Multilayer coil component

Abstract

To provide a laminated coil component which has a compact constitution, and in which desired inductance is ensured and the occurrence of stray capacity can be suppressed.SOLUTION: In a laminated coil component 1, first and second terminal electrodes 5 and 6 are electrically connected to each other through a coil 10. First and second inner conductor layers 15a and 15b are positioned at an outermost position among a plurality of inner conductor layers 15 in a lamination direction D3. A third inner conductor layer 15c is sandwiched between the first and the second inner conductor layer 15a and 15b. The third inner conductor layer 15c is electrically connected to the first terminal electrode 5 through the first inner conductor layer 15a and to the second terminal electrode 6 through the second inner conductor layer 15b. The third inner conductor layer 15c overlaps the second terminal electrode 6 when viewed from the lamination direction D3. The first inner conductor layer 15a and a via 17a connected to the first inner conductor layer 15a do not overlap the second terminal electrode 6 when viewed from the lamination direction D3.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer coil component.

Background Art

[0002] A multilayer coil component including a body, a coil disposed inside the body, and first and second terminal electrodes disposed on the surface of the body so as to be separated from each other is known (for example, Patent Document 1). The coil includes a plurality of internal conductor layers and a plurality of vias. The plurality of internal conductor layers are laminated. Each via is connected to internal conductor layers adjacent to each other in the lamination direction of the plurality of internal conductor layers. The first and second terminal electrodes are electrically connected to each other via the coil.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When operating a multilayer coil component, if the distance between the coil and the terminal electrode is short, a parasitic capacitance is generated between the coil and the terminal electrode. If a parasitic capacitance is generated between the coil and the terminal electrode, for example, the self-resonant frequency (SRF) of the coil decreases.

[0005] If the entire coil is disposed at a position away from the terminal electrode, the parasitic capacitance is reduced. In this case, the SRF can also be ensured. However, in this case, the overall size of the coil component increases, or the inner diameter of the coil decreases. If the inner diameter of the coil is reduced, for example, the inductance decreases.

[0006] One aspect of the present invention aims to provide a laminated coil component that has a compact configuration, ensures a desired inductance, and can suppress the generation of stray capacitance.

Means for Solving the Problems

[0007] The laminated coil component according to one aspect of the present invention includes a body, a coil, and first and second terminal electrodes. The coil is disposed inside the body. The coil includes a plurality of internal conductor layers and a plurality of vias. The plurality of internal conductor layers are laminated. The vias are connected to adjacent internal conductor layers in the lamination direction of the plurality of internal conductor layers. The first and second terminal electrodes are spaced apart from each other and disposed on the surface of the body, and are electrically connected to each other via the coil. The plurality of internal conductor layers include first and second internal conductor layers and at least one third internal conductor layer. The first and second internal conductor layers are located outermost in the lamination direction among the plurality of internal conductor layers. The at least one third internal conductor layer is sandwiched between the first and second internal conductor layers. The at least one third internal conductor layer is electrically connected to the first terminal electrode via the first internal conductor layer and is electrically connected to the second terminal electrode via the second internal conductor layer. The at least one third internal conductor layer overlaps the second terminal electrode when viewed in the lamination direction. The first internal conductor layer and the vias connected to the first internal conductor layer do not overlap the second terminal electrode when viewed in the lamination direction.

[0008] In this multilayer coil component, at least one third internal conductor layer is electrically connected to the first terminal electrode via the first internal conductor layer and is electrically connected to the second terminal electrode via the second internal conductor layer. Therefore, the potential difference between the first internal conductor layer and the second terminal electrode is larger than the potential difference between the third internal conductor layer and the second terminal electrode. In this case, there is a possibility that a parasitic capacitance larger than the parasitic capacitance generated between the third internal conductor layer and the second terminal electrode may be generated between the first internal conductor layer and the second terminal electrode. The first internal conductor layer and the vias connected to the first internal conductor layer do not overlap the second terminal electrode when viewed in the stacking direction. In this case, the distance between the first internal conductor layer and the vias and the second terminal electrode is increased compared to the case where the first internal conductor layer and the vias overlap the second terminal electrode. As a result, the generation of parasitic capacitance is suppressed between the first internal conductor layer and the vias and the second terminal electrode. Further, the third internal conductor layer electrically connected to the first internal conductor layer overlaps the second terminal electrode when viewed in the stacking direction. Since the third internal conductor layer is arranged to overlap the second terminal electrode, the inner diameter of the coil can be ensured and the inductance can be ensured. Therefore, according to the above multilayer coil component, a desired inductance can be ensured with a compact configuration, and the generation of parasitic capacitance can be suppressed.

[0009] In the above aspect, at least one third internal conductor layer may include an internal conductor layer connected to the first internal conductor layer by a via. This internal conductor layer may overlap the second terminal electrode when viewed in the stacking direction. Therefore, the inner diameter of the coil can also be ensured in the portion of the coil on the first internal conductor layer side. Therefore, a multilayer coil component having desired parameters can be easily designed.

[0010] In one of the above aspects, the first internal conductor layer may include a linear portion extending in a direction intersecting the lamination direction. The linear portion may include an end portion connected to a via. The end portion may be the closest to the second terminal electrode among the first internal conductor layers when viewed in the lamination direction. In this case, the inner diameter of the coil can be ensured also in the portion of the coil on the first internal conductor layer side. Therefore, a laminated coil component having desired parameters can be easily designed.

[0011] In one of the above aspects, at least one third internal conductor layer may overlap the first terminal electrode when viewed in the lamination direction. The second internal conductor layer and the vias connected to the second internal conductor layer may not overlap the first terminal electrode when viewed in the lamination direction. In this case, the generation of stray capacitance is also suppressed between the second internal conductor layer and the above vias and the first terminal electrode.

[0012] In one of the above aspects, the laminated coil component may further include a bottom electrode layer. The bottom electrode layer is disposed on the surface of the element body and is connected to the second terminal electrode. At least one third internal conductor layer may overlap the bottom electrode layer when viewed in the lamination direction. The first internal conductor layer and the vias connected to the first internal conductor layer may not overlap the bottom electrode layer when viewed in the lamination direction. In this case, the generation of stray capacitance is also suppressed between the coil and the bottom electrode layer.

[0013] In one of the above aspects, at least one third internal conductor layer may include a plurality of third internal conductor layers overlapping the second terminal electrode when viewed in the lamination direction. In the lamination direction, the length of the portion occupied by the vias between the third internal conductor layer closest to the first internal conductor layer among the plurality of third internal conductor layers and the first internal conductor layer may be larger than the length of the vias connected to each third internal conductor layer between the mutually adjacent third internal conductor layers. In this case, the third internal conductor layer closest to the first internal conductor layer and the second terminal electrode are separated by the length occupied by the above vias. Therefore, the generation of stray capacitance between the coil and the second terminal electrode is further suppressed.

[0014] In one aspect of the present invention, a multilayer coil component includes a base body, a coil, and first and second terminal electrodes. The coil is disposed inside the base body. The coil includes a plurality of internal conductor layers and a plurality of vias. The plurality of internal conductor layers are laminated. The vias are connected to adjacent internal conductor layers in the lamination direction of the plurality of internal conductor layers. The first and second terminal electrodes are spaced apart from each other and disposed on the surface of the base body, and are electrically connected to each other via the coil. The plurality of internal conductor layers include first and second internal conductor layers and at least one third internal conductor layer. The first and second internal conductor layers are located on the outermost side in the lamination direction among the plurality of internal conductor layers. The at least one third internal conductor layer is sandwiched between the first and second internal conductor layers. The at least one third internal conductor layer is electrically connected to the first terminal electrode via the first internal conductor layer and is electrically connected to the second terminal electrode via the second internal conductor layer. The first terminal electrode and the second terminal electrode face each other in a direction intersecting the lamination direction. When viewed from the lamination direction, the base body includes a first region and a second region. The first region and the second region are arranged in the facing direction of the first terminal electrode and the second terminal electrode. When viewed from the lamination direction, the third internal conductor layer overlaps the first and second regions. When viewed from the lamination direction, the first internal conductor layer and the vias connected to the first internal conductor layer do not overlap the first region and overlap the second region.

[0015] In the above-described another aspect, the base body includes a first region and a second region that are arranged in the facing direction between the first terminal electrode and the second terminal electrode. When viewed from the stacking direction, the third internal conductor layer overlaps with the first region, and the first internal conductor layer and the via connected to the first internal conductor layer do not overlap with the first region. In this case, the first internal conductor layer, the via, and the second terminal electrode are separated from the third internal conductor layer by the amount of the first region when viewed from the stacking direction. Therefore, the generation of stray capacitance is suppressed between the first internal conductor layer, the via, and the second terminal electrode. Since the third internal conductor layer is located in the first region, the inner diameter of the coil can be ensured. Therefore, according to the above-described stacked coil component, a desired inductance can be ensured with a compact configuration, and the generation of stray capacitance can be suppressed.

Effect of the Invention

[0016] One aspect of the present invention provides a stacked coil component that can ensure a desired inductance with a compact configuration and suppress the generation of stray capacitance.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

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Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

[0019] First, with reference to FIGS. 1 to 3, the schematic configuration of the multilayer coil component 1 in this embodiment will be described. FIG. 1 is a perspective view of the multilayer coil component 1 in this embodiment. FIG. 2 is a plan view of the multilayer coil component 1 in this embodiment. FIG. 3 is a diagram showing the internal configuration of the multilayer coil component 1 in this embodiment. Directions D1, D2, and D3 are directions intersecting each other.

[0020] As shown in FIGS. 1 and 2, the multilayer coil component 1 includes a base body 2, a pair of terminal electrodes 5 and 6 disposed on the outer surface of the base body 2, and a coil 10 disposed inside the base body 2. The multilayer coil component 1 is, for example, surface-mounted on an electronic device by soldering. The electronic device includes, for example, a circuit board or an electronic component.

[0021] The base body 2 has, for example, a rectangular parallelepiped shape. The rectangular parallelepiped shape includes the shape of a rectangular parallelepiped with chamfered corners and edges, and the shape of a rectangular parallelepiped with rounded corners and edges. The shape of the base body 2 is not limited to the rectangular parallelepiped shape. For example, the base body 2 may have a cylindrical shape. The base body 2 has, as its outer surface, a pair of main surfaces 2a, 2b, a pair of end surfaces 2c, 2d, and a pair of side surfaces 2e. Each of the main surfaces 2a, 2b is also a side surface of the base body 2 having a rectangular parallelepiped shape. In the multilayer coil component 1, one of the main surfaces 2b is the mounting surface to be mounted on the electronic device. In the multilayer coil component 1, one of the main surfaces 2b faces the electronic device.

[0022] The pair of main surfaces 2a, 2b face each other in the direction D3. The pair of end surfaces 2c, 2d face each other in the direction D1. The pair of side surfaces 2e face each other in the direction D2. The direction D1 is orthogonal to, for example, the direction D2 and the direction D3. The direction D2 is orthogonal to, for example, the direction D3. The base body 2 is, for example, smaller in length in the direction D1 and in the length in the direction D2. The base body 2 is, for example, smaller in length in the direction D3 compared to the lengths in the directions D1 and D2. The length ratios of the base body 2 in the directions D1, D2, and D3 are not limited to this. The direction D1 is, for example, the longitudinal direction. The direction D2 is, for example, the width direction. The direction D3 is, for example, the height direction.

[0023] The pair of terminal electrodes 5, 6 are arranged on the outer surface of the base body 2 while being separated from each other. The pair of terminal electrodes 5, 6 face each other in the direction D1. The pair of terminal electrodes 5, 6 are separated from each other in the direction D1. The terminal electrodes 5, 6 are electrically connected to each other via the coil 10.

[0024] The pair of terminal electrodes 5 and 6 are formed by a known method. The pair of terminal electrodes 5 and 6 are formed, for example, by subjecting an electrode layer to a plating process. The electrode layer is made of, for example, a conductive paste. The conductive paste is applied, for example, by a dipping method, a printing method, or a transfer method. In the present embodiment, the electrode layer is formed by the dipping method. The conductive paste used is, for example, a mixture of a conductor component, a glass component, an organic binder, and an organic solvent. The conductor component is, for example, metal powder such as Ag or Cu. The electrode layer may be formed, for example, by physical vapor deposition (PVD method) or chemical vapor deposition (CVD method). The plating process is, for example, electrolytic plating or electroless plating. By this plating process, a plating layer is formed on the outer surface of the conductive paste.

[0025] The terminal electrode 5 includes, for example, portions 5a, 5b, and 5c. The portion 5a of the terminal electrode 5 is provided on the end face 2c. The portion 5b of the terminal electrode 5 is provided on the pair of main surfaces 2a and 2b. The portion 5c of the terminal electrode 5 is provided on the pair of side surfaces 2e. The portion 5a of the terminal electrode 5 covers, for example, the entire end face 2c. The portions 5b and 5c of the terminal electrode 5 cover, for example, a part of the pair of main surfaces 2a and 2b and the pair of side surfaces 2e. The portion 5a of the terminal electrode 5 is connected to the portions 5b and 5c of the terminal electrode 5. In each of the main surfaces 2a and 2b, the region covered by the portion 5b of the terminal electrode 5 has, for example, a rectangular shape. In each of the side surfaces 2e, the region covered by the portion 5c of the terminal electrode 5 has, for example, a rectangular shape. In this specification, "connected" means being connected in a directly contacting state. "Directly contacting" means being connected to each other without passing through other members shown in this specification. "Directly contacting" does not exclude being connected through a member not explicitly shown in this specification.

[0026] The terminal electrode 6 includes, for example, portions 6a, 6b, and 6c. The portion 6a of the terminal electrode 6 is provided on the end face 2d. The portion 6b of the terminal electrode 6 is provided on the pair of main faces 2a, 2b. The portion 6c of the terminal electrode 6 is provided on the pair of side faces 2e. The portion 6a of the terminal electrode 6 covers, for example, the entire end face 2d. The portions 6b and 6c of the terminal electrode 6 cover, for example, a part of the pair of main faces 2a, 2b and the pair of side faces 2e. The portion 6a of the terminal electrode 6 is connected to the portions 6b and 6c of the terminal electrode 6. On each of the main faces 2a, 2b, the region covered by the portion 6b of the terminal electrode 6 has, for example, a rectangular shape. On each of the side faces 2e, the region covered by the portion 6c of the terminal electrode 6 has, for example, a rectangular shape.

[0027] FIG. 2 is a view of the multilayer coil component 1 seen from the direction D3, and the coil 10 disposed inside the element body 2 is shown by a dashed line. The coil 10 has a coil axis along the direction D3 inside the element body 2, and is formed in a spiral shape around this coil axis. The coil 10 includes a pair of tips 10a, 10b. The tip 10a and the tip 10b are electrically connected to each other. The tip 10a is exposed from the end face 2c of the element body 2. The tip 10a is connected to the terminal electrode 5. The tip 10b is exposed from the end face 2d of the element body 2. The tip 10b is connected to the terminal electrode 6.

[0028] As shown in FIGS. 2 and 3, the coil 10 includes a plurality of internal conductor layers 15 and a plurality of vias 17. FIG. 3 shows the case when seen from the direction D2. The plurality of internal conductor layers 15 are laminated in the direction D3. The direction D3 corresponds to the lamination direction. The plurality of internal conductor layers 15 are electrically connected to each other via the plurality of vias 17.

[0029] The via 17 is a connection conductor. The via 17 is connected to the adjacent internal conductor layers 15 in the direction D3. The plurality of vias 17 are each provided so as to penetrate the element body 2 located between the internal conductor layers 15.

[0030] The coil 10 has a conductive path formed by a plurality of internal conductor layers 15 and a plurality of vias 17 that connect each of the plurality of internal conductor layers 15, electrically connecting the tip 10a and the tip 10b. The conductive path is the path through which current flows when the multilayer coil component 1 operates normally. In other words, the conductive path is the path that electrically connects the terminal electrode 5 and the terminal electrode 6. The plurality of internal conductor layers 15, the plurality of vias 17, and the bottom electrode layer 25 described later are made of a conductive material. The conductive material contains, for example, at least one selected from Ag and Pd. For example, when one of the terminal electrodes 5 and 6 corresponds to the first terminal electrode, the other of the terminal electrodes 5 and 6 corresponds to the second terminal electrode.

[0031] The plurality of internal conductor layers 15 includes a pair of internal conductor layers 15a and 15b and at least one internal conductor layer 15c. The internal conductor layers 15a and 15b are located outermost in the direction D3 among the plurality of internal conductor layers 15. The internal conductor layers 15a and 15b are the outermost internal conductor layers. For example, when one of the internal conductor layers 15a and 15b corresponds to the first internal conductor layer, the other of the internal conductor layers 15a and 15b corresponds to the second internal conductor layer. In this case, the internal conductor layer 15c corresponds to the third internal conductor layer.

[0032] The position of the internal conductor layer 15a is closer to the main surface 2a of the element body 2 than the positions of the other internal conductor layers 15. The position of the internal conductor layer 15b is closer to the main surface 2b of the element body 2 than the positions of the other internal conductor layers 15. The internal conductor layer 15a is closer to the terminal electrode 5 than the other internal conductor layers 15 in the conductive path of the coil 10. The internal conductor layer 15b is closer to the terminal electrode 6 than the other internal conductor layers 15 in the conductive path of the coil 10.

[0033] The internal conductor layer 15a forms the tip 10a of the coil 10. The internal conductor layer 15a is connected to the terminal electrode 5 at the tip 10a, for example. The internal conductor layer 15b forms the tip 10b of the coil 10. The internal conductor layer 15b is connected to the terminal electrode 6 at the tip 10b, for example.

[0034] The plurality of internal conductor layers 15 includes, for example, a plurality of internal conductor layers 15c. Each internal conductor layer 15c is sandwiched between an internal conductor layer 15a and an internal conductor layer 15b in the direction D3. The internal conductor layer 15a and the plurality of internal conductor layers 15c are electrically connected to the terminal electrode 6 via the internal conductor layer 15b. The internal conductor layer 15b and the plurality of internal conductor layers 15c are electrically connected to the terminal electrode 5 via the internal conductor layer 15a.

[0035] Next, with reference to FIGS. 2, 3, 4(a) to 4(d), and FIGS. 5(a) to 5(e), the configuration of the multilayer coil component 1 will be described in more detail. FIGS. 4(a) to 4(d) are diagrams showing a part of the laminated structure of the multilayer coil component 1. FIGS. 5(a) to 5(e) are diagrams showing a part of the laminated structure of the multilayer coil component 1.

[0036] As shown in FIGS. 4(a) to 4(d) and FIGS. 5(a) to 5(e), the element body 2 is composed of a plurality of laminated element body layers 22. The element body layer 22 is, for example, a ceramic sheet. The plurality of internal conductor layers 15a, 15b, 15c, the plurality of vias 17, and the bottom electrode layer 25 are provided in the corresponding element body layers 22, respectively. Each of the internal conductor layers 15a, 15b, 15c, and the bottom electrode layer 25 is formed on the element body layer 22, for example, by screen printing. The plurality of vias 17 are provided in the corresponding element body layers 22 so as to penetrate each element body layer 22. The via 17 is provided, for example, in a through hole penetrating the corresponding element body layer 22. In FIGS. 4(a) to 4(d) and FIGS. 5(a) to 5(e), the arrangement where the vias 17 are connected is shown by a broken line, and the boundary between the terminal electrodes 5, 6 and the element body 2 when viewed from the direction D3 is shown by a one-dot chain line.

[0037] The plurality of element layers 22 are stacked in the direction D3. In the actual element 2, the plurality of element layers 22 are integrated to such an extent that the boundaries between the layers are not visible. The plurality of element layers 22 are, for example, insulating layers having insulating properties. The element layer 22 is, for example, composed of a magnetic material. The magnetic material includes, for example, at least one selected from Ni-Cu-Zn-based ferrite materials, Ni-Cu-Zn-Mg-based ferrite materials, or Ni-Cu-based ferrite materials. The magnetic material constituting the element layer 22 may include an Fe alloy or the like. The element layer 22 may be composed of a non-magnetic material. The non-magnetic material includes, for example, at least one selected from glass ceramic materials and dielectric materials.

[0038] The multilayer coil component 1 includes a plurality of pattern layers L. The plurality of pattern layers L include pattern layers La, Lb, Lc, Ld, Le, and Lf. FIGS. 4(a) to 4(d) and FIGS. 5(a) to 5(e) show the respective configurations of the pattern layers La, Lb, Lc, Ld, Le, and Lf included in the multilayer coil component 1. The plurality of pattern layers La, Lb, Lc, Ld, and Le are formed by the respective internal conductor layers 15a, 15b, 15c, vias 17, and element layers 22. The pattern layer Lf is formed by the bottom electrode layers 25a, 25b and the element layer 22.

[0039] The multilayer coil component 1 includes, for example, one pattern layer La, one pattern layer Lb, three pattern layers Lc, two pattern layers Ld, one pattern layer Le, and one pattern layer Lf. The multilayer coil component 1 also includes layers other than the plurality of pattern layers L. For example, the multilayer coil component 1 includes a layer composed only of the element layer 22 on the main surface 2a side of the pattern layer La.

[0040] The plurality of pattern layers La, Lb, Lc, Ld, Le, Lf are arranged in the order shown in FIGS. 4(a) to 4(d) and FIGS. 5(a) to 5(e) from the main surface 2a side toward the main surface 2b side. In other words, the plurality of pattern layers L are arranged in the order of pattern layer La, pattern layer Lb, pattern layer Lc, pattern layer Ld, pattern layer Lc, pattern layer Ld, pattern layer Lc, pattern layer Le, pattern layer Lf from the main surface 2a side toward the main surface 2b side. The pattern layers Lc and Ld are repeatedly arranged alternately between the pattern layer Lb and the pattern layer Le.

[0041] The configuration of the multilayer coil component 1 is not limited to the configuration of the above pattern layer L. For example, the multilayer coil component 1 may have four or more pattern layers Lc and three or more pattern layers Ld between the pattern layer Lb and the pattern layer Le. In this case, as the number of the pattern layer Lc and the pattern layer Ld increases, the number of turns of the coil 10 increases. The multilayer coil component 1 may have two or less pattern layers Lc and one or less pattern layer Ld between the pattern layer Lb and the pattern layer Le.

[0042] The pattern layer La includes the internal conductor layer 15a. The pattern layers Lb, Lc, Ld each include the internal conductor layer 15c. The pattern layer Le includes the internal conductor layer 15b. The internal conductor layers 15a, 15b, 15c each include a linear portion 30 having a linear shape. The linear portion 30 is a part of the conductive path of the coil 10. Each linear portion 30 includes an end portion 31 connected to the via 17 at its tip. The linear portion 30 of the internal conductor layer 15a includes the end portion 31 on the side opposite to the portion constituting the tip 10a of the coil 10. The internal conductor layer 15a includes one end portion 31. The linear portions 30 of the internal conductor layer 15c each include an end portion 31 at both ends. The internal conductor layer 15b includes two end portions 31. The linear portion 30 of the internal conductor layer 15b includes the end portion 31 on the side opposite to the portion constituting the tip 10b of the coil 10. The internal conductor layer 15b includes one end portion 31.

[0043] The pattern layer Lf includes bottom electrode layers 25a and 25b that are spaced apart from each other. The bottom electrode layer 25a is exposed from the end face 2c and the main face 2b of the base body 2. The bottom electrode layer 25a is connected to the terminal electrode 5 in the directions D1 and D3. The bottom electrode layer 25b is exposed from the end face 2d and the main face 2b of the base body 2. The bottom electrode layer 25b is connected to the terminal electrode 6 in the directions D1 and D3. The bottom electrode layers 25a and 25b exhibit, for example, a rectangular shape with rounded sides facing each other in the direction D2 in a plan view. For example, in the direction D1, the length of the bottom electrode layer 25a is longer than the length of the region where the terminal electrode 5 and the main face 2b of the base body 2 overlap. For example, in the direction D1, the length of the bottom electrode layer 25b is longer than the length of the region where the terminal electrode 6 and the main face 2b of the base body 2 overlap.

[0044] The plurality of vias 17 includes vias 17a, 17b, and 17c. The vias 17a, 17b, and 17c are arranged in regions different from each other when viewed from the direction D3. When viewed from the direction D3, the via 17a and the via 17b do not overlap, the via 17a and the via 17c do not overlap, and the via 17b and the via 17c do not overlap.

[0045] The coil 10 of the multilayer coil component 1 includes, for example, one via 17a, a plurality of vias 17b, and a plurality of vias 17c. The plurality of vias 17b overlap when viewed from the direction D3. The plurality of vias 17c overlap when viewed from the direction D3. The via 17a is connected to the internal conductor layer 15a. The vias 17b and 17c are connected to each internal conductor layer 15c between adjacent internal conductor layers 15c. The via 17c is connected to the internal conductor layer 15b. In the present embodiment, the lengths of the vias 17a, 17b, and 17c in the direction D3 are the same. The distance between adjacent internal conductor layers 15 in the direction D3 is constant.

[0046] The internal conductor layer 15a in the pattern layer La shown in FIG. 4(a) and the internal conductor layer 15c in the pattern layer Lb shown in FIG. 4(b) are connected by a via 17a. The internal conductor layer 15a and the via 17a do not overlap with the terminal electrode 6 when viewed from the direction D3. The internal conductor layer 15a includes a linear portion 30 extending in the direction D1. The internal conductor layer 15a has, for example, an elongated shape. The linear portion 30 of the internal conductor layer 15a includes an end portion 31 connected to the via 17a. The end portion 31 of the internal conductor layer 15a is the closest to the terminal electrode 6 among the internal conductor layer 15a when viewed from the direction D3.

[0047] The internal conductor layer 15c in the pattern layer Lb shown in FIG. 4(b) and the internal conductor layer 15c in the pattern layer Lc shown in FIG. 4(c) are connected by a via 17b. The internal conductor layer 15c in the pattern layer Lc shown in FIG. 4(c) and the internal conductor layer 15c in the pattern layer Ld shown in FIG. 4(d) are connected by a via 17c. The internal conductor layer 15c in the pattern layer Ld shown in FIG. 4(d) and the internal conductor layer 15c in the pattern layer Lc shown in FIG. 5(a) are connected by a via 17b.

[0048] The internal conductor layer 15c in the pattern layer Lc shown in FIG. 5(a) and the internal conductor layer 15c in the pattern layer Ld shown in FIG. 5(b) are connected by a via 17c. The internal conductor layer 15c in the pattern layer Ld shown in FIG. 5(b) and the internal conductor layer 15c in the pattern layer Lc shown in FIG. 5(c) are connected by a via 17b. The internal conductor layer 15c in the pattern layer Lc shown in FIG. 5(c) and the internal conductor layer 15c in the pattern layer Le shown in FIG. 5(d) are connected by a via 17c. The bottom electrode layer 25 in the pattern layer Lf shown in FIG. 5(e) is not connected to the via 17.

[0049] With the above configuration, in the multilayer coil component 1, a spiral structure in which the coil 10 rises counterclockwise along the direction D3 is formed. The bottom electrode layer 25 is disposed on the surface of the base body 2. The bottom electrode layer 25a is connected to the terminal electrode 5. The bottom electrode layer 25b is connected to the terminal electrode 6.

[0050] The internal conductor layer 15c and the via 17c of the pattern layers Lb, Lc, Ld overlap the terminal electrode 6 when viewed from the direction D3. The internal conductor layer 15b and the via 17c of the pattern layer Le overlap the terminal electrode 6 when viewed from the direction D3. In the multilayer coil component 1, all the internal conductor layers 15c overlap the terminal electrode 6 when viewed from the direction D3. In a modification of the present embodiment, at least one of the plurality of internal conductor layers 15c may not overlap the terminal electrode 6 when viewed from the direction D3.

[0051] As shown in FIGS. 2 and 3, when viewed from the direction D3, the base body 2 includes regions α1 and α2 arranged in the direction D1. The direction D1 corresponds to the facing direction of the terminal electrodes 5 and 6. The regions α1 and α2 are regions obtained by dividing the base body 2 in the direction D1 when viewed from the direction D3. The region α1 and the region α2 are adjacent to each other. The region α1 is closer to the end face 2d of the base body 2 than the region α2 when viewed from the direction D3. When viewed from the direction D3, the internal conductor layers 15b, 15c and the via 17c overlap the region α1. When viewed from the direction D3, the internal conductor layer 15a and the vias 17a, 17b do not overlap the region α1. When viewed from the direction D3, the internal conductor layers 15a, 15b, 15c and the vias 17a, 17b overlap the region α2. The shortest distance between the end portion 31 of the internal conductor layer 15a closest to the terminal electrode 6 and the terminal electrode 6 is greater than the shortest distance between the plurality of internal conductor layers 15c and the terminal electrode 6. The shortest distance between the via 17a connected to the internal conductor layer 15a and the terminal electrode 6 is greater than the shortest distance between the plurality of internal conductor layers 15c and the terminal electrode 6. When the region α1 corresponds to the first region, the region α2 corresponds to the second region.

[0052] Next, with reference to FIGS. 6 and 7, the laminated coil components 1A and 1B in the modified example of the present embodiment will be described. FIG. 6 is a diagram showing the internal configuration of the laminated coil component 1A. FIG. 7 is a diagram showing the internal configuration of the laminated coil component 1B. These modified examples are generally similar or the same as the above-described laminated coil component 1. Hereinafter, the differences between the above-described laminated coil component 1 and the laminated coil components 1A and 1B will be mainly described.

[0053] In the laminated coil components 1A and 1B, a plurality of internal conductor layers 15c overlap the terminal electrode 6 when viewed from the direction D3. In the direction D3, the length of the portion occupied by the via 17 between the internal conductor layer 15c closest to the internal conductor layer 15a and the internal conductor layer 15a among these internal conductor layers 15c is larger than the length of the via 17 connected to each internal conductor layer 15c between the adjacent internal conductor layers 15c.

[0054] For example, in the laminated coil component 1A, the length of the via 17a in the direction D3 is larger than the lengths of the vias 17b and 17c in the direction D3. Therefore, the distance between the internal conductor layer 15a and the internal conductor layer 15c adjacent to each other in the direction D3 is larger than the distance between two adjacent internal conductor layers 15c in the direction D3. In this case, for example, the thickness of the element body layer 22 in the pattern layer La is formed to be larger than the thickness of the element body layer 22 in other pattern layers.

[0055] The laminated coil component 1B further includes at least one internal conductor layer 15d having the same shape as the internal conductor layer 15a. The plurality of vias 17 include a plurality of vias 17a. The internal conductor layer 15d and the internal conductor layer 15a are connected by the via 17a. For example, at least one pattern layer La is further provided between the adjacent pattern layers La and Lb. An internal conductor layer 15d having the same shape as the internal conductor layer 15a is provided in the element body layer 22 in the pattern layer La located between the pattern layer La and the pattern layer Lb. The internal conductor layer 15d and the internal conductor layer 15c in the pattern layer Lb shown in FIG. 4(b) are connected by the via 17a.

[0056] In this case, when viewed from direction D3, via 17a connected to internal conductor layer 15d and internal conductor layer 15 does not overlap with region α1 and overlaps with region α2. Via 17a connected to internal conductor layer 15d and internal conductor layer 15 does not overlap with terminal electrode 6 when viewed from direction D3. Also in this case, it is configured such that the distance between internal conductor layer 15a and internal conductor layer 15c closest to internal conductor layer 15a in direction D3 is greater than the distance between two adjacent internal conductor layers 15c in direction D3.

[0057] Next, with reference to FIGS. 8, 9, 4(a) to 4(d), and 10(a) to 10(e), the laminated coil component 1C in the modification of this embodiment will be described. FIG. 8 is a plan view of the laminated coil component 1C. FIG. 9 is a diagram showing the internal configuration of the laminated coil component 1C. FIGS. 10(a) to 10(e) are diagrams showing a part of the laminated structure of the laminated coil component 1C. In FIGS. 10(a) to 10(e), the arrangement to which via 17 is connected is indicated by a broken line, and the boundary between terminal electrodes 5 and 6 and element body 2 when viewed from direction D3 is indicated by a dashed-dotted line. This modification is generally similar or the same as the above-described laminated coil component 1. Hereinafter, the differences between the above-described laminated coil component 1 and the laminated coil component 1C will be mainly described.

[0058] The multilayer coil component 1C includes a plurality of pattern layers L. The plurality of pattern layers L include pattern layers La, Lb, Lc, Ld, Lf, Lg, and Lh. FIGS. 4(a) to 4(d) and FIGS. 10(a) to 10(e) show the configurations of the pattern layers La, Lb, Lc, Ld, Lf, Lg, and Lh of the multilayer coil component 1C. The pattern layer L of the multilayer coil component 1C does not include the pattern layer Le, and further includes the pattern layer Lg and the pattern layer Lh. The pattern layer Lg includes the internal conductor layer 15c. The pattern layer Lh includes the internal conductor layer 15b. The pattern layers La, Lb, Lc, Ld, and Lf of the multilayer coil component 1C have the same configuration as the pattern layers La, Lb, Lc, Ld, and Lf of the multilayer coil component 1. The plurality of pattern layers La, Lb, Lc, Ld, Lf, Lg, and Lh are formed by the respective internal conductor layers 15a, 15b, 15c and the base body layer 22. The pattern layer Lf is formed by the bottom electrode layers 25a, 25b and the base body layer 22.

[0059] The multilayer coil component 1C includes, for example, one pattern layer La, two pattern layers Lb, two pattern layers Lc, one pattern layer Ld, one pattern layer Lf, one pattern layer Lg, and one pattern layer Lh. The plurality of pattern layers La, Lb, Lc, Ld, Lf, Lg, and Lh are arranged in the order shown in FIGS. 4(a) to 4(d) and FIGS. 10(a) to 10(e) from the main surface 2a side toward the main surface 2b side. In other words, the plurality of pattern layers L are arranged in the order of the pattern layer La, the pattern layer Lb, the pattern layer Lc, the pattern layer Ld, the pattern layer Lc, the pattern layer Lg, the pattern layer Lb, the pattern layer Lh, and the pattern layer Lf from the main surface 2a side toward the main surface 2b side. The pattern layers Lc and Ld are repeatedly arranged alternately between the pattern layer Lb and the pattern layer Lg.

[0060] The configuration of the multilayer coil component 1C is not limited to the configuration of the above pattern layer L. For example, the multilayer coil component 1C may have three or more pattern layers Lc and three or more pattern layers Ld between the pattern layer Lb and the pattern layer Lg. In this case, as the number of the pattern layer Lc and the pattern layer Ld increases, the number of turns of the coil 10 increases.

[0061] The plurality of vias 17 of the multilayer coil component 1C further includes vias 17d and 17e in addition to the vias 17a, 17b, and 17c. The vias 17a, 17b, 17c, 17d, and 17e are arranged in different regions when viewed from the direction D3. When viewed from the direction D3, the via 17d does not overlap with the vias 17a, 17b, 17c, and 17e. The via 17e does not overlap with the vias 17a, 17b, 17c, and 17d. And does not overlap.

[0062] The coil 10 of the multilayer coil component 1C includes, for example, one via 17a, a plurality of vias 17b, a plurality of vias 17c, one via 17d, and one via 17e. Similar to the via 17b, the via 17d is a via connected to each internal conductor layer 15c between adjacent internal conductor layers 15c. The via 17d is connected to the internal conductor layer 15c connected to the internal conductor layer 15b via the via 17c. The via 17e is connected to the internal conductor layer 15b. In this modification, the via 17c is not connected to the internal conductor layer 15b.

[0063] The internal conductor layer 15c in the pattern layer Ld shown in FIG. 4(d) and the internal conductor layer 15c in the pattern layer Lc shown in FIG. 10(a) are connected by a via 17b. The internal conductor layer 15c in the pattern layer Lc shown in FIG. 10(a) and the internal conductor layer 15c in the pattern layer Lg shown in FIG. 10(b) are connected by a via 17c. The internal conductor layer 15c in the pattern layer Lg shown in FIG. 10(b) and the internal conductor layer 15c in the pattern layer Lb shown in FIG. 10(c) are connected by a via 17d. The internal conductor layer 15c in the pattern layer Lb shown in FIG. 10(c) and the internal conductor layer 15c in the pattern layer Lh shown in FIG. 10(d) are connected by a via 17e. The bottom electrode layer 25 in the pattern layer Lf shown in FIG. 10(e) is not connected to the via 17. With the above configuration, in the multilayer coil component 1, a spiral structure in which the coil 10 winds counterclockwise along the direction D3 is formed.

[0064] The internal conductor layers 15c of the pattern layers Lb, Lc, Ld, and Lg and the vias 17c and 17d overlap the terminal electrode 6 when viewed from the direction D3. The internal conductor layer 15b of the pattern layer Lh overlaps the terminal electrode 6 when viewed from the direction D3. In the multilayer coil component 1C, all the internal conductor layers 15c overlap the terminal electrode 6 and the bottom electrode layers 25a and 25b when viewed from the direction D3. Also in the multilayer coil component 1C, the internal conductor layer 15a and the via 17a do not overlap the terminal electrode 6 when viewed from the direction D3. The internal conductor layer 15a includes a linear portion 30 extending in the direction D1. The internal conductor layer 15a has, for example, an elongated shape. The linear portion 30 of the internal conductor layer 15a includes an end portion 31 connected to the via 17a. The end portion 31 of the internal conductor layer 15a is the closest to the terminal electrode 6 among the internal conductor layer 15a when viewed from the direction D3.

[0065] In the multilayer coil component 1C, the internal conductor layer 15b and the via 17e do not overlap the terminal electrode 5 when viewed from the direction D3. The internal conductor layer 15b and the via 17e of the multilayer coil component 1C also do not overlap the bottom electrode layer 25a when viewed from the direction D3. The internal conductor layer 15b of the multilayer coil component 1C includes a linear portion 30 extending in the direction D1, similar to the internal conductor layer 15a. The internal conductor layer 15b of the multilayer coil component 1C has, for example, an elongated shape. The linear portion 30 of the internal conductor layer 15b of the multilayer coil component 1C includes an end portion 31 connected to the via 17e. The end portion 31 of the internal conductor layer 15b of the multilayer coil component 1C is the closest to the terminal electrode 5 among the internal conductor layer 15b when viewed from the direction D3. In the multilayer coil component 1C, the internal conductor layer 15a and the internal conductor layer 15b have a shape that is mirror-symmetric to each other.

[0066] As shown in FIGS. 8 and 9, when viewed from the direction D3, the element body 2 includes a region β1, a region β2, and a region β3 arranged in the direction D1. FIG. 9 shows the case when viewed from the direction D2. The regions β1, β2, and β3 are regions obtained by dividing the element body 2 in the direction D1 when viewed from the direction D3. The regions β1, β2, and β3 are arranged in order in the direction D1. The region β1 and the region β2 are adjacent to each other. The region β2 and the region β3 are adjacent to each other. The region β1 and the region β3 are spaced apart from each other. The region β1 is closer to the end face 2d of the element body 2 than the regions β2 and β3 when viewed from the direction D3.

[0067] When viewed from the direction D3, the internal conductor layers 15b and 15c and the vias 17c and 17d overlap the region β1. When viewed from the direction D3, the internal conductor layer 15a and the vias 17a, 17b, and 17e do not overlap the region β1. When viewed from the direction D3, the internal conductor layers 15a, 15b, and 15c and the via 17e overlap the region β2. When viewed from the direction D3, the internal conductor layers 15a and 15c and the via 17b overlap the region β3. When viewed from the direction D3, the internal conductor layer 15b and the vias 17a, 17b, 17c, and 17e do not overlap the region β3. When the regions β1 and β3 correspond to the first region, the region β2 corresponds to the second region.

[0068] In the multilayer coil component 1C, the shortest distance between the end portion 31 closest to the terminal electrode 5 in the internal conductor layer 15b and the terminal electrode 5 is greater than the shortest distance between the plurality of internal conductor layers 15c and the terminal electrode 5. The shortest distance between the via 17e connected to the internal conductor layer 15b and the terminal electrode 5 is greater than the shortest distance between the plurality of internal conductor layers 15c and the terminal electrode 5.

[0069] Next, the effects of the multilayer coil components 1, 1A, 1B, and 1C in the present embodiment and the modified example will be described. FIG. 11 is a diagram showing a part of the laminated structure of the multilayer coil component of the comparative example.

[0070] When operating the multilayer coil component, if the distance between the coil and the terminal electrode is short, a stray capacitance is generated between the coil and the terminal electrode. If the entire coil is arranged at a position away from the terminal electrode, the stray capacitance is reduced. However, in this case, the overall size of the coil component increases, or the inner diameter of the coil decreases and the inductance decreases.

[0071] For example, as shown in FIG. 11, among the plurality of internal conductor layers 15, the outermost internal conductor layers 15a and 15b in the direction D3 are connected to different terminal electrodes 5 and 6, respectively. In this case, the potential difference between the internal conductor layer 15a and the via 17 connected to the internal conductor layer 15a and the terminal electrode 6 is greater than the potential difference between the other internal conductor layers 15 and the terminal electrode 6. Therefore, there is a possibility that a stray capacitance larger than the stray capacitance generated between the other internal conductor layers 15 and the terminal electrode 6 is generated between the internal conductor layer 15a and the terminal electrode 6.

[0072] In the multilayer coil components 1, 1A, 1B, and 1C, the internal conductor layer 15a and the via 17a connected to the internal conductor layer 15a do not overlap the terminal electrode 6 when viewed from the direction D3. In this case, the distance between the internal conductor layer 15a and the via 17a and the terminal electrode 6 is larger than that in the case where the internal conductor layer 15c and the via 17a overlap the terminal electrode 6. As a result, the generation of stray capacitance is suppressed between the internal conductor layer 15a and the via 17a and the terminal electrode 6. If the generation of stray capacitance is suppressed, for example, the decrease in SRF is suppressed. The internal conductor layer 15c electrically connected to the internal conductor layer 15a overlaps the terminal electrode 6 when viewed from the direction D3. Therefore, with a compact configuration, the inner diameter of the coil 10 can be ensured. As shown in FIG. 3, since the internal conductor layer 15c is located inside the internal conductor layer 15a in the direction D3, the distance between the internal conductor layer 15c and the terminal electrode 6 can be appropriately ensured even when they overlap the terminal electrode 6 when viewed from the direction D3. Since the internal conductor layer 15c is arranged to overlap the terminal electrode 6, the inner diameter of the coil is ensured and the inductance can be ensured. The generation of stray capacitance is suppressed. Therefore, according to the multilayer coil components 1, 1A, 1B, and 1C, a desired inductance can be ensured with a compact configuration and the stray capacitance can be reduced.

[0073] In the multilayer coil components 1, 1A, 1B, and 1C, the base body 2 includes regions α1, β1 and regions α2, β2 arranged in the direction D1. When viewed from the stacking direction, the internal conductor layer 15c overlaps the regions α1, β1, and the internal conductor layer 15a and the via 17a do not overlap the regions α1, β1. In this case, the internal conductor layer 15a and the via 17a and the terminal electrode 6 are separated from the internal conductor layer 15c by the amount of the regions α1, β1 when viewed from the direction D3. For this reason, the generation of stray capacitance is suppressed between the internal conductor layer 15a and the via 17a and the terminal electrode 6. Since the internal conductor layer 15c is located in the regions α1, β1, the inner diameter of the coil 10 can be ensured. Therefore, according to the multilayer coil components 1, 1A, 1B, and 1C, a desired inductance can be ensured with a compact configuration and the generation of stray capacitance can be suppressed.

[0074] In the multilayer coil components 1, 1A, 1B, and 1C, the internal conductor layer 15c connected to the internal conductor layer 15a by the via 17a overlaps the terminal electrode 6 when viewed from the direction D3. In this case, the inner diameter of the coil 10 can be secured also in the portion of the coil 10 on the internal conductor layer 15a side. Therefore, the multilayer coil components 1, 1A, 1B, and 1C having desired parameters can be easily designed.

[0075] In the multilayer coil components 1, 1A, 1B, and 1C, the internal conductor layer 15a includes a linear portion 30 extending in the direction D1. The linear portion 30 includes an end portion 31 connected to the via 17a. The end portion 31 is the closest to the terminal electrode 6 among the internal conductor layers 15a when viewed from the direction D3. In this case, the inner diameter of the coil 10 can be secured also in the portion of the coil 10 on the internal conductor layer 15a side. Therefore, the multilayer coil components 1, 1A, 1B, and 1C having desired parameters can be easily designed.

[0076] In the multilayer coil component 1C, the internal conductor layer 15c overlaps the terminal electrode 5 when viewed from the direction D3. The internal conductor layer 15b and the via 17e connected to the internal conductor layer 15b do not overlap the terminal electrode 5 when viewed from the direction D3. In this case, the generation of stray capacitance is suppressed also between the internal conductor layer 15b and the above-described via 17e and the terminal electrode 5.

[0077] The multilayer coil components 1, 1A, 1B, and 1C include bottom electrode layers 25a and 25b. The bottom electrode layer 25a is disposed on the surface of the base body 2 and is connected to the terminal electrode 5. The internal conductor layer 15c overlaps the bottom electrode layer 25a when viewed from the direction D3. The internal conductor layer 15b and the via 17 connected to the internal conductor layer 15b do not overlap the bottom electrode layer 25a when viewed from the direction D3. In this case, the generation of stray capacitance is suppressed also between the coil 10 and the bottom electrode layer 25.

[0078] In the multilayer coil component 1A, a plurality of internal conductor layers 15c overlap the terminal electrode 6 when viewed from the direction D3. In the direction D3, the length of the portion occupied by the via 17 between the internal conductor layer 15c closest to the internal conductor layer 15a and the internal conductor layer 15a among these internal conductor layers 15c is greater than the length of the via 17 connected to each internal conductor layer 15c between the adjacent internal conductor layers 15c. In this case, the internal conductor layer 15c closest to the internal conductor layer 15a and the terminal electrode 6 are separated by the length occupied by the via 17. Therefore, the generation of stray capacitance between the coil 10 and the terminal electrode 6 is further suppressed.

[0079] As described above, the embodiments and modified examples of the present invention have been described. However, the present invention is not necessarily limited to the above-described embodiments and modified examples, and various changes are possible without departing from the gist thereof.

[0080] For example, in the multilayer coil components 1, 1A, 1B, and 1C, the terminal electrode 5 is provided on a pair of main surfaces 2a and 2b, an end surface 2c, and a pair of side surfaces 2e of the base body 2. The terminal electrode 6 is provided on a pair of main surfaces 2a and 2b, an end surface 2d, and a pair of side surfaces 2e of the base body 2. However, the positions where the terminal electrodes 5 and 6 are provided are not limited thereto. For example, the terminal electrodes 5 and 6 may be provided on only one of the main surfaces 2a and 2b.

[0081] In the multilayer coil component 1, the bottom electrode layer 25 is provided on the main surface 2b. Therefore, the multilayer coil component 1 is configured such that the main surface 2b serves as the mounting surface. However, the multilayer coil component 1 may be configured such that the main surface 2a serves as the mounting surface.

[0082] For example, in the multilayer coil component 1, the bottom electrode layer 25 is provided on the main surface 2b that is closer to the inner conductor layer 15b than the inner conductor layer 15a in the direction D3. However, the bottom electrode layer 25a may be provided on the main surface 2a that is closer to the inner conductor layer 15b than the inner conductor layer 15b in the direction D3. In this case, the inner conductor layer 15a and the via 17a are arranged so as not to overlap with the bottom electrode layer 25b when viewed from the direction D3. The multilayer coil components 1, 1A, 1B, and 1C may not include the bottom electrode layer 25.

[0083] The configuration of the via 17a in the multilayer coil component 1A may be applied to the vias 17a and 17e in the multilayer coil component 1C. For example, in the multilayer coil component 1C, the lengths of the vias 17a and 17e in the direction D3 may be greater than the lengths of the vias 17b, 17c, and 17d in the direction D3. In this case, the distance between the inner conductor layer 15a and the inner conductor layer 15c adjacent to each other in the direction D3 is greater than the distance between two adjacent inner conductor layers 15c in the direction D3. In this case, for example, the thickness of the base layer 22 in the pattern layer La is formed to be greater than the thickness of the base layer 22 in other pattern layers. Further, the distance between the inner conductor layer 15b and the inner conductor layer 15c adjacent to each other in the direction D3 is greater than the distance between two adjacent inner conductor layers 15c in the direction D3. In this case, for example, the thickness of the base layer 22 in the pattern layer Lb shown in FIG. 10(c) is formed to be greater than the thickness of the base layer 22 in other pattern layers.

[0084] The configuration in the multilayer coil component 1B may be applied to the configuration in the multilayer coil component 1C. The multilayer coil component 1C may further include an inner conductor layer 15d having the same shape as each of the inner conductor layers 15a and 15b. In this case, the plurality of vias 17 include a plurality of vias 17a and a plurality of vias 17e.

[0085] For example, at least one pattern layer La may be further provided between the adjacent pattern layers La and Lb. At least one pattern layer Lh may be further provided between the adjacent pattern layers Lb and Lh. Also in this case, it is configured such that the distance between the internal conductor layer 15a and the internal conductor layer 15c closest to the internal conductor layer 15a in the direction D3 is larger than the distance between two adjacent internal conductor layers 15c in the direction D3. It is configured such that the distance between the internal conductor layer 15b and the internal conductor layer 15c closest to the internal conductor layer 15b in the direction D3 is larger than the distance between two adjacent internal conductor layers 15c in the direction D3.

Explanation of Signs

[0086] 1, 1A, 1B, 1C... laminated coil component, 2... body, 5, 6... terminal electrode, 10... coil, 15, 15a, 15b, 15c... internal conductor layer, 17, 17a, 17b, 17c, 17d, 17e... via, 30... linear portion, 31... end portion, D1, D2, D3... directions.

Claims

1. A base body, a coil including a plurality of internal conductor layers disposed inside the base body and stacked, and a plurality of vias connected to the internal conductor layers adjacent to each other in a first direction in which the plurality of internal conductor layers are stacked, first and second terminal electrodes spaced apart from each other and disposed on the surface of the base body and electrically connected to each other via the coil, the first terminal electrode and the second terminal electrode are arranged side by side in a second direction intersecting the first direction when viewed from the first direction, the plurality of internal conductor layers include first and second internal conductor layers located outermost in the first direction among the plurality of internal conductor layers, and at least one third internal conductor layer sandwiched between the first and second internal conductor layers, the at least one third internal conductor layer is electrically connected to the first terminal electrode via the first internal conductor layer and electrically connected to the second terminal electrode via the second internal conductor layer, the at least one third internal conductor layer overlaps the second terminal electrode when viewed from the first direction, the first internal conductor layer has a linear shape extending in the second direction, the first internal conductor layer and the vias connected to the first internal conductor layer do not overlap the second terminal electrode when viewed from the first direction, the at least one third internal conductor layer includes an internal conductor layer connected to the first internal conductor layer by the via and overlapping the second terminal electrode when viewed from the first direction, a stacked coil component.

2. the first internal conductor layer includes an end portion connected to the via, the end portion is the closest to the second terminal electrode among the first internal conductor layers when viewed from the first direction, the stacked coil component according to Claim 1.

3. the at least one third internal conductor layer overlaps the first terminal electrode when viewed from the first direction, the second internal conductor layer and the vias connected to the second internal conductor layer do not overlap the first terminal electrode when viewed from the first direction, the stacked coil component according to Claim 1 or 2.

4. further comprising a bottom electrode layer disposed on the surface of the base body and connected to the second terminal electrode, the at least one third internal conductor layer overlaps the bottom electrode layer when viewed from the first direction, The first internal conductor layer and the via connected to the first internal conductor layer do not overlap the bottom electrode layer when viewed from the first direction. The laminated coil component according to any one of claims 1 to 3.

5. The at least one third internal conductor layer includes a plurality of third internal conductor layers that overlap the second terminal electrode when viewed from the first direction. In the first direction, the length of the portion occupied by the via between the third internal conductor layer closest to the first internal conductor layer and the first internal conductor layer among the plurality of third internal conductor layers is greater than the length of the via connected to each of the third internal conductor layers between the third internal conductor layers adjacent to each other. The laminated coil component according to any one of claims 1 to 4.

6. A body; A coil including a plurality of internally disposed and laminated internal conductor layers, and a plurality of vias connected to the internal conductor layers adjacent to each other in the first direction in which the plurality of internal conductor layers are laminated. First and second terminal electrodes that are spaced apart from each other and disposed on the surface of the body, and are electrically connected to each other via the coil. The first terminal electrode and the second terminal electrode are arranged side by side in a second direction intersecting the first direction when viewed from the first direction. The plurality of internal conductor layers include first and second internal conductor layers that are located outermost in the first direction among the plurality of internal conductor layers, and at least one third internal conductor layer sandwiched between the first and second internal conductor layers. The at least one third internal conductor layer is electrically connected to the first terminal electrode via the first internal conductor layer and is electrically connected to the second terminal electrode via the second internal conductor layer. The first terminal electrode and the second terminal electrode face each other in a direction intersecting the first direction. The first internal conductor layer has a linear shape extending in the second direction. When viewed from the first direction, the body includes a first region and a second region arranged in the facing direction of the first terminal electrode and the second terminal electrode. When viewed from the first direction, The third internal conductor layer overlaps the first and second regions. The first internal conductor layer and the via connected to the first internal conductor layer do not overlap the first region and overlap the second region. The laminated coil component, wherein the third internal conductor layer is connected to the first internal conductor layer by the via and overlaps the first region when viewed from the first direction, and includes an internal conductor layer.

Images