Heating Device and Method for Setting PID Coefficients of Heating Device

Abstract

To provide a heating apparatus capable of improving accuracy of temperature control of a heated object and capable of shortening a PID coefficient setting time, and a PID coefficient setting method.SOLUTION: A heating apparatus comprises: a main heat source 10 and a sub heat source 20 which heat a heated object 100; a main heat source control device 60 which controls output of the main heat source 10; and a sub heat source control device 70 which controls output of the sub heat source 20. The main heat source control device 60 performs PID control on the output of the main heat source 10 in such a manner that a temperature of the heated object 100 becomes a predetermined target temperature profile P1, and the sub heat source control device 70 performs PID control on the output of the sub heat source 20 in such a manner that a temperature of the sub heat source 20 becomes a second target temperature profile P2 resulting from adding temperature offset ΔT to the target temperature profile P1. A PID coefficient of the main heat source control device 60 and a PID coefficient of the sub heat source control device 70 can be independently set by auto-tuning, and the temperature offset ΔT can be independently set.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a heating device having a plurality of heat sources and a method for setting PID coefficients of the heating device.

Background Art

[0002] Conventionally, in the heat treatment of various articles, heat treatment apparatuses and heat treatment methods using two or more types of heat sources, such as a hot plate that heats by heat conduction and a heating lamp that heats by heat radiation, have been developed. For example, in such a heat treatment apparatus, a hot plate capable of continuous heating and a heating lamp capable of rapid temperature rise are combined to faithfully realize the time change of the target temperature (for example, Patent Documents 1 to 3).

[0003] In a heating device using two or more types of heat sources such as this, there is a problem that the setting of the PID coefficient for performing PID control so that the temperature of the object to be heated follows the time change of the target temperature (target temperature profile) is complicated. In the conventionally generally used method, first, for each heat source, the PID coefficient is set so that the temperature of the heat source closely follows the target temperature profile. Then, the object to be heated is heated, and the deviation between the temperature change of the object to be heated and the target temperature profile is confirmed. When this deviation is large, the PID control coefficient of each heat source is readjusted, the object to be heated is heated again, and it is confirmed whether the temperature change follows the target temperature profile.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in this PID coefficient setting method, the deviation between the temperature change of the object to be heated and the target temperature profile hardly converges, and it is necessary to repeatedly perform a temperature increase test for heating the object to be heated with the target temperature profile, which takes a long time. In addition, since the temperature of the object to be heated is obtained indirectly by controlling the temperature of the heat source, there is a problem that an error easily occurs with respect to the target temperature.

[0006] The present invention solves the above problems, and provides a heating device having a plurality of heat sources, capable of improving the accuracy of temperature control of an object to be heated and shortening the PID coefficient setting time, and a method for setting the PID coefficient of the heating device.

Means for Solving the Problems

[0007] In order to solve the above problems, the heating device of the present invention is a heating device including a main heat source and a sub heat source for heating an object to be heated, a main heat source control device for controlling the output of the main heat source, and a sub heat source control device for controlling the output of the sub heat source. The main heat source control device performs PID control on the output of the main heat source so that the temperature of the object to be heated becomes a predetermined target temperature profile. The sub heat source control device performs PID control on the output of the sub heat source so that the temperature of the sub heat source becomes a second target temperature profile obtained by adding a temperature offset to the target temperature profile. The PID coefficient of the main heat source control device, the PID coefficient of the sub heat source control device, and the temperature offset can be set independently.

[0008] The main heat source is a heat source that heats the object to be heated by thermal radiation, and the sub heat source may be a heat source that heats the object to be heated by heat conduction or proximity heating.

[0009] The main heat source may be a lamp heater, and the sub heat source may be a ceramic heater.

[0010] The temperature of the object to be heated may be measured by a non-contact temperature sensor.

[0011] The method for setting the PID coefficients of the heating device of the present invention is a method for setting the PID coefficients of a heating device including a main heat source and a sub heat source for heating an object to be heated, a main heat source control device for performing PID control on the output of the main heat source based on the temperature of the object to be heated, and a sub heat source control device for performing PID control on the output of the sub heat source based on the temperature of the sub heat source, comprising: a first step of calculating and setting the optimal PID coefficient of the sub heat source control device from the difference between the actual temperature profile of the sub heat source and the second target temperature profile when the object to be heated is heated with the second target temperature profile obtained by adding a temperature offset to the target temperature profile by the sub heat source; a second step of calculating and setting the optimal PID coefficient of the main heat source control device from the difference between the actual temperature profile of the object to be heated and the target temperature profile when the object to be heated is heated with the second target temperature profile by the sub heat source control device based on the set PID coefficient while heating the object to be heated, and at the same time, heating the object to be heated with the target temperature profile by the main heat source. The method includes the above steps.

[0012] In the method for setting the PID coefficients, the main heat source is a heat source for heating the object to be heated by heat radiation or hot air, and the sub heat source may be a heat source for heating the object to be heated by heat conduction or proximity heating.

[0013] In the method for setting the PID coefficients, the temperature of the object to be heated may be measured by a non-contact temperature sensor.

[0014] In the method for setting the PID coefficients, the setting of the PID coefficients may be obtained and set by utilizing the auto-tuning function of the main heat source control device and the sub heat source control device.

[0015] The heating method of the present invention uses a heating device including a main heat source and a sub heat source for heating an object to be heated, a main heat source control device for performing PID control on the output of the main heat source based on the temperature of the object to be heated, and a sub heat source control device for performing PID control on the output of the sub heat source based on the temperature of the sub heat source. It is a method of heating the object to be heated while controlling the outputs of the main heat source and the sub heat source based on the PID coefficients set by the PID coefficient setting method described in any of the above. Note that since the optimal PID coefficients and the optimal temperature offset vary depending on the shape and dimensions of the object to be heated and the temperature profile of the heat treatment, it is preferable to set them for each object to be heated and for each temperature profile of the heat treatment.

Effect of the Invention

[0016] According to the heating device of the present invention, since the output of the main heat source is PID-controlled based on the temperature of the object to be heated, the deviation between the actual temperature and the target temperature of the object to be heated is reduced. Further, since the target temperature profile (second target temperature profile) of the sub heat source is set lower than the target temperature profile of the main heat source, an appropriate auxiliary effect, that is, a relative cooling effect or a relative heating effect by the sub heat source acts, and the tracking accuracy to the target temperature profile can be improved.

[0017] Also, according to the PID coefficient setting method of the present invention, since the target temperature profile (second target temperature profile) of the sub heat source at the time of setting is made different from the target temperature profile of the main heat source, an appropriate auxiliary effect acts, and the tracking accuracy to the target temperature profile is improved. Therefore, satisfactory tracking accuracy can be obtained with a small number of PID coefficient setting times, and the PID coefficient setting time can be shortened.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0019] (Heating device) Hereinafter, based on FIGS. 1 to 4, the heating device 1 which is an embodiment of the present invention will be described. As shown in FIGS. 1 and 2, the heating device 1 includes a main heat source 10, a sub heat source 20, an object-to-be-heated temperature sensor 30, a sub heat source temperature sensor 40, a chamber 50, a main heat source control device 60, a sub heat source control device 70, and a host control device 80. Since the heating device 1 shown in FIG. 1 is a portable test device, the loading and unloading of the object to be heated 100 and the opening and closing of the opening / closing lid 53 of the chamber 50 described later are configured to be manually performed.

[0020] In the present embodiment, the main heat source 10 uses a halogen lamp heater (hereinafter, also referred to as "halogen lamp heater 10") that heats the object to be heated by heat radiation. By using the halogen lamp heater 10, rapid temperature rise of the object to be heated 100 becomes possible, and it becomes easy to accurately follow the target temperature profile. In this specification, the "temperature profile" refers to the shape of the temperature-time change curve. This halogen lamp heater 10 is a lamp in which a small amount of halogen gas is introduced in addition to an inert gas inside a substantially annular electric bulb to increase the output and extend the life. Light can be irradiated from the substantially annular electric bulb onto each surface of the object to be heated 100, and the inner surface 53a of the opening / closing lid 53 of the chamber 50 described later acts as a reflecting mirror, and the reflected light from this inner surface 53a can also be used, so efficient heating becomes possible. Also, the same effect can be obtained even if hot air is used instead of the halogen lamp heater for the main heat source.

[0021] The auxiliary heat source 20 is a heat source that heats the object to be heated by heat conduction or proximity heating. In this embodiment, a ceramic heater (hereinafter also referred to as "ceramic heater 20") is used. This ceramic heater 20 accumulates the heat generated by energizing the built-in heating wire 21 (not shown) in the ceramic hot plate 22, and conducts the heat to the object to be heated 100 placed on this hot plate 22 for heating. With such a heat source, continuous heating is possible, and the temperature of the object to be heated 100 can be controlled by controlling the temperature of the heat source, that is, the ceramic heater 20 itself. However, it is not limited to heat conduction heating in which the object to be heated 100 is placed on the hot plate 22 as described above, and proximity heating in which the object to be heated 100 is faced slightly (for example, about 0.1 to 3 mm) away from the hot plate 22 may be performed, and the same effect as above can be obtained.

[0022] The object temperature sensor 30 is a sensor that measures the temperature of the object to be heated 100. In this embodiment, an infrared sensor, which is a non-contact temperature sensor, is used. This object temperature sensor 30 is arranged at the central observation window 53b of the opening / closing lid 53 of the chamber 50 described later, and measures the temperature of the object to be heated 100 by detecting the infrared radiation intensity of the object to be heated 100 through this observation window 53b. Thereby, it is not necessary to attach and detach the object temperature sensor 30 to and from the object to be heated 100, and it becomes easy to replace the object to be heated 100. However, the object temperature sensor 30 is not limited to non-contact sensors such as infrared sensors, and any sensor that can measure the temperature of the object to be heated 100 may be used, and contact sensors such as thermocouples, thermistors, and resistance temperature detectors may also be used.

[0023] The auxiliary heat source temperature sensor 40 is a sensor that is built into the ceramic heater 20, which is the auxiliary heat source 20, and detects its temperature. In this embodiment, a thermocouple is used. However, the auxiliary heat source temperature sensor 40 is not limited to thermocouples, and any sensor that can measure the temperature of the ceramic heater 20 may be used, and contact sensors such as thermistors and resistance temperature detectors, or non-contact sensors such as infrared sensors may also be used.

[0024] The chamber 50 is a container that houses the object to be heated 100 and maintains it at a predetermined high temperature state, and may supply an inert gas that prevents chemical reactions such as oxidation of the object to be heated, or conversely, a reactive gas for causing a chemical reaction. In the present embodiment, the chamber 50 is formed in a briefcase type, and includes a substantially box-shaped chamber body 51 with an open upper surface, an opening / closing lid 53 that is connected to the chamber body 51 via a hinge 52 and opens and closes the upper surface, and two buckles 54 that fix the opening / closing lid 53 in a closed state. The halogen lamp heater 10 as the main heat source and the ceramic heater 20 as the sub heat source are also arranged in this chamber 50. However, the present invention is not limited to this form. For example, the halogen lamp heater 10 may be arranged outside the chamber, and the object to be heated may be heated by irradiating light from a transparent window of the chamber. The chamber 50 closes the opening / closing lid 53 to seal the inside of the chamber 50 during the heat treatment of the heating device 1, while opening the opening / closing lid 53 before and after the heat treatment so that the object to be heated 100 can be carried in and out.

[0025] The main heat source control device 60 is a device that controls the output of the main heat source 10, and performs PID control on the output of the main heat source 10 based on the temperature of the object to be heated 100. The main heat source control device 60 includes a processor (not shown), an output adjustment circuit (not shown) of the main heat source 10, and a signal input interface (not shown) of the object to be heated temperature sensor 30. The output adjustment circuit has, for example, a thyristor that controls the on / off of the supply power, and obtains a desired output by adjusting the duty ratio of this on / off control. The main heat source control device 60 is instructed with a target temperature (target temperature profile P1) from the upper control device 80 described later, calculates the difference between the target temperature and the temperature of the object to be heated 100 read by the object to be heated temperature sensor 30, and is configured to perform PID control on the output of the main heat source 10 based on the preset PID coefficients (Kp, Ti, Td). Note that the main heat source control device 60 has an auto-tuning function for calculating and setting the optimal PID coefficients (Kp1, Ti1, Td1) of the main heat source control device 60 from the difference between the actual temperature profile of the object to be heated 100 and the target temperature profile P1 when heating with the target temperature profile P1 by the main heat source 10.

[0026] The auxiliary heat source control device 70 is a device that controls the output of the auxiliary heat source 20, and performs PID control on the output of the auxiliary heat source 20 based on the temperature of the auxiliary heat source 20. The auxiliary heat source control device 70 also includes a processor (not shown), an output adjustment circuit of the auxiliary heat source 20 (not shown), and a signal input interface of the auxiliary heat source temperature sensor 40 (not shown). The output adjustment circuit has, for example, a thyristor that controls the on / off of the supply power, and obtains a desired output by adjusting the duty ratio of this on / off control. The auxiliary heat source control device 70 is instructed with a second target temperature profile P2 obtained by adding a temperature offset ΔT to the target temperature profile P1 from a higher-level control device 80 described later. The difference between the second target temperature profile and the temperature of the auxiliary heat source 20 read by the auxiliary heat source temperature sensor 40 is calculated, and based on the preset PID coefficients (Kp, Ti, Td), it is configured to perform PID control on the output of the auxiliary heat source 20. Note that the auxiliary heat source control device 70 has an auto-tuning function that calculates and sets the optimal PID coefficients (Kp2, Ti2, Td2) of the auxiliary heat source control device 70 from the difference between the actual temperature profile of the auxiliary heat source 20 and the target temperature profile P2 when heating with the target temperature profile P2 by the auxiliary heat source 20.

[0027] The higher-level control device 80 is a device that controls the operation of the entire heating device, and has a communication function with an operation input device (not shown), a display device (not shown), an external computer (not shown), etc. as a user interface. The higher-level control device 80 creates a temperature profile for the heat treatment according to instructions from the operation input device (not shown) or an external computer (not shown), and transmits the temperature profile to the main heat source control device 60 and the auxiliary heat source control device 70 to instruct execution. Also, it is possible to set the PID coefficients (Kp, Ti, Td) of the main heat source control device 60 and the auxiliary heat source control device 70, and the temperature offset ΔT between the two control devices, from the operation input device (not shown). The upper control device 80 can also instruct the main heat source control device 60 and the sub heat source control device 70 to execute their respective auto - tuning functions. Further, in the PID coefficient setting method of the present embodiment described later, for example, after manually setting step (1), the upper control device 80 may cause the main heat source control device 60 and the sub heat source control device 70 to sequentially and automatically execute step (2) and step (3).

[0028] Note that the main heat source control device 60, the sub heat source control device 70, and the upper control device 80 do not necessarily have to be physically independent devices. For example, their respective digital control parts may be program modules in one computer.

[0029] Next, the operation of the heating device 1 of the present embodiment configured as described above will be described. First, with the opening / closing lid 53 of the chamber 50 open, the object to be heated 100 is manually carried into the chamber 50 and placed on the ceramic heater 20 which is a sub heat source. Next, the opening / closing lid 53 of the chamber 50 is closed, a heating process program (target temperature profile P1) to be executed is selected by an operation input device (not shown) and a display device (not shown) of the heating device 1, and a process start operation is performed. Then, the halogen lamp heater 10 which is the main heat source lights up, the ceramic heater 20 which is the sub heat source is energized, and the heating process is started. In this heating process, the main heat source control device 60 performs PID control on the output of the main heat source 10 so that the temperature of the object to be heated 100 becomes a predetermined target temperature profile P1, and the sub heat source control device 70 performs PID control on the output of the sub heat source so that the temperature of the sub heat source 20 becomes a second target temperature profile P1 obtained by adding a temperature offset ΔT to the target temperature profile P1. When the heating process is completed, for example, a cooling process is performed by air cooling, the opening / closing lid 53 of the chamber 50 opens, and the object to be heated 100 becomes in a state where it can be manually carried out.

[0030] Note that since the heating device 1 of this embodiment is a portable test device as described above, the loading and unloading of the object to be heated 100 and the opening and closing of the opening / closing lid 53 of the chamber 50 are configured to be manually performed. However, in the case of a mass-production device, these operations may be automatically performed. When configuring the heating device 1 as a mass-production device, the shape of the chamber 50 is preferably formed in consideration of heat retention and airtightness, and the size of the opening / closing lid 53 is preferably set to a size sufficient for loading and unloading the object to be heated 100. Further, the upper control device 80 may have a communication function with a device for transporting the object to be heated (not shown) or the like so as to be compatible with factory automation.

[0031] According to the heating device 1 of this embodiment, since the output of the main heat source 10 is PID-controlled based on the temperature of the object to be heated 100, the deviation between the actual temperature and the target temperature of the object to be heated 100 is reduced. Further, since the target temperature profile (second target temperature profile P2) of the auxiliary heat source 20 is set lower than the target temperature profile P2 of the main heat source, an appropriate auxiliary effect, that is, a relative cooling effect or a relative heating effect by the auxiliary heat source acts, and the tracking accuracy to the target temperature profile P1 can be improved. FIG. 4 is a graph showing the tracking performance of the heating device of this embodiment to the target temperature profile. Comparing with the graph showing the tracking performance of the conventional heating device shown in FIG. 5, it can be seen that the tracking accuracy is improved.

[0032] (PDI Coefficient Setting Method) Next, the method for setting the PID coefficients of the heating device 1 of this embodiment will be described with reference to FIG. 3. (1) Setting of Temperature Offset The temperature offset ΔT is the difference between the target temperature of the auxiliary heat source 20 and the target temperature of the main heat source 10. Since the optimum value of this temperature offset ΔT varies depending on the shape, size, heat capacity, etc. of the object to be heated 100, the optimum value is obtained by experiment or the like for each object to be heated 100 and set. However, even if the temperature offset ΔT is not optimized very strictly, it does not affect the final heating accuracy of the object to be heated 100.

[0033] (2) First Step First, heat the object to be heated 100 with only the auxiliary heat source 20 using the second target temperature profile P2 obtained by adding the temperature offset ΔT to the target temperature profile P1. Then, calculate and set the optimal PID coefficients (Kp2, Ti2, Td2) of the auxiliary heat source control device 70 from the difference between the actual temperature profile of the auxiliary heat source 20 and the second target temperature profile P2 at that time. The target temperature profile P1 and the second target temperature profile P2 are step-shaped temperature profiles. In this heating, the output of the auxiliary heat source 20 is PID-controlled with the default PID coefficients so that the temperature of the auxiliary heat source 20 detected by the auxiliary heat source temperature sensor 40 becomes the second target temperature profile P2. Then, the optimal PID coefficients (Kp2, Ti2, Td2) are calculated using the auto-tuning function of the auxiliary heat source control device 70 from the difference between the actual temperature profile of the auxiliary heat source 20 and the second target temperature profile. The calculation of the optimal PID coefficients in this auto-tuning function can be performed by any known calculation method, such as the Ziegler-Nichols step response method or the CHR method.

[0034] (3) Second step Next, while heating the object to be heated 100 by PID-controlling the temperature of the auxiliary heat source 20 with the second target temperature profile P2 by the auxiliary heat source control device 70 based on the set PID coefficients (Kp2, Ti2, Td2), calculate and set the optimal PID coefficients (Kp1, Ti1, Td1) of the main heat source control device 60 from the difference between the actual temperature profile of the object to be heated 100 and the target temperature profile P1 when the object to be heated 100 is heated with the target temperature profile P1 by the main heat source 10. In the heating by this main heat source 10, the output of the main heat source 10 is PID-controlled with the default PID coefficients so that the temperature of the main heat source 10 detected by the object-to-be-heated temperature sensor 30 becomes the target temperature profile P1. From the difference between the actual temperature profile of the object to be heated 100 and the target temperature profile P1 at that time, the optimal PID coefficients (Kp1, Ti1, Td1) are obtained and set by using the auto-tuning function of the main heat source control device 60. The calculation of the optimal PID coefficients in this auto-tuning function can be performed by any known calculation method, such as the Ziegler-Nichols step response method or the CHR method.

[0035] After this second step, if necessary, while controlling the temperature of the auxiliary heat source 20 to the second target temperature profile P2, the object to be heated 100 is heated to the target temperature profile P1 by the main heat source 10 at the same time, and it is confirmed that the difference between the actual temperature profile of the object to be heated 100 and the target temperature profile P1 at that time is within the target range. If it is within the target range, the setting is terminated, and if it is not within the target range, the first and second steps may be repeated.

[0036] According to the PID coefficient setting method of this embodiment, since the output of the main heat source is PID-controlled based on the temperature of the object to be heated at the time of setting, the deviation between the actual temperature and the target temperature of the object to be heated can be reduced. In addition, since the target temperature profile (second target temperature profile P2) of the auxiliary heat source is set to a temperature different from the target temperature profile P1 of the main heat source, an appropriate auxiliary effect, that is, a relative cooling effect or a relative heating effect by the auxiliary heat source works, and the tracking accuracy to the target temperature profile is improved. Therefore, satisfactory tracking accuracy can be obtained with a small number of PID coefficient settings, and the PID coefficient setting time can be shortened.

[0037] (Heating method) The heating method of this embodiment uses a heating device 1 including a main heat source 10 and a sub heat source 20 for heating an object to be heated 100, a main heat source control device 60 that performs PID control on the output of the main heat source 10 based on the temperature of the object to be heated 100, and a sub heat source control device 70 that performs PID control on the output of the sub heat source 20 based on the temperature of the sub heat source 20. While controlling the outputs of the main heat source and the sub heat source based on the PID coefficients set by the above PID coefficient setting method, it is a method of heating the object to be heated. Note that since the optimal PID coefficients and the optimal temperature offset ΔT vary depending on the shape and dimensions of the object to be heated 100 and the temperature profile of the heat treatment, it is preferable to set them for each object to be heated 100 and for each temperature profile of the heat treatment.

[0038] According to the heating method of the present invention, the effects of the heating device 1 of the above-described embodiment and the effects of the PID coefficient setting method of the above-described embodiment can be obtained, and the heating accuracy of the object to be heated 100 can be improved. Therefore, it contributes to the improvement of the product quality, and since the PID coefficient setting time can be shortened, the device operation rate can be improved and the productivity can be improved.

[0039] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited to such specific examples, and various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

[0040] For example, in each of the above embodiments, one main heat source and one sub heat source are used. However, two or more types of heat sources may be used in combination as the sub heat source. For example, as the sub heat source, a conduction heating type ceramic heater and a hot air heating type hot air heater may be used, and the temperature of the hot air may be PID controlled so as to become a second target temperature profile.

Industrial Applicability

[0041] The heating device and the PID setting method of the heating device according to the present invention can be widely used in the industrial fields of manufacturing semiconductors and automotive parts.

Explanation of Signs

[0042] 1 Heating device 10 Main heat source (halogen lamp heater) 20 Sub heat source (ceramic heater) 22 Hot plate 30 Heated object temperature sensor 40 Sub heat source temperature sensor 50 Chamber 51 Chamber body 52 Hinge 53 Opening / closing lid 53a Inner surface 53b Observation window 54 Buckle 60 Main heat source control device 70 Sub heat source control device 80 Upper-level control device 100 Heated object P1 Target temperature profile P2 Second target temperature profile ΔT Temperature offset

Claims

1. A heating device comprising a main heat source and a sub heat source for heating an object to be heated, a main heat source control device for controlling the output of the main heat source, and a sub heat source control device for controlling the output of the sub heat source, wherein the main heat source control device performs PID control on the output of the main heat source so that the temperature of the object to be heated becomes a predetermined target temperature profile, the sub heat source control device performs PID control on the output of the sub heat source so that the temperature of the sub heat source becomes a second target temperature profile obtained by adding a temperature offset to the target temperature profile, the setting of the PID coefficients of the main heat source control device and the PID coefficients of the sub heat source control device is performed using the stepped target temperature profile and the stepped second target temperature profile, the PID coefficients of the sub heat source control device are calculated and set from the difference between the actual temperature profile of the sub heat source and the second target temperature profile when the object to be heated is heated by the sub heat source according to the second target temperature profile, the PID coefficients of the main heat source control device are calculated and set from the difference between the actual temperature profile of the object to be heated and the target temperature profile when the object to be heated is heated by the main heat source according to the target temperature profile while heating the object to be heated by performing PID control on the temperature of the sub heat source according to the second target temperature profile by the sub heat source control device based on the set PID coefficients. A heating device.

2. The heating device according to claim 1, wherein the main heat source is a heat source for heating the object to be heated non - contact, and the sub heat source is a heat source for heating the object to be heated by heat conduction or proximity heating.

3. The heating device according to claim 2, wherein the main heat source is a lamp heater and the sub heat source is a ceramic heater.

4. The heating device according to claim 1, wherein the temperature of the object to be heated is measured by a non - contact or contact temperature sensor.

5. A method for setting the PID coefficients of a heating device comprising a main heat source and a sub heat source for heating an object to be heated, a main heat source control device for performing PID control on the output of the main heat source based on the temperature of the object to be heated, and a sub heat source control device for performing PID control on the output of the sub heat source based on the temperature of the sub heat source, The first step of calculating and setting the optimal PID coefficients of the auxiliary heat source control device from the difference between the actual temperature profile of the auxiliary heat source and the second target temperature profile when the object to be heated is heated with a stepped second target temperature profile obtained by adding a temperature offset to a stepped target temperature profile by the auxiliary heat source; The second step of calculating and setting the optimal PID coefficients of the main heat source control device from the difference between the actual temperature profile of the object to be heated and the target temperature profile when the temperature of the auxiliary heat source is PID-controlled with the second target temperature profile by the auxiliary heat source control device based on the set PID coefficients, and at the same time, the object to be heated is heated with the target temperature profile by the main heat source. A PID coefficient setting method including the above steps.

6. The PID coefficient setting method according to claim 5, wherein the main heat source is a heat source that heats the object to be heated by thermal radiation, and the auxiliary heat source is a heat source that heats the object to be heated by heat conduction or proximity heating.

7. The PID coefficient setting method according to claim 5, wherein the temperature of the object to be heated is measured by a non-contact or contact temperature sensor.

8. The PID coefficient setting method according to claim 5, wherein the setting of the PID coefficients is performed using the auto-tuning function of a thermostat.

9. Using a heating device including a main heat source and an auxiliary heat source for heating an object to be heated, a main heat source control device that PID-controls the output of the main heat source based on the temperature of the object to be heated, and an auxiliary heat source control device that PID-controls the output of the auxiliary heat source based on the temperature of the auxiliary heat source, A heating method for heating the object to be heated while controlling the outputs of the main heat source and the auxiliary heat source based on the PID coefficients set by the PID coefficient setting method according to any one of claims 5 to 8.

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