Substrate Transfer Method and Substrate Transfer Device

Abstract

This substrate conveyance method is for a conveyance device having a conveyance chamber and a buffer chamber. The conveyance chamber is provided with a conveyance mechanism having two forks, on an upper side and a lower side, capable of supporting a substrate. The buffer chamber is connected to the conveyance chamber, and is provided with: a mounting unit capable of mounting a substrate by contacting a part of the substrate; and, below the mounting unit, a plurality of pins capable of supporting the substrate by being raised and lowered. In the substrate conveyance method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate mounted on the mounting unit is lifted up by the upper fork. In the substrate conveyance method, the plurality of pins are raised while the first substrate is lifted up by the upper fork, and the second substrate supported by the lower fork is lifted up by the plurality of pins. In the substrate conveyance method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted up by the plurality of pins.

Description

Technical Field

[0001] The present disclosure relates to a substrate transfer method and a substrate transfer apparatus.

Background Art

[0002] Patent Document 1 discloses a technique in which a first transfer arm and a second transfer arm that can operate individually are provided in a transfer chamber, the first transfer arm receives a processed substrate from a processing chamber, and the second transfer arm transfers an unprocessed substrate to the processing chamber.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a substrate transfer method and a substrate transfer apparatus capable of shortening the time required for substrate replacement.

Means for Solving the Problems

[0005] A substrate transfer method according to an aspect of the present disclosure is a substrate transfer method of a transfer device having a transfer chamber and a buffer chamber. The transfer chamber is provided with a transfer mechanism having two forks capable of supporting a substrate, one above the other. The buffer chamber is provided with a placement portion capable of placing a substrate in contact with a part of the substrate, and a plurality of pins capable of lifting and supporting the substrate, which are provided below the placement portion and are connected to the transfer chamber. The substrate transfer method includes causing a transfer mechanism in a state of supporting a second substrate with a lower fork to enter a buffer chamber in which a first substrate is placed on the placement portion, and lifting the first substrate placed on the placement portion with an upper fork. The substrate transfer method includes, with the first substrate lifted by the upper fork, raising a plurality of pins to lift the second substrate supported by the lower fork with the plurality of pins. The substrate transfer method includes withdrawing the transfer mechanism from the buffer chamber with the second substrate lifted by the plurality of pins.

Advantages of the Invention

[0006] According to the present disclosure, the time required for substrate replacement can be shortened.

Brief Description of the Drawings

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] Embodiments of a substrate transfer method and a substrate transfer apparatus to be disclosed will be described in detail below with reference to the drawings. Note that the disclosed technology is not limited by the following embodiments.

[0009] The substrate processing system has a vacuum transfer chamber for transferring a substrate to a process module that performs substrate processing. The substrate processing system connects a load lock whose interior can be switched between a reduced pressure state and an atmospheric pressure state to the vacuum transfer chamber, and exchanges an unprocessed substrate and a processed substrate through the load lock. For example, a transfer mechanism such as a transfer arm is provided inside the vacuum transfer chamber. The transfer mechanism takes out a substrate from the load lock and transfers the taken-out substrate to a selected process module. Further, the transfer mechanism transfers the processed substrate to the next process module or the load lock.

[0010] In addition, the substrate processing system may be configured to connect a plurality of vacuum transfer chambers with a buffer chamber. In such a case, the transfer mechanism of each vacuum transfer chamber exchanges substrates through the buffer chamber.

[0011] In this way, when exchanging an unprocessed substrate and a processed substrate using a load lock or a buffer chamber, after taking out one substrate, the other substrate is placed, so the time required for substrate exchange becomes long.

[0012] Therefore, it is expected to shorten the time required for substrate exchange.

[0013] [Embodiment] [Configuration of Substrate Processing System 1] Embodiments will be described. First, the substrate processing system 1 according to the embodiment will be described. FIG. 1 is a plan view schematically showing an example of the substrate processing system 1 according to the embodiment. The substrate processing system 1 shown in FIG. 1 is a substrate processing system capable of performing various processes such as plasma processing on a substrate W such as a semiconductor wafer.

[0014] The substrate processing system 1 includes a processing system main body 10 and a control device 100 that controls the processing system main body 10. As shown in FIG. 1 for example, the processing system main body 10 includes vacuum transfer chambers 11a and 11b, a plurality of process modules 13, a plurality of load lock modules 14, and an EFEM (Equipment Front End Module) 15. In the following description, the vacuum transfer chambers 11a and 11b are also referred to as VTM (Vacuum Transfer Module) 11a and 11b, the process module 13 is referred to as PM (Process Module) 13, and the load lock module 14 is referred to as LLM (Load Lock Module) 14.

[0015] The VTMs 11a and 11b each have a substantially rectangular shape in plan view. A plurality of PMs 13 are connected to two opposing side surfaces of the VTMs 11a and 11b, respectively. Among the other two opposing side surfaces of the VTM 11a, an LLM 14 is connected to one side surface, and a buffer chamber 19 for connecting to the VTM 11b is connected to the other side surface. The VTM 11b is connected to the VTM 11a via the buffer chamber 19. The VTMs 11a and 11b have vacuum chambers that are set to a predetermined reduced pressure state. Inside the VTMs 11a and 11b, robot arms 12 (12a and 12b) are respectively arranged. In the present embodiment, the VTMs 11a and 11b, the LLM 14, the EFEM 15, and the buffer chamber 19 correspond to the substrate transfer device of the present disclosure.

[0016] The robot arms 12a and 12b are configured to be rotatable, extendable and retractable, and vertically movable. The robot arms 12a and 12b can transfer the substrate W between the PM 13, the LLM 14, and the buffer chamber 19 by placing the substrate W on the forks 230 arranged at the tips. The robot arms 12a and 12b and the robot arm 150 described later are an example of the transfer mechanism of the present disclosure.

[0017] The substrate processing system 1 is provided with a plurality of sensors for detecting the position of the substrate W. For example, for each LLM14, two sensors 121 are arranged above the position where the substrate W passes near the connection part between the LLM14 and the EFEM15. The two sensors 121 arranged for each LLM14 acquire sensing information regarding the substrate W when the robot arm 150 in the EFEM15 carries the substrate W into and out of the LLM14. Also, for each LLM14, two sensors 122 are arranged above the position where the substrate W passes near the connection part between the VTM11a and the LLM14. The two sensors 122 arranged for each LLM14 acquire sensing information regarding the substrate W when the robot arm 12a carries the substrate W into and out of the LLM14. Further, two sensors 123 are arranged above the position where the substrate W passes near the connection part between the VTM11a and the buffer chamber 19. The two sensors 123 acquire sensing information regarding the substrate W when the robot arm 12a carries the substrate W into and out of the buffer chamber 19. Also, two sensors 124 are arranged above the position where the substrate W passes near the connection part between the VTM11b and the buffer chamber 19. The two sensors 124 acquire sensing information regarding the substrate W when the robot arm 12b carries the substrate W into and out of the buffer chamber 19. Note that although two sensors 121 to 124 are provided respectively, three or more sensors may be provided respectively. The sensors 121 to 124 may have any arrangement position and configuration as long as they can detect the position of the substrate W. For example, the sensors 121 to 124 may be configured to detect the position of the substrate W from the side surface side.

[0018] PM13 has a processing chamber and has a cylindrical stage 130 (mounting table) disposed therein. The stage 130 has three thin rod-shaped lift pins 131 that can project from the upper surface. Each lift pin 131 is arranged on the same circumference in a plan view of the stage 130. Each lift pin 131 supports and lifts the substrate W placed on the stage 130 by projecting from the upper surface of the stage 130. Further, each lift pin 131 places the substrate W to be supported on the stage 130 by retracting into the stage 130. After the substrate W is placed on the stage 130, PM13 evacuates the inside, introduces a processing gas, further applies high-frequency power to the inside to generate plasma, and subjects the substrate W to plasma processing by the plasma. VTM11a, 11b and PM13 are partitioned by an openable and closable gate valve 132.

[0019] LLM14 is disposed between VTM11a and EFEM15. LLM14 has an internal pressure variable chamber whose inside can be switched between a predetermined reduced pressure state and an atmospheric pressure state, and has a cylindrical stage 140 disposed therein.

[0020] When carrying the substrate W from EFEM15 to VTM11a, LLM14 maintains the inside at atmospheric pressure, receives the substrate W from EFEM15, and then evacuates the inside and carries the substrate W into VTM11a. When carrying the substrate W out from VTM11a to EFEM15, LLM14 maintains the inside in a reduced pressure state, receives the substrate W from VTM11a, and then increases the pressure to atmospheric pressure and carries the substrate W into EFEM15. The stage 140 has three thin rod-shaped lift pins 141 that can project from the upper surface. Each lift pin 141 is arranged on the same circumference in a plan view. Each lift pin 141 supports and lifts the substrate W by projecting from the upper surface of the stage 140. Further, each lift pin 141 places the substrate W to be supported on the stage 140 by retracting into the stage 140. LLM14 and VTM11a are partitioned by an openable and closable gate valve 142. Also, LLM14 and EFEM15 are partitioned by an openable and closable gate valve 143.

[0021] The EFEM 15 is arranged to face the VTM 11a. The EFEM 15 is in the shape of a rectangular parallelepiped, is equipped with an FFU (Fan Filter Unit), and is an air conveyance chamber maintained in an atmospheric pressure atmosphere. Two LLM 14s are connected to one side surface along the longitudinal direction of the EFEM 15. Four load ports (LP: Load Port) 16 are connected to the other side surface along the longitudinal direction of the EFEM 15. A FOUP (Front-Opening Unified Pod) (not shown), which is a container for accommodating a plurality of substrates W, is placed on the LP 16. An aligner 17 and an MTP (Mapping temporary Port) 18 are connected to one side surface along the short side direction of the EFEM 15. Also, a robot arm 150 is arranged inside the EFEM 15.

[0022] The robot arm 150 is configured to be movable along a guide rail. Also, the robot arm 150 is configured in the same manner as the robot arm 12 and is configured to be able to turn, extend and contract, and move up and down. The robot arm 150 can convey the substrate W among the FOUP of the LP 16, the aligner 17, the MTP 18, and the LLM 14 by placing the substrate W on the fork 230 arranged at the tip. Note that the robot arm 150 only needs to be able to convey the substrate W among the FOUP, the aligner 17, the MTP 18, and the LLM 14, and is not limited to the configuration shown in FIG. 1.

[0023] The aligner 17 aligns the substrate W. The aligner 17 has a rotary stage (not shown) rotated by a drive motor (not shown). The rotary stage has a diameter smaller than, for example, the diameter of the substrate W and is configured to be rotatable with the substrate W placed on the upper surface. An optical sensor for detecting the outer peripheral edge of the substrate W is provided in the vicinity of the rotary stage. In the aligner 17, the optical sensor detects the center position of the substrate W and the direction of the notch with respect to the center of the substrate W, and the substrate W is delivered to the fork 230 so that the center position and the notch direction of the substrate W become a predetermined position and a predetermined direction. Thereby, in the LLM 14, the conveyance position of the substrate W is adjusted so that the center position and the notch direction of the substrate W become a predetermined position and a predetermined direction. Further, an MTP 18 is provided directly below the aligner 17, and the substrate W can be temporarily retracted.

[0024] The buffer chamber 19 is disposed between the VTM 11a and the VTM 11b. The buffer chamber 19 has a cylindrical stage 190 inside for delivering the substrate W between the VTM 11a and the VTM 11b. The stage 190 has three lift pins 191 in the form of thin rods that can project from the upper surface. Each lift pin 191 is arranged on the same circumference in a plan view. Each lift pin 191 supports and lifts the substrate W by projecting from the upper surface of the stage 190. Further, each lift pin 191 places the substrate W supported thereon on the stage 190 by retracting into the stage 190.

[0025] The substrate processing system 1 has a control device 100. The control device 100 controls the operation of the substrate processing system 1. For example, the control device 100 controls the operations of the robot arms 12 and 150, the opening and closing of the gate valves 142 and 143, the raising and lowering of each lift pin 141 of the LLM 14, and the raising and lowering of each lift pin 191 of the buffer chamber 19. The control device 100 is, for example, a computer and includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device and controls the operations of the respective components of the substrate processing system 1. In the present embodiment, the control device 100 corresponds to the control unit of the present disclosure.

[0026] [Configuration of Robot Arms 12 and 150] Next, an example of the configuration of the robot arms 12 and 150 according to the embodiment will be described. In the present embodiment, the case where the robot arms 12 (12a, 12b) and 150 are multi-joint robots having the same configuration will be described as an example. Hereinafter, the configuration of the robot arm 12 will be described as an example. FIG. 2 is a perspective view showing an example of the configuration of the robot arm 12 according to the embodiment. In FIG. 2, the reference numerals of the respective components constituting the robot arm 12 are indicated in the 200s. Further, in FIG. 2, for the respective components constituting the robot arm 12, the reference numerals in the 300s are shown in parentheses when the robot arm 150 is considered.

[0027] The robot arm 12 has an arm portion 200 and a base portion 201. The base portion 201 supports the arm portion 200. The arm portion 200 is rotatably attached to the base portion 201.

[0028] The arm portion 200 is configured as a multi-joint arm in which a plurality of arms are connected by joint portions. The arm portion 200 according to the embodiment has a first arm 211, a second arm 212, and third arms 213 and 214.

[0029] One end of the first arm 211 is attached to the base portion 201. The base portion 201 is provided with a first joint portion 221 that rotatably supports the first arm 211. One end of the second arm 212 is attached to the other end of the first arm 211. The other end of the first arm 211 is provided with a second joint portion 222 that rotatably supports the second arm 212. One end of the third arm 213 is attached to the other end of the second arm 212. The other end of the second arm 212 is provided with a third joint portion 223 that rotatably supports the third arm 213.

[0030] In the robot arm 12 according to the embodiment, two arms are provided on the tip side as the third arms 213, 214, and one ends of the third arms 213, 214 are supported so as to overlap at the third joint portion 223. Hereinafter, among the two third arms 213, 214, the upper third arm 213 is referred to as the upper arm 213, and the lower third arm 214 is referred to as the lower arm 214. The robot arm 12 can individually rotate and drive the upper arm 213 and the lower arm 214 by the third joint portion 223.

[0031] Next, an example of the configuration of the third arms 213, 214 according to the embodiment will be described. The third arms 213, 214 have the same configuration. FIG. 3 is a plan view showing an example of the configuration of the third arms 213, 214 according to the embodiment. In FIG. 3, the reference numerals of the respective components constituting the third arms 213, 214 of the robot arm 12 are indicated in the 200s. Further, in FIG. 3, for the respective components constituting the third arms 213, 214, the reference numerals in the 300s are shown in parentheses in the case of the third arms 313, 314 of the robot arm 150.

[0032] The third arms 213, 214 (upper arm 213, lower arm 214) are provided with a fork 230. The fork 230 has a Y shape in which the tip side branches into two support portions 231 and supports the substrate W. The robot arm 12 supports and conveys the substrate W by the fork 230.

[0033] As described above, the robot arm 150 has the same configuration as the robot arm 12. When explaining the robot arm 150 below, the operations will be described using the numbers in the 300s shown in parentheses in FIGS. 2 and 3.

[0034] Note that the configurations of the robot arms 12 and 150 are merely examples and are not limited thereto. The robot arms 12a and 12b only need to be able to transfer the substrate W between the PM13, the LLM14, and the buffer chamber 19, and are not limited to the configurations shown in FIGS. 1 to 3. Also, the robot arm 150 only needs to be able to transfer the substrate W between the LLM14, the EFEM15, and the LP16, and is not limited to the configurations shown in FIGS. 1 to 3.

[0035] [Configuration of LLM14] Next, an example of the configuration of the LLM14 according to the embodiment will be described. FIG. 4 is a cross-sectional view schematically showing an example of the configuration of the LLM14 according to the embodiment. FIG. 5 is a plan view schematically showing an example of the configuration of the LLM14 according to the embodiment. The LLM14 is connected to the VTM11a and the EFEM15. A gate valve 142 is provided at the connection portion of the LLM14 with the VTM11a, and a gate valve 143 is provided at the connection portion of the LLM14 with the EFEM15. The LLM14 can switch the inside between a depressurized state and an atmospheric state by closing the gate valves 142 and 143 to depressurize the inside.

[0036] A stage 140 is provided inside the LLM14. The stage 140 is provided with a cooling mechanism such as a flow path through which a refrigerant flows inside, and the substrate W placed on the stage 140 can be cooled. Three lift pins 141 that can move up and down to support the substrate W are provided on the stage 140. Also, a placement portion 145 on which the substrate W can be placed is provided above the stage 140 in the LLM14. FIG. 5 shows an example of the relationship between the arrangement positions of the three lift pins 141 and the placement portion 145 by illustrating the fork 230 of the robot arm 12.

[0037] The three lift pins 141 are provided so as to be able to pass between two support portions 231 of the fork 230 of the robot arm 12. Also, the three lift pins 141 are provided so as to be able to pass between two support portions 331 of the fork 330 for the robot arm 150. For example, the three lift pins 141 are provided on the same circumference near the center of the stage 140. The three lift pins 141 are provided in a range narrower than the inside of the two support portions 231 of the fork 230 and the inside of the two support portions 331 of the fork 330. The LLM 14 supports the substrate W by raising the three lift pins 141.

[0038] The placement portion 145 contacts a part of the substrate W and supports the substrate W. In the LLM 14 according to the embodiment, two placement portions 145a and 145b are provided at intervals in the direction intersecting the direction of the gate valves 142 and 143 through which the substrate W passes. The interval between the placement portions 145a and 145b is narrower than the width of the substrate W and wider than the widths of the fork 230 of the robot arm 12 and the fork 330 of the robot arm 150. The placement portions 145a and 145b contact the ends of the placed substrate W respectively and support the substrate W.

[0039] [Configuration of Buffer Chamber 19] Next, an example of the configuration of the buffer chamber 19 according to the embodiment will be described. FIG. 6 is a cross-sectional view schematically showing an example of the configuration of the buffer chamber 19 according to the embodiment. FIG. 7 is a plan view schematically showing an example of the configuration of the buffer chamber 19 according to the embodiment. The buffer chamber 19 is connected to the VTMs 11a and 11b.

[0040] The buffer chamber 19 is provided with a stage 190 inside. The stage 190 is provided with three lift pins 191 that can move up and down to support the substrate W. Further, the buffer chamber 19 is provided with a placement portion 195 on the upper portion of the stage 140 where the substrate W can be placed. In FIG. 7, the fork 230 of the robot arm 12 is illustrated to show an example of the relationship between the arrangement positions of the three lift pins 191 and the placement portion 195.

[0041] The three lift pins 191 are provided so as to be able to pass between the two support portions 231 of the fork 230 of the robot arm 12. For example, the three lift pins 191 are provided on the same circumference near the center of the stage 190. The three lift pins 191 are provided in a range narrower than the inside of the two support portions 231 of the fork 230. The buffer chamber 19 supports the substrate W by raising the three lift pins 191.

[0042] Further, the buffer chamber 19 is provided with a placement portion 195 on the upper portion of the stage 140 where the substrate W can be placed. The placement portion 195 contacts a part of the substrate W to support the substrate W. In the buffer chamber 19 according to the embodiment, two placement portions 195a and 195b are provided at intervals in the intersecting direction with respect to the direction in which the substrate W passes. The interval between the placement portions 195a and 195b is narrower than the width of the substrate W and wider than the width of the fork 230 of the robot arm 12. The placement portions 195a and 195b contact the ends of the placed substrate W respectively to support the substrate W.

[0043] Based on the control of the control device 100, the substrate processing system 1 takes out the substrate W1 before processing from the FOUP by the robot arms 12 and 150 and conveys it to any one of the PM13s via the EFEM 15, LLM 14, VTM 11a, 11b, and buffer chamber 19. Further, based on the control of the control device 100, the substrate processing system 1 conveys the substrate W processed in the PM13 to the FOUP via the VTM 11a, 11b, buffer chamber 19, LLM 14, and EFEM 15 by the robot arms 12 and 150.

[0044] Based on the control of the control device 100, the substrate processing system 1 according to the embodiment performs the transfer of the substrate W1 before processing and the processed substrate W2 as follows in the LLM14 and the buffer chamber 19.

[0045] First, the flow of transferring the substrate W1 before processing and the processed substrate W2 in the LLM14 will be described. FIGS. 8A to 8G are diagrams for explaining the transfer flow in the LLM14 in the substrate processing system 1 according to the embodiment. FIGS. 8A to 8G show the flow of transferring the substrate W1 before processing and the processed substrate W2 between the LLM14 and the EFEM15. In FIGS. 8A to 8G, only the tip portion of the lift pin 141 is schematically illustrated. Also, in FIGS. 8A to 8G, when the interiors of the VTM11a and the LLM14 are in a depressurized state, a hatched pattern is shown inside the VTM11a and the LLM14.

[0046] In FIG. 8A, the LLM14 raises the lift pin 141 to support the processed substrate W2. The lift pin 141 has been raised to a height such that the distance between the lower surface of the processed substrate W2 being supported and the upper surface of the placement portion 145 is smaller than the distance of the gap between the upper arm 313 and the lower arm 314 of the robot arm 150. The LLM14 closes the gate valves 142 and 143 and switches the interior to the atmospheric state. The VTM11a is depressurized and its interior is in a predetermined depressurized state. The interior of the EFEM15 is in the atmospheric pressure state. In the EFEM15, the substrate W1 before processing is taken out from the FOUP placed on the LP16, and the substrate W1 before processing is supported by the upper arm 313 of the robot arm 150.

[0047] When the interior of the LLM14 becomes the atmospheric state, as shown in FIG. 8B, the gate valve 143 opens. As shown in FIG. 8C, the robot arm 150 causes the upper arm 313 and the lower arm 314 to enter the LLM14. The robot arm 150 causes the upper arm 313 and the lower arm 314 to enter at a height such that the upper surface of the upper arm 313 is higher than the upper surface of the placement portion 145 and the upper surface of the lower arm 314 is lower than the lower surface of the processed substrate W2 supported by the lift pin 141. In FIGS. 8B to 8F, the heights of the upper surfaces of the upper arm 313 and the lower arm 314 of the robot arm 150 when entering the LLM14 are indicated by lines H1 and H2.

[0048] When the upper arm 313 and the lower arm 314 enter the LLM14, the substrate W1 before processing passes through the detection region of the sensor 121. The sensor 121 outputs sensing information to the control device 100. The control device 100 specifies the placement position of the substrate W1 before processing on the upper arm 313 based on the sensing information obtained from the sensor 121 and the position information of the upper arm 313 of the robot arm 150. The position information of the upper arm 313 of the robot arm 150 is specified based on, for example, the lengths of the respective arms of the robot arm 150 and the angles of the respective joints. The robot arm 150 conveys the substrate W1 before processing on the upper arm 313 to a position above the predetermined placement position with respect to the placement portion 145.

[0049] As shown in FIG. 8D, the LLM14 lowers the lift pin 141 and places the processed substrate W2 supported by the lift pin 141 on the lower arm 314. As shown in FIG. 8E, the robot arm 150 lowers the upper arm 313 and the lower arm 314 and places the substrate W1 before processing supported by the upper arm 313 on the placement portion 145.

[0050] In this way, the substrate processing system 1 according to the embodiment can exchange the substrate W1 before processing and the processed substrate W2 by causing the upper arm 313 and the lower arm 314 of the robot arm 150 to enter the LLM14 once. Further, when the upper arm 313 and the lower arm 314 of the robot arm 150 enter the LLM14, the robot arm 150 conveys the substrate W1 before processing to a predetermined arrangement position with respect to the placement unit 145 based on sensing information obtained from the sensor 121 and the like. Thereby, the amount of deviation of the substrate W1 before processing from the predetermined arrangement position with respect to the placement unit 145 can be reduced.

[0051] After placing the substrate W1 before processing on the placement unit 145, the robot arm 150 withdraws the upper arm 313 and the lower arm 314 from the LLM14 as shown in FIG. 8F. After the upper arm 313 and the lower arm 314 are withdrawn, the gate valve 143 closes. The inside of the LLM14 is depressurized. The robot arm 150 conveys the processed substrate W2 supported by the lower arm 314 to the FOUP placed on the LP16 as shown in FIG. 8G.

[0052] FIGS. 9A to 9H are diagrams for explaining the flow of conveyance in the LLM14 in the substrate processing system 1 according to the embodiment. FIGS. 9A to 9H show the flow of conveying the substrate W1 before processing and the processed substrate W2 between the LLM14 and the VTM11a. In FIGS. 9A to 9H, the lift pins 141 are schematically illustrated only at the tip portions. Further, in FIGS. 9A to 9H, when the inside of the VTM11a and the LLM14 is in a depressurized state, a hatched pattern is indicated inside the VTM11a and the LLM14.

[0053] As shown in FIG. 9A, the inside of the LLM14 is depressurized until it reaches a predetermined depressurized state. The VTM11a is depressurized and its inside is in a predetermined depressurized state. The processed substrate W2 is placed on the lower arm 214 of the robot arm 12a.

[0054] When the interior of LLM14 reaches a predetermined reduced pressure state, as shown in FIG. 9B, the gate valve 142 opens. The robot arm 12a causes the upper arm 213 and the lower arm 214 to enter LLM14, as shown in FIG. 9C. The robot arm 12a causes the upper arm 213 and the lower arm 214 to enter LLM14 at a height where the upper surface of the upper arm 213 is lower than the upper surface of the placement portion 145. In FIGS. 9B to 9F, the heights of the upper surfaces of the upper arm 213 and the lower arm 214 of the robot arm 12a when entering LLM14 are indicated by lines H3 and H4.

[0055] When the upper arm 213 and the lower arm 214 enter LLM14, the processed substrate W2 passes through the detection region of the sensor 122. The sensor 122 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 122 and the position information of the lower arm 214 of the robot arm 12a. The position information of the lower arm 214 of the robot arm 12a is identified based on, for example, the lengths of the respective arms of the robot arm 12a and the angles of the respective joints. The robot arm 12a transports the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position with respect to the lift pin 141.

[0056] As shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the unprocessed substrate W1 placed on the placement portion 145 with the upper arm 213. As shown in FIG. 9E, LLM14 raises the lift pin 141 and lifts and supports the processed substrate W2 supported by the lower arm 214 with the lift pin 141.

[0057] As described above, the substrate processing system 1 according to the embodiment can exchange the substrate W1 before processing and the processed substrate W2 by causing the upper arm 213 and the lower arm 214 of the robot arm 12a to enter the LLM14 once. Further, when the upper arm 213 and the lower arm 214 of the robot arm 12a enter the LLM14, the robot arm 12a conveys the processed substrate W2 to a predetermined arrangement position with respect to the lift pins 141 based on sensing information obtained from the sensor 122 and the like. Thereby, the amount of deviation of the processed substrate W2 from the predetermined arrangement position with respect to the lift pins 141 can be reduced.

[0058] After supporting the substrate W1 before processing with the upper arm 213, the robot arm 12a withdraws the upper arm 213 and the lower arm 214 from the LLM14 as shown in FIG. 9F. After the upper arm 213 and the lower arm 214 are withdrawn, the gate valve 142 closes. As shown in FIG. 9G, the robot arm 12a conveys the substrate W1 before processing supported by the upper arm 213 to the PM13 that performs substrate processing or the buffer chamber 19. As shown in FIG. 9H, the LLM14 switches its interior to the atmospheric state, lowers the lift pins 141, places the processed substrate W2 on the stage 140, and cools the processed substrate W2 with the stage 140.

[0059] Thereafter, the LLM14 and the EFEM15 perform conveyance in the flow shown in FIGS. 8A to 8G described above, and exchange the processed substrate W2 and the next substrate W1 before processing.

[0060] During substrate processing in the PM13 or during conveyance by the robot arm 12, the processed substrate W2 may be displaced, and the arrangement position on the lower arm 214 may be displaced.

[0061] In the substrate processing system 1, the control device 100 specifies the placement position of the processed substrate W2 on the lower arm 214 based on sensing information and the like obtained from the sensor 122. The robot arm 12a conveys the processed substrate W2 to a position above the predetermined placement position with respect to the lift pin 141. For this reason, for example, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned, the positions of the upper arm 213 and the lower arm 214 when the robot arm 12a conveys the substrate W2 above the lift pin 141 are misaligned by the amount of the misalignment. In this state, when the robot arm 12a raises the upper arm 213 and the lower arm 214 as shown in FIG. 9D, a misalignment occurs in the placement position of the substrate W1 before processing on the upper arm 213. When the placement position of the substrate W1 before processing on the upper arm 213 is shifted, there is a risk of collision with members (for example, gate valves 142 and 143) around the conveyance path when conveying the substrate W1 before processing, or a misalignment may occur in the placement position at the conveyance destination.

[0062] Therefore, when the substrate processing system 1 exchanges the substrate W1 before processing and the substrate W2 after processing between the LLM 14 and the VTM 11a, it corrects the misalignment. For example, in FIG. 9C, the robot arm 12a moves the upper arm 213 to a position where there is no misalignment with respect to the substrate W1 before processing placed on the placement unit 145. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the substrate W1 before processing placed on the placement unit 145 with the upper arm 213.

[0063] The robot arm 12a moves the lower arm 214 according to the positional deviation in a state where the substrate W1 before processing is lifted, and corrects the position of the processed substrate W2 with respect to the lift pin 141. For example, the robot arm 12a moves the lower arm 214 by the amount of the positional deviation to correct the position of the processed substrate W2 with respect to the lift pin 141. For example, the robot arm 12a conveys the processed substrate W2 on the lower arm 214 to a position above a predetermined arrangement position with respect to the lift pin 141. Thereafter, as shown in FIG. 9E, the LLM 14 raises the lift pin 141 and lifts and supports the processed substrate W2 with the lift pin 141.

[0064] Thereby, the substrate processing system 1 can convey the substrate W1 before processing and the processed substrate W2 without generating a positional deviation. Thereby, the robot arms 12 and 150 can stably and accurately convey the substrate W1 before processing and the processed substrate W2. Further, when the robot arms 12 and 150 convey the substrate W1 before processing and the processed substrate W2, it is possible to suppress contact with the gate valves 142, 143, etc.

[0065] Note that the substrate processing system 1 may correct the positional deviation when the arrangement position of the processed substrate W2 on the lower arm 214 is displaced by an amount equal to or greater than the allowable value. The allowable value is determined according to the amount of displacement of the arrangement position of the substrate W allowed by the substrate processing system 1. For example, the allowable value is set to the amount of displacement of the arrangement position of the substrate W allowed by the conveyance path and the conveyance destination.

[0066] For example, in the substrate processing system 1, the control device 100 specifies the placement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 122 or the like. The control device 100 determines whether or not the placement position of the specified substrate W2 is deviated by an amount equal to or greater than the allowable value. When the placement position of the substrate W2 is deviated by an amount equal to or greater than the allowable value, the substrate processing system 1 corrects the deviation when exchanging the substrate W1 before processing and the processed substrate W2. For example, in the case of FIG. 9C, the robot arm 12a moves the upper arm 213 to a position where there is no deviation with respect to the substrate W1 before processing placed on the placement unit 145. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the substrate W1 before processing placed on the placement unit 145 with the upper arm 213. The robot arm 12a moves the lower arm 214 according to the deviation in a state where the substrate W1 before processing is lifted, and corrects the position of the processed substrate W2 with respect to the lift pin 141. As shown in FIG. 9E, the LLM 14 raises the lift pin 141, and lifts and supports the processed substrate W2 with the lift pin 141. The substrate transfer method of transferring the substrate while correcting the deviation in this way is hereinafter referred to as the first transfer method. By the first transfer method, although the time required for the exchange slightly increases because the substrate processing system 1 corrects the position of the substrate W2, the substrate W1 before processing and the processed substrate W2 can be transferred without causing a deviation.

[0067] On the other hand, when the displacement of the placement position of the processed substrate W2 on the lower arm 214 is smaller than the allowable value, the robot arm 12a moves the lower arm 214 to a position where there is no displacement with respect to the lift pin 141 for the processed substrate W2 on the lower arm 214 at the time of FIG. 9C. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the substrate W1 before processing placed on the placement portion 145 with the upper arm 213. The robot arm 12a maintains its posture while lifting the substrate W1 before processing and maintains the position of the lower fork without changing it. As shown in FIG. 9E, the LLM 14 raises the lift pin 141 and lifts and supports the processed substrate W2 with the lift pin 141. Thereby, although displacement occurs in the placement position of the substrate W1 before processing on the upper arm 213, the substrate W1 before processing and the processed substrate W2 can be quickly transported.

[0068] Further, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned, the substrate processing system 1 may correct the misalignment as follows. When the placement position of the processed substrate W2 on the lower arm 214 is misaligned, the robot arm 12a moves the upper arm 213 and the lower arm 214 according to the misalignment to correct the position of the processed substrate W2 with respect to the lift pin 141. For example, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than the allowable value, the robot arm 12a moves the upper arm 213 and the lower arm 214 to a position where the misalignment of the processed substrate W2 with respect to the lift pin 141 is smaller than the allowable value. For example, the robot arm 12a moves the upper arm 213 and the lower arm 214 so that the midpoint of the misalignment of the processed substrate W on the lower arm 214 coincides with the reference position for placing the substrate W2 with respect to the lift pin 141. Specifically, the control device 100 obtains a line segment connecting the center position of the misaligned substrate W2 on the lower arm 214 and the center position of the substrate W2 when there is no misalignment. The robot arm 12a moves the upper arm 213 and the lower arm 214 so that any position on the line segment coincides with the reference position for placing the substrate W2 with respect to the lift pin 141. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the substrate W1 before processing placed on the placement portion 145 with the upper arm 213. As shown in FIG. 9E, the LLM 14 raises the lift pin 141 and lifts and supports the processed substrate W2 supported by the lower arm 214 with the lift pin 141. The substrate transfer method of transferring the substrate while correcting the misalignment in this way is hereinafter referred to as the second transfer method. In the case of the second transfer method, misalignments equal to or less than the allowable value occur in the substrate W1 before processing and the processed substrate W2, but the substrates W1 and W2 can be exchanged quickly.

[0069] Next, the flow of transporting the substrate W1 before processing and the processed substrate W2 in the buffer chamber 19 will be described. FIGS. 10A to 10E are diagrams for explaining the flow of transportation in the buffer chamber 19 in the substrate processing system 1 according to the embodiment. FIGS. 10A to 10E show the flow of transporting the substrate W1 before processing and the processed substrate W2 between the buffer chamber 19 and the VTM 11a. In FIGS. 10A to 10E, only the tip portion of the lift pin 191 is schematically illustrated.

[0070] In FIG. 10A, the buffer chamber 19 raises the lift pin 191 to support the processed substrate W2. The lift pin 191 is raised to a height such that the distance between the lower surface of the processed substrate W2 to be supported and the upper surface of the placement portion 195 is smaller than the distance between the upper arm 213 and the lower arm 214 of the robot arm 12a. In the VTM 11a, the substrate W1 before processing is supported on the upper arm 213 of the robot arm 12a.

[0071] As shown in FIG. 10B, the robot arm 12a causes the upper arm 213 and the lower arm 214 to enter the buffer chamber 19. The robot arm 12a causes the upper arm 213 and the lower arm 214 to enter at a height such that the upper surface of the upper arm 213 is higher than the upper surface of the placement portion 195 and the upper surface of the lower arm 214 is lower than the lower surface of the processed substrate W2 supported by the lift pin 191. In FIGS. 10A to 10E, the heights of the upper surfaces of the upper arm 213 and the lower arm 214 of the robot arm 12a when entering the buffer chamber 19 are indicated by lines H5 and H6.

[0072] When the upper arm 213 and the lower arm 214 of the robot arm 12a enter the buffer chamber 19, the substrate W1 before processing passes through the detection area of the sensor 123. The sensor 123 outputs sensing information to the control device 100. Based on the sensing information obtained from the sensor 123 and the position information of the upper arm 213 of the robot arm 12a, the control device 100 identifies the placement position of the substrate W1 before processing on the upper arm 213. The position information of the upper arm 213 of the robot arm 12a is identified based on, for example, the lengths of the respective arms of the robot arm 12a and the angles of the respective joints. The robot arm 12a conveys the substrate W1 before processing on the upper arm 213 to a position above a predetermined placement position with respect to the placement unit 195.

[0073] As shown in FIG. 10C, the buffer chamber 19 lowers the lift pins 191 and places the processed substrate W2 supported by the lift pins 191 on the lower arm 214. As shown in FIG. 10D, the robot arm 12a lowers the upper arm 213 and the lower arm 214 and places the substrate W1 before processing supported by the upper arm 213 on the placement unit 195.

[0074] In this way, the substrate processing system 1 according to the embodiment can exchange the substrate W1 before processing and the processed substrate W2 by causing the upper arm 213 and the lower arm 214 of the robot arm 12a to enter the buffer chamber 19 once.

[0075] After placing the substrate W1 before processing on the placement unit 195, the robot arm 12a withdraws the upper arm 213 and the lower arm 214 from the buffer chamber 19 as shown in FIG. 10E.

[0076] FIGS. 11A to 11E are diagrams for explaining the flow of conveyance in the buffer chamber 19 in the substrate processing system 1 according to the embodiment. FIGS. 11A to 11E show the flow of conveying the substrate W1 before processing and the processed substrate W2 between the buffer chamber 19 and the VTM 11b. In FIGS. 11A to 11E, the lift pins 191 are only schematically illustrated at the tip portions.

[0077] As shown in Fig. 11A, the buffer chamber 19 has a substrate W1 before processing placed on the placement portion 195. The robot arm 12b has a processed substrate W2 placed on the lower arm 214.

[0078] As shown in Fig. 11B, the robot arm 12b causes the upper arm 213 and the lower arm 214 to enter the buffer chamber 19. The robot arm 12b causes the upper arm 213 and the lower arm 214 to enter the buffer chamber 19 at a height where the upper surface of the upper arm 213 is lower than the upper surface of the placement portion 195. In Figs. 11A to 11E, the heights of the upper surfaces of the upper arm 213 and the lower arm 214 of the robot arm 12b when entering the buffer chamber 19 are indicated by lines H7 and H8.

[0079] When the upper arm 213 and the lower arm 214 enter the buffer chamber 19, the processed substrate W2 passes through the detection region of the sensor 124. The sensor 124 outputs sensing information to the control device 100. The control device 100 specifies the arrangement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 124 and the position information of the lower arm 214 of the robot arm 12b. The position information of the lower arm 214 of the robot arm 12b is specified based on, for example, the lengths of the respective arms of the robot arm 12b and the angles of the respective joints. The robot arm 12b conveys the processed substrate W2 on the lower arm 214 to a position above a predetermined arrangement position with respect to the lift pin 191.

[0080] As shown in Fig. 11C, the robot arm 12b raises the upper arm 213 and the lower arm 214, and lifts and supports the substrate W1 before processing placed on the placement portion 195 with the upper arm 213. As shown in Fig. 11D, the buffer chamber 19 raises the lift pin 191 and lifts and supports the processed substrate W2 supported by the lower arm 214 with the lift pin 191.

[0081] In this way, the substrate processing system 1 according to the embodiment can exchange the substrate W1 before processing and the processed substrate W2 by causing the upper arm 213 and the lower arm 214 of the robot arm 12b to enter the buffer chamber 19 once.

[0082] After supporting the substrate W1 before processing with the upper arm 213, the robot arm 12b withdraws the upper arm 213 and the lower arm 214 from the buffer chamber 19 as shown in FIG. 11E. The robot arm 12b conveys the substrate W1 before processing supported by the upper arm 213 to the PM13 where substrate processing is performed and performs substrate processing. The buffer chamber 19 and the TM11a perform conveyance in the flow shown in FIGS. 10A to 10E described above, and exchange the processed substrate W2 and the next substrate W1 before processing.

[0083] By the way, as described above, the processed substrate W2 may be displaced during substrate processing in the PM13 or during conveyance by the robot arm 12, and the arrangement position on the lower arm 214 may be displaced. When exchanging the substrate W1 before processing and the processed substrate W2 between the buffer chamber 19 and the VTM11b, the substrate processing system 1 may correct the displacement in the same manner as when exchanging the substrates W1 and W2 between the LLM14 and the VTM11a described above.

[0084] [Substrate Conveyance Method] Next, the processing flow of the substrate conveyance method according to the present embodiment will be described. FIG. 12 is a flowchart showing an example of the processing flow of the substrate conveyance method according to the embodiment. In FIG. 12, as shown in FIGS. 8A to 8G, the case of conveying the substrate W1 before processing and the processed substrate W2 between the LLM14 and the EFEM15 will be described as an example.

[0085] In the LLM14, the lift pins 141 are raised to support the processed substrate W2. The robot arm 150 supports the substrate W1 before processing with the upper arm 313.

[0086] The control device 100 controls the LLM 14 and the gate valve 143 to switch the inside of the LLM 14 to the atmospheric state and open the gate valve 143 (step S10).

[0087] The control device 100 controls the robot arm 150 to move the upper arm 313 and the lower arm 314 into the LLM 14 (step S11). When the upper arm 313 and the lower arm 314 enter the LLM 14, the sensor 121 outputs sensing information to the control device 100. Based on the sensing information obtained from the sensor 121 and the position information of the upper arm 313 of the robot arm 150, the control device 100 identifies the placement position of the substrate W1 before processing on the upper arm 313. The control device 100 controls the robot arm 150 to transport the substrate W1 before processing on the upper arm 313 to a position above the predetermined placement position with respect to the placement unit 145.

[0088] The control device 100 controls the LLM 14 to lower the lift pin 141 and place the processed substrate W2 supported by the lift pin 141 on the lower arm 314 (step S12). The control device 100 controls the robot arm 150 to lower the upper arm 313 and the lower arm 314 to place the substrate W1 before processing supported by the upper arm 313 on the placement unit 145 (step S13).

[0089] The control device 100 controls the robot arm 150 to move the upper arm 313 and the lower arm 314 out of the LLM 14 (step S14) and ends the process.

[0090] FIG. 13 is a flowchart showing an example of the processing flow of the substrate transfer method according to the embodiment. In FIG. 13, as shown in FIGS. 9A to 9H, the case of transferring the substrate W1 before processing and the processed substrate W2 between the LLM 14 and the VTM 11a will be described as an example.

[0091] In the LLM 14, the substrate W1 before processing is placed on the placement unit 145. The robot arm 12a supports the processed substrate W2 with the lower arm 214.

[0092] The control device 100 controls the LLM 14 and the gate valves 142 and 143, closes the gate valves 142 and 143, decompresses the inside of the LLM 14 to switch to a decompressed state, and opens the gate valve 142 when a predetermined decompressed state is reached (step S20).

[0093] The control device 100 controls the robot arm 12a to move the upper arm 213 and the lower arm 214 into the LLM 14 (step S21). When the upper arm 213 and the lower arm 214 enter the LLM 14, the sensor 122 outputs sensing information to the control device 100. The control device 100 specifies the placement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 122 and the position information of the lower arm 214 of the robot arm 12a.

[0094] The control device 100 determines whether the placement position of the processed substrate W2 on the lower arm 214 is displaced by a value equal to or greater than the allowable value (step S22).

[0095] When the displacement is less than the allowable value (step S22: No), the control device 100 controls the robot arm 12a to transport the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position with respect to the lift pin 141 (step S23). The control device 100 controls the robot arm 12a to raise the upper arm 213 and the lower arm 214, and lift and support the unprocessed substrate W1 placed on the placement portion 145 with the upper arm 213 (step S24).

[0096] On the other hand, when the misalignment is equal to or greater than the allowable value (step S23: Yes), the control device 100 controls the robot arm 12a to move the upper arm 213 to a position where there is no misalignment with respect to the substrate W1 before processing placed on the placement unit 145 (step S25). The control device 100 controls the robot arm 12a to raise the upper arm 213 and the lower arm 214, and lift and support the substrate W1 before processing placed on the placement unit 145 with the upper arm 213 (step S26). Then, the control device 100 controls the robot arm 12a to move the lower arm 214 according to the misalignment in a state where the substrate W1 before processing is lifted, and correct the position of the processed substrate W2 with respect to the lift pin 141 (step S27). For example, the control device 100 controls the robot arm 12a to convey the processed substrate W2 on the lower arm 214 to a position above a predetermined arrangement position with respect to the lift pin 141.

[0097] The control device 100 controls the LLM 14 to raise the lift pin 141, and lift and support the processed substrate W2 supported by the lower arm 214 with the lift pin 141 (step S28). The control device 100 controls the robot arm 12a to retract the upper arm 213 and the lower arm 214 from the LLM 14 (step S29), and ends the process.

[0098] As described above, in the substrate transfer method according to the embodiment, the robot arm 12 (transfer mechanism) in a state where the substrate W2 (second substrate) is supported by the lower arm 214 (lower fork) enters the LLM 14 and the buffer chamber 19 (buffer chamber) with the substrates W1 (first substrates) placed on the placement units 145 and 195, and the substrate W1 placed on the placement units 145 and 195 is lifted by the upper arm 213 (upper fork) (steps S21, S23, S24). In the substrate transfer method, with the substrate W1 lifted by the upper arm 213, the plurality of lift pins 141 and 191 are raised to lift the substrate W2 supported by the lower arm 214 by the plurality of lift pins 141 and 191 (step S28). In the substrate transfer method, the robot arm 12 is withdrawn from the LLM 14 and the buffer chamber 19 with the substrate W2 lifted by the plurality of lift pins 141 and 191 (step S29). Thereby, the substrate transfer method according to the embodiment can shorten the time required for exchanging the substrates W1 and W2.

[0099] Further, in the substrate transfer method according to the embodiment, when the arrangement position of the substrate W2 on the lower arm 214 is displaced, after moving the robot arm 12 to a position where there is no displacement with respect to the substrate W1 placed on the placement units 145 and 195, the substrate W1 is lifted by the upper arm 213 (steps S25, S26). In the substrate transfer method, with the substrate W1 lifted by the upper arm 213, the robot arm 12 is moved according to the displacement to correct the position of the substrate W2 with respect to the plurality of lift pins 141 and 191, and then the plurality of lift pins 141 and 191 are raised (steps S27, S28). Thereby, the substrate transfer method according to the embodiment can exchange the substrates W1 and W2 without displacing the substrate W1 and correcting the displacement of the substrate W2.

[0100] Further, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is displaced by an amount equal to or greater than the allowable value, the robot arm 12 is moved to a position where there is no displacement with respect to the substrate W1 placed on the placement portions 145 and 195, and then the substrate W1 is lifted by the upper arm 213 (steps S25 and S26). Then, in the state where the substrate W1 is lifted by the upper arm 213, the robot arm 12 is moved according to the displacement to correct the position of the substrate W2 with respect to the plurality of lift pins 141 and 191, and then the plurality of lift pins 141 and 191 are raised (steps S27 and S28). On the other hand, in the substrate transfer method, when the displacement of the substrate W2 on the lower arm 214 is less than the allowable value, the robot arm 12 is moved to a position where there is no displacement with respect to the substrate W2 on the lower arm 214 with respect to the plurality of lift pins 141 and 191, and then the substrate W1 is lifted by the upper arm 213 (steps S23 and S24). Then, in the state where the substrate W1 is lifted by the upper arm 213, the plurality of lift pins 141 and 191 are raised without changing the position of the lower arm 214 (step S28). Thereby, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is displaced by an amount equal to or greater than the allowable value, the substrate W1 can be exchanged with the substrate W2 without displacement and with the displacement of the substrate W2 corrected. Further, when the placement position of the substrate W2 on the lower arm 214 is less than the allowable value, the substrate W1 and the substrate W2 can be exchanged promptly.

[0101] Further, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is displaced by an amount equal to or greater than the allowable value, the robot arm 12 is moved by the amount of displacement to correct the position of the substrate W2 with respect to the plurality of lift pins 141 and 191 (step S27). Thereby, in the substrate transfer method according to the embodiment, the displacement of the substrate W2 can be corrected and the substrate W1 and the substrate W2 can be exchanged promptly.

[0102] Further, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is misaligned, the robot arm 12 is moved according to the misalignment to correct the position of the substrate W2 with respect to the plurality of lift pins 141 and 191, and then the substrate W1 placed on the placement portions 145 and 195 is lifted by the upper arm 213. As a result, in the substrate transfer method according to the embodiment, although a misalignment smaller than the initial misalignment of the substrate W2 occurs in the substrates W1 and W2, the substrates W1 and W2 can be quickly exchanged.

[0103] Further, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than the allowable value, the robot arm 12 is moved to a position where the misalignment of the substrate W2 with respect to the plurality of lift pins 141 and 191 is smaller than the allowable value, and then the substrate W1 placed on the placement portions 145 and 195 is lifted by the upper arm 213. As a result, in the substrate transfer method according to the embodiment, although a misalignment smaller than the initial misalignment of the substrate W2 occurs in the substrates W1 and W2, the substrates W1 and W2 can be quickly exchanged while reducing the misalignment.

[0104] Further, in the substrate transfer method according to the embodiment, the robot arms 12 and 150 supporting the substrate W1 by the upper arms 213 and 313 are made to enter the LLM14 and the buffer chamber 19 in which the substrate W2 is supported by the plurality of lifted lift pins 141 and 191, and the plurality of lift pins 141 and 191 are lowered to place the substrate W2 on the lower arms 214 and 314 (steps S11, S12). In the substrate transfer method, with the substrate W2 placed on the lower arms 214 and 314, the substrate W1 supported by the upper arms 213 and 313 is placed on the placement portions 145 and 195 (step S13). In the substrate transfer method, with the substrate W2 placed on the lower arms 214 and 314, the robot arms 12 and 150 are withdrawn from the LLM14 and the buffer chamber 19 (step S14). As a result, in the substrate transfer method according to the embodiment, the time required for exchanging the substrates W1 and W2 can be shortened.

[0105] The substrate transfer method according to the embodiment uses the substrate W1 as the substrate W before a predetermined process (for example, substrate processing) is performed, and the substrate W2 as the substrate W after the predetermined process is performed. Since the substrate W1 before the process is transferred above the processed substrate W2, it is possible to suppress particles that have fallen from the processed substrate W2 from adhering to the substrate W1 before the process.

[0106] As described above, the embodiments have been described. However, the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. In fact, the above-described embodiments can be embodied in various forms. Also, the above-described embodiments may be omitted, replaced, or changed in various forms without departing from the scope of the claims and their gist.

[0107] For example, in the above embodiment, the case where the substrate W is a semiconductor wafer has been described as an example. However, it is not limited to this. The substrate may be any substrate such as a glass substrate.

[0108] In the above-described embodiment, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned, the case of correcting the misalignment when exchanging the substrate W1 before processing and the processed substrate W2 between the LLM 14 and the VTM 11a was described as an example. However, it is not limited to this. When the placement position of the substrate W is misaligned, the substrate processing system 1 may transport the misaligned substrate W to a temporary holding unit provided in the empty PM 13, VTM 11a, or 11b, temporarily place it, perform alignment, and then transport the aligned substrate W. For example, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than the allowable value, the substrate processing system 1 may perform alignment on the substrate W2 and then transport the aligned substrate W2. The substrate transfer method of temporarily placing the substrate in this way, performing alignment, and then transporting the aligned substrate will be referred to as the third transfer method below. Further, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than the allowable value, the substrate processing system 1 may not exchange the substrate W1 before processing and the processed substrate W2 by the above-described substrate transfer method in the LLM 14 and the buffer chamber 19, but may transfer them individually. For example, the substrate processing system 1 may arrange the other after taking out one of the substrates W1 and W2 in the LLM 14 and the buffer chamber 19. For example, the substrate processing system 1 may cause the robot arm 12a or the robot arm 150 to enter the LLM 14 twice, take out one of the substrates W1 and W2 during the first entry, and then arrange the other during the second entry to exchange the substrate W1 before processing and the processed substrate W2. The substrate transfer method of causing the robot arm 150 to enter twice in this way will be referred to as the fourth transfer method below. The substrate processing system 1 may switch the substrate transfer method according to the throughput required for transporting the substrates W1 and W2 and the allowable amount of misalignment. For example, the substrate processing system 1 determines whether the placement position of the processed substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than the allowable value. When the misalignment is smaller than the allowable value or more, the substrate processing system 1 may exchange the substrate W1 before processing and the processed substrate W2 by the steps S23 and S24 processing of the substrate transfer method shown in FIG. 12 described above.Further, when the misalignment is equal to or greater than the allowable value, the substrate processing system 1 may select and implement an appropriate substrate transfer method from the above-described first to fourth transfer methods based on the misalignment amount and the allowable transfer time.

Explanation of Signs

[0109] 1 Substrate processing system 10 Processing system main body 11, 11a, 11b Vacuum transfer chamber (VTM) 12, 12a, 12b, 150 Robot arm 13 Process module (PM) 14 Load lock module (LLM) 15 EFEM 16 Load port (LP) 19 Buffer chamber 100 Control device 140, 190 Stage 141, 191 Lift pin 145, 145a, 145b, 195, 195a, 195b Placement part 200, 300 Arm part 211, 311 First arm 212, 312 Second arm 213, 313 Third arm, upper arm 214, 314 Third arm, lower arm 230, 330 Fork 231, 331 Support part W, W1, W2 Substrate

Claims

1. A transfer chamber provided with a transfer mechanism having two forks capable of supporting a substrate, one above the other; A placement section capable of contacting a part of the substrate to place the substrate thereon, and a plurality of pins provided below the placement section and capable of moving up and down to support the substrate, and a buffer chamber connected to the transfer chamber; A method for transferring a substrate of a transfer device having: A first step of causing the transfer mechanism in a state of supporting a second substrate with the lower fork to enter the buffer chamber in which a first substrate is placed on the placement section, and lifting the first substrate placed on the placement section with the upper fork; A second step of lifting the plurality of pins in a state where the first substrate is lifted by the upper fork, and lifting the second substrate supported by the lower fork with the plurality of pins; A third step of causing the transfer mechanism to exit the buffer chamber in a state where the second substrate is lifted by the plurality of pins; Having; In the first step, when the placement position of the second substrate on the lower fork is misaligned, after moving the transfer mechanism to a position where there is no misalignment with respect to the first substrate placed on the placement section, the first substrate is lifted with the upper fork; In the second step, in a state where the first substrate is lifted by the upper fork, the transfer mechanism is moved according to the misalignment to correct the position of the second substrate with respect to the plurality of pins, and then the plurality of pins are lifted Substrate transfer method.

2. In the first step, when the placement position of the second substrate on the lower fork is misaligned by an amount equal to or greater than an allowable value, after moving the transfer mechanism to a position where there is no misalignment with respect to the first substrate placed on the placement section, the first substrate is lifted with the upper fork. When the misalignment of the second substrate on the lower fork is less than the allowable value, after moving the transfer mechanism to a position where there is no misalignment of the second substrate on the lower fork with respect to the plurality of pins, the first substrate is lifted with the upper fork; In the second step, when the placement position of the second substrate on the lower fork is displaced by an amount equal to or greater than the allowable value, with the first substrate lifted by the upper fork, the transport mechanism is moved according to the displacement to correct the position of the second substrate relative to the plurality of pins, and then the plurality of pins are lifted. When the displacement of the second substrate on the lower fork is less than the allowable value, with the first substrate lifted by the upper fork, the plurality of pins are lifted without changing the position of the lower fork. The substrate transfer method according to claim 1.

3. In the second step, when the placement position of the second substrate on the lower fork is displaced by an amount equal to or greater than the allowable value, the transport mechanism is moved by the amount of the displacement to correct the position of the second substrate relative to the plurality of pins. The substrate transfer method according to claim 1.

4. A transfer chamber provided with a transfer mechanism having two forks that can support a substrate, one above the other. A placement portion that can contact a part of the substrate and place the substrate thereon, and a plurality of pins that can move up and down and support the substrate are provided below the placement portion. A buffer chamber is connected to the transfer chamber. A substrate transfer method of a transfer device having: A first step of entering the transfer mechanism in a state where the second substrate is supported by the lower fork into the buffer chamber in which the first substrate is placed on the placement portion, and lifting the first substrate placed on the placement portion by the upper fork. A second step of lifting the plurality of pins with the first substrate lifted by the upper fork, and lifting the second substrate supported by the lower fork by the plurality of pins. A third step of withdrawing the transfer mechanism from the buffer chamber with the second substrate lifted by the plurality of pins. having In the first step, when the placement position of the second substrate on the lower fork is displaced, the transfer mechanism is moved according to the displacement to correct the position of the second substrate relative to the plurality of pins, and then the first substrate placed on the placement portion is lifted by the upper fork. Substrate transfer method.

5. In the first step, when the displacement of the placement position of the second substrate on the lower fork is deviated by an amount equal to or greater than the allowable value, after moving the transfer mechanism to a position where the displacement of the second substrate with respect to the plurality of pins is smaller than the allowable value, the first substrate placed on the placement portion is lifted by the upper fork. The substrate transfer method according to claim 4.

6. A transfer chamber provided with a transfer mechanism having two forks that can support a substrate, one above the other; A placement portion that can contact a part of the substrate and place the substrate thereon, and a plurality of pins that can be lifted and lowered to support the substrate are provided below the placement portion. A buffer chamber is connected to the transfer chamber; A substrate transfer method of a transfer device having: A first step of entering the transfer mechanism in a state where the second substrate is supported by the lower fork into the buffer chamber in which the first substrate is placed on the placement portion, and lifting the first substrate placed on the placement portion by the upper fork; A second step of lifting the plurality of pins while the first substrate is lifted by the upper fork, and lifting the second substrate supported by the lower fork by the plurality of pins; A third step of withdrawing the transfer mechanism from the buffer chamber while the second substrate is lifted by the plurality of pins; having The first substrate is a substrate before a predetermined process is performed. The second substrate is a substrate after a predetermined process is performed. Substrate transfer method.

7. A transfer chamber provided with a transfer mechanism having two forks that can support a substrate, one above the other; A placement portion that can contact a part of the substrate and place the substrate thereon, and a plurality of pins that can be lifted and lowered to support the substrate are provided below the placement portion. A buffer chamber is connected to the transfer chamber; A substrate transfer method of a transfer device having: A step of entering the transfer mechanism in a state where the first substrate is supported by the upper fork into the buffer chamber in which the second substrate is supported by the plurality of lifted pins, and lowering the plurality of pins to place the second substrate on the lower fork; A step of placing the first substrate supported by the upper fork on the placement portion while the second substrate is placed on the lower fork; A step of withdrawing the transfer mechanism from the buffer chamber while the second substrate is placed on the lower fork; A substrate transfer method having. The first substrate is a substrate before a predetermined process is performed. The second substrate is a substrate after a predetermined process has been performed. Substrate transfer method. **Claim 8** A transfer chamber provided with a transfer mechanism having two forks that can support a substrate, one above the other; A placement unit that can come into contact with a part of the substrate and place the substrate thereon, and a plurality of pins that can move up and down and support the substrate are provided below the placement unit. A buffer chamber connected to the transfer chamber; In the buffer chamber where a first substrate is placed on the placement unit, the transfer mechanism in a state where a second substrate is supported by the lower fork is made to enter, and the first substrate placed on the placement unit is lifted by the upper fork. In a state where the first substrate is lifted by the upper fork, the plurality of pins are raised to lift the second substrate supported by the lower fork by the plurality of pins. A control unit that performs control to cause the transfer mechanism to exit the buffer chamber in a state where the second substrate is lifted by the plurality of pins; comprising When the placement position of the second substrate on the lower fork is displaced, the control unit moves the transfer mechanism to a position where there is no displacement with respect to the first substrate placed on the placement unit, and then lifts the first substrate by the upper fork. In a state where the first substrate is lifted by the upper fork, the transfer mechanism is moved according to the displacement to correct the position of the second substrate with respect to the plurality of pins, and then control is performed to raise the plurality of pins. Substrate transfer device. **Claim 9** A transfer chamber provided with a transfer mechanism having two forks that can support a substrate, one above the other; A placement unit that can come into contact with a part of the substrate and place the substrate thereon, and a plurality of pins that can move up and down and support the substrate are provided below the placement unit. A buffer chamber connected to the transfer chamber; In the buffer chamber where a first substrate is placed on the placement unit, the transfer mechanism in a state where a second substrate is supported by the lower fork is made to enter, and the first substrate placed on the placement unit is lifted by the upper fork. In a state where the first substrate is lifted by the upper fork, the plurality of pins are raised to lift the second substrate supported by the lower fork by the plurality of pins. A control unit that performs control to cause the transfer mechanism to exit the buffer chamber in a state where the second substrate is lifted by the plurality of pins; comprising When the placement position of the second substrate on the lower fork is misaligned, the control unit corrects the position of the second substrate with respect to the plurality of pins by moving the transfer mechanism according to the misalignment, and then controls to lift the first substrate placed on the placement unit with the upper fork. Substrate transfer device.

10. A transfer chamber provided with a transfer mechanism having two forks capable of supporting a substrate, one above the other; A placement unit that can contact a part of the substrate and place the substrate, and a plurality of pins capable of lifting up and down and supporting the substrate are provided below the placement unit. A buffer chamber is connected to the transfer chamber; In the buffer chamber where the first substrate is placed on the placement unit, the transfer mechanism in a state of supporting the second substrate with the lower fork is allowed to enter, the first substrate placed on the placement unit is lifted by the upper fork, and in a state where the first substrate is lifted by the upper fork, the plurality of pins are lifted, and the second substrate supported by the lower fork is lifted by the plurality of pins. A control unit that controls to withdraw the transfer mechanism from the buffer chamber in a state where the second substrate is lifted by the plurality of pins; having The first substrate is a substrate before a predetermined process is performed; The second substrate is a substrate after a predetermined process is performed. Substrate transfer device.

11. A transfer chamber provided with a transfer mechanism having two forks capable of supporting a substrate, one above the other; A placement unit that can contact a part of the substrate and place the substrate, and a plurality of pins capable of lifting up and down and supporting the substrate are provided below the placement unit. A buffer chamber is connected to the transfer chamber; The transfer mechanism in a state of supporting the first substrate with the upper fork is allowed to enter the buffer chamber where the second substrate is supported by the plurality of lifted pins, the plurality of pins are lowered to place the second substrate on the lower fork, and in a state where the second substrate is placed on the lower fork, the first substrate supported by the upper fork is placed on the placement unit. A control unit that controls to withdraw the transfer mechanism from the buffer chamber in a state where the second substrate is placed on the lower fork; having The first substrate is a substrate before a predetermined process is performed; The second substrate is a substrate after a predetermined process is performed. Substrate transfer device.

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