface can be connected to a power source. The interface can include a conductive structure connected to the substrate, specifically, a conductive structure connected to the LEDs on the substrate to supply power to the LEDs. For example, the interface can include a plate kit including a probe card for contacting the LEDs. The dimensions of the interface can correspond to the dimensions of the substrate. Alternatively, the dimensions of the interface may exceed the dimensions of the substrate. The power supplied to the LEDs can include a voltage limited to ≤5V and / or a current in the range of 10 to 100 mA in constant current mode.

[0024] According to an embodiment that can be combined with any other embodiment described herein, the apparatus can include a first slide opening / closing mechanism 152 and / or a second slide opening / closing mechanism 158. The first slide opening / closing mechanism 152 and the second slide opening / closing mechanism 158 can each include a first track 151, 157 and a second track 153, 159. The first slide opening / closing mechanism 152 and the second slide opening / closing mechanism 158 can be arranged on the first side wall 108 and the second side wall 109 of the apparatus. Specifically, the first track 151, 157 and the second track 153, 159 can be arranged on the first side wall 108 and the second side wall 109 of the apparatus. Specifically, the first track 151, 157 can be arranged on the first side wall 108, and the second track 153, 159 can be arranged on the second side wall 109 opposite to the first side wall, or vice versa.

[0025]

[0024] It can be combined with any other embodiment described herein. According to the embodiment illustratively shown in FIG. 2, the device may include a temperature control element for adjusting the temperature inside the device. Cooling, particularly active cooling, may be provided inside the device. The temperature control element may include a cooling plate and / or a cooling gas conduit. For example, the cooling gas may be supplied to the device 100 through the cooling gas conduit. The cooling gas conduit and / or the light-sealable housing 105 may include a gas inlet 206 for supplying the cooling gas to the device. Specifically, the cooling gas may be an inert gas, such as nitrogen (N2). The cooling gas conduit and / or the light-sealable housing may further include a gas outlet 207 for removing the cooling gas from the device. Therefore, the cooling gas can circulate inside the device. For example, fresh cooling gas can be continuously supplied to the device through the gas inlet, and the gas from the device can be continuously removed through the gas outlet. The gas inlet and the gas outlet may be arranged on the back side of the device.

[0026]

[0025] According to an embodiment that can be combined with any other embodiment described herein, a shower head can be provided inside the device. The shower head is connected to the gas inlet 206 and can supply the cooling gas into the device. The shower head can evenly distribute the cooling gas inside the device. For example, the shower head may include one or more openings, specifically one or more nozzles, for distributing the cooling gas inside the device.

[0027]

[0026] According to an embodiment that can be combined with any other embodiment described herein, the device may include a cooling plate for adjusting the temperature inside the device. The cooling plate may be configured to provide a temperature to the device. For example, the cooling plate may include a conduit for providing a cooling gas or a cooling fluid for cooling the cooling plate and thus the device, i.e., inside the device.

[0028] According to an embodiment that can be combined with any other embodiment described herein, a constant temperature can be provided inside the apparatus 100. The apparatus may include temperature control. The temperature control can control the temperature of the cooling plate and / or the cooling gas conduit, i.e., the temperature of the cooling gas supplied to the cooling gas conduit, the flow rate of the cooling gas, and / or the amount of the apparatus, i.e., the cooling gas supplied to the cooling gas conduit. Specifically, a constant temperature can be provided by supplying a cooling gas. For example, the constant temperature may be in the range of 15°C to 40°C, specifically in the range of 20°C to 35°C, and more specifically in the range of 25°C to 30°C. Advantageously, temperature changes can be minimized, the curing conditions can be made more uniform, and overheating of the components provided in the apparatus can be avoided or prevented.

[0029] According to an embodiment that can be combined with any other embodiment described herein, the cooling gas may provide an inert atmosphere, i.e., an inert gas atmosphere inside the apparatus. The cooling gas may be an inert gas. Advantageously, the apparatus can maintain an inert atmosphere, i.e., an inert gas atmosphere inside the apparatus, during the curing of the photocurable ink provided on the substrate. Therefore, the generation of by-products, such as free radicals that contaminate or adversely affect the curing process, can be prevented and / or avoided. Further, a stable and controlled temperature can be provided inside the apparatus to further stabilize the curing process.

[0030] According to an embodiment that can be combined with any other embodiment described herein, the apparatus can be evacuated. The apparatus 100, i.e., the light-sealable housing 105, may include a vacuum supply system including a vacuum pump for establishing the vacuum condition of the apparatus. For example, the light-sealable housing 105 may include a first port 208 and a second port 209 for supplying vacuum to the apparatus. The first port and the second port may be arranged on the back side of the apparatus.

[0031] According to an embodiment that can be combined with any other embodiment described herein, the first slide opening / closing mechanism and / or the second slide opening / closing mechanism may include an actuator 232, such as a motor, for operating the first and second opening / closing mechanisms. The actuator 232 may be disposed on the back side of the device 100. The actuator may drive the first slide opening / closing mechanism and / or the second slide opening / closing mechanism. The first slide opening / closing mechanism and the second slide opening / closing mechanism may be driven independently.

[0032] According to an embodiment that can be combined with any other embodiment described herein and referring back to the embodiment of FIG. 1, the present device includes a transfer device. The transfer device may be selected from the group consisting of a piston and a short-stroke cylinder. Specifically, the short-stroke cylinder may be a pneumatic short-stroke cylinder. The transfer device may be driven by a machine, hydraulics, pneumatics, electricity, and / or a combination thereof. The present device may include a supply port 224, such as a pneumatic supply port, for enabling the movement of the transfer device, i.e., for enabling the movement of the pneumatic short-stroke cylinder. The supply port 224 can enable the supply of energy to the transfer device so that the transfer device can move and change the relative position between the interface and the substrate support. The transfer device may be connected to the interface and / or the substrate support within the device. For example, particularly when the transfer device is pneumatically driven, such as when the transfer device is a pneumatic short-stroke cylinder, compressed air may be supplied to the transfer device through the supply port 224 so that the transfer device can move, and as a result, the relative position between the interface and the substrate support can be changed.

[0033] According to an embodiment that can be combined with any other embodiment described herein, the transfer device may be a pneumatic short-stroke cylinder. For example, the pneumatic short-stroke cylinder may provide a 5 mm stroke to move the interface towards the substrate, particularly into contact with the LEDs on the substrate, when compressed air is applied.

[0034]

[0033] According to an embodiment that can be combined with any other embodiment described herein, and referring illustratively to the embodiment of FIG. 3, the apparatus may include a first chamber 312 and a second chamber 314. In FIG. 3, the first chamber and the second chamber are depicted by dashed lines. The chambers may only extend up to the first side wall, the second side wall, and the upper wall or the bottom wall of the light-sealable housing 105, but it should be understood that for clarity of illustration, the dashed lines in FIG. 3 extend beyond the light-sealable housing. The term "chamber" as used herein may be understood as an open compartment, i.e., a defined space that is not completely enclosed, for example by walls, in order to allow fluid connection between the various chambers. In particular, the chamber, i.e., the open compartment, may not have a bottom wall or an upper wall in order to allow interaction of the components arranged therein, particularly the vertical movement of the components arranged therein.

[0035]

[0034] According to an embodiment that can be combined with any other embodiment described herein, the transfer device 120, the interface 110, and the first slide opening and closing mechanism 152 may be arranged in the first chamber 312. The substrate support 130 and the second slide opening and closing mechanism 158 may be arranged in the second chamber 314. The first chamber may be arranged above the second chamber or vice versa.

[0036] According to an embodiment that can be combined with any other embodiment described herein, the substrate support 130 may be a support plate for supporting the substrate, particularly a support plate made of alumina. Additionally, or alternatively, the substrate support may be a gripping device, such as a gripper, for holding and / or transferring the substrate. The substrate includes one or more LEDs, particularly micro-LEDs, and a photocurable ink printed thereon. For example, the photocurable ink can be provided in a pattern on the substrate. For example, the photocurable ink can be printed on the substrate to provide colored pixels on the substrate. Different colors of photocurable ink can be provided on the substrate, particularly photocurable ink including red, green, and / or blue. Additionally, or alternatively, "white" sub-pixel positions can be provided. The term "white sub-pixel position" should be understood as a position on the substrate where there is no ink. This position can be used for reprocessing, for example, in the case of defects in the LEDs and / or other problems where defects occur in the ink layer on the substrate. According to an embodiment, one sub-pixel position can be provided for each pixel. The photocurable ink may be a quantum dot-based ink and / or a UV-curable ink, i.e., an ink curable at wavelengths in the UV light spectrum. The LED may be configured to supply light with a wavelength from 200 nm to 450 nm to the substrate to cure the photocurable ink. According to an embodiment, the photocurable ink may be a quantum dot ink.

[0037] According to an embodiment that can be combined with any other embodiment described herein, the substrate support 130 may include one or more holding arrangements for holding the substrate in the substrate support. The holding arrangements may include mechanical arrangements, magnetic arrangements, pressure arrangements, or combinations thereof for holding the substrate in the substrate support. The substrate may include fitting elements, such as magnets, hooks, etc., for contacting the holding arrangements of the substrate support.

[0038] According to an embodiment that can be combined with any other embodiment described herein, the substrate may have dimensions in the range of 500 mm × 200 mm, specifically in the range of 400 mm × 220 mm, and more specifically in the range of 320 mm × 240 mm. The substrate may include a thickness from 2 mm to 0.1 mm, specifically from 1 mm to 0.3 mm, and more specifically 0.5 mm. The substrate may include a glass substrate. The substrate may further include a polymer material. The substrate may be made of a polymer material. The substrate may include a flexible polymer material or may be made of a flexible polymer material. It should be understood that the present apparatus may be configured to process substrates of different sizes and / or thicknesses and / or made of different materials.

[0039] According to an embodiment that can be combined with any other embodiment described herein, the interface may contact the substrate, that is, the interface may contact the LEDs on the substrate. As can be exemplarily seen in FIG. 3, the transfer device can change or vary the relative positions of the interface and the substrate support, and / or can provide translational movement to the interface and / or the substrate support. Specifically, the position of the interface can be lowered and / or the position of the substrate support can be raised so as to contact the substrate placed on the substrate support below the interface. It should be understood that the interface and the substrate support may be arranged in reverse, that is, the substrate support may be arranged above the interface.

[0040] According to an embodiment that can be combined with any other embodiment described herein, the interface may include a probe card. The interface or the probe card may include one or more pins for connecting the interface or the probe card to the substrate, that is, to the LEDs on the substrate, in order to supply power to the LEDs. Thus, the LEDs can be lit. The LEDs may be configured to cure a photocurable ink printed on the substrate. Accordingly, self-curing LEDs can be obtained.

[0041] According to an embodiment that can be combined with any other embodiment described herein, the LED may include an electrically contactable element for receiving power to light the LED. The LED may be interconnected with one or more electrically contactable elements. One or more pins may be in electrical contact with one or more electrically contactable elements of the LED. In this way, the LED is lit to supply wavelengths within the UV wavelength spectrum to cure a photocurable ink, such as a UV curable ink, on the substrate.

[0042] According to an embodiment that can be combined with any other embodiment described herein, the interface and the substrate support may be integrally formed or may be connected. The substrate support may include the interface or vice versa. For example, the substrate support may include one or more substrate support pins for contacting the LED and supplying power to the LED. One or more substrate support pins may contact the electrically contactable elements of the LED. Further, one or more substrate support pins may contact one or more electrically contactable elements interconnected with the LED. Further, a further interface may be provided. The further interface can improve the electrical contact between the substrate support pins and the LED, i.e., the electrically contactable elements of the LED.

[0043] Advantageously, by supplying power to the LED, the LED can initiate the curing of the photocurable ink. The photocurable ink may include a photoinitiator that enables curing when excited by light of a determined wavelength. When power is supplied to the LED, the polymerization reaction of the photoinitiator may be initiated. More advantageously, by supplying power to the LED, the function of the LED can be checked, i.e., a functional test of the LED can be performed. Thus, the device can be used simultaneously for both curing the photocurable ink on the substrate and checking the function of the LED.

[0044]

[0043] Advantageously, the apparatus according to any of the embodiments described herein provides efficient curing of the photocurable ink. The apparatus can be used for various applications and can achieve energy savings, accurate and precise curing, and a high curing speed. By using LEDs present on the substrate to supply a specific wavelength for curing, a "self-curing type" LED can be obtained.

[0045]

[0044] According to an embodiment that can be combined with any of the other embodiments described herein, the LED can be provided on the surface of the substrate. The photocurable ink can be provided on the surface of the LED. Thus, the photocurable ink can be a printed layer above the layer providing the LED. The electrically contactable element can be contactable from the surface of the substrate and / or the surface facing the surface, i.e., the bottom surface of the substrate.

[0046]

[0045] According to an embodiment that can be combined with any of the other embodiments described herein, the apparatus can further include a controller. The controller can be configured to control the wavelength supplied by the LED. For example, the controller can be configured to control the power supplied to the LED. Additionally, or alternatively, the controller can be configured to selectively adjust the lighting of the LED. Thus, a single LED can be turned on and / or off. Further, the controller can be configured to adjust the temperature within the apparatus. The controller can include temperature control for controlling a temperature control element. For example, the controller can adjust the temperature of a cooling plate and / or the cooling gas supplied to the apparatus. Additionally, or alternatively, the controller can adjust the flow rate and / or amount of the cooling gas supplied.

[0047]

[0046] It can be combined with any other embodiment described in this specification. According to the embodiment exemplarily shown in FIGS. 4A and 4B, the first slide opening / closing mechanism and the second slide opening / closing mechanism can be configured to open and close the first chamber 312 and the second chamber 314 respectively. For example, the interface 110 can be connected to the first slide opening / closing mechanism, the substrate support 130 can be connected to the second slide opening / closing mechanism, and the interface and / or the substrate support can be moved from inside the device to the space around the device respectively. In particular, the first opening / closing mechanism and the second opening / closing mechanism can open and close the first chamber and / or the second chamber in a manner similar to pulling out.

[0048]

[0047] It can be combined with any other embodiment described in this specification. According to the embodiment exemplarily shown in FIG. 4A, the first slide opening / closing mechanism 152 can include a first track (not shown) and a second track 153 where an interface can be provided and / or an interface can be fixed. Specifically, the interface can be fixed to the first track and the second track 153 on the first side surface and the second side surface of the interface facing the first side wall and the second side wall of the device 100. The interface can include corresponding engagement structures mounted on the first track and / or the second track to enable the sliding movement of the interface and / or to open and close the first chamber 312.

[0049]

[0048] As an advantage, the maintenance of the device becomes easier. For example, the interface, that is, the probe card, and / or the transfer device can be easily replaced or maintained in place by simply opening the first chamber and replacing or maintaining the interface and / or the transfer device.

[0050]

[0049] It can be combined with any other embodiment described in this specification. According to the embodiment illustratively shown in FIG. 4B, the second slide opening and closing mechanism 158 may include a first track (not shown) and a second track 159 on which the substrate support 130 can be provided and / or to which the substrate support 130 can be fixed. Specifically, the substrate support can be fixed to the first track and the second track 159 on the first side surface and the second side surface of the substrate support facing the first side wall and the second side wall of the apparatus 100. The substrate support may include corresponding engagement structures mounted on the first track and / or the second track to enable sliding movement of the substrate support and / or to open and close the second chamber 314.

[0051]

[0050] According to an embodiment that can be combined with any other embodiment described in this specification, the first slide opening and closing mechanism and the second slide opening and closing mechanism can be driven by the actuator 232. The actuator can act on a pushing device connected to the interface and / or the substrate support, such as a piston or a bar, to push and / or pull the interface and / or the substrate support in order to open and close the first chamber and / or the second chamber, as illustratively shown in FIG. 4B.

[0052]

[0051] As an advantage, the replacement of the substrate, that is, the loading of the substrate containing the photocurable ink to be cured and / or the unloading of the substrate containing the cured photocurable ink can be facilitated. Therefore, the cycle time of the apparatus, that is, the time during which a certain number of substrates are processed, that is, cured, can be shortened. As a further advantage, a fragile substrate such as a glass substrate can be easily handled, and the yield can be improved.

[0053] According to an embodiment that can be combined with any other embodiment described herein, a system 500 for processing a substrate having a light-emitting diode (LED) is provided. The system 500 may include a printing section 560 for providing a photocurable ink to the substrate and an apparatus according to any of the embodiments described herein. The printing section 560 may include an inkjet printer for providing a photocurable ink to the substrate. The printing section 560 may be configured to provide different colors of photocurable ink to the substrate. The printing section may include one or more nozzles for providing the photocurable ink to the substrate.

[0054] According to an embodiment that can be combined with any other embodiment described herein, the system 500 may include a transport device 562, specifically a robotic arm, for transporting the substrate from the printing section to the apparatus 100 in order to cure the photocurable ink printed on the substrate. The transport device may be configured to load the substrate into the apparatus and / or unload the substrate from the apparatus. Specifically, the transport device 562 can load a substrate including the photocurable ink to be cured onto the substrate support, and / or unload a substrate including the cured photocurable ink, i.e., a processed substrate.

[0055] According to an embodiment that can be combined with any other embodiment described herein, the transport device may include a gripper for releasing the first slide opening / closing mechanism and / or the second slide opening / closing mechanism. For example, the gripper can pull the substrate support 130, thereby opening the second chamber, enabling the transport device to transport the substrate printed with the photocurable ink from the printing section to the apparatus, i.e., the transport device can insert the printed substrate into the second chamber and load the substrate onto the substrate support. The transport device may further be configured to close the apparatus or the first chamber and / or the second chamber, i.e., to push the substrate support 130 into the apparatus 100 when the substrate is loaded and / or unloaded.

[0056]

[0055] According to an embodiment that can be combined with any other embodiment described herein, the printing section may be configured to provide two or more, specifically three or more, and more specifically four or more different color photocurable inks to the substrate. Specifically, the printing section may discharge the photocurable ink onto the surface of the substrate. For example, the photocurable ink may be provided in a specific pattern on the substrate.

[0057]

[0056] According to an embodiment that can be combined with any other embodiment described herein, the system may include a plurality of devices for curing the photocurable ink printed on the substrate. Specifically, the system may include five or more devices for curing the photocurable ink printed on the substrate, and more specifically, the system may include ten or more devices for curing the photocurable ink printed on the substrate. The plurality of devices for curing the photocurable ink printed on the substrate may be arranged in parallel and / or in a staggered manner. For example, the plurality of devices may be arranged one above the other. Therefore, the cycle time can be improved. For example, the cycle time achieved by a system in which ten devices for curing the photocurable ink printed on the substrate are connected in parallel may be 4 seconds or more.

[0058]

[0057] According to an embodiment that can be combined with any other embodiment described herein, the device may be provided as a cassette, particularly a compact cassette, to facilitate the handling of the curing device and to facilitate the replacement or maintenance of the devices within the system.

[0059] According to an embodiment that can be combined with any of the other embodiments described herein, a method 600 for curing a photocurable ink on a substrate having a light-emitting diode (LED) is provided. The method includes providing an interface for supplying power to the LED (exemplarily shown by box 670 in FIG. 6). The interface can be configured according to the embodiments described herein. Specifically, the interface can be connected to a power source. The interface can be provided in a first chamber. The first chamber can be accessible by a first slide opening and closing mechanism, i.e., the first chamber can be openable and closable, for example, by a first slide opening and closing mechanism.

[0060] According to an embodiment that can be combined with any of the other embodiments described herein, the method includes providing a substrate having an LED (exemplarily shown by box 672 in FIG. 6). Providing the substrate can include transporting the substrate from a printing section to a device for curing the photocurable ink according to any of the embodiments described herein. The substrate can be provided by a transport device. For example, the substrate can be loaded and / or unloaded into the device. The substrate can be provided on a substrate support. The substrate support can be provided in a second chamber. The second chamber can be accessible by a second slide opening and closing mechanism, i.e., the second chamber can be openable and closable, for example, by a second slide opening and closing mechanism.

[0061] According to an embodiment that can be combined with any of the other embodiments described herein, the method includes bringing the interface into contact with the LED (exemplarily shown by box 674 in FIG. 6). The interface can be translated vertically so as to contact the LED on the substrate. For example, the interface can be moved towards the substrate by a translational movement in the same direction as the direction in which gravity acts on the interface, and can be moved away from the substrate by a translational movement in the direction opposite to gravity.

[0062]

[0061] According to an embodiment that can be combined with any other embodiment described herein, the method includes supplying a cooling gas for stabilizing the temperature (exemplarily shown by box 676 in FIG. 6). Specifically, the temperature inside the apparatus for curing the photocurable ink can be stabilized. The cooling gas can be supplied according to the embodiments described herein. Specifically, the cooling gas can circulate inside the apparatus to provide a constant temperature to the apparatus.

[0063]

[0062] According to an embodiment that can be combined with any other embodiment described herein, the method includes supplying power for lighting the LED to the interface (exemplarily shown by box 678 in FIG. 6). The power can be supplied via the interface. The interface can be brought into contact with the substrate, specifically the LED on the substrate. The interface is connected to a power source and can transfer energy to the LED to light it. In other words, by supplying energy or power to the interface and bringing the interface into contact with the LED, a specific wavelength can be supplied by the LED to cure the photocurable ink. For example, the interface is supplied with DC (direct current) limited to less than 100 mA in constant current mode and a voltage limited to less than 5V.

[0064]

[0063] According to an embodiment that can be combined with any other embodiment described herein, the method includes curing the photocurable ink on the substrate (exemplarily shown by box 679 in FIG. 6). The photocurable ink can be cured by supplying light having a wavelength in the UV spectrum, for example, from 200 nm to 450 nm. Accordingly, UV curable ink can be provided on the substrate. The light for curing can be supplied to the substrate by the LED. Accordingly, a "self-curing type" LED can be provided to cure the photocurable ink printed on the substrate.

[0065] According to an embodiment that can be combined with any other embodiment described herein, the method may further include applying a force to a transfer device, particularly a pneumatic short-stroke cylinder, to change or vary the relative position of the interface and the substrate support so as to contact the LED on the substrate. The interface may contact the LED via the transfer device. In other words, the transfer device can move the interface and / or the substrate support to contact the substrate, i.e., the LED provided on the substrate.

[0066]

[0065] In view of the above, compared with the current state of the art, embodiments of the present disclosure advantageously provide an apparatus for curing a photocurable ink, a system for processing a substrate, and a method for curing a photocurable ink on a substrate, which are improved in terms of curing efficiency, temperature stability, and curing accuracy in the field of high-quality display manufacturing. Further, the embodiments described herein advantageously provide the use of self-curing LEDs, particularly micro-LEDs, compared to conventional curing devices.

[0067]

[0066] Although the above is directed to embodiments of the present disclosure, other further embodiments of the present disclosure can be devised without departing from its basic scope, which is determined by the following claims.

Claims

1. An apparatus (100) comprising a light-sealable housing (105) for curing a photocurable ink printed on a substrate (10) having a light-emitting diode (LED), an interface (110) for supplying power to the LED, a substrate support (130), and a transfer device (120) configured to change the relative position between the interface (110) and the substrate support (130), The transfer device (120) is configured to bring the interface (110) into contact with the substrate (10) in order to supply power for lighting the LED to the LED and cure the photocurable ink.

2. The apparatus according to claim 1, wherein the apparatus comprises a temperature control element for regulating the temperature inside the apparatus (100).

3. The apparatus according to claim 2, wherein the temperature control element includes one selected from the group consisting of a cooling plate and / or a cooling gas conduit.

4. The temperature control element includes a cooling gas conduit, and the temperature provided by the cooling gas conduit is controlled by the flow rate of the cooling gas and / or the amount of the cooling gas supplied to the cooling gas conduit. The apparatus (100) according to claim 2.

5. The temperature control element includes a cooling gas conduit, the cooling gas conduit includes a gas inlet (206) for supplying cooling gas to the apparatus, and the cooling gas conduit includes a gas outlet (207) for removing the cooling gas from the apparatus. The apparatus (100) according to claim 2.

6. The apparatus according to any one of claims 1 to 5, wherein the light-sealable housing (105) includes a black inner wall that absorbs the stray emission light of the LED.

7. The device according to any one of claims 1 to 6, comprising a first slide opening and closing mechanism (152) and a second slide opening and closing mechanism (158).

8. The device (100) according to any one of claims 1 to 7, wherein the substrate support (130) is a support plate for supporting the substrate.

9. The device according to any one of claims 1 to 8, further comprising a controller, wherein the controller is configured to control the wavelength supplied by the LED, and / or the controller is configured to selectively adjust the lighting of the LED.

10. The device (100) according to any one of claims 1 to 9, wherein the interface (110) includes a probe card.

11. The device (100) according to any one of claims 1 to 9, wherein the LED is provided on the surface of the substrate, and the photocurable ink is provided on the surface of the LED.

12. The device (100) according to claim 11, wherein the LED is connected to one or more electrically contactable elements.

13. The device (100) according to claim 10, wherein the probe card includes one or more pins for making electrical contact with one or more electrically contactable elements of the LED.

14. The device (100) according to any one of claims 1 to 13, wherein the transfer device (120) is one selected from the group consisting of a piston and a short-stroke cylinder.

15. A system (500) for processing a substrate having a light-emitting diode (LED), comprising: A printing section (560) for providing a photocurable ink to the substrate (10); The device (100) according to any one of claims 1 to 9 A system comprising

16. The system according to claim 15, further comprising a transport device (562) for transporting the substrate from the printing section (560) to the device for curing the photocurable ink up to the device.

17. The system (500) according to claim 15 or 16, wherein the printing section (560) is configured to provide photocurable inks of two or more different colors.

18. A method (600) for curing a photocurable ink on a substrate having a light emitting diode (LED), comprising: Providing an interface for supplying power to the LED; Providing a substrate having the LED; Contacting the interface with the LED; Supplying a cooling gas for stabilizing the temperature; Supplying power to the interface to turn on the LED; Curing the photocurable ink on the substrate; And a method comprising.

19. The interface contacts the LED via a transfer device, the transfer device is a pneumatic short stroke cylinder, and the method further comprises: Applying a force to the pneumatic short stroke cylinder to change the relative position between the interface and the substrate to contact the LED on the substrate; The method (600) according to claim 18, comprising.

20. The method (600) according to claim 18 or 19, further comprising circulating the cooling gas.

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