Electronic device, terminal device, and radar

Abstract

An electronic device, a terminal device, and a radar are provided. The electronic device (10) includes a housing (100), a metal heat dissipation member (200), an electrical connection member (300), and a circuit board (400). The metal heat dissipation member (200) and the circuit board (400) are located in the housing (100), and the metal heat dissipation member (200) is located between a base plate (110) and the circuit board (400) in the housing (100). The circuit board (400) has a ground layer (410) and an electronic device (420), and the electrical connection member (300) is integrally molded into the housing (100) through injection molding and is fixedly connected to the housing (100), one end of the electrical connection member (300) is electrically connected to the ground layer, and the other end of the electrical connection member (300) is electrically connected to the metal heat dissipation member (200). The electronic device 10 can eliminate the electrostatic discharge phenomenon between the metal heat dissipation member 200 and the circuit board 400 to prevent electrostatic discharge from damaging the electronic device 420 on the circuit board 400. In addition, the circuit board 400 is fixed to the housing 100 by using the electrical connection member 300, and the metal heat dissipation member 200 is fixed between the circuit board 400 and the base plate 110, thereby improving the structural strength of the electronic device 10.

Description

Technical Field

[0001] This application claims priority based on Chinese Patent Application No. 202120455828.1, titled "Electronic Apparatus, Terminal Device, and Radar", filed with the China National Intellectual Property Administration on March 2, 2021, which is incorporated herein by reference in its entirety.

[0002] This application relates to the field of electronic technologies, and in particular, to electronic apparatuses, terminal devices, and radars.

Background Art

[0003] With the development of economy and technology, autonomous vehicles are gradually becoming the main development trend in the automotive industry. Millimeter-wave radar is an important part of autonomous vehicles. During actual applications, very high performance is required, and the power consumption is continuously increasing. To solve the heat dissipation problem caused by the increasing power consumption, a metal structure part is usually added inside to implement heat dissipation and temperature equalization. However, if the internal metal structure part cannot be in reliable and effective contact with the circuit board, an electrostatic discharge problem will occur between the metal structure part and the circuit board, and the electrostatic discharge will damage the electronic devices on the circuit board. To solve the above-mentioned electrostatic discharge problem, surface mounting technology may be introduced to absorb the tolerance between the metal structure part and the circuit board and implement reliable contact between the metal structure part and the circuit board, such as mounting a spring on the surface of the circuit board, or clamping a structural part such as a spring or an electrostatic discharge conductive foam to the metal structure part. However, this solution usually increases the cost, occupies the layout area of the circuit board, and may also cause deterioration of the structural strength due to the introduction of the structural part. In the scenario of long-term vibration, there is a risk of structural damage.

Summary of the Invention

[0004] This application provides an electronic device with high structural strength by integrally molding an electrical connection member onto a housing through injection to implement equipotential bonding between a metal heat dissipation member and a circuit board.

[0005] According to a first aspect, this application provides an electronic device. The electronic device includes a housing, a metal heat dissipation member, an electrical connection member, and a circuit board. The metal heat dissipation member and the circuit board are located within the housing. The housing has a base plate, and the metal heat dissipation member is located between the base plate and the circuit board. The circuit board has a ground layer and electronic devices. The electrical connection member is integrally molded onto the housing through injection and is fixedly connected to the housing. One end of the electrical connection member is electrically connected to the ground layer, and the other end of the electrical connection member is electrically connected to the metal heat dissipation member.

[0006] In a possible implementation, the electrical connection member has a first connection sub-member, a second connection sub-member, and a third connection sub-member that are continuously connected. The second connection sub-member is fixedly connected to the housing. One end of the first connection sub-member, which is away from the second connection sub-member, is electrically connected to the ground layer. The third connection sub-member is electrically connected to the metal heat dissipation member.

[0007] In one implementation, only the second connection sub-member of the electrical connection member is directly and fixedly connected to the housing. Specifically, to implement the fixed connection between the electrical connection member and the housing, the second connection sub-member is integrally molded onto the housing through injection. In some implementations, the second connection sub-member and the third connection sub-member of the electrical connection member may be integrally molded onto the housing through injection, but the end of the third connection sub-member, which is away from the second connection sub-member, needs to be exposed so as to be used for electrically connecting to the metal heat dissipation member.

[0008] In a possible implementation, the extending direction of the first connection sub-member intersects the circuit board. A first through-hole is disposed on the circuit board, and the first connection sub-member is inserted into and connected to the first through-hole to be electrically connected to the ground layer.

[0009] In one implementation, the extending direction of the first connection sub-member is perpendicular to the circuit board. In other words, the first connection sub-member is inserted perpendicularly into the first through-hole of the circuit board. To be within the process error range or to adapt to circuit boards with different structures and shapes and electrical connection members with different shapes in some implementations, the included angle between the extending direction of the first connection sub-member and the circuit board may be less than 90° or greater than 90°. In one implementation, the second connection sub-member includes a first sub-part connected to the first connection sub-member and a second sub-part connected to the third connection sub-member. The first sub-part intersects the second sub-part, the first sub-part is parallel to the extending direction of the first connection sub-member, and the second sub-part is parallel to the extending direction of the third connection sub-member.

[0010] In a possible implementation, the housing further has a fixing part, the fixing part is configured to be fixedly connected to the second connection sub-member, and at least a part of the second connection sub-member is located within the fixing part.

[0011] In one implementation, the housing further has a housing body, and the fixing part and the housing body are integrally formed. In this implementation, the electronic device further includes a protective cover, the protective cover and the housing body are closed to form an accommodation space, and the metal heat dissipation member and the circuit board are located within the accommodation space.

[0012] In a possible implementation, the housing further has a housing body, the housing body includes a first side wall, the fixing part is arranged on the side of the base plate facing the circuit board, and the fixing part is arranged adjacent to the first side wall.

[0013] In a possible implementation, the metal heat dissipation member has a first side edge, the first side edge is arranged adjacent to the first side wall, the first side edge includes a first notch, and the orthographic projection of the fixing part on the base plate is located within the orthographic projection of the first notch on the base plate. The first connection sub-member is connected to the circuit board through the first notch, and the fixing part abuts against the circuit board through the first notch.

[0014] In one implementation, the shape of the orthographic projection of the fixing portion on the base plate is rectangular, and the shape of the first notch is also rectangular. In some implementations, when the fixing portion can contact the circuit board through the first notch, the shape of the orthographic projection of the fixing portion on the base plate is rectangular, and the shape of the first notch may be square, elliptical, or irregular, etc.

[0015] In one implementation, there are two fixing portions, two electrical connection members, and two first notches, and the two first notches are located on two sides of the first side edge portion. In some implementations, one of the first notches may be arranged on the first side edge portion, and the other first notch may be arranged on the second side edge portion of the metal heat dissipation member, and the second side edge portion is adjacent to the first side edge portion. In some implementations, one of the first notches may be arranged on the first side edge portion, and the other first notch may be arranged on the third side edge portion of the metal heat dissipation member, and the third side edge portion and the first side edge portion are arranged at an interval.

[0016] In a possible implementation, a first through hole penetrating two opposite surfaces of the metal heat dissipation member is arranged on the metal heat dissipation member, and the orthographic projection of the fixing portion on the base plate is located within the orthographic projection of the first through hole on the base plate.

[0017] In some implementations, when there are two fixing portions and two electrical connection members, one fixing portion may contact the circuit board through the first notch, and the other fixing portion may contact the circuit board through the first through hole.

[0018] In a possible implementation, the extending direction of the third connection sub-member intersects the metal heat dissipation member, a second through hole penetrating two opposite surfaces of the metal heat dissipation member is arranged on the metal heat dissipation member, and one end of the third connection sub-member away from the second connection sub-member passes through the second through hole and is fixedly connected to the metal heat dissipation member through the second through hole.

[0019] In one implementation, the extending direction of the third connection sub-member is perpendicular to the metal heat dissipation member. To be within the process error range or to adapt to metal heat dissipation members with different structures and shapes and electrical connection members with different shapes in some implementations, the included angle between the extending direction of the third connection sub-member and the metal heat dissipation member may be less than 90° or greater than 90°.

[0020] In a possible implementation, the method of fixed connection between the third connection sub-member and the metal heat dissipation member is one of interference fit connection, snap connection, or welding.

[0021] In a possible implementation, the extending direction of the third connection sub-member is parallel to the metal heat dissipation member, and the third connection sub-member is adhered to the surface of the metal heat dissipation member facing the base plate.

[0022] In a possible implementation, the distance from the surface of the third connection sub-member away from the base plate to the base plate is longer than the distance from the surface of the second sub-part away from the base plate to the base plate. In other words, compared with the second sub-part, the third connection sub-member protrudes from the metal heat dissipation member, and as a result, the third connection sub-member is more closely adhered to the metal heat dissipation member, thereby improving the electrical connectivity.

[0023] In a possible implementation, the circuit board has a signal transmission part and a signal reception part. The signal transmission part is configured to transmit signals, and the signal reception part is configured to receive signals.

[0024] In a possible implementation, the electrical connection member is a fish-eye pin. The fish-eye pin may be solid or hollow. In the present application, the shape of the first connection sub-member in the fish-eye pin is not limited.

[0025] In a possible implementation, the fixed post is disposed on a surface of the base plate facing the metal heat dissipation member, the third through hole penetrating two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member, and the fixed post passes through the third through hole. After the fixed post is hot pressed, the fixed post is fixed on a surface of the metal heat dissipation member facing the circuit board.

[0026] In a possible implementation, a waterproof and breathable member is disposed on the base plate. The waterproof and breathable member dissipates heat inside the housing, avoids thermal expansion and cold shrinkage, and is configured to allow air to flow on two sides of the base plate to maintain pressure balance inside the housing.

[0027] In a possible implementation, the electronic device further includes a plurality of connection parts. The connection part includes a connector and a connection line connected to each other. The connector is located inside the housing, a plurality of second through holes are disposed on the circuit board, the connector is inserted into the second through hole and electrically connected to the second through hole, and the connection line passes through the third side wall and is electrically connected to an external electronic device. The connection part includes at least one of a voltage line, a signal transmission line, and a ground line.

[0028] In a possible implementation, the flanging part facing the circuit board is disposed around the metal heat dissipation member. The flanging part is configured to shield interference of an external signal with a signal on the circuit board or prevent the signal on the circuit board from being radiated. The shape of each side edge of the metal heat dissipation member is not limited and may be specifically set according to actual requirements.

[0029] In a possible implementation, the metal heat dissipation member has a heat dissipation sub-member protruding toward the circuit board, the thermal paste is disposed on the surface of the heat dissipation sub-member facing the circuit board, and the orthographic projection of the electronic device on the circuit board on the metal heat dissipation member at least partially overlaps with the orthographic projection of the heat dissipation sub-member on the metal heat dissipation member. The thermal paste can promote the heat dissipation efficiency of the operating electronic device. In this implementation, in order to improve the heat dissipation ability of the electronic device, the orthographic projection of the electronic device on the metal heat dissipation member completely overlaps with the orthographic projection of the heat dissipation sub-member on the metal heat dissipation member. The number and distribution positions of the heat dissipation sub-members may be set based on the number of electronic devices and the positions of the electronic devices on the circuit board.

[0030] According to a second aspect, the present application provides a terminal device. The terminal device includes an electronic device according to any one of the foregoing implementations, and the electronic device is fixed to the terminal device.

[0031] In a possible implementation, the terminal device is an automobile, a drone, or a robot.

[0032] According to a third aspect, the present application provides a radar, and the radar includes an electronic device according to any one of the foregoing implementations.

[0033] In a possible implementation, the radar further includes a signal processing device, and the information processing device is electrically connected to the circuit board.

Brief Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings used in the embodiments of the present application will be described below.

[0035]

Figure 1

[0036]

Figure 2

[0037]

Figure 3

[0038]

Figure 4

[0039]

Figure 5

[0040]

Figure 6

[0041]

Figure 7

[0042]

Figure 8

[0043]

Figure 9

[0044]

Figure 10

[0045]

Figure 11

[0046]

Figure 12

[0047]

Figure 13

[0048]

Figure 14

[0049]

Figure 15

[0050]

Figure 16

Embodiments for Carrying Out the Invention

[0051] Hereinafter, the technical solution in the embodiment of the present application will be described with reference to the accompanying drawings in the embodiment of the present application. It is obvious that the described embodiments are only a part, not all, of the embodiments of the present application.

[0052] The terms "first", "second", etc. in this specification are only intended for explanation and are not to be understood as indicating relative importance or implication, or as an implicit indication of the number of the indicated technical features. Therefore, the features limited by "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, unless otherwise stated, "a plurality of" means two or more.

[0053] In addition, in this specification, positional terms such as "upper" and "lower" are defined relative to the position of the structure in the attached drawings. It should be understood that these positional terms are relative concepts used for relative description and explanation, and can change accordingly based on the change in the position of the structure.

[0054] Referring to FIGS. 1 to 3. One embodiment of the present application provides an electronic device 10 including a housing 100, a metal heat dissipation member 200, an electrical connection member 300, and a circuit board 400. The metal heat dissipation member 200 and the circuit board 400 are located within the housing 100 (as shown in FIGS. 2 and 3). The housing 100 has a base plate 110, and the metal heat dissipation member 200 is located between the base plate 110 and the circuit board 400. The circuit board 400 has a ground layer 410 and electronic devices 420. The electrical connection member 300 is integrally formed with the housing 100 through injection molding, is fixedly connected to the housing 100, one end of the electrical connection member 300 is electrically connected to the ground layer 410, and the other end of the electrical connection member 300 is electrically connected to the metal heat dissipation member 200.

[0055] The housing 100 is a housing having an accommodation space, and the metal heat dissipation member 200 and the circuit board 400 may be accommodated in the housing 100. The circuit board 400 may further include a substrate, and the electronic devices 420 may be located on the surface of the substrate or within the substrate. The electronic devices 420 may be configured to implement specific functions. Specifically, the electronic devices 420 having specific functions may be arranged within the circuit board 400 according to actual requirements. The metal heat dissipation member 200 is configured to dissipate heat. When the circuit board 400 operates, the electronic devices 420 generate heat. The metal heat dissipation member 200 is configured to transfer the heat generated by the circuit board 400 to the outside to prevent the excessively high temperature of the electronic devices 420 from affecting the operating performance.

[0056] The two ends of the electrical connection member 300 are electrically connected to the ground layer 410 and the metal heat dissipation member 200 respectively. As a result, the potentials of the ground layer 410 and the metal heat dissipation member 200 are equal. This prevents electrostatic discharge between the metal heat dissipation member 200 and the circuit board 400 from damaging the electronic device 420 on the circuit board 400. In order to enable the circuit board 400 to be adhered to the metal heat dissipation member 200 to remove electrostatic discharge, compared with the prior art method in which a structural part such as a spring or a conductive foam is mounted on the surface of the circuit board 400, the method in which the electrical connection member 300 is electrically connected to the ground layer 410 of the circuit board 400 and the metal heat dissipation member 200 can reduce the cost of the structural part, can reduce the occupied space in the housing 100, and does not occupy the layout area of the electronic device 420 on the circuit board 400.

[0057] The integral molding of the electrical connection member 300 to the housing 100 through injection means that when the housing 100 is formed, the melt for forming the electrical connection member 300 and the housing 100 is placed in the mold for the housing 100, the housing 100 and the electrical connection member 300 are integrally molded through injection, and the electrical connection member 300 is fixed to the housing 100. One end of the electrical connection member 300 is electrically connected to the ground layer 410 of the circuit board 400. As a result, the circuit board 400 is fixed to one end of the electrical connection member 300, and the circuit board 400, the electrical connection member 300, and the housing 100 are fixed. In addition, the metal heat dissipation member 200 is disposed between the base plate 110 and the circuit board 400. The metal heat dissipation member 200 can be press-fitted and fixed between the circuit board 400 and the base plate 110 by using the circuit board 400. As a result, the circuit board 400 and the metal heat dissipation member 200 are simultaneously fixed to the housing 100. Compared with the prior art method in which a structural part such as a spring or a conductive foam is mounted on the surface of the circuit board 400 to enable the circuit board 400 to be adhered to the metal heat dissipation member 200 to remove electrostatic discharge, the method in which the electrical connection member 300 is integrally molded to the housing 100 through injection and the electrical connection member 300 is electrically connected to the ground layer 410 of the circuit board 400 and the metal heat dissipation member 200 enables the electronic device 10 to have higher structural strength, enables the electronic device 10 to have higher structural reliability in a long-term vibration scenario, and can prevent the electronic device 10 from being damaged.

[0058] In the electronic device 10 provided in the present application, the electrical connection member 300 is integrally formed with the housing 100 through injection molding, and the electrical connection member 300 is electrically connected to the ground layer 410 of the circuit board 400 and the metal heat dissipation member 200. The electrostatic discharge phenomenon between the metal heat dissipation member 200 and the circuit board 400 can be removed, thereby preventing electrostatic discharge from damaging the electronic device 420 on the circuit board 400. In addition, the circuit board 400 is fixed to the housing 100 by using the electrical connection member 300, and the metal heat dissipation member 200 is fixed between the circuit board 400 and the base plate 110, thereby improving the structural strength of the electronic device 10.

[0059] Refer to FIG. 4. In a possible implementation, the electrical connection member 300 has a first connection sub-member 310, a second connection sub-member 320, and a third connection sub-member 330 that are continuously connected. The second connection sub-member 320 is fixedly connected to the housing 100. One end of the first connection sub-member 310 away from the second connection sub-member 320 is electrically connected to the ground layer 410 (as shown in FIG. 3), and the third connection sub-member 330 is electrically connected to the metal heat dissipation member 200 (as shown in FIG. 2). In this implementation, only the second connection sub-member 320 of the electrical connection member 300 is directly and fixedly connected to the housing 100. Specifically, in order to implement the fixed connection between the electrical connection member 300 and the housing 100, the second connection sub-member 320 is integrally formed with the housing 100 through injection molding. In some implementations, the second connection sub-member 320 and the third connection sub-member 330 of the electrical connection member 300 may be integrally formed with the housing 100 through injection molding, but the end of the third connection sub-member 330 away from the second connection sub-member 320 needs to be exposed for use in electrically connecting to the metal heat dissipation member 200. In this implementation, the electrical connection member 300 is a fish-eye pin. The fish-eye pin may be solid or hollow. In the present application, the shape of the first connection sub-member 310 in the fish-eye pin is not limited.

[0060] In a possible implementation, the extending direction of the first connection sub-member 310 intersects the circuit board 400, and the first through-hole 430 (as shown in FIGS. 1 and 3) is disposed on the circuit board 400. The first connection sub-member 310 is inserted into the first through-hole 430 and connected to the first through-hole 430 to be electrically connected to the ground layer 410. The intersection between the extending direction of the first connection sub-member 310 and the circuit board 400 means that the extending direction of the first connection sub-member 310 intersects the overall substrate surface of the circuit board 400. In this implementation, the extending direction of the first connection sub-member 310 is perpendicular to the circuit board 400. In other words, the first connection sub-member 310 is inserted perpendicularly into the first through-hole 430 of the circuit board 400. To adapt within the process error range or to different structures and shapes of the circuit board 400 and different shapes of the electrical connection member 300 in some implementations, the included angle between the extending direction of the first connection sub-member 310 and the circuit board 400 may be less than 90° or greater than 90°. In this implementation, the second connection sub-member 320 (as shown in FIG. 4) includes a first sub-part 321 connected to the first connection sub-member 310 and a second sub-part 322 connected to the third connection sub-member 330. The first sub-part 321 intersects the second sub-part 322. The first sub-part 321 is parallel to the extending direction of the first connection sub-member 310, and the second sub-part 322 is parallel to the extending direction of the third connection sub-member 330.

[0061] Refer to FIG. 5. In a possible implementation, the housing 100 further has a fixing portion 120, and the fixing portion 120 is configured to be fixedly connected to the second connection sub-member 320, and at least a part of the second connection sub-member 320 is located within the fixing portion 120. The fixing portion 120 may be any part of the housing 100, and the second connection sub-member 320 may be fixed at any position of the housing 100 according to actual requirements. In this implementation, the housing 100 further has a housing body 130 (as shown in FIG. 1), and the fixing portion 120 and the housing body 130 are integrally formed. In this implementation, the electronic device 10 further includes a protective cover 140, and the protective cover 140 and the housing body 130 are closed to form an accommodation space 150, and the metal heat dissipation member 200 and the circuit board 400 are located within the accommodation space 150. The fixing portion 120 is configured to be fixedly connected to the second connection sub-member 320. When the electrical connection member 300 and the housing 100 are integrally formed through injection molding, the injection mold of the housing 100 may be arranged as the shape of the fixing portion 120 according to requirements, and the second connection sub-member 320 of the electrical connection member 300 is arranged at the position having the shape of the fixing portion 120 of the injection mold. After the integral injection molding is completed, a structure in which the fixing portion 120 is fixedly connected to the second connection sub-member 320 may be obtained. In this implementation, the first sub-portion 321 of the second connection sub-member 320 is located within the fixing portion 120.

[0062] The specific shape of the fixing portion 120 is not limited and may be set according to actual requirements. In one implementation, the fixing portion 120 includes a fixing portion main body 121 and a support portion 122 located on the side of the fixing portion main body 121 away from the base plate 110. The support portion 122 is configured to support the circuit board 400 to prevent the circuit board 400 from swaying in a direction perpendicular to the circuit board 400. In this implementation, there are two support portions 122, and they are symmetrically arranged on the fixing portion main body 121. In some implementations, the support portion 122 may not be arranged on the fixing portion 120, and the surface of the fixing portion main body 121 away from the base plate 110 may be directly used as a support surface for supporting the circuit board 400.

[0063] In a possible implementation, the housing body 130 includes a first side wall 131, and (as shown in FIG. 6) the fixing portion 120 is located on the side of the base plate 110 facing the circuit board 400, and the fixing portion 120 is disposed adjacent to the first side wall 131. Referring to FIG. 2 again. In this implementation, the housing body 130 includes a base plate 110, a first side wall 131, a second side wall 132, a third side wall 133, and a fourth side wall 134. The first side wall 131, the second side wall 132, the third side wall 133, and the fourth side wall 134 are continuously connected. The fixing portion 120 is disposed near the first side wall 131, and the electrical connection member 300 is electrically connected to the edge position of the circuit board 400 adjacent to the first side wall 131 and the edge position of the metal heat dissipation member 200 adjacent to the first side wall 131. In other words, the fixing portion 120 and the electrical connection member 300 are located at the edge position of the accommodation space 150. Disposing the fixing portion 120 and the electrical connection member 300 at the edge position of the accommodation space 150 can reduce the occupied space in the central portion of the housing 100.

[0064] In a possible implementation, the metal heat dissipation member 200 has a first side edge portion 210 (as shown in FIG. 6), the first side edge portion 210 is disposed adjacent to the first side wall 131, the first side edge portion 210 has a first notch 211, and the orthographic projection of the fixing portion 120 on the base plate 110 is located within the orthographic projection of the first notch 211 on the base plate 110. The first connection sub-member 310 is connected to the circuit board 400 through the first notch 211, and the fixing portion 120 abuts against the circuit board 400 through the first notch 211. To ensure that the metal heat dissipation member 200 can be adhered to the base plate 110 to the maximum extent and to reduce the gap between the metal heat dissipation member 200 and the base plate 110, the first notch 211 is arranged to avoid the fixing portion 120, and the shape of the first notch 211 may be set based on the shape of the fixing portion 120. In this implementation, the shape of the orthographic projection of the fixing portion 120 on the base plate 110 is rectangular, and the shape of the first notch 211 is also rectangular. In some implementations, when the fixing portion 120 can abut against the circuit board 400 through the first notch 211, the shape of the orthographic projection of the fixing portion 120 on the base plate 110 may be rectangular, and the shape of the first notch 211 may be square, elliptical, or irregular, etc.

[0065] In the foregoing implementation, (as shown in FIG. 2) there are two fixing parts 120, two electrical connection members 300, and two first notches 211. The two first notches 211 are located on two sides of the first side edge part 210. Refer to FIG. 7. In some implementations, one of the first notches 211 may be disposed on the first side edge part 210, and the other first notch 211 may be disposed on the second side edge part 220 of the metal heat dissipation member 200. The second side edge part 220 is adjacent to the first side edge part 210. Refer to FIG. 8. In some implementations, one of the first notches 211 may be disposed on the first side edge part 210, and the other first notch 211 may be disposed on the third side edge part 230 of the metal heat dissipation member 200. The third side edge part 230 and the first side edge part 210 are disposed at an interval. In the present application, the number of the first notches 211 may be set based on the number of the electrical connection members 300 and the number of the fixing parts 120, and the specific position may be set based on the specific structures of the housing 100 and the metal heat dissipation member 200.

[0066] Refer to FIG. 9. In a possible implementation, a first through hole 240 penetrating two opposite surfaces of the metal heat dissipation member 200 is disposed on the metal heat dissipation member 200, and the orthographic projection of the fixing part 120 on the base plate 110 is located within the orthographic projection of the first through hole 240 on the base plate 110. The first through hole 240 is located within the metal heat dissipation member 200. In this implementation, the fixing part 120 abuts against the circuit board 400 after passing through the first through hole 240. The position of the first through hole 240 may be set at any position within the metal heat dissipation member 200. When there are two fixing parts 120, two electrical connection members 300, and two first through holes 240, the two first through holes 240 may be symmetrically or asymmetrically disposed within the metal heat dissipation member 200.

[0067] Refer to FIG. 10. In some implementations, when there are two fixing parts 120 and two electrical connection members 300, one of the fixing parts 120 may abut against the circuit board 400 through the first notch 211, and the other fixing part 120 may abut against the circuit board 400 through the first through hole 240.

[0068] Refer to FIG. 6 again. In a possible implementation, the extending direction of the third connection sub-member 330 intersects the metal heat dissipation member 200, and the second through hole 250 that penetrates two opposite surfaces of the metal heat dissipation member 200 is disposed on the metal heat dissipation member 200. One end of the third connection sub-member 330 away from the second connection sub-member 320 passes through the second through hole 250 and is fixedly connected to the metal heat dissipation member 200 through the second through hole 250. In this implementation, the extending direction of the third connection sub-member 330 is perpendicular to the metal heat dissipation member 200. Within the process error range, or to adapt to different structures and shapes of the metal heat dissipation member 200 and different shapes of the electrical connection member 300 in some implementations, the included angle between the extending direction of the third connection sub-member 330 and the metal heat dissipation member 200 may be less than 90° or greater than 90°. The metal heat dissipation member 200 is disposed approximately parallel to the entire substrate surface of the circuit board 400. In this implementation, the extending direction of the third connection sub-member 330 is parallel to the extending direction of the first connection sub-member 310, and both are perpendicular to the second connection sub-member 320. When there are a plurality of electrical connection members 300, there are also a plurality of second through holes 250. The number of the second through holes 250 is the same as the number of the electrical connection members 300. In this implementation, there are two electrical connection members 300 and two second through holes 250.

[0069] In this implementation, the second through hole 250 is disposed adjacent to the fixing portion 120. In this case, the third connection sub-member 330 does not need to be overly long so as to suppress costs. In some implementations, the second through hole 250 may be disposed away from the fixing portion 120, and the distance between the second through hole 250 and the fixing portion 120 may be set according to actual requirements.

[0070] In a possible implementation, the method of fixed connection between the third connection sub-member 330 and the metal heat dissipation member 200 is one of interference fit connection, snap connection, or welding. The interference fit connection means that the third connection sub-member 330 has a specific elasticity, the third connection sub-member 300 is passed through the second through-hole 250, and is fixedly connected to the second through-hole 250. One method of snap connection is that a guide portion 331 and a step portion 332 (as shown in FIG. 11) are arranged at the end of the third connection sub-member 330. After the guide portion 331 passes through the second through-hole 250, the step portion 332 abuts against the metal heat dissipation member 200 around the second through-hole 250. As a result, the connection between the metal heat dissipation member 200 and the third connection sub-member 330 is fixed. Welding means that the third connection sub-member 330 is welded to a part of the metal heat dissipation member 200 around the second through-hole 250.

[0071] In a possible implementation, the fixed post is arranged on the surface of the base plate 110 facing the metal heat dissipation member 200. The third through-hole penetrating two opposite surfaces of the metal heat dissipation member 200 is arranged on the metal heat dissipation member 200, and the fixed post passes through the third through-hole. After the fixed post is hot-pressed, the fixed post is fixed on the surface of the metal heat dissipation member 200 facing the circuit board 400.

[0072] In a possible implementation, a waterproof and breathable member is arranged on the base plate 110. The waterproof and breathable member is configured to dissipate heat inside the housing 100, avoid thermal expansion and cold shrinkage, and allow air to flow on both sides of the base plate 110 to maintain pressure balance inside the housing 100.

[0073] In a possible implementation, the flanging portion 260 facing the circuit board 400 (as shown in FIG. 2) is disposed around the metal heat dissipation member 200. The flanging portion 260 is configured to shield the interference of external signals with signals on the circuit board 400 or prevent the signals on the circuit board 400 from being radiated. The shape of each side edge portion of the metal heat dissipation member 200 is not limited and may be specifically set according to actual requirements.

[0074] In a possible implementation, the metal heat dissipation member 200 has a heat dissipation sub-member 270 protruding toward the circuit board 400, the thermal paste is disposed on the surface of the heat dissipation sub-member 270 facing the circuit board 400, and the orthographic projection of the electronic device 420 on the circuit board 400 on the metal heat dissipation member 200 at least partially overlaps with the orthographic projection of the heat dissipation sub-member 270 on the metal heat dissipation member 200. The thermal paste can promote the heat dissipation efficiency of the operating electronic device 420. In this implementation, in order to improve the heat dissipation ability of the electronic device 420, the orthographic projection of the electronic device 420 on the metal heat dissipation member 200 completely overlaps with the orthographic projection of the heat dissipation sub-member 270 on the metal heat dissipation member 200. The number and distribution positions of the heat dissipation sub-members 270 may be set based on the number of the electronic devices 420 and the positions of the electronic devices 420 on the circuit board 400.

[0075] In a possible implementation, the electronic device 10 further includes a plurality of connection portions 500. The connection portion 500 includes a connector 510 and a connection line 520 (as shown in FIG. 2) connected to each other. The connector 510 is located within the housing 100, a plurality of second through holes are disposed on the circuit board 400, the connector 510 is inserted into the second through holes and electrically connected to the second through holes, and the connection line 520 passes through the third side wall 133 and is electrically connected to an external electronic device. The connection portion includes at least one of a voltage line, a signal transmission line, and a ground line.

[0076] Refer to FIG. 12. In a possible implementation, the circuit board 400 has a signal transmission part 440 and a signal reception part 450. The signal transmission part 440 is configured to transmit signals, and the signal reception part 450 is configured to receive signals. In this implementation, the electronic device 10 may be configured to receive signals and transmit signals, and specifically, it may be a radar.

[0077] Refer to FIGS. 13, 14, and 15. In a possible implementation, the extending direction of the third connection sub-member 330 is parallel to the metal heat dissipation member 200, and the third connection sub-member 330 is adhered to the surface of the metal heat dissipation member 200 facing the base plate 110. In this implementation, the third connection sub-member 330 is in the shape of a plate and has a surface adhered to the metal heat dissipation member 200. Adhering means that after the third connection sub-member 330 is adhered to the metal heat dissipation member 200, at least an electrical connection between the third connection sub-member 330 and the metal heat dissipation member 200 can be implemented. In this way, the second through-hole 250 does not need to be disposed within the metal heat dissipation member 200, thereby reducing the process. In this implementation, the third connection sub-member 330 includes a flat plate, and the shape of the third connection sub-member 330 is not limited to a rectangle, a square, an ellipse, or a circle. In some implementations, alternatively, the third connection sub-member 330 may include at least two flat plates.

[0078] In a possible implementation, (as shown in FIG. 13) the distance from the surface of the third connection sub-member 330 away from the base plate 110 to the base plate 110 is longer than the distance from the surface of the second sub-part 322 away from the base plate 110 to the base plate. In other words, compared with the second sub-part 322, the third connection sub-member 330 protrudes from the metal heat dissipation member 200, and as a result, the third connection sub-member 330 is more closely adhered to the metal heat dissipation member 200, thereby improving the electrical connectivity.

[0079] Referring to FIG. 16, an implementation of the present application provides a terminal device 20. The terminal device 20 includes the electronic device 10 in any one of the foregoing implementations, and the electronic device 10 is fixed to the terminal device 20. The terminal device 20 may be an automobile, a drone, a robot, or a yacht, etc. In some implementations, the terminal device 20 may be a computer product or a communication product, such as a computer, or a household electrical appliance having a communication function, such as a refrigerator or a washing machine. In one implementation, the mounting part is arranged outside the housing 100 and is configured to mount the electronic device 10 on the terminal device 20.

[0080] An implementation of the present application provides a radar, and the radar includes the electronic device 10 in any one of the foregoing implementations.

[0081] In one implementation, the radar further includes a signal processing device, and the signal processing device is electrically connected to the circuit board 400 in the electronic device 10. In this implementation, the circuit board 400 is provided together with a signal transmission part 440 and a signal reception part 450. The signal processing device is configured to transmit the processed signal to the signal transmission part 440 for transmission, or the signal reception part 450 is configured to transmit the received signal to the signal processing device for processing. The signal processing device may be a Mobile Data Center (MDC).

[0082] In some implementations, the signal processor may be arranged on the circuit board 400 in the radar and is configured to process signals.

[0083] In one implementation, when the signal transmission part 440 and the signal reception part 450 are not arranged on the circuit board 400, the radar further includes a signal transceiver, and the signal transceiver is configured to transmit signals and receive signals.

[0084] The electronic device, terminal device, and radar provided in the embodiments of the present application have been described in detail above. The principles and embodiments of the present application are described in this specification by using specific examples. The description of the foregoing embodiments is only provided to help understand the method and core idea of the present application. In addition, those skilled in the art can make modifications and variations from the perspectives of specific embodiments and application scopes related to the idea of the present application. In conclusion, the content of the specification should not be construed as a limitation to the present application 。 [Item 1] An electronic device, the electronic device comprising a housing, a metal heat dissipation member, an electrical connection member, and a circuit board, the metal heat dissipation member and the circuit board being located within the housing, the housing having a base plate, the metal heat dissipation member being located between the base plate and the circuit board; the circuit board having a ground layer and electronic devices, the electrical connection member being integrally formed with the housing through injection molding and fixedly connected to the housing, one end of the electrical connection member being electrically connected to the ground layer and the other end of the electrical connection member being electrically connected to the metal heat dissipation member. [Item 2] The electrical connection member has a first connection sub-member, a second connection sub-member, and a third connection sub-member that are continuously connected, the second connection sub-member being fixedly connected to the housing, one end of the first connection sub-member remote from the second connection sub-member being electrically connected to the ground layer, and the third connection sub-member being electrically connected to the metal heat dissipation member, the electronic device according to Item 1. [Item 3] The extending direction of the first connection sub-member intersects the circuit board, a first through hole is disposed on the circuit board, the first connection sub-member is inserted into the first through hole and connected to the first through hole and is electrically connected to the ground layer, the electronic device according to Item 2. [Item 4] The housing further has a fixing portion configured to be fixedly connected to the second connection sub-member, at least a part of the second connection sub-member being located within the fixing portion, the electronic device according to Item 2. [Item 5] The housing further has a housing body, the housing body including a first side wall, the fixing portion being disposed on a side of the base plate facing the circuit board and being disposed adjacent to the first side wall, the electronic device according to Item 4. [Item 6] The metal heat dissipation member has a first side edge portion, the first side edge portion is disposed adjacent to the first side wall, the first side edge portion includes a first notch, and the orthographic projection of the fixing portion on the base plate is located within the orthographic projection of the first notch on the base plate. The first connection sub-member is connected to the circuit board through the first notch, and the fixing portion abuts against the circuit board through the first notch. The electronic device according to item 5. [Item 7] A first through hole penetrating two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member, and the orthographic projection of the fixing portion on the base plate is located within the orthographic projection of the first through hole on the base plate. The electronic device according to item 4. [Item 8] The extending direction of the third connection sub-member intersects the metal heat dissipation member. A second through hole penetrating two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member. One end of the third connection sub-member, which is away from the second connection sub-member, passes through the second through hole and is fixedly connected to the metal heat dissipation member through the second through hole. The electronic device according to any one of items 3 to 7. [Item 9] The method of fixed connection between the third connection sub-member and the metal heat dissipation member is one of interference fit connection, snap connection, or welding. The electronic device according to item 8. [Item 10] The extending direction of the third connection sub-member is parallel to the metal heat dissipation member, and the third connection sub-member is adhered to the surface of the metal heat dissipation member facing the base plate. The electronic device according to any one of items 3 to 7. [Item 11] The circuit board has a signal transmission part and a signal reception part. The signal transmission part is configured to transmit signals, and the signal reception part is configured to receive signals. The electronic device according to item 1. [Item 12] The electrical connection member is a fish-eye pin. The electronic device according to item 1. [Item 13] A terminal device, the terminal device includes the electronic device according to any one of items 1 to 12, and the electronic device is fixed to the terminal device. The terminal device. [Item 14] The terminal device is an automobile, a drone, or a robot. The terminal device according to item 13. [Item 15] A radar including the electronic device according to any one of items 1 to 12. [Item 16] The radar according to item 15, further comprising a signal processing device, wherein the signal processing device is electrically connected to a circuit board.

Claims

Claim 1 An electronic device, comprising a housing, a metal heat dissipation member, an electrical connection member, and a circuit board, wherein the metal heat dissipation member and the circuit board are located within the housing, the housing has a base plate, the metal heat dissipation member is located between the base plate and the circuit board, the circuit board has a ground layer and electronic devices, the electrical connection member is integrally formed with the housing through injection molding and is fixedly connected to the housing, one end of the electrical connection member is electrically connected to the ground layer through a first notch of the metal heat dissipation member, the other end of the electrical connection member is electrically connected to the metal heat dissipation member, and the electrical connection member is a fish-eye pin having at least a part of the tip portion with a width larger than that of the portion connecting the tip portion to the main body portion. Claim 2 The electrical connection member has a first connection sub-member, a second connection sub-member, and a third connection sub-member connected continuously, the second connection sub-member is fixedly connected to the housing, one end of the first connection sub-member away from the second connection sub-member is electrically connected to the ground layer, and the third connection sub-member is electrically connected to the metal heat dissipation member. The electronic device according to claim 1. Claim 3 The extending direction of the first connection sub-member intersects the circuit board, a first through-hole is disposed on the circuit board, the first connection sub-member is inserted into the first through-hole and is connected to the first through-hole and electrically connected to the ground layer. The electronic device according to claim 2. Claim 4 The housing further has a fixing portion configured to be fixedly connected to the second connection sub-member, and at least a part of the second connection sub-member is located within the fixing portion. The electronic device according to claim 2. Claim 5 The housing further has a housing body including a first side wall, the fixing portion is disposed on a side of the base plate facing the circuit board, and the fixing portion is disposed adjacent to the first side wall. The electronic device according to claim 4. Claim 6 The metal heat dissipation member has a first side edge portion, the first side edge portion is disposed adjacent to the first side wall, the first side edge portion includes the first notch, and the orthographic projection of the fixing portion on the base plate is located within the orthographic projection of the first notch on the base plate. The first connection sub-member is connected to the circuit board through the first notch, and the fixing portion abuts against the circuit board through the first notch. The electronic device according to claim 5.

7. A first through hole penetrating two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member, and the orthographic projection of the fixing portion on the base plate is located within the orthographic projection of the first through hole on the base plate. The electronic device according to claim 4.

8. The extending direction of the third connection sub-member intersects the metal heat dissipation member. A second through hole penetrating two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member. One end of the third connection sub-member, which is away from the second connection sub-member, passes through the second through hole and is fixedly connected to the metal heat dissipation member through the second through hole. The electronic device according to claim 3.

9. The method of fixed connection between the third connection sub-member and the metal heat dissipation member is one of interference fit connection, snap connection, or welding. The electronic device according to claim 8.

10. The extending direction of the third connection sub-member is parallel to the metal heat dissipation member, and the third connection sub-member is adhered to the surface of the metal heat dissipation member facing the base plate. The electronic device according to claim 3.

11. The circuit board has a signal transmission portion and a signal reception portion. The signal transmission portion is configured to transmit signals, and the signal reception portion is configured to receive signals. The electronic device according to claim 1.

12. An electronic device, the electronic device comprising a housing, a metal heat dissipation member, an electrical connection member, and a circuit board, the metal heat dissipation member and the circuit board being located within the housing, the housing having a base plate, the metal heat dissipation member being located between the base plate and the circuit board, the circuit board having a ground layer and electronic devices, the electrical connection member being integrally formed with the housing through injection molding and fixedly connected to the housing, one end of the electrical connection member being electrically connected to the ground layer, and the other end of the electrical connection member being electrically connected to the metal heat dissipation member, the electrical connection member having a first connection sub-member, a second connection sub-member, and a third connection sub-member that are continuously connected, the second connection sub-member being fixedly connected to the housing, one end of the first connection sub-member away from the second connection sub-member being electrically connected to the ground layer, and the third connection sub-member being electrically connected to the metal heat dissipation member, the housing further having a fixing portion configured to be fixedly connected to the second connection sub-member, at least a part of the second connection sub-member being located within the fixing portion, the housing further having a housing body, the housing body including a first side wall, the fixing portion being disposed on a side of the base plate facing the circuit board and being disposed adjacent to the first side wall, An electronic device.

13. An electronic device, the electronic device comprising a housing, a metal heat dissipation member, an electrical connection member, and a circuit board, the metal heat dissipation member and the circuit board being located within the housing, the housing having a base plate, the metal heat dissipation member being located between the base plate and the circuit board, the circuit board having a ground layer and electronic devices, the electrical connection member being integrally formed with the housing through injection molding and fixedly connected to the housing, one end of the electrical connection member being electrically connected to the ground layer, and the other end of the electrical connection member being electrically connected to the metal heat dissipation member, The electrical connection member has a first connection sub-member, a second connection sub-member, and a third connection sub-member that are continuously connected. The second connection sub-member is fixedly connected to the housing. One end of the first connection sub-member, which is away from the second connection sub-member, is electrically connected to the grounding layer. The third connection sub-member is electrically connected to the metal heat dissipation member. The housing further has a fixing portion, and the fixing portion is configured to be fixedly connected to the second connection sub-member. At least a part of the second connection sub-member is located within the fixing portion. A first through-hole penetrating two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member. The orthographic projection of the fixing portion on the base plate is located within the orthographic projection of the first through-hole on the base plate. Electronic device.

14. An electronic device, comprising a housing, a metal heat dissipation member, an electrical connection member, and a circuit board. The metal heat dissipation member and the circuit board are located within the housing. The housing has a base plate. The metal heat dissipation member is located between the base plate and the circuit board. The circuit board has a grounding layer and electronic devices. The electrical connection member is integrally formed with the housing through injection molding and is fixedly connected to the housing. One end of the electrical connection member is electrically connected to the grounding layer, and the other end of the electrical connection member is electrically connected to the metal heat dissipation member. The electrical connection member has a first connection sub-member, a second connection sub-member, and a third connection sub-member that are continuously connected. The second connection sub-member is fixedly connected to the housing. One end of the first connection sub-member, which is away from the second connection sub-member, is electrically connected to the grounding layer. The third connection sub-member is electrically connected to the metal heat dissipation member. The extending direction of the first connection sub-member intersects with the circuit board. A first through-hole is disposed on the circuit board. The first connection sub-member is inserted into and connected to the first through-hole and is electrically connected to the grounding layer. The extending direction of the third connection sub-member intersects the metal heat dissipation member, and a second through-hole that penetrates two opposite surfaces of the metal heat dissipation member is disposed on the metal heat dissipation member. One end of the third connection sub-member, which is away from the second connection sub-member, passes through the second through-hole and is fixedly connected to the metal heat dissipation member through the second through-hole. Electronic device.

15. An electronic device, comprising a housing, a metal heat dissipation member, an electrical connection member, and a circuit board. The metal heat dissipation member and the circuit board are located within the housing. The housing has a base plate, and the metal heat dissipation member is located between the base plate and the circuit board. The circuit board has a ground layer and electronic devices. The electrical connection member is integrally formed with the housing through injection molding and is fixedly connected to the housing. One end of the electrical connection member is electrically connected to the ground layer, and the other end of the electrical connection member is electrically connected to the metal heat dissipation member. The electrical connection member has a first connection sub-member, a second connection sub-member, and a third connection sub-member that are continuously connected. The second connection sub-member is fixedly connected to the housing. One end of the first connection sub-member, which is away from the second connection sub-member, is electrically connected to the ground layer. The third connection sub-member is electrically connected to the metal heat dissipation member. The extending direction of the first connection sub-member intersects the circuit board. A first through-hole is disposed on the circuit board. The first connection sub-member is inserted into the first through-hole and is connected to the first through-hole and electrically connected to the ground layer. The extending direction of the third connection sub-member is parallel to the metal heat dissipation member, and the third connection sub-member is adhered to the surface of the metal heat dissipation member that faces the base plate. Electronic device.

16. A terminal device, comprising the electronic device according to any one of claims 1 to 15, wherein the electronic device is fixed to the terminal device. Terminal device.

17. The terminal device according to claim 16, wherein the terminal device is an automobile, a drone, or a robot.

18. A radar comprising the electronic device according to any one of claims 1 to 15.

19. The radar according to claim 18, further comprising a signal processing device, wherein the signal processing device is electrically connected to a circuit board.

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