Sensor device

Abstract

To improve spatial resolution of sensor devices.SOLUTION: A sensor device is provided, comprising multiple substrates arranged side-by-side in a thickness direction thereof, and multiple sensors arranged along the multiple substrates, where each of the multiple sensors is provided at a different position in plane view of the multiple substrates.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a sensor device.

Background Art

[0002] For example, Patent Document 1 discloses a technique for detecting wall thickness reduction of a pipe based on sensing data of a plurality of magnetic sensors provided for the pipe.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In order to improve the spatial resolution of a sensor device, it is necessary to arrange a plurality of sensors at a high density. However, due to the package size of the sensors, peripheral components, wiring, etc., there are limitations.

[0005] One aspect of the present invention is to improve the spatial resolution of a sensor device.

Means for Solving the Problems

[0006] The sensor device according to one aspect includes a plurality of substrates arranged side by side in the substrate thickness direction, and a plurality of sensors arranged over the plurality of substrates. When the plurality of substrates are viewed in plan view, each of the plurality of sensors is arranged at a different position.

Effects of the Invention

[0007] According to the present invention, the spatial resolution of the sensor device can be improved.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described with reference to the drawings. The same elements are denoted by the same reference numerals, and redundant descriptions will be omitted as appropriate.

[0010] FIG. 1 is a diagram showing an example of the schematic configuration of a sensor system including a sensor device according to an embodiment. The sensor system 1 is used, for example, for monitoring an object. As the object, a pipe 9 is exemplified. In a non - conflicting range, the pipe 9 may be appropriately replaced with other objects. Details of the pipe 9 will be described later.

[0011] The sensor system 1 includes a sensor device 2 and an information processing device 7. The sensor device 2 and the information processing device 7 are communicatively configured so that at least data can be transmitted from the sensor device 2 to the information processing device 7.

[0012] The sensor device 2 includes a plurality of substrates 3 and a plurality of sensors 4. In FIG. 1, an XYZ coordinate system with respect to the substrate 3 is also shown. The X-axis direction and the Y-axis direction (XY plane direction) correspond to the plane direction of the substrate 3. The Z-axis direction corresponds to the thickness direction of the substrate 3. The XY plane direction is also referred to as the substrate plane direction. The Z-axis direction is also referred to as the substrate thickness direction.

[0013] The plurality of substrates 3 are arranged side by side in the substrate thickness direction (Z-axis direction). The plurality of substrates 3 may be arranged so as to be stacked. In the example shown in FIG. 1, two substrates 3 are illustrated as the plurality of substrates 3. The first substrate among the two substrates 3 is referred to as the substrate 31 and illustrated. The second substrate is referred to as the substrate 32 and illustrated. In the negative Z-axis direction, the substrate 31 and the substrate 32 are arranged in this order.

[0014] The plurality of sensors 4 are arranged over the plurality of substrates 3. This will also be described with reference to FIGS. 2 and 3.

[0015] FIG. 2 is an exploded perspective view showing an example of the schematic configuration of the sensor device. The substrate 31 and the substrate 32 are shown decomposed in the Z-axis direction. The plurality of sensors 4 are separately arranged on the substrate 31 and on the substrate 32.

[0016] Among the plurality of sensors 4, the sensor 4 arranged on the substrate 31 is referred to as the sensor 41 (first sensor) and illustrated. The plurality of sensors 41 are arranged in a two-dimensional array on the substrate 31.

[0017] Among the plurality of sensors 4, the sensor 4 arranged on the substrate 32 is referred to as the sensor 42 (second sensor) and illustrated. The plurality of sensors 42 are arranged in a two-dimensional array on the substrate 32.

[0018] In this example, the plurality of sensors 41 are arranged on the surface of the substrate 31 on the positive Z-axis side. The plurality of sensors 42 are arranged on the surface of the substrate 32 on the positive Z-axis side. In the substrate thickness direction (Z-axis direction), the plurality of sensors 41 and the plurality of sensors 42 are located on opposite sides with the substrate 31 in between.

[0019] FIG. 3 is a diagram showing an example of sensor arrangement. FIG. 3(A) shows an example of sensor arrangement when viewed in the substrate thickness direction, more specifically, in the negative Z-axis direction. The substrate 32 and the sensor 42 located behind the substrate 31 are shown by dashed lines. When a plurality of substrates 3 are viewed in plan (when viewed in the Z-axis direction), the plurality of sensors 4 are each arranged at different positions from each other.

[0020] FIG. 3(B) and FIG. 3(C) show examples of sensor arrangement when viewed in the substrate plane direction, more specifically, in the positive X-axis direction and the negative Y-axis direction. The plurality of sensors 41 arranged on the substrate 31 and the plurality of sensors 42 arranged on the substrate 32 are arranged at different positions from each other in the substrate thickness direction (Z-axis direction). Also, in this example, as shown in FIG. 3(B), the sensors 41 and 42 are alternately arranged in the Y-axis direction. As shown in FIG. 3(C), the sensors 41 and 42 are alternately arranged in the X-axis direction.

[0021] Note that in the example shown in FIG. 3, the plurality of sensors 42 arranged on the substrate 32 are arranged so as to fill between the plurality of sensors 41 arranged on the substrate 31. Therefore, the number of sensors 42 is less than the number of sensors 41. However, it is not limited to this, and the plurality of sensors 41 may be arranged so as to fill between the plurality of sensors 42, and in that case, the number of sensors 41 is less than the number of sensors 42. Also, the sensors 41 and 42 may be arranged so that their numbers are the same.

[0022] According to the sensor device 2, the plurality of sensors 4 can be three-dimensionally arranged over the plurality of substrates 3. Thereby, for example, compared with the case where the plurality of sensors 4 are two-dimensionally arranged on one substrate 3, the interval between the sensors 4 in the substrate plane direction (XY plane direction) can be shortened, and the plurality of sensors 4 can be arranged at high density. Accordingly, the spatial resolution of the sensor device 2 can be improved.

[0023] Note that, for example, peripheral components, wiring, etc. for driving the sensors 4 are arranged between the sensors 4 arranged on the substrate 3. For this reason, there is a limit to how narrow the interval between the sensors 4 arranged on one substrate 3 can be. This will be explained with reference to FIG.

[0024] 4 is a diagram showing an example of a board layout. The illustrated board 3 may be either board 31 or board 32. The board 3 has a sensor peripheral region R between the sensors 4 arranged on the board 3. Specifically, the sensor peripheral region R is located between the adjacent sensors 4 in the X-axis direction, the Y-axis direction, and in the direction between them (diagonal direction).

[0025] Some elements arranged in the sensor peripheral region R are illustrated by symbols as components P and wiring L. Examples of the components P include resistors, coils, and capacitors. Examples of the wiring L include power lines, signal lines, ground lines, and land patterns.

[0026] 4 with the previously described FIG. 3A, when viewed in the substrate thickness direction (Z-axis direction), at least some of the sensors 42 among the multiple sensors 42 arranged on the substrate 32 may overlap with the sensor peripheral region R of the substrate 31. Similarly, at least some of the sensors 41 among the multiple sensors 41 arranged on the substrate 31 may overlap with the sensor peripheral region R of the substrate 32. Since the sensors 4 can be arranged so as to overlap with the sensor peripheral region R, a high-density arrangement of multiple sensors 4 becomes possible.

[0027] Returning to FIG. 1 , the piping 9 will be described. The piping 9 may be made of metal, such as carbon steel. The piping 9 may be magnetized in advance. There are no particular limitations on the magnetization method, and the method disclosed in Patent Document 1, for example, may be used.

[0028] The sensor device 2 is attached to the pipe 9 and detects the magnetic field generated around the pipe 9. In this case, the sensor 4 is a magnetic sensor. Hereinafter, it is assumed that the sensor 4 is a magnetic sensor that detects the magnetic flux density. For example, the magnetic flux density in three axial directions is detected by the sensor 4.

[0029] The sensor device 2 is attached to the pipe 9 such that a plurality of sensors 4 face the side surface of the pipe 9. The plurality of sensors 4 are installed in an array, for example, with respect to the side surface of the pipe 9.

[0030] In one embodiment, the plurality of substrates 3 may all be flexible substrates having flexibility. The sensor device 2 can be attached to the pipe 9 such that the plurality of substrates 3 fit the side surface of the pipe 9. Attachment of the sensor device 2 to various arbitrary shapes, not limited to the illustrated shape of the pipe 9, becomes easy.

[0031] The magnetic flux density is detected at the position of each of the plurality of sensors 4 attached to the pipe 9. The data indicating the detection results of the plurality of sensors 4 is referred to as sensing data. This sensing data is data indicating the distribution of the magnetic flux density along the side surface of the pipe 9 and is transmitted from the sensor device 2 to the information processing device 7.

[0032] The information processing device 7 monitors the pipe 9 based on the sensing data from the sensor device 2. Monitoring of the pipe 9 includes detection of a decrease in the thickness (thinning) of the pipe 9. Specifically, when the pipe 9 corrodes and thinning occurs, leakage magnetic flux corresponding to the thinned portion is generated, and the magnetic flux density distribution shown in the sensing data changes. The information processing device 7 detects the occurrence of thinning of the pipe 9, and thus the occurrence of corrosion or the like, based on such a change in the magnetic flux density distribution.

[0033] The specific method for detecting the wall thinning of the pipe 9 based on the change in the magnetic flux density distribution is not particularly limited, and various known algorithms and the like may be used. For example, based on the comparison result between the magnetic flux density distribution shown in the reference data and the magnetic flux density distribution shown in the sensing data obtained from the sensor device 2, the wall thinning of the pipe 9 may be detected. This method is also referred to as pattern matching or the like. Alternatively, as shown in Patent Document 2, the wall thinning of the pipe 9 may be detected based on the frequency distribution of the determination index based on the difference between the reference data and the sensing data obtained from the sensor device 2.

[0034] The information processing device 7 is designed to be able to execute, for example, the above algorithms. The design may be a hardware design or a software design. The information processing device 7 may be realized using a general-purpose computer such as a PC.

[0035] In the sensor system 1 described above, by using the sensor device 2, the pipe 9 can be monitored non-destructively. In the sensor device 2, a plurality of sensors 4 are arranged at high density over a plurality of substrates 3. Accordingly, the spatial resolution of the sensor device 2 can be improved. If the object is the pipe 9, the magnetic flux density distribution along its side surface can be detected more accurately, and the monitoring accuracy can be improved.

[0036] For example, when the sensor device 2 includes only one substrate 31, the magnetic flux density between the sensors 41 on the substrate 31, that is, in the sensor peripheral region R of the substrate 31, cannot be detected, and it becomes difficult to detect the wall thinning at that position. By including the substrate 32 in the sensor device 2, the magnetic flux density in the sensor peripheral region R of the substrate 31 can be detected by the sensor 42 on the substrate 32. The possibility of detecting the wall thinning at that position also increases. As a result, the detection rate of the wall thinning of the pipe 9 can be improved.

[0037] <Modification Example> The disclosed technology is not limited to the above-described embodiment. Some modification examples will be described.

[0038] In the above embodiment, the case where the sensor device 2 includes two substrates 3, i.e., substrate 31 and substrate 32, as a plurality of substrates 3 has been described as an example. However, the sensor device 2 may include three or more substrates 3. By arranging a plurality of sensors 4 at a higher density, the spatial resolution of the sensors can be further improved.

[0039] In the above embodiment, the case where the sensor 4 is a magnetic sensor has been described as an example. However, various sensors other than magnetic sensors may be used as the sensor 4. Also, various objects other than the pipe 9 can be the object.

[0040] In one embodiment, the plurality of substrates 3 may be identical design substrates that are arranged with their positions shifted from each other in the substrate surface direction (XY plane direction). By unifying the substrates, advantages such as cost reduction and easier component management can be obtained. This will be described with reference to FIGS. 5 and 6.

[0041] FIG. 5 is an exploded perspective view showing an example of the schematic configuration of the sensor device. Substrate 31 and substrate 32 are exemplified as the plurality of substrates 3. Substrate 32 is a substrate designed the same as substrate 31. The number and arrangement positions of the sensors 4 that can be arranged on substrate 32 are the same as those on substrate 31.

[0042] In this example, the number of sensors 42 actually arranged on substrate 32 is less than the number of sensors 41 arranged on substrate 31. The portion on substrate 32 where no sensor 42 is arranged (unmounted portion) is virtually shown by a dashed-dotted line.

[0043] FIG. 6 is a diagram showing an example of sensor arrangement. In FIG. 6(A), among substrate 32 and sensor 42, the portions located behind substrate 31 and sensor 41 are shown by broken lines. As before, the plurality of sensors 41 and the plurality of sensors 42 are arranged at different positions from each other in the substrate surface direction (XY plane direction).

[0044] As shown in (B) of FIG. 6 and (C) of FIG. 6, the plurality of sensors 41 and the plurality of sensors 42 are arranged at different positions from each other in the substrate thickness direction (Z-axis direction). Further, in the Y-axis direction and the X-axis direction, the sensors 41 and the sensors 42 are alternately arranged.

[0045] In one embodiment, the sensor device 2 may include a substrate holder that holds a plurality of substrates 3. Various known holder configurations may be adopted. Some substrate holders expand and contract due to temperature changes and the like. In particular, if the expansion and contraction rate of the substrate 3 and the expansion and contraction rate of the substrate holder 5 are different from each other, unexpected expansion, contraction, bending and other forces may be generated on the substrate 3 and the sensor 4 due to the expansion and contraction of the substrate holder, and the detection result of the sensor 4 may fluctuate. To address such problems, the substrate holder may hold the plurality of substrates 3 so that the plurality of substrates 3 are not affected by the expansion and contraction of the substrate holder. This will be described with reference to FIGS. 7 to 9.

[0046] FIGS. 7 to 9 are diagrams showing an example of the schematic configuration of the sensor device. FIG. 7 is an exploded perspective view of the sensor device 2. FIG. 8 is a perspective view of the sensor device 2. FIG. 9 is a perspective view showing an example of the schematic configuration of the substrate holder 5 to be described later.

[0047] As shown in FIG. 7, the substrate 31 includes a screw hole 31b, and the substrate 32 includes a screw hole 32b. The screw hole 31b is provided near one end portion (the portion on the negative X-axis direction side) in the longitudinal direction of the substrate 31. Similarly, the screw hole 32b is provided near one end portion of the substrate 32.

[0048] The sensor device 2 further includes a substrate holder 5, a screw 61, and a screw 62. The substrate holder 5 is provided between the substrate 31 and the substrate 32, holds the substrate 31 on one surface (the surface on the positive Z-axis direction side), and holds the substrate 32 on the other surface (the surface on the negative Z-axis direction side). The substrate holder 5 may be housed in a housing (not shown) in a state where the substrate 31 and the substrate 32 are held. Some elements of the substrate holder 5 will be described.

[0049] The substrate holder 5 includes screw holes 50b. Screws (not shown) for fixing the substrate holder 5 to the housing are inserted through the screw holes 50b. In this example, the substrate holder 5 includes screw holes 50b at both ends in the longitudinal direction (X-axis direction), and that portion is fixed to a housing (not shown).

[0050] The substrate holder 5 includes a fixing surface 51a, screw holes 51b, and elastic fixing portions 51c. In the longitudinal direction (X-axis direction) of the substrate holder 5, the fixing surface 51a is provided between the screw holes 51b and the elastic fixing portions 51c. In other words, the screw holes 51b and the elastic fixing portions 51c are provided on opposite sides with the fixing surface 51a therebetween. In this example, screw holes 51b are provided near one end in the longitudinal direction of the substrate holder 5 (the end on the negative X-axis direction side), and elastic fixing portions 51c are provided near the other end (the end on the positive X-axis direction side).

[0051] The fixing surface 51a abuts against a part of the substrate 31 so as to support the substrate 31 toward the side opposite to the substrate holder 5 (the positive Z-axis direction side). In this example, the fixing surface 51a is a pair of fixing surfaces 51a, 51a, and abuts against a part of the edge portions at both ends in the short-side direction (Y-axis direction) of the substrate 31.

[0052] A screw 61 is fitted into the screw hole 51b. The screw 61 passes through the screw hole 31b of the substrate 31 and is fitted into the screw hole 51b of the substrate holder 5 so as to press and fix the substrate 31 to the substrate holder 5.

[0053] The elastic fixing portions 51c press and fix the substrate 31 to the substrate holder 5. In this example, the elastic fixing portions 51c are a pair of elastic fixing portions 51c, 51c, and have a hook shape that abuts against a part of the edge portions at both ends in the short-side direction (Y-axis direction) of the substrate 31. The elastic fixing portions 51c are elastically deformable.

[0054] The substrate 31 is firmly fixed to the substrate holder 5 by the screw holes 51b and the screws 61, while being flexibly fixed to the substrate holder 5 by the elastic fixing portion 51c. In this example, in the longitudinal direction (X-axis direction), since the screw holes 51b and the screws 61 only fix the substrate 31 and the substrate holder 5 at one location, the substrate 31 can expand and contract independently of the expansion and contraction of the substrate holder 5. In the short-side direction (Y-axis direction), since the elastic fixing portion 51c fixes both sides of the substrate 31 and the substrate holder 5, the substrate 31 can expand and contract independently of the expansion and contraction of the substrate holder 5.

[0055] According to the above configuration, even when the substrate holder 5 expands and contracts at a different expansion and contraction rate from the substrate 31 and the sensor 41 due to a temperature change or the like, the difference in expansion and contraction is absorbed. Therefore, it is possible to prevent the substrate 31 and the sensor 41 from being affected by the expansion and contraction of the substrate holder 5.

[0056] Regarding the substrate 32 as well, the substrate holder 5 includes a fixing surface (not shown in the figure), screw holes 52b, and an elastic fixing portion 52c. Since these are the same as the above fixing surface 51a, screw holes 51b, and elastic fixing portion 51c, the description is omitted.

[0057] Note that three or more substrates 3 may be arranged in the substrate thickness direction (Z-axis direction). In that case, a plurality of substrate holders 5 may be housed in the same housing and fixed within the housing. For example, the screw holes 50b of each substrate holder 5 may be inserted and fixed with long screws. A washer having a relatively large thickness may be interposed between the peripheral portions of the screw holes 50b. The plurality of sensors 4 may be arranged so as to be evenly spaced over all the substrates 3.

[0058] A plurality of substrates 3 may be arranged side by side in the substrate surface direction (XY plane direction). In that case, one substrate holder 5 may be configured to support two or more substrates 3 arranged side by side in the substrate surface direction. Alternatively, a plurality of substrate holders 5 may be housed in the housing so as to be arranged side by side.

[0059] When using a combination of a plurality of substrate holders 5 as described above, the position of the sensor 4 can be shifted by changing the positions of the screw holes 50b, 51b, etc. in the substrate holder 5.

[0060] For example, when the sensor 41 is a magnetic sensor, the material of the substrate holder 5 may be a non-magnetic material. It is possible to prevent the influence on the detection performance of the sensor 41 and the like due to the magnetization of the substrate holder 5.

[0061] The technology described above is specified as follows, for example. One of the disclosed technologies is the sensor device 2. As described with reference to FIGS. 1 to 3 and the like, the sensor device 2 includes a plurality of substrates 3 arranged side by side in the substrate thickness direction (Z-axis direction), and a plurality of sensors 4 arranged over the plurality of substrates 3. When the plurality of substrates 3 are viewed in plan (when viewed in the Z-axis direction), each of the plurality of sensors 4 is arranged at a different position from each other.

[0062] According to the above-described sensor device 2, by arranging a plurality of sensors 4 over a plurality of substrates 3, the interval between the sensors 4 in the substrate surface direction (XY plane direction) can be made shorter than when arranged on one substrate 3, for example, and a plurality of sensors 4 can be arranged at a high density. Therefore, the spatial resolution of the sensor device 2 can be improved.

[0063] As described with reference to FIGS. 1 to 3 and the like, the plurality of substrates 3 include a substrate 31 (first substrate) and a substrate 32 (second substrate), and the plurality of sensors 4 include a plurality of sensors 41 (first sensors) arranged on the substrate 31 and a plurality of sensors 42 (second sensors) arranged on the substrate 32. In the substrate thickness direction (Z-axis direction), the plurality of sensors 41 arranged on the substrate 31 and the plurality of sensors 42 arranged on the substrate 32 may be arranged at different positions from each other. Also, in the substrate surface direction (XY plane direction), the sensors 41 and 42 may be arranged alternately. For example, by arranging a plurality of sensors 4 three-dimensionally over a plurality of substrates 3 in this way, a plurality of sensors 4 can be arranged at a high density.

[0064] As described with reference to FIGS. 3 and 4 and the like, each of the plurality of substrates 3 has a sensor peripheral region R in which the component P and the wiring L are arranged between the sensors 4 arranged on the substrate 3. When the plurality of substrates 3 are viewed in plan (when viewed in the Z-axis direction), at least some of the plurality of sensors 42 arranged on the substrate 32 may overlap with the sensor peripheral region R of the substrate 31. Thereby, even when there is a sensor peripheral region R where the sensor 4 cannot be arranged on the substrate 3, the plurality of sensors 4 can be arranged at high density.

[0065] As described with reference to FIG. 1 and the like, the plurality of substrates 3 may have flexibility. Thereby, it becomes easy to attach the sensor device 2 to an object having an arbitrary shape.

[0066] As described with reference to FIGS. 5 and 6 and the like, the plurality of substrates 3 may be identical design substrates arranged with their positions shifted from each other in the substrate surface direction (XY plane direction). By unifying the substrates 3, merits such as cost reduction and easy component management can be obtained.

[0067] As described with reference to FIGS. 7 to 9 and the like, the sensor device 2 includes a substrate holder 5 that holds the plurality of substrates 3, and the substrate holder 5 may hold the plurality of substrates 3 so that the plurality of substrates 3 are not affected by the expansion and contraction of the substrate holder 5. Thereby, it is possible to suppress fluctuations in the detection results of the sensor 4 that may occur due to the expansion and contraction of the substrate holder 5.

[0068] As described with reference to FIG. 1 and the like, all of the plurality of sensors 4 are magnetic sensors, and the sensor device 2 may be attached to a metal object (for example, a pipe 9). Thereby, it is possible to detect the occurrence of corrosion in the object. The sensor device 2 may be attached to the pipe 9 so that the plurality of sensors 4 face the side surface of the pipe 9. Thereby, it is possible to detect the occurrence of wall thinning of the pipe 9.

[0069] Among the technical features described so far, the non-exclusive technical features may be combined as appropriate.

[0070] Some examples of combinations of the disclosed technical features are described below. (1) A plurality of substrates arranged side by side in the substrate thickness direction, A plurality of sensors arranged over the plurality of substrates, Comprising, When the plurality of substrates are viewed in plan view, each of the plurality of sensors is arranged at a different position, Sensor device. (2) The plurality of substrates are A first substrate, A second substrate, Including, The plurality of sensors are A plurality of first sensors arranged on the first substrate, A plurality of second sensors arranged on the second substrate, Including, In the substrate thickness direction, the plurality of first sensors arranged on the first substrate and the plurality of second sensors arranged on the second substrate are arranged at different positions from each other. The sensor device according to (1). (3) In the substrate plane direction, the first sensor and the second sensor are arranged alternately. The sensor device according to (2). (4) Each of the plurality of substrates has a sensor peripheral region in which components and wirings are arranged between the sensors arranged on the substrate, When the plurality of substrates are viewed in plan view, at least some of the plurality of second sensors arranged on the second substrate overlap with the sensor peripheral region of the first substrate. The sensor device according to (2) or (3). (5) The plurality of substrates are flexible. The sensor device according to any one of (1) to (4). (6) The plurality of substrates are identical designed substrates arranged with their positions shifted from each other in the substrate surface direction. The sensor device according to any one of (1) to (5). (7) Comprising a substrate holder for holding the plurality of substrates. The substrate holder holds the plurality of substrates so that the plurality of substrates are not affected by the expansion and contraction of the substrate holder. The sensor device according to any one of (1) to (6). (8) All of the plurality of sensors are magnetic sensors. The sensor device is attached to a metal object. The sensor device according to any one of (1) to (7). (9) Attached to the pipe so that the plurality of sensors face the side surface of the pipe. The sensor device according to any one of (1) to (8).

Explanation of Signs

[0071] 1 Sensor system 2 Sensor device 3 Substrate 31 Substrate 31b Screw hole 32 Substrate 32b Screw hole 4 Sensor 41 Sensor 42 Sensor 5 Substrate holder 50b Screw hole 51a Fixed surface 51b Screw hole 51c Elastic fixing part 52b Screw hole 52c Elastic fixing part 61 Screw 62 Screw 7 Information processing device 9 Pipe L Wiring P part Area around R sensor

Claims

1. A plurality of substrates including a first substrate and a second substrate arranged side by side in the substrate thickness direction, a plurality of sensors including a plurality of first sensors arranged on the first substrate and a plurality of second sensors arranged on the second substrate, comprising: When the plurality of substrates are viewed in plan view, in the substrate thickness direction, the plurality of first sensors arranged on the first substrate and the plurality of second sensors arranged on the second substrate are arranged at different positions from each other, Each of the plurality of substrates has a sensor peripheral region where components and wirings are arranged between the sensors arranged on the substrate, When the plurality of substrates are viewed in plan view, at least some of the plurality of second sensors arranged on the second substrate overlap with the sensor peripheral region of the first substrate, A sensor device.

2. In the substrate surface direction, the first sensor and the second sensor are arranged alternately, The sensor device according to claim 1.

3. The plurality of substrates have flexibility, The sensor device according to claim 1 or 2.

4. The plurality of substrates are identical design substrates arranged with their positions shifted from each other in the substrate surface direction, The sensor device according to claim 1 or 2.

5. Comprising a substrate holder for holding the plurality of substrates, The substrate holder holds the plurality of substrates so that the plurality of substrates are not affected by the expansion and contraction of the substrate holder, The sensor device according to claim 1 or 2.

6. All of the plurality of sensors are magnetic sensors, The sensor device is attached to a metal object, The sensor device according to claim 1 or 2.

7. Attached to the pipe so that the plurality of sensors face the side surface of the pipe, The sensor device according to claim 1 or 2.

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