Semiconductor device and method of manufacturing the same

Abstract

A printed circuit board (2) is disposed on the upper surface of a metal plate (1). The printed circuit board (2) has an opening (3) that exposes a part of the upper surface of the metal plate (1) and wiring patterns (4, 5, 6). A semiconductor chip (9) is mounted on the upper surface of the metal plate (1) within the opening (3) and is connected to the wiring patterns (4, 5, 6). A signal terminal (12) is joined to the wiring pattern (6) on the upper surface of the printed circuit board (2). A sealing resin (13) seals the printed circuit board (2), the semiconductor chip (9), and the signal terminal (12). The upper end portion of the signal terminal (12) is exposed from the upper surface of the sealing resin (13). The signal terminal (12) has a spring structure with elasticity in the vertical direction.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device and a method for manufacturing the same.

Background Art

[0002] A semiconductor device has been proposed in which a printed circuit board is disposed on a metal plate, a semiconductor chip is mounted on the metal plate exposed from an opening of the printed circuit board, and these are mold-sealed with a sealing material (see, for example, Patent Document 1). In the conventional semiconductor device, heat is dissipated from the lower surface and signals are input and output from the lower surface.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] There is a demand for input and output of signals from the upper surface of the device. For this purpose, it is necessary to draw out signal terminals joined to the wiring pattern on the upper surface of the printed circuit board from the upper surface of the sealing material. However, due to variations in the member sizes of the metal plate, the printed circuit board, and the signal terminals, the height from the lower surface of the metal plate to the upper end of the signal terminals varies. Since the height of the cavity of the mold for accommodating these members is fixed during mold sealing, the height variation of the members hinders mold sealing.

[0005] The present disclosure has been made to solve the above-described problems, and an object thereof is to obtain a semiconductor device and a method for manufacturing the same that can absorb height variations of members during mold sealing.

Means for Solving the Problems

[0006] The semiconductor device according to the present disclosure includes a printed circuit board having a metal plate, an opening disposed on the upper surface of the metal plate and exposing a part of the upper surface of the metal plate, and a wiring pattern, a semiconductor chip mounted on the upper surface of the metal plate in the opening and connected to the wiring pattern, a signal terminal joined to the wiring pattern on the upper surface of the printed circuit board, and a sealing material for sealing the printed circuit board, the semiconductor chip, and the signal terminal. A part of the signal terminal is exposed from the upper surface of the sealing material, and the signal terminal has a spring structure having elasticity in the vertical direction. Moreover, the spring structure is a metal thin plate bent at two or more locations, and the metal thin plate is bent to form a lower plate, an inclined plate, and an upper plate. The lower plate extends along the upper surface of the printed circuit board and is joined to the wiring pattern and connected to the lower end of the inclined plate. The inclined plate extends obliquely upward with respect to the upper surface of the printed circuit board. The upper plate extends along the upper surface of the sealing material and is connected to the upper end of the inclined plate. The signal terminal has a protrusion provided on the upper surface of the upper plate. The upper plate is not exposed from the sealing material, and the protrusion is exposed from the upper surface of the sealing material. It is characterized by this.

Effect of the Invention

[0007] In the present disclosure, the signal terminal has a spring structure having elasticity in the vertical direction. Therefore, it is possible to absorb the height variation of the members during mold sealing.

Brief Description of the Drawings

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Embodiment for Carrying Out the Invention

[0009] A semiconductor device and a method for manufacturing the same according to an embodiment will be described with reference to the drawings. The same or corresponding components may be denoted by the same reference numerals, and repeated descriptions may be omitted.

[0010] Embodiment 1 FIG. 1 is a cross-sectional view showing a semiconductor device according to Embodiment 1. FIG. 2 is a top view showing the inside of the semiconductor device according to Embodiment 1. The metal plate 1 is, for example, a thick copper member. A printed circuit board 2 is disposed on the upper surface of the metal plate 1. The printed circuit board 2 has an opening 3 that exposes a part of the upper surface of the metal plate 1, and wiring patterns 4, 5, and 6. The wiring patterns 5 and 6 are connected to an internal wiring 8 inside the substrate via vias 7.

[0011] A semiconductor chip 9 is mounted on the upper surface of the metal plate 1 within the opening 3. The semiconductor chip 9 is, for example, a transistor that processes high-frequency signals. A back electrode is formed on the back surface of the semiconductor chip 9 by plating. The back electrode is a GND electrode such as a source electrode, and is soldered to the metal plate 1, and heat can be exhausted from the back electrode. The signal electrode on the upper surface of the semiconductor chip 9 is connected to the wiring pattern 4 by a metal wire 10. An electronic component 11 is mounted on the printed circuit board 2 and is connected to the wiring patterns 4 and 5. The electronic component 11 is a chip capacitor, a resistor, an IC chip for bias control, or the like.

[0012] A signal terminal 12 is joined to the wiring pattern 6 on the upper surface of the printed circuit board 2. A sealing resin 13, which is a sealing material, molds and seals the printed circuit board 2, the semiconductor chip 9, and the signal terminal 12. A bias is supplied to the semiconductor chip 9 from outside the device or signals are input / output via the wiring patterns 4, 5, and 6, the vias 7, the internal wiring 8, the electronic component 11, and the signal terminal 12.

[0013] The signal terminal 12 is a thin metal plate bent at two or more locations. Specifically, the thin metal plate is bent to form a lower plate 12a, an inclined plate 12b, and an upper plate 12c. The lower plate 12a extends along the upper surface of the printed circuit board 2, is soldered to the wiring pattern 6, and is connected to the lower end of the inclined plate 12b. The inclined plate 12b extends obliquely upward with respect to the upper surface of the printed circuit board 2. The upper plate 12c extends along the upper surface of the sealing resin 13 and is connected to the upper end of the inclined plate 12b. This Z-shaped thin metal plate of the signal terminal 12 has a spring structure with elasticity in the vertical direction. The upper surface of the upper plate 12c, which is the upper end portion of the signal terminal 12, is exposed from the upper surface of the sealing resin 13. However, the tip of the upper plate 12c is bent downward. By having this tip portion bite into the sealing resin 13, it is possible to prevent the signal terminal 12 from coming out of the sealing resin 13.

[0014] Figs. 3 and 4 are cross-sectional views showing the manufacturing process of the semiconductor device according to Embodiment 1. First, as shown in Fig. 3, the printed circuit board 2 is placed on the metal plate 1. The semiconductor chip 9 is mounted on the upper surface of the metal plate 1 exposed at the opening 3, and the semiconductor chip 9 and the wiring pattern 4 are wire-connected. The signal terminal 12 is soldered to the wiring pattern 6 on the upper surface of the printed circuit board 2.

[0015] Next, as shown in Fig. 4, the metal plate 1, the printed circuit board 2, the semiconductor chip 9, and the signal terminal 12 are sandwiched from above and below by the upper mold 14 and the lower mold 15 and accommodated in the cavity 16. A release film 17 is provided on the inner surfaces of the upper mold 14 and the lower mold 15. The upper end portion of the signal terminal 12 is pressed against the upper mold 14 via the release film 17. In this state, the sealing resin 13 is injected into the cavity 16 and the mold sealing is performed with the sealing resin 13.

[0016] Here, the height from the lower surface of the metal plate 1 to the upper end of the signal terminal 12 is affected by variations in the member sizes of the metal plate 1, the printed circuit board 2, the wiring pattern 6, and the signal terminal 12. However, in the present embodiment, the signal terminal 12 has a spring structure with elasticity in the vertical direction. This spring structure can absorb variations in the height of the members during mold encapsulation. Also, since the signal terminal 12 is a thin metal plate, the flow of the encapsulation resin 13 during mold encapsulation is good.

[0017] By the upper end of the signal terminal 12 sinking into the release film 17, the upper end of the signal terminal 12 is exposed from the upper surface of the encapsulation resin 13 after mold encapsulation. If there is no release film 17, the encapsulation resin 13 may enter the small gap between the upper mold 14 and the signal terminal 12, and there is a risk that the signal terminal 12 will not be exposed. The thickness of the release film 17 is about 50 μm, and after mold encapsulation, the signal terminal 12 protrudes several μm to a dozen or so μm from the upper surface of the encapsulation resin 13.

[0018] FIG. 5 is a cross-sectional view showing the system according to Embodiment 1. The semiconductor device 18 is the semiconductor device according to the above-described present embodiment. The heat sink 19 is joined to the metal plate 1 on the lower surface of the semiconductor device 18. A wiring board 20 is disposed on the upper surface side of the semiconductor device 18, and an antenna 21 is disposed above the wiring board 20. The signal terminal 12 on the upper surface of the semiconductor device 18 and the antenna 21 are connected by the wiring 22 of the wiring board 20.

[0019] Subsequently, the effects of the system of the present embodiment will be described in comparison with a comparative example. FIG. 6 is a cross-sectional view showing the system according to the comparative example. The semiconductor device 23 of the comparative example also performs signal input / output while dissipating heat from the lower surface. For this reason, signal input / output is performed using the wiring board 24 disposed on the lower surface side of the semiconductor device 23. For this reason, it is necessary to embed a metal plate 25 in the wiring board 24. Also, it is necessary to provide an electromagnetic shield 26 between the antenna 21 disposed on the upper surface side of the semiconductor device 23 and the semiconductor device 23.

[0020] In contrast, the semiconductor device 18 of the present embodiment performs signal input / output from the upper surface while exhausting heat from the lower surface. Since signal input / output is performed by the wiring board 20 disposed on the upper surface side of the semiconductor device 18, it is not necessary to embed the metal plate 25 in the wiring board 20. Further, since the heat sink 19 also functions as a shield, it is not necessary to provide the electromagnetic shield 26. As a result, the system of the present embodiment can be miniaturized as compared with the comparative example.

[0021] Embodiment 2 FIG. 7 is a cross-sectional view showing a semiconductor device according to Embodiment 2. The signal terminal 12 has a protrusion 12d provided on the upper surface of the upper plate 12c. The upper plate 12c is not exposed from the sealing resin 13, and the protrusion 12d is exposed from the upper surface of the sealing resin 13. By embedding the upper plate 12c inside the sealing resin 13 while exposing the protrusion 12d to secure contact, it is possible to prevent the signal terminal 12 from coming out of the sealing resin 13. Other configurations and effects are the same as those of Embodiment 1.

[0022] FIGS. 8, 10, and 11 are cross-sectional views showing the manufacturing process of the semiconductor device according to Embodiment 2. FIG. 9 is a top view showing the manufacturing process of the semiconductor device according to Embodiment 2. First, as shown in FIGS. 8 and 9, the printed circuit board 2 is disposed on the metal plate 1. The printed circuit board 2 has a plurality of device regions 27. The configuration of each device region 27 corresponds to the configuration of the printed circuit board 2 of Embodiment 1. In each device region 27, the semiconductor chip 9 is mounted on the upper surface of the metal plate 1 exposed through the opening 3, and the semiconductor chip 9 and the wiring pattern 4 are connected. In each device region 27, the signal terminal 12 is joined to the wiring pattern 6 on the upper surface of the printed circuit board 2.

[0023] The lower plates 12a of the signal terminals 12 in adjacent device regions 27 are connected to each other by the metal connection portion 12e. The upper plates 12c of the signal terminals 12 in adjacent device regions 27 are separated from each other. In each device region 27, a plurality of signal terminals 12 are respectively joined to a plurality of wiring patterns 6 arranged in a row and are connected to each other by the metal connection portion 12e.

[0024] FIG. 12 is a top view showing the signal terminal according to Embodiment 2. FIG. 13 is a side view showing the signal terminal according to Embodiment 2. FIG. 14 is a perspective view showing the signal terminal according to Embodiment 2. A pair of symmetric signal terminals 12 are connected to each other by a metal connecting portion 12e, and a plurality of such pairs are arranged side by side at regular intervals and connected to each other by the metal connecting portion 12e.

[0025] Next, as shown in FIG. 10, the metal plate 1, the printed circuit board 2, the semiconductor chip 9, and the signal terminal 12 are sandwiched from above and below by the upper mold 14 and the lower mold 15 and accommodated in the cavity 16. At this time, the protrusion 12d, which is the upper end portion of the signal terminal 12, is pressed against the upper mold 14. Since the signal terminal 12 has a spring structure with elasticity in the vertical direction, it can absorb the height variation of the members.

[0026] Next, as shown in FIG. 11, it is molded and sealed with the sealing resin 13. The molded printed circuit board 2 and the metal plate 1 are diced into each device region 27. At this time, the metal connecting portion 12e is cut to separate the signal terminals 12 of adjacent device regions 27 from each other, and to separate the plurality of signal terminals 12 of each device region 27 from each other.

[0027] In the present embodiment, a plurality of signal terminals 12 are connected to each other by the metal connecting portion 12e. Since the size of such an aggregate of a plurality of signal terminals 12 becomes large, the size of the conveying mechanism can also be increased. By making the aggregate of the plurality of signal terminals 12 self-supporting, the handleability is improved. Further, since the upper plates 12c of the plurality of adjacent signal terminals 12 are separated from each other, the signal terminals 12 are likely to bend and exhibit elasticity.

[0028] Embodiment 3 FIG. 15 is a cross-sectional view showing the semiconductor device according to Embodiment 3. The orientation of the Z-shaped thin metal plate of the signal terminal 12 is opposite to that of Embodiment 2. Other configurations and effects are the same as those of Embodiment 2.

[0029] Figs. 16, 18, and 19 are cross-sectional views showing the manufacturing process of the semiconductor device according to Embodiment 3. Fig. 17 is a top view showing the manufacturing process of the semiconductor device according to Embodiment 3.

[0030] First, as shown in Figs. 16 and 17, a printed circuit board 2 is placed on a metal plate 1. The printed circuit board 2 has a plurality of device regions 27. In each device region 27, a semiconductor chip 9 is mounted on the upper surface of the metal plate 1 exposed through an opening 3, and the semiconductor chip 9 is connected to a wiring pattern 4. In each device region 27, a signal terminal 12 is bonded to a wiring pattern 6 on the upper surface of the printed circuit board 2.

[0031] The upper plates 12c of the signal terminals 12 in adjacent device regions 27 are connected to each other by a metal connection part 12e. The lower plates 12a of the signal terminals 12 in adjacent device regions 27 are separated from each other. In each device region, a plurality of signal terminals 12 are respectively soldered to a plurality of wiring patterns 6 arranged in a row.

[0032] Fig. 20 is a top view showing the signal terminal according to Embodiment 3. Fig. 21 is a side view showing the signal terminal according to Embodiment 3. Fig. 22 is a perspective view showing the signal terminal according to Embodiment 3. A pair of left-right symmetric signal terminals 12 are connected to each other by a metal connection part 12e, and a plurality of such pairs are arranged side by side at a certain interval and connected to each other by the metal connection part 12e.

[0033] Next, as shown in Fig. 18, the metal plate 1, the printed circuit board 2, the semiconductor chip 9, and the signal terminal 12 are sandwiched from above and below by an upper mold 14 and a lower mold 15 and accommodated in a cavity 16. At this time, the upper end portion of the signal terminal 12 is pressed against the upper mold 14. Since the signal terminal 12 has a spring structure with elasticity in the vertical direction, it can absorb the height variation of the members.

[0034] Next, as shown in FIG. 19, it is molded and sealed with the sealing resin 13. The molded printed circuit board 2 and the metal plate 1 are diced into individual device regions 27. At this time, the metal connection portion 12e is cut to separate the signal terminals 12 of adjacent device regions 27 from each other, and to separate the plurality of signal terminals 12 of each device region 27 from each other.

[0035] In this embodiment, a plurality of signal terminals 12 are connected to each other by the metal connection portion 12e. Since the aggregate of such a plurality of signal terminals 12 is large in size, the size of the transfer mechanism can also be increased. By making the aggregate of the plurality of signal terminals 12 self-supporting, the handling property is improved. Further, since the upper plates 12c of the signal terminals 12 of adjacent device regions 27 are connected to each other by the metal connection portion 12e, it is easy to confirm from above whether the metal connection portion 12e has been cut during dicing.

[0036] Embodiment 4 FIG. 23 is a cross-sectional view showing a semiconductor device according to Embodiment 4. The signal terminals 12 are embedded in the resin block 28. The sealing resin 13 molds and seals the printed circuit board 2, the semiconductor chip 9, and the resin block 28. The sealing resin 13 is made of an epoxy resin having a dielectric constant of 4. The resin block 28 is made of LCP (liquid crystal polymer) having a dielectric constant of 3.5, PPS (polyphenylene sulfide) having a dielectric constant of 3.7, or PEE (polyphenylene ether) having a dielectric constant of 3.2. Since the resin block 28 and the sealing resin 13 are made of different materials, the dielectric constant around the signal terminals 12 can be adjusted according to the material of the resin block 28. Other configurations and effects are the same as those in Embodiment 2.

[0037] FIGS. 24, 26, and 27 are cross-sectional views showing the manufacturing process of the semiconductor device according to Embodiment 4. FIG. 25 is a top view showing the manufacturing process of the semiconductor device according to Embodiment 4. First, as shown in FIGS. 24 and 25, the signal terminals 12 are embedded in the resin block 28. The signal terminals 12 embedded in the resin block 28 are soldered to the wiring pattern 6 on the upper surface of the printed circuit board 2.

[0038] Next, as shown in FIG. 26, the metal plate 1, the printed circuit board 2, the semiconductor chip 9, the signal terminals 12, and the resin block 28 are sandwiched between the upper mold 14 and the lower mold 15 and accommodated in the cavity 16. At this time, the upper end portions of the signal terminals 12 are pressed against the upper mold 14.

[0039] Next, as shown in FIG. 27, it is molded and sealed with the encapsulating resin 13. The molded and sealed printed circuit board 2 and the metal plate 1 are diced into individual device regions 27. At this time, the metal connection portions 12e are cut to separate the signal terminals 12 of adjacent device regions 27 from each other and to separate the plurality of signal terminals 12 of each device region 27 from each other.

[0040] In the present embodiment, the signal terminals 12 are embedded in the resin block 28. The resin block 28 in which the signal terminals 12 are embedded has an increased area that can be handled compared to the signal terminals 12 alone, making it easier to handle, and it is also possible to carry it by suction.

[0041] Further, since the resin block 28 is softer than the encapsulating resin 13, the resin block 28 in which the signal terminals 12 are embedded also has elasticity in the vertical direction. Therefore, when sandwiched between the upper mold 14 and the lower mold 15, the resin block 28 can shrink together with the signal terminals 12 to absorb the height variation of the members.

[0042] Embodiment 5 FIG. 28 is a cross-sectional view showing a semiconductor device according to Embodiment 5. The direction of the Z-shaped metal thin plate of the signal terminals 12 is opposite to that of Embodiment 4. Other configurations and effects are the same as those of Embodiment 4.

[0043] FIG. 29 is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 5. Similar to Embodiment 4, the signal terminals 12 embedded in the resin block 28 are soldered to the wiring pattern 6 on the upper surface of the printed circuit board 2. Next, the metal plate 1, the printed circuit board 2, the semiconductor chip 9, the signal terminals 12, and the resin block 28 are sandwiched between the upper mold 14 and the lower mold 15 and accommodated in the cavity 16. Then, it is molded and sealed with the encapsulating resin 13. Other processes and effects are the same as those of Embodiment 4.

Description of Symbols

[0044] 1 Metal plate, 2 Printed circuit board, 3 Opening, 4, 5, 6 Wiring patterns, 9 Semiconductor chip, 12 Signal terminal, 12a Lower plate, 12b Inclined plate, 12c Upper plate, 12d Protrusion, 12e Metal connection part, 13 Encapsulating resin (encapsulant), 14 Upper mold, 15 Lower mold, 16 Cavity, 27 Device area, 28 Resin block (encapsulant)

Claims

1. A metal plate; a printed circuit board disposed on the upper surface of the metal plate, the printed circuit board having an opening exposing a portion of the upper surface of the metal plate and a wiring pattern; a semiconductor chip mounted on the upper surface of the metal plate in the opening and connected to the wiring pattern; a signal terminal joined to the wiring pattern on the upper surface of the printed circuit board; a sealing material that seals the printed circuit board, the semiconductor chip, and the signal terminals, an upper end portion of the signal terminal is exposed from an upper surface of the sealing material; The signal terminal has a spring structure having elasticity in the vertical direction, the spring structure is a metal sheet bent in two or more places; The metal sheet is folded to form a lower plate, an inclined plate, and an upper plate, the lower plate extends along an upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to a lower end of the inclined plate; the inclined plate extends obliquely upward with respect to an upper surface of the printed circuit board, The upper plate extends along the upper surface of the sealing material and is connected to an upper end of the inclined plate; The signal terminal has a protrusion provided on an upper surface of the upper plate, The semiconductor device according to claim 1, wherein the upper plate is not exposed from the sealing material, and the protrusion is exposed from an upper surface of the sealing material.

2. A metal plate, a printed circuit board disposed on the upper surface of the metal plate, the printed circuit board having an opening exposing a portion of the upper surface of the metal plate and a wiring pattern; a semiconductor chip mounted on the upper surface of the metal plate in the opening and connected to the wiring pattern; a signal terminal joined to the wiring pattern on the upper surface of the printed circuit board; a sealing material that seals the printed circuit board, the semiconductor chip, and the signal terminals, an upper end portion of the signal terminal is exposed from an upper surface of the sealing material; The signal terminal has a spring structure having elasticity in the vertical direction, the spring structure is a metal sheet bent in two or more places; The metal sheet is folded to form a lower plate, an inclined plate, and an upper plate, the lower plate extends along an upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to a lower end of the inclined plate; the inclined plate extends obliquely upward with respect to an upper surface of the printed circuit board, The upper plate extends along the upper surface of the sealing material and is connected to an upper end of the inclined plate; A semiconductor device, characterized in that a tip portion of the upper plate is bent downward.

3. the sealing material includes a resin block in which the signal terminals are embedded, and a sealing resin that mold-seals the printed circuit board, the semiconductor chip, and the resin block; 3. The semiconductor device according to claim 1, wherein the resin block and the sealing resin are made of different materials.

4. 4. The semiconductor device according to claim 3, wherein the resin block is softer than the sealing resin.

5. A step of placing a printed circuit board having a plurality of device regions having openings and wiring patterns on a metal plate; mounting a semiconductor chip on an upper surface of the metal plate exposed in the opening in each device region and connecting the semiconductor chip and the wiring pattern; bonding a signal terminal to the wiring pattern on the upper surface of the printed circuit board in each device region; a step of sandwiching the metal plate, the printed circuit board, the semiconductor chip, and the signal terminals between an upper mold and a lower mold, housing them in a cavity, and molding and sealing them with a sealing material; and cutting the mold-sealed printed circuit board and the metal plate into individual device regions by dicing; During molding, the upper end of the signal terminal is pressed against the upper mold, The signal terminal has a spring structure having elasticity in the vertical direction, the signal terminals joined to the wiring patterns of the adjacent device regions are connected to each other by metal connecting portions; cutting the metal interconnects during the dicing to separate the signal terminals of adjacent device regions from each other; The signal terminal is bent to form a lower plate, an inclined plate and an upper plate, the lower plate extends along an upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to a lower end of the inclined plate; the inclined plate extends obliquely upward with respect to an upper surface of the printed circuit board, The upper plate extends along the upper surface of the sealing material and is connected to an upper end of the inclined plate; The lower plates of the signal terminals of the adjacent device regions are connected to each other by the metal connecting portion, and the upper plates of the signal terminals of the adjacent device regions are separated from each other; A method for manufacturing a semiconductor device, wherein a tip portion of the upper plate is bent downward.

6. A method of manufacturing a printed circuit board, the printed circuit board having a plurality of device regions each having an opening and a wiring pattern, on a metal plate; mounting a semiconductor chip on an upper surface of the metal plate exposed in the opening in each device region and connecting the semiconductor chip and the wiring pattern; bonding a signal terminal to the wiring pattern on the upper surface of the printed circuit board in each device region; a step of sandwiching the metal plate, the printed circuit board, the semiconductor chip, and the signal terminals between an upper mold and a lower mold, housing them in a cavity, and molding and sealing them with a sealing material; and cutting the mold-sealed printed circuit board and the metal plate into individual device regions by dicing; During molding, the upper end of the signal terminal is pressed against the upper mold, The signal terminal has a spring structure having elasticity in the vertical direction, the signal terminals joined to the wiring patterns of the adjacent device regions are connected to each other by metal connecting portions; cutting the metal interconnects during the dicing to separate the signal terminals of adjacent device regions from each other; The signal terminal is bent to form a lower plate, an inclined plate and an upper plate, the lower plate extends along an upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to a lower end of the inclined plate; the inclined plate extends obliquely upward with respect to an upper surface of the printed circuit board, The upper plate extends along the upper surface of the sealing material and is connected to an upper end of the inclined plate; A method for manufacturing a semiconductor device, wherein the upper plates of the signal terminals in adjacent device regions are connected to each other by the metal connecting portion, and the lower plates of the signal terminals in adjacent device regions are separated from each other.

7. A method of manufacturing a printed circuit board having a plurality of device regions each having an opening and a wiring pattern, the method comprising: mounting a semiconductor chip on an upper surface of the metal plate exposed in the opening in each device region and connecting the semiconductor chip and the wiring pattern; bonding a signal terminal to the wiring pattern on the upper surface of the printed circuit board in each device region; a step of sandwiching the metal plate, the printed circuit board, the semiconductor chip, and the signal terminals between an upper mold and a lower mold, housing them in a cavity, and molding and sealing them with a sealing material; and cutting the mold-sealed printed circuit board and the metal plate into individual device regions by dicing; During molding, the upper end of the signal terminal is pressed against the upper mold, The signal terminal has a spring structure having elasticity in the vertical direction, the signal terminals joined to the wiring patterns of the adjacent device regions are connected to each other by metal connecting portions; cutting the metal interconnects during the dicing to separate the signal terminals of adjacent device regions from each other; The signal terminal is bent to form a lower plate, an inclined plate and an upper plate, the lower plate extends along an upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to a lower end of the inclined plate; the inclined plate extends obliquely upward with respect to an upper surface of the printed circuit board, The upper plate extends along the upper surface of the sealing material and is connected to an upper end of the inclined plate; The signal terminal has a protrusion provided on an upper surface of the upper plate, The method for manufacturing a semiconductor device, wherein the projection is pressed against the upper die during molding and sealing.

8. A plurality of the wiring patterns are provided in each device region, In each device region, a plurality of the signal terminals are respectively bonded to a plurality of the wiring patterns and are connected to each other by the metal connection parts; 8. The method for manufacturing a semiconductor device according to claim 5, wherein the metal connection portion is cut during the dicing to separate the plurality of signal terminals in each device region from each other.

9. the sealing material has a resin block made of different materials and a sealing resin; embedding the signal terminal in the resin block; 8. The method for manufacturing a semiconductor device according to claim 5, further comprising the steps of: joining the signal terminal embedded in the resin block to the wiring pattern on the upper surface of the printed circuit board; and molding and sealing the signal terminal with the sealing resin.

10. A method of manufacturing a printed circuit board, the printed circuit board having a plurality of device regions each having an opening and a wiring pattern, on a metal plate; mounting a semiconductor chip on an upper surface of the metal plate exposed in the opening in each device region and connecting the semiconductor chip and the wiring pattern; bonding a signal terminal to the wiring pattern on the upper surface of the printed circuit board in each device region; a step of sandwiching the metal plate, the printed circuit board, the semiconductor chip, and the signal terminals between an upper mold and a lower mold, housing them in a cavity, and molding and sealing them with a sealing material; and cutting the mold-sealed printed circuit board and the metal plate into individual device regions by dicing; During molding, the upper end of the signal terminal is pressed against the upper mold, The signal terminal has a spring structure having elasticity in the vertical direction, the signal terminals joined to the wiring patterns of the adjacent device regions are connected to each other by metal connecting portions; cutting the metal interconnects during the dicing to separate the signal terminals of adjacent device regions from each other; the sealing material has a resin block made of different materials and a sealing resin; embedding the signal terminal in the resin block; the signal terminal embedded in the resin block is joined to the wiring pattern on the upper surface of the printed circuit board, and the signal terminal is mold-sealed with the sealing resin; The method for manufacturing a semiconductor device, wherein the resin block is softer than the sealing material.

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