Waveguide

Abstract

To provide a waveguide capable of reducing loss due to conductor loss in high-frequency bands.SOLUTION: A waveguide includes: a first laminated board in which a first dielectric layer and multiple first conductor layers with first openings are stacked; a first group of through vias in which multiple first through vias electrically connecting between the first conductor layers are arranged linearly at intervals of half the wavelength or less of the electromagnetic waves propagating through the waveguide in the in-plane direction of the first laminated board; and a second group of through vias in which multiple second through vias electrically connecting between the first conductor layers are linearly arranged at said intervals in the in-plane direction. The waveguide does not include through vias other than the multiple first through vias and the multiple second through vias. The first group of through vias and the second group of through vias are arranged in a direction perpendicular to the direction of the electric field of the signal propagating in the thickness direction of the first laminated board in the in-plane direction and are arranged facing each other across the first opening.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a waveguide.

Background Art

[0002] As a means for transmitting high-frequency signals on a dielectric substrate, a microstrip line is often used. However, in frequency bands such as millimeter waves and terahertz waves, due to the skin effect, which is a high-frequency specific phenomenon, and the influence of surface irregularities, the transmission loss due to conductor loss increases.

[0003] In order to reduce such transmission loss, for example, as disclosed in Non-Patent Document 1, a waveguide structure in which electromagnetic waves propagate inside a dielectric substrate without having a conductor wiring may be used as a transmission line with low loss.

[0004] As a waveguide structure formed in a dielectric substrate, a waveguide structure in the plane of the substrate is common, in which an electrically grounded wiring layer is used as a top plate and a bottom plate, and vias connecting the top plate and the bottom plate are arranged on both sides as side walls.

[0005] As a waveguide in the substrate thickness direction in such a waveguide structure, for example, as disclosed in Patent Document 1, there is a structure in which copper foils having openings are laminated at intervals of λe / 2 (λe: effective wavelength of the signal to be transmitted) or less in the thickness direction, and vias are arranged around the openings.

[0006] The reason for arranging vias around the openings in this way is to approach a metal waveguide structure surrounded by metal walls on four sides and expect the effect of reliably suppressing the leakage of electromagnetic waves propagating inside.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Non-Patent Documents

[0008]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0009] However, in the technology described in Patent Document 1, in a high-frequency band such as 100 GHz or higher, losses due to conductor loss tend to become more prominent due to the current flowing through the surrounding through conductors.

[0010] Non-limiting examples of the present disclosure contribute to providing a waveguide capable of reducing losses due to conductor loss in a high-frequency band.

Means for Solving the Problems

[0011] A waveguide according to an embodiment of the present disclosure includes a first laminated substrate in which a first dielectric layer and a plurality of first conductor layers having first openings are laminated, and a plurality of first vias that electrically connect between the first conductor layers. A first via group linearly arranged at intervals of less than half the wavelength of the electromagnetic wave propagating through the waveguide in the in-plane direction of the first laminated substrate, and a plurality of second vias that electrically connect between the first conductor layers. A second via group linearly arranged at the intervals in the in-plane direction of the first laminated substrate, the waveguide does not include vias other than the plurality of first vias and the plurality of second vias, and the first via group and the second via group are arranged in the in-plane direction of the first laminated substrate in a direction orthogonal to the direction of the electric field of the signal propagating in the thickness direction of the first laminated substrate, and are arranged to face each other with the first opening interposed therebetween.

Advantages of the Invention

[0012] According to the present disclosure, it is possible to reduce the loss due to conductor loss in the high-frequency band.

[0013] Further advantages and effects in an embodiment of the present disclosure will be clarified from the specification and drawings. Such advantages and / or effects are respectively provided by several embodiments and the features described in the specification and drawings, but it is not necessary to provide all of them in order to obtain one or more identical features.

Brief Description of the Drawings

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Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with appropriate reference to the drawings. However, a more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially the same configurations may be omitted. This is to avoid making the following description unnecessarily redundant and to facilitate the understanding of those skilled in the art.

[0016] Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0017] (Embodiment 1) Hereinafter, Embodiment 1 will be described with reference to FIGS. 1 to 20.

[0018] [Example 1] <Configuration of Waveguide> FIG. 1 is a perspective view showing a waveguide 10 according to Example 1 of Embodiment 1 of the present disclosure, FIG. 2 is a cross-sectional view of the waveguide 10 taken along line A-A', and FIG. 3 is a cross-sectional view of the waveguide 10 taken along line B-B'. FIG. 4 is a plan view showing the waveguide 10 when viewed from the positive Z-axis direction of FIG. 1, and FIG. 5 is a view showing the electric field in the waveguide 10 when viewed from the positive Z-axis direction.

[0019] As shown in FIGS. 1 to 3, the waveguide 10 includes a laminated substrate 15 formed by laminating at least once a copper foil layer 12, which is an example of a conductor layer, and a dielectric layer 11, and a plurality of vias 13. Copper foil layers 12 are formed on both surfaces (the upper surface and the lower surface) of the laminated substrate 15 on which the waveguide 10 is formed. The plurality of vias (through vias) 13 are formed so as to electrically connect between at least two copper foil layers 12 and penetrate the dielectric layer 11 and the copper foil layer 12. Note that a semiconductor layer may be used instead of the dielectric layer 11.

[0020] As shown in FIGS. 1, 4, and 5, each copper foil layer 12 formed on the laminated substrate 15 has an opening 14 having a rectangular shape and is laminated in the substrate thickness direction (the direction parallel to the Z-axis in FIG. 1).

[0021] With such a configuration, the waveguide 10 can propagate electromagnetic waves (transmit (propagate) signals) in the substrate thickness direction within the substrate.

[0022] Here, when the wavelength of the electromagnetic wave transmitted through the waveguide 10 is λ, it is desirable that the thickness of the dielectric layer 11 be λe / 2 or less.

[0023] As shown in FIGS. 1, 4, and 5, the vias 13 that electrically connect the stacked copper foil layers 12 are linearly arranged (arrayed) at intervals of λe / 2 or less in the in-plane direction of the dielectric layer 11 and the copper foil layer 12 (in-plane direction of the substrate, for example, the XY plane in FIG. 1) near the long side (parallel to the X axis in FIG. 1) of the opening 14. Here, it is desirable that the interval d from the long side (opening end) shown in FIG. 4 to the via end be λ / 12 or less. In these figures, as an example, six vias 13, three each near one long side, are shown, but the number of vias 13 is not limited to six. In these figures, in the in-plane direction of the substrate, the intervals between the vias are equally spaced, but may be unequally spaced as long as they are λe / 2 or less.

[0024] Referring to FIG. 25, the results of an electromagnetic field simulation of S11 (reflection) among the S parameters (Scattering parameters) with the horizontal axis representing frequency and the vertical axis representing S11 are shown, where the interval d between the opening end and the via end in FIG. 4 is changed. The interval d was changed to 0, λ / 50, λ / 25, λ / 16.7, λ / 12.5, and λ / 10. Here, when the loss due to reflection is large, the transmission becomes small.

[0025] Referring to FIG. 26, the return loss at 300 GHz in FIG. 25 is shown, with the horizontal axis representing the distance (wavelength ratio) as the interval d and the vertical axis representing the return loss. When the threshold value of the return loss is set to 10 dB, since it is below the threshold value at λ / 10, in this embodiment, λ / 12 or less is defined as the vicinity.

[0026] When power is input to the waveguide 10, as shown in FIG. 5, an electric field 51 is generated in the short side direction of the opening 14 (parallel to the Y-axis in FIG. 1), and signals can be transmitted in the stacking direction of the dielectric layer 11 and the copper foil layer 12.

[0027] Here, the first via group above FIG. 5 and the second via group below FIG. 5 are arranged in a direction orthogonal to the direction of the electric field 51 of the signal propagating in the substrate thickness direction in the in-plane direction of the substrate, and are arranged to face each other with the opening 14 interposed therebetween (in the Z direction of FIG. 5). Alternatively, the via 13 may be expressed as being arranged along two straight lines extending two straight line segments (the long sides of the rectangle in this example) of the opening 14 that are orthogonal to the direction of the electric field 51 of the signal propagating in the substrate thickness direction in the in-plane direction of the substrate.

[0028] Note that when power is input to the waveguide 10, regardless of the shape of the opening, an electric field is generated in the short side direction of the opening.

[0029] [Comparative Example 1] FIG. 6 is a perspective view showing a waveguide according to a conventional example (Comparative Example 1). In Comparative Example 1, the same elements as those in Example 1 are denoted by the same reference numerals.

[0030] The difference between the waveguide 10 according to Example 1 and the waveguide according to Comparative Example 1 is that in the waveguide according to Comparative Example 1, vias 13 are also arranged near the short side of the opening 14. In FIG. 6, two vias 13, one on each short side, are arranged near the short side of the opening 14.

[0031] [Comparative Example 2] FIG. 7 is a perspective view showing a waveguide according to Comparative Example 2. In Comparative Example 2, the same elements as those in Example 1 are denoted by the same reference numerals.

[0032] The difference between the waveguide 10 according to Example 1 and the waveguide according to Comparative Example 2 is that in the waveguide according to Comparative Example 2, vias 13 are arranged in the short side direction of the opening 14. In FIG. 7, six vias 13, three on each short side, are arranged in the short side direction of the opening 14.

[0033] [Comparison Result 1] The inventors analyzed and compared the passing characteristics and conductor losses of the waveguide 10 according to Example 1, the waveguide according to Comparative Example 1, and the waveguide according to Comparative Example 2 by electromagnetic field simulation using the finite integration method.

[0034] FIG. 8 is a diagram showing the simulation results of the passing characteristics of the waveguide 10 according to Example 1, the waveguide according to Comparative Example 1, and the waveguide according to Comparative Example 2. In FIG. 8, the horizontal axis represents the frequency (unit: GHz), and the vertical axis represents the value of S21 (unit: dB), which is the S parameter indicating the passing characteristics.

[0035] From FIG. 8, it can be seen that the passing characteristics of the waveguide according to Comparative Example 2 are worse than those of the waveguide 10 according to Example 1 and the waveguide according to Comparative Example 1. Therefore, it can be understood that the waveguide according to Comparative Example 2 has a large loss and it is difficult for signals to pass through.

[0036] On the other hand, the passing characteristics of the waveguide 10 according to Example 1 and the passing characteristics of the waveguide according to Comparative Example 1 do not seem to have much difference in FIG. 8.

[0037] FIG. 9 is a diagram showing the simulation results of the passing characteristics of the waveguide according to Example 1 and the waveguide according to Comparative Example 1, in which the scale of the vertical axis in FIG. 8 is changed. In FIG. 9, the horizontal axis represents the frequency (unit: GHz), and the vertical axis represents the value of S21 (unit: dB).

[0038] From FIG. 9, it can be seen that the waveguide 10 according to Example 1 has a larger value of S21 and a smaller loss. Therefore, from the perspective of passing characteristics, it can be understood that the waveguide 10 according to Example 1 is better than the waveguide according to Comparative Example 1.

[0039] FIG. 10 is a diagram showing the simulation results of the conductor losses of the waveguide 10 according to Example 1 and the waveguide according to Comparative Example 1. Specifically, FIG. 10 shows the simulation results in which the conductor loss is extracted from the loss components at 300 GHz when a power of 0.5 W is input. In FIG. 10, the vertical axis represents the conductor loss (unit: W).

[0040] From FIG. 10, at 300 GHz, the conductor loss of the waveguide 10 according to Example 1 is smaller than the conductor loss of the waveguide according to Comparative Example 1. It can be seen that in the waveguide 10 according to Example 1, the conductor loss can be suppressed. In addition, from the perspective of conductor loss, it can be seen that the waveguide 10 according to the example is better than the waveguide according to Comparative Example 1.

[0041] FIG. 11 is a diagram showing another conductor loss simulation result of the waveguide 10 according to Example 1 and the waveguide according to Comparative Example 1. Specifically, FIG. 10 shows the simulation result of extracting the conductor loss among the loss components at 200 GHz when 0.5 W of power is input. In FIG. 11, the vertical axis represents the conductor loss (unit: W).

[0042] From FIG. 11, at 200 GHz as well, the conductor loss of the waveguide 10 according to Example 1 is smaller than the conductor loss of the waveguide according to Comparative Example 1. It can be seen that in the waveguide 10 according to Example 1, the conductor loss can be suppressed. In addition, from the perspective of conductor loss at 200 GHz, it can be seen that the waveguide 10 according to the example is better than the waveguide according to Comparative Example 1.

[0043] FIG. 12 is a diagram showing yet another conductor loss simulation result of the waveguide 10 according to Example 1 and the waveguide according to Comparative Example 1. Specifically, FIG. 12 shows the simulation result of extracting the conductor loss among the loss components at 100 GHz when 0.5 W of power is input. In FIG. 12, the vertical axis represents the conductor loss (unit: W).

[0044] From FIG. 12, at 100 GHz as well, the conductor loss of the waveguide 10 according to Example 1 is smaller than the conductor loss of the waveguide according to Comparative Example 1. It can be seen that in the waveguide 10 according to Example 1, the conductor loss can be suppressed. In addition, from the perspective of conductor loss at 100 GHz, it can be seen that the waveguide 10 according to the example is better than the waveguide according to Comparative Example 1.

[0045] As shown in FIGS. 10 to 12, the reason why conductor loss increases as the frequency increases is that the equivalent resistivity increases due to the skin effect.

[0046] As described above, it can be seen that the configuration of the waveguide 10 according to Embodiment 1 is effective at frequencies of 100 GHz or higher. This is because the total amount of current flowing around the waveguide 10 is reduced by the configuration of the waveguide 10 according to Embodiment 1.

[0047] Next, Embodiment 2 and Comparative Example 3 according to Embodiment 1 when the total number of vias 13 is the same will be examined.

[0048] [Embodiment 2] FIG. 13 is a plan view showing the waveguide 10 according to Embodiment 2 of Embodiment 1 when viewed from the positive Z-axis direction. In Embodiment 2, the same elements as those in Embodiment 1 are denoted by the same reference numerals. The difference between the waveguide 10 according to Embodiment 1 and the waveguide 10 according to Embodiment 2 is that in the waveguide 10 according to Embodiment 2, four vias 13 are arranged along a straight line extending the long side.

[0049] [Comparative Example 3] FIG. 14 is a plan view showing another waveguide according to Comparative Example 3 when viewed from the positive Z-axis direction. In Comparative Example 3, the same elements as those in Embodiment 1 are denoted by the same reference numerals. The difference between the waveguide 10 according to Embodiment 2 and the waveguide 10 according to Comparative Example 3 is that two vias 13 arranged at both ends of the two long sides of the waveguide 10 according to Embodiment 2 are respectively arranged near the two short sides.

[0050] [Comparison Results 2] Similar to the above, the present inventors analyzed and compared the passing characteristics of the waveguide 10 according to Embodiment 2 and the waveguide according to Comparative Example 3 by electromagnetic field simulation using the finite integration method.

[0051] FIG. 15 is a diagram showing the simulation results of the passing characteristics of the waveguide 10 according to Embodiment 2 and the waveguide according to Comparative Example 3. In FIG. 15, the horizontal axis represents the frequency (unit: GHz), and the vertical axis represents the value of S21 (unit: dB).

[0052] From FIG. 15, it can be seen that the waveguide 10 according to Example 2 has a larger S21 value and smaller loss, so the waveguide 10 according to Example 2 is better than the waveguide according to Comparative Example 3.

[0053] Thus, even when the total number of vias 13 is the same, arranging the vias in the long side direction of the opening 14 results in smaller loss. Therefore, it can be understood that the reduction of loss is an effect due to the arrangement direction of the vias 13.

[0054] In the above, an example where the shape of the opening 14 is rectangular as shown in FIG. 4 etc. has been described, but the present disclosure is not limited thereto. For example, the shape of the opening 14 may be trapezoidal (Example 3) as shown in FIG. 16, may be parallelogram-shaped (Example 4) as shown in FIG. 17, may be hexagonal (Example 5) as shown in FIG. 18, or may be an arbitrary polygon (Example 6) including an obtuse angle at the inner angle as shown in FIG. 19. Further, for example, the shape of the opening 14 may be an arbitrary shape without vertices (Example 7) as shown in FIG. 20. In these Examples 3 to 7, an electric field is generated in a direction parallel to the Y axis, and signals can be transmitted in the stacking direction of the dielectric layer 11 and the copper foil layer 12.

[0055] Here, the first via group above these figures and the second via group below these figures are arranged in a direction orthogonal to the direction of the electric field of the signal propagating in the substrate thickness direction in the in-plane direction of the substrate, and are arranged to face each other with the opening 14 in between. Alternatively, the via 13 may be expressed as being arranged along two straight lines extending two straight line segments of the opening 14 (two straight line segments extending in the X-axis direction in these examples) that are orthogonal to the direction of the electric field of the signal propagating in the substrate thickness direction in the in-plane direction of the substrate.

[0056] By having such a configuration, Examples 3 to 7 can achieve the same effects as Examples 1 and 2.

[0057] (Embodiment 2) Hereinafter, Embodiment 2 of the present disclosure will be described with reference to FIGS. 21 and 22. In the following, the same elements as those in Embodiment 1 are denoted by the same reference numerals, and the differences from Embodiment 1 will be described.

[0058] <Configuration of Waveguide> FIG. 21 is a perspective view showing a waveguide 20 according to Embodiment 2 of the present disclosure, and FIG. 22 is a cross-sectional view taken along the line C-C' of the waveguide 20.

[0059] The waveguide 20 includes a waveguide 10 according to Embodiment 1 and a post-wall waveguide 215. As shown in FIG. 21, the waveguide 10 and the post-wall waveguide 215 are formed in an L shape, and the waveguide 20 may be referred to as an L-shaped waveguide. Note that the post-wall waveguide 215 may be connected to the upper part of the waveguide 10 or the lower part of the waveguide 10.

[0060] The post-wall waveguide 215 includes a dielectric layer 211, a copper foil layer 212, and a plurality of vias 213.

[0061] The copper foil layer 212 on the lower surface of the post-wall waveguide 215, the dielectric layer 211, and the copper foil layer 212 on the upper surface of the post-wall waveguide 215 are sequentially laminated to form a laminated substrate.

[0062] The plurality of vias 213 are formed to electrically connect the copper foil layers 212 and penetrate the dielectric layer 211 and the copper foil layer 212. The plurality of vias 213 are arranged at intervals of λe / 2 or less and form two side walls.

[0063] In this way, by confining electromagnetic waves by the copper foil layers 212 and the vias 213 formed on both surfaces (upper surface and lower surface) of the laminated substrate on which the post-wall waveguide 215 is formed, electromagnetic waves can be propagated (signals can be transmitted) in the arrangement direction of the plurality of vias 213 (substrate horizontal direction) within the substrate.

[0064] As shown in FIG. 22, the post-wall waveguide 215 is connected to the waveguide 10 through the connection part opening 221. By making the opening 14 include the connection part opening 221 when viewed from the Z-axis direction in FIG. 22 and making the area of the connection part opening 221 smaller than the area of the opening 14, reflection of electromagnetic waves can be suppressed and impedance matching can be achieved. Note that it is desirable that the shape of the connection part opening 221 and the shape of the opening 14 be similar shapes.

[0065] Since the waveguide 20 is formed by combining the waveguide 10 that transmits signals in the substrate thickness direction and the post-wall waveguide 215 that transmits signals in the substrate horizontal direction through the opening 214, it is possible to convert the signal transmission direction by 90 degrees within the substrate.

[0066] (Embodiment 3) Hereinafter, Embodiment 3 of the present disclosure will be described with reference to FIGS. 23 and 24. In the following, the same elements as those in Embodiment 1 are denoted by the same reference numerals, and the differences from Embodiment 1 will be described.

[0067] <Configuration of waveguide> [Example 8] FIG. 23 is a perspective view showing a waveguide 30 according to Example 8 of Embodiment 3 of the present disclosure.

[0068] The waveguide 30 includes the waveguide 10 according to Embodiment 1 and a conductor (hereinafter, cavity) 231. The cavity 231 has an opening 232 having a rectangular shape. The cavity 231 may be connected to the upper part of the waveguide 10 or may be connected to the lower part of the waveguide 10.

[0069] The opening 232 may be filled with a dielectric or may be filled with air. The area of the opening 232 is larger than the area of the opening 14, the opening 232 includes the opening 14 when viewed from the Z-axis direction in FIG. 23, and radio waves can be transmitted and received through the opening 232. Therefore, the waveguide 30 may be used as an antenna. Note that the shape of the opening 14 and the shape of the opening 232 do not need to be similar shapes. For example, the aspect ratio of the opening 14 and the aspect ratio of the opening 232 may be different.

[0070] [Embodiment 9] FIG. 24 is a perspective view showing a waveguide 30 according to Embodiment 9 of Embodiment 3 of the present disclosure.

[0071] As can be seen from FIGS. 23 and 24, the waveguide 30 may be formed by replacing the cavity 231 with a laminated substrate having a dielectric layer 241, a copper foil layer 242, and vias 243, which are formed in the same manner as the waveguide 10 according to Embodiment 1. In FIG. 24, an example is shown in which vias 243 are provided over the entire periphery of the opening, as in the conventional example (Comparative Example 1). However, the vias 243 along the short side shown, for example, the vias 243 arranged along a straight line parallel to the electric field, may not be provided.

[0072] Also in Embodiment 9, the area of the opening 232 is larger than the area of the opening 14, the opening 232 includes the opening 14 when viewed from the Z-axis direction in FIG. 24, and radio waves can be transmitted and received through the opening 232. Therefore, this waveguide 30 may also be used as an antenna. Also in this case, the shape of the opening 14 and the shape of the opening 232 do not necessarily have to be similar. For example, the aspect ratio of the opening 14 and the aspect ratio of the opening 232 may be different.

[0073] (Effect in the embodiment) In an embodiment of the present disclosure, a waveguide (waveguide 10) includes a first dielectric layer (dielectric layer 11), a first laminated substrate (laminated substrate 15) in which a plurality of first conductor layers (copper foil layers 12) having first openings (openings 14) are laminated, a first through-via group in which a plurality of first through-vias (vias 13) that electrically connect between the first conductor layers are linearly arranged at intervals equal to or less than half the wavelength of an electromagnetic wave that propagates through the waveguide in the in-plane direction of the first laminated substrate, a second through-via group in which a plurality of second through-vias (vias 13) that electrically connect between the first conductor layers are linearly arranged at the above intervals in the in-plane direction of the first laminated substrate, the waveguide does not include through-vias other than the plurality of first through-vias and the plurality of second through-vias, the first through-via group and the second through-via group are arranged in a direction orthogonal to the direction of the electric field of a signal that propagates in the thickness direction of the first laminated substrate in the in-plane direction of the first laminated substrate, and are arranged to face each other with the first opening therebetween. With this configuration, the total amount of current flowing around the waveguide is reduced, so that losses due to conductor loss in the high-frequency band can be reduced. Also, compared with the conventional technique of arranging vias around the entire periphery of the opening, the number of vias is reduced, so that the manufacturing cost of the substrate can be reduced.

[0074] In an embodiment of the present disclosure, a waveguide (waveguide 30) includes the above waveguide (waveguide 10), a second dielectric layer (dielectric layer 241), a plurality of second conductor layers (copper foil layers 242) having second openings, and a second laminated substrate connected to the upper surface or the lower surface of the above waveguide and having a plurality of through-vias (vias 243) provided around the second openings and electrically connecting between the second conductor layers. The area of the second opening is larger than the area of the first opening. With this configuration, transmission and reception of radio waves are possible through the second opening, so that the waveguide can be used as an antenna.

[0075] In an embodiment of the present disclosure, a waveguide (waveguide 30) includes the above waveguide (waveguide 10), a conductor (conductor 231) having a third opening (opening 232) and connected to the upper surface or the lower surface of the above waveguide. The area of the third opening is larger than the area of the first opening. With this configuration, transmission and reception of radio waves are possible through the third opening, so that the waveguide can be used as an antenna.

[0076] In the embodiment of the present disclosure, the L-shaped waveguide (waveguide 20) includes the above-mentioned waveguide (waveguide 10) and a post-wall waveguide (post-wall waveguide 215) having a connection portion opening (connection portion opening 221) and connected to the upper or lower surface of the above-mentioned waveguide through the connection portion opening. The area of the connection portion opening is smaller than the area of the first opening. With this configuration, impedance matching can be achieved, and the signal transmission direction can be converted by 90 degrees within the substrate.

[0077] As described above, the embodiments have been described with reference to the drawings, but the present disclosure is not limited to such examples. It is obvious that those skilled in the art can conceive of various modification examples or correction examples within the scope described in the claims. Such modification examples or correction examples are also understood to belong to the technical scope of the present disclosure. Also, within the scope not departing from the gist of the present disclosure, the components in the embodiments may be arbitrarily combined.

Industrial Applicability

[0078] The present disclosure is useful for waveguides that transmit high-frequency signals.

Explanation of Signs

[0079] 10 Waveguide 11 Dielectric layer 12 Copper foil layer 13 Via 14 Opening 15 Multilayer substrate 51 Electric field 20 Waveguide 211 Dielectric layer 212 Copper foil layer 213 Via 214 Opening 215 Post-wall waveguide 221 Connection portion opening 30 Waveguide 231 Conductor 232 Opening 241 Dielectric layer 242 Copper foil layer 243 Via

Claims

1. A waveguide comprising: a first laminated substrate in which a first dielectric layer and a plurality of first conductor layers having first openings are laminated; a first group of through vias that electrically connect between the first conductor layers and are linearly arranged at intervals of half a wavelength or less of an electromagnetic wave that propagates through the waveguide in the in-plane direction of the first laminated substrate; a second group of through vias that electrically connect between the first conductor layers and are linearly arranged at the intervals in the in-plane direction of the first laminated substrate; wherein the waveguide does not include through vias other than the plurality of first through vias and the plurality of second through vias; the first group of through vias and the second group of through vias are arranged in a direction orthogonal to the direction of the electric field of a signal propagating in the thickness direction of the first laminated substrate in the in-plane direction of the first laminated substrate, and are arranged to face each other with the first opening therebetween; a waveguide.

2. At least one of the plurality of first through vias and the plurality of second through vias is arranged at equal intervals in the in-plane direction of the first laminated substrate. The waveguide according to claim 1.

3. At least one of the plurality of first through vias and the plurality of second through vias is arranged at unequal intervals in the in-plane direction of the first laminated substrate. The waveguide according to claim 1.

4. The shape of the first opening is rectangular, the plurality of first through vias are arranged along a straight line extending one long side of the rectangle, and the plurality of second through vias are arranged along a straight line extending the other long side of the rectangle. The waveguide according to any one of claims 1 to 3.

5. The waveguide according to any one of claims 1 to 4, and a second laminated substrate connected to the upper surface or the lower surface of the waveguide, in which a second dielectric layer and a plurality of second conductor layers having second openings are laminated, and which has a plurality of through vias provided around the second openings and electrically connecting between the second conductor layers; wherein the area of the second opening is larger than the area of the first opening. a waveguide.

6. The waveguide according to any one of claims 1 to 4, and a conductor having a third opening and connected to the upper surface or the lower surface of the waveguide; wherein the area of the third opening is larger than the area of the first opening. a waveguide.

7. The waveguide according to any one of claims 1 to 4, and A post-wall waveguide having a connection part opening and connected to the upper or lower surface of the waveguide through the connection part opening, comprising, the area of the connection part opening is smaller than the area of the first opening, an L-shaped waveguide.

8. the shape of the connection part opening and the shape of the first opening are similar, the L-shaped waveguide according to claim 7.

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