Article with IC chip and method for manufacturing the same

Abstract

To provide an article with an IC chip that can reduce a resistance value of a loop-shaped conductor for impedance matching, and a method for manufacturing the same.SOLUTION: An IC chip-equipped article 30 includes a first substrate 41, an antenna 42 on the first substrate 41, a loop-shaped conductor 20 connected or capacitively coupled to the antenna 42, and an IC chip 12 connected or capacitively coupled to the loop-shaped conductor 20. The loop-shaped conductor 20 includes a material having a lower volume resistivity than a material of the antenna 42.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an article with an IC chip and a method for manufacturing the same.

Background Art

[0002] Conventionally, for the purpose of managing and identifying product information, contactless RFID (Radio Frequency Identification) tags equipped with IC chips have been used for products and the like. Information regarding products and the like is written in the IC chips of the RFID tags. When managing and selling products and the like, the information of these IC chips can be wirelessly read and utilized by a reader / writer. Such RFID tags have brought great advantages such as improved convenience and safety in product management and elimination of human errors.

[0003] RFID tags include active tags that incorporate a battery and can transmit radio waves on their own, and passive tags that receive power wirelessly and activate the IC chip. In recent years, passive tags, which have a simple configuration and can be produced at low cost, have begun to be widely adopted. Among passive tags, those having a linear antenna for receiving power and a loop conductor for impedance matching with the IC to efficiently transmit power are known (see Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In conventional RFID tags, a linear antenna and a loop conductor for impedance matching are often formed by an etching method, which tends to increase production costs. On the other hand, it is also conceivable to form both the linear antenna or both the linear antenna and the loop conductor by printing using conductive ink. However, since the conductive ink needs to be mixed with a certain amount of resin to hold the coating film, there is a problem that the sheet resistance value of the coating film is higher than that of the metal film formed by a vacuum process as employed in the etching method. When using highly resistive conductive ink, the resistance value of the loop conductor becomes high, and there is a risk that impedance matching becomes insufficient. For the purpose of reducing the resistance value of the loop conductor, a method of increasing the width of the loop conductor in a plan view can be considered. However, in a high-frequency circuit such as an RFID tag, electrons selectively pass through a path with a short distance, and sufficient effects cannot be obtained.

[0006] The present disclosure provides an article with an IC chip and a method for manufacturing the same, which are capable of reducing the resistance value of a loop conductor for impedance matching.

Means for Solving the Problems

[0007] The article with an IC chip according to the present embodiment includes a first substrate, an antenna on the first substrate, a loop conductor connected or capacitively coupled to the antenna, and an IC chip connected or capacitively coupled to the loop conductor, wherein the loop conductor includes a material having a lower volume resistivity than the material of the antenna.

[0008] The article with an IC chip according to the present embodiment includes a first substrate, an antenna on the first substrate, a loop conductor connected or capacitively coupled to the antenna, and an IC chip connected or capacitively coupled to the loop conductor, wherein the thickness of the loop conductor is thicker than the thickness of the antenna.

[0009] In the article with an IC chip according to the present embodiment, the antenna may be composed of a first printing layer, and the loop conductor may include the first printing layer and a second printing layer located above or below the first printing layer.

[0010] In the article with an IC chip according to this embodiment, the antenna and the loop-shaped conductor may be made of the same material.

[0011] In the article with an IC chip according to this embodiment, it is composed of an electrode pair to which the IC chip is connected or capacitively coupled, and a substrate with an antenna. The electrode pair to which the IC chip is connected or capacitively coupled has a second substrate and the IC chip. The substrate with an antenna may have the first substrate, the antenna, and the loop-shaped conductor.

[0012] In the article with an IC chip according to this embodiment, the electrode pair to which the IC chip is connected or capacitively coupled may be located on the surface of the first substrate opposite to the loop-shaped conductor and the antenna.

[0013] In the article with an IC chip according to this embodiment, it is composed of a loop-shaped conductor to which the IC chip is connected or capacitively coupled, and a substrate with an antenna. The loop-shaped conductor to which the IC chip is connected or capacitively coupled has a third substrate, the loop-shaped conductor, and the IC chip. The substrate with an antenna may have the first substrate and the antenna.

[0014] In the article with an IC chip according to this embodiment, the loop-shaped conductor to which the IC chip is connected or capacitively coupled may be located on the surface of the first substrate opposite to the antenna.

[0015] In the article with an IC chip according to this embodiment, it is composed of an electrode pair to which the IC chip is connected or capacitively coupled, a loop-shaped conductor to which the IC chip is connected or capacitively coupled, and a substrate with an antenna. The electrode pair to which the IC chip is connected or capacitively coupled has a fourth substrate and the IC chip. The loop-shaped conductor to which the IC chip is connected or capacitively coupled has a fifth substrate and the loop-shaped conductor. The substrate with an antenna may have the first substrate and the antenna.

[0016] In the article with an IC chip according to this embodiment, the electrode pair to which the IC chip is connected or capacitively coupled and the loop-shaped conductor may be located on the surface of the first substrate opposite to the antenna.

[0017] In the article with an IC chip according to this embodiment, the loop-shaped conductor and the IC chip may be located on the surface of the first substrate opposite to the antenna.

[0018] In the article with an IC chip according to this embodiment, the loop-shaped conductor and the electrode pair to which the IC chip is connected or capacitively coupled may be located on the surface of the first substrate opposite to the antenna.

[0019] In the article with an IC chip according to this embodiment, it may be an RFID tag.

[0020] In the article with an IC chip according to this embodiment, it may be a packaging material.

[0021] The manufacturing method of the article with an IC chip according to this embodiment includes a step of preparing a first substrate, a step of forming an antenna on the first substrate, a step of connecting or capacitively coupling a loop-shaped conductor to the antenna, and a step of connecting or capacitively coupling an IC chip to the loop-shaped conductor, wherein the loop-shaped conductor contains a material having a lower volume resistivity than the material of the antenna.

[0022] The manufacturing method of the article with an IC chip according to this embodiment includes a step of preparing a first substrate, a step of forming an antenna on the first substrate, a step of connecting or capacitively coupling a loop-shaped conductor to the antenna, and a step of connecting or capacitively coupling an IC chip to the loop-shaped conductor, wherein the thickness of the loop-shaped conductor is thicker than the thickness of the antenna.

[0023] In the manufacturing method of the article with an IC chip according to this embodiment, the antenna may be formed by printing.

[0024] In the method for manufacturing an article with an IC chip according to the present embodiment, the antenna and the loop-shaped conductor may each be formed by printing.

Advantages of the Invention

[0025] According to the present embodiment, the resistance value of the loop-shaped conductor can be reduced.

Brief Description of the Drawings

[0026]

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Mode for Carrying Out the Invention

[0027] Hereinafter, an embodiment will be specifically described with reference to the drawings. Each of the drawings shown below is schematically illustrated. Therefore, the size and shape of each part are exaggerated as appropriate for easy understanding. Also, it is possible to implement with appropriate changes within the scope not departing from the technical idea. In each of the drawings shown below, the same parts are denoted by the same reference numerals, and some detailed descriptions may be omitted. Also, the numerical values and material names of the dimensions of each member described in this specification are examples as an embodiment, and are not limited thereto, and can be appropriately selected and used. In this specification, terms specifying shapes and geometric conditions, such as terms like parallel, orthogonal, and perpendicular, include not only the strictly meant states but also substantially the same states.

[0028] (First Embodiment) Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 7.

[0029] [Article with an IC Chip] First, with reference to FIGS. 1 and 2, the configuration of the article with an IC chip according to this embodiment will be described. FIG. 1 is a plan view showing the article with an IC chip according to this embodiment, and FIG. 2 is a cross-sectional view showing the article with an IC chip according to this embodiment.

[0030] As shown in FIGS. 1 and 2, the article 30 with an IC chip according to this embodiment includes a first substrate (article substrate) 41, a pair of antennas 42 on the first substrate 41, a loop conductor 20 connected to the pair of antennas 42, and an IC chip 12 connected to the loop conductor 20. This article 30 with an IC chip performs non-contact wireless communication with a reader / writer (not shown).

[0031] The first substrate 41 serves as a support for supporting the article 30 with an IC chip. As the first substrate 41, a resin sheet (film) or a paper substrate can be used. As the resin sheet, for example, materials such as polyethylene terephthalate, polyethylene naphthalate, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, polypropylene, polyethylene, polycarbonate, polyamide, polyimide, polyphenylene sulfide, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, cellulose diacetate, cellulose triacetate, polystyrene, acrylonitrile-butadiene-styrene copolymer, polyacrylate ester, polymethacrylate ester, and polyurethane are used. As the paper substrate, for example, high-quality paper, coated paper, kraft paper, glassine paper, synthetic paper, latex or melamine-impregnated paper, etc. can be used. Note that the thickness T1 of the first substrate 41 can be, for example, 5 μm or more and 3 mm or less.

[0032] The antennas 42 are laminated on the first substrate 41. Each antenna 42 has an inner end portion 43 provided on the inner side and on the loop conductor 20 side, and an antenna wiring portion 44 connected to the outside of the inner end portion 43 and bent a plurality of times in a zigzag shape in plan view. Note that the antennas 42 can have various planar shapes, and in addition to the folded meander shape, they may be patch-shaped or other shapes.

[0033] The loop-shaped conductor 20 is laminated on the first base material 41. Also, the loop-shaped conductor 20 is directly connected to or capacitively coupled to a pair of antennas 42. The loop-shaped conductor 20 is an element for adjusting the resonance frequency of the antenna 42 in a state where it is connected to the IC chip 12 having a capacitance between the input terminals to be near a predetermined frequency. Specifically, the loop-shaped conductor 20 is configured in an elongated loop shape and is formed in a ring shape except for a portion covered by the IC chip 12. In this case, the loop-shaped conductor 20 has a rectangular shape in a plan view except for the cut-out portion (gap portion 24). One side of the rectangle constituting the loop-shaped conductor 20 is positioned parallel to the first direction DL, and the other side of the rectangle is positioned parallel to the second direction DS.

[0034] Also, the loop-shaped conductor 20 has a pair of first-direction portions 21 extending along the first direction DL and a pair of second-direction portions 22 extending along the second direction DS. The pair of first-direction portions 21 are arranged parallel to each other, and the pair of second-direction portions 22 are arranged parallel to each other. Also, each first-direction portion 21 and each second-direction portion 22 are arranged so as to be orthogonal to each other. Among the pair of first-direction portions 21, one first-direction portion 21 located on the IC chip 12 side is interrupted at the central portion, and a pair of connection portions 23 are formed in this first-direction portion 21. A gap portion 24 is formed between the pair of connection portions 23, and the pair of connection portions 23 face each other via the gap portion 24. The pair of connection portions 23 are each electrically connected to the IC chip 12.

[0035] The IC chip 12 is laminated on the loop-shaped conductor 20. The IC chip 12 is directly connected to or capacitively coupled to the loop-shaped conductor 20. The IC chip 12 has a data storage area (memory) and can use a normal one with input / output functions, control functions, signal modulation, and demodulation. This IC chip 12 receives the power and signals obtained from the antenna 42 and performs writing and reading of the memory. The IC chip 12 may have a wireless communication interface, a memory for storing data used for managing the article 30 with the IC chip, etc. The IC chip 12 is electrically connected to a pair of connection portions 23 of the loop-shaped conductor 20 via a connection layer (not shown). As this connection layer, for example, an anisotropic conductive film (ACP or ACF: Anisotropic Conductive Film) may be used. The anisotropic conductive film has a structure in which resin particles coated with a conductor such as nickel, silver, or gold or conductor particles such as nickel, silver, or gold are dispersed in a polymer. By disposing the anisotropic conductive film between the loop-shaped conductor 20 and the IC chip 12 and applying pressure while heating, these metals electrically connect the loop-shaped conductor 20 and the IC chip 12.

[0036] In the present embodiment, both the loop-shaped conductor 20 and the antenna 42 are made of a conductive material. In this case, since the loop-shaped conductor 20 can be regarded as a thin film having a substantially uniform thickness, the loop-shaped conductor 20 may be configured to have a lower sheet resistance than the antenna 42. Specifically, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42, and thereby the loop-shaped conductor 20 may have a lower sheet resistance than the antenna 42.

[0037] Specifically, the sheet resistance of the loop-shaped conductor 20 may be 5 Ω / sq or less. Also, the sheet resistance of the antenna 42 may be 50 Ω / sq or less. Desirably, the sheet resistance of the loop-shaped conductor 20 is 1 Ω / sq or less, and the sheet resistance of the antenna 42 is 10 Ω / sq or less. More desirably, the sheet resistance of the loop-shaped conductor 20 is 0.3 Ω / sq or less. Further, the sheet resistance of the loop-shaped conductor 20 may be 1 / 10 or less of the sheet resistance of the antenna 42, desirably 1 / 20 or less. The sheet resistance can be measured, for example, by forming a uniform film having the same material and the same film thickness as those used in the present embodiment and having an area of at least 150 mm × 150 mm by the same method, and using a low resistivity meter and a four-terminal probe manufactured by Mitsubishi Chemical Analytic.

[0038] In this case, the loop-shaped conductor 20 may be a printed layer formed by a method of printing conductive ink. As the conductive ink, for example, conductive ink containing aluminum powder, copper powder, silver powder, gold powder, or particles whose surface is coated or chemically modified with a different metal can be used. Thus, when the loop-shaped conductor 20 is constituted by a printed layer of conductive ink containing, for example, metal powder, the production cost can be suppressed at a low level as compared with the case where the loop-shaped conductor 20 is formed by, for example, etching. Alternatively, the loop-shaped conductor 20 may be formed, for example, by a method of chemically etching a metal foil. As the metal foil, for example, aluminum, copper, or the like can be used. The metal foil can be formed on the first base material 41 by plating, vapor deposition, dry lamination, adhesion using an adhesive, or the like.

[0039] Each antenna 42 may be, for example, a printed layer formed by a method of printing conductive ink. As the conductive ink, for example, conductive ink containing particles such as carbon, aluminum powder, copper powder, silver powder, gold powder, or particles whose surfaces are coated with a different metal or chemically modified can be used. In this way, when each antenna 42 is constituted by a printed layer of conductive ink containing, for example, carbon, the production cost can be reduced as compared with the case where the antenna 42 is formed by, for example, etching or formed from conductive ink containing metal powders such as aluminum powder, copper powder, and silver powder. Further, when both the loop-shaped conductor 20 and the antenna 42 are formed by a method of printing conductive ink, for example, using a multicolor printer, the ink for the loop-shaped conductor 20 and the ink for the antenna 42 may be used for printing respectively. In this case, the loop-shaped conductor 20 and the antenna 42 can be formed at low cost. The loop-shaped conductor 20 and the antenna 42 may have different ink compositions, ratios of metal to resin, film thicknesses, printing methods, etc.

[0040] As shown in FIGS. 2(a) and 2(b), the thickness T2 of the loop-shaped conductor 20 may be the same as the thickness T5 of the antenna 42. The thickness T2 of the loop-shaped conductor 20 can be appropriately adjusted according to the required sheet resistance of the loop-shaped conductor 20, and the appropriate thickness T2 of the loop-shaped conductor 20 can be determined by the material, printing method, etc. As an example, the thickness T2 of the loop-shaped conductor 20 may be 0.1 μm or more and 50 μm or less, and the thickness T5 of the antenna 42 may be, for example, 0.04 μm or more and 50 μm or less. Note that the thickness T2 of the loop-shaped conductor 20 and the thickness T5 of the antenna 42 refer to the maximum thicknesses of the loop-shaped conductor 20 and the antenna 42 when measured in the normal direction of the main surfaces of the loop-shaped conductor 20 and the antenna 42, respectively.

[0041] Further, the loop-shaped conductor 20 and the antenna 42 are both printed layers formed by a method of printing conductive ink, and the loop-shaped conductor 20 may be formed thicker than the antenna 42. As the conductive ink, for example, conductive ink containing particles such as aluminum powder, copper powder, silver powder, or particles such as carbon can be used. Thus, when the loop-shaped conductor 20 and the antenna 42 are constituted by a printed layer of conductive ink, the production cost can be reduced as compared with the case where the loop-shaped conductor 20 and the antenna 42 are formed by, for example, etching. In this case, by printing the loop-shaped conductor 20 thicker than the antenna 42, the thickness T2 of the loop-shaped conductor 20 may be made thicker than the thickness T5 of the antenna 42. Note that the thickness T2 of the loop-shaped conductor 20 may be, for example, 1.5 times or more and 3 times or less the thickness T5 of the antenna 42. Further, when both the loop-shaped conductor 20 and the antenna 42 are formed by a method of printing conductive ink, for example, a multicolor printing machine may be used. That is, using the conductive ink for the loop-shaped conductor 20 and the conductive ink for the antenna 42, printing may be performed such that the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42. In this case, since the thickness T5 of the antenna 42 can be made thin, the antenna 42 can be formed at low cost. Further, since the resin concentration of the conductive ink for the antenna 42 can be increased, the coating film strength can be improved, and the abrasion resistance and bend resistance of the antenna 42 can be enhanced.

[0042] FIG. 3 and FIG. 4 are diagrams each showing a modification of the article 30 with an IC chip, and are cross-sectional views corresponding to FIG. 2(a). As shown in FIG. 3, a pair of antennas 42 may be connected to each other at the connection portion 42a, and the loop-shaped conductor 20 may be disposed on the connection portion 42a. Alternatively, as shown in FIG. 4, a part of the loop-shaped conductor 20 may be disposed so as to overlap a part of each antenna 42.

[0043] In addition, in the present embodiment, (i) the loop-shaped conductor 20 contains a material having a lower volume resistivity than the material of the antenna 42, and (ii) the thickness T2 of the loop-shaped conductor 20 is the same as the thickness T5 of the antenna 42. However, it is not limited to this. For example, (i) the loop-shaped conductor 20 contains a material having a lower volume resistivity than the material of the antenna 42, and (ii) the thickness T2 of the loop-shaped conductor 20 may be thicker than the thickness T5 of the antenna 42 or thinner than the thickness T5 of the antenna 42.

[0044] Also, as shown in FIG. 2, the overall thickness T4 of the article 30 with the IC chip may be 200 μm or more and 3600 μm or less.

[0045] As shown in FIG. 5, the article 30 with the IC chip may be, for example, an RFID tag 35. Such an RFID tag 35 has its own independent circulation. When the RFID tag 35 is used for, for example, merchandise management, it may be attached to a product using an adhesive layer (not shown) formed on the first base material 41.

[0046] Also, as shown in FIG. 6, the article 30 with the IC chip may be, for example, a packaging material 36. A printing layer (not shown) may be formed on the packaging material 36. Such a packaging material 36 may include a container having a storage portion for storing the contents. In this case, the first base material 41 constitutes the main base material of the container. Alternatively, the packaging material 36 may be attached to a container having a storage portion. In this case, the first base material 41 constitutes a base material different from the main base material of the container.

[0047] When the article 30 with an IC chip is the packaging material 36, the packaging material 36 may be a flexible packaging material, a paper container, a resin molded product, or the like. Among these, examples of the flexible packaging material include a pouch, a pillow, a shrink label, an in-mold label container, a lid material, and the like. Examples of the paper container include general paper containers such as boxes, paper containers, paper cups, paper trays, or base papers. Examples of the resin molded product include a blister container, a vacuum formed container, a deep drawn container, an injection molded container, a blow molded container, a plastic bottle, and the like. Note that FIG. 6 shows a case where the packaging material 36 is a paper container.

[0048] When the article 30 with an IC chip is the packaging material 36, the antenna 42 may be located on the outer surface side of the container (the side opposite to the accommodating portion). In this case, the IC chip 12, the loop-shaped conductor 20, and the antenna 42 may each be located on the outer surface side of the first base material 41. Alternatively, the antenna 42 may be located on the inner surface side of the container (the accommodating portion side). In this case, the IC chip 12 and the loop-shaped conductor 20 may be located on the inner surface side of the container (the accommodating portion side) or on the outer surface side of the container (the side opposite to the accommodating portion).

[0049] Also, when the article 30 with an IC chip is the packaging material 36, a normal printing layer for the packaging material 36 may be formed so as to cover the antenna 42.

[0050] [Manufacturing Method of Article with IC Chip] Next, a manufacturing method of the article 30 with an IC chip according to the present embodiment will be described with reference to FIGS. 7(a) - (d).

[0051] In this case, first, as shown in FIG. 7(a), a first base material 41 made of a resin sheet (film), a paper base material, or the like is prepared.

[0052] Next, as shown in FIG. 7(b), an antenna 42 having a predetermined pattern is formed on the first substrate 41. Each antenna 42 may be formed, for example, by printing a conductive ink. As the conductive ink, for example, a conductive ink containing particles such as carbon can be used. When printing the conductive ink, a gravure printing method, a screen printing method, or an inkjet method may be used.

[0053] Subsequently, as shown in FIG. 7(c), a loop-shaped conductor 20 having a predetermined pattern is formed on the first substrate 41. This loop-shaped conductor 20 is coupled to the antenna 42. The loop-shaped conductor 20 may be formed, for example, by printing a conductive ink. As the conductive ink, for example, a conductive ink containing particles such as aluminum powder, copper powder, or silver powder can be used. When printing the conductive ink, a gravure printing method, a screen printing method, or an inkjet method may be used. Alternatively, the loop-shaped conductor 20 may be formed, for example, by a method of chemically etching a metal foil or a method of punching out a metal foil. At this time, the loop-shaped conductor 20 contains a material having a lower volume resistivity than the material of the antenna 42. Note that the thickness T2 of the loop-shaped conductor 20 may be the same as the thickness T5 of the antenna 42 or may be different from the thickness T5 of the antenna 42.

[0054] Note that when the conductive ink is formed by printing, the antenna 42 and the loop-shaped conductor 20 may be formed using the same printing machine. Also, using the same printing machine as the printing machine for applying the conductive ink, a normal printing layer (for example, a printing layer for the packaging material 36) may be formed together with the antenna 42 and the loop-shaped conductor 20.

[0055] Note that the antenna 42 is not limited to the above and may be formed simultaneously with the loop-shaped conductor 20. Alternatively, the antenna 42 may be formed after the loop-shaped conductor 20 is formed.

[0056] Thereafter, as shown in FIG. 7(d), an IC chip 12 is mounted on the loop-shaped conductor 20 via a connection layer (not shown). As the connection layer, for example, an anisotropic conductive film may be used. In this case, by disposing the anisotropic conductive film between the loop-shaped conductor 20 and the IC chip 12 and applying pressure while heating, the loop-shaped conductor 20 and the IC chip 12 can be electrically connected. In this way, an article 30 with an IC chip including a first base material 41, a pair of antennas 42 on the first base material 41, a loop-shaped conductor 20 coupled to the antennas 42 on the first base material 41, and an IC chip 12 on the loop-shaped conductor 20 is obtained.

[0057] As described above, according to this embodiment, the loop-shaped conductor 20 includes a material having a lower volume resistivity than the material of the antenna 42. Thereby, the sheet resistance of the loop-shaped conductor 20, which is required to be lower in resistance than the antenna 42, can be made lower than that of the antenna 42. By thus reducing the sheet resistance of the loop-shaped conductor 20, it is possible to suppress the resonance of the loop-shaped conductor 20 from becoming insufficient and extend the propagation distance of wireless communication using the article 30 with an IC chip.

[0058] Also according to this embodiment, the antenna 42 and the loop-shaped conductor 20 are each a printed layer. Thereby, the antenna 42 and the loop-shaped conductor 20 can be formed at low cost. In particular, when formed by printing, even if the sheet resistance of the antenna 42 satisfies the required value, the sheet resistance of the loop-shaped conductor 20 tends to be higher than the required value. In contrast, in this embodiment, the loop-shaped conductor 20 includes a material having a lower volume resistivity than the material of the antenna 42. Thereby, the sheet resistance of the loop-shaped conductor 20 can be reduced.

[0059] Also, according to this embodiment, the antenna 42 may contain carbon. Thereby, the antenna 42 can be manufactured at low cost. Also, according to this embodiment, the loop-shaped conductor 20 may contain silver. Thereby, the loop-shaped conductor 20 can be made to have low resistance. In this case, the antenna 42, which does not necessarily have to have low resistance, can be manufactured with an inexpensive conductive ink containing carbon, and the loop-shaped conductor 20, for which low resistance is required, can be manufactured with a low-resistance conductive ink containing silver. Thereby, the sheet resistance of the loop-shaped conductor 20 can be lowered without significantly increasing the production cost.

[0060] (Second Embodiment) Next, with reference to FIGS. 8 and 9, the second embodiment will be described. FIGS. 8 and 9 are diagrams showing an article with an IC chip according to this embodiment. The second embodiment shown in FIGS. 8 and 9 is different in that the loop-shaped conductor 20 is composed of a first printing layer 32 and a second printing layer 33, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 8 and 9, the same parts as those in the forms shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0061] As shown in FIGS. 8 and 9, the article 30 with an IC chip includes a first base material 41, a pair of antennas 42 on the first base material 41, a loop-shaped conductor 20 disposed on the first base material 41 and directly connected to the pair of antennas 42, and an IC chip 12 connected to the loop-shaped conductor 20.

[0062] In the present embodiment, the antenna 42 is composed of a single first printed layer 32, and the loop conductor 20 is composed of the first printed layer 32 and a second printed layer 33 located above the first printed layer 32. As a result, the thickness T2 of the loop conductor 20 is greater than the thickness T5 of the antenna 42. In this case, the first printed layer 32 may be formed by printing a conductive ink containing particles such as carbon. Also, the second printed layer 33 may use a material having a lower volume resistivity than the first printed layer 32, or the first printed layer 32 and the second printed layer 33 may be composed of the same material. The second printed layer 33 may be formed, for example, by printing and laminating on the first printed layer 32 using a multicolor printer, or may be formed by printing a conductive ink containing metal powders such as aluminum powder, copper powder, and silver powder on the first printed layer 32. Thus, by configuring the loop conductor 20 from the first printed layer 32 and the second printed layer 33, the loop conductor 20 and the antenna 42 can be formed at low cost, and the loop conductor 20 can be made to have a lower resistance than the antenna 42. Although not shown, the loop conductor 20 may include three or more printed layers, and the antenna 42 may include two or more printed layers. Also, the second printed layer 33 may be located below the first printed layer 32.

[0063] (Third Embodiment) Next, with reference to FIGS. 10 and 11, the third embodiment will be described. FIGS. 10 and 11 are diagrams showing an article with an IC chip according to the present embodiment. The third embodiment shown in FIGS. 10 and 11 is different in that the thickness T2 of the loop conductor 20 is greater than the thickness T5 of the antenna 42, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 10 and 11, the same parts as those in the forms shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0064] As shown in FIGS. 10 and 11, the article 30 with an IC chip includes a first substrate 41, a pair of antennas 42 on the first substrate 41, a loop-shaped conductor 20 disposed on the first substrate 41 and directly connected to the pair of antennas 42, and an IC chip 12 connected to the loop-shaped conductor 20.

[0065] In the present embodiment, the thickness T2 of the loop-shaped conductor 20 is greater than the thickness T5 of the antenna 42. The thickness T2 of the loop-shaped conductor 20 can be appropriately adjusted according to the required sheet resistance of the loop-shaped conductor 20, and the appropriate thickness T2 of the loop-shaped conductor 20 can be determined by materials, printing methods, etc. As an example, the thickness T2 of the loop-shaped conductor 20 may be 0.1 μm or more and 50 μm or less, and the thickness T5 of the antenna 42 may be, for example, 0.1 μm or more and 50 μm or less. In this case, the thickness T2 of the loop-shaped conductor 20 may be, for example, 1.5 times or more and 3 times or less the thickness T5 of the antenna 42.

[0066] Both the loop-shaped conductor 20 and the antenna 42 are printing layers formed by a method of printing conductive ink, and the loop-shaped conductor 20 may be formed thicker by printing than the antenna 42. As the conductive ink, for example, conductive ink containing particles such as aluminum powder, copper powder, silver powder, or particles such as carbon can be used. Thus, when the loop-shaped conductor 20 and the antenna 42 are constituted by a printing layer of conductive ink, the production cost can be reduced as compared with the case where the loop-shaped conductor 20 and the antenna 42 are formed by etching, for example. In this case, the loop-shaped conductor 20 and the antenna 42 are made of the same material, and the loop-shaped conductor 20 may be printed thicker than the antenna 42 by overprinting or the like. Further, when both the loop-shaped conductor 20 and the antenna 42 are formed by a method of printing conductive ink, for example, a multicolor printing machine may be used. That is, using the conductive ink for the loop-shaped conductor 20 and the conductive ink for the antenna 42, printing may be performed such that the thickness T2 of the loop-shaped conductor 20 is greater than the thickness T5 of the antenna 42. In this case, since the thickness T5 of the antenna 42 can be made thin, the antenna 42 can be formed at low cost.

[0067] (Fourth Embodiment) Next, referring to FIGS. 12 to 14, a fourth embodiment will be described. FIGS. 12 to 14 are diagrams showing an article with an IC chip according to this embodiment. The fourth embodiment shown in FIGS. 12 to 14 is different in that the article 30 with an IC chip is composed of an electrode pair 60 to which an IC chip is connected or capacitively coupled and a substrate 40 with an antenna, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 12 to 14, the same parts as those in the forms shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0068] As shown in FIGS. 12 and 13, the article 30 with an IC chip according to this embodiment includes a substrate 40 with an antenna and an electrode pair 60 to which an IC chip is connected or capacitively coupled and which is connected to the substrate 40 with an antenna. The electrode pair 60 to which the IC chip is connected or capacitively coupled and the substrate 40 with an antenna are configured separately from each other, and the article 30 with an IC chip is configured by adhering these to each other.

[0069] The electrode pair 60 to which the IC chip is connected or capacitively coupled includes a second substrate 61, connection terminals 62 on the second substrate 61, and an IC chip 12 on the connection terminals 62. This electrode pair 60 to which the IC chip is connected or capacitively coupled is integrated with the substrate 40 with an antenna to form an article 30 with an IC chip that performs non-contact wireless communication with a reader / writer (not shown).

[0070] The second substrate 61 has a substantially rectangular shape in plan view. The second substrate 61 supports the IC chip 12, and a resin sheet (film) or a paper substrate can be used. As the resin sheet and the paper substrate, for example, those similar to those used for the first substrate 41 described above can be used.

[0071] The connection terminal 62 is formed on the second base material 61 and may be composed of a metal foil conductive layer such as copper. An IC chip 12 is attached onto the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

[0072] The base material 40 with an antenna has a first base material 41, a pair of antennas 42 on the first base material 41, and a loop-shaped conductor 20 disposed on the first base material 41 and directly connected to the pair of antennas 42. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

[0073] The base material 40 with an antenna and the electrode pair 60 to which the IC chip is connected or capacitively coupled are produced separately from each other and then connected via an adhesive layer 63. As the adhesive layer 63, for example, adhesives such as urethane adhesives, acrylic adhesives, styrene-butadiene copolymer adhesives, vinyl chloride adhesives, epoxy adhesives, and hot melt adhesives can be used.

[0074] According to the present embodiment, the base material 40 with an antenna and the electrode pair 60 to which the IC chip is connected or capacitively coupled are configured separately from each other, and by adhering these, the article 30 with an IC chip is produced. Thereby, when mounting the IC chip 12 on the antenna 42, high positional accuracy between the IC chip 12 and the antenna 42 is not required, and the article 30 with an IC chip can be easily manufactured.

[0075] As shown in FIG. 14, it is preferable that a portion 62a of the connection terminal 62 that overlaps the loop-shaped conductor 20 is thicker than other portions of the connection terminal 62. Similarly, it is preferable that a portion (connection portion 23) of the loop-shaped conductor 20 that overlaps the connection terminal 62 is thicker than other portions of the loop-shaped conductor 20. Thereby, the capacitive coupling between the connection terminal 62 and the connection portion 23 can be increased.

[0076] (Fifth Embodiment) Next, referring to FIGS. 15 and 16, the fifth embodiment will be described. FIGS. 15 and 16 are diagrams showing an article with an IC chip according to this embodiment. The fifth embodiment shown in FIGS. 15 and 16 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite side of the loop conductor 20, and other configurations are substantially the same as those of the fourth embodiment shown in FIGS. 12 to 14 described above. In FIGS. 15 and 16, the same parts as those in the forms shown in FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0077] As shown in FIGS. 15 and 16, the article 30 with an IC chip includes a substrate 40 with an antenna and an electrode pair 60 to which an IC chip is connected or capacitively coupled and which is connected to the substrate 40 with an antenna. Among these, the substrate 40 with an antenna has a first substrate 41, a pair of antennas 42 on the first substrate 41, and a loop conductor 20 disposed on the first substrate 41 and directly connected to the pair of antennas 42. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second substrate 61, a connection terminal 62 on the second substrate 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop conductor 20 of the substrate 40 with an antenna via the connection terminal 62.

[0078] In this embodiment, the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the surface of the first substrate 41 opposite to the loop conductor 20 and the antenna 42. That is, the first substrate 41 is interposed between the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop conductor 20. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is joined to the first substrate 41 by an adhesive layer 63 with the IC chip 12 facing the first substrate 41 side. In this embodiment, the loop conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop conductor 20 may be thicker than the thickness of the antenna 42.

[0079] (Sixth Embodiment) Next, with reference to FIGS. 17 and 18, a sixth embodiment will be described. FIGS. 17 and 18 are diagrams showing an article with an IC chip according to this embodiment. The sixth embodiment shown in FIGS. 17 and 18 is different in that the loop conductor 20 is composed of a first printed layer 32 and a second printed layer 33, and other configurations are substantially the same as those of the fourth embodiment shown in FIGS. 12 to 14 described above. In FIGS. 17 and 18, the same parts as those in the forms shown in FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0080] As shown in FIGS. 17 and 18, the article 30 with an IC chip includes a substrate 40 with an antenna and an electrode pair 60 to which an IC chip connected or capacitively coupled to the substrate 40 with an antenna is connected. Among these, the substrate 40 with an antenna has a first substrate 41, a pair of antennas 42 on the first substrate 41, and a loop conductor 20 disposed on the first substrate 41 and directly connected to the pair of antennas 42. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second substrate 61, a connection terminal 62 on the second substrate 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop conductor 20 of the substrate 40 with an antenna via the connection terminal 62.

[0081] In this embodiment, the antenna 42 is composed of a single first printing layer 32, and the loop conductor 20 includes the first printing layer 32 and a second printing layer 33 positioned above the first printing layer 32. As a result, the thickness T2 of the loop conductor 20 is greater than the thickness T5 of the antenna 42. In this case, the first printing layer 32 may be formed by printing a conductive ink containing particles such as carbon. Also, the second printing layer 33 may use a material having a lower volume resistivity than the first printing layer 32. Thus, since the loop conductor 20 is composed of the first printing layer 32 and the second printing layer 33, the loop conductor 20 and the antenna 42 can be formed at low cost, and the loop conductor 20 can be made to have a lower resistance than the antenna 42. Note that in FIG. 18, the planar shape of the adhesive layer 63 is smaller than the planar shape of the second base material 61, but the present invention is not limited to this, and the planar shape of the adhesive layer 63 may be the same as the planar shape of the second base material 61. Also, the second printing layer 33 may be positioned below the first printing layer 32.

[0082] (Seventh Embodiment) Next, with reference to FIGS. 19 and 20, the seventh embodiment will be described. FIGS. 19 and 20 are diagrams showing an article with an IC chip according to this embodiment. The seventh embodiment shown in FIGS. 19 and 20 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled is positioned on the opposite side of the loop conductor 20, and other configurations are substantially the same as those of the sixth embodiment shown in FIGS. 17 and 18 described above. In FIGS. 19 and 20, the same parts as those in the forms shown in FIGS. 17 and 18 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0083] As shown in FIGS. 19 and 20, the article 30 with an IC chip includes a substrate 40 with an antenna and an electrode pair 60 to which an IC chip is connected or capacitively coupled and which is connected to the substrate 40 with an antenna. Among these, the substrate 40 with an antenna has a first substrate 41, a pair of antennas 42 on the first substrate 41, and a loop-shaped conductor 20 disposed on the first substrate 41 and directly connected to the pair of antennas 42. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second substrate 61, a connection terminal 62 on the second substrate 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the substrate 40 with an antenna via the connection terminal 62.

[0084] In the present embodiment, the antenna 42 is composed of a single first printed layer 32, and the loop-shaped conductor 20 includes the first printed layer 32 and a second printed layer 33 located above the first printed layer 32. Also, the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the surface of the first substrate 41 opposite to the loop-shaped conductor 20 and the antenna 42. That is, the first substrate 41 is interposed between the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 20. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is joined to the first substrate 41 by an adhesive layer 63 with the IC chip 12 facing the first substrate 41 side. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42. Also, the second printed layer 33 may be located below the first printed layer 32.

[0085] (Eighth Embodiment) Next, referring to FIGS. 21 and 22, the eighth embodiment will be described. FIGS. 21 and 22 are diagrams showing an article with an IC chip according to this embodiment. The eighth embodiment shown in FIGS. 21 and 22 is different in that the thickness T2 of the loop conductor 20 is greater than the thickness T5 of the antenna 42, and other configurations are substantially the same as those of the fourth embodiment shown in FIGS. 12 to 14 described above. In FIGS. 21 and 22, the same reference numerals are given to the same parts as those in the forms shown in FIGS. 12 to 14, and detailed descriptions thereof are omitted.

[0086] As shown in FIGS. 21 and 22, the article 30 with an IC chip includes a substrate 40 with an antenna and an electrode pair 60 to which an IC chip is connected or capacitively coupled and which is connected to the substrate 40 with an antenna. Among these, the substrate 40 with an antenna has a first substrate 41, a pair of antennas 42 on the first substrate 41, and a loop conductor 20 disposed on the first substrate 41 and directly connected to the pair of antennas 42. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second substrate 61, a connection terminal 62 on the second substrate 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop conductor 20 of the substrate 40 with an antenna via the connection terminal 62.

[0087] In the present embodiment, the thickness T2 of the loop conductor 20 is greater than the thickness T5 of the antenna 42. The thickness T2 of the loop conductor 20 can be appropriately adjusted according to the required sheet resistance of the loop conductor 20, and the appropriate thickness T2 of the loop conductor 20 can be determined by the material, printing method, etc. As an example, the thickness T2 of the loop conductor 20 may be 0.1 μm or more and 50 μm or less, and the thickness T5 of the antenna 42 may be, for example, 0.1 μm or more and 50 μm or less. In this case, the thickness T2 of the loop conductor 20 may be, for example, 1.5 times or more and 3 times or less the thickness T5 of the antenna 42. The loop conductor 20 and the antenna 42 are both printed layers formed by a method of printing conductive ink, and the loop conductor 20 may be formed thicker by printing than the antenna 42. For example, in this case, the loop conductor 20 and the antenna 42 are made of the same material, and the loop conductor 20 may be made thicker than the antenna 42 by overprinting or the like. In this case, since the thickness T5 of the antenna 42 can be made thin, the antenna 42 can be formed at low cost.

[0088] (Ninth Embodiment) Next, with reference to FIGS. 23 and 24, the ninth embodiment will be described. FIGS. 23 and 24 are diagrams showing an article with an IC chip according to the present embodiment. The ninth embodiment shown in FIGS. 23 and 24 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite side of the loop conductor 20, and the other configurations are substantially the same as those of the eighth embodiment shown in FIGS. 21 and 22 described above. In FIGS. 23 and 24, the same parts as those in the forms shown in FIGS. 21 and 22 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0089] As shown in FIGS. 23 and 24, the article 30 with an IC chip includes a substrate 40 with an antenna, and an electrode pair 60 connected to the substrate 40 with an antenna, to which an IC chip is connected or capacitively coupled. Among these, the substrate 40 with an antenna has a first substrate 41, a pair of antennas 42 on the first substrate 41, and a loop-shaped conductor 20 disposed on the first substrate 41 and directly connected to the pair of antennas 42. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second substrate 61, a connection terminal 62 on the second substrate 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the substrate 40 with an antenna via the connection terminal 62.

[0090] In the present embodiment, the thickness T2 of the loop-shaped conductor 20 is greater than the thickness T5 of the antenna 42. Also, the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the surface of the first substrate 41 opposite to the loop-shaped conductor 20 and the antenna 42. That is, the first substrate 41 is interposed between the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 20. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is joined to the first substrate 41 by an adhesive layer 63 with the IC chip 12 facing the first substrate 41 side. In the present embodiment, the loop-shaped conductor 20 and the antenna 42 are both printed layers formed by a method of printing conductive ink, and the loop-shaped conductor 20 may be formed thicker by printing than the antenna 42. For example, in this case, the loop-shaped conductor 20 and the antenna 42 may be made of the same material, and the loop-shaped conductor 20 may be made thicker than the antenna 42 by overprinting or the like.

[0091] (Tenth Embodiment) Next, referring to FIGS. 25 to 27, a tenth embodiment will be described. FIGS. 25 to 27 are diagrams showing an article with an IC chip according to this embodiment. The tenth embodiment shown in FIGS. 25 to 27 is different in that the article 30 with an IC chip is composed of a loop-shaped conductor 10 to which an IC chip is connected or capacitively coupled and a substrate 50 with an antenna, and the loop-shaped conductor 10 to which an IC chip is connected or capacitively coupled includes both a loop-shaped conductor 20 and an IC chip 12. Other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 25 to 27, the same parts as those in the forms shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0092] As shown in FIGS. 25 and 26, the article 30 with an IC chip according to this embodiment includes a substrate 50 with an antenna and a loop-shaped conductor 10 to which an IC chip is connected or capacitively coupled and which is connected to the substrate 50 with an antenna. The loop-shaped conductor 10 to which an IC chip is connected or capacitively coupled and the substrate 50 with an antenna are configured separately from each other, and the article 30 with an IC chip is configured by adhering these to each other.

[0093] The loop-shaped conductor 10 to which an IC chip is connected or capacitively coupled has a third substrate 11, a loop-shaped conductor 20 on the third substrate 11, and an IC chip 12 connected to the loop-shaped conductor 20. The loop-shaped conductor 10 to which an IC chip is connected or capacitively coupled is integrated with the substrate 50 with an antenna to form an article 30 with an IC chip that performs non-contact wireless communication with a reader / writer (not shown).

[0094] The third substrate 11 has a substantially rectangular shape in plan view. The third substrate 11 supports the loop-shaped conductor 20 and the IC chip 12, and a resin sheet (film) or a paper substrate can be used. As the resin sheet and the paper substrate, for example, those similar to those used for the first substrate 41 described above can be used.

[0095] The loop-shaped conductor 20 is laminated on the third substrate 11. Also, the IC chip 12 is laminated on the loop-shaped conductor 20.

[0096] The substrate 50 with an antenna has a first substrate 41 and a pair of antennas 42 on the first substrate 41. The pair of antennas 42 are coupled (capacitively coupled) to the loop conductor 20 via an adhesive layer 31. In the present embodiment, the loop conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop conductor 20 may be thicker than the thickness of the antenna 42.

[0097] The substrate 50 with an antenna and the loop conductor 10 to which the IC chip is connected or capacitively coupled are manufactured separately from each other and then connected via the adhesive layer 31. As the adhesive layer 31, for example, adhesives such as urethane-based adhesives, acrylic-based adhesives, styrene-butadiene copolymer-based adhesives, vinyl chloride-based adhesives, epoxy-based adhesives, and hot-melt adhesives can be used.

[0098] According to the present embodiment, the substrate 50 with an antenna and the loop conductor 10 to which the IC chip is connected or capacitively coupled are configured separately from each other, and by adhering these, an article 30 with an IC chip is manufactured. Thereby, when mounting the IC chip 12 to the antenna 42, high positional accuracy between the IC chip 12 and the antenna 42 is not required, and the article 30 with an IC chip can be easily manufactured.

[0099] Note that, as shown in FIG. 27, a protrusion 26 protruding outward in the plane direction may be provided at a portion of the loop conductor 20 that overlaps with the inner end portion 43 of the antenna 42. Thereby, the capacitive coupling between the protrusion 26 of the loop conductor 20 and the inner end portion 43 of the antenna 42 can be increased.

[0100] (11th Embodiment) Next, referring to FIGS. 28 to 30, the eleventh embodiment will be described. FIGS. 28 to 30 are diagrams showing an article with an IC chip according to this embodiment. The eleventh embodiment shown in FIGS. 28 to 30 is different in that the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled is located on the opposite side of the antenna 42, and other configurations are substantially the same as those of the tenth embodiment shown in FIGS. 25 to 27 described above. In FIGS. 28 to 30, the same parts as those in the form shown in FIGS. 25 to 27 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0101] As shown in FIGS. 28 and 29, the article 30 with an IC chip includes a substrate 50 with an antenna and a loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled and which is connected to the substrate 50 with an antenna. Among these, the substrate 50 with an antenna has a first substrate 41 and a pair of antennas 42 on the first substrate 41. The loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled has a third substrate 11, a loop-shaped conductor 20 on the third substrate 11, and an IC chip 12 connected to the loop-shaped conductor 20.

[0102] In this embodiment, the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled is located on the surface of the first substrate 41 opposite to the antenna 42. That is, the first substrate 41 is interposed between the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled and the antenna 42. In this case, the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled is joined to the first substrate 41 by an adhesive layer 31 with the IC chip 12 facing the first substrate 41 side. In this embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

[0103] Note that, as shown in FIG. 30, a protrusion 26 protruding outward in the plane direction may be provided at a portion of the loop-shaped conductor 20 that overlaps with the inner end 43 of the antenna 42. Thereby, the capacitive coupling between the protrusion 26 of the loop-shaped conductor 20 and the inner end 43 of the antenna 42 can be increased.

[0104] (Embodiment 12) Next, referring to FIGS. 31 and 32, Embodiment 12 will be described. FIGS. 31 and 32 are diagrams showing an article with an IC chip according to this embodiment. Embodiment 12 shown in FIGS. 31 and 32 is different in that the article 30 with an IC chip is composed of a substrate 50 with an antenna, an electrode pair 70 to which an IC chip is connected or capacitively coupled, and a loop conductor 80 to which an IC chip having a loop conductor 20 is connected or capacitively coupled. Other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 31 and 32, the same parts as those shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0105] As shown in FIGS. 31 and 32, the article 30 with an IC chip according to this embodiment includes a substrate 50 with an antenna, an electrode pair 70 to which an IC chip is connected or capacitively coupled and which is joined to the substrate 50 with an antenna, and a loop conductor 80 to which an IC chip is connected or capacitively coupled and which is joined to the electrode pair 70 to which an IC chip is connected or capacitively coupled. The substrate 50 with an antenna, the electrode pair 70 to which an IC chip is connected or capacitively coupled, and the loop conductor 80 to which an IC chip is connected or capacitively coupled are configured as separate bodies from each other, and the article 30 with an IC chip is configured by adhering these to each other. That is, the electrode pair 70 to which an IC chip is connected or capacitively coupled and the loop conductor 80 to which an IC chip is connected or capacitively coupled are integrated with the substrate 50 with an antenna to constitute the article 30 with an IC chip that performs non-contact wireless communication with a reader / writer (not shown).

[0106] The electrode pair 70 to which the IC chip is connected or capacitively coupled includes a fourth base material 71, connection terminals 72 on the fourth base material 71, and an IC chip 12 on the connection terminals 72. The fourth base material 71 has a substantially rectangular shape in plan view. The fourth base material 71 supports the IC chip 12, and a resin sheet (film) or a paper base material can be used. As the resin sheet and the paper base material, for example, the same materials as those used for the first base material 41 described above can be used. The connection terminals 72 are formed on the fourth base material 71 and may be composed of a metal foil conductive layer such as copper. Also, the IC chip 12 is attached on the connection terminals 72.

[0107] The loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled includes a fifth base material 81 and a loop-shaped conductor 20 on the fifth base material 81. The fifth base material 81 has a substantially rectangular shape in plan view. The fifth base material 81 supports the loop-shaped conductor 20, and a resin sheet (film) or a paper base material can be used. As the resin sheet and the paper base material, for example, the same materials as those used for the first base material 41 described above can be used. The loop-shaped conductor 20 is laminated on the fifth base material 81. The IC chip 12 of the electrode pair 70 to which the IC chip is connected or capacitively coupled is capacitively coupled to the loop-shaped conductor 20 via the connection terminals 72.

[0108] The base material 50 with an antenna includes a first base material 41 and a pair of antennas 42 on the first base material 41. The pair of antennas 42 are coupled (capacitively coupled) to the loop-shaped conductor 20 via an adhesive layer 73. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

[0109] The electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are manufactured separately from each other and then connected via the adhesive layer 83. Further, the base material 50 with an antenna, the electrode pair 70 to which the IC chip is connected or capacitively coupled, and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are connected via the adhesive layer 73. As the adhesive layers 73 and 83, for example, adhesives such as urethane adhesives, acrylic adhesives, styrene-butadiene copolymer adhesives, vinyl chloride adhesives, epoxy adhesives, and hot melt adhesives can be used.

[0110] According to the present embodiment, the base material 50 with an antenna, the electrode pair 70 to which the IC chip is connected or capacitively coupled, and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are configured separately from each other, and by adhering these, the article 30 with an IC chip is manufactured. Thereby, when mounting the IC chip 12 on the antenna 42, high positional accuracy between the IC chip 12 and the antenna 42 is not required, and the article 30 with an IC chip can be easily manufactured.

[0111] In this embodiment as well, a protrusion 26 protruding outward in the plane direction may be provided at a portion of the loop-shaped conductor 20 that overlaps with the inner end portion 43 of the antenna 42 (see FIGS. 27 and 30).

[0112] (13th Embodiment) Next, referring to FIGS. 33 and 34, the 13th embodiment will be described. FIGS. 33 and 34 are diagrams showing an article with an IC chip according to the present embodiment. The 13th embodiment shown in FIGS. 33 and 34 is different in that the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are located on the opposite side of the antenna 42, and other configurations are substantially the same as those of the 12th embodiment shown in FIGS. 31 and 32 described above. In FIGS. 33 and 34, the same parts as those in the form shown in FIGS. 31 and 32 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0113] As shown in FIGS. 33 and 34, the article 30 with an IC chip includes a substrate 50 with an antenna, an electrode pair 70 to which an IC chip joined to the substrate 50 with an antenna is connected or capacitively coupled, and a loop-shaped conductor 80 to which an IC chip joined to the electrode pair 70 to which the IC chip is connected or capacitively coupled is connected or capacitively coupled. Among these, the substrate 50 with an antenna has a first substrate 41 and a pair of antennas 42 on the first substrate 41. The electrode pair 70 to which the IC chip is connected or capacitively coupled has a fourth substrate 71, connection terminals 72 on the fourth substrate 71, and an IC chip 12 on the connection terminals 72. The loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled has a fifth substrate 81 and a loop-shaped conductor 20 on the fifth substrate 81.

[0114] In the present embodiment, the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are located on the surface of the first substrate 41 opposite to the antenna 42. That is, the first substrate 41 is interposed between the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled and the antenna 42. In this case, the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are connected via an adhesive layer 83. Further, the substrate 50 with an antenna and the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are connected via an adhesive layer 73. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

[0115] (The 14th embodiment) Next, with reference to FIGS. 35 and 36, a fourteenth embodiment will be described. FIGS. 35 and 36 are diagrams showing an article with an IC chip according to this embodiment. The fourteenth embodiment shown in FIGS. 35 and 36 is different in that the loop conductor 20 and the IC chip 12 are located on the opposite side of the antenna 42, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 35 and 36, the same parts as those shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0116] As shown in FIGS. 35 and 36, the article 30 with an IC chip includes a first base material 41, a pair of antennas 42 on the first base material 41, a loop conductor 20 disposed on the first base material 41, and an IC chip 12 connected to the loop conductor 20.

[0117] In this embodiment, the loop conductor 20 and the IC chip 12 are located on the surface of the first base material 41 opposite to the antenna 42. That is, the first base material 41 is interposed between the loop conductor 20 and the IC chip 12 and the antenna 42. In this case, the pair of antennas 42 are capacitively coupled to the loop conductor 20. Note that the pair of antennas 42 are connected to each other, but the present invention is not limited thereto, and the pair of antennas 42 may be separated from each other. In this embodiment, the loop conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop conductor 20 may be thicker than the thickness of the antenna 42.

[0118] (Fifteenth Embodiment) Next, with reference to FIGS. 37 and 38, a fifteenth embodiment will be described. FIGS. 37 and 38 are diagrams showing an article with an IC chip according to this embodiment. The fifteenth embodiment shown in FIGS. 37 and 38 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop conductor 20 are located on the opposite side of the antenna 42, and other configurations are substantially the same as those of the fourth embodiment shown in FIGS. 12 to 14 described above. In FIGS. 37 and 38, the same parts as those shown in FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0119] As shown in FIGS. 37 and 38, the article 30 with an IC chip includes a substrate 40 with an antenna, and an electrode pair 60 to which an IC chip is connected or capacitively coupled and which is connected to the substrate 40 with an antenna. Among these, the substrate 40 with an antenna has a first substrate 41, a pair of antennas 42 on the first substrate 41, and a loop-shaped conductor 20 disposed on the first substrate 41. The electrode pair 60 to which an IC chip is connected or capacitively coupled has a second substrate 61, connection terminals 62 on the second substrate 61, and an IC chip 12 on the connection terminals 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the substrate 40 with an antenna via the connection terminals 62. Also, the pair of antennas 42 are capacitively coupled to the loop-shaped conductor 20 of the substrate 40 with an antenna.

[0120] In the present embodiment, the electrode pair 60 to which an IC chip is connected or capacitively coupled and the loop-shaped conductor 20 are located on the surface of the first substrate 41 opposite to the side of the antenna 42. That is, the first substrate 41 is interposed between the electrode pair 60 to which an IC chip is connected or capacitively coupled and the loop-shaped conductor 20 and the antenna 42. In this case, the electrode pair 60 to which an IC chip is connected or capacitively coupled is joined to the first substrate 41 and the loop-shaped conductor 20 by an adhesive layer 63 with the IC chip 12 facing the first substrate 41 side. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Also, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

[0121] It is also possible to appropriately combine a plurality of components disclosed in the above-described embodiments and each modification as necessary. Alternatively, some components may be deleted from all the components shown in the above-described embodiments and each modification.

Description of Reference Numerals

[0122] 12 IC chip 20 Loop-shaped conductor 30 Article with an IC chip 41 First substrate 42 Antenna 43 Inner End 44 Antenna Wiring Section

Claims

1. A first substrate, an antenna on the first substrate, a loop-shaped conductor connected or capacitively coupled to the antenna, and an IC chip connected or capacitively coupled to the loop-shaped conductor, wherein the loop-shaped conductor includes a material having a lower volume resistivity than the material of the antenna, and the loop-shaped conductor and the antenna are in contact on the same surface of the first substrate, an article with an IC chip.

2. A first substrate, an antenna on the first substrate, a loop-shaped conductor connected or capacitively coupled to the antenna, and an IC chip connected or capacitively coupled to the loop-shaped conductor, wherein the thickness of the loop-shaped conductor is greater than the thickness of the antenna, and the loop-shaped conductor and the antenna are in contact on the same surface of the first substrate, an article with an IC chip.

3. The antenna is composed of a first printed layer, and the loop-shaped conductor includes the first printed layer and a second printed layer located above or below the first printed layer, the article with an IC chip according to Claim 1 or 2.

4. The antenna and the loop-shaped conductor are made of the same material, the article with an IC chip according to Claim 2.

5. Composed of an electrode pair to which an IC chip is connected or capacitively coupled and a substrate with an antenna, the electrode pair to which the IC chip is connected or capacitively coupled has a second substrate and the IC chip, and the substrate with an antenna has the first substrate, the antenna, and the loop-shaped conductor, the article with an IC chip according to any one of Claims 1 to 4.

6. The electrode pair to which the IC chip is connected or capacitively coupled is located on a surface opposite to the loop-shaped conductor and the antenna with respect to the first substrate, the article with an IC chip according to Claim 5.

7. Composed of a loop-shaped conductor to which an IC chip is connected or capacitively coupled and a substrate with an antenna, the loop-shaped conductor to which the IC chip is connected or capacitively coupled has a third substrate, the loop-shaped conductor, and the IC chip, and the substrate with an antenna has the first substrate and the antenna, the article with an IC chip according to Claim 1 or 2.

8. The loop-shaped conductor to which the IC chip is connected or capacitively coupled is located on a surface opposite to the antenna with respect to the first substrate, the article with an IC chip according to Claim 7. **Claim 9**: An article with an IC chip, comprising an electrode pair to which the IC chip is connected or capacitively coupled, a loop conductor to which the IC chip is connected or capacitively coupled, and a substrate with an antenna. The electrode pair to which the IC chip is connected or capacitively coupled has a fourth substrate and the IC chip. The loop conductor to which the IC chip is connected or capacitively coupled has a fifth substrate and the loop conductor. The substrate with an antenna has the first substrate and the antenna, and is the article with an IC chip according to any one of claims 1 to 4. **Claim 10**: The article with an IC chip according to claim 9, wherein the electrode pair to which the IC chip is connected or capacitively coupled and the loop conductor are located on a surface of the first substrate opposite to the surface of the antenna. **Claim 11**: The article with an IC chip according to claim 1 or 2, wherein the loop conductor and the IC chip are located on a surface of the first substrate opposite to the surface of the antenna. **Claim 12**: The article with an IC chip according to claim 5, wherein the loop conductor and the electrode pair to which the IC chip is connected or capacitively coupled are located on a surface of the first substrate opposite to the surface of the antenna. **Claim 13**: The article with an IC chip according to any one of claims 1 to 12, which is an RFID tag. **Claim 14**: The article with an IC chip according to any one of claims 1 to 12, which is a packaging material. **Claim 15**: A method for manufacturing an article with an IC chip, comprising: preparing a first substrate; forming an antenna on the first substrate; connecting or capacitively coupling a loop conductor to the antenna; and connecting or capacitively coupling an IC chip to the loop conductor, wherein the loop conductor contains a material with a lower volume resistivity than the material of the antenna, and the loop conductor and the antenna are in contact on the same surface of the first substrate. **Claim 16**: A method for manufacturing an article with an IC chip, comprising: preparing a first substrate; forming an antenna on the first substrate; connecting or capacitively coupling a loop conductor to the antenna; and connecting or capacitively coupling an IC chip to the loop conductor, wherein the thickness of the loop conductor is greater than the thickness of the antenna, and the loop conductor and the antenna are in contact on the same surface of the first substrate. **Claim 17**: The method for manufacturing an article with an IC chip according to claim 15 or 16, wherein the antenna is formed by printing. The manufacturing method of the article with an IC chip according to claim 15 or 16, wherein the antenna and the loop-shaped conductor are each formed by printing.

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