Mold coil

Abstract

To provide a mold coil which can inhibit deformation and displacement of a detection part of a sensor.SOLUTION: A mold coil includes: a coil; a sensor having a detection part 11 which detects a physical quantity of the mold coil; a coil cover which covers a periphery of the coil; and a coil mold resin 5 which integrates the oil with the sensor. The coil mold resin 5 has a gate G which is a mark formed by injection of the coil mold resin 5 during molding. The coil cover has a detection part support part 45 supporting the detection part 11. The detection part support part 45 and the gate G are arranged facing each other.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a molded coil molded together with a sensor.

Background Art

[0002] Coil components such as reactors are used in various applications such as OA equipment, solar power generation systems, and automobiles. The coil component is formed by winding a coil around the outer periphery of a core made of a magnetic material. Further, a resin member is provided between the core and the coil to insulate the core and the coil.

[0003] In recent years, molded coils molded with resin members have been used everywhere. For the molded coil, the coil is placed at a predetermined position in a mold, and resin is injected into the mold and solidified. In this way, a molded coil in which the inner peripheral surface and the outer peripheral surface of the coil are covered with a resin member is produced.

[0004] A sensor may be provided in the coil component. The sensor detects a physical quantity of the coil component, for example, temperature. The sensor includes a detection unit having an element that detects the physical quantity of the coil. When arranging the sensor in the molded sensor, the sensor may be covered with a resin member together with the coil and integrated during the molding process.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In mold molding, in order to fill the resin into the details, the resin is injected into the mold at a high injection pressure. Therefore, there were cases where the detection part of the sensor was deformed by the injection pressure or displaced from a predetermined position. If the sensor is deformed or displaced, the physical quantity of the coil component cannot be accurately detected, and in some cases, detection may become impossible.

[0007] The present invention has been made to solve the above problems, and an object thereof is to provide a mold coil capable of suppressing deformation and displacement of the detection part of the sensor.

Means for Solving the Problems

[0008] To achieve the above object, the mold coil of the present invention includes a coil, a sensor having a detection part for detecting the physical quantity of the mold coil, a coil cover covering the periphery of the coil, and a coil mold resin integrating the coil, the sensor, and the coil cover. The coil mold resin has a gate which is a mark of injecting the coil mold resin during mold molding, and the coil cover has a detection part support part for supporting the detection part. The detection unit support portion has a support surface that supports the end surface on the opposite side of the detection unit facing the gate. The gate is It faces the support surface and is disposed on the end surface on the coil cover side that covers the end surface in the axial direction of the coil in the coil molded resin. , and is characterized by.

Effects of the Invention

[0009] According to the present invention, a mold coil capable of suppressing deformation and displacement of the detection part of the sensor can be obtained.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0011] (Embodiment) The mold coil according to the embodiment will be described with reference to the drawings. FIG. 1 is a perspective view showing the overall configuration of the mold coil. In each drawing, for ease of understanding, the thickness, dimensions, positional relationship, ratio, shape, etc. may be emphasized and shown, and the present invention is not limited to those emphases.

[0012] The mold coil 10 is formed by coating the sensor 1 and the coil 3 with the coil mold resin 5 by mold molding. The sensor 1 is equipped with a sensor cover 2 for protecting it from the injection pressure during mold molding. Also, since the coating of the coil 3 may be damaged if the mold directly contacts it, a coil cover 4 is provided. That is, the mold coil 10 includes the sensor 1, the sensor cover 2, the coil 3, the coil cover 4, and the coil mold resin 5. The mold coil 10 is used as a component of a reactor as will be described later.

[0013] The sensor 1 detects a physical quantity related to the mold coil 10. The sensor 1 is, for example, a temperature sensor. The sensor 1 has a detection unit 11, a lead wire 12, and a connector 13.

[0014] The detection unit 11 detects a physical quantity related to the mold coil 10. In the present embodiment, as the detection unit 11, an element that detects the temperature of the mold coil 10, and for example, a thermistor can be used. The detection unit 11 is generally in the shape of a rectangular parallelepiped. The detection unit 11 is arranged between a pair of coils 3 provided.

[0015] The lead wire 12 has one end connected to the detection unit 11 and the other end connected to the connector 13. The lead wire 12 is composed of a metal wire and a coating portion that coats the metal wire. As the material of the metal wire, copper, nickel, aluminum, silver, gold, or a combination of two or more of these can be included. As the metal wire, a single wire or a stranded wire formed by combining a plurality of wires can be used. The coating portion coats the metal wire with an insulating member such as vinyl, silicone rubber, or fluororubber. Note that a part of the metal wire on the detection unit 11 side is not coated with the coating portion.

[0016] The connector 13 is a member that is connected to the connector of an external device. The connector 13 is configured to be detachable from the connector of the external device. The information detected by the detection unit 11 is transmitted to an external device connected to the connector 13 via the lead wire 12 and the connector 13.

[0017] The sensor cover 2 is a member that protects the sensor 1 and is disposed around the sensor 1. The sensor cover 2 is separate from the sensor 1 and is fixed to the sensor 1 by being attached to the sensor 1. That is, the sensor cover 2 and the sensor 1 are not integrated, and the sensor cover 2 is detachable from the sensor 1.

[0018] The sensor cover 2 is made of resin, and examples of the type of resin include epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate), etc. In particular, PPS is preferable. Since PPS has high heat resistance, it can prevent the sensor cover 2 from deforming due to the heat of the resin during mold molding, and can also suppress the deformation and displacement of the sensor 1 by the sensor cover 2.

[0019] The sensor cover 2 has a U-shaped cross-section with one side of a rectangle being an opening. The sensor 1 is accommodated in the internal space of the sensor cover 2 through this opening. The sensor cover 2 has a detection unit cover 21 that protects the detection unit 11 of the sensor 1 and a lead wire cover 22 that protects the lead wire 12.

[0020] The detection unit cover 21 only needs to be provided around at least a part of the detection unit 11. In this embodiment, the detection unit cover 21 is provided on a part of the detection unit 11 on the lead wire 12 side. In other words, the detection unit cover 21 does not cover the tip portion of the detection unit 11, that is, the periphery of the element portion. The internal space of the detection unit cover 21 is substantially the same size as the detection unit 11. By press-fitting the detection unit 11 into the detection unit cover 21, the detection unit cover 21 and the detection unit 11 are in close contact, and the sensor cover 2 is fixed to the detection unit 11.

[0021] The lead wire cover 22 only needs to be arranged around at least the portion of the lead wire 12 that is arranged in the mold when the sensor 1 and the coil 3 are molded with the coil molding resin 5. The lead wire cover 22 has a flange 23. The flange 23 protrudes in a direction orthogonal to the side wall from the outer peripheral surface of a pair of side walls of the lead wire cover 22.

[0022] The coil 3 is a wound body formed by winding a conductive member having an insulating coating such as an enamel coating in a cylindrical shape. The coil 3 is formed by winding in a spiral while shifting the winding position by one turn along the winding axis. The coil 3 has four flat surfaces and four curved surfaces formed alternately. The conductive member of the coil 3 is, for example, a rectangular wire, and is a spiral edgewise coil formed by winding the conductive member so that the wide surface of the conductive member extends in a direction orthogonal to the winding axis of the coil 3. However, the wire material and winding method of the coil 3 are not limited to the edgewise coil of the rectangular wire, and other forms may be used.

[0023] Two coils 3 are provided. Each coil 3 is arranged opposite to each other so that the winding axes are parallel. The two coils 3 are connected by a connecting wire 32 (see FIG. 6). A lead wire 31 extends from the coil 3, and the lead wire 31 is connected to one end of the bus bar 6. The other end of the bus bar 6 is connected to the terminal of an external device, and the coil 3 is energized via the bus bar 6.

[0024] FIG. 2 is a diagram showing a state in which a coil cover is attached to a coil. As shown in FIG. 2, a coil cover 4 is provided on the outer periphery of a coil 3. Since the coil 3 is formed by winding a conductive member, there may be variations in dimensions. Therefore, when performing mold molding, the mold is strongly pressed against the coil 3 to correct the dimensional variations of the coil 3. At this time, if the coil 3 is directly pressed by the mold, there is a risk of damaging the insulating coating of the conductive member. Therefore, the outer periphery of the coil 3 is covered with the coil cover 4 to protect the coil 3.

[0025] The coil cover 4 is made of resin, and examples of the resin type include epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate), and the like.

[0026] The coil cover 4 has an upper cover 41, a lower cover 42, and an annular cover 43. The up and down directions referred to here are the up and down directions when being accommodated in the mold. The upper cover 41 is a plate-like member and covers the upper surface of the coil 3.

[0027] The lower cover 42 is disposed on the lower surface of the coil 3. FIG. 3 is a perspective view showing the overall configuration of the lower cover. As shown in FIG. 3, the lower cover 42 has a lower support portion 421 and an annular plate 422. The lower support portion 421 and the annular plate 422 are connected integrally and continuously without a joint. The lower support portion 421 abuts against the curved surface on the lower surface side of the coil 3 and supports the coil 3.

[0028] The annular plate 422 extends orthogonally to the lower support portion 421 from the end of the lower support portion 421. The annular plate 422 covers the end face of the coil 3 orthogonal to the winding axis. An opening is formed in the annular plate 422 substantially the same as the inner circumference of the coil 3. The leg portion of the core is inserted into this opening when constituting the reactor. Note that the lower support portion 421 and the annular plate 422 are respectively provided for each coil 3.

[0029] The lower cover 42 further has a fixing portion 44 and a detection portion support portion 45. The fixing portion 44 and the detection portion support portion 45 are integrally formed by mold molding together with the lower support portion 421 and the annular plate 422. FIG. 4 is a view showing a state where the sensor cover 2 is fixed to the fixing portion 44. The fixing portion 44 fixes the sensor 1 with the sensor cover 2 attached. The fixing portion 44 extends outward from the upper end of the annular plate 422, that is, in a direction opposite to the coil 3, outside the mold coil 10. The fixing portion 44 is provided between the coils 3.

[0030] The fixing portion 44 has a placement portion 441 and side walls 442. The placement portion 441 is a flat member on which the lead wire cover 22 of the sensor cover 2 is placed. A pair of side walls 442 are provided and extend orthogonally to the placement portion 441 from both ends of the placement portion 441. The space between the pair of side walls 442 only needs to be large enough to accommodate the lead wire cover 22. The lead wire cover 22 is inserted into the fixing portion 44 from the opening of the lead wire cover 22, and the opening of the lead wire cover 22 is blocked by the placement portion 441. The placement portion 441 is provided with a protruding portion that protrudes toward the lead wire 12. When the lead wire cover 22 is inserted into the fixing portion 44, the protruding portion enters the inner surface of the lead wire cover 22, and the lead wire 12 is accommodated in the space defined by the inner surface of the lead wire cover 22 and the protruding portion.

[0031] The side wall 442 is provided with a notch 46. The notch 46 is formed by notching the side wall 442 from the extending tip of the side wall toward the placement portion 441. The flange 23 of the lead wire cover 22 is accommodated in this notch 46. The depth of the notch 46 only needs to be large enough to accommodate the flange 23.

[0032] The detection unit support part 45 is provided between the three coils 3. FIG. 5 is an enlarged view of the detection unit support part 45. FIG. 6 is a cross-sectional view showing a state in which the detection unit support part 45 supports the detection unit 11. The detection unit support part 45 is a plate-like member extending along the vertical direction from the lower support part 421 between the three coils 3. As shown in FIG. 6, the detection unit support part 45 holds the detection unit 11. That is, the detection unit support part 45 has a support surface 451 for supporting the detection unit 11.

[0033] As shown in FIG. 6, a gap S is provided between the detection unit support part 45 and the annular plate 422. This is provided to accommodate the connecting wire 32 of the coil 3. Therefore, when the coil 3 is not a connecting coil, it is preferable that the detection unit support part 45 is also connected to the annular plate 422. By configuring in this way, the strength of the detection unit support part 45 can be increased.

[0034] The support surface 451 is arranged to face the gate G into which the coil mold resin 5 is injected during the mold forming. The term "opposite" here means that it is sufficient if the support surface 451, the gate G, and the support surface 451 are in a positional relationship where the coil mold resin 5 injected from the gate G comes straight toward the support surface 451.

[0035] The support surface 451 is at the highest position on the annular plate 422 side and is an inclined surface extending downward therefrom. In the present embodiment, a step is formed on the support surface 451 around the tip of the detection unit cover 21, but this step is not an essential configuration. That is, the support surface 451 may be a flat inclined surface without a step formed. The inclination angle of the support surface 451 is preferably 45 degrees to 90 degrees, and in the present embodiment, it is 45 degrees. Here, the 90 degrees means that the support surface 451 faces the gate G, that is, it is parallel to the vertical direction when housed in the mold. That is, the support surface 451 does not have to be an inclined surface.

[0036] The support surface 451 supports the end surface on the side opposite to the end surfaces of the detection unit 11 and the detection unit cover 21 facing the gate G. In other words, the support surface 451 supports only one side of the detection unit 11 and the detection unit cover 21. When the lead wire cover 22 is fixed to the fixing portion 44, the support surface 451 is in contact with the detection unit 11 and the detection unit cover 21. The support surface 451 extends from the boundary portion with the lead wire 12 to the tip of the detection unit 11 where the element is provided. That is, the support surface 451 supports the entire one side of the detection unit 11.

[0037] Note that there may be a slight gap between the support surface 451 and the detection unit 11 and the detection unit cover 21. This gap is sized such that when the detection unit 11 and the detection unit cover 21 move due to the injection pressure during mold forming, they can come into contact, preventing large misalignments.

[0038] As shown in FIG. 2, the annular cover 43 covers the end surface of the coil 3 orthogonal to the winding shaft on the side opposite to the annular plate 422 of the lower cover 42. The annular cover 43 has an opening substantially the same as the inner circumference of the coil 3, and covers the end surface of the coil 3 so that this opening overlaps the inner circumference of the coil 3. The annular cover 43 has a plate-like portion extending to the inner circumference of the coil 3. The inner circumferential surface of the coil 3 is supported by this plate-like portion.

[0039] As shown in FIG. 1, the coil mold resin 5 coats the sensor 1 with the sensor cover 2 attached and the coil 3 with resin, integrating the sensor 1 and the coil 3. Here, the bus bar 6 is also integrated with the sensor 1 and the coil 3. The coil mold resin 5 has a concave portion 51 that fits with a convex portion of a mold core described later. The concave portion 51 is provided at the upper corner portion of the end surface orthogonal to the winding shaft.

[0040] Examples of the types of resin constituting the coil mold resin 5 include, for example, epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate), and the like. In particular, it is desirable to use a resin with high thermal conductivity. By using a resin with high thermal conductivity, the heat of the coil 3 can be transferred to the outside.

[0041] The coil mold resin 5 has a gate G. The gate G is an injection mark where the resin is injected during mold molding. The gate G is provided on the end face facing the support surface 451 of the detection unit support 45. That is, the gate G is formed between the coils 3 on the annular cover 43 side. There are no components of the mold coil 10 between this gate G and the support surface 451. Therefore, the coil mold resin 5 injected from this gate G is injected toward the support surface 451. In addition, the gate G is also provided not only between the coils 3 but also at the lower part of each recess 51 on the annular cover 43 side. When a plurality of gates G are provided, it is sufficient if one of them is in an opposing relationship with the support surface 451.

[0042] By combining the above mold coil 10 with a pair of mold cores, a reactor is formed. A reactor is an electromagnetic component that converts electrical energy into magnetic energy for storage and release, and is used in various applications such as OA equipment, solar power generation systems, and automobiles.

[0043] The mold core is produced by molding the core with a core mold resin. As the core, a powder compact core, a ferrite core, a laminated steel plate, a metal composite core, or the like can be used. A metal composite core is a magnetic material in which magnetic powder and resin are kneaded and the resin is cured.

[0044] The core consists of a U-shaped core member having a pair of legs and a yoke portion connecting the pair of legs. Two U-shaped core members are provided and joined together with an adhesive at their legs to form an annular shape.

[0045] The core mold resin covers at least a part of the surface of the core. As the type of resin used as the core mold resin, the same resin as the coil mold resin 5 can be used. The core mold resin has a convex portion at a position corresponding to the concave portion 51 of the mold coil 10. The convex portion protrudes toward the mold coil 10. The convex portion protrudes in a shape corresponding to the recessed shape of the concave portion 51, and when the convex portion fits into the concave portion 51, the mold core is held and fixed to the mold coil 10.

[0046] (Molding) Next, the molding for manufacturing the mold coil 10 will be described. First, the coil 3 is placed on the lower cover 42, the annular cover 43 and the upper cover 41 are attached, and the periphery of the coil 3 is covered with the upper cover 41, the lower cover 42, and the annular cover 43. Then, the sensor 1 with the sensor cover 2 attached is fixed to the fixing portion 44. At this time, the detection portion 11 and the detection portion cover 21 are in contact with the support surface 451 of the detection portion support portion 45. And this assembly is accommodated in a mold.

[0047] After the assembly is accommodated in the mold, the coil mold resin 5 is injected into the mold from the position of the gate G. The coil mold resin 5 injected from the gate G located between the coils 3 is ejected toward the detection portion 11 and the detection portion cover 21. In particular, since there is no constituent member of the mold coil 10 that obstructs between the gate G and the support surface 451, the coil mold resin 5 comes toward the detection portion 11 without being decompressed. Therefore, there is a risk that the detection portion 11 may be deformed or the position may be displaced.

[0048] However, in the present embodiment, the support surface 451 is provided at a position facing the gate G, and the detection portion 11 and the detection portion cover 21 are in contact with and supported by the support surface 451. Therefore, deformation of the detection portion 11 and displacement of the position are suppressed.

[0049] (Effect) As described above, the mold coil 10 of the present embodiment includes a coil 3, a sensor 1 having a detection unit 11 that detects a physical quantity of the mold coil 10, a coil cover 4 that covers the periphery of the coil 3, and a coil mold resin 5 that integrates the coil 3 and the sensor 1. The coil mold resin 5 has a gate G that is an injection mark formed by injecting the coil mold resin 5 during mold molding. The coil cover 4 has a lower cover 42 disposed on the lower surface of the coil 3, and the lower cover 42 has a detection unit support portion 45 that supports the detection unit 11. The detection unit support portion 45 and the gate G are disposed opposite to each other.

[0050] Accordingly, even when the coil mold resin 5 is injected toward the detection unit 11 during mold molding, the detection unit 11 is supported by the detection unit support portion 45. Therefore, deformation and displacement of the detection unit 11 are suppressed, and the sensor 1 can accurately detect the temperature of the mold coil 10.

[0051] The detection unit support portion 45 has only a support surface 451 that supports the end surface on the opposite side of the detection unit 11 facing the gate G. In this way, there is only one support surface 451 around the detection unit 11, and the other end surfaces are not covered by the detection unit support portion 45. For example, if the detection unit support portion 45 is provided so as to cover the entire periphery of the detection unit 11, the detection unit support portion 45 is interposed between the detection unit 11 and the coil 3, and thus the temperature detection accuracy may deteriorate. Therefore, by making the support surface 451 only on one surface of the detection unit 11, deformation and displacement of the detection unit 11 can be suppressed, and the temperature of the mold coil 10 can be detected more accurately.

[0052] The sensor 1 further includes a sensor cover 2 that covers the periphery of the sensor 1, and the sensor 1 further includes a connector 13 that connects to an external device and a lead wire 12 that connects the detection unit 11 and the connector 13. The sensor cover 2 has a lead wire cover 22 that covers at least a part of the lead wire 12, and the lead wire cover 22 has a flange 23 that is fitted to a fixing portion 44 of the coil cover 4. The sensor 1 and the sensor cover 2 are fixed by fitting the flange 23 to the fixing portion 44 of the coil cover 4 before mold molding.

[0053] Since the detection unit 11 is disposed opposite to the gate G, if the sensor 1 and the sensor cover 2 are fixed around the detection unit 11, when mold-molding, the coil mold resin 5 will directly hit the fixed position, the fixed position may be damaged, and the position of the sensor 1 may shift. Therefore, as in this configuration, a flange 23 is provided on the lead wire cover 22 away from the detection unit 11, and by fixing with this flange 23 and the fixing portion 44, the direct hit of the coil mold resin 5 can be avoided, and it is possible to prevent the fixed position from being damaged by the injection pressure during mold molding. Also, since there is no member around the detection unit 11 that becomes a barrier to the heat transfer from the coil 3, the accuracy of the temperature detection of the mold coil 10 is improved.

[0054] The support surface 451 supports the detection unit 11 from the boundary portion between the detection unit 11 and the lead wire 12 to the tip of the detection unit 11. In this way, the support surface 451 supports the entire one surface of the detection unit 11. Thereby, the detection unit 11 can be supported more firmly, and even if the injection pressure during mold molding is large, deformation and displacement of the detection unit 11 can be suppressed.

[0055] The lower cover 42 is integrally molded with the detection unit support portion 45. For example, when the detection unit support portion 45 is separate from the lower cover 42 and joined with an adhesive or the like, there is a risk that the detection unit support portion 45 may be peeled off by the injection pressure during mold molding. Also, an operation such as an adhesion process is required. Therefore, by integrally molding the detection unit support portion 45 with the lower cover 42, the strength of the detection unit support portion 45 is increased and the workability is improved.

[0056] (Other embodiments) In this specification, embodiments according to the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. The above-described embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. Embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalent scope thereof.

[0057] In this embodiment, the sensor cover 2 is separate from the sensor 1 and is attached to the sensor 1, but it is not limited to this. The resin constituting the sensor cover 2 may be used for injection molding so that the sensor 1 and the sensor cover 2 are integrally molded.

[0058] Further, the sensor cover 2 may only have the lead wire cover 22 having the flange 23 fitted to the fixing portion 44, and the detection portion cover 21 may not be provided. That is, the detection portion 11 may not be covered by the sensor cover 2. Furthermore, the sensor 1 may not be covered by the sensor cover 2.

[0059] In this embodiment, the support surface 451 extends from the boundary portion between the detection portion 11 and the lead wire 12 to the tip of the detection portion 11 where the element is provided, and supports the entire one surface of the detection portion 11. However, the support surface 451 may be configured to support only the tip portion (the portion having the element) of the detection portion 11. If the deformation and displacement of the tip portion of the detection portion 11 can be suppressed, the detection accuracy of the sensor can be improved. Also, compared to supporting the entire one surface of the detection portion 11, the amount of resin constituting the detection portion support portion 45 can be reduced, resulting in cost reduction. Note that the detection portion support portion 451 does not necessarily have to be provided on the lower cover 42, and if there is the coil cover 4, for example, it may be provided on the upper cover 41.

[0060] In this embodiment, the gate G is formed between the coils 3 on the annular cover 43 side, but it is a position facing the support surface 451 and may be formed between the coils 3 on the upper surface of the coil 3. That is, the coil mold resin 5 may be injected from the upper surface of the coil 3. In particular, since the inclination angle of the support surface 451 is 45 degrees, the detection portion 11 can be supported by the support surface 451 without changing the configuration of the support surface 451.

Explanation of Reference Numerals

[0061] 10 Molded Coil 1 Sensor 11 Detection Portion 12 Lead Wire 13 Connector 2 Sensor Cover 21 Detection Unit Cover 22 Lead Wire Cover 23 Flange 3 Coil 31 Lead-Out Wire 32 Connecting Wire 4 Coil Cover 41 Upper Cover 42 Lower Cover 421 Lower Support Part 422 Annular Part 43 Annular Cover 44 Fixing Part 441 Placing Part 442 Side Wall 45 Detection Unit Support Part 451 Support Surface 46 Notch 5 Coil Molded Resin 51 Recess 6 Bus Bar G Gate

Claims

1. A coil, A sensor having a detection unit that detects a physical quantity of the mold coil, A coil cover that covers the periphery of the coil, A coil molding resin that integrates the coil, the sensor, and the coil cover, and comprising: The coil molding resin has a gate that is a mark left by injecting the coil molding resin during mold molding, The coil cover has a detection unit support portion that supports the detection unit, The detection unit support portion has a support surface that supports the end surface on the opposite side of the detection unit facing the gate, The gate faces the support surface and is disposed on the end surface on the coil cover side that covers the end surface in the axial direction of the coil in the coil molding resin. A mold coil characterized by the above.

2. The detection unit support portion has only the support surface, The mold coil according to claim 1, characterized by the above.

3. Further comprising a sensor cover that covers the periphery of the sensor, The sensor has a connector for connecting to an external device, and a lead wire that connects the detection unit and the connector, and further has: The sensor cover has a lead wire cover that covers at least a part of the lead wire, The lead wire cover has a flange that is fitted to the coil cover, The sensor and the sensor cover are fixed by fitting the flange to the coil cover before mold molding. The mold coil according to claim 1 or 2, characterized by the above.

4. The support surface supports the detection part from the boundary part between the detection part and the lead wire to the tip of the detection part. The molded coil according to claim 2, characterized in that.

5. The support surface supports only the tip portion of the detection part where the element is provided. The molded coil according to claim 2, characterized in that.

6. The coil cover is integrally molded with the detection part support part. The molded coil according to claim 1 or 2, characterized in that.

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