Compatibilized high heat polymer composition

Abstract

A compatibilizing composition comprising a polyimide and a compatibilized polyarylene sulfide composition comprising a melt blend of an epoxy novolac resin and a polyarylene sulfide, wherein the compatibilizing composition is free of polyphenylene sulfone.

Description

Technical Field

[0001] (Cross - reference to related applications) This application claims priority and the benefit thereof to European Patent Application No. EP19208408.5, filed on November 11, 2019, the entire content of which is incorporated herein by reference in its entirety.

[0002] The present disclosure relates to compatibilized epoxy compositions and methods for producing compatibilized epoxy compositions.

Background Art

[0003] The development of thermoplastic mixtures containing semi - crystalline materials and amorphous materials that exhibit chemical resistance and maintain good mechanical properties even at high temperatures has long been of interest. Many semi - crystalline polymer mixtures exhibit excellent chemical resistance. However, when an amorphous material is added to maintain high - temperature properties, the polymer mixture becomes incompatible and difficult to blend without the addition of fillers or additives such as glass, talc, mica, etc. Therefore, there has been little reporting on the addition of amorphous materials. When a compatible resin mixture without fillers is desired, it is often necessary to add a small amount of another component or compatibilizer so that the two polymers mix well. The additional component can promote bond formation between different materials. Since an effective compatibilizer for one polymer mixture may be ineffective for another, and it is greatly affected by the chemical properties and inherent functions of the mixing molecules and their interactions, it is considered difficult to identify an appropriate compatibilizer.

[0004] Polyetherimide is an amorphous polyimide that can be used in various manufacturing processes for manufacturing various articles and is suitable for techniques such as injection molding, extrusion, and thermoforming. Polyetherimide has high strength, toughness, heat resistance, and modulus of elasticity. Polyarylene sulfides such as polyphenylene sulfide are semi - crystalline thermoplastic substances with good mechanical properties, chemical resistance, and flame retardancy.

[0005] In order to take advantage of the respective characteristics and advantages of polyetherimide and polyphenylene sulfide, attempts have been made to create compositions incorporating these two polymers. However, when these amorphous and semi-crystalline polymers are combined, an immiscible mixture with separated domains is formed.

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] Accordingly, there is a need for a compatibilized composition comprising a polyimide such as polyetherimide and a polyarylene sulfide such as polyphenylene sulfide.

MEANS FOR SOLVING THE PROBLEMS

[0007] What is presented is a compatibilized composition comprising a polyimide and a compatibilized polyarylene sulfide composition comprising a melt mixture of an epoxy novolac resin and a polyarylene sulfide, the compatibilized composition not containing polyphenylene sulfone (also known as PPSU).

[0008] What is presented is further a method for producing a compatibilized composition, comprising a step of melt-mixing an epoxy novolac resin and a polyarylene sulfide to produce a compatibilized polyarylene sulfide composition, and a step of melt-mixing the compatibilized polyarylene sulfide composition and a polyimide to produce a compatibilized composition, preferably, the temperature of the step of melt-mixing to produce the compatibilized composition is from 250 to 360 °C.

[0009] What is presented is further an article comprising this compatibilized composition, preferably, the article is a molded article.

[0010] Examples of the above and other features are shown in the following figures and detailed description.

[0011] The following drawings are representative embodiments of the present disclosure.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Modes for Carrying Out the Invention

[0013] The inventors of the present invention have previously melt - mixed polyarylene sulfide with epoxy novolac resin to act as a compatibilizer between polyimide (such as polyetherimide, poly(sulfone etherimide), etc.) and polyarylene sulfide (such as polyphenylene sulfide, etc.). Beneficially, it has been discovered that a compatibilized composition containing polyimide and polyarylene sulfide can be prepared. This compatibilized composition can achieve a higher heat deflection temperature, tensile modulus, and elongation at break, and can improve the melt volume flow rate. Previously, without preparing a compatibilizer in a separate process, instead, when polyarylene sulfide, polyimide, and epoxy novolac resin are melt - mixed together, these improved properties cannot be obtained. Furthermore, the inventors of the present invention have discovered that these improved properties can be obtained even if the compatibilized composition does not contain polyphenylene sulfone. Polyphenylene sulfone (also known as "PPSU") is a poly(arylene ether sulfone) containing structural units represented by the following structural formula, for example, at least 60% by mass, at least 75% by mass, or at least 85% by mass.

Chemical formula

[0014] Accordingly, one aspect of the present disclosure is a compatibilized composition comprising a polyimide and a compatibilized polyarylene sulfide composition comprising a melt mixture of an epoxy novolac resin and a polyarylene sulfide. Note that a composition containing polyarylene sulfide and epoxy novolac resin is melt - mixed to separately prepare a compatibilized polyarylene sulfide composition. When the obtained compatibilized polyarylene sulfide composition is then admixed with polyimide, a compatibilized composition can be produced.

[0015] The polyimide contains more than 1, for example, 5 to 1000, 5 to 500, or 10 to 100, structural units represented by the structural formula (1). [Chemical formula] (1) In the formula, each V is the same or different and is a substituted or unsubstituted tetravalent C 4~40 hydrocarbon group, for example, a substituted or unsubstituted C 6~20 aromatic hydrocarbon group, substituted or unsubstituted, branched or linear, saturated or unsaturated C 2~20 aliphatic group, or a substituted or unsubstituted C 4~8 cycloaliphatic group, particularly a substituted or unsubstituted C 6~20 aromatic hydrocarbon group. Examples of the aromatic hydrocarbon group include those represented by the following structural formula. [Chemical formula] In the formula, W is -O-, -S-, -C(O)-, -SO2-, -SO-, C 1~18 hydrocarbon group (which can be cyclic, acyclic, aromatic, or non-aromatic), -P(R a )(=O)- (wherein R a is C 1~8 alkyl or C 6~12 aryl), -C y H 2y - (wherein y is an integer from 1 to 5) or a halogenated derivative thereof (such as a perfluoroalkylene group), or a group represented by the formula -O-Z-O- as described in the later structural formula (3).

[0016] Each R in the structural formula (1) is the same or different and is a substituted or unsubstituted divalent organic group (C 6~20 aromatic hydrocarbon group or a halogenated derivative thereof, branched or linear C 2~20 alkylene group or a halogenated derivative thereof, C 3~8 cycloalkylene group or a halogenated derivative thereof, etc.), particularly a divalent group represented by the structural formula (2). [Chemical formula] (2) In the formula, Q 1 is -O-, -S-, -C(O)-, -SO2-, -SO-, -P(R a )(=O)-(wherein R a is C 1~8 alkyl or C 6~12 aryl), -C y H 2y -(wherein y is an integer from 1 to 5) or a halogenated derivative thereof (such as a perfluoroalkylene group), or -(C6H 10 ) z -(wherein z is an integer from 1 to 4). In certain embodiments, R is m-phenylene, p-phenylene, or diaryl sulfone.

[0017] The polyetherimide is a polyimide containing more than 1, for example, 10 to 1000 or 10 to 500, structural units represented by structural formula (3). [Chemical formula] (3) In the formula, each R is the same or different and is the same as described in structural formula (1). The polyetherimide may be a poly(sulfone ether imide). In the poly(sulfone ether imide) of the present disclosure, at least a part of the group R in structural formula (3) is a sulfone group (-SO2-).

[0018] Furthermore, in structural formula (3), T is -O- or a group represented by the formula -O-Z-O-, and the divalent bond of the -O- or -O-Z-O- group is at the 3,3′, 3,4′, 4,3′, or 4,4′ position. The group Z in -O-Z-O- of structural formula (3) is a substituted or unsubstituted divalent organic group and is an aromatic C 6~24 monocyclic or polycyclic group (optionally, under the condition that the valence of Z is not exceeded, 1 to 6 C 1~8It can be (substituted with an alkyl group, 1 to 8 halogen atoms, or a combination thereof). Examples of the group Z include groups derived from the dihydroxy compound represented by the structural formula (4).

Chemical formula

Chemical formula

[0019] In one aspect, R in Structural Formula (3) is m-phenylene or p-phenylene, and T is -O-Z-O- (wherein Z is a divalent group represented by Structural Formula (4a)). Alternatively, R is m-phenylene or p-phenylene, and T is -O-Z-O- (wherein Z is a divalent group represented by Structural Formula (4a) and Q is 2,2-isopropylidene).

[0020] In some aspects, the polyetherimide may be a copolymer, for example, a polyetherimide sulfone copolymer containing structural units represented by Structural Formula (1). At this time, at least 50 mol% of the R groups are those represented by Structural Formula (2) (wherein Q 1 is -SO2-), and the remaining R groups are independently p-phenylene or m-phenylene, or a combination thereof, and Z is 2,2'-(4-phenylene)isopropylidene.

[0021] Alternatively, the polyetherimide copolymer optionally contains additional structural imide units, for example, imide units represented by Structural Formula (1). At this time, R and V are the same as those described in Structural Formula (1), and for example, V is represented by the following structural formula.

Chemical Formula

[0022] Polyimides and polyetherimides can be prepared by any method well known to those skilled in the art. For example, an aromatic bis(ether anhydride) represented by structural formula (5a) or structural formula (5b)

Chemical formula

Chemical formula

[0023] Specific examples of the bis(anhydride) include 3,3-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride, 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride, 4,4′-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride, 4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfide dianhydride, 4,4′-bis(2,3-dicarboxyphenoxy)benzophenone dianhydride, 4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl-2,2-propane dianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl ether dianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride, 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)benzophenone dianhydride, and 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride, and further various combinations thereof.

[0024] Examples of organic diamines include hexamethylenediamine, polymethylated 1,6-n-hexanediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, 1,12-dodecanediamine, 1,18-octadecanediamine, 3-methylheptamethylenediamine, 4,4-dimethylheptamethylenediamine, 4-methylnonamethylenediamine, 5-methylnonamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,5-dimethylheptamethylenediamine, 2,2-dimethylpropylenediamine, N-methyl-bis(3-aminopropyl)amine, 3-methoxyhexamethylenediamine, 1,2-bis(3-aminopropoxy)ethane, bis(3-aminopropyl)sulfide, 1,4-cyclohexanediamine, bis(4-aminocyclohexyl)methane, m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, 2,6-diaminotoluene, m-xylylenediamine, p-xylylenediamine, 2-methyl-4,6-diethyl-1,3-phenylenediamine, 5-methyl-4,6-diethyl-1,3-phenylenediamine, benzidine, 3,3′-dimethylbenzidine, 3,3′-dimethoxybenzidine, 1,5-diaminonaphthalene, bis(4-aminophenyl)methane, bis(2-chloro-4-amino-3,5-diethylphenyl)methane, bis(4-aminophenyl)propane, 2,4-bis(p-amino-t-butyl)toluene, bis(p-amino-t-butylphenyl)ether, bis(p-methyl-o-aminophenyl)benzene, bis(p-methyl-o-aminopentyl)benzene, 1,3-diamino-4-isopropylbenzene, bis(4-aminophenyl)sulfide, bis(4-aminophenyl)sulfone (also known as 4,4′-diaminodiphenylsulfone (DDS)), and bis(4-aminophenyl)ether. Positional isomers of the aforementioned compounds can also be used. Furthermore, combinations of these compounds can also be used. In some embodiments, the organic diamine is m-phenylenediamine, p-phenylenediamine, 4,4′-diaminodiphenylsulfone, or a combination thereof.

[0025] Poly(ether imide) may also be a copolymer containing polyether imide units represented by structural formula (1) and siloxane blocks represented by structural formula (7). [Chemical formula] (7) In the formula, the average value of E is from 2 to 100, from 2 to 31, from 5 to 75, from 5 to 60, from 5 to 15, or from 15 to 40, and each R′ is independently a C 1~13 monovalent hydrocarbyl group. For example, each R′ is independently a C 1~13 alkyl group, C 1~13 alkoxy group, C 2~13 alkenyl group, C 2~13 alkenyloxy group, C 3~6 cycloalkyl group, C 3~6 cycloalkoxy group, C 6~14 aryl group, C 6~10 aryloxy group, C 7~13 arylalkyl group, C 7~13 arylalkoxy group, C 7~13 alkylaryl group, or C 7~13 alkylaryloxy group. The aforementioned groups may be fully or partially halogenated with fluorine, chlorine, bromine, or iodine, or a combination thereof. In one aspect, bromine or chlorine is absent, and in another aspect, halogen is absent. Combinations of the aforementioned R groups may be used within the same copolymer. In one aspect, the polysiloxane block contains the R′ group with the lowest hydrocarbon content. In a specific aspect, the R′ group with the lowest hydrocarbon content is a methyl group.

[0026] Poly(siloxane-ether imide) can be produced by polymerizing an aromatic bis(ether anhydride) of structural formula (5), a diamine component containing the aforementioned organic diamine (6) or a combination of diamines, and a polysiloxane diamine represented by structural formula (8). [Chemical formula] (8) In the formula, R′ and E are the same as those described in Structural Formula (7), and R 4 is, independently of each other, a C2-C 20 hydrocarbon, particularly a C2-C 20 arylene, alkylene, or arylenealkylene group. In certain embodiments, R 4 is a C2-C 20 alkylene group, particularly a C2-C 10 alkylene group (such as propylene), and the average value of E is from 5 to 100, from 5 to 75, from 5 to 60, from 5 to 15, or from 15 to 40. The method for producing the polysiloxanediamine of Structural Formula (10) is well known in the art.

[0027] In some poly(siloxane-etherimide)s, the diamine component can contain, for example, from 10 to 90 mol%, from 20 to 50 mol%, or from 25 to 40 mol% of polysiloxanediamine (8) and from 10 to 90 mol%, from 50 to 80 mol%, or from 60 to 75 mol% of diamine (6), as described in U.S. Patent No. 4,404,350. Physically mixing the diamine components before reacting with the dianhydride can produce a substantially random copolymer. Alternatively, (6) and (8) can be selectively reacted with an aromatic bis(ether anhydride) (5) to form polyimide blocks, and then these can be reacted together to produce block or alternating copolymers. In this way, poly(siloxane-imide) copolymers can be made into block, random, or graft copolymers. In certain embodiments, the copolymer is a block copolymer.

[0028] Specific examples of poly(siloxane-etherimide) are described in U.S. Patent No. 4,404,350, U.S. Patent No. 4,808,686, and U.S. Patent No. 4,690,997. In certain embodiments, the poly(siloxane-etherimide) contains units represented by Structural Formula (9).

Chemical Formula

[0029] The relative amounts of the polysiloxane units and the ether imide units in the poly(siloxane-ether imide) vary depending on the desired properties and are selected using the guidelines presented herein. Specifically, as described above, a block or graft poly(siloxane-ether imide) copolymer is selected such that E has a certain average value, and an amount is selected and used such that the polysiloxane units in the composition are at the desired mass %. In one aspect, the poly(siloxane-ether imide) contains from 10 to 50 mass %, from 10 to 40 mass %, or from 20 to 35 mass % of polysiloxane units based on the total mass of the poly(siloxane-ether imide).

[0030] The polyimide and polyether imide (including poly(sulfone ether imide)) can have a melt index of from 0.1 to 10 grams per minute (g / min) in a measurement using a load of 6.7 kilograms (kg) at 340 to 370 °C in accordance with American Society for Testing and Materials (ASTM) D1238. In some aspects, the polyether imide polymer has a mass average molecular weight (M w ) of from 1,000 to 150,000 grams per mole (g / mol) as measured by gel permeation chromatography using a polystyrene standard. In some aspects, the polyether imide has an M wIt has. Such polyetherimide polymers generally have an intrinsic viscosity greater than 0.2 deciliters / gram (dl / g), more specifically from 0.35 to 0.7 dl / g, as measured in m-cresol at 25°C.

[0031] The amount of polyimide (such as polyetherimide or poly(sulfone ether imide)) can be from 10 to 90% by mass based on the total mass of the compatibilized composition. For example, the amount of polyimide can be from 20 to 80% by mass, desirably from 30 to 70% by mass, based on the total mass of the compatibilized composition.

[0032] In addition to the polyimide (such as polyetherimide or poly(sulfone ether imide)), the compatibilized composition further comprises a compatibilized polyarylene sulfide composition. The compatibilized polyarylene sulfide composition includes a mixture or composition containing an epoxy novolac resin and a polyarylene sulfide, which are separately melt-mixed.

[0033] Polyarylene sulfide (hereinafter referred to as "PPS") is derived from known polymers containing arylene groups separated by sulfur atoms. Desirable poly(arylene sulfide) resins include various poly(phenylene sulfide), such as poly(p-phenylene sulfide) and substituted poly(phenylene sulfide). The PPS polymer contains at least 70 mol%, desirably at least 90 mol%, of the repeating structural unit represented by the structural formula (10).

Chemical formula

Chemical formula

[0034] PPS can be a linear or branched homopolymer or copolymer. Linear PPS containing at least 70 mol% of the repeating unit of structural formula (7) has a high crystallinity and is excellent in heat resistance, chemical resistance, and mechanical strength.

[0035] PPS can be prepared using methods known in the art. For example, the manufacturing process of polyarylene sulfide can include a step of reacting a substance that generates hydrosulfide ions, such as an alkali metal sulfide, with a dihalobenzene in an organic amide solvent. PPS is commercially available. For example, FORTRON polyphenylene sulfide is available from Celanese.

[0036] The alkali metal sulfide can be, for example, lithium sulfide, sodium sulfide, potassium sulfide, rubidium sulfide, cesium sulfide, or a mixture thereof. When the alkali metal sulfide is a hydrate or an aqueous mixture, a dehydration operation may be performed on the alkali metal sulfide before the polymerization reaction. The alkali metal sulfide can also be generated in situ. Further, an alkali metal hydroxide may be added to this reaction to reactively remove impurities such as polysulfide alkali metals and alkali metal thiosulfates.

[0037] The dihaloaromatic compound may be (but is not limited to) o-dihalobenzene, m-dihalobenzene, p-dihalobenzene, methoxydihalobenzene, dihalobenzoic acid, or dihalotoluene. At this time, the halogen atom can be fluorine, chlorine, bromine, or iodine, and the two halogen atoms in the same dihaloaromatic compound may be the same or different. Specific dihaloaromatic compounds include p-dichlorobenzene, m-dichlorobenzene, o-dichlorobenzene, 2,5-dichlorotoluene, 1,4-dibromobenzene, 1-methoxy-2,5-dichlorobenzene, and 3,5-dichlorobenzoic acid.

[0038] Alternatively, polyarylene sulfide may be made using an aromatic group other than phenylene. Corresponding dihaloaromatic compounds for preparing polyarylene sulfide include dihalobiphenyl, dihalodiphenyl ether, dihalodiphenyl sulfone, dihalodiphenyl sulfoxide, or dihalodiphenyl ketone. At this time, the halogen atom can be fluorine, chlorine, bromine, or iodine, and the two halogen atoms in the same dihaloaromatic compound may be the same or different. Specific dihaloaromatic compounds include 1,4-dichloronaphthalene, 4,4'-dichlorobiphenyl, 4,4'-dichlorodiphenyl ether, 4,4'-dichlorodiphenyl sulfone, 4,4'-dichlorodiphenyl sulfoxide, and 4,4'-dichlorodiphenyl ketone.

[0039] If necessary, a monohalo compound (not necessarily an aromatic compound) can be used in combination with a dihalo aromatic compound to form end groups of the polyarylene sulfide, or to adjust the polymerization reaction and / or molecular weight of the polyarylene sulfide. Representative end groups include, for example, halogen, thiol, and hydroxy.

[0040] The production process of PPS can include a step of performing a polymerization reaction in an organic amide solvent. Examples of the organic amide solvent include, but are not limited to, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylcaprolactam, tetramethylurea, dimethylimidazolidinone, hexamethylphosphoric triamide, and mixtures thereof. The amount of the organic amide solvent used in the reaction can be, for example, 0.2 to 5 kilograms (kg) per mole of the effective amount of the alkali metal sulfide.

[0041] The polymerization can be carried out in a stepwise polymerization process. The first polymerization step can include a step of introducing a dihalo aromatic compound into a reactor, a step of polymerizing the dihalo aromatic compound at a temperature of 180 to 235°C in the presence of water, and a step of continuing the polymerization until the conversion rate of the dihalo aromatic compound reaches at least about 50 mol% of the theoretically required amount. In the second polymerization step, water can be added to the reaction slurry, and the reaction mixture can be heated to 250 to 290°C to continue the polymerization until the melt viscosity of the resulting polymer reaches the desired final level of polyphenylene sulfide or polyarylene sulfide. The duration of the second polymerization step can be, for example, 0.5 to 20 hours.

[0042] The PPS product can further be treated by immersing this resin in deionized water or treating it with an acid (generally hydrochloric acid, sulfuric acid, phosphoric acid, or acetic acid) to remove undesirable contaminant ions. In some product applications, it is desirable that the impurity concentration in PPS be low. The impurity concentration can be represented by the mass percentage of the ash remaining after burning a PPS sample. The ash content of PPS is desirably less than 1% by mass, more desirably less than 0.5% by mass, and even more desirably less than 0.1% by mass.

[0043] The melt viscosity of PPS is not particularly limited, but from the viewpoint of toughness, a melt viscosity of at least 100 poises is desirable, and from the viewpoint of injection moldability, 10,000 poises or less is desirable.

[0044] PPS can have an M of 5,000 to 100,000 g / mol as measured by gel permeation chromatography (GPC) using a polystyrene standard according to ASTM D5296. w and can have.

[0045] In addition to PPS, the melt mixture of the compatibilized polyarylene sulfide composition further contains an epoxy novolak resin in an amount effective to compatibilize the polyarylene sulfide and the polyimide.

[0046] The epoxy novolak resin can have an average epoxy equivalent of at least 2 units per molecule, or an average of 6 or more pendant epoxy groups per molecule, more specifically, an average of 20 or more pendant epoxy groups per molecule, and even more specifically, an average of 50 or more pendant epoxy groups per molecule. In a specific embodiment, the epoxy novolak resin can have 2 to 8 pendant epoxy groups per molecule, 3 to 7 pendant epoxy groups per molecule, or 4 to 6 pendant epoxy groups per molecule.

[0047] Although not bound by theory, it is believed that epoxy novolac resin interacts with polyarylene sulfide. This interaction is thought to be either chemical (e.g., grafting) or physical (e.g., effect on the surface properties of the dispersed phase). When the interaction is chemical, the epoxy groups of the epoxy novolac resin can react partially or completely with the polyarylene sulfide such that a molten mixture of the polyarylene sulfide and the epoxy novolac resin becomes a reaction product.

[0048] Epoxy novolac resin can be made by reacting phenol with formaldehyde. The term "phenol" as used herein includes substituted and unsubstituted phenyl, aryl, and fused aromatic rings having a hydroxyl group. The molar ratio of formaldehyde to phenol is less than 1. The novolac resin can be functionalized with epoxy groups by reacting the novolac resin with epichlorohydrin in the presence of sodium hydroxide as a catalyst. Epoxy novolac resin can have an M w as measured by GPC, of from 500 to 2,500 g / mol, desirably from 540 to 2,000 g / mol. Also within this range, epoxy novolac resin can have an M w as measured by GPC, of 900 g / mol or less.

[0049] Epoxy novolac resin can have an epoxy equivalent of from 0.3 to 0.8, desirably from 0.35 to 0.6, more desirably from 0.425 to 0.5, per 100 g of epoxy novolac resin.

[0050] Epoxy novolac resin can have a mass / epoxide, or epoxide equivalent weight (EEW), of from 100 to 500, desirably from 150 to 350, more desirably from 200 to 250, still more desirably from 200 to 235.

[0051] For example, the epoxy novolak resin can be an epoxy phenol novolak (EPN) resin, an epoxy cresol novolak (ECN) resin, or a combination thereof. For example, the epoxy novolak resin can contain units represented by structural formula (11).

Chemical formula

[0052] In some embodiments, epoxy-containing materials other than the epoxy novolak resin can be excluded from the composition. For example, the composition can exclude epoxy-functionalized styrene-based polymers such as epoxy-functionalized acrylic styrene oligomers.

[0053] The epoxy novolak resin can be added to the melt mixture or to the precursor composition of the polyarylene sulfide and the epoxy novolak resin before melt mixing in an amount of 1 to 20% by mass based on the mass of the compatibilized polyarylene sulfide composition or the mass of the melt mixture. For example, the compatibilized polyarylene sulfide composition can be prepared from a melt mixture of, respectively, 80 to 99% by mass, preferably 85 to 98% by mass, more preferably 90 to 98% by mass of polyarylene sulfide and 1 to 20% by mass, preferably 2 to 15% by mass, more preferably 2 to 10% by mass of epoxy novolak resin based on the total mass of the compatibilized polyarylene sulfide composition.

[0054] The compatibilized composition can contain 10 to 90% by mass of polyimide and 10 to 90% by mass of a compatibilized polyarylene sulfide composition, preferably 20 to 80% by mass of polyimide and 20 to 80% by mass of a compatibilized polyarylene sulfide composition, more preferably 30 to 70% by mass of polyimide and 30 to 70% by mass of a compatibilized polyarylene sulfide composition, based on the total mass of the compatibilized composition. In a specific embodiment, the compatibilized composition contains 35 to 50% by mass of polyimide and 50 to 65% by mass of a compatibilized polyarylene sulfide composition, based on the total mass of the compatibilized composition. In another specific embodiment, the compatibilized composition contains 30 to 55% by mass of polyimide and 45 to 70% by mass of a compatibilized polyarylene sulfide composition, based on the total mass of the compatibilized composition.

[0055] Additives can be further added to the compatibilized composition, if necessary, as long as they do not unduly affect the preferred properties of the compatibilized composition. Typical additives include, for example, conductive fillers, reinforcing fillers, stabilizers, lubricants, mold release agents, inorganic pigments, UV absorbers, antioxidants, plasticizers, antistatic agents, foaming agents, expanding agents, metal deactivators, and combinations containing one or more of the foregoing. Examples of conductive fillers include conductive carbon black, carbon fibers, metal fibers, metal powders, carbon nanotubes, etc., and combinations containing any of the foregoing conductive fillers. Examples of reinforcing fillers include glass beads (hollow and / or solid), glass flakes, milled glass, glass fibers, talc, wollastonite, silica, mica, kaolin or montmorillonite clay, silica, quartz, barite, etc., and combinations containing any of the foregoing reinforcing fillers. The antioxidant can be a compound such as phosphite, phosphonites, hindered phenol, or a mixture thereof. Stabilizers containing phosphorus such as triaryl phosphite and aryl phosphonate are mentioned as useful stabilizers. Bifunctional phosphorus-containing compounds can also be used. The stabilizer can have a molecular weight of 300 or more. In some embodiments, a phosphorus-containing stabilizer having a molecular weight of 500 or more is useful. The phosphorus-containing stabilizer is usually present in the composition in an amount of 0.05 to 0.5% by mass of the formulation. Flow aids and mold release agents are also contemplated.

[0056] In some embodiments, the compatibilized composition can include particulate materials. Examples of particulate materials include fumed silica, fused silica, precipitated silica, silica gel, polysilsesquioxane, quartz, diatomaceous earth, crushed glass, glass spheres, or combinations thereof. The particle size of the particulate material can be from 0.1 to 200 micrometers (μm), for example, from 0.5 to 150 μm or from 1 to 100 μm. In some embodiments, the particle size can be from 0.1 to 20 μm, for example, from 0.5 to 15 μm. In another embodiment, the particle size can be from 25 to 150 μm, for example, from 50 to 100 μm. The compatibilized composition may contain two or more different particulate materials, and the particle sizes of the respective particulate materials can be the same or different. For example, the compatibilized composition can include a first particulate material having a particle size of from 50 to 100 μm and a second particulate material having a particle size of from 0.5 to 12 μm. In another embodiment, the compatibilized composition does not include particulate materials, conductive fillers, or reinforcing fillers. For example, in some embodiments, the compatibilized composition does not include particulate materials or glass fibers.

[0057] Each composition can be prepared by melt - mixing or melt - kneading the components of the composition. Melt - mixing or melt - kneading can be carried out using common apparatuses such as a ribbon blender, a HENSCHEL mixer, a BANBURY mixer, a drum tumbler, a single - screw extruder, a twin - screw extruder, a multi - screw extruder, a kneader, etc. For example, a compatibilized composition can be prepared by: a) a step of melt - mixing an epoxy novolak resin and a polyarylene sulfide to produce a compatibilized polyarylene sulfide composition; and b) a step of melt - mixing the compatibilized polyarylene sulfide composition and a polyimide to produce a compatibilized composition, where step a) and step b) are carried out successively. Desirably, step a) and step b) can be carried out at a temperature of 250 to 360 °C. In some embodiments, the step a) of melt - mixing an epoxy novolak resin and a polyarylene sulfide to produce a compatibilized polyarylene sulfide composition is carried out in an initial pass in an extruder, and the step b) of melt - mixing the compatibilized polyarylene sulfide composition and a polyimide to produce a compatibilized composition is carried out in a second pass through the extruder. The method for manufacturing the compatibilized composition will be further described in the following examples.

[0058] The compatibilized composition can have a tensile modulus of 3550 to 5000 MPa, desirably 3650 to 4500 MPa, as measured by ISO - 527.

[0059] The compatibilized composition can have a heat distortion temperature of 180 to 220 °C, desirably 185 to 210 °C, as measured by ISO - 75 at a pressure of 0.45 MPa.

[0060] The compatibilized composition can have a heat distortion temperature of 130 to 200 °C, desirably 132 to 190 °C, as measured by ISO - 75 at a pressure of 1.8 MPa.

[0061] The compatibilized composition has, as measured by ISO - 180, 4.5 kJ / m 2Above, desirably 4.6 kJ / m 2 It is possible to have an impact strength of above.

[0062] In some embodiments, the heat deflection temperature and the tensile modulus of the compatibilized composition are greater than those of a comparative composition that does not include the compatibilized polyarylene sulfide composition. As used herein, the "comparative composition" is one that includes the same amounts of polyimide, polyarylene sulfide, and epoxy novolac resin as the present compatibilized composition, but in the comparative composition, the polyarylene sulfide and the epoxy novolac resin are not melt mixed as in the compatibilized polyarylene sulfide composition.

[0063] In one embodiment, in terms of morphology, the domain size of the compatibilized composition is smaller than that of the comparative composition. The comparative composition is as defined herein. The domain size is determined as follows with a transmission electron microscope (TEM). A sample of the composition is injection molded into a sample that is 60 millimeters (mm) square and 3.2 mm thick. A block (5 mm × 10 mm) is cut out from the central part of the sample. Next, this block is sectioned from the top to the bottom with an ultramicrotome using a diamond knife at room temperature. The thickness of the sections is 100 nanometers. At least five sections are scanned with a TEM at 100 to 120 kilovolts (kV), and the images are recorded at a magnification of 66,000. The longest single linear dimension of each domain is taken as the domain size, and the domains are counted and measured. Next, the domain sizes of the five sections are averaged to calculate the average domain size. As used herein, the "domain size" refers to the average domain size.

[0064] In one aspect, the compatibilized composition comprises, respectively, 10 to 90% by mass, desirably 20 to 80% by mass, more desirably 30 to 70% by mass of polyimide and 10 to 90% by mass of a compatibilized polyarylene sulfide composition, based on the total mass of the compatibilized composition. At this time, the compatibilized polyarylene sulfide composition is prepared from a melt mixture of, respectively, 80 to 99% by mass, desirably 85 to 98% by mass, more desirably 90 to 98% by mass of polyarylene sulfide and 1 to 20% by mass, desirably 2 to 15% by mass, more desirably 2 to 10% by mass of an epoxy novolac resin, based on the total mass of the compatibilized polyarylene sulfide composition. In this aspect, the polyimide is polyetherimide, poly(sulfone ether imide), or a combination thereof, and the epoxy novolac resin is an epoxy phenol novolac resin, an epoxy cresol novolac resin, or a combination thereof. In this aspect, the heat distortion temperature and the tensile modulus of the compatibilized composition are greater than those of the comparative composition. At this time, the comparative composition contains the same amount of polyimide, the same amount of polyarylene sulfide, and the same amount of epoxy novolac resin as the compatibilized composition. However, in the comparative composition, the polyarylene sulfide and the epoxy novolac resin are not melt-mixed like the compatibilized polyarylene sulfide composition.

[0065] In a specific aspect, the compatibilized composition comprises 35 to 50% by mass of polyetherimide and 50 to 65% by mass of a compatibilized polyarylene sulfide composition, does not contain particulate material or glass fiber, and the compatibilized composition has a melt volume flow rate of 25 to 35 cm 3 / 10 min as measured at 360 °C / 5 kg according to ISO-1133, an elongation at break of 55% or more as measured according to ISO-527, a heat distortion temperature of 180 °C or higher as measured at a pressure of 0.45 MPa according to ISO-75, and a heat distortion temperature of 130 °C or higher as measured at a pressure of 1.8 MPa according to ISO-75.

[0066] In a specific embodiment, the compatibilized composition comprises 30 to 55% by mass of poly(sulfone ether imide) and 45 to 70% by mass of a compatibilized polyarylene sulfide composition, and does not contain particulate material or glass fiber. The compatibilized composition has a melt volume flow rate of 25 to 40 cm 3 / 10 min as measured at 360 °C / 5 kg according to ISO-1133, an elongation at break of 50% or more as measured according to ISO-527, a heat distortion temperature higher than 180 °C as measured at a pressure of 0.45 MPa according to ISO-75, and a heat distortion temperature of 135 °C or more as measured at a pressure of 1.8 MPa according to ISO-75.

[0067] In a specific embodiment, the compatibilized composition comprises 30 to 55% by mass of polyetherimide, 45 to 70% by mass of a compatibilized polyarylene sulfide composition, and 1 to 6% by mass of particulate material. The compatibilized composition has a heat distortion temperature higher than 185 °C as measured at a pressure of 0.45 MPa according to ISO-75, and a heat distortion temperature of 130 °C or more as measured at a pressure of 1.8 MPa according to ISO-75.

[0068] The compatibilized composition can have an elongation at break of 40% or more, preferably 50% or more, as measured according to ISO-527.

[0069] The present compatibilized composition is also useful in the manufacture of various articles. Examples of such article manufacturing methods include single-layer and multi-layer sheet extrusion, injection molding, blow molding, film extrusion, profile extrusion, drawing molding, compression molding, thermoforming, pressure molding, hydroforming, vacuum molding, and the like. The aforementioned article manufacturing methods may be used in combination. The present composition is considered particularly useful in the manufacture of electronic components, for example, components of household electrical appliances.

Examples

[0070] The present disclosure will be further described in the following examples, but is not limited thereto.

[0071] The materials used in the following examples are shown in Table 1.

[0072]

Table 1

[0073] Using a two-pass method, PEI or PPS was melt-mixed with ECN to prepare a polymer mixture, and a modified polyetherimide (PEI-E) or polyphenylene sulfide (PPS-E) masterbatch was produced. 1) Either PEI-E and PPS, or 2) PPS-E and PEI were melt-mixed and compounded at 20 Kg / hour using a 6.4 cm twin-screw vacuum vented extruder to prepare the composition. The evaluated material mixtures are shown in the following table. The extruder temperature was set to range from 300 to 335 °C at the feed port. The screw speed was 300 revolutions per minute (rpm) under vacuum. The extrudate was cooled, pelletized and dried. As preparation for injection molding the test samples, the resin was dried at 140 °C for 5 hours. The polymer mixture was injection molded with a barrel temperature of 320 to 340 °C, a mold temperature of 130 to 150 °C, and a cycle time of 32 to 35 seconds to obtain ISO test samples. Any additives were added during the melt mixing of the polymer mixture.

[0074] The heat deflection temperature (HDT) was measured at 0.45 or 1.8 MPa, in accordance with ISO 75 / Bf and ISO 75 / Af, on an injection-molded bar of 80 mm × 10 mm × 4 mm, at intervals of 64 mm. The melt flow rate (MFR) was measured in accordance with ISO 1133 at 337 °C or 367 °C using a load of 6.6 kg. The melt volume flow rate (MVR) was measured in accordance with ISO 1133 at 360 °C / 5 kg with a residence time of 300 seconds. The tensile properties (tensile modulus, tensile stress at break, yield tensile stress) were measured in accordance with ISO 527 at a speed of 50 mm / min and expressed in megapascals (MPa). The maximum tensile stress was taken as the stress at UTS. The elongation at break was measured in accordance with ISO 527 and expressed as percent elongation (%). The Izod notched and unnotched impact strengths were measured in accordance with ISO 180 / 1A and ISO 180 / 1U at 23 °C using a multipurpose specimen in accordance with ISO 3167. The impact strength was expressed in kilojoules per square meter (kJ / m 2 2). The glass transition temperature (Tg, °C) was determined by differential scanning calorimetry. The coefficients of linear thermal expansion (CTE) parallel to the flow (flow) and transverse to the flow (x-flow) were measured in accordance with ISO 11359-2 from 0 to 80 °C at a rate of 5 °C / min.

[0075] [Examples 1 to 8] The purpose of Examples 1 to 8 was to show the effects of PPS and ECN as compatibilizers for the PEI composition. The compositions were prepared and tested according to the above-described procedure. The compositions and properties of Examples 1 to 8 are shown in Table 2.

[0076]

Table 2

[0077] Example 3 is a combination of 98% by mass of PPS and 2% by mass of ECN, and is an ECN-modified polyphenylene sulfide (PPS-E) without additional polymer. Example 4 is a combination of 98% by mass of PEI and 2% by mass of ECN, and is an ECN-modified polyetherimide (PEI-E) without additional polymer. For convenience, in Table 2, the amount of PPS-E or PEI-E is shown as 100% by mass in parentheses. Examples 7 and 8 were prepared using PPS-E or PEI-E prepared in Examples 3 and 4, respectively. Therefore, the compatibilized polyphenylene sulfide composition (PPS-E) of Example 7 is a molten mixture of 98% by mass of PPS and 2% by mass of ECN.

[0078] These examples show that the ECN-modified polyphenylene sulfide (PPS-E) combined with PEI (Example 7) results in a composition that achieves an MVR of less than 31 cm 3 / 10 min, an HDT higher than 185 °C at 0.45 MPa, and an HDT higher than 132 °C at 1.8 MPa. Furthermore, Example 7 shows a higher HDT and tensile properties along with a low MVR, indicating that the viscosity of the composition prepared by the two-step method of PPS-E and PEI is improved compared to that prepared by the one-step method of the composition of PEI, PPS, and ECN (Comparative Example 5).

[0079] [Examples 9 to 13] The purpose of Examples 9 to 13 was to show the effect of ECN-compatibilized PPS (PPS-E) in a composition containing poly(sulfone ether imide) (PSEI) instead of PEI when prepared by a two-step method. The compositions were prepared and tested according to the above-mentioned procedure. The compositions and properties of Examples 9 to 13 are shown in Table 3.

[0080]

Table 3

[0081] Example 11 uses the PPS-E prepared in Example 3. Accordingly, the compatibilized polyphenylene sulfide composition (PPS-E) of Example 11 is a melt mixture of 98% by mass of PPS and 2% by mass of ECN.

[0082] These examples show that when prepared by a one-step method, the composition containing PSEI / PPS / ECN (Comparative Example 10) has an improved HDT compared to the composition containing PEI / PPS / ECN (Comparative Example 9). These examples also show that the ECN-modified polyphenylene sulfide (PPS-E) (Example 11) combined with PSEI results in a composition that can achieve higher HDT, tensile modulus, and elongation at break, and better MVR. Furthermore, when 45% by mass of glass fiber (Comparative Examples 12 and 13) is added to the PEI / PPS / ECN mixture (Comparative Example 9) and the PSEI / PPS / ECN mixture (Comparative Example 10) respectively, it is also shown that the HDT and tensile modulus increase significantly.

[0083] [Examples 14 to 18] The purpose of Examples 14 to 18 was to show the effect of adding silicon-containing particles to the composition containing ECN-compatibilized PPS (PPS-E) and PEI when prepared by a two-step method. The composition was prepared and tested according to the above-mentioned procedure. The composition and properties of Examples 14 to 18 are shown in Table 4.

[0084]

Table 4

[0085] Example 18 uses the PPS-E prepared in Example 3. Accordingly, the compatibilized polyphenylene sulfide composition (PPS-E) of Example 18 is a melt mixture of 98% by mass of PPS and 2% by mass of ECN.

[0086] These examples show that when Particle 1 or Particle 2 is added to the composition containing PEI / PPS / ECN prepared by the one-step method (Comparative Examples 15 and 16), the HDT increases (Comparative Example 14). When both Particle 1 and Particle 2 are added to the composition containing PEI / PPS / ECN prepared by the one-step method (Comparative Example 17), further, the HDT increases without significantly degrading the mechanical properties. In the composition (Example 18) containing a combination of ECN-modified polyphenylene sulfide (PPS-E) prepared by the two-step method and PEI, the HDT is even higher and the mechanical properties are improved.

[0087] The present disclosure further includes the following aspects.

[0088] Aspect 1: A compatibilized composition comprising a polyimide and a compatibilized polyarylene sulfide composition comprising a melt mixture of an epoxy novolak resin and a polyarylene sulfide, wherein the compatibilized composition does not contain polyphenylene sulfone.

[0089] Aspect 2: The compatibilized composition of Aspect 1, comprising 10 to 90% by mass of polyimide and 10 to 90% by mass of the compatibilized polyarylene sulfide composition, wherein each % by mass is based on the total mass of the compatibilized composition.

[0090] Aspect 3: The compatibilized composition of Aspect 1 or 2, wherein the amount of polyimide is 20 to 80% by mass, preferably 30 to 70% by mass, based on the total mass of the compatibilized composition, and the compatibilized polyarylene sulfide composition is prepared from a melt mixture of 80 to 99% by mass, preferably 85 to 98% by mass, more preferably 90 to 98% by mass of polyarylene sulfide and 1 to 20% by mass, preferably 2 to 15% by mass, more preferably 2 to 10% by mass of epoxy novolak resin, based on the total mass of the compatibilized polyarylene sulfide composition.

[0091] Aspect 4: The compatibilized composition according to any of the preceding aspects, wherein the polyimide is polyetherimide, poly(sulfone ether imide), or a combination thereof.

[0092] Aspect 5: A compatibilized composition according to any of the above aspects, wherein the epoxy novolak resin is an epoxy phenol novolak resin, an epoxy cresol novolak resin, or a combination thereof.

[0093] Aspect 6: A compatibilized composition according to any of the above aspects, wherein the compatibilized composition has a tensile modulus of 3550 to 5000 MPa, desirably 3650 to 4500 MPa, as measured by ISO-527; a heat distortion temperature of 180 to 220 °C, desirably 185 to 210 °C, at a pressure of 0.45 MPa as measured by ISO-75; a heat distortion temperature of 130 to 200 °C, desirably 132 to 190 °C, at a pressure of 1.8 MPa as measured by ISO-75; an impact strength of 4.5 kJ / m 2 or more, desirably 4.6 kJ / m 2 or more, as measured by ISO-180; or an elongation at break of 40% or more, desirably 50% or more, as measured by ISO-527.

[0094] Aspect 7: A compatibilized composition according to any of the above aspects, wherein the heat distortion temperature and the tensile modulus of the compatibilized composition are greater than those of a comparative composition, the comparative composition containing the same amount of polyimide, the same amount of polyarylene sulfide, and the same amount of epoxy novolak resin as the compatibilized composition, and in the comparative composition, the polyarylene sulfide and the epoxy novolak resin are not melt-mixed as in a compatibilized polyarylene sulfide composition.

[0095] Aspect 8: A compatibilized composition according to any of the above aspects, wherein, in terms of morphology, the domain size of the compatibilized composition is smaller than that of a comparative composition, the comparative composition containing the same amount of polyimide, the same amount of polyarylene sulfide, and the same amount of epoxy novolak resin as the compatibilized composition, and in the comparative composition, the polyarylene sulfide and the epoxy novolak resin are not melt-mixed as in a compatibilized polyarylene sulfide composition.

[0096] Aspect 9: A compatibilized composition according to any of the preceding aspects, further comprising a particulate material, preferably the particulate material is fumed silica, fused silica, precipitated silica, silica gel, polysilsesquioxane, quartz, diatomaceous earth, ground glass, glass beads, or a combination thereof.

[0097] Aspect 10: A compatibilized composition according to any of Aspects 1 to 8, comprising 35 to 50% by mass of polyetherimide and 50 to 65% by mass of a compatibilized polyarylene sulfide composition, wherein each % by mass is based on the total mass of the compatibilized composition, the compatibilized composition does not contain a particulate material or glass fiber, and the compatibilized composition has, as measured by ISO - 1133 at 360 °C / 5 kg, a melt volume flow rate of 25 to 35 cm 3 / 10 min, an elongation at break of 55% or more as measured by ISO - 527, and a heat distortion temperature of 180 °C or higher as measured by ISO - 75 at a pressure of 0.45 MPa, or a heat distortion temperature of 130 °C or higher as measured by ISO - 75 at a pressure of 1.8 MPa, and has at least one of these.

[0098] Aspect 11: A compatibilized composition according to any of Aspects 1 to 8, comprising 30 to 55% by mass of poly(sulfone ether imide) and 45 to 70% by mass of a compatibilized polyarylene sulfide composition, wherein each % by mass is based on the total mass of the compatibilized composition, the compatibilized composition does not contain a particulate material or glass fiber, and the compatibilized composition has, as measured by ISO - 1133 at 360 °C / 5 kg, a melt volume flow rate of 25 to 40 cm 3 / 10 min, an elongation at break of 50% or more as measured by ISO - 527, and a heat distortion temperature higher than 180 °C as measured by ISO - 75 at a pressure of 0.45 MPa, or a heat distortion temperature of 135 °C or higher as measured by ISO - 75 at a pressure of 1.8 MPa, and has at least one of these.

[0099] Aspect 12: A compatibilized composition according to any one of Aspects 1 to 9, comprising 30 to 55% by mass of a polyetherimide, 45 to 70% by mass of a compatibilized polyarylene sulfide composition, and 1 to 6% by mass of a particulate material, wherein each % by mass is based on the total mass of the compatibilized composition, and the compatibilized composition has at least one of a heat deflection temperature higher than 185°C as measured at a pressure of 0.45 MPa according to ISO-75, or a heat deflection temperature of 130°C or higher as measured at a pressure of 1.8 MPa according to ISO-75.

[0100] Aspect 13: A method for producing a compatibilized composition according to any one of the above aspects, the production method comprising a step of melt-mixing an epoxy novolac resin and a polyarylene sulfide to produce a compatibilized polyarylene sulfide composition, and a step of melt-mixing the compatibilized polyarylene sulfide composition and a polyimide to produce a compatibilized composition, and preferably, the temperature of the step of melt-mixing to produce the compatibilized composition is 250 to 360°C.

[0101] Aspect 14: The production method of Aspect 13, wherein the step of melt-mixing to produce a compatibilized polyarylene sulfide composition is a first pass through an extruder, and the step of melt-mixing to produce a compatibilized composition is a second pass through an extruder.

[0102] Aspect 15: An article comprising a compatibilized composition according to any one of the above aspects, preferably, the article is a molded article.

[0103] The compositions, methods, and articles can optionally comprise, consist of, or consist essentially of any suitable materials, steps, or components disclosed in the text. The compositions, methods, and articles can additionally or optionally be configured to exclude or substantially exclude any materials (or species), steps, or components that are not necessarily required for the achievement of the functions or objectives of the compositions, methods, and articles.

[0104] All ranges disclosed herein include their endpoints, and the endpoints are combinable independently of each other (e.g., the range “up to 25% by weight, or 5 to 20% by weight” includes the endpoints and all values within this range, such as “5 to 25% by weight”). “Combinations” include blends, mixtures, alloys, reaction products, etc. The terms “first,” “second,” etc. do not indicate any order, quantity, or importance, but are used to distinguish one element from another. The terms “a,” “an,” and “the” do not indicate a limitation of quantity and should be construed to include both the singular and plural forms unless otherwise indicated or clearly contradicted by the context. “Or” means “and / or” unless otherwise expressly stated. References in the specification to “some embodiments,” “an embodiment,” etc. mean that a particular element described in connection with that embodiment is included in at least one embodiment described herein, but may or may not be present in other embodiments. Furthermore, it goes without saying that the elements described can be combined in any suitable manner in various embodiments. “Combinations thereof” is open-ended and includes any combination that includes at least one of the recited components or features and, optionally, together with similar or equivalent components or features not recited.

[0105] Unless otherwise specified herein, all test standards are the most recent standards that are in effect as of the filing date of this application, or, if priority is claimed, as of the filing date of the earliest priority application in which the test standard is described.

[0106] Unless otherwise defined, technical and scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. All patents, patent applications, and other references cited are hereby incorporated by reference in their entirety. However, if the terms in this application conflict with or are inconsistent with the terms in the incorporated references, the terms of this application shall prevail over the conflicting terms from the incorporated references.

[0107] Compounds are described using standard nomenclature. For example, positions not substituted with any indicated group are assumed to have their valences filled with the indicated bond or a hydrogen atom. A dash ("-") not sandwiched between two letters or symbols is used to indicate the position at which a substituent is attached. For example, -CHO is attached at the carbon of the carbonyl group.

[0108] As used herein, the term "hydrocarbyl" includes groups containing carbon and hydrogen, and optionally one or more heteroatoms (e.g., one, two, three, or four atoms such as halogen, O, N, S, P, Si, etc.). "Alkyl" means a branched or straight-chain, saturated monovalent hydrocarbon group, e.g., methyl, ethyl, i-propyl, n-butyl. "Alkylene" means a branched or straight-chain, saturated divalent hydrocarbon group (e.g., methylene (-CH2-) or propylene (-(CH2)3-)). "Alkenyl" and "alkenylene" mean, respectively, a monovalent or divalent, branched or straight-chain hydrocarbon group having at least one carbon-carbon double bond (e.g., ethenyl (-HC=CH2) or propenylene (-(HC(CH3)=CH2-))). "Alkynyl" means a branched or straight-chain, monovalent hydrocarbon group having at least one carbon-carbon triple bond (e.g., ethynyl). "Alkoxy" means an alkyl group attached through oxygen (i.e., alkyl-O-), e.g., methoxy, ethoxy, sec-butyloxy. "Cycloalkyl" and "cycloalkylene" mean, respectively, the structural formulas -C n H 2n-x and -C n H 2n-2x-(wherein x is the number of cyclizations), and means monovalent and divalent cyclic hydrocarbon groups. "Aryl" means a monovalent monocyclic or polycyclic aromatic group (e.g., phenyl or naphthyl). "Arylene" means a divalent monocyclic or polycyclic aromatic group (e.g., phenylene or naphthylene). "Arylene" means a divalent aryl group. "Alkylaryl" means an aryl group substituted with an alkyl group. "Arylalkyl" means an alkyl group substituted with an aryl group (e.g., benzyl). The prefix "halo" means a group or compound containing one or more halogen (F, Cl, Br, or I) substituents (these may be the same or different). The prefix "hetero" means a group or compound containing at least one ring member that is a heteroatom (e.g., 1, 2, or 3 heteroatoms, each heteroatom independently being N, O, S, or P).

[0109] When the substituent is not specifically indicated, each of the aforementioned groups may or may not be substituted, provided that the substitution does not significantly adversely affect the synthesis, stability, or use of the compound. "Substituted" means that, under the condition that the compound or group does not exceed the normal valence of the substituted atom, instead of hydrogen, at least one (e.g., 1, 2, 3, or 4) substituents (each independently being C 1~9 alkoxy, C 1~9 haloalkoxy, nitro (-NO2), cyano (-CN), C 1~6 alkylsulfonyl (-S(=O)2-alkyl), C 6~12 arylsulfonyl (-S(=O)2-aryl), thiol (-SH), thiocyanato (-SCN), tosyl (CH3C6H4SO2-), C 3~12 cycloalkyl, C 2~12 alkenyl, C 5~12 cycloalkenyl, C 6~12 aryl, C 7~13 arylene, C 4~12 heterocycloalkyl, and C 3~12It means that it can be a heteroaryl) and is substituted. When a compound is substituted, the number of carbon atoms shown is the total number of carbon atoms in the compound or group, including the carbon atoms of the substituent.

[0110] Although specific embodiments have been described, alternatives, modifications, variations, improvements, and substantial equivalents that are not presently contemplated or are not believed to be presently contemplated may be devised by the applicant or others skilled in the art. Accordingly, the appended claims, as filed and as they may be amended, are intended to cover all such alternatives, modifications, variations, improvements, and substantial equivalents.

Claims

1. A compatibilized composition, wherein the composition comprises a polyimide, a compatibilized polyarylene sulfide composition comprising a melt mixture of an epoxy novolak resin and a polyarylene sulfide, and characterized in that the compatibilized composition does not contain polyphenylene sulfone.

2. The compatibilized composition according to claim 1, comprising 10 to 90% by mass of the polyimide and 10 to 90% by mass of the compatibilized polyarylene sulfide composition, wherein each % by mass is based on the total mass of the compatibilized composition.

3. The compatibilized composition according to claim 1 or 2, wherein the amount of the polyimide is 20 to 80% by mass based on the total mass of the compatibilized composition, and the compatibilized polyarylene sulfide composition is prepared from a melt mixture of, respectively, 80 to 99% by mass of the polyarylene sulfide, 1 to 20% by mass of the epoxy novolak resin based on the total mass of the compatibilized polyarylene sulfide composition.

4. The compatibilized composition according to any one of claims 1 to 3, characterized in that the polyimide is a polyetherimide, a poly(sulfone ether imide), or a combination thereof.

5. The compatibilized composition according to any one of claims 1 to 4, characterized in that the epoxy novolak resin is an epoxy phenol novolak resin, an epoxy cresol novolak resin, or a combination thereof.

6. The compatibilized composition according to any one of claims 1 to 5, wherein the compatibilized composition has a tensile modulus of 3550 to 5000 MPa as measured by ISO-527, a heat deflection temperature of 180 to 220 °C as measured by ISO-75 at a pressure of 0.45 MPa, a heat deflection temperature of 130 to 200 °C as measured by ISO-75 at a pressure of 1.8 MPa, an impact strength of 4.5 kJ / m or more as measured by ISO-180, or ２ an elongation at break of 40% or more as measured by ISO-527, and has at least one of the above. The compatibilized composition is characterized by this.

7. The compatibilized composition according to any one of claims 1 to 6, wherein the heat deflection temperature and tensile modulus of the compatibilized composition are greater than those of the comparative composition, the comparative composition contains the same amount of polyimide, the same amount of polyarylene sulfide, and the same amount of epoxy novolac resin as the compatibilized composition, in the comparative composition, the polyarylene sulfide and the epoxy novolac resin are not melt-mixed like a compatibilized polyarylene sulfide composition The compatibilized composition is characterized by this.

8. The compatibilized composition according to any one of claims 1 to 7, wherein in terms of morphology, the domain size of the compatibilized composition is smaller than that of the comparative composition, the comparative composition contains the same amount of polyimide, the same amount of polyarylene sulfide, and the same amount of epoxy novolac resin as the compatibilized composition, In the composition for comparison, the polyarylene sulfide and the epoxy novolak resin are not melt-mixed like a compatibilized polyarylene sulfide composition A compatibilized composition characterized by this.

9. A compatibilized composition according to any one of claims 1 to 8, further comprising a particulate material.

10. A compatibilized composition according to any one of claims 1 to 8, wherein the compatibilized composition contains 35 to 50% by mass of polyetherimide and 50 to 65% by mass of a compatibilized polyarylene sulfide composition, and where each % by mass is based on the total mass of the compatibilized composition, the compatibilized composition does not contain a particulate material or glass fiber, the compatibilized composition has a melt volume flow rate of 25 to 35 cm ３ / 10 min at a measurement of 360 °C / 5 kg according to ISO-1133, an elongation at break of 55% or more at a measurement according to ISO-527, a heat distortion temperature of 180 °C or higher at a measurement at a pressure of 0.45 MPa according to ISO-75, or a heat distortion temperature of 130 °C or higher at a measurement at a pressure of 1.8 MPa according to ISO-75 and at least one of A compatibilized composition characterized by having.

11. A compatibilized composition according to any one of claims 1 to 8, wherein the compatibilized composition contains 30 to 55% by mass of poly(sulfone ether imide) and 45 to 70% by mass of a compatibilized polyarylene sulfide composition, and At this time, each mass % is based on the total mass of the compatibilized composition, the compatibilized composition does not contain particulate material or glass fiber, the compatibilized composition, has, at 360 ° C. / 5 kg measured by ISO-1133, a melt volume flow rate of 25 to 40 cm ３ / 10 min, and has, in a measurement by ISO-527, an elongation at break of 50% or more, and has, in a measurement by ISO-75 at a pressure of 0.45 MPa, a heat distortion temperature higher than 180 ° C., or has, in a measurement by ISO-75 at a pressure of 1.8 MPa, a heat distortion temperature of 135 ° C. or higher of at least one, and A compatibilized composition characterized by having.

12. A compatibilized composition according to any one of Claims 1 to 9, the compatibilized composition, 30 to 50 mass % of polyetherimide, and 45 to 65 mass % of a compatibilized polyarylene sulfide composition, and 1 to 6 mass % of particulate material and, At this time, each mass % is based on the total mass of the compatibilized composition, the compatibilized composition, has, in a measurement by ISO-75 at a pressure of 0.45 MPa, a heat distortion temperature higher than 185 ° C., or has, in a measurement by ISO-75 at a pressure of 1.8 MPa, a heat distortion temperature of 130 ° C. or higher A compatibilized composition characterized by having at least one of.

13. A manufacturing method for manufacturing the compatibilized composition according to any one of Claims 1 to 12, the manufacturing method, a step of melt-mixing an epoxy novolac resin and a polyarylene sulfide to produce a compatibilized polyarylene sulfide composition, A step of melt-mixing the compatibilized polyarylene sulfide composition and the polyimide to produce the compatibilized composition A production method characterized by including this.

14. The production method according to claim 13, wherein the step of melt-mixing to produce the compatibilized polyarylene sulfide composition is a first pass through an extruder, and the step of melt-mixing to produce the compatibilized composition is a second pass through an extruder. A production method characterized by this.

15. An article characterized by including the compatibilized composition according to any one of claims 1 to 12.

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