Inspection apparatus and inspection method

Abstract

To provide an inspection device and an inspection method for appropriately bringing a probe and a substrate into contact with each other, irrespective of the probe height, in a substrate inspection device.SOLUTION: The method comprises: a plurality of positioning members (positioning pins 130) for coming into contact with the top face of a placement member (chuck top 70) or the underside of a holding unit (pogo frame 90) and defining the height of the placement member with respect to a probe 102; an adjustment mechanism 140 for adjusting the height of the positioning member; a detection unit (lower camera 80) for detecting the probe, the placement member and the positioning member; and a control unit. The control unit acquires the height of the probe, acquires the height of the placement member, and acquires the height of the positioning member, and positions, using the adjustment mechanism, the positioning member at a reference height where an overdrive amount is reduced to zero, on the basis of the result of detection by the detection unit. Then the control unit acquires the height of the positioning member that equals a desired overdrive amount, and raises the placement member while adjusting the drive amount of the adjustment mechanism until said height is reached.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to an inspection apparatus and an inspection method.

Background Art

[0002] Patent Document 1 discloses a wafer inspection apparatus that performs wafer inspection by bringing a probe card into pressure contact with a wafer. In this wafer inspection apparatus, the pressure of the vacuum suction force applied between the probe card and the wafer in the surrounding space by evacuation of the vacuum mechanism substantially exactly matches the pressure of the pressing force applied between the probe card and the wafer by pushing up the moving stage and the chuck top prior thereto.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technology according to the present disclosure appropriately contacts a probe and a substrate in an inspection apparatus for inspecting a substrate, regardless of the height of the probe.

Means for Solving the Problems

[0005] One aspect of the present disclosure is an inspection apparatus for inspecting a substrate, comprising: a placement member on which the substrate is placed; a holding unit that holds a probe card having probes that contact the substrate; a plurality of positioning members that contact the upper surface of the placement member or the lower surface of the holding unit to define the height of the placement member with respect to the probes; an adjustment mechanism that adjusts the height of the positioning members; a detection unit for detecting the probes, the placement member, and the positioning members; and a control unit. The control unit includes: a step of acquiring the height of the probes based on the detection result of the probes using the detection unit; a step of acquiring the height of the placement member based on the detection result of the placement member using the detection unit; a step of acquiring the height of the positioning members based on the detection result of the positioning members using the detection unit; a step of positioning the positioning members using the adjustment mechanism to a reference height at which the overdrive amount becomes zero based on the detection results of the probes, the placement member, and the positioning members using the detection unit; and a step of raising the placement member while adjusting the driving amount of the adjustment mechanism until the height of the positioning members reaches a desired overdrive amount.

Advantages of the Invention

[0006] According to the present disclosure, in an inspection apparatus for inspecting a substrate, the probes and the substrate can be appropriately brought into contact regardless of the height of the probes.

Brief Description of the Drawings

[0007]

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Mode for Carrying Out the Invention

[0008] In a semiconductor manufacturing process, a large number of semiconductor devices having a predetermined circuit pattern are formed on a semiconductor wafer (hereinafter referred to as "wafer"). The formed semiconductor devices are inspected for electrical characteristics and the like, and sorted into good products and defective products. The inspection of semiconductor devices is performed, for example, in the state of the wafer before being divided into each semiconductor device, using an inspection apparatus.

[0009] The inspection apparatus is provided with a probe card having a large number of probes which are a large number of needle-like contact terminals. When inspecting electrical characteristics, first, the wafer and the probe card are brought close to each other, and the probes of the probe card come into contact with the respective electrodes of the semiconductor devices formed on the wafer. In this state, an electrical signal is supplied from a tester provided above the probe card to the semiconductor device through each probe. Then, based on the electrical signal received by the tester from the semiconductor device through each probe, it is determined whether the semiconductor device is a defective product.

[0010] As an inspection apparatus for performing such electrical characteristic inspection, there is known one that reduces the pressure in a sealed space between a chuck top on which a wafer is placed and a pogo frame that holds a probe card, and brings the probe of the wafer and the probe card included in the space into contact with each other. In this inspection apparatus, by reducing and shrinking the sealed space, the chuck top is attracted toward the probe card side, that is, raised, and the wafer on the chuck top is brought into contact with the probe of the probe card. At this time, the height of the chuck top is set to a height that becomes higher by a predetermined over-drive amount after the wafer on the chuck top comes into contact with the probe. Thereby, the electrode of the wafer and the probe are brought into contact with each other regardless of the presence or absence of a protective film or the like on the wafer.

[0011] Note that the chuck top is held by an aligner and is movable in the horizontal direction and the vertical direction by the aligner. However, at the stage where the wafer on the chuck top and the probe are in contact with each other and the electrical characteristics are inspected, the chuck top is not supported by the aligner but is supported by a bellows that forms the sealed space. Also, conventionally, the height of the chuck top is set with reference to the pogo frame or the aligner. Specifically, conventionally, the height of the chuck top is set so that the distance from the pogo frame or the aligner to the chuck top becomes a predetermined value based on the detection result by a height sensor provided in, for example, the pogo frame or the aligner.

[0012] By the way, the height of the probe of the probe card (specifically, the height of the contact end of the probe to the wafer) changes depending on the temperature of the probe card, and also changes due to thermal expansion or thermal contraction of the pogo frame. Therefore, if the height of the chuck top at the time of performing the electrical characteristic inspection is set with reference to the pogo frame or the aligner as described above, the probe and the wafer (specifically, the electrode) may not be properly brought into contact with each other.

[0013] In view of the above, the technology according to the present disclosure properly brings the probe and the substrate into contact with each other regardless of the height of the probe in an inspection apparatus for inspecting a substrate.

[0014] Hereinafter, the inspection apparatus and inspection method according to the present embodiment will be described with reference to the drawings. In the present specification and drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0015] <Inspection apparatus> FIG. 1 and FIG. 2 are a cross-sectional view and a longitudinal sectional view respectively showing the outline of the configuration of the inspection apparatus according to the present embodiment. In FIG. 2, only a part of the aligner described later is shown.

[0016] The inspection apparatus 1 in FIGS. 1 and 2 inspects a wafer W as a substrate. Specifically, it performs an electrical characteristic inspection of a semiconductor device as an inspection target device formed on the wafer W. The inspection apparatus 1 has a housing 10, and an loading / unloading area 11, a transfer area 12, and an inspection area 13 are provided in the housing 10. The loading / unloading area 11 is an area where the wafer W is loaded and unloaded with respect to the inspection apparatus 1. The transfer area 12 is an area connecting the loading / unloading area 11 and the inspection area 13. Further, the inspection area 13 is an area where an electrical characteristic inspection of the semiconductor device formed on the wafer W is performed.

[0017] In the loading / unloading area 11, there are provided a port 20 for receiving a cassette C containing a plurality of wafers W, a loader 21 for housing a probe card described later, and a control unit 22 for controlling each component of the inspection apparatus 1. The control unit 22 is constituted by a computer including, for example, a CPU and a memory, and has a storage unit (not shown) for storing various information. The storage unit stores, for example, a program for realizing inspection processing and the like. Note that the above program may be recorded on a computer-readable storage medium and installed from the storage medium to the control unit 22. The storage medium may be temporary or non-temporary. Note that part or all of the program may be realized by dedicated hardware (circuit board). Further, the storage unit is, for example, a storage device such as an HDD, a memory such as a RAM for temporarily storing information necessary for the operation of the program, or a combination thereof.

[0018] In the transfer area 12, a transfer device 30 that can freely move while holding a wafer W or the like is arranged. The transfer device 30 transfers the wafer W between the cassette C in the port 20 of the loading / unloading area 11 and the inspection area 13. Further, the transfer device 30 transfers a probe card that needs maintenance among the probe cards fixed to a pogo frame described later in the inspection area 13 to the loader 21 in the loading / unloading area 11. Furthermore, the transfer device 30 transfers a new or maintained probe card from the loader 21 into the inspection area 13.

[0019] In the inspection area 13, a plurality of testers 40 are provided. Specifically, as shown in FIG. 2, for example, the inspection area 13 is divided into three in the vertical direction, and each divided area 13a is provided with a tester row including four testers 40 arranged in the horizontal direction (X direction in the figure). Further, each divided area 13a is provided with an aligner 50 as a single moving mechanism and an upper camera 60. Note that the number and arrangement of the testers 40, the aligner 50, and the upper camera 60 can be arbitrarily selected.

[0020] The tester 40 transmits and receives electrical signals for electrical characteristic inspection to and from the wafer W. The aligner 50 is configured to hold the chuck top 70 described later and be movable in the horizontal directions (the X and Y directions in the figure and the θ direction centered on the Z axis in the figure) and the vertical direction (the Z direction in the figure). Further, the aligner 50 is used for aligning the wafer W placed on the chuck top 70 with the probes of the probe card described later.

[0021] The upper camera 60 is provided to image the lower side. In one embodiment, the upper camera 60 is configured to be horizontally movable. The upper camera 60 is located, for example, in a region on the front side (the negative Y direction in the figure) of each tester 40 within the inspection area where the upper camera 60 is provided and that does not overlap with the pogo frame described later in a plan view, and images the wafer W placed on the chuck top 70 on the aligner 50. Note that the upper camera 60 is controlled by the control unit 22. Also, the imaging result by the upper camera 60 is output to the control unit 22.

[0022] The chuck top 70 is an example of a mounting member, and the wafer W is placed thereon. The chuck top 70 can hold the placed wafer W by suction or the like, for example.

[0023] In this inspection apparatus 1, while the transfer device 30 transfers the wafer W toward one tester 40, the other testers 40 can inspect the electrical characteristics of the electronic devices formed on the other wafers W.

[0024] <Inspection area> Subsequently, with reference to FIGS. 3 to 5, a more detailed configuration of the inspection area 13 will be described. FIG. 3 is a side cross-sectional view of the inspection area 13. FIG. 4 is a cross-sectional view around the pogo frame described later. FIG. 5 is a schematic partial enlarged view of the lower surface of the pogo frame described later. In FIG. 5, the illustration of the probes described later is omitted.

[0025] As described above, the aligner 50 and the upper camera 60 are provided in each divided area 13a of the inspection area 13. Further, as shown in FIG. 3, each divided area 13a is provided with a lower camera 80, a pogo frame 90, and a probe card 100, which will be described later.

[0026] The aligner 50 has, for example, an X stage 51, a Y stage 52, and a Z stage 53.

[0027] The X stage 51 moves along the guide rail 51a in the X-axis direction that constitutes the coordinate system of the moving plane (XY plane) by the aligner 50. A position detection mechanism (not shown) for detecting the position of the X stage 51 in the X direction, that is, the position of the chuck top 70 in the X-axis direction, is provided for the X stage 51. The above position detection mechanism is, for example, a linear encoder.

[0028] The Y stage 52 moves on the X stage 51. Specifically, it moves along the guide rail 52a in the Y-axis direction that constitutes the coordinate system of the moving plane (XY plane) by the aligner 50. A position detection mechanism (not shown) for detecting the position of the Y stage 52 in the Y-axis direction, that is, the position of the chuck top 70 in the Y-axis direction, is provided for the Y stage 52. The above position detection mechanism is, for example, a linear encoder.

[0029] The Z stage 53 moves in the height direction (Z direction) by a telescopic shaft 53a that can be telescoped in the height direction (Z direction) orthogonal to the moving plane (XY plane) by the aligner 50. A position detection mechanism (not shown) for detecting the position of the Z stage 53 in the Z direction, that is, the position of the chuck top 70 in the Z direction, is provided for the Z stage 53. The above position detection mechanism is, for example, a linear encoder. Further, the chuck top 70 is detachably adsorbed and held on the Z stage 53. The adsorption and holding of the chuck top 70 by the Z stage 53 is performed by vacuum adsorption or the like by an adsorption and holding mechanism (not shown).

[0030] The lower camera 80 is an example of a detection unit and is for detecting a probe (described later) and a positioning pin (described later) provided on the probe card 100. Further, the lower camera 80 is an example of an imaging unit and images the upper side.

[0031] The lower camera 80 is fixed to the aligner 50. Specifically, the lower camera 80 is fixed to the Z stage 53 of the aligner 50. Because it is fixed in this way, the lower camera 80 can be moved together with the chuck top 70 by the aligner 50. The lower camera 80 is located, for example, in the area below the probe card 100 fixed to the pogo frame 90 and images the probe card 100.

[0032] Note that the aligner 50 and the lower camera 80 are controlled by the control unit 22. Also, the imaging result by the lower camera 80 and the position detection result by the position detection mechanism provided on the X stage 51, Y stage 52, and Z stage 53 are output to the control unit 22.

[0033] As shown in FIG. 4, the tester 40 has a tester mother board 41 at the bottom. A plurality of inspection circuit boards (not shown) are mounted on the tester mother board 41 in an upright state. Also, a plurality of electrodes (not shown) are provided on the bottom surface of the tester mother board 41. Furthermore, a pogo frame 90 is provided below the tester 40.

[0034] The pogo frame 90 is an example of a holding unit and holds the probe card 100. Also, the pogo frame 90 electrically connects the probe card 100 and the tester 40. This pogo frame 90 has pogo pins 91 for the above-described electrical connection, and specifically, has a pogo block 92 that holds a large number of pogo pins 91. Also, the pogo frame 90 has a frame body 93 to which the pogo block 92 is attached. The probe card 100 is fixed to the lower surface of the pogo frame 90 in a state of being aligned at a predetermined position.

[0035] Note that, by an exhaust mechanism (not shown), the test mother board 41 is vacuum-sucked to the pogo frame 90, and the probe card 100 is vacuum-sucked to the pogo frame 90. Due to the vacuum suction force for performing these vacuum suction operations, the lower end of each pogo pin 91 of the pogo frame 90 contacts the corresponding electrode on the upper surface of a card body 101 of the probe card 100 described later, and the upper end of each pogo pin 91 is pressed against the corresponding electrode on the lower surface of the test mother board 41.

[0036] The probe card 100 has a disc-shaped card body 101 provided with a plurality of electrodes on its upper surface. On the lower surface of the card body 101, a plurality of probes 102, which are needle-shaped contact terminals extending downward, are provided. Each of the plurality of electrodes provided on the upper surface of the card body 101 is electrically connected to the corresponding probe 102. Also, during inspection, each probe 102 contacts an electrode (not shown) of a semiconductor device formed on the wafer W. Therefore, during the electrical characteristic inspection, an electrical signal to be inspected is transmitted and received between the test mother board 41 and the semiconductor device on the wafer W via the pogo pin 91, the electrodes provided on the upper surface of the card body 101, and the probe 102.

[0037] Note that, in order to collectively perform the electrical characteristic inspection of a plurality of semiconductor devices formed on the wafer W, the inspection apparatus 1 is provided with a large number of probes 102 so as to cover substantially the entire lower surface of the card body 101.

[0038] Also, a bellows 94 is attached to the lower surface of the pogo frame 90. The bellows 94 is an example of a cylindrical member, is configured to be stretchable, and is formed in a cylindrical shape, and forms a sealed space S between the chuck top 70 and the pogo frame 90. Further, the bellows 94 hangs down from the pogo frame 90 so as to surround the probe card 100. As shown by the dotted line in FIG. 4, this bellows 94 sucks and holds the chuck top 70 at a position below the probe card 100.

[0039] Further, the bellows 94 forms a sealed space S including the probe card 100 and the wafer W by sucking and holding the chuck top 70. The sealed space S is surrounded by the pogo frame 90, the bellows 94, and the chuck top 70, and communicates with one end of an exhaust passage 93a formed in the frame body 93 of the pogo frame 90. A pressure reducing mechanism 110 and an atmosphere releasing mechanism 120 are connected to the other end of the exhaust passage 93a.

[0040] The pressure reducing mechanism 110 reduces the pressure in the sealed space S. Thereby, the contact state between the wafer W and the probe 102 is maintained. The pressure reducing mechanism 110 includes a vacuum pump that exhausts the sealed space S, a switching valve that switches the start and stop of the exhaust by the vacuum pump, etc., and is controlled by the control unit 22.

[0041] The atmosphere releasing mechanism 120 is a mechanism for returning the sealed space S to atmospheric pressure, and introduces air into the sealed space S. The atmosphere releasing mechanism 120 includes a switching valve that switches the start and stop of introducing air into the sealed space S, etc., and is controlled by the control unit 22. In order to return the sealed space S to atmospheric pressure, an inert gas or the like may be introduced instead of introducing air.

[0042] Furthermore, in the present embodiment, a plurality of positioning pins 130 are provided. The positioning pins 130 are an example of positioning members, protrude downward from the pogo frame 90 side, contact the upper surface of the chuck top 70, and define the height of the chuck top 70 with respect to the probe 102. Specifically, the positioning pins 130 protrude downward from the lower surface of the pogo frame 90, and the lower ends thereof contact the upper surface of the chuck top 70, defining the height of the upper surface of the chuck top 70.

[0043] Also, as shown in FIG. 5, for example, the plurality of positioning pins 130 are provided at intervals (specifically, at equal intervals) on the same circumference centered on the center of the probe card 100 along the outer circumference of the bellows 94 in the region outside the bellows 94. The shape of each positioning pin 130 is, for example, cylindrical. Note that the number of the positioning pins 130 is not limited to four as in the example of FIG. 5, and may be five or more or three as long as the attitude of the chuck top 70 whose height is defined by the positioning pins 130 can be maintained horizontally.

[0044] In this embodiment, an adjustment mechanism 140 for adjusting the height of each positioning pin 130 is provided. Specifically, the adjustment mechanism 140 adjusts the height of the lower end of the positioning pin 130. In other words, the adjustment mechanism 140 adjusts the protruding length (i.e., the protruding amount) downward from the lower surface of the pogoframe 90 of the positioning pin 130. The adjustment mechanism 140 has, for example, a drive unit (not shown) that drives the positioning pin 130 to move up and down in order to adjust the height of the corresponding positioning pin 130. The drive unit has, for example, a motor (not shown) as a drive unit that generates the driving force for the above-described up and down movement. The drive unit also has an encoder (not shown) connected to the motor. The encoder outputs the number of pulses corresponding to the movement amount of the positioning pin 130 by the motor to the control unit 22. The control unit 22 can acquire the height of the corresponding positioning pin 130 based on the output from this encoder.

[0045] Further, a torque detection unit is provided as a detection unit that detects the load of the drive unit of the adjustment mechanism 140. The torque detection unit detects, for example, the torque of the motor of the drive unit and outputs the detection result to the control unit 22. The control unit 22 can detect the contact between the corresponding positioning pin 130 and the chuck top 70 based on the output from this torque detection unit.

[0046] <Inspection Process Using the Inspection Apparatus 1> Subsequently, the inspection process using the inspection apparatus 1 will be described with reference to FIGS. 6 to 12.

[0047] (S1: Loading) First, the wafer W to be inspected is loaded into the desired divided region 13a. Specifically, the transfer device 30 and the like are controlled by the control unit 22, and the wafer W is taken out from the cassette C in the port 20 of the loading / unloading area 11, and then carried into, for example, the middle splitting area 13a, and placed on the chuck top 70 adsorbed and held by the aligner 50.

[0048] (S2: Acquisition of the horizontal position and height of the probe) Next, based on the detection result of the probe 102 using the lower camera 80 by the control unit 22, the position (hereinafter referred to as "horizontal position") and height of the probe 102 in the horizontal direction are acquired. Specifically, under the control of the control unit 22, as shown in FIG. 6, the chuck top 70 is moved by the aligner 50 so that the lower camera 80 is located in the area below the probe card 100. Then, based on the imaging result of the lower camera 80 and the detection result of the position detection mechanism of the aligner 50 by the control unit 22, the horizontal position and height of the probe 102 are acquired.

[0049] The horizontal position and height of the probe 102 are, for example, the horizontal position and height related to the center of gravity of the lower ends of a plurality of predetermined probes 102 among the probes 102 provided on the probe card 100.

[0050] (S3: Acquisition of the height of the positioning pin) Next, the height of the positioning pin 130 is acquired by the control unit 22 using the lower camera 80. Specifically, under the control of the control unit 22, as shown in FIG. 7, the chuck top 70 is moved by the aligner 50 so that the lower camera 80 is located in the area below the positioning pin 130. Then, based on the imaging result of the lower camera 80 and the detection result of the position detection mechanism of the aligner 50 by the control unit 22, the height of the positioning pin 130 is acquired. Specifically, the height of the positioning pin 130 is the height of the lower end of the positioning pin 130. Also, in one embodiment, the height of the positioning pin 130 is acquired for each positioning pin 130.

[0051] (S4: Acquisition of the horizontal position and height of the wafer) Next, the control unit 22 uses the upper camera 60 to acquire the horizontal position and height of the wafer W on the chuck top 70 held by the aligner 50. Specifically, under the control of the control unit 22, as shown in FIG. 8, the chuck top 70 is moved by the aligner 50 to a region below the upper camera 60. Then, based on the imaging result of the upper camera 60 and the detection result of the position detection mechanism of the aligner 50, the control unit 22 acquires the horizontal position and height of the wafer W on the chuck top 70. The horizontal position of the wafer W is, for example, the horizontal position related to the centroid of a plurality of predetermined electrodes among the electrodes provided on the wafer W.

[0052] (S5: Acquisition of the height of the chuck top) Also, the control unit 22 uses the upper camera 60 to acquire the height of the chuck top 70 held by the aligner 50. Specifically, under the control of the control unit 22, as shown in FIG. 9, the chuck top 70 is moved by the aligner 50 to a region below the upper camera 60. Then, based on the imaging result of the upper camera 60 and the detection result of the position detection mechanism of the aligner 50, the control unit 22 acquires the height of the chuck top 70 where the positioning pin 130 contacts. Note that the height of the chuck top 70 is specifically the height of the upper surface of the outer peripheral portion of the chuck top 70.

[0053] (S6: Adjust the positioning pin to the reference height) Thereafter, based on the height of the probe 102, the height of the positioning pin 130, the height of the wafer W, and the height of the chuck top 70 acquired by the control unit 22, the height of the positioning pin 130, that is, the protruding length downward, is set so that the overdrive amount OD becomes zero. That is, the adjustment mechanism 140 positions the positioning pin 130 at the reference height where the overdrive amount OD becomes zero. This reference height is set so that the timing when the probe 102 contacts the wafer W and the timing when the positioning pin 130 contacts the chuck top 70 are substantially the same. Note that when setting the height of the positioning pin 130, it is not necessary to use the height of the wafer W acquired by the control unit 22. Instead, information such as the thickness of the wafer W stored in advance may be used.

[0054] (S7: Movement of the wafer W downward to the probe card) After steps S2 to S6, under the control of the control unit 22, as shown in FIG. 10, the chuck top 70 is moved downward to the lower side of the probe card 100 by the aligner 50. At this time, the wafer W and the probe 102 of the probe card 100 are aligned based on the acquisition results in steps S2 and S4.

[0055] (S8: Formation of a sealed space) Subsequently, under the control of the control unit 22, the chuck top 70 is raised by the aligner 50, and as shown in FIG. 11, a sealed space S is formed. Specifically, for example, under the control of the control unit 22, the chuck top 70 is raised by the aligner 50 until it abuts against the lower end of the bellows 94, and then is adsorbed and held by the bellows 94. Thereby, a sealed space S surrounded by the pogo frame 90, the bellows 94, and the chuck top 70 and including the probe card 100 and the wafer W inside is formed.

[0056] (S9: Depressurization of the sealed space and contact between the positioning pin and the chuck top) Next, under the control of the control unit 22, the sealed space S is depressurized and the positioning pin 130 adjusted to the reference height and the upper surface of the chuck top 70 are brought into contact. By this contact, the wafer W on the chuck top 70 is maintained parallel to the probe 102.

[0057] Specifically, for example, under the control of the control unit 22, the chuck top 70 is detached from the aligner 50 and the sealed space S is depressurized by the depressurization mechanism 110. As a result, the chuck top 70 rises, and as shown in FIG. 12, the wafer W on the chuck top 70 comes into contact with the probe 102, and the lower end of the positioning pin 130 comes into contact with the upper surface of the chuck top 70.

[0058] (S10: Ascent of the chuck top and adjustment of the height of the positioning pins 130) Thereafter, the control unit 22 acquires the height of the positioning pins 130, i.e., the target height, at which a desired overdrive amount OD is achieved, and while adjusting the driving amount of the ascent of the positioning pins 130 by the adjustment mechanism 140, the chuck top 70 is raised. Specifically, for all the positioning pins 130, the control unit 22 acquires the target height from a storage unit (not shown), monitors the driving amount of the positioning pins 130 by the adjustment mechanism 140, which is related to the height of the positioning pins 130, and moves each positioning pin 130 to the target height. At this time, by continuing the decompression of the sealed space S, the chuck top 70 is raised following the ascent of the positioning pins 130. As a result, the probe 102 can be uniformly brought into contact with the wafer W at a desired contact pressure.

[0059] Also, when the chuck top 70 is raised, the driving amount of the ascent and descent of the positioning pins 130 by the adjustment mechanism 140 is adjusted so that contact between all the positioning pins 130 and the chuck top 70 is maintained. Thereby, the parallelism of the chuck top 70 can be maintained.

[0060] (S11: Inspection) Then, under the control of the control unit 22, an electrical characteristic inspection of the electronic devices formed on the wafer W is performed. Electrical signals for the electrical characteristic inspection are input from the tester 40 to the electronic devices via the pogo pins 91, the probes 102, and the like.

[0061] (S12. Unloading) Thereafter, the inspected wafer W is unloaded. Specifically, under the control of the control unit 22, the chuck top 70 adsorbed by the bellows 94 is transferred to and held by the aligner 50. Also, the inspected wafer W on the chuck top 70 held by the aligner 50 is unloaded from the inspection area 13 by the transfer device 30 and returned to the cassette C in the port 20 of the loading / unloading area 11. Note that the above steps S1 to S12 are performed for each wafer W. Further, during the inspection by one tester 40, the aligner 50 conveys the wafer W to be inspected to another tester 40 and retrieves the wafer W after inspection from another tester 40.

[0062] <Main effects of this embodiment> In this embodiment, when performing the inspection, while raising the positioning pin 130, the chuck top 70 is raised based on the reference height of the positioning pin 130 calculated from the result acquired by the camera, that is, the contact height at which the probe 102 contacts the wafer W (the position where the overdrive amount OD is zero). Therefore, the probe 102 and the wafer W can be appropriately brought into contact. Further, since the parallelism of the chuck top 70 is maintained by the positioning pin 130, contact can be made uniformly in the plane with a desired overdrive amount. Furthermore, in this embodiment, the lower camera 80 is used to actually detect the lower end of the positioning pin 130, and based on the detection result, the reference height of the positioning pin 130 is set. Therefore, regardless of the state of the positioning pin 130 (for example, the degree of thermal expansion of the positioning pin 130 or the inclination of the positioning pin 130), the lower end of the positioning pin 130 can be set to the target height. Accordingly, regardless of the state of the positioning pin 130, the probe 102 and the wafer W can be appropriately brought into contact.

[0063] It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or changed in various forms without departing from the scope and gist of the appended claims.

[0064] For example, the positioning pin 130 may be provided on the chuck top 70 side and contact the lower surface of the pogo frame 90.

Explanation of reference numerals

[0065] 1 Inspection apparatus 22 Control unit 70 Chuck top 80 Lower camera 90 Pogo frame 100 Probe card 102 Probe 130 Positioning pin 140 Adjustment mechanism W Wafer

Claims

1. An inspection apparatus for inspecting a substrate, comprising: a placement member on which the substrate is placed; a holding portion that holds a probe card having probes that contact the substrate; a plurality of positioning members that contact the upper surface of the placement member or the lower surface of the holding portion to define the height of the placement member with respect to the probes; an adjustment mechanism that adjusts the height of the positioning members; a detection unit for detecting the probes, the placement member, and the positioning members; a control unit; and the control unit:[[]] a step of obtaining the height of the probes based on the detection result of the probes using the detection unit; a step of obtaining the height of the placement member based on the detection result of the placement member using the detection unit; a step of obtaining the height of the positioning members based on the detection result of the positioning members using the detection unit; a step of positioning the positioning members using the adjustment mechanism to a reference height at which the over-drive amount becomes zero based on the detection results of the probes, the placement member, and the positioning members using the detection unit; a step of obtaining the height of the positioning members at which a desired over-drive amount is obtained, and raising the placement member while adjusting the driving amount of the adjustment mechanism until the height is reached. An inspection apparatus configured to perform.

2. The inspection apparatus according to claim 1, wherein the reference height at which the over-drive amount becomes zero is the height at which the substrate on the placement member contacts the probes.

3. a telescopic cylindrical member that forms a sealed space between the placement member and the holding portion; an exhaust path for decompressing the sealed space; and the control unit is configured to perform a step of decompressing the sealed space including the substrate and the probe card. The inspection apparatus according to claim 1 or 2.

4. The inspection apparatus according to any one of claims 1 to 3, wherein the reference height is set for each of the positioning members.

5. An inspection method for inspecting a substrate by an inspection apparatus, wherein the inspection apparatus includes a placement member on which the substrate is placed; a holding portion that holds a probe card having probes that contact the substrate; a plurality of positioning members that contact the upper surface of the placement member or the lower surface of the holding portion to define the height of the placement member with respect to the probes; an adjustment mechanism that adjusts the height of the positioning members; a detection unit for detecting the probes, the placement member, and the positioning members. A step of obtaining the height of the probe based on the detection result of the probe using the detection unit; A step of obtaining the height of the placement member based on the detection result of the placement member using the detection unit; A step of obtaining the height of the positioning member based on the detection result of the positioning member using the detection unit; A step of positioning the positioning member using the adjustment mechanism at a reference height at which the over-drive amount becomes zero based on the detection results of the probe, the placement member, and the positioning member using the detection unit; A step of obtaining the height of the positioning member that results in a desired over-drive amount and raising the placement member while adjusting the driving amount of the adjustment mechanism until the height is reached. The inspection method includes these steps.

Images