Printed circuit board (PCB) capable of detecting deviation of slotted hole in board at board edge

Abstract

The utility model relates to the technical field of PCB production, and provides a PCB for detecting in-board slot deviation at a board edge, the PCB comprises a main body, the main body develops an image through an outer-layer film, the main body is provided with a first inspection gong groove, and the outer-layer film is provided with a second inspection gong groove; the first inspection milling groove is smaller than the second inspection milling groove; and when the outer-layer film is aligned with the main body, the first inspection gong groove is completely positioned in the second inspection gong groove, or the first inspection gong groove and the second inspection gong groove are intersected and separated. According to the PCB, a first inspection gong groove is formed in a main body, a second inspection gong groove is formed in an external outer layer film, after the PCB and the external outer layer film are subjected to alignment exposure and development, whether the first inspection gong groove deviates or not is inspected, and whether the hole ring size of the first inspection gong groove meets the requirement or not is measured; therefore, the deviation problem of the slotted hole can be found in time.

Description

Technical Field

[0001] The present application relates to the field of PCB production technology, and in particular to a PCB board in which the misalignment of slot holes in the board is detected at the board edge. Background Art

[0002] PCBs (printed circuit boards) are a vital component of the electronics industry. As the support for electronic components and the carrier for electrical connections, their designs are trending towards higher precision, more compact structures, and enhanced performance. For multilayer PCBs, interlayer circuit connectivity requires drilling and metallization of holes. However, factors such as thermal expansion and contraction of the board material and the precision of the drilling machine can cause hole offset. Generally speaking, the round holes and slots in PCBs are not produced on the same equipment, resulting in the accumulation of tolerances between different equipment, causing the slots to misalign. When the offset exceeds the acceptable range, it can cause short circuits or open circuits, seriously affecting the electrical performance of electronic products.

[0003] CN209572201U discloses a PCB board with a structure for detecting the matching consistency of through and blind holes, including a PCB board body, on which a positioning structure capable of detecting the matching consistency of through and blind holes is provided, wherein the positioning structures are plural, and the plural positioning structures are divided into 4 groups and respectively provided at the four corners of the PCB board body. Its working principle is that if the positioning structures at the four corners of each board - the blind hole test holes and the through hole test holes in the specification - can be aligned without being tangent or intersecting, it means that other positions within each board can also meet the quality requirements. Although the above-mentioned PCB board can achieve the purpose of detection, its detection process requires an additional test drilling step on the PCB board and determines whether it is offset, and then re-performs the normal drilling process, which results in a problem of reduced production efficiency.

[0004] Based on this, the technical problem to be solved by this application is: how to quickly detect the misalignment of the slot holes of the PCB board. Utility Model Content

[0005] In order to solve the above technical problems, the present application provides a PCB board that detects the misalignment of the slot holes in the board at the edge of the board. This PCB board is provided with a first inspection gong groove on the main body, and then a second inspection gong groove is provided on the outer film of the peripheral device. The PCB board and the outer film of the peripheral device are aligned and exposed. After development, the first inspection gong groove is checked for misalignment, and the hole ring size of the first inspection gong groove is measured to see whether it meets the requirements, so as to timely discover the misalignment problem of the slot hole.

[0006] The technical solution of this application is:

[0007] A PCB board with an offset slot hole in the board edge detection board includes a main body, the main body develops an image through an outer film, the main body is provided with a first inspection gong groove, and the outer film is provided with a second inspection gong groove; the first inspection gong groove is smaller than the second inspection gong groove; when the outer film is aligned with the main body, the first inspection gong groove is completely located in the second inspection gong groove, or the first inspection gong groove and the second inspection gong groove intersect and separate.

[0008] In the above-mentioned PCB board with offset slot holes in the board edge detection board, the first inspection gong slot is set at the board edge of the main body.

[0009] In the above-mentioned PCB board with offset slots in the board edge detection board, a photosensitive layer is provided on the surface of the main body.

[0010] In the above-mentioned PCB board with offset slots in the board edge detection board, in the horizontal cross section, the difference between each side of the first inspection gong slot and each side of the second inspection gong slot is 0.1 mm.

[0011] In the above-mentioned PCB board with offset slots in the board edge detection board, both the first inspection gong slots and the second inspection gong slots are multiple and arranged in one-to-one correspondence.

[0012] In the above-mentioned PCB board with offset slots in the board edge detection board, there are four first inspection gong slots, and the four first inspection gong slots are respectively arranged at the four corners of the main body.

[0013] One of the above technical solutions of this application has at least one of the following advantages or beneficial effects:

[0014] The present application provides a first inspection gong groove and a second inspection gong groove on the main body of the PCB board and the outer film sheet outside the PCB board respectively, and the first inspection gong groove is smaller than the second inspection gong groove in size. After development, if there is a deviation phenomenon, the direction of the hole offset can be seen against the backdrop of the first inspection gong groove, thereby ensuring the product's warehouse quality and being able to adjust the parameters of the drilling rig and the gong machine in time; in addition, compared with the use of a circular hole as a detection reference, the present embodiment uses the first inspection gong groove as the detection reference. The directionality of the slot hole is stronger, suitable for providing more precise positioning in direction, and has better matching and positioning capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the bonding process between the PCB board and the outer film sheet according to Example 1 of the present application;

[0016] Figure 2 A schematic diagram of the PCB board of Example 1 of the present application;

[0017] Figure 3This is a simplified diagram of the outer film sheet of Example 1 of the present application.

[0018] Description of reference numerals:

[0019] 1. Main body; 11. Board edge; 12. Hole position; 101. First inspection groove; 2. Outer film; 201. Second inspection groove. DETAILED DESCRIPTION

[0020] The following is a clear and complete description of the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0021] Example 1

[0022] refer to Figures 1 to 3 A PCB board with an offset slot hole in the board edge detection board includes a main body 1, the main body 1 develops an image through an outer film 2, the main body 1 is provided with a first inspection gong groove 101, and the outer film 2 is provided with a second inspection gong groove 201; the first inspection gong groove 101 is smaller than the second inspection gong groove 201; when the outer film 2 is aligned with the main body 1, the first inspection gong groove 101 is completely located in the second inspection gong groove 201, or the first inspection gong groove 101 and the second inspection gong groove 201 intersect and separate.

[0023] Under the above design, when the outer film 2 is aligned with the main body 1, three situations may occur in the first inspection gong groove 101 and the second inspection gong groove 201: First, the first inspection gong groove 101 is completely located in the second inspection gong groove 201. After development, the first inspection gong groove 101 is surrounded by the surrounding graphics. This state indicates that the hole position 12 on the PCB board has not shifted or the degree of shift is acceptable; Second, the first inspection gong groove 101 intersects with the second inspection gong groove 201. After development, there is no graphic somewhere on the edge of the first inspection gong groove 101. This state indicates that the hole position 12 on the PCB board is shifted, and the direction of the shift of the hole position 12 can be determined based on the position of the graphic in the first inspection gong groove 101; Third, the first inspection gong groove 101 is separated from the second inspection gong groove 201. After development, there is no second inspection gong groove 201 graphic around the first inspection gong groove 101. This state indicates that the hole position 12 on the PCB board is seriously shifted, and it is necessary to consider whether there is a problem in the production link and make timely adjustments.

[0024] The advantage of this embodiment is that, by providing a first inspection gong groove 101 and a second inspection gong groove 201 on the main body 1 of the PCB board and the outer film sheet 2 outside the PCB board respectively, and the first inspection gong groove 101 is smaller than the second inspection gong groove 201 in size, after development, if there is a deviation phenomenon, the direction of the hole position 12 offset can be seen against the background of the first inspection gong groove 101, thereby ensuring the product's warehouse quality and being able to adjust the parameters of the drilling rig and the gong machine in time; in addition, compared with the use of a circular hole as a detection reference, the first inspection gong groove 101 used in this embodiment as a detection reference has a stronger directionality, is suitable for providing more precise positioning in direction, and has better matching and positioning capabilities.

[0025] It should be noted that the holes 12 in the PCB board in this embodiment are only used to illustrate the distinction between the board edge and the interior and are not specific PCB board holes 12. At the same time, the corresponding holes on the outer film 2 are not shown.

[0026] As a preferred embodiment of the present invention, the first inspection gong groove 101 is provided at the board edge 11 of the main body 1. During the production process of the PCB board, the board edge 11 is generally a space without electronic components and circuits. As the contact position for the belt and chain to transport the board, it is generally required to retain at least 5.0 mm. Under this design, the first inspection gong groove 101 is independent of the hole position 12 in the main body 1 of the PCB board. When designing the production data, all the round holes in the main body 1 are first drilled out using an external drilling rig, and then all the slots in the body are drilled out using an external gong machine. Then, the first inspection gong groove 101 is drilled out. Completing the gong groove in one process can effectively reduce the error of detection without affecting the arrangement of electronic components and circuits in the main body 1 of the PCB board.

[0027] In this embodiment, specifically, a photosensitive layer is provided on the surface of the main body 1. The photosensitive layer is a dry film. It should be noted that when applying the dry film, the first inspection gong groove 101 must be completely covered.

[0028] In this embodiment, preferably, in a horizontal cross-section, the difference between each side of the first inspection gong groove 101 and each side of the second inspection gong groove 201 is 0.1 mm. This design represents the maximum acceptable offset dimension in actual production of this embodiment. Those skilled in the art may appropriately reduce or increase this difference based on different production scenarios, and this still falls within the scope of protection of this embodiment.

[0029] In this embodiment, specifically, the first inspection gong slots 101 and the second inspection gong slots 201 are both provided in a plurality and in a one-to-one correspondence. More specifically, the first inspection gong slots 101 are four, and the four first inspection gong slots 101 are respectively provided at the four corners of the main body 1 .

[0030] Under the above design, the plurality of first inspection gong grooves 101 and second inspection gong grooves 201 and their arrangement can make the detection of this embodiment more accurate.

[0031] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A PCB board with a slot deviation detection board at the board edge, comprising a main body, the main body developing an image through an outer film, characterized in that: The main body is provided with a first inspection gong groove, and the outer film is provided with a second inspection gong groove; the first inspection gong groove is smaller than the second inspection gong groove; when the outer film is aligned with the main body, the first inspection gong groove is completely located in the second inspection gong groove, or the first inspection gong groove intersects and separates from the second inspection gong groove.

2. The PCB board with slot offset detection in the board edge detection board according to claim 1, characterized in that: The first inspection gong groove is arranged on the plate edge of the main body.

3. The PCB board with slot offset detection in the board edge detection board according to claim 1, characterized in that: A photosensitive layer is provided on the surface of the main body.

4. The PCB board with slot offset detection in the board edge detection board according to claim 1, characterized in that: In the horizontal section, the difference between each side of the first inspection gong groove and each side of the second inspection gong groove is 0.1 mm.

5. The PCB board with slot offset detection board according to claim 1, characterized in that: The first inspection gong slots and the second inspection gong slots are both multiple and arranged in one-to-one correspondence.

6. The PCB board with slot offset detection board according to claim 5, characterized in that: There are four first inspection gong grooves, and the four first inspection gong grooves are respectively arranged at the four corners of the main body.

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