Vehicle lighting device and vehicle lamp

The vehicle lighting device addresses heat dissipation challenges by integrating a socket with heat dissipation fins, a heat transfer plate, and multiple heat transfer fins, enhancing thermal management and preventing malfunctions due to increased luminous flux and miniaturization.

JP7694163B2Active Publication Date: 2025-06-18TOSHIBA LIGHTING & TECHNOLOGY CORP
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Patent Information

Application Number
JP2021092799
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-06-02
Publication Date
2025-06-18
Estimated Expiration
2041-06-02

AI Technical Summary

Technical Problem

Existing vehicle lighting devices equipped with light-emitting diodes face challenges in heat dissipation due to increased luminous flux demands and miniaturization, leading to potential malfunctions and reduced lifespan.

Method used

The vehicle lighting device incorporates a socket with a flange and heat dissipation fins, a heat transfer portion with a heat transfer plate and multiple heat transfer fins, and a light emitting module mounted on the heat transfer plate, enhancing heat dissipation through efficient thermal conductivity and fin arrangements.

Benefits of technology

This configuration significantly improves heat dissipation capabilities, effectively managing increased heat generation from higher luminous flux and miniaturized designs, thereby preventing malfunctions and extending the lifespan of the light-emitting diodes.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a lamp for a vehicle which can further improve heat radiation performance.SOLUTION: A lighting device for a vehicle comprises: a socket having a flange, a columnar attachment part arranged at one face of the flange and having a first recess, and heat radiation fins arranged at the other face of the flange; and a light emitting module arranged at a first face of a heat transmission part having a heat transmission plate arranged at a bottom face of the first recess. The heat transmission part further has a first heat transmission fin arranged at a second face of the heat transmission plate, and a second heat transmission fin arranged at the second face of the heat transmission plate, opposing the first heat transmission fin, and protruding in a direction substantially vertical to the second face. The vicinity of an end part of the first heat transmission fin in a direction parallel to the second face is bent toward the inside of the second face along a side face of the attachment part. The vicinity of an end part of the second heat transmission fin in a direction parallel to the second face is bent toward the inside of the second face along the side face of the attachment part.SELECTED DRAWING: Figure 4
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Description

Technical Field

[0001] Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.

Background Art

[0002] From the viewpoints of energy saving and long life, the spread of vehicle lighting devices equipped with light-emitting diodes instead of vehicle lighting devices equipped with filaments has been progressing. When a vehicle lighting device equipped with a light-emitting diode is lit, light is irradiated from the light-emitting diode, and heat is generated in the light-emitting diode and a resistor electrically connected to the light-emitting diode. In the case of a vehicle lighting device, the vehicle lighting device may be placed in a high-temperature environment of about 85°C.

[0003] If the temperature of the lit light-emitting diode exceeds the maximum junction temperature due to the heat generated in the light-emitting diode or resistor or the ambient temperature, etc., the light-emitting diode may malfunction or its life may be shortened.

[0004] Therefore, a technique has been proposed in which a heat transfer portion formed of metal is provided between a substrate on which a light-emitting diode or the like is mounted and a socket formed of a high thermal conductivity resin. If a heat transfer portion is provided, it becomes easier to transfer the heat generated in the light-emitting diode or the like to the socket. Therefore, it is possible to suppress the temperature of the light-emitting diode from exceeding the maximum junction temperature.

[0005] However, in recent years, higher luminous flux of vehicle lighting devices has been demanded, and the current flowing through a light-emitting diode or the like may be increased. When the current flowing through a light-emitting diode or the like is increased, the heat generated in the light-emitting diode or the like increases. In recent years, there has also been a demand for miniaturization of vehicle lighting devices, and in some cases, the portion of the socket where a substrate on which light-emitting diodes or the like are mounted is provided becomes smaller. When the portion of the socket where the substrate is provided becomes smaller, the area of the portion through which heat is transferred becomes smaller, making it difficult to dissipate the heat generated in the light-emitting diodes or the like. Therefore, even when a heat transfer portion is provided, further improvement in heat dissipation has been desired.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] The problem to be solved by the present invention is to provide a vehicle lighting device and a vehicle lamp that can further improve heat dissipation.

Means for Solving the Problems

[0008] The vehicle lighting device according to the embodiment includes a socket having a flange, a mounting portion that has a cylindrical shape, is provided on one surface of the flange, and has a first recess that opens at an end opposite to the flange side, and heat dissipation fins provided on the other surface of the flange; a heat transfer portion having a heat transfer plate provided on the bottom surface of the first recess; and a light emitting module having a light emitting element provided on a first surface of the heat transfer plate that is exposed from the bottom surface of the first recess. The heat transfer portion includes a first heat transfer fin provided on a second surface of the heat transfer plate that faces the first surface and protrudes in a direction substantially perpendicular to the second surface; a second heat transfer fin provided on the second surface of the heat transfer plate, facing the first heat transfer fin, and protruding in a direction substantially perpendicular to the second surface; and a third heat transfer fin provided on the second surface of the heat transfer plate, positioned between the first heat transfer fin and the second heat transfer fin, and protruding in a direction substantially perpendicular to the second surface. In the direction parallel to the second surface of the first heat transfer fin, On both sides the end of Each the vicinity is bent along the side surface of the mounting portion toward the inside of the second surface. The outer surface is a first part that is a curved surface. The outer surface between the first parts of the first heat transfer fin is a flat and continuous surface. In the direction parallel to the second surface of the second heat transfer fin, On both sides the end of Each the vicinity is bent along the side surface of the mounting portion toward the inside of the second surface. The outer surface is a second part that is a curved surface. The outer surface between the second parts of the second heat transfer fin is a flat and continuous surface. The first heat transfer fin, the second heat transfer fin, and the third heat transfer fin are arranged side by side in one direction. When viewed from a direction intersecting the direction in which the first heat transfer fin, the second heat transfer fin, and the third heat transfer fin are arranged, the first part overlaps with the third heat transfer fin adjacent to the first heat transfer fin, and the second part overlaps with the third heat transfer fin adjacent to the second heat transfer fin.

Advantages of the Invention

[0009] According to the embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can further improve heat dissipation.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments will be exemplified with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and detailed descriptions thereof are omitted as appropriate.

[0012] (Vehicle Lighting Device) The vehicle lighting device 1 according to the present embodiment can be provided in, for example, an automobile or a railway vehicle. Examples of the vehicle lighting device 1 provided in an automobile include, for example, a front combination lamp (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc. as appropriate), a rear combination lamp (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc. as appropriate), etc. However, the use of the vehicle lighting device 1 is not limited to these.

[0013] FIG. 1 is a schematic exploded view for exemplifying the vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view taken along line A-A of the vehicle lighting device 1 in FIG. 1. FIG. 3 is a schematic perspective view of the vehicle lighting device 1 in FIG. 1 as seen from the B direction.

[0014] As shown in FIGS. 1 to 3, the vehicle lighting device 1 is provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.

[0015] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on a surface of the flange 13 opposite to the side where the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 can be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a concave portion 11a (corresponding to an example of a first concave portion) that opens at an end opposite to the flange 13 side.

[0016] The bayonet 12 is provided on the side surface of the mounting portion 11, for example. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 can be provided. The bayonet 12 is used when mounting the vehicle lighting device 1 to a housing 101 of a vehicle lamp 100 described later, for example. The bayonet 12 can be used for a twist lock.

[0017] The flange 13 has a plate shape, for example. The flange 13 has a substantially disc shape, for example. The side surface of the flange 13 is located outside the vehicle lighting device 1 more than the side surface of the bayonet 12.

[0018] The heat dissipation fins 14 are provided on the side of the flange 13 opposite to the mounting portion 11 side. At least one heat dissipation fin 14 can be provided. For example, as shown in FIG. 3, a plurality of heat dissipation fins 14 can be provided on the socket 10. The plurality of heat dissipation fins 14 can be arranged side by side in a predetermined direction. The heat dissipation fins 14 have a plate shape or a cylindrical shape, for example.

[0019] The connector holder 15 is provided on the side of the flange 13 opposite to the mounting portion 11 side. The connector holder 15 can be provided side by side with the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a inside is inserted therein.

[0020] The socket 10 has a function of holding the light emitting module 20 and the power supply unit 30, and a function of transferring the heat generated in the light emitting module 20 to the outside. Therefore, the socket 10 is preferably formed of a material having a high thermal conductivity.

[0021] In recent years, it has been desired that the socket 10 can efficiently dissipate the heat generated in the light emitting module 20 and is lightweight. Therefore, the socket 10 can be formed of, for example, a high thermal conductivity resin. The high thermal conductivity resin includes, for example, a resin and a filler using an inorganic material. The high thermal conductivity resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon or aluminum oxide. The heat transfer rate of the high thermal conductivity resin can be, for example, about 8 W / (m·k) to 20 W / (m·k).

[0022] If the socket 10 includes a high thermal conductivity resin and the mounting portion 11, the bayonet 12, the flange 13, the heat dissipation fins 14, and the connector holder 15 are integrally formed, the heat generated in the light emitting module 20 can be efficiently dissipated. Also, the weight of the socket 10 can be reduced. In this case, the mounting portion 11, the bayonet 12, the flange 13, the heat dissipation fins 14, and the connector holder 15 can be integrally formed using an injection molding method or the like. Also, the socket 10 and the power supply unit 30 can be integrally formed using an insert molding method or the like.

[0023] The light emitting module 20 is provided on a surface 40a1 (corresponding to an example of the first surface) of the heat transfer plate 40a that is exposed from the bottom surface 11a1 of the recess 11a. The light-emitting module 20 has, for example, a substrate 21, a light-emitting element 22, a frame portion 23, a sealing portion 24, and an element 25. The substrate 21 is adhered to, for example, the surface 40a1 of the heat transfer portion 40. In this case, it is preferable that the adhesive be an adhesive having a high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The thermal conductivity of the adhesive is, for example, 0.5 W / (m·K) or more and 10 W / (m·K) or less.

[0024] The substrate 21 has a plate shape. The planar shape of the substrate 21 is, for example, a quadrilateral. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (e.g., aluminum oxide, aluminum nitride, etc.), an organic material such as paper phenol or glass epoxy, or the like. Further, the substrate 21 may be a metal core substrate in which the surface of a metal plate is coated with an insulating material. When the heat generation amount of the light-emitting element 22 is large, it is preferable to form the substrate 21 using a material having a high thermal conductivity from the viewpoint of heat dissipation. Examples of materials having a high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, high thermal conductivity resins, metal core substrates, and the like. The substrate 21 may have a single-layer structure or a multilayer structure.

[0025] In addition, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed from, for example, a material mainly composed of silver or a material mainly composed of copper.

[0026] Further, a covering portion that covers the wiring pattern 21a and a film-like resistor described later can also be provided. The covering portion can include, for example, a glass material.

[0027] The light-emitting element 22 is provided on the substrate 21 (on the side opposite to the heat transfer portion 40 side). The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. When a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series with each other. The light-emitting element 22 can be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, or the like.

[0028] The light-emitting element 22 can be, for example, a chip-shaped light-emitting element. By using a chip-shaped light-emitting element 22, the area where the light-emitting element 22 is provided can be reduced, so that the substrate 21 can be miniaturized, and thus the vehicle lighting device 1 can be miniaturized. The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 can be, for example, an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, a flip-chip type light-emitting element, or the like. The electrode of the upper electrode type light-emitting element or the upper electrode of the upper and lower electrode type light-emitting element can be electrically connected to the wiring pattern 21a by wiring. In this case, the wiring can be connected, for example, by the wire bonding method. The flip-chip type light-emitting element 22 can be directly mounted on the wiring pattern 21a.

[0029] The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those illustrated, and can be appropriately changed according to the size and use of the vehicle lighting device 1.

[0030] The frame portion 23 is provided on the substrate 21. The frame portion 23 has a frame shape and is adhered to the substrate 21. The frame portion 23 surrounds the light-emitting element 22. The frame portion 23 is formed of, for example, resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

[0031] The frame portion 23 can have the function of defining the formation range of the sealing portion 24 and the function of a reflector. Therefore, the frame portion 23 can contain particles of titanium oxide or the like, or contain a white resin in order to improve the reflectivity. Further, the frame portion 23 can also be omitted. However, if the frame portion 23 is provided, the utilization efficiency of the light irradiated from the light-emitting element 22 can be improved. Also, since the range in which the sealing portion 24 is formed can be reduced, miniaturization of the light-emitting module 20 and thus miniaturization of the vehicle lighting device 1 can be achieved.

[0032] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the region surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having translucency. The sealing portion 24 is formed, for example, by filling resin inside the frame portion 23. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, a silicone resin or the like. When the frame portion 23 is omitted, for example, a dome-shaped sealing portion 24 is formed on the substrate 21.

[0033] Further, a phosphor can be included in the sealing portion 24. The phosphor can be, for example, a YAG-based phosphor (yttrium-aluminum-garnet-based phosphor) or the like. However, the type of the phosphor can be appropriately changed according to the use of the vehicle lighting device 1 or the like so as to obtain a predetermined emission color.

[0034] The element 25 can be a passive element or an active element used to constitute a light-emitting circuit having the light-emitting element 22. The element 25 is provided, for example, around the frame portion 23 and is electrically connected to the wiring pattern 21a. At least one element 25 can be provided.

[0035] The element 25 can be, for example, a resistor 25a and a control element 25b or the like. However, the type of element 25 is not limited to the exemplified ones and can be appropriately changed according to the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to those described above, the element 25 may be a capacitor, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, an inductor, a surge absorber, a varistor, a transistor such as an FET or a bipolar transistor, an integrated circuit, an arithmetic element, or the like.

[0036] The resistor 25a is provided on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21a. The resistor 25a can be, for example, a surface mount type resistor, a resistor having lead wires (metal oxide film resistor), a film resistor formed using a screen printing method or the like. Note that the resistor 25a exemplified in FIG. 1 is a film resistor.

[0037] The material of the film resistor is, for example, ruthenium oxide (RuO2). The film resistor is formed using, for example, a screen printing method and a firing method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that the heat dissipation can be improved. Also, a plurality of resistors 25a can be formed at once. Therefore, the productivity can be improved. Also, the variation in the resistance values of the plurality of resistors 25a can be suppressed.

[0038] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the applied voltage between the anode terminal and the ground terminal is made constant, there will be variation in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitted from the light-emitting element 22. Therefore, in order for the brightness of the light emitted from the light-emitting element 22 to fall within a predetermined range, the value of the current flowing through the light-emitting element 22 is made to be within a predetermined range by the resistor 25a connected in series with the light-emitting element 22. In this case, by changing the resistance value of the resistor 25a, the value of the current flowing through the light-emitting element 22 is made to be within a predetermined range.

[0039] When the resistor 25a is a surface-mounted resistor or a resistor having lead wires, etc., a resistor 25a having an appropriate resistance value is selected according to the forward voltage characteristics of the light-emitting element 22. When the resistor 25a is a film resistor, the resistance value can be increased by removing a part of the resistor 25a. For example, if a laser beam is irradiated on the film resistor, a part of the film resistor can be easily removed. Note that the number, size, etc. of the resistor 25a are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light-emitting elements 22, etc.

[0040] The control element 25b is provided on the substrate 21. The control element 25b is electrically connected to the wiring pattern 21a. The control element 25b is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The control element 25b is, for example, a surface-mounted diode, a diode having lead wires, etc. The control element 25b exemplified in FIG. 1 is a surface-mounted diode.

[0041] In addition, an optical element can be provided as necessary. The optical element can be provided, for example, on the sealing portion 24. The optical element can be, for example, a convex lens, a concave lens, a light guide, etc.

[0042] The power supply unit 30 has, for example, a plurality of power supply terminals 31 and a holding unit 32. The plurality of power supply terminals 31 can be in the form of a rod-shaped body. One end of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. The plurality of power supply terminals 31 are provided, for example, arranged in a predetermined direction. One end of the plurality of power supply terminals 31 is soldered to a wiring pattern 21a provided on the substrate 21. The other end of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. A connector 105 is fitted onto the plurality of power supply terminals 31 that are exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of a metal such as a copper alloy, for example. Note that the shape, arrangement, material, etc. of the plurality of power supply terminals 31 are not limited to those exemplified and can be changed as appropriate.

[0043] As described above, it is preferable that the socket 10 is formed of a material with high thermal conductivity. However, a material with high thermal conductivity may have electrical conductivity. For example, a highly thermally conductive resin containing a filler using carbon has electrical conductivity. Therefore, the holding portion 32 is provided to insulate between the plurality of power supply terminals 31 and the electrically conductive socket 10. Further, the holding portion 32 also has a function of holding the plurality of power supply terminals 31. Note that when the socket 10 is formed of a highly thermally conductive resin having insulating properties (for example, a highly thermally conductive resin containing a filler using aluminum oxide, etc.), the holding portion 32 can be omitted. In this case, the socket 10 holds the plurality of power supply terminals 31. The holding portion 32 is formed of an insulating resin, for example. The holding portion 32 can be press-fitted into a hole provided in the socket 10 or adhered to the inner wall of the hole, for example.

[0044] Here, when the light-emitting element 22 is lit, heat is generated in the light-emitting element 22, the resistor 25a, etc. Also, in the case of the vehicle lighting device 1, the vehicle lighting device 1 may be placed in a high-temperature environment of about 85°C. If the temperature of the lit light-emitting element 22 exceeds the maximum junction temperature due to the heat generated in the light-emitting element 22, the resistor 25a, etc., and the ambient temperature, etc., there is a risk that the light-emitting diode may malfunction or its lifespan may be shortened.

[0045] In recent years, there has been a demand for increasing the luminous flux of the vehicle lighting device 1, and in some cases, the current flowing through the light-emitting element 22 is increased. When the current flowing through the light-emitting element 22 is increased, the heat generated in the light-emitting element 22, the resistor 25a, etc. increases. In recent years, there has also been a demand for miniaturizing the vehicle lighting device 1, and in some cases, the cross-sectional area of the mounting portion 11 in the direction orthogonal to the central axis of the vehicle lighting device 1 becomes smaller. When the cross-sectional area of the mounting portion 11 becomes smaller, the area of the portion through which heat is transferred between the light-emitting module 20 and the heat-radiating fins 14 becomes smaller, so that the heat generated in the light-emitting element 22 etc. is less likely to be transferred to the heat-radiating fins 14.

[0046] Therefore, the vehicle lighting device 1 according to the present embodiment is provided with a heat transfer portion 40 exemplified below. FIG. 4 is a schematic perspective view for exemplifying the heat transfer portion 40. FIG. 5 is a schematic perspective view of the heat transfer portion 40 in FIG. 4 as viewed from the C direction. FIG. 6 is a schematic perspective cross-sectional view of the socket 10 in which the heat transfer portion 40 is provided. As shown in FIGS. 2, 4, and 5, the heat transfer portion 40 has, for example, a heat transfer plate 40a, heat transfer fins 40b (corresponding to an example of a third heat-radiating fin), heat transfer fins 40c (corresponding to an example of a first heat-radiating fin), and heat transfer fins 40d (corresponding to an example of a second heat-radiating fin).

[0047] The heat transfer plate 40a is plate-shaped. The heat transfer plate 40a is provided on the bottom surface 11a1 of the recess 11a. One surface 40a1 of the heat transfer plate 40a is exposed from the bottom surface 11a1 of the recess 11a. As described above, the light-emitting module 20 (substrate 21) is adhered to the surface 40a1. As shown in FIGS. 1 and 2, the surface 40a1 of the heat transfer plate 40a can be provided at a position protruding from the bottom surface 11a1 of the recess 11a.

[0048] The planar shape and planar dimensions of the heat transfer plate 40a can be made substantially the same as, for example, the planar shape and planar dimensions of the substrate 21. However, the heat transfer plate 40a is provided with notches 40a2 for preventing short circuits with the plurality of power supply terminals 31. A recess 40a3 (corresponding to an example of the second recess) can be provided at the periphery of the surface 40a1 of the heat transfer plate 40a. The recess 40a3 opens, for example, to the surface 40a1 of the heat transfer plate 40a and the side surface of the heat transfer plate 40a. The length (depth) of the recess 40a3 in the direction perpendicular to the surface 40a1 can be, for example, about 1 mm. The length (width) of the recess 40a3 in the direction parallel to the surface 40a1 can be, for example, about 1 mm.

[0049] As will be described later, the recess 40a3 provided in the heat transfer portion 40 and the convex portion 11a2 provided in the socket 10 cooperate to fix the heat transfer portion 40 to the socket 10. Therefore, at least one recess 40a3 may be provided, but if a plurality of recesses 40a3 are provided, the fixing of the heat transfer portion 40 can be strengthened or the posture of the heat transfer portion 40 can be stabilized.

[0050] The heat transfer fin 40b has a plate shape. The heat transfer fin 40b is provided on the surface 40a4 (corresponding to an example of the second surface) of the heat transfer plate 40a that faces the surface 40a1. The heat transfer fin 40b is provided between the heat transfer fin 40c and the heat transfer fin 40d. The heat transfer fin 40b protrudes from the surface 40a4 in a direction substantially perpendicular to the surface 40a4. At least one heat transfer fin 40b can be provided. When a plurality of heat transfer fins 40b are provided, the plurality of heat transfer fins 40b can be arranged parallel to each other.

[0051] When providing a plurality of heat transfer fins 40b, the length (thickness) of the heat transfer fins 40b in the direction parallel to the surface 40a4 can be made substantially constant. Note that the substantially constant thickness includes the case where the shape of the heat transfer fins 40b is a tapered shape of about 1.5°. If the thickness of the heat transfer fins 40b is substantially constant, the thickness of the portion of the socket 10 provided between the heat transfer fins 40b can be made substantially constant. By doing so, heat interference between the heat transfer fins 40b can be suppressed, and fluctuation of the cross-sectional area of the heat conduction path in the relevant portion of the socket 10 can be suppressed. Therefore, heat conduction from the heat transfer portion 40 to the socket 10, and thus the heat dissipation performance of the vehicle lighting device 1 can be improved.

[0052] The heat transfer fin 40c has a plate shape. The heat transfer fin 40c is provided on the surface 40a4 of the heat transfer plate 40a. The heat transfer fin 40c protrudes from the surface 40a4 in a direction substantially perpendicular to the surface 40a4. The heat transfer fin 40c is provided at the periphery of the surface 40a4. The vicinity of the end portion 40c1 of the heat transfer fin 40c in the direction parallel to the surface 40a4 is bent toward the inside of the surface 40a4. The vicinity of the end portion 40c1 can have, for example, a shape along the side surface of the mounting portion 11 (for example, a part of the side surface of a cylinder).

[0053] The heat transfer fin 40d has a plate shape. The heat transfer fin 40d is provided on the surface 40a4 of the heat transfer plate 40a. The heat transfer fin 40d faces the heat transfer fin 40c. The heat transfer fin 40d protrudes from the surface 40a4 in a direction substantially perpendicular to the surface 40a4. The heat transfer fin 40d is provided at the periphery of the surface 40a4. The vicinity of the end portion 40d1 of the heat transfer fin 40d in the direction parallel to the surface 40a4 is bent toward the inside of the surface 40a4. The vicinity of the end portion 40d1 can have, for example, a shape along the side surface of the mounting portion 11 (for example, a part of the side surface of a cylinder).

[0054] If the vicinity of the end 40c1 of the heat transfer fin 40c and the vicinity of the end 40d1 of the heat transfer fin 40d are shaped along the side surface of the mounting portion 11, the lengths of the heat transfer fins 40c and 40d in the direction parallel to the surface 40a4 can be increased. Therefore, the amount of heat transferred from the heat transfer fins 40c and 40d to the socket 10 (mounting portion 11) can be increased, and thus the heat dissipation performance of the vehicle lighting device 1 can be improved.

[0055] As shown in FIG. 2, the tips of the heat transfer fins 40b (the ends on the side opposite to the surface 40a4 side), the heat transfer fin 40c, and the heat transfer fin 40d are provided inside the flange 13 and are not provided inside the radiation fin 14. If the tips of the heat transfer fins 40b to 40d are provided inside the radiation fin 14, the thickness of the radiation fin 14 will increase by the thickness of these fins.

[0056] In recent years, miniaturization of the vehicle lighting device 1 has been demanded, and the distance between the radiation fins 14 tends to be shortened. Therefore, if the tips of the heat transfer fins 40b to 40d are provided inside the radiation fin 14 and the thickness of the radiation fin 14 increases, the distance between the radiation fins 14 will be further shortened. If the distance between the radiation fins 14 becomes too short, convective heat transfer interference may occur between the radiation fins 14, and the heat dissipation performance of the vehicle lighting device 1 may deteriorate.

[0057] In the heat transfer portion 40 according to the present embodiment, since the tips of the heat transfer fins 40b to 40d are not provided inside the radiation fin 14, it is easy to set the distance between the radiation fins 14 to a distance at which convective heat transfer interference does not occur. Also, the number and intervals of the heat transfer fins 40b can be determined regardless of the number and intervals of the radiation fins 14. Therefore, the heat dissipation performance of the vehicle lighting device 1 can be improved.

[0058] The heat transfer part 40 is provided to facilitate the transfer of the heat generated in the light emitting module 20 to the socket 10. Therefore, the heat transfer part 40 is formed of a material with high thermal conductivity. The heat transfer part 40 is formed of a metal such as, for example, aluminum, an aluminum alloy, copper, or a copper alloy. For example, the heat transfer part 40 can be formed using an aluminum alloy with a density of about 2.7 kg / m 3 . The heat transfer plate 40a, the heat transfer fins 40b, 40c, and 40d can be integrally formed using, for example, die casting. When forming the heat transfer part 40 using die casting, molten aluminum alloy or the like can be injected from the surface 40a1 side of the heat transfer plate 40a. In this case, the thickness of the heat transfer plate 40a can be, for example, about 3 mm. The thicknesses of the heat transfer fins 40b, 40c, and 40d can be, for example, about 1 mm to 2 mm.

[0059] Also, as shown in FIG. 6, a recess 11a3 into which the heat transfer part 40 is inserted is provided on the bottom surface 11a1 of the recess 11a of the socket 10 (mounting part 11). The ridge line of the recess 11a3 is a curved surface. Also, the ridge line of the portion of the heat transfer part 40 that is inserted into the recess 11a3 is a curved surface. The tips of the heat transfer fins 40b to 40d are curved surfaces. In this way, it becomes easy to insert the heat transfer part 40 into the inside of the socket 10.

[0060] Here, the heat transfer part 40 and the socket 10 can be integrally formed using the insert molding method, or the heat transfer part 40 and the socket 10 can be adhered using an adhesive with high thermal conductivity. However, thermal stress repeatedly occurs between the heat transfer part 40 and the socket due to the lighting and extinguishing of the light emitting element 22, changes in the ambient temperature, etc. In addition, vibrations associated with driving are applied to the vehicle lighting device 1. Therefore, if the heat transfer part 40 and the socket 10 are integrally formed or the heat transfer part 40 and the socket 10 are adhered to fix them, there is a possibility that a gap may occur between the heat transfer part 40 and the socket 10 over time. If a gap occurs between the heat transfer part 40 and the socket 10, heat conduction from the heat transfer part 40 to the socket 10 may be hindered, or unevenness may occur in the temperature of the heat transfer plate 40a.

[0061] Therefore, in the vehicle lighting device 1 according to the present embodiment, a layer 41 containing heat conductive grease (heat dissipating grease) is provided between the heat transfer part 40 and the socket 10. The heat conductive grease is, for example, a modified silicone mixed with a filler using an inorganic material. The thermal conductivity of the heat conductive grease is, for example, 1 W / (m·K) or more and 5 W / (m·K) or less.

[0062] Since the layer 41 containing heat conductive grease is in a semi-solid state, it flows when a stress of a certain level or more is applied. Therefore, if the layer 41 containing heat conductive grease is provided, the layer 41 containing heat conductive grease can absorb thermal stress and vibrations, or fill the generated gaps. If the occurrence of a gap between the heat transfer part 40 and the socket 10 over time can be suppressed, the heat dissipation performance of the vehicle lighting device 1 can be maintained for a long period.

[0063] Note that the gap between the heat transfer part 40 and the socket 10 may be filled with a layer 41 containing heat conductive grease. For example, when the heat transfer part 40 and the socket 10 are in partial contact, the layer 41 containing heat conductive grease may be provided in the portion where the heat transfer part 40 and the socket 10 are not in contact. In this case, if the heat transfer part 40 and the socket 10 are in partial contact, it is possible to suppress the movement of the position of the heat transfer part 40, and thus the position of the light emitting module 20.

[0064] Also, as described above, since the layer 41 containing heat conductive grease flows when a stress of a certain level or more is applied, the force for holding the heat transfer part 40 is weak. Therefore, as shown in FIGS. 2 and 6, at least one convex part 11a2 is provided on the bottom surface 11a1 of the concave part 11a. The convex part 11a2 is provided on the periphery of the region where the heat transfer plate 40a is provided on the bottom surface 11a1 of the concave part 11a. The convex part 11a2 can be provided on the periphery of the concave part 11a3 that opens to the bottom surface 11a1. The convex part 11a2 is provided at a position facing the concave part 40a3 of the heat transfer plate 40a. The number of the convex parts 11a2 can be the same as the number of the concave parts 40a3, for example.

[0065] The tip side of the convex part 11a2 is in contact with the bottom surface of the concave part 40a3. Therefore, it is possible to suppress the heat transfer part 40 from falling off the socket 10. For example, by applying ultrasonic vibration or heating to the tip side of the convex part 11a2, the tip side of the convex part 11a2 can be brought into contact with the bottom surface of the concave part 40a3.

[0066] (Vehicle lamp) Next, the vehicle lamp 100 will be exemplified. In the following, as an example, the case where the vehicle lamp 100 is a front combination lamp provided on an automobile will be described. However, the vehicle lamp 100 is not limited to the front combination lamp provided on an automobile. The vehicle lamp 100 may be a vehicle lamp provided on an automobile, a railway vehicle, or the like.

[0067] FIG. 7 is a schematic partial cross-sectional view for illustrating the vehicle lamp 100. As shown in FIG. 7, the vehicle lamp 100 has, for example, a vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0068] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 has a box shape with one end open. The housing 101 is formed of, for example, a resin that does not transmit light. An attachment hole 101a into which a portion of the mounting portion 11 provided with the bayonet 12 is inserted is provided on the bottom surface of the housing 101. A recess into which the bayonet 12 provided on the mounting portion 11 is inserted is provided at the periphery of the attachment hole 101a. Although the case where the attachment hole 101a is directly provided in the housing 101 is illustrated, an attachment member having the attachment hole 101a may be provided on the housing 101.

[0069] When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 provided with the bayonet 12 is inserted into the attachment hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held by a fitting portion provided at the periphery of the attachment hole 101a. Such an attachment method is called a twist lock.

[0070] The cover 102 is provided so as to close the opening of the housing 101. The cover 102 is formed of a translucent resin or the like. The cover 102 can also have functions such as a lens.

[0071] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 performs functions such as reflection, diffusion, light guiding, light collection, and formation of a predetermined light distribution pattern of the light emitted from the vehicle lighting device 1. For example, the optical element 103 illustrated in FIG. 7 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0072] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 is annular and is formed of a material having elasticity such as rubber or silicone resin.

[0073] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the internal space of the housing 101 can be sealed by the seal member 104. Further, due to the elastic force of the seal member 104, the bayonet 12 is pressed against the housing 101. Therefore, it is possible to prevent the vehicle lighting device 1 from detaching from the housing 101.

[0074] The connector 105 is fitted to the ends of a plurality of power supply terminals 31 exposed inside the connector holder 15. A power source (not shown) or the like is electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the plurality of power supply terminals 31, a power source (not shown) or the like and the light emitting element 22 can be electrically connected.

[0075] Further, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0076] As described above, some embodiments of the present invention have been illustrated. However, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and its equivalent scope. Further, the above-described embodiments can be implemented in combination with each other.

Explanation of Reference Numerals

[0077] 1 Vehicle lighting device, 10 Socket, 11 Mounting part, 11a Recess, 11a1 Bottom surface, 11a2 Protrusion, 13 Flange, 14 Heat dissipation fin, 20 Light emitting module, 21 Substrate, 22 Light emitting element, 40 Heat transfer part, 40a Heat transfer plate, 40a1 Surface, 40a3 Recess, 40a4 Surface, 40b Heat transfer fin, 40c Heat transfer fin, 40c1 End part, 40d Heat transfer fin, 40d1 End part, 41 Layer, 100 Vehicle lamp, 101 Housing

Claims

1. A socket having a flange, a mounting portion that is cylindrical, provided on one surface of the flange, and has a first recess that opens at an end opposite to the flange side, and heat dissipation fins provided on the other surface of the flange; A heat transfer portion having a heat transfer plate provided on the bottom surface of the first recess; A light emitting module provided on a first surface of the heat transfer plate that is exposed from the bottom surface of the first recess and has a light emitting element; Comprising: The heat transfer portion is A first heat transfer fin provided on a second surface of the heat transfer plate that faces the first surface and protrudes in a direction substantially perpendicular to the second surface; A second heat transfer fin provided on the second surface of the heat transfer plate, facing the first heat transfer fin, and protruding in a direction substantially perpendicular to the second surface; A third heat transfer fin provided on the second surface of the heat transfer plate, located between the first heat transfer fin and the second heat transfer fin, and protruding in a direction substantially perpendicular to the second surface; Further comprising: In the vicinity of each of both ends of the first heat transfer fin in a direction parallel to the second surface, it bends along the side surface of the mounting portion and toward the inside of the second surface, and the outer surface is a first portion that is a curved surface. The outer surface between the first portions of the first heat transfer fin is a flat and continuous surface. In the vicinity of each of both ends of the second heat transfer fin in a direction parallel to the second surface, it bends along the side surface of the mounting portion and toward the inside of the second surface, and the outer surface is a second portion that is a curved surface. The outer surface between the second portions of the second heat transfer fin is a flat and continuous surface. The first heat transfer fin, the second heat transfer fin, and the third heat transfer fin are arranged side by side in one direction. When viewed from a direction intersecting the direction in which the first heat transfer fin, the second heat transfer fin, and the third heat transfer fin are arranged, the first portion overlaps with the third heat transfer fin adjacent to the first heat transfer fin, and the second portion overlaps with the third heat transfer fin adjacent to the second heat transfer fin. A vehicle lighting device.

2. The tip of the first heat transfer fin, the tip of the second heat transfer fin, and the tip of the third heat transfer fin are provided inside the flange. The vehicle lighting device according to claim 1.

3. The tip of the first heat transfer fin, the tip of the second heat transfer fin, and the tip of the third heat transfer fin are curved surfaces protruding outward. The vehicle lighting device according to claim 1 or 2.

4. The socket includes a high thermal conductivity resin, and the flange, the mounting portion, and the heat dissipation fins are integrally formed. The heat transfer portion includes a metal, and the heat transfer plate, the first heat transfer fin, the second heat transfer fin, and the third heat transfer fin are integrally formed. The vehicle lighting device according to any one of claims 1 to 3.

5. A layer containing thermal conductive grease is provided between the heat transfer portion and the socket. A convex portion is provided around the region where the heat transfer plate is provided on the bottom surface of the first recess, and the tip side of the convex portion is in contact with the bottom surface of the second recess provided at the periphery of the first surface of the heat transfer plate. The vehicle lighting device according to any one of claims 1 to 4.

6. A vehicle lighting device according to any one of claims 1 to 5; A housing to which the vehicle lighting device is attached; A vehicle lamp comprising the same.

Citation Information

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