Beam, Swing Element, and Optical Scanning Device

Abstract

To provide a beam that can be fixed to a substrate with a sufficient strength in a short time, an oscillation element including the same, and an optical scanner.SOLUTION: A beam comprises: a base connection part that is connected with a base substrate; a coil connection part that is connected with a coil substrate; and a beam part that connects the base connection part and the coil connection part to each other. At least one of the base connection part and the coil connection part has a soldering part that is soldered to the base substrate or the coil substrate. The soldering part includes a first connection part and a second connection part adjacent to the first connection part. When a direction in which the first connection part and the second connection part are adjacent to each other is an adjacent direction, the area of a cross section of the first connection part orthogonal to the adjacent direction is smaller than the area of a cross section of the second connection part orthogonal to the adjacent direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a beam, a swing element, and an optical scanning device.

Background Art

[0002] Conventionally, in a distance measuring device or the like, an optical scanning device that changes the traveling direction of light by reflecting light from a light source with a mirror is used to scan light. Further, conventionally, in such an optical scanning device, an electromagnetic drive type element using a Lorentz force generated when an electric current flows in a magnetic field is used to swing a mirror.

[0003] For example, the micro mechanical device disclosed in Patent Document 1 includes a movable part, a fixed part, a pair of beam parts that support the movable part on the fixed part, and a pair of permanent magnets. The movable part includes a deflection mirror and a coil substrate.

[0004] In the above micro mechanical device, when an alternating current is applied to a coil formed on a coil substrate via a beam part from a pin provided on a fixed part, a Lorentz force is generated by the alternating current and a magnetic field formed by a permanent magnet. Due to this Lorentz force, the movable part swings. That is, the deflection mirror swings. Thereby, the traveling direction of the light reflected by the deflection mirror can be changed.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] As described above, in the micro mechanical device of Patent Document 1, current is supplied from the pins of the fixed part to the coil substrate via the beam part. That is, in the micro mechanical device of Patent Document 1, the beam part that supports the mirror so as to be swingable also serves to supply current. In a conventional device having such a configuration, it is necessary to fix the beam for swinging the mirror to the substrate (the coil substrate and the fixed part in the micro mechanical device of Patent Document 1) with a conductive adhesive.

[0007] However, in adhesion using a conductive adhesive, the adhesion strength tends to be weaker than adhesion using a normal adhesive. Also, when adhering the beam to the substrate with an adhesive, it is difficult to proceed to the next process until the adhesive cures, so it is difficult to shorten the manufacturing time.

[0008] Therefore, an example of the object of the present invention is to provide a beam that can be fixed to a substrate in a short time with sufficient strength, and a swinging element and an optical scanning device including the same.

Means for Solving the Problems

[0009] (1) To achieve the above object, a beam according to one aspect of the present invention is a beam that connects a base substrate and a coil substrate and supplies a current for swinging the coil substrate in a swinging element that swings a mirror that reflects light in an optical scanning device. The beam includes a base connection part connected to the base substrate, a coil connection part connected to the coil substrate, and a beam part that connects the base connection part and the coil connection part. At least one of the base connection part and the coil connection part has a soldering part that is soldered to the base substrate or the coil substrate. The soldering part includes a first connection part and a second connection part adjacent to the first connection part. When the direction in which the first connection part and the second connection part are adjacent is defined as the adjacent direction, the area of the cross section orthogonal to the adjacent direction of the first connection part is smaller than the area of the cross section orthogonal to the adjacent direction of the second connection part.

[0010] The beam having the above configuration is electrically and mechanically connected to the base substrate or the coil substrate by soldering. In this case, compared with the case of adhering the beam to the substrate using a conductive adhesive as in the prior art, the beam can be connected to the base substrate or the coil substrate in a short time with sufficient strength.

[0011] Also, in the soldering portion, the area of the cross-section orthogonal to the adjacent direction of the first connection portion is smaller than the area of the cross-section orthogonal to the adjacent direction of the second connection portion. By setting the cross-sectional areas of the first connection portion and the second connection portion as described above, unevenness can be formed in the soldering portion. Thereby, in the soldering portion, a sufficient contact area between the solder and the soldering portion can be ensured. As a result, the soldering portion can be surely connected to the base substrate or the coil substrate.

[0012] (2) The thickness of the first connection portion may be smaller than the thickness of the second connection portion. By changing the thicknesses of the first connection portion and the second connection portion in this way, the contact area between the solder and the soldering portion can be easily increased.

[0013] (3) The width of the first connection portion may be smaller than the width of the second connection portion. By changing the widths of the first connection portion and the second connection portion in this way, the contact area between the solder and the soldering portion can be easily increased.

[0014] (4) The coil connection portion may have an extension portion provided in a direction away from the beam portion and a soldering portion provided via the extension portion. In this case, the soldering portion can be soldered to the coil substrate at a position sufficiently separated from the beam portion. Thereby, when the coil substrate and the mirror swing, it is possible to prevent an excessive load from being applied to the connection portion between the soldering portion and the coil substrate.

[0015] (5) The surface roughness of the first connection portion may be rougher than that of the second connection portion. In this case, on the surface of the first connection portion, the contact area with the solder can be made sufficiently large. Thereby, the first connection portion can be surely soldered to the base substrate or the coil substrate.

[0016] (6) The first connection portion may be an etching portion. For example, by forming the first connection portion by half etching, the surface roughness of the first connection portion can be moderately roughened.

[0017] (7) The beam may be made of stainless steel. In this case, sufficient strength can be ensured.

[0018] (8) The swing element in one aspect of the present invention includes a movable part including a mirror that reflects light and a coil substrate, a pair of the beams provided so as to extend in opposite directions from the coil substrate and supporting the coil substrate by coil connection portions, a base substrate that supports the base connection portions of the respective beams, and a magnetic field forming portion that forms a magnetic field at the position of the coil substrate. By supplying a current from the base substrate to the coil substrate via the pair of beams, the movable part swings about the beam portions of the pair of beams.

[0019] In the swing element having the above configuration, a Lorentz force is generated by the current flowing through the coil substrate and the magnetic field formed by the magnetic field forming portion, and the movable part can be swung about the beam portions of the pair of beams. Thereby, the mirror can be swung.

[0020] (9) A mirror may be provided on one side in the thickness direction of the coil substrate, and the coil connection portions of the respective beams may be provided on one side or the other side in the thickness direction of the coil substrate. In this case, the swing of the coil substrate can be appropriately transmitted to the mirror, so that the mirror can be appropriately swung.

[0021] (10) In the coil substrate, notch portions may be formed in portions facing the beam portions of the pair of beams, respectively. According to this configuration, even if a part of the beam portion is positioned on one side of the coil substrate in the thickness direction of the coil substrate, it is possible to prevent the coil substrate and the beam portion from coming into contact with each other. In this case, the coil connection portion of one beam and the coil connection portion of the other beam can be brought sufficiently close to each other. As a result, it becomes possible to miniaturize the rocking element in the axial direction of the beam (the length direction of the beam portion).

[0022] (11) The optical scanning device according to one aspect of the present invention includes the above-described rocking element and a light projecting unit that outputs measurement light to the mirror of the rocking element.

[0023] In the optical scanning device having the above configuration, while rocking the mirror in the rocking element, by irradiating the mirror with measurement light from the light projecting unit, the measurement light reflected by the mirror can be scanned within a predetermined scanning range.

Effects of the Invention

[0024] According to the present invention, the beam can be fixed to the substrate in a short time with sufficient strength.

Brief Description of the Drawings

[0025]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

[0026] Hereinafter, a beam according to an embodiment of the present invention, a swing element including the same, and an optical scanning device will be described with reference to the drawings.

[0027] (Configuration of the optical scanning device) FIG. 1 is a schematic diagram showing an optical scanning device according to an embodiment of the present invention. As shown in FIG. 1, the optical scanning device 1 includes a swing element 10 having a mirror 100 and a light projecting unit 102 that outputs measurement light (such as laser light) to the mirror 100. The mirror 100 is provided in the swing element 10 so as to be swingable about a beam portion 28 of a beam 20 described later as an axis. The light projecting unit 102 can be configured in the same manner as the light projecting unit of a known optical scanning device, and includes, for example, a light emitting element such as a laser diode.

[0028] In the optical scanning device 1 according to the present embodiment, by irradiating the mirror 100 with measurement light from the light projecting unit 102 while swinging the mirror 100 by the swing element 10, the traveling direction of the measurement light reflected by the mirror 100 can be changed. Thereby, the measurement light can be deflected and scanned within a predetermined scanning range. Hereinafter, the swing element 10 will be described.

[0029] (Configuration of the swing element) FIGS. 2 and 3 are diagrams for explaining the configuration of the swing element 10. Specifically, FIG. 2 is an exploded perspective view showing the swing element 10, FIG. 3(a) is a plan view showing the swing element 10, FIG. 3(b) is a cross-sectional view showing the B-B portion of FIG. 3(a), and FIG. 3(c) is a cross-sectional view showing the C-C portion of FIG. 3(a).

[0030] As shown in FIGS. 1 to 3, the swing element 10 includes a yoke 12, a pair of permanent magnets 14 supported by the yoke 12, a base substrate 16 supported by the yoke 12, a movable part 18 provided at the central part of the base substrate 16, and a pair of beams 20 connected to the base substrate 16 and supporting the movable part 18. The movable part 18 includes a coil substrate 22 and a mirror 100.

[0031] As shown in FIGS. 2 and 3, in the present embodiment, the yoke 12 has a plate-like part 12a and a pair of protruding parts 12b protruding upward from the plate-like part 12a. A concave part 12c is formed between the pair of protruding parts 12b at the central part of the plate-like part 12a. In the present embodiment, the pair of permanent magnets 14 has a rectangular parallelepiped shape. The pair of permanent magnets 14 is held in the concave part 12c of the yoke 12. In the present embodiment, the yoke 12 and the pair of permanent magnets 14 function as a magnetic field forming part, and form a magnetic field in the space including the coil substrate 22.

[0032] The base substrate 16 is made of, for example, a resin material. The base substrate 16 may be a single-layer substrate or a multi-layer substrate. In the present embodiment, the base substrate 16 is fixed to the yoke 12 by a plurality of screws 17.

[0033] A through hole 16a is formed at the central part of the base substrate 16. The pair of protruding parts 12b of the yoke 12 and the pair of permanent magnets 14 are arranged in the through hole 16a. A pair of notch parts 16b are formed at the edge part of the through hole 16a. The pair of notch parts 16b are formed at the part of the base substrate 16 facing a beam part 28 (see FIG. 1) described later.

[0034] As shown in FIG. 2, a plurality of lands 16c are formed on the upper surface of the base substrate 16. As will be described later, the base connection portion 24 (see FIG. 3) of the beam 20 is connected to the land 16c. In the present embodiment, each beam 20 may be electrically connected to a wiring (not shown) formed on the base substrate 16 via any one of the lands 16c. Therefore, a predetermined number of the plurality of lands 16c may not be electrically connected to the wiring formed on the base substrate 16.

[0035] As shown in FIGS. 1 and 3, the movable portion 18 and a pair of beams 20 are provided so as to cross the central portion of the through hole 16a of the base substrate 16. In the present embodiment, the movable portion 18 is provided at the central portion of the through hole 16a so as to be positioned between the pair of permanent magnets 14 in a plan view. Further, the movable portion 18 is supported by the base substrate 16 via a pair of beams 20. The pair of beams 20 are provided so as to extend in opposite directions from the movable portion 18 (coil substrate 22) along a direction orthogonal to the thickness direction of the coil substrate 22. In other words, the pair of beams 20 are provided so as to extend in opposite directions from the coil substrate 22 when viewed from the winding axis direction of a pattern coil (not shown) formed on the coil substrate 22 described later.

[0036] FIG. 4 is a perspective view of the movable portion 18 viewed from the back side (opposite side to FIG. 1). The coil substrate 22 is made of, for example, a resin material. The coil substrate 22 may be a single-layer substrate or a multi-layer substrate. In the present embodiment, a mirror 100 is fixed to the surface of the coil substrate 22. In the present embodiment, the mirror 100 is fixed to the surface of the coil substrate 22 by, for example, an adhesive or a screw.

[0037] As shown in FIGS. 2 and 4, a pair of cutout portions 22a are formed at the outer edge of the coil substrate 22. The pair of cutout portions 22a are formed at portions facing a beam portion 28 (see FIG. 1) described later.

[0038] Although illustration is omitted, a pattern coil is formed on the coil substrate 22. As shown in FIG. 4, a plurality of lands 22b are formed on the back surface of the coil substrate 22. As will be described later, the coil connection portion 26 (see FIG. 6) of the beam 20 is connected to the land 22b. In the present embodiment, one beam 20 is electrically connected to one end of the pattern coil, and the other beam 20 is electrically connected to the other end of the pattern coil. Therefore, a predetermined number of the plurality of lands 22b may not be electrically connected to the pattern coil formed on the coil substrate 22.

[0039] FIG. 5 is a perspective view showing the beam 20. The beam 20 is made of a metal material such as stainless steel, for example. Note that the material of the beam 20 is preferably a non-magnetic material.

[0040] The beam 20 has a base connection portion 24, a coil connection portion 26, and a beam portion 28 that connects the base connection portion 24 and the coil connection portion 26. In the present embodiment, the base connection portion 24, the coil connection portion 26, and the beam portion 28 are each formed in a plate shape. Further, the beam portion 28 has an elongated shape.

[0041] The base connection portion 24 has an extension portion 40 and a soldering portion 42. The extension portion 40 is provided so as to extend in a direction away from the beam portion 28. In the present embodiment, the base connection portion 24 has a pair of extension portions 40 and a pair of soldering portions 42. Each of the pair of extension portions 40 is provided so as to extend in a direction away from the beam portion 28. In the present embodiment, the pair of extension portions 40 are provided so as to extend in a direction away from each other in a direction orthogonal to the length direction of the beam portion 28.

[0042] Each soldering portion 42 is provided at the tip of the extension portion 40. The soldering portion 42 has a first connection portion 42a and a second connection portion 42b provided so as to be arranged along one direction. In the present embodiment, each first connection portion 42a is provided so as to be sandwiched between a pair of second connection portions 42b.

[0043] When the direction in which the first connection part 42a and the second connection part 42b are adjacent is defined as the adjacent direction A, the area of the cross-section of the first connection part 42a orthogonal to the adjacent direction A is smaller than the area of the cross-section of the second connection part 42b orthogonal to the adjacent direction A. In the present embodiment, the thickness of the first connection part 42a is smaller than the thickness of the second connection part 42b. Also, in the present embodiment, the first connection part 42a and the second connection part 42b are formed such that one surface in the thickness direction of the soldering part 42 is a flat surface and the other surface is a concavo-convex surface.

[0044] Note that in the present embodiment, the widths of the first connection part 42a and the second connection part 42b are substantially equal. In this specification, the width direction of the soldering part 42 (the width direction of the first connection part 42a and the second connection part 42b) means the direction orthogonal to the thickness direction and the adjacent direction A of the soldering part 42.

[0045] The coil connection part 26 has an extension part 60 and a soldering part 62. The extension part 60 is provided so as to extend in a direction away from the beam part 28. In the present embodiment, the coil connection part 26 has a pair of extension parts 60 and a pair of soldering parts 62. Each of the pair of extension parts 60 is provided so as to extend in a direction away from the beam part 28. In the present embodiment, the pair of extension parts 60 are provided so as to extend in a direction away from each other in a direction orthogonal to the length direction of the beam part 28.

[0046] Each soldering part 62 is provided at the tip of the extension part 60. In the present embodiment, each soldering part 62 is provided so as to extend from the tip of the extension part 60 toward the base connection part 24 side. The soldering part 62 has a first connection part 62a and a second connection part 62b provided so as to be arranged along one direction. In the present embodiment, each first connection part 62a is provided so as to be sandwiched between a pair of second connection parts 62b.

[0047] When the direction in which the first connection part 62a and the second connection part 62b are adjacent is defined as the adjacent direction B, the area of the cross-section orthogonal to the adjacent direction B of the first connection part 62a is smaller than the area of the cross-section orthogonal to the adjacent direction B of the second connection part 62b. In the present embodiment, the thickness of the first connection part 62a is smaller than the thickness of the second connection part 62b. In the present embodiment, the first connection part 62a and the second connection part 62b are formed such that one surface in the thickness direction of the soldering part 62 is a flat surface and the other surface is a concavo-convex surface. Note that, in the present embodiment, the soldering parts 42 and 62 are formed such that the concavo-convex surfaces of the soldering part 42 face one side and the concavo-convex surfaces of the soldering part 62 face the other side in the thickness direction of the beam 20.

[0048] Note that, in the present embodiment, the widths of the first connection part 62a and the second connection part 62b are substantially equal. In this specification, the width direction of the soldering part 62 (the width directions of the first connection part 62a and the second connection part 62b) means the direction orthogonal to the thickness direction and the adjacent direction B of the soldering part 62.

[0049] Although detailed description is omitted, the beam 20 can be manufactured, for example, from a metal plate having a predetermined thickness using an etching method. Also, the first connection parts 42a and 62a can be formed, for example, by half-etching. In this case, the surface roughness of the first connection part 42a becomes rougher than the surface roughness of the second connection part 42b. Similarly, the surface roughness of the first connection part 62a becomes rougher than the surface roughness of the second connection part 62b. Note that the surface roughness of the soldering parts 42 and 62 means the roughness of the portions that become concavo-convex surfaces among the soldering parts 42 and 62. In the present embodiment, the surface roughness means the maximum height Rz (JIS B0651:2001) measured using a stylus with a tip radius of 2 μm and setting the measurement force to 0.75 mN.

[0050] As shown in FIGS. 1 and 3, the base connection portion 24 of each beam 20 is connected to the base substrate 16 by solder 30. In the present embodiment, when connecting the base connection portion 24 to the base substrate 16, each soldering portion 42 is disposed between a pair of lands 16c (see FIG. 2) such that the flat surface of each soldering portion 42 faces the base substrate 16 side. In that state, the soldering portion 42 is soldered to the pair of lands 16c. Thereby, the beam 20 is mechanically and electrically connected to the base substrate 16. In the present embodiment, the solder 30 is provided so as to straddle the soldering portion 42. That is, the solder 30 bridges a pair of adjacent lands 16c straddling the soldering portion 42, and mechanically and electrically connects the beam 20 (soldering portion 42) to the base substrate 16.

[0051] FIG. 6 is a perspective view of the movable portion 18 and the beam 20 as viewed from the back side (opposite side to FIG. 1). As shown in FIG. 6, the coil connection portion 26 of each beam 20 is connected to the coil substrate 22 by solder 32. In the present embodiment, when connecting the coil connection portion 26 to the coil substrate 22, each soldering portion 62 is disposed between a pair of lands 22b (see FIG. 4) such that the flat surface of each soldering portion 62 faces the coil substrate 22 side. In that state, the soldering portion 62 is soldered to the pair of lands 22b. Thereby, the beam 20 is mechanically and electrically connected to the coil substrate 22. In the present embodiment, the solder 32 is provided so as to straddle the soldering portion 62. That is, the solder 32 bridges a pair of adjacent lands 22b straddling the soldering portion 62, and mechanically and electrically connects the beam 20 (soldering portion 62) to the coil substrate 22.

[0052] As described above, as shown in FIG. 1, the movable part 18 is supported by the base substrate 16 via a pair of beams 20. In the present embodiment, an AC power supply (not shown) is connected to the base substrate 16, and an AC current is supplied from the AC power supply to a pattern coil (not shown) of the coil substrate 22 (see FIG. 2) via the wiring formed on the base substrate 16 and the pair of beams 20. At this time, a Lorentz force is generated by the current flowing through the pattern coil and the magnetic field formed by the yoke 12 and the pair of permanent magnets 14, and the movable part 18 swings about the beam part 28 as an axis.

[0053] (Effect of the present embodiment) In the present embodiment, as described above, the beam 20 is electrically and mechanically connected to the base substrate 16 and the coil substrate 22 by soldering. In this case, compared with the case where the beam is adhered to the substrate using a conductive adhesive as in the prior art, the beam 20 can be connected to the base substrate 16 and the coil substrate 22 in a short time with sufficient strength.

[0054] Further, in the present embodiment, in the soldering part 62, the area of the cross section orthogonal to the adjacent direction B of the first connection part 62a is smaller than the area of the cross section orthogonal to the adjacent direction B of the second connection part 62b. By setting the cross-sectional areas of the first connection part 62a and the second connection part 62b as described above, an uneven surface can be formed on the surface of the soldering part 62. Thereby, in the soldering part 62, a sufficient contact area between the solder 32 and the soldering part 62 can be ensured. As a result, the soldering part 62 can be reliably connected to the coil substrate 22. The same applies to the soldering part 42.

[0055] Further, in the present embodiment, the surface roughness of the first connection part 62a is rougher than the surface roughness of the second connection part 62b. Thereby, on the surface of the first connection part 62a that becomes a recess, the contact area with the solder 32 can be made sufficiently large. Thereby, the first connection part 62a can be reliably soldered to the coil substrate 22. The same applies to the first connection part 42a of the soldering part 42.

[0056] In addition, in the present embodiment, an extension portion 60 is provided so as to extend in a direction away from the beam portion 28, and a soldering portion 62 is provided at the tip of the extension portion 60. Thereby, the soldering portion 62 can be soldered to the coil substrate 22 at a position sufficiently away from the beam portion 28. In this case, when the movable portion 18 swings, it is possible to prevent an excessive load from being applied to the connection portion between the soldering portion 62 and the coil substrate 22. The same applies to the connection portion between the soldering portion 42 and the base substrate 16.

[0057] In addition, in the present embodiment, in the coil substrate 22, a notch portion 22a is formed in a portion facing the beam portion 28 of the beam 20. Thereby, even if a part of the beam portion 28 is positioned on one side of the coil substrate 22 in the thickness direction of the coil substrate 22, it is possible to prevent the coil substrate 22 and the beam portion 28 from coming into contact with each other. In this case, the coil connection portion 26 of one beam 20 and the coil connection portion 26 of the other beam 20 can be brought sufficiently close to each other. As a result, it becomes possible to miniaturize the swing element 10 (optical scanning device 1) in the axial direction of the beam 20 (the length direction of the beam portion 28).

[0058] Similarly, in the base substrate 16, a notch portion 16b is formed in a portion facing the beam portion 28 of the beam 20. Thereby, even if a part of the beam portion 28 is positioned on one side of the base substrate 16 in the thickness direction of the base substrate 16, it is possible to prevent the base substrate 16 and the beam portion 28 from coming into contact with each other. In this case, in the axial direction of the beam 20 (the length direction of the beam portion 28), it is possible to sufficiently secure in the base substrate 16 the area necessary for forming a land 16c having a sufficient length or the area necessary for forming a hole for the screw 17 without extending the base substrate 16. As a result, it becomes possible to miniaturize the swing element 10 (optical scanning device 1) in the axial direction of the beam 20 (the length direction of the beam portion 28).

[0059] In this embodiment, each soldering portion 62 is provided so as to extend from the tip of the extension portion 60 toward the base connection portion 24. In this case, it is possible to surely prevent the solder 32 for connecting one beam 20 to the coil substrate 22 and the solder 32 for connecting the other beam 20 to the coil substrate 22 from contacting each other. As a result, even when the tips of the beam portions 28 of the pair of beams 20 are brought close to each other, it is possible to sufficiently prevent the one beam 20 and the other beam 20 from being directly connected by the solder 32. As a result, it is possible to sufficiently increase the length of the beam portion 28 without increasing the length of the swing element 10 (optical scanning device 1) in the axial direction of the beam 20 (the length direction of the beam portion 28).

[0060] (Other embodiments) In the above-described embodiment, the plurality of first connection portions 42a and the plurality of second connection portions 42b are provided so as to be arranged alternately, and the plurality of first connection portions 62a and the plurality of second connection portions 62b are provided so as to be arranged alternately. However, as shown in FIG. 7, in the soldering portion 42, it is sufficient that at least one first connection portion 42a and one second connection portion 42b are provided so as to be adjacent to each other. Similarly, in the soldering portion 62, it is sufficient that at least one first connection portion 62a and one second connection portion 62b are provided so as to be adjacent to each other.

[0061] In the above-described embodiment, the width of the first connection portion 42a and the width of the second connection portion 42b are substantially equal, and the width of the first connection portion 62a and the width of the second connection portion 62b are substantially equal. However, the width of the first connection portion 42a may be smaller than the width of the second connection portion 42b. In this case, the thickness of the first connection portion 42a and the thickness of the second connection portion 42b may be substantially equal. Also, the width of the first connection portion 62a may be smaller than the width of the second connection portion 62b. In this case, the thickness of the first connection portion 62a and the thickness of the second connection portion 62b may be substantially equal.

[0062] In the above-described embodiment, a pair of beams 20 are connected to one surface of the coil substrate 22 in the thickness direction, and the mirror 100 is provided so as to cover the other surface of the coil substrate 22 in the thickness direction. However, the positional relationship among the beam 20, the coil substrate 22, and the mirror 100 is not limited to the above example. FIG. 8 is a diagram showing another arrangement example of the beam 20, the coil substrate 22, and the mirror 100.

[0063] For example, as shown in FIG. 8(a), a pair of beams 20 are connected to one surface of the coil substrate 22, and the mirror 100 may be held by the coil substrate 22 such that the other surface of the coil substrate 22 and the reflecting surface of the mirror 100 are substantially flush. Further, as shown in FIG. 8(b), the mirror 100 may be provided so as to be sandwiched between the beam 20 and the coil substrate 22. In this case, for example, a through hole 22c for exposing the mirror 100 is formed in the coil substrate 22.

[0064] Further, for example, as shown in FIGS. 8(c) and 8(d), a pair of beams 20 and a mirror 100 may be provided on one side in the thickness direction of the coil substrate 22. In the example shown in FIG. 8(c), a pair of beams 20 and a mirror 100 are connected to one side in the thickness direction of the coil substrate 22 such that the surface of the beam 20, the surface of the coil substrate 22, and the reflecting surface of the mirror 100 are substantially flush. In the example shown in FIG. 8(d), a pair of beams 20 may be sandwiched between the coil substrate 22 and the mirror 100.

[0065] In the above-described embodiment, the case where the rocking element 10 includes the mirror 100 as a member separate from the beam 20 or the coil substrate 22 has been described. However, for example, a mirror may be integrally formed on the beam 20 by performing plating, vapor deposition, mirror finishing, or the like on the beam 20. Similarly, a mirror may be integrally formed on the coil substrate 22.

[0066] In the above-described embodiment, the case where the base connection portion 24 is soldered to the base substrate 16 and the coil connection portion 26 is soldered to the coil substrate 22 has been described. However, one of the base connection portion 24 or the coil connection portion 26 may be connected to the substrate not by soldering but by an adhesive.

Explanation of Reference Numerals

[0067] 1 Optical scanning device 10 Oscillating element 12 Yoke 14 Permanent magnet 16 Base substrate 18 Movable part 20 Beam 22 Coil substrate 22a Notch portion 24 Base connection portion 26 Coil connection portion 28 Beam portion 30,32 Solder 40,60 Extension portion 42,62 Soldering portion 42a,62a First connection portion 42b,62b Second connection portion 100 Mirror 102 Light projecting portion

Claims

1. In an oscillating element that oscillates a mirror that reflects light in an optical scanning device, a beam that connects a base substrate and a coil substrate and supplies a current for oscillating the coil substrate from the base substrate to the coil substrate, comprising a base connection portion connected to the base substrate, a coil connection portion connected to the coil substrate, and a beam portion connecting the base connection portion and the coil connection portion, at least one of the base connection portion and the coil connection portion has a soldering portion soldered to the base substrate or the coil substrate, the soldering portion includes a first connection portion and a second connection portion adjacent to the first connection portion, when the direction in which the first connection portion and the second connection portion are adjacent is defined as the adjacent direction, the area of a cross-section perpendicular to the adjacent direction of the first connection portion is smaller than the area of a cross-section perpendicular to the adjacent direction of the second connection portion. A beam.

2. The beam according to claim 1, wherein the thickness of the first connection portion is smaller than the thickness of the second connection portion.

3. The beam according to claim 1 or 2, wherein the width of the first connection portion is smaller than the width of the second connection portion.

4. The beam according to any one of claims 1 to 3, wherein the coil connection portion has an extension portion provided in a direction away from the beam portion and the soldering portion provided via the extension portion.

5. The beam according to any one of claims 1 to 4, wherein the surface roughness of the first connection portion is rougher than the surface roughness of the second connection portion.

6. The beam according to any one of claims 1 to 5, wherein the first connection portion is an etching portion.

7. The beam according to any one of claims 1 to 6, made of stainless steel.

8. A movable part including a mirror that reflects light and a coil substrate, a pair of beams according to any one of claims 1 to 7, provided so as to extend in opposite directions from the coil substrate and supporting the coil substrate by the coil connection portion, a base substrate that supports the base connection portion of each beam, and a magnetic field forming portion that forms a magnetic field at the position of the coil substrate. An oscillating element that oscillates the movable part about the beam portion of the pair of beams by supplying a current from the base substrate to the coil substrate via the pair of beams.

9. ​ The mirror is provided on one side in the thickness direction of the coil substrate, and the coil connection portions of the respective beams are provided on the one side or the other side in the thickness direction of the coil substrate. The rocking element according to claim 8.

10. In the coil substrate, notch portions are respectively formed in portions facing the beam portions of the pair of beams. The rocking element according to claim 8 or 9.

11. The rocking element according to claim 8 or 9, a light projecting unit that outputs measurement light to the mirror of the rocking element, A light scanning device comprising:

Images