Capacitor and power conversion device including the capacitor

Abstract

To provide a capacitor which can be easily manufactured and has a good heat dissipation, and provide a power conversion device having this capacitor.SOLUTION: A capacitor formed by housing a capacitor element 30 into a housing space 11 provided in an attached body, and flowing a sealing material 40, comprises a bus bar assembly 50 connected to the capacitor element 30. The bus bar assembly 50 comprises a base part 60, a positive and negative bus bar 70 insert-molded in the base part 60, and a penetration hole 60a for flowing the sealing material 40 into the housing space 11, provided in a position that is opposite to the capacitor element 30 when connecting the capacitor element 30 and the positive and negative bus bar 70. The positive and negative bus bar 70 comprises substrate parts 72 and 76 into which the penetration hole 60a passes. The substrate parts 72 and 76 are positioned at the outside of the sealing material 40.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a capacitor in which a capacitor element is sealed in a housing space provided in an object to be attached, and a power conversion device including this capacitor.

Background Art

[0002] In recent years, for the purpose of miniaturizing power conversion devices, reducing costs, improving heat dissipation efficiency, etc., as shown in Patent Documents 1 and 2, a capacitor element is directly housed and sealed in a part of a power conversion device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, after filling or applying resin (sealing material) to the housing portion, the capacitor element is housed, but there are problems such as resin overflow when the amount of resin is large, and poor insulation and fixation when the amount of resin is small.

[0005] In Patent Document 2, since the capacitor element and its periphery are covered by the pedestal, it cannot be said that the heat dissipation property is good.

[0006] An object of the present invention is to provide a capacitor that is easy to manufacture and has good heat dissipation, and a power conversion device including this capacitor.

Means for Solving the Problems

[0007] The capacitor of the present invention is a capacitor in which a capacitor element 30 is housed in a housing space 11 provided in an object to be attached, and a sealing material 40 is poured therein. The capacitor includes bus bar assemblies 50, 50A, 50B connected to the capacitor element 30. The bus bar assemblies 50, 50A, 50B include a base portion 60, positive and negative bus bars 70 insert-molded in the base portion 60, and a through hole 60a provided at a position facing the capacitor element 30 when the capacitor element 30 and the positive and negative bus bars 70 are connected, for pouring the sealing material 40 into the housing space 11. The positive and negative bus bars 70 include substrate portions 72, 76 through which the through hole 60a passes, and element connection portions 73, 77 extending from the substrate portions 72, 76 and connected to the capacitor element 30, and the substrate portions 72, 76 are located outside the sealing material 40.

[0008] In the above capacitor, it is preferable that the base portion 60 includes a fixing portion 61 for fixing the bus bar assemblies 50, 50A, 50B to the object to be attached.

[0009] Also, it is preferable that the size of the through hole 60a is approximately the same as the area of the opposing surface of the capacitor element 30 facing the substrate portions 72, 76.

[0010] Also, when a set of positive and negative bus bars 70 is formed by one positive bus bar 71 and one negative bus bar 75, a plurality of sets of positive and negative bus bars 70 may be insert-molded in the base portion 60.

[0011] Furthermore, a heat dissipation member 80 may be insert-molded in the base portion 60.

[0012] Furthermore, a plurality of capacitor elements 30 may be housed in one housing space 11.

[0013] The power conversion device of the present invention includes the capacitor according to any one of the above, and is characterized in that the object to be attached is the housing 10 of the power conversion device 1.

Advantages of the Invention

[0014] In the capacitor of the present invention, since the bus bar assembly is provided with a through hole for pouring a sealing material into the accommodation space, which is provided at a position facing the capacitor element when the capacitor element and the positive and negative bus bars are connected, the sealing material can be poured after the capacitor element is accommodated in the accommodation space, and the filling operation can be performed simply and reliably. Further, since the area of the sealing material exposed to the outside air is increased by the through hole, the heat dissipation property is also good. Furthermore, since the substrate portions of the positive and negative bus bars are located outside the sealing material, the heat dissipation property is better than the case where the substrate portions are embedded in the sealing material.

[0015] In the above capacitor, when the base portion is provided with a fixing portion for fixing the bus bar assembly to the object to be attached, the positioning of the positive and negative bus bars and the capacitor connected to the positive and negative bus bars can be performed simply and accurately.

[0016] Also, when the size of the through hole is approximately the same as the area of the opposing surface of the capacitor element facing the substrate portion, the filling operation of the sealing material can be performed easily, and the heat dissipation property is also good.

[0017] Further, when a plurality of sets of positive and negative bus bars are insert-molded on the base portion when one positive bus bar and one negative bus bar are used as a set of positive and negative bus bars, the assembly operation can be performed more easily compared to fixing each set of positive and negative bus bars to the object to be attached respectively.

[0018] Furthermore, when a heat dissipation member is insert-molded on the base portion, the heat dissipation property can be improved.

[0019] Furthermore, when a plurality of capacitor elements are accommodated in one accommodation space, compared to accommodating one capacitor element in one accommodation space, the member separating the accommodation spaces can be omitted, and the capacitor can be miniaturized.

[0020] In the power conversion device of the present invention, since an accommodation space is provided in the housing of the power conversion device, the heat generated in the capacitor element and the positive and negative bus bars can be transmitted to the housing, and the heat dissipation performance is good. Further, it is possible to reduce the size as compared with the case where the capacitor housed separately in a case is attached.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0022] Next, a capacitor 20 of the present invention and an embodiment of a power conversion device 1 using the capacitor 20 will be described. The power conversion device 1 shown in FIG. 1 is a so-called inverter device, particularly for in-vehicle use. This power conversion device 1 includes a housing 10, an inverter circuit (not shown), a converter circuit (not shown), and a smoothing capacitor. Note that this smoothing capacitor is the capacitor 20 of the present invention. Therefore, when viewed from the capacitor 20, the housing 10 serves as an object to be attached for attaching the capacitor 20.

[0023] The housing 10 is made of, for example, metal. Specifically, it is made of aluminum or the like. As shown in FIGS. 2 and 3, the housing 10 is provided with a housing space 11 for housing and sealing the capacitor element 30. This housing space 11 is provided so as to be recessed from the upper surface of the housing 10 and is open at the top. And the capacitor element 30 can be housed inside from this opening 11a. Further, a plurality (five in the figure) of housing spaces 11 are provided, and the housing spaces 11 are partitioned by a wall portion 12. This wall portion 12 is continuous with other parts of the housing 10 and heat transfer to other parts is possible. Also, the housing 10 is provided with a connecting portion 13 for positioning and fixing a bus bar assembly 50 described later. This connecting portion 13 is, for example, a screw hole and a plurality (four in the figure) are provided. Specifically, it is provided at the four corners of the plurality of arranged housing spaces 11. [[ID=!]]

[0024] The capacitor 20 includes a capacitor element 30, a sealing material 40 for sealing the capacitor element 30, and a bus bar assembly 50 connected to the capacitor element 30.

[0025] The capacitor element 30 is, for example, a film capacitor formed by winding a metallized film obtained by vapor-depositing a metal on an insulating film. A first electrode surface 31 is provided on one end face in the axial direction, and a second electrode surface 32 is provided on the other end face. These electrode surfaces are formed, for example, by thermal spraying a metal. This capacitor element 30 has a barrel shape with substantially semicircular bulging portions 33 at both ends when viewed from the axial direction. More specifically, it has a shape in which R (round) is provided at four rectangular corner portions. And it has a side surface 34 composed of a flat portion 34a and a curved portion 34b between the first electrode surface 31 and the second electrode surface 32 (the peripheral surface). A plurality of, specifically five, of these capacitor elements 30 are arranged side by side with the first electrode surface 31 and the second electrode surface 32 facing sideways and the flat portions 34a facing each other to form a capacitor element group. Note that the capacitor element 30 is not limited to a film capacitor, and various capacitor elements such as an electrolytic capacitor and a ceramic capacitor may be used. Various shapes such as a cylindrical shape and a prismatic shape may be adopted for the shape. The number can also be appropriately changed.

[0026] The sealing material 40 is an insulating synthetic resin and is liquid before curing. A thermosetting resin or a photocurable resin is preferred, such as an epoxy resin, a urethane resin, or a silicone resin.

[0027] The bus bar assembly 50 includes a base portion 60, positive and negative bus bars 70 insert-molded in the base portion 60, and a through hole 60a provided at a position facing the capacitor element 30 when the capacitor element 30 and the positive and negative bus bars 70 are connected, for pouring the sealing material 40 into the accommodation space 11. ;

[0028] The base portion 60 is made of an insulating synthetic resin. For example, it is a thermoplastic resin such as polyphenylene sulfide or polybutylene terephthalate. As shown in FIGS. 4 and 5A, the outer shape is a substantially rectangular plate shape. However, since a plurality of through holes 60a are provided in the base portion 60 at equal intervals, it has a ladder shape in plan view. The width and length of the base portion 60 are sized to cover the accommodation space 11 in plan view. This base portion 60 is provided with a fixing portion 61 for fixing the bus bar assembly 50 to the housing 10. This fixing portion 61 is provided so as to correspond to the connecting portion 13 provided in the housing 10. Specifically, it is provided at the four corners of the base portion 60. The fixing portion 61 is, for example, a hole through which a screw 14 can be inserted. The bus bar assembly 50 is fixed to the housing 10 by inserting the screw 14 through the fixing portion 61 and the connecting portion 13. Note that the fixing method is not limited to that using screws, and an uneven fitting in which a convex portion is provided on one of the fixing portion 61 or the connecting portion 13 and a concave portion is provided on the other may be used, and various fixing methods can be adopted. It is preferable that there are two or more fixing locations.

[0029] The positive and negative bus bars 70 are composed of one positive bus bar 71 and one negative bus bar 75. This positive and negative bus bar 70 is formed by appropriately bending a conductive metal plate such as copper.

[0030] As shown in FIG. 5B, the positive electrode bus bar 71 includes a substrate portion 72 having a substantially rectangular outer shape in plan view, an element connection portion 73 connected to the capacitor element 30, and a circuit connection portion 74 connected to the inverter circuit and / or the converter circuit. A hole 72a is provided in the substrate portion 72 at a position corresponding to the through hole 60a of the base portion 60. In other words, since the through hole 60a passes through, the shape in plan view is ladder-shaped. The element connection portion 73 extends downward from the inner end of the hole at one long side of the substrate portion 72 having a substantially rectangular outer shape (the portion corresponding to the pillar in the case of a ladder). This element connection portion 73 is connected to the first electrode surface 31 of the capacitor element 30. Therefore, the same number (i.e., five) as the capacitor elements 30 are provided. The circuit connection portion 74 extends upward from one short side of the substrate portion 72 (the portion corresponding to the rung in the case of a ladder).

[0031] As shown in FIG. 5C, the negative electrode bus bar 75 includes a substrate portion 76 having a substantially rectangular outer shape in plan view, an element connection portion 77 connected to the capacitor element 30, and a circuit connection portion 78 connected to the inverter circuit and / or the converter circuit. The substrate portion 76 of the negative electrode bus bar 75 has substantially the same shape in plan view as the substrate portion 72 of the positive electrode bus bar 71. That is, a hole 76a is also provided in the substrate portion 76 of the negative electrode bus bar 75 at a position corresponding to the through hole 60a of the base portion 60, and it is ladder-shaped in plan view. The element connection portion 77 of the negative electrode bus bar 75 extends downward from the inner end of the hole at the other long side of the substrate portion 76. This element connection portion 77 is connected to the second electrode surface 32 of the capacitor element 30. Therefore, the same number (i.e., five) as the capacitor elements 30 are provided. The circuit connection portion 78 extends upward from one short side of the substrate portion 76. The circuit connection portion 78 of the negative electrode bus bar 75 and the circuit connection portion 74 of the positive electrode bus bar 71 do not overlap in plan view and are in positions shifted from each other as shown in FIG. 4.

[0032] As described above, the through-hole 60a penetrates the base portion 60 and the positive and negative bus bars 70. Its size is made approximately the same as the area of the opposing surface of the capacitor element 30 that faces the substrate portions 72 and 76 (the area when looking down at the capacitor element 30 from above). However, it may be larger or smaller than that. Also, in FIG. 4, the through-hole 60a is substantially rectangular, but it may be square, polygonal, circular, or elliptical. The main point is that it should be of a size and shape that allows the sealing material 40 to be filled in without difficulty. The interval between the through-holes 60a is equal to the interval of the accommodation space 11. Note that the holes 72a and 76a of the positive and negative bus bars 70 are preferably made larger than the through-hole 60a. Thereby, the positive and negative bus bars 70 are not exposed from the inner end surface of the base portion 60 that defines the through-hole 60a, except for the element connection portions 73 and 77, making it easier to achieve insulation.

[0033] Next, the manufacturing method of the capacitor 20 will be described. First, the substrate portion 72 of the positive bus bar 71 and the substrate portion 76 of the negative bus bar 75 are overlapped with the positions of the holes 72a and 76a aligned and with a space left that can ensure insulation during insert molding. Next, the base portion 60 is formed by covering the peripheries of the respective substrate portions 72 and 76 with resin. In other words, the positive and negative bus bars 70 are insert molded into the base portion 60. At this time, the element connection portions 73 and 77 and the circuit connection portions 74 and 78 are extended outward from the base portion 60. Thereby, the bus bar assembly 50 is manufactured.

[0034] Next, the capacitor element 30 is connected to the bus bar assembly 50. Specifically, the first electrode surface 31 of the capacitor element 30 and the element connection portion 73 of the positive bus bar 71 are electrically and mechanically connected by soldering, welding, or the like. Similarly, the second electrode surface 32 of the capacitor element 30 and the element connection portion 77 of the negative bus bar 75 are electrically and mechanically connected by soldering, welding, or the like. Note that the interval between the capacitor elements 30 is made equal to the interval of the accommodation space 11. In short, a gap is provided between the capacitor elements 30 so that the capacitor elements 30 do not contact the wall portion 12. Thereafter, the capacitor element 30 is accommodated in the accommodation space 11, and the capacitor element 30 is positioned and fixed by passing a screw 14 through the fixing portion 61 of the base portion 60 and the connecting portion 13 of the housing 10. When the bus bar assembly 50 is fixed to the housing 10, the accommodation space 11 is covered from above by the bus bar assembly 50. A gap is formed between the lower surface of the base portion 60 and the upper surface of the housing 10, or a slight gap is formed so that the sealing material 40 cannot be poured. The portion corresponding to the tread of the base portion 60 is placed (abutted) on the wall portion 12. However, it does not have to abut.

[0035] Then, the sealing material 40 is poured into the accommodation space 11 through the through hole 60a. The amount to be poured is an amount that can cover at least the entire capacitor element 30. Also, it is set to an amount (thickness) that can ensure the desired moisture resistance. The substrate portions 72 and 76 of the positive and negative bus bars 70 are located outside the sealing material 40. Naturally, the base portion 60 is also located outside the sealing material 40. What is located inside the sealing material 40 is the lower part of the element connection portions 73 and 77 (see FIG. 3). Thereafter, the manufacturing of the capacitor 20 is completed by curing the sealing material 40.

[0036] Although the bus bar assembly 50 covers the accommodation space 11 from above, since the through hole 60a is provided in the bus bar assembly 50, after the bus bar assembly 50 is fixed to the housing 10, the sealing material 40 can be poured into the accommodation space 11. There is no need to worry about the overflow or shortage of the sealing material 40 that may occur in the method of accommodating the capacitor element 30 after filling the accommodation space 11 with the sealing material 40, and the filling operation can be performed simply and reliably. Further, since the upper surface of the sealing material 40 is exposed to the outside air through the through hole 60a, the heat dissipation property is also good. Furthermore, since the substrate portions 72 and 76 of the positive and negative bus bars 70 are located outside the sealing material 40, the heat of the positive and negative bus bars 70 can be released to the outside air. In order to further enhance the heat dissipation property, a cooler or the like may be brought into contact with the base portion 60.

[0037] Also, since the wall portion 12 is provided between the accommodation spaces 11, the heat generated by the capacitor element 30 can be absorbed and blocked by the wall portion 12, and the heat influence between the capacitor elements 30 can be mitigated. Further, compared with the case where the wall portion 12 is not provided, since the volume and area of the accommodation space 11 are reduced, cracks and peeling of the sealing material 40 can be reduced. Also, by providing a plurality of accommodation spaces 11, the type of the sealing material 40 filled in each accommodation space 11 can be changed. For example, by filling a sealing material 40 with good characteristics in a portion that is particularly susceptible to the influence of moisture or a portion that is particularly susceptible to heat generation, and filling the sealing material 40 that is usually used in other portions, it is possible to improve the performance of the entire capacitor while reducing costs. Also, since the positive and negative bus bars 70 are insert-molded into the base portion 60, positioning during assembly is easy. Further, since the substrate portion 72 of the positive electrode bus bar 71 and the substrate portion 76 of the negative electrode bus bar 75 overlap each other, an effect of reducing the ESL can be expected.

[0038] Next, a modified example of the bus bar assembly 50A will be described. In the bus bar assembly 50A shown in FIG. 6A, a heat dissipation member 80 is insert-molded. The heat dissipation member 80 is formed by appropriately bending a conductive metal plate such as copper. As shown in FIG. 6B, this heat dissipation member 80 includes a substrate portion 81 having substantially the same planar shape (i.e., ladder shape) as the substrate portions 72 and 76 of the positive and negative bus bars 70, and a housing connection portion 82 that extends from the outer edge of the substrate portion 81 and is connected so as to enable heat transfer with the housing 10. Further, a hole 81a is provided in the substrate portion 81 so that the through hole 60a can pass through it.

[0039] As shown in FIG. 7A, the substrate portion 81 of the heat dissipation member 80 is overlapped with the substrate portion 76 of the negative bus bar 75 with a gap ensuring insulation therebetween. In other words, the heat dissipation member 80 is positioned between the positive and negative bus bars 70 and the capacitor element 30. In this case, the heat that would otherwise be transmitted from the positive and negative bus bars 70 to the capacitor element 30 can be blocked by the heat dissipation member 80 and dissipated to the housing 10.

[0040] Also, as shown in FIG. 7B, when the substrate portion 81 of the heat dissipation member 80 is provided so as to be sandwiched between the substrate portion 72 of the positive bus bar 71 and the substrate portion 76 of the negative bus bar 75 while ensuring insulation, the heat dissipation member 80 comes close to both the positive bus bar 71 and the negative bus bar 75, and the positive bus bar 71 and the negative bus bar 75 can be uniformly and efficiently cooled.

[0041] As shown in FIG. 7C, when the substrate portion 81 of the heat dissipation member 80 is overlapped with the substrate portion 72 of the positive bus bar 71 with a gap ensuring insulation therebetween, in other words, when the heat dissipation member 80 is positioned farther from the capacitor element 30 than the substrate portions 72 and 76 of the positive and negative bus bars 70 (located at the top), since the heat dissipation member 80 itself is closer to the outside air, the heat dissipation performance from the heat dissipation member 80 to the outside air is improved.

[0042] Note that the planar shape of the substrate portion 81 of the heat dissipation member 80 does not necessarily have to be the same as those of the substrate portions 72 and 76 of the positive and negative bus bars 70, and various shapes can be adopted, such as providing it only at locations with a large amount of heat generation. However, it is preferably provided so as to pass through the through hole 60a, that is, so as not to protrude from the inner end surface of the base portion 60.

[0043] FIG. 8A is a plan view of the bus bar assembly 50 when there is one accommodation space 11. Thus, when there is one accommodation space 11, since there is one through hole 60a, it has a substantially square shape in plan view. When the accommodation spaces 11 are arranged in a plurality of rows, for example, in a 2×2 arrangement as shown in FIG. 8B, it has a checkerboard shape in plan view. Also, when the pitch of the accommodation spaces 11 is shifted vertically, the pitch of the through holes 60a is shifted as shown in FIG. 8C. Further, when the accommodation spaces 11 are arranged, for example, in an L shape, it has an L shape in plan view as shown in FIG. 8D. Thus, the planar shape of the bus bar assembly 50 may be appropriately changed according to the arrangement of the accommodation spaces 11.

[0044] Also, as shown in FIG. 9, when one positive bus bar 71 and one negative bus bar 75 are used as a set of positive and negative bus bars 70, a plurality of sets of positive and negative bus bars 70 may be insert-molded into one base portion 60. In this case, capacitor elements 30 with different applications can be connected, or different electronic devices can be connected, and it is possible to expect a reduction in the man-hours during assembly. For example, a smoothing capacitor can be arranged in the main part, and an X capacitor or a Y capacitor can be arranged in other parts. Note that when the shapes and sizes differ depending on the type of the capacitor element 30 or the electronic device, it is preferable to also change the shape of the bus bar assembly 50 and the size of the through hole 60a according to the shape and size.

[0045] Also, as shown in FIG. 10, a plurality of capacitor elements 30 may be accommodated in one accommodation space 11. Further, a plurality of accommodation spaces 11 may be provided in one housing 10, and one capacitor element 30 may be accommodated in one accommodation space 11, while a plurality of capacitor elements 30 may be accommodated in other accommodation spaces 11.

[0046] The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments, and various modifications can be made and implemented within the scope of the present invention. For example, in the above embodiment, the reference numeral 71 is used as the positive electrode bus bar and the reference numeral 75 is used as the negative electrode bus bar, but the positive and negative may be interchanged. Also, although the capacitor elements 30 are arranged horizontally, they may be arranged vertically (the first electrode surface 31 and the second electrode surface 32 face in the vertical direction). The shape of the accommodation space 11 is not particularly limited as long as it can accommodate the capacitor element 30. Further, although the circuit connection portions 74 and 78 are connected to an inverter circuit or a converter circuit, they may be connected to other circuits or external devices. Also, although the housing connection portion 82 of the heat radiating member 80 is connected to the housing 10, it may be connected to other external devices or a cooler. Further, the number of through holes 60a, the number of capacitor elements 30, the number of through holes 60a and the number of accommodation spaces 11, and the number of capacitor elements 30 and the number of accommodation spaces 11 may be different from each other. For example, in a plan view, if one through hole 60a straddles a plurality of accommodation spaces 11, the sealing material 40 can be poured into each accommodation space 11.

[0047] Also, pre-sealed capacitor elements 30 may be used. As a method of pre-sealing the capacitor elements 30, for example, a case having a size and shape capable of accommodating the capacitor elements 30 and capable of being accommodated in the accommodation space 11 is prepared, and the capacitor elements 30 are sealed with the sealing material 40 in the case. By accommodating the pre-sealed capacitor elements 30 in the accommodation space 11 in this way and further pouring the sealing material 40, even if air bubbles enter when the sealing material 40 is poured into the accommodation space 11, insulation between the housing 10 and the capacitor elements 30 can be surely ensured. The case is preferably made of an insulating material, for example, a synthetic resin. The sealing material 40 filled in the case (for pre-sealing the capacitor elements 30) may be the same as or different from the one filled in the accommodation space 11.

Explanation of Reference Numerals

[0048] 1 Power conversion device 10 Housing 11 Accommodation space 11a Opening 12 Wall part 13 Connecting part 14 Screw 20 Capacitor 30 Capacitor element 31 First electrode surface 32 Second electrode surface 33 Bulging part 34 Side surface 34a Flat part 34b Curved part 40 Sealing material 50, 50A, 50B Bus bar assembly 60 Base part 60a Through hole 61 Fixing part 70 Positive and negative bus bars 71 Positive bus bar 72 Substrate part 72a Hole 73 Element connection part 74 Circuit connection part 75 Negative bus bar 76 Substrate part 76a Hole 77 Element connection part 78 Circuit connection part 80 Heat dissipation member 81 Substrate part 81a Hole 82 Housing connection part

Claims

1. A capacitor in which a capacitor element is housed in a housing space provided in an object to be attached and a sealing material is poured in, comprising a bus bar assembly connected to the capacitor element, the bus bar assembly including a base portion, positive and negative bus bars insert-molded in the base portion, and a through hole provided at a position facing the capacitor element when the capacitor element and the positive and negative bus bars are connected for pouring the sealing material into the housing space, the positive and negative bus bars including a substrate portion through which the through hole passes and an element connection portion extending from the substrate portion for connection to the capacitor element, the capacitor, wherein the substrate portion is located outside the sealing material.

2. The capacitor according to claim 1, wherein the base portion includes a fixing portion for fixing the bus bar assembly to the object to be attached.

3. The capacitor according to claim 1 or 2, wherein the size of the through hole is approximately the same as the area of the facing surface of the capacitor element facing the substrate portion.

4. The capacitor according to any one of claims 1 to 3, wherein when one positive bus bar and one negative bus bar are used as a set of positive and negative bus bars, a plurality of sets of positive and negative bus bars are insert-molded in the base portion.

5. The capacitor according to any one of claims 1 to 4, wherein a heat radiating member is insert-molded in the base portion.

6. The capacitor according to any one of claims 1 to 5, wherein a plurality of capacitor elements are housed in one housing space.

7. A power conversion device including the capacitor according to any one of claims 1 to 6, the power conversion device, wherein the object to be attached is a housing of the power conversion device.

Images