Information processing apparatus and control method

Abstract

Efficiently exhaust the heat of the device that serves as the main heat source. 【Solution means】It includes a controller, a housing that houses a plurality of temperature sensors, a first heat dissipation fan, and a second heat dissipation fan. The first heat dissipation fan and the second heat dissipation fan are respectively installed in the vicinity within a predetermined range from one end and the other end of one side surface of the housing. The first heat dissipation fan and the second heat dissipation fan blow air at least in a direction facing each other, and have a first control mode for controlling the outputs of the first heat dissipation fan and the second heat dissipation fan equally, and a second control mode for variably controlling the output ratio between the output of the first heat dissipation fan and the output of the second heat dissipation fan. When the first temperature detected by a predetermined first temperature sensor among the plurality of temperature sensors is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor close to either the first heat dissipation fan or the second heat dissipation fan is higher than a predetermined second reference temperature, the controller selects the second control mode.

Description

Technical Field

[0001] This application relates to an information processing apparatus and a control method, for example, an exhaust heat mechanism that exhausts heat generated inside a housing.

Background Art

[0002] Electronic devices including personal computers (PCs) are configured to include devices that are heat sources. In particular, processors such as CPUs (Central Processing Units) that consume a large amount of power are the main heat sources. The temperature rise due to heat generation can cause failures and malfunctions. Therefore, many electronic devices are provided with an exhaust heat mechanism for dissipating the heat generated by the devices.

[0003] In addition, there is a tendency for power consumption to increase due to the higher functionality of devices. Therefore, further improvement in exhaust heat efficiency has become more important. For example, the electronic device described in Patent Document 1 includes a casing member, a low heat transfer medium, a second heat spreader, and a first heat spreader, and has a casing structure. When a user uses such an electronic device, the flow of heat generated from the heat source is transmitted from the first heat spreader to the second heat spreader. According to the low heat transfer medium, the heat conduction speed from the second heat spreader to the casing member is decelerated, and the flow of heat is radiated from the outer surface of the casing member and dissipated to the atmosphere.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Generally, the power consumption varies greatly depending on the operating conditions of the electronic device. Along with the variation in power consumption, the amount of heat generated changes. Also, the devices that are the main heat sources are not limited to the processor. Depending on the operating conditions, the memory or the charger may become the main heat source. The exhaust heat mechanism described in Patent Document 1 functions effectively for the devices arranged at specific sites, but does not necessarily function effectively for the heat from the devices distributed over all sites.

Means for Solving the Problems

[0006] The present application has been made to solve the above problems, and an information processing apparatus according to one aspect of the present application includes a controller, a plurality of temperature sensors, a first heat radiation fan, and a housing that houses the second heat radiation fan. The first heat radiation fan and the second heat radiation fan are installed in the vicinity within a predetermined range from one end and the other end of one side surface of the housing, respectively. The first heat radiation fan and the second heat radiation fan blow air at least in a direction facing each other, and have a first control mode for controlling the outputs of the first heat radiation fan and the second heat radiation fan equally, and a second control mode for variably controlling the output ratio between the output of the first heat radiation fan and the output of the second heat radiation fan. The controller selects the second control mode when a first temperature detected by a predetermined first temperature sensor among the plurality of temperature sensors is lower than a predetermined first reference temperature, and a second temperature detected by a second temperature sensor close to either the first heat radiation fan or the second heat radiation fan is higher than a predetermined second reference temperature.

[0007] In the above information processing apparatus, in the second control mode, the controller may control the outputs of the first heat radiation fan and the second heat radiation fan such that the output ratio of the output of the second heat radiation fan to the output of the first heat radiation fan increases as the position of the second temperature sensor that has detected the second temperature higher than the second reference temperature is closer to the first heat radiation fan than to the second heat radiation fan.

[0008] In the above information processing apparatus, the housing may accommodate a processor, a memory, and a charger.

[0009] In the above information processing apparatus, the housing may include air inlets on the front or bottom surfaces of the first heat dissipation fan and the second heat dissipation fan, respectively, and an air outlet on the opposing surface that is the surface opposite to the one side surface.

[0010] In the above information processing apparatus, a heat radiator may be housed in the housing, the one side surface may be sealed, and the heat radiator may be adjacent to at least a part of the air outlet.

[0011] A control method according to an aspect of the present application includes a controller, a plurality of temperature sensors, and a housing that houses a first heat dissipation fan and a second heat dissipation fan. The first heat dissipation fan and the second heat dissipation fan are installed in the vicinity within a predetermined range from one end and the other end of one side surface of the housing, respectively. The first heat dissipation fan and the second heat dissipation fan blow air at least in a direction facing each other, and include a first control mode for controlling the outputs of the first heat dissipation fan and the second heat dissipation fan equally, and a second control mode for variably controlling the output ratio between the output of the first heat dissipation fan and the output of the second heat dissipation fan. The information processing apparatus selects the second control mode when a first temperature detected by a predetermined first temperature sensor among the plurality of temperature sensors is lower than a predetermined first reference temperature and a second temperature detected by a second temperature sensor close to either the first heat dissipation fan or the second heat dissipation fan is higher than a predetermined second reference temperature.

Advantages of the Invention

[0012] According to the embodiment of the present application, the heat of the device serving as the main heat source can be dissipated with high efficiency.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present application will be described with reference to the drawings. A configuration example of the information processing apparatus 1 according to the present embodiment will be described.

[0015] FIG. 1 is a schematic block diagram showing a configuration example of the information processing apparatus 1 according to the present embodiment. In the example of FIG. 1, the information processing apparatus 1 is configured as a general-purpose personal computer (PC). The information processing apparatus 1 includes a host system 10, a display 14, a ROM (Read Only Memory) 22, an auxiliary storage device 23, a communication module 25, an input / output I / F (Interface) 26, an EC (Embedded Controller) 31, an input device 32, a power supply circuit 34, and a heat radiation mechanism 35. A battery 33 is housed in the information processing apparatus 1.

[0016] The host system 10 is a computer system that forms the core of the information processing apparatus 1. The host system 10 includes a CPU (Central Processing Unit) 11, a main memory 12, a GPU (Graphic Processing Unit) 13, a VRAM (Video Random Access Memory) 132, and a chipset 21.

[0017] The main memory 12 is a writable memory that is used as a loading area for the execution program of the CPU 11 or as a working area for writing the processing data of the execution program. The main memory 12 is composed of, for example, a plurality of DRAM (Dynamic Random Access Memory) chips. The CPU 11 and the main memory 12 are the minimum hardware that makes up the host system 10.

[0018] The GPU 13 is an arithmetic processing unit mainly for realizing functions related to image display. The GPU 13 processes (image processes) the drawing commands issued from the CPU 11 and writes the display data indicating the obtained display information into the VRAM 132 provided in its own unit. The GPU 13 sequentially reads out the display data written from the VRAM 132 and outputs the read display data to the display 14. The GPU 13 may share some processing with the CPU 11. The GPU 13 may execute parallel arithmetic processing other than image processing or share some processing with the CPU 11.

[0019] The VRAM 132 temporarily stores the display data generated by the GPU 13 and functions as a buffer until it is output to the display 14. The VRAM 132 corresponds to a video memory. The VRAM 132 may be used for buffering the intermediate data generated by the rendering process by the GPU 13.

[0020] The display 14 displays a display screen based on the display data input from the GPU 13. The display 14 may be, for example, any of a liquid crystal display (LCD), an OLED (Organic Light Emitting Diode) display, etc.

[0021] The chipset 21 includes a plurality of controllers and is connectable so as to be able to input and output various data with a plurality of devices. The controllers provided in the chipset 21 may be any of, for example, USB (Universal Serial Bus), SPI (Serial Peripheral Interface) bus, PCI-Express bus, and the like. In the example of FIG. 1, the chipset 21 is connected to the ROM 22, the auxiliary storage device 23, the communication module 25, the input / output I / F 26, and the EC 31.

[0022] The ROM 22 mainly stores firmware. The firmware stored in the ROM 22 includes firmware such as BIOS (Unified Extensible Firmware Interface Basic Input / Output System) and firmware for controlling individual devices. The ROM 22 may be any of EEPROM (Electrically Erasable Programmable Read Only Memory), flash ROM, and the like.

[0023] The auxiliary storage device 23 stores various data used for the processing of the host system 10, various data obtained by those processes, or various programs and the like. The auxiliary storage device 23 is, for example, an SSD (Solid State Drive).

[0024] The communication module 25 is connected to a communication network so as to be able to transmit and receive various data wirelessly or wired. The communication module 25 communicates various data with other devices connected to the communication network. The communication module 25 is, for example, a wireless LAN module that connects to a wireless LAN.

[0025] The input / output I / F 26 is connected to various devices so as to be able to input and output data wirelessly or wired. The input / output I / F 26 includes, for example, a connector (USB connector) for inputting and outputting data wired in accordance with the USB standard. EC31 is a controller that monitors and controls the operations of various devices connected to itself regardless of the operating state of the host system 10. EC31 is provided with a CPU, a ROM, a RAM, a timer, and an input / output I / F separately from the host system 10. Devices with a lower data transfer speed than the chipset 21 can be connected to EC31. In the example of FIG. 1, an input device 32, a power supply circuit 34, and a heat dissipation mechanism 35 are connected to EC31.

[0026] The input device 32 detects a user's operation, generates an operation signal according to the detected operation, and outputs it to EC31. The input device 32 may be, for example, any of a keyboard, a touch pad, and the like. The battery 33 stores the power supplied from the power supply circuit 34. Alternatively, the battery 33 discharges the power stored in itself to the power supply circuit 34. The battery may be, for example, any of a lithium-ion battery, a sodium-ion battery, and the like.

[0027] The power supply circuit 34 executes power supply to each device according to the control of EC31. The power supply circuit 34 includes a charger 341 and a DC / DC (Direct Current / Direct Current) 342. The charger 341 charges the battery 33 with the power remaining from the power supplied from the external power supply without being consumed by each device. When no power is supplied from the external power supply, or when the power supplied from the external power supply does not satisfy the demand, the charger 341 supplies the power discharged from the battery 33 to each device.

[0028] DC / DC 342 is a voltage converter that converts the voltage of the DC power supplied from an external power supply or a battery (not shown) into the voltage required for the operation of each device constituting the information processing apparatus 1. DC / DC 342 supplies the DC power having the converted voltage to the device at the supply destination.

[0029] The heat dissipation mechanism 35 is housed inside the housing 50 (Fig. 2) of the information processing apparatus 1, and controls the distribution of the heat dissipation amount from the information processing apparatus 1 according to the temperature distribution detected under the control of the EC 31. The heat dissipation mechanism 35 includes a plurality of temperature sensors, drive circuits 353, and two heat dissipation fans 355. The plurality of temperature sensors are dispersedly arranged at different positions inside the housing 50. The plurality of temperature sensors consists of one or more first temperature sensors 351 and one or more second temperature sensors 352. The first temperature sensor 351 is arranged at a position substantially in the middle of the two heat dissipation fans 355. The second temperature sensor 352 is arranged at a position closer to one of the two heat dissipation fans 355 than the other.

[0030] In the example of Fig. 1, the heat dissipation mechanism 35 includes one first temperature sensor, N (N is an integer of 2 or more determined in advance) second temperature sensors 352, two drive circuits 353, and two heat dissipation fans 355. In Fig. 1, members such as N second temperature sensors 352, two drive circuits 353, and two heat dissipation fans 355 are each distinguished by attaching a sub-number (-1, etc.). In this application, for matters common among a plurality of like members and other matters that do not need to be distinguished, the sub-numbers may be omitted.

[0031] The first temperature sensor 351 and the second temperature sensors 352-1 to 352-N each detect the temperature of its own part and output a temperature signal indicating the detected temperature to the EC 31. Each drive circuit 353 supplies power to the corresponding heat dissipation fan 355 from the power supply circuit 34 according to the control of the EC 31. The operation of each heat dissipation fan 355 is controlled according to the power supplied from the power supply circuit 34. Each of the heat dissipation fans 355 includes a motor that rotates by consuming the power supplied from the corresponding drive circuit 353, and the motor rotates the blades. The rotation of the blades causes an air flow to occur as air flows into the housing 50. The inflowing air exchanges heat with the components of the information processing apparatus 1 and is discharged outside the housing 50. The arrangement of the two heat dissipation fans 355 and some devices inside the housing 50 and the output control of the heat dissipation fans 355 will be described later.

[0032] The host system 10 has the CPU 11 execute various programs and realizes its functions in cooperation with hardware such as the main memory 12, the chipset 21, and the EC 31. The host system 10 is a computer system that executes an OS (Operating), manages the execution of other programs, manages computing resources such as memory and processes, and manages input / output with each device. The host system 10 is connected to the temperature sensor 351 via the EC 31. The host system 10 operates according to one of a plurality of predetermined power modes, and power control parameters are set in the registers of the CPU 11 for each power mode.

[0033] The host system 10 may select a power control mode indicated by an operation signal input from the input device 32 according to a user operation, or may select a power control mode that satisfies the power consumption by that process according to the change trend of the power consumption of the CPU 11 or the application program being executed. The host system 10 notifies the selected power control mode to the EC 31.

[0034] The power control parameters include, for example, a first limit power (PL1: Power Limit 1). PL1 corresponds to the rated power. The rated power is a threshold value for restricting that the moving average of the power consumption of the CPU 11 temporarily exceeds this value, but restricting that it constantly (for example, continuously for several seconds to several tens of seconds or more) exceeds this value. The window length in the moving average (that is, the observation period related to the moving average of the power consumption) is, for example, about 1 to 10 s. The power control parameters may include a second limit power (PL2: Power Limit 2). PL2 is a threshold value for restricting that the power consumption exceeds this value even if it is temporary. Generally, the higher the clock frequency of the CPU 11, the more arithmetic processing is executed, and accordingly the power consumption increases. The CPU 11 adjusts the clock frequency so that, for example, the instantaneous value of the power consumption does not exceed PL2 and the moving average of the power consumption does not exceed PL1.

[0035] The power supply modes include, for example, a performance mode, a balance mode, and an eco mode. PL1 is set to be the smallest in the order of the performance mode, the balance mode, and the eco mode, and is the largest with respect to the performance mode. PL2 may be smaller in the order of the performance mode, the balance mode, and the eco mode, or may be equal among some or all of the power control modes. The maximum output is set to be the smallest in the order of the performance mode, the balance mode, and the eco mode, and is the largest with respect to the performance mode. Among the three levels, for the performance mode, in which the power consumption tends to be larger than other power supply modes, the operation of the heat radiation fan 355 is permitted, and for the balance mode and the eco mode, the operation of the heat radiation fan 355 may be stopped.

[0036] Next, an example of the device arrangement in the information processing apparatus 1 according to the present embodiment will be described. FIG. 2 is a plan view showing an example of the device arrangement in the information processing apparatus 1 according to the present embodiment. The information processing apparatus 1 has a housing 50, and various devices are accommodated in the space inside the housing 50. The housing 50 has a horizontally long shape with one side length being longer than the other sides. Heat dissipation fans 355-1 and 355-2 are arranged at positions separated by a predetermined distance from one end and the other end in the longitudinal direction (in the present application, they are respectively referred to as the "left end" and the "right end", and the respective directions may be referred to as the "left side" and the "right side"). The heat dissipation fans 355-1 and 355-2 are arranged symmetrically left and right. Fins 356-1 and 356-2 are respectively arranged between one of the side surfaces parallel to the longitudinal direction of the housing 50 (which may be referred to as the "rear surface" in the present application) and the heat dissipation fans 355-1 and 355-2. The rear surface of the housing 50 has an open area. That area is formed as an exhaust port 50e. The other side surface parallel to the longitudinal direction of the housing 50 (which may be referred to as the "front surface" in the present application) is sealed and has no opening.

[0037] The heat dissipation fans 355-1 and 355-2 occupy areas close within a predetermined range from one end and the other end of the front surface respectively. The housing 50 has open areas on the surfaces (which may be referred to as the "upper surfaces" in the present application) covering the heat dissipation fans 355-1 and 355-2 respectively. Those areas are formed as intake ports 50i-1 and 50i-2.

[0038] Therefore, the air flow generated by the operation of the heat dissipation fans 355-1 and 355-2 passes while absorbing the heat radiated from the fins 356-1 and 356-2, and is discharged from the exhaust port 50e. Here, the heat dissipation fans 355-1 and 355-2 blow air toward the exhaust port 50e via the fins 356-1 and 356-2 by rotating their blades respectively. The fins 356-1 and 356-2 have the function of a heat sink. That is, the fins 356-1 and 356-2 dissipate the heat conducted to themselves to the surrounding air. The air flowing around the fins 356-1 and 356-2 absorbs the heat radiated from the fins 356-1 and 356-2 and the temperature rises. The air that has absorbed heat is discharged from the exhaust port 50e to the outside of the housing 50.

[0039] The housings of the heat dissipation fans 355-1 and 355-2 each have a region that opens to the surface facing the heat dissipation fans 355-2 and 355-1, respectively. These regions are formed as exhaust ports 355o-1 and 355o-2, respectively. As illustrated in FIG. 3, the heat dissipation fans 355-1 and 355-2 each blow air toward the opposing heat dissipation fans 355-2 and 355-1 by rotating their blades. Then, the airflows generated by the heat dissipation fans 355-1 and 355-2 collide with each other and change their directions toward the exhaust port 50e. In the example of FIG. 3, the intensities of the airflows generated by the heat dissipation fans 355-1 and 355-2 are equivalent. Therefore, the bending points at which the respective airflows change their directions are located in the middle of the heat dissipation fans 355-1 and 355-2.

[0040] Other devices are arranged in the region sandwiched between the heat dissipation fans 355-1 and 355-2. In the example of FIG. 3, as other devices, a CPU 11, a GPU 13, a VRAM 132, an auxiliary storage device 23, a charger 341, a DC / DC 342, a first temperature sensor 351, and second temperature sensors 352-1 to 352-4 are arranged on the substrate. Therefore, the heat generated by these devices is absorbed by the airflows directed from the heat dissipation fans 355-1 and 355-2 toward the exhaust port 50e, respectively. An airflow with an increased temperature due to heat absorption is discharged from the exhaust port 50e.

[0041] The first temperature sensor 351 is arranged approximately at the center inside the housing 50. This position corresponds to the middle between the exhaust port 355o-1 of the heat dissipation fan 355-1 and the exhaust port 355o-2 of the heat dissipation fan 355-2. The temperature detected by the first temperature sensor 351 (which may be collectively referred to as the "first temperature" in the present application) may represent the temperature inside the housing 50 as described later. Also, the position of the first temperature sensor 351 is in the middle between the CPU 11 and the GPU 13. When the heat generation amount of the CPU 11 or the GPU 13 is large, the temperature detected by the temperature sensor 351 close to the CPU 11 and the GPU 13 becomes high. The first temperature sensor 351 is also called the "main temperature sensor".

[0042] The second temperature sensors 352-1 to 352-4 are arranged at a position closer to either the exhaust port 355o-1 of the radiator fan 355-1 or the exhaust port 355o-2 of the radiator fan 355-2 than the other. In the present application, the temperature detected by any one or all of the second temperature sensors 352-1 to 352-4 may be collectively referred to as the "second temperature".

[0043] The second temperature sensors 352-1 and 352-2 are arranged at positions biased to the left and right of the central portion inside the housing 50, respectively. That is, the second temperature sensors 352-1 and 352-2 are arranged closer to the radiator fans 355-1 and 355-2 than the radiator fans 355-2 and 355-1, respectively. The second temperature sensor 352-1 is arranged at a position close to the left side of the CPU 11. When the heat generation amount of the CPU 11 is large, the temperature detected by the second temperature sensor 352-1 close to the CPU 11 becomes high. The second temperature sensor 352-2 is arranged at a position closer to the right side across the GPU 13 and the VRAM 132 than the first temperature sensor 351. When the heat generation amount of the VRAM 132 is large, the temperature measured by the second temperature sensor 352-2 close to the GPU 13 and the VRAM 132 becomes high.

[0044] The second temperature sensors 352-3 and 352-4 are arranged at positions farther from the exhaust port 50e than the second temperature sensors 352-1 and 352-2, respectively. The second temperature sensors 352-3 and 352-4 are arranged at positions biased to the left and right of the central portion inside the housing 50, respectively. That is, the second temperature sensors 352-3 and 352-5 are arranged closer to the radiator fans 355-1 and 355-2 than the radiator fans 355-2 and 355-1, respectively. When the heat generation amount of the auxiliary storage device 23 is large, the temperature measured by the adjacent second temperature sensor 352-3 tends to be high. When the heat generation amount of the charger 341 is large, the temperature measured by the adjacent second temperature sensor 352-4 tends to be high.

[0045] Next, a control example of the cooling fans 355-1 and 355-2 by the EC 31 will be described. In the following description, as an example, the case where the EC 31 operates the cooling fans 355-1 and 355-2 when the power mode at that time is the performance mode will be taken. When the power mode at that time is a power mode with less rated power (i.e., the balance mode or the eco mode), the EC 31 does not operate the cooling fans 355-1 and 355-2.

[0046] The EC 31 determines the control mode of the cooling fans 355-1 and 355-2 based on the temperatures notified by the temperature signals input from the first temperature sensor 351 and the second temperature sensors 352-1 to 352-4, and controls the outputs of the cooling fans 355-1 and 355-2 according to the determined control mode. There are a first control mode and a second control mode for the control modes of the cooling fans 355-1 and 355-2. The first control mode is a control mode that controls the outputs of the cooling fan 355-1 and the cooling fan 355-2 equally. In the first control mode, the output values of the cooling fans 355-1 and 355-2 are determined so that the air volume of the air flow generated in the housing 50 is bilaterally symmetric. The first control mode may be called the "normal mode" or the "symmetric mode". The second control mode is a control mode that variably controls the output ratio between the output of the cooling fan 355-1 and the output of the cooling fan 355-2. In the second control mode, the output values of the cooling fans 355-1 and 355-2 are determined so that the air volume of the air flow generated in the housing 50 is bilaterally asymmetric. The second control mode may be called the "unbalanced mode" or the "asymmetric mode".

[0047] The EC 31 monitors the temperatures notified from the first temperature sensor 351 and the second temperature sensors 352-1 to 352-4, and determines the control mode based on the notified temperatures respectively. When the first temperature detected by the first temperature sensor 351 is lower than a predetermined first reference temperature and any of the second temperatures detected by the second temperature sensors 352-1 to 352-4 is higher than a predetermined second reference temperature, EC31 selects the second control mode. Otherwise, EC31 selects the first control mode. That is, when the first temperature is equal to or higher than the first reference temperature, or when there is no second temperature sensor that detects a second temperature higher than the second reference temperature, EC31 selects the first control mode. Note that the first reference temperature is set to be higher than the second reference temperature and lower than the upper limit of the predetermined operating temperature range of the heat dissipation mechanism 35.

[0048] When EC31 selects the first control mode, the higher the temperature notified from the first temperature sensor 351, the larger the common output is determined between the heat dissipation fans 355-1 and 355-2 so as not to exceed the maximum output of each of the heat dissipation fans 355-1 and 355-2. In the first control mode, EC31 determines the output values of the heat dissipation fans 355-1 and 355-2 corresponding to the first temperature by referring to, for example, a predetermined first control table. The common output values of the heat dissipation fans 355-1 and 355-2 set in the first control table are set to be larger as the first temperature is higher and not to exceed the maximum output of each of the heat dissipation fans 355-1 and 355-2.

[0049] When EC31 selects the second control mode, among the second temperatures notified from the second temperature sensors 352-1 to 352-4, the second temperature sensor with a second temperature higher than the second reference temperature is identified, and the closer the position of the identified second temperature sensor is to the heat dissipation fan 355-1, the larger the output ratio of the output of the heat dissipation fan 355-2 to the output of the heat dissipation fan 355-1. The higher the second temperature, the larger the output values of each of the heat dissipation fans 355-1 and 355-2 are determined so as not to exceed the maximum output of each of the heat dissipation fans 355-1 and 355-2.

[0050] In the second control mode, for example, the EC 31 refers to a preset second control table and determines the output values of the heat dissipation fans 355-1 and 355-2 corresponding to the second temperature for the specified second temperature sensors. The output values of the heat dissipation fans 355-1 and 355-2 set in the second control table are set for each second temperature sensor. The output values of the heat dissipation fans 355-1 and 355-2 to be set are such that the output ratio of the output of the heat dissipation fan 355-2 to the output of the heat dissipation fan 355-1 with respect to the output of the heat dissipation fan 355-1 is larger for the second temperature sensor closer to the heat dissipation fan 355-1, and are larger for the heat dissipation fans 355-1 and 355-2 as the second temperature is higher, and are set so as not to exceed the maximum output of the heat dissipation fans 355-1 and 355-2 respectively.

[0051] The EC 31 notifies the corresponding drive circuits 353-1 and 353-2 of the output values determined for the heat dissipation fans 355-1 and 355-2 respectively. The drive circuits 353-1 and 353-2 supply power to the heat dissipation fans 355-1 and 355-2 so as to operate the heat dissipation fans 355-1 and 355-2 with the output values notified from the EC 31 respectively.

[0052] Next, control examples of the heat dissipation fans 355-1 and 355-2 will be described. FIG. 4 illustrates a case where the temperature detected by the second temperature sensor 352-4 is higher than the second reference temperature and lower than the first reference temperature, and the temperatures detected by the other temperature sensors are lower than the second reference temperature. Since the second temperature sensor 352-4 is closer to the heat dissipation fan 355-2 than to the heat dissipation fan 355-1, the EC 31 determines the output values of the heat dissipation fans 355-1 and 355-2 such that the output from the heat dissipation fan 355-1 is greater than the output from the heat dissipation fan 355-2. Therefore, the intensity of the air flow generated by the heat dissipation fan 355-1 is higher than the intensity of the air flow generated by the heat dissipation fan 355-2. The position of the bending point where the respective air flows collide and change their direction toward the exhaust port 50e is biased toward the heat dissipation fan 355-2 rather than the heat dissipation fan 355-1. In the example of FIG. 4, the bending point is located on the charger 341. Since the air flow concentrates at the bending point, the amount of exhaust heat in the vicinity thereof is higher than that in other parts. Thus, heat dissipation of the charger 341 close to the second temperature sensor 352-4 that detects a significantly rising temperature is promoted.

[0053] FIG. 5 illustrates a case where the temperature detected by the second temperature sensor 352-3 is higher than the second reference temperature and lower than the first reference temperature, and the temperatures detected by the other temperature sensors are lower than the second reference temperature. Since the second temperature sensor 352-3 is closer to the heat dissipation fan 355-1 than to the heat dissipation fan 355-2, the EC 31 determines the output values of the heat dissipation fans 355-1 and 355-2 such that the output from the heat dissipation fan 355-2 is greater than the output from the heat dissipation fan 355-1. Therefore, the intensity of the air flow generated by the heat dissipation fan 355-2 is higher than the intensity of the air flow generated by the heat dissipation fan 355-1. The bending point where the respective air flows collide and change their direction toward the exhaust port 50e is biased toward the heat dissipation fan 355-1 rather than the heat dissipation fan 355-2. In the example of FIG. 5, the bending point is located on the auxiliary storage device 23. Thus, heat dissipation of the auxiliary storage device 23 close to the second temperature sensor 352-3 that detects a significantly rising temperature is promoted.

[0054] Next, a method for controlling the heat dissipation fans 355-1 and 355-2 according to the present embodiment will be described. FIG. 6 is a flowchart illustrating the method for controlling the heat dissipation fans 355-1 and 355-2 according to the present embodiment.

[0055] (Step S102) The EC 31 monitors the power mode notified from the host system 10 and determines whether the power mode is the performance mode. When the notified power mode is the performance mode (Step S102 YES), the process proceeds to the process of Step S104. When the notified power mode is a power mode with a rated power less than that of the performance mode (Step S102 NO), the process of Step S102 is repeated.

[0056] (Step S104) The EC 31 monitors the temperatures (detected temperatures) notified from the second temperature sensors 352-1 to 352-4 and determines the presence or absence of a second temperature sensor whose detected temperature exceeds the second reference temperature. When it is determined that there is a second temperature sensor whose detected temperature exceeds the second reference temperature (Step S104 YES), the process proceeds to the process of Step S106. When it is determined that there is no second temperature sensor whose detected temperature exceeds the second reference temperature (Step S104 NO), the process returns to the process of Step S102.

[0057] (Step S106) The EC 31 determines the output values of the heat dissipation fans 355-1 and 355-2 in the second control mode. Here, the EC 31 identifies a second temperature sensor whose detected temperature exceeds the second reference temperature, and determines the output values of the heat dissipation fans 355-1 and 355-2 corresponding to the detected temperature detected by the second temperature sensor using the second control table. According to this step, the closer the position of the identified second temperature sensor is to the heat dissipation fan 355-1 than to the heat dissipation fan 355-2, the output of the heat dissipation fans 355-1 and 355-2 is controlled so that the output ratio of the output of the heat dissipation fan 355-2 to the output of the heat dissipation fan 355-1 becomes larger.

[0058] (Step S108) The EC 31 monitors the temperature (detected temperature) notified from the first temperature sensor 351. (Step S110) The EC 31 determines whether or not the first temperature notified from the first temperature sensor 351 is equal to or higher than the first reference temperature. When it is determined that the first temperature is equal to or higher than the first reference temperature (Step S110 YES), the process proceeds to the process of Step S112. When the first temperature is lower than the first reference temperature (Step S110 NO), the EC 31 controls the drive circuits 353-1 and 353-2 so as to operate the heat radiation fans 355-1 and 355-2 based on the output values determined using the second control table. Then, the process proceeds to the process of Step S102.

[0059] (Step S112) The EC 31 determines the output values of the heat radiation fans 355-1 and 355-2 in the first control mode. Here, the EC 31 uses the first control table to determine the output values of the heat radiation fans 355-1 and 355-2 corresponding to the first temperature notified from the first temperature sensor 351. The EC 31 controls the drive circuits 353-1 and 353-2 so as to operate the heat radiation fans 355-1 and 355-2 based on the output values determined using the first control table. According to this step, the outputs from the heat radiation fans 355-1 and 355-2 are controlled to be equal. Therefore, the air volume inside the housing 50 is controlled symmetrically between the heat radiation fans 355-1 and 355-2. Then, the process proceeds to the process of Step S102.

[0060] In the above description, the case where the EC 31 determines the output values of the heat radiation fans 355-1 and 355-2 using the first control table and the second control table is illustrated, but it is not limited to this. Instead of the first control table, the EC 31 may use a mathematical model that calculates the output values of the heat radiation fans 355-1 and 355-2 corresponding to the first temperature detected by the first temperature sensor as an input value. Instead of the second control table, for each of the second temperature sensors 352-1 to 352-4, the EC 31 may use a mathematical model that calculates the output values of the heat radiation fans 355-1 and 355-2 corresponding to the second temperature detected by each of the second temperature sensors 352-1 to 355-4 as an input value.

[0061] In the above description, it is assumed that in the case where EC31 detects that among the second temperatures notified by the second temperature sensors 352-1 to 352-4, there is one second temperature sensor that detects a second temperature higher than the second reference temperature. However, there may be a case where there are two or more such sensors. In that case, EC31 may identify the second temperature sensor that detects the highest second temperature among the detected second temperatures, and determine the output values of the heat dissipation fans 355-1 and 355-2 based on the identified second temperature sensor and its second temperature. This promotes heat dissipation from the hottest part.

[0062] Also, when two or more second temperature sensors that detect a second temperature higher than the second reference temperature are present in both a position closer to the heat dissipation fan 355-1 than the heat dissipation fan 355-2 and a position closer to the heat dissipation fan 355-2 than the heat dissipation fan 355-1, EC31 may select the first control mode as the control mode. By avoiding the phenomenon that the concentration of heat dissipation from a part close to either the heat dissipation fan 355-1 or the heat dissipation fan 355-2 causes the temperature rise of the part close to the other fan to not be suppressed.

[0063] The number of the second temperature sensors 352 is not limited to four, and may be one or more and three or less, or five or more. The number of the first temperature sensors 351 is not limited to one, and may be two or more. In that case, EC31 may determine the output values of the heat dissipation fans 355-1 and 355-2 based on the highest first temperature among the first temperatures detected by two or more first temperature sensors 351.

[0064] Also, in the above description, the case where EC31 controls the output values of the heat dissipation fans 355-1 and 355-2 using the drive circuits 353-1 and 353-2 is exemplified, but it is not limited to this. Instead of EC31, the chipset 21 or the CPU 11 may control the output values of the heat dissipation fans 355-1 and 355-2. Also, the housing 50 may be provided with air inlets on the bottom surfaces of the heat dissipation fans 355-1 and 355-2 instead of, or in addition to, their respective surfaces.

[0065] FIG. 6 illustrates the case where the processes of steps S104 to S112 are executed when the power mode is the performance mode, but it is not limited thereto. When there is a possibility that the functions of the heat radiation fans 355-1 and 355-2 are activated and operate, the processes of steps S104 to S112 may be executed. For example, when the heat radiation fans 355-1 and 355-2 are activated when the power mode is the balance mode, the processes of steps S104 to S112 may also be executed. When the heat radiation fans 355-1 and 355-2 are activated regardless of the power mode, the process of step S102 may be omitted, and the processes of steps S104 to S112 may be executed. Also, in the above description, the case where the power mode has three levels is taken as an example, but it may have one level, two levels, or four levels.

[0066] As described above, the information processing apparatus 1 according to the present embodiment includes a controller (for example, EC 31), a plurality of temperature sensors, a first heat radiation fan (for example, heat radiation fan 355-1), and a second heat radiation fan (for example, heat radiation fan 355-2), and a housing 50 that houses them. The first heat radiation fan and the second heat radiation fan are installed in the vicinity within a predetermined range from one end and the other end of one side surface (for example, the back surface) of the housing, respectively, and the first heat radiation fan and the second heat radiation fan blow air at least in directions facing each other. The information processing apparatus 1 also has a first control mode for controlling the outputs of the first heat radiation fan and the second heat radiation fan equally, and a second control mode for variably controlling the output ratio between the output of the first heat radiation fan and the output of the second heat radiation fan. When the first temperature detected by a predetermined first temperature sensor 351 among the plurality of temperature sensors is lower than a predetermined first reference temperature and the second temperature detected by a second temperature sensor 352 close to either the first heat radiation fan or the second heat radiation fan is higher than a predetermined second reference temperature, the controller selects the second control mode. A device that becomes a heat source (for example, any one of a processor, a memory, a charger, etc., or any combination thereof) may be housed in the housing 50. According to this configuration, when the first temperature is lower than the first reference temperature and the second temperature is higher than the second reference temperature, the second control mode is selected, and the output ratio between the output of the first heat radiation fan and the output of the second heat radiation fan is variably controlled. Therefore, under the situation where a temperature difference occurs inside the housing 50, by adjusting the output ratio between the first heat radiation fan and the second heat radiation fan, the air flows from the first heat radiation fan and the second heat radiation fan can be concentrated on the high-temperature part. Since the exhaust heat at the high-temperature part is promoted before the temperature of the entire inside of the housing 50 rises, the heat radiation efficiency can be improved.

[0067] In the second control mode, the controller may control the output of the first heat radiation fan and the output of the second heat radiation fan such that the closer the position of the second temperature sensor that has detected a second temperature higher than the second reference temperature is to the first heat radiation fan than to the second heat radiation fan, the larger the output ratio of the output of the second heat radiation fan to the output of the first heat radiation fan becomes. According to this configuration, the air flows from the first heat radiation fan and the second heat radiation fan can be concentrated on the position of the second temperature sensor that has detected a second temperature higher than the second reference temperature. Therefore, the exhaust heat of the device close to the second temperature sensor is promoted.

[0068] The housing 50 may be provided with air inlets on the surfaces or bottom surfaces of the first heat radiation fan and the second heat radiation fan respectively, and an air outlet on the opposing surface that is the surface opposing one side surface of the housing 50. According to this configuration, the air flow sucked from the surfaces or bottom surfaces of the first heat radiation fan and the second heat radiation fan and discharged from the opposing surface is not obstructed. Therefore, the air flows facing each other between the first heat radiation fan and the second heat radiation fan can be promoted.

[0069] A heat radiator (for example, fins 356-1, 356-2) is accommodated in the housing 50, one side surface of the housing 50 is sealed, and the heat radiator may be adjacent to at least a part of the air outlet. According to this configuration, the air flows facing each other from the first heat radiation fan and the second heat radiation fan are guided to the air outlet, and the heat radiation by the heat radiator is promoted.

[0070] As described above, the embodiments of the present application have been described in detail with reference to the drawings. However, the specific configuration is not limited to the above-described embodiments, and designs and the like within the scope not departing from the gist of the present invention are also included. Each configuration described in the above embodiments can be arbitrarily combined.

Description of Reference Numerals

[0071] 1... Information processing apparatus, 10... Host system, 11... CPU, 12... Main memory, 13... GPU, 14... Display, 21... Chipset, 22... ROM, 23... Auxiliary storage device, 25... Communication module, 26... Input / output I / F, 31... EC, 32... Input device, 33... Battery, 34... Power supply circuit, 35... Heat dissipation mechanism, 36... Power switch, 132... VRAM, 341... Charger, 342... DC / DC, 351... First temperature sensor, 352(352-1 to 352-N)... Second temperature sensor, 353(353-1, 353-2)... Drive circuit, 355(355-1, 355-2)... Heat dissipation fan, 356(356-1, 356-2)... Fin

Claims

1. a housing that houses a controller, a plurality of temperature sensors, a first heat dissipation fan, and a second heat dissipation fan; The first and second heat dissipation fans are installed adjacent to each other within a predetermined range from one end and the other end of one side of the housing, respectively. The first heat dissipation fan and the second heat dissipation fan blow air at least in directions facing each other, a first control mode in which the output of the first heat dissipation fan and the output of the second heat dissipation fan are controlled equally; a second control mode in which an output ratio between the output of the first heat dissipation fan and the output of the second heat dissipation fan is variably controlled; The controller: When a first temperature detected by a predetermined first temperature sensor among the plurality of temperature sensors is lower than a predetermined first reference temperature, and a second temperature detected by a second temperature sensor adjacent to either the first heat dissipation fan or the second heat dissipation fan is higher than a predetermined second reference temperature, Selecting the second control mode Information processing device.

2. The controller: In the second control mode, The output of the first heat dissipation fan and the output of the second heat dissipation fan are controlled so that the ratio of the output of the second heat dissipation fan to the output of the first heat dissipation fan increases as the position of the second temperature sensor that detects the second temperature higher than the second reference temperature is closer to the first heat dissipation fan than the second heat dissipation fan. The information processing device according to claim 1 .

3. The housing houses a processor, a memory, and a charger. The information processing device according to claim 1 .

4. The housing has an intake port on a surface or a bottom surface of each of the first heat dissipation fan and the second heat dissipation fan, and has an exhaust port on an opposing surface that is a side surface opposite to the one side surface. The information processing device according to claim 1 .

5. The housing accommodates a heat sink, The one side surface is sealed, and the heat sink is adjacent to at least a portion of the exhaust port. The information processing device according to claim 4.

6. a housing that houses a controller, a plurality of temperature sensors, a first heat dissipation fan, and a second heat dissipation fan; The first and second heat dissipation fans are installed adjacent to each other within a predetermined range from one end and the other end of one side of the housing, respectively. The first heat dissipation fan and the second heat dissipation fan blow air at least in directions facing each other, a first control mode in which the output of the first heat dissipation fan and the output of the second heat dissipation fan are controlled equally; a second control mode in which an output ratio between the output of the first heat dissipation fan and the output of the second heat dissipation fan is variably controlled, The information processing device includes: When a first temperature detected by a predetermined first temperature sensor among the plurality of temperature sensors is lower than a predetermined first reference temperature and a second temperature detected by a second temperature sensor adjacent to either the first heat dissipation fan or the second heat dissipation fan is higher than a predetermined second reference temperature, the second control mode is selected. Control methods.

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