Flexible Wiring Board, Module, and Electronic Device

Abstract

To provide a technique advantageous in achieving both flexibility and strength of a flexible wiring board.SOLUTION: The present invention is a flexible wiring board comprising an insulator and a wiring layer supported on the insulator, and has a first terminal part that is provided at one end of the wiring layer and includes a plurality of connection terminals, a second terminal part that is provided at the other end of the wiring layer and includes a plurality of connection terminals, and first holes and second holes that are formed in the insulator on the way in a first direction from the first terminal part toward the second terminal part. The first holes and the second holes are arranged separated from each other in the first direction. An insulator area adjacent to the first holes in a second direction intersecting with the first direction is adjacent to at least part of the second holes in the first direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a flexible printed circuit board, a module, and an electronic device.

Background Art

[0002] Patent Document 1 proposes a structure of a composite substrate having a connection structure between substrates. The composite substrate described in Patent Document 1 includes a first flexible printed circuit board having a reinforcing plate laminated on a first surface, and a second flexible printed circuit board joined to a second surface of the first flexible printed circuit board. Further, the reinforcing plate has a portion protruding from an end surface of the first flexible printed circuit board so as to overlap a joint portion of the first and second flexible printed circuit boards. In addition, in the composite substrate described in Patent Document 1, at the joint portion, wiring patterns of the first and second flexible printed circuit boards are electrically connected, and the reinforcing plate and the second flexible printed circuit board are fixed with an adhesive. Thereby, disconnection of the wiring pattern exposed portion due to bending stress can be prevented.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the technique described in Patent Document 1, the strength of the flexible printed circuit board can be increased by the reinforcing plate, but on the other hand, the flexibility of the flexible printed circuit board is impaired. For this reason, a load is applied to a connection portion that connects the flexible printed circuit board and a connection destination such as a printed circuit board. Conversely, when the flexibility of the flexible printed circuit board is too high, the flexible printed circuit board sags and comes into contact with peripheral electronic components or the like. For this reason, the flexible printed circuit board is required to achieve both flexibility and strength.

[0005] Therefore, an object of the present invention is to provide a technology that is advantageous in achieving both flexibility and strength in a flexible printed circuit board.

Means for Solving the Problems

[0006] According to one aspect of the present invention, there is provided a flexible printed circuit board including an insulator and a wiring layer supported by the insulator, the flexible printed circuit board including: a first terminal portion provided at one end of the wiring layer and including a plurality of connection terminals; a second terminal portion provided at the other end of the wiring layer and including a plurality of connection terminals; a first hole and a second hole formed in the insulator in the middle of a first direction from the first terminal portion toward the second terminal portion, the first hole and the second hole being spaced apart from each other in the first direction, and an insulator region adjacent to the first hole in a second direction intersecting the first direction being adjacent to at least a part of the second hole in the first direction. The insulator includes a first insulator layer and a second insulator layer, the wiring layer is provided between the first insulator layer and the second insulator layer, and the first hole and the second hole penetrate the first insulator layer and reach at least a part of the wiring layer. A flexible printed circuit board characterized by the above is provided.

Effects of the Invention

[0007] According to the present invention, it is possible to provide a technology that is advantageous in achieving both flexibility and strength in a flexible printed circuit board.

Brief Description of the Drawings

[0008]

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Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiments, and can be appropriately modified without departing from the gist thereof. Also, in the drawings described below, those having the same function are denoted by the same reference numerals, and the description thereof may be omitted or simplified. Note that the term "hole" in this specification is used to mean both a bottomed hole and a non-bottomed hole. Also, the term "through hole" means a hole that penetrates a single member or a composite member. The "through hole" can include both a case where the bottom of the through hole that penetrates a single member or a composite member is formed by another member to form a bottomed hole and a case where it becomes a non-bottomed hole.

[0010] [First Embodiment] The connection structure between the flexible printed circuit board 110 and the printed circuit board 121 in the imaging module 100 according to the first embodiment will be described with reference to FIGS. 1, 2A to 2D, 3, and 4. FIG. 1 is a top view showing the schematic configuration of the imaging module 100 according to the present embodiment. FIG. 2A is a top view of the hole formation region A1 of the flexible printed circuit board 110 of the imaging module 100 shown in FIG. 1. FIG. 2B is a cross-sectional view taken along the line B-B' shown in FIG. 2A. FIG. 2C is a bottom view of the hole formation region A1 of the flexible printed circuit board 110 shown in FIG. 1. FIG. 2D is a cross-sectional view taken along the line C-C' shown in FIG. 2C. FIG. 3 is a schematic cross-sectional view showing the schematic configuration of the imaging module 100 according to the present embodiment, and is a cross-sectional view taken along the line A-A' shown in FIG. 1. FIG. 4 is an enlarged cross-sectional view of the main part of the imaging module 100 shown in FIG. 3.

[0011] As shown in FIGS. 1 and 3, the imaging module 100 includes a flexible printed circuit board 110, a sensor unit 120, an anti-shake correction unit 130, and an image processing unit 150.

[0012] Here, the coordinate axes and directions of the X, Y, and Z axes of the XYZ coordinate system, which is an orthogonal coordinate system used in the following description, are defined. First, an axis perpendicular to the main surface of the printed wiring board 121 of the sensor unit 120 is defined as the Z axis. Also, an axis parallel to the main surface of the printed wiring board 121 and along a set of mutually parallel side edges of the printed wiring board 121 is defined as the X axis. Further, an axis orthogonal to the X and Z axes is defined as the Y axis. In the XYZ coordinate system thus defined, the direction along the X axis is the X direction. Among the X directions, the direction from one end on the side of the connection portion 140 of the flexible wiring board 110 to the other end is the +X direction, and the direction opposite to the +X direction is the -X direction. Also, the direction along the Y axis is the Y direction. Among the Y directions, the direction from the right side to the left side with respect to the +X direction is the +Y direction, and the direction opposite to the +Y direction is the -Y direction. Also, the direction along the Z axis is the Z direction. Among the Z directions, the direction from the side of the imaging sensor element 122 of the sensor unit 120 to the side of the connection portion 140 is the +Z direction, and the direction opposite to the +Z direction is the -Z direction. Also, the rotational direction around the Z axis is the θ direction.

[0013] Also, as shown in FIGS. 2B and 2D, the flexible wiring board 110 has a flexible base material 111, a flexible wiring layer 112, and a coverlay 113. The flexible wiring board 110 has one or more conductor layers as the flexible wiring layer 112, and the conductor layers are laminated via the flexible base material 111 as an insulating layer. In this embodiment, the case where the wiring layer in the flexible wiring board 110 is a single layer will be described, but it is not limited to a single layer, and the wiring layer may be a plurality of layers. Also, in this embodiment, the flexible base material 111 and the coverlay 113 are collectively referred to as an "insulator". The "insulator" may have a single-layer structure with only the flexible base material 111 as the insulator layer, or may have a multi-layer structure of a plurality of insulator layers with each of the flexible base material 111 and the coverlay 113 as the insulator layer. The number of insulator layers in the insulator having a multi-layer structure may be 3 or more.

[0014] The flexible base material 111 is an insulating base material made of resin or the like, for example, in the form of a sheet or film, and has plasticity and flexibility. Therefore, the flexible printed circuit board 110 having the flexible base material 111 can be deformed such as bent. The insulator constituting the flexible base material 111 only needs to have electrical insulation. For example, as the insulator constituting the flexible base material 111, polyimide, polyethylene terephthalate, or the like is used.

[0015] The flexible wiring layer 112 is a conductor layer made of copper foil, other metal foils, or the like. The flexible wiring layer 112 has a predetermined wiring pattern. The flexible wiring layer 112 is formed on one or both sides of the flexible base material 111. The conductor constituting the flexible wiring layer 112 is a material having higher conductivity and thermal conductivity than the insulator, for example, a metal such as copper, silver, or gold. Note that the flexible wiring layer 112 only needs to be formed on at least one surface of the flexible base material 111.

[0016] The coverlay 113 is an insulating layer that protects the circuit formed by the flexible wiring layer 112. The coverlay 113 is formed of a cover film or the like. As the insulator such as the cover film of the coverlay 113, polyimide, polyethylene terephthalate, or the like is used.

[0017] The cover film serving as the coverlay 113 is bonded to the flexible base material 111 and the flexible wiring layer 112 by an adhesive 114, and the adhesive 114 is formed so as to cover the flexible wiring layer 112. The adhesive 114 only needs to have electrical insulation. For example, adhesives such as epoxy-based and silicone-based adhesives are used. The coverlay 113 may be formed by overcoating or the like so as to cover the flexible wiring layer 112 on the surface of the flexible base material 111 where the flexible wiring layer 112 is formed.

[0018] In the flexible printed circuit board 110 of this embodiment, before being connected to the printed circuit board 121, holes are formed in the hole formation region A1 by mechanical processing such as a laser processing machine, a drill, or punching. In the case of mechanical processing, burrs or scratches may occur at the processing ends, so laser processing is preferred. Also, in the case of laser processing, a CO2 laser, a UV laser, an excimer laser, etc. are appropriately selected according to the flexible base material 111 and the base material of the coverlay 113. In this embodiment, at least two or more rows of holes are formed in the hole formation region A1. Also, the holes in this embodiment are blind holes, but they can also be replaced with through holes.

[0019] Also, as shown in FIG. 2C, a coverlay 113 is not formed at one tip of the flexible printed circuit board 110, and the flexible wiring layer 112 is exposed. The exposed portion of the flexible wiring layer 112 constitutes the first electrode 115.

[0020] Also, the first electrode 115 may be coated with plating such as gold. The first electrodes 115 are arranged, for example, in a plurality at a predetermined pitch.

[0021] In this way, the first electrode 115 is formed by the flexible wiring layer 112 exposed at the tip of the flexible printed circuit board 110. A first terminal portion including a plurality of connection terminals (first electrodes 115) is provided at one tip of the flexible printed circuit board 110 where the first electrode 115 is formed.

[0022] Also, as shown in FIG. 1, the imaging module 100 includes a flexible printed circuit board 110, a sensor unit 120 (first unit) connected to one end of the flexible printed circuit board 110, and an image processing unit 150 (second unit) connected to the other end of the flexible printed circuit board 110. Then, as shown in FIGS. 3 and 4, at the connection portion 140 between the printed circuit board 121 of the sensor unit 120 (first unit) and the flexible printed circuit board 110, a first electrode 115 exposed at one tip of the flexible printed circuit board 110 is connected to a second electrode 127 of the printed circuit board 121 by solder 141. The solder 141 is an example of a conductive adhesive. The flexible printed circuit board 110 and the printed circuit board 121 are reliably connected by the solder 141 that contacts the first terminal portion provided in the flexible wiring layer 112. Instead of the solder 141, a conductive adhesive such as an anisotropic conductive film (ACF) can also be used. Further, a connector may be used instead of the conductive adhesive such as the solder 141 for connecting the sensor unit 120 and the flexible printed circuit board 110. That is, the first terminal portion of the flexible printed circuit board 110 can be inserted into, for example, a connector mounted on the printed circuit board 121 of the sensor unit 120. Since the connection by the solder 141 can be stronger than other connection forms, it is more suitable to use the solder 141 when achieving both flexibility and strength in the flexible printed circuit board 110. Note that a gap is formed between the coverlay 113 of the flexible printed circuit board 110 and the solder 141 connected to the printed circuit board 121 at the connection portion 140, and it is desirable that the exposed portion 112a of the flexible wiring layer 112 is separated from the printed circuit board 121. In the example shown in FIG. 4, the positioning of the flexible printed circuit board 110 can be facilitated by the tip of the flexible printed circuit board 110 contacting (abutting) the solder resist layer 121c. However, as shown in FIG. 8 described later, the tip of the flexible printed circuit board 110 may be separated from the solder resist layer 121c, and the tip of the flexible printed circuit board 110 does not have to contact (abut) the solder resist layer 121c. A gap may be provided between the tip of the flexible printed circuit board 110 and the solder resist layer 121c.Further, solids such as solder 141 and a reinforcing resin (not shown) may be provided between the tip of the flexible printed circuit board 110 and the solder resist layer 121c.

[0023] Also, as shown in FIG. 1, a plurality of second connection terminals 116 are arranged at predetermined intervals by a flexible wiring layer 112 exposed at the tip of the flexible printed circuit board 110 at the other tip of the flexible printed circuit board 110. That is, a second terminal portion including connection terminals (insertion terminals) with electrodes formed by the flexible wiring layer 112 is provided at the other tip of the flexible printed circuit board 110. The other connection terminal of the flexible printed circuit board 110 is inserted into, for example, a connector 151 mounted on a printed circuit board of the image processing unit 150 (second unit). In this way, in the imaging module 100, the flexible printed circuit board 110 electrically connects the sensor unit 120 and the image processing unit 150 to each other.

[0024] As shown in FIG. 3, the sensor unit 120 includes a printed circuit board 121, an imaging sensor element 122, a cover glass 123, a frame 124, a metal wire 125, and a wire pad 126. The printed circuit board 121 is adhered and fixed to the frame 124 by an adhesive such as an ultraviolet curable resin. The sensor unit 120 (first unit) is supported by the shake correction unit 130 (third unit) so as to be movable with respect to the shake correction unit 130 as will be described later.

[0025] On one surface of the printed circuit board 121 on the side to which the flexible printed circuit board 110 is connected, a second electrode 127 is provided on the surface layer as will be described later. A frame 124 is attached on the peripheral edge of the other surface of the printed circuit board 121. The cover glass 123 is attached to the bottom side of the frame 124 so as to be parallel to the printed circuit board 121.

[0026] The imaging sensor element 122 is an imaging device composed of, for example, a semiconductor device. Specifically, the imaging sensor element 122 is a solid-state imaging device such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The imaging sensor element 122 is attached to the printed wiring board 121 in a hollow portion surrounded by the printed wiring board 121, the cover glass 123, and the frame 124 so as not to contact the cover glass 123. The imaging sensor element 122 is electrically connected to the wire pad 126 of the printed wiring board 121 through the metal wire 125. The wire pad 126 is, for example, gold-plated.

[0027] The shake correction unit 130 supports the sensor unit 120 fixed by the frame 131 so as to be movable in the X and Y directions and rotatable in the θ direction. The shake correction unit 130 can correct hand shake by moving or rotating the sensor unit 120 according to hand shake. The shake correction unit 130 has, for example, an L shape and is configured to support a frame 131 having a rectangular outer shape from the sides of two adjacent sides of the frame 131.

[0028] In the present embodiment, the case where the frame 131 is attached is described, but the arrangement location thereof is not limited to the peripheral portion of the printed wiring board 121. Further, the arrangement location of the imaging sensor element 122 may be inside the hollow portion of the printed wiring board 121 having a counterbore, such as a cavity substrate. Although not shown, the printed wiring board 121 is mounted with the minimum components necessary for the operation of the imaging module 100.

[0029] Also, as shown in FIG. 4, the printed wiring board 121 has a printed wiring base material 121a, a wiring layer 121b, and a solder resist layer 121c. The printed wiring board 121 is configured by laminating a plurality of wiring layers 121b via the printed wiring base material 121a. Unlike the flexible wiring board 110, the printed wiring board 121 is a rigid wiring board.

[0030] For example, the printed wiring board 121 may be formed of a glass epoxy material or may be formed of a ceramic substrate. Further, a printed circuit board in which the imaging sensor element 122 is disposed on a ceramic substrate and the ceramic substrate and the printed wiring board 121 are connected by a pair of electrodes with solder 141 can also be used. For example, an LGA (Land Grid Array) type or CLCC (Ceramic Leadless Chip Carrier) type sensor unit 120 can also be used.

[0031] In this embodiment, the case where the wiring layer 121b in the printed wiring board 121 has four layers will be described, but it is not limited to four layers. The wiring layer 121b in the printed wiring board 121 can be a single layer or a plurality of layers. That is, the wiring layer 121b may be four layers or less or four layers or more.

[0032] The printed wiring base material 121a is, for example, a substrate-like insulating base material made of a hard composite material or the like. Unlike the flexible base material 111, the printed wiring base material 121a is rigid. The insulator constituting the printed wiring base material 121a only needs to have electrical insulation. For example, the printed wiring base material 121a may be a resin substrate obtained by curing a resin such as an epoxy resin or a ceramic substrate using ceramic.

[0033] The wiring layer 121b is a conductor layer made of a copper foil or other metal foils. The wiring layer 121b has a wiring pattern. The wiring layer 121b is formed on one or both sides of the printed wiring base material 121a. Also, one or more layers of the wiring layer 121b are formed inside the printed wiring base material 121a. FIG. 4 shows a case where a total of four layers of the wiring layer 121b are formed on both sides and inside the printed wiring base material 121a. Also, inside the printed wiring base material 121a, vias 121d for electrically connecting between the wiring layers 121b are formed. Conductors such as the wiring layer 121b and the vias 121d are substances with higher conductivity and thermal conductivity than insulators, for example, metals such as copper and gold.

[0034] The solder resist layer 121c is an insulating protective film that protects the circuit constituted by the wiring layer 121b. The solder resist layer 121c is formed of a cured liquid solder resist, a film-like solder resist, etc. The solder resist layer 121c is formed so as to cover the wiring layer 121b on one surface of the printed wiring board 121 on the side where the flexible wiring board 110 is connected. Also, the solder resist layer 121c is formed so as to cover the wiring layer 121b on the other surface of the printed wiring board 121 on the side where the imaging sensor element 122 is attached.

[0035] In the solder resist layer 121c located on the flexible wiring board 110 side, openings 121e where the wiring layer 121b is exposed are formed. The exposed portions of the wiring layer 121b form the second electrodes 127. The second electrodes 127 are arranged, for example, in a plurality and in parallel at a predetermined pitch. Also, the second electrodes 127 are arranged, for example, at the central portion of the printed wiring board 121. On the second electrodes 127, the first electrodes 115 of the flexible wiring board 110 are electrically connected by solder 141.

[0036] When connecting the first electrode 115 and the second electrode 127 using the solder 141, the connection material having the solder 141 can be heated to a temperature equal to or higher than the melting point of the solder 141, and then the first electrode 115 and the second electrode 127 can be adhered to the solder 141 for connection. Further, the solder 141 may be, for example, a paste formed by combining a Sn-3.0Ag-0.5Cu solder or a Sn-58Bi solder with a flux. The heating of the solder 141 may be electromagnetic induction heating. Also, in order to connect the first electrode 115 and the second electrode 127, a conductive adhesive material such as an anisotropic conductive film (ACF) can be used instead of the solder 141.

[0037] Next, the holes formed on the surfaces of the flexible base material 111 and the coverlay 113 of the flexible wiring board 110 will be described in detail with reference to FIGS. 2A to 2D.

[0038] In FIGS. 2A and 2C, on the flexible base material 111 of the flexible wiring board 110, a hole formation region A1 in which a plurality of holes are arranged in the Y direction, and the ranges of the first column C1, the second column C2, and the third column C3 within the hole formation region A1 are indicated by broken lines.

[0039] In the first column C1, a plurality of holes 110a are arranged at a predetermined period and phase. Similarly, in the second column C2, a plurality of holes 110b are arranged at a predetermined period and phase. In the third column C3, a plurality of holes 110a are arranged at a predetermined period and phase. The holes 110a and the holes 110b are formed along the Y direction on the surface of the flexible wiring board 110 which is the XY plane. In the present embodiment, the "phase" of the hole means the position of the hole in the Y direction. Also, the "period" of the hole means the interval between a plurality of holes formed regularly in the Y direction. The plurality of holes 110a in the first column C1 and the third column C3 are arranged so as not to overlap the plurality of holes 110b in the second column C2 in a top view. Thus, the flexible wiring board 110 has a hole forming region A1 in which three columns of hole groups are arranged spaced apart from each other in the X direction. In the present embodiment, the plurality of holes 110a arranged in the first column C1 are referred to as the first hole group, the plurality of holes 110b arranged in the second column C2 are referred to as the second hole group, and the plurality of holes 110a arranged in the third column C3 are referred to as the third hole group, respectively. As shown in FIG. 2A, the third hole group is arranged on the opposite side of the first hole group with the second hole group sandwiched therebetween in the X direction in a plan view.

[0040] Note that since the plurality of holes 110b arranged in the second column C2 are holes formed on the coverlay 113 side, they are shown by broken lines in FIG. 2A. Similarly, since the plurality of holes 110a arranged in the first column C1 and the third column C3 are holes formed on the flexible base material 111 side, they are shown by broken lines in FIG. 2C.

[0041] As shown in FIG. 2A, the length of the hole 110a in the X direction is W1, and the length of the hole 110a in the Y direction is L1. The region A11 is a region that extends adjacent to one hole 110a in the Y direction. In FIG. 2A, the region A11 corresponds to the interval between one hole 110a and another hole 110a arranged adjacent to each other in the Y direction. The length of the region A11 in the Y direction is G1. The period in which a plurality of holes 110a are arranged in the first column C1 is D1. The period in which a plurality of holes 110a are arranged in the third column C3 is the same as D1. In the present embodiment, the length W1 of the hole 110a, which is the first hole, in the X direction is longer than the length L1 of the hole 110a in the Y direction. That is, the hole 110a is formed as an elongated depression (groove).

[0042] On the other hand, the length of the hole 110b in the X direction is W2, and the length of the hole 110b in the Y direction is L2. The region A12 is a region that extends adjacent to one hole 110b in the Y direction. In FIG. 2A, the region A12 corresponds to the interval between one hole 110b and another hole 110b arranged adjacent to each other in the Y direction. The length of the region A12 in the Y direction is G2. In the present embodiment, the length G2 of the region A12 is set to be the same as the length G1 of the region A11. The period in which a plurality of holes 110b are arranged in the second column C2 is D2. In the present embodiment, the period D2 of the holes 110b is set to be the same as the period D1 of the holes 110a. Also, similar to the case of the hole 110a, the length W2 of the hole 110b, which is the second hole, in the X direction is longer than the length L2 of the hole 110b in the Y direction.

[0043] The lines P1 and P2 shown in FIGS. 2A and 2C indicate the phases of the center points of the holes in the Y direction. The plurality of holes 110a in the first column C1 and the plurality of holes 110a in the third column C3 are formed such that the phases in the Y direction are the same for the corresponding holes in the X direction. In contrast, the plurality of holes 110a in the first column C1 are formed with a phase shift in the Y direction with respect to the plurality of holes 110b in the second column C2.

[0044] As described above, the length, period, and phase of the holes in the hole-forming region A1 are appropriately determined. As a result, the region A11 extending adjacent to the holes 110a in the first column C1 in the Y direction is adjacent to the holes 110b in the second column C2 in the X direction. Therefore, at least a part of the holes 110b overlaps the region A11 in a side view in the X direction.

[0045] Similarly, the region A12 extending adjacent to the holes 110b in the second column C2 in the Y direction is adjacent to the holes 110b in the first column C1 and the third column C3 in the X direction. Therefore, at least a part of the holes 110a overlaps the region A12 in a side view in the X direction.

[0046] Also, as shown in FIG. 2B, the holes 110a on the flexible substrate 111 do not penetrate the flexible wiring layer 112 and do not reach the coverlay 113. Similarly, as shown in FIG. 2D, the holes 110b on the coverlay 113 do not penetrate the coverlay 113 and do not reach the flexible wiring layer 112.

[0047] The holes 110a and 110b are preferably formed so that at least a part of the holes does not cover the flexible wiring layer 112 so as not to affect the wiring resistance of the flexible wiring layer 112 from increasing. However, the hole 110a may be formed as a through hole as long as it does not affect the wiring resistance of the flexible wiring layer 112.

[0048] The processing depth, pitch, size, number, etc. of the holes are preferably appropriately set based on the so-called "stiffness" strength such as the hardness and flexibility of the flexible substrate 111 and the coverlay 113, etc. and the load on the connection portion 140.

[0049] The shapes and depths of the holes 110a and 110b may be different. Also, within the hole formation region A1, the shapes and depths of the holes 110a and 110b may be different from each other. For example, the shape when viewed from above may be any of circular, elliptical, rectangular, rhombic, etc. Also, the cross-sectional shape may be rectangular, mortar-shaped, etc. By changing the arrangement, number, depth, size, shape, etc. of the holes 110a and 110b, it becomes possible to appropriately change the flexibility and strength of the flexible printed circuit board 110.

[0050] If too many holes are formed in the flexible printed circuit board 110 and the so-called "stiffness" is weak, the flexible printed circuit board 110 may sag and come into contact with electronic components (not shown) on the printed circuit board 121. When the sensor unit 120 moves, there is a concern that it may interfere with the electronic components (not shown) or the components of the hand shake correction unit 130, causing the flexible printed circuit board 110 to break or affecting the operation of the imaging module 100. Therefore, the length of the hole formation region in the wiring direction is preferably, for example, equal to or less than the length of the flexible printed circuit board 110 in the direction orthogonal to the wiring direction of the flexible printed circuit board 110. The number of columns is 10 columns or less, and 5 columns or less is more preferable.

[0051] Also, when the number of columns is 1, the flexibility effect of the flexible printed circuit board 110 is reduced with respect to rotation in the θ direction. For this reason, the number of columns needs to be at least 2 columns or more, and 3 columns or more is more preferable.

[0052] When the holes are formed so that the phases of the holes 110a and 110b are the same, or when the length of the holes in the wiring direction of the holes 110a and 110b is increased, during handling when installing the flexible wiring board 110 on the printed wiring board 121 or the like, the "resilience" of the flexible wiring board 110 in only one direction is weak, and it becomes easy to deform. Therefore, there is an increased concern that the flexible wiring board 110 may interfere with mechanical parts (not shown), electronic parts (not shown), etc., and break. Therefore, rather than forming the holes 110a and 110b with the same phase, arranging the holes in a checkered pattern with the phases shifted not only provides better flexibility of the flexible wiring board 110 with respect to rotation in the θ direction, but also has an advantage in the handleability of the flexible wiring board 110. In this way, the imaging module 100 according to the present embodiment is configured.

[0053] In recent years, in a digital camera, an image stabilization unit that moves the imaging sensor itself for shake correction is mounted. In the image stabilization unit, not only a conventional static load but also a dynamic load such as vibration during shake correction is superimposed in the plane XY direction and the rotation θ direction. Therefore, the flexible wiring board connecting the rigid wiring board on which the imaging sensor is mounted and the rigid wiring board on which the LSI for image processing is mounted is required to have flexibility that does not inhibit the driving of the shake correction unit and bonding strength against repeated loads.

[0054] On the other hand, in the flexible printed circuit board 110 according to the present embodiment, in the middle of the X direction (the first direction) from the first terminal portion including a plurality of connection terminals (first electrodes 115) provided at one end of the flexible wiring layer 112 to the second terminal portion including a plurality of second connection terminals 116 provided at the other end, there are a plurality of holes 110a and a plurality of holes 110b. The plurality of holes 110a and the plurality of holes 110b are arranged to be spaced apart from each other in the X direction (the first direction). In the Y direction (the second direction) intersecting the X direction, the insulator region adjacent to the hole 110a is adjacent to at least a part of the hole 110b in the X direction. Similarly, the insulator region adjacent to the hole 110b in the Y direction is adjacent to at least a part of the hole 110a in the X direction. Note that the region adjacent to the hole may include not only the insulator region made of the insulator of the flexible printed circuit board 110 but also the conductor region made of the conductor of the flexible wiring layer 112.

[0055] Thus, in the flexible printed circuit board 110 according to the present embodiment, since two or more rows of hole groups (recess groups) are formed at a predetermined period along the Y direction intersecting the X direction from the first terminal portion to the second terminal portion provided in the flexible wiring layer 112 in the vicinity of the connection portion 140, the vicinity of the connection portion 140 is locally softened. That is, since it is not a configuration for reinforcing the entire flexible printed circuit board 110, the flexibility of the flexible printed circuit board 110 is not impaired. Thereby, the flexible printed circuit board 110 can be deformed in accordance with the moving direction even when the connected sensor unit 120 moves in multiple directions.

[0056] Thereby, the vicinity of the connection portion 140 between the flexible printed circuit board 110 and the printed circuit board 121 can be locally softened. As a result, the deformation in the vicinity of the connection portion 140 of the flexible printed circuit board 110 accompanying the driving of the shake correction unit 130 becomes easy, and the stress applied to the connection portion 140 can be reduced. Further, since the bending angle of the flexible printed circuit board 110 during driving can be made an obtuse angle, the load on the connection portion 140 can be reduced, and the reliability of the connection between the flexible printed circuit board 110 and the printed circuit board 121 at the connection portion 140 can be improved.

[0057] According to this embodiment, it is possible to achieve both the strength and flexibility (flexibility) of the flexible printed circuit board 110. That is, it is possible to improve the connection reliability at the connection portion 140 while reducing the load generated at the connection portion 140 between the flexible printed circuit board 110 and the printed circuit board 121. Further, since holes are formed in the flexible printed circuit board 110 at a predetermined period and phase, the strength of the flexible printed circuit board 110 can be appropriately adjusted. As a result, when the sensor unit 120 moves, the flexible printed circuit board 110 deforms moderately, so that the operation of the shake correction unit 130 is not inhibited.

[0058] In this embodiment, there may be not only one flexible printed circuit board 110 but also two or more. Further, the connection position between the flexible printed circuit board 110 and the printed circuit board 121 is not limited to the center of the printed circuit board 121, and may be the end of the printed circuit board 121. Also, when a plurality of flexible printed circuit boards 110 are mounted on the imaging module 100, the positions of the plurality of flexible printed circuit boards 110 can be, for example, one at the center of the printed circuit board 121 and one at the end of the printed circuit board 121.

[0059] In this embodiment, the imaging module 100 is exemplified as the module. However, the module may not include an imaging sensor element. Also, the module is not limited to an electronic module. That is, the module may not have electronic components mounted thereon. Electronic components can be mounted on a module without electronic components mounted thereon to make an electronic module.

[0060] In this embodiment, the case where the X direction from the first terminal portion to the second terminal portion is orthogonal to the Y direction in which the connection terminals and the holes are arranged is exemplified, but the two directions do not necessarily have to be orthogonal, and it is sufficient if they intersect.

[0061] Furthermore, in the present embodiment, the case where the period and phase of the third hole group including the plurality of holes 110a arranged in the third column C3 are the same as the period and phase of the first hole group including the plurality of holes 110a arranged in the first column C1 has been described. However, the positional relationship between the plurality of holes in the third hole group and the plurality of holes in the first hole group is not limited to this. In the flexible wiring board 110, it is preferable to satisfy at least one of (A) the period of the third hole group is the same as the period of the first hole group, and (B) in the Y direction, the phases of the arrangements of the plurality of holes in the first hole group and the plurality of holes in the third hole group are the same.

[0062] [Second Embodiment] Next, the imaging module 100 according to the second embodiment will be described with reference to FIGS. 5, 6A to 6D, 7, and 8.

[0063] FIG. 5 is a top view showing a schematic configuration of the imaging module 100 according to the present embodiment. FIG. 6A is a top view of the hole formation regions A1 and A2 of the flexible wiring board 110 before being mounted on the imaging module 100 according to the present embodiment. FIG. 6B is a cross-sectional view taken along the line E-E' shown in FIG. 6A. FIG. 6C is a bottom view of the hole formation regions A1 and A2 of the flexible wiring board 110 before being mounted on the imaging module 100. FIG. 6D is a cross-sectional view taken along the line F-F' shown in FIG. 6C. FIG. 7 is a cross-sectional view taken along the line D-D' shown in FIG. 5. FIG. 8 is an enlarged cross-sectional view of the main part of the imaging module 100 shown in FIG. 7.

[0064] In this embodiment, the arrangement method of the flexible printed circuit board 110 is different from that of the first embodiment. Specifically, as shown in FIGS. 5 and 7, in this embodiment, after one tip of the flexible printed circuit board 110 is connected by the connection portion 140, the other tip is bent by folding it back once toward the connection destination. Then, by arranging the hole forming regions A1 and A2 in the bent portion of the flexible printed circuit board 110, the flexibility of the flexible printed circuit board 110 is improved in the hole forming regions A1 and A2. The holes 110a and 110b in the hole forming region A1 and the holes 110c and 110d in the hole forming region A2 are formed in the flexible printed circuit board 110 by a laser processing machine before the flexible printed circuit board 110 is connected to the printed circuit board 121.

[0065] In FIGS. 6A and 6C, on the flexible base material 111 of the flexible printed circuit board 110, a hole forming region A1 and A2 in which a plurality of holes are arranged, a first row C1, a second row C2, and a third row C3 in the hole forming region A1, and a fourth row C4, a fifth row C5, and a sixth row C6 in the hole forming region A2 are each indicated by a broken line. In this embodiment, since all the holes in the hole forming regions A1 and A2 are the holes formed on the flexible base material 111 side, they are indicated by broken lines in FIG. 6C.

[0066] In the first row C1 and the third row C3 in the hole forming region A1, a plurality of holes 110a are arranged at a predetermined period and phase. Also, in the second row C2 in the hole forming region A1, a plurality of holes 110b are arranged at a predetermined period and phase.

[0067] On the other hand, in the fourth row C4 and the sixth row C6 in the hole forming region A2, a plurality of holes 110c are arranged at a predetermined period and phase. In the fifth row C5 in the hole forming region A2, a plurality of holes 110d are arranged at a predetermined period and phase. The positional relationship between the plurality of holes 110c and the plurality of holes 110d in the hole forming region A2 is the same as the positional relationship between the plurality of holes 110a and the plurality of holes 110b in the hole forming region A1. The number, length, period, and phase of the holes are also the same. For this reason, hereinafter, the hole forming region A1 will be described as an example.

[0068] As shown in FIG. 6A, the length of the hole 110a in the X direction in the first column C1 is W3. The length of the hole 110a in the Y direction in the first column C1 is L3. Further, the region A13 is a region that extends adjacent to one hole 110a in the Y direction. In FIG. 6A, the region A13 corresponds to the interval between one hole 110a and another hole 110a arranged adjacent to each other in the Y direction. The length of the region A13 in the Y direction is G3. The period in which a plurality of holes 110a are arranged in the first column C1 is D3. Note that in the Y direction, the period and phase of the holes 110a in the first column C1 are the same as the period and phase of the holes 110a in the third column C3.

[0069] On the other hand, the length of the hole 110b in the X direction in the second column C2 is W4. The length of the hole 110b in the Y direction is L4. Further, the region A14 is a region that extends adjacent to one hole 110b in the Y direction. In FIG. 6A, the region A14 corresponds to the interval between one hole 110b and another hole 110b arranged adjacent to each other in the Y direction. The length of the region A14 in the Y direction is G4. In the present embodiment, the length G4 of the region A14 is set to be the same as the length G3 of the region A13. The period in which a plurality of holes 110b are arranged in the second column C2 is D4. The period D4 of the holes 110b is set to be the same as the period D3 of the holes 110a.

[0070] In addition, the lines P3 and P4 shown in FIGS. 6A and 6C indicate the phase of the center points of the holes in the Y direction. The plurality of holes 110a in the first column C1 and the third column C3, and the plurality of holes 110c in the fourth column C4 and the sixth column C6 are formed such that the phases in the Y direction are the same for the corresponding holes in the X direction. Also, the plurality of holes 110b in the second column C2 and the plurality of holes 110d in the fifth column C5 are formed such that the phases in the Y direction are the same for the corresponding holes in the X direction. Then, the plurality of holes 110b in the second column C2 and the plurality of holes 110d in the fifth column C5 are formed with a phase shift in the Y direction with respect to the plurality of holes 110a in the first column C1 and the plurality of holes 110c in the fourth column C4.

[0071] As described above, the lengths, periods, and phases of the holes in the hole formation regions A1 and A2 are appropriately determined. As a result, a region A13 that extends adjacent to the hole 110a in the first column C1 in the Y direction is adjacent to the hole 110b in the second column C2 in the X direction. Therefore, in a side view in the X direction, at least a part of the hole 110b overlaps with the region A13.

[0072] Similarly, a region A14 that extends adjacent to the hole 110b in the second column C2 in the Y direction is adjacent to the holes 110a in the first column C1 and the third column C3 in the X direction. Therefore, in a side view in the X direction, at least a part of the hole 110a overlaps with the region A14.

[0073] Also, as described above, the holes 110a, 110b, 110c, and 110d arranged at a predetermined period and phase in the Y direction are preferably formed so that at least a part of the holes does not cover the flexible wiring layer 112 so as not to cause an increase in the wiring resistance of the flexible wiring layer 112 or the like.

[0074] As shown in FIGS. 6B and 6D, the holes 110a and 110b in the hole formation region A1 of the flexible wiring board 110 and the holes 110c and 110d in the hole formation region A2 are formed from the surface side in the Z direction of the flexible base material 111. As shown in FIG. 6B, the holes 110a, 110b, 110c, and 110d on the flexible base material 111 do not penetrate, but each hole is formed so as to reach into the coverlay 113. That is, the insulator constituting the flexible wiring board 110 of the present embodiment includes a first insulator layer (flexible base material 111) and a second insulator layer (coverlay 113), and the flexible wiring layer 112 is provided between the first insulator layer and the second insulator layer. The first holes (holes 110a, 110c) and the second holes (holes 110b, 110d) are bottomed holes that penetrate the first insulator layer (flexible base material 111) and have the second insulator layer (coverlay 113) as the bottom.

[0075] Note that the holes 110a, 110b, 110c, and 110d may be formed to penetrate as long as they do not affect the wiring resistance of the flexible wiring layer 112. Specifically, the insulator constituting the flexible wiring board 110 includes a first insulator layer (flexible base material 111) and a second insulator layer (coverlay 113), and the flexible wiring layer 112 is provided between the first insulator layer and the second insulator layer. Then, the first holes (holes 110a and 110c) and the second holes (holes 110b and 110d) are through holes that penetrate the first insulator layer (flexible base material 111) and the second insulator layer (coverlay 113). However, when the through holes interfere with chip components (not shown) or the like mounted on the printed wiring board 121, the flexible wiring board 110 may be torn or damaged. In such a case, it is preferable not to make the holes penetrate.

[0076] The processing depth, pitch, size, number, etc. of the holes are preferably set as appropriate based on the so-called "stiffness" strength such as the hardness and flexibility of the flexible base material 111 and the coverlay 113, etc. and the load on the connection portion 140.

[0077] The shapes and depths of the holes (holes 110a and 110b) in the hole formation region A1 and the holes (holes 110c and 110d) in the hole formation region A2 may be different. Also, the shapes and depths of the holes 110a and 110b may be different within the hole formation region A1. Similarly, the shapes and depths of the holes 110c and 110d may be different within the hole formation region A2. For example, the shape as viewed from above may be any of circular, elliptical, square, rhombic, etc. Also, the cross-sectional shape may be rectangular, mortar-shaped, etc.

[0078] In the present embodiment, the mode in which the flexible wiring board 110 is arranged with respect to the printed wiring board 121 is different from that of the first embodiment. Note that since the other configurations are the same as those of the first embodiment, the description of the same configurations will be omitted.

[0079] In the first embodiment, the flexible printed circuit board 110 was arranged to extend without bending in the +X direction on the side of the image processing unit 150, which is the connection destination where the other tip on the side of the connection part 140 is connected to the connection part 140.

[0080] On the contrary, the flexible printed circuit board 110 in the present embodiment is arranged to extend in the -X direction opposite to the +X direction on the side of the image processing unit 150, which is the connection destination where the other tip is connected, with respect to the connection part 140. Further, the flexible printed circuit board 110 extending in the -X direction is bent in the +X direction on the side of the image processing unit 150 on the printed circuit board 121.

[0081] That is, in the present embodiment, as shown in FIGS. 5, 6A to 6D, 7, and 8, the flexible printed circuit board 110 is connected to the printed circuit board 121 by connecting the first electrode 115 to the second electrode 127 with solder 141 so that one tip faces the +X direction opposite to that in the first embodiment. Further, the flexible printed circuit board 110 is folded back once from the side opposite to the shake correction unit 130 to the side of the shake correction unit 130 so that the other tip is located on the side of the shake correction unit 130 and its connection destination, the image processing unit 150, and is in a bent state.

[0082] In this way, in the present embodiment, even when the flexible printed circuit board 110 is in a bent state, similar to the first embodiment, the load generated at the connection part 140 between the flexible printed circuit board 110 and the printed circuit board 121 can be reduced without inhibiting the driving of the shake correction unit 130, and the connection reliability at the connection part 140 can be improved.

[0083] In addition, in this embodiment, there may be not only one flexible printed circuit board 110 but also two or more. Further, the connection position between the flexible printed circuit board 110 and the printed circuit board 121 is not limited to the center of the printed circuit board 121 and may be at the end of the substrate. Also, when mounting a plurality of flexible printed circuit boards 110, their positional relationship may be such that one is at the center of the substrate and one is at the end of the substrate.

[0084] Also, a shielding material such as for radio waves or magnetism may be formed by coating or the like on either the flexible base material 111 or the coverlay 113. In that case, holes can be formed in the same manner as in the first embodiment from the surface side where the shielding material is not formed so as not to process the shielding material or the flexible wiring layer 112.

[0085] Also, in FIGS. 6B and 6D, the structure of the blind via hole in the case where the insulator constituting the flexible printed circuit board 110 includes the flexible base material 111 as the first insulator layer and the coverlay 113 as the second insulator layer was described. However, the structure of the blind via hole is not limited to this. Specifically, the blind via hole may be formed not from the flexible base material 111 side but from the coverlay 113 side. That is, the insulator constituting the flexible printed circuit board 110 may include the coverlay 113 as the first insulator layer and the flexible base material 111 as the second insulator layer, and the flexible wiring layer 112 may be provided between the first insulator layer and the second insulator layer. In this case, the first holes (holes 110a, 110c) and the second holes (holes 110b, 110d) may be blind via holes that penetrate the coverlay 113 (first insulator layer) and have the flexible base material 111 (second insulator layer) as the bottom.

[0086] Furthermore, also in this embodiment, there may be two or more flexible printed circuit boards 110. The connection position between the flexible printed circuit board 110 and the printed circuit board 121 is not limited to the center of the printed circuit board 121 and may be at the end of the substrate.

[0087] [Third Embodiment] FIG. 9 is an explanatory diagram of a camera 160, which is an example of an electronic device having the imaging module 100 according to the above-described first or second embodiment.

[0088] The imaging module 100 has the configuration described in the above-described first or second embodiment, and includes a shake correction unit 130, a sensor unit 120 including a printed wiring board 121, and a flexible wiring board 110.

[0089] As shown in FIG. 9, the camera 160 includes a camera body 200 and an interchangeable lens 300 (lens barrel) that is detachable from the camera body 200. In FIG. 9, the interchangeable lens 300 is attached to the camera body 200. Hereinafter, a case where the camera 160 is configured as an imaging device with the interchangeable lens 300 attached to the camera body 200 will be described.

[0090] The camera body 200 includes a housing 201, a mirror 222, a shutter 223, the imaging module 100 which is a printed circuit board, and an image processing circuit 224, which are housed inside the housing 201. The imaging module 100 and the image processing circuit 224 are electrically connected to each other communicably by a cable (not shown). Further, the camera body 200 includes a liquid crystal display 225 fixed to the housing 201 so as to be exposed to the outside from the housing 201.

[0091] The interchangeable lens 300 has a housing 201 which is an interchangeable lens housing and an imaging optical system. The imaging optical system is disposed inside the housing 301 and forms an optical image on the sensor unit 120 when the housing 301 (interchangeable lens 300) is attached to the housing 201. The imaging optical system is configured with a plurality of lenses.

[0092] The housing 301 of the interchangeable lens 300 has a lens-side mount 301a with an opening. On the other hand, the housing 201 of the camera body 200 has a camera-side mount 201a with an opening. By fitting the lens-side mount and the camera-side mount, the interchangeable lens 300 (housing 301) is attached to the camera body 200. Note that the arrow in the X direction shown in FIG. 9 indicates the optical axis direction of the imaging optical system.

[0093] Light traveling in the X direction is guided into the housing 201 through the opening of the lens-side mount 301a in the housing 301 and the opening of the camera-side mount 201a in the housing 201 by the imaging optical system. Inside the housing 201, a mirror 222, a shutter 223, etc. are provided in front of the imaging module 100 in the X direction along the X direction.

[0094] The imaging sensor element 122 in the sensor unit 120 is a solid-state imaging device such as a CMOS image sensor or a CCD image sensor that photoelectrically converts the optical image formed by the imaging optical system.

[0095] An imaging device equipped with the imaging module 100 according to this embodiment with such a configuration can reduce the load generated at the connection portion 140 between the flexible wiring board 110 and the printed wiring board 121 without inhibiting the driving of the shake correction unit 130, and can sufficiently guarantee the connection reliability at the connection portion 140 and the optical performance of the built-in CMOS image sensor.

[0096] In addition, in this embodiment, the case where the camera 160 is divided into the camera body 200 and the interchangeable lens 300 has been described, but an integrated camera 160 in which a lens is built into the camera body 200 may also be used.

[0097] In addition, in this embodiment, the camera 160 has been described as an imaging device that is an electronic device, but the present invention is not limited to this.

[0098] In addition, in this embodiment, the case where the electronic component is an image sensor or a memory element has been described as an example, but the present invention is not limited thereto. For example, the electronic component may be a semiconductor device for image processing or a power supply IC.

[0099] Furthermore, in this embodiment, the case where the electronic device is a digital camera has been described as an example, but the present invention is not limited thereto. For example, the electronic device may be an information device such as a smartphone or a personal computer, a communication device such as a modem or a router. Alternatively, the electronic device may be an office device such as a printer or a copier, a medical device such as an X-ray imaging device or an endoscope, an industrial device such as a robot or a semiconductor manufacturing device, or a transportation device such as a vehicle, an airplane, or a ship. When wiring is provided in the limited space inside the housing of the electronic device, if the flexible printed circuit board 110 is used, due to its flexibility, miniaturization and high density of the electronic device can be achieved. In particular, when the electronic device has a movable part, if the flexible printed circuit board 110 is used for the movable part, due to its high strength, the reliability of the electronic device can be improved.

[0100] [Modified Embodiment] Next, the hole formation pattern on the flexible printed circuit board 110 in the modified embodiment will be described with reference to FIGS. 10 to 15. FIGS. 10 to 15 are top views showing the schematic configuration of the flexible printed circuit board 110 according to the modified embodiment.

[0101] In the case of FIG. 10, five holes 110a and four holes 110b are provided on the flexible base material 111 side. The length of the hole 110a in the X direction is W5. The length of the hole 110a in the Y direction is L5. The region A15 is a region corresponding to the interval between two adjacent holes 110a in the Y direction and is the first insulator region in the flexible base material 111. The length of the region A15 in the Y direction is G5. The period of the first hole group composed of a plurality of holes 110a in the Y direction is D5.

[0102] On one hand, the length of the hole 110b in the X direction is W6. The length of the hole 110b in the Y direction is L6. The region A16 is a region corresponding to the interval between two adjacent holes 110b in the Y direction and is the second insulator region in the flexible substrate 111. The length of the region A16 in the Y direction is G6. The length G6 of the region A16 in the Y direction is longer than the length L6 of the hole 110b (the second hole) in the Y direction. The period in the Y direction of the second hole group composed of a plurality of holes 110b is D6.

[0103] The lengths W6 and L6 of the hole 110b are the same as the lengths W5 and L5 of the hole 110a respectively. The period D5 of the first hole group is different from the period D6 of the second hole group. In the Y direction, the length G5 of the region A15 is shorter than the length G6 of the region A16.

[0104] Also, the lines P5 and P6 indicate the phases of the center points of two adjacent holes 110a in the Y direction. In the first hole group and the second hole group in FIG. 10, the phases in the Y direction are the same for the holes at both ends, but different for the holes located in the middle. That is, in the Y direction, the arrangements of the plurality of holes 110a in the first hole group and the plurality of holes 110b in the second hole group have different phases.

[0105] In the case of FIG. 10 as well, similar to the first embodiment, at least a part of the region A15 in the first hole group is adjacent to the hole 110b in the X direction. Similarly, at least a part of the region A16 in the second hole group is adjacent to the hole 110a in the X direction. Therefore, the period D5 of the first hole group may be different from the period D6 of the second hole group. Also, the number of holes 110a may be different from the number of holes 110b.

[0106] In the case of FIG. 11, on the flexible substrate 111 side, there are five holes 110a and four holes 110b. The length of the hole 110a in the X direction is W7. The length of the hole 110a in the Y direction is L7. The region A17 is the interval between two adjacent holes 110a in the Y direction and is the first insulator region in the flexible substrate 111. The length of the region A15 in the Y direction is G7. The period of the first hole group composed of a plurality of holes 110a in the Y direction is D7.

[0107] On the other hand, the length of the hole 110b in the X direction is W8. The length of the hole 110b in the Y direction is L8. The region A18 is the interval between two adjacent holes 110b in the Y direction and is the second insulator region in the flexible substrate 111. The length of the region A18 in the Y direction is G8. The period of the second hole group composed of a plurality of holes 110b in the Y direction is D8.

[0108] The length W8 of the hole 110b is the same as the length W7 of the hole 110a. However, the length L8 of the hole 110b is longer than the length L7 of the hole 110a. Also, the period D7 of the first hole group is different from the period D8 of the second hole group. In the Y direction, the length G7 of the region A17 is longer than the length G8 of the region A18.

[0109] Also, the lines P7 and P8 indicate the phases of the center points of two adjacent holes 110a in the Y direction. Between the first hole group and the second hole group in FIG. 11, in the Y direction, the phases of the holes at both ends are the same, but the phases of the holes located in the middle are different.

[0110] In the case of FIG. 11 as well, similar to the first embodiment, at least a part of the region A17 in the first hole group is adjacent to the hole 110b in the X direction. Similarly, at least a part of the region A18 in the second hole group is adjacent to the hole 110a in the X direction. Therefore, in the Y direction, the length L7 of the hole 110a may be different from the length L8 of the hole 110b. The period D7 of the first hole group may be different from the period D8 of the second hole group.

[0111] In the case of FIG. 12, on the flexible substrate 111 side, there is one hole 110a and two holes 110b. The length of the hole 110a in the X direction is W9. The length of the hole 110a in the Y direction is L9.

[0112] On the other hand, the length of the hole 110b in the X direction is W10. The length of the hole 110b in the Y direction is L10. The region A19 is the interval between two adjacent holes 110b in the Y direction and is an insulator region in the flexible substrate 111. The length of the region A19 in the Y direction is G10. The length W10 of the hole 110b is the same as the length W9 of the hole 110a. The length L10 of the hole 110b is shorter than the length L9 of the hole 110a.

[0113] The line P9 indicates the phase of the center point of the hole 110a in the Y direction. The phase of the hole 110a in the Y direction in FIG. 12 is different from the phases of the two holes 110b. Also, in the Y direction, the length L9 of the hole 110a is longer than the length G10 of the region A19. Also in the case of FIG. 12, as in the first embodiment, at least a part of the region extending adjacent to the hole 110a in the Y direction is adjacent to the hole 110b in the X direction. Therefore, the number of holes 110a may be different from the number of holes 110b.

[0114] In the case of FIG. 13, as in FIG. 12, on the flexible substrate 111 side, there is one hole 110a and two holes 110b. The length of the hole 110a in the X direction is W11. The length of the hole 110a in the Y direction is L11.

[0115] On the other hand, the length of the hole 110b in the X direction is W12. The length of the hole 110b in the Y direction is L12. The region A20 is the interval between two adjacent holes 110b in the Y direction and is an insulator region in the flexible substrate 111. The length of the region A20 in the Y direction is G12. The length W12 of the hole 110b is the same as the length W11 of the hole 110a. The length L12 of the hole 110b is longer than the length L11 of the hole 110a.

[0116] The line P10 indicates the phase of the center point of the hole 110a in the Y direction. The phase of the hole 110a in the Y direction in FIG. 13 is different from the phases of the two holes 110b. Also, in the Y direction, the length L11 of the hole 110a is shorter than the length G12 of the region A19. Also in the case of FIG. 13, as in the first embodiment, at least a part of the region extending adjacent to the hole 110a in the Y direction is adjacent to the hole 110b in the X direction. Similarly, the region A20 is adjacent to the hole 110a in the X direction. Therefore, the number of the holes 110a may be different from the number of the holes 110b. In the Y direction, the length L11 of the hole 110a may be different from the length L12 of the hole 110b.

[0117] In the case of FIG. 14, on the flexible base material 111 side, one hole 110a and one hole 110b are provided separately in the X direction. The length of the hole 110a in the X direction is W13. The length of the hole 110a in the Y direction is L13.

[0118] On the other hand, the length of the hole 110b in the X direction is W14. The length of the hole 110b in the Y direction is L14. The length L14 of the hole 110b is longer than the length L13 of the hole 110a.

[0119] The line P11 indicates the phase of the center point of the hole 110a in the Y direction. The phase of the hole 110a in the Y direction is the same as the phase of the hole 110b. However, in the Y direction, the length L13 of the hole 110a is shorter than the length L14 of the hole 110b. For this reason, also in the case of FIG. 14, as in the first embodiment, at least a part of the region extending adjacent to the hole 110a in the Y direction is adjacent to the hole 110b in the X direction. Therefore, the number of the holes 110a and 110b is not necessarily limited to a plurality, and may be a single number.

[0120] In the case of FIG. 15, as in FIG. 14, on the flexible base material 111 side, one hole 110a and one hole 110b are provided separately in the X direction. The length of the hole 110a in the X direction is W15. The length of the hole 110a in the Y direction is L15.

[0121] On the one hand, the length of the hole 110b in the X direction is W16. The length of the hole 110b in the Y direction is L16. The lengths W16 and L16 of the hole 110b are the same as the lengths W15 and L15 of the hole 110a, respectively.

[0122] The line P12 indicates the phase of the center point of the hole 110a in the Y direction. The phase of the hole 110a in the Y direction in FIG. 15 is different from the phase of the hole 110b. Also, the hole 110a and the hole 110b are arranged so as not to overlap in the X direction. Therefore, also in the case of FIG. 15, similar to the first embodiment, at least a part of the region extending adjacent to the hole 110a in the Y direction is adjacent to the hole 110b in the X direction.

[0123] When the hole 110a is the first hole and the hole 110b is the second hole, in the hole formation patterns shown in FIGS. 10 to 15, in any pattern, the first hole and the second hole are arranged to be separated from each other in the X direction, and the insulator region adjacent to the first hole in the Y direction is adjacent to at least a part of the second hole in the Y direction. This is the same as the hole formation patterns described in the above-described first and second embodiments.

[0124] Therefore, when the holes 110a and 110b are formed on at least one surface of the flexible wiring board 110 as shown in FIGS. 10 to 15, the same effects as those of the above-described first and second embodiments can be achieved. Note that the pattern of forming a plurality of holes on the surface of the flexible wiring board 110 is not limited to the above-described pattern. For example, in the X direction, the length of the hole 110a does not have to be the same as the length of the hole 110b. It is only necessary that the region adjacent to the hole 110a in the Y direction, that is, the region where no hole is formed, is arranged to be adjacent to the hole 110b in the X direction. Also, in the Y direction, the lengths of the holes in the first hole group and the second hole group may be made different. For example, in the Y direction, the arrays of the plurality of holes 110a in the first hole group and the arrays of the plurality of holes 110b in the second hole group may have the same phase, and in the Y direction, the length of the hole 110a may be formed to be different from that of the hole 110b.

[0125] [Example 1] As the imaging module 100 of Example 1, the imaging module 100 according to the first embodiment shown in FIGS. 1, 2, 3, and 4 was manufactured. In the imaging module 100 of Example 1, as the frame 124, a resin having a thickness of 2 mm was used. As the imaging sensor element 122, a CMOS image sensor having a rectangular planar shape of 30 mm × 20 mm was used. As the cover glass 123, one having a rectangular planar shape of 28 mm × 38 mm was used.

[0126] As the flexible printed circuit board 110, one in which the material of the flexible base material 111 and the coverlay 113 is polyimide and the material of the flexible wiring layer 112 and the first electrode 115 is Cu was used. The thickness of the flexible base material 111 was 25 μm, the thickness of the coverlay 113 was 12 μm, the thickness of the flexible wiring layer 112 was 18 μm, and the thickness of the adhesive 114 was 18 μm. As the adhesive 114, an epoxy-based adhesive was used. The position of the tip of the coverlay 113 was set at a position 1.5 mm away from the tip of the flexible base material 111.

[0127] The flexible wiring layer 112 had a pitch of 0.2 mm, an electrode width of 0.1 mm, and 80 wiring lines. The width of the flexible printed circuit board 110 was made larger than the opening width of 20 mm of the solder resist layer 121c and was 22 mm.

[0128] The hole formation region A1 was formed in a region having a width of 1 mm from 1 mm to 2 mm at the tip of the coverlay 113. Holes 110a were formed on the flexible base material 111 in the hole formation region A1 and holes 110b were formed on the coverlay 113 using a UV laser processing machine, respectively.

[0129] The holes 110a were formed from the surface side of the flexible base material 111 where the flexible wiring layer 112 was not formed directly below, with a depth of 45 μm, a diameter of Φ75 μm so that a part of the hole did not cover the flexible wiring layer 112, at a pitch of 0.2 mm in a direction perpendicular to the wiring, and 79 holes were formed and two rows were formed at a pitch of 0.4 mm in the wiring direction.

[0130] The holes 110b were formed in a single row of 80 holes at a pitch of 0.2 mm in a direction orthogonal to the wiring, with a depth of 10 μm and a diameter of Φ75 μm, from the surface side of the coverlay 113 where the flexible wiring layer 112 is formed directly below, at a position intermediate to the holes 110a. That is, the holes 110b are shifted in phase by about 0.1 mm with respect to the holes 110a.

[0131] As the printed wiring board 121, a rectangular printed wiring board having an outer shape of 30 mm × 40 mm was used, where the material of the printed wiring base material 121a is a glass epoxy material, and the materials of the wiring layer 121b and the second electrode 127 are Cu. The thickness of the wiring layer 121b and the second electrode 127 was about 30 μm, and the thickness of the solder resist layer 121c was about 25 μm. Also, as the adhesive for fixing the printed wiring board 121 to the frame 124, a UV curable resin was used. As the frame 124, one having an outer shape of 50 mm × 60 mm was used.

[0132] The first electrode 115 of the flexible wiring board 110 and the second electrode 127 of the printed wiring board 121 were connected by solder 141. The second electrode 127 had a pitch of 0.2 mm, an electrode width of 0.15 mm, and 80 wiring lines. Also, the opening 121e of the solder resist layer 121c where the second electrode 127 is exposed had a size of 1.1 mm × 20 mm. On the other hand, the first electrode 115 had a pitch of 0.2 mm, an electrode width of 0.1 mm, and 80 wiring lines. The width of the flexible wiring board 110 was made larger than the opening width of 20 mm of the solder resist layer 121c, at 22 mm. The electrode pitch, the electrode width, the width between electrodes, and the number of electrodes were set appropriately according to the specifications of the sensor unit 120.

[0133] The gap between the coverlay 113 and the solder 141 was set to 1 mm. As the solder 141, one having a material of Sn-3.0-Ag-0.5Cu was used. As the hand tremor correction unit 130, one having an L-shaped configuration with a rectangle of 85 mm × 70 mm from which a rectangle of 70 mm × 55 mm was cut out was used.

[0134] The imaging device equipped with the imaging module 100 of the completed Example 1 was able to reduce the load generated at the connection portion 140 between the flexible printed circuit board 110 and the printed circuit board 121 without inhibiting the driving of the image stabilization unit 130. Also, the imaging device could sufficiently guarantee the connection reliability at the connection portion 140 and the optical performance of the CMOS image sensor built in the imaging module 100.

[0135] [Example 2] As the imaging module 100 of Example 2, the imaging module 100 according to FIGS. 5, 6A to 6D, 7 and 8 was manufactured. In the imaging module 100 of Example 2, the flexible printed circuit board 110 was pulled out to the opposite side of the image stabilization unit 130 as shown in FIG. 8 and was folded once.

[0136] As the flexible printed circuit board 110, one in which the material of the flexible base material 111 and the coverlay 113 is polyimide and the material of the flexible wiring layer 112 and the first electrode 115 is Cu was used. The thickness of the flexible base material 111 was 25 μm, the thickness of the coverlay 113 was 25 μm, the thickness of the flexible wiring layer 112 was 18 μm, and the thickness of the adhesive 114 was 18 μm. As the adhesive 114, an epoxy-based adhesive was used. The position of the tip of the coverlay 113 was set at a position 1.5 mm away from the tip of the flexible base material 111.

[0137] The hole forming region A1 was formed in a region with a width of 2 mm from 1 mm to 3 mm at the tip of the coverlay 113. The hole forming region A2 was formed in a region with a width of 4 mm from 10 mm to 14 mm at the tip of the coverlay 113. In the hole forming region A1, holes 110a and 110b were formed on the flexible base material 111, and in the hole forming region A2, holes 110c and 110d were formed with a UV laser processing machine, respectively.

[0138] The holes 110a were formed such that, from the surface side of the flexible substrate 111 where the flexible wiring layer 112 is not formed directly below, there are 40 holes with a diameter of Φ75 μm, a depth of 50 μm, a pitch of 0.4 mm in the direction perpendicular to the wiring, and they are formed in 3 rows with a pitch of 0.4 mm in the wiring direction, and a part of the holes does not cover the flexible wiring layer 112. The holes 110b are formed with a phase shift of about 0.2 mm with respect to the holes 110a. From the surface side of the flexible substrate 111 where the flexible wiring layer 112 is not formed directly below, there are 39 holes with a diameter of Φ75 μm, a depth of 50 μm, a pitch of 0.4 mm in the direction perpendicular to the wiring, and they are formed in 2 rows with a pitch of 0.4 mm in the wiring direction, and a part of the holes does not cover the flexible wiring layer 112.

[0139] The holes 110c were formed in the same manner as the holes 110a. From the surface side of the flexible substrate 111 where the flexible wiring layer 112 is not formed directly below, there are 40 holes with a diameter of Φ75 μm, a depth of 50 μm, a pitch of 0.4 mm in the direction perpendicular to the wiring, and they are formed in 3 rows with a pitch of 0.4 mm in the wiring direction, and a part of the holes does not cover the flexible wiring layer 112.

[0140] The holes 110d are formed with a phase shift of 0.2 mm with respect to the holes 110c. From the surface side of the flexible substrate 111 where the flexible wiring layer 112 is not formed directly below, there are 39 holes with a diameter of Φ75 μm, a depth of 50 μm, a pitch of 0.4 mm in the direction perpendicular to the wiring, and they are formed in 2 rows with a pitch of 0.4 mm in the wiring direction, and a part of the holes does not cover the flexible wiring layer 112.

[0141] For the rest, the same components as those in Example 1 were used. The imaging device equipped with the completed imaging module 100 of Example 2 was able to sufficiently guarantee the optical performance of the built-in CMOS image sensor. Also, the imaging device equipped with the completed imaging module 100 of Example 2 was able to reduce the load generated at the connection portion 140 between the flexible wiring board 110 and the printed wiring board 121 without inhibiting the driving of the shake correction unit 130 even when the flexible wiring board 110 was in a bent state, and was able to sufficiently guarantee the reliability of the connection at the connection portion 140.

[0142] [Evaluation by Structural Analysis] To confirm the effects of the present invention, an example of analyzing the structure of a structure including a flexible printed circuit board 110, a printed circuit board 121, and a solder 141, where the flexible printed circuit board 110 is folded back, is shown. FIG. 16 is a perspective view showing the simplified structure. In the analysis, as will be described later, the end face on the side not connected to the solder 141 of the flexible printed circuit board 110 becomes the fixed face 117.

[0143] FIG. 17A is a top view showing the schematic configuration of the flexible printed circuit board 110 according to Analysis Example 1. FIG. 17B is a cross-sectional view taken along the line G-G' shown in FIG. 17A. The flexible printed circuit board 110 in Analysis Example 1 has a structure in which there is no hole formation region A1.

[0144] FIG. 18A is a top view showing the schematic configuration of the flexible printed circuit board 110 according to Analysis Example 2. FIG. 18B is a cross-sectional view taken along the line G-G' shown in FIG. 18A. The flexible printed circuit board 110 in Analysis Example 2 has a structure in which a plurality of holes 110a are formed in only one row in the hole formation region A1.

[0145] Also, Analysis Example 3 and Analysis Example 4 have a structure in which a plurality of holes are formed in three rows in the hole formation region A1.

[0146] FIG. 19A is a top view showing the schematic configuration of the flexible printed circuit board 110 according to Analysis Example 3. FIG. 19B is a cross-sectional view taken along the line G-G' shown in FIG. 19A. The flexible printed circuit board 110 in Analysis Example 3 has a structure in which a plurality of holes 110a have the same phase from the first row C1 to the third row C3.

[0147] FIG. 20A is a top view showing the schematic configuration of the flexible printed circuit board 110 according to Analysis Example 4. FIG. 20B is a cross-sectional view taken along the line G-G' shown in FIG. 20A. In the flexible printed circuit board 110 in Analysis Example 4, the phases of the plurality of holes 110a in the first row C1 in the hole formation region A1 are the same as the phases of the plurality of holes 110a in the third row C3, and the phases of the plurality of holes 110a are different from the phases of the plurality of holes 110b in the second row C2.

[0148] Furthermore, in Analysis Example 5 and Analysis Example 6, in addition to the hole formation region A1, a hole formation region A2 was formed.

[0149] FIG. 21A is a top view showing a schematic configuration of the flexible printed circuit board 110 according to Analysis Example 5. FIG. 21B is a cross-sectional view taken along the line G-G' shown in FIG. 21A. In the flexible printed circuit board 110 in Analysis Example 5, in the hole formation region A1, the phases of the plurality of holes 110a in the first row C1, the second row C2, and the third row C3 are the same. In the hole formation region A2, the phases of the plurality of holes 110c in the fourth row C4, the fifth row C5, and the sixth row C6 are the same. And the phases of the plurality of holes 110a in the hole formation region A1 are the same as the phases of the plurality of holes 110c in the hole formation region A2. That is, in the flexible printed circuit board 110 in Analysis Example 5, a structure having the same phase as the hole formation region A1 is added to the hole formation region A2.

[0150] FIG. 22A is a top view showing a schematic configuration of the flexible printed circuit board 110 according to Analysis Example 6. FIG. 22B is a cross-sectional view taken along the line G-G' shown in FIG. 22A. In the flexible printed circuit board 110 in Analysis Example 6, in the hole formation region A1, the phases of the plurality of holes 110a in the first row C1 and the third row C3 are the same. However, the phases of the plurality of holes 110a in the first row C1 and the third row C3 are different from the phases of the plurality of holes 110b in the second row C2. Also, in the hole formation region A2, the phases of the plurality of holes 110c in the fourth row C4 and the sixth row C6 are the same. However, the phases of the plurality of holes 110c in the fourth row C4 and the sixth row C6 are different from the phases of the plurality of holes 110d in the fifth row C5. The phases of the plurality of holes 110a in the hole formation region A1 are the same as the phases of the plurality of holes 110c in the hole formation region A2. The phases of the plurality of holes 110b in the hole formation region A1 are the same as the phases of the plurality of holes 110d in the hole formation region A2.

[0151] The structural analysis method used for evaluation will be described. ANSYS Mechanical Enterprise Version 19.1 was used as the structural analysis software. The structural analysis was performed as a three-dimensional analysis.

[0152] Next, each dimension and the like used in the structural analysis will be described. The printed wiring board 121 had a length of 23 mm, a width of 3 mm, and a thickness of 0.8 mm. The flexible wiring board 110 was simplified with the flexible base material 111, the flexible wiring layer 112, and the coverlay 113 as a polyimide substrate with a uniform thickness of 50 μm, having a length of 22 mm, a width of 7 mm, and a thickness of 0.05 mm.

[0153] The solder 141 was 1 mm in length from the end of the flexible wiring board 110 at the central position of the printed wiring board 121 in the X direction, extended to both ends of the flexible wiring board 110 in the Y direction, and had a solder height in the Z direction of 50 μm. The curvature R of the fold was 0.5 mm, the interval H in the Z direction of the folded flexible wiring board 110 was 1 mm, and the length L in the X direction after folding and becoming flat was 2 mm.

[0154] The shape of the holes was a square through-hole of 0.1 mm × 0.1 mm for all the holes. The number of holes was 40. The pitch in the Y direction of the holes 110a was 0.5 mm, and the intervals between the holes 110a and 110b, and between the holes 110c and 110d in the X direction were 0.25 mm. The holes 110a and 110b, and the holes 110c and 110d in Analysis Example 4 and Analysis Example 6 were shifted in phase by about 0.25 mm. The position of the hole formation region A1 was such that the center of the hole 110a was 0.5 mm away from the joint end of the solder 141 in the X direction. The position of the hole formation region A2 was such that the center of the second row of the holes 110c coincided with the bending center of the flexible wiring board 110 in the X direction.

[0155] For the analysis, with the end face on the side not connected to the solder 141 of the flexible wiring board 110 as the fixed surface 117, the reaction forces of the fixed surface 117 from Analysis Example 1 to Analysis Example 6 were compared when rotated ±1° in the θ direction about the center in the Y direction of the fixed surface 117. Fig. 23 shows the analysis results by the structural analysis.

[0156] In FIG. 23, the evaluation axis (vertical axis) compares the evaluation values of Analysis Example 1, in which no holes are formed on the surface of the flexible printed circuit board 110, as 100% with Analysis Examples 2 to 6. As shown in FIG. 23, it can be seen that for Analysis Examples 1, 2, and 3, Analysis Example 4 can reduce the reaction force. That is, the effect of reducing the stress applied to the connection portion 140 was verified. Also, it can be seen that Analysis Example 6 can reduce the reaction force compared to Analysis Example 5. That is, the effect of reducing the stress applied to the connection portion 140 was verified.

[0157] From the above, according to the present invention, it was confirmed that the flexibility of the flexible printed circuit board 110 can be improved and the load on the connection portion 140 between the flexible printed circuit board 110 and the printed circuit board 121 can be reduced.

[0158] As described above, the embodiments described can be appropriately modified without departing from the technical idea. For example, a plurality of embodiments can be combined. Also, some matters of at least one embodiment can be deleted or replaced. Further, new matters can be added to at least one embodiment.

[0159] Note that the disclosure of this specification includes not only what is explicitly described in this specification, but also all matters that can be grasped from this specification and the drawings attached to this specification. Also, the disclosure of this specification includes the complement sets of the individual concepts described in this specification. That is, for example, if this specification describes that "A is B", even if the description that "A is not B" is omitted, it can be said that this specification discloses that "A is not B". Because when the description that "A is B" is made, it is premised that the case where "A is not B" is considered.

Description of Reference Numerals

[0160] 100 ··· Imaging module 110 ··· Flexible printed circuit board 110a, 110b, 110c, 110d ··· Holes 111 ··· Flexible base material 112 ··· Flexible wiring layer 112a ··· Exposed part 113 ··· Coverlay 114 ··· Adhesive 115 ··· First electrode 120 ··· Sensor unit 121 ··· Printed wiring board 121a ··· Printed wiring substrate 121b ··· Wiring layer 121c ··· Soldermask layer 121d ··· Via 121e ··· Opening 122 ··· Imaging sensor element (image sensor, semiconductor element) 123 ··· Cover glass 124 ··· Frame 125 ··· Metal wire 126 ··· Pad for wire 127 ··· Second electrode 130 ··· Shake correction unit 131 ··· Frame 140 ··· Connection part 141 ··· Solder 150 ··· Image processing unit 151 ··· Connector 160 ··· Camera A1, A2 ··· Hole formation region

Claims

1. An insulator, A wiring layer supported by the insulator, A flexible printed circuit board comprising: A first terminal portion provided at one end of the wiring layer and including a plurality of connection terminals, A second terminal portion provided at the other end of the wiring layer and including a plurality of connection terminals, A first hole and a second hole formed in the insulator in the middle of a first direction from the first terminal portion toward the second terminal portion, The first hole and the second hole are spaced apart from each other in the first direction, An insulator region adjacent to the first hole in a second direction intersecting the first direction is adjacent to at least a part of the second hole in the first direction, The insulator includes a first insulator layer and a second insulator layer, and the wiring layer is provided between the first insulator layer and the second insulator layer, The first hole and the second hole penetrate the first insulator layer and reach at least a part of the wiring layer, A flexible printed circuit board characterized by the above.

2. The insulator region is located between the first hole and a third hole arranged side by side with the first hole in the second direction, The flexible printed circuit board according to claim 1, characterized by the above.

3. In a side view from the first direction, at least a part of the second hole overlaps the insulator region, The flexible printed circuit board according to claim 1 or 2, characterized by the above.

4. In the second direction, the length of the insulator region is longer than the length of the second hole, The flexible printed circuit board according to any one of claims 1 to 3, characterized by the above.

5. In the second direction, the length of the insulator region is shorter than the length of the second hole, The flexible printed circuit board according to any one of claims 1 to 3, characterized by the above.

6. Taking the insulator region as a first insulator region, the length of a second insulator region adjacent to the second hole in the second direction and adjacent to at least a part of the first hole in the first direction is longer than the length of the second hole in the second direction, The flexible printed circuit board according to any one of claims 1 to 5, characterized by the above.

7. In the second direction, the length of the first insulator region is longer than the length of the second insulator region, The flexible printed circuit board according to claim 6, characterized by the above.

8. In the second direction, the length of the first insulator region is shorter than the length of the second insulator region, The flexible printed circuit board according to claim 6, characterized in that...

9. A first group of holes including the first holes, wherein a plurality of holes including the first holes are arranged in the second direction at a predetermined period; A second group of holes including the second holes, wherein a plurality of holes including the second holes are arranged in the second direction at a predetermined period and are arranged spaced apart from the first group of holes in the first direction; The flexible printed circuit board according to any one of claims 1 to 8, characterized by having the above.

10. The period of the first group of holes is the same as the period of the second group of holes; The flexible printed circuit board according to claim 9, characterized in that...

11. The period of the first group of holes is different from the period of the second group of holes; The flexible printed circuit board according to claim 9, characterized in that...

12. In the second direction, the arrangement of the plurality of holes in the first group of holes and the arrangement of the plurality of holes in the second group of holes have different phases from each other; The flexible printed circuit board according to claim 9, characterized in that...

13. In the second direction, the arrangement of the plurality of holes in the first group of holes and the arrangement of the plurality of holes in the second group of holes have the same phase, and in the second direction, the length of the first hole is different from the length of the second hole; The flexible printed circuit board according to claim 9, characterized in that... The flexible printed circuit board according to claim 9, characterized in that...

14. Having a third group of holes in which a plurality of holes are arranged in the second direction at a predetermined period, and the third group of holes is arranged on the opposite side of the first group of holes across the second group of holes in the first direction in a plan view; The flexible printed circuit board according to any one of claims 9 to 13, characterized by having the above.

15. The period of the third group of holes is the same as the period of the first group of holes, and in the second direction, the arrangement of the plurality of holes in the first group of holes and the arrangement of the plurality of holes in the third group of holes have the same phase; and at least one of the above is satisfied; The flexible printed circuit board according to claim 14, characterized in that...

16. The length of the first hole in the first direction is longer than the length of the first hole in the second direction; The flexible printed circuit board according to any one of claims 1 to 15, characterized by having the above.

17. The first hole and the second hole are bottomed holes; The flexible printed circuit board according to any one of claims 1 to 16, characterized by having the above.

18. ​ The insulator includes a first insulator layer and a second insulator layer, and the wiring layer is provided between the first insulator layer and the second insulator layer. The first hole and the second hole are bottomed holes that penetrate the first insulator layer and have the second insulator layer as the bottom. The flexible wiring board according to any one of claims 1 to 16, characterized in that.

19. The insulator includes a first insulator layer and a second insulator layer, and the wiring layer is provided between the first insulator layer and the second insulator layer. The first hole and the second hole are through holes that penetrate the first insulator layer and the second insulator layer. The flexible wiring board according to any one of claims 1 to 16, characterized in that.

20. A flexible wiring board according to any one of claims 1 to 19, A first unit connected to the first terminal portion of the flexible wiring board, A second unit connected to the second terminal portion of the flexible wiring board, A module characterized by comprising.

21. The flexible wiring board is bent at positions where the first hole and the second hole are formed. The module according to claim 20, characterized in that.

22. The flexible wiring board is connected to the first unit by solder that contacts the first terminal portion. The module according to claim 20 or 21, characterized in that.

23. The first unit includes an imaging element. The module according to any one of claims 20 to 22, characterized in that.

24. A module according to any one of claims 20 to 23, A third unit for moving the first unit, An electronic device characterized by comprising.

25. A module according to any one of claims 20 to 23, A housing for housing the module, An electronic device characterized by comprising.

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