Indicating devices, modules, and equipment

Abstract

To provide a technology which is advantageous in suppressing a decline in the reliability or display quality of a display apparatus.SOLUTION: A display apparatus pertaining to one embodiment of the present invention comprises a display device having a display region and a peripheral region located in the periphery of the display region, and a translucent plate that overlaps the display device. A gap is provided between the display region and the translucent plate, and a joint member for joining the display device and the translucent plate together is provided between the peripheral region and the translucent plate, the gap communicating with a space that exists in the joint member on the side opposite the gap.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a display device.

Background Art

[0002] In a display device, a light-transmitting plate facing a display device is provided. Patent Document 1 discloses a display device in which a semiconductor device having a color filter layer and a light-transmitting plate are bonded together with a bonding member, and a gap is provided between the color filter layer and the light-transmitting plate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a gap is provided in a display device, the reliability and display quality of the display device are more likely to deteriorate than when no gap is provided. Accordingly, an object of the present invention is to provide a technique advantageous in suppressing deterioration of the reliability and display quality of a display device.

Means for Solving the Problems

[0005] A display device according to an embodiment of the present invention includes a display device having a display area and a peripheral area located around the display area, a light-transmitting plate overlapping the display device in a plan view, and a lens disposed above the display area. A gap is provided between the display area and the light-transmitting plate, and the display device has foreign matter disposed in the gap, wherein when the size of the foreign matter is Q, the height of the lens is H, and the distance from the apex of the lens to the light-transmitting plate is G, The thickness of the light-transmitting plate is R the display device is characterized by satisfying Expression (1). Q≦H<G <R (1)

Advantages of the Invention

[0006] According to the present invention, it is possible to provide an advantageous technique for suppressing a decrease in the reliability and display quality of a display device.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the following description and drawings, common configurations across a plurality of drawings are denoted by common reference numerals. Therefore, the common configurations will be described by referring to the plurality of drawings mutually, and the description of the configurations denoted by the common reference numerals will be omitted as appropriate.

[0009] FIG. 1(a) is a cross-sectional view of a display module 900 including a display device 800. FIG. 1(b) is a plan view of the display device 800, and FIG. 1(c) is a cross-sectional view of the display device 800. Hereinafter, an exemplary configuration of the display device 800 will be described, but the present invention does not necessarily include all features of the configuration of the exemplary display device 800. The display device 800 includes a display device 100 having a display area 500 (see FIGS. 1(b) and 1(c)), and a light-transmitting plate 300 overlapping the display device 100. The light-transmitting plate 300 is disposed to face the display area 500 with a gap 180 therebetween. That is, a gap 180 is provided between the display area 500 and the light-transmitting plate 300. The display device 800 includes a joining member 200 that joins the light-transmitting plate 300 and the display device 100. A plurality of pixels 140 are arranged in the display area 500. The pixel 140 includes display elements such as a light-emitting element, a reflecting element, and a shutter element. The display device 100 includes a substrate 105. The substrate 105 may be any of a conductor substrate, an insulator substrate, or a semiconductor substrate, but in this example, it is a single-crystalline semiconductor substrate made of silicon. At least a part of the semiconductor elements attached to the pixel 140 is provided in or on the substrate 105. The display device 100 has a peripheral area 600 located around the display area 500. The light-transmitting plate 300 is disposed to face the display area 500 and the peripheral area 600. The joining member 200 is disposed between the light-transmitting plate 300 and the peripheral area 600 of the display device 100, and the joining member 200 is in contact with the light-transmitting plate 300 and the display device 100.

[0010] As shown in FIGS. 1(a) and 1(c), in the display device 800, a gap 180 is provided between the pixel 140 and the light-transmitting plate 300. The light-transmitting plate 300 has a main surface 310, a main surface 320 which is the opposite surface of the main surface 310, and side surfaces 330. The main surface 310 of the light-transmitting plate 300 is the surface located closer to the display device 100 than the main surface 320. And the main surface 310 of the two main surfaces 310 and 320 of the light-transmitting plate 300 is the surface in contact with the gap 180. The display device 100 has a front surface 101, a back surface 102 which is the opposite surface of the front surface 101, and end surfaces 103. The front surface 101 of the display device 100 is located closer to the light-transmitting plate 300 than the back surface 102. And the front surface 101 of the front surface 101 and the back surface 102 of the display device 100 is the surface in contact with the gap 180. The gap 180 is a vacuum space or a space in which gas exists. If the space between the display area 500 and the light-transmitting plate 300 is filled with a light-transmitting member without providing the gap 180, light is absorbed by the light-transmitting member, the utilization efficiency of light decreases, and the display quality such as brightness decreases. By providing the gap 180, it is possible to suppress the loss (absorption) of light between the front surface 101 of the display device 100 and the main surface 310 of the light-transmitting plate 300, which is advantageous for improving the utilization efficiency of light. The gas present in the gap 180 is typically air, and the gap 180 can also be referred to as an air gap. The gas present in the gap 180 may be not only air but also an inert gas such as nitrogen or argon, or an active gas. The light-transmitting plate 300 is disposed to face the display area 500 and the peripheral area 600. The joining member 200 is disposed between the main surface 310 of the light-transmitting plate 300 and the front surface 101 of the display device 100, and the joining member 200 is in contact with the main surface 310 of the light-transmitting plate 300 and the front surface 101 of the display device 100. At least a part of the display element included in the pixel 140 provided in the display area 500 is disposed between the light-transmitting plate 300 and the substrate 105.

[0011] Here, as a dimension corresponding to the thickness of the gap 180, a distance G from the surface 101 in contact with the gap 180 of the display device 100 to the main surface 310 in contact with the gap 180 of the light-transmitting plate 300 is defined. Details of the distance G will be described later. In this example, the light-transmitting plate 300 is supported by the display device 100 via the joining member 200. However, the light-transmitting plate 300 may be supported by another supporting member that does not contact the display device 100 without providing the joining member 200 between the light-transmitting plate 300 and the display device 100. For example, the display device 100 may be fixed to the bottom surface of the recess of a supporting member having a recess surrounded by a frame portion, and the light-transmitting plate 300 may be fixed to the frame portion. In that case, a gap 180 can be formed between the light-transmitting plate 300 and the display device 100 by the frame portion.

[0012] The display device 100 has external connection terminals 190. The external connection terminals 190 are arranged at positions that do not overlap the light-transmitting plate 300 in the direction in which the display device 100 and the light-transmitting plate 300 overlap. As shown in FIG. 1(b), the area of the light-transmitting plate 300 is smaller than that of the display device 100 in plan view. Therefore, although most of the display area 500 of the display device 100 overlaps the light-transmitting plate 300, a remaining part of the display device 100 does not overlap the light-transmitting plate 300. The external connection terminals 190 are provided at the part of the display device 100 that does not overlap the light-transmitting plate 300. If a through electrode is provided on the substrate 105, it is also possible to provide the external connection terminals 190 at positions that overlap the light-transmitting plate 300.

[0013] The display module 900 includes a wiring member 400 such as a flexible wiring board connected to an external connection terminal 190 of the display device 100 of the display apparatus 800. Since the external connection terminal 190 is provided at a portion of the display device 100 that does not overlap with the light-transmitting plate 300, the light-transmitting plate 300 does not interfere with the wiring member 400. The electrical connection portion between the external connection terminal 190 and the wiring member 400 such as a flexible wiring board is constituted by a conductive member 410 such as solder or an ACF (anisotropic conductive film). The display module 900 may further include a light-shielding member 450 fixed to the display apparatus 800 and a light-transmitting member 470 fixed to the light-shielding member 450 and covering the light-transmitting plate 300. A space 460 surrounded by the light-shielding member 450 is located between the light-transmitting member 470 and the light-transmitting plate 300. Since the light-shielding member 450 surrounds the space 460, the light-shielding member 450 can also be referred to as a frame member or an outer surrounding member. The light-transmitting member 470 serves as a cover that closes the space 460. The light-transmitting member 470 may be an optical member such as a lens or a prism. The user can observe an image displayed in the display area 500 of the display device 100 through the light-transmitting member 470 and the light-transmitting plate 300.

[0014] FIG. 1(b) shows a plan view of the display device 800 when viewed in a plan view with respect to the front surface 101 or the back surface 102 which is the main surface of the display device 100. The arrangement in the plan view is the arrangement when the display device 800 is viewed from a direction perpendicular to the front surface 101 or the back surface 102 which is the main surface of the display device 100 (the normal direction of the main surface), and for overlapping members, it is assumed that they can be seen through. In the plan view with respect to the front surface 101 or the back surface 102 which is the main surface of the display device 100, the light-transmitting plate 300 overlaps the display area 500 of the display device 100. The direction in which the light-transmitting plate 300 faces the display device 100 and the pixel 140 (the facing direction) is a direction perpendicular to the front surface 101 or the back surface 102 which is the main surface of the display device 100 (the normal direction of the main surface). The display device 100 has a display area 500 provided with effective pixels and a peripheral area 600 located around the display area 500. The display area 500 can also be referred to as an effective pixel area. The display area 500 is quadrilateral, and the length of each side of the display area 500 is, for example, 1 to 100 mm, for example, 5 to 50 mm, and the diagonal length is, for example, 1 to 100 mm, for example, 5 to 50 mm. The aspect ratio of the display area 500 is, for example, 16:V (V = 8 to 13, typically V = 9 or 12). It is preferable that the diagonal length of the display area 500 is 24 mm or more. The average value of the size of an adult's eyeball is 24 mm, and a head-mounted display having a display area 500 with a diagonal length of 24 mm or more can provide an excellent video experience to the user. The peripheral area 600 may include a peripheral circuit area in which peripheral circuits are arranged. The peripheral circuits in the display device include a drive circuit for driving effective pixels and a processing circuit such as a DAC (digital-to-analog conversion circuit) that processes signals input to the effective pixels. The peripheral area 600 is located between the peripheral circuit area and the display area 500 and may include a non-effective pixel area provided with non-effective pixels. Non-effective pixels are dummy pixels, reference pixels, test pixels, monitor pixels, etc. that do not function as effective pixels.

[0015] FIG. 1(c) is a cross-sectional view of the display device 800. The display device 800 has a wiring member 400 such as a flexible printed circuit board (FPC) connected to an external connection terminal 190 formed on the display device 100 via a conductive member 410 such as solder or an anisotropic conductive film (ACF). The display device 100 includes a substrate 105, a semiconductor element 110, an insulating member 120, a wiring structure 130, a pixel 140, and an external connection terminal 190 (also referred to as a pad). A light-transmitting plate 300 is joined to the display device 100 via a joining member 200, and a gap 180 having a predetermined distance G is provided between the pixel 140 and the light-transmitting plate 300. The substrate 105 is made of a semiconductor such as single-crystalline silicon. The semiconductor element 110 is a transistor or a diode, and at least a part of it is provided in the substrate 105. The wiring structure 130 includes a multilayer wiring layer such as an aluminum layer or a copper layer, and via plugs and contact plugs. The external connection terminal 190 can be constituted by a wiring layer included in the wiring structure 130.

[0016] The insulating member 120 includes a plurality of interlayer insulating layers and is made of a silicon oxide layer, a silicon nitride layer, a silicon carbide layer, etc. Note that silicon oxynitride and silicon carbonitride are regarded as a kind of silicon nitride because nitrogen and silicon are the main elements. A pixel 140 is provided in the display area 500 of the display device 100. The display element included in the pixel 140 is an EL element in an ELD (electroluminescence display), a liquid crystal element (shutter element) in an LCD (liquid crystal display), or a reflection element in a DMD (digital mirror device).

[0017] The display elements of each pixel 140 are each connected to the wiring structure 130 via vias (not shown) provided in the insulating member 120, and are electrically connected to the semiconductor element 110 via the wiring structure 130. Generally, pixels 140 (picture elements) of each color of red (R), green (G), and blue (B) are set as a set to represent the color of the display unit 145 in full color. The pixels 140 of each color included in the display unit 145 can also be referred to as sub-pixels. Each pixel 140 is composed of at least a display element, and a wiring structure 130 and a semiconductor element 110 for driving the display element are attached to the pixel 140. Further, each pixel 140 may include optical elements such as a microlens and a color filter corresponding to the display element. The size of each pixel 140 is called the pixel size, and in this embodiment, the pixel size is defined as X.

[0018] An enlarged view of the outer peripheral portion of the display area 500 surrounded by the broken line A in FIG. 1(c) and the peripheral area 600 is shown in FIG. 2(a). FIG. 2(b) shows an enlarged view of a portion including the display area 500 and the gap 180.

[0019] On the main surface of the substrate 105, a semiconductor element 110, an insulating member 120, a wiring structure 130, and pixels 140 are provided, and a protective film 150 is provided on the display elements of the pixels 140. The display elements of the pixels 140 are provided for each pixel 140 and are, for example, white EL elements. The pixel 140 includes a white EL element as a display element and a color filter of a primary color associated with the white EL element. By the white light emitted from the white EL element passing through the color filter of the primary color, the pixel 140 exhibits the primary color. If the display element included in the pixel 140 is a primary color EL element, the color filter of the pixel 140 can be omitted, but a color filter may be provided to improve color purity.

[0020] Define the size of pixel 140 as X. The size of pixel 140 is 1 to 100 μm, for example 1 to 50 μm, for example 2 to 20 μm, for example 3 to 10 μm, for example 5 to 10 μm, for example 6 to 8 μm. The protective film 150 is provided to suppress the intrusion of moisture, oxygen, etc. into pixel 140, and is composed of an inorganic material layer such as silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide. The inorganic material layer used for the protective film 150 is particularly advantageous in suppressing the intrusion of moisture into the organic material layer existing between the protective film 150 and the substrate 105. The organic material layer existing between the protective film 150 and the substrate 105 is included in, for example, a display element, and is, for example, an organic light-emitting layer. The thickness of the protective film 150 is, for example, 1 to 5 μm, for example 2 to 4 μm, for example 3 μm. In FIG. 2, the protective film 150 is described as a single layer, but it may also have a multilayer structure of a plurality of inorganic material layers. For example, it may have a structure in which two silicon nitride layers are laminated, and further may have a structure in which an aluminum oxide layer is provided between the two silicon nitride layers. In this case, the aluminum oxide layer may be thinner than the two silicon nitride layers. A color filter array 152 is provided on the protective film 150, and resin layers 151 and 153 are appropriately provided above and below the color filter array 152. The resin layer 151 is formed to flatten the surface unevenness of the protective film 150, and a transparent resin such as an acrylic resin or an epoxy resin can be used. The thickness of the resin layer 151 is, for example, 100 to 1000 nm, for example 500 nm. At least one resin layer is provided on the protective film 150. The resin layers on the protective film 150 are the resin layer 151, the color filter array 152, the resin layer 153, and the lens array 170. The resin layer 153 on the protective film 150 is provided between the color filter array 152 and the gap 180. The resin layer 151 on the protective film 150 is provided between the color filter array 152 and the inorganic material layer included in the protective film 150.

[0021] The details of the color filter array 152 will be described. The color filter array 152 in the display area 500 is configured by arranging color filters of a plurality of primary colors in an array. The primary colors of the color filter array 152 are red (R), green (G), and blue (B), but may also be cyan (C), magenta (M), yellow (Y), etc. The arrangement of the color filters of each color is a stripe arrangement, a delta arrangement, a Bayer arrangement, etc. Also, above the peripheral area 600, the color filter array 152 has a multi-color portion, which is a portion where color filters of a plurality of colors are arranged in an array. The multi-color portion may be arranged in an array in the same arrangement as the color filter in the display area 500, or may be arranged by changing the pixel sizes of a plurality of colors. Further, the color filter array 152 in the peripheral area 600 may have a single-color portion, which is a portion where a single-color filter extends. Here, the width of the single-color filter in the single-color portion is larger than the width of the single-color filter in the display area 500 (i.e., the width of one pixel). Also, it is larger than the width of the single-color filter in the multi-color portion. The width of the single-color portion is, for example, 10 μm or more, for example, 100 μm or more, and for example, 1000 μm or less. A multi-color portion may be provided outside the display area 500, and a single-color portion may be further provided outside the multi-color portion. The distinction between the multi-color portion and the single-color portion can also be arranged regardless of the configuration of the circuit in the peripheral area 600. As the color of the single-color portion, it is preferable to use one that is more likely to absorb light with a longer wavelength among visible light among the plurality of color filters included in the color filter array 152. Among red (R), green (G), blue (B), cyan, magenta, and yellow, it is preferable to use a blue filter for the single-color portion. This is because the blue filter is likely to absorb green light and red light. The thickness of the color filter array 152 is, for example, 0.5 to 5 μm, for example, 1 to 3 μm, and for example, 1.5 to 2.5 μm.

[0022] The resin layer 153 can stabilize the shape of the lens array 170 to be formed later by planarizing the surface of the color filter array 152. The thickness of the resin layer 153 is 100 to 1000 nm, for example, 500 nm. A lens array 170 may be provided on the resin layer 153. The lens array 170 is provided at least in the display area 500, but may also be provided in the peripheral area 600. The lens array 170 is provided to condense the light emitted from the display elements of the pixels 140 and improve the extraction efficiency, and resins such as transparent acrylic resin and styrene resin can be used. The lens array 170 may be an inorganic material such as silicon oxide or silicon nitride as long as it is transparent. A typical lens array 170 is typically a fly array in which microlenses having a spherical surface, a substantially spherical surface or an aspherical surface are arranged in a two-dimensional manner in the vertical and horizontal directions, but may be an array of cylindrical lenses in a one-dimensional manner in the vertical or horizontal direction. In the fly array, the number of discrete vertices of each microlens may match the number of pixels 140 or the number of display units 145. In this example, one microlens of the lens array 170 corresponds to one pixel 140. However, one microlens of the lens array 170 may correspond to one display unit. For example, one microlens of the lens array 170 may correspond to a plurality of (for example) three pixels 140R, 140G, 140B included in one display unit 145. The number C of vertices of the microlenses of the lens array 170 in the display area 500 is equal to or greater than the number N of display units 145 provided in the display area 500 (C≧N). Typically, assuming the number of pixels 140 included in the display unit 145 is S, C = N×S. If S≧2, then C≧2*N. If S = 3 as in this example, then C = 3×N. When the display area 500 composed of three-color sub-pixels has a resolution of the full HD standard (1920×1080), N = 2073600 and C = 6220800. Of course, a display area 500 with a resolution higher than the full HD standard may be adopted. In that case, the lens array 170 has a number of vertices exceeding 6220800.

[0023] The height of the lens array 170 is, for example, 0.5 to 5 μm, for example, 1 to 3 μm, for example, 1.5 to 2.5 μm. The refractive index of the transparent material constituting the lens array 170 is, for example, about 1.4 to 2.0, and the refractive index of the air gap 180 is 1.0. Therefore, the refractive index difference between the air gap 180 and the lens array 170 can increase the power of the lenses in the lens array 170 compared to the case where the space between the display region 500 and the light-transmitting plate 300 is filled with a solid light-transmitting member having a refractive index of about 1.1 to 1.5. As a result, the light utilization efficiency is improved, and the display quality can be improved. As described above, the display device 100 is configured, and a bonding member 200 is provided in the peripheral region 600 of the display device 100, and the light-transmitting plate 300 is bonded thereto. A typical bonding member 200 mainly has a resin portion made of resin, but the bonding member 200 may be composed of an inorganic material such as glass frit or metal solder. It is desirable that spacers 210 are provided in the resin portion of the bonding member 200. The thickness (distance G) of the air gap 180 between the lens array 170 and the light-transmitting plate 300 constituting the surface 101 of the display device 100 can be controlled according to the thickness T of the bonding member 200. Furthermore, since the bonding member 200 contains the spacers 210, the thickness of the air gap 180 can be determined according to the size of the spacers 210 included in the bonding member 200. As described above, the thickness of the air gap 180 is defined as the distance G. Resin beads, silica beads, etc. can be used for the spacers 210. The spacers 210 are preferably spherical from the viewpoint that their dimensions can be defined regardless of their orientation. The diameter of the spherical spacers 210 is, for example, 10 to 50 μm, for example, 20 to 40 μm, for example, 30 μm. The distance G can be determined by the thickness of the layer (color filter array 152 or lens array 170) between the layer (inorganic material layer or resin layers 151, 153 of the protective film 150) with which the spacers 210 are in contact and the light-transmitting plate 300. If the total thickness of the layer between the layer with which the spacers 210 are in contact and the light-transmitting plate 300 is 5 μm or less, when using spacers 210 with a diameter of 30 μm, the distance G can be, for example, 25 to 30 μm.

[0024] The light-transmitting plate 300 can be made of any light-transmitting material such as glass or acrylic, but it is preferable to use non-alkali glass. The thickness R of the light-transmitting plate 300 is not particularly limited, but for example, 0.1 to 1 mm, for example, 0.3 to 0.7 mm, for example, 0.5 mm is preferable. The thickness S of the substrate 105 is not particularly limited, but for example, 0.3 to 0.8 mm is preferable. It is preferable that the thickness S of the substrate 105 is thicker than the thickness R of the light-transmitting plate 300 (S > R). This is because damage to the display device 100 can be suppressed by making the substrate 105 thicker. If the thickness S of the substrate 105 is less than 300 μm, the substrate 105 may bend toward the gap 180. At the corner adjacent to the main surface 310 and the side surface 330 of the light-transmitting plate 300 facing the display device 100, an inclined surface 340 may be provided from the side surface 330 to the main surface 310 of the light-transmitting plate 300. The inclined surface 340 is inclined with respect to the side surface 330 and the main surface 310. The inclined surface 340 can be formed by chamfering the substrate that becomes the light-transmitting plate 300. By providing this inclined surface 340, when the light-transmitting plate 300 is bonded to the display device 100, it is possible to suppress damage to the display device 100 caused by the corner of the light-transmitting plate contacting the display device 100. In this regard, the width of the inclined surface 340 in the direction parallel to the main surface 310 of the light-transmitting plate 300 may be larger than the width (depth) in the normal direction to the main surface 310 of the light-transmitting plate 300. In other words, the angle (obtuse angle) formed by the inclined surface 340 and the main surface 310 may be larger than the angle (obtuse angle) formed by the inclined surface 340 and the side surface 330. The width of the inclined surface 340 in the direction parallel to the main surface 310 of the light-transmitting plate 300 is, for example, 50 to 250 μm, for example, 200 μm, and the width (depth) of the inclined surface 340 in the normal direction to the main surface 310 of the light-transmitting plate 300 is, for example, 50 to 250 μm, for example, 150 μm. Further, at least one of the two main surfaces 310 and 320 of the light-transmitting plate 300 is preferably composed of an anti-reflection film (Anti-Refrection film, abbreviated as AR film) formed on the substrate of the light-transmitting plate 300. By forming the AR film, it is possible to suppress ghosting (a phenomenon in which multiple contours are visible in an image) caused by the display light being reflected at the interface of the light-transmitting plate 300 and then re-reflected by the display device 100.Note that the main surface 310 of the light-transmitting plate 300 is defined as the surface that contacts the gap 180. If the substrate of the light-transmitting plate 300 contacts the gap 180, the surface of the substrate constitutes the main surface 310. If a functional film such as an antireflection film formed on the substrate of the light-transmitting plate 300 contacts the gap 180, the functional film constitutes the main surface 310 of the light-transmitting plate 300. Examples of functional films other than the antireflection film include an antistatic film, an antifogging film, and a moisture-absorbing film.

[0025] An organic EL display device as an example of an embodiment will be described with reference to FIG. 2. As shown in FIG. 2, the organic EL display device according to this embodiment includes a substrate 105. The substrate 105 can be a single-crystalline semiconductor substrate such as silicon, for example. On the main surface 1, which is the surface of the substrate 105, semiconductor elements 110 such as transistors are provided. Alternatively, the substrate 105 may be an insulator substrate such as glass or resin, and a TFT (thin film transistor) as the semiconductor element 110 may be arranged on the insulator substrate. An insulating member 120 is provided on the semiconductor element 110 and the main surface of the substrate 105. Silicon oxide, silicon nitride, etc. are used for the insulating member 120. A contact plug (not shown) electrically connected to the semiconductor element 110 is arranged in the insulating member 120. A conductive member such as tungsten is embedded in the contact plug. Inside the insulating member 120, a wiring structure 130 electrically connected to the semiconductor element 110 via the contact plug is provided. The wiring structure 130 uses a metal member such as aluminum or copper, and a barrier metal such as Ti, Ta, TiN, or TaN may be provided at the interface between the insulating layer and the wiring structure 130 to suppress metal diffusion into the insulating layer. In the peripheral region 600 of the substrate 105, an external connection terminal 190 and a ground wiring 130E are provided in the same layer as the wiring structure 130. As shown in FIG. 1(c), an opening is provided in the insulating member 120 on the external connection terminal 190 so that the external connection terminal 190 is exposed from the opening of the insulating member 120. Similarly, an opening is provided in the insulating member 120 on the ground wiring 130E so that the ground wiring 130E is exposed from the opening of the insulating member 120 and is grounded to the counter electrode of the display element in a later process.

[0026] An organic EL element as a display element 14 included in the pixel 140 is provided on the insulating member 120 in the display area 500. The display element 14 may include a pixel electrode 141 electrically connected to the wiring structure 130 via a via plug, a counter electrode 142, and an organic material layer 143 provided between the pixel electrode 141 and the counter electrode 142. The pixel electrodes 141 are separated and arranged for each pixel by a pixel separation portion (not shown) such as a bank, and function as one of the anode (anode) and the cathode (cathode) in the organic EL element (display element 14) (the anode in this example). The counter electrode 142 functions as the other of the anode (anode) and the cathode (cathode) in the organic EL element (the cathode in this example). It is preferable to adopt a structure in which the end portions of the pixel electrodes 141 are covered by a pixel separation portion (bank) formed of an insulating layer in order to suppress a short circuit between the pixel electrodes 141. It is preferable to form a hole injection layer and a hole transport layer between the organic light emitting layer and the pixel electrode 141 in order to facilitate injection and transport of holes from the pixel electrode 141. Further, it is preferable to form an electron transport layer and an electron injection layer between the organic light emitting layer and the counter electrode 142 in order to facilitate injection and transport of electrons from the counter electrode 142. Here, a stacked structure of pixel electrode 141 / hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / electron injection layer / counter electrode 142 is adopted. Each of the hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / electron injection layer is an organic material layer, and the organic material constituting these organic material layers is typically a low molecular organic material, but may be a high molecular organic material. Note that a typical resin is a high molecular organic material. Note that a silicone resin has an inorganic main skeleton and organic groups in the side chains, and is a hybrid material having both inorganic and organic properties, and can be classified as either an organic material or an inorganic material. The counter electrode 142 is an electrode common to all pixels, extends to the peripheral area 600, and is connected to the above-described ground wiring 130E. The counter electrode 142 is a conductor film provided from the display area 500 to the peripheral area 600. The counter electrode 142 may be a conductor film made of, for example, a metal material such as silver (Ag), an alloy material such as an alloy of silver (Ag) and magnesium (Mg) (AgMg), or a transparent conductive material such as ITO.Each of the ground wiring 130E of the wiring structure 130 and the counter electrode 142 includes a contact portion 700 called a cathode contact for connecting to each other. The organic material layer 143 and the counter electrode 142 are formed over the entire display area 500 by vapor deposition or sputtering using a metal mask. However, since a distance is generated between the metal mask and the substrate 105, overhang occurs outside the metal mask opening. Since the overhang of the organic material layer 143 is 0.2 mm or more, the position of the contact portion 700 is preferably provided at least 0.2 mm or more outside from the end of the display area 500. The width of the contact portion 700 is, for example, 50 μm or more, for example, 500 μm or less, and for example, 100 to 200 μm.

[0027] Thereafter, a protective film 150 for sealing is formed on the organic EL element (display element 14) to suppress the penetration of moisture. The protective film 150 is provided to protect the display element and is also referred to as a passivation film or a sealing film. A lens structure for enhancing the light extraction efficiency may be separately provided on the protective film 150. Before forming the color filter array 152 described later, a resin layer 151 for planarization can be formed to mitigate the step difference between the pixels of the organic EL element. Next, a color filter array 152 is provided on at least the display element 14 (organic EL element) in the display area 500. The effective pixel portion of the color filter array 152 is composed of color filters of three colors: red, green, and blue, and is arranged, for example, in a delta arrangement. Outside the display area 500, there is a peripheral area 600 where mainly peripheral circuits are arranged, and a color filter array 152 is also provided on the insulating member 120 in the peripheral area 600. The color filter array 152 in the peripheral area 600 may be arranged in parallel with three colors: red, green, and blue, similar to the display area, may have a three-color laminated structure to enhance light-shielding properties, or may be arranged in a single color of any one of the colors. In the case of single-color arrangement, in applications where the background outside the display area (display area 500) is a dark part, such as in an organic EL display device, it is preferable to make the peripheral circuit portion of the color filter array 152 blue because it is the most difficult to visually recognize. The peripheral circuit portion of the color filter array 152 does not need to be arranged in a delta arrangement like the color filter array and can be arranged in an arbitrary pattern, but the positional relationship with the joining member 200 formed in the subsequent process will be described later. Also, since the vicinity of the aforementioned contact portion 700 has large irregularities, it is preferable that the color filter array 152 is arranged inside the contact portion 700 and not provided on the contact portion 700. Therefore, it is preferable that the outer end portion 142E of the counter electrode 142 is arranged outside the outer edge 152E of the color filter array 152. As a result, the outer edge 152E of the color filter array 152 will overlap the counter electrode 142. In this example, the conductive film serving as the counter electrode 142 overlaps the joining member 200. For the purpose of surface protection and planarization of the color filter array 152, a transparent resin layer 153 is formed on the color filter array 152. A lens array 170 is provided on the resin layer 153.The lens array 170 is composed of a plurality of microlenses provided for each pixel 140 and can be formed in an exposure and development process. Specifically, a film (photoresist film) made of a material for forming the microlens is formed, and the photoresist film is exposed and developed using a mask having a continuous gradation change. As such a mask, it is possible to use a grayscale mask or an area gradation mask that enables light irradiation having a continuous gradation on the imaging surface by changing the density distribution of dots composed of a light-shielding film with a resolution lower than that of the exposure apparatus. Further, the lens shape can be adjusted by performing etch-back on the microlens formed in the exposure and development process. In this example, a photosensitive transparent acrylic resin was used as the material of the lens array 170. The lens array 170 may be arranged at an arbitrary position not only in the display area 500 but also in the peripheral area 600, and the shape of the lens array arranged in the peripheral area 600 may be changed from the shape of the lens array arranged in the display area 500.

[0028] Next, a resin material to be the bonding member 200 is formed by a method such as dispensing or screen printing in a region of the peripheral region 600 of the substrate 105 excluding the external connection terminals 190. Then, after bonding the light-transmitting plate 300 to the substrate 105, the resin material is cured to form the bonding member 200. As shown in FIG. 2, the distance G between the outermost surface of the display device 100, that is, between the lens array 170 and the light-transmitting plate 300, is determined by the thickness T of the cured bonding member 200. As the bonding member 200, any resin such as epoxy, acrylic, urethane, or polyimide, such as a UV-curable resin, a thermosetting resin, or a two-component mixed resin, can be used, and it is preferable to appropriately contain spacers in the resin. By containing spacers, it becomes easy to control the thickness T of the bonding member 200 when bonding the substrate 105 and the light-transmitting plate 300 according to the size of the spacers, and the distance G between the lens array 170 and the light-transmitting plate 300 can be precisely controlled, which is suitable. As the spacer 210, any spacer such as glass beads or resin beads can be used, but it is preferable to use resin beads that are less likely to damage the insulating member 120 or the protective film 150 on the substrate 105. When the color filter array 152 is not disposed under the bonding member 200 in the entire region where the bonding member 200 is formed, the thickness T of the bonding member 200 may be set to be larger than the total thickness of the color filter array 152 and the lens array 170. In this way, a gap 180 that defines the distance G between the lens array 170 and the light-transmitting plate 300 can be provided. The distance G may be equal to the thickness T, but typically the distance G is smaller than the thickness T (G < T). For example, when the thickness of the color filter array 152 is 1.5 μm and the thickness of the lens array 170 is 2 μm, the thickness T of the bonding member 200 is desirably 3.5 μm or more, and a thickness T of the bonding member 200 of 50 μm or less is sufficient. Therefore, the distance G can be less than 50 μm. In this example, the light-transmitting plate 300 uses non-alkali glass. The thickness of the light-transmitting plate 300 is, for example, 0.1 to 1 mm, for example, 0.3 to 0.7 mm, for example, 0.5 mm. Further, an inclined surface 340 formed by chamfering is provided at a corner between the main surface 310 and the side surface 330 of the light-transmitting plate 300 facing the display device 100.

[0029] Note that packaging can also be performed at the wafer level. For example, the substrate 105 is prepared as a silicon wafer, a plurality of display devices are formed on the silicon wafer, and a color filter array 152 is formed for each display device. Then, a bonding member 200 is formed on the silicon wafer so as to surround each display device. A glass wafer serving as the light-transmitting plate 300 is prepared, and the glass wafer is bonded to the silicon wafer via the bonding member 200. Then, the bonded body of the silicon wafer and the glass wafer is diced for each device. Of the glass wafer, the portion above the external connection terminal 190 may be removed after dicing.

[0030] Thereafter, an external connection terminal 190 and an external power supply (not shown) are connected using mounting means (not shown) such as bonding wires, bumps, anisotropic conductive resins, etc., and the organic EL display device of the present invention is completed. Further, a light-shielding member 450 to which a light-transmitting member 470 is attached in advance is brought into contact with the light-transmitting plate 300 of the display device 800 and fixed with an adhesive (not shown) provided at an arbitrary position, thereby completing the display module 900.

[0031] Using FIG. 2(b), the distance G in the display area 500 will be described. The surface 101 of the display device 100 has a height difference H in the display area 500. The height difference H is, for example, 0.5 to 5 μm, for example, 1 to 3 μm, for example, 1.5 to 2.5 μm. The relatively high portion of the surface 101 is called the high portion 170T, and the relatively low portion is called the low portion 170B. For convenience, the boundary between the high portion 170T and the low portion 170B may be set at a position that is half of the height difference H. This height difference H can be formed by the unevenness due to the shape of the lens array 170 in FIG. 2(b). Alternatively, as shown in FIG. 3(a), it can be formed by the unevenness due to each color filter of the color filter array 152. The height difference H may reflect the shapes of both the lens array 170 and the color filter array 152, or may reflect the shapes of other components such as the protective film 150.

[0032] In the display device 800, since the user of the display device 800 optically observes the display area 500, the display quality may be degraded by foreign matter. It is difficult to correct the optical display quality degradation caused by foreign matter by an electrical method such as signal processing. Therefore, countermeasures against foreign matter are important in the display device 800. The height difference H to be considered in the countermeasures against foreign matter is greater than 1 μm. When the height difference H is 1 μm or less, it is regarded as substantially flat, and the consideration is omitted here. In particular, foreign matter smaller than the wavelength of visible light (400 to 800 nm, typically 550 nm) used in the display device 500 is considered not to have a great impact on the display quality for the user. If the height difference H is 100 nm or less, the surface 101 may be regarded as substantially flat. The height difference of the region of the main surface 310 of the light-transmitting plate 300 facing the display area 500 is preferably smaller than the height difference H in the display area 500 of the surface 101 of the display device 100. The height difference of the portion of the main surface 310 of the light-transmitting plate 300 facing the display area 500 is, for example, 1 μm or less, for example, 500 nm or less, and for example, 100 nm. One of the features of the present embodiment is that, between the display area 500 and the light-transmitting plate 300, the distance G is greater than the height difference H.

[0033] Here, regarding the distance G, the relationship with the foreign object DUS existing between the display area 500 and the light-transmitting plate 300 will be examined. When the size Q of the foreign object DUS does not exceed the height difference H (Q ≤ H), even if the surface 101 and the main surface 310 are in contact (G = 0), the foreign object DUS can exist between the lower part 170B of the surface 101 and the light-transmitting plate 300, so the influence of the foreign object is small. However, when the size Q of the foreign object DUS is less than or equal to the height difference H (Q ≤ H), the foreign object DUS may adhere to the upper part 170T. In this case, when the distance G is less than or equal to the size of the foreign object DUS (G ≤ Q), the foreign object DUS contacts both the surface 101 and the main surface 310, and the foreign object DUS may be fixed. Furthermore, the foreign object DUS may be pressed against the display device 100 by the light-transmitting plate 300. The fixation of the foreign object DUS may cause a decrease in image quality, and the pressing of the foreign object DUS may cause damage to the display device 100. To reduce these problems, it is sufficient if the distance G is larger than the size Q of the foreign object DUS (G > Q). Here, considering that Q ≤ H, it suffices to set Q ≤ H < G. That is, it can be seen that the distance G being larger than the height difference H is advantageous in suppressing a decrease in the reliability and display quality of the display device with respect to the foreign object DUS having a size Q smaller than the height difference H. As a countermeasure against the foreign object DUS having a size Q smaller than the height difference H, the distance G may be 10 μm or less.

[0034] Using FIG. 2(b), the relationship between the pixel size X and the distance G in the present embodiment will be described in detail. One of the features of the present embodiment is that, between the display area 500 and the light-transmitting plate 300, the distance G is larger than the pixel size X (G > X). In FIG. 3(a), semiconductor elements, wiring structures, etc. in the display device 100 are omitted, and only the pixel 140 is shown. The display elements are provided for each pixel 140. In this example, one display unit 145 is composed of a red pixel 140R, a green pixel 140G, and a blue pixel 140B.

[0035] Figs. 4(a) and 4(b) show the planar layout of pixel 140 when viewed from the normal direction to surface 101 which is the main surface of display device 100. Fig. 4(a) shows the case of a stripe array, and Fig. 4(b) shows the case of a delta array. In Fig. 4(b), the pixels 140 included in one display unit 145 are surrounded by a thick line. The pixel size X preferably adopts the length of pixel 140 in the direction in which pixels 140 of all colors are periodically arranged. When the planar shape of the contour of pixel 140 is a polygon, the pixel size X can be defined by the distance between opposite sides of the polygon. When the distance between opposite sides is different for each pair of opposite sides, the shorter distance may be adopted as the pixel size X. For example, in the example of Fig. 4(a), the contour of pixel 140 is a rectangle, and the pixel size X is defined by the distance between the long sides of the rectangle, that is, the length of the short side. This is because in the example of Fig. 4(a), pixels 140R, 140G, and 140B are periodically arranged in the direction in which the long sides of the rectangle are arranged (the horizontal direction on the drawing). For example, in the example of Fig. 4(b), the contour of pixel 140 is a hexagon, and the pixel size X is defined by the distance between opposite sides of the hexagon. This is because in the example of Fig. 4(b), pixels 140R, 140G, and 140B are periodically arranged in the direction in which the opposite sides of the hexagon are arranged (the horizontal direction on the drawing).

[0036] Using FIGS. 3(a), (b) and FIGS. 4(a), (b), the case where foreign matter DUS enters the space between the display device 100 and the light-transmitting plate 300, that is, the gap 180, will be described. The foreign matter DUS may originally adhere to the display device 100 or the light-transmitting plate 300, or may enter when the light-transmitting plate 300 is bonded to the display device 100. There is a limit to suppressing the entry of small foreign matter that does not exceed the pixel size X. The structure of the display device 100 that does not impair the display quality when foreign matter equal to or smaller than the pixel size X enters will be described. As shown in FIG. 3(a), consider a model in which the foreign matter DUS of size Q is spherical with a diameter Q. Since the size Q of the foreign matter DUS is equal to or less than the pixel size X, Q≦X. When the distance G is equal to or less than the size Q of the foreign matter DUS (G≦Q), when the light-transmitting plate 300 is bonded to the display device 100, the foreign matter may be pushed into the pixel 140, and the pixel 140 may be damaged and non-luminous. In addition, the foreign matter DUS may be sandwiched and fixed between the light-transmitting plate 300 and the display device 100, and the foreign matter DUS may block the light of the pixel 140 or change the optical path. That is, when the distance G is smaller than the pixel size X, there is a risk that the display quality will be impaired by the foreign matter DUS. On the other hand, as in the present embodiment, by making the distance G larger than the size Q of the foreign matter DUS (G>Q), it is possible to suppress the foreign matter DUS from being pushed into the pixel 140. Therefore, in order to satisfy Q≦X and Q<G, Q≦X<G is satisfied, that is, by making the distance G larger than the pixel size X (X<G), it is possible to suppress a decrease in display quality due to the foreign matter DUS. As described above, by designing the distance G wider than the pixel size X (G>X), it is possible to improve the display quality.

[0037] When a foreign object DUS larger than the pixel size X exists on the pixel 140, the emitted light is blocked by the foreign object DUS, and depending on the specifications of the display device 100, it may result in a pixel defect. With reference to FIG. 5, the preferable range of the distance G will be described. In FIG. 5, the pixel size X of the pixel 140R of the first color (e.g., red) is defined, the pixel size Y of the pixel 140G of the second color (e.g., green) different from the first color is defined, and the pixel size Z of the pixel 140B of the third color (e.g., blue) different from the second color is defined. In FIG. 5, the same hatching is applied to the pixels presenting the same color, and the hatching in FIG. 5 and the hatching in FIGS. 4(a) and 4(b) are common for each color. The pixels 140R, 140G, and 140B in FIG. 5 correspond to the pixels 140R, 140G, and 140B arranged horizontally in FIGS. 4(a) and 4(b). The pixel sizes X, Y, and Z may be different from each other (X < Y < Z or X > Y > Z or Y < X < Z), or may be the same (X = Y = Z). The pixel size X' of the pixel 140R' of the same color (e.g., red) as the pixel 140R is defined, and the pixel size X'' of the pixel 140R'' of the same color (e.g., red) as the pixel 140R of the first color is defined. The pixel sizes X, X', and X'' may be different from each other (X < X' < X'' or X > X' > X'' or X' < X < X''), or may be the same (X = X' = X''). The pixel size Y' of the pixel 140G' of the same color (e.g., green) as the pixel 140G of the second color is defined, and the pixel size Z' of the pixel 140B' of the same color (e.g., blue) as the pixel 140B of the third color is defined. The pixel sizes Y and Y' may be different from each other (Y < Y' or Y > Y'), or may be the same (Y = Y'). The pixel sizes Z and Z' may be different from each other (Z < Z' or Z > Z'), or may be the same (Z = Z').

[0038] Here, attention is paid to pixel 140R with pixel size X. Pixels 140R' and 140R" of the same color are located adjacent to both sides of the pixel 140R being focused on. Pixels of other colors are arranged between pixel 140R and the adjacent pixels 140R' and 140R" of the same color. As shown in FIG. 5, one pixel is composed of three colors: red, green, and blue. When the pixel 140R being focused on is red, green and blue pixels are arranged between pixel 140R and the adjacent pixels 140R' and 140R" of the same color. The distance Da from pixel 140R to pixel 140R' is defined, and the distance Db from pixel 140R to pixel 140R" is defined. Typically, Da = Y' + Z, and Db = Y + Z'. The pitch Pa between pixel 140R and pixel 140R' and the pitch Pb between pixel 140R and pixel 140R" are defined. The pitch between two pixels is the distance between the centers of the two pixels. Pa = X / 2 + Da + X' / 2, and Pb = X / 2 + Db + X" / 2. Typically, Pa = X + Da, and Pb = X + Db.

[0039] In the description of G>X, the influence of foreign matter DUS with a size Q smaller than the pixel size X on the display quality was examined. Hereinafter, foreign matter DUS with a size Q larger than the pixel size X will be examined. Regarding display defects caused by the foreign matter DUS being sandwiched and fixed between the light-transmitting plate 300 and the display device 100, or by the foreign matter DUS being pressed against the display device 100, the larger the foreign matter DUS, the wider the range. Therefore, it is desirable to confine such display defects caused by the fixation or pressing of the foreign matter DUS within the range of three pixels, namely the target pixel and its two adjacent pixels. In FIG. 5, the range indicated by size Qc corresponds to the size Q of the foreign matter DUS examined by this criterion. One pixel 140R presenting the first color (e.g., red) is located between one pixel 140G presenting the second color (e.g., green) and one pixel 140B presenting the third color (e.g., blue). For size Q = Qc = X + Y + Z, it is sufficient that G < Q. That is, it is preferable that the distance G is larger than the sum of the pixel size X of pixel 140R, the pixel size Y of pixel 140G, and the pixel size Z of pixel 140B (G > X + Y + Z). Applying X = Y = Z to G > X + Y + Z gives G > 3*X. If the pixel size X is larger than 6 μm, the distance G may be 18 μm or more.

[0040] Next, consider foreign matter DUS that enters from outside the gap 180 between the display area 500 and the light-transmitting plate 300. When an opening (gap 250) where the joining member 200 is not provided is provided in a part of the pattern of the joining member 200 as described later, the larger the distance G, the easier it is for foreign matter to enter. Also, when the distance G becomes wider, a so-called ghost occurs where a part of the display light is reflected by the light-transmitting plate 300 and then re-reflected by the display device, and multiple outlines of the image are visually recognized. Therefore, it is necessary to set an appropriate upper limit for the distance G. Although the quality standards of the display device 800 vary depending on the specifications of each product, the criterion is to suppress display defects that extend to a plurality of adjacent pixels of the same or different colors.

[0041] As the first index, display defects occurring in one pixel of interest and the same-color pixels on both sides thereof are suppressed. When the foreign object DUS spans a total of three same-color (e.g., red) pixels, namely pixel 140R, pixel 140R', and pixel 140R", it can be considered that display defects are likely to occur. Here, the three same-color pixels are exemplified as follows in FIG. 5. In the direction in which pixel 140R presenting the first color (e.g., red) has the pixel size X, pixel 140R is located between two pixels 140R', 140R" presenting the first color (e.g., red). In FIG. 5, the range indicated by Qa corresponds to the size Q of the foreign object DUS examined by this first index. Between the two pixels 140R', 140R" presenting the first color, two pixels 140G, 140G" presenting the second color (e.g., green) and two pixels 140B, 140B' presenting the third color (e.g., blue) are provided. Here, the case where the foreign object DUS of size Q spans three same-color (e.g., red) pixels means the case where the condition Q > Pa + Pb is satisfied. In order to suppress the mixing or intrusion of the foreign object DUS of such size Q, it suffices to set G < Q, and it is reasonable to satisfy the condition G < Pa + Pb < Q. It is preferable that the distance G is smaller than the sum of the pitch Pa between pixel 140R and one of the two pixels 140R', 140" (pixel 140R') and the pitch Pb between pixel 140R and the two pixels 140R', 140" (pixel 140R") (G < Pa + Pb). Substituting Pa = X + Da and Pb = X + Db into G < Pa + Pb gives G < X + Da + X + Db. Therefore, in order to suppress the display defect caused by the foreign object DUS satisfying Q > X + Da + X + Db, that is, the display defect occurring in three same-color pixels, it suffices that Q < X + Da + X + Db. Assuming that the foreign object DUS is spherical, by setting the distance G < Q, it is possible to suppress the foreign object DUS having a size of Q or more from entering through the opening (gap 250) provided in the joining member 200 and causing a display defect. That is, it suffices to set G < X + Da + X + Db. Substituting Da = Y' + Z and Db = Y + Z' into G < X + Da + X + Db gives G < X + Y' + Z + X + Y + Z', and applying Y' = Z = X = Y = Z' to G < X + Y' + Z + X + Y + Z' gives G < 6*X.

[0042] If the pixel size X is less than, for example, 8 μm, then the distance G may be 48 μm or less in that case. As a countermeasure against foreign matter DUS having a size Q larger than the pixel size X, the distance G is preferably 20 μm or more. However, considering the size of foreign matter DUS that is easy to manage industrially, a distance G of less than 50 μm is sufficient.

[0043] As a second indicator, display defects occurring in one pixel of interest and the different-color pixels on both sides thereof are reduced. In FIG. 5, the range indicated by size Qb corresponds to the size Q of foreign matter DUS examined by this second indicator. For size Q = Qb = Da + X + Db, it is sufficient if G < Q. That is, it is also preferable that the distance G is smaller than the distance between two pixels 140R', 140" (G < Da + X + Db). Substituting Da = Y' + Z and Db = Y + Z' into G < Da + X + Db gives G < Y' + Z + X + Y + Z'. Applying Y' = Z = X = Y = Z' to G < Y' + Z + X + Y + Z' gives G < 5*X. If the pixel size X is less than 8 μm, then the distance G may be 40 μm or less.

[0044] Here, foreign matter DUS between the light-transmitting plate 300 and the display device 100 has been described, but foreign matter may also adhere to the main surface 320 of the light-transmitting plate 300. Foreign matter on the main surface 320 may be visible to the user. However, if the foreign matter on the main surface 320 is far from the display area 500, the focus will not be on the foreign matter on the main surface 320 when viewing the display area 500, so the influence of the presence of the foreign matter can be reduced. That is, in order for the main surface 320 to be sufficiently far from the display area 500, it is desirable that the distance between the main surface 320 and the main surface 310, that is, the thickness R of the light-transmitting plate 300, is at least larger than the distance G (R > G). In other words, the distance G may be smaller than the thickness R of the light-transmitting plate 300. The possibility of foreign matter existing in the narrow gap 180 sealed by the joining member 200 is smaller than the possibility of foreign matter adhering to the main surface 320, so satisfying the relationship R > G is appropriate as a countermeasure against foreign matter. While the thickness R can be 0.1 to 1 mm, the distance G may be less than 100 μm.

[0045] The larger the area of the display area 500, the higher the probability of the presence of foreign matter, and thus the greater the influence of the foreign matter. The length of one side of the display area 500 is, for example, 5 to 50 mm, and the area of the display area 500 is, for example, 25 to 2500 mm 2 It can be. When considering the industrial production of the display device 100, the area of the display area 500 is preferably smaller than 2912 mm 2 Preferably smaller than 2912 mm 2 The display area 500 smaller than 2912 mm can be formed by batch exposure using a commercially available semiconductor exposure apparatus (i-line stepper FPA-5510iX manufactured by Canon, maximum exposure range: 52 mm × 56 mm). The area of the display area 500 is preferably smaller than 1392 mm 2 Preferably smaller than 1392 mm 2 The display area 500 smaller than 1392 mm can be formed by batch exposure using a commercially available semiconductor exposure apparatus (KrF scanner FPA-6300ESW manufactured by Canon, exposure range: 33 mm × 42.2 mm). If the display area 500 smaller than 1392 mm 2 is formed by a KrF scanner, a finer structure can be formed than using an i-line stepper. The area of the display area 500 may be smaller than 858 mm 2 Preferably smaller than 858 mm 2 The display area 500 smaller than 858 mm can be formed by batch exposure using a commercially available semiconductor exposure apparatus (KrF scanner FPA-6300ES6a manufactured by Canon, exposure range: 26 mm × 33 mm). The display area 500 smaller than 858 mm 2 can be formed by batch exposure using a commercially available semiconductor exposure apparatus (ArF scanner NSR-S322F manufactured by Nikon, exposure range: 26 mm × 33 mm). If the display area 500 smaller than 858 mm 2 is formed by an ArF scanner, a finer structure can be formed than using a KrF scanner. When using an exposure apparatus with an exposure range of 26 mm × 33 mm, the area of the display area 500 is 214 mm 2Even if it is larger, since the display areas 500 of two or more devices can be exposed in one shot, the productivity is high. On the other hand, when the long side of the display area 500 is 16.5 mm or more, in the direction where the exposure range is 33 mm, only the display area 500 of one device can be arranged in one shot, and the productivity of the display device 100 may be low. Therefore, the above-mentioned foreign matter countermeasures are particularly useful. When the long side of the display area 500 is 16.5 mm or more, if the aspect ratio of the display area 500 is 16:9, the diagonal length is 19.0 mm or more, and the area of the display area 500 is 153 mm 2 or more. When the long side of the display area 500 is 16.5 mm or more, if the aspect ratio of the display area 500 is 4:3, the diagonal length is 20.7 mm or more, and the area of the display area 500 is 205 mm 2 or more. Therefore, the present embodiment is suitable for the display device 100 in which the diagonal length of the display area 500 is 19 mm or more, or the display device 100 including the display area 500 with an area of 153 mm 2 or more. When the diagonal length of the display area 500 is 24 mm or more, if the aspect ratio of the display area 500 is 16:9, the area of the display area 500 is 245 mm 2 or more, and if the aspect ratio of the display area 500 is 4:3, the area of the display area 500 is 276 mm 2 or more. In the above, the case of using batch exposure has been described. However, if split exposure (stitched exposure) is used, a large-area display area 500 can be formed without the limitation of the semiconductor exposure apparatus. Even if an exposure apparatus with an exposure range of 26 mm × 33 mm is used and split exposure is used, a display device 100 having a display area 500 larger than 858 mm 2 can be manufactured. 858 mm 2Since the display device 100 having a larger display area 500 is even less productive, the above-described foreign matter countermeasures are even more useful. In the manufacturing process of the display device 100, an exposure apparatus having an exposure range of 26 mm × 33 mm, an exposure apparatus having an exposure range of 33 mm × 42.2 mm, and an exposure apparatus having an exposure range of 52 mm × 56 mm may be used in combination. Further, in the manufacturing process of the display device 100, overall exposure and divided exposure may be selectively used according to the process. Considering that the display device 100 has a peripheral area 600, to manufacture the display device 100 having the display area 500 with the above-described dimensions, an exposure apparatus or an exposure method (overall exposure / divided exposure) capable of exposing a range larger than the display area 500 may be applied.

[0046] FIG. 3(b) shows a cross-sectional view of a display device 100 in which a lens array 170 is provided on a display element in each pixel 140. Similar to FIG. 3(a), FIG. 3(b) also omits semiconductor elements, wiring structures, etc. in the display device 100, and depicts only the substrate 105 and the pixel 140 including the lens array 170. As shown in FIG. 3(a), the display device 100 and the light-transmitting plate 300 are bonded via a bonding member 200. The lens array 170 and the light-transmitting plate 300 are separated by a distance G, and a gap 180 is provided between the lens array 170 and the light-transmitting plate 300. Each pixel 140R, 140G, 140G that constitutes the three colors R, G, and B forms a display unit 145 as a set. FIG. 2(b) is an enlarged view of the display unit 145 in FIGS. 2(a) and 3(b). The lens array 170 is a microlens and is provided for each pixel. Here, let the height difference of the lens array 170 be H. When adjacent lens arrays are separated, the film thickness of the lens array corresponds to the height difference H of the lens array 170. When adjacent lens arrays are not separated but are in contact, as shown in FIG. 2(b), the distance between the high part 170T and the low part 170B of the surface 101 by the lens array 170 corresponds to the height difference H of the lens array 170. Assuming that the microlens of the lens array 170 is a hemisphere (height is half of the diameter) having the same diameter as the pixel size X, the height difference H of the lens array 170 can be half of the pixel size X (H = X / 2). However, the hemispherical microlens is optically inefficient and the productivity is not good. Therefore, it is desirable to use an aspherical microlens or a microlens smaller than a hemisphere. Therefore, it is preferable that the height difference H of the lens array 170 is smaller than half of the pixel size X. When such a lens array 170 is adopted, the height difference H of the surface 101 in the display area 500 is smaller than half of the size X of one pixel among the plurality of pixels constituting the display area 500 (H < X / 2). Therefore, it can be said that it is preferable to satisfy H < X / 2.

[0047] Before attaching the light-transmitting plate 300, foreign matter adhering to the surface of the display device 100 is removed by cleaning. However, foreign matter that has entered between the unevenness on the surface of the lens array 170 and that is smaller than the height difference H may remain without being removed by cleaning. As shown in FIG. 3(b), foreign matter DUS having a size Q < H is likely to remain with respect to the surface unevenness having the height difference H. When the light-transmitting plate 300 is attached after the foreign matter DUS has moved to the high portion 170T of the lens array 170, if the distance G between the light-transmitting plate 300 and the lens array 170 is too narrow, the foreign matter DUS may damage the display device 100. Therefore, by setting the distance G to be larger than the foreign matter having a size Q < H relationship, that is, by setting G > H, damage to the display device caused by foreign matter remaining between the surface unevenness of the lens array can be suppressed. Here, the height difference of the lens array 170, the height difference H is, for example, 0.5 to 5 μm, for example, 1 to 3 μm, for example, 1.5 to 2.5 μm, and the distance G is, for example, 3 to 10 μm. When the height difference H of the surface 101 in the display area 500 is caused by the lens array 170, since a very large number of unevenness are repeated, even if the height difference H of the surface 101 in the display area 500 is 1 μm or less, it is preferable to satisfy the relationship G > H.

[0048] Next, with reference to FIG. 6, other characteristic configurations of the display device 800 will be described. As shown in FIG. 6(a), a plurality of pixels 140 are provided in the display area 500 of the display device 100, and peripheral areas 601 and 602 are provided on the outer periphery of the display area 500. The peripheral area 601 refers to the left and right peripheral areas of the display area 500, and the peripheral area 602 refers to the upper peripheral area of the display area 500. In order to suppress the reflection of the peripheral area, a color filter array 152 also extends outside the display area 500, and the outer end 152E of the color filter array 152 is disposed on the peripheral areas 601 and 602. In the present embodiment, as shown in FIG. 6(a), a contact portion 700 is provided in the peripheral area 601. Comparing the widths of the peripheral area 601 and the peripheral area 602, the peripheral area 601 where the contact portion 700 is provided is wider, and the peripheral area 602 is narrower than the peripheral area 601. Therefore, in the present embodiment, the joining member 200 is arranged so that a part of the outer end 152E of the color filter array 152 and the joining member 200 overlap in the peripheral area 602. The inner end 201, which is the side surface on the side of the gap 180 of the joining member 200, overlaps the color filter array 152. And the outer end 202, which is the side surface on the side opposite to the side of the gap 180 of the joining member 200, does not overlap the color filter array 152. That is, the inner end 201 of the joining member 200 is disposed on the color filter array 152, and the outer end 202 of the joining member 200 is disposed outside the outer end 152E of the color filter array 152. On the other hand, in the peripheral area 601 where the contact portion 700 is provided, both the inner end 201 and the outer end 202 of the joining member 200 are disposed outside the outer end 152E of the color filter array 152. The X-X' cross section for showing the structure of the peripheral area 601 is shown in FIG. 6(b), and the Y-Y' cross section for showing the structure of the peripheral area 602 is shown in FIG. 6(c). As shown in FIGS. 6(b) and 6(c), the display device 100 includes a substrate 105, and of the front and back surfaces of the substrate 105, the surface on which the transistor is provided is defined as the main surface 1. A semiconductor element 110, an insulating member 120, and a wiring structure 130 are formed on the main surface 1 of the substrate 105. A plurality of pixel electrodes 141, a counter electrode 142 opposing the plurality of pixel electrodes 141, and an organic material layer 143 provided between the plurality of pixel electrodes 141 and the counter electrode 142 are provided on the insulating member 120.Although it is omitted here, an insulating pixel separation portion (also referred to as a bank) may be provided between the plurality of pixel electrodes 141. Thus, the display element of the pixel 140 is an EL element, and is configured to include a pixel electrode 141, an organic material layer 143, and a counter electrode 142. In the EL element, the pixel electrode 141 functions as an anode, and the counter electrode 142 functions as a cathode. The wiring structure 130 is provided between the plurality of pixel electrodes 141 and the substrate 105. Appropriate wirings of the wiring structure 130 are connected to the pixel electrode 141 and the counter electrode 142, respectively. As shown in FIG. 6(b), a contact portion 700 is provided in the peripheral region 601, and in the contact portion 700, the counter electrode 142 and the wiring structure 130E provided in the peripheral region are in contact with each other.

[0049] The protective film 150 covers the display element (counter electrode 142, organic material layer 143, pixel electrode 141) of the pixel 140, the wiring structure 130, the insulating member 120, and the substrate 105.

[0050] A color filter array 152 is provided on the protective film 150 via a resin layer 151. A resin layer 153 provided on the color filter array 152 is provided. In other words, the color filter array 152 is located between the resin layer 151 and the resin layer 153. The resin layer 151 functions as an adhesive layer, and the resin layer 153 functions as a planarization layer. The resin layer 153 is disposed on the display region 500 and the peripheral regions 601 and 602. The color filter array 152 is located between the resin layer 153 and the display device 100. If the color filter array 152 is not arranged in the peripheral regions 601 and 602, light may be reflected in the peripheral regions 601 and 602, or light may be incident on the peripheral regions 601 and 602, so that the image quality may deteriorate. Therefore, the color filter array 152 is provided in a range somewhat outside from the display region 500. Here, the outer end of the color filter array 152 is 152E, and the side surface of the outer end 152E of the color filter array 152 is covered with the resin layer 153. Outside the outer end 152E of the color filter array 152, a structure in which the resin layer 151 and the resin layer 153 are laminated is formed on the protective film 150.

[0051] The joining member 200 is provided in the peripheral regions 601 and 602 and adheres the light-transmitting plate 300.

[0052] In order to enhance the light-shielding property of the peripheral region 600, it is conceivable to form the color filter array 152 up to the edge of the substrate 105, form the joining member 200 on the color filter array 152, and bond the light-transmitting plate 300. However, the color filter array 152 contains pigments and has low adhesion between the color filter array 152 and the underlying layer. Therefore, there is a problem of delamination at the interface between the color filter array 152 and the joining member 200 or at the interface between the color filter array 152 and the underlying layer. Such delamination can occur due to the curing shrinkage of the resin when forming the joining member 200 or due to the expansion and contraction when the display device is exposed to a high-temperature and high-humidity environment or the like.

[0053] In this example, as will be described later, an area where the color filter array 152 is not provided is arranged under the joining member 200. By arranging an area where the color filter array 152 is not provided under the joining member 200, delamination between the joining member 200 and the display device 100 due to the volume shrinkage when the joining member 200 cures can be suppressed. Also, delamination between the joining member 200 and the display device 100 due to the expansion and contraction of the material when exposed to a high-temperature and high-humidity environment or the like can be suppressed. Also, delamination at the interface between the color filter array 152 and the underlying layer of the color filter array 152 can be suppressed. In particular, when the color filter array 152 contains pigments, it has lower adhesion to the adherend compared to when the color filter array 152 contains dyes. Therefore, when the color filter array 152 contains pigments, delamination due to the volume shrinkage when the joining member 200 cures or due to the expansion and contraction when the display device is exposed to a high-temperature and high-humidity environment or the like is likely to occur. Thus, when the color filter array 152 contains pigments, this example is suitable.

[0054] Next, the details regarding the arrangement position of the joining member 200 will be described. As shown in FIG. 6(b), in the region where the contact portion 700 is provided, since the peripheral region 601 is wider than the peripheral region 602 where the contact portion 700 is not provided, the joining member 200 is provided outside the outer end 152E of the color filter array 152. The joining member 200 is disposed between the resin layers 151, 153 and the light-transmitting plate 300. That is, there is a region where the resin layers 151, 153 extend between the joining member 200 and the display device 100. As described above, by disposing a region where the color filter array 152 is not provided under the joining member 200, it is possible to suppress delamination between the joining member 200 and the display device 100 due to volume shrinkage when the joining member 200 cures. Further, it is possible to suppress delamination between the joining member 200 and the display device 100 due to expansion and contraction of the material when exposed to a high-temperature and high-humidity environment or the like. Also, delamination at the interface between the color filter array 152 and the underlying layer of the color filter array 152 can be suppressed.

[0055] On the other hand, in the peripheral region 602 where the contact portion 700 is not provided, since the space is narrower than that in the peripheral region 601, the following structure is adopted. As shown in FIG. 6(c), the inner end 201 of the bonding member 200 is disposed on the color filter array 152 formed outside the display region 500, and the outer end 202 of the bonding member 200 is disposed outside the outer end 152E of the color filter array 152. A part of the bonding member 200 is disposed between the resin layers 151, 153, the color filter array 152 and the light-transmitting plate 300, and a part of the bonding member 200 is disposed between the resin layers 151, 153 and the light-transmitting plate 300. There is an overlapping region 205 between the bonding member 200 and the color filter array 152. That is, between the bonding member 200 and the display device 100, there are a region where the resin layers 151, 153 extend, and a region where the resin layers 151, 153 and the color filter array 152 extend. By disposing the bonding member 200 so as to overlap the color filter array 152 in this way, space can be saved by the width of the overlapping region 205, and the display device 100 can be miniaturized. In the overlapping region 205, there is a risk of the above-mentioned delamination between layers, but in the region outside the overlapping region 205, since the bonding member 200 is grounded in the region where the color filter array 152 is not provided, the progress of delamination between layers in the entire width direction of the bonding member is suppressed. As a result, delamination between the bonding member 200 and the display device 100 due to volume shrinkage when the bonding member 200 hardens can be suppressed. Further, delamination between the bonding member 200 and the display device 100 due to expansion and contraction of the material when exposed to a high-temperature and high-humidity environment or the like can be suppressed. Further, delamination at the interface between the color filter array 152 and the underlying layer of the color filter array 152 can also be suppressed.

[0056] The width of the joining member 200 is, for example, 0.1 to 2 mm, for example, 0.5 to 1 mm, for example, 0.8 mm. Among them, the distance from the inner end 201 of the joining member 200 to the outer end 152E of the color filter array 152, that is, the width of the overlapping region 205, is, for example, 10 to 500 μm, for example, 50 to 200 μm, for example, 100 μm. The distance from the outer end 152E of the color filter array 152 to the outer end 202 of the joining member 200 is, for example, 0.1 to 1 mm, for example, 0.5 to 1 mm, for example, 0.7 mm. The joining member 200 may include a matrix made of resin and spacers made of resin dispersed in the matrix. The distance G between the display device 100 and the light-transmitting plate 300 is adjusted according to the particle diameter of the spacers. As shown in FIG. 6(c), the distance G between the display device 100 and the light-transmitting plate 300 in the display region 500 may vary depending on the thickness of the joining member 200 in the overlapping region 205 between the joining member 200 and the color filter array 152. Therefore, the distance G is the difference between the spacer diameter and the thickness of the lens array 170. The total thickness of the lens array 170 is, for example, 2 μm, and the spacer particle diameter is, for example, 30 μm. In that case, the distance G is 28 μm. The matrix resin of the joining member 200 contacts both the display device 100 and the light-transmitting plate 300. As another example of the joining member 200, the joining member 200 can also be constituted by a base portion that occupies most of the thickness of the joining member 200, an adhesive layer that adheres the base portion to the display device 100, and an adhesive layer that adheres the base portion to the light-transmitting plate 300.

[0057] Regarding the light-transmitting plate 300, an inclined surface 340 formed by chamfering is provided at the end of the main surface 310 facing the display device 100 of the light-transmitting plate 300. By providing the inclined surface 340, it is possible to suppress the corner of the light-transmitting plate from abutting on the display device 100 when the light-transmitting plate 300 is bonded, thereby preventing damage to the display device 100. The width of the inclined surface 340 in the direction parallel to the main surface 310 is, for example, 0.1 mm. In this example, the inclined surface 340 is formed only at the end of the main surface 310 facing the display device 100, but an inclined surface may be formed by chamfering at the end of the main surface 320 not facing the display device 100, or inclined surfaces may be formed at the ends of both main surfaces 310 and 320.

[0058] Next, when the width of the joint member 200 is W and the distance from the outer edge of the display area 500 to at least a part of the joint member 200 is L, the relationship between the width W and the distance L will be described with reference to FIG. 7. Note that the distance from the outer edge of the display area 500 to the joint member 200 does not have to be uniform around the entire circumference of the outer edge of the display area 500.

[0059] FIG. 7 is a schematic diagram showing the state in which the emitted light EMI from the pixel 140E at the outer edge of the display area 500 is emitted at the emission angle θ. Here, for simplicity, the lens array is omitted from the illustration. The angle θ between the normal to the main surface of the display device 100 and the emitted light is defined as the emission angle. It can be seen that in order for the emitted light EMI from the pixel 140E at the outer edge of the display area 500 not to be blocked by the joint member 200, it is necessary to make L > Gtanθ. Conversely, in the case of the relationship L ≦ Gtanθ, the emitted light EMI from the pixel 140E at the outer edge of the display area 500 is blocked by the joint member 200, which may result in a display defect. It can be understood that the required width L depends on the viewing angle. In a typical application, a viewing angle of about 45° is sufficient. When θ = 45°, it is sufficient that L > G from the above relational expression. That is, it is preferable that the distance L from at least a part of the display area 500 to the joint member 200 is larger than the distance G. Also, the distance L from the pixel 140E at the outer edge of the display area 500 to the joint member 200 is preferably smaller than the width W of the joint member 200 in order to save space. That is, it is preferable to make W > L, and considering the above-mentioned relationship X < G of the pixel size, it is preferable to design with the relationship X < G < L < W. For example, the pixel size X is 5 to 10 μm, the distance G is 10 to 50 μm, the distance L is 50 to 500 μm, and the width W is 500 to 1000 μm. In one example, the pixel size X is 6 μm, the distance G is 28 μm, the distance L is 100 μm, and the width W is 700 μm.

[0060] One of the features of the present embodiment is that the gap 180 communicates with a space (external space) existing on the side opposite to the joining member 200 with respect to the gap 180. For example, as shown in FIG. 8, a gap 250 for communicating the gap 180 with the external space is provided between a certain part and another part of the joining member 200. The certain part and the other part of the joining member 200 are parts located on both sides of the gap 250 in the joining member 200. In addition to the method of providing the gap 250, grooves or holes for communicating the gap 180 with the external space can also be provided in the light-transmitting plate 300 or the display device 100.

[0061] Next, a preferred pattern of the joining member 200 will be described. In the above-described embodiment, the joining member 200 has a closed pattern surrounding the display area 500. However, it is preferable to provide at least one gap 250 in the joining member 200. If the gap 250 is not provided in the joining member 200, pressure fluctuations in the gap 180 occur due to changes in the external environment, and the light-transmitting plate 300 may be deformed, impairing the quality and reliability of the display device. For example, when the external environment suddenly changes from room temperature to sub-zero temperature, the pressure in the gap 180 decreases, creating a pressure difference inside and outside the joining member 200, causing the light-transmitting plate 300 to deform toward the display device 100 side. As described above, by setting the distance G wider than the pixel size X, display defects due to foreign matter can be suppressed. However, if the light-transmitting plate 300 is deformed and the distance G fluctuates, there is a risk that the display device 100 will be damaged by the internal foreign matter. Since the amount of deformation of the light-transmitting plate 300 also depends on the rigidity of the light-transmitting plate 300, it is difficult to generally define the amount of deformation, and it is preferable to suppress the deformation of the light-transmitting plate itself due to external environment fluctuations. Also, if the gap 250 is not provided in the joining member 200, when a rapid temperature cycle between high and low temperatures is repeated, the gap 180 expands and contracts repeatedly, and repeated stress is applied to the interface of the joining member 200. As a result, there is also a risk that the joining member 200 will peel off from the display device 100 or the light-transmitting plate 300. In particular, this problem becomes more prominent as the line width W of the joining member 200 becomes thinner. Furthermore, there is also a problem of dew condensation. If the gap 250 is not provided in the joining member 200, for example, during a period when it is left in a high-temperature and high-humidity environment, the gap 180 has a saturated water vapor pressure. When the environmental temperature suddenly drops, the saturated water vapor pressure in the gap drops, and dew condensation occurs in the gap. Dew condensation in the gap may impair the display quality and reliability. To suppress the above problems, it is preferable to provide at least one gap 250 in the joining member 200. Next, the arrangement pattern when the gap 250 is provided in the joining member 200 will be described with reference to FIG. 8.

[0062] FIG. 8 shows a plan view of a display device 800 in which a gap 250 is provided in the joining member 200 as viewed in plan with respect to the surface 101 which is the main surface of the display device 100.

[0063] In FIG. 8(a), the gap 250 is provided on the side where the contact portion 700 is disposed. As shown in FIG. 8(a), the contour of the display region 500 is a quadrilateral, and the gap 250 is provided at a position sandwiched between two straight lines (indicated by a one-dot chain line) obtained by virtually extending the upper and lower sides of the contour that face each other. Note that the external connection terminal 190 does not exist at a position sandwiched between the two straight lines indicated by this one-dot chain line. When forming the joining member 200 using a dispensing method, the line width of the gap end portion of the joining member 200 corresponding to the start and end points of the dispensing may be slightly thicker than the line width other than the gap end portion. As described above, since the side where the contact portion 700 is disposed has a wider peripheral region 600 than the other sides, there is no problem even if the line width of the joining member 200 in the gap 250 becomes slightly thicker. Therefore, it is preferable to provide the gap 250 on the side where the contact portion 700 is disposed.

[0064] As another example, in FIG. 8(b), the gap 250 is provided on the side where the external connection terminal 190 is disposed. The contour of the display region 500 is a quadrilateral, and the gap 250 is provided at a position sandwiched between two straight lines (indicated by a two-dot chain line) obtained by virtually extending the left and right sides of the contour that face each other. Note that at least a part of the external connection terminal 190 exists at a position sandwiched between the two straight lines indicated by this two-dot chain line. The region between the external connection terminal 190 and the display region 500 often has a wider space than the other sides for routing the wiring structure. Therefore, it is easy to provide a gap as described above. Since the gap 250 of the joining member 200 can be a path for foreign matter to enter, it is preferable to dispose some structure outside the gap 250 so as not to block the gap 250. A flexible printed circuit board (FPC, not shown) is joined to the external connection terminal 190, and a reinforcing resin may be provided to reinforce the adhesive force between the FPC and the display device 100. By providing the gap 250 on the side where the external connection terminal 190 is disposed, the reinforcing resin 260 of the FPC can be used as a structure for suppressing foreign matter intrusion, which is preferable.

[0065] As yet another example, as shown in FIG. 8(c), the gap 250 may be provided at a corner. The contour of the display area 500 is quadrilateral, and the gap 250 is provided at a position not sandwiched between two straight lines (indicated by a one-dot chain line) obtained by virtually extending the upper and lower sides that face each other among the contours. Further, the gap 250 is provided at a position not sandwiched between two straight lines (indicated by a two-dot chain line) obtained by virtually extending the left and right sides that face each other among the contours. Providing the gap 250 at the corner can reduce the risk of display failure caused by foreign matter because the distance from the gap 250 to the display area 500 is long if foreign matter intrudes from the gap 250.

[0066] Also, in FIG. 8(d), the joining member 200 has a double pattern. The joining member 200 has a structure including a joining member pattern 201 provided on the outer periphery with the gap 250, and a joining member pattern 202 provided inside the joining member pattern 201 and separated from the joining member pattern 201. The joining member pattern 202 is provided so as to overlap with the gap 250 of the joining member pattern 201 in plan view. The joining member pattern 202 may be provided outside the joining member pattern 201. By providing the joining member pattern 202, the gap 250 can be formed into a labyrinth structure, and the distance for foreign matter that has intruded from the gap 250 of the joining member 200 to reach the display area 500 can be lengthened. As a result, the risk of display failure can be reduced.

[0067] As described above, by providing the gap 250 in the joining member 200, the risk of display failure and reliability degradation associated with fluctuations in the external environment can be reduced.

[0068] According to the present invention as described above, by making the distance between the display device and the light-transmitting plate larger than the pixel size, it is possible to suppress display defects caused by foreign matter. Further, when providing a lens array, by making the distance between the display device and the light-transmitting plate larger than the height difference of the lens array, it is possible to suppress display defects caused by foreign matter. Furthermore, by providing a gap in the joining member, it is possible to reduce the risk of display defects and reliability degradation due to external environmental fluctuations. As described above, it is possible to improve the display quality and reliability of the display device.

[0069] In the present embodiment, since a gap 180 is provided between the light-transmitting plate 300 and the display device 100, compared with the case where the space between the light-transmitting plate 300 and the display area 500 is filled with a light-transmitting member, it is disadvantageous in terms of ensuring the joining strength between the light-transmitting plate 300 and the display device 100. That is, it is difficult to increase the joining area between the light-transmitting plate 300 and the display device 100 in order to provide the gap 180. Further, since the heat conduction between the display device 100 and the light-transmitting plate 300 is reduced by the gap 180, a temperature difference between the display device 100 and the light-transmitting plate 300 is likely to occur. Therefore, since the thermal expansion amounts of the display device 100 and the light-transmitting plate 300 are likely to be different, stress is likely to occur between the display device 100 and the light-transmitting plate 300. Further, in order to reduce thermal damage to the organic material layer 143, it is preferable to avoid exposing the resin films that become the resin layers 151 and 152 to high temperatures. Therefore, there may be a case where the curing of the resin film is not sufficient. When the display device 100 and the light-transmitting plate 300 are joined by the joining member 200 via an insufficiently cured resin film, peeling may occur at the interface between the insufficiently cured resin film and the protective film 150. Alternatively, peeling may occur at the interface between the insufficiently cured resin film and the joining member 200. Alternatively, the insufficiently cured resin film itself may break. Therefore, an advantageous form for improving the joining strength between the light-transmitting plate 300 and the display device 100 due to the limited joining area will be described.

[0070] Figs. 9(a) and (b) are cross-sectional views taken along the line Z-Z’ in Fig. 6(a). The display device 100 includes a substrate 105 and an inorganic material layer positioned between the substrate 105 and the gap 180. This inorganic material layer may be included in the protective film 150 in Fig. 9(a). The inorganic material layer included in the protective film 150 is typically a silicon nitride layer. The inorganic material layer included in the protective film 150 extends between the joining member 200 and the substrate 105. The display device 100 includes an organic material layer 143 positioned between the substrate 105 and the inorganic material layer of the protective film 150, and at least one resin layer 151, 153 positioned between the organic material layer 143 and the gap 180. The ends of the resin layers 151, 153 are inside the joining member 200. The resin layers 151, 153 are formed to expose the inorganic material layer included in the protective film 150. Therefore, the joining member 200 contacts the inorganic material layer included in the protective film 150. Since the joining strength decreases when the joining member 200 contacts the resin layers 151, 153, the resin layers 151, 153 are removed so that the joining member 200 contacts the inorganic material layer included in the protective film 150. If no resin layer is provided between the joining member 200 and the substrate 105, peeling caused by the resin layer is less likely to occur.

[0071] This structure can be formed by forming resin films that will become resin layers 151 and 153 over the entire surface of the substrate 105, then leaving the resin films in the remaining regions described in FIGS. 9(a) and 9(b), and removing the resin films from the removal regions described in FIGS. 9(a) and 9(b). For example, after forming a resin film that will become resin layer 151 and a resin film that will become resin layer 153 over the entire surface of the substrate 105, the remaining regions may be protected with a mask, and the two resin films located in the removal regions may be removed by etching. It is efficient to remove the unnecessary films from the removal regions all at once in this way. Therefore, the positions of the ends of resin layer 151 and the ends of resin layer 153 generally coincide. That the ends generally coincide means that the deviation in the positions of the respective ends is 1 μm or less. Of course, the resin films may be removed from the removal regions each time a resin film is formed, and in that case, the ends of resin layer 151 and resin layer 153 do not have to coincide. When the resin film has photosensitivity, the resin film can be patterned by photolithography each time a resin film is formed.

[0072] In FIG. 9(b), an antireflection film 171 is provided over the lens array 170. The antireflection film 171 includes an inorganic material layer such as a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer. The organic material layer 143 is located between the substrate 105 and the inorganic material layer included in the antireflection film 171. The ends of the antireflection film 171 are also inside the joining member 200, similar to the ends of the resin layers 151 and 153. Therefore, the joining member 200 contacts the inorganic material layer included in the protective film 150, rather than the inorganic material layer included in the antireflection film 171. The inorganic material layer included in the antireflection film 171 can also be patterned together with the resin films that will become the resin layers 151 and 153.

[0073] The inorganic material layer included in the antireflection film 171 can also be left in the removal regions of the resin layers 151 and 153. In that case, the inorganic material layer included in the antireflection film 171 can extend between the joining member 200 and the substrate 105. And the joining member 200 can be in contact with the inorganic material layer included in the antireflection film 171. Even if the inorganic material layer included in the antireflection film 171 is left in the removal region of the resin film, there is an advantage that a decrease in bonding strength is less likely to occur because the resin layers 151 and 153 are not present (removed) between this inorganic material layer and the substrate 105.

[0074] The peripheral region 600 shown in FIG. 9(a) includes a non-effective pixel region 610 and a peripheral circuit region 620. In the example of FIG. 9(a), the color filter array 152 has a multicolor portion in the non-effective pixel region 610, and in the example of FIG. 9(b), the color filter array 152 has a single-color portion in the non-effective pixel region 610. Pixel separation portions 144 called banks are shown in FIGS. 9(a) and 9(b). The pixel separation portion 144 is made of an inorganic material layer such as a silicon oxide layer or a silicon nitride layer. The inorganic material layer constituting the pixel separation portion 144 may be provided between the substrate 105 and the joining member 200.

[0075] FIG. 10(a) shows an example of a device EQP equipped with a display device DSPL. The above-described display device 800 can be applied to the display device DSPL. The device EQP includes at least one of a control device CTRL, a communication device IF, an optical device OPT, an imaging device IS, and an audio device AUDIO. The control device CTRL controls the display device DSPL. The control device CTRL can be a DSP or an ASIC. The communication device IF communicates (transmits / receives) a signal including information displayed in the display area 500. The communication device IF has a wireless communication function and / or a wired communication function. The communication device IF may have only a receiving function without a transmitting function. The optical device OPT projects an image displayed in the display area 500 onto a screen or a retina. The optical device OPT can be a lens, a prism, or a mirror. The imaging device IS captures an image displayed in the display area 500. The imaging device IS can be a CMOS image sensor that photoelectrically converts light taken in from outside the device EQP. The audio device AUDIO may include a microphone for receiving sound from outside the device EQP and / or a speaker for outputting sound. In particular, the imaging device IS and the audio device AUDIO can be appropriately omitted according to the specifications of the device EQP and the user's requirements.

[0076] Also, the device EQP is suitable for electronic devices such as an information terminal having a display function (e.g., a smartphone or a wearable terminal) and a camera (e.g., a single-lens reflex camera, a compact camera, a video camera, a surveillance camera). Also, the device 9191 can be a transportation device such as a vehicle, a ship, or an aircraft. The device EQP as a transportation device is suitable for those that transport the display device 800 or those that assist in driving (operation) by means of a display function. Alternatively, the device EQP may be a medical device such as an ophthalmic device, a measuring device such as a distance measuring sensor, or an office device such as a copying machine.

[0077] FIG. 10(b) shows an example of a head-mounted display (HMD) as an example of the device EQP. The head-mounted display (HMD) includes a wearing means WR for using the device EQP as a head-mounted display. The wearing means WR is a band, a strap, or the like. The head-mounted display (HMD) is provided with a plurality of display devices DSPL so that the user can observe an image with both eyes. In addition, the head-mounted display (HMD) is provided with a plurality of imaging devices IS so that distance information can be obtained. By positioning the microphone of the audio device AUDIO near the user's mouth, the sound emitted from the user's mouth can be input to the microphone. By positioning the speaker of the audio device AUDIO near the user's ear, the sound directed to the user's ear can be output from the speaker. The diagonal length of the display area of the display device DSPL in the head-mounted display (HMD) may be 24 mm or more.

[0078] As described above, the embodiments described can be appropriately changed without departing from the technical idea. Note that the disclosure of this specification includes not only what is described in this specification but also all matters that can be grasped from this specification and the drawings attached to this specification.

[0079] Regarding the specifically exemplified numerical ranges, the description "e to f" (where e and f are numbers) means "e or more and / or f or less". Also, regarding the specifically exemplified numerical ranges, when the ranges "i to j" and "m to n" are described together (where i, j, m, and n are numbers), the combinations of the lower and upper limits are not limited to the combinations of i and j or m and n. For example, it is also possible to consider combinations of the lower and upper limits of multiple sets. That is, when the ranges "i to j" and "m to n" are described together, it is possible to conduct the consideration within the range "i to n" or within the range "m to j".

[0080] Also, the disclosure of this specification includes the complement of the individual concepts described in this specification. That is, for example, if this specification describes that "A is larger than B", even if the description that "A is not larger than B" is omitted, it can be said that this specification discloses that "A is not larger than B". This is because when the description that "A is larger than B" is given, it is premised that the case where "A is not larger than B" is considered.

Description of Reference Numerals

[0081] 100 Display device 500 Display area G Distance H Level difference X Pixel size 200 Joining member 300 Translucent plate 180 Gap

Claims

1. A display device having a display area and a peripheral area located around the display area, a light-transmitting plate overlapping the display device in a planar view, and a lens disposed above the display area, A display device having a gap between the display area and the light-transmitting plate, and a foreign object disposed in the gap, A display device characterized in that, when the size of the foreign matter is Q, the height of the lens is H, the distance from the apex of the lens to the light-transmitting plate is G, and the thickness of the light-transmitting plate is R, formula (1) is satisfied. Q≦H<G<R (1)

2. The display device according to claim 1 , wherein the G is 40 μm or less.

3. The display device according to claim 1 , wherein the G is 10 μm or less.

4. The display device according to claim 1 , wherein the G is 20 μm or more.

5. The display device according to claim 1 , further comprising a bonding member between the peripheral region and the light-transmitting plate, the bonding member bonding the display device and the light-transmitting plate to each other.

6. The display device according to claim 5 , wherein a distance L from said display area to at least a part of said joint member is greater than said distance G and is smaller than a width W of said joint member.

7. The display device according to claim 1 , wherein the display region has a light-emitting element, and the light-emitting element is covered with an inorganic material layer.

8. The display device according to claim 7 , wherein the inorganic material layer is a silicon nitride layer.

9. 9. The display device according to claim 1, wherein the display device is provided on a substrate, the substrate being a single crystal semiconductor substrate, and the thickness of the substrate is greater than the thickness of the light-transmitting plate.

10. 10. A display device according to any preceding claim, wherein the display device is provided with a colour filter array.

11. The display device of claim 10 , wherein the lens is disposed above the color filter array.

12. The display device according to claim 5 , wherein the joining member includes a resin portion and a spherical spacer.

13. The display device according to claim 5 , further comprising a conductive film disposed from the display region to the peripheral region, the bonding member overlapping the conductive film.

14. 14. The display device according to claim 1, wherein the light-transmitting plate has a main surface facing the display device and a side surface inclined with respect to the main surface, and a surface inclined with respect to the side surface and the main surface extending from the side surface to the main surface.

15. The display device according to claim 1 , wherein an area of ​​the display region is greater than 153 mm 2 and smaller than 2912 mm 2 .

16. The display device according to claim 1 , wherein a plurality of organic EL elements are arranged in the display region.

17. A display device according to any one of claims 1 to 16, A module comprising: The display device has a terminal arranged at a position that does not overlap the light-transmitting plate in a direction in which the display device and the light-transmitting plate overlap, and the wiring member is connected to the terminal.

18. A display device according to any one of claims 1 to 16, A light blocking member; A module comprising: The light blocking member surrounds a space between the light transmitting member and the light transmitting plate.

19. An apparatus comprising a display device according to any one of claims 1 to 16, A control device that controls the display device; a receiving device for receiving a signal including information to be displayed in the display area; an optical device for projecting an image displayed on the display area; an imaging device that captures an image to be displayed in the display area; An audio device for inputting or outputting sound; The device further comprises at least one of the following:

20. 20. The device of claim 19, comprising mounting means for using the device as a head mounted display.

Images