Method for manufacturing semiconductor component and semiconductor component manufacturing apparatus

Abstract

To provide a method and an apparatus for manufacturing a semiconductor component that can manufacture a large number of semiconductor components from one lead frame.SOLUTION: A semiconductor component has resin parts 21 in which semiconductor chips are sealed with a resin, and a plurality of lead parts 22 projecting in a common direction from one surfaces of the resin parts 21. A method for manufacturing a semiconductor component includes the steps of: cutting a lead frame 3 in which the plurality of resin parts 21 are formed, and thereby singulating the plurality of resin parts 21; and extending the lengths of the plurality of lead parts 22 projecting from the singulated resin parts 21. In the lead frame 3, the projection surfaces of the respective resin parts 21 where the lead parts 22 project face the projection surfaces of the other resin parts 21, and the projection ends of the two lead parts 22 projecting from each of the two projection surfaces facing each other are connected to each other.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a method for manufacturing semiconductor components and a manufacturing apparatus for semiconductor components.

Background Art

[0002] Patent Document 1 discloses a method for manufacturing a plurality of semiconductor devices from a lead frame. In the lead frame, a plurality of mold resins are arranged, and a plurality of lead terminals protrude from each mold resin. The plurality of mold resins are arranged in a lattice pattern. A plurality of lead terminals protruding from the plurality of mold resins arranged in each row are connected by tie bars. The plurality of tie bars are connected to a frame body. In the lead frame, by separating a plurality of lead terminals from each tie bar, a semiconductor device in which a plurality of lead terminals protrude from a common mold resin is manufactured.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in Patent Document 1, the length of the lead terminals is not considered. For example, when the lead terminals are long, the number of mold resins that can be formed on a lead frame with a fixed size is small. In this case, the number of semiconductor devices that can be manufactured from one lead frame is small.

[0005] Therefore, an object of the present invention is to provide a manufacturing method and a manufacturing apparatus capable of manufacturing a large number of semiconductor components from one lead frame.

Means for Solving the Problems

[0006] A method for manufacturing a semiconductor component according to one aspect of the present invention is a method for manufacturing a semiconductor component having a resin portion in which a semiconductor chip is encapsulated with resin and a plurality of lead portions protruding in a common direction from one surface of the resin portion, the method including: a step of separating the plurality of resin portions by cutting a lead frame on which the plurality of resin portions are formed; and a step of extending the lengths of the plurality of lead portions protruding from the separated resin portions, wherein in the lead frame, the protruding surfaces of the resin portions from which the lead portions protrude face the protruding surfaces of other resin portions, and the protruding end portions of the two lead portions protruding from the two opposing protruding surfaces are connected to each other.

[0007] A manufacturing apparatus for a semiconductor component according to one aspect of the present invention is a manufacturing apparatus for the semiconductor component used in the manufacturing method described above, the apparatus including: a resin molding module that forms the plurality of resin portions by encapsulating each of the plurality of semiconductor chips fixed to the lead frame with resin; a separation module that separates the plurality of resin portions by cutting the lead frame after the resin molding module forms the plurality of resin portions; and an extension module that extends the lengths of the plurality of lead portions protruding from the resin portions separated by the separation module.

Advantages of the Invention

[0008] According to the above aspect, a large number of semiconductor components can be manufactured from one lead frame.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of a method for manufacturing a semiconductor component and a manufacturing apparatus for a semiconductor component according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.

[0011] (Embodiment 1) FIG. 1 is a schematic diagram of a manufacturing apparatus 1 in Embodiment 1. The manufacturing apparatus 1 includes a resin molding module 10, a singulation module 11, an extension module 12, and a component storage module 13. Each module is detachably connected to other modules. In the example of FIG. 1, the resin molding module 10, the singulation module 11, the extension module 12, and the component storage module 13 are connected in this order.

[0012] In the manufacturing apparatus 1, other modules may be added. As a first example, the manufacturing apparatus 1 may include a plurality of resin molding modules 10. As a second example, a plurality of singulation modules 11 may be connected between the resin molding module 10 and the extension module 12. As a third example, one module may be omitted. For example, the extension module 12 may be omitted. In this case, the singulation module 11 is connected to the component storage module 13.

[0013] By each of the resin molding module 10, the singulation module 11, and the extension module 12 executing processing, a plurality of semiconductor components 2 (see FIG. 2) are manufactured. The component storage module 13 stores the manufactured plurality of semiconductor components 2 in a case (not shown).

[0014] FIG. 2 is an explanatory view of the appearance of the semiconductor component 2. In FIG. 2, the plane, side surface, and bottom surface of the semiconductor component 2 are shown. In the semiconductor component 2, a semiconductor chip 25 (see FIG. 3) is placed on the wide surface of a rectangular plate-shaped mounting piece 20 having conductivity and heat conductivity. The wide surface is a surface different from the end surface of the mounting piece 20. The mounting piece 20 is a part of a lead frame 3 (see FIG. 3). The lead frame 3 is manufactured from copper or a copper alloy containing a copper component or the like. A through hole 20a penetrating in the thickness direction of the mounting piece 20 is provided in the wide surface of the mounting piece 20. The semiconductor chip 25 and the through hole 20a are arranged along the longitudinal direction of the mounting piece 20.

[0015] In the semiconductor component 2, the semiconductor chip 25 is arranged in a rectangular parallelepiped resin portion 21. In the resin portion 21, the semiconductor chip 25 is sealed with resin. The resin portion 21 covers a part of the mounting piece 20. Regarding the mounting piece 20, the wide surface on the side opposite to the wide surface where the semiconductor chip 25 is arranged is exposed from the resin portion 21 (see FIG. 5). The heat conductivity of the mounting piece 20 is higher than the heat conductivity of the resin portion 21. Therefore, the heat generated by the semiconductor chip 25 is released to the outside through the mounting piece 20. The mounting piece 20 also functions as a heat sink.

[0016] As described above, the mounting piece 20 protrudes from one surface of the resin portion 21. In the mounting piece 20, a through hole 20a is provided in the portion protruding from the resin portion 21.

[0017] Regarding the resin portion 21, a plurality of rod-shaped lead portions 22 protrude in a common direction from the surface opposite to the surface from which the mounting piece 20 protrudes. Each lead portion 22 has conductivity. Similar to the mounting piece 20, each lead portion 22 is a part of the lead frame 3. As described above, the lead frame 3 is manufactured from copper, a copper alloy, or the like. FIG. 2 shows an example in which the number of lead portions 22 is 3. The plurality of lead portions 22 are arranged in a direction along the wide surface of the mounting piece 20. The direction along the wide surface of the mounting piece 20 is the left-right direction of the semiconductor component 2 in which the plane and the bottom surface are shown in FIG. 2.

[0018] Examples of the semiconductor chip 25 include a field effect transistor, a bipolar transistor, an IGBT (Insulated Gate Bipolar Transistor), and a regulator. When the semiconductor chip 25 is a field effect transistor, a bipolar transistor, or an IGBT, for example, the number of lead portions 22 is 3. When the semiconductor chip 25 is a field effect transistor, each of the three lead portions 22 is, for example, a drain terminal, a source terminal, and a gate terminal. When the semiconductor chip 25 is a bipolar transistor, each of the three lead portions 22 is, for example, a collector terminal, an emitter terminal, and a base terminal. When the semiconductor chip 25 is an IGBT, each of the three lead portions 22 is, for example, a collector terminal, an emitter terminal, and a gate terminal.

[0019] When the semiconductor chip 25 is a regulator, for example, the number of lead portions 22 is 3. In this case, each of the three lead portions 22 is, for example, a current input terminal, a current output terminal, and a control terminal. Note that the number of lead portions 22 of the semiconductor chip 25 is not limited to 3, and may be 2 or 4 or more.

[0020] Each lead portion 22 is connected to a rod-shaped extension conductor 23. Therefore, the connection portion 24 between the lead portion 22 and the extension conductor 23 is realized by welding. At the connection portion 24, a part of the lead portion 22 is melted, and the melted metal adheres to the extension conductor 23. Each lead portion 22 is electrically connected to the connected extension conductor 23. The axial direction of each lead portion 22 coincides with the axial direction of the extension conductor 23.

[0021] Note that the coincidence of the two axial directions does not mean only a strict coincidence, but also includes a substantial coincidence. Therefore, when the angle formed by the two axial directions is within the error range, the two axial directions coincide.

[0022] The overall axial length of the connected lead portion 22 and the extension conductor 23 is longer than the axial length of the lead portion 22. Therefore, by connecting the extension conductor 23 to the lead portion 22, the length of the lead portion 22 is extended.

[0023] Next, the process of the resin molding module 10 will be described. FIG. 3 is an explanatory view of the appearance of the lead frame 3 before resin encapsulation. The resin molding module 10 is loaded with the lead frame 3 before resin encapsulation. The lead frame 3 has a rectangular frame body 30. Inside the frame body 30, a plurality of mounting pieces 20 are arranged in a grid pattern. On each mounting piece 20, the semiconductor chip 25 is fixed by a conductive adhesive, for example, silver paste. On each mounting piece 20, the through hole 20a and the semiconductor chip 25 are arranged side by side along the column direction. The column direction is the vertical direction in FIG. 3.

[0024] In each column, a plurality of lead portions 22 corresponding to two mounting pieces 20 are arranged between the mounting piece 20 in the (2·N - 1)-th row and the mounting piece 20 in the (2·N)-th row. Here, N is a natural number. The "·" indicates multiplication. Regarding the two mounting pieces 20 arranged in the (2·N - 1)-th row and the (2·N)-th row in each column, two semiconductor chips 25 are arranged between the two through holes 20a. Therefore, in FIG. 3, in the mounting piece 20 in the (2·N - 1)-th row, the semiconductor chip 25 is arranged below the through hole 20a. In the mounting piece 20 in the (2·N)-th row, the semiconductor chip 25 is arranged above the through hole 20a.

[0025] One of the plurality of lead portions 22 corresponding to the mounting piece 20 in the (2·N - 1)-th row is connected to the mounting piece 20 in the (2·N - 1)-th row. Similarly, one of the plurality of lead portions 22 corresponding to the mounting piece 20 in the (2·N)-th row is connected to the mounting piece 20 in the (2·N)-th row. In each column, each end of the plurality of lead portions 22 corresponding to the mounting piece 20 in the (2·N - 1)-th row is connected to the end of the plurality of lead portions 22 corresponding to the mounting piece 20 in the (2·N)-th row. Therefore, in the lead frame 3, a single conductor is formed by two lead portions 22.

[0026] Among the plurality of lead portions 22 corresponding to each mounting piece 20, the other lead portions 22 except the lead portion 22 connected to the mounting piece 20 are separated from the mounting piece 20. The semiconductor chip 25 is connected to each of the remaining lead portions 22 separated from the mounting piece 20 by a conductive wire 26. In the example of FIG. 3, the number of lead portions 22 is 3, and the semiconductor chip 25 is connected to each of the two lead portions 22 separated from the mounting piece 20 by a wire 26.

[0027] The plurality of lead portions 22 corresponding to the plurality of mounting pieces 20 arranged in the (2·N - 1)-th row are connected by a common tie bar 31 extending in the row direction. The row direction is the left - right direction in FIG. 3. The plurality of lead portions 22 corresponding to the plurality of mounting pieces 20 arranged in the (2·N)-th row are also connected by a common tie bar 31 extending in the row direction. Each tie bar 31 is connected in the middle of the lead portion 22. Both ends of each tie bar 31 are connected to the frame body 30.

[0028] The resin - molded module 10 uses a mold 4 (see FIG. 4) to seal each of the plurality of semiconductor chips 25 fixed to the mounting pieces 20 of the lead frame 3 with resin. Thereby, a plurality of resin portions 21 are formed. The mold 4 is, for example, a metal mold. FIG. 4 is a cross - sectional view of the mold 4 used for resin sealing. The mold 4 has an upper mold 40 and a lower mold 41. The lead frame 3 is sandwiched between the upper mold 40 and the lower mold 41. At this time, a cavity 42 is formed in the mold 4. In the cavity 42, a semiconductor chip 25, a part of the mounting piece 20, and a part of each of the plurality of lead portions 22 are arranged.

[0029] For resin sealing, for example, a resin having thermosetting properties is used. When using this resin, the upper mold 40 and the lower mold 41 are heated. After heating, the melted and liquefied resin is injected into the cavity 42. After the resin is injected, the arrangement of the upper mold 40 and the lower mold 41 is maintained for a certain period. Thereby, the resin hardens. As a result, the semiconductor chip 25 is sealed with resin, and the resin portion 21 is formed.

[0030] Note that the configuration of the resin - molded module 10 may be a configuration having a supply module that supplies the lead frame 3 and the resin material and a press module that closes the mold 4. In this case, the resin - molded module 10 may have a plurality of press modules.

[0031] FIG. 5 is an explanatory view of the appearance of the lead frame 3 after resin encapsulation. FIG. 5 shows the plan view and the side view of the lead frame 3 after resin encapsulation. Resin portions 21 are formed at respective positions where a plurality of semiconductor chips 25 are arranged. Therefore, the plurality of resin portions 21 are arranged in a lattice pattern. As described above, the resin portion 21 has a rectangular parallelepiped shape, and the mounting piece 20 is exposed from the resin portion 21. The mounting piece 20 protrudes from one surface of the resin portion 21. One resin portion 21 covers a part of each of the plurality of lead portions 22 corresponding to one mounting piece 20. With respect to the resin portion 21, the plurality of lead portions 22 protrude in a common direction from the surface opposite to the surface from which the mounting piece 20 protrudes.

[0032] In the resin portion 21, the surface from which the plurality of lead portions 22 protrude is referred to as the protruding surface. In the lead frame 3, the protruding surface of the resin portion 21 in the (2·N - 1)-th row faces the protruding surface of the resin portion 21 in the (2·N)-th row. The protruding end portions of the two lead portions 22 protruding from the two mutually facing protruding surfaces are directly connected to each other. Therefore, the protruding end portions of the two lead portions 22 are in contact with each other.

[0033] The resin molding module 10, after forming the plurality of resin portions 21 in the lead frame 3, passes the lead frame 3 in which the plurality of resin portions 21 are formed to the singulation module 11. The singulation module 11 singulates the plurality of resin portions 21 by cutting the lead frame 3 received from the resin molding module 10.

[0034] Specifically, the tie bar 31 is cut along each lead portion 22. Thereby, a plurality of sets of resin portions 21 are taken out. One set of resin portions 21 includes two resin portions 21 connected to each other. For each set of resin portions 21, a single conductor formed by the two lead portions 22 is cut. When the number of lead portions 22 is 3, three conductors are cut. Thereby, the plurality of resin portions 21 are singulated.

[0035] FIG. 6 is an explanatory view of the appearance of the fragmented resin portion 21. In FIG. 6, the top, side, and bottom surfaces of the resin portion 21 are shown. The fragmented resin portion 21 is the semiconductor component 2 before connecting a plurality of extension conductors 23. Therefore, the mounting piece 20 protrudes from one surface of the resin portion 21, and a plurality of lead portions 22 protrude in a common direction from the protruding surface of the resin portion 21. The fragmentation module 11 passes the plurality of fragmented resin portions 21 to the extension module 12.

[0036] The extension module 12 extends each of the plurality of lead portions 22 protruding from the resin portion 21 received from the fragmentation module 11 using a laser beam. Thereby, the semiconductor component 2 shown in FIG. 1 is manufactured.

[0037] FIG. 7 is an explanatory view of a method for extending the lead portion 22 using a laser beam. The extension module 12 includes an irradiator 50 and a controller 51. The irradiator 50 is connected to the controller 51. The controller 51 has a processing element (not shown) that executes processing, such as a CPU (Central Processing Unit). The processing element of the controller 51 controls the operation of the irradiator 50 by executing a program.

[0038] The irradiator 50 performs pulsed irradiation or continuous irradiation of the laser beam according to an instruction from the controller 51. The irradiator 50 is a CO2 laser, a YAG laser, a fiber laser, or the like. Pulsed irradiation is intermittent irradiation of the laser beam. Continuous irradiation is continuous irradiation of the laser beam. The irradiator 50 starts or ends the irradiation of the laser beam according to an instruction from the controller 51. When the irradiator 50 is irradiating the laser beam, the irradiator 50 adjusts the output intensity of the irradiating laser beam according to an instruction from the controller 51.

[0039] When pulsed irradiation is being performed, the irradiator 50 periodically starts the irradiation of the laser beam. In one cycle, the ratio of the irradiation period during which the laser beam is irradiated is described as the duty. The larger the duty, the longer the irradiation period in one cycle. When pulsed irradiation is being performed, the irradiator 50 adjusts the duty according to an instruction from the controller 51.

[0040] The extension module 12 overlaps a part of the lead portion 22 with a part of the rod-shaped extension conductor 23. As described above, the axial direction of the lead portion 22 coincides with the axial direction of the extension conductor 23. As described above, the coincidence of the two axial directions does not mean only a strict coincidence, but also includes a substantial coincidence. The irradiator 50 irradiates laser light onto the portion of the lead portion 22 that overlaps the extension conductor 23. Thereby, a part of the lead portion 22 melts, and the melted metal adheres to the extension conductor 23. Thereby, the extension conductor 23 is connected to the lead portion 22. As described above, the extension conductor 23 is welded to the lead portion 22.

[0041] The extension module 12 welds a plurality of extension conductors 23 to each of the plurality of lead portions 22 protruding from the protruding surface of the resin portion 21 that has been individualized, using laser light. Thereby, the lengths of the plurality of lead portions 22 are extended. Note that the extension conductor 23 may be bent. In this case, the number of bends is not limited to one, and may be two or more.

[0042] The extension module 12 passes the semiconductor component 2 generated by extending the lengths of the plurality of lead portions 22 to the component storage module 13. The component storage module 13 stores the plurality of semiconductor components 2 received from the extension module 12 in a case (not shown).

[0043] FIG. 8 is a flowchart showing the procedure of the manufacturing method of the semiconductor component 2. As described above, the resin molding module 10 of the manufacturing apparatus 1 first forms a plurality of resin portions by sealing each of the plurality of semiconductor chips 25 fixed to the lead frame 3 with resin (step S1). After step S1 is executed, the singulation module 11 of the manufacturing apparatus 1 singulates the plurality of resin portions 21 by cutting the lead frame 3 in which the plurality of resin portions 21 are formed (step S2).

[0044] After step S2 is executed, the extension module 12 of the manufacturing apparatus 1 extends the lengths of the plurality of lead portions 22 protruding from the individualized resin portions 21 (step S3). Thereby, the semiconductor component 2 is manufactured. After step S3 is executed, the component storage module 13 of the manufacturing apparatus 1 stores the plurality of manufactured semiconductor components 2 in a case (step S4). After step S4 is executed, the manufacturing method of the semiconductor component 2 ends.

[0045] In the manufacturing apparatus 1 configured as described above, after the plurality of resin portions 21 are individualized, the lengths of the plurality of lead portions 22 protruding from the protruding surface of the resin portion 21 are extended. For this reason, in the lead frame 3, the two lead portions 22 connecting the two resin portions 21 whose protruding surfaces face each other may be short. When the two lead portions 22 are short, the resin molding module 10 can form a large number of resin portions 21 in the lead frame 3.

[0046] The extension module 12 welds the extension conductor 23 to the lead portion 22 using a laser beam. Since the laser beam has high directivity, the area of the lead portion 22 irradiated with the laser beam is small. For this reason, local heating can be realized. As a result, the extension module 12 can extend the length of the lead portion 22 in a short time. Further, since light is used as the heat source, a large current does not flow through the lead portion 22 to the semiconductor chip 25 during welding. For the same reason, a large voltage is not applied to the semiconductor chip 25 via the lead portion 22 during welding. Therefore, the possibility of failure of the semiconductor chip 25 occurring while the extension module 12 extends the length of the lead portion 22 is low.

[0047] Note that the shape of the extension conductor 23 is not limited to a rod shape, and may be, for example, a long plate shape.

[0048] (Embodiment 2) In Embodiment 1, the component storage module 13 stores the semiconductor component 2 in a case. However, the object stored in the component storage module 13 is not limited to the semiconductor component 2. In the following, differences from Embodiment 1 will be described for Embodiment 2. For other configurations except those described later, they are common to Embodiment 1. Therefore, the same reference numerals as those in Embodiment 1 are assigned to the constituent parts common to Embodiment 1, and the description of those constituent parts is omitted.

[0049] FIG. 9 is an explanatory diagram of the storage performed by the component storage module 13 in Embodiment 2. In Embodiment 2, the component storage module 13 stores a plurality of resin parts 21 fragmented by the fragmentation module 11 in the case 6, instead of a plurality of semiconductor components 2. The case 6 has a cylindrical shape. One end face of the case 6 is closed. The other end face of the case 6 is open. As a result, an insertion port 60 is formed in the other end face. The component storage module 13 sequentially inserts the plurality of fragmented resin parts 21 into the case 6 from the insertion port 60.

[0050] In the case 6, a recess 61 is provided. The recess 61 extends along the axial direction of the case 6. Inside the case 6, one surface of the resin part 21 where the placement piece 20 protrudes is supported by the recess 61. Note that the case 6 may be called a tube.

[0051] As described in the description of Embodiment 1, the plurality of lead portions 22 protruding from the protruding surface of the resin part 21 may be short. When the plurality of lead portions 22 are short, when the resin part 21 is stored in the case 6, the possibility that the lead portions 22 protruding from the resin part 21 hit the insertion port 60 of the case 6 is low. Therefore, the possibility that the shape of the lead portion 22 is deformed when the resin part 21 is stored is low.

[0052] For example, a resin molding module 10, a singulation module 11, and a component storage module 13 are installed in the first factory. An extension module 12 is arranged in the second factory where the semiconductor component 2 is mounted. In the first factory, as described above, the component storage module 13 houses the plurality of resin parts 21 singulated by the singulation module 11 in the case 6. The case 6 containing the plurality of singulated resin parts 21 is transported from the first factory to the second factory. In the second factory, the extension module 12 extends the plurality of lead parts 22 of the resin part 21 housed in the case 6. The semiconductor component 2 is manufactured in the second factory. The manufacturing apparatus 1 in the second embodiment exhibits the same effects as those of the first embodiment.

[0053] (Embodiment 3) In the extension module 12 in the first embodiment, the length of the lead part 22 is extended by welding the extension conductor 23 to the lead part 22. However, the method of extending the length of the lead part 22 is not limited to the method of welding the extension conductor 23. Hereinafter, the differences between the third embodiment and the first embodiment will be described. Regarding the other configurations except for the configurations described later, they are common to the first embodiment. For this reason, the same reference numerals as those in the first embodiment are given to the constituent parts common to the first embodiment, and the description of those constituent parts is omitted.

[0054] FIG. 10 is an explanatory view of the appearance of the crimp terminal 7 in the third embodiment. The extension module 12 in the third embodiment uses the crimp terminal 7 to extend the length of the lead part 22. FIG. 10 shows the plan view and the bottom view of the crimp terminal 7. In the crimp terminal 7, a cylindrical body 70 with both end faces open is arranged. Therefore, a through hole 70a penetrating in the axial direction of the cylindrical body 70 is provided in the cylindrical body 70. A long plate body 71 protrudes from the end of the cylindrical body 70 along the axial direction of the cylindrical body 70. The cylindrical body 70 and the long plate body 71 have conductivity. The longitudinal direction of the long plate body 71 coincides with the axial direction of the cylindrical body 70.

[0055] Note that the coincidence of the longitudinal direction and the axial direction does not mean only a strict coincidence, but also includes a substantial coincidence. Therefore, when the angle formed by the longitudinal direction and the axial direction is within the error range, the longitudinal direction and the axial direction coincide with each other.

[0056] FIG. 11 is an explanatory view of a method for extending the lead portion 22 using the crimp terminal 7. As shown in the upper part of FIG. 11, the extension module 12 passes each of the plurality of lead portions 22 protruding from the resin portion 21 through the through holes 70a of the plurality of crimp terminals 7. With the lead portion 22 passing through the through hole 70a of the cylindrical body 70, the cylindrical body 70 is caulked using a tool, for example, a crimping pliers. As a result, as shown in the lower part of FIG. 11, the cylindrical body 70 is deformed and a part of the cylindrical body 70 is recessed. As a result, the cylindrical body 70 is crimped to the lead portion 22, and the lead portion 22 is electrically connected to the crimp terminal 7.

[0057] As described above, in step S2 of the manufacturing method of the semiconductor component 2, the extension module 12 crimps a plurality of crimp terminals 7 to each of the plurality of lead portions 22. As a result, the lengths of the plurality of lead portions 22 are extended. The crimp terminal 7 functions as a second conductor.

[0058] Since the extension module 12 extends the lead portion 22 by crimping the crimp terminal 7 to the lead portion 22, while the length of the lead portion 22 is being extended, no voltage is applied to the semiconductor chip 25 and no current flows through the semiconductor chip 25. Therefore, the possibility of failure of the semiconductor chip 25 during the extension of the length of the lead portion 22 is low.

[0059] The manufacturing apparatus 1 in Embodiment 3 exhibits the same effects as those of the manufacturing apparatus 1 in Embodiment 1, except for the effects obtained by performing welding using laser light. The component storage module 13 in Embodiment 3 may store the plurality of resin portions 21 that have been separated into individual pieces in the case 6 before extending the length of the lead portion 22, in the same manner as in Embodiment 2. Also, the long plate body 71 may be bent. In this case, the number of bends is not limited to one and may be two or more.

[0060] (Embodiment 4) In Embodiment 1, the extension module 12 extends the length of the lead portion 22 by welding the extension conductor 23 to the lead portion 22. However, the method of extending the length of the lead portion 22 is not limited to the method of welding the extension conductor 23. Hereinafter, the differences between Embodiment 4 and Embodiment 1 will be described. Regarding other configurations except the configurations described later, they are common to Embodiment 1. For this reason, the same reference numerals as those in Embodiment 1 are assigned to the components common to Embodiment 1, and the description of those components is omitted.

[0061] FIG. 12 is an explanatory diagram of the appearance of the electrical appliance 8 for extension in Embodiment 4. In Embodiment 4, the extension module 12 uses the electrical appliance 8 to extend the length of the lead portion 22. In FIG. 12, the side surface and the plane of the electrical appliance 8 are shown. As shown in FIG. 12, in the electrical appliance 8, an insertion port 81 into which a plurality of lead portions 22 are inserted is provided in the appliance main body 80. The opening area of the insertion port 81 is larger than the cross-sectional area of the lead portion 22.

[0062] Also, a plurality of rod-shaped appliance terminals 82 protrude from one surface of the appliance main body 80. Each of the side walls of the plurality of insertion ports 81 is electrically connected to the plurality of appliance terminals 82.

[0063] FIG. 13 is an explanatory diagram of a method for extending the lead portion 22 using the electrical appliance 8. FIG. 13 shows a state before inserting a plurality of lead portions 22 into the electrical appliance 8 and a state after inserting the plurality of lead portions 22 into the electrical appliance 8. As shown in FIG. 13, the extension module 12 inserts each of the plurality of lead portions 22 protruding from the resin portion 21 into a plurality of insertion ports 81 provided in the appliance main body 80. Thereby, each of the plurality of lead portions 22 is electrically connected to the plurality of appliance terminals 82, and the lengths of the plurality of lead portions 22 are extended.

[0064] As described above, in step S2 of the method for manufacturing the semiconductor component 2, the extension module 12 inserts each of the plurality of lead portions 22 into the common electrical appliance 8. As a result, the lengths of the plurality of lead portions 22 are extended. Therefore, the extension of the length of the lead portion 22 can be easily achieved.

[0065] The manufacturing apparatus 1 in the fourth embodiment exhibits the same effects as those of the manufacturing apparatus 1 in the first embodiment, except for the effects obtained by performing welding using a laser beam. The component storage module 13 in the fourth embodiment may store the plurality of resin portions 21 that have been separated into individual pieces in the case 6, as in the second embodiment, before extending the lengths of the lead portions 22.

[0066] In the fourth embodiment, the shape of the appliance terminal 82 is not limited to a rod shape, and for example, it may be a long plate shape. Also, the appliance terminal 82 may be bent. In this case, the number of bends is not limited to one, and may be two or more.

[0067] In the first to fourth embodiments, the shape of the resin portion 21 is not limited to a rectangular parallelepiped shape, and for example, it may be a cylindrical shape.

[0068] Hereinafter, an overview of the manufacturing apparatus 1 for the semiconductor component 2 and the method for manufacturing the semiconductor component 2 disclosed this time will be described.

[0069] (1) The method for manufacturing the semiconductor component 2 according to the present disclosure is a method for manufacturing the semiconductor component 2 having a resin portion 21 in which a semiconductor chip 25 is sealed with resin and a plurality of lead portions 22 protruding in a common direction from one surface of the resin portion 21, including a step of separating the plurality of resin portions 21 by cutting a lead frame 3 in which the plurality of resin portions 21 are formed, and a step of extending the lengths of the plurality of lead portions 22 protruding from the separated resin portions 21. In the lead frame 3, the protruding surfaces of the resin portions 21 from which the lead portions 22 protrude face the protruding surfaces of the other resin portions 21, and the protruding end portions of the two lead portions 22 protruding from the two protruding surfaces facing each other are connected to each other.

[0070] According to the manufacturing method described in (1) above, after fragmenting a plurality of resin portions 21, the length of a plurality of lead portions 22 protruding from the resin portions 21 is extended. For this reason, in the lead frame 3, the two lead portions 22 connecting the two resin portions 21 whose protruding surfaces face each other may be short. When the lead portions 22 provided on the lead frame 3 are short, a large number of resin portions 21 can be formed in the lead frame 3. For example, before extending the length of the lead portions 22, a plurality of resin portions 21 are housed in the case 6. When the lead portions 22 are short, the possibility that the lead portions 22 hit the insertion opening of the case 6 is low. For this reason, the possibility that the shape of the lead portions 22 is deformed when housing the resin portions 21 is low.

[0071] (2) The manufacturing method described in (1) above may further include a step of forming a plurality of resin portions 21 by encapsulating each of a plurality of semiconductor chips 25 fixed to the lead frame 3 with resin.

[0072] According to the manufacturing method described in (2) above, after encapsulating each of a plurality of semiconductor chips 25 fixed to the lead frame 3 with resin, the plurality of resin portions 21 are fragmented.

[0073] (3) Regarding the manufacturing method described in (1) or (2) above, in the step of extending the length of the plurality of lead portions 22, a plurality of extension conductors 23 may be welded to each of the plurality of lead portions 22 using laser light.

[0074] According to the manufacturing method of (3) above, the extension conductor 23 is welded to the lead portion 22 using a laser beam. Since the laser beam has high directivity, the area irradiated by the laser beam is small. Therefore, local heating can be realized. As a result, the length of the lead portion 22 can be extended in a short time. Further, since the heat source is light, a large current does not flow through the semiconductor chip 25 during welding. Furthermore, a large voltage is not applied to the semiconductor chip 25 during welding. Therefore, the possibility of failure of the semiconductor chip 25 occurring while extending the length of the lead portion 22 is low.

[0075] (4) Regarding the manufacturing method described in (1) or (2) above, in the step of extending the lengths of the plurality of lead portions 22, a plurality of crimp terminals 7 (second conductors) may be crimped to each of the plurality of lead portions 22.

[0076] According to the manufacturing method of (4) above, the crimp terminal 7 is crimped to the lead portion 22. Therefore, while the length of the lead portion 22 is being extended, no voltage is applied to the semiconductor chip 25 and no current flows through the semiconductor chip 25. Therefore, the possibility of failure of the semiconductor chip 25 occurring while extending the length of the lead portion 22 is low.

[0077] (5) Regarding the manufacturing method described in (1) or (2) above, in the step of extending the lengths of the plurality of lead portions 22, the plurality of lead portions 22 may be inserted into a common electrical appliance 8.

[0078] According to the manufacturing method described in (5) above, by inserting the plurality of lead portions 22 into a common electrical appliance 8, the extension of the length of the lead portions 22 can be easily realized.

[0079] (6) The manufacturing apparatus 1 for the semiconductor component 2 of the present disclosure is a manufacturing apparatus for a semiconductor component used in the manufacturing method according to any one of (1) to (5) above. The resin molding module 10 forms a plurality of resin portions 21 by encapsulating each of the plurality of semiconductor chips 25 fixed to the lead frame 3 with resin. After the resin molding module 10 forms the plurality of resin portions 21, the singulation module 11 cuts the lead frame 3 to singulate the plurality of resin portions 21. The extension module 12 extends the lengths of the plurality of lead portions 22 protruding from the resin portions 21 singulated by the singulation module 11.

[0080] According to the manufacturing apparatus described in (6) above, similar to the manufacturing method described in (1) above, the two lead portions 22 connecting the two resin portions 21 with opposing protruding surfaces may be short. When the lead portions 22 provided on the lead frame 3 are short, a large number of resin portions 21 can be formed on the lead frame 3. For example, the component storage module 13 stores the plurality of resin portions 21 in the case 6 before extending the lengths of the lead portions 22. When the lead portions 22 are short, the possibility that the lead portions 22 hit the insertion opening of the case 6 is low. Therefore, the possibility that the shape of the lead portions 22 is deformed when storing the resin portions 21 is low.

Explanation of Reference Numerals

[0081] 1 Manufacturing apparatus 2 Semiconductor component 3 Lead frame 7 Crimp terminal (second conductor) 8 Electric appliance 10 Resin molding module 11 Singulation module 12 Extension module 12 21 Resin portion 22 Lead portion 23 Conductor (extension conductor) 25 Semiconductor chip

Claims

1. A method for manufacturing a semiconductor component having a resin portion in which a semiconductor chip is encapsulated with resin and a plurality of lead portions protruding in a common direction from one surface of the resin portion, comprising: fragmenting the plurality of resin portions by cutting a lead frame on which the plurality of resin portions are formed; extending the lengths of the plurality of lead portions protruding from the fragmented resin portions; and in the lead frame, the protruding surfaces of the resin portions from which the lead portions protrude face the protruding surfaces of the other resin portions, and the protruding ends of the two lead portions protruding from the two opposing protruding surfaces are connected to each other. A method for manufacturing a semiconductor component.

2. The method for manufacturing a semiconductor component according to claim 1, further comprising: forming the plurality of resin portions by encapsulating each of the plurality of semiconductor chips fixed to the lead frame with resin.

3. In the step of extending the lengths of the plurality of lead portions, a plurality of conductors are welded to each of the plurality of lead portions using a laser beam. The method for manufacturing a semiconductor component according to claim 1.

4. In the step of extending the lengths of the plurality of lead portions, a plurality of second conductors are crimped to each of the plurality of lead portions. The method for manufacturing a semiconductor component according to claim 1.

5. In the step of extending the lengths of the plurality of lead portions, the plurality of lead portions are inserted into a common electrical appliance. The method for manufacturing a semiconductor component according to claim 1.

6. A manufacturing apparatus for a semiconductor component used in the manufacturing method according to any one of claims 1 to 5, comprising: a resin molding module that forms the plurality of resin portions by encapsulating each of the plurality of semiconductor chips fixed to the lead frame with resin; a fragmentation module that fragments the plurality of resin portions by cutting the lead frame after the resin molding module forms the plurality of resin portions; and an extension module that extends the lengths of the plurality of lead portions protruding from the resin portions fragmented by the fragmentation module. A manufacturing apparatus for a semiconductor component. ​

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