Substrate Processing Apparatus and Misalignment Correction Method

Abstract

To provide a technique for suppressing misalignment.SOLUTION: A mounting plate is positioned by a first positioning mechanism in the expansion and contraction direction in which a processing container expands and contracts due to expansion and contraction due to temperature changes with respect to a predetermined reference position that is used as a reference for measuring positional deviation within the processing container, and is attached to the processing container. A mounting table is positioned in the processing container by a second positioning mechanism at a position opposite to the position of the first positioning mechanism with respect to the reference position, and is placed in the processing container via a support mechanism attached to the mounting plate to mount a substrate.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a misalignment correction method.

Background Art

[0002] As an example of a positioning method, Patent Document 1 discloses a method of positioning two members by providing a recess on the back surface of a focus ring and inserting a positioning pin protruding from the opposing surface of the focus ring of the mounting table into the recess.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique for suppressing misalignment.

Means for Solving the Problems

[0005] A substrate processing apparatus according to an aspect of the present disclosure includes a processing container, a mounting plate, and a mounting table. The mounting plate is attached to the processing container by being positioned by a first positioning mechanism in a stretching and shrinking direction in which the processing container expands and contracts due to temperature changes with respect to a predetermined reference position serving as a reference for measuring misalignment within the processing container. The mounting table is positioned by a second positioning mechanism at a position opposite to the position of the first positioning mechanism with respect to the reference position, and is disposed in the processing container via a support mechanism attached to the mounting plate, and a substrate is placed thereon.

Effects of the Invention

[0006] According to the present disclosure, misalignment can be suppressed.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

[0008] Hereinafter, embodiments of a substrate processing apparatus and a misalignment correction method disclosed in the present application will be described in detail with reference to the drawings. Note that the substrate processing apparatus and the misalignment correction method disclosed are not limited by the present embodiment.

[0009] By the way, a substrate processing apparatus that performs substrate processing by decompressing the inside of a chamber on which a substrate is placed is known. In the substrate processing apparatus, a component such as a mounting table for mounting the substrate is provided inside the chamber, but misalignment may occur in the component due to expansion, contraction, etc. caused by a temperature change in the chamber. When the component of the substrate processing apparatus is misaligned, the processing result of the substrate processing on the substrate may be biased.

[0010] Therefore, a technique for suppressing misalignment is expected.

[0011] [First Embodiment] [Configuration of Substrate Processing Apparatus] An embodiment will be described. First, the substrate processing apparatus 100 according to the first embodiment will be described. FIG. 1 is a diagram showing an example of the schematic configuration of the substrate processing apparatus 100 according to the first embodiment. The substrate processing apparatus 100 is an apparatus that performs substrate processing on a substrate. In the embodiment, the case where the substrate processing apparatus 100 is a plasma processing apparatus and plasma processing such as plasma CVD or plasma etching is performed on the substrate as the substrate processing will be described as an example.

[0012] The substrate processing apparatus 100 has a chamber 1. The chamber 1 is made of a metal such as aluminum and is formed in a substantially cylindrical shape. The chamber 1 is provided inside with a mounting table 2 on which a substrate W such as a semiconductor wafer is placed. The chamber 1 is provided with a shower plate 3 above the mounting table 2.

[0013] The shower plate 3 is provided so as to face the mounting table 2. The shower plate 3 is fixed to the ceiling wall 1a that constitutes the ceiling of the chamber 1. The chamber 1 is evacuated by an exhaust mechanism (not shown) and the inside is depressurized to a predetermined reduced pressure state. The shower plate 3 is supplied with various gases used for substrate processing from a gas supply unit (not shown) and ejects the supplied gases into the chamber 1. High-frequency power is supplied from a high-frequency power source to either one or both of the mounting table 2 and the shower plate 3. In the chamber 1, when high-frequency power is supplied to either one or both of the mounting table 2 and the shower plate 3, a high-frequency electric field is formed inside, and the gas ejected from the shower plate 3 is turned into plasma.

[0014] The mounting table 2 is formed in a disk shape having a diameter larger than that of the substrate W on its upper surface. The mounting table 2 supports the substrate W placed on its upper surface. The mounting table 2 is supported by a support mechanism 20 so as to be movable up and down, and is disposed in the chamber 1 via the support mechanism 20. The support mechanism 20 includes a support member 21, a plate 22, and a lifting mechanism 23.

[0015] Chamber 1 has an opening 1c formed in its bottom wall 1b. The support member 21 extends downward from the center of the bottom surface of the mounting table 2 through the opening 1c in the bottom wall 1b of Chamber 1. The lower end of the support member 21 is fixed to the plate 22. The plate 22 is fixed to the lifting mechanism 23.

[0016] The lifting mechanism 23 supports the mounting table 2 via the support member 21 and the plate 22. The mounting table 2 is disposed in Chamber 1 via the support mechanism 20. The lifting mechanism 23 raises and lowers the support member 21 and the plate 22. Due to the raising and lowering of the support member 21 and the plate 22 by the lifting mechanism 23, the mounting table 2 moves up and down between a processing position where substrate processing above Chamber 1 is performed and a transfer position where the substrate W below can be transferred. A bellows 26 is provided between the bottom surface of Chamber 1 and the plate 22 so as to surround the periphery of the support member 21. The bellows 26 expands and contracts as the mounting table 2 moves up and down. The bellows 26 partitions the atmosphere inside Chamber 1 from the outside air and maintains the inside of Chamber 1 in a reduced pressure state even when the mounting table 2 moves up and down.

[0017] An attachment plate 30 is attached to Chamber 1 by being positioned by a first positioning mechanism. For example, the attachment plate 30 is attached to the bottom wall 1b of Chamber 1 by being positioned by a positioning pin 51. The support mechanism 20 is attached to the attachment plate 30 by being positioned by a second positioning mechanism. For example, the support mechanism 20 is attached to the attachment plate 30 by being positioned by a positioning pin 52. Note that the attachment plate 30 is an example of an attachment member, the positioning pin 51 is an example of a first positioning mechanism, and the positioning pin 52 is an example of a second positioning mechanism.

[0018] By the way, in the substrate processing apparatus 100, positional deviation may occur in the constituent members due to expansion, contraction, etc. caused by a temperature change in Chamber 1. For example, in the substrate processing apparatus 100, positional deviation occurs in the mounting table 2 due to expansion and contraction caused by a temperature change in Chamber 1. When the mounting table 2 is displaced in the substrate processing apparatus 100, there may be a bias in the processing result of the substrate processing with respect to the substrate W.

[0019] Therefore, the substrate processing apparatus 100 according to the present embodiment positions and attaches the mounting plate 30 with the positioning pins 51 in the expansion and contraction direction in which the chamber 1 expands and contracts due to thermal expansion and contraction with respect to a predetermined reference position that serves as a reference for measuring the displacement within the chamber 1.

[0020] The reference position is a position that serves as a reference for measuring the displacement of the components mounted within the chamber 1. In the present embodiment, the reference position is indicated by the line BL. The reference position BL is the central position within the chamber 1 along the vertical direction. In the substrate processing apparatus 100, in order to enhance the in-plane uniformity and symmetry of the substrate processing with respect to the substrate W, the center of the mounting table 2 is arranged to coincide with the center within the chamber 1. For example, the reference position BL is the central position of the shower plate 3. The mounting table 2 is arranged such that the center of the mounting table 2 coincides with the center of the shower plate 3.

[0021] Further, the substrate processing apparatus 100 according to the present embodiment positions and attaches the support mechanism 20 to the mounting plate 30 with the positioning pin 52 at a position opposite to the position of the positioning pin 51 with respect to the reference position BL. The mounting table 2 is arranged within the chamber 1 via the support mechanism 20 attached to the mounting plate 30.

[0022] FIG. 2 is a diagram showing an example of the attachment positions of the mounting plate 30 and the support mechanism 20 according to the first embodiment. FIG. 2 shows a view of the bottom wall 1b of the chamber 1 as seen from below. An opening 1c is formed in the bottom wall 1b of the chamber 1. The opening 1c is formed in a circular shape centered on the reference position BL. The reference position BL is shown at the center of the opening 1c in FIG. 2.

[0023] The mounting plate 30 is attached so as to surround the periphery of the opening 1c in the bottom wall 1b of the chamber 1. In the present embodiment, the mounting plate 30 is formed with a circular opening 30a that is larger than the opening 1c in the bottom wall 1b of the chamber 1. The mounting plate 30 is attached such that the opening 1c is positioned within the opening 30a.

[0024] The mounting plate 30 is positioned on the bottom wall 1b of the chamber 1 by the positioning pin 51 and is attached to the bottom wall 1b of the chamber 1 by mounting bolts at a plurality of locations around the opening 1c. In FIG. 2, the arrangement position of the positioning pin 51 is shown above the opening 1c, and the arrangement position 31 of the mounting bolts for attaching the mounting plate 30 is shown around the opening 1c.

[0025] The support mechanism 20 is positioned by the positioning pin 52 at a position opposite to the position of the positioning pin 51 with respect to the reference position BL and is attached to the mounting plate 30. In the present embodiment, the lifting mechanism 23 of the support mechanism 20 is positioned on the mounting plate 30 by the positioning pin 52 at a position opposite to the position of the positioning pin 51 with respect to the reference position BL, and is attached to the mounting plate 30 by mounting bolts at a plurality of locations. In FIG. 2, the arrangement position of the positioning pin 52 is shown below the opening 1c, and the arrangement position 24 of the mounting bolts for attaching the lifting mechanism 23 is shown. The reference position BL, the position of the positioning pin 51, and the position of the positioning pin 52 are arranged in a straight line (on a straight line in a plan view). The positioning pins 51 and 52 are in a state where there is no gap around them. The mounting bolts at the arrangement position 31 and the arrangement position 24 are in a state where there is a slight gap around them.

[0026] By the way, since the chamber 1 is heated up and temperature-controlled to a temperature suitable for substrate processing, the chamber 1 expands. Further, when substrate processing is performed in the chamber 1, the chamber 1 may expand and contract due to temperature changes caused by the heat generated by the substrate processing. For example, when the substrate processing apparatus 100 performs plasma processing such as plasma CVD or plasma etching in the chamber 1, the chamber 1 expands due to heat input from the plasma. As a result, the positions of the mounting plate 30 and the lifting mechanism 23 move.

[0027] FIG. 3 is a diagram for explaining the movement of the mounting plate 30 and the support mechanism 20 of the substrate processing apparatus 100 according to the first embodiment. Due to the expansion of the chamber 1, the bottom wall 1b extends. For example, the bottom wall 1b of the chamber 1 extends left and right in FIG. 3 with respect to the reference position BL. As a result, the positioning pin 51 on the bottom wall 1b of the chamber 1 moves to the left. Although the mounting plate 30 is held against the bottom wall 1b by mounting bolts, it is slightly movable. Since the mounting plate 30 is positioned on the bottom wall 1b by the positioning pin 51, it is pulled to the left and moves entirely to the left.

[0028] The mounting plate 30 expands and extends due to heat transfer from the bottom wall 1b. For example, as shown in FIG. 3, since the mounting plate 30 is positioned on the bottom wall 1b by the positioning pin 51, it mainly extends to the right due to expansion. As a result, the positioning pin 52 on the mounting plate 30 moves to the right with respect to the reference position BL. Since the support mechanism 20 is positioned on the mounting plate 30 by the positioning pin 52, it is pulled to the right and moves entirely to the right.

[0029] The mounting table 2 supported by the support mechanism 20 is displaced to the left with respect to the reference position BL as the bottom wall 1b of the chamber 1 expands, but moves to the right with respect to the bottom wall 1b due to the expansion of the mounting plate 30. As a result, the displacement of the mounting table 2 to the left with respect to the reference position BL is reduced. Thus, the substrate processing apparatus 100 according to the embodiment can suppress the displacement of the mounting table 2 with respect to the reference position BL. As a result, the substrate processing apparatus 100 can suppress the occurrence of bias in the processing result of substrate processing on the substrate W.

[0030] Here, a comparative example will be described. FIG. 4 is a diagram showing an example of the schematic configuration of the substrate processing apparatus 100 according to the comparative example. The substrate processing apparatus 100 according to the comparative example shows a case where the positioning pin 51 and the positioning pin 52 are provided in the same direction with respect to the reference position BL. In FIG. 4, the positioning pin 51 and the positioning pin 52 are provided on the right side with respect to the reference position BL.

[0031] FIG. 5 is a diagram for explaining the movement of the mounting plate 30 and the support mechanism 20 of the substrate processing apparatus 100 according to the comparative example. Due to the expansion of the chamber 1, the bottom wall 1b extends. For example, the bottom wall 1b of the chamber 1 extends to the left and right in FIG. 5 with respect to the reference position BL. As a result, the positioning pin 51 on the bottom wall 1b of the chamber 1 moves to the right with respect to the reference position BL. Since the mounting plate 30 is positioned on the bottom wall 1b by the positioning pin 51, it moves to the right as a whole. Since the mounting plate 30 is positioned on the bottom wall 1b by the positioning pin 51, it extends to the right due to expansion caused by heat transfer from the bottom wall 1b. Since the support mechanism 20 is positioned on the mounting plate 30 by the positioning pin 52, it moves to the right as a whole. As a result, in the configuration of the comparative example shown in FIGS. 4 and 5, the displacement of the mounting table 2 with respect to the reference position BL becomes large.

[0032] On the other hand, the substrate processing apparatus 100 according to the first embodiment shown in FIGS. 1 to 3 can suppress the displacement of the mounting table 2 with respect to the reference position BL by providing the positioning pin 51 and the positioning pin 52 on the opposite sides with respect to the reference position BL.

[0033] As described above, the substrate processing apparatus 100 according to the first embodiment includes a chamber 1 (processing container), a mounting plate 30, and a mounting table 2. The mounting plate 30 is positioned by a positioning pin 51 (first positioning mechanism) provided in the expansion and contraction direction in which the chamber 1 expands and contracts due to thermal expansion and contraction with respect to a predetermined reference position BL that serves as a reference for measuring the displacement inside the chamber 1, and is attached to the chamber 1. The mounting table 2 is positioned with respect to the reference position BL by a positioning pin 52 (second positioning mechanism) at a position opposite to the position of the positioning pin 51, and is disposed inside the chamber 1 via a support mechanism 20 attached to the mounting plate 30, and the substrate W is placed thereon. Thereby, the substrate processing apparatus 100 according to the embodiment can suppress the displacement of the mounting table 2.

[0034] In addition, in the substrate processing apparatus 100 according to the first embodiment, the reference position BL, the positioning pin 51, and the positioning pin 52 are arranged linearly (on a straight line in a plan view). Thereby, the substrate processing apparatus 100 according to the embodiment can suppress the displacement of the mounting table 2.

[0035] Further, the reference position BL is the central position along the vertical direction in the chamber 1. Thereby, the substrate processing apparatus 100 according to the embodiment can suppress the displacement of the mounting table 2 with respect to the central position in the chamber 1. As a result, the substrate processing apparatus 100 according to the embodiment can suppress the occurrence of bias in the processing result of the substrate processing with respect to the substrate W.

[0036] In addition, the chamber 1 includes a shower plate 3 that ejects a gas used for substrate processing above the mounting table 2. The reference position BL is set as the central position of the shower plate 3. Thereby, the substrate processing apparatus 100 according to the embodiment can suppress the displacement of the mounting table 2 with respect to the central position of the shower plate 3. As a result, the substrate processing apparatus 100 according to the embodiment can suppress the occurrence of bias in the processing result of the substrate processing with respect to the substrate W.

[0037] In addition, an opening 1c is formed in the bottom wall 1b of the chamber 1. The mounting plate 30 is positioned and attached by the positioning pin 51 so as to surround the periphery of the opening 1c outside the bottom wall 1b of the chamber 1. The support mechanism 20 includes a support member 21 and a lifting mechanism 23. The support member 21 passes through the opening 1c and supports the mounting table 2. The lifting mechanism 23 is positioned and attached to the mounting plate 30 by the positioning pin 52 and raises and lowers the support member 21. Thereby, the substrate processing apparatus 100 according to the embodiment can raise and lower the mounting table 2 while suppressing the displacement of the mounting table 2.

[0038] [Second Embodiment] Next, the second embodiment will be described. FIG. 6 is a diagram showing an example of the schematic configuration of the substrate processing apparatus 100 according to the second embodiment. Since the substrate processing apparatus 100 according to the second embodiment has a configuration partly similar to that of the substrate processing apparatus 100 according to the first embodiment shown in FIG. 1, the same reference numerals are given to the same parts and the description thereof is omitted, and mainly the different parts will be described.

[0039] The substrate processing apparatus 100 further includes a temperature control mechanism for adjusting the temperature of the mounting plate 30. For example, a heater 60 is provided on the mounting plate 30. The heater 60 is supplied with power from a heater power supply (not shown) and generates heat. The substrate processing apparatus 100 can adjust the temperature of the mounting plate 30 by being heated by the heater 60. Note that the substrate processing apparatus 100 may form a flow path inside the mounting plate 30 and allow a temperature-controlled temperature control medium to flow through the flow path to adjust the temperature of the mounting plate 30.

[0040] In addition, the substrate processing apparatus 100 further includes a temperature detection unit for detecting the temperature of the chamber 1. For example, a temperature sensor 61 is provided on the bottom wall 1b of the chamber 1. The temperature sensor 61 outputs information on the detected temperature to the control unit 7.

[0041] The substrate processing apparatus 100 has a control unit 7. The control unit 7 is an information processing apparatus such as a computer. The control unit 7 controls each part of the substrate processing apparatus 100. The specific configuration and functions of the control unit 7 are not particularly limited. The control unit 7 has, for example, a main control unit, an input device, an output device, a display device, and a storage unit. The main control unit is a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit), for example. The storage unit is an arbitrary storage device such as a hard disk, an optical disk, or a semiconductor memory element, for example. Programs for controlling the substrate processing apparatus 100 and data used in the programs are stored in the storage unit. The main control unit reads out the programs and data stored in the storage unit and controls the substrate processing apparatus 100 to perform a predetermined process according to the processing of the programs. The control unit 7 controls each component of the substrate processing apparatus 100. For example, the control unit 7 can adjust the temperature of the mounting plate 30 by controlling the power supplied from the heater power supply to the heater 60, thereby controlling the expansion and contraction of the mounting plate 30. The control unit 7 executes the processing of the position shift correction method described later by controlling each component of the substrate processing apparatus 100.

[0042] The substrate processing apparatus 100 controls the temperature of the mounting plate 30 by the heater 60 to control the expansion and contraction of the mounting plate 30 so that the positional deviation of the mounting table 2 with respect to the reference position BL becomes small. For example, the substrate processing apparatus 100 adjusts the temperature of the mounting plate 30 by the heater 60 so that the amount of expansion and contraction between the reference position BL and the position of the positioning pin 52 of the mounting plate 30 is the same as the amount of expansion and contraction between the reference position BL of the bottom wall 1b of the chamber 1 and the position of the positioning pin 51.

[0043] For example, the control unit 7 controls the temperature of the mounting plate 30 by controlling the power supplied from the heater power supply to the heater 60 according to the temperature of the bottom wall 1b of the chamber 1 detected by the temperature sensor 61. For example, the control unit 7 stores, in the storage unit, the set temperature of the mounting plate 30 as corresponding information such as table data for each temperature of the bottom wall 1b of the chamber 1. The set temperature is the temperature of the mounting plate 30 at which the displacement of the mounting table 2 with respect to the reference position BL is equal to or less than the allowable value for each temperature of the bottom wall 1b of the chamber 1. For example, the set temperature is the temperature of the mounting plate 30 at which the amount of expansion and contraction between the reference position BL and the position of the positioning pin 52 of the mounting plate 30 is the same as the amount of expansion and contraction between the reference position BL of the bottom wall 1b of the chamber 1 and the position of the positioning pin 51. The control unit 7 obtains the set temperature corresponding to the temperature of the bottom wall 1b of the chamber 1 detected by the temperature sensor 61 from the corresponding information stored in the storage unit. The control unit 7 adjusts the temperature of the mounting plate 30 to the obtained set temperature.

[0044] [Position Shift Correction Method] Next, the processing flow of the position shift correction method according to the embodiment will be described. FIG. 7 is a flowchart showing an example of the flow of the position shift correction method according to the second embodiment. FIG. 7 shows an example of the flow of implementing the position shift correction method.

[0045] The control unit 7 detects the temperature of the bottom wall 1b of the chamber 1 by the temperature sensor 61 (step S10).

[0046] The control unit 7 controls the temperature of the mounting plate 30 by controlling the power supplied from the heater power supply to the heater 60 according to the temperature of the bottom wall 1b of the chamber 1 detected by the temperature sensor 61 (step S11). For example, the control unit 7 controls the temperature of the mounting plate 30 based on the detection result by the temperature sensor 61. For example, the control unit 7 obtains the set temperature corresponding to the temperature of the bottom wall 1b of the chamber 1 detected by the temperature sensor 61 from the corresponding information stored in the storage unit. The control unit 7 adjusts the temperature of the mounting plate 30 to the obtained set temperature.

[0047] As a result, the substrate processing apparatus 100 according to the second embodiment can suppress the displacement of the mounting table 2 with respect to the reference position BL.

[0048] In addition, the control unit 7 has been described by taking as an example the case where the temperature of the mounting plate 30 is controlled according to the temperature of the bottom wall 1b of the chamber 1 detected by the temperature sensor 61. However, the present invention is not limited to this. When the temperature of the bottom wall 1b of the chamber 1 during substrate processing falls within a certain range, the control unit 7 may be set with a set temperature of the mounting plate 30 at which the displacement of the mounting table 2 with respect to the reference position BL within the certain range becomes an allowable value. For example, the set temperature is the temperature of the mounting plate 30 at which the amount of expansion and contraction between the reference position BL and the positioning pin 52 of the mounting plate 30 is the same as the amount of expansion and contraction between the reference position BL of the bottom wall 1b of the chamber 1 and the positioning pin 51. The control unit 7 may adjust the temperature of the mounting plate 30 to the set set temperature during substrate processing.

[0049] As described above, the substrate processing apparatus 100 according to the second embodiment further includes a heater 60 (temperature control mechanism) that adjusts the temperature of the mounting plate 30. The heater 60 adjusts the temperature of the mounting plate 30 so that the amount of expansion and contraction between the reference position BL and the positioning pin 52 of the mounting plate 30 is the same as the amount of expansion and contraction between the reference position BL of the chamber 1 and the positioning pin 51. As a result, the substrate processing apparatus 100 according to the embodiment can suppress the displacement of the mounting table 2.

[0050] In addition, the substrate processing apparatus 100 according to the second embodiment further includes a temperature sensor 61 (temperature detection unit) that detects the temperature of the chamber 1 and a control unit 7 that controls the temperature of the heater 60 based on the detection result of the temperature sensor 61. As a result, the substrate processing apparatus 100 according to the embodiment can control the expansion and contraction of the mounting plate 30 by adjusting the temperature of the mounting plate 30, and thus can suppress the displacement of the mounting table 2.

[0051] The above describes the embodiments. However, the embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. In fact, the above-described embodiments can be embodied in various forms. Also, the above-described embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the claims.

[0052] For example, in the above embodiment, the case of suppressing the displacement of the mounting table 2 with respect to the reference position BL was described as an example. However, it is not limited to this. The disclosed technology may be applied to suppressing the displacement of various components attached to the chamber 1.

[0053] Also, in the above embodiment, the case where the mounting table 2 can be moved up and down by the elevating mechanism 23 in the support mechanism 20 was described as an example. However, it is not limited to this. The support mechanism 20 may be configured to only support the mounting table 2 without moving it up and down.

[0054] Also, in the above embodiment, the case where the substrate processing apparatus 100 of the present disclosure is a single-chamber type plasma processing apparatus having one chamber was described as an example. However, it is not limited to this. The substrate processing apparatus 100 of the present disclosure may be a multi-chamber type plasma processing apparatus having a plurality of chambers. Also, the substrate processing apparatus 100 of the present disclosure may be a type of plasma processing apparatus that carries two or more substrates into two or more chambers and simultaneously performs substrate processing.

[0055] Also, in the above embodiment, the case where substrate processing is plasma processing such as plasma CVD or plasma etching was described as an example. However, it is not limited to this. Substrate processing may be any processing on the substrate.

[0056] Also, in the above embodiment, the case where the substrate W is a semiconductor wafer was described as an example. However, it is not limited to this. The substrate may be any substrate.

[0057] It should be noted that the embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. Indeed, the above-described embodiments can be embodied in various forms. Also, the above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

Explanation of Reference Numerals

[0058] 1 Chamber 1a Top Wall 1b Bottom Wall 1c Opening 2 Mounting Table 3 Shower Plate 7 Control Unit 20 Support Mechanism 21 Support Member 22 Plate 23 Lifting Mechanism 24 Arrangement Position 26 Bellows 30 Mounting Plate 30a Opening 31 Arrangement Position 51 Positioning Pin 52 Positioning Pin 60 Heater 61 Temperature Sensor 100 Substrate Processing Apparatus BL Reference Position W Substrate

Claims

1. A processing container, and a mounting plate attached to the processing container, which is positioned by a first positioning mechanism in the expansion and contraction direction in which the processing container expands and contracts due to thermal expansion and contraction with respect to a predetermined reference position serving as a reference for measuring displacement within the processing container; and a mounting table disposed within the processing container and on which a substrate is placed, the mounting table being positioned by a second positioning mechanism at a position opposite to the position of the first positioning mechanism with respect to the reference position and attached to the mounting plate via a support mechanism; A substrate processing apparatus comprising the above components.

2. The substrate processing apparatus according to claim 1, wherein the reference position, the first positioning mechanism, and the second positioning mechanism are arranged linearly. The substrate processing apparatus according to claim 1.

3. The substrate processing apparatus according to claim 1 or 2, wherein the reference position is the central position within the processing container. The substrate processing apparatus according to claim 1 or 2.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the processing container includes a shower plate for ejecting a gas used for substrate processing above the mounting table, and the reference position is the central position of the shower plate. The substrate processing apparatus according to any one of claims 1 to 3.

5. The substrate processing apparatus according to any one of claims 1 to 4, further comprising a temperature control mechanism for adjusting the temperature of the mounting plate. The substrate processing apparatus according to any one of claims 1 to 4.

6. The substrate processing apparatus according to claim 5, wherein the temperature control mechanism adjusts the temperature of the mounting plate such that the amount of expansion and contraction between the reference position of the processing container and the position of the second positioning mechanism of the mounting plate is the same as the amount of expansion and contraction between the reference position of the processing container and the position of the first positioning mechanism. The substrate processing apparatus according to claim 5.

7. The substrate processing apparatus according to claim 5 or 6, further comprising a temperature detection unit for detecting the temperature of the processing container, and a control unit for controlling the temperature of the temperature control mechanism based on the detection result of the temperature detection unit. The substrate processing apparatus according to claim 5 or 6.

8. The processing container has an opening formed in the bottom wall, the mounting plate is positioned and attached by the first positioning mechanism so as to surround the periphery of the opening outside the bottom wall of the processing container, the support mechanism includes a support member that penetrates the opening and supports the mounting table, and a lifting mechanism that is positioned by the second positioning mechanism and attached to the mounting plate and lifts and lowers the support member. The substrate processing apparatus according to any one of claims 1 to 7.

9. A processing container, An attachment member attached to the processing container, which is positioned by a first positioning mechanism in the expansion and contraction direction in which the processing container expands and contracts due to thermal expansion and contraction with respect to a predetermined reference position serving as a reference for measuring displacement within the processing container; A component member attached to the attachment member, which is positioned by a second positioning mechanism at a position opposite to the position of the first positioning mechanism with respect to the reference position; A substrate processing apparatus having the above.

10. A processing container; An attachment plate attached to the processing container, which is positioned by a first positioning mechanism in the expansion and contraction direction in which the processing container expands and contracts due to thermal expansion and contraction with respect to a predetermined reference position serving as a reference for measuring displacement within the processing container; A mounting table disposed within the processing container via a support mechanism attached to the attachment plate, which is positioned by a second positioning mechanism at a position opposite to the position of the first positioning mechanism with respect to the reference position, and on which a substrate is placed; A temperature detection unit that detects the temperature of the processing container; A temperature control mechanism that adjusts the temperature of the attachment plate; A method for correcting displacement of a substrate processing apparatus having the above, comprising: A step of detecting the temperature of the processing container by the temperature detection unit; A step of adjusting the temperature of the attachment plate by the temperature control mechanism such that the amount of expansion and contraction between the reference position of the processing container and the position of the second positioning mechanism of the attachment plate is the same as the amount of expansion and contraction between the reference position of the processing container and the position of the first positioning mechanism based on the detection result by the temperature detection unit; A displacement correction method including the above.

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