Electronic device

Abstract

Provided is an electronic device capable of improving cooling performance. 【Solution means】The electronic device includes a housing, a heat generating body provided in the housing, and a cooling module provided in the housing for cooling the heat generating body. The housing is provided so as to protrude from the bottom surface and has a protruding portion extending along the width direction. The cooling module is arranged so as to be arranged with a space between each other, has discharge ports on one side surface facing each other, and a part of the discharge ports is located in the inner space of the protruding portion. A pair of fans, a heat diffusion member disposed between the pair of fans for absorbing and diffusing the heat of the heat generating body, a metal plate member laminated on the surface of the heat diffusion member between the pair of fans, and provided so as to protrude from the surface of the plate member, and a plurality of fins disposed between the discharge ports of the pair of fans in the inner space of the protruding portion.

Description

Technical Field

[0001] The present invention relates to an electronic device equipped with a cooling module.

Background Art

[0002] An electronic device such as a notebook PC is equipped with a heat generating body such as a CPU. Such an electronic device often mounts a cooling module equipped with a fan and a heat sink. The cooling module can absorb the heat generated by the heat generating body and dissipate it to the outside (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration of Patent Document 1, the left and right fans have air outlets on the side faces facing each other. The air that exits the air outlets of the left and right fans flows along the surfaces of heat pipes and vapor chambers arranged therebetween and is discharged outside the housing.

[0005] By the way, in order to increase the air volume, it is preferable for the fan to secure the maximum thickness within the range that can be installed in the housing. On the other hand, heat dissipation members such as heat pipes arranged between the left and right fans do not have the same thickness as the fan. For this reason, a space with a certain height may be formed between the heat dissipation member and the bottom surface of the housing. In this space, the air discharged from the left and right fans may simply pass through and may hardly contribute to the cooling of the heat generating body. In this case, the cooling module cannot sufficiently obtain the effect of improving the cooling performance by increasing the thickness of the fan to increase the air volume.

[0006] The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device capable of improving cooling performance.

Means for Solving the Problems

[0007] An electronic device according to an aspect of the present invention includes a housing, a heat generating body provided in the housing, and a cooling module provided in the housing for cooling the heat generating body. The housing is provided so as to protrude from the bottom surface and has a protruding portion extending along the width direction. The cooling module is arranged so as to be arranged with a space therebetween, has discharge ports on one side surfaces facing each other, and a part of the discharge ports is located in the inner space of the protruding portion. A pair of fans, a heat diffusion member disposed between the pair of fans for absorbing and diffusing the heat of the heat generating body, a metal plate member laminated on the surface of the heat diffusion member between the pair of fans, and provided so as to protrude from the surface of the plate member, and disposed between the discharge ports of the pair of fans in the inner space of the protruding portion. And a plurality of fins.

Effects of the Invention

[0008] According to the above aspect of the present invention, the cooling performance can be improved.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0010] Hereinafter, preferred embodiments of the electronic device according to the present invention will be given and described in detail with reference to the accompanying drawings.

[0011] FIG. 1 is a schematic plan view of an electronic device 10 according to an embodiment as viewed from above. As shown in FIG. 1, the electronic device 10 of the present embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid body 11 and a housing 12 are relatively rotatably connected by a hinge 14. In the present embodiment, the electronic device 10 of the notebook PC is exemplified, but the electronic device may be other than the notebook PC, for example, a tablet PC, a smartphone, or a portable game machine.

[0012] The lid body 11 is a thin and flat box-shaped housing. The lid body 11 mounts a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0013] The housing 12 is a thin and flat box. A keyboard device 18 and a touch pad 19 face the upper surface (surface 12a) of the housing 12. Hereinafter, with respect to the housing 12 and each component mounted thereon, based on the posture of the operator operating the keyboard device 18, the width direction (left and right) of the housing 12 is referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 is referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 is referred to as the Z1 and Z2 directions, respectively, for explanation. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may also be similarly referred to as the Y direction and the Z direction. These directions are directions defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0014] The housing 12 is composed of a housing member 20 that forms the upper surface and the four peripheral side surfaces, and a cover material 21 that forms the lower surface. The housing member 20 is formed by forming vertical walls 20B at the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a substantially bathtub shape with an open lower surface. The cover material 21 has a substantially flat plate shape and serves as a lid that closes the lower surface opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The vertical wall 20B may be formed on the cover material 21. In this case, the housing member 20 may be composed of only the cover plate 20A.

[0015] The hinge 14 is installed in a concave hinge placement groove 12b formed at the rear edge of the housing 12 to connect the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft 14a serving as a rotation axis is supported at both longitudinal ends of a hinge housing 14b (see FIG. 5). The hinge 14 of the present embodiment is configured in a so-called one-bar shape in which the hinge housing 14b extends along the longitudinal direction of the hinge placement groove 12b. The hinge 14 rotates with the hinge housing 14b integrated with the lid 11 and descends obliquely rearward (see FIG. 5). The hinge 14 has a structure that gains the rotation angle of the lid 11 in this way, a so-called drop-down structure. The structure of the hinge 14 may be other than the above.

[0016] FIG. 2 is a plan view schematically showing the internal structure of the housing 12. FIG. 2 is a view of the inside of the housing member 20 seen from the lower surface side with the cover material 21 removed.

[0017] As shown in FIG. 2, a cooling module 24, a motherboard 25, and a battery device 26 are housed inside the housing 12. Various electronic components, mechanical components, etc. are further provided inside the housing 12.

[0018] The motherboard (substrate) 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source of the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the motherboard 25 and extends in the X direction.

[0019] The motherboard 25 of the present embodiment mounts a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the motherboard 25 can mount various electronic components, such as a GPU (Graphics Processing Unit), a memory, a communication module, etc. For example, the upper surface (the first surface 25A) of the motherboard 25 serves as an attachment surface to the housing member 20, and the lower surface (the second surface 25B) serves as a mounting surface for the CPU 25a and the like.

[0020] Next, the cooling module 24 and the configurations related thereto will be described.

[0021] The CPU 25a is a heat generating component with the largest heat generation amount among the electronic components mounted in the housing 12. The cooling module 24 can absorb and dissipate the heat generated by the CPU 25a and discharge it outside the housing 12. The cooling module 24 may be configured to cool heat generating components other than the CPU 25a, such as a GPU.

[0022] FIG. 3 is a perspective view of the bottom surface 12c of the housing 12 as viewed obliquely from the rear. FIG. 4 is an exploded perspective view of the plate member 30 and the heat diffusion member 28 that constitute the cooling module 24. FIG. 5 is a side cross-sectional view schematically showing the internal structure of the housing 12 around the cooling module 24. FIG. 6 is a front cross-sectional view schematically showing the internal structure of the housing 12 around the cooling module 24.

[0023] As shown in FIGS. 2 and 4 to 6, the cooling module 24 includes a heat diffusion member 28, a plate member 30, and a pair of fans 32, 32.

[0024] The heat dissipation member 28 absorbs and dissipates the heat of the CPU 25a. The heat dissipation member 28 of the present embodiment has a configuration in which two heat pipes 28a are arranged in parallel in the Y direction. The two heat pipes 28a extend in the X direction between the left and right fans 32, 32. One or three or more heat pipes 28a may be used.

[0025] The heat pipe 28a is a pipe-type heat transport device. The heat pipe 28a is formed by flattening a metal pipe thinly into an elliptical cross-sectional shape and enclosing a working fluid in the inner sealed space. Examples of the working fluid include water, alternative Freon, acetone, or butane. The vicinity of the center in the longitudinal direction of the heat pipe 28a overlaps with the CPU 25a in the Z direction and is connected to the top surface of the CPU 25a. A heat conduction grease, a copper plate, or the like can be interposed between the heat pipe 28a and the CPU 25a. Thereby, the heat pipe 28a can quickly dissipate the heat of the CPU 25a with high efficiency. The heat dissipation member 28 can also be configured by a vapor chamber which is a plate-type heat transport device.

[0026] The heat dissipation member 28 can be pressed against the CPU 25a using a pressing component 34. The pressing component 34 has a pair of leaf springs 34a, 34a in the Y direction. The leaf spring 34a is connected to, for example, a thin metal frame disposed on the Z1 side of the heat dissipation member 28 at the central portion, and presses the heat dissipation member 28 against the CPU 25a through this metal frame. Both ends of the leaf spring 34a are screwed to the second surface 25B of the motherboard 25. Both ends of the leaf spring 34a on the Y2 side are screwed to the second surface 25B together with the mounting pieces 30b on the Y2 side protruding from the plate member 30.

[0027] The plate member 30 is a thin metal plate formed of a material with high thermal conductivity such as copper or aluminum. The plate member 30 of the present embodiment is a copper plate. The plate member 30 extends in the X direction between the left and right fans 32, 32. The plate member 30 is connected to the surface 28b on the Z2 side of the heat diffusion member 28 and covers the heat diffusion member 28 from the Z2 side. The plate member 30 and the heat diffusion member 28 can be joined by, for example, soldering. Thereby, the plate member 30 can efficiently receive the heat of the CPU 25a diffused by the heat diffusion member 28 and diffuse and dissipate the heat.

[0028] As shown in FIGS. 2 and 4 to 6, the plate member 30 can have a plurality of fins 36 and a flow rectifying member 38. The fins 36 and the flow rectifying member 38 project from the surface (lower surface) 30a on the Z2 side opposite to the heat diffusion member 28 side.

[0029] The fins 36 expand the surface area of the plate member 30. The fins 36 are interposed between the discharge ports 40, 40 of the left and right fans 32 within the inner space 48c of the protruding portion 48 described later. Thereby, the fins 36 can directly exchange heat with the air discharged from the discharge port 40 into the inner space 48c. The fins 36 can have, for example, a bar shape extending in the X direction. Both ends of the fins 36 can have an R shape. The fins 36 can be formed, for example, by pressing the plate member 30. The fins 36 may be formed by joining bar-shaped parts to the surface 30a by soldering or the like.

[0030] The number and arrangement of the fins 36 are not limited. In the present embodiment, the fins 36 are densely arranged at positions (regions R1) close to the discharge ports 40 of the left and right fans 32 (see FIGS. 2 and 4). In each region R1, the fins 36 are arranged in, for example, 4 or 5 rows in the Y direction with gaps between them and 3 rows in the X direction with gaps between them. The three rows of fins 36 arranged in the X direction can be arranged alternately in the Y direction. Thereby, the fins 36 in adjacent rows in the X direction are displaced in the Y direction, and the heat exchange efficiency between the air from the discharge port 40 and each fin 36 is improved.

[0031] The region (first region) R1 is a range of a predetermined width from both ends in the longitudinal direction (X direction) of the plate member 30. The region R1 faces the discharge port 40 and is a region that can directly receive the air from the discharge port 40. Thereby, the fins 36 can efficiently exchange heat with the air from the discharge port 40.

[0032] The flow rectifying member 38 is interposed between the discharge ports 40, 40 of the left and right fans 32 in the inner space 48c of the protruding portion 48. The flow rectifying member 38 is a member for smoothly guiding the air discharged from the discharge port 40 to the inner space 48c toward the exhaust port 44 described later. The flow rectifying member 38 can be formed of a metal block formed of a metal having a high thermal conductivity such as copper or aluminum. The flow rectifying member 38 of the present embodiment is the same copper block as the plate member 30. The flow rectifying member 38 can be joined to the surface 30a by, for example, soldering. The flow rectifying member 38 may be formed by, for example, subjecting the plate member 30 to press molding or embossing.

[0033] The flow rectifying member 38 can have, for example, a triangular shape with one vertex facing the Y2 direction. Thereby, the flow rectifying member 38 has a pair of flow rectifying walls 38a, 38b that are gradually inclined toward the exhaust port 44 side (Y2 direction) in the air discharge direction (X direction) from the left and right discharge ports 40. That is, the flow rectifying walls 38a, 38b extend in a direction intersecting the air discharge direction from each of the discharge ports 40 of the left and right fans 32. Specifically, in the plan view of the plate member 30 shown in FIG. 2, the flow rectifying wall 38a on the X1 side is gradually inclined in the Y2 direction toward the X2 direction. The flow rectifying wall 38b on the X2 side is gradually inclined in the Y2 direction toward the X1 direction. Thereby, the pair of flow rectifying walls 38a, 38b are arranged in an arrow shape that tapers toward the exhaust port 44.

[0034] The flow rectifying member 38 can be arranged near the center (region R2) in the longitudinal direction of the plate member 30. That is, the flow rectifying member 38 is located in the region R2 between the regions R1, R1 where the left and right fins 36 are arranged, and forms a wall portion that stands up so as to partition between the regions R1, R1.

[0035] In the plate member 30 of the configuration example shown in FIGS. 2 and 4, the region (second region) R2 is a region where the fins 36 are not provided. As a result, in the cooling module 24, it is possible to suppress the fins 36 from affecting the air rectifying action by the rectifying member 38, and the air can be guided to the exhaust port 44 more smoothly. Depending on the shape and arrangement of the fins 36, the fins 36 can also be provided around the rectifying member 38 in the region R2.

[0036] The pair of fans 32, 32 are arranged side by side in the X direction so as to straddle the heat dissipation member 28 and the plate member 30 between them, and face each other. Each fan 32 is arranged along the longitudinal direction of the protruding portion 48, and each overlaps with the protruding portion 48 in the Z direction. Each fan 32 has a discharge port 40 on the side surface 32a facing each other. That is, the discharge ports 40 of the left and right fans 32 face each other with the heat dissipation member 28 and the plate member 30 sandwiched therebetween. As a result, each fan 32 can discharge air toward the heat dissipation member 28 and the plate member 30. Each fan 32 has a suction port 41 on at least the end surface 32b on the Z2 side among the upper and lower end surfaces facing the Z direction. The suction port 41 can also be provided on the end surface on the Z1 side.

[0037] The fan 32 can be configured as a centrifugal fan that rotates an impeller 32c housed inside the housing by a motor (see FIG. 6). As a result, the fan 32 can discharge the air sucked from the suction port 41 from the discharge port 40.

[0038] As shown in FIGS. 2 and 5, the housing 12 can be provided with an exhaust port 44 formed in the standing wall 20B (outer wall 42) at the rear edge portion (Y2 side edge portion) thereof. The exhaust port 44 is an opening through which the air (warm air) discharged from the discharge port 40 of each fan 32 and flowing around the motherboard 25, the heat dissipation member 28, and the plate member 30 can be discharged to the outside of the housing 12.

[0039] In the case of this embodiment, the vertical wall 20B on the Y2 side extends along its longitudinal direction and has a hinge arrangement groove 12b recessed toward the Y1 side. The outer wall 42 is the bottom wall (front wall) of the hinge arrangement groove 12b. The exhaust port 44 is provided near the center in the longitudinal direction of the outer wall 42. The exhaust port 44 is composed of, for example, a plurality of small windows arranged in proximity in the X direction. The exhaust port 44 is located between the fans 32, 32 when based on the arrangement direction (X direction) of the left and right fans 32, 32. The exhaust port 44 is arranged on the Y2 side of the flow rectifying member 38. The vertical wall 20B can also be configured not to have the hinge arrangement groove 12b. In this case, the exhaust port 44 may be formed in the vertical wall 20B itself which is the outer wall.

[0040] As shown in FIGS. 2 and 3, the housing 12 can be provided with an air intake port 50 in a protruding portion 48 protruding from the bottom surface 12c. The air intake port 50 is an opening capable of supplying air (cool air) outside the housing 12 to the air suction port 41 of the fan 32.

[0041] The protruding portion 48 protrudes from the bottom surface 12c. The protruding portion 48 has a rectangular tube shape that is long in the X direction and flat in the Z direction. The length of the protruding portion 48 in the X direction can extend over substantially the entire length of the width of the housing 12 in the X direction. The protruding portion 48 is provided at a position closer to the Y2 side in the front-rear direction (Y direction) of the bottom surface 12c. The protruding portion 48 has a pair of side walls 48a, 48b extending along its longitudinal direction (X direction). The side wall 48b on the Y2 side is immediately in front of the outer wall 42.

[0042] On the longitudinal ends (left and right end faces) of the protrusion 48, two input / output ports 54 are provided on each side. Examples of the input / output ports 54 include those compliant with the HDMI (registered trademark) standard, those compliant with the USB3.0 communication standard, and the like. As a result, the electronic device 10 can install the input / output ports 54 that require a certain height while suppressing the apparent thickness by providing tapered surfaces on the left and right (X1, X2 sides) vertical walls 20B. The protrusion 48 also functions as a rear leg that lifts the rear part of the housing 12 placed on a mounting surface such as the upper surface of a desk higher than the front part. The reference numeral 55 in FIGS. 3, 5, and 6 is a rubber leg that serves as a leg when the electronic device 10 is placed on a mounting surface. The rubber leg 55 on the Y2 side is provided on the bottom surface of the protrusion 48.

[0043] The air intake 50 is provided at a position facing each fan 32 in the longitudinal direction of the side wall 48b on the Y2 side. The air intake 50 is composed of, for example, a plurality of small windows arranged in proximity in the X direction. The air intake 50 can also be provided on the side wall 48a on the Y1 side (see FIG. 5). The air intake 50 may be provided on the vertical wall 20B or the bottom surface 12c of the housing 12.

[0044] As shown in FIGS. 5 and 6, a part of the air outlet 40 of each fan 32 is located inside the inner space 48c of the protrusion 48. That is, a part (lower part) of the fan 32 on the Z2 side is inserted into the inner space 48c, and the lower part of the air outlet 40 is at a position where air can be discharged into the inner space 48c.

[0045] The inner space 48c is a groove-shaped space that is deeper by the height of the protrusion 48 in the Z2 direction from the inner surface 21a of the cover material 21 forming the bottom surface 12c (see FIGS. 5 and 6). That is, the inner space 48c extends the internal space of the housing 12 in the Z direction. Since a part of the fan 32 is inserted into the inner space 48c extended in this Z direction, the maximum thickness can be ensured inside the housing 12, and the air volume can be increased.

[0046] Next, the cooling effect by the cooling module 24 will be described. The dashed-dotted arrows shown in FIGS. 2, 3, 5, and 6 schematically show the air flow, and the same applies to FIG. 7.

[0047] In the electronic device 10, the heat generated by a heat-generating component such as the CPU 25a is transmitted to the heat diffusion member 28 and efficiently diffused. A part of the heat transmitted to the heat diffusion member 28 is transmitted to the plate member 30 and diffused throughout the plate member 30 including the fins 36. The left and right fans 32 suck outside air (cool air) through the intake port 50 into the suction port 41 and discharge it from the discharge port 40.

[0048] A part of the air discharged from the discharge ports 40 of the left and right fans 32 flows along the first surface 25A of the motherboard 25, cools it, and is discharged outside the housing 12 through the exhaust port 44.

[0049] Another part of the air discharged from the left and right discharge ports 40 flows between the second surface 25B of the motherboard 25 and the heat diffusion member 28 and on the surface 30a side of the plate member 30. This air cools the heat diffusion member 28, the plate member 30, the fins 36, the CPU 25a, etc., and is discharged outside the housing 12 through the exhaust port 44.

[0050] As shown in FIGS. 5 and 6, the lower part of each fan 32 is inserted into the inner space 48c of the protruding part 48, and a part of the discharge port 40 is located in the inner space 48c. Therefore, yet another part of the air discharged from the left and right discharge ports 40 is discharged into the inner space 48c. Here, in the electronic device 10, fins 36 are interposed between the left and right discharge ports 40, 40 in the inner space 48c. Therefore, the air discharged into the inner space 48c cools each fin 36 while flowing through the gaps between the fins 36, and is discharged outside the housing 12 through the exhaust port 44.

[0051] At this time, the plate member 30 is provided with a flow rectifying member 38 in the region R2 between the left and right regions R1, R1 where the fins 36 are installed. Therefore, the air discharged into the inner space 48c and cooling each fin 36 is smoothly guided to the exhaust port 44 along the flow rectifying walls 38a, 38b.

[0052] As described above, the electronic device 10 according to the present embodiment is provided so as to protrude from the bottom surface 12c of the housing 12 and has a protruding portion 48 extending along the width direction. The cooling module 24 mounted in the housing 12 includes a pair of fans 32, 32, a heat diffusion member 28, and a metal plate member 30. The fans 32 are arranged side by side with a space therebetween, and have air outlets 40 on one side surface 32a facing each other. A part of the air outlet 40 is located in the inner space 48c of the protruding portion 48. The heat diffusion member 28 is disposed between the pair of fans 32, 32 and absorbs and diffuses the heat of the heat generating body (for example, the CPU 25a). The plate member 30 is laminated on the surface 28b of the heat diffusion member 28 between the pair of fans 32, 32. The cooling module 24 further includes a plurality of fins 36 provided so as to protrude from the surface 30a of the plate member 30 and disposed between the air outlets 40, 40 of the pair of fans 32, 32 in the inner space 48c.

[0053] In this way, by providing the protruding portion 48 on a part of the bottom surface 12c of the housing 12, a part of the internal space of the housing 12 is expanded in the Z2 direction. Each fan 32 is arranged such that a part of the air outlet 40 is located in the inner space 48c. That is, the fan 32 can utilize the inner space 48c of the protruding portion 48 to expand its thickness and increase the air volume.

[0054] Here, consider a configuration (comparative example) in which the plate member 30 having fins 36 is not laminated on the surface 28b of the heat diffusion member 28. In the case of the comparative example, a blank space is formed between the air outlets 40, 40 of the left and right fans 32 in the inner space 48c without the fins 36 intervening. In this space, the air discharged from the left and right fans 32 hardly contributes to the cooling of the heat generating body and simply passes through the space and is discharged to the exhaust port 44. In particular, in this configuration, the air flowing through the space hardly contributes to the cooling of the CPU 25a, the keyboard device 18, the cover plate 20A, etc. As a result, in the configuration of the comparative example, although the thickness of the fan 32 is increased and the air volume is increased, the effect of improving the cooling performance cannot be sufficiently obtained.

[0055] On the one hand, the electronic device 10 of the present embodiment arranges a plate member 30 having fins 36 between the heat dissipation member 28 and the bottom surface of the inner space 48c. Thereby, the cooling module 24 can cool each fin 36 with the air discharged from the left and right discharge ports 40 into the inner space 48c. As a result, the electronic device 10 can effectively utilize the capacity of the fan 32 with an increased thickness and improve the cooling performance. That is, by cooling the fins 36 with the air flowing through the inner space 48c, the cooling efficiency of the CPU 25a and the heat dissipation member 28 is improved, and the keyboard device 18, the cover plate 20A, etc. can also be cooled.

[0056] The surface 30a of the plate member 30 can have a flow rectifying member 38 that discharges air from the discharge ports 40 of the pair of fans 32, 32 respectively and directs the air flowing in the inner space 48c toward the exhaust port 44 provided in the outer wall 42. Then, the air that has cooled each fin 36 is more smoothly guided to the exhaust port 44 by the flow rectifying member 38. For this reason, the cooling module 24 has a smoother flow of the air flowing from the discharge port 40 around the fins 36 to the exhaust port 44, and the cooling capacity is further improved.

[0057] That is, in the inner space 48c, each fin 36 may become a ventilation resistance to the air from the discharge port 40. However, by providing the flow rectifying member 38 in the inner space 48c, the flow toward the exhaust port 44 becomes smooth, and a decrease in wind speed and air volume can be suppressed. Furthermore, the flow rectifying member 38 also functions as a partition wall that suppresses the collision of the air discharged from the left and right fans 32 and the decrease in wind speed and air volume. The flow rectifying member 38 may be omitted depending on, for example, the arrangement or shape of the fins 36, or the arrangement of the exhaust port 44.

[0058] Thus, on the surface 30a of the plate member 30, a pair of regions R1 where a plurality of fins 36 are provided at positions respectively facing the discharge ports 40 of the fans 32, and a region R2 between the regions R1, R1 can be formed. In the region R2, straightening walls 38a, 38b extending in a direction intersecting the discharge direction of the air from each discharge port 40 of the fans 32 are provided. Thereby, the air that has cooled each fin 36 can be more smoothly guided to the exhaust port 44 by the straightening walls 38a, 38b. The straightening member 38 may have a configuration having, for example, a bar-shaped straightening wall along the Y direction.

[0059] At this time, fins 36 may not be provided in the region R2. That is, each fin 36 has a bar shape extending in the discharge direction of the air from the discharge port 40. For this reason, if there are fins 36 around the straightening member 38, the straightening effect by the straightening member 38 may be reduced. Therefore, it is preferable that the plate member 30 does not provide fins 36 in the region R2, particularly when using bar-shaped fins 36.

[0060] FIG. 7 is a schematic plan view of the plate member 60 according to the modified example as viewed from the Z2 side.

[0061] The plate member 60 shown in FIG. 7 includes a plurality of fins 62 and a straightening member 64 having a different configuration from the fins 36 and the straightening member 38 of the plate member 30 shown in FIGS. 2 and 4. The plate member 60 can also be made of, for example, a copper plate.

[0062] The fin 62 is a substantially square protrusion. The fin 62 protrudes from the surface 60a on the Z2 side of the plate member 60. The fin 62 can be formed, for example, by performing press forming on the plate member 60. The fin 62 may also be formed by joining a block-shaped component to the surface 60a by soldering or the like.

[0063] The rectifying member 64 has a pair of rectifying walls 64a and 64b that gradually incline toward the exhaust port 44 side (Y2 direction) in the air discharge direction (X direction) from the discharge ports 40 of the left and right fans 32, 32. The pair of rectifying walls 64a and 64b are also arranged in an arrow shape that tapers toward the exhaust port 44. The rectifying member 64 can be formed, for example, by performing a cut-and-raise process on the plate member 60.

[0064] By laminating such a plate member 60 on the surface 28b of the heat diffusion member 28, the fins 62 and the rectifying member 64 can be interposed between the discharge ports 40, 40 of the left and right fans 32 in the inner space 48c. Thus, also in the cooling module 24 provided with the plate member 60, the capacity of the fan 32 with an increased thickness can be effectively utilized using the inner space 48c, and the cooling performance can be improved.

[0065] Note that the present invention is not limited to the above-described embodiments, and it goes without saying that it can be freely changed without departing from the gist of the present invention.

[0066] The plate members 30 and 60 may omit the rectifying members 38 and 64 and have fins 36 and 62 installed over the entire surfaces 30a and 60a. However, in a configuration where the air discharge direction from the discharge port 40 of the fan 32 and the opening direction of the exhaust port 44 intersect as shown in FIG. 2, it is preferable to provide the rectifying members 38 and 64 to smooth the air flow from the discharge port 40 to the exhaust port 44. This is because an improvement in the cooling capacity is expected due to an increase in the air volume and air speed of the fan 32.

Description of Reference Numerals

[0067] 10 Electronic device 11 Cover 12 Housing 24 Cooling module 25 Motherboard 25a CPU 28 Heat diffusion member 30, 60 Plate members 32 Fan 36, 62 Fins 38, 64 Rectifying member 38a, 38b, 64a, 64b Rectifying wall 40 Discharge port 44 Exhaust port 48 Protrusion 48c Inner space

Claims

1. An electronic device, A housing and A heating element provided within the housing; a cooling module provided in the housing and configured to cool the heat generating element; Equipped with The housing has a protrusion that protrudes from a bottom surface and extends along a width direction, The cooling module includes: a pair of fans arranged side by side with a space between them, the fans having outlets on one side surfaces facing each other, with a portion of the outlet opening being located within the inner space of the protrusion; a heat diffusion member disposed between the pair of fans and configured to absorb and diffuse heat from the heat generating element; a metal plate member laminated on a surface of the heat diffusion member between the pair of fans; a plurality of fins provided so as to protrude from a surface of the plate member and disposed between the outlets of the pair of fans within an inner space of the protruding portion; have 1. An electronic device comprising:

2. 2. The electronic device according to claim 1, The housing includes: An outer wall extending along a longitudinal direction of the protrusion; an exhaust port provided in the outer wall and positioned between the pair of fans when the arrangement direction of the pair of fans is taken as a reference; having The surface of the plate member is provided with a pair of first regions in which the plurality of fins are provided and which face the outlets of the pair of fans, respectively; a second region between the pair of first regions; is established, The second area is provided with a straightening wall extending in a direction intersecting the direction in which air is discharged from each of the outlets of the pair of fans.

1. An electronic device comprising:

3. 3. The electronic device according to claim 2, The flow straightening walls are provided in pairs, The pair of straightening walls are gradually inclined toward the exhaust port in a direction in which air is discharged from each of the outlets of the pair of fans.

1. An electronic device comprising:

4. 4. The electronic device according to claim 3, The pair of flow straightening walls are arranged in an arrow shape tapering toward the exhaust port.

1. An electronic device comprising:

5. The electronic device according to any one of claims 2 to 4, The second region is not provided with the fins.

1. An electronic device comprising:

6. 2. The electronic device according to claim 1, The housing includes: An outer wall extending along a longitudinal direction of the protrusion; an exhaust port provided in the outer wall and located between the pair of fans with respect to an arrangement direction of the pair of fans; having A straightening member is provided on the surface of the plate member to direct the air discharged from the outlets of the pair of fans and flowing within the inner space of the protrusion toward the exhaust port.

1. An electronic device comprising:

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