Drive Circuit Device

Abstract

To provide a drive circuit device capable of ensuring good insulation between an input-side component and an output-side component.SOLUTION: A gate driver includes: a driver board 101 that can be mounted on an IGBT module which is an external device to be driven; input side wiring patterns 301, 302 that are arranged on the driver board 101; output side wiring patterns 303, 304 that are arranged on the driver board 101; and a plurality of slits S1 to S7 that have shapes different from each other, are formed to penetrate the driver board 101, and are formed at positions intersecting with lines L1, L2, L3 (virtual lines) that connect the input side wiring patterns 301, 302 and the output side wiring patterns 303, 304 with straight lines (any straight lines, for example, a straight line of the shortest distance or a straight line of a distance longer than the shortest distance).SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a drive circuit device for driving an external device having a semiconductor element.

Background Art

[0002] This type of drive circuit device can be used to drive a module having a power semiconductor such as an IGBT (Insulated Gate-Bipolar Transistor) (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The drive circuit device of Patent Document 1 has an advantage in that insulation between the external device can be ensured, but there is a desire to ensure good insulation between the input-side components and the output-side components, which are components of the drive circuit device.

[0005] Therefore, the present invention provides a drive circuit device capable of ensuring good insulation between the input-side components and the output-side components.

Means for Solving the Problems

[0006] The present invention employs the following solution means. Note that the following solution means are merely examples, and the present invention is not limited thereto.

[0007] The driving circuit device of the solution means is, for example, a circuit board that can be mounted on an external device to be driven, an input-side component arranged on the circuit board, an output-side component arranged on the circuit board and electrically insulated from the input-side component, and a plurality of slits formed through the circuit board at positions intersecting a line connecting the input-side component and the output-side component in a straight line and having different shapes, respectively.

[0008] According to the driving circuit device of the solution means, since a plurality of slits having different shapes are formed at positions intersecting a line connecting the input-side component and the output-side component in a straight line, not only are there a plurality of slits, but also because they have different shapes, the creepage distance between the input-side component and the output-side component can be multiplicatively extended, and as a result, good insulation between the input-side component and the output-side component can be ensured.

Effect of the Invention

[0009] According to the present invention, good insulation between the input-side component and the output-side component can be ensured.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a gate driver is cited as an example of a drive circuit device, and an IGBT module is cited as an example of an external device to be driven. However, the external device may be another power semiconductor module, and the gate driver may be in a packaged form.

[0012] FIG. 1 is a perspective view showing the configuration of the gate driver 100 according to an embodiment. FIG. 2 is a perspective view showing the gate driver 100 excluding the case 200. FIG. 3 is a plan view showing the gate driver 100 excluding the case 200. FIG. 4 is a left side view showing the gate driver 100 excluding the case 200. FIG. 5 is a front view showing the gate driver 100 excluding the case 200. FIG. 6 is a right side view showing the gate driver 100 excluding the case 200. FIG. 7 is an exploded perspective view showing the gate driver 100 excluding the case 200.

[0013] 〔Overall Configuration (Case)〕 The gate driver 100 is a gate driver module that can handle high breakdown voltages (e.g., 3300V) and high frequencies. As shown in FIG. 1, the gate driver 100 includes a box-shaped case 200, and components such as a driver circuit board necessary for the gate driver 100 are housed inside the case 200. The case 200 includes a plate-shaped ceiling member 201 disposed on the upper part and an annular outer peripheral member 202 disposed around the ceiling member 201, and the lower part of the case 200 is open. Legs 203 are formed at the four lower corners of the outer peripheral member 202, and these legs 203 are joined to a driver circuit board 103 described later. Also, a pedestal (not shown) is formed inside the case 200, and a driver circuit board 102 described later is attached to this pedestal.

[0014] 〔Circuit Board〕 As shown in FIG. 2, the gate driver 100 has five driver circuit boards 101, 102, 103, 104, 105 (circuit boards) arranged separately in the vertical direction (Z-axis direction in FIG. 2, up and down direction) and the horizontal direction (X-axis direction in FIG. 2, left and right direction), and gate drive circuits (not shown) are formed on these driver circuit boards 101 to 105. Each of the driver circuit boards 101 to 105 may have a multilayer structure individually. Among the driver circuit boards 101 to 105, specific driver circuit boards (e.g., driver circuit boards 102 and 103) can be arranged so that their circuit surfaces face each other and are stacked.

[0015] On the driver circuit board 101 arranged at the top, six optical connectors 110 and various chip components are mounted, and wiring patterns are also formed. The optical connector 110 is a connector using an optical fiber and can perform signal input and output. On the driver circuit board 102 arranged second from the top, two isolated DC / DC converters 111 and various chip components are mounted, and wiring patterns are also formed. The inside of the isolated DC / DC converter 111 can be filled with a resin such as urethane.

[0016] The isolated DC / DC converter 111 converts an externally input DC power supply (for example, DC +12V) into a drive current for the gate drive circuit. Note that the external power supply may be an AC power supply, and in that case, an AC / DC converter or the like can be mounted on the driver board 102 or other driver boards. On the driver board 103 arranged third from the top (bottommost), in addition to two auxiliary boards 160 and various chip components being mounted, a wiring pattern is formed. The auxiliary board 160 can be arranged when there is insufficient mounting space for the components to be mounted on the driver board 103. The auxiliary board 160 is a smaller board than the driver board 103, and by arranging the components that cannot be arranged on the driver board 103 on the auxiliary board 160, the mounting space of the driver board 103 can be increased. Note that when there is sufficient mounting space on the driver board 103, the auxiliary board 160 may not be arranged.

[0017] On the left driver board 104 arranged in the vertical direction, in addition to a pair of connection connectors 112 being mounted, various chip components and wiring patterns are formed. The connection connector 112 is a connector for parallel driving the IGBT module 130 described later. On the right driver board 105 arranged in the vertical direction, in addition to the input connector 113 being mounted, various chip components and wiring patterns are formed. Wires connected to an external DC power supply, a control unit, etc. (not shown) can be connected to the input connector 113.

[0018] The five driver boards 101 to 105 are connected and electrically connected via connection members 114 such as pins, other wirings, wiring patterns, etc. On the five driver boards 101 to 105, a gate drive circuit (not shown) is formed as described above, and the gate drive circuit is formed separately into a plurality of systems according to the circuit configuration (semiconductor bridge) of the module to be driven.

[0019] On the right side of the driver substrate 101 (the -X side in FIG. 2), the driver substrate 105, the right side of the driver substrate 102 (the -X side in FIG. 2), and the components arranged in these regions serve as input-side components (primary-side circuits). Also, on the left side of the driver substrate 101 (the +X side in FIG. 2), the driver substrate 104, the left side of the driver substrate 102 (the +X side in FIG. 2), the driver substrate 103, and the components arranged in these regions serve as output-side components (secondary-side circuits).

[0020] As shown in FIG. 3, six optical connectors 110 are mounted on the left side (secondary-side circuit) of the driver substrate 101. For this reason, it is difficult to ensure the creepage distance between the left side (secondary-side circuit) and the right side (primary-side circuit) of the driver substrate 101. Therefore, in this embodiment, a plurality of slits S1 to S8 are formed to ensure a sufficient creepage distance. The details of the plurality of slits S1 to S8 will be described later.

[0021] As shown in FIG. 4, the driver substrate 104 is divided into two substrates, and a non-linear (substantially S-shaped) slit S9 is formed between the two substrates. The width of the slit S9 is equal to or greater than a predetermined interval (for example, 1.5 mm or more, preferably 2.0 mm or more). The substrate arranged on the left side in the figure corresponds to the substrate for the two optical connectors 110 on the left side (only one is shown in the figure), and the substrate arranged on the right side in the figure corresponds to the substrate for the four optical connectors 110 on the right side (only two are shown in the figure). Also, the upper connecting member 114 in the figure connects the driver substrate 104 and the driver substrate 101, and the lower connecting member 114 in the figure connects the driver substrate 104 and the driver substrate 102.

[0022] As shown in FIG. 5, a space is maintained between the three driver substrates 101, 102, and 103, and an insulated DC / DC converter 111 is arranged between the driver substrate 101 and the driver substrate 102. Above the isolated DC / DC converter 111, the pin P of the optical connector 110 protrudes through the driver board 101. And there is a gap of a predetermined distance or more (for example, 1.5 mm or more, preferably 2.0 mm or more) between the lower end of the pin P and the upper end of the isolated DC / DC converter 111, thereby avoiding electrical short circuits. Also, the driver board 103 and the auxiliary board 160 are connected by a connecting member 114, and the driver board 103 and the driver board 104 are connected by lead wires 161 and connectors 162, 163.

[0023] As shown in FIG. 6, the driver board 105 is composed of one board. Also, the upper connecting member 114 in the figure connects the driver board 105 and the driver board 101, and the lower connecting member 114 in the figure connects the driver board 105 and the driver board 102.

[0024] As shown in FIG. 7, among the driver boards 101 to 105, the upper two driver boards 101 and 102 arranged in the horizontal direction are sandwiched and supported between the two driver boards 104 and 105 arranged in the vertical direction. On the other hand, the lower one driver board 103 arranged in the horizontal direction is arranged below the driver board 102. Each board is connected by a connecting member 114 or the like.

[0025] Also, a protruding portion 120 protruding toward the driver board 104 is formed on the left side surface of the driver board 101, and this protruding portion 120 is fitted into a recessed portion 121 formed at the upper center of the driver board 104. Also, a protruding portion 122 protruding toward the driver board 104 is formed on the left side surface of the driver board 102, and this protruding portion 122 is fitted into a recessed portion 123 formed at the lower center of the driver board 104.

[0026] The driver substrate 104 is composed of two substrates, and a slit S9 is formed therebetween. Then, by fitting the protruding portions 120 and 122 into the recessed portions 121 and 123 for positioning, any force is applied so that the width of the slit S9 does not become narrower.

[0027] Furthermore, on the right side surface of the driver substrate 102, a protruding portion (not shown) protruding toward the direction of the driver substrate 105 is formed, and this protruding portion is disposed in a recessed portion 124 formed at the lower end portion of the driver substrate 105.

[0028] FIG. 8 is a plan view showing the driver substrate 101. The driver substrate 101 includes input-side wiring patterns 301 and 302 (input-side components), output-side wiring patterns 303 and 304 (output-side components electrically insulated from the input-side components), and a plurality of slits S1 to S8. The input-side wiring patterns 301 and 302 are annular wiring patterns and are connected to the driver substrate 105 (see FIG. 7) by a connecting member 114 (see FIG. 7). The output-side wiring patterns 303 and 304 are annular or polygonal wiring patterns and are connected to the optical connector 110 (see FIG. 7) or are connected to the driver substrate 104 (see FIG. 7) by a connecting member 114 (see FIG. 7).

[0029] 〔Slit〕 The plurality of slits S1 to S8 are formed through the driver substrate 101. Among these, the slits S2, S6, and S8 are slits connected to the outer periphery of the driver substrate 101, and the slits S1, S3, S4, S5, and S7 are slits not connected to the outer periphery of the driver substrate 101.

[0030] From the input-side wiring pattern 301 to the output-side wiring pattern 303, slits S1, S2, S4, and S3 are arranged in this order. Also, from the input-side wiring pattern 302 to the output-side wiring pattern 304, slits S5, S6, S4, and S7 are arranged in this order. Note that slit S4 is formed straddling the upper slit group and the lower slit group in the figure.

[0031] Starting from the lower end of slit S1, it is a non-linear slit that extends obliquely upward to the right in the figure from the starting point, then upward, then obliquely upward to the left, and then upward. Starting from the lower end of slit S2, it is a Y-shaped slit that extends upward in the figure from the starting point and then bifurcates and extends. Starting from the lower end of slit S3, it is a non-linear slit that extends obliquely upward to the left in the figure from the starting point, then upward, then obliquely upward to the right, and then upward. Slit S4 is a linear slit that extends in the vertical direction in the figure.

[0032] Starting from the upper end of slit S5, it is a non-linear slit that extends obliquely downward to the right in the figure from the starting point, then downward, then obliquely downward to the left, and then downward. Starting from the upper end of slit S6, it is a Y-shaped slit that extends downward in the figure from the starting point and then bifurcates and extends. Starting from the upper end of slit S7, it is a non-linear slit that extends obliquely downward to the left in the figure from the starting point, then downward, then obliquely downward to the right, and then downward. Starting from the left end of slit S8, it is a non-linear slit that extends to the right in the figure from the starting point and then downward.

[0033] The slits S1, S2, and S3 are formed through the driver substrate 101 and are formed at positions intersecting with a line L1 (virtual line) that connects the wiring pattern 301 and the wiring pattern 303 in a straight line (any straight line, for example, a straight line of the shortest distance or a straight line of a distance longer than the shortest distance), and each has a different shape.

[0034] The slits S1, S3, and S4 are formed through the driver substrate 101 and are formed at positions intersecting with a line L2 (virtual line) that connects the wiring pattern 301 and the wiring pattern 303 in a straight line (any straight line, for example, a straight line of the shortest distance or a straight line of a distance longer than the shortest distance), and each has a different shape.

[0035] The slits S5, S6, and S7 are formed through the driver substrate 101 and are formed at positions intersecting with a line L3 (virtual line) that connects the wiring pattern 302 and the wiring pattern 304 in a straight line (any straight line, for example, a straight line of the shortest distance or a straight line of a distance longer than the shortest distance), and each has a different shape.

[0036] Let the distance from one end to the other end of the driver substrate 101 be the first distance D1, the surface distance from the input-side wiring patterns 301 and 302 to the output-side wiring patterns 303 and 304 be the second distances D2 and D4, and the straight-line distance from the input-side wiring patterns 301 and 302 to the output-side wiring patterns 303 and 304 be the third distance D3. In this case, the first distance D1 (for example, 64 mm) is longer than the second distances D2 and D4 (50 mm or more and less than 64 mm), and the second distances D2 and D4 (50 mm or more and less than 64 mm) are longer than the third distance D3 (for example, 27 mm).

[0037] The surface path R1 from the input-side wiring pattern 301 to the output-side wiring pattern 303 includes a path (see the arrows X1 and Y1 in FIG. 8) that returns in the direction of the input-side wiring pattern 301 due to the formation of the plurality of slits S1, S2, and S3. The creeping path R2 from the input-side wiring pattern 302 to the output-side wiring pattern 304 includes a path that returns in the direction of the input-side wiring pattern 302 (see arrows X2 and Y2 in FIG. 8) due to the formation of a plurality of slits S5, S6, and S7. Note that the return path is a path that, when proceeding from a first point to a second point, proceeds in the direction from the first point to the second point, then changes direction to proceed in the direction of the first point midway, and then proceeds again in the direction of the second point.

[0038] Thus, due to the formation of a plurality of slits S1 to S7, the creeping paths R1 and R2 are paths that ensure distance by detouring (a meandering path like a maze), and a longer creeping path can be ensured.

[0039] In addition, the plurality of slits S1, S2, and S3 formed between the input-side wiring pattern 301 and the output-side wiring pattern 303 (the first output-side component) and the plurality of slits S5, S6, and S7 formed between the input-side wiring pattern 302 and the output-side wiring pattern 304 (the second output-side component) are formed in a symmetrical shape that overlaps when flipped vertically or horizontally in the figure (the shape is symmetrical vertically and also approximately symmetrical horizontally).

[0040] Let the creeping distances D2 from the input-side wiring pattern 301 to the output-side wiring pattern 303 and D4 from the input-side wiring pattern 302 to the output-side wiring pattern 304 be the first creeping distances D2 and D4, and let the creeping distance from the output-side wiring pattern 303 (the first output-side component) to the output-side wiring pattern 304 (the second output-side component) be the second creeping distance D5. In this case, a slit S8 is formed between the output-side wiring pattern 303 and the output-side wiring pattern 304 to ensure a second creeping distance D5 (e.g., 25 mm) that is shorter than the first creeping distances D2 and D4 (e.g., 50 mm).

[0041] In this embodiment, a creepage distance of 50 mm or more is ensured between the primary circuit (e.g., the input-side wiring pattern 301) and the secondary circuit (e.g., the output-side wiring pattern 303), and a creepage distance of 25 mm or more is ensured between secondary circuits (e.g., the output-side wiring pattern 303 and the output-side wiring pattern 304). Note that the first value and the second value can be appropriately changed according to the specifications of the gate driver 100.

[0042] Also, the reason for setting the creepage distance between the primary circuit and the secondary circuit to be 50 mm or more and the creepage distance between secondary circuits to be 25 mm or more (the reason for the specific values being half the values) is that the purposes of insulation are different. The insulation between the primary circuit and the secondary circuit is for reinforced insulation and is the insulation necessary for the risk of electric shock. On the other hand, the insulation between secondary circuits is for functional insulation and is the insulation necessary for the correct functioning of the device.

[0043] Also, the plurality of slits S1 to S8 in this embodiment include linear, non-linear, and Y-shaped slits. Further, the plurality of slits S1 to S7 in this embodiment intersect the lines L1, L2, and L3 at various angles. Thereby, the creepage path can be made complex, and a longer creepage distance can be ensured while maintaining the strength of the substrate with slits of a small area.

[0044] As described above, there are five driver substrates, and an optical connector 110 is disposed on the driver substrate 101 (a specific circuit board). The plurality of slits S1 to S8 are formed in the driver substrate 101 on which the optical connector 110 is disposed.

[0045] The driver substrate 101 is provided with a plurality of contact portions 310 that come into contact with the case 200 (see FIG. 1) on its side surface. And, between the plurality of contact portions 310 of the driver substrate 101, a notch portion 311 that is recessed in the inner direction of the driver substrate 101 is formed. Regarding the portion where the notch portion 311 is present, since the driver substrate 101 does not come into contact with the case 200, insulation is ensured. The notch portion 311 is formed so as to secure a gap of a predetermined distance or more (for example, 1.5 mm or more, preferably 2.0 mm or more) between the driver substrate 101 and the case 200, thereby avoiding an electrical short circuit.

[0046] Regarding the case 200, a material having higher insulation performance than each driver substrate can be used. Thereby, the creepage distance when passing through the case 200 can be set to a third value (for example, 45 mm or more) that is smaller than a first value (for example, 50 mm or more). If the length of the notch portion 311 is a first length (for example, 43 mm) and the lengths from the end of the notch portion 311 to the input-side wiring pattern and the output-side wiring pattern are each a second length (for example, 2 mm), the third value can be sufficiently exceeded.

[0047] In addition, although slits are also provided in driver substrates other than the driver substrate 101, since components that require a large space such as the optical connector 110 are not arranged in the driver substrates other than the driver substrate 101, slits as dense as those of the driver substrate 101 are not provided. The slits formed in each driver substrate can be formed so as not to reduce the strength of the driver substrate as much as possible, and linear slits, non-linear slits, etc. can be combined and used. Also, in driver substrates other than the driver substrate 101, notch portions 311 similar to those of the driver substrate 101 can be formed.

[0048] 〔Details of the case〕 FIG. 9 is a plan view showing the ceiling member 201 of the case 200. The ceiling member 201 is a plate-shaped member, and includes an input-side opening 210, output-side openings 211 and 212, four protruding portions 213 (a plurality of ribs), and two protruding portions 214 (a plurality of ribs).

[0049] The input-side opening 210 is an opening for protruding the input connector 113 (a part of the input-side component, see Fig. 7) to the outside. The output-side openings 211 and 212 are openings for protruding the optical connector 110 (a part of the output-side component, see Fig. 7) to the outside. The four protruding portions 213 are members formed between the input-side opening 210 and the output-side openings 211 and 212, and protruding outward from the surface of the ceiling member 201. The two protruding portions 214 are members formed between the output-side opening 211 (the first output-side opening) and the output-side opening 212 (the second output-side opening), and protruding outward from the surface of the ceiling member 201.

[0050] The protruding portions 213 and 214 are integrally formed and have the same height. Also, since the protruding portions 213 and 214 have a predetermined height, a creepage distance can be ensured to be longer by that height.

[0051] The four protruding portions 213 can ensure creepage distances D12 and D13 (creepage distances of 50 mm or more) that are longer than the linear distances D10 and D11 between the input-side opening 210 and the output-side openings 211 and 212. Also, the two protruding portions 214 can ensure a creepage distance D15 (creepage distance of 25 mm or more) that is longer than the linear distance D14 between the output-side opening 211 and the output-side opening 212. Furthermore, the two protruding portions 214, which are less than four, can ensure a creepage distance D15 (creepage distance of 25 mm or more) that is shorter than the creepage distances D12 and D13 (creepage distances of 50 mm or more).

[0052] Here, an optical connector 110 (see FIG. 7) is disposed at the output-side opening 211 and the output-side opening 212. However, since the upper end portion of the optical connector 110 is not an electrical component and the electrical components are internal LEDs or the like, considering the distance from the electrical components, the creepage distances D12, D13, D15 can also be shortened by the distance from the opening to the location where the electrical components are disposed.

[0053] FIG. 10 is an exploded perspective view showing an implementation example of the gate driver 100. The gate driver 100 can drive a semiconductor element (IGBT) in a state of being mounted on an IGBT module 130 to be driven. The IGBT module 130 is provided with various connection terminals 131, 132, 133, and the gate driver 100 is mounted, for example, in a state where a lower surface terminal (not shown) of the driver substrate 103 is crimped to the connection terminal 133. Further, a main conductor (+ / -) such as a bus bar is connected to the connection terminal 131 located on one side in the longitudinal direction of the IGBT module 130, and a conductor for the midpoint between semiconductor elements is connected to the connection terminal 132 on the other side.

[0054] An implementation region for the gate driver 100 is secured in advance in the IGBT module 130, and this implementation region is defined by a dimension L in the longitudinal direction and a dimension W in the width direction of the IGBT module 130, for example. Therefore, the gate driver 100 is configured such that the outer dimensions of the driver substrate 103 fit within the implementation region (dimensions L, W).

[0055] 〔Circuit Configuration〕 FIG. 11 is a circuit diagram showing the connection relationship between the gate driver 100 and the IGBT module 130. When the gate driver 100 is mounted on the IGBT module 130 as described above, it is electrically connected to the IGBT module 130 through the connection terminal 133.

[0056] The gate driver 100 has two sets of gate drive circuits 141 and 142 corresponding to the semiconductor elements Q1 and Q2 in the IGBT module 130 respectively. Gate drive signals are applied to the semiconductor elements Q1 and Q2 from each of the gate drive circuits 141 and 142 via resistors R1 and R2 respectively. Note that the external device to be driven can be the IGBT module 130, or the semiconductor elements Q1 and Q2 can be considered as external devices.

[0057] As described above, in addition to the control signal being externally input to each of the gate drive circuits 141 and 142 through the input connector 113 (not shown in FIG. 11), a DC power supply is also externally input (supplied) to the isolated DC / DC converter 111, and drive currents are supplied to each of the gate drive circuits 141 and 142 from the isolated DC / DC converter 111.

[0058] 〔Input-side circuit〕 At this time, in the gate driver 100, the input-side (primary-side) circuit and the output-side (secondary-side) circuit are in an electrically isolated state. The input-side circuit PI includes the input connector 113, the primary-side circuit in the isolated DC / DC converter 111, the primary-side circuits in each of the gate drive circuits 141 and 142, and their resistors, wiring patterns, connection terminals, a device 134 capable of voltage-to-light conversion, etc.

[0059] 〔Output-side circuit〕 Assuming the above is the input-side circuit PI, the entire IGBT module 130 as seen in the mounted state of the gate driver 100 becomes the output-side circuit PO, and the input-side circuit PI and the output-side circuit PO are connected by an insulated member such as an optical fiber. At this time, the output-side circuit PO receives the secondary-side circuit in the isolated DC / DC converter 111 insulated from the input-side circuit PI, the secondary-side circuits in each of the gate drive circuits 141 and 142, and their resistors R1 and R2, wiring patterns, connection terminals, temperature, voltage, etc., and also includes a device 135 capable of voltage-to-light conversion, etc.

[0060] Therefore, it is necessary to ensure an appropriate insulation distance Id (creepage distance) between the input-side circuit PI and the output-side circuit PO. Thus, in the present embodiment, by means of the plurality of slits, the plurality of protrusions, the notches, etc. described above, a creepage distance of 50 mm or more, which is a first numerical value or more, is ensured between the primary-side circuit and the secondary-side circuit, and a creepage distance of 25 mm or more, which is a second numerical value or more, is ensured between the secondary-side circuits, thereby ensuring an appropriate insulation distance Id (creepage distance).

[0061] 〔Parallel drive〕 The gate driver 100 of the present embodiment can output (apply) a drive signal to the IGBT module 130 at the mounting destination to drive the semiconductor element, but can also output (apply) a drive signal in parallel to other IGBT modules other than the mounting destination, and can drive a plurality of IGBT modules in parallel.

[0062] 〔Parallel drive circuit〕 FIG. 12 is a diagram showing a circuit configuration in which a plurality of IGBT modules 130 and 140 are connected.

[0063] In the example of FIG. 12, starting from the IGBT module 130 on which the gate driver 100 of the present embodiment is mounted, one adjacent IGBT module 140 is connected. At this time, by mounting the relay substrate 150 on the IGBT module 140, the drive signals output from the gate drive circuits 141 and 142 of the gate driver 100 can also be applied to the semiconductor elements Q1 and Q2 in the IGBT module 140. And even when such parallel drive is performed, an appropriate insulation distance Id (creepage distance) can be ensured.

[0064] As described above, according to the present embodiment, there are the following effects. (1) According to this embodiment, since a plurality of slits S1 to S7 having different shapes are formed at positions intersecting lines L1, L2, and L3 that linearly connect the input-side component and the output-side component, not only are there a plurality of slits S1 to S7, but because they have different shapes, the creepage distance between the input-side component and the output-side component can be multiplicatively extended. As a result, good insulation between the input-side component and the output-side component can be ensured.

[0065] (2) According to this embodiment, since the first distance D1 is longer than the second distances D2 and D4, and the second distances D2 and D4 are longer than the third distance D3, even when the space for arranging the plurality of slits S1 to S7 is narrow, a necessary and sufficient creepage distance can be ensured.

[0066] (3) According to this embodiment, since the creepage paths R1 and R2 from the input-side component to the output-side component include paths that return in the direction of the input-side component due to the formation of the plurality of slits S1 to S7, by setting a folded path, not only can the creepage distance be ensured to be even longer in a narrow space, but also the plurality of slits S1 to S7 can be formed in a narrower area, and a decrease in the strength of the driver substrate can be suppressed.

[0067] (4) According to this embodiment, since the slits S2 and S6 are Y-shaped slits, while forming the slits in a space-saving manner, the creepage path can be made complex, and while suppressing a decrease in the strength of the driver substrate, the creepage distance can be ensured to be even longer.

[0068] (5) According to this embodiment, since the plurality of slits S1 to S3 and the plurality of slits S5 to S7 are formed in symmetric shapes, the slits are easy to manufacture, and a decrease in the strength of the driver substrate can also be suppressed by the symmetry of the slits.

[0069] (6) According to this embodiment, a slit S8 is formed between the first output-side component and the second output-side component to ensure a second creepage distance D5 shorter than the first creepage distances D2 and D4. Therefore, the slit S8 can ensure a sufficient creepage distance between the output-side components.

[0070] (7) According to this embodiment, since the plurality of slits S1 to S7 are formed in the driver substrate 101 on which the optical connector 110 is disposed, even in the driver substrate 101 where it is difficult to ensure a creepage distance by disposing the optical connector 110, a sufficient creepage distance can be ensured.

[0071] (8) According to this embodiment, for the case 200, since the creepage distance is ensured by the protruding portions 213 and 214, it is not necessary to provide a slit for ensuring the creepage distance in the case 200, and the role of the case 200 to protect the internal components can be firmly fulfilled.

[0072] (9) According to this embodiment, since two protruding portions 214, which are fewer in number than the four protruding portions 213, are formed between the output-side opening 211 and the output-side opening 212, the two protruding portions 214 can ensure a sufficient creepage distance between the output-side components.

[0073] (10) According to this embodiment, since a notch portion 311 recessed in the inner direction of the driver substrate 101 is formed between the plurality of contact portions 310 of the driver substrate 101, it is possible to avoid the creepage distance becoming short due to the arrangement of the case 200.

[0074] 〔Modification〕 FIG. 13 is a plan view showing a driver substrate 101-2 of a modification. The driver substrate 101 described in the embodiment can be changed to the driver substrate 101-2 of the modification. In the driver substrate 101-2 shown in FIG. 13, the components corresponding to the driver substrate 101 of the embodiment are denoted by the same reference numerals, and overlapping descriptions are omitted as appropriate.

[0075] The driver substrate 101-2 includes input-side wiring patterns 301 and 302 (input-side components), output-side wiring patterns 303 and 304 (output-side components electrically insulated from the input-side components), and a plurality of slits S1-2, S2, S3, S4, S5-2, S6, S7, and S8.

[0076] When starting from the lower end of the slit S1-2, the slit S1-2 bulges to the right side in the figure from the starting point and extends in an arc shape, and then extends linearly upward, forming a non-linear slit (a slit combining an arc and a straight line).

[0077] When starting from the upper end of the slit S5-2, the slit S5-2 bulges to the right side in the figure from the starting point and extends in an arc shape, and then extends linearly downward, forming a non-linear slit (a slit combining an arc and a straight line).

[0078] Since the driver substrate 101-2 is provided with such slits S1-2 and S5-2, in addition to the configuration and effects of the embodiment, the creepage distance can be extended at the arc-shaped portion, and creepage distances D2-2 and D4-2 with a distance longer than the creepage distances D2 and D4 of the embodiment (for example, 51 mm or more) can be ensured. Regarding the slits S3 and S7, similar to the slits S1-2 and S5-2, they may also be slits including an arc-shaped portion. In this case, the arc-shaped portion can bulge to the left side in the figure.

[0079] FIG. 14 is a plan view showing a driver substrate 101-3 in another modified form. The driver substrate 101 described in the embodiment can be changed to a driver substrate 101-3 in another modified form. In the driver substrate 101-3 shown in FIG. 14, the configurations corresponding to the driver substrate 101 of the embodiment are denoted by common reference numerals, and overlapping descriptions are omitted as appropriate.

[0080] The driver substrate 101-3 includes input-side wiring patterns 301 and 302 (input-side components), output-side wiring patterns 303 and 304 (output-side components electrically insulated from the input-side components), and a plurality of slits S1, S2-3, S3, S4, S5, S6-3, S7, and S8.

[0081] When starting from the lower end of the slit S2-3, the slit S2-3 extends upward in the drawing from the starting point and becomes a Y-shaped slit that branches and extends. Further, the branched portion of the slit S2-3 is a slit that is wider than the slit S2 of the embodiment, the central portion of the slit S2-3 is an opening larger than the slit S2 of the embodiment, and the upper end face of the branched portion is curved so as to be recessed inward. When starting from the upper end of the slit S6-3, the slit S6-3 extends downward in the drawing from the starting point and becomes a Y-shaped slit that branches and extends. Further, the branched portion of the slit S6-3 is a slit that is wider than the slit S6 of the embodiment, the central portion of the slit S6-3 is an opening larger than the slit S6 of the embodiment, and the lower end face of the branched portion is curved so as to be recessed inward.

[0082] Since the driver substrate 101-3 includes such slits S2-3 and S6-3, in addition to the configuration and effects of the embodiment, the surface distance can be extended by the wide Y-shaped slit, and a surface distance D2-3, D4-3 longer than the surface distances D2 and D4 of the embodiment (for example, 51 mm or more) can be ensured.

[0083] In the embodiment, the gate driver 100 has been described by taking an example of having five driver substrates, but the number of driver substrates may be four or less or six or more.

[0084] In the embodiment, an example is given in which another IGBT module is connected to one side of the IGBT module, but a form in which it is connected to both sides may also be used. Further, the number of other IGBT modules to be connected is not limited to the exemplified ones, and the numbers may be different when connecting to both sides.

[0085] In the embodiment, an example has been described in which the driver board 103 is arranged below the case 200, but the driver board 103 may be housed inside the case 200, or the driver board 103 may be eliminated and the functions of the driver board 103 may be implemented on other driver boards.

[0086] In addition, the structures exemplified together with the drawings in the embodiment are merely preferred examples, and various elements may be added to the basic structure, or some may be replaced.

Explanation of Reference Numerals

[0087] 100 Gate driver 101~105, 101-2, 101-3 Driver boards 110 Optical connector 111 Isolated DC / DC converter 112 Connecting connector 113 Input connector 114 Connection member 130 IGBT module 301, 302 Input-side wiring patterns 303, 304 Output-side wiring patterns S1~S9, S1-2, S5-2, S2-3, S6-3 Slits

Claims

1. A circuit board that can be mounted on an external device to be driven, Input-side components arranged on the circuit board, Output-side components arranged on the circuit board and electrically insulated from the input-side components, A plurality of slits formed through the circuit board at positions intersecting a line that linearly connects the input-side components and the output-side components, and having different shapes respectively, The surface path from the input-side components to the output-side components includes a path that returns in the direction of the input-side components due to the formation of the plurality of slits. A drive circuit device characterized by this.

2. A circuit board that can be mounted on an external device to be driven, Input-side components arranged on the circuit board, Output-side components arranged on the circuit board and electrically insulated from the input-side components, A plurality of slits formed through the circuit board at positions intersecting a line that linearly connects the input-side components and the output-side components, and having different shapes respectively, The plurality of slits include Y-shaped slits. A drive circuit device characterized by this.

3. In the drive circuit device according to claim 1 or 2, Let the distance from one end to the other end of the circuit board be the first distance, Let the surface distance from the input-side components to the output-side components be the second distance, Let the linear distance from the input-side components to the output-side components be the third distance. Then, The first distance is longer than the second distance, The second distance is longer than the third distance. A drive circuit device characterized by this.

4. In the drive circuit device according to claim 1 or 2, The output-side components include a first output-side component and a second output-side component, The plurality of slits formed between the input-side components and the first output-side component and the plurality of slits formed between the input-side components and the second output-side component are formed in a symmetrical shape. A drive circuit device characterized by this.

5. In the drive circuit device according to claim 1 or 2, The output-side components include a first output-side component and a second output-side component, Let the surface distance from the input-side components to the output-side components be the first surface distance, Let the surface distance from the first output-side component to the second output-side component be the second surface distance. Then, Between the first output-side component and the second output-side component, slits are formed to ensure the second surface distance that is shorter than the first surface distance. A drive circuit device characterized by this.

6. In the drive circuit device according to claim 1 or 2, there are a plurality of the circuit boards, a light connector is arranged on a specific circuit board among the plurality of the circuit boards, the drive circuit device is characterized in that the plurality of slits are formed in the specific circuit board on which the light connector is arranged.

7. In the drive circuit device according to claim 1 or 2, it includes a case for housing the circuit board inside, the case, has an input-side opening for protruding a part of the input-side components to the outside, has an output-side opening for protruding a part of the output-side components to the outside, and includes a plurality of protruding portions formed between the input-side opening and the output-side opening and protruding outward from the surface of the case, and is characterized by the drive circuit device.

8. In the drive circuit device according to claim 7, the output-side opening includes a first output-side opening and a second output-side opening, and the drive circuit device is characterized in that a number of protruding portions less than the plurality of protruding portions are formed between the first output-side opening and the second output-side opening.

9. In the drive circuit device according to claim 1 or 2, it includes a case for housing the circuit board inside, the circuit board includes a plurality of contact portions in contact with the case, and the drive circuit device is characterized in that a notch portion recessed in the inner direction of the circuit board is formed between the plurality of contact portions of the circuit board.

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