Dicing Die Bond Film

Abstract

To provide a dicing die-bonding film capable of reducing the peel force of an adhesive layer from a die-bonding layer when the die-bonding layer is peeled off from the adhesive layer.SOLUTION: A dicing die-bonding film includes a dicing tape in which an adhesive layer is laminated on a base material layer, and a die-bonding layer laminated on the adhesive layer while part of the adhesive layer is exposed. The adhesive layer contains an acrylic polymer, and the die-bonding layer contains an aromatic compound. A parameter derived by combining a plurality of parameters satisfies a predetermined numerical range, the plurality of parameters being obtained by performing FT-IR analysis on an exposed portion of the adhesive layer and a laminated portion with the die-bonding layer in the adhesive layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a dicing die bond film.

Background Art

[0002] Conventionally, in the manufacture of semiconductor devices, it is known to use a dicing die bond film to obtain a semiconductor chip for die bonding (for example, Patent Document 1). The dicing die bond film includes a dicing tape in which an adhesive layer is laminated on a base material layer, and a die bond layer laminated on the adhesive layer with a part of the adhesive layer exposed.

[0003] And, as a method of obtaining a semiconductor chip (die) for die bonding using the dicing die bond film, a half-cut step of forming grooves in a semiconductor wafer to process the semiconductor wafer into chips (dies) by a dicing process, a back grinding step of grinding the semiconductor wafer after the half-cut step to reduce the thickness, a mounting step of attaching one surface (for example, the surface opposite to the circuit surface) of the semiconductor wafer after the back grinding step to the die bond layer to fix the semiconductor wafer to the dicing tape, an expand step of widening the interval between semiconductor chips, a kerf maintaining step of maintaining the interval between semiconductor chips, and a pick-up step of peeling between the die bond layer and the adhesive layer and taking out the semiconductor chip with the die bond layer attached. It is known to adopt a method having these steps. And, in the pick-up step, the semiconductor chip taken out in a state of being attached to the die bond layer (hereinafter, also referred to as a semiconductor chip with a die bond layer) is adhered to a wiring board as an adherend.

[0004] Further, the adhesive layer usually contains a resin such as a (meth)acrylic resin, a cross-linking agent that reacts with the resin to polymerize the resins, and a photopolymerization initiator that generates active species enabling chain polymerization of the resins by irradiating active energy rays such as ultraviolet rays (for example, Patent Document 2). In such an adhesive layer, for example, when the adhesive layer is irradiated with active energy rays such as ultraviolet rays, a curing reaction proceeds, and the peel strength of the adhesive layer with respect to the die bond layer is reduced. As a result, the die bond layer can be peeled off from the adhesive layer relatively easily. That is, the pick-up process can be carried out relatively smoothly.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] By the way, as described above, when peeling the die bond layer from the adhesive layer, for example, even after irradiating the adhesive layer with active energy rays such as ultraviolet rays to cure the adhesive layer, the peel strength of the adhesive layer with respect to the die bond layer may not be sufficiently reduced. Thus, if the peel strength of the adhesive layer with respect to the die bond layer cannot be sufficiently reduced, the pick-up process cannot be carried out smoothly, which is not preferable. However, it is hard to say that sufficient studies have been made on sufficiently reducing the peel strength of the adhesive layer with respect to the die bond layer when peeling the die bond layer from the adhesive layer.

[0007] Therefore, an object of the present invention is to provide a dicing die bond film capable of sufficiently reducing the peel strength of the adhesive layer with respect to the die bond layer when peeling the die bond layer from the adhesive layer.

Means for Solving the Problems

[0008] As a result of intensive studies by the present inventors, in the dicing die bond film configured as described above, in which the adhesive layer contains an alkyl polymer and the die bond layer contains an aromatic compound, by making the parameters derived by combining a plurality of parameters obtained by performing FTIR analysis on the exposed portion of the adhesive layer and the laminated portion of the adhesive layer with the die bond layer satisfy a predetermined numerical range, it has been found that when peeling the die bond layer from the adhesive layer, the peeling force of the adhesive layer with respect to the die bond layer can be sufficiently reduced. And the present invention has been conceived.

[0009] That is, the dicing die bond film according to the present invention is a dicing tape in which an adhesive layer is laminated on a base material layer, and a die bond layer laminated on the adhesive layer with a part of the adhesive layer exposed, the adhesive layer contains an acrylic polymer, the die bond layer contains an aromatic compound, FTIR analysis is performed on each of the exposed portion of the adhesive layer and the laminated portion with the die bond layer, the sum of the total peak heights appearing in the range of 675 cm -1 or more and 900 cm -1 or less in the exposed portion of the adhesive layer is defined as H1, the peak height appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less in the exposed portion of the adhesive layer is defined as T1, the sum of the total peak heights appearing in the range of 675 cm -1 or more and 900 cm -1 or less in the laminated portion with the die bond layer is defined as H2, the peak height appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less in the laminated portion with the die bond layer is defined as T2, when The value of R calculated by the following formula (1) is 1.5 or less.

[0010]

Equation

[0011] According to such a configuration, when peeling the die bond layer from the adhesive layer, the peeling force of the adhesive layer with respect to the die bond layer can be sufficiently reduced. Thereby, the pickup process can be carried out smoothly.

[0012] In the dicing die bond film, It is preferable that the acrylic polymer contains 13 mol% or more of a structural unit of an alkyl (meth) acrylate having an alkyl group with 9 or more carbon atoms.

[0013] According to such a configuration, when peeling the die bond layer from the adhesive layer, the peeling force of the adhesive layer with respect to the die bond layer can be further sufficiently reduced. Thereby, the pickup process can be carried out more smoothly.

[0014] In the dicing die bond film, It is preferable that the acrylic polymer contains a structural unit of an alkyl (meth) acrylate having an alkyl group with 12 or more carbon atoms.

[0015] According to such a configuration, when peeling the die bond layer from the adhesive layer, the peeling force of the adhesive layer with respect to the die bond layer can be further sufficiently reduced. Thereby, the pickup process can be carried out more smoothly.

[0016] In the dicing die bond film, It is preferable that the acrylic polymer contains 15 mol% or more of a structural unit of an alkyl (meth) acrylate having an alkyl group with 12 or more carbon atoms.

[0017] According to such a configuration, when peeling the die bond layer from the adhesive layer, the peeling force of the adhesive layer with respect to the die bond layer can be further sufficiently reduced. Thereby, the pickup process can be carried out more smoothly.

[0018] In the dicing die bond film, It is preferable that the acrylic polymer contains a structural unit of an alkyl (meth) acrylate having an alkyl group with 9 or more and 14 or less carbon atoms and a structural unit of a hydroxyl group-containing (meth) acrylate.

[0019] According to such a configuration, when peeling the die bond layer from the adhesive layer, the peeling force of the adhesive layer with respect to the die bond layer can be further sufficiently reduced. Thereby, the pickup process can be carried out more smoothly.

Advantages of the Invention

[0020] According to the present invention, it is possible to provide a dicing die bond film capable of sufficiently reducing the peeling force of the adhesive layer with respect to the die bond layer when peeling the die bond layer from the adhesive layer.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2A

Figure 2B

Figure 2C

Figure 2D

Figure 3A

Figure 3B

Figure 4A

Figure 4B

Figure 4C

Figure 5A

Figure 5B

Figure 6

Figure 7

DETAILED DESCRIPTION OF THE INVENTION

[0022] Hereinafter, an embodiment of the present invention will be described.

[0023] [Dicing Die Bond Film] As shown in FIG. 1, the dicing die bond film 20 according to the present embodiment includes a dicing tape 10 in which an adhesive layer 2 is laminated on a base material layer 1, and a die bond layer 3 laminated on the adhesive layer 2 in a state where a part of the adhesive layer 2 is exposed. In the dicing die bond film 20, a semiconductor wafer is attached onto the die bond layer 3. In dicing a semiconductor wafer using the dicing die bond film 20, the die bond layer 3 is also diced together with the semiconductor wafer. The die bond layer 3 is diced into a size corresponding to the size of a plurality of singulated semiconductor chips. Thereby, semiconductor chips with the die bond layer 3 can be obtained.

[0024] In the dicing die bond film 20 according to the present embodiment, the adhesive layer 2 has adhesiveness and holds the die bond layer 3 by adhesion. In the dicing die bond film 20 according to the present embodiment, the adhesive layer 2 contains an acrylic polymer. In this specification, the acrylic polymer is a polymer containing (meth)acrylate monomer as a constituent unit. (Meth)acrylate is a concept including methacrylate and acrylate. In the specification of the claims, the acrylic polymer may contain monomers other than the (meth)acrylate monomer as constituent units.

[0025] Preferably, the adhesive layer 2 contains 50% by mass or more of the acrylic polymer, more preferably 70% or more, and even more preferably 80% by mass or more. Also, preferably, the adhesive layer 2 contains 95% by mass or less of the acrylic polymer, more preferably 90% by mass or less.

[0026] Preferably, the acrylic polymer is an ultraviolet curable polymer having a polymerizable unsaturated bond (polymerizable acrylic polymer). Examples of the polymerizable polymer include polymers containing a polymerizable vinyl group or ethynyl group at the end of the main chain or side chain. Hereinafter, the polymerizable vinyl group or ethynyl group is collectively referred to as a polymerizable group. The polymerizable acrylic polymer can be obtained by copolymerizing a (meth)acrylate monomer and a polymerizable monomer.

[0027] In the acrylic polymer contained in the adhesive layer 2, the above structural units are 1 identifiable by NMR analysis such as H-NMR, 13 C-NMR, thermal decomposition GC / MS analysis, infrared spectroscopy (e.g., FTIR method), etc. Note that the molar ratio of the above structural units in the acrylic polymer is usually calculated from the blending amount (charged amount) when polymerizing the acrylic polymer.

[0028] In the present embodiment, it is preferable that the acrylic polymer contains a structural unit of an alkyl (meth)acrylate. The structural unit of the alkyl (meth)acrylate is derived from an alkyl (meth)acrylate monomer. That is, the structure of the alkyl (meth)acrylate monomer after polymerization is the above structural unit of the alkyl (meth)acrylate. In the structural unit of the alkyl (meth)acrylate, the alkyl may be a saturated hydrocarbon or an unsaturated hydrocarbon. For example, the alkyl is a linear saturated hydrocarbon, a branched saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. It is preferable that the alkyl is a linear saturated hydrocarbon or a branched saturated hydrocarbon. Further, the alkyl may contain a polar group containing oxygen, nitrogen, or the like.

[0029] Examples of the structural unit of the alkyl (meth)acrylate include structural units such as ethyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, iso(sec)-nonyl (meth)acrylate, tert-nonyl (meth)acrylate, isobornyl (meth)acrylate, n-decyl (meth)acrylate, iso(sec)-decyl (meth)acrylate, tert-decyl (meth)acrylate, n-undecyl (meth)acrylate, iso(sec)-undecyl (meth)acrylate, tert-undecyl (meth)acrylate, lauryl (meth)acrylate, and the like.

[0030] In the present embodiment, among these various alkyl (meth)acrylate structural units of the acrylic polymer, it is preferable to contain an alkyl (meth)acrylate having an alkyl group with 9 or more carbon atoms as a structural unit, and more preferably to contain an alkyl (meth)acrylate having an alkyl group with 12 or more carbon atoms as a structural unit. In the present embodiment, it is preferable that the acrylic polymer contains 13 mol% or more of the structural unit of an alkyl (meth)acrylate having an alkyl group with 9 or more carbon atoms. In the present embodiment, it is more preferable that the acrylic polymer contains 30 mol% or more of the structural unit of an alkyl (meth)acrylate having an alkyl group with 9 or more carbon atoms, and even more preferably 40 mol% or more. In the present embodiment, it is preferable that the acrylic polymer contains 80 mol% or less of the structural unit of an alkyl (meth)acrylate having an alkyl group with 9 or more carbon atoms. In the present embodiment, it is preferable that the acrylic polymer contains 15 mol% or more of the structural unit of an alkyl (meth)acrylate having an alkyl group with 12 or more carbon atoms. In this embodiment, the acrylic polymer preferably contains 30 mol% or more, more preferably 40 mol% or more, of a structural unit of an alkyl (meth)acrylate having an alkyl group with 12 or more carbon atoms. In this embodiment, the acrylic polymer preferably contains 80 mol% or less of a structural unit of an alkyl (meth)acrylate having an alkyl group with 12 or more carbon atoms. Since the acrylic polymer is as described above, when the die bond layer 3 is peeled off from the adhesive layer 2, the peeling force of the adhesive layer 2 with respect to the die bond layer 3 can be further reduced. Thereby, the pickup process can be carried out more smoothly. Note that the upper limit of the number of carbon atoms in the structural unit of the alkyl (meth)acrylate is 18.

[0031] In this embodiment, the acrylic polymer is preferably composed of a structural unit of an alkyl (meth)acrylate and a structural unit of a hydroxyl group-containing (meth)acrylate. When the acrylic polymer is configured in this way, the structural unit of the alkyl (meth)acrylate is preferably a structural unit of an alkyl (meth)acrylate having an alkyl group with 9 or more and 14 or less carbon atoms. In the acrylic polymer configured in this way, the structural unit of the alkyl (meth)acrylate having an alkyl group with 9 or more and 14 or less carbon atoms preferably contains 15 mol% or more, more preferably 30 mol% or more, still more preferably 40 mol% or more. In the acrylic polymer configured in this way, the structural unit of the alkyl (meth)acrylate having an alkyl group with 9 or more and 14 or less carbon atoms preferably contains 80 mol% or less. In the acrylic polymer configured in this way, the structural unit of the hydroxyl group-containing (meth)acrylate preferably contains 10 mol% or more, more preferably 20 mol% or more. Since the acrylic polymer is as described above, when peeling the die bond layer 3 from the adhesive layer 2, the peeling force of the adhesive layer 2 with respect to the die bond layer 3 can be further reduced. As a result, the pickup process can be carried out more smoothly.

[0032] In the structural unit of the hydroxyl group-containing (meth)acrylate, the hydroxyl group contained in the structural unit easily reacts with the isocyanate group. Therefore, in the adhesive layer 2, as the acrylic polymer, one composed of the structural unit of the alkyl (meth)acrylate and the structural unit of the hydroxyl group-containing (meth)acrylate is contained, and an isocyanate compound is contained. Thus, the hydroxyl group in the structural unit of the hydroxyl group-containing (meth)acrylate reacts with the isocyanate group in the isocyanate compound, and the adhesive layer 2 can be appropriately cured.

[0033] The structural unit of the hydroxyl group-containing (meth)acrylate is derived from a hydroxyl group-containing (meth)acrylate monomer. That is, the structure of the hydroxyl group-containing (meth)acrylate monomer after polymerization is the structural unit of the hydroxyl group-containing (meth)acrylate.

[0034] The structural unit of the hydroxyl group-containing (meth)acrylate is preferably a structural unit of a hydroxyl group-containing C2-C4 alkyl (meth)acrylate. In the structural unit of the hydroxyl group-containing C2-C4 alkyl (meth)acrylate, the alkyl is usually a saturated hydrocarbon. For example, the alkyl is a linear saturated hydrocarbon or a branched saturated hydrocarbon. Also, the alkyl preferably does not contain a polar group containing oxygen, nitrogen, or the like. In the structural unit of the hydrogen group-containing (meth)acrylate, although the hydroxyl group may be bonded to any carbon of the alkyl, it is preferably bonded to the terminal carbon of the alkyl.

[0035] Examples of the structural unit of the hydroxyl group-containing (meth)acrylate include structural units such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, or hydroxybutyl (meth)acrylate such as hydroxy n-butyl (meth)acrylate or hydroxy iso-butyl (meth)acrylate. Among these structural units of the hydroxyl group-containing (meth)acrylate, the structural unit of hydroxyethyl (meth)acrylate is preferable, and the structural unit of 2-hydroxyethyl (meth)acrylate is more preferable.

[0036] In the present embodiment, it is preferable that the acrylic polymer is composed of a structural unit of an alkyl (meth)acrylate, a structural unit of a hydroxyl group-containing (meth)acrylate, and a structural unit of a polymerizable group-containing (meth)acrylate. Since the acrylic polymer contains a structural unit of a polymerizable group-containing (meth)acrylate, the adhesive layer 2 can be cured by irradiating the adhesive layer 2 with active energy rays (for example, ultraviolet rays) before the pickup step. Specifically, the adhesive layer 2 can be cured by irradiating the adhesive layer 2 with active energy rays (for example, ultraviolet rays) to crosslink the acrylic polymers contained in the adhesive layer 2. From the viewpoint of facilitating the progress of the crosslinking reaction, it is preferable that the adhesive layer 2 contains a photoinitiator. When the adhesive layer 2 contains a photoinitiator, radicals are generated from the photoinitiator by irradiating with active energy rays (for example, ultraviolet rays), and the crosslinking reaction between the acrylic polymers can be further advanced by the action of these radicals. Thus, when the adhesive layer 2 is cured by irradiation with active energy rays (for example, ultraviolet rays), the adhesive force of the adhesive layer 2 to the die bond layer 3 decreases. As a result, the semiconductor chip with a die bond layer can be easily picked up from the adhesive layer 2. Before irradiating the active energy ray (for example, ultraviolet ray), in the pressure-sensitive adhesive layer 2, since the crosslinking reaction between the acrylic polymers has not sufficiently proceeded, the pressure-sensitive adhesive layer 2 has sufficient adhesiveness and can sufficiently adhere to and hold the die bond layer 3.

[0037] The structural unit of the polymerizable group-containing (meth)acrylate can be formed by bonding a monomer having a functional group capable of bonding with a hydroxyl group and a polymerizable functional group in the molecule to the structural unit of the hydroxyl group-containing (meth)acrylate. The functional group capable of bonding with the hydrogen bond is preferably an isocyanate group having relatively high reactivity with a hydroxyl group. In such a case, the structural unit of the polymerizable group-containing (meth)acrylate preferably has an isocyanate group and a polymerizable group functional group at both ends of the molecule. Also, the polymerizable functional group is preferably a vinyl group. In such a case, the structural unit of the polymerizable group-containing (meth)acrylate preferably has an isocyanate group and a vinyl group at both ends of the molecule. Also, the vinyl group may be a part of a (meth)acryloyl group. The structural unit of the polymerizable group-containing (meth)acrylate may have a molecular structure in which the isocyanate group in the structural unit of the polymerizable group-containing (meth)acrylate containing an isocyanate group is urethane-bonded to the hydroxyl group in the structural unit of the hydroxyl group-containing (meth)acrylate. In the following, the polymerizable group-containing (meth)acrylate monomer containing an isocyanate group may be referred to as an isocyanate group-containing (meth)acrylate monomer.

[0038] When the alkyl-based polymer is composed of the structural unit of the alkyl (meth)acrylate, the structural unit of the hydroxyl group-containing (meth)acrylate, and the structural unit of the polymerizable group-containing (meth)acrylate, it can be obtained as follows. Specifically, an alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer are subjected to a polymerization reaction to obtain an intermediate of an alkyl polymer containing a structural unit of the alkyl (meth)acrylate and a structural unit of the hydroxyl group-containing (meth)acrylate. Then, the alkyl polymer can be obtained by subjecting the intermediate of the alkyl polymer and an isocyanate group-containing (meth)acrylate monomer to a polymerization reaction. That is, the acrylic polymer can be obtained by performing the polymerization reaction in two steps. The polymerization reaction between the intermediate of the acrylic polymer and the isocyanate group-containing (meth)acrylate monomer can be carried out by forming a urethane bond between the hydroxyl group in the intermediate of the acrylic polymer and the isocyanate group of the isocyanate group-containing (meth)acrylate monomer.

[0039] The isocyanate group-containing (meth)acrylate monomer preferably has one isocyanate group and one (meth)acryloyl group in the molecule. Examples of such isocyanate group-containing (meth)acrylate monomers include 2-isocyanatoethyl (meth)acrylate and 4-acryloylmorpholine.

[0040] The adhesive layer 2 preferably contains an isocyanate compound. The isocyanate compound may be in a state after a part of it has reacted by a urethanization reaction or the like. The isocyanate compound preferably contains a plurality of isocyanate groups in the molecule. By containing a plurality of isocyanate groups, when the acrylic polymer has a structural unit of the hydroxyl group-containing (meth)acrylate, the crosslinking reaction between the acrylic polymers in the adhesive layer 2 can be promoted. Specifically, by reacting one isocyanate group of the isocyanate compound with the hydroxyl group of one of the acrylic polymers and reacting the other isocyanate group of the isocyanate compound with the hydroxyl group of the other acrylic polymer, a crosslinking reaction can proceed through an isocyanate compound containing a plurality of isocyanate groups. That is, the isocyanate compound functions as a crosslinking agent.

[0041] The pressure-sensitive adhesive layer 2 preferably contains 0.1 part by mass or more and 5 parts by mass or less, more preferably 0.5 part by mass or more and 3 parts by mass or less, and even more preferably 0.75 part by mass or more and 2 parts by mass or less of the isocyanate compound with respect to 100 parts by mass of the acrylic polymer.

[0042] Examples of the isocyanate compound include diisocyanates such as aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates.

[0043] Examples of the aliphatic diisocyanate include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and methyl 2,6-diisocyanatocaproate. Examples of the alicyclic diisocyanate include 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane, methylcyclohexane-2,4-diisocyanate, methylcyclohexane-2,6-diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3-diisocyanatocyclohexane, and 1,4-diisocyanatocyclohexane. Examples of the aromatic diisocyanate include m-phenylene diisocyanate, p-phenylene diisocyanate, diphenylmethane-4,4'-diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3'-bis(isocyanatomethyl)benzene, 1,4'-bis(isocyanatomethyl)benzene, 1,3-bis(α-isocyanatoisopropyl)benzene, 1,4-(α-isocyanatoisopropyl), etc.

[0044] Examples of the isocyanate compound also include triisocyanate. Examples of the triisocyanate include triphenylmethane-4,4',4''-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, 1,3,5-tris(isocyanatomethyl)benzene, 2,6-diisocyanatocaproic acid-2-isocyanatoethyl, etc. Furthermore, examples of the isocyanate compound include polymeric polyisocyanates such as dimers and trimers of diisocyanate, polymethylene polyphenylene polyisocyanate, etc.

[0045] Examples of the isocyanate compound also include polyisocyanates obtained by reacting an excess of the above-described isocyanate compound with an active hydrogen-containing compound. Examples of the active hydrogen-containing compound include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, hexanediol, cyclohexanedimethanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbite, sucrose, castor oil, ethylenediamine, hexamethylenediamine, diethanolamine, triethanolamine, water, ammonia, urea, etc. In addition, various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, epoxy polyols, etc. can also be mentioned.

[0046] Furthermore, as the diisocyanate compound, allophanate polyisocyanate, biuret polyisocyanate, etc. can also be used. Each of the above-mentioned isocyanate compounds may be used alone or in combination of two or more.

[0047] As the isocyanate compound, it is preferably a reaction product of the aromatic diisocyanate and the active hydrogen-containing compound. Since such a reaction product has a relatively slow reaction rate of the isocyanate group, when it is included in the pressure-sensitive adhesive layer 2, it is possible to suppress the excessive progress of the curing reaction in the pressure-sensitive adhesive layer 2. As such a reaction product, those containing three or more isocyanate groups in the molecule are preferably used.

[0048] From the viewpoint of making the crosslinking reaction between the above-mentioned acrylic polymers more likely to proceed, the pressure-sensitive adhesive layer 2 preferably contains a photopolymerization initiator as described above. Examples of the photopolymerization initiator include α-ketol compounds, acetophenone-based compounds, benzoin ether compounds, ketal-based compounds, aromatic sulfonyl chloride-based compounds, photoactive oxime-based compounds, benzophenone-based compounds, thioxanthone-based compounds, camphorquinone, halogenated ketones, acylphosphine oxides, and acylphosphonates. Examples of the α-ketol compound include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, and 1-hydroxycyclohexyl phenyl ketone. Examples of acetophenone compounds include methoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropan-1-one, and 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one. Examples of benzoin ether compounds include benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether. Examples of ketal compounds include benzyldimethyl ketal compounds. Examples of aromatic sulfonyl chloride compounds include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime compounds include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime. Examples of benzophenone compounds include benzophenone, benzoin benzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. Examples of thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone. Among these, it is preferable to use 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one (commercially available as Omnirad 127 manufactured by IGM Resins).

[0049] The pressure-sensitive adhesive layer 2 preferably contains the photoinitiator in an amount of 0.1 part by mass or more and 10 parts by mass or less, more preferably 0.5 part by mass or more and 7 parts by mass or less, and even more preferably 0.75 part by mass or more and 5 parts by mass or less, based on 100 parts by mass of the acrylic polymer.

[0050] The adhesive layer 2 may contain other components than those described above. Examples of the other components include plasticizers, fillers, anti-aging agents, antioxidants, ultraviolet absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, and easy-peeling agents.

[0051] The thickness of the adhesive layer 2 is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 30 μm or less, and even more preferably 5 μm or more and 25 μm or less. The thickness of the adhesive layer 2 can be determined, for example, by measuring the thicknesses of arbitrarily selected five points randomly using a dial gauge (manufactured by PEACOCK, model R-205) and calculating the arithmetic mean of these thicknesses.

[0052] In the dicing die bond film 20 according to the present embodiment, FTIR analysis is performed on each of the exposed portion of the adhesive layer 2 and the laminated portion with the die bond layer 3. The sum of the heights of all peaks appearing in the range of 675 cm -1 or more and 900 cm -1 or less at the exposed portion of the adhesive layer 2 is defined as H1, the peak height appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less at the exposed portion of the adhesive layer 2 is defined as T1, the sum of the heights of all peaks appearing in the range of 675 cm -1 or more and 900 cm -1 or less at the laminated portion with the die bond layer 3 is defined as H2, and the peak height appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less at the laminated portion with the die bond layer 3 is defined as T2. When this is the case, the value of R calculated by the following formula (1) is 1.5 or less.

[0053]

Equation

[0054] The FTIR analysis can be performed by adopting the following conditions using a Fourier transform infrared spectrophotometer (manufactured by Thermo Scientific, trade name "Nicolet iS10 FT-IR") as the measuring device. · Measuring light: polarized light · Measuring mode: attenuated total reflection spectroscopy (ATR) · Measuring range: 600 cm -1 ~4000 cm -1 · Measuring interval: 0.5 cm -1 per

[0055] Also, the peak heights T1 and T2, and the sums of the heights of all peaks H1 and H2 are the data for the exposed portion of the adhesive layer 2 and the data for the laminated portion with the die bond layer 3 obtained when performing the FTIR analysis as described above. After plotting them on a graph with the horizontal axis being the wave number (unit: cm -1 ), and the vertical axis being the detection intensity (abs), a curve is drawn to connect the plotted data for each data series, and they can be obtained by analyzing each curve.

[0056] 1600 cm -1 above 1800 cm -1 below, if a plurality of peaks are recognized in the range, as the peak heights T1 and T2, the height (detection intensity) of the highest peak among the plurality can be measured by obtaining it. Note that the peak height means the height of the peak from the axis (horizontal axis) indicating the wave number. Also, the sums of the heights of all peaks H1 and H2 can be obtained by calculating the sum of the heights of all upwardly convex peaks that appear on each curve in the range of 675 cm -1 above 900 cm -1 below, that is, on the curves for the exposed portion of the adhesive layer 2 and the curves for the laminated portion with the die bond layer 3.

[0057] The peak heights T1 and T2, and the sums H1 and H2 of the total peak heights are obtained by calculating the arithmetic mean of the values obtained for any randomly selected five locations. Regarding the laminated portion with the die bond layer 3, on one surface of the die bond layer 3 (the surface not in contact with the adhesive layer 2), a peeling tape (for example, the product name "ELP BT-315" manufactured by Nitto Denko Corporation) is attached, and the die bond layer 3 is peeled from the adhesive layer 2 while gently applying force by hand to expose the exposed surface of the adhesive layer 2. The FTIR analysis is performed on any randomly selected five locations from the exposed surface.

[0058] Note that when performing FT-IR analysis, peaks appearing in the range of 675 cm -1 to 900 cm -1 or less mean peaks derived from aromatic compounds, and peaks appearing in the range of 1600 cm -1 to 1800 cm -1 or less (when multiple peaks are recognized, the highest peak) mean peaks derived from carbonyl groups. From this, in the above formula (1), H1 / T1 means the ratio of the amount of aromatic compound to the amount of acrylic polymer in the exposed portion of the adhesive layer 2, and H2 / T2 means the ratio of the amount of aromatic compound to the amount of acrylic polymer in the laminated portion with the die bond layer 3. That is, when the value of R calculated by the above formula (1) is 1.5 or less, it means that the amount of aromatic compound based on the amount of acrylic polymer in the laminated portion with the die bond layer 3 is relatively close to the amount of aromatic compound based on the amount of acrylic polymer in the exposed portion of the adhesive layer 2. From this, the value of R calculated by the above formula (1) is preferably 1.4 or less, and more preferably 1.3 or less. Note that the value of R calculated by the above formula (1) varies due to the component transfer from the die bond layer 3 to the adhesive layer 2 as described later, and its lower limit value is 1.

[0059] Incidentally, the value of R calculated by the above formula (1) can be adjusted by making the adhesive layer 2 contain an acrylic polymer and making the die bond layer 3 contain an aromatic compound, and then appropriately adjusting the amount of the aromatic compound contained in the die bond layer 3. Further, the value of R can be more easily adjusted by making the acrylic polymer contained in the adhesive layer 2 contain a structural unit of an alkyl (meth) acrylate having an alkyl group with 9 or more carbon atoms or a structural unit of an alkyl (meth) acrylate having an alkyl group with 12 or more carbon atoms.

[0060] The adhesive layer 2 can be obtained by applying an adhesive composition containing each component as described above to the surface of a resin film or the like using an applicator or the like, and then drying the applied adhesive composition.

[0061] The die bond layer 3 contains a resin component. The die bond layer 3 preferably has thermosetting properties. By including at least one of a thermosetting resin and a thermoplastic resin having a thermosetting functional group in the die bond layer 3, the die bond layer 3 can be made to have thermosetting properties.

[0062] When the die bond layer 3 contains a thermosetting resin, examples of such a thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. Among these, it is preferable to use an epoxy resin.

[0063] Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, ortho-cresol novolac type, trishydroxyphenylmethane type, tetraphenylol ethane type, hydantoin type, tris glycidyl isocyanurate type, and glycidylamine type epoxy resins.

[0064] Examples of the phenolic resin include novolak-type phenolic resins, resol-type phenolic resins, and polyoxystyrenes such as polyp paraoxystyrene. Note that the phenolic resin functions as a curing agent for the epoxy resin.

[0065] When the die bond layer 3 contains a thermoplastic resin having a thermosetting functional group, examples of such a thermoplastic resin include a thermosetting functional group-containing acrylic resin. Examples of the acrylic resin in the thermosetting functional group-containing acrylic resin include those containing monomer units derived from (meth)acrylate esters. In a thermosetting resin having a thermosetting functional group, a curing agent is selected according to the type of the thermosetting functional group.

[0066] Examples of the (meth)acrylate ester include (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters. The above acrylic resin may contain monomer units derived from other components copolymerizable with the (meth)acrylate ester. Examples of the other components include functional group-containing monomers such as carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, and acrylonitrile, and various polyfunctional monomers. From the viewpoint of achieving high cohesive force in the die bond layer, the above acrylic resin is preferably a copolymer of a (meth)acrylate ester (particularly, a (meth)acrylic acid alkyl ester having 4 or less carbon atoms in the alkyl group), a carboxy group-containing monomer, a nitrogen atom-containing monomer, and a polyfunctional monomer (particularly, a polyglycidyl-based polyfunctional monomer), and more preferably a copolymer of ethyl acrylate, butyl acrylate, acrylic acid, acrylonitrile, and polyglycidyl (meth)acrylate.

[0067] The die bond layer 3 may contain a thermosetting catalyst (curing accelerator) from the viewpoint of allowing the curing reaction of the resin component to proceed sufficiently or increasing the curing reaction rate. Examples of the thermosetting catalyst include imidazole compounds, phosphorus compounds, amine compounds, and trihalogenoborane compounds. The die bond layer 3 preferably contains the phosphorus compound. Examples of the phosphorus compound include triphenylphosphine (TPP), tri(p-tolyl)phosphine (TPTP), tetraphenylphosphonium tetraphenylborate (TPP-K), tetrabutylphosphonium laurate (TBPLA), and tetrabutylphosphonium hydrogen hexahydronaphthalate (TBS-3S). The die bond layer 3 may contain an imidazole compound as the thermosetting catalyst. Examples of the imidazole compound include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole.

[0068] The die bond layer 3 may contain a thermoplastic resin as the resin component. The thermoplastic resin functions as a binder. Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resins such as polyamide 6 and polyamide 6,6, phenoxy resin, acrylic resin, saturated polyester resins such as PET and PBT, polyamideimide resin, fluororesin, and the like. Only one kind of the above thermoplastic resin may be used, or two or more kinds may be used in combination. From the viewpoint that the connection reliability by the die bond layer 3 is easily ensured because the thermoplastic resin has few ionic impurities and high heat resistance, an acrylic resin is preferable.

[0069] The above acrylic resin is preferably a polymer containing a monomer unit derived from (meth)acrylic acid ester as the monomer unit having the largest mass ratio. As the (meth)acrylic acid ester, the same ones as those described above can be used.

[0070] The die bond layer 3 may contain one or more other components as necessary. Examples of the other components include a flame retardant, a silane coupling agent, and an ion trap agent.

[0071] In the dicing die bond film 20 according to the present embodiment, it is important that the die bond layer 3 contains an aromatic compound. In this specification, the aromatic compound means an aromatic hydrocarbon and a heteroaromatic compound. By including an aromatic compound as the resin component in the die bond layer 3 or including an aromatic compound as the thermosetting catalyst, the die bond layer 3 contains an aromatic compound. Examples of the resin as the aromatic ring compound include epoxy resin and phenol resin. Examples of the thermosetting catalyst as the aromatic compound include the above-described imidazole-based compounds and the above-described phosphorus-based compounds.

[0072] Regarding the reason why the dicing die bond film 20 according to the present embodiment can sufficiently reduce the peeling force of the adhesive layer 2 with respect to the die bond layer 3 when peeling the die bond layer 3 from the adhesive layer 2, the present inventors speculate as follows.

[0073] In the conventional dicing die bond film 20, from the viewpoint of enhancing the affinity between the die bond layer 3 and the adhesive layer 2, the configuration of the die bond layer 3 and the configuration of the adhesive layer 2 are often determined so that the difference between the polarity (surface free energy) of the die bond layer 3 and the polarity (surface free energy) of the adhesive layer 2 becomes relatively small. Also, in the dicing die bond film 20, the die bond layer 3 is often configured to contain an aromatic compound, and the adhesive layer 2 is often configured to contain an acrylic polymer. In the dicing die bond film 20 configured as described above, since the difference between the polarity of the die bond layer 3 and the polarity of the adhesive layer 2 is small, in the state where the die bond layer 3 is laminated on the adhesive layer 2, it is considered that the aromatic compound contained in the die bond layer 3 easily undergoes component migration to the adhesive layer 2 (mainly, it is considered that the thermosetting catalyst as the aromatic compound easily undergoes component migration). Here, when the aromatic compound contained in the die bond layer 3 undergoes component migration to the adhesive layer 2, it is considered that recesses are formed on the surface of the die bond layer 3 (the contact surface with the adhesive layer 2) according to the amount of the aromatic compound that has undergone component migration. That is, in the conventional dicing die bond film 20, it is considered that relatively large recesses are formed on the surface of the die bond layer 3 because the aromatic compound contained in the die bond layer 3 easily undergoes component migration to the adhesive layer 2. When a relatively large recess is formed on the surface of the die bond layer 3, as described above, when the difference between the polarity of the die bond layer 3 and the polarity of the adhesive layer 2 is relatively small, it is considered that a part of the adhesive layer 2 easily penetrates into the recess. Thus, when the adhesive layer 2 is irradiated with active energy rays such as ultraviolet rays and cured while a part of the adhesive layer 2 has penetrated into the recess, it is considered that a relatively large anchor effect is generated between the die bond layer and the adhesive layer 2. As a result, it is considered that the peeling force of the adhesive layer 2 with respect to the die bond layer 3 cannot be sufficiently reduced.

[0074] On the other hand, in the dicing die bond film 20 according to the present embodiment, FTIR analysis is performed on each of the exposed portion of the adhesive layer 2 and the laminated portion with the die bond layer 3, and 675 cm -1 at the exposed portion of the adhesive layer 2. Above 900 cm -1 The sum of the total peak heights appearing in the following range is defined as H1, and 1600 cm at the exposed portion of the adhesive layer 2 -1 Above 1800 cm -1 The peak height appearing in the following range is defined as T1, and 675 cm at the laminated portion with the die bond layer 3 -1 Above 900 cm -1 The sum of the total peak heights appearing in the following range is defined as H2, and 1600 cm at the laminated portion with the die bond layer 3 -1 Above 1800 cm -1 When the peak height appearing in the following range is defined as T2, the value of R calculated by the following formula (1) is 1.5 or less. As described above, in the following formula (1), H1 / T1 means the ratio of the amount of the aromatic compound to the amount of the acrylic polymer in the exposed portion of the adhesive layer 2, and H2 / T2 means the ratio of the amount of the aromatic compound to the amount of the acrylic polymer in the laminated portion with the die bond layer 3. That is, when the value of R calculated by the following formula (1) is 1.5 or less, it means that the amount of the aromatic compound based on the amount of the acrylic polymer in the laminated portion with the die bond layer 3 is relatively close to the amount of the aromatic compound based on the amount of the acrylic polymer in the exposed portion of the adhesive layer 2. Therefore, in the dicing die bond film 20 according to the present embodiment, since the transfer of the aromatic compound from the die bond layer 3 to the adhesive layer 2 can be relatively suppressed, the recesses formed on the surface of the die bond layer 3 are relatively small, and it is considered that the anchor effect generated between the die bond layer 3 and the adhesive layer 2 is relatively small. As a result, the inventors presume that when the die bond layer 3 is peeled off from the adhesive layer 2, the peeling force of the adhesive layer 2 with respect to the die bond layer 3 can be sufficiently reduced.

[0075]

Number

[0076] The die bond layer 3 may contain a filler. By changing the amount of the filler contained in the die bond layer 3, the elasticity and viscosity of the die bond layer 3 can be more easily adjusted. In addition, physical properties such as the conductivity, thermal conductivity, and elastic modulus of the die bond layer 3 can be adjusted. Examples of the filler include inorganic fillers and organic fillers. As the filler, inorganic fillers are preferred. Examples of the inorganic filler include fillers containing silica such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica. In addition, examples of the material of the inorganic filler include simple metals such as aluminum, gold, silver, copper, and nickel, and alloys. The inorganic filler may be, for example, aluminum borate whisker, amorphous carbon black, graphite, or the like. The shape of the filler may be various shapes such as spherical, needle-like, flake-like, and the like. As the filler, only one of the above may be used, or two or more of the above may be used in combination.

[0077] The average particle size of the filler is preferably 0.005 μm or more and 10 μm or less, and more preferably 0.005 μm or more and 1 μm or less. When the average particle size of the filler is 0.005 μm or more, the wettability and adhesiveness to an adherend such as a semiconductor wafer can be further improved. In addition, when the average particle size of the filler is 10 μm or less, not only can the characteristics of the contained filler be more sufficiently exhibited, but also the heat resistance of the die bond layer 3 can be further exhibited. The average particle size of the filler can be determined, for example, using a photometric particle size distribution meter (for example, product name "LA-910", manufactured by Horiba, Ltd.).

[0078] When the die bond layer 3 contains a filler, the content is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and even more preferably 42% by mass or more and 55% by mass or less with respect to the total mass of the die bond layer 3.

[0079] The thickness of the die bond layer 3 is not particularly limited, but is, for example, 1 μm or more and 200 μm or less. Such a thickness may be 3 μm or more and 150 μm or less, or may be 5 μm or more and 135 μm or less.

[0080] Note that the die bond layer 3 can be obtained by applying an adhesive composition containing each component as described above to the surface of a resin film or the like using an applicator or the like, and then drying the applied adhesive composition. In addition, the attachment of the die bond layer 3 to the adhesive layer 2 can be carried out by laminating the die bond layer 3 on the adhesive layer 2 produced as described above.

[0081] The base material layer 1 supports the adhesive layer 2. The base material layer 1 is made using a metal foil, a fiber sheet, a rubber sheet, a resin film, or the like. The base material layer 1 is preferably made using a resin film. The base material layer 1 may have a single-layer structure or a laminated structure.

[0082] Examples of the fiber sheet include those composed of paper, woven fabric, non-woven fabric, or the like.

[0083] Examples of the material of the resin film include polyolefins such as polyethylene, polypropylene, and ethylene-propylene copolymer; copolymers of ethylene such as ethylene-vinyl acetate copolymer, ionomer resin, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester random copolymer, and ethylene-(meth)acrylic acid ester alternating copolymer; polyesters such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; polyacrylate; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide; polyamides such as aliphatic polyamide and wholly aromatic polyamide (aramid); polyether ether ketone; polyimide; polyether imide; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; fluorine-containing polymers, and the like. These may be used alone or in combination of two or more.

[0084] When the base material layer 1 is made of a resin film, the base material layer 1 may be obtained by non-stretching molding or stretching molding, but is preferably obtained by stretching molding.

[0085] On the surface of the base material layer 1 on the side where the adhesive layer 2 is laminated (hereinafter, also simply referred to as the surface), surface treatment may be performed from the viewpoint of enhancing the adhesion to the adhesive layer 2. As the surface treatment, oxidation treatment by chemical methods or physical methods such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, etc. may be employed. Also, as the surface treatment, coating treatment with a coating agent such as an anchor coating agent, primer, adhesive, etc. may be performed.

[0086] On the surface of the base material layer 1 on the side where the adhesive layer 2 is not laminated (hereinafter, also simply referred to as the back surface), in order to enhance the peelability, coating treatment may be performed with a release agent (peeling agent) such as a silicone resin or a fluororesin.

[0087] The thickness of the base material layer 1 is preferably 55 μm or more and 195 μm or less, more preferably 55 μm or more and 190 μm or less, still more preferably 55 μm or more and 170 μm or less, and most optimally 60 μm or more and 160 μm or less. By setting the thickness of the base material layer 1 within the above range, the dicing tape 10 can be efficiently manufactured. Also, the dicing bond layer 3 of the dicing die bond film 20 can be efficiently cut. The thickness of the base material layer 1 can be obtained, for example, by measuring the thicknesses of arbitrarily selected 5 points randomly using a dial gauge (manufactured by PEACOCK, model R-205) and calculating the arithmetic mean of these thicknesses.

[0088] The dicing die bond film 20 according to the present embodiment is used, for example, as an auxiliary tool for manufacturing a semiconductor integrated circuit. Hereinafter, specific examples of the use of the dicing die bond film 20 will be described. Hereinafter, an example using the dicing die bond film 20 in which the base material layer 1 is a single layer will be described.

[0089] A method for manufacturing a semiconductor integrated circuit includes a half-cut step of forming grooves in a semiconductor wafer to process the semiconductor wafer into chips (dies) by a dicing process, a back grinding step of grinding the semiconductor wafer after the half-cut step to reduce its thickness, a mounting step of attaching one surface (e.g., the surface opposite to the circuit surface) of the semiconductor wafer after the back grinding step to a die bond layer 3 to fix the semiconductor wafer to a dicing tape 10, an expand step of widening the spacing between semiconductor chips, a kerf maintaining step of maintaining the spacing between semiconductor chips, a pickup step of peeling between the die bond layer 3 and an adhesive layer 2 and taking out the semiconductor chip (die) with the die bond layer 3 attached, and a die bond step of bonding the semiconductor chip (die) with the die bond layer 3 attached to a substrate. When these steps are carried out, the dicing tape (dicing die bond film) of the present embodiment is used as a manufacturing auxiliary tool.

[0090] In the half-cut step, as shown in FIGS. 2A and 2B, a half-cut process for dicing the semiconductor integrated circuit into small pieces (dies) is performed. Specifically, a wafer processing tape T is attached to the surface of the semiconductor wafer W opposite to the circuit surface (see FIG. 2A). Also, a dicing ring R is attached to the wafer processing tape T (see FIG. 2A). With the wafer processing tape T attached, a dividing groove is formed (see FIG. 2B). In the back grinding step, as shown in FIGS. 2C and 2D, the semiconductor wafer is ground to reduce its thickness. Specifically, a back grinding tape G is attached to the surface where the groove is formed while peeling off the previously attached wafer processing tape T (see FIG. 2C). With the back grinding tape G attached, grinding is performed until the semiconductor wafer W reaches a predetermined thickness (see FIG. 2D). In the backgrind process, when the thickness of the semiconductor wafer is particularly thin, i.e., 20 μm or more and 30 μm or less, in the pickup process described later, when the semiconductor chip is pushed up using the pin member P, the semiconductor chip is likely to be deformed or cracked. However, since the dicing die bond film 20 according to the present embodiment is configured as described above, in the pickup process, it is possible to relatively suppress the occurrence of deformation or cracking in the semiconductor chip.

[0091] In the mounting process, as shown in FIGS. 3A to 3B, after attaching the dicing ring R to the adhesive layer 2 of the dicing tape 10, the half-cut semiconductor wafer W is attached to the exposed surface of the die bond layer 3 (see FIG. 3A). Thereafter, the backgrind tape G is peeled off from the semiconductor wafer W (see FIG. 3B).

[0092] In the expand process, as shown in FIGS. 4A to 4C, the dicing ring R is fixed to the holder H of the expand device. By pushing up the dicing die bond film 20 from below using the pushing member U provided in the expand device, the dicing die bond film 20 is stretched so as to expand in the plane direction (see FIG. 4B). Thereby, at a specific temperature condition, the half-cut semiconductor wafer W is cut. The above temperature condition is, for example, -20 to 5°C, preferably -15 to 0°C, and more preferably -10 to -5°C. By lowering the pushing member U, the expanded state is released (see FIG. 4C). Furthermore, in the expand process, as shown in FIGS. 5A to 5B, at a higher temperature condition (for example, room temperature (23 ± 2°C)), the dicing tape 10 is stretched so as to expand the area. Thereby, the adjacent cut semiconductor chips are separated in the plane direction of the film surface, and the interval is further widened.

[0093] In the kerf maintaining process, as shown in FIG. 6, hot air (for example, 100 to 130°C, illustrated by arrows) is applied to the dicing tape 10 to thermally contract the dicing tape 10 and then cooled and solidified to maintain the distance (kerf) between adjacent semiconductor chips that have been severed.

[0094] In the pick-up process, as shown in FIG. 7, the semiconductor chip with the die bond layer 3 attached is peeled off from the adhesive layer 2 of the dicing tape 10. Specifically, the pin member P is raised to push up the semiconductor chip to be picked up through the dicing tape 10. The pushed-up semiconductor chip is held by the suction jig J. In the dicing die bond film 20 according to this embodiment, FTIR analysis is performed on each of the exposed portion of the adhesive layer 2 and the laminated portion with the die bond layer 3. The sum of the peak heights of all peaks appearing in the range of 675 cm -1 or more and 900 cm -1 or less at the exposed portion of the adhesive layer 2 is designated as H1, the peak height appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less at the exposed portion of the adhesive layer 2 is designated as T1, the sum of the peak heights of all peaks appearing in the range of 675 cm -1 or more and 900 cm -1 or less at the laminated portion with the die bond layer 3 is designated as H2, and the peak height appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less at the laminated portion with the die bond layer 3 is designated as T2. Since the value of R calculated by the above formula (1) is 1.5 or less, the pick-up process can be carried out in a state where the peeling force of the adhesive layer 2 with respect to the die bond layer 3 is sufficiently reduced. That is, the pick-up process can be carried out smoothly.

[0095] In the die bond process, the semiconductor chip with the die bond layer 3 attached is adhered to the adherend.

[0096] Note that the dicing die bond film according to the present invention is not limited to the above embodiment. Further, the dicing die bond film according to the present invention is not limited by the above-described effects. The dicing die bond film according to the present invention can be variously modified without departing from the gist of the present invention.

Example

[0097] Next, the present invention will be described more specifically with reference to examples. The following examples are for further explaining the present invention and do not limit the scope of the present invention.

[0098] [Example 1] [Synthesis of Acrylic Polymer] In a reaction vessel equipped with a cooling pipe, a nitrogen introduction pipe, a thermometer, and a stirring device, (meth)acrylic monomers were put in the mixing ratios shown in Table 1 below. At the same time, benzoyl peroxide (hereinafter referred to as BPO) as a thermal polymerization initiator was added in an amount of 0.2 parts by mass with respect to 100 parts by mass of the (meth)acrylic monomers. Further, toluene as a reaction solvent was added so that the concentration of the (meth)acrylic monomers became 52%. Then, under a nitrogen stream, polymerization was carried out at 62°C for 4 hours and polymerization treatment was carried out at 78°C for 2 hours to obtain a first acrylic polymer as an intermediate. To the solution containing this first acrylic polymer, (meth)acrylic monomers were put in the mixing ratios shown in Table 1 below. At the same time, 0.06 parts by mass of dibutyltin dilaurate was added with respect to 100 parts by mass of the first acrylic polymer A. Then, under an air stream, an addition reaction treatment was carried out at 50°C for 12 hours to obtain an acrylic polymer according to Example 1. Here, when obtaining the first acrylic polymer, 2-isocyanatoethyl methacrylate (hereinafter referred to as MOI) is used as the (meth)acrylate monomer. However, since MOI undergoes addition polymerization with HEA, it is not included in the mol% of the (meth)acrylate monomer. Note that, as the MOI, the product name "Karenz MOI (registered trademark)" manufactured by Showa Denko KK was used. "Karenz MOI (registered trademark)" is a polymerizable group-containing (meth)acrylate having an isocyanate group and has a vinyl group as the polymerizable group.

[0099] <Preparation of Adhesive Solution> To the solution containing the acrylic polymer according to Example 1, a polyisocyanate compound (product name "Coronate L", manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent and a photoinitiator (product name "Omnirad127", manufactured by IGM Resins) were added at the compounding ratios shown in Table 1 below to prepare the adhesive solution according to Example 1. Note that the parts by mass of the crosslinking agent and the parts by mass of the photoinitiator shown in Table 1 below are values based on 100 parts by mass of the acrylic polymer according to Example 1.

[0100] <Preparation of Dicing Tape> The adhesive solution according to Example 1 was applied onto the silicone release-treated surface of a PET separator (thickness: 50 μm) having a silicone release-treated surface using an applicator, and dried at 120°C for 2 minutes to form an adhesive layer with a thickness of 30 μm. Then, a polyolefin film (product name "RB-0192", thickness: 120 μm) manufactured by Kuraray Co., Ltd. as a base material layer was laminated on the adhesive layer, and stored at 50°C for 24 hours to obtain the dicing tape according to Example 1.

[0101] <Preparation of Die Bond Layer> To 100 parts by mass of an acrylic resin (trade name "SG-N80", manufactured by Nagase ChemteX Corporation, glass transition temperature -23°C), 210 parts by mass of an epoxy resin (trade name "EPPN 501HY", manufactured by Nippon Kayaku Co., Ltd.), 100 parts by mass of phenol resin 1 (trade name "LVR8210-DL", manufactured by Gunei Chemical Industry Co., Ltd.), 33 parts by mass of phenol resin 2 (trade name "HF-1M", manufactured by Meiwa Kasei Co., Ltd.), 440 parts by mass (in terms of spherical silica) of spherical silica (trade name "SE2050-MCV", manufactured by Admatechs Co., Ltd., average particle diameter 500 nm), 3 parts by mass of a silane coupling agent (trade name "KBM-303", manufactured by Shin-Etsu Chemical Co., Ltd.), and 0.5 parts by mass of a thermosetting catalyst (trade name "TPP-K", manufactured by Hokko Chemical Industry Co., Ltd.) were added to methyl ethyl ketone and mixed to prepare the adhesive composition according to Example 1. Next, the adhesive composition according to Example 1 was applied onto the silicone release-treated surface of a PET separator (thickness 50 μm) having a silicone release-treated surface using an applicator to form a coating film, and this coating film was subjected to a solvent removal treatment at 130°C for 2 minutes. Thereby, a die bond layer having a thickness (average thickness) of 40 μm was produced on the PET separator (a PET separator with a die bond layer was produced). Then, after overlapping the die bond layers of two sets of PET separators with die bond layers (after overlapping them such that the PET separators were on the outside), one PET separator was peeled off to expose the die bond layer, and the die bond layer of another set of PET separators with die bond layers was further overlapped on the exposed die bond layer. After overlapping three die bond layers in this way, lamination was performed using a roll laminator to produce a die bond layer having a thickness of 120 μm. Note that the lamination using the roll laminator was performed under the conditions of a lamination speed of 10 mm / second, a temperature of 90°C, and a pressure of 0.15 MPa.

[0102] <Production of Dicing Die Bond Film> First, the die bond layer with PET separators laminated on both sides was punched out into a 330 mmφ circle. Next, the PET separator was removed from the dicing tape according to Example 1 to expose one surface of the adhesive layer, and after removing the PET separator from one side of the die bond layer with the PET separator laminated on both sides to expose one surface of the die bond layer, the exposed surface of the die bond layer and the exposed surface of the adhesive layer were overlapped at room temperature (23 ± 2°C). Then, by performing lamination using a roll laminator, a dicing die bond film according to Example 1 was obtained. That is, the dicing tape according to Example 1 was composed of a polyolefin film, an adhesive layer, a die bond layer, and a PET separator laminated in this order. Note that the lamination using the roll laminator was performed under the conditions of a lamination speed of 10 mm / second, a temperature of 23 ± 2°C, and a pressure of 0.15 MPa.

[0103] [Example 2] [Synthesis of Acrylic Polymer] An acrylic monomer according to Example 2 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer had the blending ratio shown in Table 1 below. [Preparation of Adhesive Solution] Using the acrylic monomer according to Example 2, an adhesive solution according to Example 2 was obtained in the same manner as in Example 1. [Preparation of Dicing Tape] Using the adhesive solution according to Example 2, a dicing tape according to Example 2 was obtained in the same manner as in Example 1. [Preparation of Die Bond Layer] A die bond layer according to Example 2 was obtained in the same manner as in Example 1. [Preparation of Dicing Die Bond Film] Using the dicing tape according to Example 2 and the die bond layer according to Example 2, a dicing die bond film according to Example 2 was obtained in the same manner as in Example 1.

[0104] [Example 3] [Synthesis of Acrylic Polymer] An acrylic monomer according to Example 3 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer had the blending ratio shown in Table 1 below. <Preparation of Adhesive Solution> An adhesive solution according to Example 3 was obtained in the same manner as in Example 1, using the acrylic monomer according to Example 3. <Preparation of Dicing Tape> A dicing tape according to Example 3 was obtained in the same manner as in Example 1, using the adhesive solution according to Example 3. <Preparation of Die Bond Layer> A die bond layer according to Example 3 was obtained in the same manner as in Example 1. <Preparation of Dicing Die Bond Film> A dicing die bond film according to Example 3 was obtained in the same manner as in Example 1, using the dicing tape according to Example 3 and the die bond layer according to Example 3.

[0105] [Example 4] <Synthesis of Acrylic Polymer> An acrylic monomer according to Example 4 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer had the blending ratio shown in Table 1 below. <Preparation of Adhesive Solution> An adhesive solution according to Example 4 was obtained in the same manner as in Example 1, using the acrylic monomer according to Example 4. <Preparation of Dicing Tape> A dicing tape according to Example 4 was obtained in the same manner as in Example 1, using the adhesive solution according to Example 4. <Preparation of Die Bond Layer> A die bond layer according to Example 4 was obtained in the same manner as in Example 1. <Preparation of Dicing Die Bond Film> A dicing die bond film according to Example 4 was obtained in the same manner as in Example 4, using the dicing tape according to Example 4 and the die bond layer according to Example 4.

[0106] [Example 5] <Synthesis of Acrylic Polymer> An acrylic monomer according to Example 5 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer had the blending ratio shown in Table 1 below. <Preparation of Adhesive Solution> An adhesive solution according to Example 5 was obtained in the same manner as in Example 1, using the acrylic monomer according to Example 5. <Preparation of Dicing Tape> A dicing tape according to Example 5 was obtained in the same manner as in Example 1, using the adhesive solution according to Example 5. <Preparation of Die Bond Layer> A die bond layer according to Example 5 was obtained in the same manner as in Example 1. <Preparation of Dicing Die Bond Film> A dicing die bond film according to Example 5 was obtained using the dicing tape according to Example 5 and the die bond layer according to Example 5.

[0107] [Example 6] <Synthesis of Acrylic Polymer> An acrylic monomer according to Example 6 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer had the blending ratio shown in Table 1 below. <Preparation of Adhesive Solution> An adhesive solution according to Example 6 was obtained in the same manner as in Example 1, using the acrylic polymer according to Example 6 and setting the crosslinking agent (Coronate L) and the photopolymerization initiator (Omnirad 127) at the blending ratios shown in Table 1 below. <Preparation of Dicing Tape> A dicing tape according to Example 6 was obtained in the same manner as in Example 1, using the adhesive solution according to Example 6. <Preparation of Die Bond Layer> A die bond layer according to Example 6 was obtained in the same manner as in Example 1. <Preparation of Dicing Die Bond Film> A dicing die bond film according to Example 6 was obtained using the dicing tape according to Example 6 and the die bond layer according to Example 6.

[0108] [Comparative Example 1] <Synthesis of Acrylic Polymer> (Meth)acrylic monomers were used in the blending ratios shown in Table 1 below, and an acrylic polymer according to Comparative Example 1 was obtained in the same manner as in Example 1, except for this. <Preparation of Adhesive Solution> An adhesive solution according to Comparative Example 1 was obtained in the same manner as in Example 1, except that the acrylic polymer according to Comparative Example 1 was used and the crosslinking agent (Coronate L) and the photopolymerization initiator (Omnirad 127) were used in the blending ratios shown in Table 1 below. <Preparation of Dicing Tape> Using the adhesive solution according to Comparative Example 1, a dicing tape according to Comparative Example 1 was obtained in the same manner as in Example 1. <Preparation of Die Bond Layer> A die bond layer according to Comparative Example 1 was obtained in the same manner as in Example 1. <Preparation of Dicing Die Bond Film> Using the dicing tape according to Comparative Example 1 and the die bond layer according to Comparative Example 1, a dicing die bond film according to Comparative Example 1 was obtained.

[0109] [Comparative Example 2] <Synthesis of Acrylic Polymer> (Meth)acrylic monomers were used in the blending ratios shown in Table 1 below, and an acrylic polymer according to Comparative Example 2 was obtained in the same manner as in Example 1, except for this. <Preparation of Adhesive Solution> An adhesive solution according to Comparative Example 2 was obtained in the same manner as in Example 1, except that the acrylic polymer according to Comparative Example 2 was used and the crosslinking agent (Coronate L) and the photopolymerization initiator (Omnirad 127) were used in the blending ratios shown in Table 1 below. <Preparation of Dicing Tape> Using the adhesive solution according to Comparative Example 2, a dicing tape according to Comparative Example 2 was obtained in the same manner as in Example 1. <Preparation of Die Bond Layer> A die bond layer according to Comparative Example 2 was obtained in the same manner as in Example 1. <Preparation of Dicing Die Bond Film> Using the dicing tape according to Comparative Example 2 and the die bonding layer according to Comparative Example 2, a dicing die bonding film according to Comparative Example 2 was obtained.

[0110] In Table 1 below, LA means lauryl acrylate (alkyl (meth)acrylate having an alkyl group with 12 or more carbon atoms), INA means isononyl acrylate (alkyl (meth)acrylate having an alkyl group with 9 or more carbon atoms), 2EHA means 2-ethylhexyl acrylate, BA means butyl acrylate, EA means ethyl acrylate, and HEA means 2-hydroxyethyl acrylate (hydroxyl group-containing (meth)acrylate).

[0111]

Table 1

[0112] (FTIR analysis) For the dicing die bonding film according to each example, FTIR analysis was performed on each of the exposed portion of the adhesive layer and the laminated portion with the die bonding layer as described in the section of the above embodiment, and data for each of the exposed portion of the adhesive layer and the laminated portion with the die bonding layer were obtained. Next, the obtained data were each plotted on a graph with the horizontal axis being the wave number (unit: cm -1 ) and the vertical axis being the detection intensity (abs), and then a curve connecting the plotted data was drawn for each data series. Then, based on the above curve, the sum H1 of the total peak heights appearing in the range of 675 cm -1 or more and 900 cm -1 or less at the exposed portion of the adhesive layer, the peak height T1 appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less at the exposed portion of the adhesive layer, the sum H2 of the total peak heights appearing in the range of 675 cm -1 or more and 900 cm -1 or less at the laminated portion with the die bonding layer, and at the laminated portion with the die bonding layer in the range of 1600 cm-1 Above 1800 cm -1 The peak height T2 that appears in the following range was determined. Note that the sum H1 and H2 of all peak heights, and the peak heights T1 and T2 were determined as described in the section of the above embodiment. Also, the value of R was determined using the following formula (1). For each example, the values of H1, H2, T1, T2, and R determined as described above are shown in Table 2 below.

[0113] [Number]

[0114] (Peeling force) For the dicing die bond film according to each example, the peeling force of the die bond layer with respect to the adhesive layer was measured. The peeling force of the die bond layer with respect to the adhesive layer was measured after curing the adhesive layer. The peeling force of the die bond layer with respect to the adhesive layer was measured by a T-peel test. The T-peel test was performed on a dicing die bond film in which a backing tape (product name "ELP BT315, manufactured by Nitto Denko Corporation") was bonded to the exposed surface of the die bond layer. Using a product name "UM-810" (high-pressure mercury lamp, 60 mW / cm 2 ) manufactured by Nitto Seiki Co., Ltd., ultraviolet rays with an intensity of 150 J / cm were irradiated from the dicing tape side to cure the adhesive layer, and then a sample cut out to a size of 50 mm in width × 120 mm in length was used as a measurement sample. Using a tensile testing machine (for example, product name "TG-1kN", manufactured by Minebea Mitsumi Inc.), the test was performed under the conditions of a temperature of 25 °C and a tensile strength of 300 mm / min. 2 The peeling force measured as described above is shown in Table 2 below. The peeling force measured as described above is shown in Table 2 below.

[0115] (Pick-up property) The pick-up property of the semiconductor chip with a die bond layer in a cut state was evaluated. The semiconductor chip with a die bond layer in a cut state was obtained according to the following procedure. (1) For a 12-inch bare wafer (diameter 300 mm, thickness 55 μm) with a dividing groove (10 mm × 10 mm) formed by half-cut, attach a back grinding tape to the surface on which the dividing groove is formed. (2) Using a back grinder (manufactured by DISCO, model DGP8760), grind the 12-inch bare wafer from the surface opposite to the side where the back grinding tape is attached until the thickness reaches 25 μm to obtain a back-grounded bare wafer. (3) Attach the die bond layer of the dicing die bond film according to each example to the side opposite to the attachment surface of the back grinding tape on the back-grounded bare wafer to obtain a bare wafer with a dicing die bond film. (4) The bare wafer with a dicing die bond is obtained by expanding it using a die separator device (product name "Die Separator DDS3200", manufactured by DISCO). Note that the expansion using the die separator device was performed with the back grinding tape peeled off from the bare wafer. In the expansion using the die separator device, after performing cool expansion, normal temperature expansion was performed.

[0116] The cool expansion was performed according to the following procedure. (1) Attach a SUS ring frame (manufactured by DISCO) with a diameter of 12 inches to the frame attachment area on the adhesive layer of the dicing die bond film attached to the bare wafer at room temperature. (2) Mount the bare wafer with the SUS ring frame attached to the die separator device, and perform it by expanding the dicing tape of the dicing die bond film with the cool expander unit of the die separator device. (3) The cool expansion is performed under the conditions of an expansion temperature of -15°C, an expansion speed of 100 mm / second, and an expansion amount of 7 mm. Note that after the cool expansion, the semiconductor wafer was diced into a plurality of semiconductor chips, and the die bond layer was also diced into sizes corresponding to the semiconductor chips, resulting in a plurality of semiconductor chips with die bond layers.

[0117] The room temperature expansion was performed by expanding the dicing tape of the dicing die bond film using the room temperature expansion unit of the die separation device after the cool expansion. The room temperature expansion was carried out under the conditions of an expansion temperature of 23 ± 2°C, an expansion speed of 1 mm / second, and an expansion amount of 10 mm. The dicing tape after the room temperature expansion was subjected to a heat shrinkage treatment. The heat shrinkage treatment was performed under the conditions of a temperature of 200°C and a time of 20 seconds.

[0118] After the dicing tape was heat-shrunk, a pick-up test of the diced semiconductor chips with die bond layers was performed using a device having a pick-up mechanism (trade name "Die Bonder SPA-300", manufactured by Shinagawa). In the device having the pick-up mechanism, the pushing-up speed by the pin member was set to 1 mm / second, and the pushing-up amount was set to 2000 μm. The pick-up test was performed using a product named "UM-810" (high-pressure mercury lamp, 60 mW / cm 2 ) manufactured by Nitto Seiki Co., Ltd., and after irradiating ultraviolet rays with an intensity of 150 J / cm 2 from the dicing tape side to cure the adhesive layer. The pick-up test was performed on 5 semiconductor chips with die bond layers, and the pick-up property was judged according to the following criteria. Excellent: All 5 semiconductor chips with die bond layers can be picked up. Good: 3 or 4 out of 5 semiconductor chips with die bond layers can be picked up. Fair: 1 or 2 out of 5 semiconductor chips with die bond layers can be picked up. Poor: None of the 5 semiconductor chips with die bond layers can be picked up. The results of evaluating the pick-up property are shown in Table 2 below.

[0119]

Table 2

[0120] From Table 2, it can be seen that in the dicing die bond films according to Examples 1 to 6, the values of R are all 1.5 or less, and the peel strength (the peel strength of the die bond layer with respect to the adhesive layer) is a sufficiently low value of 0.3 N or less. And it can be seen that in the dicing die bond films according to Examples 1 to 6, the pick-up property is good (good or excellent) in all cases. In particular, in the dicing die bond films according to Examples 2 and 5, it can be seen that the peel strength has sufficiently decreased to 0.14 N, and the pick-up property is particularly good and excellent.

[0121] On the other hand, it can be seen that in the dicing die bond film according to Comparative Example 1, the peel strength shows a high value of 0.48 N, and in the dicing die bond film according to Comparative Example 2, the peel strength shows a particularly high value of 1.75 N. And it can be seen that in the dicing die bond film according to Comparative Example 1, the pick-up property is slightly poor (acceptable), and in the dicing die bond film according to Comparative Example 2, the pick-up property is poor (unacceptable).

[0122] From these results, in the dicing die bond film, for each of the exposed portion of the adhesive layer and the laminated portion with the die bond layer, FTIR analysis was performed, and at 675 cm -1 or more and 900 cm -1 or less in the exposed portion of the adhesive layer, the sum of the heights of all peaks appearing in the range is defined as H1, and at 1600 cm -1 or more and 1800 cm -1 or less in the exposed portion of the adhesive layer, the peak height is defined as T1, and at 675 cm in the laminated portion with the die bond layer -1900 cm or more -1 Let the sum of the heights of all peaks appearing in the range of 1600 cm -1 or more and 1800 cm -1 or less at the laminated portion with the die bond layer be H2, and when the peak height appearing in the range of 1600 cm or more and 1800 cm or less at the laminated portion with the die bond layer is T2, it can be understood that when the value of R calculated by the above formula (1) is 1.5 or less, the peeling force of the adhesive layer with respect to the die bond layer can be sufficiently reduced when peeling the die bond layer from the adhesive layer.

Explanation of Reference Numerals

[0123] 1 Substrate layer 2 Adhesive layer 3 Die bond layer 10 Dicing tape 20 Dicing die bond film G Back grinding tape H Holder J Suction jig P Pin member R Dicing ring T Wafer processing tape U Pushing member W Semiconductor wafer

Claims

1. A dicing tape with an adhesive layer laminated on a base material layer, and a die bond layer laminated on the adhesive layer with a part of the adhesive layer exposed, wherein the adhesive layer contains an acrylic polymer including a structural unit of isononyl acrylate and a structural unit of lauryl acrylate, the die bond layer contains an aromatic compound, FTIR analysis is performed on each of the exposed portion of the adhesive layer and the laminated portion with the die bond layer, The sum of the heights of all peaks appearing in the range of 675 cm －１ or more and 900 cm －１ or less at the exposed portion of the adhesive layer is defined as H1, The peak height that appears in the range of 1600 cm －１ or more and 1800 cm －１ or less at the exposed portion of the adhesive layer is defined as T1, The sum of the total peak heights appearing in the range of 675 cm －１ or more and 900 cm －１ or less at the laminated portion with the die bond layer is defined as H2, When the peak height that appears in the range of 1600 cm －１ or higher and 1800 cm －１ or lower at the laminated portion with the die bond layer is defined as T2 and the value of R calculated by the following formula (1) is 1.5 or less A dicing die bond film. 【Number 1】

2. The acrylic polymer contains 13 mol% or more of the structural unit of isononyl acrylate The dicing die bond film according to Claim 1.

3. The acrylic polymer contains 15 mol% or more of the structural unit of lauryl acrylate The dicing die bond film according to Claim 1 or 2.

4. The acrylic polymer further contains a structural unit of a hydroxyl group-containing (meth)acrylate The dicing die bond film according to any one of Claims 1 to 3.

Images