Reaction by-product collection system for narrow spaces that prevents the generation of reaction by-products in connecting pipes and has a structure that allows for easy replacement

Abstract

To provide a collection system for narrow space in which a reactive by-product collection processing capacity can be increased.SOLUTION: A reactive by-products collection system for narrow space is provided, preventing generation of reactive by-products in a connecting pipe and having structure facilitating replacement, the system includes: a vacuum pump 1; a collection device 2; a vacuum pump housing and fixing portion 3 which has movement means 31, horizontal adjustment means 32, and fixing means 33; a loading portion 4 which is installed at the upper end of the housing and fixing portion, supports the load of the collection device and has transfer means 41 used for position adjustment and replacement of the collection device; a collection device support portion 5 which is installed above the loading portion, wraps and fixes the collection device; piping 6 which absorbs clearance while vertically connecting the vacuum pump and the collection device; and a valve 61 which is installed in such a way as to control a flow channel of the exhaust gas flowing the piping.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a reaction by-product collection system for a narrow space having a structure that prevents the generation of reaction by-products in a connecting pipe and is easy to replace. Specifically, by utilizing the narrow sub-factory structure of an existing semiconductor manufacturing facility consisting of a two-layer structure of a main factory and a sub-factory, a replaceable collection device structure with an increased collection processing capacity while being connected to a vacuum pump vertically through a pipe is provided, and it relates to a collection system that solves the problem of insufficient reaction by-product collection processing capacity due to an increase in the use of process gas.

Background Art

[0002] Generally, the semiconductor manufacturing process mainly consists of a front process (Fabrication process) and a back process (Assembly process). The front process repeatedly performs the process of depositing a thin film on a wafer in various process chambers (Chambers) and selectively etching the deposited thin film to process a specific pattern to manufacture a semiconductor chip (Chip). The back process refers to the process of individually separating the chips manufactured in the above front process and then assembling them as a finished product by combining them with a lead frame.

[0003] At this time, the process of depositing a thin film on the wafer or etching the thin film deposited on the wafer is carried out at a high temperature by injecting a precursor and a reaction gas such as TiCl4 (titanium tetrachloride), NH3 (ammonia), SiH4 (monosilane), SiCl2H2 (dichlorosilane), WF6 (tungsten hexafluoride), Hf (hafnium), etc. through a gas injection system in the process chamber. During the progress of the above process, a large amount of various flammable gases and corrosive foreign substances are generated inside the process chamber.

[0004] In order to purify and discharge such harmful gases, a scrubber is installed at the rear end of a vacuum pump that evacuates the semiconductor manufacturing process chamber to a vacuum state. After purifying the exhaust gas discharged from the process chamber, it is released into the atmosphere.

[0005] However, since the scrubber mainly purifies only the reaction by-products in gaseous form, when the reaction by-products are solidified after being discharged outside the process chamber, problems such as sticking to the exhaust line and increasing the exhaust pressure, inducing pump failure when flowing into the vacuum pump, and reverse flow of harmful gases into the process chamber to contaminate the wafer may occur.

[0006] Therefore, most semiconductor manufacturing equipment installs a reaction by-product collection device between the process chamber and the vacuum pump to aggregate the exhaust gas and collect it in the form of powder or solid matter.

[0007] On the other hand, looking at the conventional semiconductor manufacturing facilities where the above process chamber, collection device, and vacuum pump are installed, they mainly consist of a two-layer semiconductor manufacturing facility and a three-layer semiconductor manufacturing facility.

[0008] First, the structure of the two-layer semiconductor manufacturing facility is composed of a main factory installed in the clean room where the process chamber and the embedded collection device are connected by vertical pipes, and a sub-factory where the above process chamber, embedded collection device, and vertical pipes are connected, and a vacuum pump for providing a vacuum state is installed, consisting of a two-layer structure of the main factory and the sub-factory.

[0009] In addition, the structure of the three-layer semiconductor manufacturing facility is composed of a main factory where the process chamber is installed in the clean room, an intermediate factory where a large-capacity collection device capable of collecting a large amount of reaction by-products is installed and connected to the process chamber by vertical pipes, and a sub-factory where the large-capacity collection device and vertical pipes are connected and a vacuum pump for providing a vacuum state is installed, consisting of a three-layer structure of the main factory, intermediate factory, and sub-factory.

[0010] Among the above structures, the three-layer semiconductor manufacturing facility has the structural advantage that even if the usage amount of the process gas increases due to changes in the semiconductor manufacturing process, it can cope with the capacity increase by increasing or replacing the capacity of the large-capacity collection device in the intermediate factory.

[0011] However, in the case of a semiconductor manufacturing facility with a two-layer structure, when the amount of process gas used increases due to changes in the semiconductor manufacturing process, there is a structural problem in that the physical space structure is narrow and it is difficult to accommodate and process this with an embedded type collection device.

[0012] That is, when installing an embedded type collection device in a semiconductor manufacturing facility with a two-layer structure, it is difficult to provide an installation space for a large-capacity collection device designed to optimize a complex semiconductor manufacturing facility including a process chamber in a clean room with a limited space. Therefore, if the process gas input due to changes in the semiconductor manufacturing process increases, the reaction by-product collection processing capacity of the embedded type collection device optimized for the existing process will soon reach its limit.

[0013] In this case, since the semiconductor manufacturing process can be interrupted and replaced with a new collection device or the collection process can be resumed after a cleaning process, there is a disadvantage that the maintenance cycle becomes short.

[0014] Of course, the embedded type collection device installed in the main factory can be removed and a large-capacity collection device can be installed in the sub-factory. However, in this case, there is a structural problem in that it cannot be installed by connecting it vertically above the vacuum pump due to the vertical height.

[0015] Therefore, as shown in FIG. 7, the exhaust gas discharged to the lower discharge pipe of the large-capacity collection device in the sub-factory must be connected by a bent pipe structure that bends the pipe upward and then bends downward again to be connected to the upper stage of the vacuum pump. The reason for piping in such a structure is that the collection device has a structure that discharges to the lower stage, and in general, the vacuum pump has a structure that is inhaled through the upper stage and discharged to the side due to the pump structure. Therefore, it will inevitably be connected to a bent pipe structure for connecting from the lower part to the upper part.

[0016] However, in such a piping structure, there is a problem that the exhaust gas flowing through each bending point hits the pipe, and vortices are generated during the process of changing the flow path, which may generate reaction by-products. When reaction by-products are generated, the pipes through which the exhaust gas moves may become clogged, the vacuum efficiency may drop rapidly, or the reaction by-products may flow back into the collection device, so it is not a desirable installation structure in semiconductor manufacturing equipment.

[0017] Therefore, instead of newly constructing a semiconductor manufacturing facility with an upper and lower layer structure of a main factory and a sub-factory, there is an emerging need for a collection system with an enlarged-capacity collection device that can cope with the situation where the process gas input increases due to changes in the semiconductor manufacturing process and a vacuum pump structure connected vertically by pipes.

Prior Art Documents

Patent Documents

[0018]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0019] An object of the present invention for solving the above problems is that an existing semiconductor manufacturing facility consisting of a main factory where a process chamber is installed in a clean room and a sub-factory where a vacuum pump is installed, utilizes the vertical space structure of the sub-factory where it is difficult to install a large-capacity collection device due to the narrow space structure of the sub-factory when the process gas usage increases. While being connected to a vertical pipe at the location where the already installed vacuum pump is located, it provides a structure with a larger processing capacity than an embedded type collection device and an exchangeable structure, and aims to provide a collection system for a narrow space capable of increasing the reaction by-product collection processing capacity.

Means for Solving the Problems

[0020] The present invention for achieving the above object and accomplishing the task of removing the conventional drawbacks includes a vacuum pump fixed to the ground of a sub-factory forming the lower layer of the main factory; A collection device that collects reaction by-products from the exhaust gas discharged from the process chamber and discharges them to the lower part; A vacuum pump storage and fixing part comprising moving means positioned to surround the vacuum pump fixed to the ground, horizontal adjustment means provided to adjust the horizontal, and fixing means fixed to the ground; A loading part installed at the upper end of the vacuum pump storage and fixing part, which supports the load of the collection device and is provided with transfer means used when adjusting the position and exchanging the collection device; A collection device support part installed above the loading part, which wraps and fixes the collection device; A pipe that vertically connects between the vacuum pump and the collection device and absorbs play; A valve installed to control the flow path of the exhaust gas flowing through the pipe; It is achieved by providing a reaction by-product collection system for a narrow space that prevents the generation of reaction by-products in the connecting pipe and has a structure that is easy to exchange.

[0021] As a desirable embodiment, the collection device is a collection device with an increased capacity, characterized in that it is larger than the capacity of an embedded type collection device and smaller than the capacity of a large-capacity collection device.

[0022] As a desirable embodiment, the vacuum pump storage and fixing part forms a structure by welding or fastening means a plurality of horizontal frames and vertical frames, and is characterized in that it is a structure having an open part with one side open so that the vacuum pump can enter.

[0023] As a desirable embodiment, the moving means is composed of a plurality of rotators, any one or more of which are freely rotatable casters, balls, or rollers. The horizontal adjustment means is composed of a bolt part fastened to the frame and a ground support part in contact with the ground, and is configured such that the bolt part moves up and down by the rotation of the ground support part. The fixing means is composed of a vertical fastening part bolted to the frame and a horizontal fastening part fastened to the ground, and is characterized in that one or more long hole holes are formed in the vertical fastening part and the horizontal fastening part, respectively.

[0024] As a desirable embodiment, the loading part is formed with an open part that is open from one side where the collection device enters to the central part where the pipe is installed, and is provided with transfer means for loading and exchanging the collection device with an increased capacity and for adjusting the position of the collection device.

[0025] As a desirable embodiment, the transfer means is provided in plurality on each of the loading parts installed on both sides of the upper end of the storage and fixing part, and is characterized in that it is composed of any one of the rotators of casters, balls, or rollers.

[0026] As a desirable embodiment, the collection device support part forms a structure by welding or fastening means a plurality of horizontal frames and vertical frames, and is composed of a structure having an open part with one side open so that the collection device can enter the loading part, and is configured such that stoppers are inserted into storage parts protruding outside both side vertical frames located in the open part to prevent the collection device from falling.

[0027] As a desirable embodiment, the collection device support part is characterized in that support pads for shock absorption and separation prevention are respectively provided inside the three horizontal frames constituting the upper end so as to support the outer surface of the collection device that comes into contact therewith.

Effect of the Invention

[0028] The reaction by-product collection system according to the present invention having the above characteristics utilizes the narrow sub-factory structure of an existing semiconductor manufacturing facility consisting of a main factory with a process chamber installed in a clean room and a sub-factory with a vacuum pump installed. While being connected to a vacuum pump fixed to an existing floor by a vertical pipe, by having a configuration in which a collection device having a relatively larger processing capacity than an existing embedded type collection device is installed, an increase in the use of process gas for more semiconductor manufacturing causes a shortage in the reaction by-product collection processing capacity of the embedded type collection device connected by a vertical pipe to the process chamber in the clean room of the conventional main factory, and it has the effect of solving the difficulty of maintenance such as repair and replacement installed in the clean room.

[0029] Further, the present invention is provided with an exchangeable collection device having an increased collection processing capacity of reaction by-products connected to a vacuum pump by a vertical pipe in a narrow sub-factory structure. When installing a large-capacity collection system in the narrow space of an existing sub-factory, the problem of reaction by-products generated by vortex generation while exhaust gas flows through the pipe due to the inevitable bending pipe structure for connecting between the vacuum pump and the collection device is solved, and it is possible to collect and process reaction by-products by utilizing the factory structure in which the existing main factory and sub-factory are configured in upper and lower layers without constructing a new semiconductor manufacturing factory.

[0030] Thus, the present invention is a useful invention having various effects and is an invention whose industrial utilization is highly expected.

Brief Description of the Drawings

[0031]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, the configuration and its operation, which are examples of the present invention, will be described in detail in relation to the accompanying drawings as follows. In addition, when it is determined that a specific description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

[0033] FIG. 1 is an exemplary diagram showing the configuration of a reaction by-product collection system for a narrow space according to an embodiment of the present invention, FIG. 2 is an exemplary diagram showing the exploded configuration of a reaction by-product collection system for a narrow space according to an embodiment of the present invention, and FIG. 3 is an exemplary diagram showing a configuration in which a collection device, a vacuum pump, and piping are excluded from a reaction by-product collection system for a narrow space according to an embodiment of the present invention.

[0034] As shown in the figure, the reaction by-product collection system for a narrow space according to the present invention is composed of a vacuum pump 1, a collection device 2, a vacuum pump storage and fixing part 3, a loading part 4, a collection device support part 5, and piping 6.

[0035] The reaction by-product collection system for narrow spaces with the above configuration is composed of an upper main factory (Main Fab.) and a lower sub-factory (Sub Fab.), and is a collection system installed in a narrow sub-factory with a limited space structure. When the use of process gas in semiconductor manufacturing increases, a collection device with an increased capacity is installed above the point where the vacuum pump installed in the basic sub-factory is installed, so as to provide an increased reaction by-product collection processing capacity.

[0036] The vacuum pump 1 is a device that provides a vacuum state to the process chamber and the collection device, and at the same time discharges the exhaust gas discharged from the collection device to the scrubber.

[0037] Such a vacuum pump discharges the air in the pipe to one side of the exhaust port while the pen rotates by a motor or an engine, so as to provide a vacuum state to the internal spaces of the process chamber and the collection device by the suction force formed on the other side of the inlet side. At this time, the inflowing exhaust gas will be discharged to the scrubber side through the exhaust port and the pipe.

[0038] For this purpose, the vacuum pump generally has an inlet 11 formed at the upper part and is connected to the lower discharge port of the collection device by a vertical pipe, and an exhaust port 12 is formed in the side direction and is connected to the scrubber through the pipe.

[0039] However, since the engine, motor configuration, power supply device, and pipe structure for the operation of the vacuum pump in the present invention are not the core matters of the present invention, it is sufficient to refer to the known vacuum pumps used in the semiconductor manufacturing process when necessary, so specific descriptions are omitted.

[0040] The vacuum pump is installed in a semiconductor manufacturing process chamber or the like installed in a clean room of a main factory. When the vertical pipe for exhausting exhaust gas descends into the sub-space after the setting is completed, the vacuum pump is installed at the corresponding position and fixed to the ground. However, in the drawings according to one embodiment, the fastening structure for fixing to the ground is not visible for the sake of convenience, but in the present invention, the vacuum pump is described based on the state of being fixed to the ground.

[0041] The vacuum pump will occupy a considerable part of the indoor height of the sub-factory with limited working space. During installation, it will have an installation space of about 1 m, and since it must comply with a height of 2 m or less based on the height standard for high-altitude work, the physical space where additional equipment is located on the upper side of the vacuum pump will be reduced.

[0042] The collection device 2 is a collection device with an increased capacity that collects reaction by-products from the exhaust gas discharged from the process chamber and discharges them to the lower part.

[0043] Such a configuration of the collection device is sufficient if it has a general internal structure like a known collection device. For example, it is installed on the exhaust line between the process chamber and the vacuum pump. After accommodating the exhaust gas that has flowed into the upper inlet 21 in order to collect the reaction by-products in the exhaust gas discharged from the process chamber, it discharges to the lower outlet 22. A housing, a heater that provides the collection temperature conditions inside the housing while preventing the exhaust gas that has flowed into the housing from aggregating at the inlet part, and a collection tower that is installed inside the housing and collects particulate reaction by-products from the flowing exhaust gas are sufficient.

[0044] However, the collection device of the present invention is composed of an upper main factory and a lower sub-factory, is installed in a narrow sub-factory with a limited space structure, and is applied to a collection system for solving the problem of insufficient capacity for collecting reaction by-products due to an increase in the use of process gas. Therefore, it is important to use a collection device that has a vertical height that allows installation within a narrow space structure while providing an increased capacity for collecting reaction by-products in the exhaust gas.

[0045] That is, in order to solve the problem of insufficient capacity for collecting reaction by-products due to an increase in the use of process gas, the embedded collection device installed in the clean room of the conventional main factory must be replaced frequently, which requires frequent interruption of the semiconductor manufacturing process, making it difficult to perform a smooth semiconductor manufacturing process. The large-capacity collection device usually installed in the intermediate factory is difficult to be applied to the sub-factory due to its physical size.

[0046] Therefore, by using a collection device with a larger capacity than the embedded collection device as in the present invention, it is possible to provide a relatively sufficient capacity and perform a smooth semiconductor manufacturing process, while also solving the limitation of the physical space of the sub-factory because it has a large vertical height.

[0047] Specifically, the collection device with an increased capacity according to the present invention is preferably larger than the capacity of the embedded collection device and smaller than the capacity of the large-capacity collection device. The reason for limiting such a capacity is that since the height of the working space with limited space is usually about 2 m, when a general vacuum pump that provides a normal vacuum state for the process chamber and the collection device is installed with a vertical pipe, it is the optimal capacity.

[0048] In such a case of capacity, even when using one with a vertical height limit smaller than 1 m, a much larger capacity than the conventional embedded type can be applied.

[0049] The reason why it is necessary to use one smaller than 1 m here is that due to the structure of the sub-factory, the space structure occupied by the vacuum pump is generally smaller than about 1 m, but excluding various necessary structures for the installation and replacement of the vertical pipe and the collection device, the actual available vertical size of the space is smaller than 1 m.

[0050] However, the present invention is not limited by the specific numerical values constituting the above volume. It is sufficient to provide a collection device with a capacity increased from the conventional embedded collection device while having a vertical height smaller than 1 m that can be installed in the spare space of the vacuum pump while providing the above capacity.

[0051] Incidentally, a large-capacity collection device with a height of about 1 m cannot be vertically installed considering the vertical piping with a vacuum pump, the spare space for loading and replacement, and the safety of workers during high-altitude work.

[0052] After moving the vacuum pump storage and fixing part 3 to the space where the vacuum pump is located, it enters from the direction of the opening part and is stored, providing a structure that wraps the outside of the vacuum pump from three directions. By fixing the vacuum pump to the ground with the vacuum pump located inside, it is configured to support the structure installed on the upper part without shaking while stably protecting the vacuum pump.

[0053] For this purpose, the vacuum pump storage and fixing part 3 forms a structure using a plurality of horizontal frames 3a and vertical frames 3b by welding or fastening means, and consists of a structure with an opening part 3c with one side open so that the vacuum pump can enter.

[0054] The vacuum pump storage and fixing part 3 configured in this way will stably provide a supporting force when vibrations generated in the semiconductor manufacturing process or when the flow of vacuum or exhaust gas through the piping occurs.

[0055] For this purpose, a moving means 31, a horizontal adjusting means 32, and a fixing means 33 are installed and provided at the lower part of the horizontal frame at the lower end of the vacuum pump storage and fixing part 3.

[0056] The moving means 31 is composed of a rotating body such as a freely rotating caster, ball, or roller. Desirably, two are installed for each of the horizontal frames at both lower ends installed in the length direction to enable traveling while stably supporting the load during movement.

[0057] Also, the horizontal adjusting means 32 is configured to adjust the vertical height and horizontal level while being in close contact with the ground so that it does not move any further at the local point after the process of moving using the moving means 31 until the vacuum pump is located inside and stored.

[0058] Even when the ground is not uniform through such horizontal adjustment means 32, the vacuum pump storage and fixing part 3 is provided in a fixed state without moving while maintaining a horizontal state.

[0059] The horizontal adjustment means 32 may be installed on the lower horizontal frame or vertical frame, but it is desirable to install it at the lower part of each of the four vertical frames. Installing in this way will make the center of gravity stable during horizontal adjustment and is advantageous for supporting the vertical load without the upper part of the bolt being exposed when the bolt part is raised and lowered.

[0060] The horizontal adjustment means 32 is composed of a bolt part 32a fastened to the frame and a ground support part 32b in contact with the ground. When the ground support part 32b is rotated in one side direction, the bolt part 32a protrudes from or is retracted into the vertical frame, and the ground support part 32b moves up and down.

[0061] Therefore, after the ground support part 32b is rotated to contact the ground and then continuously rotated, the moving means 31 will separate from the ground and the position of the vacuum pump storage and fixing part 3 will be fixed. When the level is not correct, the horizontal level can be adjusted by adjusting the rotation direction of any one or more of the four horizontal adjustment means to protrude or retract.

[0062] Also, the fixing means 33 is a means for fixing the vacuum pump storage and fixing part 3 to the ground after the horizontal adjustment by the horizontal adjustment means 32, with two pieces installed for each of the horizontal frames at both lower ends like the moving means 31.

[0063] The fixing means 33 is composed of a kind of bent bracket structure. The vertical fastening part 331 on one side is bolt-fastened and fixed to the lower frame, and the horizontal fastening part 332 on the other side is fastened and fixed to the ground by fastening means such as anchor bolts. At this time, one or more long hole holes 331a and 332a are formed in the vertical fastening part and the horizontal fastening part respectively.

[0064] As a result, even if the height of the horizontal frame fluctuates slightly due to the height adjustment of the horizontal adjustment means 32, the vertical fastening part can be sufficiently adjusted in height within the range of the long hole while fastening.

[0065] Similarly, when fastening means such as anchor bolts are fastened to the ground for the horizontal fastening part, the fastening parts at regular intervals can be adjusted.

[0066] The loading part 4 is installed so as to protrude inward from the upper end of the storage fixing part, and is a means for supporting the load of the collection device and vertically connecting the vacuum pump and the pipe located below.

[0067] At this time, the loading part is installed in a state where an opening part 4a is formed and opened from at least one side where the collection device enters to the central part where the pipe is installed for the pipe connection between the vacuum pump located below and the collection device, and a plurality of support members 4b installed on the horizontal frame 3a and the vertical frame 3b constituting the upper part of the storage fixing part protrude inward to support the lower surface, so that the loading part has a stable structure in the form of a cantilever.

[0068] In addition, the loading part 4 is provided with transfer means 41 to enable smooth movement during the loading and replacement process of the collection device with an increased capacity, and to easily adjust the position between the vacuum pumps located below in the loaded state.

[0069] The loading part 4 provided with such transfer means 41, when a collection device with an increased capacity and heavy weight is lifted to the loading part located above the vacuum pump using a lift or a forklift, the operator uses the transfer means 41 to horizontally move the collection device and align the discharge port protruding from the lower part of the collection device with the inflow section protruding from the upper part of the vacuum pump, and then adjusts so that the vertical pipe is connected. By providing the transfer means for the loading part in this way, it becomes possible to adjust the position while supporting the load of the collection device.

[0070] The above-mentioned transfer means 41 are each provided with a plurality of them on the loading parts 4 installed on both sides of the upper end of the storage and fixing part 3. Desirably, they are composed of means such as casters, rollers, or balls, etc., so as to reduce the frictional force during movement while being able to sufficiently withstand the load of the collection device. Desirably, 12 transfer means are installed, 6 on each side, and those that can withstand a load of 400 kg per one are used. When each transfer means needs to be repaired due to a failure or the like, it can be configured to be fastened to the plate forming the loading part 4 individually so as to be replaceable.

[0071] The collection device support part 5 is configured to wrap around and support the periphery of the collection device in order to prevent damage or safety accidents such as dropping when the collection device is loaded on the upper part of the loading part.

[0072] For this purpose, the collection device support part 5 forms a structure by using a plurality of horizontal frames 5a and vertical frames 5b through welding or fastening means, but it is composed of a structure in which an open part 5c with one side open is formed so that the collection device can enter the loading part.

[0073] However, when the collection device moves inside and its position is aligned, the collection device support part is provided with storage parts 51a protruding at one point of each vertical frame 5b located on both sides of the open part so as not to drop through the open one-side open part 5c, and the stopper 51 is configured to prevent the collection device from dropping during storage. At this time, the stopper can be configured to be fixed to the storage part by fastening means so as not to detach.

[0074] Also, support pads 52 for shock absorption and separation prevention are respectively provided inside the three horizontal frames 5a constituting the upper end of the collection device support part 5 so as to support the outer surface of the contacting collection device.

[0075] It is desirable that the material of the support pad 52 be composed of an elastic silicon pad. If it is composed of such a material, the collection device can be stably supported by exerting an elastic force while being contracted through contact when installed, and various impacts generated during operation can be absorbed and the separation of the collection device can be prevented.

[0076] The pipe 6 is a pipe that vertically connects between the vacuum pump and the collection device. By configuring it in the form of a corrugated pipe (a form of an expandable and contractible pipe) instead of a through pipe, even when there is a certain amount of play in the position between the inlet protruding from the upper part of the vacuum pump located vertically above and the outlet protruding from the lower part of the collection device, it can be easily adjusted in position while absorbing this and connected so as to be vertically connected.

[0077] At this time, a valve 61 is installed at the lower part of the pipe so as to control the flow path of the exhaust gas flowing through the pipe. As one embodiment, the valve is installed at the upper end side of the vacuum pump and the lower part of the pipe, and will control the opening and closing of the flow path of the exhaust gas.

[0078] The upper end structure of the valve is formed with a pipe protruding and communicating with the pipe, and the lower end structure is formed with a pipe protruding and communicating with the upper end inlet of the vacuum pump.

[0079] The valve with the upper and lower ends communicating with the collection device and the vacuum pump in this way is composed of an automatic valve in which a structure for opening and closing the flow path is formed by an actuator or the like inside by a remote signal or a manual valve in which a structure for mechanically opening and closing the flow path inside is formed by turning a knob (handle), and can open and close the flow path of the exhaust gas moving through the pipe. Incidentally, the reason why the exhaust gas can flow like this is to suck the air inside the process chamber and the collection device so that a vacuum state is formed through the inlet pipe of the vacuum pump.

[0080] Since the type and structure of the valve described above may be selected and used from known valves, a detailed description of the specific durable structure is omitted.

[0081] The vacuum pump storage and fixing part 3, the loading part 4, and the collection device support part 5 described above are characterized in that they are integrally formed from the beginning, or are assembled and integrated on-site by welding, bolts, pieces, or known fastening means, and are configured not to be separated from each other.

[0082] FIG. 4 is an exemplary diagram showing the process of loading a collection device onto a reaction by-product collection system for a narrow space according to an embodiment of the present invention. FIG. 5 is an exemplary diagram showing the process of replacing the collection device of the reaction by-product collection system for a narrow space according to an embodiment of the present invention. FIG. 6 is an exemplary diagram showing the structure of a semiconductor manufacturing factory where the reaction by-product collection system for a narrow space according to an embodiment of the present invention is installed.

[0083] With reference to the drawings, the installation and replacement processes of the collection system for a narrow space according to the present invention and a semiconductor manufacturing factory where such a collection system is installed will be described. Hereinafter, for the sake of convenience of explanation, it will be described on the assumption that the storage and fixing part 3, the loading part 4, and the collection device support part 5 have a structure that is integrally formed from the beginning. Also, for reference numerals not shown in the drawings, refer to FIGS. 1 to 3.

[0084] The storage and fixing part 3 provided with the moving means 31 is installed in a sub-factory b having a vertical height space with a limited height (for example, about 2 m), moved to the fixed vacuum pump 1, and surrounded. Then, after adjusting the height according to the state of the ground using the horizontal adjustment means 32 to make it horizontal, it is fixed to the ground using fastening means such as anchor bolts.

[0085] Thereafter, the collection device is placed on the transfer means 41 of the loading part 4 located above the vacuum pump using a lift (f) or a forklift. At this time, while being elastically supported by the support pad 52 formed inside the collection device support part 5 with one side open, it is horizontally moved through the moving means, and the discharge port protruding from the lower part of the collection device and the inflow section protruding from the upper part of the vacuum pump are aligned.

[0086] Thereafter, in order to prevent the dropped collection device with increased capacity in the position-aligned state, the open side surface of the collection device support part 5 is blocked by the stopper 51. In the state where such a step is performed, the height including the vacuum pump and the collection device is less than 2 m, and there is no difficulty during installation, and the capacity increase for the reaction by-product treatment through the sub-factory is performed.

[0087] Thereafter, it is installed above the vacuum pump, and the discharge ports protruding from the lower part of the collection device are connected using the pipe 6 that absorbs the play.

[0088] Thereafter, the vertical pipe for discharging the exhaust gas from the upper inlet of the collection device and the process chamber (d) installed inside the clean room (c) of the main factory (a) is also connected. This process can also be performed earlier in some cases before connecting the pipe.

[0089] After such a process is completed, the process chamber of the main factory, the collection device, and the vacuum pump are connected through the vertical pipe, and the vacuum pump is connected to the scrubber in the lateral direction through the horizontal pipe.

[0090] Thereafter, the valve 61 provided between the lower part of the pipe 6 and the upper end of the vacuum pump is opened.

[0091] Thereafter, if the vacuum pump is operated to make the inside of the collection device and the process chamber in a vacuum state, process gas is supplied to the process chamber to manufacture a semiconductor on the wafer, and the reaction by-products contained in the exhaust gas discharged during this process are collected by the collection device, and then the remaining exhaust gas is discharged to the scrubber (e) through the vacuum pump located at the lower part.

[0092] Thus, although the present invention has a collection device with increased capacity, there is no bent pipe structure for connecting the conventional large-capacity collection device to the vacuum pump, and no vortex is generated at the bent part of the bent pipe for the exhaust gas discharged from the collection device to the vacuum pump during operation, and no reaction by-products are generated in the pipe.

[0093] After that, after the collection device in the state with increased capacity has performed the collection operation for a longer time than the conventionally embedded collection device and the processing capacity reaches the limit, the operation of the process chamber is stopped or switched to the idling state, then the valve 61 of the pipe 6 is closed, and after the collection device with the stopper removed is horizontally moved from the loading section and loaded using a lift (f) or a forklift, a new collection device with increased capacity may be replaced.

[0094] The present invention is not limited to the specific desirable embodiments described above. Of course, any person having ordinary knowledge in the technical field to which the invention pertains can make various modified implementations without departing from the gist of the invention claimed in the claims, and such changes will be within the scope described in the claims.

Explanation of Reference Numerals

[0095] 1... Vacuum pump, 2... Collection device, 3... Vacuum pump storage and fixing part, 3a... Horizontal frame, 3b... Vertical frame, 3c... Open part, 4... Loading section, 4a... Open part, 4b... Support member, 5... Collection device support part, 5a... Horizontal frame, 5b... Vertical frame, 5c... Open part, 6... Pipe, 11... Inlet, 12... Outlet, 21... Inlet, 22... Outlet, 31... Moving means, 32... Horizontal adjustment means, 32a... Bolt part, 32b... Ground support part, 33... Fixing means, 41... Transfer means, 51... Stopper, 51a... Storage part, 52... Support pad, 61... Valve, 331... Vertical fastening part, 332... Horizontal fastening part, 331a, 332a... Long hole, a... Main factory, b... Sub-factory, c... Clean room

Claims

1. A vacuum pump (1) fixed to the ground of the sub-factory below the main factory; A collector (2) for collecting reaction by-products from the exhaust gas discharged from the process chamber and discharging the reaction by-products to the bottom; a vacuum pump storage and fixing section (3) including a moving means (31) for surrounding and positioning a vacuum pump fixed to the ground, a level adjustment means (32) installed for adjusting the level, and a fixing means (33) for fixing to the ground; a loading section (4) installed at the upper end of the vacuum pump storage and fixing section (3) to support the load of the collection device (2) and equipped with a transport means (41) used when adjusting the position of the collection device (2) and replacing it; a collection device support part (5) that is installed on the upper part of the loading part (4) and wraps and fixes the collection device (2); a pipe (6) for vertically connecting the vacuum pump (1) and the collector (2) and absorbing any clearance; A reaction by-product collection system for narrow spaces having a structure that prevents the generation of reaction by-products in the connecting pipe and is easily replaceable, characterized by comprising: a valve (61) installed to control the flow path of the exhaust gas flowing through the pipe (6).

2. 2. The reaction by-product collection system for a narrow space having a structure that prevents the generation of reaction by-products in the connecting pipe and is easily replaced, as claimed in claim 1, wherein the vacuum pump storage and fixing part (3) is a structure formed by welding or fastening a plurality of horizontal frames (3a) and vertical frames (3b) to form a structure having an opening (3c) on one side to allow the vacuum pump to enter.

3. The moving means (31) is composed of a plurality of freely rotating casters, balls, or rollers, The horizontal adjustment means (32) is composed of a bolt portion (32a) fastened to the frame and a ground support portion (32b) in contact with the ground, and is configured so that the bolt portion (32a) moves up and down by rotation of the ground support portion (32b); 2. The reaction by-product collection system for a narrow space having a structure for preventing generation of reaction by-products in the connecting pipe and for easy replacement, as set forth in claim 1, wherein the fixing means (33) is composed of a vertical fastening part (331) bolted to the frame and a horizontal fastening part (332) fastened to the ground, and one or more long holes (331a, 332a) are formed in the vertical fastening part and the horizontal fastening part, respectively.

4. 2. The reaction by-product collection system for a narrow space having a structure for preventing generation of reaction by-products in the connecting pipe and for easily replacing the reaction by-products, as set forth in claim 1, wherein the loading unit (4) has an open portion (4a) that is open from one side where the collection device enters to a central portion where the piping is installed, and the transport means (41) is provided for loading and replacing a collection device with an increased capacity and for adjusting the position of the collection device.

5. 5. The reaction by-product collection system for a narrow space, as set forth in claim 4, wherein the transport means (41) is provided in a plurality of units on each of the loading units (4) installed on both sides of the upper end of the storage and fixing unit (3), and is composed of a rotating body such as a caster, a roller, or a ball.

6. 2. The reaction by-product collection system for a narrow space having a structure for preventing generation of reaction by-products in a connecting pipe and having an easily replaceable structure as set forth in claim 1, wherein the collection device support part (5) is a structure in which a plurality of horizontal frames (5a) and vertical frames (5b) are welded or fastened to form a structure, and an opening part (5c) is formed on one side to allow the collection device to enter the loading part (4), and a stopper (51) is inserted into a storage part (51a) protruding outward from the vertical frames (5b) on both sides located in the opening part (5c) to prevent the collection device from falling.

7. 2. The reaction by-product collection system for a narrow space having a structure that prevents generation of reaction by-products in the connecting pipe and is easily replaced as described in claim 1, wherein the collection device support part (5) is configured to support the outer surface of the collection device (2) that comes into contact with the collection device support part (5) by providing support pads (52) for shock absorption and prevention of separation on the inside of three horizontal frames (5a) that constitute the upper end.

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