SiC chip mounting method and device

Abstract

The invention discloses a SiC chip mounting method and device, and the device comprises a machine body, and a calibration seat is disposed at one corner of the outer wall of the upper side of the machine body; the XY moving module is fixedly arranged on the outer wall of the upper side of the machine body; and the XY moving module is provided with a plurality of moving platforms. By arranging the buffer mounting mechanism, an effective buffer effect can be provided when the chip is in contact with the substrate, so that the chip is in flexible contact with the substrate, the impact force is remarkably reduced, and the mounting precision and the reliability of the chip are improved; according to the invention, through the arrangement of the dust cleaning mechanism, the surface of the substrate can be cleaned and blown during mounting, and dust and other tiny impurities on the surface of the substrate can be effectively removed, so that the precision and stability of chip mounting are ensured, and negative pressure is generated in the dust collection nozzle during cleaning and blowing, so that the dust blown in the cleaning and blowing process is rapidly sucked away. By means of the design, secondary pollution caused by the fact that dust is re-deposited on the surface of the substrate in the air is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and in particular to a SiC chip mounting method and device. Background Art

[0002] Chip attachment refers to fixing the cut and selected bare chips to a frame or substrate through a specific process to achieve electrical connection between the chip and the external circuit.

[0003] In existing chip placement technology, the process of placing the chip on the substrate after the nozzle picks up the chip is generally lacking an effective buffering mechanism. Traditional methods typically use a nozzle to directly pick up the chip and place it on the substrate. This method is prone to generating significant impact force at the moment of contact between the chip and the substrate, potentially causing chip damage or positional displacement, affecting placement accuracy and chip reliability. Furthermore, impurities such as dust and particles are easily retained on the substrate surface during the placement process. The presence of these impurities not only affects the bonding quality between the chip and the substrate, but can also cause circuit shorts or performance degradation. Summary of the Invention

[0004] The main purpose of the present invention is to provide a SiC chip mounting method and device, which can effectively solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a SiC chip mounting device, comprising: A machine body, wherein a calibration seat is provided at a corner of an upper outer wall of the machine body; An XY movable module, the XY movable module being fixedly arranged on the upper outer wall of the machine body; The XY moving module has a plurality of moving platforms, one of which is fixedly connected to a support plate, and a U-shaped plate is fixedly connected to the lower outer wall of the support plate; A cylinder, the cylinder being mounted on the lower inner wall of the support plate; A dust cleaning mechanism is provided on the U-shaped plate and is used to clean the substrate and absorb dust during the mounting process; A buffer placement mechanism, which is arranged at the output shaft end of the cylinder and can provide a buffering effect during the placement process; A positioning mechanism is provided on the upper outer wall of the machine body and is used to clamp and fix the substrate.

[0006] As a further description of the above technical solution, the dust cleaning mechanism includes a first box body, a second box body, a first sleeve, a second sleeve, a piston, an air nozzle, a dust suction nozzle, a first L-shaped push rod, a second L-shaped push rod, an active rack, a driven rack, a gear and a connecting rod, the first box body is fixedly connected to the outer wall of one side of the U-shaped plate and the second box body is fixedly connected to the outer wall of the other side, the first sleeve is fixedly connected in the first box body, the second sleeve is fixedly connected in the second box body, pistons are provided in the first sleeve and the second sleeve, the air nozzle is installed on the bottom wall of the first box body, the air nozzle is communicated with the first sleeve, the second box body A dust suction nozzle is installed on the bottom wall, and the dust suction nozzle is communicated with the second sleeve. A first L-shaped push rod and a second L-shaped push rod are fixedly connected to the output shaft of the cylinder, respectively. The other end of the first L-shaped push rod is fixedly connected to the piston in the first sleeve. A gear is rotatably provided on the rear inner wall of the second box body, and a driving rack and a driven rack are respectively provided in the second box body and on both sides of the gear. The driving rack and the driven rack are both meshed with the gear. The other end of the second L-shaped push rod is fixedly connected to the driving rack, and a connecting rod is fixedly connected to the bottom wall of the driven rack. The lower end of the connecting rod is fixedly connected to the piston in the second sleeve.

[0007] As a further description of the above technical solution, the buffer mounting mechanism includes a lifting plate, a sliding column, a buffer plate, a buffer spring and a suction nozzle. The output shaft of the cylinder passes through the U-shaped plate and is fixedly connected to the lifting plate. Two symmetrically distributed sliding columns are slidably inserted on the lifting plate. A buffer plate is fixedly connected between the lower ends of the two sliding columns. A buffer spring is sleeved on the sliding column. One end of the buffer spring is fixedly connected to the lifting plate and the other end is fixedly connected to the buffer plate. A suction nozzle is installed at the center of the bottom wall of the buffer plate.

[0008] As a further description of the above technical solution, the positioning mechanism includes a groove, a slider, an L-shaped positioning plate and a clamping spring. Two symmetrically distributed grooves are opened on the upper outer wall of the body. A slider is provided for sliding in the groove. An L-shaped positioning plate is fixedly connected to the upper side wall of the slider. A clamping spring is provided on one side wall of the two grooves away from each other, and the other end of the clamping spring is fixedly connected to the slider.

[0009] As a further description of the above technical solution, through grooves are provided on both side walls of the U-shaped plate, and the first L-shaped push rod and the second L-shaped push rod are both slidably engaged with the through grooves.

[0010] As a further description of the above technical solution, the bottom of the cylinder of the second sleeve is connected to a connecting pipe, a first one-way valve is installed on the connecting pipe, and the other end of the connecting pipe is threadedly connected to a dust bag.

[0011] As a further description of the above technical solution, a second one-way valve is installed on the dust collection nozzle.

[0012] As a further description of the above technical solution, a door is provided on the front side wall of the second box body.

[0013] As a further description of the above technical solution, two guide grooves are opened on the rear inner wall of the second box body, and guide posts are slidably provided in the guide grooves. The front ends of the two guide posts are fixedly connected to the active rack and the driven rack respectively.

[0014] A SiC chip mounting method comprises the following steps: S1. Place the substrate on the machine body and clamp it with a positioning mechanism; S2, through the moving platform on the XY moving module and the cylinder, the nozzle can achieve three-dimensional movement; S3, the nozzle first picks up the chip from the feeder, and then performs visual calibration through the calibration base; S4. After calibration, the nozzle moves the chip to the top of the substrate; S5. The output shaft of the cylinder pushes the lifting plate downward, thereby moving the suction nozzle downward. Under the action of the buffer placement mechanism, the chip flexibly contacts the substrate, completing the placement and releasing the vacuum. S6. When the cylinder output shaft moves downward, the dust cleaning mechanism can clean the substrate to blow away the dust on the surface of the substrate, and can also suck away the dust while blowing.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention provides an effective buffering effect when the chip contacts the substrate by setting a buffering mounting mechanism, so that the chip and the substrate can achieve flexible contact, thereby significantly reducing the impact force and improving the mounting accuracy and chip reliability.

[0016] 2. The dust-clearing mechanism in this invention can clean the substrate surface during placement, effectively removing dust and other minor impurities, thereby ensuring the accuracy and stability of chip placement. During the cleaning process, negative pressure is generated within the suction nozzle, rapidly sucking away dust raised during the cleaning process. This design prevents dust from redepositing on the substrate surface in the air and causing secondary contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a SiC chip mounting method and device proposed by the present invention; Figure 2 A schematic diagram of the support plate structure of a SiC chip mounting method and device proposed in the present invention; Figure 3A cross-sectional view of a U-shaped plate of a SiC chip mounting method and device proposed by the present invention; Figure 4 This is a schematic diagram of the enlarged structure of point A of a SiC chip mounting method and device proposed by the present invention; Figure 5 A schematic diagram of the nozzle structure of a SiC chip mounting method and device proposed in the present invention; Figure 6 This is a schematic diagram of the box door structure of a SiC chip mounting method and device proposed in the present invention; Figure 7 This is a schematic diagram of the internal structure of the second box of a SiC chip mounting method and device proposed by the present invention; In the figure: 1, machine body; 2, XY moving module; 3, moving table; 31, support plate; 32, U-shaped plate; 4, cylinder; 5, dust cleaning mechanism; 6, buffer placement mechanism; 7, positioning mechanism; 51, first housing; 52, second housing; 53, first sleeve; 54, second sleeve; 55, piston; 56, air nozzle; 57, dust suction nozzle; 58, first L-shaped push rod; 59, second L-shaped push rod; 510, active rack; 511, Driven rack; 512, gear; 513, connecting rod; 61, lifting plate; 62, sliding column; 63, buffer plate; 64, buffer spring; 65, suction nozzle; 71, groove; 72, slider; 73, L-shaped positioning plate; 74, pressing spring; 321, through groove; 541, connecting pipe; 542, first one-way valve; 543, dust bag; 571, second one-way valve; 521, box door; 522, guide groove; 523, guide column. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative features, and purpose effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0019] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0021] See also Figure 1-7 The present invention provides a SiC chip mounting device, comprising: The body 1 has a calibration seat at one corner of the upper outer wall of the body 1; XY moving module 2, XY moving module 2 is fixedly arranged on the upper outer wall of the body 1; The XY moving module 2 has a plurality of moving platforms 3 , wherein a support plate 31 is fixedly connected to one of the moving platforms 3 , and a U-shaped plate 32 is fixedly connected to the lower outer wall of the support plate 31 ; Cylinder 4, which is mounted on the lower inner wall of the support plate 31; The dust cleaning mechanism 5 is provided on the U-shaped plate 32 and is used to clean the substrate and suck away dust during the mounting process; The buffer placement mechanism 6 is provided at the output shaft end of the cylinder 4 and can provide a buffering effect during the placement process; The positioning mechanism 7 is arranged on the upper outer wall of the body 1 and is used to clamp and fix the substrate.

[0022] Through the setting of the above structure, a certain buffering effect can be achieved during mounting, avoiding the problem of chip damage due to excessive impact force caused by rigid contact between the chip and the substrate, and the substrate can be cleaned during mounting to avoid dust and other impurities remaining on the surface of the substrate.

[0023] Among them, the dust cleaning mechanism 5 includes a first box body 51, a second box body 52, a first sleeve 53, a second sleeve 54, a piston 55, an air nozzle 56, a dust suction nozzle 57, a first L-shaped push rod 58, a second L-shaped push rod 59, an active rack 510, a driven rack 511, a gear 512 and a connecting rod 513. The first box body 51 is fixedly connected to the outer wall of one side of the U-shaped plate 32, and the second box body 52 is fixedly connected to the outer wall of the other side. The first sleeve 53 is fixedly connected in the first box body 51, and the second sleeve 54 is fixedly connected in the second box body 52. A piston 55 is provided in each of the first sleeve 53 and the second sleeve 54. An air nozzle 56 is installed on the bottom wall of the first box body 51, and the air nozzle 56 is connected to the first sleeve 53. The bottom wall of the second box body 52 is installed There is a dust suction nozzle 57, which is connected to the second sleeve 54. The first L-shaped push rod 58 and the second L-shaped push rod 59 are fixedly connected to the output shaft of the cylinder 4 respectively. The other end of the first L-shaped push rod 58 is fixedly connected to the piston 55 in the first sleeve 53. A gear 512 is rotatably provided on the inner wall of the rear side of the second box body 52. A driving rack 510 and a driven rack 511 are respectively provided in the second box body 52 and on both sides of the gear 512. The driving rack 510 and the driven rack 511 are both engaged with the gear 512. The other end of the second L-shaped push rod 59 is fixedly connected to the driving rack 510, and a connecting rod 513 is fixedly connected to the bottom wall of the driven rack 511. The lower end of the connecting rod 513 is fixedly connected to the piston 55 in the second sleeve 54.

[0024] By setting up the above structure, the surface of the substrate can be cleaned and blown while mounting, so that dust and other impurities on the surface of the substrate are separated from the substrate. During the cleaning, negative pressure will be generated in the dust suction nozzle 57, which will quickly suck away the dust blown up during the cleaning process, avoiding the dust from being re-deposited on the surface of the substrate in the air and causing secondary pollution.

[0025] Among them, the buffer mounting mechanism 6 includes a lifting plate 61, a sliding column 62, a buffer plate 63, a buffer spring 64 and a suction nozzle 65. The output shaft of the cylinder 4 passes through the U-shaped plate 32 and is fixedly connected to the lifting plate 61. Two symmetrically distributed sliding columns 62 are slidably inserted on the lifting plate 61. A buffer plate 63 is fixedly connected between the lower ends of the two sliding columns 62. A buffer spring 64 is sleeved on the sliding column 62. One end of the buffer spring 64 is fixedly connected to the lifting plate 61 and the other end is fixedly connected to the buffer plate 63. A suction nozzle 65 is installed at the center of the bottom wall of the buffer plate 63.

[0026] Through the arrangement of the above structure, when the output shaft of the cylinder 4 pushes the suction nozzle 65 downward, it has a certain buffering effect when the chip contacts the substrate, so that the chip and the substrate contact flexibly and reduce the impact force during contact.

[0027] Among them, the positioning mechanism 7 includes a groove 71, a slider 72, an L-shaped positioning plate 73 and a clamping spring 74. Two symmetrically distributed grooves 71 are provided on the upper outer wall of the body 1. A slider 72 is provided to slide in the groove 71. An L-shaped positioning plate 73 is fixedly connected to the upper side wall of the slider 72. A clamping spring 74 is provided on one side wall of the two grooves 71 away from each other, and the other end of the clamping spring 74 is fixedly connected to the slider 72.

[0028] By setting the above structure, the substrate can be quickly positioned to ensure the stability of the substrate during the mounting process.

[0029] A through slot 321 is formed on both side walls of the U-shaped plate 32 , and the first L-shaped push rod 58 and the second L-shaped push rod 59 are slidably engaged with the through slot 321 .

[0030] The bottom of the second sleeve 54 is connected to a connecting pipe 541 , a first one-way valve 542 is installed on the connecting pipe 541 , and a dust bag 543 is threadedly connected to the other end of the connecting pipe 541 .

[0031] Through the setting of the above structure, the first one-way valve 542 can prevent the outside air from entering the second sleeve 54 through the connecting pipe 541 when the piston 55 in the second sleeve 54 moves upward, thereby ensuring the suction force of the dust nozzle 57. When the piston 55 moves downward, the air containing dust in the second sleeve 54 will enter the dust bag 543 through the connecting pipe 541 for collection.

[0032] A second one-way valve 571 is installed on the suction nozzle 57 .

[0033] By setting the above structure, the second one-way valve 571 can prevent the dust suction nozzle 57 from exhausting outward when the piston 55 moves downward, thereby preventing dust and other impurities from being ejected again.

[0034] The second box body 52 has a box door 521 on its front side wall.

[0035] With the above-mentioned structure, when there is a lot of dust in the dust bag 543, the box door 521 can be opened to remove the dust bag 543 for cleaning.

[0036] Two guide grooves 522 are provided on the rear inner wall of the second box body 52 , and guide posts 523 are slidably provided in the guide grooves 522 . The front ends of the two guide posts 523 are fixedly connected to the active rack 510 and the driven rack 511 respectively.

[0037] Through the above-mentioned structural setting, when the active rack 510 and the driven rack 511 move up and down, the guide column 523 will interact along the guide groove 522 to guide the active rack 510 and the driven rack 511, so that the active rack 510 and the driven rack 511 move more smoothly.

[0038] A SiC chip mounting method comprises the following steps: S1. Place the substrate on the body 1 and clamp it using the positioning mechanism 7; S2, the suction nozzle 65 is moved in three dimensions by the movable table 3 on the XY movable module 2 in conjunction with the cylinder 4; S3, the nozzle 65 first picks up the chip from the feeder, and then performs visual calibration through the calibration seat; S4: After calibration, the nozzle 65 moves the chip to the top of the substrate; S5. The output shaft of the cylinder 4 pushes the lifting plate 61 downward, thereby moving the suction nozzle 65 downward. Under the action of the buffer placement mechanism 6, the chip flexibly contacts the substrate, completing the placement and releasing the vacuum. S6. When the output shaft of the cylinder 4 moves downward, the dust cleaning mechanism 5 can clean and blow away the dust on the surface of the substrate, and can also suck away the dust while cleaning and blowing.

[0039] When the present invention is in use, the two L-shaped positioning plates 73 are pulled apart, at which time the holding spring 74 is compressed, and then the substrate is placed between the two L-shaped positioning plates 73, and the L-shaped positioning plates 73 are released. Under the push of the holding spring 74, the slider 72 drives the L-shaped positioning plates 73 to move, so that the two L-shaped positioning plates 73 clamp the substrate. The multiple moving stages 3 on the XY moving module 2 cooperate with the cylinder 4 to realize the three-dimensional movement of the suction nozzle 65. The suction nozzle 65 first picks up the chip on the feeder (not shown in the figure), and then performs visual calibration through the calibration seat. After calibration, the suction nozzle 65 moves above the substrate, and the output shaft of the cylinder 4 When the lifting plate 61 is pushed downward and the output shaft of the cylinder 4 is moved downward, the first L-shaped push rod 58 and the second L-shaped push rod 59 will move downward together, thereby pushing the piston 55 in the first sleeve 53 to move downward. When the piston 55 moves downward, the air in the first sleeve 53 is compressed, so that the air is ejected from the air nozzle 56 to clean the substrate. The downward movement of the second L-shaped push rod 59 will push the active rack 510 to move downward. The movement of the active rack 510 will drive the gear 512 to rotate. The rotation of the gear 512 can make the driven rack 511 meshed with it move upward. Driven by the connecting rod 513, the piston 55 in the second sleeve 54 will move upward, so that the suction Negative pressure is generated in the dust nozzle 57, which in turn sucks the dust and other impurities that fly after blowing into the second sleeve 54. The downward movement of the lifting plate 61 can make the suction nozzle 65 move down. When the chip contacts the substrate, the buffer plate 63 can push the sliding column 62 to move up, so that the suction nozzle 65 has a certain buffering effect, thereby achieving flexible contact between the chip and the substrate. After the mounting is completed, the suction nozzle 65 releases the vacuum, and the output shaft of the cylinder 4 moves up. Under the push of the buffer spring 64, the buffer plate 63 and the suction nozzle 65 are reset. When the output shaft of the cylinder 4 moves up, the first L-shaped push rod 58 and the second L-shaped push rod 59 move up together. The first L-shaped push rod 58 moves up to pull the first sleeve The piston 55 in the cylinder 53 moves upward, allowing air to enter the first sleeve 53 through the air nozzle 56 for air replenishment. When the second L-shaped push rod 59 moves upward, the connecting rod 513 will push the piston 55 in the second sleeve 54 to move downward through the transmission of the active rack 510, the gear 512 and the driven rack 511. Under the restriction of the second one-way valve 571, the air in the second sleeve 54 will not be ejected through the dust suction nozzle 57, but enter the dust bag 543 through the connecting pipe 541, isolating the dust in the dust bag 543 for dust collection, and then the suction nozzle 65 continues to pick up the chip and transport it, and the chip can be attached to the substrate to complete the mounting.

[0040] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A SiC chip mounting device, characterized in that: include: A machine body (1), wherein a calibration seat is provided at a corner of an upper outer wall of the machine body (1); An XY movable module (2), wherein the XY movable module (2) is fixedly arranged on the upper outer wall of the machine body (1); A moving platform (3), wherein the XY moving module (2) has a plurality of moving platforms (3), wherein a support plate (31) is fixedly connected to one of the moving platforms (3), and a U-shaped plate (32) is fixedly connected to the lower outer wall of the support plate (31); A cylinder (4), wherein the cylinder (4) is mounted on the lower inner wall of the support plate (31); A dust cleaning mechanism (5), the dust cleaning mechanism (5) being arranged on the U-shaped plate (32), and the dust cleaning mechanism (5) being used to clean the substrate and suck away dust during the mounting process; A buffer mounting mechanism (6), the buffer mounting mechanism (6) being arranged at the output shaft end of the cylinder (4), and the buffer mounting mechanism (6) being capable of providing a buffering effect during the mounting process; A positioning mechanism (7), wherein the positioning mechanism (7) is arranged on the upper outer wall of the body (1), and the positioning mechanism (7) is used to clamp and fix the substrate.

2. The SiC chip mounting device according to claim 1, wherein: The dust cleaning mechanism (5) comprises a first box body (51), a second box body (52), a first sleeve (53), a second sleeve (54), a piston (55), an air nozzle (56), a dust suction nozzle (57), a first L-shaped push rod (58), a second L-shaped push rod (59), a driving rack (510), a driven rack (511), a gear (512) and a connecting rod (513). The first box body (51) is fixedly connected to the outer wall of one side of the U-shaped plate (32). A second box body (52) is fixedly connected to an outer wall of one side, a first sleeve (53) is fixedly connected to the inside of the first box body (51), a second sleeve (54) is fixedly connected to the inside of the second box body (52), a piston (55) is provided in both the first sleeve (53) and the second sleeve (54), an air nozzle (56) is installed on the bottom wall of the first box body (51), the air nozzle (56) is connected to the first sleeve (53), a dust suction nozzle (57) is installed on the bottom wall of the second box body (52), the dust suction nozzle (57) is connected to the second sleeve (54), a first L-shaped push rod (58) and a second L-shaped push rod (59) are fixedly connected to the output shaft of the cylinder (4), the other end of the first L-shaped push rod (58) is fixedly connected to the piston (55) in the first sleeve (53), a gear (512) is rotatably provided on the inner wall of the rear side of the second box body (52), and a gear (512) is located in the second box body (52) and is located at the bottom wall of the gear (512). ) are provided with a driving rack (510) and a driven rack (511) on both sides, and the driving rack (510) and the driven rack (511) are both engaged with the gear (512). The other end of the second L-shaped push rod (59) is fixedly connected to the driving rack (510), and a connecting rod (513) is fixedly connected to the bottom wall of the driven rack (511). The lower end of the connecting rod (513) is fixedly connected to the piston (55) in the second sleeve (54).

3. The SiC chip mounting device according to claim 1, wherein: The buffer mounting mechanism (6) comprises a lifting plate (61), a sliding column (62), a buffer plate (63), a buffer spring (64) and a suction nozzle (65); the output shaft of the cylinder (4) passes through the U-shaped plate (32) and is fixedly connected to the lifting plate (61); two symmetrically distributed sliding columns (62) are slidably inserted on the lifting plate (61); a buffer plate (63) is fixedly connected between the lower ends of the two sliding columns (62); a buffer spring (64) is sleeved on the sliding column (62); one end of the buffer spring (64) is fixedly connected to the lifting plate (61) and the other end is fixedly connected to the buffer plate (63); a suction nozzle (65) is installed at the center of the bottom wall of the buffer plate (63).

4. The SiC chip mounting device according to claim 1, wherein: The positioning mechanism (7) includes a groove (71), a slider (72), an L-shaped positioning plate (73) and a holding spring (74). Two symmetrically distributed grooves (71) are provided on the upper outer wall of the body (1). A slider (72) is provided in the groove (71) for sliding movement. The L-shaped positioning plate (73) is fixedly connected to the upper side wall of the slider (72). A holding spring (74) is provided on one side wall of the two grooves (71) that are away from each other. The other end of the holding spring (74) is fixedly connected to the slider (72).

5. The SiC chip mounting device according to claim 2, wherein: Through slots (321) are provided on both side walls of the U-shaped plate (32), and the first L-shaped push rod (58) and the second L-shaped push rod (59) are both slidably engaged with the through slots (321).

6. The SiC chip mounting device according to claim 2, wherein: The bottom of the second sleeve (54) is connected to a connecting pipe (541), a first one-way valve (542) is installed on the connecting pipe (541), and the other end of the connecting pipe (541) is threadedly connected to a dust bag (543).

7. The SiC chip mounting device according to claim 2, wherein: A second one-way valve (571) is installed on the dust suction nozzle (57).

8. The SiC chip mounting device according to claim 2, wherein: The front side wall of the second box body (52) is provided with a box door (521).

9. The SiC chip mounting device according to claim 2, wherein: Two guide grooves (522) are provided on the rear inner wall of the second box body (52), and guide posts (523) are slidably provided in the guide grooves (522). The front ends of the two guide posts (523) are fixedly connected to the active rack (510) and the driven rack (511), respectively.

10. A SiC chip mounting method, characterized in that: The following steps are involved: S1, placing the substrate on the machine body (1) and clamping it with the positioning mechanism (7); S2, the suction nozzle (65) is moved three-dimensionally by the movable table (3) on the XY movable module (2) in conjunction with the cylinder (4); S3, the nozzle (65) first picks up the chip from the feeder, and then performs visual calibration through the calibration seat; S4, after calibration, the nozzle (65) moves the chip to the top of the substrate; S5, the output shaft of the cylinder (4) pushes the lifting plate (61) downward, thereby moving the suction nozzle (65) downward, and under the action of the buffer placement mechanism (6), the chip flexibly contacts the substrate, completing the placement and releasing the vacuum; S6. When the output shaft of the cylinder (4) moves downward, the dust cleaning mechanism (5) can clean and blow the substrate to blow away the dust on the surface of the substrate, and at the same time, the dust can be sucked away.

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