Cooling device and cooling system

Abstract

To provide a cooling device which allows attachment / detachment and post-attachment, and can lower a temperature of a space in a casing without forming a ventilation hole at a wall body of the casing, and a cooling system.SOLUTION: In a cooling system of the present embodiment, an outside unit 20 and an inside unit 50 comprise Peltier modules 43, 63 or the like, heat sinks 41, 61, fans 47, 67, and magnets 28a, 58c or the like. The Peltier modules 43, 63 or the like have heat absorption faces 43a, 63a or the like for absorbing heat when supplied with DC power, and heat generation faces 43b, 63b or the like for generating heat. In the heat sinks 41, 61, flat parts 41b, 61b are thermally coupled to the heat generation face 43b and the heat absorption face 63a of the Peltier modules 43, 63 or the like, and the fans 47, 67 make air contacting with fins 41a, 61a of the heat sinks 41, 61 circulate. The magnets 28a, 58c or the like detachably attach the Peltier modules 43, 63 or the like and the heat sinks 41, 61 to a casing 11.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a cooling device and a cooling system for cooling the internal space of a housing having a plate-shaped wall such as a control panel, a distribution board, or a sub-distribution board.

Background Art

[0002] As a device for cooling the inside of a box-shaped housing such as a control panel, a distribution board, or a sub-distribution board, for example, there is a "panel cooler" disclosed in Patent Document 1 below. This panel cooler is attached and used outside an electrical equipment housing box (referred to as a "panel" in the columns of [Background Art] and [Problems to be Solved by the Invention]) such as a distribution board. An operating fluid cooled by a Peltier unit having a Peltier element is circulated through a radiator, and cold air heat-exchanged by this radiator is sent into the panel by a cooling fan to cool the inside of the panel.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, since the panel cooler disclosed in Patent Document 1 is attached and used outside the panel, its presence can interfere with the movement of people and objects and work. Therefore, for example, in a working environment where a panel cooler is required only for a specific period (such as summer when the temperature inside the panel is likely to rise), there may be a desire to attach the panel cooler to the panel only during that period and remove the panel cooler from the panel otherwise. Further, as shown in FIGS. 4 and 5 of Patent Document 1, in this panel cooler, in order to send cold air from a radiator outside the panel into the panel and take in the air inside the panel into the radiator, it is necessary to form a plurality of ventilation holes in the side surface and ceiling of the panel.

[0005] However, in the board cooler of Patent Document 1, the technical consideration has not been made until it is removed after being attached to the board. Therefore, there may be problems such that the board cooler cannot be removed from the board due to its structure, or that the removal is possible but involves very complicated work, or that the board cooler cannot be retrofitted to an existing board. Further, a plurality of ventilation holes described above are formed on the side surface and the ceiling of the board after the board cooler is removed. Therefore, when it is necessary to prevent the intrusion of foreign matters such as dust and dirt, the work of closing such a plurality of ventilation holes may also occur after the board cooler is removed.

[0006] The present invention has been made to solve the above-described problems, and an object thereof is to provide a cooling device and a cooling system that can be attached and detached and retrofitted, and can lower the temperature of the space inside the housing without providing ventilation holes in the wall of the housing.

Means for Solving the Problems

[0007] To achieve the above object, the technical means of claim 1 described in the claims is adopted. According to this means, the cooling device includes a thermoelectric conversion unit, a heat exchange unit, a ventilation unit, and a mounting unit. The thermoelectric conversion unit has a heat absorption side that absorbs heat and a heat generation side that generates heat when DC power is supplied. One surface of the heat exchange unit is thermally coupled to the heat generation side or the heat absorption side of the thermoelectric conversion unit, and the ventilation unit circulates air that contacts the other surface of the heat exchange unit or circulates the air that has contacted the other surface. The mounting unit detachably mounts at least the thermoelectric conversion unit and the heat exchange unit to the housing. Thereby, it becomes possible to attach and detach the thermoelectric conversion unit and the heat exchange unit to and from the housing. Further, it also becomes possible to retrofit an existing housing. A typical example of a rectangular box-shaped housing having a plate-like wall is the housing of a control panel, and the top plate, side plates, bottom plate, and door of the housing are often all made of iron steel plates. Therefore, the plate-like wall has a flat inner wall surface (inner surface) and outer wall surface (outer surface) that are easily attracted by magnetic force.

[0008] Furthermore, (1) when the heat exchange unit is thermally coupled to the heat generation side of the thermoelectric conversion unit, the heat absorption side of the thermoelectric conversion unit is thermally coupled to the outer surface of the wall of the housing such that at least the thermoelectric conversion unit and the heat exchange unit can be One facing each other with the inner space in between thermally coupled to the outer surface of the wall of the housing by the mounting portion housing is attracted by magnetic force to the outer surface of By being mounted, the heat absorbed by the heat absorption side of the thermoelectric conversion unit from the outer surface of the wall body is dissipated outside the housing through the heat exchange unit as the heat generated by the heat generation side of the thermoelectric conversion unit, so the temperature of the wall body of the housing decreases. Further, (2) when the heat exchange unit is thermally coupled to the heat absorption side of the thermoelectric conversion unit, at least the thermoelectric conversion unit and the heat exchange unit can be thermally coupled to the inner surface of the wall body of the housing One facing each other with the inner space in between such that at least the thermoelectric conversion unit and the heat exchange unit are thermally coupled to the inner surface of the wall body of the housing by the mounting portion housing is attracted by magnetic force to the inner surface of By being mounted, the heat absorbed by the heat absorption side of the thermoelectric conversion unit through the heat exchange unit in the space within the housing is transmitted from the inner surface of the wall body to the outer surface of the wall body and dissipated outside the housing as the heat generated by the heat generation side of the thermoelectric conversion unit. Therefore, in both the above (1) and (2), it is possible to lower the temperature of the space within the housing.

[0009] Also, the technical means of claim 2 described in the claims is adopted. According to this means, in the case where the cooling system is an outer cooling device in which the cooling device described in claim 1 is detachably mounted on the outer surface of the wall body in the above (1), in addition to this outer cooling device, the following inner cooling device is included. This inner cooling device includes a heat exchange unit having one surface and the other surface, an air intake and exhaust unit for circulating air contacting the other surface of this heat exchange unit or the air within the housing contacting the other surface, and a mounting unit for detachably mounting at least this heat exchange unit on the housing. And the inner cooling device can thermally couple one surface of such a heat exchange unit to the inner surface of the wall body by magnetic force and is mounted on the housing by the mounting portion housing the inner surface of with respect to is attracted by magnetic force being mounted.

[0010] As a result, in the outer cooling device, the heat absorbed from the outer surface of the housing wall by the heat absorption side of the thermoelectric conversion unit is dissipated to the outside of the housing through the heat exchange unit as the heat generated by the heat generation side of the thermoelectric conversion unit, so that the temperature of the housing wall decreases. Therefore, the inner cooling device is attached to the housing such that one surface of the heat exchange unit can be thermally coupled to the inner surface of such a wall, and thus the temperature of one surface of the heat exchange unit of the inner cooling device also decreases. Accordingly, the air in the space inside the housing that contacts the other surface of the heat exchange unit of the inner cooling device has its heat taken away and its temperature decreases, so that the temperature of the space inside the housing can be further decreased compared to the case where such an inner cooling device is not included.

[0011] Also, the technical means of claim 3 described in the claims is adopted. According to this means, in the case where the cooling system is an inner cooling device detachably attached to the inner surface of the wall body of (2) in claim 1, in addition to this inner cooling device, the following outer cooling device is included. This outer cooling device includes a heat exchange unit having one surface and the other surface, an air supply and intake unit for circulating air that contacts the other surface of this heat exchange unit or the outside air outside the housing that has been contacted, and a mounting unit for detachably mounting at least this heat exchange unit to the housing. And this outer cooling device is mounted on the housing such that one surface of such a heat exchange unit can be thermally coupled to the outer surface of the wall body. by magnetic force When it is the inner cooling device detachably attached to the inner surface of the wall body of (2) in claim 1, in addition to this inner cooling device, the following outer cooling device is included. This outer cooling device includes a heat exchange unit having one surface and the other surface, an air supply and intake unit for circulating air that contacts the other surface of this heat exchange unit or the outside air outside the housing that has been contacted, and a mounting unit for detachably mounting at least this heat exchange unit to the housing. And this outer cooling device is mounted on the housing such that one surface of such a heat exchange unit can be thermally coupled to the outer surface of the wall body. by the mounting portion housing the outer surface of to is attracted by magnetic force be mounted.

[0012] As a result, in the inner cooling device, the heat absorbed by the heat absorption side of the thermoelectric conversion unit through the heat exchange unit in the space inside the housing is transmitted from the inner surface of the wall of the housing to the outer surface of the wall as the heat generated by the heat generation side of the thermoelectric conversion unit. Although the temperature of the wall of the housing rises, one surface of the heat exchange unit of the outer cooling device can be thermally coupled to the outer surface of such a wall. By attaching the outer cooling device to the housing, the heat transmitted to the wall of the housing is further transmitted to one surface of the heat exchange unit of the outer cooling device. Therefore, the heat transmitted to one surface of the heat exchange unit can be released from the other surface of the heat exchange unit to the outside of the housing by the contact of the air outside the housing with the other surface of the heat exchange unit of the outer cooling device. Therefore, the heat generated by the heat generation side of the thermoelectric conversion unit of the inner cooling device escapes to the outside of the housing not only through the path via the wall of the housing but also through the path via the heat exchange unit of the outer cooling device. Compared with the case where such an outer cooling device is not included, it becomes possible to improve the thermoelectric conversion efficiency of the thermoelectric conversion unit of the inner cooling device.

[0013] Also, the technical means of claim 4 described in the claims is adopted. According to this means, in the cooling system described in claim 3, another thermoelectric conversion unit having a heat absorption side that absorbs heat and a heat generation side that generates heat when DC power is supplied is interposed between the outer surface of the wall and one surface of the heat exchange unit. And for this another thermoelectric conversion unit, the heat absorption side is thermally coupled to the outer surface and the heat generation side is thermally coupled to one surface to thermally. Also, the mounting portion mounts another thermoelectric conversion unit to the housing the outer surface of detachably in addition to the heat exchange unit is magnetically attracted so as to be .

[0014] As a result, in the internal cooling device, heat absorbed by the heat absorption side of the thermoelectric conversion unit via the heat exchange unit in the space within the housing is conducted from the inner surface of the wall of the housing to the outer surface of the wall as heat emitted by the heat generation side of the thermoelectric conversion unit, causing the temperature of the wall of the housing to rise, but in the external cooling device, such heat is absorbed from the outer surface of the wall by the heat absorption side of another thermoelectric conversion unit and can be released to the outside of the housing via the heat exchange unit as heat emitted by the heat generation side of another thermoelectric conversion unit. Therefore, the heat generated by the heat generation side of the thermoelectric conversion unit of the internal cooling device escapes to the outside of the housing not only via the wall of the housing but also via the other thermoelectric conversion unit and heat exchange unit of the external cooling device, making it possible to further improve the thermoelectric conversion efficiency of the thermoelectric conversion unit of the internal cooling device compared to a case where an external cooling device having such another thermoelectric conversion unit is not included.

[0015] In addition, the technical means of claim 5 described in the claims is adopted. According to this means, In the case where the wall of the housing is made of a non-magnetic material, the mounting portion A positioning section that determines the mounting positions of the inner cooling device and the outer cooling device so that the devices face each other across the wall. functions as. This This allows the inner and outer cooling devices to be positioned mounting portion that functions as Compared with a case where the thermoelectric conversion of the outer cooling device that is sandwiched between the walls is portion and Heat exchanger for the inner cooling device portion and It is possible to minimize the distance (heat transfer distance) over which heat is transferred or conducted between the other thermoelectric conversion unit of the outer cooling device and the thermoelectric conversion unit of the inner cooling device. It is also possible to minimize the distance (heat transfer distance) over which heat is transferred or conducted between the other thermoelectric conversion unit of the outer cooling device and the thermoelectric conversion unit of the inner cooling device. This makes it possible to improve the heat transfer efficiency between them. It is therefore possible to further improve the thermoelectric conversion efficiency of the thermoelectric conversion units (other thermoelectric conversion units) provided in the inner cooling device and the outer cooling device. [Effects of the Invention]

[0016] In the present invention, it is possible to attach and detach a thermoelectric conversion unit and a heat exchange unit to and from a housing. Further, it is also possible to retrofit an existing housing. Furthermore, in both cases where (1) the heat exchange unit is thermally coupled to the heat generation side of the thermoelectric conversion unit and (2) the heat exchange unit is thermally coupled to the heat absorption side of the thermoelectric conversion unit, it is possible to lower the temperature of the space inside the housing. Therefore, it is detachable (removable), and the space inside the housing can be cooled without providing ventilation holes in the wall of the housing. by the magnetic attraction of the mounting portion Since it is detachable and it is possible to easily attach and detach the thermoelectric conversion unit and the heat exchange unit, except during necessary periods such as summer when the temperature inside the housing is likely to rise, by removing the thermoelectric conversion unit and the heat exchange unit, compared to when they are attached, it is less likely to obstruct the movement of people and objects and work, and it is also possible to easily perform maintenance work, cleaning work, etc. on the housing.

Brief Description of Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the cooling device and the cooling system of the present invention will be described with reference to the drawings. First, a configuration example of the cooling system of the present embodiment (hereinafter referred to as "this cooling system") will be described based on FIGS. 1 to 4. FIG. 1 shows a cross-sectional view showing a state where an outer unit 20 and an inner unit 50 constituting this cooling system are mounted on a housing 11 (side plate 13) of a control panel 10. Further, FIG. 2 shows a front view and the like showing a configuration example of the outer unit 20. Furthermore, FIG. 3 shows a front view and the like showing a configuration example of the inner unit 50. FIG. 4 shows a block diagram and the like showing the electrical configuration of this cooling system.

[0019] In these Figures 1 to 3, the coordinate system shown has the X-axis direction being the thickness direction of the side plate 13 to which the outer unit 20 and the inner unit 50 are attached, or the thickness direction of these units 20 and 50, the Y-axis direction being the plane direction of the side plate 13 or the width direction of these units 20 and 50, and the Z-axis direction being the height direction of the housing 11 (side plate 13) or the height direction of these units 20 and 50, respectively. In this embodiment, since the housing 11 of the control panel 10 is erected on the floor surface or the like, the Z-axis direction is the height direction of the housing 11 and also the direction of gravity.

[0020] As shown in FIG. 1, this cooling system is composed of an outer unit 20 and an inner unit 50, which are attached to the housing 11 of the control panel 10 that is already installed, for example, and have the function of cooling the internal space SP of the housing 11. That is, the outer unit 20 and the inner unit 50 constitute a cooling system that can be retrofitted to an existing control panel 10. The control panel 10 having such an internal space SP to be cooled is an example, and it may be erected on the floor surface in a work space such as in a factory or attached to a pillar. Note that the cross-sectional views of the outer unit 20 and the inner unit 50 shown in FIG. 1 are the cross-sections that appear when these units 20 and 50 are cut along the dashed-dotted line shown in FIGS. 2 and 3 and viewed from the direction of arrow I.

[0021] In this embodiment, the housing 11 of the control panel 10 is a rectangular box-shaped body, which is composed of a top plate 12, side plates 13, a bottom plate, etc. For example, the outer unit 20 is attached to the outer wall surface 13b (outer surface) of the side plate 13, and the inner unit 50 is attached to the inner wall surface 13a (inner surface) of the side plate 13. Note that the side plate 13 may be a door 15. Since the top plate 12, side plates 13, bottom plate, and door 15 of the housing 11 are often composed of iron steel plates (plate-shaped wall bodies), they have flat inner wall surfaces 13a and outer wall surfaces 13b, and the outer unit 20 and the inner unit 50 are attached to such flat surfaces via magnets. Also, many of them have wiring holes, ventilation holes, etc. formed in advance for drawing in electrical wiring, etc. into the housing 11 (internal space SP). Therefore, the predetermined wiring described later is inserted into the housing 11 through such wiring holes, ventilation holes, etc.

[0022] <Outer unit 20> As shown in FIGS. 1 and 2, the outer unit 20 includes a case 21, a handle 22, brackets 23, 24, a base plate 25, a subplate 26, a heat absorption plate 27, four magnets 28a to 28d, a control unit 31, an operation panel 32, a power supply unit 36, a temperature sensor 38, a heat sink 41, five Peltier modules 42 to 46, a fan 47, a filter 48, etc. The outer unit 20 may correspond to an embodiment of the cooling device or the outer cooling device of the present invention.

[0023] The case 21 has a thickness capable of accommodating the heat sink 41 and the fan 47 laminated in the thickness direction as described later, and is formed into a bottomless box body with a convex character shape having a narrow part on both sides in the width direction when viewed from the front (see FIG. 2(A)). In the present embodiment, the case 21 is made of, for example, resin or metal, and a large number of ventilation slits for enabling internal and external ventilation are formed in the front panel and the side panel, and a wiring hole 21a through which a predetermined wiring can be drawn out is formed in the side panel facing downward in the gravitational direction in the mounted state of the outer unit 20. Inside the side panel of the case 21, resin brackets 23, 24 capable of fixing the base plate 25, the subplate 26, the heat absorption plate 27, etc. to the case 21 are attached.

[0024] The handle 22 is a resin handle formed in a U-shape that a user can hold when attaching or detaching the outer unit 20 to or from a side plate 13 or the like (see FIG. 2(E)). In the present embodiment, the handle 22 is provided, for example, on both sides in the width direction where a part of the case 21 is narrowed, and is attached and fixed to the subplate 26 so that both ends of the U-shape are in contact with the subplate 26 described later. In FIG. 2, since the left side view appears as a diagram obtained by vertically inverting the right side view of FIG. 2(E), the illustration is omitted.

[0025] The base plate 25 is a metal plate that serves as the bottom plate of the case 21, and is formed in a convex letter shape that is slightly smaller than the case 21. The base plate 25 is configured to be able to hold the power supply unit 36 and the like, which will be described later, in the case 21 by being attached to the brackets 23 and 24. The subplate 26 is a metal plate formed in a strip shape with a thickness thinner than that of the heat absorption plate 27, similar to the base plate 25, and is attached to the heat absorption plate 27 so as to be exposed from both sides in the width direction of the heat absorption plate 27. The handle 22 is attached to this subplate 26 as described above.

[0026] The heat absorption plate 27 is a thick aluminum plate having a substantially square shape. As will be described later, the inner surface is in close contact with the heat absorption surfaces 42a to 46a of the Peltier modules 42 to 46, and the outer surface can contact the outer wall surface 13b of the side plate 13. Four bottomed holes are formed near the four corners of the heat absorption plate 27, and the magnets 28a to 28d, which will be described later, are embedded in these bottomed holes in a substantially flush state with respect to the outer surface of the heat absorption plate 27 (see FIGS. 1 and 2(B)). In FIG. 2(B), the Peltier modules 42 to 46 in close contact with the inner surface of the heat absorption plate 27 are represented by square broken lines, and in FIG. 1, they are represented by being colored gray.

[0027] The four magnets 28a to 28d are neodymium magnets having a disc shape, and are respectively attached to the four bottomed holes formed in the heat absorption plate 27. In the present embodiment, for example, one surface on the N-pole side (or S-pole side) faces the opening side (i.e., the outer side) of the bottomed hole of the heat absorption plate 27, and the other surface on the S-pole side (or N-pole side) faces the bottom side (i.e., the inner side) of the same bottomed hole, and the four magnets 28a to 28d are press-fitted into their respective bottomed holes so that the surface facing the outside has substantially no step with respect to the outer surface of the heat absorption plate 27. The magnets 28a to 28d, together with the magnets 58a to 58d of the inner unit 50, constitute a mounting portion and a positioning portion as will be described later.

[0028] The heat sink 41 is made of aluminum, has a flat portion 41b on one side formed in a substantially square shape, and on the other side, a large number of rod-shaped fins 41a of the same shape are arranged in a matrix and erected. In this embodiment, the heat sink 41 is a pincushion type heat exchange part having a function of releasing (radiating) the heat transmitted from the flat portion 41b to the outside through the fins 41a, and appears to have a substantially rectangular parallelepiped shape. The flat portion 41b of the heat sink 41 is set to a size slightly smaller than that of the heat absorption plate 27, and five Peltier modules 42 to 46 are sandwiched between the flat portion 41b and the inner surface of the heat absorption plate 27.

[0029] The Peltier modules 42 to 46 are thermoelectric conversion parts having a thin plate square shape composed of a large number of Peltier elements (thermoelectric elements) and two ceramic substrates. The Peltier element is a semiconductor element utilizing the Peltier effect. The Peltier modules 42 to 46 are configured such that a large number of such Peltier elements are electrically connected in series and sandwiched between two ceramic substrates. One ceramic substrate functions as a heat absorption surface 42a to 46a (heat absorption side), and the other ceramic substrate functions as a heat generation surface 42b to 46b (heat generation side). In this embodiment, the power (driving power) supplied to the Peltier modules 42 to 46 is controlled by a control unit 31 described later.

[0030] The fan 47 is an axial flow type air supply and intake part having a function of sucking in from the front of the rotating blades and discharging toward the back, and is formed in a substantially square shape with the front and back having substantially the same size as the flat portion 41b of the heat sink 41. In this embodiment, the fan 47 is arranged such that the back (discharge side) is in contact with the top of the fins 41a of the heat sink 41, and a filter 48 is disposed on the front (suction side). The filter 48 has a function of collecting foreign matters such as dust and preventing them from entering the fan 47, and is provided so as to cover the front of the fan 47 in this embodiment.

[0031] In this embodiment, the five Peltier modules 42 to 46 are arranged in a cross shape on the surface between the heat absorption plate 27 and the heat sink 41, and the heat absorption surfaces 42a to 46a are in close contact with the inner surface of the heat absorption plate 27, and the heat dissipation surfaces 42b to 46b are in close contact with the flat portion 41b of the heat sink 41, respectively, and are sandwiched in a sandwich shape between the heat absorption plate 27 and the heat sink 41. More specifically, the heat sink 41 and the fan 47 laminated in the thickness direction are screwed to the heat absorption plate 27 by four bolts 49, and the Peltier modules 42 to 46 are sandwiched and fixed between the inner surface of the heat absorption plate 27 and the flat portion 41b of the heat sink 41. In this embodiment, the filter 48 is also fastened together with the bolts 49 and attached to the fan 47. Note that a paste-like silicone grease with high thermal conductivity is applied and interposed so that the heat absorption surfaces 42a to 46a and the heat dissipation surfaces 42b to 46b of the Peltier modules 42 to 46 can be thermally coupled to the heat absorption plate 27 and the heat sink 41 over substantially the entire surface.

[0032] The control unit 31 is attached to the front panel of the case 21 together with the operation panel 32 exposed to the outside, and is, for example, a microcomputer unit composed of an MPU, memories (RAM, EEPROM), input / output interfaces, a Peltier driver circuit, a fan driver circuit, etc. (CNT). The control unit 31 receives power supply from the power supply unit 36 attached to the base plate 25 and executes predetermined control processing to control the driving of the Peltier modules 42 to 46 and the fan 47.

[0033] As shown in Fig. 4(A), in addition to the power supply unit 36 that supplies direct current power, an operation panel 32, a temperature sensor 38, Peltier modules 42 to 46, 62 to 66, fans 47, 67, etc. are connected to the control unit 31. The temperature sensor 38 is provided in the internal space SP of the housing 11 to be cooled, and the Peltier modules 62 to 66 and the fan 67 are provided in the inner unit 50 described later. Although not shown, the power supply unit 36 is provided with a power switch (not shown), and the user can start or end the supply of driving power to the control unit 31 by manually performing an on / off operation.

[0034] In this embodiment, the Peltier modules 42 to 46 of the outer unit 20 and the Peltier modules 62 to 66 of the inner unit 50 are configured with the same specifications (the types, sizes, and quantities of the Peltier elements are the same). That is, the Peltier modules 42 to 46 and the Peltier modules 62 to 66 are the same, and are configured such that the thermoelectric conversion (electrothermal conversion) characteristics as thermoelectric elements are within a predetermined allowable range and are substantially the same. In this embodiment, the Peltier modules 42 to 46, 62 to 66 have the maximum heat absorption capacity due to the Peltier effect when, for example, a direct current of 6 A (ampere) is supplied. Therefore, when the supply current exceeds such a maximum current value (6 A in this embodiment), the Joule heat generated by passing a direct current through the Peltier element exceeds the heat absorption capacity due to the Peltier effect, so that the temperature may rise even on the heat absorption surfaces 42a to 46a, 62a to 66a of the Peltier modules 42 to 46, 62 to 66, and the heat absorption efficiency (cooling performance) may decrease.

[0035] Therefore, in the present embodiment, on the premise of suppressing the supply current to be equal to or less than the maximum current value, the ratio between the supply current to the Peltier modules 42 to 46 of the outer unit 20 and the supply current to the Peltier modules 62 to 66 of the inner unit 50 is set to be 5 A (ampere): 2 A (ampere). From the experimental results conducted by the inventors of the present application, as shown in Table 1 below, it has been confirmed that the temperature inside the housing 11 (internal space SP) can be further reduced by increasing the supply current to the Peltier modules 42 to 46 of the outer unit 20 compared to the Peltier modules 62 to 66 of the inner unit 50. When the supply current to the Peltier modules 62 to 66 of the inner unit 50 increases, the amount of heat generated at their heat generation surfaces 62b to 66b also increases. Therefore, it is considered that the resulting temperature rise is the cause of preventing the temperature inside the housing 11 from decreasing.

[0036] The temperature shown in this Table 1 is the temperature difference Tdef (= Tint - Tout) between the temperature Tout outside the housing 11 and the temperature Tint inside the internal space SP during the period from 1 minute 30 seconds to 2 minutes after the start of the supply of the direct current. Therefore, when the temperature Tint inside the internal space SP is lower than the temperature Tout outside the housing 11, a minus (-) sign is attached, and vice versa, a plus (+) sign is attached.

[0037]

Table 1

[0038] From the results in Table 1 above, the temperature difference Tdef (= Tint - Tout) is maximized at -5.0 °C when the ratio of the direct current Io supplied to the Peltier modules 42 - 46 of the outer unit 20 to the direct current Ii supplied to the Peltier modules 62 - 66 of the inner unit 50 is 5A:2A (= Io:Ii). The next largest temperature difference Tdef of -4.5 °C is obtained when the ratio is 4A:3A. Note that temperature differences Tdef of -4 °C and above are -4.3 °C when the ratio is 4A:2A and -4.1 °C when the ratio is 3A:2A. Therefore, as described above, in this embodiment, the ratio is set to 5A:2A (= Io:Ii).

[0039] That is, as will be described later with reference to Fig. 5, the heat absorbed by the Peltier modules 62 - 66 of the inner unit 50 from the heat sink 61 on their heat absorption surfaces is transmitted as heat emitted from their heat emission surfaces to the outer unit 20 etc. via the side plate 13 of the housing 11, and then is absorbed by the heat absorption surfaces of the Peltier modules 42 - 46 of the outer unit 20 and is emitted from the heat sink 41 outside the housing 11 as heat emitted from their heat emission surfaces. Therefore, in this embodiment, the balance between heat dissipation by the outer unit 20 and heat absorption by the inner unit 50 is set to 5:2 as the ratio of the supply currents of the respective Peltier modules 42 - 46, 62 - 66. That is, the direct current values supplied to the respective Peltier modules 42 - 46, 62 - 66 are set at a ratio of 5:2 so that the heat dissipation capacity of the outer unit 20 is higher than the heat absorption capacity of the inner unit 50.

[0040] Strictly speaking, the heat dissipation capacity of the outer unit 20 and the heat absorption capacity of the inner unit 50 depend not only on the supply currents of the Peltier modules 42 to 46 and 62 to 66 provided respectively, but also on the differences in the heat exchange performance of the heat sinks 41 and 61 provided in both units 20 and 50, and the differences in the air supply (intake) performance of the fans 47 and 67. Therefore, the heat dissipation capacity of the outer unit 20 including the heat sink 41 and the fan 47 must exceed the heat absorption capacity of the inner unit 50 including the heat sink 61 and the fan 67. For example, in the results of Table 1 above, when the direct current Io of the outer unit 20 is 5 A, as the current values of both currents Io and Ii approach each other, such as in the ratio of the direct current Io of the outer unit 20 to the direct current Ii of the inner unit 50 being 5 A:3 A or 5 A:4 A, the temperature difference Tdef also becomes smaller.

[0041] This is presumably because the heat dissipation performance of the heat sink 41 provided in the outer unit 20 and the air supply performance of the fan 47 are insufficient, and thus the heat generated by the heat generation surfaces of the Peltier modules 42 to 46 cannot be sufficiently dissipated. When the inner unit excluding the Peltier modules 62 to 66 from the inner unit 50 is used as the inner unit, the heat dissipation capacity of the outer unit 20 including the Peltier modules 42 to 46 and the fan 47 exceeds the heat absorption capacity of such an inner unit. This is because the heat dissipation capacity of the outer unit 20 is enhanced by the Peltier modules 42 to 46.

[0042] As shown in FIG. 4(B), the operation panel 32 includes a display module 33 and operation buttons 34a to 34d, and is connected to the control unit 31. The display module 33 is configured, for example, by a small display with a size of 1 to 2 inches or a 7-segment LED display unit for four digits. The display module 33 is configured to be able to display information such as the current temperature in the internal space SP of the housing 11 detected by the temperature sensor 38 and the temperature (set temperature) set to cool the internal space SP to a predetermined temperature, and is controlled by the control unit 31. The operation buttons 34a to 34d are all push-button switches, and each is controlled by the control unit 31 so that the display module 33 displays as follows when pressed.

[0043] The operation button 34a is, for example, a switch operated when switching the information displayed on the display module 33 to other information. For example, each time it is pressed, the current temperature and the set temperature are alternately displayed. The operation button 34b is a switch operated when the set temperature is displayed on the display module 33, for shifting to the change mode of the set temperature or determining the changed content. The operation buttons 34c and 34d are switches operated when raising (pressing the operation button 34c) or lowering (pressing the operation button 34d) the set temperature when shifting to the change mode of the set temperature. The set temperature changed by operating these operation buttons 34c and 34d is determined by pressing the operation button 34b and stored in the memory (EEPROM) of the control unit 31 to complete the setting.

[0044] The power supply unit 36 is a power supply unit having a function of converting AC power supplied from an external AC power supply into DC power. In this embodiment, in addition to the control unit 31 in the outer unit 20, it is configured to be able to supply DC power to the inner unit 50 outside the outer unit 20. The AC power supplied from the AC power supply AC is supplied through a power cable (not shown) inserted through the wiring hole 21a of the case 21 and drawn into the case 21.

[0045] The temperature sensor 38 is a thermistor or a temperature sensor IC, and is a temperature detection unit that detects the temperature of the internal space SP of the housing 11 and outputs it to the control unit 31. One end of an electrical wiring that is electrically connected to the control unit 31 in the outer unit 20 mounted on the side plate 13 or the like and has a length that can be sufficiently routed into the internal space SP of the housing 11 is electrically connected to the temperature sensor 38. The other end of the electrical wiring is the above-mentioned predetermined wiring that is drawn out from the wiring hole 21a formed in the case 21, and is inserted into the internal space SP via a wiring hole, a ventilation hole, or the like previously formed in the housing 11 of the control panel 10. The temperature sensor 38 is attached, for example, at a substantially central position within the internal space SP or in the vicinity thereof, as shown in FIG. 5 described later.

[0046] When the information on the temperature detected by such a temperature sensor 38 is input, the control unit 31 performs, for example, the following control processes. The control unit 31 determines whether the current temperature of the internal space SP is higher than the set temperature based on the information on the current temperature of the internal space SP input from the temperature sensor 38 and the information on the set temperature set (or default set) by the operation of the operation buttons 34a to 34d (determination process).

[0047] When it is determined that the current temperature of the internal space SP is higher than the set temperature, after supplying direct current to the Peltier modules 42 to 46 of the outer unit 20 and the Peltier modules 62 to 66 of the inner unit 50 according to the above-mentioned ratio (5A: 2A), after a predetermined time (for example, 30 to 60 seconds) has elapsed, the above-mentioned determination process is performed again based on the temperature information detected by the temperature sensor 38. On the other hand, when it is determined that the current temperature of the internal space SP is equal to or lower than the set temperature, after stopping the supply of driving power to both Peltier modules 42 to 46 and 62 to 66 (after determining when no driving power is supplied), after the above-mentioned predetermined time has elapsed, the above-mentioned determination process is performed again based on the temperature information detected by the temperature sensor 38.

[0048] The control process by such a control unit 31 for the Peltier modules 42 to 46 and 62 to 66 is started almost simultaneously when a power switch (not shown) is turned on and driving power is supplied from the power supply unit 36 of the outer unit 20 to the control unit 31, and continues until the power switch is turned off. Thereby, it becomes possible to lower the temperature of the internal space SP of the housing 11 by the cooperation of the cooling operation by the outer unit 20 (the Peltier modules 42 to 46 thereof) and the cooling operation by the inner unit 50 (the Peltier modules 62 to 66 thereof) described later. This will be described in detail later with reference to FIGS. 5 to 7.

[0049] Note that the fan 47 of the outer unit 20 and the fan 67 of the inner unit 50 are controlled by the control unit 31 so as to start almost simultaneously when a power switch (not shown) is turned on and driving power is supplied from the power supply unit 36 of the outer unit 20 to the control unit 31, and stop almost simultaneously when the power switch is turned off. That is, in the present embodiment, the start and stop of the fans 47 and 67 are not linked to the drive control of the Peltier modules 42 to 46 and 62 to 66.

[0050] <Inner unit 50> As shown in FIGS. 1 and 3, the inner unit 50 is composed of a case 51, a handle 52, a bracket 53, a sub-plate 56, a heat dissipation plate 57, four magnets 58a to 58d, a drain 59, a heat sink 61, five Peltier modules 62 to 66, a fan 67, a cover 68, etc. The inner unit 50 is different from the outer unit 20 in that it is not provided with a base plate, a control unit, etc., the bracket 53 is provided only on one side, and a drain 59 not provided in the outer unit 20 is provided. The inner unit 50 can correspond to an embodiment of the cooling device or the inner cooling device of the present invention.

[0051] Similar to the case 21 of the outer unit 20 described above, the case 51 has a thickness capable of accommodating the heat sink 61 and the fan 67 laminated in the thickness direction, and is formed into a bottomless box body with a convex character shape where a part of both sides in the width direction is narrow in a front view (see Fig. 3(A)). Compared with the case 21, the case 51 has a smaller height direction length of the portion where the width direction is wider and a large number of ventilation slits are formed in a front view. Similar to the case 21, the case 51 is made of resin or metal, and a large number of ventilation slits are formed in the front panel and the side panels. In addition to the wiring hole 51a through which predetermined wiring can be drawn out to the outside, notches 51b for protruding the discharge port 59a of the drain 59 described later to the outside are formed in the side panels facing downward in the gravity direction in the mounted state of the inner unit 50, respectively. Inside the side panel of the case 51, a resin bracket 53 capable of fixing the sub-plate 56, the heat dissipation plate 57, etc. to the case 51 is attached.

[0052] The handle 52 is a resin handle formed in a U shape that a user can hold when attaching or detaching the inner unit 50 to or from the side plate 13 or the like (see Fig. 3(E)). In the present embodiment, the handle 52 is provided, for example, on each of both sides in the width direction where a part of the case 51 becomes narrow, and is attached and fixed to the sub-plate 56 so that both ends of the U shape are in contact with the sub-plate 56. In Fig. 3, since the left side view appears as a diagram obtained by vertically inverting the right side view of Fig. 3(E), the illustration is omitted.

[0053] The sub-plate 56 is configured in the same manner as the sub-plate 26 of the outer unit 20, and is attached to the heat dissipation plate 57 so as to be exposed from both sides in the width direction of the heat dissipation plate 57. The handle 52 is attached to this sub-plate 56 as described above.

[0054] The heat radiating plate 57 is also configured in the same manner as the heat absorbing plate 27 of the outer unit 20 in terms of material, dimensions, shape, etc. However, the inner surface is in close contact with the heat generating surfaces 62b to 66b of the Peltier modules 62 to 66, and the outer surface can be in contact with the inner wall surface 13a of the side plate 13. Four bottomed holes are also formed near the four corners of the heat radiating plate 57, and magnets 58a to 58d are embedded in these bottomed holes in a state substantially flush with the outer surface of the heat radiating plate 57 (see FIGS. 1 and 3(B)). In FIG. 3(B), the Peltier modules 62 to 66 in close contact with the inner surface of the heat radiating plate 57 are represented by square dashed lines, and in FIG. 1, they are represented in gray coloring.

[0055] The four magnets 58a to 58d are neodymium magnets having a disc shape and are respectively attached to the four bottomed holes formed in the heat radiating plate 57. In the present embodiment, when the outer unit 20 and the inner unit 50 face each other, the magnets of both are attracted to facilitate positioning at a predetermined position. The heat radiating plate 57 is attached so as to have a polarity opposite to that of the magnets 28a to 28d of the outer unit 20. For example, one surface on the S pole side (or N pole side) faces the opening side (i.e., the outer side) of the bottomed hole of the heat radiating plate 57, and the other surface on the N pole side (or S pole side) faces the bottom side (i.e., the inner side) of the same bottomed hole, and the four magnets 58a to 58d are press-fitted into their respective bottomed holes so that the surface facing the outside has substantially no step with respect to the outer surface of the heat radiating plate 57.

[0056] "Predetermined positioning" means that the two units 20 and 50 are opposed to each other so that the distance (heat transfer distance) for heat to be transferred or conducted between the Peltier modules 42 to 46 of the outer unit 20 and the Peltier modules 62 to 66 of the inner unit 50 becomes the shortest, and their respective positions are determined. As will be described later, the magnets 58a to 58d of the inner unit 50 and the magnets 28a to 28d of the outer unit 20, as positioning portions, enable the positioning of the two units 20 and 50 so that such a heat transfer distance becomes the shortest, and also, as mounting portions, enable the two units 20 and 50 to be mounted on the housing 11.

[0057] The drain 59 is a water receiving part that can receive moisture and water droplets that have condensed inside the case 51 and adhered to the heat sink 61 or the like on the lower side in the gravity direction of the heat sink 61. The drain 59 is made of resin and is a bottomed box body having an elongated rectangular opening. The opening is set to an opening width and an opening thickness (depth) that are equal to or greater than the length in the width direction and the length in the thickness direction of the heat sink 61, respectively. Further, at the bottom thereof, a discharge port 59a for discharging the water that has dripped and accumulated inside the drain 59 to the outside is formed in a thin cylindrical shape. At the tip of the discharge port 59a, the proximal end side of a tube (not shown) whose tip can be exposed outside the housing 11 via a wiring hole, a ventilation hole, etc. previously formed in the housing 11 is connected.

[0058] The heat sink 61 is configured in the same manner as the heat sink 41 of the outer unit 20. It has a flat portion 61b on one side formed in a substantially square shape, and on the other side, a large number of rod-shaped fins 61a of the same shape are arranged in a matrix and erected. The flat portion 61b of the heat sink 61 is set to a size that is slightly smaller than the heat dissipation plate 57. Five Peltier modules 62 to 66 are sandwiched between the flat portion 61b and the inner surface of the heat dissipation plate 57.

[0059] The Peltier modules 62 to 66 are also configured in the same manner as the Peltier modules 42 to 46 of the outer unit 20, and are thermoelectric conversion parts in which one ceramic substrate functions as a heat absorption surface 62a to 66a (heat absorption side) and the other ceramic substrate functions as a heat dissipation surface 62b to 66b (heat dissipation side). In the present embodiment, the power (driving power) supplied to the Peltier modules 62 to 66 is controlled by the control unit 31 described above.

[0060] The fan 67 is also an axial flow type air intake and exhaust section configured in the same manner as the fan 47 of the outer unit 20, and is formed in a substantially square shape with the front and back having substantially the same size as the flat portion 61b of the heat sink 61. In the present embodiment, the fan 67 is arranged such that the front (suction side) is in contact with the top of the fins 61a of the heat sink 61, and a cover 68 is provided on the back (discharge side). The cover 68 has a function of preventing a user's hand or the like from touching the rotating blades of the fan 67, and in the present embodiment, it is provided so as to cover the back of the fan 67.

[0061] In the present embodiment, the five Peltier modules 62 to 66 are arranged in a cross shape on the surface between the heat dissipation plate 57 and the heat sink 61, and the heat generation surfaces 62b to 66b are in close contact with the inner surface of the heat dissipation plate 57, and the heat absorption surfaces 62a to 66a are in close contact with the flat portion 61b of the heat sink 61, and are sandwiched in a sandwich shape between the heat dissipation plate 57 and the heat sink 61. More specifically, the heat sink 61 and the fan 67 laminated in the thickness direction are screwed to the heat dissipation plate 57 by four bolts 69, and the Peltier modules 62 to 66 are sandwiched and fixed between the inner surface of the heat dissipation plate 57 and the flat portion 61b of the heat sink 61. In the present embodiment, the cover 68 is also fastened together by the bolts 69 and attached to the fan 67. Note that a paste-like silicone grease having a high thermal conductivity is applied and interposed so that the heat generation surfaces 62b to 66b and the heat absorption surfaces 62a to 66a of the Peltier modules 62 to 66 can be thermally coupled to the heat dissipation plate 57 and the heat sink 61 over substantially the entire surface.

[0062] Note that since the inner unit 50 is not provided with a control unit 31 like the outer unit 20, the Peltier modules 62 to 66 and the fan 67 are connected to the control unit 31 of the outer unit 20 at one end as described above, and the other end of the electrical wiring having a length that can be sufficiently routed to the inner unit 50 mounted on the inner wall surface 13a of the side plate 13 within the internal space SP of the housing 11 is electrically connected. This electrical wiring is the predetermined wiring drawn out of the inner unit 50 from the wiring hole 51a formed in the case 51, and is drawn out of the housing 11 through the wiring holes, ventilation holes, etc. formed in advance in the housing 11 of the control panel 10, and is connected to the control unit 31 in the outer unit 20.

[0063] With the outer unit 20 and the inner unit 50 constituting the present cooling system configured in this way, in the present cooling system, a cooling operation as shown in FIG. 5 is performed. FIG. 5 shows a conceptual diagram illustrating an example of the cooling operation by the present cooling system. Note that in FIG. 5, for the sake of convenience in drawing representation, the case 21, heat absorption plate 27, magnets 28a to 28d, control unit 31, wiring of the temperature sensor 38, etc. constituting the outer unit 20, and the case 51, heat dissipation plate 57, magnets 68a to 68d, etc. constituting the inner unit 50 are omitted, and it should be noted that the heat sinks 41, 61, Peltier modules 42 to 46, 62 to 66, and fans 47, 67 are shown in a simplified manner.

[0064] As shown in Fig. 5, in this cooling system, the outer unit 20 and the inner unit 50 are attached and mounted in a positional relationship where they face each other with respect to the side plate 13 or the door 15 that constitutes the housing 11 of the control panel 10. When these units 20 and 50 are attached to the side plate 13, the outer unit 20 is attached to the outer wall surface 13b of the side plate 13, and the inner unit 50 is attached to the inner wall surface 13a of the side plate 13. Although not shown in Fig. 5, in this embodiment, as described above, for example, the magnets 28a to 28d of the outer unit 20 are attached to the heat absorption plate 27 such that the N poles face outward (in the direction of the side plate 13), and the magnets 58a to 58d of the inner unit 50 are attached to the heat dissipation plate 57 such that the S poles face outward (in the direction of the side plate 13).

[0065] Thus, as a positioning part and a mounting part, by aligning the magnets 28a to 28d of the outer unit 20 and the magnets 58a to 58d of the inner unit 50 so that they can attract each other, it becomes possible to mount these units 20 and 50 on the side plate 13 so that they face each other. Also, even when the housing 11 of the control panel 10 is originally made of a non-magnetic material (for example, aluminum, high heat conduction resin, high heat conduction fine ceramics, etc.) to which the magnets 28a to 28d and 58a to 58d cannot be attracted, by aligning these magnets 28a to 28d and 58a to 58d so that they attract each other, it becomes possible to mount both units 20 and 50 on the housing 11 made of a non-magnetic material.

[0066] When, for example, an inverter unit 17 that is likely to generate heat during operation is attached to and housed in the bottom plate 14 inside the internal space SP of the housing 11, the inverter unit 17 becomes a heat source. Therefore, when the internal space SP is a substantially sealed space without active ventilation, the temperature Tinv of the inverter unit 17 and the temperature Tint inside the internal space SP gradually increase. If left unattended, the temperature characteristics will be as shown in, for example, Fig. 6(A). In Fig. 6(A), when the temperature Tinv of the inverter unit 17 is around 43°C, the temperature Tint inside the internal space SP is close to 33°C. It can be seen that the temperature Tout (outside air temperature) outside the housing 11 is around 30°C.

[0067] Here, as shown in Fig. 5, an outer unit 20 is attached to the outer wall surface 13b of the side plate 13, and an inner unit 50 is attached to the inner wall surface 13a of the side plate 13. Also, a paste-like silicone grease with high thermal conductivity is applied and interposed between the outer unit 20 and the outer wall surface 13b, and between the inner unit 50 and the inner wall surface 13a. As a result, the outer unit 20 can be well thermally coupled to the outer wall surface 13b, and the inner unit 50 can be well thermally coupled to the inner wall surface 13a.

[0068] As a result, in the inner unit 50 attached to the inner wall surface 13a of the side plate 13, the heat absorbed by the heat absorption surfaces of the Peltier modules 62 - 66 via the heat sink 61 in the internal space SP inside the housing 11 is transmitted from the inner wall surface 13a of the side plate 13 of the housing 11 to the outer wall surface 13b of the side plate 13 as the heat generated by the heat generation surfaces of the Peltier modules 62 - 66. Although the temperature of the side plate 13 rises, in the outer unit 20, such heat can be absorbed from the outer wall surface 13b of the side plate 13 by the heat absorption surfaces of the Peltier modules 42 - 46, and can be released outside the housing 11 via the heat sink 41 as the heat generated by the heat generation surfaces of the Peltier modules 42 - 46.

[0069] Therefore, the heat generated by the heat generating surfaces of the Peltier modules 62 to 66 of the inner unit 50 escapes to the outside of the housing 11 not only through the path via the side plate 13 of the housing 11 but also through the path via the Peltier modules 42 to 46 and the heat sink 41 of the outer unit 20. Therefore, for example, the temperature characteristics are as shown in FIG. 7(E). The temperature Tinv of the inverter unit 17, which was around 43°C in FIG. 6(A), has dropped to around 33°C (a 10°C drop) in FIG. 7(E), and the temperature Tint inside the internal space SP is lower than the temperature Tout outside the housing 11, which is around 30°C, and it can be seen that it has dropped to 29°C or lower (a 4°C drop).

[0070] Inside the housing 11 (internal space SP), since the heat sink 61 is cooled by the heat absorption surfaces of the Peltier modules 62 to 66, the air sucked in through the cooled heat sink 61 comes into contact with the fins 61a for heat exchange and then becomes cold air and is blown into the internal space SP from the fan 67. As a result, inside the internal space SP, cold air circulates as shown by the dashed arrow, so the inverter unit 17, which is the heat source, is also cooled and its temperature Tinv drops as described above. Also, the inner wall surface 13a of the side plate 13 may locally increase in temperature due to the heat transmitted from the heat generating surfaces of the Peltier modules 62 to 66, but on the back side, that is, the outer wall surface 13b, the heat absorption surfaces of the Peltier modules 42 to 46 of the outer unit 20 are thermally coupled, and the absorbed heat is transmitted from its heat generating surface to the heat sink 41 and the heat sink 41 is heated. Therefore, after being sucked in by the fan 47, the air that has passed through the heated heat sink 41 comes into contact with the fins 41a for heat exchange and then becomes hot air and is discharged from the side of the heat sink 41 to the space outside the housing 11 (external space) (the thick dashed-dotted arrow shown in FIG. 6). As a result, the heat sink 41 of the outer unit 20 can radiate (reject heat) the heat absorbed by the Peltier modules 62 to 66 of the inner unit 50 to the external space, so the inside of the housing 11 (internal space SP) can be efficiently cooled.

[0071] Note that FIG. 6(B) shows the temperature characteristics of the inverter unit 17, inside the internal space SP, and outside the housing 11 when only the inner unit 50 of the present embodiment is mounted on the inner wall surface 13a of the side plate 13. In this case, it can be seen that the temperature Tinv of the inverter unit 17 has decreased to around 37°C (a decrease of 6°C compared to FIG. 6(A)). Also, while the temperature Tout outside the housing 11 is around 35°C, it can be seen that the temperature Tint inside the internal space SP has decreased to around 33°C, which is 2°C lower than that.

[0072] Further, FIG. 6(C) shows the temperature characteristics of the inverter unit 17, inside the internal space SP, and outside the housing 11 when only the outer unit 20 of the present embodiment is mounted on the outer wall surface 13b of the side plate 13. In this case, it can be seen that the temperature Tinv of the inverter unit 17 has decreased to around 35°C (a decrease of 8°C compared to FIG. 6(A)), the temperature Tint inside the internal space SP is around 33°C, and the temperature Tout outside the housing 11 is around 31°C. From these results, when only one unit is mounted on the housing 11, it was concluded that attaching the inner unit 50 to the inner wall surface 13a has a higher cooling effect than attaching the outer unit 20 to the outer wall surface 13b. Since the inner unit 50 can circulate cold air inside the internal space SP of the housing 11 while the outer unit 20 cannot, it is considered that the temperature Tint inside the internal space SP did not decrease more than the temperature Tout outside the housing 11.

[0073] Furthermore, Fig. 7(D) shows the temperature characteristics of the inverter unit 17, inside the internal space SP, and outside the housing 11 when the inner unit 50 of the present embodiment is mounted on the inner wall surface 13a of the side plate 13 and the outer unit 100 having a configuration excluding the Peltier modules 42 to 46 from the outer unit 20 is mounted on the outer wall surface 13b of the side plate 13. The outer unit 100 having such a configuration, and also the inner unit having a configuration excluding the Peltier modules 62 to 66 from the inner unit 50, are both embodiments of the cooling device of the present invention. In the case of the outer unit 100, it can be seen that the temperature Tinv of the inverter unit 17 has dropped to around 33°C (a 10°C drop compared to Fig. 6(A)). Also, it can be seen that both the temperature Tint inside the internal space SP and the temperature Tout outside the housing 11 have dropped to around 30°C. Even though only the inner unit 50 is provided with the Peltier modules 62 to 66 and the outer unit 100 is not provided with Peltier modules, results that are not much different from those in the case of Fig. 7(E) described above are obtained.

[0074] In addition, in Fig. 7(F), large holes 13c are formed in the side plate 13, and the Peltier modules 62 to 66 of the inner unit 50 are directly brought into contact with the heat sink of the outer unit 100 through the large holes 13c without the side plate 13 intervening. The temperature characteristics of the inverter unit 17, inside the internal space SP, and outside the housing 11 are shown. In this case, it can be seen that the temperature Tinv of the inverter unit 17 has dropped to around 28°C (a 15°C drop compared to Fig. 6(A)). Also, it can be seen that the temperature Tint inside the internal space SP has dropped to around 25°C and the temperature Tout outside the housing 11 has dropped to around 28°C on average. Since the large holes 13c are formed so that the side plate 13 does not intervene, the best results are obtained, but the difference in the cooling temperature is small compared to the case of Fig. 7(E) where the side plate 13 intervenes. That is, it can be seen that the present cooling system composed of the outer unit 20 and the inner unit 50 obtains a cooling effect close to the configuration in the case where large holes 13c are formed in the side plate 13 shown in Fig. 7(F).

[0075] As described above, in the cooling system of the present embodiment, the outer unit 20 and the inner unit 50 include Peltier modules 42 to 46, 62 to 66, heat sinks 41, 61, fans 47, 67, and magnets 28a to 28d, 58a to 58d. The Peltier modules 42 to 46, 62 to 66 have heat absorption surfaces 42a to 46a, 62a to 66a that absorb heat when supplied with direct current power, and heat dissipation surfaces 42b to 46b, 62b to 66b that generate heat. The heat sinks 41, 61 have flat portions 41b, 61b thermally coupled to the heat dissipation surfaces 42b to 46b or the heat absorption surfaces 62a to 66a of the Peltier modules 42 to 46, 62 to 66, and the fans 47, 67 circulate air that contacts the fins 41a of the heat sinks 41, 61 or circulate the air that has contacted the fins 61a. The magnets 28a to 28d, 58a to 58d detachably attach the Peltier modules 42 to 46, 62 to 66 and the heat sinks 41, 61 to the housing 11. Thereby, it becomes possible to attach and detach the Peltier modules 42 to 46, 62 to 66 and the heat sinks 41, 61 to and from the housing 11. Also, it becomes possible to retrofit an existing housing.

[0076] Furthermore, (1) when the heat sink 41 is thermally coupled to the heat dissipation surfaces 42b to 46b of the Peltier modules 42 to 46, the Peltier modules 42 to 46 and the heat sink 41 are attached to the housing 11 such that the heat absorption surfaces 42a to 46a of the Peltier modules 42 to 46 can be thermally coupled to the outer wall surface 13b of the side plate 13 of the housing 11. Thus, the heat absorbed from the outer wall surface 13b of the side plate 13 by the heat absorption surfaces 42a to 46a of the Peltier modules 42 to 46 is dissipated outside the housing 11 via the heat sink 41 as the heat generated by the heat dissipation surfaces 42b to 46b of the Peltier modules 42 to 46, and the temperature of the side plate 13 of the housing 11 decreases.

[0077] Also, when the heat sink 61 is thermally coupled to the heat absorption surfaces 62a to 66a of the Peltier modules 62 to 66, the heat generation surfaces 62b to 66b of the Peltier modules 62 to 66 can be thermally coupled to the inner wall surface 13a of the side plate 13 of the housing 11. By mounting the Peltier modules 62 to 66 and the heat sink 61 on the housing 11, the heat absorbed by the heat absorption surfaces 62a to 66a of the Peltier modules 62 to 66 via the heat sink 61 in the internal space SP within the housing 11 is transferred from the inner wall surface 13a of the side plate 13 to the outer wall surface 13b of the side plate 13 as heat generated by the heat generation surfaces 62b to 66b of the Peltier modules 62 to 66 and dissipated outside the housing 11. Therefore, in both the above (1) and (2), it is possible to lower the temperature of the internal space SP within the housing 11. Accordingly, it is possible to cool the internal space SP within the housing 11 without providing ventilation holes in the top plate 12, side plates 13, door 15, etc. of the housing 11, and with the ability to be detached and attached or retrofitted.

[0078] Further, in the cooling system of the present embodiment, when the outer unit 20 is detachably mounted on the outer wall surface 13b of the side plate 13, in addition to this outer unit 20, an inner unit 50 is included. This inner unit 50 includes a heat sink 61 having fins 61a and a flat portion 61b, a fan 67 for circulating air that contacts the fins 61a of the heat sink 61 or air within the housing 11 that contacts the fins 61a, and magnets 58a to 58d for detachably mounting the heat sink 61 to the housing 11. This inner unit 50 is mounted on the housing 11 such that the flat portion 61b of such a heat sink 61 can be thermally coupled to the inner wall surface 13a of the side plate 13.

[0079] As a result, in the outer unit 20, the heat absorbed from the outer wall surface 13b of the side plate 13 of the housing 11 by the heat absorption surfaces 42a to 46a of the Peltier modules 42 to 46 is radiated outside the housing 11 through the heat sink 41 as the heat generated by the heat generation surfaces 42b to 46b of the Peltier modules 42 to 46, so that the temperature of the side plate 13 of the housing 11 decreases. Therefore, the inner unit 50 is mounted on the housing 11 such that the flat portion 61b of the heat sink 61 can be thermally coupled to the inner wall surface 13a of such a side plate 13, and thus the temperature of the flat portion 61b of the heat sink 61 of the inner unit 50 also decreases. Accordingly, the air in the internal space SP inside the housing 11 that contacts the fins 61a of the heat sink 61 of the inner unit 50 has its heat taken away and its temperature decreases, so that the temperature of the space inside the housing 11 can be further decreased compared to the case where such an inner unit 50 is not included.

[0080] Furthermore, in the cooling system of the present embodiment, when the inner unit 50 is detachably mounted on the inner wall surface 13a of the side plate 13, in addition to this inner unit 50, an outer unit 20 is included. This outer unit 20 includes a heat sink 41 having fins 41a and a flat portion 41b, a fan 47 for circulating air that contacts the fins 41a of the heat sink 41 or the air outside the housing 11 that has been contacted, and magnets 28a to 28d for detachably mounting the heat sink 41 to the housing 11. And this outer unit 20 is mounted on the housing 11 such that the flat portion 41b of such a heat sink 41 can be thermally coupled to the outer wall surface 13b of the side plate 13.

[0081] As a result, in the inner unit 50, the heat absorbed by the heat absorption surfaces 62a to 66a of the Peltier modules 62 to 66 via the heat sink 61 in the internal space SP within the housing 11 is transmitted from the inner wall surface 13a of the side plate 13 of the housing 11 to the outer wall surface 13b of the side plate 13 as the heat generated by the heat generation surfaces 62b to 66b of the Peltier modules 62 to 66. Although the temperature of the side plate 13 of the housing 11 thus rises, the flat portion 41b of the heat sink 41 of the outer unit 20 can be thermally coupled to the outer wall surface 13b of such a side plate 13. When the outer unit 20 is attached to the housing 11, the heat transmitted to the side plate 13 of the housing 11 is further transmitted to the flat portion 41b of the heat sink 41 of the outer unit 20. Therefore, the heat transmitted to the flat portion 41b of the heat sink 41 can escape from the fins 41a of the heat sink 41 to the outside of the housing 11 when the air outside the housing 11 comes into contact with the heat sink 41 of the outer unit 20. Accordingly, the heat generated by the heat generation surfaces 62b to 66b of the Peltier modules 62 to 66 of the inner unit 50 escapes to the outside of the housing 11 not only through the path via the side plate 13 of the housing 11 but also through the path via the heat sink 41 of the outer unit 20. Thus, it becomes possible to improve the thermoelectric conversion efficiency of the Peltier modules 62 to 66 of the inner unit 50 as compared with the case where such an outer unit 20 is not included.

[0082] In addition, in the cooling system of the present embodiment, as a positioning unit that determines the mounting positions of the outer unit 20 and the inner unit 50 so that the outer unit 20 and the inner unit 50 face each other with the side plate 13 interposed therebetween, the outer unit 20 includes magnets 28a to 28d, and the inner unit 50 includes magnets 58a to 58d. Thereby, compared with the case where the outer unit 20 and the inner unit 50 do not include such a positioning unit, the heat transfer distance is minimized between the Peltier modules 42 to 46 of the outer unit 20 and the Peltier modules 62 to 66 of the inner unit 50 that are present with the side plate 13 interposed therebetween, and it becomes possible to easily perform predetermined positioning of both units 20 and 50. Therefore, it becomes possible to improve the heat transfer efficiency between the Peltier modules 42 to 46 of the outer unit 20 and the Peltier modules 62 to 66 of the inner unit 50. Accordingly, it becomes possible to further improve the thermoelectric conversion efficiency of the Peltier modules 42 to 46 and 62 to 66 included in the outer unit 20 and the inner unit 50.

[0083] Note that, instead of the positioning unit constituted by such magnets 28a to 28d and 58a to 58d, for example, in order to easily perform predetermined positioning when both units 20 and 50 face each other, a positioning pin and a positioning hole capable of receiving the tip of the positioning pin may be provided at two or more locations on either one or both of these two units 20 and 50. Such a positioning unit is provided, for example, by vertically standing a positioning pin having a diameter of 1 to 2 mm so as to protrude substantially perpendicularly from the sub-plate 26 of the outer unit 20, and drilling a positioning hole capable of receiving the tip of this positioning pin in the sub-plate 56 of the inner unit 50. A positioning pin may be provided on the sub-plate 56 of the inner unit 50 and a positioning hole may be provided on the sub-plate 26 of the outer unit 20. Note that, on the side plate 13 or the like of the housing 11, it is necessary to provide a through-hole through which the positioning pin can pass corresponding to the position and number of such positioning pins.

[0084] Note that instead of the handles 22 and 52 of the outer unit 20 and the inner unit 50 described above, it may be configured to include a handle 120 having an eject function as shown in FIGS. 8(A) and 8(B).

[0085] In the outer unit 20A provided with the handle 120, the handle 120 is composed of a movable part 122 and a fixed part 123. At both ends of the movable part 122, the proximal end side 125a of a shaft 125 penetrating through the fixed part 123 is fixed. And a coil spring 127 interposed between the movable part 122 and the fixed part 123 is inserted through the shaft 125. At the distal end side 125b of the shaft 125, a retaining part (not shown in the figure) for preventing the shaft 125 penetrating through the fixed part 123 from coming out of the fixed part 123 is provided. The fixed part 123 is attached and fixed to the sub-plate 26 such that both ends of its U-shaped form are in contact with the sub-plate 26. Through holes (not shown in the figure) through which the distal end side 125b can be inserted are formed in the sub-plate 26 for each shaft 125.

[0086] By configuring the handle 120 in this way, since the movable part 122 is biased in a direction away from the fixed part 123 by the biasing force of the coil spring 127, in the state shown in FIG. 8(A), the shaft 125 does not have its distal end side 125b protruding from both ends of the U-shaped form of the fixed part 123. On the contrary, when the user places a hand on the handle 120 and holds the handle 120 with a gripping force that resists the biasing force of the coil spring 127, the movable part 122 approaches the fixed part 123. By moving the movable part 122 in a direction approaching the fixed part 123 in this way, the distal end side 125b of the shaft 125 also moves in the direction of the sub-plate 26. Therefore, when the user further holds the handle 120, as shown in FIG. 8(B), the distal end side 125b protrudes from both ends of the U-shaped form of the fixed part 123.

[0087] As a result, the tip side 125b of the shaft 125 abuts against the outer wall surface 13b of the side plate 13, and the entire outer unit 20A' floats in a direction away from the outer wall surface 13b. Therefore, even when the attracting force by the magnets 28a to 28d is extremely strong, for example, the outer unit 20A' can be easily removed from the side plate 13. That is, the outer unit 20A can be ejected. In FIGS. 8(A) and 8(B), only the handle 120 on one side of the outer unit 20A is shown, but it is possible to apply such handles 120 on both sides. Also, in FIGS. 8(A) and 8(B), the case of the outer unit 20A is illustrated and described, but for the inner unit 50 as well, it is possible to configure it to include the handle 120 instead of the handle 52.

[0088] Also, as shown in FIGS. 8(C) and 8(D), it may be configured to include a handle 220 having an ejection function with a different structure.

[0089] In the outer unit 20B including the handle 220, one corner 222a at both ends of the U-shaped handle 220 is formed with a rounded corner, and a rotating shaft 225 having an axial length in the height direction (Z-axis direction) is provided with respect to the corner 222a. The bearing portion (not shown) of the rotating shaft 225 is provided on the sub-plate 26. Both ends of the U-shaped handle 220 are attached to the sub-plate 26 only by the rotating shaft 225.

[0090] By configuring the handle 220 in this way, the handle 220 can rotate outward in the width direction of the outer unit 20B (in the direction of the arrow). When the handle 220 rotates in that direction, the other corner 222b moves in the direction of the side plate 13 rather than the sub-plate 26. Therefore, in the state shown in FIG. 8(C), a gap is formed between the side plate 13 and the other corner 222b of the handle 220. Thus, the outer unit 20B is stably mounted on the outer wall surface 13b of the side plate 13 by the adsorption force of the magnets 28a to 28d. On the contrary, when the user places a hand on the handle 220 and rotates it outward in the width direction (in the direction of the arrow) so as to expand it, the other corner 222b protrudes from the sub-plate 26 and approaches and contacts the outer wall surface 13b of the side plate 13. Therefore, when the user further rotates the handle 220 so as to expand it outward, as shown in FIG. 8(D), the other corner 222b protrudes greatly from the sub-plate 26.

[0091] As a result, the other corner 222b of the handle 220 contacts the outer wall surface 13b of the side plate 13, and the entire outer unit 20B' floats in the direction away from the outer wall surface 13b. Therefore, for example, even when the adsorption force of the magnets 28a to 28d is very strong, the outer unit 20B can be easily removed from the side plate 13. That is, the outer unit 20B can be ejected. Although the case of the outer unit 20B has been illustrated and described in FIGS. 8(C) and 8(D), the inner unit 50 can also be configured to include the handle 220 instead of the handle 52.

[0092] In the above-described embodiment, the case where the outer unit 20 and the inner unit 50 are attached to the control panel 10 has been exemplified and described. However, as long as it is a housing having a plate-shaped wall body, for example, a distribution board or a sub-distribution board may be used. Further, in the above-described embodiment, the case where the outer unit 20 and the inner unit 50 are attached to the side plate 13 of the housing 11 has been exemplified and described. However, they may be attached to the top plate 12 or the bottom plate 14 of the housing 11. In this case, the drain 59 of the inner unit 50 needs to be arranged such that the discharge port 59a is located on the lower side in the direction of gravity.

[0093] Further, in the above-described embodiment, the configuration in which the control unit 31 and the like are provided in the outer unit 20 has been exemplified and described. However, the control unit 31, the operation panel 32, the power supply unit 36, etc. may be configured to be provided in the inner unit 50. In this case, it is necessary to connect electrical wiring from the inner unit 50 to the outer unit 20 so that the Peltier modules 42 to 46 and the fan 47 can be controlled from the inner unit 50 with respect to the outer unit 20.

[0094] Further, in the above-described embodiment, the configuration in which the control unit 31 and the like are provided in the outer unit 20 has been exemplified and described. However, a control unit, a power supply unit, etc. may also be configured to be provided in the inner unit 50. In this case, since the outer unit 20 and the inner unit 50 will independently control the Peltier modules 42 to 46 and the fan 47 and the Peltier modules 62 to 66 and the fan 67 individually, when it is necessary to perform synchronized control between the two, it is necessary to configure the control unit 31 of the outer unit 20 and the control unit of the inner unit 50 to be able to perform data communication via a wired communication line or a wireless communication line.

[0095] Further, in the above-described embodiment, the configuration in which the Peltier modules 42 to 46 and the Peltier modules 62 to 66 are provided as the thermoelectric conversion units in the outer unit 20 and the inner unit 50 has been exemplified and described. However, the Peltier modules 42 to 46 or the Peltier modules 62 to 66 may be provided in only one of these units 20, 50.

[0096] In addition, in the above-described embodiments, in the outer unit 20 and the inner unit 50, the case where the sword-shaped heat sinks 41 and 61 are used as the heat exchange units has been described as an example. However, for example, a heat sink in which a plurality of thin plate-shaped fins are erected, or a heat sink in which one surface and the other surface are flat surfaces and rod-shaped or plate-shaped fins are provided on both sides or the like may be used for the configuration.

[0097] In addition, in the above-described embodiments, in the outer unit 20 and the inner unit 50, the case where the axial flow type fans 47 and 67 are used as the air supply and intake units has been described as an example. However, for example, a centrifugal type or blower type fan may be used for the configuration. Further, the fan 47 may be arranged such that the front surface (suction side) contacts the top of the fins 41a of the heat sink 41 and the filter 48 covers the back surface (discharge side). Thereby, the air outside the housing 11 sucked from the side of the heat sink 41 flows into the heat sink 41 heated by the heat generating surfaces 42b to 46b of the Peltier modules 42 to 46, contacts the fins 41a for heat exchange, and then is sucked by the fan 47 and discharged as hot air from the back surface of the fan 47 to the external space of the housing 11.

[0098] Further, the fan 67 may be arranged such that the back surface (discharge side) contacts the top of the fins 61a of the heat sink 61 and the cover 68 covers the front surface (suction side). Thereby, the air inside the housing 11 (internal space SP) sucked from the front surface of the fan 67 flows into the heat sink 61 cooled by the heat absorbing surfaces 62a to 66a of the Peltier modules 62 to 66, contacts the fins 61a for heat exchange, and then is discharged as cold air from the side of the heat sink 61 to the internal space SP of the housing 11.

[0099] Furthermore, the fans 47, 67 do not necessarily need to be provided in direct contact with the heat sinks 41, 61. As long as they are configured to be able to send air (supply air) or suck air (intake air) to and from the heat sinks 41, 61, for example, they may be configured to be able to supply or intake air to and from the heat sinks 41, 61 from a position separated via an air tube, an air duct, or the like. That is, the fans 47, 67 may be configured separately (independently) from the heat sinks 41, 61 and the Peltier modules 42 to 46, 62 to 66 to which the housing 11 is attached, and they do not necessarily need to be attached to the housing 11. Also, as long as it is possible to supply or intake air to and from the heat sinks 41, 61, there is no need to interpose an air tube or the like.

[0100] In the above-described embodiment, the inverter unit 17 has been illustrated and described as a heat source within the housing 11. However, any other device or equipment may be used as long as it generates heat during operation.

[0101] Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications or changes of the above-described specific examples. Also, the technical elements described in this specification or the drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology illustrated in this specification or the drawings achieves a plurality of purposes simultaneously, and has technical utility by achieving one of those purposes alone. Note that the descriptions within parentheses in the [Description of Reference Numerals] column can clarify the correspondence between the terms used in the above-described embodiments and the terms described in the claims.

Description of Reference Numerals

[0102] 10…Control panel 11…Housing 12…Top plate (wall) 13…Side plate (wall) 13a…Inner wall surface (inner surface) 13b…Outer wall surface (outer surface) 14…Base plate (wall) 15…Door (wall) 17…Inverter unit 20, 20A, 20B…Outer unit (cooling device, outer cooling device) 21, 51…Case 22, 52…Handle 23, 24, 53…Bracket 26, 56…Subplate 27…Heat absorption plate 28a, 28b, 28c, 28d…Magnet (mounting part, positioning part) 31…Control unit 32…Operation panel 33…Display module 36…Power supply unit 38…Temperature sensor 41, 61…Heat sink (heat exchange part) 41a, 61a…Fin (the other side) 41b, 61b…Flat part (one side) 42, 43, 44, 45, 46, 62, 63, 64, 65, 66…Peltier module (thermoelectric conversion part) 43a, 44a, 45a, 63a, 65a, 66a…Heat absorption surface (heat absorption side) 43b, 44b, 45b, 63b, 65b, 66b…Heat generation surface (heat generation side) 47, 67…Fan (air supply and intake part) 50…Inner unit (cooling device, inner cooling device) 57…Heat dissipation plate 58a, 58b, 58c, 58d…Magnet (mounting part, positioning part) 59…Drain 120, 220…Handle 122…Movable part 123…Fixed part 125…Shaft 127…Coil spring 225…Rotating shaft AC…AC power supply SP…Internal space (space inside the housing)

Claims

1. A cooling device for cooling a space within a rectangular box-shaped housing having a plate-shaped wall body, comprising: a thermoelectric conversion unit having a heat absorption side that absorbs heat and a heat dissipation side that dissipates heat when supplied with direct current power; a heat exchange unit having one surface thermally coupled to the heat dissipation side or the heat absorption side of the thermoelectric conversion unit; a supply / intake unit that circulates air that contacts or is in contact with the other surface of the heat exchange unit; a mounting unit that detachably mounts at least the thermoelectric conversion unit and the heat exchange unit to the housing, (1) When the heat exchange unit is thermally coupled to the heat dissipation side of the thermoelectric conversion unit, the mounting unit is magnetically adsorbed to the outer surface with respect to the outer surface such that the heat absorption side of the thermoelectric conversion unit is thermally coupled to the outer surface of one of the wall bodies facing the space across the space, or ((2) When the heat exchange unit is thermally coupled to the heat absorption side of the thermoelectric conversion unit, the mounting unit is magnetically adsorbed to the inner surface with respect to the inner surface such that the heat dissipation side of the thermoelectric conversion unit is thermally coupled to the inner surface of one of the wall bodies facing the space across the space. A cooling device characterized by the above.

2. In the case where the cooling device according to Claim 1 is an outer cooling device detachably magnetically mounted to the outer surface of the wall body in the above (1), In addition to the outer cooling device, an inner cooling device including a heat exchange unit having one surface and the other surface, a supply / intake unit that circulates air in the housing that contacts or is in contact with the other surface of the heat exchange unit, and a mounting unit that detachably mounts at least the heat exchange unit to the housing, the mounting unit being magnetically adsorbed to the inner surface with respect to the inner surface such that one surface of the heat exchange unit is thermally coupled to the inner surface of the wall body. A cooling system characterized by the above.

3. In the case where the cooling device according to Claim 1 is an inner cooling device detachably magnetically mounted to the inner surface of the wall body in the above (2), In addition to the inner cooling device, an outer cooling device including a heat exchange unit having one surface and the other surface, a supply / intake unit that circulates air outside the housing that contacts or is in contact with the other surface of the heat exchange unit, and a mounting unit that detachably mounts at least the heat exchange unit to the housing, the mounting unit being magnetically adsorbed to the outer surface with respect to the outer surface such that one surface of the heat exchange unit is thermally coupled to the outer surface of the wall body. A cooling system characterized by the above.

4. Between the outer surface of the wall body and one surface of the heat exchange part, another thermoelectric conversion part having an endothermic side that absorbs heat when direct current power is supplied and an exothermic side that generates heat is interposed. The endothermic side of this another thermoelectric conversion part is thermally coupled to the outer surface, and the exothermic side is thermally coupled to the one surface. The mounting part magnetically adsorbs the other thermoelectric conversion part so that it can also be detachably mounted on the outer surface of the housing. The cooling system according to claim 3, characterized by this.

5. When the wall body of the housing is made of a non-magnetic material, The mounting part functions as a positioning part that determines the mounting positions of both the inner cooling device and the outer cooling device so that they face each other with the wall body interposed therebetween. The cooling system according to any one of claims 2 to 4, characterized by this.

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