Pattern fuse including an opening and battery module including the same

Abstract

The present invention relates to a pattern fuse including a flame-retardant coating layer and an opening that can prevent ignition due to overcurrent generated during operation of a circuit pattern and can specify a disconnection position, a flexible printed circuit board including the same, and a battery module including the same. The operation of the pattern fuse can prevent ignition even when heated to a high temperature, and can have the effect of disconnecting by melting at a specific position.

Description

Technical Field

[0001] This application claims the benefit of priority based on Korean Patent Application No. 2022-0019952, filed on February 16, 2022, and all the contents disclosed in the literature of the Korean patent application are incorporated herein by reference in their entirety.

[0002] The present invention relates to a patterned fuse including an opening and a battery module including the same. More specifically, the present invention relates to a flame-retardant coating layer and a patterned fuse including an opening that prevent ignition due to overcurrent generated during the operation of a circuit pattern and can specify a disconnection position, a flexible printed circuit board including the same, and a battery module including the same.

Background Art

[0003] With the increasing development of technologies and demand for mobile devices such as smartphones, notebook computers, and digital cameras, technologies related to rechargeable secondary batteries have been actively studied. In addition, secondary batteries are alternative energy sources for fossil fuels that generate air pollutants and are applied to electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and energy storage devices (ESSs).

[0004] Currently widely used types of secondary batteries include lithium-ion batteries, lithium polymer batteries, nickel-cadmium batteries, nickel-metal hydride batteries, nickel-zinc batteries, and the like. Such unit secondary battery cells can also be connected in series or in parallel to form a battery module according to the required output voltage or charge-discharge capacity, and it is common to fabricate a battery pack by adding additional components using at least one such battery module.

[0005] Such a battery pack can be applied with various circuit boards as needed, such as a substrate of a protection circuit module (PCM) that can control charging and discharging of battery cells or protect battery cells, and a sensing substrate for sensing voltage and the like.

[0006] Such a circuit board generally includes a fuse element to prevent fires and explosions of the battery pack due to overcurrent or short-circuit current.

[0007] Patent Document 1 discloses a battery pack in which a fuse pattern having an overcurrent or short-circuit current cutoff function is formed on a circuit board instead of such a fuse element.

[0008] In FIG. 1, in a battery pack including a plurality of battery cells C1, C2, and C3, a connection circuit board 20 that connects the main circuit board 30 and the battery cell C is interposed, and the connection circuit board 20 includes a conductive pattern L including a fuse pattern F and a connection pattern N.

[0009] When such a fuse pattern F is located between the electrode tab 22 and the main circuit board 30, there is an advantage that no work of mounting a separate fuse element or space for the fuse element is required. However, although the conductive pattern is generally manufactured from a metal such as copper, such a metal has a very high melting point (the melting point of copper is about 1085°C), and thus extremely high heat and sparks may be instantaneously generated during the operation of the fuse pattern.

[0010] Fuse elements are installed to protect each functional element installed in an electric circuit from an unintended large current. The fuse element cuts off the current when a current equal to or greater than a certain value flows in order to prevent each functional element from being damaged. When constructing an electric circuit using a conventional printed wiring board, a board-mounted fuse with lead wires was used. Such a mounted fuse is mounted on the printed wiring board by soldering.

[0011] Recently, for example, in vehicle electronic devices, an electric circuit using a flexible printed circuit board has been developed instead of a conventional printed wiring board. Since a flexible printed circuit board can form wirings and functional elements on a flexible film as a base material, it is thinner and can be bent compared to a conventional printed wiring board. When forming a fuse element on a flexible printed circuit board, for example, in a vehicle electronic device, when a chip fuse has to operate due to stress such as vibration or heat during vehicle travel, problems have occurred due to a fuse wire detached from the adhesive layer due to heat generation.

[0012] Therefore, when various problems due to short circuit or over current occur in a printed circuit board (PCB) or a flexible printed circuit board (FPCB) in which various circuit patterns implemented for sensing voltage, current, temperature, etc. are implemented, a patterned fuse line has to short circuit, but a problem occurs in that the movement of the shorted fuse line and which part of the fuse line the short circuit occurs in cannot be predicted, so the over current persists and there is a possibility of a fire due to heat generation.

[0013] Therefore, there is a need to accurately form a disconnection of a circuit line by fusing due to over current at a specific part on a flexible printed circuit board, but no technical development for this has been confirmed, so technical development for this is required.

Prior Art Documents

Patent Documents

[0014]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Summary of the Invention

Problems to be Solved by the Invention

[0015] In order to solve the above - mentioned problems, the present invention provides a pattern fuse including a flame - retardant coating layer and an opening, which can prevent ignition caused by over - current generated during the operation of a circuit pattern and specify a disconnection position, a flexible printed circuit board including the same, and a battery module including the same.

Means for Solving the Problems

[0016] The pattern fuse according to the present invention for achieving the above - mentioned object is a pattern fuse having a predetermined length so as to cut off current by fusing and including a first electro - conductive line portion located in one or more openings formed in a first film layer.

[0017] Further, the pattern fuse may include a coating layer formed on a first surface of the first film layer.

[0018] The first electro - conductive line portion may include any one or more of a linear shape, a curved shape, a pattern shape, or an amorphous shape.

[0019] The portion of the first conductive line portion that is not located in the opening can be covered with the first film layer.

[0020] The coating layer can be formed so as to completely cover the first film layer in contact with the first conductive line portion.

[0021] The pattern fuse includes an adhesive layer formed on the second surface of the first film layer, an adhesive layer formed on the adhesive layer in contact with the second surface of the first conductive line portion, and a second film layer formed on the surface opposite to the surface of the adhesive layer on which the first conductive line portion is formed.

[0022] The adhesive force between the first conductive line portion and the adhesive layer may be greater than the adhesive force between the first conductive line portion and the coating layer.

[0023] The melting point of the coating layer may be higher than the melting point of the first film layer, and the thermal conductivity of the coating layer may be lower than the thermal conductivity of the first film layer.

[0024] The ratio (AEC / AOP) of the area (AEC) of the first conductive line portion located in the opening to the area (AOP) of the opening can be 1 to 0.01.

[0025] The opening can have any one or more shapes among circular, triangular, square, polygonal, and amorphous.

[0026] Further, the present invention provides a flexible printed circuit board including the pattern fuse.

[0027] The battery module according to the present invention for achieving other objects as described above includes a battery cell, a BMS for monitoring the voltage, current, and temperature of the battery cell, and a flexible printed circuit board connected to the battery cell and the BMS. The flexible printed circuit board includes a pattern fuse having a predetermined length so as to cut off current by fusing, and including a first conductive line portion located in one or more openings formed in a first film layer.

[0028] Further, the device can be an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV).

Advantages of the Invention

[0029] Since the pattern fuse of the present invention is provided with a flame retardant coating layer, it is possible to prevent arc discharge or sparks generated during the operation of the pattern fuse from being discharged to the outside.

[0030] Further, since the circuit board of the present invention includes the pattern fuse of the present invention, it has the advantage of having the function of a fuse without the process of mounting a separate fuse element.

[0031] Further, the flexible printed circuit board including the pattern fuse of the present invention induces heat concentration so that disconnection by fusing occurs at a specific position, and thus has the effect of inducing disconnection in the shortest time possible.

[0032] Further, the flexible printed circuit board including the pattern fuse of the present invention has the effect of preventing overheating and ignition from occurring in other regions.

[0033] In addition, the flexible printed circuit board including the pattern fuse of the present invention ensures the reproducibility of the disconnection operation by inducing disconnection in a corresponding specific region. Therefore, contrary to expectations, it is possible to prevent problems such as a short circuit that may occur when the disconnected fuse wire moves due to the dissolution of the adhesive layer.

Brief Description of the Drawings

[0034]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Modes for Carrying Out the Invention

[0035] In this application, terms such as "comprising", "having", or "including" are intended to specify the presence of the features, numbers, steps, components, parts, or combinations thereof described in the specification, and should not be construed as precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0036] Also, the same reference numerals are used for parts having similar functions and operations throughout the drawings. Throughout the specification, when a part is said to be connected to another part, this includes not only the case where it is directly connected, but also the case where it is indirectly connected with other elements interposed therebetween. Also, including a certain component means, unless otherwise specified to the contrary, not excluding other components, but further including other components.

[0037] Hereinafter, the pattern fuse according to the present invention will be described with reference to the accompanying drawings.

[0038] FIG. 2 is an exploded perspective view schematically showing a pattern fuse according to an embodiment of the present invention.

[0039] Referring to FIGS. 2 to 4, the pattern fuse 100 of the present invention will be described. The pattern fuse 100 includes a second film layer 150, an adhesive layer 140, a conductive wire 110, a first film layer 120, and a coating layer 130.

[0040] The conductive wire 110 can be composed of a first conductive wire portion 111 and a second conductive wire portion 112. Usually, fusing occurs in the first conductive wire portion 111.

[0041] The conductive wire 110 is not limited to its material as long as it can be formed of a conductive substance. Preferably, it can be composed of either electrolytic foil (ED) or rolled foil (RA). Preferably, it can be made of rolled copper foil. The rolled copper foil has excellent bend resistance, high density, and a difficult production process, but may be advantageous for moving parts.

[0042] First, the second film layer 150 serves to insulate the conductive conductive line 110 from the outside and can be formed from a variety of known insulating polymer materials.

[0043] In particular, as the material of the second film layer 150, polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), etc., which have excellent thermal properties, are preferable, and among them, polyimide (PI) is most preferable in terms of thermal properties.

[0044] The adhesive layer 140 located above the second film layer 150 is a layer for attaching the conductive line 110 to the second film layer 150, and its material is not particularly limited as long as it can adhere the conductive line 110.

[0045] Here, the above-mentioned conductive line 110 is fixed to the upper part of the second film layer 150 via the adhesive layer 140, but a part of the conductive line 110 may be in a state of slightly sinking into the adhesive layer 140.

[0046] The conductive line 110 is designed to be advantageous for heat generation using a conductive material such as copper, and as shown in FIG. 2, it can be formed not only in a curved waveform but also in various known forms.

[0047] Also, the conductive line 110 can be formed from the same material as the conductive wires (not shown) on both sides connected to the conductive line 110, or can be formed from a different material with a melting point lower than that of the conductive wires on both sides. The thickness of the conductive line 110 and the conductive wires on both sides, the length of the conductive line 110, etc. can be appropriately designed according to the operating conditions of the pattern fuse 100.

[0048] Next, the first film layer 120 will be described. Similar to the aforementioned second film layer 150, the first film layer 120 serves as an insulation function from the outside. Therefore, it can be formed from the same material as the second film layer 150, but is not limited thereto and can be formed from various insulating polymer materials.

[0049] On the other hand, as shown in FIG. 2, an opening 121 is formed in the central portion of the first film layer 120 such that a part of the conductive wire 110, more specifically, a part or all of the first conductive wire portion 111 is exposed.

[0050] And such an opening 121 is covered by the coating layer 130. The coating layer 130 is a layer for preventing a fire caused by heat generation or sparking of the conductive wire 110.

[0051] As described above, when the pattern fuse operates, the temperature rises to the extent that the material constituting the conductive wire 110 melts. Generally, the film layer covering the circuit pattern has poor flame retardancy and frequently leads to fires.

[0052] Of course, a material with excellent flame retardancy can be adopted for the film layer covering the circuit pattern. However, since it has to be provided even in the portion without the circuit pattern, there is a problem of increased cost.

[0053] Here, as the material of the flame retardant coating layer, it is preferable to use a flame retardant composition having an electrical insulation property and being of V-0 grade based on the UL94V test, which is one of the plastic material flame retardancy tests.

[0054] The UL94V test is to evaluate the combustion state of the product and the degree of flame propagation to the surroundings when a spark is applied vertically to a plastic product. It can be classified into grades V-0, V-1, V-2, etc. according to the combustion time, etc. Among these, the V-0 grade has the highest flame retardancy.

[0055] Here, the flame-retardant composition means a composition in which a flame retardant and various additives are added to a polymer resin composition to enhance its flame retardancy.

[0056] Examples of polymer resins that can form such flame-retardant compositions include various known materials such as polyurethane, urethane, epoxy, and acryl.

[0057] In particular, the conductive wire 110 generates heat. At this time, the lower the heat absorption and thermal conductivity of the coating layer 130 covering the conductive wire 110, the earlier the conductive wire 110 will be disconnected, so that an overcurrent can be interrupted earlier.

[0058] Therefore, among various polymer resins, a composition mainly containing urethane-based, polyurethane-based, or a mixture of polyurethane and polyacryl, which has relatively low heat absorption and thermal conductivity, may be appropriate.

[0059] Since the properties of the polymer resin can vary depending on the ratio of the materials and physical property values, it is obvious that it can be selected and applied according to the actual heat absorption and thermal conductivity when selecting the resin. As an example, the thermal conductivity is preferably 0.10 W / mK or less, and more preferably 0.05 W / mK or less.

[0060] Outside the above range, the coating layer cannot function properly.

[0061] Of course, it is obvious that the flame-retardant composition for forming the flame-retardant coating layer can include various additives usually contained.

[0062] In addition, an inorganic filler for improving flame retardancy, such as glass fiber or spherical silica, can be added alone or in combination.

[0063] On the one hand, when the area of the coating layer 130 is formed smaller than that of the opening 121, the lower conductive wire 110 cannot be completely blocked from the outside. Therefore, it is preferably the same as the area of the opening 121 so that only the opening 121 can be covered, and it is more preferable that it is slightly larger than the opening 121 so as to partially overlap with the edge of the opening 121 including the opening 121.

[0064] Also, the ratio (AEC / AOP) of the area (AEC) of the first conductive wire portion located in the opening to the area (AOP) of the opening can be 1 to 0.01. Preferably, it can be 1 to 0.5, and more preferably, it can be 1 to 0.8. If it is outside the above range, the wire-breaking function by fusing in the opening may not be realized normally.

[0065] Next, a method for manufacturing the pattern fuse of the present invention will be described.

[0066] FIG. 3 is an exploded perspective view schematically showing a pattern fuse with an opening formed according to an embodiment of the present invention.

[0067] The first conductive wire portion having a predetermined length so as to cut off the current by fusing may be a pattern fuse located in one or more openings formed in the first film layer.

[0068] It is obvious that the predetermined length of the first conductive wire portion can vary depending on the rated current of the fuse to be implemented. When the rated current of the fuse is low, generally, in order to increase the resistance, the length can be increased or the width can be narrowed. When the rated current of the fuse is high, in order to decrease the resistance, the length can be decreased or the width can be widened.

[0069] As an example, for a configuration with a low rated current, the length can be 50 mm. If it is outside this range, fusing may not occur effectively.

[0070] The predetermined length can be implemented in the range of about 0.01 μm to 500 mm.

[0071] As an example, for a configuration with a low rated current, the cross-sectional area forming the width of the first conductive wire portion can have a uniform cross-sectional area over the entire region of the first conductive wire portion where the pattern fuse is embodied, or the width can be wider or narrower at a specific portion of the first conductive wire portion. Obviously, this can be changed according to the rated current of the fuse for generating a fuse break at a predetermined position and under predetermined conditions of the first conductive wire portion.

[0072] As an example, it is obvious that the cross-sectional shape of the width can have any one or more forms among square, circular, triangular, and amorphous.

[0073] The first film layer can select any one of Polyimide (PI), Polyethylene naphthalate (PEN), and polyethylene terephthalate (PET). In the selection of the material of the first film layer, as an example, since the characteristics of the material can be changed by the proportion of the material and physical property values, it is obvious that it can be selected and applied according to the actual heat absorption and thermal conductivity during resin selection.

[0074] Figure 4 is a (a) cross-sectional view cut along the A-A line of Figure 3 and a (b) cross-sectional view cut along the B-B line.

[0075] The first conductive wire portion can have any one or more shapes among linear, curved, patterned, or amorphous.

[0076] The shape of the first conductive wire portion is not limited to a specific shape or form as long as the resistance value for the disconnection characteristics (such as applied current and disconnection time) to be embodied by the length of the first conductive wire portion formed per unit area can be embodied.

[0077] It is not only good for the resistance to increase, but depending on the disconnection characteristics to be realized, the resistance can also decrease or increase.

[0078] The conductive wire part can be composed of copper foil forming a circuit. Preferably, it can be composed of rolled foil or electrolytic foil.

[0079] The conductive wire part can be composed of an electroconductive wire.

[0080] The conductive wire part can be composed of a second conductive wire part that forms the flow of current due to the energization of the circuit, and a first conductive wire part that causes fusing to occur due to heat generation caused by an increase in resistance on the circuit when an overcurrent occurs, thereby disconnecting the circuit and interrupting the current.

[0081] FIG. 5 is an exploded perspective view schematically showing a pattern fuse according to an embodiment of the present invention, on which a coating layer and an opening are formed.

[0082] The pattern fuse can include a coating layer formed on the first surface of the first film layer.

[0083] The coating layer can be formed by applying a flame-retardant composition to the opening and curing it.

[0084] The coating layer is a film formed by applying a flame-retardant composition to the opening, and can seal the opening.

[0085] The coating layer can be composed of a flame-retardant material.

[0086] The flame-retardant composition can be a flame-retardant composition having a flame-retardant grade of V-0 according to the UL94 standard.

[0087] The flame retardant composition can be a polyurethane-based or urethane-based composition. Preferably, the flame retardant composition can include an inorganic filler, and the inorganic filler can be any one or more selected from glass fiber and spherical silica. The flame retardant composition is an example in the case of applying polyurethane-based and polyacrylic-based coating agents, and it is obvious that it can be variously selected depending on the change of the coating agent, the form of the coating layer, and the application conditions.

[0088] The coating layer can have a lower thermal conductivity than the first film layer.

[0089] Figure 6 is a (a) cross-sectional view taken along line A-A of Figure 5 and a (b) cross-sectional view taken along line B-B.

[0090] The first conductive wire portion not located in the opening portion can be covered with the first film layer.

[0091] The coating layer can be formed to completely cover the first film layer in contact with the first conductive wire portion.

[0092] The pattern fuse can include an adhesive layer formed on the second surface of the first film layer and a second film layer formed on the opposite surface of the adhesive layer in contact with the second surface where the first conductive wire portion is formed.

[0093] The adhesive force between the first conductive wire portion and the adhesive layer may be greater than the adhesive force between the first conductive wire portion and the coating layer.

[0094] The adhesive force between the first conductive wire portion and the adhesive layer may be smaller than the adhesive force between the first conductive portion and the coating layer.

[0095] If the adhesive force between the first conductive wire portion and the adhesive layer is stronger than the adhesive force between the first conductive wire portion and the coating layer, when gas is generated between the first film layer and the adhesive layer due to vaporization of the first conductive wire portion caused by overheating, a space may be generated between the first conductive wire portion and the coating layer.

[0096] The first conductive wire portion, the adhesive layer, and the second film layer can be defined as being below the pattern fuse of the flexible printed circuit board.

[0097] The first conductive wire portion, the first film layer including the opening, and the coating layer can be defined as being above the pattern fuse of the flexible printed circuit board.

[0098] When the first conductive wire portion formed in the pattern form vaporizes due to overheating and gas is generated, a space may be generated above the pattern fuse rather than below the pattern fuse due to the difference in adhesive force.

[0099] The melting point of the coating layer may be higher than that of the first film layer, and the thermal conductivity of the coating layer may be lower than that of the first film layer.

[0100] The melting point of the coating layer may be higher than that of the first film layer, and the thermal conductivity of the coating layer may not be lower than that of the first film layer.

[0101] It is obvious that the melting point and thermal conductivity of the coating layer can be changed by the material of the coating layer, the formation conditions, and the material selection according to the operating conditions of the pattern fuse.

[0102] FIG. 7 is a conceptual diagram of the form and area of the opening and the first conductive wire portion.

[0103] The area (AOP) of the opening may be the same as or larger than the area (AEC) of the first conductive wire portion located in the opening.

[0104] The present invention can provide a flexible printed circuit board including the pattern fuse.

[0105] The flexible printed circuit board may be any one of a single-sided type consisting of a cover layer (Cover Layer) composed of a film layer and an adhesive layer, and a copper-clad laminate (CCL, Copper Clad Laminate) composed of a conductive metal wire and a film layer, a double-sided type composed of two cover layers and one copper-clad laminate, a multi-layer type composed of three or more cover layers and copper-clad laminates, a double access type composed of two cover layers and a conductive metal wire, a rigid type, and a build-up type.

[0106] (Example) In this experiment, the pattern fuse was blown by applying 500% of the rated current. The rated current of the fuse is 1A and the test current is 5A.

[0107] FIG. 8 is an X-ray photograph taken of the opening formed by fusing in accordance with an embodiment of the present invention, in which the first conductive wire portion is disconnected.

[0108] According to the verification result of the operability of the pattern fuse structure of the present invention, it was confirmed that when the pattern fuse was disconnected, there was no movement of the pattern, and the disconnection sites of all samples were located at the opening.

[0109] From this, it can be confirmed that heat accumulates most quickly in the opening due to its structure, and it can be confirmed that the reliability of the disconnection operation of the pattern fuse is ensured by ensuring reproducibility.

[0110] (Comparative Example) This experiment was conducted under the same experimental conditions as those in the above-described examples, except that the experiment was carried out using a pattern fuse without the first film layer in which the opening of the present invention was formed, and the experiment was carried out under the same conditions.

[0111] FIG. 9 is an X-ray photograph taken as a comparative example, showing the case (a) where the first conductive wire portion is disconnected without an opening, and the case (b) where a short circuit occurs after the first conductive wire portion is disconnected.

[0112] Interpretation of Experimental Results Looking at the results of the comparative example, it is a case where a pattern fuse copper foil and a film layer, which are the structures of existing pattern fuses, are formed. As shown in FIG. 9(a), a part of the pattern fuse can be appropriately disconnected, but as shown in FIG. 9(b), after being disconnected, it can be confirmed that there may be a risk that short circuit and insulation resistance cannot be ensured due to the movement of the pattern.

[0113] Also, as shown in FIG. 9(a), since the disconnection site of the pattern fuse is formed randomly, it can be confirmed that there is a problem that it is difficult to ensure the position reproducibility of the disconnection region.

[0114] Referring to FIGS. 2 to 6 and explaining, the method for manufacturing the above-described pattern fuse 100 includes a first step of preparing a second film layer 150, a second step of forming an adhesive layer 140 on the upper part of the second film layer 150, a third step of seating a conductive wire 110 on the upper part of the adhesive layer 140, a fourth step of laminating a first film layer 120 provided with an opening 121, and a fifth step of forming a coating layer 130.

[0115] On the other hand, the conductive wire 110 can be seated on the upper part of the adhesive layer 140 with a pattern prepared in a desired shape in advance, or can be immediately formed in a desired shape on the upper part of the adhesive layer 140.

[0116] Also, in the fourth step of laminating the first film layer 120, after laminating the first film layer 120 on top of the adhesive layer 140 with the conductive line 110 mounted, it is possible to remove the region corresponding to the opening 121 so that part or all of the conductive line 110 is exposed. However, it is more preferable to laminate the first film layer 120 with the opening 121 formed in advance.

[0117] Also, in the fifth step of forming the coating layer 130 in the opening 121, the coating layer 130 can be formed by applying a flame-retardant composition to the opening 121 and curing it, or after preparing a thin film-like coating layer 130 in advance, it can also be laminated so as to cover the opening 121.

[0118] The pattern fuse 100 described above can be formed in the above-described process at a certain position on a circuit board such as a PCB (Printed Circuit Board) or an FPCB (Flexible PCB) and applied to various devices such as a battery pack.

[0119] Of course, when forming the pattern fuse 100 on the circuit board, in some cases, part or all of the second film layer 150 or the adhesive layer 140 may not be formed, and the conductive line 110 can be directly formed on the substrate.

[0120] Although the specific part of the content of the present invention has been described in detail above, such a specific technology is only a preferred embodiment for those with ordinary knowledge in the art, and the scope of the present invention is not limited thereby. It is obvious to those skilled in the art that various changes and modifications are possible within the scope of the present invention and the scope of the technical idea. Needless to say, such variations and modifications also belong to the scope of the appended claims.

Description of Reference Numerals

[0121] 100 Pattern Fuse 110 Conductive Line (ElectroConductive Line) 111 First ElectroConductive Lineportion 112 Second ElectroConductive Lineportion 120 First Film Layer 121 Opening 122 First Surface 123 Second Surface 130 Coating Layer 140 Adhesive Layer 150 Second Film Layer

Claims

1. A pattern fuse having a predetermined length to cut off current by fusing, and including a first electroconductive line portion located in one or more openings formed in a first film layer, wherein a portion of the first electroconductive line portion not located in the opening is covered by the first film layer.

2. A pattern fuse having a predetermined length to cut off current by fusing, and including a first electroconductive line portion located in one or more openings formed in a first film layer, a coating layer formed on a first surface of the first film layer, an adhesive layer formed on a second surface of the first film layer, the adhesive layer being formed on the adhesive layer where the first electroconductive line portion is in contact with the second surface, and a second film layer formed on a surface opposite to the surface of the adhesive layer on which the first electroconductive line portion is formed, wherein an adhesive force between the first electroconductive line portion and the adhesive layer is greater than an adhesive force between the first electroconductive line portion and the coating layer.

3. The pattern fuse according to claim 1, including a coating layer formed on a first surface of the first film layer.

4. The pattern fuse according to claim 1 or 2, wherein the first electroconductive line portion includes one or more shapes of linear, curved, patterned or amorphous.

5. The pattern fuse according to claim 2, wherein a portion of the first electroconductive line portion not located in the opening is covered by the first film layer.

6. The pattern fuse according to claim 2 or 3, wherein the coating layer is formed to completely cover the first film layer in contact with the first electroconductive line portion.

7. An adhesive layer formed on a second surface of the first film layer, the adhesive layer being formed on the adhesive layer where the first electroconductive line portion is in contact with the second surface, and a second film layer formed on a surface opposite to the surface of the adhesive layer on which the first electroconductive line portion is formed,

8. The pattern fuse according to claim 7, wherein an adhesive force between the first electroconductive line portion and the adhesive layer is greater than an adhesive force between the first electroconductive line portion and the coating layer.

9. The melting point of the coating layer is higher than the melting point of the first film layer, and the thermal conductivity of the coating layer is lower than the thermal conductivity of the first film layer. The pattern fuse according to claim 2 or 3.

10. The ratio (AEC / AOP) of the area (AEC) of the first conductive line portion located in the opening to the area (AOP) of the opening is 1 to 0.

01. The pattern fuse according to claim 1 or 2.

11. The opening has any one or more shapes among circular, triangular, square, polygonal, and amorphous. The pattern fuse according to claim 1 or 2.

12. A flexible printed circuit board including the pattern fuse according to claim 1 or 2.

13. A battery cell, A BMS for monitoring the voltage, current, and temperature of the battery cell, A flexible printed circuit board connected to the battery cell and the BMS, including: The flexible printed circuit board has a predetermined length so as to cut off current by fusing, and includes a pattern fuse including a first conductive line portion located in one or more openings formed in the first film layer. A battery module, wherein a portion of the first conductive line portion not located in the opening is covered by the first film layer.

14. A battery cell, A BMS for monitoring the voltage, current, and temperature of the battery cell, A flexible printed circuit board connected to the battery cell and the BMS, including: The flexible printed circuit board has a predetermined length so as to cut off current by fusing, and includes a pattern fuse including a first conductive line portion located in one or more openings formed in the first film layer. A coating layer formed on a first surface of the first film layer, An adhesive layer formed on a second surface of the first film layer, the adhesive layer on which the first conductive line portion is formed in contact with the second surface, A second film layer formed on a surface opposite to the surface of the adhesive layer on which the first conductive line portion is formed, including: A battery module, wherein the adhesive force between the first conductive line portion and the adhesive layer is greater than the adhesive force between the first conductive line portion and the coating layer.

15. A device including the battery module according to claim 13 or 14.

Images